JP7659970B2 - Composition, cured product, and method for producing the cured product - Google Patents

Description

This disclosure relates to a composition that has excellent storage stability, electrical properties, and adhesive strength.

Epoxy compound-containing curable compositions are used in the fields of inks, paints, various coating agents, adhesives, optical members, and the like.
For example, Patent Document 1 describes a thermosetting composition containing an epoxy compound. It also describes a method of laminating this thermosetting composition with copper foil. Specifically, it describes a method of impregnating a glass cloth with the thermosetting composition, laminating it with copper foil, and then heating and curing it.

JP 2011-046815 A

However, the thermosetting composition described in Patent Document 1 has problems such as the epoxy curing agent causing precipitation or aggregation, and it may not be possible to form a cured product with excellent electrical properties and adhesive strength.

This disclosure has been made in consideration of the above problems, and has as its main objective the provision of a composition that has an excellent balance of storage stability, electrical properties, and adhesive strength.

As a result of intensive research conducted by the present inventors to solve the above problems, the present inventors discovered that a composition containing a cyclic ether component, a latent curing agent, and an elastomer component, in which the latent curing agent is an ionic compound and in which the elastomer component is contained in a predetermined amount, has an excellent balance of storage stability, electrical properties, and adhesive strength, and have completed the present disclosure.

That is, the present disclosure provides a polymerizable composition comprising a cyclic ether component and
A latent hardener;
An elastomer component;
Including,
the latent curing agent is an ionic compound,
The present invention provides a composition in which the content of the elastomer component is 30 parts by mass or more per 100 parts by mass of the total of the cyclic ether component, the latent curing agent, and the elastomer component.

According to the present disclosure, the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In the present disclosure, it is preferable that the elastomer contains a polymer containing a structural unit having an aromatic ring in the side chain. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In the present disclosure, it is preferable that the cyclic ether component contains at least one of an aromatic epoxy compound and an aliphatic epoxy compound containing an aliphatic ring. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In the present disclosure, it is preferable to include a nitrogen-containing heterocyclic cation. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In the present disclosure, it is preferable that the anion of the ionic compound contains at least one of a cyanate-based anion and a carboxylate-based anion. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In the present disclosure, the content of the ionic compound is preferably 0.1 parts by mass or more and 30 parts by mass or less per 100 parts by mass of the cyclic ether component and the ionic compound in total. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In the present disclosure, it is preferable that the composition contains a resin having a phenylene ether skeleton. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

The present disclosure provides a cured product of the above-mentioned composition.

According to the present disclosure, the use of the above-mentioned composition provides excellent adhesive strength and, for example, less variation in adhesive strength when viewed in a plan view.

The present disclosure provides a method for producing a cured product that includes a curing step in which the cyclic ether components in the composition are cured together.

According to the present disclosure, by using the above-mentioned composition, it is possible to obtain a cured product with excellent electrical properties and adhesive strength.

The present disclosure has the effect of providing a composition that has an excellent balance of storage stability, electrical properties, and adhesive strength.

The present disclosure relates to a composition, a cured product thereof, and a method for producing the cured product.
The composition, cured product, and method for producing the cured product according to the present disclosure will be described in detail below.

A. Composition First, the composition of the present disclosure will be described.
The composition of the present disclosure comprises a cyclic ether component, a latent curing agent, and an elastomer component, wherein the latent curing agent is an ionic compound, and the content of the elastomer component is 30 parts by mass or more in a total of 100 parts by mass of the cyclic ether component, the latent curing agent, and the elastomer component.

According to the present disclosure, the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
The reason why the composition has an excellent balance of storage stability, electrical properties and adhesive strength is presumed to be as follows.

That is, the latent curing agent used in the composition is an ionic compound and has excellent compatibility with the cyclic ether component, the solvent, etc. Therefore, for example, even when the composition has a low viscosity, precipitation, aggregation, etc. of the latent curing agent is suppressed, and the composition has excellent storage stability.
In addition, as described above, the ionic compound contained as the latent curing agent has high compatibility with the cyclic ether component and the like and is easily dispersed or dissolved uniformly in the composition, so that the curing reaction between the cyclic ether components can proceed efficiently and excellent adhesive strength can be exhibited.
Furthermore, by containing a specified amount of elastomer, the composition can exhibit excellent electrical properties such as a low relative dielectric constant and a low dielectric loss tangent when cured.
For these reasons, the composition has an excellent balance of storage stability, electrical properties and adhesive strength.

The composition of the present disclosure comprises a cyclic ether component, a latent curing agent, and an elastomer component.
Each component of the composition of the present disclosure will be described below.

1. Latent Hardener The latent hardener used in the present disclosure is an ionic compound.
The latent curing agent herein may be one which has no activity towards the cyclic ether component at 25° C., but is activated by the application of a stimulus such as heating, thereby accelerating curing.
The activation temperature of the latent curing agent that is activated by heating may be higher than 25° C., but is preferably from 60° C. to 250° C., and more preferably from 80° C. to 200° C. This is because the composition has excellent curability.

The ionic compound used as the latent hardener is a salt of a cation and an anion.
The ionic compound may be an ionic liquid compound or an ionic solid compound, but is preferably an ionic liquid compound. This is because the composition in which the ionic compound is an ionic liquid compound has a better balance of storage stability, electrical properties, and adhesive strength. The ionic liquid compound refers to an ionic compound that is liquid at 25° C. and atmospheric pressure. The ionic solid compound refers to an ionic compound that is solid at 25° C. and atmospheric pressure.

Examples of cations of ionic compounds include nitrogen-containing heterocyclic cations, tetraalkylphosphonium cations, tetraalkylammonium cations, trialkylsulfonium cations, etc.

The nitrogen-containing heterocyclic cation refers to a cation consisting of a heterocyclic ring containing a nitrogen atom as a ring skeleton atom or a derivative thereof. Examples of the nitrogen-containing heterocyclic ring include a ring whose ring skeleton atoms consist of nitrogen atoms and carbon atoms, or a ring whose ring skeleton atoms consist of nitrogen atoms, carbon atoms, and oxygen atoms, and a ring whose ring skeleton atoms consist of nitrogen atoms and carbon atoms is preferred. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Specific examples of nitrogen-containing heterocyclic cations include nitrogen-containing aromatic heterocyclic cations such as imidazolium cation, pyrazolium cation, pyridinium cation, and pyrimidinium cation. Specific examples of nitrogen-containing aliphatic heterocyclic cations include piperidinium cation and pyrrolidinium cation.

In the present disclosure, the cation preferably contains a nitrogen-containing heterocyclic cation, more preferably a nitrogen-containing aromatic heterocyclic cation, particularly preferably a nitrogen-containing aromatic heterocyclic cation containing two nitrogen atoms on the ring or a cation of a nitrogen-containing aromatic heterocyclic ring that is a five-membered ring, more preferably a nitrogen-containing aromatic heterocyclic ring that contains two nitrogen atoms on the ring and is a five-membered ring, and particularly preferably contains an imidazolium cation or a derivative thereof. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

The derivative of the imidazolium cation refers to a cation in which a hydrogen atom bonded to an atom constituting the ring skeleton of the imidazolium cation is substituted with a substituent.
The imidazolium cation and its derivatives include a cation represented by the following general formula (1).

(In the formula, R ¹ and R ² each independently represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an alkenyl group having 2 to 12 carbon atoms;
R ³ , R ⁴ , and R ⁵ each independently represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms.

Examples of the alkyl group having 1 to 12 carbon atoms used for R ¹ , R ² , R ³ , R ⁴ and R ⁵ include chain or cyclic alkyl groups. Examples of the chain alkyl group include linear or branched ones, such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, t-butyl, amyl, isoamyl, t-amyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, t-octyl, nonyl, isononyl, decyl, isodecyl, undecyl and dodecyl groups. Examples of the cyclic alkyl group include cycloalkyl groups and cycloalkylalkyl groups. Examples of the cycloalkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclononyl group, a cyclodecyl group, an adamantyl group, a decahydronaphthyl group, an octahydropentalene group, and a bicyclo[1.1.1]pentanyl group. Examples of the cycloalkylalkyl group include cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, cycloheptylmethyl, cyclooctylmethyl, cyclononylmethyl, cyclodecylmethyl, 2-cyclobutylethyl, 2-cyclopentylethyl, 2-cyclohexylethyl, 2-cycloheptylethyl, 2-cyclooctylethyl, 2-cyclononylethyl, 2-cyclodecylethyl, 3-cyclobutylpropyl, 3-cyclopentylpropyl, 3-cyclohexylpropyl, 3-cycloheptylpropyl, 3-cyclooctylpropyl, 3-cyclononylpropyl, 3-cyclodecylpropyl, 4-cyclobutylbutyl, and 4-cyclopentylbutyl.

Examples of the alkenyl group having 2 to 12 carbon atoms used for R ¹ and R ² include a vinyl group, an allyl group, a 3-butenyl group, a 2-butenyl group, a 4-pentenyl group, a 3-pentenyl group, a 2-hexenyl group, a 3-hexenyl group, a 5-hexenyl group, a 2-heptenyl group, a 3-heptenyl group, a 4-heptenyl group, a 3-octenyl group, a 3-nonenyl group, a 4-decenyl group, a 3-undecenyl group, a 4-dodecenyl group, a 3-cyclohexenyl group, a 2,5-cyclohexadienyl-1-methyl group, and a 4,8,12-tetradecatrienyl allyl group.

^R1 is preferably an alkyl group having 1 to 12 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and particularly preferably an alkyl group having 1 to 3 carbon atoms, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
^R2 is preferably an alkyl group having 1 to 8 carbon atoms or an alkenyl group having 2 to 8 carbon atoms, more preferably an alkyl group having 2 to 6 carbon atoms or an alkenyl group having 2 to 6 carbon atoms, particularly preferably an alkyl group having 2 to 5 carbon atoms or an alkenyl group having 2 to 4 carbon atoms, and most preferably an alkyl group having 2 to 5 carbon atoms. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
R ⁴ and R ⁵ are preferably hydrogen atoms, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
^R3 is preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and more preferably a hydrogen atom, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
When any of R ¹ to R ⁵ is an alkyl group, the alkyl group is preferably a chain alkyl group, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Specific examples of the imidazolium cation and its derivatives include 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-propyl-3-methylimidazolium ion, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation, 1,2-dimethyl-3-propylimidazolium cation, 1-ethyl-2,3-dimethylimidazolium cation, 1-butyl-2,3-dimethylimidazolium cation, 1-hexyl-2,3-dimethylimidazolium cation, and 1-allyl-3-methylimidazolium cation.
Among these, at least one selected from the group consisting of 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-propyl-3-methylimidazolium ion, 1-butyl-3-methylimidazolium cation and 1-allyl-3-methylimidazolium cation is preferred, as this provides the composition with an excellent balance of storage stability, electrical properties and adhesive strength.

Examples of the pyrazolium cation and its derivatives include a 1-methylpyrazolium cation and a 3-methylpyrazolium cation.
Examples of pyridinium cations and derivatives thereof include 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-(3-hydroxypropyl)pyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-(3-cyanopropyl)pyridinium cation, 1,3-dimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3-trimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation, and 1,2,3,5-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation.
Examples of pyrimidinium cations and derivatives thereof include 1,3-dimethyl-1,4-dihydropyrimidinium cation, 1,3-dimethyl-1,6-dihydropyrimidinium cation, 1,2,3-trimethyl-1,4-dihydropyrimidinium cation, 1,2,3-trimethyl-1,6-dihydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4-dihydropyrimidinium cation, and 1,2,3,4-tetramethyl-1,6-dihydropyrimidinium cation.
Examples of the piperidinium cation and its derivatives include 1-butyl-1-methylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, and the like.
Examples of pyrrolidinium cations and derivatives thereof include 1,1-dimethylpyrrolidinium cation, 1-methyl-1-ethylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, and 1-ethyl-1-pentylpyrrolidinium cation.

Examples of the tetraalkylphosphonium cation include a tributylethylphosphonium cation, a tetrahexylphosphonium cation, a triethylmethylphosphonium cation, a trimethyldecylphosphonium cation, and a trihexyltetradecylphosphonium cation.
Examples of the tetraalkylammonium cation include tetramethylammonium cation, tetraethylammonium cation, tetrabutylammonium cation, tetrahexylammonium cation, triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, trihexyltetradecylammonium cation, (2-hydroxyethyl)trimethylammonium cation, N,N-diethyl-N-(2-methoxyethyl)-N-methylammonium [DEME] cation, tris(2-hydroxyethyl)methylammonium cation, N,N-trimethyl-N-propylammonium [TMPA] cation, trimethyl(1H,1H,2H,2H-heptadecafluorodecyl)ammonium cation, trimethyl-(4-vinylbenzyl)ammonium cation, and 2-(methacryloyloxy)ethyltrimethylammonium.
Examples of the trialkylsulfonium cation include a diethylmethylsulfonium cation, a dibutylethylsulfonium cation, and a dimethyldecylsulfonium cation.

Examples of anions of ionic compounds include halide ions, metal chloride anions, cyanate anions, carboxylate anions, sulfonate anions, sulfonyl anions, other fluoride anions, ClO ₄ ⁻ , NO ₃ ⁻ and the like.

In the present disclosure, it is particularly preferred that the anion is at least one of a cyanate-based anion and a carboxylate-based anion, and it is particularly preferred that the anion is a cyanate-based anion. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Cyanate-based anions include anions having a cyano group, such as CNS ⁻ (thiocyanate), (CN) ₂ N ⁻ (dicyanate), B(CN) ₄ ⁻ , NCS ⁻ , and C(CN) ₃ ⁻ .

Among cyanate-based anions, those containing 1 to 2 cyano groups are preferred, particularly (CN) ₂ N ^- or CNS ^- , with (CN) ₂ N ^- being most preferred, as this provides the composition with an even better balance of storage stability, electrical properties and adhesive strength.

The carboxylate anion may be any compound having a carboxylate anion (*COO ⁻ , * represents a bond).
The number of carboxylate anions in one molecule of the carboxylate anion may be 1 or more, but is preferably 1 to 3, more preferably 1 to 2, and particularly preferably 1. This is because a better balance of storage stability, electrical properties, and adhesiveness is achieved.
The carboxylate anion is preferably an anion of a hydrocarbon carboxylate in which * ^COO- is bonded to a hydrocarbon group, and more preferably an anion of an aliphatic carboxylate in which a carboxylate anion is bonded to an aliphatic hydrocarbon group. The composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
In the present disclosure, the carboxylate anion is preferably an anion of a monovalent aliphatic carboxylic acid. As the carboxylate anion, an anion in which one or more hydrogen atoms in an anion of a hydrocarbon carboxylic acid are substituted with halogen atoms can also be used.
Specific examples of carboxylate anions include CH ₃ ^COO- , C ₂ H ₅ ^COO- , C ₃ H ₇ ^COO- , C ₄ H ₉ COO-, C 5 H 11 ^COO- , C ₆ H ₁₃ ^COO- , C ₇ H ₁₅ ^COO- , C ₈ H ^{17 COO-} , _{C 9 H 19 COO-, C 10 H 21 COO-, C 11 H 23 COO- , ( CH} ^{3 )} _{2 CHCOO- ,} ⁽ _{CH 3 )} ³ _{CCOO- ,} ^C ₆ H ₅ ^COO- , CF ₃ ^COO- , C ₂ F ₅ COO- ^, and C ₃ F ₇ ^{COO- ,} _{C4F9COO- , C5F11COO- , C6F13COO- , C7F15COO-} ^, _{C8F17COO- ,} ^{C9F19COO- ,} _{C10F21COO- ,} ^C11F23COO- _{, and the} ^{like . ​} _{​ ​}

The number of carbon atoms in the carboxylate anion can be from 2 to 20, preferably from 2 to 10, more preferably from 2 to 5, particularly preferably from 2 to 3, and most preferably 2, i.e., the carboxylate anion is preferably an acetate anion, because this provides a better balance of storage stability, electrical properties, and adhesiveness.
The acetate-based anion is an acetate anion or an anion in which one or more hydrogen atoms have been substituted with halogen atoms, and examples thereof include CH ₃ COO ⁻ and CF ₃ COO ⁻ .

Examples of halide ions include Cl ⁻ , Br ⁻ , and I ⁻ .

Metal chloride anions include AlCl ₄ ⁻ , Al ₂ Cl ₇ ^{− ,} and the like.

Examples of sulfonic acid anions include CH ₃ SO ₃ ⁻ , CF ₃ SO ₃ ⁻ , C ₄ F ₉ SO ₃ ⁻ , ^{and −O} ₃ S(CF ₂ ) ₃ SO ₃ ⁻ .

Examples of sulfonyl anions include (CF ₃ SO ₂ ) ₃ C ⁻ , ((CF ₃ SO ₂ )(CF ₃ CO)N ^{− ,} and anions represented by the following general formulas (α) to (δ):
(α)(C _n F _2n+1 SO ₂ ) ₂ N ⁻ (wherein n is an integer from 1 to 10);
(β) CF ₂ (C _m F _{2 m} SO ₂ ) ₂ N ⁻ (wherein m is an integer from 1 to 10);
(γ) ⁻ O ₃ S(CF ₂ ) _l SO ₃ ⁻ (wherein l is an integer from 1 to 10);
(δ)(C _p F _2p+1 SO ₂ )N ⁻ (C _q F _2q+1 SO ₂ ) (wherein p and q are integers of 1 to 10), etc.

Other fluoride-based anions include BF ₄ ⁻ , PF ₆ ⁻ , AsF ₆ ⁻ , SbF ₆ ⁻ , NbF ₆ ⁻ , TaF ₆ ^{− ,} and the like.

Examples of the ionic compound include compounds described as ionic liquids in JP-A-2020-007568. In addition, as a method for synthesizing an ionic compound, for example, the method described in JP-A-2020-007568 can be used.
Specific examples of the ionic compound include 1-ethyl-3-methylimidazolium dicyanamide, 1-ethyl-3-methylimidazolium acetate, 1-ethyl-3-methylimidazolium trifluoroacetate, 1-butyl-3-methylimidazolium dicyanamide, 1-butyl-3-methylimidazolium trifluoroacetate, 1-butyl-3-methylimidazolium thiocyanate, 3-cyanopropylimidazolium dicyanamide, 1-allyl-3-methylimidazolium dicyanamide, 1-ethyl-3- Examples of the compound include methylimidazolium ethyl sulfate, 1-ethyl-3-methylimidazolium methanesulfonate, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium dicyanamide, 1-ethyl-3-methylimidazolium dimethyl phosphate, 1-ethyl-3-methylimidazolium ethyl phosphate, and 1-ethyl-3-methylimidazolium methylphosphonate.

Commercially available ionic compounds include IL-P11, IL-P14, IL-IM1, IL-C1, IL-C3, IL-C5, IL-A1, IL-A2, IL-A3, IL-A4, IL-A5, IL-MA1, IL-MA2, IL-MA3, IL-OH1, IL-OH2, ILA21-9, and ILP14-2 manufactured by Koei Chemical Industry Co., Ltd., and AS-110 manufactured by Daiichi Kogyo Seiyaku Co., Ltd., etc.

As the ionic compound, a combination of a nitrogen-containing aromatic heterocyclic cation and a cyanate-based anion, or a combination of a nitrogen-containing aromatic heterocyclic cation and an acetate-based anion can be preferably used. This is because the composition has an even better balance of storage stability, electrical properties, and adhesive strength.

The content of the ionic compound as the latent curing agent may be any content that provides a desired balance of storage stability, electrical properties, and adhesive strength, but is preferably 0.1 parts by mass or more and 30 parts by mass or less, more preferably 0.5 parts by mass or more and 20 parts by mass or less, particularly preferably 1 part by mass or more and 15 parts by mass or less, particularly preferably 2 parts by mass or more and 10 parts by mass or less, and most preferably 3 parts by mass or more and 8 parts by mass or less, per 100 parts by mass of the cyclic ether component and the ionic compound as the latent curing agent in total. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength. This is because the composition has particularly excellent adhesive strength.

The content of the ionic compound as the latent curing agent may be any content that provides a desired balance of storage stability, electrical properties, and adhesive strength, but is preferably 0.1 parts by mass or more and 15 parts by mass or less, more preferably 0.3 parts by mass or more and 10 parts by mass or less, particularly preferably 0.5 parts by mass or more and 5 parts by mass or less, and particularly preferably 0.8 parts by mass or more and 3 parts by mass or less, per 100 parts by mass of the total of the cyclic ether component, the ionic compound as the latent curing agent, and the elastomer component. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

The content of the ionic compound as the latent curing agent may be any amount that provides a desired balance of storage stability, electrical properties, and adhesive strength, but is preferably 0.1 to 15 parts by mass, more preferably 0.3 to 5 parts by mass, particularly preferably 0.5 to 4 parts by mass, and most preferably 0.8 to 2 parts by mass, per 100 parts by mass of all components of the composition other than the solvent. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

The total content of the ionic compound as a latent curing agent, the cyclic ether component, and the elastomer component is preferably 60 parts by mass or more, more preferably 65 parts by mass or more and 99 parts by mass or less, particularly preferably 70 parts by mass or more and 98 parts by mass or less, and particularly preferably 75 parts by mass or more and 98 parts by mass or less, out of 100 parts by mass of all components other than the solvent of the composition, the total content is preferably 60 parts by mass or more and 99 parts by mass or less, particularly preferably 70 parts by mass or more and 98 parts by mass or less. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

2. Cyclic Ether Component The cyclic ether component contains one or more compounds having a cyclic ether group (hereinafter, sometimes referred to as "cyclic ether compounds").
The cyclic ether group may be any group having at least one ether bond in a ring structure, and examples of such groups include an epoxy group, an oxetanyl group, etc. That is, as the cyclic ether component, one or a combination of two or more of epoxy compounds, oxetane compounds, etc. may be used.
In addition, compounds having a cyclic ether group and an ethylenically unsaturated group are included in the cyclic ether compounds.
Examples of the ethylenically unsaturated group include an acryloyl group, a methacryloyl group, and a vinyl group.
Furthermore, compounds having an alkoxysilyl group together with a cyclic ether group are generally classified as silane coupling agents, and do not fall under the category of the above-mentioned cyclic ether compounds. For example, compounds having an alkoxysilyl group together with an epoxy group, such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, are generally classified as silane coupling agents, and do not fall under the category of epoxy compounds.
In addition, a compound having a cyclic ether group as an elastomer component is not considered to be a cyclic ether compound but is considered to be an elastomer component. Therefore, a rubber-modified epoxy compound described later is not considered to be an epoxy compound.
Furthermore, "resins having a phenylene ether skeleton" described below as other resin components that have a cyclic ether group are not considered to be cyclic ether components such as epoxy compounds in the present disclosure. Therefore, even if a "resin having a phenylene ether skeleton" has an epoxy group, it does not fall under the category of an epoxy compound.

The type of cyclic ether group in the cyclic ether compound may be any type that provides a desired balance of storage stability, electrical properties, and adhesive strength, but it is preferable that the cyclic ether group is an epoxy group, i.e., the cyclic ether component contains an epoxy compound. This is because the composition has a better balance of storage stability, electrical properties, and adhesive strength due to the use of such a cyclic ether component.

(1) Epoxy Compound The epoxy compound includes all compounds containing an epoxy group. For example, a compound containing both an epoxy group and an oxetane group is considered to be an epoxy compound.
Examples of such epoxy compounds include aromatic epoxy compounds, alicyclic epoxy compounds, and aliphatic epoxy compounds.
In the present disclosure, the cyclic ether compound preferably contains at least one of an aromatic epoxy compound and an aliphatic epoxy compound, and more preferably contains at least one of an aromatic epoxy compound and an aliphatic epoxy compound containing an aliphatic ring (hereinafter, sometimes referred to as an aliphatic ring-containing epoxy compound), and more preferably contains an aromatic epoxy compound, because the composition has a better balance of storage stability, electrical properties, and adhesive strength.

(1-1) Aromatic Epoxy Compound The aromatic epoxy compound has an aromatic ring and an epoxy group, but does not have a cycloalkene oxide structure.
In addition, those having an aromatic ring and an aliphatic ring are also considered to be aromatic epoxy compounds.
Here, examples of the aromatic ring include naphthalene, anthracene, phenanthrene, pyrene, etc. In the present disclosure, the aromatic ring is preferably a benzene ring, because the composition has particularly excellent electrical properties.
Examples of such aromatic epoxy compounds include polyglycidyl ethers of polyhydric phenols having at least one aromatic ring or their alkylene oxide adducts. Examples of polyglycidyl ethers of polyhydric phenols or their alkylene oxide adducts include polyglycidyl ethers of bisphenol A, bisphenol F, or compounds obtained by adding alkylene oxides to these; epoxy novolac resins (phenol novolac type epoxy compounds); polyglycidyl ethers of aromatic compounds having two or more phenolic hydroxyl groups such as resorcinol, hydroquinone, and catechol; dicyclopentadiene type epoxy resins obtained by epoxidizing co-condensed resins of dicyclopentadiene and phenolic compounds; dicyclopentadiene modified epoxy resins which are polyglycidyl ethers of dicyclopentadiene modified phenolic resins; cyclopentadiene modified epoxy resins which are polyglycidyl ethers of cyclopentadiene modified phenolic resins.
Other examples of the aromatic epoxy compound include polyglycidyl ethers of aromatic compounds having two or more alcoholic hydroxyl groups, such as benzenedimethanol, benzenediethanol, and benzenedibutanol; polyglycidyl esters of polybasic aromatic compounds having two or more carboxylic acids, such as phthalic acid, terephthalic acid, and trimellitic acid; glycidyl esters of benzoic acids, such as benzoic acid, toluic acid, and naphthoic acid; and epoxidized products of styrene oxide or divinylbenzene.

In the present disclosure, the aromatic epoxy compound is preferably a polyglycidyl ether of a polyhydric phenol having at least one aromatic ring or an alkylene oxide adduct thereof, for example, a compound represented by the following general formula (6-1) or (6-2), and among these, a compound represented by the above general formula (6-1) is preferable. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength. This is because the composition has particularly excellent electrical properties.

（一般式（６－１）中、Ｒ^６２－１及びＲ^６３－１は、それぞれ独立に、水素原子又は炭素原子数１～４のアルキル基を表し、
ｒ１及びｓ１は、それぞれ独立に、０～５の数を表し、
Ｒ^６１－１は、下記一般式（７）で表される二価の芳香環含有基を表す。）

(In general formula (6-1), R ^62-1 and R ^63-1 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms;
r1 and s1 each independently represent a number from 0 to 5;
R ^61-1 represents a divalent aromatic ring-containing group represented by the following general formula (7):

（一般式（７）中、Ｒ^７１、Ｒ^７２、Ｒ^７３、Ｒ^７４、Ｒ^７５、Ｒ^７６、Ｒ^７７、Ｒ^７８、Ｒ^７９、Ｒ^８０、Ｒ^８１、Ｒ^８２、Ｒ^８３、Ｒ^８４、Ｒ^８５、Ｒ^８６及びＲ^８７は、それぞれ独立に、水素原子又は炭素原子数１～４のアルキル基を表し、
Ｚ^３及びＺ^４は、それぞれ独立に、単結合又は炭素原子数１～４のアルキレン基を表し、アルキレン基中の水素原子はメチル基又はハロゲン原子で置換されてもよく、
ｔは、０～５の整数を表し、
ｕは、０～３０の整数を表し、
＊は、結合箇所を表す。)

(In general formula (7), R ⁷¹ , R ⁷² , R ⁷³ , R ⁷⁴ , R ⁷⁵ , R ⁷⁶ , R ⁷⁷ , R ⁷⁸ , R ⁷⁹ , R ⁸⁰ , R ⁸¹ , R ⁸² , R ⁸³ , R ⁸⁴ , R ⁸⁵ , R ⁸⁶ and R ⁸⁷ each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms;
^Z3 and ^Z4 each independently represent a single bond or an alkylene group having 1 to 4 carbon atoms, and a hydrogen atom in the alkylene group may be substituted with a methyl group or a halogen atom;
t represents an integer from 0 to 5;
u represents an integer of 0 to 30;
* indicates the binding site.)

（一般式（６－２）中、Ｌ１及びＬ２は二価の炭化水素基を表し、Ｒ^２１、Ｒ^２２及びＲ^２３はそれぞれ独立に水素原子、ハロゲン原子又は炭素原子数１～４のアルキル基を表し、ｍ^１、ｍ^３はそれぞれ独立に０～４の数を表し、ｍ^２は０～３の数を表し、Ｒ^２２及びｍ^２がそれぞれ複数存在する場合、互いに同一であっても異なってもよい。ｎ^１は０以上の数である。）

(In general formula (6-2), L1 and L2 represent a divalent hydrocarbon group, R ²¹ , R ²² and R ²³ each independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms, m ¹ and m ³ each independently represent a number from 0 to 4, m ² represents a number from 0 to 3, and when there are multiple R ²² and multiple m ² , they may be the same or different. ^{n 1} is a number of 0 or more.)

Examples of the alkyl group having 1 to 4 carbon atoms represented by R ^62-1 and R ^63-1 in general formula (6-1) include those having a predetermined number of carbon atoms among the groups listed above as the alkyl group represented by R ¹ , such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a s-butyl group, and a t-butyl group.

Examples of the alkyl group having 1 to 4 carbon atoms ^represented by R ⁷¹ , R ⁷² , R ⁷³ , R ⁷⁴ , R ⁷⁵ , R ⁷⁶ , R ⁷⁷ , R ⁷⁸ , R ⁷⁹ , R ⁸⁰ , R ⁸¹ , R ⁸² , R ⁸³ , R ⁸⁴ , R 85 , R ⁸⁶ and R ⁸⁷ in general formula (7) include the same groups as the alkyl groups having 1 to 4 carbon atoms represented by R ^62-1 and R ^63-1 in general formula (6-1).

Examples of the alkylene group having 1 to 4 carbon atoms represented by ^Z3 and ^Z4 in general formula (7) include a methylene group, a methylidene group, an ethylene group, an ethylidene group, an n-propylene group, a propylidene group, an isopropylidene group, a methylethylene group, an n-butylene group, a butylidene group, an isobutylidene group, a sec-butylidene group, a 1,2-dimethylethylene group, a 1-methylpropylene group, and a 2-methylpropylene group.

Examples of the halogen atom substituting the hydrogen atom in the alkylene group having 1 to 4 carbon atoms represented by Z ³ and Z ⁴ in the general formula (7) include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

In general formula (6-1), r1 and s1 are each preferably independently an integer of 0 to 3, more preferably an integer of 0 to 2, and even more preferably an integer of 0 to 1, and even more preferably 0. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In general formula (7), R ⁷¹ , R ⁷² , R ⁷³ , R ⁷⁴ , R ⁷⁵ , R ⁷⁶ , R ⁷⁷ , R ⁷⁸ , R ⁷⁹ , R ⁸⁰ , R ⁸¹ , R ⁸² , R ⁸³ , R ⁸⁴ , R ⁸⁵ , R ⁸⁶ and R ⁸⁷ are preferably a hydrogen atom or an alkyl group having 1 to 2 carbon atoms, that is, a hydrogen atom, a methyl group or an ethyl group, and more preferably a hydrogen atom, because the composition has a better balance of storage stability, electrical properties and adhesive strength.

In general formula (7), ^Z3 and ^Z4 are preferably each independently an alkylene group having 1 to 4 carbon atoms, more preferably an alkylene group having 2 to 4 carbon atoms, and particularly preferably an alkylene group having 2 to 3 carbon atoms such as an ethylene group, an ethylidene group, a propylene group, a propylidene group, or an isopropylidene group, and particularly preferably an ethylidene group, an isopropylidene group, or the like, that is, the aromatic epoxy compound is a compound having a bisphenol structure such as a bisphenol A type structure or a bisphenol F type structure, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In general formula (7), t is preferably 0 to 3, and more preferably 0 to 1. Also, u is preferably 0 to 10, and more preferably 0 to 5, and particularly preferably 0 to 2, and most preferably 0. By having t and u in the above ranges, the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

The divalent hydrocarbon groups represented by L1 and L2 in general formula (6-2) include, for example, aliphatic hydrocarbon groups and aromatic hydrocarbon ring-containing groups.

Examples of the aliphatic hydrocarbon group include linear or branched alkylene groups having 1 to 30 carbon atoms, and divalent groups containing an aliphatic ring having 3 to 30 carbon atoms.
Examples of the linear or branched alkylene group having 1 to 30 carbon atoms include a methylene group, an ethylidene group, a propylidene group, and an isopropylidene group.
The aliphatic ring may be a monocyclic structure or a condensed ring structure.
The aliphatic ring may be any ring that does not have aromaticity, and may be a saturated aliphatic ring that does not have an unsaturated bond such as an unsaturated double bond as a bond that constitutes the ring, or an unsaturated aliphatic ring that has an unsaturated bond as a bond that constitutes the ring, such as cyclohexene.
Examples of the aliphatic ring having a monocyclic structure include a cyclohexane ring, a cycloheptane ring, and a cyclodecane ring.
Examples of the fused aliphatic ring, which is an aliphatic ring having a fused ring structure, include fused aliphatic hydrocarbon rings such as an adamantane ring, a bornane ring, a norbornane ring, a tricyclodecane ring, a tetracyclododecane ring, a decalin ring, a cyclopentadiene ring, a dicyclopentadiene ring, and a tetrahydrodicyclopentadiene ring.
Divalent groups containing an aliphatic ring represented by L1 and L2 include aliphatic ring groups obtained by removing two hydrogen atoms from the aliphatic ring and groups in which one or more hydrogen atoms of the aliphatic ring group are substituted with a substituent. Examples of the substituent include alkylene groups having 1 to 4 carbon atoms and groups in which one or more methylene groups in the alkylene group are substituted with -O-, provided that the oxygen atoms are not adjacent to each other.

The aromatic hydrocarbon ring-containing group is a group that has an aromatic hydrocarbon ring.
As the aromatic hydrocarbon ring-containing group, an aromatic hydrocarbon ring-containing group having 6 to 30 carbon atoms can be used.
The aromatic hydrocarbon ring-containing group may have a monocyclic structure or a polycyclic structure.
The aromatic hydrocarbon ring-containing group having a polycyclic structure may be a condensed ring structure or may have two linked aromatic hydrocarbon rings.
The aromatic hydrocarbon ring-containing group in which two aromatic hydrocarbon rings are linked may be one in which two aromatic hydrocarbon rings of a monocyclic structure are linked, or one in which an aromatic hydrocarbon ring of a monocyclic structure and an aromatic hydrocarbon ring of a fused ring structure are linked, or one in which an aromatic hydrocarbon ring of a fused ring structure and an aromatic hydrocarbon ring of a fused ring structure are linked.
The linking group linking two aromatic hydrocarbon rings may be any group that can impart aromaticity to the aromatic hydrocarbon ring-containing group as a whole, and examples of such a linking group include a single bond, a sulfide group (-S-), and a carbonyl group.
Examples of the aromatic hydrocarbon ring having a monocyclic structure include benzene, toluene, ethylbenzene, and 2,4,6-trimethylbenzene.
Examples of the aromatic hydrocarbon ring having a condensed ring structure include naphthalene, anthracene, phenanthrene, and pyrene.
Examples of aromatic hydrocarbon ring-containing groups in which two aromatic hydrocarbon rings are linked include groups in which aromatic hydrocarbon rings having a monocyclic structure are linked, such as diphenyl sulfide and benzoylphenyl.

As the groups represented by L1 and L2 in general formula (6-2), aromatic hydrocarbon ring-containing groups and divalent groups containing an aliphatic ring are preferred, and aromatic hydrocarbon ring-containing groups are particularly preferred. The composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In the present disclosure, the aromatic hydrocarbon ring-containing group used in L1 and L2 is preferably an aromatic hydrocarbon ring-containing group having 8 to 20 carbon atoms, and more preferably an aromatic hydrocarbon ring-containing group having 10 to 15 carbon atoms, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
In the present disclosure, the aromatic hydrocarbon ring-containing group is preferably a polycyclic structure, and is preferably a group in which two aromatic hydrocarbon rings are linked, and is particularly preferably a group in which aromatic hydrocarbon rings of a monocyclic structure are linked, and is particularly preferably a group in which the linking group linking the aromatic hydrocarbon rings is a single bond, and is particularly preferably a biphenyl group-containing group.This is because the composition has a better balance of storage stability, electrical properties, and adhesive strength.In the present disclosure, the biphenyl group-containing group is preferably represented by formula (10).

（一般式（１０）中、Ｒ^１２１、Ｒ^１２２、Ｒ^１２３、Ｒ^１２４、Ｒ^１２５、Ｒ^１２６、Ｒ^１２７、Ｒ^１２８はそれぞれ独立に水素原子、ハロゲン原子又は炭素原子数１～４のアルキル基を表し、Ｒ^１３０、Ｒ^１３１はそれぞれ独立に直接結合又は炭素原子数１～４のアルキレン基を表す。）

(In general formula (10), R ¹²¹ , R ¹²² , R ¹²³ , R ¹²⁴ , R ¹²⁵ , R ¹²⁶ , R ¹²⁷ and R ¹²⁸ each independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms, and R ¹³⁰ and R ¹³¹ each independently represent a direct bond or an alkylene group having 1 to 4 carbon atoms.)

Examples of the alkyl group and halogen atom represented by R ¹²¹ to R ¹²⁸ in formula (10) include the same as those exemplified as R ⁶¹ in formula (6-2). Examples of the alkylene group represented by R ¹³⁰ and R ¹³¹ in formula (10) include the same as those exemplified as Z ³ in formula (7).

R ¹²¹ to R ¹²⁸ are preferably a hydrogen atom or an alkyl group having 1 to 2 carbon atoms, and particularly preferably a hydrogen atom, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
R ¹³⁰ and R ¹³¹ are preferably a direct bond or an alkylene group having 1 to 2 carbon atoms, and particularly preferably a methylene group, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In the present disclosure, the divalent group containing an aliphatic ring used for L1 and L2 is preferably a divalent group containing an aliphatic ring having 8 to 18 carbon atoms, and more preferably a divalent group containing a condensed aliphatic hydrocarbon ring having 8 to 18 carbon atoms, and even more preferably a divalent group containing a condensed saturated aliphatic hydrocarbon ring having 8 to 18 carbon atoms, and even more preferably a group represented by the following general formula (9). This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

（一般式（９）中、Ｒ^１１０及びＲ^１１１は、それぞれ独立に、直接結合、炭素原子数１～４のアルキレン基又は上記アルキレン基中のメチレン基の１つ又は２つ以上が酸素原子が隣り合わない条件で－Ｏ－で置換された基を表し、
＊は、結合箇所を表す。）

(In general formula (9), R ¹¹⁰ and R ¹¹¹ each independently represent a direct bond, an alkylene group having 1 to 4 carbon atoms, or a group in which one or more methylene groups in the alkylene group are substituted with -O- with the proviso that no oxygen atom is adjacent to each other;
* indicates the bonding site.)

When the groups represented by L1 and L2 in general formula (6-2) are groups represented by general formula (9), it is particularly preferred that R ¹¹⁰ and R ¹¹¹ are direct bonds, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Examples of the alkyl group having 1 to 4 carbon atoms represented by R ²¹ , R ²² and R ²³ in general formula (6-2) include the same groups as the alkyl groups having 1 to 4 carbon atoms represented by R ^62-1 and R ^63-1 in general formula (6-1).

In general formula (6-2), ^m1 and ^m3 are each preferably independently an integer of 0 to 3, more preferably an integer of 0 to 2, particularly preferably an integer of 0 to 1, and most preferably 0. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
^m2 is preferably an integer of 0 to 2, more preferably an integer of 0 to 1, and particularly preferably 0. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In general formula (6-2), n1 is preferably in the range of 40 to 100°C, more preferably 45 to 90°C, and particularly preferably 50 to 80°C, in which the softening point measured by the ring and ball method (JIS K5902) is in the range. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Commercially available products that can be suitably used as the aromatic epoxy compound include, for example, those described in Japanese Patent No. 6103653.

The total content of the aromatic epoxy compound and the aliphatic epoxy compound may be any content that provides a desired balance of storage stability, electrical properties, and adhesive strength, and is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, and even more preferably 90 parts by mass or more, in a total of 100 parts by mass of the epoxy compounds. By having the content within the above range, the composition has a better balance of storage stability, electrical properties, and adhesive strength.
When the epoxy compound contains only an aromatic epoxy compound among the aromatic epoxy compound and the aliphatic epoxy compound, the preferred range of the content of the aromatic epoxy compound can be the same as the preferred range of the total content of the aromatic epoxy compound and the aliphatic epoxy compound.
In addition, a preferred content of the total amount of the aromatic epoxy compound and the aliphatic epoxy compound containing an aliphatic ring in the epoxy compounds can be within the same range as the preferred ratio of the aromatic epoxy compound and the aliphatic epoxy compound in the total epoxy compounds.

(1-2) Aliphatic Epoxy Compound The aliphatic epoxy resin has an epoxy group and does not contain a cycloalkene oxide structure or an aromatic ring.
Examples of such aliphatic epoxy compounds include polyglycidyl ethers of aliphatic polyhydric alcohols or their alkylene oxide adducts; polyglycidyl esters of aliphatic long-chain polybasic acids; homopolymers synthesized by vinyl polymerization of glycidyl acrylate or glycidyl methacrylate; and copolymers synthesized by vinyl polymerization of glycidyl acrylate or glycidyl methacrylate with other vinyl monomers.
Representative compounds include glycidyl ethers of polyhydric alcohols such as diglycidyl ethers of diols, triglycidyl ethers of glycerin, triglycidyl ethers of trimethylolpropane, tetraglycidyl ethers of sorbitol, and hexaglycidyl ethers of dipentaerythritol; polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides to aliphatic polyhydric alcohols such as propylene glycol, trimethylolpropane, and glycerin; and diglycidyl esters of aliphatic long-chain dibasic acids.
Further examples include monoglycidyl ethers of higher aliphatic alcohols, monoglycidyl ethers of polyether alcohols obtained by adding alkylene oxides to phenol, cresol, butylphenol, or these, glycidyl esters of higher fatty acids, epoxidized soybean oil, epoxy octyl stearate, epoxy butyl stearate, and epoxidized polybutadiene.
Further, the aliphatic epoxy compound may also be a hydrogenated product of an aromatic epoxy compound, such as hydrogenated bisphenol A diglycidyl ether.
Examples of the aliphatic epoxy compound include compounds having, as a constituent unit, a structure in which an oxiranyl group is directly bonded via a single bond to a cycloalkyl ring derived from an epoxycycloalkyl ring, and having, as a main chain structure, a structure in which epoxy groups of the epoxycycloalkyl ring are polymerized together, such as a 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol.

As the aliphatic epoxy compound, both an aliphatic epoxy compound containing an aliphatic ring such as an aliphatic hydrocarbon ring or an aliphatic heterocycle (hereinafter, sometimes referred to as an aliphatic ring-containing epoxy compound) and an aliphatic epoxy compound without an aliphatic ring (hereinafter, sometimes referred to as a chain epoxy compound) are preferable, but among them, an aliphatic ring-containing epoxy compound is preferable, and an aliphatic hydrocarbon ring-containing epoxy compound having an aliphatic hydrocarbon ring is particularly preferable. This is because the inclusion of the aliphatic epoxy compound provides the composition with a better balance of storage stability, electrical properties, and adhesive strength.

The aliphatic hydrocarbon ring may be any ring in which the ring-forming atoms are only carbon atoms and which does not have aromaticity.
Furthermore, the aliphatic hydrocarbon ring is not limited to an aliphatic hydrocarbon ring structure, but also includes a group in which one or more hydrogen atoms of an aliphatic hydrocarbon ring structure are substituted with a straight-chain or branched alkyl group.
Examples of such an aliphatic hydrocarbon ring include a monocyclic aliphatic hydrocarbon ring such as a cyclohexane ring, and a polycyclic aliphatic hydrocarbon ring having a structure in which two or more monocyclic aliphatic hydrocarbon rings, such as an isobornyl ring, an adamantane ring, a dicyclopentene ring, a dicyclopentane ring, a tricyclodecane ring, a norbornene ring, and a norbornane ring, share one or more carbon atoms in the ring.

The aliphatic heterocycle may be any ring that contains atoms other than carbon atoms and does not have aromaticity, and examples of such rings include a pyrrolidine ring, a piperidine ring, a piperazine ring, a morpholine ring, a thiomorpholine ring, a homopiperidine ring, a homopiperazine ring, a tetrahydropyridine ring, a tetrahydroquinoline ring, a tetrahydroisoquinoline ring, a tetrahydrofuran ring, a tetrahydropyran ring, a dihydrobenzofuran ring, a tetrahydrocarbazole ring, a caprolactam ring, an isocyanuric ring, and a hydantoin ring.

As the aliphatic hydrocarbon ring-containing epoxy compound, a compound represented by the following general formula (6-3) is preferred. By including such an aliphatic hydrocarbon ring-containing epoxy compound, the composition has a better balance of storage stability, electrical properties, and adhesive strength.

（一般式（６－３）中、Ｒ^６２－２及びＲ^６３－２は、それぞれ独立に、水素原子又は炭素原子数１～４のアルキル基を表し、
ｒ２及びｓ２は、それぞれ独立に、０～５の数を表し、
Ｒ^６１－２は、下記一般式（８）又は一般式（９）を表す。）

(In general formula (6-3), R ^62-2 and R ^63-2 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms;
r2 and s2 each independently represent a number from 0 to 5;
R ^61-2 represents the following general formula (8) or general formula (9):

（一般式（８）中、Ｒ^９１は、水素原子又は炭素原子数１～４のアルキル基を表し、
Ｒ^９２、Ｒ^９３、Ｒ^９４、Ｒ^９５、Ｒ^９６、Ｒ^９７、Ｒ^９８、Ｒ^９９、Ｒ^１００、Ｒ^１０１、Ｒ^１０２、Ｒ^１０３、Ｒ^１０４、Ｒ^１０５、Ｒ^１０６及びＲ^１０７は、それぞれ独立に、水素原子、ハロゲン原子又は炭素原子数１～４のアルキル基を表し、
Ｚ^５及びＺ^６は、それぞれ独立に、単結合又は直鎖であっても分岐鎖を有していても環状であってもよい炭素原子数１～４のアルキレン基又は上記アルキレン基中のメチレン基の１つ又は２つ以上が酸素原子が隣り合わない条件で－ＣＯ－Ｏ－又はＯ－ＣＯ－で置換された基を表し、
ｖ及びｗは、それぞれ独立に、０～５の数を表し、
＊は、結合箇所を表す。）

(In the general formula (8), R ⁹¹ represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms;
R ⁹² , R ⁹³ , R ⁹⁴ , R ⁹⁵ , R ⁹⁶ , R ⁹⁷ , R ⁹⁸ , R ⁹⁹ , R ¹⁰⁰ , R ¹⁰¹ , R ¹⁰² , R ¹⁰³ , R ¹⁰⁴ , R ¹⁰⁵ , R ¹⁰⁶ and R ¹⁰⁷ each independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms;
^Z5 and ^Z6 each independently represent a single bond, an alkylene group having 1 to 4 carbon atoms which may be linear, branched or cyclic, or a group in which one or more methylene groups in the alkylene group are substituted with -CO-O- or O-CO-, provided that no oxygen atom is adjacent to each other;
v and w each independently represent a number from 0 to 5;
* indicates the bonding site.)

Examples of the alkyl group having 1 to 4 carbon atoms represented by R ^62-2 and R ^63-2 in the general formula (6-3) include the same groups as the alkyl groups having 1 to 4 carbon atoms represented by R ^62-1 and R ^63-1 in the general formula (6-1).

Examples of the alkyl group having 1 to 4 carbon atoms represented by R ⁹¹ and R ⁹² to R ¹⁰⁷ in general formula (8) include the same groups as the alkyl groups having 1 to 4 carbon atoms represented by R ⁶² and R ⁶³ in general formula (6-1).

Examples of the halogen atoms represented by ^R to ^R in general formula (8) include the same atoms as the halogen atoms substituting hydrogen atoms in the alkylene groups having 1 to 4 carbon atoms represented by ^Z and ^Z in general formula (7).

Examples of the alkylene group having 1 to 4 carbon atoms represented by ^Z5 and ^Z6 in the general formula (8) include the same groups as the alkylene group having 1 to 4 carbon atoms represented by ^Z3 and ^Z4 in the general formula (7).

General formula (9) can be the same as that used in general formula (6-2) above.

In formula (6-3), R ^61-2 is preferably a group represented by formula (8), because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In general formula (6-3), r2 and s2 are each preferably independently an integer of 0 to 3, more preferably an integer of 0 to 2, and even more preferably an integer of 0 to 1, and even more preferably 0. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In general formula (8), R ⁹² to R ¹⁰⁷ are preferably a hydrogen atom or an alkyl group having 1 to 2 carbon atoms, that is, a hydrogen atom, a methyl group, or an ethyl group, and more preferably a hydrogen atom, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In general formula (8), ^Z5 and ^Z6 are preferably each independently an alkylene group having 1 to 4 carbon atoms, more preferably an alkylene group having 2 to 4 carbon atoms, and particularly preferably an alkylene group having 2 to 3 carbon atoms such as an ethylene group, an ethylidene group, a propylene group, a propylidene group, or an isopropylidene group, and particularly preferably an ethylidene group, an isopropylidene group, or the like, that is, the aliphatic epoxy compound is preferably a compound having a hydrogenated bisphenol structure such as a hydrogenated bisphenol A structure or a hydrogenated bisphenol F structure, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

In general formula (8), v is preferably 0 to 3, and more preferably 0 to 1. Also, w is preferably 0 to 3, and more preferably 0 to 1, and most preferably 0. By setting v and w within the above ranges, the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Commercially available products that can be suitably used as the above-mentioned aliphatic epoxy compounds include, for example, those described in Japanese Patent No. 6103653.

(1-3) Alicyclic Epoxy Compound The alicyclic epoxy compound is a compound having a cycloalkene oxide structure.
The cycloalkene oxide structure is a structure in which an aliphatic ring and an epoxy ring share a part of a ring structure, such as a cyclohexene oxide structure or a cyclopentene oxide structure obtained by epoxidizing a cyclohexene ring-containing compound or a cyclopentene ring-containing compound with an oxidizing agent. In addition, a group obtained by removing one hydrogen atom from a cycloalkane in such a cycloalkene oxide structure is sometimes called an "epoxy cycloalkyl group".

More specifically, the alicyclic epoxy compounds include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4- Examples of such epoxycyclohexane-metadioxane include bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-epoxy-6-methylcyclohexylcarboxylate, methylene bis(3,4-epoxycyclohexane), dicyclopentadiene diepoxide, ethylene bis(3,4-epoxycyclohexanecarboxylate), dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, 3,4-epoxycyclohexylmethyl acrylate, and 3,4-epoxycyclohexylmethyl methacrylate.

In the present disclosure, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate are preferred. This is because the above compositions have an excellent balance of storage stability, electrical properties, and adhesive strength.

Commercially available products that can be suitably used as the above-mentioned alicyclic epoxy compounds include, for example, those described in Japanese Patent No. 6103653.

(1-4) Others The content of the epoxy compound may be any content that provides a desired balance of storage stability, electrical properties, and adhesive strength, but for example, it is preferably 60 parts by mass or more, more preferably 90 parts by mass or more, particularly preferably 95 parts by mass or more, and particularly preferably 100 parts by mass, that is, it is preferable that the cyclic ether component contains only the epoxy compound. This is because, when the content is within the above range, the composition has a better balance of storage stability, electrical properties, and adhesive strength.

(2) Oxetane Compound The oxetane compound is a compound having an oxetane ring and no epoxy group.
Examples of such oxetane compounds include 3-ethyl-3-hydroxymethyloxetane, 3-(meth)allyloxymethyl-3-ethyloxetane, (3-ethyl-3-oxetanylmethoxy)methylbenzene, 4-fluoro-[1-(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 4-methoxy-[1-(3-ethyl-3-oxetanylmethoxy)methyl]benzene, [1-(3-ethyl-3-oxetanylmethoxy)ethyl]phenyl ether, isobutoxymethyl(3-ethyl-3-oxetanylmethy ethyl diethylene glycol (3-ethyl-3-oxetanylmethyl) ether, dicyclopentadiene (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenyloxyethyl (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenyl (3-ethyl-3-oxetanylmethyl) ether, isobornyloxyethyl (3-ethyl-3-oxetanylmethyl) ether, isobornyl (3-ethyl-3-oxetanylmethyl) ether, 2-ethylhexyl (3-ethyl-3-oxetanylmethyl) ether, ethyl diethylene glycol (3-ethyl-3-oxetanylmethyl) ether, dicyclopentadiene (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenyl (3-ethyl-3-oxetanyl furfuryl (3-ethyl-3-oxetanylmethyl) ether, tetrahydrofurfuryl (3-ethyl-3-oxetanylmethyl) ether, tetrabromophenyl (3-ethyl-3-oxetanylmethyl) ether, 2-tetrabromophenoxyethyl (3-ethyl-3-oxetanylmethyl) ether, tribromophenyl (3-ethyl-3-oxetanylmethyl) ether, 2-tribromophenoxyethyl (3-ethyl-3-oxetanylmethyl) ether, 2-hydroxyethyl (3-ethyl-3-oxetanylmethyl) ether, 2-hydroxypropyl (3- ethyl-3-oxetanylmethyl) ether, butoxyethyl (3-ethyl-3-oxetanylmethyl) ether, pentachlorophenyl (3-ethyl-3-oxetanylmethyl) ether, pentabromophenyl (3-ethyl-3-oxetanylmethyl) ether, bornyl (3-ethyl-3-oxetanylmethyl) ether, 3,7-bis(3-oxetanyl)-5-oxa-nonane, 3,3'-(1,3-(2-methyleneyl)propanediylbis(oxymethylene))bis-(3-ethyloxetane), 1,4-bis[(3- 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, dicyclopentenyl bis(3-ethyl-3-oxetanylmethyl)ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether ter, tricyclodecanediyldimethylene (3-ethyl-3-oxetanylmethyl) ether, trimethylolpropane tris(3-ethyl-3-oxetanylmethyl) ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, polyethylene glycol bis(3-ethyl-3 -oxetanylmethyl) ether, dipentaerythritol hexakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol hexakis(3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether, ditrimethy Examples of such bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether include ethylene glycol-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, EO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, PO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, PO-modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, and EO-modified bisphenol F(3-ethyl-3-oxetanylmethyl)ether.

(3) Others The content of the cyclic ether component may be any content that provides a desired balance of storage stability, electrical properties, and adhesive strength, and is preferably 1 part by mass or more and 60 parts by mass or less, more preferably 3 parts by mass or more and 40 parts by mass or less, particularly preferably 5 parts by mass or more and 35 parts by mass or less, and particularly preferably 10 parts by mass or more and 30 parts by mass or less, per 100 parts by mass of the cyclic ether component, the ionic compound as the latent curing agent, and the elastomer in the composition. By having the content within the above range, the composition has a better balance of storage stability, electrical properties, and adhesive strength.

The content of the cyclic ether component may be any content that provides a desired balance of storage stability, electrical properties, and adhesive strength, but is preferably 1 part by mass or more and 60 parts by mass or less, more preferably 3 parts by mass or more and 40 parts by mass or less, particularly preferably 5 parts by mass or more and 30 parts by mass or less, and particularly preferably 8 parts by mass or more and 25 parts by mass or less, per 100 parts by mass of the total components of the composition other than the solvent. When the content is within the above range, the composition has a better balance of storage stability, electrical properties, and adhesive strength.

3. Elastomer Component The elastomer is contained as a component other than the above-mentioned ionic compound and cyclic ether component.
In addition, a compound having an elastomer component and a cyclic ether group such as an epoxy group, such as a rubber-modified epoxy compound, is considered to be an elastomer component.

(1) Types of elastomers Elastomers generally refer to amorphous, soft polymeric substances that exhibit the properties of rubber elastic bodies at room temperature. In the present disclosure, the elastomer is preferably one that can be plasticized (fluidized) by the application of heat and used for molding or processing, that is, a thermoplastic elastomer. The composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Known thermoplastic elastomers include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic-based elastomers, silicone-based elastomers, rubber-modified epoxy compounds, etc. In the present disclosure, one or more of the above may be used in combination.
Among them, in the present disclosure, a polymer having a structural unit having an aromatic ring in a side chain is preferred, and a styrene-based elastomer is particularly preferred, because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.
The aromatic ring may be the same as that used in an aromatic epoxy compound.
The main chain refers to the relatively longest bonded chain in a polymeric substance, and the side chain refers to a portion branched off from the main chain. Therefore, a structural unit having an aromatic ring in its side chain refers to a structure in which the aromatic ring is bonded to a bonded chain constituting the main chain.

Examples of styrene-based elastomers include polymers having structural units derived from styrene or its derivatives, and copolymers having structural units derived from styrene or its derivatives are preferred, with copolymers having structural units derived from styrene or its derivatives (hereinafter also referred to as "styrene units") and structural units derived from olefins (hereinafter also referred to as "olefin units") being particularly preferred. This is because the above composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

As styrene or a derivative thereof, in addition to styrene, a compound in which one or more hydrogen atoms in the benzene ring or α-position of styrene are substituted with an alkyl group having 1 to 6 carbon atoms can be used, such as α-methylstyrene, 3-methylstyrene, 4-propylstyrene, and 4-cyclohexylstyrene. As styrene or a derivative thereof, styrene or α-methylstyrene is preferable. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength. When the styrene-based elastomer is a copolymer, it may be a random copolymer or a block copolymer.

When the styrene-based elastomer is a block copolymer having a styrene unit and an olefin unit, the styrene-based elastomer is preferably a copolymer in which one or more blocks consisting of olefin units (hereinafter also referred to as "olefin blocks") and one or more blocks consisting of one or more styrene units (hereinafter also referred to as "styrene blocks") are arranged. One olefin block is composed of a plurality of olefin units, and one styrene block is composed of a plurality of styrene units. Examples of units derived from olefins include divalent groups obtained by removing two hydrogen atoms from ethane, ethylene, propylene, butane, butylene, butadiene, hydrogenated butadiene, isoprene, hydrogenated isoprene, or other α-olefins. When the styrene-based elastomer is a block copolymer having a styrene unit and an olefin unit, the styrene unit and the olefin unit preferably account for 50% by mass or more in total, and more preferably 80% by mass or more, in the styrene-based elastomer. The above composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Specific examples of styrene-based elastomers include block copolymers such as acrylonitrile-butadiene-styrene (ABS) resin, methyl methacrylate-butadiene-styrene (MBS) resin, heat-resistant ABS resin, styrene-butadiene-styrene (SBS) resin, styrene-isoprene-styrene (SIS) resin, styrene-butadiene-butylene-styrene (SBBS) resin, and methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin, as well as hydrogenated styrene-based elastomer resins such as styrene-ethylene-butylene-styrene (SEBS) resin, styrene-ethylene-propylene-styrene (SEPS) resin, styrene-ethylene-propylene (SEP) resin, and styrene-ethylene-ethylene-propylene-styrene (SEEPS) resin, in which the double bonds of these butadienes or isoprenes have been hydrogenated. These can be used alone or in a mixture of multiple resins. SBS may be referred to as "polystyrene-polybutadiene", SEBS may be referred to as "polystyrene-poly(ethylene/butylene)block-polystyrene", SEPS may be referred to as "(polystyrene-poly(ethylene/propylene)block-polystyrene)", SEEPS may be referred to as "(polystyrene-poly(ethylene-ethylene/propylene)block-polystyrene)", and SBBS may be referred to as "(polystyrene-poly(butadiene-butylene)block-polystyrene)". In the present disclosure, among these, SBS, SEBS, SEPS, and SEEPS are preferred, and SEBS, SEPS, and SEEPS are particularly preferred, with SEBS being the most preferred. This is because the above composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Examples of olefin-based elastomers include copolymers of α-olefins having 2 to 20 carbon atoms, such as ethylene, propylene, and 1-butene. Also included are copolymers of α-olefins and non-conjugated dienes having 2 to 20 carbon atoms, such as dicyclopentadiene, and carboxy-modified NBR obtained by copolymerizing methacrylic acid with a butadiene-acrylonitrile copolymer.
Examples of urethane-based elastomers include elastomers composed of structural units of a hard segment composed of low molecular weight ethylene glycol and diisocyanate, and a soft segment composed of a high molecular weight (long chain) diol and diisocyanate.
The polyester-based elastomer may be an elastomer obtained by polycondensation of a dicarboxylic acid or a derivative thereof with a diol compound or a derivative thereof.
Examples of polyamide-based elastomers include polyether block amide type elastomers and polyether ester block amide type elastomers, which use polyamide in the hard phase and polyether or polyester in the soft phase.
Examples of the acrylic elastomer include an acrylonitrile-butyl acrylate copolymer, an acrylonitrile-butyl acrylate-ethyl acrylate copolymer, and an acrylonitrile-butyl acrylate-glycidyl methacrylate copolymer.
Silicone-based elastomers contain organopolysiloxane as a main component, and examples thereof include polydimethylsiloxane, polymethylphenylsiloxane, and polydiphenylsiloxane.
Examples of rubber-modified epoxy compounds include epoxy compounds of epoxidized butadiene-styrene copolymers, polydimethylsiloxane, etc. Compounds obtained by modifying a part or all of the epoxy groups of the various epoxy compounds listed in the above "2. Cyclic ether component" with butadiene-acrylonitrile rubber modified at both ends with carboxylic acids, terminal amino-modified silicone rubber, etc. can also be used.

(2) Styrene Content When the elastomer in the present disclosure is a styrene-based elastomer, the content of styrene units in the styrene-based elastomer is preferably 30% by mass or more and 90% by mass or less, more preferably 40% by mass or more and 80% by mass or less, particularly preferably 45% by mass or more and 75% by mass or less, and particularly preferably 50% by mass or more and 70% by mass or less, because the composition has a better balance of storage stability, electrical properties, and adhesive strength.

(3) Physical properties (3-1) Physical property 1: MFR
When the elastomer is SBS, the MFR of the SBS measured at 200° C. under a load of 5 kgf is preferably 1 g/10 min or more and 20 g/10 min or less, and more preferably 2 g/10 min or more and 10 g/10 min or less, because the composition has a better balance of storage stability, electrical properties, and adhesive strength.
Furthermore, when the elastomer is SEBS, the MFR (2.16 kg) of the SEBS is preferably 0.5 g/10 min to 15 g/10 min, more preferably 1.0 g/10 min to 10 g/10 min, and particularly preferably 1.5 g/10 min to 5 g/10 min, because the composition has a better balance of storage stability, electrical properties, and adhesive strength.
MFR is measured in accordance with ISO 1133.

(3-2) Physical property 2: Density/specific gravity The density of the elastomer is preferably 0.9 g/cm3 or ^more and 1.5 g/ ^cm3 or less, more preferably 0.95 g/ ^cm3 or more and 1.2 g/ ^cm3 or less, and particularly preferably 0.96 g/ ^cm3 or more and 1.0 g/ ^cm3 or less. This is because the composition has a better balance of storage stability, electrical properties, and adhesive strength. Preferred ranges of the specific gravity of the elastomer include the same numerical ranges as those mentioned above except for the unit "g/ ^cm3 " from the density ranges. The density and specific gravity of the elastomer can be measured in accordance with ISO1183.

(4) Commercially Available Products Suitable elastomers include, for example, the following:
Tufprene (registered trademark) series: A, 125, 126S (styrene content 40%), Asaprene (registered trademark) series: T-411, T-432, T-437 (styrene content 30%), T-438 (styrene content 35%), T-439 (styrene content 45%) (all SBS), Tuftec (registered trademark) H series: H1221 (styrene content 12%), H1062, H1521 (styrene content 18%), H1052 (styrene content 20%), H1053 (styrene content 29%), H1 051 (42%), H1517 (43%), H1043 (67%) (all SEBS), Tuftec P series: P1083 (20%), P1500 (30%), P5051 (47%), P2000 (50%) (all SBBS), Tuftec M series: M1943 (20%), M1913, M1911, MP10 (30%) (all modified SEBS) (all manufactured by Asahi Chemical Industry Co., Ltd.);
Elastomer AR series (SEBS, manufactured by Aronkasei Co., Ltd.);
Kraton D Series: D0243, D0246, D1101, D1102, D1116, D1118, D1152, D1155, D1184, D1189, D1191, D1192, D4150, D4153, D4270, DX1000 (all SBS), D1111, D1113, D1114, D1117, D1119, D1124, D1126, D1161, D1162, D1163, D1164, D1170, D1171, D1173, D1183, D1193 (all SIS), Kraton G Series: A1535, A1536, G1633, G1640, G1641, G1642, G1643, G1645, G1650, G1651, G1652, G1654, G1657, G1660, G1701, G1702, G1726, G1730, G1740, G1765, G2705, G2708, G2806, G2832, G2836, G2874, G4609, G4610, G7705, G7720, G7723, G7820 (SEBS or SEPS) (manufactured by Kraton Polymer Japan Co., Ltd.);
TR series: TR2000 (40%), TR2001 (40%), TR2003 (43%), TR2250 (52%), 2500 (35%), TR2601 (30%), TR2787 (30%), TR2827 (24%), TR2086 (45%) (all SBS); SIS series: SIS5002 (22%), SIS5229 (15%), SIS5250 (20%), SIS5403 (15%), SIS5506 (16%) (all SIS); Dynaron (registered trademark) series: 8600P (15%), 8300P (9%), 8903P (35%), 9901P (all SEBS) (all manufactured by JSR Corporation);
Denka STR (SBS, manufactured by Denki Kagaku Kogyo Co., Ltd.);
Quintac (registered trademark) series: 3421 (14%), 3450 (19%), 3270 (24%), 3280 (25%), 3190 (30%), 3390 (48%), 3620 (14%), 3433N (16.5%), 3520 (15%) (all SIS), Zeofit series: ZFT1330 (SBS, 30%) (all manufactured by Zeon Corporation);
TPE-SB series (SEBS, manufactured by Sumitomo Chemical Co., Ltd.);
Labaron (registered trademark) series (SEBS, manufactured by Mitsubishi Chemical Corporation);
Septon (registered trademark) series: 1020 (SEP, 36%), 2002 (30%), 2004F (18%), 2005 (20%), 2006 (35%), 2063 (13%), 2104 (65%), (all SEPS), 4033 (30%), 4044 (32%), 4055 (30%), 4077 (30%), 4099 (30%) (all S EEPS), 8004 (same as above, 31%), 8006 (same as above, 33%), 8007L (same as above, 30%) (all SEBS), HG252 (same as above, SEEPS-OH), Hybla (registered trademark) series: 5125 (same as above, 20%), 5127 (same as above, 20%) (all SIS), 7125F (same as above, SEPS), 7311F (same as above, SEEPS) (all manufactured by Kuraray Co., Ltd.);
Leostomer, Actimer (both manufactured by RIKEN TECHNOS CORPORATION), etc.

(5) Content of elastomer In the total of 100 parts by mass of the elastomer, the cyclic ether component, and the ionic compound as the latent curing agent, the elastomer is 30 parts by mass or more. As a result, the composition of the present disclosure has excellent adhesive strength, electrical properties such as dielectric tangent, and solution stability. If the amount of elastomer is less than 30 parts by mass, the amount of epoxy increases accordingly, and the content of the ionic compound as the curing agent increases proportionately. Since the ionic compound has excellent electrical conductivity, if the amount added is too large, the electrical properties may decrease. It is preferable to set the amount of elastomer to a predetermined amount or less, because it is possible to more reliably prevent the adhesive strength from decreasing. From these viewpoints, in the total of 100 parts by mass of the elastomer, the cyclic ether component, and the ionic compound as the latent curing agent, the content of the elastomer is preferably 40 parts by mass or more and 95 parts by mass or less, particularly preferably 60 parts by mass or more and 93 parts by mass or less, and particularly preferably 70 parts by mass or more and 90 parts by mass or less. This is because the composition has a better balance of storage stability, electrical properties, and adhesive strength.

From the same viewpoint as above, the content of the elastomer is preferably 25 parts by mass or more and 95 parts by mass or less, more preferably 30 parts by mass or more and 90 parts by mass or less, even more preferably 40 parts by mass or more and 80 parts by mass or less, and particularly preferably 50 parts by mass or more and 70 parts by mass or less, out of a total of 100 parts by mass of the components other than the solvent of the composition. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

4. Resin components other than cyclic ether components and elastomers
(1) Type The composition may contain resin components other than the cyclic ether component and the elastomer (hereinafter also referred to as "other resin components").
The other resin components may be any resin that provides a desired balance of storage stability, electrical properties, and adhesive strength, but a resin having an aromatic ring in the main chain is preferred, and in particular, a resin having a phenylene ether skeleton is preferred, because the composition has a better balance of storage stability, electrical properties, and adhesive strength.
The phenylene ether skeleton herein refers to a structure having the following structure (X) as a structural unit constituting the main chain of a polymer.

（式中、*は結合箇所を表す。）

(In the formula, * represents a bonding site.)

As the resin having a phenylene ether skeleton, those having various reactive groups such as those having a hydroxyl group at the end, those having a glycidyl ether group, and those having an ethylenically unsaturated group such as an acrylate group or a vinyl group can be used, but among them, those having an ethylenically unsaturated group at the end are preferably used, and among them, those having a styrene group at the end are preferable, and specifically, those represented by the following general formula (2) are particularly preferable. This is because the above composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

（一般式（２）中、－（Ｏ－Ｘ－Ｏ）－は、下記一般式（ａ）で表される。－（Ｙ－Ｏ）－は、一般式（ｂ）で表される。複数存在するＹは同一であっても異なっていてもよい。ｎ２及びｎ３は、少なくともいずれか一方が０でない、０～１００の整数を示す。）

(In general formula (2), -(O-X-O)- is represented by the following general formula (a). -(Y-O)- is represented by general formula (b). A plurality of Y's may be the same or different. n2 and n3 each represent an integer of 0 to 100, with at least one of them not being 0.)

（一般式（ａ）中、Ｒ^１１、Ｒ^１２、Ｒ^１３、Ｒ^１４、Ｒ^１５、Ｒ^１６、Ｒ^１７、Ｒ^１８は、それぞれ独立に、水素原子、炭素原子数１～６のアルキル基又はフェニル基である。Ｌ３は直接結合又は２価の有機基である。）

(In general formula (a), R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , and R ¹⁸ each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group. L3 represents a direct bond or a divalent organic group.)

（一般式（ｂ）中、Ｒ^２７、Ｒ^２８は、それぞれ独立に、炭素原子数１～６のアルキル基又はフェニル基である。Ｒ^２９、Ｒ^３０は、それぞれ独立に、水素原子、炭素原子数１～６のアルキル基又はフェニル基である。）

(In general formula (b), R ²⁷ and R ²⁸ each independently represent an alkyl group having 1 to 6 carbon atoms or a phenyl group. R ²⁹ and R ³⁰ each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group.)

The alkyl group having 1 to 6 carbon atoms represented by R ¹¹ to R ¹⁸ in general formula (a) and R ²⁷ to R ³⁰ in general formula (b) includes those having a specified number of carbon atoms among the groups given above as examples of the alkyl group represented by R ¹ in general formula (1), and preferably has 1 to 3 carbon atoms. The composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

The divalent organic group represented by L3 in general formula (b) may, for example, be one having 1 to 12 carbon atoms, such as alkylidene groups such as methylene, ethylidene, 1-methylethylidene, and 1,1-propylidene, 1,4-phenylenebis(1-methylethylidene), 1,3-phenylenebis(1-methylethylidene), cyclohexylidene, phenylmethylene, naphthylmethylene, and 1-phenylethylidene.

As the compound represented by the general formula (2), X is preferably a compound represented by the general formula (a) in which R ¹¹ , R ¹² , R ¹³ , R ¹⁶ , R ¹⁷ , and R ¹⁸ are alkyl groups having 1 to 3 carbon atoms, and R ¹⁴ and R ¹⁵ are hydrogen atoms or alkyl groups having 1 to 3 carbon atoms, more preferably a compound represented by the general formula (a) in which R ¹¹ , R ¹² , R ¹³ , R ¹⁶ , R ¹⁷ , and R ¹⁸ are alkyl groups having 1 to 3 carbon atoms, and R ¹⁴ and R ¹⁵ are hydrogen atoms, and particularly preferably a compound represented by the general formula (a) in which R ¹¹ , R ¹² , R ¹³ , R ¹⁶ , R ¹⁷ , and R ¹⁸ are methyl groups, and R ¹⁴ and R ¹⁵ are hydrogen atoms. This is because the composition has a better balance of storage stability, electrical properties, and adhesive strength.

L3 in general formula (b) is preferably a direct bond or an alkylidene group having 1 to 12 carbon atoms, more preferably a direct bond or an alkylidene group having 1 to 5 carbon atoms, and most preferably a direct bond. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

As Y in general formula (b), it is preferable that R ²⁷ and R ²⁸ are alkyl groups having 1 to 3 carbon atoms, and R ²⁹ and R ³⁰ are hydrogen atoms or alkyl groups having 1 to 3 carbon atoms, it is preferable that R ²⁷ and R ²⁸ are methyl groups, and R ²⁹ and R ³⁰ are hydrogen atoms or alkyl groups having 1 to 3 carbon atoms, and it is most preferable that R ²⁷ and R ²⁸ are methyl groups, and R ²⁹ and R ³⁰ are hydrogen atoms. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

Commercially available resins having a phenylene ether skeleton include, for example, the OPE (bifunctional polyphenylene ether oligomer) series, such as OPE-2Gly, OPE-2St, and OPE-2EA manufactured by Mitsubishi Gas Chemical Co., Ltd., and Noryl PPO640, SA120, SA90, and SA9000 manufactured by SABIC Japan LLC.

The number average molecular weight of the other resin components is preferably 500 or more and 3,000 or less, more preferably 800 or more and 2,000 or less, and most preferably 1,000 or more and 1,500 or less. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength. The number average molecular weight of the other resin components is the molecular weight calculated as polystyrene by GPC.

(2) Preferred Content When the composition contains the other resin components, the amount of the other resin components is preferably 3 parts by mass or more and 75 parts by mass or less, more preferably 5 parts by mass or more and 50 parts by mass or less, still more preferably 15 parts by mass or more and 40 parts by mass or less, and particularly preferably 20 parts by mass or more and 30 parts by mass or less, relative to 100 parts by mass in total of the cyclic ether component, the elastomer, and the ionic compound as the latent curing agent, because the composition has a better balance of storage stability, electrical properties, and adhesive strength.

The amount of other resin components is preferably 5 parts by mass or more and 50 parts by mass or less, more preferably 10 parts by mass or more and 40 parts by mass or less, and particularly preferably 15 parts by mass or more and 30 parts by mass or less, based on a total of 100 parts by mass of the components other than the solvent in the composition of the present disclosure. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

5. Other Curing Agents The composition may contain a curing agent other than the ionic compound as a latent curing agent (hereinafter, may be simply referred to as other curing agents).

Examples of the other curing agents include thermal curing agents, and specifically, examples of the other curing agents include phenolic resins, polyamines, latent curing agents (hereinafter, may be referred to as latent curing agent 2 to distinguish them from ionic compounds), and acid anhydrides.
Examples of the latent curing agent 2 include a dicyandiamide type latent curing agent, an imidazole type latent curing agent, and a polyamine type latent curing agent.
As such other curing agents, for example, those described in JP 2019-038891 A can be used.
The other curing agent preferably contains a latent curing agent, and in particular, it is preferable to contain a dicyandiamide type latent curing agent, an imidazole type latent curing agent, etc. The composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

The dicyandiamide-type latent curing agent may be dicyandiamide alone or, if necessary, in combination with an epoxy resin curing accelerator described below.
Commercially available dicyandiamide-type latent curing agents include Omicure DDA-5 manufactured by PTI Japan Co., Ltd., and DICY7, DICY15, and DICY50 manufactured by Mitsubishi Chemical Corporation.

Imidazole-type latent curing agents include imidazole compounds and epoxy adduct-type imidazole compounds which are reaction products of imidazole compounds and epoxy compounds.

The imidazole compound used as the imidazole-type latent curing agent is one that does not have a structure obtained by reacting an imidazole structure with an epoxy structure, and examples thereof include 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, and 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine. imidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 1-cyanoethyl-2-undecylimidazole, and 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine.
In addition, the imidazole compound used in the production of an epoxy adduct type imidazole compound described later can also be used as an imidazole type latent curing agent.

The imidazole-type latent curing agent may be one of the imidazole compounds listed above, or two or more of them may be mixed together.

Commercially available imidazole compounds used as the imidazole-type latent curing agents include 2P4MHZ-PW (2-phenyl-4-methyl-5-hydroxymethylimidazole), 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazole), C11Z (2-undecylimidazole), C11Z-CN (1-cyanoethyl-2-undecylimidazole), C17Z (2-heptadecylimidazole), and 2E4MZ-CN (1-cyanoethyl-2-ethyl-4-methylimidazole). , 2PZ-CN (1-cyanoethyl-2-phenylimidazole), 2MZ-A (2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine), 2E4MZ-A (2,4-diamino-6-[2'-ethyl-4'methylimidazolyl-(1')]-ethyl-s-triazine), and 2MAOK-PW (2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct) (all trade names manufactured by Shikoku Chemical Industry Co., Ltd.).

Examples of the imidazole compound used in the production of the epoxy adduct type imidazole compound include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, and 2-phenylimidazole.
Examples of the epoxy compound used in the production of the epoxy adduct type imidazole compound include the compounds exemplified in the section "(1) Epoxy compound" of "2. Cyclic ether component" described below.

Commercially available imidazole-type latent hardeners include ADEKA HARDNER EH-5011S and ADEKA HARDNER EH-5046S. These can be used alone or as a suitable mixture.

The content of the other curing agent may be any amount that provides a desired balance of storage stability, electrical properties, and adhesive strength, but is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, particularly preferably 3 parts by mass or less, and particularly preferably 1 part by mass or less, relative to 100 parts by mass of the ionic compound as the latent curing agent. This is because the composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

6. Solvent The composition may contain a solvent, if necessary.
The above-mentioned solvent is liquid at room temperature (25° C.) and atmospheric pressure, capable of dispersing or dissolving each component in the composition, and does not react with each other or with each component such as the cyclic ether component, the latent curing agent, the elastomer component, other curing agents, etc.
Therefore, the cyclic ether component, latent curing agent, elastomer component, other curing agents, etc. are not included in the solvent even if they are liquid at room temperature (25° C.) and atmospheric pressure.

As such a solvent, either water or an organic solvent can be used, but organic solvents are preferred because the above composition can be easily made to have excellent storage stability.

Examples of the organic solvent include carbonates such as propylene carbonate, ethylene carbonate, 1,2-butylene carbonate, dimethyl carbonate, and diethyl carbonate; ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl isoamyl ketone, and 2-heptanone; polyhydric alcohols and derivatives thereof such as ethylene glycol, ethylene glycol monoacetate, diethylene glycol, diethylene glycol monoacetate, propylene glycol, propylene glycol monoacetate, dipropylene glycol, and monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether, and monophenyl ether of dipropylene glycol monoacetate; cyclic ethers such as dioxane; ethyl formate, methyl lactate, ethyl lactate, methyl acetate, and the like. Examples of the solvent include ethyl acetate, butyl acetate, methyl pyruvate, methyl acetoacetate, ethyl acetoacetate, ethyl pyruvate, ethyl ethoxyacetate, methyl methoxypropionate, ethyl ethoxypropionate, methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, methyl 2-hydroxy-3-methylbutanoate, 3-methoxybutyl acetate, and 3-methyl-3-methoxybutyl acetate; aromatic hydrocarbons such as toluene and xylene; and lactones such as γ-caprolactone, δ-caprolactone, ε-caprolactone, dimethyl-ε-caprolactone, δ-valerolactone, γ-valerolactone, and γ-butyrolactone. These solvents can be used alone or in the form of a mixed solvent of two or more kinds.
In the present disclosure, the organic solvent is preferably a ketone. This is because the composition can be easily made to have excellent storage stability. In addition, the organic solvent is easy to handle in terms of ease of manufacture, safety, etc.

The content of the solvent may be any content that provides a desired balance of storage stability, electrical properties, and adhesive strength, but is preferably 1 part by mass or more and 99 parts by mass or less, more preferably 30 parts by mass or more and 90 parts by mass or less, and particularly preferably 50 parts by mass or more and 80 parts by mass or less, per 100 parts by mass of the composition. This is because the composition can be easily made to have an excellent balance of storage stability, electrical properties, and adhesive strength. In addition, the applicability of the composition can be easily adjusted.

7. Composition The composition of the present disclosure contains a cyclic ether component, a latent curing agent, and an elastomer, and optionally contains other resin components, other curing agents, and a solvent, and may further contain other components as necessary.
Examples of the other components include various additives such as silane coupling agents, inorganic fillers, organic fillers, colorants such as pigments and dyes, photosensitizers, defoamers, thickeners, thixotropic agents, surfactants, leveling agents, flame retardants, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow adjusters, and adhesion promoters.
The other components may also include a radical polymerizable compound, a radical polymerization initiator (a photoradical polymerization initiator, a thermal radical polymerization initiator), and the like.
The other components may be added as necessary, and the total content of them is preferably 30 parts by mass or less per 100 parts by mass of the total of the cyclic ether component, the latent curing agent, and the elastomer. The composition has an excellent balance of storage stability, electrical properties, and adhesive strength.

The method for producing the composition is not particularly limited as long as it can uniformly mix the above components, and examples of the method include a method in which a latent curing agent and an elastomer are added to the cyclic ether component and mixed. As for the mixing method, a method using a known mixing device can be adopted, and examples of the method include a method using a three-roll mill, a sand mill, a ball mill, etc.

The uses of the above composition are not particularly limited as long as they require a balance between storage stability, electrical properties, and adhesive strength. Examples of the uses include adhesives, resist materials for printed wiring boards, resist inks, pigmented resist inks for car filters, semiconductor sealants, inks, plastic paints, paper printing, film coatings, glass coatings, shatterproof paints, furniture paints, and other coating fields, FRP, linings, and in the electronics field, display media such as insulating varnishes, insulating sheets, laminates, plasma display panels, and display elements, optical anisotropics such as retardation plates, polarizing plates, light polarizing prisms, and various optical filters, adhesives, insulating materials, structural materials, and optical waveguide clads.

In the present disclosure, the above-mentioned use is preferably as an adhesive, and in particular, it is preferably for bonding conductive materials and insulating materials, and for bonding insulating materials and insulating materials, because the effect of excellent adhesive strength and electrical properties can be effectively exhibited.
When the composition is used as an adhesive, the insulating material to be bonded can be a material used as an insulating substrate in a circuit board. For example, the insulating material can be a material having a dielectric loss tangent (1 GHz) of 0.01 or less.
Examples of such insulating materials include organic insulating materials such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), fluororesin (PTFE, etc.), polyphenylene ether, and liquid crystal polymer (LCP), and inorganic oxide materials such as glass.
An example of a combination of a conductive material and an insulating material is a combination of an organic insulating material and a metal material or a carbon material, such as a laminate formed by bonding a liquid crystal polymer film and copper foil.
Examples of combinations of insulating materials include combinations of organic insulating materials, such as a laminate formed by bonding a film of liquid crystal polymer to another film of liquid crystal polymer, and combinations of an organic insulating material such as a liquid crystal polymer with an inorganic oxide material such as glass.

B. Cured Product Next, the cured product of the present disclosure will be described.
The cured product of the present disclosure is a cured product of the composition of the present disclosure described above.

According to the present disclosure, since the above-mentioned composition is used, it is possible to provide a cured product having an excellent balance of storage stability, electrical properties, and adhesive strength.
The composition of the present disclosure is similar to that described in the above section "A. Composition," and therefore will not be described here.

The uses of the cured product of this disclosure may be the same as those described in the "A. Composition" section above.

The method for producing the cured product of the present disclosure may be any method capable of curing the composition of the present disclosure. The method for producing the cured product of the present disclosure may be the method described below in "C. Method for producing the cured product".

C. Method for Producing the Cured Product Next, a method for producing the cured product of the present disclosure will be described.
The method for producing a cured product according to the present disclosure is characterized by having a curing step of curing the cyclic ether components in the composition.

According to the present disclosure, by using the above-mentioned composition, it is possible to easily obtain a cured product that has an excellent balance of storage stability, electrical properties, and adhesive strength.

1. Curing Step The curing step in the present disclosure is a step of curing the cyclic ether components in the composition together.
In this step, the curing method may be any method capable of curing the cyclic ether components together, and examples of the method include a method in which a heat treatment is performed.

The heating temperature in the heat treatment may be any temperature that can stably cure the composition, and is appropriately set depending on the type of the latent curing agent, and may be, for example, 50° C. or higher and 250° C. or lower, preferably 100° C. or higher and 200° C. or lower, and particularly preferably 100° C. or higher and 190° C. or lower. The heating time may be 1 minute or higher and 2 hours or lower, preferably 3 minutes or higher and 1 hour and 30 minutes or lower, and preferably 5 minutes or higher and 70 minutes or lower. This is because the effect of the composition having an excellent balance of storage stability, electrical properties, and adhesive strength can be more effectively exhibited.
The composition may be the same as that described in the section "A. Composition", and therefore a description thereof will be omitted here.

2. Other steps The method for producing a cured product according to the present disclosure may include other steps as necessary. Examples of such steps include a pre-bake step in which the composition is heat-treated to remove the solvent in the composition before the curing step, and a step in which a coating film of the composition according to the present disclosure is formed before the curing step.

The heating conditions in the pre-baking step may be any conditions that can remove the solvent in the composition, for example, 70°C to 150°C for 30 to 300 seconds.

In the step of forming a coating film, the composition can be applied by known methods such as using a spin coater, roll coater, bar coater, die coater, curtain coater, various printing methods, and immersion. Such a coating film can be formed on a substrate.

The substrate can be appropriately selected depending on the application of the cured product, and examples of the substrate on which the cured product is formed include those described in the above section "A. Composition." After being formed on the substrate, the cured product of the present disclosure may be peeled off from the substrate and used, or transferred from the substrate to another adherend and used.

This disclosure is not limited to the above-described embodiments. The above-described embodiments are merely examples, and anything that has substantially the same configuration as the technical ideas described in the claims of this disclosure and provides similar effects is included within the technical scope of this disclosure.

The present disclosure will be described in more detail below with reference to examples, but the present disclosure is not limited to these examples. In the following examples, among Examples 1 to 26, Examples 1 to 4, 10, 12, and 13 are outside the scope of the present invention.

[Examples 1 to 26 and Comparative Examples 1 to 4]
Compositions were obtained by blending the components according to the formulations shown in Tables 1 to 4 below. The following materials were used for each component. The blending amounts in the tables indicate parts by mass of each component.

(Elastomer Component)
A1: Tufprene A (SBS manufactured by Asahi Kasei Corporation, styrene content 40% by mass, MFR 200° C., 5 kgf: 13 g/10 min, density 0.95 g/cm ³ )
A2: Asaprene T439 (SBS manufactured by Asahi Kasei Corporation, styrene content 45% by mass, density 0.95 g/cm ³ )
A3: Asaprene T438 (SBS manufactured by Asahi Kasei Corporation, styrene content 35% by mass, MFR 200° C., 5 kgf: 25 g/10 min, density 0.94 g/cm ³ )
A4: TR2250 (SBS manufactured by JSR, styrene content 52% by mass, MFR 200°C, 5kgf: 4g/10min, specific gravity 0.98)
A5: DYNARON9901P (SEBS manufactured by JSR, styrene content 53% by mass, MFR 230°C, 2.16kgf: 3.3g/10min, specific gravity 0.97)
A6: Tuftec H1043 (SEBS manufactured by Asahi Kasei Corporation, styrene content 67% by mass, MFR 230° C., 2.16 kgf: 2.0 g/10 min, density 0.97 g/cm ³ )
A7: Tuftec P2000 (SEBS manufactured by Asahi Kasei Corporation, styrene content 67% by mass, MFR 230° C., 2.16 kgf: 3.0 g/10 min, density 0.98 g/cm ³ )

(Cyclic Ether Component)
B1: A compound represented by the following formula (B1) (aromatic epoxy compound)
B2: Compound represented by the following formula (B2) (aliphatic epoxy compound, aliphatic ring-containing epoxy compound)
B3: Compound represented by the following formula (B3) (aromatic epoxy compound, aliphatic ring-containing epoxy compound, polyglycidyl ether of dicyclopentadiene-phenol polymer, "XD1000" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 254, softening point by ring and ball method 68 to 78°C)
B4: Compound represented by the following formula (B4) (aromatic epoxy compound, aromatic ring-containing epoxy compound, novolac-type epoxy compound having a biphenyl structure, "NC-3000" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 280, softening point by ring and ball method 53 to 63°C)

(Latent hardener)
C1: 1-Butyl-3-methylimidazolium dicyanamide (latent curing agent, ionic liquid compound, salt of nitrogen-containing heterocyclic cation and cyanate anion)

(Other resin components)
D1: Phenylene ether resin (other resin components, resin having a phenylene ether skeleton, (modified polyphenylene ether represented by the above general formula (2) (resin in which R ¹¹ , R ¹² , R ¹³ , R 16 , R ¹⁷ , and R ¹⁸ in general formula (a) are methyl groups, R ¹⁴ and R ¹⁵ are hydrogen atoms, and L3 is a direct bond, and in general formula (b) R ²⁷ and R ²⁸ are methyl groups, and R ^{29 and} R ³⁰ are hydrogen atoms, Mn=1200), "OPE1200st", manufactured by Mitsubishi Gas Chemical Co., Inc.)

(solvent)
E1: Methyl ethyl ketone (MEK)

[evaluation]
The adhesive strength, electrical properties, and storage stability of each composition obtained were evaluated according to the following procedures. The results are shown in Tables 1 to 4. In the tables, evaluation results columns with a diagonal line indicate that evaluation tests were not performed because a cured product could not be obtained or for other reasons.

1. Adhesion The compositions obtained in the examples and comparative examples were applied to an LCP substrate (Sumitomo Chemical Co., Ltd. E5508, thickness 2 mm) as a first substrate using a dispenser so that the thickness after curing (thickness of the adhesive layer) was 20 μm, and then the solvent was removed by heat treatment at 80° C. for 3 minutes.
Next, a copper substrate (a copper-clad laminate (number: No. 35) having a thickness of 1.6 mm, manufactured by Sanhayato) was placed on the dried coating film as a second substrate, and then heat treatment was performed at 180°C for 60 minutes to obtain a sample for evaluation.
Using this evaluation sample, peel strength was measured according to a method conforming to JIS K 6850 "Test method for tensile shear adhesive strength of adhesives". A small tabletop tester EZ-X (manufactured by Shimadzu Corporation) was used as the measuring device, and the shear adhesive strength (MPa) was measured under conditions of a measurement temperature of 25°C and a tensile speed of 5 mm/min. From the measurement results, the adhesive strength was evaluated according to the following criteria. The results are shown in Tables 1 to 4.

<Evaluation criteria>
++: 5 MPa or more +: 1 MPa or more and less than 5 MPa -: less than 1 MPa It can be determined that the greater the adhesive strength (MPa), the better the adhesive strength.

2. Electrical Properties 2 g of each of the compositions of the Examples and Comparative Examples was placed in a release-treated screw tube (20 cc) and heated at 60° C. for 12 hours to remove the solvent, thereby obtaining a resin film.
The resin film had a thickness of 500 μm. The obtained resin film was heated at 180° C. for 60 minutes to prepare a sample for evaluation.

The dielectric constant and dielectric loss tangent of the above evaluation samples were measured at a frequency of 1 GHz using an impedance/material analyzer E4991A manufactured by Agilent Technologies, and the samples were evaluated according to the following criteria. The results are shown in Tables 1 to 4.

<Evaluation criteria>
(Dielectric constant)
+++: less than 2.6 ++: 2.6 or more and less than 3.2 -: 3.2 or more It can be determined that the smaller the relative dielectric constant, the more excellent the electrical properties.

(Dielectric tangent)
+++: less than 0.005++: 0.005 or more and less than 0.01+: 0.01 or more and less than 0.015-: 0.015 or moreThe smaller the dielectric tangent, the more excellent the electrical properties can be determined to be.

3. Storage Stability The compositions of the Examples and Comparative Examples were left to stand at 23° C. for one week, after which the compositions were visually observed and the storage stability was evaluated according to the following criteria. The results are shown in Tables 1 to 4.
<Evaluation criteria>
++: No turbidity (white opacity) was observed.
+: Cloudiness (white turbidity) was observed, but no precipitate was observed.
-: Phase separation or precipitation was observed in the composition.
The composition is judged to have better storage stability when it has less turbidity and precipitates.

[summary]
From Tables 1 to 4, it was confirmed that the compositions of the Examples have an excellent balance of storage stability, electrical properties, and adhesive strength.

Claims (7)

A cyclic ether component;
A latent hardener;
A styrene-ethylene-butylene-styrene resin having a styrene content of 50% by mass or more and 90% by mass or less;
Including,
the latent curing agent is an ionic liquid compound containing a nitrogen-containing aromatic heterocyclic cation,
The content of the styrene-ethylene-butylene-styrene resin is 30 parts by mass or more in a total of 100 parts by mass of the cyclic ether component, the latent curing agent, and the styrene-ethylene-butylene-styrene resin. The composition according to claim 1, wherein the cyclic ether component includes at least one of an aromatic epoxy compound and an aliphatic epoxy compound containing an aliphatic ring. The composition according to claim 1 or 2, wherein the anion of the ionic liquid compound includes at least one of a cyanate-based anion and a carboxylate-based anion. The composition according to any one of claims 1 to 3, wherein the content of the ionic liquid compound is 0.1 parts by mass or more and 30 parts by mass or less per 100 parts by mass of the cyclic ether component and the ionic liquid compound combined. The composition according to claim 1 , further comprising a resin having a phenylene ether skeleton. A cured product of the composition according to any one of claims 1 to 5. A method for producing a cured product, comprising a curing step of curing the cyclic ether components in the composition according to claim 1 .