JP7659872B2 - Method and device for transferring electronic components - Google Patents

Description

The present invention relates to a transfer method and device for transferring an electronic component held in a first holding member to a second holding member.

In a manufacturing method for electronic components, such as forming external electrodes on electronic components such as multilayer capacitors, one end of the electronic component is held on an adhesive plate and a conductive paste is applied to the other end (Figure 8 of Patent Document 1).

JP 2012-244104 A

As shown in FIG. 1 of Patent Document 1, in order to form external electrodes at both ends of an electronic component, it is necessary to first apply and dry a conductive paste to one end of the electronic component, one of which is adhered to an adhesive plate, to form a first external electrode, and then form a second external electrode at the other end of the electronic component while the first external electrode is still adhered to the adhesive plate.

However, after forming the first external electrode and before forming the second external electrode, it was necessary to peel off the end portion that had been adhered to the adhesive plate from the adhesive plate and then re-adhere the first external electrode of the electronic component to the adhesive plate, which was a cumbersome task.

The present invention aims to provide a method and apparatus for transferring electronic components that can directly and smoothly transfer electronic components from a first holding member to a second holding member.

(1) One aspect of the present invention is a method for transferring an electronic component having one end and another end from a first holding member to a second holding member, the method comprising the steps of:
a first step of shortening a distance between the first holding member to which the other end of the electronic component is adhered and the second holding member, thereby adhering the one end of the electronic component to the second holding member;
a second step of peeling off the electronic component adhered to the second adhesive surface of the second holding member from the first holding member by utilizing a difference in adhesive strength between a first adhesive surface of the first holding member and a second adhesive surface of the second holding member, the second adhesive surface having an adhesive strength per unit area greater than that of the first adhesive surface;
having
The second step relates to a method for transferring and mounting an electronic component, the method including a distance expansion movement for expanding the distance between the first holding member and the second holding member, and a position change movement for moving one of the first holding member and the second holding member in parallel relative to the other at least at the start of and/or before the start of the distance expansion movement.

According to one aspect of the present invention, the electronic component is tilted with respect to the perpendicular line of the first holding member by the position change movement during the second step. This allows the other end of the electronic component to be locally peeled off from the first adhesive surface of the first holding member. In this way, the adhesive force of the electronic component by the first adhesive surface of the first holding member can be weakened. At this time, one end of the electronic component may also be locally peeled off from the second adhesive surface of the second holding member. However, since the adhesive force per unit area of the second adhesive surface of the second holding member is greater than that of the first adhesive surface of the first holding member, the electronic component adheres to the second adhesive surface more strongly than the first adhesive surface. On the other hand, the electronic component is completely peeled off from the first adhesive surface of the first holding member by the distance expansion movement performed simultaneously with or after the above-mentioned position change movement, and the electronic component is held only by the second holding member.

(2) In one aspect (1) of the present invention, the second step can include the position change movement performed before the start of the distance expansion movement, and the distance expansion movement performed thereafter. By performing the position change movement before the start of the distance expansion movement, the other end of the electronic component is locally peeled off from the first adhesive surface of the first holding member at the time of the distance expansion movement, making it possible to easily remove the electronic component from the first holding member. Note that the position change movement performed before the start of the distance expansion movement may be, for example, a linear movement, and may be performed multiple times as one step. This is effective for reliably removing the electronic component from the first holding member.

(3) In one aspect of the present invention (1), the second step can simultaneously perform the distance expansion movement and the position change movement. In this way, localized peeling in different areas is repeated and the electronic component is simultaneously pulled away from the first holding member, so that the electronic component can be reliably detached from the first holding member.

(4) In one aspect (3) of the present invention, the position change movement can change the two-dimensional position of the electronic component projected onto the first adhesive surface of the first holding member such that the direction of movement of the two-dimensional position within the plane of the first adhesive surface changes sequentially. In this way, the direction of movement within the projection plane of the two-dimensional position of the electronic component changes sequentially, and the inclination of the central axis of the electronic component inclined with respect to the perpendicular line of the first holding member changes sequentially. As a result, the local position where the other end of the electronic component is peeled off from the first adhesive surface of the first holding member also changes sequentially. Therefore, local peeling in different areas is repeated, making it easier to detach the electronic component from the first holding member.

(5) In one aspect (1) of the present invention, the electronic component may have a first external electrode formed at the one end and a second external electrode not formed at the other end. In this case, the first external electrode is formed in advance at one end of the electronic component held by the first holding member before transfer. Thereafter, it is possible to apply the second external electrode to the other end of the electronic component transferred from the first holding member to the second holding member.

(6) Another aspect of the present invention is
a first holding member including a first adhesive surface and capable of holding an electronic component having one end and another end by adhering the other end of the electronic component to the first adhesive surface;
a second holding member including a second adhesive surface having a greater adhesive strength per unit area than the first adhesive surface, the second holding member being capable of holding the electronic component by adhering the one end to the second adhesive surface;
a moving mechanism that moves the first holding member and the second holding member relatively;
having
The moving mechanism includes:
a distance shortening movement for shortening a distance between the first holding member to which the other end of the electronic component is adhered and the second holding member, thereby adhering the one end of the electronic component to the second adhesive surface of the second holding member;
Then, by a distance expansion movement that expands a distance between the first holding member and the second holding member, the electronic component adhered to the second holding member is peeled off from the first adhesive surface of the first holding member,
According to another aspect (6) of the present invention, the method according to the aspect (1) of the present invention can be preferably carried out by the device for transferring an electronic component, the device for transferring an electronic component being locally peeled off from the first adhesive surface by a position change movement in which one of the first holding member and the second holding member is moved in parallel with respect to the other at least at the start of the distance expansion movement and/or before the start of the distance expansion movement.

(7) Aspects (2) to (5) of the present invention can also be applied to another aspect (6) of the present invention.

1A to 1C are diagrams illustrating an example of an electronic component manufactured by an electronic component manufacturing method and apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the electronic component of FIG. 1 . 1 is a diagram showing an electronic component manufacturing apparatus according to an embodiment of the present invention; FIG. 4 is a block diagram of the manufacturing apparatus of FIG. 3 . FIG. 13 is a diagram showing a first step of the transfer method. FIG. 11 is a diagram showing a second step of the transfer method in the first embodiment. FIG. 13 is a diagram showing a state in which the electronic components have been transferred. 13A and 13B are diagrams showing a state in which the electronic component is locally peeled off from the first holding member by the position change movement in the second step. FIG. 11 is a diagram showing a second step of the transfer method in the second embodiment. FIG. 13 is a diagram showing a position change movement in a second step in the second embodiment.

In the following invention, many different embodiments and examples are provided for implementing different features of the presented subject matter. Of course, these are merely examples and are not intended to be limiting. Furthermore, the present invention may repeat reference numbers and/or letters in various examples. Such repetition is for the sake of brevity and clarity and does not, per se, require a relationship between the various embodiments and/or configurations described. Furthermore, when a first element is described as being "connected" or "coupled" to a second element, such a description includes embodiments in which the first element and the second element are directly connected or coupled to each other, as well as embodiments in which the first element and the second element are indirectly connected or coupled to each other with one or more other elements intervening therebetween. Also, when a first element is described as "moving" relative to a second element, such a description includes embodiments of relative movement in which at least one of the first element and the second element moves relative to the other.

1. Electronic Components Figure 1 shows an electronic component 1 manufactured by a manufacturing method according to an embodiment of the present invention, and Figure 2 shows a schematic cross section of a paste material, for example, first and second external electrodes 4A and 4B, formed on the electronic component 1. Here, there is no particular restriction on the size of the electronic component 1 to which the present invention is applied, but it is suitable for an electronic component 1 that has been made ultra-small in accordance with downsizing. For example, when the maximum length of one side of a rectangular (square or oblong) cross section shown in Figure 1 is L1 and the length in the direction perpendicular to the rectangular cross section is L2, the ultra-small electronic component 1 has L1 = 500 μm or less and L2 = 1000 μm or less. Preferably, L1 = 300 μm or less and L2 = 600 μm or less, more preferably, L1 = 200 μm or less and L2 = 400 μm or less, and even more preferably, L1 = 125 μm or less and L2 = 250 μm or less. The term "rectangle" as used herein includes not only a shape in which the corner where two sides intersect is strictly 90°, but also a shape that is approximately rectangular with curved or chamfered corners. It goes without saying that the present invention can be applied to electronic components 1 with cross sections other than rectangular.

2, first and second external electrodes 4A, 4B made of conductive paste layers are formed on both end portions 2, 2 of the electronic component 1. Each end portion 2 of the electronic component 1 includes an end face 2A, a side face 2B, and a corner portion 2C connecting the end face 2A and the side face 2B. In this embodiment, the first external electrode 4A is first applied and dried to one of the end portions 2, and then the second external electrode 4B is applied to the other end portion 2.

2. Manufacturing Apparatus for Electronic Components FIG. 3 shows a manufacturing apparatus 10 used in the implementation of this embodiment, and FIG. 4 shows a control system block diagram. This manufacturing apparatus 10 has a carrier plate (jig) 20 which is a holding member for the electronic component 1, a moving mechanism 50, and a surface plate 100. In FIG. 3, the three orthogonal axial directions are X, Y, and Z. The surface plate 100 can be used for the coating process of the first and second external electrodes 4A and 4B. The surface plate 100 may be used to transfer the electronic component 1 between the two carrier plates 20A and 20B (see FIG. 5), but the transfer table 200 shown in FIG. 5 may be used instead of the surface plate 100. In this case, the moving mechanism 50 can be moved above the transfer table 200 by a mechanism not shown.

The carrier plate 20 that holds multiple electronic components 1 in a suspended manner has an adhesive surface that holds at least one, for example multiple, electronic components 1. The carrier plate 20 is supported removably on a jig fixing plate 30. A base 40 is fixed above the jig fixing plate 30, and a base plate 100 or a transfer table 200 is arranged below.

A squeegee unit 110 equipped with a squeegee 112 and a blade 114 is provided on the surface plate 100. The squeegee unit 110 moves over the surface plate 100. By moving the blade 114, the squeegee unit 110 can form a dip layer of height H of conductive paste 120 on the surface 101 of the surface plate 100. By moving the squeegee 112, the squeegee unit 110 can scrape off the dip layer of conductive paste 120 from the surface 101 of the surface plate 100.

The base 40 is provided with a moving mechanism 50 for moving the jig fixing platen 30. Here, the moving mechanism 50 can include an X-axis drive unit 60, a Y-axis drive unit 70, and a Z-axis drive unit 80. The moving mechanism 50 may move the jig fixing platen 30 and the base plate 100 relatively in the X, Y, and Z axis directions. In other words, the moving mechanism 50 may move the base plate 100 (transfer table 200). Alternatively, a moving mechanism 50 for moving the jig fixing platen 30 and a moving mechanism 50 for moving the base plate 100 (transfer table 200) may be provided. Alternatively, some of the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80 included in the moving mechanism 50 may move the jig fixing platen 30, and the other parts may move the base plate 100 (transfer table 200).

The X-axis drive unit 60 can be configured with an X-table that can move in the X-axis direction relative to the base 40 along the X-axis guide 62. The Y-axis drive unit 70 can be configured with a Y-table that can move in the Y-axis direction relative to the X-axis drive unit 60 along the Y-axis guide 72. The Z-axis drive unit 80 is fixed to the Y-axis drive unit 70, for example, and can move the Z-axis 82 in the Z-axis direction. The jig fixing plate 30 is fixed to the Z-axis 82. Note that in FIG. 3, the drive sources for the X, Y, and Z axes, for example, motors and their drive force transmission mechanisms, are omitted from the illustration.

In this way, the jig fixing plate 30, the carrier plate 20 and the multiple electronic components 1 can be moved in the Z-axis direction relative to the base plate 100 (transfer table 200) by the moving mechanism 50, and can also be moved along the X-Y plane parallel to the surface of the base plate 100.

As shown in FIG. 4, the manufacturing apparatus 10 has a control unit 90 that controls the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80. The control unit 90 is connected to an operation input unit 92 such as a keyboard. The control unit 90 includes a memory unit 91, which stores operation information input via the operation input unit 92 and pre-registered programs. The control unit 90 controls the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80 according to the data and programs stored in the memory unit 91. The control unit 90 can shorten the distance between the jig fixing platen 30 and the base plate 100 (transfer table 200) by the Z-axis drive unit 80 (distance shortening movement). In addition, the control unit 90 can move the jig fixing platen 30 along a movement trajectory in a plane parallel to the base plate 100 (transfer table 200), for example, along a straight line or a circular orbit, by the X-axis drive unit 60 and/or the Y-axis drive unit 70 (position change movement). Furthermore, the control unit 90 can expand the distance between the jig fixing plate 30 and the base plate 100 (transfer table 200) by the Z-axis drive unit 80 (distance expansion movement) simultaneously with the linear or circular movement by the X-axis drive unit 60 and the Y-axis drive unit 70, or after the linear movement.

3. Manufacturing method of electronic components In the manufacturing apparatus 10 of this embodiment, a prepress process, a coating process, and a subsequent blotting process are performed on both ends 2 of the electronic component 1. The prepress process is a process of contacting the end faces 2A of each of the electronic components 1 held on the carrier plate 20 with the surface plate 100 before the coating process. The coating process is a process of contacting the end 2 including each of the end faces 2A of each of the electronic components 1 held on the carrier plate 20 with a dip layer of conductive paste formed on the surface 101 of the surface plate 100 to coat the end 2 of each of the electronic components 1 with the conductive paste. The blotting process is a process of contacting the conductive paste applied to each of the end 2 of each of the electronic components 1 held on the carrier plate 20 with the surface 101 of the surface plate 100, and transferring excess conductive paste to the surface plate 100. The conductive paste is then dried to form the first and second external electrodes 4A and 4B.

5, an electronic component 1 having a first external electrode 4A formed at one end is held by a first carrier plate 20A. That is, the electronic component 1 held by the first carrier plate 20A undergoes the above-mentioned prepress process, coating process, blotting process, and drying process to form the first external electrode 4A. In order to form a second external electrode 4B at the other end of the electronic component 1, it is necessary to transfer the electronic component 1 from the first carrier plate 20A to the second carrier plate 20B.

For this reason, in Fig. 5, the first carrier plate 20A, which has been removed from the jig fixing plate 30, is held on the transfer table 200. The first carrier plate 20A is fixed onto the transfer table 200, for example, by vacuum suction or clamping. Next, the jig fixing plate 30 and the second carrier plate 20B in Fig. 3 are moved above the transfer table 200 on which the first carrier plate 20A is placed. However, the jig fixing plate 30 is omitted in Fig. 5, and only one electronic component 1 is shown on the first carrier plate 20A.

In Figure 5, the first carrier plate 20A includes a first substrate 21A and a first adhesive sheet (broadly speaking, first adhesive surface) 22A. An electronic component 1 having a first external electrode 4A formed at one end is held upright with the other end adhered to the adhesive sheet 22A. The second carrier plate 20B similarly includes a first substrate 21B and a second adhesive sheet 22B (broadly speaking, second adhesive surface). The first and second carrier plates 20A, 20B are arranged with the adhesive sheets 22A, 22B facing each other.

3.1. Electronic component transfer method (first embodiment)
3.1.1 First Step As shown in Fig. 5, the distance between the first carrier plate 20A and the second carrier plate 20B to which the other end of the electronic component 1 is adhered is shortened. In this embodiment, the second carrier plate 20B is lowered in the direction D1 in Fig. 5 by the Z-axis driving unit 80 shown in Fig. 3. In this way, as shown in Fig. 6, the first external electrode 4A at one end of the electronic component 1 can be adhered to the adhesive sheet 22B of the second carrier plate 20B while the other end of the electronic component 1 remains adhered to the adhesive sheet 22A of the first carrier plate 20A.

3.1.2. Second step As shown in Fig. 6 and Fig. 7, the electronic component 1 adhered to the second carrier plate 20B is peeled off from the first carrier plate 20A by utilizing the difference in adhesive strength between the first and second adhesive sheets 22A and 22B. For this purpose, in Fig. 6, the second carrier plate 20B is slid in the D2 direction in Fig. 6 (hereinafter also referred to as D2 movement) by the X-axis driving unit 60 shown in Fig. 3, and then the second carrier plate 20B is raised in the D3 direction in Fig. 6 (hereinafter also referred to as D3 movement) by the Z-axis driving unit 80 shown in Fig. 3. Here, the D2 movement is a position change movement that moves one of the first carrier plate 20A and the second carrier plate 20B in parallel with the other. The D3 movement is a distance expansion movement that expands the distance between the first carrier plate 20A and the second carrier plate 20B. The D2 movement (slide movement) performed before the D3 movement may be performed multiple times in different directions. Incidentally, the D3 movement may be performed simultaneously with the D2 movement.

Here, by the movement D2 shown in FIG. 6, the central axis P of the electronic component 1 is tilted with respect to the perpendicular line of the first carrier plate 20A as shown in FIG. 8. As a result, as shown in FIG. 8, the end face 2A of the electronic component 1 can be locally peeled off from the adhesive sheet 22A of the first carrier plate 20A. In this way, the adhesive force of the electronic component 1 by the adhesive sheet 22A can be weakened, and the electronic component 1 can be more easily peeled off from the adhesive sheet 22A. At this time, there is a possibility that the first external electrode 4A of the electronic component 1 will also be locally peeled off from the adhesive sheet 22B of the second carrier plate 20B. However, since the adhesive sheet 22B has a greater adhesive force per unit area than the adhesive sheet 22A, even in the state of FIG. 8, the electronic component 1 will be adhered to the adhesive sheet 22B more strongly than the adhesive sheet 22A.

By the movement D3 after the movement D2 shown in FIG. 6, the electronic component 1 is completely peeled off from the adhesive sheet 22A, and the electronic component 1 is held only by the second carrier plate 20B as shown in FIG. 7. Thereafter, the second external electrode 4B can be formed on the electronic component 1 using the second carrier plate 20B in the same manner as the formation of the first external electrode 4A on the electronic component 1. In particular, by the above-mentioned transfer method, multiple electronic components 1 can be simultaneously transferred from the first carrier plate 20A to the second carrier plate 20B while maintaining the positional relationship of the multiple electronic components 1 aligned on the first carrier plate 20A. In addition, in the first embodiment, the distance expansion movement may be performed simultaneously with the position change movement. In this case, the electronic component 1 that is locally peeled off by the position change movement can be separated from the first carrier plate 20A by the distance expansion movement performed simultaneously.

3.2. Electronic component transfer method (second embodiment)
In the second embodiment, the second step (D2 movement and D3 movement) shown in FIG. 6 of the first embodiment is changed to the D3 movement and D4 movement shown in FIG. 9. In FIG. 9, the D4 movement shown in FIG. 10 is performed simultaneously with the distance expansion movement (D3) between the first and second carrier plates 20A and 20B. The D4 movement in FIG. 10 is a movement that changes the two-dimensional position 1A on the projection plane (the paper surface of FIG. 10) of the first carrier plate 20A of the electronic component 1 projected onto the adhesive sheet 22A so that the movement direction of the two-dimensional position 1A in the projection plane changes sequentially. This D4 movement is also a position change movement that moves one of the first carrier plate 20A and the second carrier plate 20B in parallel with the other. Specifically, in FIG. 10, the movement direction of the two-dimensional position 1A (the direction of the tangent 211 to the circle 210 shown in FIG. 10) changes sequentially so that the two-dimensional position 1A becomes, for example, a part or the whole (loop) of the circular movement locus 210. In other words, the simultaneous movements of D3 and D4 shown in Fig. 9 cause the second carrier plate 20B to move in a spiral manner by the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80 in Fig. 3. As a result, the electronic component 1 is locally peeled off from the adhesive sheet 22A of the first carrier plate 20A by the second step of the second embodiment as well, as shown in Fig. 8. The loop locus is not limited to a circle and may be an ellipse or the like.

Moreover, as the direction of movement (the direction of tangent 211 to circle 210 shown in FIG. 10) of electronic component 1 in the projection plane (the plane of FIG. 10) of two-dimensional position 1A changes sequentially, the inclination of central axis P of electronic component 1, which is inclined relative to the perpendicular line of first carrier plate 20A, changes sequentially. As a result, the local position where the other end 2A of electronic component 1 is peeled off from first adhesive sheet 22A of first carrier plate 20A also changes sequentially. Therefore, local peeling in different areas is repeated, making it easier to detach electronic component 1 from first carrier plate 20A.

In the second embodiment, the distance expansion movement and the position change movement are performed simultaneously in the second step. In this way, localized peeling in different areas is repeated and at the same time the electronic component 1 is pulled away from the first carrier plate 20A, so that the electronic component 1 can be smoothly and reliably detached from the first carrier plate 20A. As a result, similar to the first embodiment, the electronic component 1 can be held only by the second carrier plate 20B as shown in FIG. 7.

Note that the present invention is not limited to the above embodiment, and various modifications are possible within the scope of the present invention. This transfer method can also be used to transfer electronic components before external electrodes are formed on one end and the other end. For example, multiple electronic components without external electrodes before being held by the first carrier plate 20A are aligned through a guide having multiple guide holes and held on a holding member. This holding member has an adhesive surface with a smaller adhesive force per unit area than the first carrier plate 20A. This transfer method can also be used when transferring electronic components from the holding member to the first carrier plate 20A.

1...electronic component, 2...end, 2A...end face, 2B...side face, 2C...corner, 4A, 4B...paste material, 10...manufacturing device, 20, 20A, 20B...holding member (carrier plate), 21A, 21B...substrate, 22A...first adhesive surface, 22B...second adhesive surface, 30...jig fixing plate, 40...base, 50...movement mechanism, 60...X-axis drive unit, 70...Y-axis drive unit, 80...Z-axis drive unit, 90...control unit, 91...memory unit, 92...operation input unit, 100...table, 200...transfer table, 210...circular movement trajectory, 211...circular tangent (movement direction that changes sequentially), P...central axis of electronic component

Claims (9)

A method for transferring an electronic component having one end and another end from a first holding member to a second holding member, comprising the steps of:
a first step of shortening a distance between the first holding member to which the other end of the electronic component is adhered and the second holding member, thereby adhering the one end of the electronic component to the second holding member;
a second step of peeling off the electronic component adhered to the second adhesive surface of the second holding member from the first holding member by utilizing a difference in adhesive strength between a first adhesive surface of the first holding member and a second adhesive surface of the second holding member, the second adhesive surface having an adhesive strength per unit area greater than that of the first adhesive surface;
having
The second step is a method for transferring electronic components that includes a distance expansion movement that expands the distance between the first holding member and the second holding member, and a position change movement that moves one of the first holding member and the second holding member parallel to the other at least at the start of and/or before the start of the distance expansion movement. In claim 1,
The second step comprises:
the repositioning movement being performed before the initiation of the distance extension movement;
the distance-widening movement being subsequently performed;
A method for transferring electronic parts, comprising: In claim 1,
The second step is a method for transferring and mounting an electronic component, in which the distance expansion movement and the position change movement are carried out simultaneously. In claim 3,
The position change movement is a method for transferring and mounting an electronic component, in which the two-dimensional position of the electronic component projected onto the first adhesive surface of the first holding member is changed so that the movement direction of the two-dimensional position within the plane of the first adhesive surface is changed sequentially. In claim 1,
The electronic component has a first external electrode formed at one end and a second external electrode not yet formed at the other end. a first holding member including a first adhesive surface and capable of holding an electronic component having one end and another end by adhering the other end of the electronic component to the first adhesive surface;
a second holding member including a second adhesive surface having a greater adhesive strength per unit area than the first adhesive surface, the second holding member being capable of holding the electronic component by adhering the one end to the second adhesive surface;
a moving mechanism that moves the first holding member and the second holding member relatively;
having
The moving mechanism includes:
a distance shortening movement for shortening a distance between the first holding member to which the other end of the electronic component is adhered and the second holding member, thereby adhering the one end of the electronic component to the second adhesive surface of the second holding member;
Then, by a distance expansion movement that expands a distance between the first holding member and the second holding member, the electronic component adhered to the second holding member is peeled off from the first adhesive surface of the first holding member,
An electronic component transfer device that locally peels the other end of the electronic component from the first adhesive surface by a position change movement that moves one of the first holding member and the second holding member parallel to the other at least at the start of and/or before the start of the distance expansion movement. In claim 6,
The moving mechanism performs the position change movement before starting the distance expansion movement, and then performs the distance expansion movement. In claim 6,
The movement mechanism is an electronic component transfer device that simultaneously performs the distance expansion movement and the position change movement. In claim 8,
The position change movement of the electronic component transfer device changes the two-dimensional position of the electronic component projected onto the first adhesive surface of the first holding member so that the movement direction of the two-dimensional position within the plane of the first adhesive surface changes sequentially.

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