JP7660485B2 - Crystal devices and electronic equipment - Google Patents

Description

This disclosure relates to quartz crystal devices and electronic devices.

There is a crystal device in which a crystal vibration element that generates resonance is sealed inside a package and outputs a voltage signal corresponding to the vibration due to the resonance frequency. In a crystal device, the crystal vibration element has connection electrodes at its ends, and the connection electrodes are fixed to the base of the package with a conductive adhesive, and the remaining part, including the excitation electrode electrically connected to the connection electrode, is arranged in the air so that it does not come into contact with anything inside the package, thereby generating appropriate vibration.

As the resonant frequency of a quartz crystal vibration element increases, the quartz crystal vibration element becomes thinner. As quartz crystal vibration elements become smaller and lighter, the variation in the amount and position of conductive adhesive applied compared to their size and weight cannot be ignored, and it is becoming more difficult to fix the quartz crystal vibration element in the appropriate direction with adhesive so that the vibration part does not come into contact with the package. Patent Document 1 discloses a technology in which a substrate has a pier that comes into contact between the adhesive side end of the quartz crystal vibration element and the vibration part, and the vibration side end of the quartz crystal vibration element and the part directly below the pier are in contact with the substrate while the other end is bonded, and the pier is used as a lever to move the vibration side end of the quartz crystal vibration element in response to the shrinkage of the adhesive when it hardens, thereby appropriately lifting the vibration side end from the adhesive surface of the package and improving electrical characteristics such as phase noise characteristics related to vibration.

JP 2004-112420 A

However, with the above technology, when the adhesive is applied, it may flow through the gaps in the jetty along the back surface of the quartz crystal vibrating element, and after the adhesive hardens, it may adversely affect the vibration of the vibrating part of the quartz crystal piece.

Therefore, we provide a quartz crystal device and electronic device that have a quartz crystal vibration element that can vibrate more stably at a desired resonant frequency.

One aspect of the present disclosure is
A quartz crystal vibrating element including a quartz crystal piece, a mounting electrode located along one end of the quartz crystal piece, and an excitation electrode located farther from the one end than the mounting electrode and electrically connected to the mounting electrode;
a base having a mounting surface including a reference surface and a pad protruding upward from the reference surface and to which the mounting electrode is attached;
Equipped with
The substrate is
a first protrusion having a first overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
a second protruding portion having a second overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
having
the first overlapping portion is located farther from the one end than a part or the entirety of the mounting electrode;
the second overlapping portion is located farther from the one end than the first overlapping portion;
a height of the second overlapping portion from the reference plane is equal to or less than a height of the first overlapping portion from the reference plane;
the first protrusion is located within the pad in a plan view, and the second protrusion is located outside the pad in a plan view,
the second protrusion is between the excitation electrode and the mounting electrode in a planar perspective view, and the distance to the mounting electrode is shorter than the distance to the excitation electrode;
It is a quartz device.
Another aspect of the present disclosure is
A quartz crystal vibrating element having a quartz crystal piece and a plurality of mounting electrodes arranged in a direction along one end of the quartz crystal piece;
a base having a mounting surface including a reference surface and a pad protruding upward from the reference surface and to which the mounting electrode is attached;
Equipped with
The substrate is
a first protrusion having a first overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
a second protruding portion having a second overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
The number of electrodes is the same as the number of the mounting electrodes,
the first overlapping portion is located farther from the one end than a part or the entirety of the mounting electrode;
the second overlapping portion is located farther from the one end than the first overlapping portion;
a height of the second overlapping portion from the reference plane is equal to or less than a height of the first overlapping portion from the reference plane;
the first protrusion is located within the pad in a plan view, and the second protrusion is located outside the pad in a plan view ,
the quartz crystal vibrating element has a plurality of excitation electrodes each located farther from the one end than the plurality of mounting electrodes and electrically connected to the mounting electrodes;
the second protrusion is between the excitation electrode and the mounting electrode in a planar perspective view, and the distance to the mounting electrode is shorter than the distance to the excitation electrode;
It is a quartz device.
Another aspect of the present disclosure is
A quartz crystal vibrating element including a quartz crystal piece, a plurality of mounting electrodes arranged in a direction along one end of the quartz crystal piece, and a plurality of excitation electrodes each located farther away from the one end than the plurality of mounting electrodes and electrically connected to the mounting electrodes;
a base having a mounting surface including a reference surface and a pad protruding upward from the reference surface and to which the mounting electrode is attached;
Equipped with
The substrate is
a first protrusion having a first overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
a second protruding portion having a second overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
having
the first overlapping portion is located farther from the one end than a part or the entirety of the mounting electrode;
the second overlapping portion is located farther from the one end than the first overlapping portion;
a height of the second overlapping portion from the reference plane is equal to or less than a height of the first overlapping portion from the reference plane;
the base body has the first protrusions in the same number as the mounting electrodes and the second protrusions in the smaller number than the mounting electrodes;
At least a portion of the second protrusion extends across two or more of the mounting electrodes in a direction along the one end,
the second protrusion is between the excitation electrode and the mounting electrode in a planar perspective view, and the distance to the mounting electrode is shorter than the distance to the excitation electrode;
It is a quartz device.

This disclosure makes it possible to obtain a signal with a desired resonant frequency more stably.

1 is a diagram showing a configuration of a quartz crystal device according to an embodiment of the present invention; FIG. 11 is a plan view perspective view illustrating the positional relationship of protrusions. 1A to 1C are diagrams illustrating attachment of a quartz crystal vibration element to an electrode pad. 13A and 13B are diagrams showing a protrusion of a modified example.

Hereinafter, an embodiment will be described with reference to the drawings.
FIG. 1 is a diagram showing the configuration of a quartz crystal device 1 according to this embodiment.
The crystal device 1 includes a base 11, a crystal vibration element 12, a conductive adhesive 13, a lid 14, and components 15.

As shown in the cross-sectional view of FIG. 1(a) (attached to the module substrate 2 at the cross-sectional line CC in FIG. 1(b)) and the plan view of FIG. 1(b) (with the lid 14 removed), the base 11 has a side wall surface 112 located around one surface (top surface) and a box-like shape having a recess A surrounded by the side wall surface 112 and a bottom surface B (reference surface). An electrode pad 111 (pad) is located on the bottom surface B of the recess A, protruding upward from the bottom surface B and being one step higher. The bottom surface B and the electrode pad 111 together form the mounting surface of this embodiment.

The electrode pad 111 is connected to the crystal vibration element 12. The electrode pad 111 is electrically connected to the external connection pad 118 exposed on the outer surface of the base 11 by a conductor passing through the inside of the base 11. The electrode pad 111 may be located not only on its own thickness but also on the protruding portion of the bottom surface B. The bottom surface B has a protruding portion 113 (first protruding portion) and a protruding portion 114 (second protruding portion). These will be described later. The external connection pad 118 is connected to the module substrate 2 using, for example, solder, and enables the crystal device 1 to transmit and receive signals in the electronic device D equipped with the crystal device 1 and the module substrate 2.

The quartz crystal vibration element 12 has a quartz crystal blank 121, an excitation electrode 122, a mounting electrode 124, and an extraction electrode 125. The mounting electrode 124 is an electrode for mounting the quartz crystal vibration element 12 on the substrate 11, and is located near one end E1 on the +z side of the quartz crystal blank 121 (along one end E1), here in contact with one end E1, and is connected and fixed to the electrode pad 111 via the conductive adhesive 13, i.e., in a cantilevered state.

The excitation electrodes 122 are located on the lower surface side (opposite the bottom surface B, the -z side) and the upper surface side (+z side) of the crystal blank 121. Here, the pair of excitation electrodes 122 are in the same position when viewed from the top surface side. The excitation electrodes 122 are electrically connected to the mounting electrodes 124 via the corresponding lead electrodes 125. As shown in FIG. 1B, the mounting electrodes 1241 connected to the lead electrodes 1251 located on the upper surface side extend over both the upper and lower surfaces. As a result, the external connection pads 118 and the excitation electrodes 122 are connected via the conductive adhesive 13 on the lower surface side of the crystal vibration element 12, and a voltage signal is applied to the excitation electrodes 122 to vibrate (excite) the crystal blank 121, or the voltage generated between the excitation electrodes 122 is output to the external connection pads 118.

The quartz crystal piece 121 has a thickness according to the resonant frequency of the output target. Typically, the higher the resonant frequency, the thinner the quartz crystal piece 121. Although not particularly limited, here, the quartz crystal piece 121 has a resonant frequency of 50 to 100 MHz or higher. Note that the quartz crystal piece 121 is not limited to having a uniform thickness throughout. The portion of the mounting electrode 124 may be thicker than the thickness of the contact area with the excitation electrode 122 that generates vibration and its surroundings (these will be referred to as the vibrating portion), and the quartz crystal piece 121 may further have a relatively thick portion surrounding the vibrating portion.

The vibrating portion of the quartz crystal vibration element 12 is fixed above the bottom surface B of the recess A so that the vibrating portion does not come into contact with the bottom surface B during vibration. Due to the height of the electrode pad 111 and the thickness of the conductive adhesive 13, the quartz crystal vibration element 12 only needs to be fixed above the bottom surface B and approximately parallel to the bottom surface B.

The lid 14 is joined to the upper end surface of the side wall surface 112 surrounding the recess A of the base 11 by a brazing material or the like. A frame-shaped metallized layer (not shown) having approximately the same shape as the side wall surface 112 in a plan view may be located between the side wall surface 112 and the lid 14. The metallized layer may be a conductive layer that is applied and fired, or may be a plating layer or the like. The lid 14 seals the recess A, blocking the entry and exit of air, dust, and the like from the outside. The base 11 and the lid 14 form a housing that houses the quartz crystal vibration element 12 inside in the quartz crystal device 1 of this embodiment.

The component 15 is located on the bottom side of the base 11. The component 15 may be an electronic component such as an IC chip, or a sensor such as a temperature measuring element (such as a thermistor). The component 15 may also be a combination of multiple components of the same type or multiple types. These output additional information related to the adjustment of the resonant frequency of the crystal vibration element 12, or perform adjustments according to the additional information, that is, the crystal device 1 may be a crystal oscillator. The position of the component 15 may not be near the center of the bottom surface when viewed from above, but may be offset.

Here, the base 11 is not particularly limited, but may be, for example, a ceramic material, a semiconductor material, a glass material, or a combination of these, and has conductive signal lines (including those related to power supply and grounding) inside or on the surface, etc. The conductive electrode pads 111 may be, for example, printed on the base 11, and the uppermost surface thereof may be, for example, gold-plated.
Furthermore, the conductive adhesive 13 may be, for example, a resin-based adhesive (such as an epoxy resin) containing a silver filler.
The cover 14 is a flat plate of a metal conductor, for example, a metal containing iron, copper, nickel, chromium, cobalt, molybdenum, or tungsten, or an alloy of these metals.

Next, the protrusions 113 and 114 of the base 11 will be described.
2 is a plan view perspective view for explaining the positional relationship between the protruding portions 113 and 114. Here, anything other than the lid 14 that is on the upper side is indicated by dashed lines, dotted lines, or the like.

On the bottom surface B of the recess A, two electrode pads 111 (electrode pads 1111 and 1112, respectively) are arranged in the y direction near the end on the +x side. Mounting electrodes 124 (mounting electrodes 1241 and 1242, respectively) are bonded to these electrode pads 1111 and 1112 on the underside of the quartz crystal vibration element 12 via conductive adhesive 13 (conductive adhesives 131 and 132, respectively).

The protrusion 1131 is located on the electrode pad 1111 (inside the electrode pad 1111 in planar perspective), and the protrusion 1132 is located on the electrode pad 1112 (inside the electrode pad 1112 in planar perspective). The protrusions 1131 and 1132 are located on the -x side of the mounting electrodes 1241 and 1242, i.e., near the ends farther from the one end E1 (i.e., located farther from the one end E1 than part or all of the mounting electrodes 1241 and 1242), and here, the entirety (first overlapping portion) overlaps with the quartz crystal vibrating element 12 in planar perspective. The conductive adhesives 131 and 132 bond the electrode pads 1111 and 1112 to the mounting electrodes 1241 and 1242 on the +x side of the protrusions 1131 and 1132.
1A, the height of the protrusion 113 from the bottom surface B is approximately the same as the height of the quartz vibrating element 12 (quartz blank 121) at the same position from the bottom surface B in a plan view. In other words, the protrusion 113 may be in contact with the quartz vibrating element 12 (mounting electrode 124). This defines the height of the quartz vibrating element 12 from the bottom surface B. In addition, the protrusions 1131 and 1132 function as jetties that suppress the conductive adhesives 131 and 132 from flowing along the quartz vibrating element 12 to the vibrating portion.

The protrusions 1141 and 1142 are located on the side (-x side) farther from one end E1 than the electrode pads 1111 and 1112 and the protrusions 1131 and 1132 (first overlapping portion). In this embodiment, the protrusions 1141 and 1142 may have the same shape as the protrusions 1131 and 1132, respectively, and are located directly on the bottom surface B (i.e., outside the electrode pads 1111 and 1112 in a planar perspective), so that their height from the bottom surface B (reference surface) is lower (or less) than the protrusions 1131 and 1132 by the height of the electrode pads 1111 and 1112. The protrusions 1141 and 1142 overlap at least partially, and here entirely, with the crystal vibration element 12 in a planar perspective (second overlapping portion). However, the protrusions 1141 and 1142 do not contact the crystal vibration element 12.

The protrusions 1141, 1142 are located between the positions of the mounting electrodes 1241, 1242 and the excitation electrodes 1221, 1222, respectively, in a planar perspective view, and in particular are located on the +x side of the midpoint (midline) between the -x side ends of the mounting electrodes 1241, 1242 and the +x side ends of the excitation electrodes 1221, 1222, i.e., closer to the mounting electrodes 1241, 1242 than to the excitation electrodes 1221, 1222.
The conductive adhesives 131 and 132 are prevented from spilling out onto the vibrating portion side by the protruding parts 1131 and 1132 .

The protrusions 113, 114 may protrude directly from the bottom surface B, or may be separately joined to the bottom surface B. The material of the protrusions 113, 114 may be the same as that of the base 11, or may be the same as that of the electrode pad 111. Alternatively, the protrusions 113, 114 may be made of a material different from that of both the base 11 and the electrode pad 111. Note that when the protrusion 113 is made of the same material as that of the electrode pad 111, the surface of the protrusion 113 does not need to be gold-plated or the like.

FIG. 3 is a diagram for explaining the attachment of the quartz crystal vibrating element 12 to the electrode pads 111. As shown in FIG.
When the quartz crystal vibration element 12 becomes very thin and lightweight, it becomes difficult to adhere and fix it with the conductive adhesive 13 while maintaining the horizontal state (parallel state to the bottom surface B). In particular, since the conductive adhesive 13 shrinks when hardening, if it is adhered to only one end E1 of the quartz crystal vibration element 12, the conductive adhesive 13 will pull the end E1 downward when hardening. As a result, if the quartz crystal vibration element 12 is parallel to the bottom surface B from the beginning, the other end E2 of the quartz crystal vibration element 12 will be excessively raised and the other end E2 may come into contact with the lid 14 when the vibrating part vibrates.

As shown in FIG. 3(a), conductive adhesive 13 is applied to the electrode pad 111 on the one end E1 side of the protrusion 113. Then, as shown in FIG. 3(b), the crystal vibration element 12 is placed at an angle so that the other end E2 is in contact with or close to the bottom surface B, with the protrusions 113 and 114 as fulcrums. At this time, the conductive adhesive 13 pressed by the crystal vibration element 12 spreads quickly to the outside (-x side) of the electrode pad 111 through the narrow gap with the protrusion 113, and a portion 135 protrudes. This spread is prevented by the protrusion 114. Then, when the conductive adhesive 13 hardens, the other end E2 of the crystal vibration element 12 is lifted and separated from the bottom surface B by an appropriate angle, as shown in FIG. 3(c). At the same time, the crystal vibration element 12 also separates from the protrusion 114. As a result, when the crystal piece 121 actually vibrates, the protrusion 114 does not come into contact with the crystal vibration element 12, so the protrusion 114 does not adversely affect the vibration or damage the crystal piece 121. In addition, the adhesion of the conductive adhesive 13 to the vibrating part side rather than the position that initially contacts the protrusion 114 is more reliably prevented, thereby more reliably preventing deterioration of the vibration characteristics of the crystal piece 121.

On the other hand, since the protruding portion 135 of the conductive adhesive 13 may have some adverse effect on vibration, it is preferable that this length is short. In other words, the protrusion 114 is positioned close to the protrusion 113. Here, the protrusion 114 is preferably located such that the distance L2 from the mounting electrode 124 side is less than half the distance L1 between the -x side end of the electrode pad 111 or the mounting electrode 124 and the +x side end of the excitation electrode 122 in a planar perspective view as described above, that is, the protrusion 114 is located closer to one end E1 than the midpoint of the line segment connecting the two electrodes. Note that the ratio of the distance between the upper ends of the protrusions 113 and 114 and the height difference becomes the initial inclination of the quartz crystal vibration element 12, so the distance may be within a range in which this inclination can be determined with precision.

Note that, before the conductive adhesive 13 hardens, the crystal vibration element 12 can be more stably bonded by contacting the other end E2 with the bottom surface B at the same time as the protrusions 113 and 114, but this is not limited to this. In other words, the ratio of the height of the protrusion 113 to the length (distance) from the contact point between the protrusion 113 and the crystal vibration element 12 to the other end E2 is equal to or less than the ratio of the height of the protrusion 114 to the length (distance) from the point where the protrusion 114 contacts the crystal vibration element 12 to the other end E2 in the initial state.

[Modification]
4A is a plan view perspective view showing a protrusion 114a of the first modified example, and FIG. 4B is a cross-sectional view showing a protrusion 113b of the second modified example.
4A may be wider in the y direction than the protrusion 113 in order to prevent the conductive adhesive 13 from spreading. For example, the protrusion 114a may be a common protrusion that extends across the ranges in the y direction of the protrusions 1141 and 1142 in the above embodiment.

The protrusion 113b shown in FIG. 4(b) is located outside the electrode pad 111 together with the protrusion 114b in a plan view. In this case, the different heights from the bottom surface B of the protrusions 113b and 114b means that the respective heights are different. Even with such protrusions 113b and 114b, the protrusion 114b can suppress the spread of the conductive adhesive 13 to the vibration portion and can separate the protrusion 114b from the quartz vibration element 12.

As described above, the quartz crystal device 1 of this embodiment includes the quartz crystal vibrating element 12 having the quartz crystal blank 121 and the mounting electrode 124 located along one end E1 of the quartz crystal blank 121, and the base 11 having a mounting surface including a bottom surface B and an electrode pad 111 protruding upward from the bottom surface B and to which the mounting electrode 124 is attached. The base 11 has a first overlapping portion that overlaps with the quartz crystal vibrating element 12 in a planar perspective and a protrusion 113 that protrudes upward from the mounting surface, and a second overlapping portion that overlaps with the quartz crystal vibrating element 12 in a planar perspective and a protrusion 114 that protrudes upward from the mounting surface. The first overlapping portion (protrusion 113) is located farther from one end E1 than part or all of the mounting electrode 124, the second overlapping portion (protrusion 114) is located farther from one end E1 than the first overlapping portion (protrusion 113), and the height of the second overlapping portion (protrusion 114) from the bottom surface B is less than or equal to the height of the first overlapping portion (protrusion 113) from the bottom surface B.
By arranging the protrusions 113 and 114 in two rows in this way, the height of the crystal vibration element 12 in the initial state can be appropriately determined by one (protrusion 113), while the other (protrusion 114) can more reliably prevent the conductive adhesive 13 from flowing out to the vibration part. This makes it possible to prevent deterioration of vibration characteristics. In addition, when the conductive adhesive 13 hardens and the crystal vibration element 12 becomes approximately parallel to the bottom surface B, the crystal vibration element 12 and the protrusion 114 are separated, so that the protrusion 114 does not adversely affect the resonance of the crystal vibration element 12. Therefore, with this crystal device 1, it is possible to obtain vibration with a suitable resonance frequency more reliably than before.

In addition, the protrusion 113 is located inside the electrode pad 111 in a planar perspective, and the protrusion 114 is located outside the electrode pad 111 in a planar perspective. By positioning the protrusion 113 that ultimately contacts the quartz crystal vibration element 12 inside the electrode pad 111, the protrusion 113 does not adversely affect the resonance. In addition, by providing the protrusion 113 on the electrode pad 111 that originally protrudes from the bottom surface B, the height of the protrusion 113 from the electrode pad 111 and the height of the protrusion 114 from the bottom surface B can be the same, making manufacturing easier.

The protrusion 113 is also in contact with the mounting electrode 124. In addition to the above, the surface of the protrusion 113 is conductive and continues from the electrode pad 111, so that the protrusion 113 can serve as a path that electrically connects the electrode pad 111 and the mounting electrode 124, making it possible to transmit signals more stably.

The quartz crystal vibration element 12 also has an excitation electrode 122 that is located further away from one end E1 than the mounting electrode 124 and is electrically connected to the mounting electrode 124, and the protrusion 114 is located between the excitation electrode 122 and the mounting electrode 124 in a planar perspective view, and is located at a position where the distance to the mounting electrode 124 is shorter than the distance to the excitation electrode 122. In this way, the position of the protrusion 114, i.e., the range over which the conductive adhesive spreads, can be limited to a narrow range around the electrode pad 111, thereby reducing the adverse effect of the spread of the conductive adhesive 13 on resonance.

The quartz crystal vibration element 12 also has a plurality of mounting electrodes 124 aligned in a direction along one end E1, and a plurality of excitation electrodes 122 each positioned farther away from the one end E1 than the mounting electrodes 124 and electrically connected to the mounting electrodes 124, and the base 11 may have the same number of protrusions 113 and protrusions 114 as the mounting electrodes 124. In other words, by having protrusions 114 in accordance with the adhesion range of each mounting electrode 124, it is possible to efficiently and reliably prevent the conductive adhesive 13 from flowing out to the vibration portion.

Alternatively, the base 11 may have the same number of protrusions 113 as the mounting electrodes 124, and a smaller number of protrusions 114 than the mounting electrodes 124, and at least a portion of the protrusions 114 may extend across the range of two or more mounting electrodes 124 in a direction along one end E1.
In other words, the outflow of the conductive adhesive 13 is commonly suppressed by the protrusion 114 that is long in the y direction, so that the conductive adhesive 13 can also be prevented from wrapping around the protrusion 114, and the outflow to the vibrating part and the resulting adverse effects on resonance can be more reliably suppressed.

The electronic device D of this embodiment also includes the above-mentioned crystal device 1. With this electronic device D, it is possible to vibrate the crystal vibration element 12 more stably at the desired resonant frequency.

The above-described embodiment is merely an example, and various modifications are possible.
For example, in the above embodiment and modified examples, an example has been described in which the protrusion 113 is located on the electrode pad 111 and outside the electrode pad 111, but it may be located across the inside and outside of the electrode pad 111.

In addition, in the above embodiment, the protrusions 113 and 114 are described as being in a positional relationship in which they entirely overlap the quartz vibration element 12 in a planar perspective view, but it is also possible that they do not overlap in part with the quartz vibration element 12.

In addition, in the above embodiment, the shape of the protrusions 113, 114 is shown as a square frustum shape when viewed from above, but this is not limited to this. The upper ends of the protrusions 113, 114 may be rounded, or the upper surfaces may be inclined according to the initial inclination of the quartz crystal vibration element 12. Furthermore, the shapes of the protrusions 113 and 114 do not have to be the same (including cases where the heights are different).

In addition, the position of the protrusion 114 does not necessarily have to be located on the side of the mounting electrode 124 from the midpoint between the opposing portions of the mounting electrode 124 and the excitation electrode 122.

In addition, in the above embodiment, the height of the protrusion 114 from the bottom surface B is set lower than the height of the protrusion 113 from the bottom surface B, so that the crystal vibration element 12 becomes approximately parallel to the bottom surface B after the conductive adhesive 13 hardens. However, if there is no problem with the crystal vibration element 12 being slightly upward, the heights of the protrusion 114 and the protrusion 113 from the bottom surface B may be the same.

In addition, in the above embodiment, the mounting electrode 124 is described as being in contact with one end E1, but it does not necessarily have to be in contact, as long as it is located close to (along) one end E1.

In addition, in the above embodiment, two sets of mounting electrodes 124 (1241, 1242) and excitation electrodes 122 (1221, 1222) are described, but the number of these is not limited, and the contents of this disclosure may be applied to only some of the mounting electrodes 124.

In the above embodiment, the crystal device 1 is described in which the crystal vibration element 12 is housed in the recess A of the base 11 having the recess A and sealed with the flat lid 14, but this is not limited to the above. For example, the crystal device 1 may be configured such that the crystal vibration element 12 is bonded onto the reference surface of the flat base 11 and the crystal vibration element 12 is sealed with the lid 14 having a recess that covers the crystal vibration element 12.

In the above embodiment, the crystal device 1 is described as a part of the electronic device D attached to the module substrate 2, but the crystal device 1 may be manufactured and distributed as a standalone device.
In addition, the specific configurations, contents and procedures of the processing operations, etc. shown in the above embodiments can be modified as appropriate without departing from the spirit of the present invention. The scope of the present invention includes the scope of the invention described in the claims and its equivalents.

1 Crystal device 2 Module substrate 11 Base body 111, 1111, 1112 Electrode pad 112 Side wall surface 113, 1131, 1132, 113b, 114, 1141, 1142, 114a, 114b Protrusion 118 External connection pad 12 Crystal vibrating element 121 Crystal blank 122, 1221, 1222 Excitation electrode 124, 1241, 1242 Mounting electrode 125, 1251 Extraction electrode 13 Conductive adhesive 131, 132 Conductive adhesive 135 Part 14 Lid 15 Part A Recess B Bottom surface D Electronic device E1 One end E2 Other end

Claims (6)

A quartz crystal vibrating element including a quartz crystal piece, a mounting electrode located along one end of the quartz crystal piece, and an excitation electrode located farther from the one end than the mounting electrode and electrically connected to the mounting electrode;
a base having a mounting surface including a reference surface and a pad protruding upward from the reference surface and to which the mounting electrode is attached;
Equipped with
The substrate is
a first protrusion having a first overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
a second protruding portion having a second overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
having
the first overlapping portion is located farther from the one end than a part or the entirety of the mounting electrode;
the second overlapping portion is located farther from the one end than the first overlapping portion;
a height of the second overlapping portion from the reference plane is equal to or less than a height of the first overlapping portion from the reference plane;
the first protrusion is located within the pad in a plan view, and the second protrusion is located outside the pad in a plan view,
the second protrusion is between the excitation electrode and the mounting electrode in a planar perspective view, and the distance to the mounting electrode is shorter than the distance to the excitation electrode;
Crystal device. A quartz crystal vibrating element having a quartz crystal piece and a plurality of mounting electrodes arranged in a direction along one end of the quartz crystal piece;
a base having a mounting surface including a reference surface and a pad protruding upward from the reference surface and to which the mounting electrode is attached;
Equipped with
The substrate is
a first protrusion having a first overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
a second protruding portion having a second overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
The number of electrodes is the same as the number of the mounting electrodes,
the first overlapping portion is located farther from the one end than a part or the entirety of the mounting electrode;
the second overlapping portion is located farther from the one end than the first overlapping portion;
a height of the second overlapping portion from the reference plane is equal to or less than a height of the first overlapping portion from the reference plane;
the first protrusion is located within the pad in a plan view, and the second protrusion is located outside the pad in a plan view ,
the quartz crystal vibrating element has a plurality of excitation electrodes each located farther from the one end than the plurality of mounting electrodes and electrically connected to the mounting electrodes;
the second protrusion is between the excitation electrode and the mounting electrode in a planar perspective view, and the distance to the mounting electrode is shorter than the distance to the excitation electrode;
Crystal device. A quartz crystal vibrating element including a quartz crystal piece, a plurality of mounting electrodes arranged in a direction along one end of the quartz crystal piece, and a plurality of excitation electrodes each located farther away from the one end than the plurality of mounting electrodes and electrically connected to the mounting electrodes;
a base having a mounting surface including a reference surface and a pad protruding upward from the reference surface and to which the mounting electrode is attached;
Equipped with
The substrate is
a first protrusion having a first overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
a second protruding portion having a second overlapping portion that overlaps with the crystal vibrating element in a plan view and protruding upward from the mounting surface;
having
the first overlapping portion is located farther from the one end than a part or the entirety of the mounting electrode;
the second overlapping portion is located farther from the one end than the first overlapping portion;
a height of the second overlapping portion from the reference plane is equal to or less than a height of the first overlapping portion from the reference plane;
the base body has the first protrusions in the same number as the mounting electrodes and the second protrusions in the smaller number than the mounting electrodes;
At least a portion of the second protrusion extends across two or more of the mounting electrodes in a direction along the one end,
the second protrusion is between the excitation electrode and the mounting electrode in a planar perspective view, and the distance to the mounting electrode is shorter than the distance to the excitation electrode;
Crystal device. 4. The crystal device according to claim 3 , wherein the first protrusion is located inside the pad when viewed from above, and the second protrusion is located outside the pad when viewed from above. The quartz crystal device according to claim 1 , wherein the first protrusion is in contact with the mounting electrode. An electronic device comprising the crystal device according to any one of claims 1 to 5 .

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