JP7661858B2 - Soldering Equipment - Google Patents

Description

This disclosure relates to a soldering device.

For example, as disclosed in Patent Document 1, a soldering device is considered to have a cylindrical iron, or so-called "sleeve," as a component for melting solder. This type of soldering device has a heater on the outside of the sleeve. The heater heats the sleeve, melting the solder supplied into the sleeve.

Patent No. 5184359

In conventional configurations, gaps can occur between the sleeve and the heater, for example due to dimensional errors. In such cases, the heat generated by the heater cannot be efficiently transferred to the sleeve, and as a result, the solder in the sleeve cannot be efficiently melted.

Therefore, we provide a soldering device that can efficiently transfer heat generated by the heating part to the melting part.

The soldering device 10 according to the present disclosure includes a melting section 11 for melting the solder H, a heating section 12 provided outside the melting section for heating the melting section, and a pressing section 14 for pressing the outer surface of the melting section against the inner surface of the heating section.

According to the soldering device of the present disclosure, the pressing part can press the outer surface of the melting part against the inner surface of the heating part to make tight contact. This allows the heat generated by the heating part to be efficiently transferred to the melting part.

FIG. 1 is a diagram illustrating an example of the configuration of a soldering device according to a first embodiment; FIG. 11 is a cross-sectional view showing a schematic configuration example of a sleeve and its surrounding parts according to a second embodiment. FIG. 13 is a cross-sectional view showing a schematic configuration example of a sleeve and its surrounding parts according to a third embodiment. FIG. 13 is a vertical cross-sectional view showing a schematic configuration example of a sleeve and a heater according to a fourth embodiment. FIG. 13 is a diagram illustrating an example of the configuration of a soldering device according to a fifth embodiment. FIG. 13 is a diagram illustrating an example of the configuration of a soldering device according to a sixth embodiment. FIG. 13 is an enlarged cross-sectional view showing a schematic configuration example of a pressing pin and its surrounding parts according to a modified embodiment; FIG. 13 is a schematic diagram showing an example of the configuration of a sleeve and a heater according to a modified embodiment; FIG. 11 is a cross-sectional view showing a schematic configuration example of a sleeve and a heater according to a modified embodiment;

Below, several embodiments of the soldering device will be described with reference to the drawings. Note that elements that are essentially the same in several embodiments will be given the same reference numerals, and their description will be omitted.

First Embodiment
1 is a device that solders a terminal 110 of an electronic component into a land 102 provided in a through hole 101 of a printed circuit board 100, for example. In this case, the soldering device 10 is configured as a so-called "sleeve soldering device" that melts solder using a cylindrical sleeve 11 to perform soldering.

The soldering device 10 includes a sleeve unit 15 having a sleeve 11, a heater 12, a solder supply unit 13, a pressing pin 14, etc. The soldering device 10 includes a movement mechanism (not shown) that moves the sleeve unit 15 vertically and horizontally relative to the printed circuit board 100.

The sleeve 11 is an example of a fusion part. The sleeve 11 is made of ceramics made of aluminum nitride or silicon carbide, and is formed into a long cylindrical shape that is long in the vertical direction. The inside of the sleeve 11 is hollow. The sleeve 11 made of ceramics has a non-adhesive property that makes it difficult for solder to adhere to it. Note that the non-adhesive property here preferably means that no solder will adhere to the sleeve 11 at all, but allows a small amount of solder to adhere to the sleeve 11. In other words, the non-adhesive sleeve 11 has a property that solder does not adhere to it or that solder does not adhere to it easily, although there is a possibility that a small amount of solder will adhere to it. The sleeve 11 also has high thermal conductivity. The material forming the sleeve 11 is preferably made of a material with as high a thermal conductivity as possible, and may be a material other than aluminum nitride or silicon carbide, for example.

The heater 12 is an example of a heating unit. The heater 12 is formed in a vertically long cylindrical shape, similar to the sleeve 11. The heater 12 is hollow inside. The heater 12 is provided on the outside of the sleeve 11. In this case, the heater 12 is arranged so as to cover the outer peripheral surface of the sleeve 11 from the outside. The length of the sleeve 11 is shorter than the length of the heater 12. The length of the sleeve 11 may be longer than the length of the heater 12, or may be approximately or completely the same as the length of the heater 12. The lower end, which is the tip of the sleeve 11, protrudes downward beyond the lower end, which is the tip of the heater 12. The amount of protrusion of the tip of the sleeve 11 from the tip of the heater 12 can be changed as appropriate.

The heater 12 also has a main heating section 12A and a sub heating section 12B. The main heating section 12A is a section of the heater 12 where the density of the heating wire 12C that generates heat when current is applied is higher than a predetermined density, and where heat is actively generated by the heating wire 12C. In the main heating section 12A, the heating wire 12C is wired as densely and uniformly as possible, and the heating efficiency of the heating wire 12C is high. In the main heating section 12A, for example, the heating wires 12C are in contact with each other. On the other hand, the sub heating section 12B is a section of the heater 12 where the density of the heating wire 12C that generates heat when current is applied is lower than a predetermined density, and where heat is not actively generated by the heating wire 12C. In the sub heating section 12B, the heating wire 12C is not wired as densely and uniformly as in the main heating section 12A, and the heating efficiency of the heating wire 12C is low. In the sub-heating portion 12B, for example, the heating wires 12C are spaced apart. Also, the density of the heating wires 12C in the main heating portion 12A is higher than the density of the heating wires 12C in the sub-heating portion 12B, in other words, the density of the heating wires 12C in the sub-heating portion 12B is lower than the density of the heating wires 12C in the main heating portion 12A. The above-mentioned predetermined density can be changed and set as appropriate.

In addition, in the longitudinal direction of the sleeve 11 and heater 12, the length of the main heat generating portion 12A is shorter than the length of the portion of the sleeve 11 that is inserted into the heater 12. In addition, the maximum heat generating region 12R, which has the highest heat generation amount in the main heat generating portion 12A, is provided on the tip side of the heater 12, in other words, in a portion corresponding to the tip side of the sleeve 11. In this case, the maximum heat generating region 12R is provided within a predetermined distance D above the lower end of the tip side portion of the sleeve 11, in this case, the portion of the sleeve 11 that is inserted into the heater 12.

The specified distance D can be changed as appropriate, and is preferably set to a length that is at least about 1/3 the length of the entire sleeve 11. The specified distance D may also be, for example, at least about 1/2 the length of the entire sleeve 11. The highest heat generation region 12R generally tends to be formed in or near the center in the longitudinal direction of the main heat generation part 12A. However, the highest heat generation region 12R may be formed on the end side in the longitudinal direction of the main heat generation part 12A depending on conditions such as the heat generation performance, arrangement, and density of the heating wire 12C.

When the heater 12 is turned on by a control device (not shown), it generates heat, particularly in the main heating section 12A, to heat the sleeve 11. The heat generated from the main heating section 12A also propagates to the sub-heating section 12B, and heat is also generated in the sub-heating section 12B by the heating wire 12C, so that the sleeve 11 is also heated in the sub-heating section 12B. Considering the deterioration of the sleeve 11 due to heating, it is preferable to set the output of the heater 12 to, for example, 600 degrees or less. Depending on the properties of the sleeve 11, such as its heat resistance, it is also acceptable to set the output of the heater 12 to a temperature exceeding 600 degrees.

The solder supply unit 13 cuts the long, thread-like solder (not shown) to a predetermined length with a cutter (not shown) to form a solder piece H. The solder piece H formed by the solder supply unit 13 falls into the cylindrical sleeve 11. As a result, the solder piece H is supplied from the solder supply unit 13 to the inside of the sleeve 11. The solder piece H supplied to the inside of the sleeve 11 melts when it comes into contact with the inner surface of the sleeve 11 heated by the heater 12. As a result, the terminal 110 of the electronic component inserted into the land 102 of the printed circuit board 100 is soldered by the molten solder piece H. Inside the heater 12, a long, cylindrical guide pipe 11G that is long in the vertical direction is provided at the top of the sleeve 11. The inner and outer diameters of the guide pipe 11G are approximately or completely the same as the inner and outer diameters of the sleeve 11. The guide pipe 11G guides the solder piece H supplied from the solder supply unit 13 toward the inside of the sleeve 11.

The pressing pin 14 is an example of a pressing portion, and extends linearly in a direction perpendicular to the longitudinal direction of the sleeve 11 and heater 12. The pressing pin 14 penetrates radially through the sub-heating portion 12B of the heater 12, and presses the outer peripheral surface of the sleeve 11 with its tip. As a result, the pressing pin 14 presses the outer surface of the sleeve 11 against the inner surface of the heater 12 on the side opposite the pressing pin 14.

It is preferable that the pressing pin 14 is made of a material with as low a thermal conductivity as possible, and at least a material with a lower thermal conductivity than the sleeve 11. It is also preferable that the pressing pin 14 is made of a material with as high a heat resistance as possible. One possible material for forming the pressing pin 14 is zirconia. However, the material for forming the pressing pin 14 is not limited to zirconia.

In this case, the pressing pin 14 is formed into a hollow, long cylinder. The pressing pin 14 has a temperature detection sensor 16 inside. The temperature detection sensor 16 is an example of a temperature detection unit, and is configured, for example, by a well-known thermocouple. The temperature detection sensor 16 is disposed inside the tip of the pressing pin 14, and is configured to be able to detect the temperature of the sleeve 11.

The soldering device 10 further includes a positioning unit 17. The positioning unit 17 is an example of a maintaining unit, and maintains the pressing state in which the pressing pin 14 presses the outer surface of the sleeve 11 against the inner surface of the heater 12.

That is, the positioning unit 17 is provided with a biasing mechanism (not shown) that biases the pressing pin 14 toward the sleeve 11. The biasing mechanism (not shown) is provided with, for example, an expandable spring that biases the pressing pin 14 toward the sleeve 11. The positioning unit 17 is also provided with an adjustment mechanism (not shown) that adjusts the amount of movement of the pressing pin 14 toward the sleeve 11. The adjustment mechanism (not shown) is provided with, for example, a cam structure for moving the pressing pin 14. The positioning unit 17 is also provided with a locking mechanism that locks the movement of the pressing pin 14. The locking mechanism (not shown) is provided with, for example, a lock pin that restricts the movement of the pressing pin 14.

The positioning unit 17 locks the movement of the pressing pin 14 in a pressing state in which the pressing pin 14 presses the outer surface of the sleeve 11 against the inner surface of the heater 12. In other words, the positioning unit 17 positions the pressing pin 14 at its movement position in a pressing state in which the pressing pin 14 presses the outer surface of the sleeve 11 against the inner surface of the heater 12. In this way, the positioning unit 17 maintains the pressing state in which the pressing pin 14 presses the outer surface of the sleeve 11 against the inner surface of the heater 12.

The overall operation of the soldering device 10 described above, including the energization of the heater 12, the driving of the solder supply unit 13, the driving of the sleeve unit 15, the driving of the positioning unit 17, etc., is performed by a control device (not shown) that is mainly composed of a microcomputer, for example.

The soldering device 10 illustrated above is configured to press the outer surface of the sleeve 11 against the inner surface of the heater 12 using the pressing pin 14. With this configuration example, the outer surface of the sleeve 11 can be brought into close contact with the inner surface of the heater 12 with almost no or no gaps. This makes it possible to efficiently transfer heat generated by the heater 12 to the sleeve 11, and thus makes it possible to efficiently melt the solder in the sleeve 11.

In addition, according to the soldering device 10, the pressing pin 14 is provided in the sub-heating portion 12B of the heater 12, which is not provided with the heating wire 12C. According to this configuration example, the pressing pin 14 can be provided with as little effect as possible on the main heating portion 12A, which is the main heat generating portion of the heater 12. Therefore, it is possible to avoid the heating performance of the heater 12 being impaired by providing the pressing pin 14.

According to the soldering device 10, the pressing pin 14 is provided with a temperature detection sensor 16 capable of detecting the temperature of the sleeve 11. According to this configuration example, the heating state of the sleeve 11 can be monitored with high accuracy. In addition, the output of the heater 12 can be adjusted with high accuracy according to the heating state of the sleeve 11. The temperature detection sensor 16 is not limited to a thermocouple, and may be configured with anything other than a thermocouple as long as it can detect temperature. In addition, the temperature detection sensor 16 does not have to be provided in the pressing pin 14 as long as it can detect the temperature of the sleeve 11. In addition, the temperature detection sensor 16 does not necessarily have to be built into the pressing pin 14. Therefore, for example, taking into consideration the cost required for the configuration required to ensure the pressing force of the pressing pin 14 and the cost incurred due to the replacement of the temperature detection sensor 16, a separate through hole may be provided in the heater 12, and the temperature of the sleeve 11 may be measured through the through hole by the temperature detection sensor 16. In addition, for example, if space can be secured on the printed circuit board 100 side, it is also effective to provide the temperature detection sensor 16 near the tip of the sleeve 11.

In addition, according to the soldering device 10, the positioning unit 17 maintains a pressing state in which the pressing pin 14 presses the outer surface of the sleeve 11 against the inner surface of the heater 12. According to this configuration example, the outer surface of the sleeve 11 can be stably maintained in a state in which it is possible to efficiently transfer heat generated by the heater 12 to the sleeve 11, and thus to stably maintain a state in which it is possible to efficiently melt the solder in the sleeve 11. In addition, it is preferable to configure the portion of the sleeve 11 opposite the pressing pin 14, that is, the portion pressed against the inner surface of the heater 12 by being pressed by the pressing pin 14, so that it coincides with the maximum heat generation region 12R or a portion in the vicinity thereof. This can further increase the efficiency of heat conduction from the heater 12 to the sleeve 11. The necessary requirements for the pressing pin 14 are at least the function of ensuring a pressing force that presses the sleeve 11 against the inner surface of the heater 12, the function of preventing the sleeve 11 from gradually descending relative to the heater 12, and the function of ensuring a gap, or so-called insertion allowance, required when inserting the sleeve 11 into the heater 12. As long as the pressing pin 14 has at least these functions, its configuration can be modified as appropriate.

In addition, according to the soldering device 10, the heater 12 has a main heating portion 12A which is the main heat generating portion, and in the longitudinal direction of the sleeve 11 and the heater 12, the length of the main heating portion 12A is shorter than the length of the portion of the sleeve 11 which is inserted into the heater 12. In other words, the heater 12 is configured such that the main heating portion 12A which is the main heat generating portion is formed as compact as possible. According to this configuration example, the power energy consumed by the main heating portion 12A can be minimized. In addition, the sleeve 11 can be heated in a concentrated manner from the main heating portion 12A which is formed as compact as possible, improving the heating efficiency.

In addition, according to the soldering device 10, the maximum heat generation region 12R, which has the highest heat generation amount among the main heat generation portion 12A, is provided on the tip side of the heater 12, in other words, on the tip side of the sleeve 11. According to this configuration example, the heat generated by the main heat generation portion 12A can be efficiently transferred to the tip portion of the sleeve 11, that is, the portion where the solder piece H is melted and soldered, and the melting efficiency of the solder piece H can be improved.

Second Embodiment
2 includes a pressing surface 11A that is pressed by the pressing pin 14. The pressing surface 11A is a plane that is almost or completely perpendicular to the longitudinal direction of the pressing pin 14. According to this configuration example, even if the pressing pin 14 is slightly displaced from the center of the sleeve 11, the sleeve 11 can be sufficiently pressed. This allows the pressing of the sleeve 11 by the pressing pin 14 to be performed more stably, and therefore the outer surface of the sleeve 11 can be pressed against the inner surface of the heater 12 more stably.

Third Embodiment
3 includes a pressing recess 11B that is pressed by the pressing pin 14. The pressing recess 11B is a recess that is recessed in the outer peripheral surface of the sleeve 11 along the longitudinal direction of the pressing pin 14 in the opposite direction to the pressing pin 14. This configuration example makes it possible to prevent the pressing pin 14 from shifting from the center of the sleeve 11. This makes it possible to more stably press the sleeve 11 with the pressing pin 14, and ultimately makes it possible to more stably press the outer surface of the sleeve 11 against the inner surface of the heater 12.

Fourth Embodiment
According to the configuration example of "Pattern A" shown in Fig. 4, the outer surface of the sleeve 11 and the inner surface of the heater 12 have a shape in which the diameter gradually increases from the upper end side to the lower end side. According to the configuration example of "Pattern B" shown in Fig. 4, the outer surface of the sleeve 11 and the inner surface of the heater 12 have a shape in which the diameter gradually decreases from the upper end side to the lower end side.

According to the configuration examples of "Pattern A" or "Pattern B" illustrated in FIG. 4, the contact surface S where the outer surface of the sleeve 11 and the inner surface of the heater 12 come into contact is inclined with respect to the longitudinal direction of the sleeve 11 and the heater 12. According to this configuration example, the contact area between the outer surface of the sleeve 11 and the inner surface of the heater 12 can be increased compared to a configuration example where the contact surface where the outer surface of the sleeve 11 and the inner surface of the heater 12 come into contact is aligned along the longitudinal direction of the sleeve 11 and the heater 12. This makes it easier to transfer heat generated by the heater 12 to the sleeve 11.

Fifth Embodiment
The soldering device 10 illustrated in FIG. 5 includes a pressing force detection sensor 18 on the pressing pin 14. The pressing force detection sensor 18 is an example of a pressing force detection unit, and is configured to detect the pressing force, i.e., the load, applied by the pressing pin 14 to the sleeve 11. According to this configuration example, the pressing state of the sleeve 11 can be monitored with high accuracy. In addition, the movement amount of the pressing pin 14 can be adjusted with high accuracy according to the pressing state of the sleeve 11. The pressing force detection sensor 18 can be configured with well-known sensors capable of detecting the pressing force. In addition, the pressing force detection sensor 18 does not need to be provided on the pressing pin 14 as long as it can detect the pressing force applied by the pressing pin 14 to the sleeve 11. In addition, the soldering device 10 may be configured to include a position detection sensor that detects the position of the pressing pin 14. According to this configuration example, based on the position of the pressure pin 14 detected by the position detection sensor, it is possible to confirm whether the pressure pin 14 is sufficiently pressing the sleeve 11 against the inner surface of the heater 12, i.e., whether it is exerting sufficient pressing force.

Sixth Embodiment
The soldering device 10 illustrated in Fig. 6 includes a cooling unit 19 for cooling the pressing pin 14. According to this configuration example, it is possible to prevent the pressing pin 14 from becoming excessively hot due to the heat generated by the heater 12. In addition, by preventing the pressing pin 14 from becoming excessively hot, it is possible to prevent the temperature of the pressing pin 14 from affecting the temperature detected by the temperature detection sensor 16, and it is possible to detect the temperature of the sleeve 11 with higher accuracy. The cooling unit 19 can be appropriately applied as long as it can cool the pressing pin 14. For example, it may be a water-cooled cooling device, an air-cooled cooling device, an evaporator constituting a well-known heat pump mechanism, or a heat absorbing material or a cooling material.

The cooling unit 19 may or may not be in contact with the pressing pin 14. According to a configuration example in which the cooling unit 19 is in contact with the pressing pin 14, the pressing pin 14 can be directly cooled by the cooling unit 19, and the cooling efficiency can be improved. According to a configuration example in which the cooling unit 19 is not in contact with the pressing pin 14, the pressing pin 14 can be indirectly cooled by the cooling unit 19, and a sufficient cooling effect can be obtained. Furthermore, in a configuration in which the cooling unit 19 is not in contact with the pressing pin 14, a gap, i.e., a space, may be provided between the cooling unit 19 and the pressing pin 14, or a member that easily transmits cold and heat, such as a metal plate, may be interposed.

Other Embodiments
The soldering apparatus according to the present disclosure is not limited to the above-described embodiments, and various modifications and extensions can be made without departing from the spirit of the present disclosure. For example, the soldering apparatus may be configured by appropriately selecting and combining the above-described embodiments.

Also, as shown in FIG. 7, the tip of the pressing pin 14 may be recessed in an arc shape to fit the outer peripheral surface of the sleeve 11. According to this configuration example, the tip of the pressing pin 14 can be brought into closer contact with the outer peripheral surface of the sleeve 11, and the outer peripheral surface of the sleeve 11 can be pressed more reliably. In addition, the area when the tip of the pressing pin 14 presses the outer peripheral surface of the sleeve 11 can be secured, and the surface pressure can be reduced. This is expected to have the effect of preventing the outer peripheral surface of the sleeve 11 from being damaged by the tip of the pressing pin 14.

Also, as shown in FIG. 8, the heater 12 may be divided into two heater components 12D and 12E. According to this configuration example, the two heater components 12D and 12E can clamp the sleeve 11 from two directions to fix it. The heater 12 may be divided into three or more heater components. According to this configuration example, the sleeve 11 can be fixed from three or more directions by three or more heater components.

9, at least one of the diameter L1 of the outer peripheral surface of the sleeve 11 and the diameter L2 of the inner peripheral surface of the heater 12 may be adjusted as appropriate. In this case, it is advisable to adjust at least one of the diameter L1 of the outer peripheral surface of the sleeve 11 and the diameter L2 of the inner peripheral surface of the heater 12 so that the diameter L1 of the outer peripheral surface of the sleeve 11 is relatively shorter than the diameter L2 of the inner peripheral surface of the heater 12. This makes it possible to more reliably bring the outer surface of the sleeve 11 into contact with the inner surface of the heater 12.

The unillustrated biasing mechanism of the positioning unit 17 is not limited to a configuration with an expandable spring, but may be, for example, a leaf spring, a screw with a spring, a cylinder, or any other suitable mechanism capable of biasing the pressing pin 14 toward the sleeve 11.

The shape and size of the molten part can be changed as appropriate. That is, the shape of the molten part is not limited to a circular cylinder, but may be a polygon such as a triangle, a square, or a pentagon, or may be a complex shape according to the arrangement of the lands 102 and mounted components on the printed circuit board 100. The shape and size of the heating part can be changed as appropriate according to the shape and size of the molten part.

Although the present disclosure has been described with reference to the examples, it is understood that the present disclosure is not limited to the examples or structures. The present disclosure also encompasses various modifications and modifications within the scope of equivalents. In addition, various combinations and forms, as well as other combinations and forms including only one element, more than one element, or less than one element, are also within the scope and concept of the present disclosure.

In the drawings, 10 indicates the soldering device, 11 indicates the sleeve (melting portion), 11A indicates the pressing surface portion, 11B indicates the pressing recess, 12 indicates the heater (heating portion), 12A indicates the main heat generating portion, 12B indicates the sub-heat generating portion, 12C indicates the heating wire, 12R indicates the maximum heat generating area, 14 indicates the pressing pin (pressing portion), 16 indicates the temperature detection sensor (temperature detection portion), 17 indicates the positioning portion (maintenance portion), 18 indicates the pressing force detection sensor (pressing force detection portion), 19 indicates the cooling portion, and S indicates the contact surface.

Claims (10)

A melting portion (11) for melting the solder (H);
A heating section (12) provided outside the melting section and configured to heat the melting section;
A pressing part (14) that presses an outer surface of the melting part against an inner surface of the heating part;
a pressing force detection unit (18) that detects the pressing force applied by the pressing unit to the melting portion;
A soldering apparatus comprising: The heating section has a sub-heating section (12B) in which the density of the heating wire (12C) is lower than a predetermined density,
The soldering device according to claim 1 , wherein the pressing portion is provided on the sub-heating portion. The soldering device according to claim 1 or 2, wherein the pressing unit is provided with a temperature detection unit (16) that detects the temperature of the melting portion. The soldering device according to any one of claims 1 to 3, further comprising a maintaining section (17) that maintains a pressing state in which the pressing section presses the outer surface of the melting section against the inner surface of the heating section. The heating section has a main heating section (12A) in which the density of the heating wire (12C) is higher than a predetermined density,
5. A soldering apparatus according to claim 1, wherein in the longitudinal direction of the melting portion and the heating portion, the length of the main heat generating portion is shorter than the length of the portion of the melting portion that is inserted into the heating portion. The soldering device according to claim 5, wherein the highest heat generation area (12R) of the main heat generation section, which has the highest heat generation amount, is provided on the tip side of the melting section. The soldering device according to any one of claims 1 to 6, wherein the melting portion has a pressing surface portion (11A) that is pressed by the pressing portion. The soldering device according to any one of claims 1 to 6, wherein the melting portion has a pressing recess (11B) that is pressed by the pressing portion. The soldering device according to any one of claims 1 to 8, wherein a contact surface (S) where the outer surface of the melting part and the inner surface of the heating part come into contact is inclined with respect to the longitudinal direction of the melting part and the heating part. The soldering device according to any one of claims 1 to 9 , further comprising a cooling section (19) for cooling the pressing section.

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