JP7664816B2 - Semiconductor manufacturing apparatus and method for manufacturing semiconductor device - Google Patents

Description

This disclosure relates to a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device.

In recent years, as electronic devices have become smaller and thinner, there is a demand for semiconductor devices mounted on electronic devices to also be smaller and thinner. Therefore, grinding is performed to thin the semiconductor wafers included in the semiconductor devices. In grinding, the semiconductor wafer is placed on a chuck table with the grinding surface facing up, and the grinding surface of the semiconductor wafer is ground by a rotating grinding wheel.

After grinding, when fluid was sprayed from the chuck table to remove the semiconductor wafer, there was a problem in that grinding debris accumulated in the gap between the chuck table and the semiconductor wafer was sprayed out along with the fluid and adhered to the semiconductor wafer.

For example, Patent Document 1 discloses a method of using a chuck table that has areas where fluid is sprayed and areas where fluid is not sprayed. Using this chuck table prevents grinding debris from adhering to the semiconductor wafer.

JP 2020-93330 A

After grinding, the outer periphery of the semiconductor wafer is clamped by a transport arm and the semiconductor wafer is transported. In conventional technology, the gap between the transport arm and the semiconductor wafer is narrow, and surface tension makes it easy for fluid containing grinding debris to accumulate in this gap. As a result, when the suction of the semiconductor wafer is released on the chuck table, the fluid containing the grinding debris flows around to the grinding surface of the semiconductor wafer. This causes the problem that the fluid dries out during transport of the semiconductor wafer, and the grinding debris contained in the fluid adheres to the grinding surface of the semiconductor wafer, affecting subsequent processes.

Therefore, the present disclosure aims to provide a technology that can prevent grinding debris from adhering to semiconductor wafers after grinding.

A semiconductor manufacturing apparatus according to the present disclosure includes a chuck table on which a semiconductor wafer is placed with its grinding surface facing upward, a transport arm that transports the semiconductor wafer by clamping the outer periphery of the semiconductor wafer, an adjustment mechanism that adjusts a gap between the semiconductor wafer and the transport arm , and a nozzle that sprays water from the outer periphery of the semiconductor wafer toward the grinding surface of the semiconductor wafer, wherein the chuck table has a suction area that suctions and holds the surface of the semiconductor wafer opposite to the grinding surface, a blow area that sprays fluid toward the surface of the semiconductor wafer opposite to the grinding surface of the semiconductor wafer to release the suction on the semiconductor wafer, and a vacuum area that discharges the water sprayed from the nozzle .

According to the present disclosure, the fluid containing the grinding debris is sucked in the suction area of the chuck table, and therefore when the suction on the semiconductor wafer is released, the fluid containing the grinding debris can be prevented from flowing around to the grinding surface of the semiconductor wafer. Furthermore, when the semiconductor wafer is transported by the transport arm after grinding, the adjustment mechanism can be used to adjust the gap between the semiconductor wafer and the transport arm to be wider, thereby further preventing the fluid containing the grinding debris from flowing around to the grinding surface of the semiconductor wafer. This prevents the grinding debris from adhering to the semiconductor wafer after grinding.

1 is a schematic cross-sectional view showing a state in which a transfer arm provided in the semiconductor manufacturing apparatus according to the first embodiment clamps a semiconductor wafer. 2 is a top view of a chuck table included in the semiconductor manufacturing apparatus according to the first embodiment; FIG. 11 is a schematic cross-sectional view showing a state in which water is being sprayed from a nozzle provided in the semiconductor manufacturing apparatus according to the first modification of the first embodiment. FIG. 11 is a schematic cross-sectional view showing a state in which water is being sprayed from a nozzle provided in a semiconductor manufacturing apparatus according to a second modification of the first embodiment. FIG. 5A to 5C are schematic cross-sectional views showing the operation of a transfer arm provided in the semiconductor manufacturing apparatus according to the first embodiment. 11 is a schematic cross-sectional view showing the operation of a transport arm when an adjustment mechanism included in the semiconductor manufacturing apparatus according to the first embodiment includes a motor. FIG. 11 is a schematic cross-sectional view showing the operation of a transfer arm when an adjustment mechanism provided in the semiconductor manufacturing apparatus according to the first embodiment includes an air cylinder. FIG. 2 is a flowchart showing each step of a manufacturing method of a semiconductor device. 5A to 5C are schematic cross-sectional views showing the implementation of a protective film cleaning process from completion of a grinding process. 11A to 11C are schematic cross-sectional views showing the implementation of a final wafer cleaning step to a protective film drying step. 11 is a schematic cross-sectional view showing a state in which a transfer arm provided in a semiconductor manufacturing apparatus according to a second embodiment clamps a semiconductor wafer. FIG. 13 is a schematic cross-sectional view showing a state in which water is being sprayed from a spray unit provided on a transport arm included in a semiconductor manufacturing apparatus according to a third embodiment. FIG. 13 is a schematic cross-sectional view showing a state in which air is being ejected from an air ejection portion provided on a transport arm included in a semiconductor manufacturing apparatus according to a fourth embodiment. FIG.

<First embodiment>
The first embodiment will be described below with reference to the drawings. Fig. 1 is a schematic cross-sectional view showing a state in which a transport arm 1 included in a semiconductor manufacturing apparatus according to the first embodiment clamps a semiconductor wafer 5. Fig. 2 is a top view of a chuck table 2 included in the semiconductor manufacturing apparatus according to the first embodiment. Fig. 3 is a schematic cross-sectional view showing a state in which water 8 is sprayed from a nozzle 7 included in a semiconductor manufacturing apparatus according to a first modification of the first embodiment. Fig. 4 is a schematic cross-sectional view showing a state in which water 8 is sprayed from a nozzle 7 included in a semiconductor manufacturing apparatus according to a second modification of the first embodiment.

As shown in FIG. 1, the semiconductor manufacturing apparatus includes a chuck table 2, a pair of transfer arms 1, an adjustment mechanism 30 (see FIG. 6), and a pair of nozzles 7.

As shown in Figures 1 and 2, a semiconductor wafer 5 having a front and back surface is placed on the chuck table 2. The chuck table 2 is made of inorganic material that has been sintered into a porous form, and is formed into a circular shape when viewed from above to correspond to the shape of the semiconductor wafer 5.

As shown in FIG. 1, a pair of transport arms 1 are provided at positions facing each other. Each transport arm 1 has a main body 1a incorporating an adjustment mechanism 30, and a clamp 1b provided on the outer periphery of the underside of the main body 1a. The outer periphery 5a of the semiconductor wafer 5 is clamped by the clamp 1b. The pair of transport arms 1 are clamp-type arms that can adjust the gap between the semiconductor wafer 5 clamped by the clamp 1b and the main body 1a using the adjustment mechanism 30. Details of the adjustment mechanism 30 will be described later, but the adjustment mechanism 30 may include a motor 20 (see FIG. 6) or an air cylinder 25 (see FIG. 7).

The semiconductor wafer 5 is mainly made of, for example, silicon (Si) or silicon carbide (SiC). The semiconductor wafer 5 is placed on the chuck table 2 with the grinding surface facing upward. By grinding the grinding surface of the semiconductor wafer 5, the semiconductor wafer 5 becomes a ribbed semiconductor wafer having ribs at the outer periphery 5a that are thicker than the center. Here, the grinding surface of the semiconductor wafer 5 is the area excluding the outer periphery 5a on the back surface of the semiconductor wafer 5. In other words, the grinding surface of the semiconductor wafer 5 is the area on the inner side of the outer periphery 5a on the back surface of the semiconductor wafer 5.

As shown in Figures 1 and 2, the chuck table 2 has a concave frame 2a, a suction area 3 that is annular in top view, and a blow area 4 that is annular in top view. The suction area 3 and the blow area 4 are provided in a recess 2b that is circular in top view and formed in a portion of the frame 2a excluding the outer periphery. The suction area 3 is an area that suctions and holds the surface of the semiconductor wafer 5 opposite the grinding surface. The blow area 4 is an area that releases suction on the semiconductor wafer 5 by spraying fluid toward the surface of the semiconductor wafer 5 opposite the grinding surface.

The suction area 3 is connected to a suction source (not shown) via a pipe 3a (see FIG. 11). The blow area 4 is connected to a blow source (not shown) via a pipe 4a (see FIG. 11). Here, the surface opposite to the grinding surface of the semiconductor wafer 5 is the front surface of the semiconductor wafer 5. The fluid is, for example, a mixture of water and air.

Conventionally, flapping of the semiconductor wafer 5 during grinding was not taken into consideration. If a blow area 4 is provided at a location on the chuck table 2 facing the outer periphery 5a of the semiconductor wafer 5, it is conceivable that the semiconductor wafer 5 will flap during grinding. For this reason, a suction area 3 is provided at that location, and by arranging the blow area 4 and the suction area 3 alternately on the inner side of that location, flapping of the semiconductor wafer 5 during grinding can be suppressed. Here, the location on the chuck table 2 facing the outer periphery 5a of the semiconductor wafer 5 is the outer periphery of the recess 2b.

For example, in Figures 1 and 2, suction areas 3 and blow areas 4 are alternately arranged in a concentric pattern, with the center and outer periphery of recess 2b forming suction area 3. The reason for forming suction area 3 not only in the outer periphery but also in the center of recess 2b is that when grinding semiconductor wafer 5, the grinding wheel tends to hit the center aggressively, and if semiconductor wafer 5 flutters during grinding, this leads to abnormal appearance and cracking of semiconductor wafer 5. By providing suction area 3 in the center of recess 2b, fluttering of semiconductor wafer 5 can be suppressed. Here, abnormal appearance of semiconductor wafer 5 refers to, for example, deep grinding marks and scratches.

The suction area 3 and the blow area 4 are separated by a ring-shaped partition plate 6 made of metal, ceramic, or the like. By providing separate areas for suction only and blow only, it is possible to prevent grinding debris from being ejected from the blow area 4. This allows the transport arm 1 to clamp the outer periphery 5a of the semiconductor wafer 5 while preventing adhesion of grinding debris to the semiconductor wafer 5 when the suction on the semiconductor wafer 5 is released.

In the semiconductor manufacturing apparatus according to the first embodiment, the outer periphery of the recess 2b is made the suction area 3 and not the blow area 4, which makes it possible to prevent grinding debris from adhering to the outer periphery 5b of the semiconductor wafer 5, compared to a case in which a blow area 4 is provided on the outer periphery of the recess 2b. The transport arm 1 clamps the outer periphery 5b of the semiconductor wafer 5 while transporting it, but because grinding debris is less likely to adhere to the outer periphery 5b of the semiconductor wafer 5, it is also possible to prevent foreign matter and dirt from adhering to the transport arm 1.

As shown in FIG. 1, a pair of nozzles 7 are provided at positions facing each other on the frame 2a of the chuck table 2, and spray water 8 from the outer periphery of the semiconductor wafer 5. When the semiconductor wafer 5 is removed from the chuck table 2, the pair of nozzles 7 spray water 8 between the semiconductor wafer 5 and the chuck table 2, thereby preventing the fluid containing grinding debris sprayed from the chuck table 2 from flowing around onto the grinding surface of the semiconductor wafer 5.

The nozzle 7 may be one. Also, instead of spraying the water 8 from the outer periphery of the semiconductor wafer 5, the nozzle 7 may spray the water 8 toward the center of the grinding surface of the semiconductor wafer 5 as shown in FIG. 3, or may be provided on the transport arm 1 and spray the water 8 toward the grinding surface of the semiconductor wafer 5 as shown in FIG. 4.

Next, the operation of the adjustment mechanism 30 that adjusts the gap between the semiconductor wafer 5 and the transport arm 1 will be described. Figure 5(a) is a schematic cross-sectional view showing the operation of the transport arm 1 when clamping and removing the semiconductor wafer 5, and Figure 5(b) is a schematic cross-sectional view showing the operation of the transport arm 1 when transporting the semiconductor wafer 5.

When clamping and removing the semiconductor wafer 5, the main body 1a of the transport arm 1 moves downward as shown in FIG. 5(a), narrowing the gap between the semiconductor wafer 5 and the transport arm 1 to d1. When transporting the semiconductor wafer 5, the main body 1a of the transport arm 1 moves upward as shown in FIG. 5(b), widening the gap between the semiconductor wafer 5 and the transport arm 1 from d1 to d2. The gap between the semiconductor wafer 5 and the transport arm 1 is the gap between the ground surface of the semiconductor wafer 5 and the part of the main body 1a that is more inward than the clamping part 1b.

Next, the structure of the adjustment mechanism 30 will be described. FIG. 6 is a schematic cross-sectional view showing the operation of the transport arm 1 when the adjustment mechanism 30 includes a motor 20. FIG. 7 is a schematic cross-sectional view showing the operation of the transport arm 1 when the adjustment mechanism 30 includes an air cylinder 25.

The adjustment mechanism 30 is provided for each transport arm 1, and may include a motor 20 or an air cylinder 25. First, a case where the adjustment mechanism 30 includes a motor 20 will be described. As shown in FIG. 6, the adjustment mechanism 30 includes a motor 20 and a ball screw 21. The ball screw 21 is erected on the outer periphery side of the semiconductor wafer 5. The motor 20 is provided on the main body 1a of the transport arm 1, and is connected to the ball screw 21. The main body 1a can move up and down along the ball screw 21 by being driven by the motor 20.

Next, a case where the adjustment mechanism 30 includes an air cylinder 25 will be described. As shown in FIG. 7, the adjustment mechanism 30 includes an air cylinder 25 and a piston 26. The piston 26 is erected on the outer periphery side of the semiconductor wafer 5. The air cylinder 25 is provided on the main body 1a of the transport arm 1 and is connected to the piston 26. The main body 1a can be moved up and down along the piston 26 by driving the air cylinder 25.

Next, a method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus according to the first embodiment will be described. FIG. 8 is a flow chart showing each step of the method for manufacturing a semiconductor device. FIG. 9 is a schematic cross-sectional view showing the implementation from the completion of the grinding step to the protective film cleaning step. FIG. 10 is a schematic cross-sectional view showing the implementation from the final wafer cleaning step to the protective film drying step. Note that in FIG. 9, the suction area 3 and blow area 4 are omitted to make the drawing easier to see.

As shown in FIG. 8, first, in the wafer preparation process, a semiconductor wafer 5 is prepared (step S1) on which an element region (not shown) is formed on the surface and on which a protective film (not shown) is further provided to protect the element region.

Next, in the grinding process, the grinding surface of the semiconductor wafer 5 is ground, and the semiconductor wafer 5 is thinned to a predetermined thickness (step S2). Here, the semiconductor wafer 5 is placed on the chuck table 2, and the grinding process is performed while the surface opposite the grinding surface of the semiconductor wafer 5 is sucked by the suction area 3.

In the wafer cleaning process, water 8 is sprayed from nozzle 7 to clean semiconductor wafer 5 that has grinding debris attached thereto during the grinding process (step S3).

As shown in FIG. 9, the semiconductor manufacturing equipment is provided with an underwater area 31 in which water is stored. In the transport process, the semiconductor wafer 5 is transported to the underwater area 31 by the transport arm 1 (step S4). Specifically, the chuck table 2 is rotated by a drive means (not shown) while the transport arm 1 is clamping the semiconductor wafer 5 so that the semiconductor wafer 5 is placed in the underwater area 31.

In the protective film cleaning process, the protective film provided on the surface of the semiconductor wafer 5 is cleaned (step S5). The protective film cleaning process is performed in water by a protective film cleaning brush 17 arranged on the surface side of the semiconductor wafer 5. Note that the protective film cleaning process can be omitted.

In the transport process, the semiconductor wafer 5 is transported by the transport arm 1 from the underwater area 31 to the spinner table 18 (see FIG. 10) where the final wafer cleaning process is performed (step S6). Specifically, the transport arm 1 transports the semiconductor wafer 5 from underwater to the atmosphere and places the semiconductor wafer 5 on the spinner table 18.

As shown in FIG. 10, in the final wafer cleaning process, water 8a and air 8b are sprayed from nozzles 19a, 19b arranged above the semiconductor wafer 5 toward the ground surface of the semiconductor wafer 5, thereby cleaning the semiconductor wafer 5 (step S7). The final wafer cleaning process and the subsequent protective film drying process (not shown) are performed in the atmosphere. In the protective film drying process, the protective film of the semiconductor wafer 5 is dried with air 15 when the semiconductor wafer 5 is transported after the final wafer cleaning is completed.

Next, we will explain the effects obtained from the semiconductor manufacturing device according to the first embodiment, comparing it with a conventional semiconductor manufacturing device.

In conventional semiconductor manufacturing equipment, when the semiconductor wafer 5 is transported by the transport arm 1, the gap between the semiconductor wafer 5 and the transport arm 1 cannot be adjusted, so the semiconductor wafer 5 is transported with a narrow gap between them. Water containing grinding debris tends to accumulate in this gap due to surface tension, so when the suction of the semiconductor wafer 5 on the chuck table 2 is released, the fluid containing the grinding debris flows around to the grinding surface of the semiconductor wafer 5. There was a problem that the fluid dries out during the transport of the semiconductor wafer 5, and the grinding debris contained in the fluid adheres to the grinding surface of the semiconductor wafer 5, affecting subsequent processes.

In contrast, the semiconductor manufacturing apparatus according to the first embodiment includes a chuck table 2 on which the semiconductor wafer 5 is placed with its grinding surface facing upwards, a transport arm 1 that clamps the outer periphery 5a of the semiconductor wafer 5 to transport the semiconductor wafer 5, and an adjustment mechanism 30 that adjusts the gap between the semiconductor wafer 5 and the transport arm 1. The chuck table 2 includes a suction area 3 that holds the surface of the semiconductor wafer 5 opposite the grinding surface by suction, and a blow area 4 that releases the suction on the semiconductor wafer 5 by spraying a fluid toward the surface of the semiconductor wafer 5 opposite the grinding surface.

Therefore, since the fluid containing the grinding debris is sucked in the suction area 3 of the chuck table 2, when the suction on the semiconductor wafer 5 is released, the fluid containing the grinding debris can be prevented from flowing around to the grinding surface of the semiconductor wafer 5. Furthermore, when the semiconductor wafer 5 is transported by the transport arm 1 after grinding, the adjustment mechanism 30 is used to adjust the gap between the semiconductor wafer 5 and the transport arm 1 to be wider, thereby further preventing the fluid containing the grinding debris from flowing around to the grinding surface of the semiconductor wafer 5. This prevents the grinding debris from adhering to the semiconductor wafer 5 after grinding. As a result, it is possible to improve the yield of semiconductor devices manufactured by the semiconductor manufacturing apparatus.

In addition, the suction area 3 is located at a position facing the outer periphery 5a of the semiconductor wafer 5 on the chuck table 2, which helps prevent the semiconductor wafer 5 from flapping during grinding.

The semiconductor manufacturing apparatus further includes a nozzle 7 that sprays water 8 from the outer periphery of the semiconductor wafer 5 toward the grinding surface of the semiconductor wafer 5. Therefore, when the fluid is sprayed from the blow area 4, the water 8 sprayed from the nozzle 7 flows over the grinding surface of the semiconductor wafer 5, thereby preventing the fluid containing the grinding debris from getting around to the grinding surface of the semiconductor wafer 5.

The nozzle 7 also sprays water 8 toward the center of the grinding surface of the semiconductor wafer 5. Therefore, when the transport arm 1 clamps the semiconductor wafer 5 after grinding, the nozzle 7 sprays water 8 toward the center of the grinding surface of the semiconductor wafer 5 immediately before the fluid is sprayed from the blow area 4 to release the suction on the semiconductor wafer 5, thereby preventing the fluid containing the grinding debris from getting around to the grinding surface of the semiconductor wafer 5.

In addition, since the nozzle 7 is attached to the transport arm 1, the transport arm 1 can transport the semiconductor wafer 5 while supplying water 8 to the grinding surface of the semiconductor wafer 5. This lengthens the time that the grinding surface of the semiconductor wafer 5 is immersed in the water 8, thereby suppressing the adhesion of foreign matter and dirt during transport.

The method for manufacturing a semiconductor device according to the first embodiment includes the steps of: (a) preparing a semiconductor wafer 5 provided with a protective film for protecting an element region formed on the surface opposite to the grinding surface; (b) placing the semiconductor wafer 5 on the chuck table 2 and grinding the grinding surface to form a rib thicker at the outer periphery 5a of the semiconductor wafer 5 than at the center; (c) placing the semiconductor wafer 5 in water and cleaning the protective film in water; and (d) transporting the semiconductor wafer 5 from the water into the atmosphere by the transport arm 1 and drying the protective film while the semiconductor wafer 5 is being transported.

As a result, in addition to preventing grinding debris from adhering to the semiconductor wafer 5 after grinding, it is also possible to prevent foreign matter and dirt from adhering when the semiconductor wafer 5 is clamped by the transport arm 1, and to prevent the ground surface of the semiconductor wafer 5 from drying out.

<Embodiment 2>
Next, a semiconductor manufacturing apparatus according to a second embodiment will be described. Fig. 11 is a schematic cross-sectional view showing a state in which a transfer arm 1 provided in the semiconductor manufacturing apparatus according to the second embodiment is clamping a semiconductor wafer 5. Although the nozzle 7 is not shown in Fig. 11, the description will be given assuming that the nozzle 7 is present. In the second embodiment, the same components as those described in the first embodiment are given the same reference numerals and the description will be omitted.

As shown in FIG. 11, in the second embodiment, the chuck table 2 further has a vacuum area 10 that discharges the water 8 sprayed from the nozzle 7. The vacuum area 10 is provided in a ring shape between the suction area 3 and the blow area 4. The vacuum area 10 is connected to a vacuum source (not shown) via a pipe 10a.

As described above, in the semiconductor manufacturing apparatus according to the second embodiment, the chuck table 2 further has a vacuum area 10 that discharges the water 8 sprayed from the nozzle 7, so that when the transport arm 1 removes the semiconductor wafer 5 from the chuck table 2, the water 8 containing the grinding debris remaining on the chuck table 2 can be discharged by the vacuum area 10. This makes it possible to prevent foreign matter and dirt from getting onto the grinding surface of the semiconductor wafer 5.

<Third embodiment>
Next, a semiconductor manufacturing apparatus according to a third embodiment will be described. Fig. 12 is a schematic cross-sectional view showing a state in which water 8 is being sprayed from a spray unit 13 provided on a transport arm 1 included in the semiconductor manufacturing apparatus according to the third embodiment. In the third embodiment, the same components as those described in the first and second embodiments are denoted by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 12, in the third embodiment, a plurality of spraying parts 13 are provided that spray water 8 toward the inner circumferential surface of the main body part 1a of the transport arm 1. The plurality of spraying parts 13 are provided on the inner circumferential surface of the main body part 1a and are connected to a water supply source (not shown) via a pipe (not shown) that passes through the inside of the main body part 1a. The water 8 sprayed from the plurality of spraying parts 13 falls along the inner circumferential surface of the main body part 1a.

Although not shown, the spraying unit 13 may be configured as a nozzle that sprays water 8 toward the inner circumferential surface of the main body 1a, rather than being provided on the inner circumferential surface of the main body 1a. The nozzle may be provided on the main body 1a or on the chuck table 2.

The nozzle 7 of embodiment 1 and the vacuum area 10 of embodiment 2 can also be used in the semiconductor manufacturing apparatus of embodiment 3.

As described above, the semiconductor manufacturing apparatus according to the third embodiment is provided with a spray unit 13 that sprays water 8 toward the inner circumferential surface of the transport arm 1. Therefore, by spraying water 8 toward the inner circumferential surface of the transport arm 1 after the transport is completed or during standby, foreign matter and dirt adhering to the transport arm 1 can be removed. In addition, the adhesion of foreign matter and dirt to the transport arm 1 can also be suppressed.

<Fourth embodiment>
Next, a semiconductor manufacturing apparatus according to a fourth embodiment will be described. Fig. 13 is a schematic cross-sectional view showing a state in which air 16 is being ejected from an air ejection unit 14 provided on a transport arm 1 included in the semiconductor manufacturing apparatus according to the fourth embodiment. Note that in the fourth embodiment, the same components as those described in the first to third embodiments are given the same reference numerals and the description thereof will be omitted.

As shown in FIG. 13, in the fourth embodiment, the transport arm 1 is provided with a plurality of air ejection units 14 that eject air 16 from the outer circumferential surface of the main body 1a of the transport arm 1 toward the outside of the main body 1a. The plurality of air ejection units 14 are provided on the outer circumferential surface of the main body 1a and are connected to an air source (not shown) via a pipe (not shown) that passes through the inside of the main body 1a.

In the protective film drying process, when the transport arm 1 transports the semiconductor wafer 5, air 15 for drying the protective film of the semiconductor wafer 5 is sprayed toward the surface of the semiconductor wafer 5. By spraying air 16 from the air spraying portion 14 toward the outside of the main body portion 1a, it is possible to prevent the air 15 from passing around the outside of the main body portion 1a and reaching the grinding surface of the semiconductor wafer 5.

In addition, the nozzle 7 of embodiment 1, the vacuum area 10 of embodiment 2, and the ejection section 13 of embodiment 3 can also be used in the semiconductor manufacturing apparatus of embodiment 4.

As described above, in the semiconductor manufacturing apparatus according to the fourth embodiment, the transport arm 1 is provided with an air ejection section 14 that ejects air 16 from the outer peripheral surface of the transport arm 1. Therefore, by ejecting air 16 from the air ejection section 14 toward the outside of the main body section 1a, it is possible to prevent the air 15 from passing around the outside of the main body section 1a and flowing around to the ground surface of the semiconductor wafer 5 when the air 15 is ejected to dry the protective film of the semiconductor wafer 5 in the protective film drying process. This makes it possible to prevent the occurrence of drying unevenness on the ground surface of the semiconductor wafer 5.

The embodiments can be freely combined, modified, or omitted as appropriate.

1 Transport arm, 2 Chuck table, 3 Suction area, 4 Blow area, 5 Semiconductor wafer, 7 Nozzle, 10 Vacuum area, 13 Jet part, 14 Air jet part, 30 Adjustment mechanism.

Claims (9)

a chuck table on which the semiconductor wafer is placed with the grinding surface of the semiconductor wafer facing upward;
a transfer arm that clamps an outer periphery of the semiconductor wafer and transfers the semiconductor wafer;
an adjustment mechanism for adjusting a gap between the semiconductor wafer and the transfer arm;
a nozzle for spraying water from an outer periphery side of the semiconductor wafer toward the grinding surface of the semiconductor wafer ,
the chuck table has a suction area that sucks and holds the surface of the semiconductor wafer opposite the grinding surface, a blow area that sprays fluid toward the surface of the semiconductor wafer opposite the grinding surface to release the suction on the semiconductor wafer , and a vacuum area that discharges the water sprayed from the nozzle . a chuck table on which the semiconductor wafer is placed with the grinding surface of the semiconductor wafer facing upward;
a transfer arm that clamps an outer periphery of the semiconductor wafer and transfers the semiconductor wafer;
an adjustment mechanism for adjusting a gap between the semiconductor wafer and the transfer arm;
a nozzle for spraying water toward a center portion of the grinding surface of the semiconductor wafer ,
the chuck table has a suction area that sucks and holds the surface of the semiconductor wafer opposite the grinding surface, a blow area that sprays fluid toward the surface of the semiconductor wafer opposite the grinding surface to release the suction on the semiconductor wafer , and a vacuum area that discharges the water sprayed from the nozzle . a chuck table on which the semiconductor wafer is placed with the grinding surface of the semiconductor wafer facing upward;
a transfer arm that clamps an outer periphery of the semiconductor wafer and transfers the semiconductor wafer;
an adjustment mechanism for adjusting a gap between the semiconductor wafer and the transfer arm;
a nozzle for spraying water from an outer periphery side of the semiconductor wafer toward the grinding surface of the semiconductor wafer ,
the chuck table has a suction area that suctions and holds a surface of the semiconductor wafer opposite to the grinding surface, and a blow area that releases the suction applied to the semiconductor wafer by spraying a fluid toward the surface of the semiconductor wafer opposite to the grinding surface ,
The nozzle is attached to the transfer arm of the semiconductor manufacturing device. a chuck table on which the semiconductor wafer is placed with the grinding surface of the semiconductor wafer facing upward;
a transfer arm that clamps an outer periphery of the semiconductor wafer and transfers the semiconductor wafer;
an adjustment mechanism for adjusting a gap between the semiconductor wafer and the transfer arm;
a nozzle for spraying water toward a center portion of the grinding surface of the semiconductor wafer ,
the chuck table has a suction area that suctions and holds a surface of the semiconductor wafer opposite to the grinding surface, and a blow area that releases the suction applied to the semiconductor wafer by spraying a fluid toward the surface of the semiconductor wafer opposite to the grinding surface ,
The nozzle is attached to the transfer arm of the semiconductor manufacturing device. a chuck table on which the semiconductor wafer is placed with the grinding surface of the semiconductor wafer facing upward;
a transfer arm that clamps an outer periphery of the semiconductor wafer and transfers the semiconductor wafer;
an adjustment mechanism for adjusting a gap between the semiconductor wafer and the transfer arm,
the chuck table has a suction area that suctions and holds a surface of the semiconductor wafer opposite to the grinding surface, and a blow area that releases the suction applied to the semiconductor wafer by spraying a fluid toward the surface of the semiconductor wafer opposite to the grinding surface ,
The semiconductor manufacturing apparatus is provided with a spraying unit that sprays water toward an inner peripheral surface of the transfer arm . a chuck table on which the semiconductor wafer is placed with the grinding surface of the semiconductor wafer facing upward;
a transfer arm that clamps an outer periphery of the semiconductor wafer and transfers the semiconductor wafer;
an adjustment mechanism for adjusting a gap between the semiconductor wafer and the transfer arm,
the chuck table has a suction area that suctions and holds a surface of the semiconductor wafer opposite to the grinding surface, and a blow area that releases the suction applied to the semiconductor wafer by spraying a fluid toward the surface of the semiconductor wafer opposite to the grinding surface ,
The semiconductor manufacturing apparatus , wherein the transport arm is provided with an air blowing unit that blows air from an outer circumferential surface of the transport arm . 7. The semiconductor manufacturing apparatus according to claim 1, wherein the suction area is provided at a location on the chuck table facing an outer periphery of the semiconductor wafer. A method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus according to any one of claims 1 to 7 , comprising the steps of:
(a) preparing the semiconductor wafer having a protective film provided on a surface opposite to the grinding surface to protect an element region;
(b) placing the semiconductor wafer on the chuck table and grinding the grinding surface to form a rib on the outer periphery of the semiconductor wafer that is thicker than a central portion of the semiconductor wafer;
(c) placing the semiconductor wafer in water and cleaning the protective film in the water;
(d) transporting the semiconductor wafer from the water to the atmosphere by the transport arm, and drying the protective film during the transport of the semiconductor wafer;
The manufacturing method of a semiconductor device comprising the steps of: a chuck table on which the semiconductor wafer is placed with the grinding surface of the semiconductor wafer facing upward;
a transfer arm that clamps an outer periphery of the semiconductor wafer and transfers the semiconductor wafer;
an adjustment mechanism for adjusting a gap between the semiconductor wafer and the transfer arm,
a manufacturing method of a semiconductor device using a semiconductor manufacturing apparatus, the method comprising: the chuck table having a suction area that suctions and holds a surface of the semiconductor wafer opposite to the grinding surface, and a blow area that releases suction on the semiconductor wafer by spraying a fluid toward the surface of the semiconductor wafer opposite to the grinding surface,
(a) preparing the semiconductor wafer having a protective film provided on a surface opposite to the grinding surface to protect an element region;
(b) placing the semiconductor wafer on the chuck table and grinding the grinding surface to form a rib on the outer periphery of the semiconductor wafer that is thicker than a central portion of the semiconductor wafer;
(c) placing the semiconductor wafer in water and cleaning the protective film in the water;
(d) transporting the semiconductor wafer from the water to the atmosphere by the transport arm, and drying the protective film during the transport of the semiconductor wafer;
The manufacturing method of a semiconductor device comprising the steps of:

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