JP7669163B2 - Suction mechanism, article manufacturing device, semiconductor manufacturing device - Google Patents

Description

The present invention relates to an apparatus and method for mounting, for example, a semiconductor chip onto a lead frame.

Electronic devices come in various forms, but many include semiconductor packages in which semiconductor chips are mounted on a lead frame, and circuit packages in which electronic components such as semiconductor chips are mounted on a circuit board. Semiconductor packages and circuit packages are manufactured, for example, in the following procedure. First, a large number of integrated circuits are formed on a semiconductor wafer, and the semiconductor wafer is cut in a dicing process to divide it into semiconductor chips (dies). Then, in a bonding process, electronic components such as semiconductor chips (dies) are bonded to a lead frame or a circuit board. The device used in this bonding process is a die bonding device known as a die bonder. A die bonder is a device that mounts electronic components on a lead frame or a board and bonds them using a bonding material such as solder, gold, or resin, but in some cases it can also be used to mount and bond another electronic component on top of an electronic component that has already been bonded.

For example, when bonding an electronic component to the surface of a substrate or the like using a die bonder, a suction nozzle called a collet is used to pick up and suck up the electronic component, and transport it to the specified position where bonding is to take place. The bonding material is then heated to perform bonding. The collet may be used only to pick up and transport the electronic component, or it may also be used to apply a pressing force to the electronic component during bonding. A collet is a holder that has suction holes and sucks in air to suck and hold the electronic component, and a collet that is suited to the size and shape of the electronic component to be sucked is used.

When changing the type of electronic component to be bonded with such a die bonder, the collet must be replaced with one of a size and shape that matches the new electronic component. Even when continuously bonding the same type of electronic component, the collet must be replaced with a new one at the appropriate time to prevent the collet from wearing out and scratching the surface of the electronic component, or from becoming dirty and contaminating the surface of the electronic component. For this reason, devices that allow tools such as collets to be replaced are known in the field of die bonders.

For example, Patent Document 1 discloses a bonding head in which a collet is held removably by fitting into a collet holder. A through slit (through opening) is formed in the collet holder, and a retaining pin is attached to the through slit. The collet is retained in the collet holder by engaging this retaining pin with a retaining groove in the collet.

Patent Document 2 also discloses a semiconductor manufacturing device that is equipped with a collet replacement unit for replacing collets, and the collet replacement unit is provided with an opening/closing arm having a claw structure and a collet clamp unit. The collet holder is provided with a clearance for the claws, and the device attaches and detaches the collet to and from the collet holder by controlling the opening/closing arm.

Japanese Patent Application Publication No. 10-135251 JP 2018-206843 A

In order to suck and pick up electronic components, to suck and hold and transport electronic components, and to apply sufficient pressing force to electronic components during bonding, the collet must be able to suck the electronic components with sufficient suction force during these operations. If air leaks occur in the suction path to the suction hole, sufficient suction force cannot be obtained. However, with conventional die bonders, air leaks can occur and suction force can decrease when the collet is replaced.

For example, in the bonding head described in Patent Document 1, a collet and a collet holder, both of which are rigid bodies, are fitted together to form an air suction path. When fitting the collet and the collet holder, if the collet and the collet holder are not properly aligned, the fitting surface may come into contact with the non-mating surface and be damaged, or the corners of the fitting structure may come into contact with a smooth surface and the fitting parts may scratch each other. If the machining precision of the corners or fitting surfaces that make up the fitting part is insufficient, damage due to contact may occur during the fitting operation. For this reason, when the collet is replaced, the fitting surface may become insufficiently airtight, causing air leaks and preventing the bonding operation from being performed properly.

The semiconductor manufacturing device described in Patent Document 2 also had the same problem. That is, when the opening and closing arm is operated to engage the collet and collet holder while they are not properly aligned, the engaging surface may come into contact with the non-engaging surface and be damaged, or the corners of the engaging structure may come into contact with a smooth surface, causing the engaging portions to scratch each other. If the machining precision of the corners or engaging surfaces that make up the engaging portion is insufficient, damage due to contact during the engaging operation may also occur. For this reason, replacing the collet may result in insufficient airtightness of the engaging surface, causing air leaks and making it difficult to carry out the bonding operation.

In addition, in die bonders, the lead frame to which the electronic components are bonded may be held by a lead frame holder using suction. When changing the type of lead frame, the lead frame holder must be replaced, and in this case, air leaks can occur, just as with the collet replacement mentioned above.

Therefore, there was a demand for a die bonder that could mount tools with reduced leakage when replacing tools that adsorb the workpiece, such as collets or lead frame holders, without placing an excessive burden on the alignment work during installation.

One aspect of the present invention is an suction mechanism comprising: a tool capable of adsorbing a workpiece by suction; a tool holder having a suction path; and a positioning portion that determines a relative position of the tool with respect to the tool holder when the tool holder holds the tool, wherein the positioning portion comprises: at least one convex portion formed of an elastic material and having a tapered surface, disposed on one of the tool and the tool holder that does not have the convex portion , at least one concave portion capable of engaging with the convex portion; and a position regulating portion disposed on one of the tool and the tool holder that suppresses deformation of the convex portion .

The present invention provides a die bonder that can mount tools with reduced leakage when replacing tools that adsorb a workpiece, such as a collet or lead frame holder, without placing an excessive burden on the alignment work during installation.

FIG. 1 is a schematic perspective view of a die bonder according to an embodiment. FIG. 2 is a schematic cross-sectional view showing a lead frame holding mechanism of the die bonder according to the first embodiment. FIG. 2 is a perspective view of a suction mechanism according to the first embodiment. FIG. 3 is a cross-sectional view of the suction mechanism according to the first embodiment. 1A is a cross-sectional view showing a state before a collet is attached to a collet holder in the suction mechanism according to embodiment 1. FIG. 1B is a cross-sectional view showing a state in which the collet is attached (held) in the collet holder in the suction mechanism according to embodiment 1. FIG. 1C is a cross-sectional view showing a state in which the collet has adsorbed a semiconductor chip in the suction mechanism according to embodiment 1. FIG. 4 is a top view of the collet and the collet holder according to the first embodiment, as viewed from the Z direction. 1A is a diagram showing the collet being moved above the semiconductor chip, FIG. 1B is a diagram showing the collet suctioning the semiconductor chip, and FIG. 1C is a diagram showing the collet picking up the semiconductor chip. 1A is a top view of one of the mating portions as viewed from the Z direction, and FIG. (a) A cross-sectional view showing a state before mating. (b) A view showing a state where the collet (convex portion) and the position regulating portion are in contact. (c) A view showing a state where the collet (convex portion) and the collet holder (concave portion) are close to each other. (d) A view showing a state where the collet (convex portion) and the collet holder (concave portion) are in contact. (e) A view showing a state where mating is completed. FIG. 13 is a top view of a collet and a collet holder according to a first modified example of the first embodiment, as viewed from the Z direction. (a) A cross-sectional view showing a state before mating in a second modified example of embodiment 1. (b) A diagram showing a state in which a collet (convex portion) and a collet holder (concave portion) are in contact with each other in the second modified example of embodiment 1. (c) A diagram showing a state in which mating in the second modified example of embodiment 1 is completed. (a) A cross-sectional view showing a state before mating in a third modified example of embodiment 1. (b) A view showing a state in which a collet (convex portion) and a collet holder (concave portion) are in contact with each other in the third modified example of embodiment 1. (c) A view showing a state in which mating in the third modified example of embodiment 1 is completed. (a) A cross-sectional view showing a state before mating in a fourth modified example of embodiment 1. (b) A diagram showing a state in which a collet (convex portion) and a collet holder (concave portion) are in contact in the fourth modified example of embodiment 1. (c) A diagram showing a state in which mating in the fourth modified example of embodiment 1 is completed. (d) A plan view of the convex portion in the fourth modified example of embodiment 1. FIG. 11 is a schematic plan view showing a lead frame holding mechanism according to a second embodiment. FIG. 11 is a schematic cross-sectional view showing a lead frame holding mechanism according to a second embodiment. FIG. 13 is a top view of a collet and a collet holder according to a fifth modified example of the first embodiment, as viewed from the Z direction. FIG. 13 is a top view of a collet and a collet holder according to a sixth modified example of the first embodiment, as viewed from the Z direction. FIG. 13 is a top view of a collet and a collet holder according to a seventh modified example of the first embodiment, as viewed from the Z direction. FIG. 23 is a top view of a collet and a collet holder according to an eighth modified example of the first embodiment, as viewed from the Z direction. FIG. 13 is a top view of a collet and a collet holder according to a ninth modified example of the first embodiment, as viewed from the Z direction. FIG. 23 is a top view of a collet and a collet holder according to a tenth modified example of the first embodiment, as viewed from the Z direction.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A suction mechanism, an article manufacturing apparatus, a semiconductor manufacturing apparatus, and the like according to embodiments of the present invention will be described with reference to the drawings.
In the drawings referred to in the following description of the embodiments, elements denoted by the same reference numbers have the same or similar functions unless otherwise specified.

[Embodiment 1]
Fig. 1 is a schematic perspective view for explaining a die bonder according to an embodiment. The die bonder 100 as a semiconductor manufacturing device picks up a semiconductor chip 11 (die) as a workpiece, transports it to an island portion 42 provided on a lead frame 41 as a mounting member, places it there, and performs bonding. Note that Fig. 1 is a schematic diagram in which a portion of the die bonder 100 is extracted for the convenience of explaining the present invention, and some mechanical and electrical elements, such as a housing, a fixed base, and a power supply, that are provided to perform the functions of a practical device are not shown.

(Die bonder configuration)
The die bonder 100 includes a wafer support device 14 , a collet 21 , a collet holder 22 , a bonding arm 23 , a transport unit 24 , a supply unit camera 31 , an island unit camera 32 , and a control unit 200 .
The control unit 200 is a computer for controlling the operation of the die bonder 100, and includes a CPU, ROM, RAM, I/O ports, and the like.

The programs for executing the various processes according to this embodiment may be stored in ROM together with other programs, or may be loaded into RAM from an external source via a network. Alternatively, the programs may be loaded into RAM via a recording medium on which the programs are recorded.

The I/O port is connected to external devices and networks, and can, for example, input and output data required for bonding between an external computer. The I/O port is also connected to a monitor or input device (not shown), and can display information about the die bonder's operating status to the operator and accept commands from the operator.

The control unit 200 is connected to components including the bonding arm 23, the transport unit 24, the supply unit camera 31, and the island unit camera 32, and controls these components using control signals.

The wafer support device 14 is a device that supports a semiconductor wafer 13 that has been diced (divided) into a large number of semiconductor chips 11. In the wafer support device 14, a predetermined area on which the semiconductor wafer 13 is placed is called the supply section 12, and the semiconductor chips 11 for die bonding are supplied from the supply section 12.

The collet 21 (tool) has a suction section capable of suctioning the semiconductor chip 11 (workpiece). Specifically, the lower end surface of the collet 21 is provided with a suction hole capable of vacuum suction, and the semiconductor chip 11 can be suctioned by bringing the lower end surface close to or in contact with the semiconductor chip 11 and suctioning through the suction hole. In addition, if the vacuum suction is released after suction, the semiconductor chip 11 that was being suctioned can be released.

The collet holder 22 (tool holder) is a holding mechanism that detachably holds the collet 21 (tool). A collet 21 that matches the size and shape of the semiconductor chip 11 to be attached is attached to the collet holder 22. As will be described in detail later, in the die bonder 100 of this embodiment, the collet 21 is held in the collet holder 22 by magnetic force.

The collet holder 22 is provided with a suction path, and when the collet holder 22 holds the collet 21, the suction hole of the collet 21 is connected to the suction path of the collet holder 22. By supplying negative pressure from a vacuum pump or the like to the suction hole of the collet 21 via this suction path, the collet 21 can suction the semiconductor chip 11. As will be described in detail later, the die bonder 100 of this embodiment is provided with a flexible member for airtightly connecting the suction hole of the collet 21 to the suction path of the collet holder 22 when the collet holder 22 holds the collet 21 by magnetic force.

The collet holder 22 is connected to the bonding arm 23, which has a movable mechanism for adjusting the position and posture of the collet holder 22. For example, when picking up a semiconductor chip 11 from the supply unit 12, the bonding arm 23 adjusts the height of the collet holder 22 so that the lower end surface of the collet 21 approaches or abuts the semiconductor chip 11 to be picked up. Also, when bonding the semiconductor chip 11 to the island portion 42 of the lead frame 41, the bonding arm 23 adjusts the position and posture of the collet holder 22 so that the semiconductor chip 11 adsorbed by the collet 21 approaches or abuts the island portion 42. Furthermore, the position and posture of the collet holder 22 may be adjusted so that the semiconductor chip 11 is pressed against the island portion 42 with an appropriate force.

The bonding arm 23 is connected to the transport unit 24, and the transport unit 24 can move the bonding arm 23 so that the collet 21 can move freely between the supply unit 12 of the wafer support device 14 and the island portion 42 of the lead frame 41. The transport unit 24 can move the bonding arm 23 in each of the X, Y, and Z directions and in the θ direction around the Z axis.

The supply unit camera 31 is a camera capable of capturing images of the vicinity of the supply unit 12. In order to confirm the position and orientation of the semiconductor chip 11 placed on the supply unit 12 and to confirm the position and orientation of the collet 21 when picking up the semiconductor chip 11, the supply unit camera 31 transmits image data to the control unit 200. When the die bonder 100 performs a pick-up operation, the control unit 200 controls the position and orientation of the collet 21 using the image data transmitted from the supply unit camera 31.

The island portion camera 32 is a camera capable of capturing an image of the area around the island portion 42 of the lead frame 41. In order to check the position and orientation of the island portion 42 and to check the position and orientation of the collet 21 when bonding the semiconductor chip 11, the island portion camera 32 transmits image data to the control unit 200. When the die bonder 100 performs a bonding operation, the control unit 200 controls the position and orientation of the collet 21 using the image data transmitted from the island portion camera 32.

(Die bonding method)
Before describing each part of the die bonder 100 in more detail, an outline of a die bonding method using the die bonder 100 will be given.

First, in preparation for starting die bonding, a semiconductor chip 11 is placed on the supply unit 12 as a workpiece. A lead frame 41 as a workpiece is set on a lead frame holder 40 (described later with reference to FIG. 2) as a workpiece holder.

Then, the control unit 200 of the die bonder 100 causes the supply unit camera 31 to capture an image of the semiconductor chip 11 to be picked up, confirms the position and orientation of the semiconductor chip 11, and drives the transport unit 24 and bonding arm 23 to move the collet 21.

After positioning the collet 21 above the semiconductor chip 11 as shown in FIG. 7(a), the collet 21 is lowered as shown in FIG. 7(b) to bring the bottom end face close to or into contact with the semiconductor chip 11, and the semiconductor chip 11 is sucked by suction through the suction holes. Then, as shown in FIG. 7(c), the collet 21 is raised to pick up the semiconductor chip 11. At this time, the control unit 200 can feedback-control the operation of the transport unit 24, bonding arm 23, suction mechanism, etc. based on image data captured by the supply unit camera 31.

The control unit 200 also causes the island unit camera 32 to capture an image of the island unit 42 (predetermined position) where bonding is to be performed, and confirms its position and orientation. Then, the control unit 200 drives the transport unit 24 and the bonding arm 23 to move the collet 21, which has adsorbed the semiconductor chip 11, above the island unit 42, for example, along the path indicated by the arrow in FIG. 1.

Then, the collet 21 is lowered to bring the semiconductor chip 11 into contact with or close to the island portion 42, and suction is stopped, so that the semiconductor chip 11 can be placed on the island portion 42. The bonding material is then heated to bond the semiconductor chip 11 to the lead frame 41. The control unit 200 may control the bonding arm 23 so that the collet 21 presses the semiconductor chip 11 against the lead frame 41 during bonding. At that time, the control unit 200 can feedback-control the operations of the transport unit 24, bonding arm 23, suction mechanism, heating mechanism, etc., based on image data captured by the island portion camera 32.

After the die bonder 100 completes the bonding of one semiconductor chip through the above procedure, it sequentially picks up another semiconductor chip and bonds it to a specified island portion. Note that the object to be die bonded is not limited to the island portion of the lead frame, and for example, a first semiconductor chip may be die bonded to a second semiconductor chip mounted on a lead frame.

(Lead frame holding mechanism)
Next, a mechanism for holding the lead frame 41 as the mounted member will be described below. Fig. 2 is a schematic cross-sectional view of the holding mechanism taken along the YZ plane direction in Fig. 1 .
2, the lead frame 41 is held by a lead frame holder 40. The lead frame holder 40 has a rail portion 40b that surrounds the periphery of the lead frame 41 and a receiving portion 40a that supports the bottom surface of the lead frame 41, and removably holds the lead frame 41.

The rail portion 40b is a position restricting portion that restricts the position of the lead frame 41 in the horizontal plane so that it falls within a predetermined range. For example, when the lead frame 41 is set on the lead frame holder 40 in an area not shown in FIG. 1 and moved to the position shown in FIG. 1, the position of the lead frame 41 is restricted so that the island portion 42 does not shift beyond the size of the semiconductor chip 11. Specifically, for example, the position and shape of the rail portion 40b are determined so that a clearance of about 0.5 mm remains in the Y direction even if the lead frame is at its maximum size within the dimensional tolerance.

(Adsorption mechanism)
Next, a suction mechanism for picking up the semiconductor chip 11 as the workpiece will be described with reference to Figures 3 to 6, 8, 9, etc. In the die bonder of this embodiment, a dedicated collet is prepared for each type of workpiece (semiconductor chip), and a collet appropriate for the workpiece to be bonded is selected and attached to the collet holder to form the suction mechanism.

Figure 3 is a perspective view of the suction mechanism, which includes a collet 21, a collet holder 22, and a bonding arm 23. The collet holder 22 holds the collet 21 in a detachable manner, but Figure 3 shows the collet 21 detached from the collet holder 22.

The bonding arm 23 is provided with a Z-direction actuator 121 for moving the collet 21 and collet holder 22 in the Z direction. The Z-direction actuator 121 can perform Z-direction movement operations and pressure load feedback control during bonding under the control of the control unit 200. When performing operations such as picking up, placing, and bonding the semiconductor chip 11, the Z-direction actuator 121 is operated to raise and lower the collet. At this time, the operation of the Z-direction actuator is controlled by pressure load feedback to prevent the semiconductor chip 11 from being deformed or damaged, and a force greater than a predetermined load is not applied.

Figure 4 is a schematic cross-sectional view of the collet 21 and collet holder 22 cut along the bent line B-B shown in Figure 3, i.e., the path passing through the convex portion 102c, the suction path 108, and the convex portion 102a. Also, Figure 6 is a top view of the collet 21 and collet holder 22 as viewed from the Z direction.

Collet 21 includes as its components collet base 103, convex portion 102a, convex portion 102b, convex portion 102c, seating surface 104a, seating surface 104b, seating surface 104c, position restricting portion 117a, position restricting portion 117b, position restricting portion 117c, and workpiece suction portion 106, which are integrated together. Collet 21 is provided with a suction path 108 that runs through the inside, and a suction hole 109 for sucking semiconductor chip 11 is disposed at the lower end of suction path 108.

Collet holder 22 includes recesses 112a, 112b, 112c, magnet 113, seating surface 114a, seating surface 114b, and seating surface 114c as its components, which are integrated together. Collet holder 22 is provided with suction path 116 that passes through the inside, and suction path 116 is connected to a negative pressure application mechanism (vacuum pump, control valve, etc.) (not shown).

The magnet 113 of the collet holder 22 and the collet base 103 are arranged to face each other, and the collet base 103 is made of a ferromagnetic material. When the collet 21 is attached to the collet holder 22, the collet base 103 is subjected to an attractive force by the magnetic force of the magnet 113, and the collet 21 is detachably held in the collet holder 22. Note that in this embodiment, the mechanism for detachably holding the collet using magnetic force is not limited to this configuration, and for example, a magnet may be provided on the collet side, and the collet holder may be formed of a ferromagnetic material. Alternatively, a first magnet may be provided on one of the collet and the collet holder, and a second magnet may be provided on the other, and the first magnet and the second magnet may be arranged so that their opposite magnetic poles face each other.

The strength of the force with which the collet holder holds the collet is set so that it can hold the collet stably during the entire bonding process, but does not require the application of excessive external force when removing the collet, and a magnet with magnetic force according to this setting is used. This makes it easier to attach and remove the collet when replacing it, and prevents unexpected damage caused by excessive external force.

As shown in FIG. 6, the magnets 113 are arranged symmetrically around the suction path 116 so that the necessary holding force is applied uniformly to each part of the collet and collet holder. However, the magnets may be arranged in an exception to this as long as the necessary holding force is applied uniformly. Note that a permanent magnet is used for the magnet 113, but an electromagnet may also be used if implementation is possible.

In the suction mechanism of this embodiment, a flexible member 115 capable of elastic deformation is disposed between the collet 21 and the collet holder 22. In the example of FIG. 4, the flexible member 115 is fixed to the recess of the collet holder 22, but it may be fixed to the collet 21 side, or it may be sandwiched between the collet holder 22 and the collet 21 without being fixed to either.

As shown in FIG. 6, the flexible member 115 is an annular member, and when viewed in a plan view from the Z direction, it has a circular ring shape that surrounds the suction path 108 of the collet 21 and the suction path 116 of the collet holder 22. Note that the shape of the ring when viewed in a plan view is not limited to a circular ring and may be a ring of another shape, but from the standpoint of stability and reproducibility of elastic deformation, a symmetrical shape is preferable, and a circular ring is particularly desirable.

When the collet 21 is held by the collet holder 22 with a holding force that does not require excessive external force for removal, the flexible member 115 elastically deforms to adhere to both the upper end surface of the collet 21 and the lower end surface of the collet holder 22. In other words, the flexible member 115 is formed of a material that can easily elastically deform with the holding force described above and can airtightly connect the suction path 108 and the suction path 116 (connecting the two and sealing them from the atmosphere). For this reason, the flexible member 115 can contain, for example, any of the following materials: rubber, porous resin, or magnetic fluid. In addition, the annular flexible member 115 is preferably arranged in a concentric shape with the suction path 116 as the center. This is because the flexible member 115 can be elastically deformed uniformly in the suction direction even with a weak suction force.

(How to attach the collet)
Next, a method of mounting the collet 21 in the collet holder 22 will be described with reference to FIGS. 5(a) to 5(c), 6, etc.
5(a) to 5(c) are schematic cross-sectional views of the collet 21 and the collet holder 22 cut along the bent line B-B shown in Fig. 3, i.e., the path passing through the convex portion 102c, the suction path 108, and the convex portion 102a. For convenience of illustration, the dimensions and shapes of each part are not drawn to scale.

Figure 5(a) shows the state before the collet 21 is attached to the collet holder 22, and Figure 5(b) shows the state in which the collet 21 is attached (held) in the collet holder 22. Also, Figure 5(c) shows the state in which the collet 21 held by the collet holder 22 adsorbs the semiconductor chip 11.

The convex portions 102a, 102b, and 102c of the collet 21 and the concave portions 112a, 112b, and 112c of the collet holder 22 act as positioning mechanisms that can fit together. That is, as shown in FIG. 5(b), when the collet holder 22 holds the collet 21, they fit together and restrain each other, so that the collet holder 22 can hold the collet 21 without rattling. In this embodiment, three pairs of fitting portions each consisting of a pair of a convex portion and a concave portion are provided, but any number of pairs can be provided taking into consideration positioning accuracy, mechanical strength, spatial margin, manufacturing costs, and the like. However, in order to stabilize the posture when held, it is desirable to arrange the positioning mechanisms symmetrically around the suction path.

The magnet 113 (magnet) provided in the collet holder 22 and the collet base 103 (ferromagnetic material) provided in the collet 21 act as a holding means that removably holds the collet in the collet holder by magnetic force. That is, when the collet 21 is aligned with the collet holder 22 and brought close to it, the collet base 103 is subjected to an attractive force by the magnetic force of the magnet 113, and the collet 21 is held in the collet holder 22. When replacing the collet, it is possible to remove the collet from the collet holder by applying an external force greater than the attractive force of the magnet (the holding force of the holding means).

The attractive force of the magnet (holding force of the holding means) needs to be set to a strength sufficient to prevent the collet from rattling due to weight or inertia when the semiconductor chip 11 (workpiece) is picked up or transported by suction, as shown in FIG. 5(c). However, the attractive force of the magnet (holding force of the holding means) is not necessarily better the stronger it is, and it is best to set it within a range that does not require an excessively large external force when removing the collet from the collet base.

The positional relationship between the magnet 113 and the collet base 103 is preferably set so that when the collet holder 22 holds the collet 21, the magnet 113 and the collet base 103 face each other with a small gap between them, as shown in FIG. 5(b). If the magnet 113 and the collet base 103 are positioned so that they come into contact with each other, there is a possibility that the magnet 113 will be worn down when the collet is attached or removed.

To achieve this, as shown in FIG. 5(b), when the collet is attached, the bottom surface of the collet holder 22 and the top surface of the collet base 103 are spaced apart by a distance L2. By ensuring the distance L2 as a clearance, a positional relationship can be achieved in which the magnet 113 and the collet base 103 do not come into contact. To ensure the distance L2, the seating surfaces 104a, 104b, and 104c of the collet 21 are located higher than the top surface of the collet base 103. Then, when attached, the seating surfaces 104a, 104b, and 104c of the collet 21 come into contact with the seating surfaces 114a, 114b, and 114c of the collet holder 22.

In this embodiment, as shown in Figs. 3 and 6, three pairs of collet side seating surfaces and collet holder side seating surfaces are arranged equiangularly and equidistantly around the suction path. However, the embodiment of the present invention is not limited to this, and an appropriate number and shape of collet side seating surfaces and collet holder side seating surfaces can be provided taking into consideration positioning accuracy, mechanical strength, spatial margin, manufacturing costs, etc. In addition, in order to ensure the distance L2, in this embodiment, the seating surfaces 104a to 104c are configured to protrude from the upper surface of the collet base 103, but the seating surfaces 114a to 114c of the collet holder 22 may be configured to protrude from the lower surface of the collet holder 22. In addition, the seating surfaces do not necessarily have to be installed near the positioning mechanism (protrusions 102a to 102c, recesses 112a to 112c), and may be located at a distance.

Next, the flexible member 115 will be described. The flexible member 115 is a member that airtightly connects the suction hole 109 (suction path 108) of the collet 21 and the suction path 116 of the collet holder 22 from the outside air when the collet holder 22 holds the collet 21 by magnetic force.

The flexible member 115 of this embodiment has a base that fits into an annular groove provided in the collet holder 22, and an annular inclined surface with one end connected to the base (protruding from the base) so as to be inclined with respect to the Z direction. The inclination direction of the annular inclined surface is set so that the tip of the ring opens toward the collet, that is, as shown in FIG. 5(b), the inner diameter D1 (annular diameter) on the side in contact with the collet is larger than the inner diameter D2 (annular diameter) on the collet holder side. In other words, the annular inclined surface is inclined in a direction such that the inner diameter D2 on the side connected to the base (the collet base side in the example of FIG. 5(b)) is smaller and the inner diameter D1 on the opposite tip side not connected to the base is larger.

When the collet 21 is not attached to the collet holder 22, as shown in FIG. 5(a), it protrudes by L1 in the Z direction from the bottom surface of the collet holder 22. Here, L1 is set to be larger than the aforementioned L2.

When the collet 21 is attached to the collet holder 22, as shown in FIG. 5(b), the flexible member 115 is elastically deformed by the holding force of the holding means. That is, the inclined surface protrudes L2 in the Z direction from the bottom surface of the collet holder 22, and deforms so that its bottom end comes into close contact with the top surface of the collet base 103. The top surface of the flexible member 115 also comes into close contact with the collet holder 22 due to the holding force of the holding means. As a result of the elastic deformation, the inclination of the inclined surface in the Z direction increases, and the inner diameter D1 becomes larger than before the collet 21 was attached.

The flexible member 115, which is in close contact with both the collet holder 22 and the collet 21, forms an airtight connection that connects the suction path 116 (suction hole 109) of the collet 21 to the suction path 116 of the collet holder 22 and seals them from the atmosphere.

As shown in FIG. 5(c), when the semiconductor chip 11 (workpiece) is held using the collet 21, the suction path is evacuated and the semiconductor chip 11 (workpiece) is adsorbed through the suction hole 109. In this embodiment, the suction path is excellent in airtightness because an elastically deformable flexible member 115 is interposed. In the conventional method of directly abutting the rigid collet and the collet holder to connect the suction path, air leakage may occur from a small gap, and it was necessary to repeatedly adjust the installation when attaching the collet. In contrast, in this embodiment, the flexible member 115 is elastically deformed by the holding force of the holding mechanism using magnetic force, and is in close contact with both the collet and the collet holder to connect the suction path, so there is no need to repeatedly adjust the installation of the collet. Moreover, in this embodiment, the relative positions of the collet and the collet holder are fixed by the above-mentioned positioning mechanism, so there is no risk of unexpected twisting of the flexible member 115 after the collet is attached, causing leakage. In addition, according to this embodiment, leakage can be prevented with a small and lightweight structure. The small, lightweight structure makes it possible to perform advanced position control.

When implementing the present invention, for example, a doughnut-shaped flexible member with a circular cut surface can be used. However, in this embodiment, since the flexible member 115 is composed of a base and a slope as described above, the sealing performance when the suction path is evacuated can be particularly excellent. That is, due to the internal and external pressure difference that occurs when the suction path is evacuated, the upper and side surfaces of the base are pressed even more strongly against the groove of the collet holder, and the tip of the slope opposite the base is pressed even more strongly against the upper surface of the collet. In this way, the flexible member of this embodiment is not only tightly attached by the holding force of the magnetic force, but also has atmospheric pressure acting in a direction that further improves the adhesion, resulting in particularly excellent sealing performance when evacuated.

(Regarding the fitting part)
In this embodiment, the configuration of the fitting mechanism consisting of the convex parts 102a to 102c and the concave parts 112a to 112c is devised so that the alignment accuracy required at the stage of Fig. 5(a) can be relaxed when attaching the collet to the collet holder. Furthermore, as shown in Fig. 6, the position regulating parts 117a to 117c are arranged so as to ensure the alignment accuracy required for the fitting mechanism. This will be explained with reference to Figs. 8(a) to 8(b) and Figs. 9(a) to 9(e) and the like. In the following explanation, when matters common to each of the convex parts 102a to 102c are explained, these may be collectively referred to as the convex part 102. Similarly, when it is not necessary to distinguish each of the concave parts 112a to 112c individually, these may be collectively referred to as the concave part 112. Similarly, when there is no need to distinguish between the position regulating units 117a to 117c, they may be collectively referred to as the position regulating unit 117.

Figure 8(a) is a top view of one of the three engagement mechanisms, namely, the convex portion 102c, the concave portion 112c, and the position regulation portion 117c, viewed from the Z direction in a state before engagement. Figure 8(b) is a cross-sectional view showing the state before engagement of the convex portion 102c and the concave portion 112c. As shown in Figure 3, the other two engagement mechanisms are provided in different positions on the collet base, but the shapes of the convex portion, the concave portion, and the position regulation portion that constitute the engagement mechanism are the same as those shown in Figures 8(a) and 8(b).

As shown in FIG. 8(b), the convex portion 102 has a pin shape with a maximum outer diameter of d2 when not engaged. The convex portion 102 has a slit 105 (slit 105c in the case of convex portion 102c) of a predetermined depth from the tip to the base. Looking at the pin-shaped convex portion 102 from the tip to the base, the tip is a flat surface with a diameter of d1, and passes through a tapered surface 107 that connects to the flat surface, leading to the body portion with the maximum outer diameter, and the outer diameter decreases on the base side of the body portion. Note that the depth of the slit 105 is preferably at least a depth that reaches from the tip to the body portion in order to appropriately perform the elastic deformation described later, and in the example of FIG. 8(b), an example is shown in which the slit 105 reaches further than the body portion to the base side.

The recess 112 is a through hole, and when viewed from the Z direction, has a shape of a rectangle with semicircles joined to both ends as shown in Fig. 8(a) . When viewed from the Z direction, the length of the longitudinal direction of the recess 112 is L and the length of the lateral direction is D, the protrusion 102 and the recess 112 are configured to satisfy the relationship of the following mathematical formula 1.
d1<D<d2<L...(Formula 1)

As described above, the protrusion 102 has a pin shape with a slit in the center, but because it is made of an elastic material, when it engages with the recess 112, whose inner diameter in the short direction is D, it can elastically deform in a direction such that the maximum outer diameter becomes smaller than d2.

As shown in Fig. 8A, the position restricting portions 117 are disposed on the collet 21 facing each other so as to sandwich the collet holder 22 along the longitudinal direction of the recess 112. In the example of Fig. 8A, the length of the position restricting portions is approximately the same as the longitudinal length L of the recess 112. The dimension of the position restricting portions 117 in the Z direction may be larger or smaller than the dimension of the protrusion 102 in the Z direction.
9(a) to 9(e), the fitting process will be described using the protrusion 102c and the recess 112c as an example. As shown in FIG. 9(a), it is assumed that the center of the protrusion 102c and the center of the recess 112c are misaligned by ΔX2 before the fitting is started.

As shown in FIG. 9(b), when the fitting operation is started and the collet 21 and collet holder 22 are moved relative to each other in the Z direction, the centers of the convex portion 102c and the concave portion 112c are misaligned, so the tapered surface 118 of the position regulating portion 117c comes into contact with the outer edge of the collet holder 22. Furthermore, when the collet 21 is brought closer to the collet holder 22, the tapered surface 118 and the outer edge slide together, and a force acts in a direction (horizontal direction) in which the center of the convex portion 102c and the center of the concave portion 112c coincide, and the collet holder 22 is inserted into the position regulating portion 117.

Furthermore, as shown in FIG. 9(c), the fitting operation continues, and the collet 21 and collet holder 22 are moved relatively toward each other in the Z direction. Then, because the centers of the convex portion 102c and the concave portion 112c are misaligned, the tapered surface 107 of the convex portion 102c comes into contact with the opening edge of the concave portion 112c, as shown in FIG. 9(d).

Furthermore, when the collet is brought close to the collet holder, the tapered surface 107 slides against the opening edge, and a force acts in a direction (horizontal direction) such that the center of the convex portion 102c and the center of the concave portion 112c coincide, and the convex portion 102c is inserted into the concave portion 112c.

Then, as shown in FIG. 9(e), the convex portion 102c elastically deforms so that the maximum outer diameter of the body of the convex portion 102c becomes equal to the inner diameter of the concave portion 112c, and the misalignment is eliminated, completing the engagement.

In this embodiment, as shown in Equation 1, d1<D is satisfied, and a tapered surface 107 is provided that connects to the flat surface at the tip of the convex portion 102, thereby absorbing the positional misalignment between the convex portion 102 and the concave portion 112.

Here, if the tolerable amount of positional deviation that can be absorbed is ΔX, ΔX can be expressed by the following equation 2.
ΔX=D−d1 (Formula 2)

Position restriction portion 117 is also provided with tapered surface 118 that connects to the flat surface at the tip, thereby making it possible to absorb positional misalignment between position restriction portion 117 and collet holder 22. If the tolerable amount of positional misalignment that can be absorbed between position restriction portion 117 and collet holder 22 is ΔX2, then ΔX2 can be expressed by the following equation 3.
ΔX2=Wo−W (Formula 3)
By setting the values of Wo and W such that ΔX2 is greater than ΔX, the allowable amount of positional deviation that can be absorbed by providing the position regulating portion 117 can be increased.

Furthermore, as shown in Equation 1, by making D<d2, the convex portion 102 can be elastically deformed and can be fitted into the concave portion 112 without rattling.

In addition, as shown in Equation 1, by making d2<L, there is a margin (play) in the X direction, so even if the convex portion 102c and the concave portion 112c are misaligned in the X direction, as shown in FIG. 8(a), for example, the mating operation can be performed without any problems.

In other words, in the case of the convex portion 102c and the concave portion 112c, in the X direction in which the slit 105c extends in a plan view, if the misalignment is equal to or less than ΔY as shown in the following mathematical expression 4, they can be smoothly fitted together.
ΔY<L−d2...(Formula 4)

As shown in FIG. 9C, when the fitting is completed, the deformation amount M in the fitted state where the protrusion 102 is elastically deformed is expressed by the following formula 5.
M=d2-D...(Formula 5)

Here, if the spring constant when both sides of the slit elastically deform is k, the relationship between the force F in the direction of elastic deformation (the Y direction in the case of the convex portion 102c), the spring constant k, and the deformation amount M in the fitted state is expressed by the following equation 6.
F = k × M (Formula 6)

If you want to make the mating mechanism more rigid, you can increase the spring constant k or the amount of deformation M in the mated state. However, d2, D, and the spring constant k are subject to variation due to processing errors during manufacturing, etc. It is necessary to take these factors into consideration when determining d2 and D, and the amount of deformation M in the mated state. Furthermore, it is best to take into consideration factors such as frictional resistance during the mating operation, and then determine the spring constant k and the amount of deformation M in the mated state overall.

Since the protrusion 102 is made of an elastically deformable material, when the deformation amount exceeds a certain value, the shape cannot be restored by elastic deformation, and the function of the fitting mechanism is impaired. The relationship between the maximum deformation amount N of the protrusion 102 that can be tolerated in order for the protrusion 102 to maintain the fitting function and the deformation amount M in the fitted state is expressed by the following mathematical expression 7.
M<N... (Formula 7)

Here, when an external force acts on collet holder 22 with collet 21 and collet holder 22 positioned, convex portion 102 deforms to an amount M or more of deformation in the fitted state. The amount of movement L by which convex portion 102 can move with collet 21 and collet holder 22 positioned is expressed by the following mathematical formula 8, because position restriction portion 117 restricts the relative positions of collet 21 and collet holder 22.
L = Wi - W ... (Formula 8)

If the amount of movement L is smaller than the maximum amount of deformation N, the amount of deformation of the convex portion 102 falls within the range of possible elastic deformation, and it is possible to prevent impairment of the fitting function even if an unexpected external force acts on the convex portion 102. In other words, it is preferable to determine the dimensions W1 and W so as to satisfy the relationship expressed in the following formula 9.
W - W < N ... (Formula 9)

In this embodiment, as shown in FIG. 6, three fitting mechanisms consisting of convex portions 102a to 102c, concave portions 112a to 112c, and position restricting portions 117a to 117c are equiangularly arranged to surround the magnet 113, flexible member 115, and suction path 116.

Of these, the convex portion 102a and the convex portion 102b are arranged along the Y direction, and the respective slits 105a and slits 105b are also oriented along the Y direction. The corresponding recesses 112a and 112b are also arranged along the Y direction, and the longitudinal direction of each oblong hole is oriented along the Y direction. The corresponding position restricting portion 117a and the position restricting portion 117b are also arranged along the Y direction, and the respective position restricting surfaces are oriented along the Y direction. In other words, the position restricting force acts in the same direction for these two fitting structures. In addition, the convex portion 102c and the corresponding recess 112c are arranged so that the longitudinal direction of the slit 105c and the oblong hole are along the X direction. Furthermore, the convex portion 102c and the corresponding position restricting portion 117c are arranged so that the slit 105c and the restricting surface of the position restricting portion are along the X direction. In other words, the direction of the position restricting force is perpendicular to that of the previous two fitting structures.

By adopting such an arrangement, the position in the X direction and the rotation direction around the Z axis are determined by the convex portion 102a, the concave portion 112a, and the position regulation portion 117a, and the convex portion 102b, the concave portion 112b, and the position regulation portion 117b, and the position in the Y direction is determined by the convex portion 102c, the concave portion 112c, and the position regulation portion 117c. In this way, in the three fitting mechanisms, the positioning of the short sides of each long hole is performed by the sliding of the tapered surfaces and the action of elastic deformation, so that the overall position in three directions, the X direction, the Y direction, and the rotation direction around the Z axis, can be determined.

As described above, according to this embodiment, even if the positions of the convex portion and the concave portion are slightly misaligned, the fitting mechanism automatically aligns them, so the collet can be attached to the collet holder without placing an excessive burden on the alignment work. Furthermore, since the fitting mechanism of this embodiment is not part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion and becomes worn, no leaks will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the position regulating portion functions to prevent the elastically deformable member that aligns it from deforming beyond the elastic deformation limit.

(First Modification)
Next, a first modified example of the first embodiment will be described with reference to Fig. 10. In the first modified example, the directions in which the convex portions 102a, 102b, the concave portions 112a, 112b, and the position restricting portions 117a, 117c are arranged when viewed in a plan view from the Z direction are different from the basic shape of the first embodiment described with reference to Fig. 6.

That is, in the basic form, the slits 105a of the convex portion 102a and the slits 105b of the convex portion 102b are both arranged along the Y direction. In addition, the longitudinal direction of the concave portion 112a and the longitudinal direction of the concave portion 112b are both arranged along the Y direction.

In contrast, in the first modified example, the slits 105a of the convex portion 102a and the slits 105b of the convex portion 102b are arranged in directions that differ by 120 degrees from each other. In addition, the longitudinal direction of the recess 112a and the longitudinal direction of the recess 112b are also arranged in directions that differ by 120 degrees from each other. In other words, the slits 105a, 105b, and 105c are arranged at 120 degree intervals around the communication hole. Similarly, the longitudinal direction of the recess 112a, the longitudinal direction of the recess 112b, and the longitudinal direction of the recess 112c are arranged at 120 degree intervals around the communication hole. Similarly, the longitudinal direction of the position restricting portion 117a, the longitudinal direction of the position restricting portion 117b, and the longitudinal direction of the position restricting portion 117c are arranged at 120 degree intervals around the communication hole.

Even in this modified example, even if the convex and concave portions are slightly misaligned, the collet can be attached to the collet holder without excessive strain due to the automatic alignment caused by the sliding and elastic deformation of the tapered surface of the fitting mechanism. The fitting mechanism of this modified example allows easy alignment before attaching the collet to the collet holder when there is a tendency for misalignment to occur in the rotational direction around the Z axis. Furthermore, since the fitting mechanism of this modified example is not part of the airtight seal surface of the suction path, no leakage will occur in the suction path even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting. Furthermore, even if an unexpected external force acts on the collet when it is attached to the collet holder, the elastically deformable member that aligns the collet can be prevented from deforming beyond the elastic deformation limit.

(Second Modification)
Next, a second modification of the first embodiment will be described with reference to Fig. 11(a) to Fig. 11(c). In the second modification, as shown in Fig. 11(a), the inner diameter of the recess 112 changes depending on the position in the Z direction. That is, W1<W2, and the relationship with the maximum outer diameter of the protrusion 102 is W2<d2.

In this modified example, if the convex portion 102 and the concave portion 112 are misaligned, the tapered surface 107 slides against the inner edge of the concave portion 112 as shown in FIG. 11(b), and the convex portion 102 and the concave portion 112 move relative to each other in a direction that eliminates the misalignment.

During the engagement, the body of the convex portion 102 with the maximum outer diameter elastically deforms to match the inner diameter W1 of the concave portion, but when the engagement is complete as shown in FIG. 11(b), the body of the convex portion 102 with the maximum outer diameter reaches the inner diameter W2 portion, and the elastic deformation of the convex portion 102 is alleviated.

Even in this modified example, even if the positions of the convex and concave portions are slightly misaligned, the alignment is automatically achieved by the sliding and elastic deformation of the tapered surfaces of the engagement mechanism, so the collet can be attached to the collet holder without excessive effort required for the alignment work.

In addition, in this modified example, when an unexpected external force is applied in a direction to remove the collet after it is attached to the collet holder, the tapered surface 107R at the bottom of the convex portion 102 comes into contact with the step portion of the inner diameter of the concave portion 112, and the elastic force of the convex portion 102 acts in a direction to maintain the engagement. In other words, it can be said that a restraining portion that restrains the body portion of the convex portion is provided on the inner surface of the concave portion. In this way, since the engagement mechanism acts in a direction that assists in holding the collet by magnetic force, the stability of holding the collet by the collet holder during the die bonding operation is increased. And since the engagement mechanism of this modified example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during engagement and is worn out, no leak will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the position regulating portion functions to prevent the elastically deformable member that performs alignment from deforming beyond the elastic deformation limit.

(Third Modification)
Next, a third modified example of the first embodiment will be described with reference to Figures 12(a) to 12(c). In the third modified example, the protrusions 102 are not provided with slits, and are formed using an elastic material with a smaller elastic modulus than the basic shape. In this modified example as well, the maximum outer diameter of the body of the protrusions 102 is set to be larger than the inner diameter of the recesses 112.

In this modified example, if the convex portion 102 and the concave portion 112 are misaligned, the tapered surface 107 slides against the inner edge of the concave portion 112 as shown in FIG. 12(b), and the convex portion 102 and the concave portion 112 move relative to each other in a direction that eliminates the misalignment.
When the fitting is completed as shown in FIG. 12( c ), the body of the protrusion 102 is compressed in the radial direction, and the outer diameter of the protrusion 102 becomes equal to the inner diameter of the recess 112 .

Even in this modified example, even if the positions of the convex and concave portions are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so the collet can be attached to the collet holder without placing an excessive burden on the alignment work. Furthermore, since the fitting mechanism of this modified example is not part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and becomes worn, no leaks will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the position regulating part functions to prevent the elastically deforming member that performs the alignment from deforming beyond the elastic deformation limit.

(Fourth Modification)
Next, a fourth modification of the first embodiment will be described with reference to Figures 13(a) to 13(d). In the fourth modification, the shape of the protrusion 102 is changed, and a biasing portion is provided in the recess 112 for elastically biasing and restraining the protrusion 102 during fitting.

As shown in the side view of FIG. 13(a) and the plan view of FIG. 13(d), the protrusion 102 of this modified example is a so-called D-cut pin-shaped protrusion in which part of a circle is cut out into a D-shape in plan view. A groove 105k is formed in the flat side surface of the protrusion 102. A gap is provided on the inner surface of the recess 112, and a hard ball 202 is arranged so that it protrudes from the gap. The hard ball 202 is biased by a leaf spring 201 toward the gap. When the protrusion 102 is fitted, the hard ball 202 biased by the leaf spring 201 engages with the groove 105k and acts as a restraining portion.

In this modified example, if the convex portion 102 and the concave portion 112 are misaligned, the tapered surface 107 slides against the inner edge of the concave portion 112 as shown in Figure 13 (b), and the convex portion 102 and the concave portion 112 move relative to each other in a direction that eliminates the misalignment.
When the fitting is completed as shown in FIG. 13C, the hard ball 202 in the recess 112 engages with the groove 105k, and the protrusion 102 is restrained by the recess 112.

Even in this modified example, even if the positions of the convex and concave portions are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so the collet can be attached to the collet holder without placing an excessive burden on the alignment work. Furthermore, because the fitting mechanism of this modified example is not part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and becomes worn, no leaks will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastically deforming member that aligns it can be prevented from deforming beyond the elastic deformation limit.

(Fifth Modification)
Next, a fifth modified example of the first embodiment will be described with reference to Fig. 16. In the fifth modified example, the number of position restriction units 117 provided is reduced to two.
As shown in FIG. 16, the position restricting portion 117 in this modified example is provided in two places: a position restricting portion 117a corresponding to the convex portion 102a and the concave portion 112a, and a position restricting portion 117c corresponding to the convex portion 102c and the concave portion 112c.

The position regulating portion 117a can regulate the position in the X direction, so that the elastic deformation members of the convex portion 102a and the convex portion 102b can be prevented from deforming beyond the elastic deformation limit. In addition, the convex portion 102a and the concave portion 112a and the convex portion 102b and the concave portion 112b can be engaged after the position regulating portion 117a absorbs the positional deviation in the X direction during the engagement operation. The position regulating portion 117c can regulate the position in the Y direction, so that the elastic deformation members of the convex portion 102c can be prevented from deforming beyond the elastic deformation limit. In addition, the convex portion 102c and the concave portion 112c can be engaged after the position regulating portion 117c absorbs the positional deviation in the Y direction during the engagement operation.

Even in this modified example, even if the positions of the convex and concave portions are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so the collet can be attached to the collet holder without placing an excessive burden on the alignment work. Furthermore, because the fitting mechanism of this modified example is not part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and becomes worn, no leaks will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastically deforming member that aligns it can be prevented from deforming beyond the elastic deformation limit.

(Sixth Modification)
Next, a sixth modified example of the first embodiment will be described with reference to Fig. 17. In the sixth modified example, the number of position restriction units 117 provided is reduced to two.
17, the position restricting portion 117 in this modification is provided with two position restricting portions, a position restricting portion 117a corresponding to the convex portion 102a and the concave portion 112a, and a position restricting portion 117c corresponding to the convex portion 102c and the concave portion 112c. The position restricting portion 117a is disposed at a position away from the convex portion 102 and the concave portion 112.

Since the position restricting portion 117a can restrict the position in the X direction, it is possible to prevent the elastically deformable members of the convex portions 102a and 102b from being deformed beyond the elastic deformation limit amount.
Furthermore, the position restriction portion 117a absorbs the positional deviation in the X direction during the fitting operation, and then the convex portion 102a and the concave portion 112a and the convex portion 102b and the concave portion 112b can be fitted together. The position restriction portion 117c can restrict the position in the Y direction, and therefore can prevent the elastic deformation member of the convex portion 102c from being deformed beyond the elastic deformation limit. Furthermore, the position restriction portion 117c absorbs the positional deviation in the Y direction during the fitting operation, and then the convex portion 102c and the concave portion 112c can be fitted together.

Even in this modified example, even if the positions of the convex and concave portions are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so the collet can be attached to the collet holder without placing an excessive burden on the alignment work. Furthermore, because the fitting mechanism of this modified example is not part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and becomes worn, no leaks will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastically deforming member that aligns it can be prevented from deforming beyond the elastic deformation limit.

(Seventh Modification)
Next, a seventh modification of the first embodiment will be described with reference to Fig. 18. In the seventh modification, the number of position restriction portions 117 provided is reduced to two.
18, the position restricting portion 117 in this modification is provided with two position restricting portions, a position restricting portion 117a corresponding to the convex portion 102a and the concave portion 112a, and a position restricting portion 117c corresponding to the convex portion 102c and the concave portion 112c. The position restricting portion 117a is disposed at a position away from the convex portion 102a and the concave portion 112a.

The position regulating portion 117a can regulate the position in the X direction, so that the elastic deformation members of the convex portion 102a and the convex portion 102b can be prevented from deforming beyond the elastic deformation limit. In addition, the convex portion 102a and the concave portion 112a and the convex portion 102b and the concave portion 112b can be engaged after the position regulating portion 117a absorbs the positional deviation in the X direction during the engagement operation. The position regulating portion 117c can regulate the position in the Y direction, so that the elastic deformation members of the convex portion 102c can be prevented from deforming beyond the elastic deformation limit. In addition, the convex portion 102c and the concave portion 112c can be engaged after the position regulating portion 117c absorbs the positional deviation in the Y direction during the engagement operation.

Even in this modified example, even if the positions of the convex and concave portions are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so the collet can be attached to the collet holder without placing an excessive burden on the alignment work. Furthermore, because the fitting mechanism of this modified example is not part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and becomes worn, no leaks will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastically deforming member that aligns it can be prevented from deforming beyond the elastic deformation limit.

(Eighth Modification)
Next, an eighth modification of the first embodiment will be described with reference to Fig. 19. In the eighth modification, a position restriction portion 117 is provided so as to correspond to the recess 112 having the biasing portion shown in the fourth modification.
19, the position restricting portion 117 of this modification is arranged in three places: position restricting portion 117a corresponding to the convex portion 102a and the concave portion 112a, position restricting portion 117b corresponding to the convex portion 102b and the concave portion 112b, and position restricting portion 117c corresponding to the convex portion 102c and the concave portion 112c. However, since the elastic deformation direction of the biasing portion in the fitted state is unidirectional, the position restricting portion 117 is arranged to restrict deformation in one direction corresponding to the deformation direction of the biasing portion.

The position restricting portion 117a and the position restricting portion 117b can restrict the position in the X direction, so that the elastic deformation members of the recesses 112a and 112b can be prevented from deforming beyond the elastic deformation limit. The position restricting portion 117c can restrict the position in the Y direction, so that the elastic deformation members of the recesses 112c can be prevented from deforming beyond the elastic deformation limit.

Even in this modified example, even if the positions of the convex and concave portions are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so the collet can be attached to the collet holder without placing an excessive burden on the alignment work. Furthermore, because the fitting mechanism of this modified example is not part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and becomes worn, no leaks will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastically deforming member that aligns it can be prevented from deforming beyond the elastic deformation limit.

(Ninth Modification)
Next, a ninth modification of the first embodiment will be described with reference to Fig. 20. In the ninth modification, the number of position restriction units 117 provided is reduced to two.
20, the position restricting portion 117 in this modified example is provided with two position restricting portions 117a and 117c. The position restricting portion 117a is disposed at a position away from the protruding portion 102a and the recessed portion 112a, and the position restricting portion 117c is disposed at a position away from the protruding portion 102c and the recessed portion 112c.

The position regulating portion 117a can regulate the position in the X direction, so that the elastic deformation members of the convex portion 102a and the convex portion 102b can be prevented from deforming beyond the elastic deformation limit. In addition, the convex portion 102a and the concave portion 112a and the convex portion 102b and the concave portion 112b can be engaged after the position regulating portion 117a absorbs the positional deviation in the X direction during the engagement operation. The position regulating portion 117c can regulate the position in the Y direction, so that the elastic deformation members of the convex portion 102c can be prevented from deforming beyond the elastic deformation limit. In addition, the convex portion 102c and the concave portion 112c can be engaged after the position regulating portion 117c absorbs the positional deviation in the Y direction during the engagement operation.

Even in this modified example, even if the positions of the convex and concave portions are slightly misaligned, the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism, so the collet can be attached to the collet holder without placing an excessive burden on the alignment work. Furthermore, because the fitting mechanism of this modified example is not part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and becomes worn, no leaks will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while it is attached to the collet holder, the elastically deforming member that aligns it can be prevented from deforming beyond the elastic deformation limit.

(Tenth Modification)
Next, a tenth modification of the first embodiment will be described with reference to Fig. 21. In the tenth modification, a position restriction portion 117 is provided at one location in consideration of the deformation direction of the recess 112 having the biasing portion shown in the fourth modification.

21, the position restricting portion 117 of this modified example has a protrusion shape provided on the collet 21 so as to restrict deformation in one direction corresponding to the deformation direction of the biasing portion. The protrusion shape is disposed away from the collet holder 22 by a distance that is smaller than the elastic deformation limit amount of the elastic fitting portion.
Since the position restricting portion 117 can restrict the position in the X direction, it is possible to prevent the elastic deformation member of the recess 112 from deforming beyond the elastic deformation limit amount. Since the position restricting portion 117 can restrict the position in the Y direction, it is possible to prevent the elastic deformation member of the recess 112 from deforming beyond the elastic deformation limit amount.

Even in this modified example, even if the positions of the convex portion and the concave portion are slightly misaligned, the collet can be attached to the collet holder without excessive burden for the alignment work because the alignment is automatically performed by the sliding and elastic deformation of the tapered surface of the fitting mechanism. Furthermore, since the fitting mechanism of this modified example is not a part of the airtight seal surface of the suction path, even if the tapered surface of the convex portion slides against the edge or inner surface of the concave portion during fitting and is worn out, no leak will occur in the suction path. Furthermore, even if an unexpected external force acts on the collet while the collet is attached to the collet holder, the elastic deformation member that performs the alignment can be prevented from deforming beyond the elastic deformation limit. In addition, although the projection shape is cylindrical in FIG. 21, it is not necessarily required to be cylindrical, and it may be formed into any three-dimensional shape such as a rectangular parallelepiped. Also, although a cutout shape that matches the projection shape is provided in the collet holder 22 in FIG. 21, it is not necessarily required to form such a shape.

[Embodiment 2]
A second embodiment of the present invention will be described with reference to the drawings. However, detailed descriptions of parts common to the first embodiment will be omitted as much as possible.
1, the die bonder according to the second embodiment also includes elements such as a wafer support device, a collet, a collet holder, a bonding arm, a transport unit, a camera for the supply unit, a camera for the island unit, a control unit, etc. In the die bonder according to the second embodiment, the suction mechanism for picking up the semiconductor chip may be the same as or different from that of the first embodiment, but the lead frame holding mechanism for holding the lead frame has a different configuration from that of the first embodiment.

In the lead frame holding mechanism in embodiment 1 (see FIG. 2), rails 40b are provided on the lead frame holder 40, making it possible to regulate the position of the lead frame 41. However, because it is necessary to ensure a certain degree of clearance in consideration of the dimensional tolerance of the lead frame, the position of the lead frame 41 may fluctuate slightly.

In the second embodiment, therefore, the lead frame holder is provided with suction holes to attract the lead frame so that the lead frame can be held easily and without rattling. The lead frame holder is also held by the holder holder using magnetic force, and the suction path of the lead frame holder and the suction path of the holder holder are connected by a flexible member that can be airtightly connected. When replacing the lead frame holder depending on the type of lead frame being handled, the lead frame holder can be attached to the holder holder in a state where leakage is suppressed without excessive burden on the installation adjustment work.

In other words, the die bonder according to the second embodiment is a semiconductor manufacturing device in which a lead frame holder (tool) that can adsorb a lead frame (workpiece) is detachably held by a holder holder (tool holder) using magnetic force, and the suction path is provided with a flexible member that can be airtightly connected.

In the die bonder according to the second embodiment, a dedicated lead frame holder is prepared for each type of lead frame. When bonding is performed, a lead frame holder corresponding to the type of lead frame is selected and attached to the holder holder, forming a lead frame holding mechanism.

Figure 14 is a schematic plan view for explaining that the holder holder of the die bonder according to the second embodiment can hold a plurality of lead frame holders. Figure 15 is a schematic cross-sectional view of the lead frame holding mechanism of the second embodiment, which is a YZ cross-sectional view taken along a line passing through the protrusions 71a and 71c shown in Figure 14.

Figure 14 shows a schematic diagram of a large-sized lead frame 51 and a small-sized lead frame 61 that are handled by the die bonder of this embodiment. A dedicated lead frame holder 50 is prepared in advance for the large-sized lead frame 51, and a dedicated lead frame holder 60 is prepared in advance for the small-sized lead frame 61. When performing die bonding work, a lead frame holder corresponding to the lead frame is selected and attached to the holder holder 70. For ease of explanation, only two types of lead frame holders, the lead frame holder 50 and the lead frame holder 60, are shown in Figure 14, but the lead frame holders that can be attached to the die bonder are not limited to these two types.

Figure 15 shows the lead frame holder 50 attached to the holder holder 70, with the lead frame 51 attached to the lead frame holder 50. In addition, a number of islands 52 for bonding semiconductor elements are arranged on the lead frame 51.

The lead frame holder 50 has a suction path 53 for attracting the lead frame 51, and recesses 72a, 72b, and 72c, which are formed in a base made of a ferromagnetic material. The suction path 53 penetrates the base in the Z direction, and the upper end of the suction path 53 serves as a suction hole for attracting the lead frame 51.

The holder 70 includes a protrusion 71a, a protrusion 71b, a protrusion 71c, a magnet 74, and a position control part 77, which are integrated together. The holder 70 includes a suction path 73 that passes through the inside, and the suction path 73 is connected to a negative pressure application mechanism (such as a vacuum pump or a control valve) (not shown).

The recesses 72a, 72b, and 72c of the lead frame holder 50 and the protrusions 71a, 71b, and 71c of the holder holder 70 function as a positioning mechanism that can fit together. That is, as shown in FIG. 15, when the holder holder 70 holds the lead frame holder 50, they fit together and restrain each other, so that the holder holder 70 can hold the lead frame holder 50 without rattling. In this embodiment, three pairs of protrusions, recesses, and position regulation parts are provided, but an appropriate number of pairs can be provided in appropriate positions taking into consideration positioning accuracy, mechanical strength, spatial margin, manufacturing cost, etc.

The convex portions 71a to 71c, the concave portions 72a to 72c, and the position restricting portions 77a to 77c of this embodiment form a fitting mechanism similar to the convex portions 102a to 102c, the concave portions 112a to 112c, and the position restricting portions 117a to 117c of embodiment 1.

That is, the tops of the convex portions 71a to 71c connect to the tapered surfaces, and the maximum outer diameter of the body of the convex portions 71a to 71c in the non-engaged state is set to be larger than the inner diameter of the concave portions 72a to 72c. In addition, the position restricting portion 77 is also provided with a tapered surface 78 that connects to the flat surface at the tip, so that any misalignment between the position restricting portion 77 and the lead frame holder 50 can be absorbed.

Therefore, even if the positions of the convex and concave portions are slightly misaligned when the lead frame holder 50 is attached to the holder holder 70, the fitting mechanism automatically aligns them, allowing the lead frame holder 50 to be attached without placing an excessive burden on the fitting process. Furthermore, the position regulating portion 77 keeps the deformation of the convex portion 71 within the range of elastic deformation, preventing the fitting function from being impaired even if an unexpected external force acts on the convex portion 71.

When the lead frame holder 50 is attached to the holder holder 70, the base of the lead frame holder 50 is subjected to an attractive force by the magnetic force of the magnet 74, and the lead frame holder 50 is detachably held by the holder holder 70. Note that in this embodiment, the mechanism for detachably holding the lead frame holder 50 using magnetic force is not limited to this configuration, and for example, a magnet may be provided on the lead frame holder side, and the holder holder may be formed of a ferromagnetic material. Alternatively, a first magnet may be provided on one of the lead frame holder and the holder holder, and a second magnet may be provided on the other, with the first magnet and the second magnet positioned so that their opposite magnetic poles face each other.

The strength of the holding force with which the holder 70 holds the lead frame holder 50 is set so that the lead frame holder 50 can be stably held during bonding work, but no excessive external force needs to be applied when removing the lead frame holder 50. A magnet with a magnetic force according to the setting is used. This is to facilitate the attachment and detachment work when replacing the lead frame holder 50, and to prevent unexpected damage caused by excessive external force. A permanent magnet is used for the magnet 74, but an electromagnet may also be used if implementation is possible.

As shown in FIG. 15, in the lead frame holding mechanism of this embodiment, a flexible member 75 made of an elastic material is disposed between the lead frame holder 50 and the holder holder 70. In the example of FIG. 15, the flexible member 75 is fixed to the recess of the holder holder 70, but it may be fixed to the lead frame holder 50 side, or it may be sandwiched between the holder holder 70 and the lead frame holder 50 without being fixed to either.

The flexible member 75 is an annular member, and when viewed in a plan view from the Z direction, has a circular ring shape that surrounds the suction path 53 of the lead frame holder 50 and the suction path 73 of the holder holder 70. Note that the shape of the ring when viewed in a plan view is not limited to a circular ring, and may be a ring of another shape, but a circular ring is preferable from the standpoint of stability and reproducibility of elastic deformation.

When the lead frame holder 50 is held by the holder holder 70 with the holding force described above, the flexible member 75 elastically deforms so as to come into close contact with both the lower end surface of the lead frame holder 50 and the upper end surface of the holder holder 70. In other words, the flexible member 75 is formed of an elastic material that is elastically deformed by the holding force described above and can hermetically connect the suction path 53 and the suction path 73 (connecting the two and sealing them from the outside air). The flexible member 75 can include, for example, any of the following materials: rubber, porous resin, or magnetic fluid.

As shown in FIG. 15, when the lead frame (workpiece) is held using the lead frame holder 50, the suction path is vacuumed and the lead frame (workpiece) is adsorbed through the suction hole. In this embodiment, the flexible member 75, which can be elastically deformed, is interposed, so that the airtightness of the suction path is excellent. In this embodiment, the flexible member 75 is elastically deformed by the holding force of the holding mechanism using magnetic force, and is in close contact with both the lead frame holder and the holder holder to connect the suction path, so there is no need to repeatedly adjust the attachment of the lead frame holder. Moreover, in this embodiment, the relative positions of the lead frame holder and the holder holder are fixed by the above-mentioned positioning mechanism, so that the flexible member 75 does not unexpectedly twist after the lead frame holder is attached, and no leaks occur. By using a flexible member as in this embodiment, the airtightness during vacuuming can be made particularly excellent.

As described above, according to this embodiment, even if the positions of the convex and concave parts of the fitting mechanism are slightly misaligned, they are automatically aligned, so the lead frame holder can be attached to the holder holder without excessive strain on the alignment work. Furthermore, since the fitting mechanism of this embodiment is not part of the airtight seal surface of the suction path, even if the tapered surface of the convex part slides against the edge or inner surface of the concave part during fitting and is worn down, no leaks will occur in the suction path. Furthermore, even if an unexpected external force acts, the elastic deformation function, which is important for positioning, is not impaired.

[Other embodiments]
The present invention is not limited to the above-described embodiments and modifications, and many modifications and combinations are possible within the technical concept of the present invention.
For example, a die bonder may be provided with both a semiconductor element suction mechanism as in the first embodiment and a lead frame suction mechanism as in the second embodiment.

In addition, in the first embodiment, a convex portion is provided on the collet and a concave portion is provided on the collet holder as a positioning mechanism that determines the relative position of the collet and the collet holder, but the opposite may be true, with a concave portion on the collet and a convex portion on the collet holder. Alternatively, convex portions and concave portions may be provided on both the collet and the collet holder. A position regulating portion may be provided on either the collet or the collet holder, or both, to match the arrangement of the convex portions and concave portions.

In addition, in the second embodiment, a convex portion is provided on the holder holder and a concave portion is provided on the lead frame holder as a positioning mechanism that determines the relative position of the lead frame holder and the holder holder, but the opposite may be true, with a concave portion on the holder holder and a convex portion on the lead frame holder. Alternatively, convex portions and concave portions may be provided on both the lead frame holder and the holder holder. A position regulating portion may be provided on either the collet or the collet holder, or on both, to match the arrangement of the convex portions and concave portions.

In the embodiment, a tapered surface is provided on the protruding portion made of an elastic material, but a tapered surface may also be provided on the recessed portion. In other words, if a sliding surface can be configured that acts in a direction that eliminates misalignment when the protruding portion is inserted into the recessed portion, a tapered surface can be provided only on the protruding portion, only on the recessed portion, or on both.

Furthermore, the workpiece that the collet attracts is not limited to a semiconductor element (semiconductor chip), but may be, for example, an electronic component such as a resistor element or a capacitor.
The die bonder according to the present invention can be widely used in a manufacturing method of a semiconductor for die-bonding a semiconductor chip, as well as a manufacturing method of an article for mounting an electronic component or the like on a circuit board or the like.

11...Semiconductor chip/14...Wafer support device/21...Collet/22...Collet holder/24...Transport section/40...Lead frame holder/41...Lead frame/50...Lead frame holder/51...Lead frame/53...Suction path/60...Lead frame holder/61...Lead frame/70...Holder holder/71a, 71b, 71c...Convex portion/72a, 72b, 72c...Concave portion/73...Suction path/74...Magnet/75...・Flexible member/77...position control unit/100...die bonder/102a, 102b, 102c...protruding portion/103...collet base/105a, 105b, 105c...slit/105k...groove/107...tapered surface/108...suction path/109...suction hole/112a, 112b, 112c...recess/113...magnet/115...flexible member/116...suction path/117a, 117b, 117c...position control unit/118...tapered surface/200...control unit

Claims (17)

A tool that can pick up a workpiece by suction,
a tool holder having a suction passage;
a positioning portion that determines a relative position of the tool with respect to the tool holder when the tool holder holds the tool,
The positioning portion is
At least one protrusion, which is disposed on one of the tool and the tool holder and is made of an elastic material and has a tapered surface;
at least one recessed portion that is disposed on one of the tool and the tool holder on which the protrusion is not provided and that is capable of engaging with the protrusion ;
a position restriction portion that is disposed in one of the tool and the tool holder and that suppresses deformation of the protrusion ,
The adsorption mechanism is characterized by the above. The convex portion has a slit formed therein, the slit extending from the top to a predetermined depth,
When viewed in a plan view, the length of the recess along the extension direction of the slit is greater than the length of the recess along a direction perpendicular thereto.
The suction mechanism according to claim 1 . In a plan view, in a direction perpendicular to the direction in which the slit extends,
When the protrusion is not engaged with the recess, the length of the protrusion is greater than the length of the recess,
When the protrusion is engaged with the recess, the length of the protrusion is equal to the length of the recess.
3. The suction mechanism according to claim 2. The positioning portion has a plurality of the protrusions and the recesses, and the protrusions include a plurality of protrusions having the same extending direction of the slits in a plan view.
4. The suction mechanism according to claim 2 or 3. The recess includes a restraining portion that restrains the protrusion when the recess is engaged with the protrusion.
5. The suction mechanism according to claim 1 , wherein the suction mechanism is a suction mechanism. The positioning portion is disposed in at least three locations.
6. The suction mechanism according to claim 1 , wherein the suction mechanism is a suction mechanism. a holding means for removably holding the tool in the tool holder by magnetic force;
a flexible member capable of airtightly connecting the tool and the suction path when the tool holder holds the tool by magnetic force.
7. The suction mechanism according to claim 1 , wherein the suction mechanism is a suction mechanism. The flexible member has a base and an inclined surface having one end connected to the base.
8. The suction mechanism according to claim 7 . The inclined surface is annular in plan view, and is inclined in a direction such that the ring diameter on the side connected to the base is small and the ring diameter on the side not connected to the base is large.
9. The suction mechanism according to claim 8 . The flexible member includes any one of rubber, porous resin, and magnetic fluid.
10. The suction mechanism according to claim 7 , wherein the suction mechanism is a suction device. The holding means includes a magnet fixed to one of the tool and the tool holder, and a ferromagnetic body fixed to the other.
11. A suction mechanism according to any one of claims 7 to 10 . the holding means includes a first magnet fixed to one of the tool and the tool holder, and a second magnet fixed to the other, the first magnet and the second magnet being arranged such that different magnetic poles face each other.
11. A suction mechanism according to any one of claims 7 to 10 . The workpiece is an electronic component and the tool is a collet.
13. A suction mechanism according to any one of the preceding claims. An adsorption mechanism according to claim 13 ;
a mounting member holding portion for holding a mounting member,
The collet sucks the electronic component and places it at a predetermined position on the workpiece.
An apparatus for manufacturing an article, comprising: An adsorption mechanism according to claim 13 ;
a lead frame holder for holding a lead frame,
the collet sucks the first semiconductor chip, places it on the lead frame or a second semiconductor chip mounted on the lead frame, and bonds them;
A semiconductor manufacturing apparatus comprising: A tool that can pick up a workpiece by suction,
a tool holder having a suction passage;
a positioning portion that determines a relative position of the tool with respect to the tool holder when the tool holder holds the tool,
The positioning portion is
At least one protrusion, which is disposed on one of the tool and the tool holder and is made of an elastic material and has a tapered surface;
at least one recessed portion that is disposed on one of the tool and the tool holder on which the protrusion is not provided and that is capable of engaging with the protrusion;
the workpiece is a lead frame, and the tool is a lead frame holder;
The adsorption mechanism is characterized by the above. An adsorption mechanism according to claim 16 ;
a transport unit that transports the first semiconductor chip,
the conveying unit conveys the first semiconductor chip, places it on the lead frame held by the lead frame holder or a second semiconductor chip mounted on the lead frame, and bonds the first semiconductor chip to the lead frame.
A semiconductor manufacturing apparatus comprising:

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