JP7681463B2 - LED lamp - Google Patents

Description

This application relates to lighting fixtures, and in particular to LED lamps.

A ceiling light is a lamp that is attached or embedded in the ceiling of a roof, and is often used as a lighting fixture in various places such as homes, offices, and entertainment facilities. A conventional ceiling light is usually composed of a base, a light source module, a circuit module, and a lamp cover, and the light emitting element in the light source module is generally an energy-saving lamp tube. Energy-saving lamp tubes not only cause mercury pollution during production and after use and disposal, but also consume more power than LEDs. In contrast, LEDs do not contain mercury, are non-toxic, do not cause electromagnetic pollution, do not emit harmful radiation, are energy-saving and environmentally friendly, and have a long service life, so LEDs are used as light emitting elements in ceiling lights instead of energy-saving lamp tubes. However, conventional ceiling lights still have problems in terms of light emission, heat dissipation, installation, and packaging during use. The details are as follows.

1. Flicker occurs during lighting, the irradiation range is narrow, the light emission is uneven, the brightness in the center part of the lamp is low, the brightness between the center part and the peripheral part of the lamp is uneven, the light from the light-emitting surface is uneven, glare occurs, the brightness in the circumferential direction of the lamp is uneven, the illuminance on the mounting surface of the light-emitting element is uneven, the brightness is uneven, the color rendering is low, the luminous efficiency and the light designability are low, the brightness is uneven, the rendering effect is low, the color mixing is uneven, the illuminance in the circumferential direction of the ceiling is uneven, the circuit element with a high altitude blocks the light, the color temperature and color deviation are large, the light orientation distribution is narrow, the light transmission efficiency is low, the luminous efficiency of the light source is low, the side area of the lamp cover is dark, the brightness of the light output surface of the lamp cover is uneven, bright lines occur, the light extraction efficiency of the light-emitting element is low, the light comfort is low, and the appearance is poor when the light is turned off. Meanwhile, conventional lamps have the following problems. In certain usage scenarios, the light emitted from the lamp has a three-dimensional effect, or does not meet the requirements of generating a corresponding light space according to the life scenario, and users have difficulty reading colored paper under the lamp, or the elderly have poor color discrimination ability for letters and objects to be observed, so the elderly are less comfortable when using light, etc.

The following two methods are used to improve the optical effect of ceiling lights. The first method is to add a backlight lens to the LED to reduce the dark areas in the middle and edge parts of the lamp. However, the backlight lens and the lens bonding process are used, which significantly increases the manufacturing cost and reduces the competitiveness of the product. The second method is to provide optical components such as a light guide plate, lens, and reflection unit between the light emitting element and the lamp cover. However, the use of the above optical components can cause problems such as changes in the amount of light incident on the light guide plate, complex structure of the optical components, uneven brightness in the light guide plate, and dark areas in the light guide plate.

2. Heat generated by the light-emitting elements and circuit elements affects the service life of the ceiling light.

3. The light source module is often attached to the lamp body with screws or glued to the lamp body with adhesive, making it difficult to remove or replace after installation. In addition, when the ceiling light is used for a long period of time, the light source module tends to deteriorate and burn out. For example, if the light source module is broken and needs to be replaced, it is necessary to use a tool to remove the broken light source module and use the tool to install a new light source module. The replacement of the LED light source module must be performed by a professional technician, which makes the use process inconvenient.

4. Although ceiling lights usually have a flat structure, occupy less space in the vertical direction, and have a wide lighting range, the overall thickness of the ceiling light is still large, which increases the volume of the product and further increases the packaging and storage costs.

In addition, there are problems with the use of the lamp, such as low safety, low manufacturing efficiency, high usage costs, the ease with which insects and other pests can get inside the lamp, affecting its appearance, inability to continue lighting in the event of a power failure, limited luminous flux of the entire lamp due to the small mounting area of the circuit board, low sensitivity or narrow range of remote control when using intelligent control, and noise during installation.

In light of the above-mentioned shortcomings and deficiencies of the conventional technology, it is necessary to improve conventional LED lamps to compensate for these shortcomings and deficiencies.

This application provides an LED lamp that addresses the shortcomings of the prior art described above.

In order to solve the above technical problems, the present application provides the following invention.

An LED lamp including a lamp cover and a base connected to the lamp cover, in which a photoelectric module including a light source module and a power supply module is provided within a first storage space formed by the lamp cover and the base, and the base is provided with a mounting portion, and the photoelectric module is fixed to the base via the mounting portion.

Preferably, the photovoltaic module is removably fixed to the base.

Preferably, the photovoltaic module includes a circuit board having a first surface and a second surface arranged opposite to each other, the first surface being one surface facing the lamp cover, the electronic elements of the light source module being arranged on the first surface, and all of the electronic elements of the power supply module being arranged on the second surface.

Preferably, the photovoltaic module further includes an insulating unit having a first insulating portion covering the electronic element on the first surface and a second insulating portion covering the electronic element on the second surface.

Preferably, the circuit board is provided with several LED chip groups, each of which includes several LED chips and is located on the same circumference, and when the number of circumferences is n (n is 1 or more), the elevation and depression angles of the LED chips may be 90*(1/n)°.

Preferably, the second surface of the circuit board includes a third region for arranging the power supply module and a fourth region in which the power supply module is not arranged, the first surface includes a first region facing the third region and a second region facing the fourth region, and the number of LED chips located in the first region is greater than the number of LED chips located in the second region.

Preferably, the second surface of the circuit board includes a third region and a fourth region, the electronic elements of the power supply module include a heat generating element and a non-heat resistant element (e.g., an electrolytic capacitor), the heat generating element and the non-heat resistant element are located in the third region and the fourth region, respectively, the first surface includes a first region facing the third region and a second region facing the fourth region, and the number of LED chips located in the first region is less than the number of LED chips located in the second region.

Preferably, a light reflecting component is provided between the LED light source module and the power supply module, the LED light source module surrounds the light reflecting component, and the light source module includes a circuit board and at least one group of LED chips located on the circuit board, and each group of LED chips includes a plurality of LED chips whose light emitting surfaces face the central axis of the lamp.

Preferably, the LED lamp is arranged in a spatial Cartesian coordinate system (x, y, z) in which the z-axis is parallel to the central axis of the LED lamp, a hole is formed in the central part of the base, a support part and an edge part are formed around the hole, there is a gap between the support part and the edge part that extends in the negative direction of the z-axis and forms a groove part, and the support part and the edge part are in the same position in the positive direction of the z-axis.

Preferably, there is a gap between the photovoltaic module and the support.

Through the above structure and design, the present application achieves one or any combination of the following advantageous effects:

(1) The photovoltaic module is rotated and fixed by the mounting part, which makes installation and maintenance easier and improves work efficiency. (2) By adjusting the arrangement of the LED chips in the light source module, the light emission effect of the LED lamp can be made more uniform and the heat dissipation effect can be improved. (3) The electronic elements on the second surface of the circuit board are located radially inward of the circuit board compared to any electronic elements in the light source module, so that the heat generated during the operation of the electronic elements of the light source module can be prevented from affecting the electronic elements on the second surface. By limiting the distribution area of the electronic elements on the second surface, the size of the second insulating part can be controlled and costs can be reduced. (4) The LED chips and the power supply module are located on the first surface and the second surface of the circuit board, respectively, and the number of LED chips in the area corresponding to the power supply module on the first surface is smaller than the number of LED chips in the area not corresponding to the power supply module on the first surface, which significantly reduces the dark area in the center of the LED lamp and improves the light emitting effect of the LED lamp, while reducing the impact of heat from the power supply module on the light source module. (5) The second power module, which has a high height, is located in the groove of the base, so there is no need to provide a dedicated storage space for the power module, which effectively reduces the height of the ceiling light, and the photovoltaic module can be separated from the lamp cover, so the amount of light reaching the edge of the lamp cover from the light source module can be increased. (6) The first insulating part has a certain arc degree, which improves the force resistance and ensures that the photovoltaic module is not damaged during transportation. (7) The second insulating part contacts the side wall of the groove of the base, which increases the contact area and improves the thermal conductivity. (8) The light emitting surface of the LED chip faces the central axis of the lamp, which effectively eliminates the dark area in the middle and improves the light emitting effect of the lamp. (9) The refractive index of the package layer of the LED lamp bead with an appropriate refractive index is set to n1, and the material of the lamp cover with an appropriate refractive index is selected, so that the luminous flux of the LED lamp can be effectively increased. (10) By providing a refractive index matching layer on the surface of the LED chip or the inner surface of the lamp cover and designing its thickness, excellent optical effects can be obtained.

1 is a schematic diagram showing the structure of an embodiment of an LED lamp according to the present application. FIG. 2 is a schematic diagram of one embodiment of the present invention when a lamp cover is removed from FIG. 1 . FIG. 1 is a schematic perspective view of a photoelectric module of an LED lamp according to an embodiment with an insulating unit removed; FIG. 2 is a schematic perspective view of a photoelectric module of an LED lamp according to an embodiment with an insulating unit removed; FIG. 1 is a schematic perspective view of a photoelectric module of an LED lamp according to another embodiment with an insulating unit removed; FIG. 2 is a schematic perspective view of a photoelectric module of an LED lamp according to another embodiment with an insulating unit removed; FIG. 1 is a schematic perspective view of a photovoltaic module of an LED lamp in one embodiment. FIG. 2 is a schematic perspective view of a photovoltaic module of an LED lamp in an embodiment. 2 is a schematic perspective view of a first insulating part of a photovoltaic module of an LED lamp according to an embodiment; FIG. 1 is a schematic cross-sectional view of a photovoltaic module of an LED lamp according to an embodiment; FIG. 11 is an enlarged view of a portion C in FIG. 2 is a schematic perspective view of a second insulating part of the photovoltaic module of an LED lamp according to an embodiment; FIG. FIG. 2 is a schematic diagram of an LED lamp in one embodiment with a lamp cover removed. 1 is a structural schematic diagram of an LED lamp photovoltaic module according to an embodiment; 2 is a structural schematic diagram of a photovoltaic module of an LED lamp according to an embodiment; 15 is a structural schematic diagram of the AA cross section in FIG. 14. 15 is a structural schematic diagram of the cross section BB in FIG. 14. FIG. 2 is a structural schematic diagram of the photovoltaic module of the LED lamp in one embodiment when the insulating unit is removed; FIG. 1 is a structural schematic diagram of an embodiment of a photovoltaic module of an LED lamp with an insulating unit removed; FIG. 2 is a structural schematic diagram 2 of the photoelectric module of the LED lamp according to the embodiment when the insulating unit is removed; FIG. 1 is a structural schematic diagram of a photoelectric module of an LED lamp according to another embodiment when an insulating unit is removed. FIG. 2 is a structural schematic diagram 2 of a photoelectric module of an LED lamp according to another embodiment when an insulating unit is removed; FIG. 2 is a structural schematic diagram of a first insulating part of an LED lamp according to an embodiment. FIG. 4 is a structural schematic diagram of a second insulating part of the LED lamp according to an embodiment. FIG. 2 is a structural schematic diagram of an LED lamp photovoltaic module in one embodiment. 2 is a schematic diagram of an embodiment of an assembly method for a photovoltaic module in the present application; 2 is a schematic diagram of an embodiment of an assembly method for a photovoltaic module in the present application; 2 is a schematic diagram of an embodiment of an assembly method for a photovoltaic module in the present application; 2 is a schematic diagram of an embodiment of an assembly method for a photovoltaic module in the present application; FIG. 27 is a structural schematic diagram of a photovoltaic module assembled by the assembly method shown in FIG. 26 . 28 is a structural schematic diagram of the AA cross section in FIG. 27. FIG. 2 is a schematic perspective view of an LED lamp according to an embodiment with a lamp cover removed; FIG. 2 is a schematic perspective view of a lamp cover according to an embodiment. FIG. 30 is an enlarged view of a portion A in FIG. 29 . FIG. 30 is an enlarged view of a portion B in FIG. 29 . FIG. FIG. 1 is a schematic perspective view of a mounting portion according to an embodiment of the present invention. FIG. 2 is a schematic perspective view of a mounting portion according to an embodiment of the present invention; FIG. 2 is a schematic perspective view of a photovoltaic module of an LED lamp according to an embodiment; FIG. 2 is a perspective view of an LED lamp in one embodiment with a lamp cover removed. 1 is a schematic cross-sectional view of an LED lamp according to an embodiment. FIG. 39 is an enlarged view of a portion B in FIG. 38. FIG. 2 is a schematic perspective view of an LED lamp according to an embodiment with a lamp cover removed; FIG. 2 is a schematic perspective view of an LED lamp according to an embodiment with a lamp cover removed; FIG. 2 is a schematic perspective view of a mounting portion according to an embodiment. FIG. 2 is a schematic perspective view of an LED lamp according to an embodiment with a lamp cover removed; FIG. 2 is a schematic perspective view of an LED lamp according to an embodiment with a lamp cover removed; FIG. 2 is a schematic perspective view of a base according to an embodiment. FIG. 2 is a schematic perspective view of an LED lamp according to an embodiment. FIG. 1 is a schematic perspective view of a photovoltaic module of an LED lamp in one embodiment. FIG. 2 is a schematic perspective view of a photovoltaic module of an LED lamp in an embodiment. FIG. 2 is a schematic perspective view of an LED lamp according to an embodiment. FIG. 50 is a schematic perspective view of the photovoltaic module in FIG. 49 . FIG. 50B is an enlarged schematic diagram of part A in FIG. 50A. FIG. 50B is a schematic diagram of a first insulating part in FIG. 50A. FIG. 51 is a schematic perspective view of the circuit board in FIG. 50 . 50 is a schematic cross-sectional view of the LED lamp shown in FIG. 49 with the lamp cover removed. This is a schematic diagram of the AA cross section in Figure 52A. FIG. 52C is an enlarged schematic diagram of part B in FIG. 52B. 1 is a structural schematic diagram of a photovoltaic module according to an embodiment; 2 is a structural schematic diagram of a photovoltaic module according to an embodiment; This is a schematic diagram of the AA cross section in Figure 53A. FIG. 53D is an enlarged schematic diagram of part B in FIG. 53C. FIG. 53D is an enlarged schematic diagram of part C in FIG. 53C. FIG. 53B is a structural schematic diagram of the first insulating part in FIG. 53A. This is a schematic diagram of the cross section taken along line BB in Figure 53F. FIG. 53C is an enlarged schematic diagram of part D in FIG. 53G. 1 is a structural schematic diagram of a photovoltaic module according to an embodiment; 2 is a structural schematic diagram of a photovoltaic module according to an embodiment; This is a schematic diagram of the E-E cross section in Figure 54B. FIG. 54D is an enlarged view of part F in FIG. 54C. 3 is a structural schematic diagram of a photovoltaic module according to an embodiment; FIG. 54E is an enlarged view of part B. This is an enlarged view of the GG cross section in Figure 54E. An enlarged view of part H in FIG. 54G. 4 is a structural schematic diagram of a photovoltaic module according to an embodiment; This is an enlarged view of the II section in Figure 54I. FIG. 54J is an enlarged view of part J in FIG. FIG. 54B is a schematic diagram of the circuit board in FIG. 54A. FIG. 54B is a schematic diagram of a first insulating part in FIG. 54A. An enlarged view of part K in Figure 54M. 1 is a schematic perspective view of an LED lamp according to an embodiment of the present invention; FIG. 2 is a schematic perspective view of an LED lamp according to an embodiment of the present invention. 2 is a diagram of an interface through which light emitted from an LED chip passes in one embodiment. 1 is a schematic diagram of the main components of a lamp according to an embodiment of the present invention;

The present application will now be described in more detail with reference to the drawings and examples.

In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the drawings. In the drawings, preferred embodiments of the present application are shown, but the present application is not limited to the following embodiments and may be realized in many different forms. On the contrary, these embodiments are provided for the purpose of making the disclosure of the present application clearer and more complete. Hereinafter, directions such as "axial direction", "upward", and "downward" are not intended to limit the present application, but are all intended to more clearly indicate the positional relationship of the structures. "Equal", "vertical", "horizontal", and "parallel" described in this application are defined to include cases where the angle is ±10% based on the standard definition. For example, while vertical usually means an angle of 90 degrees with respect to a reference line, in this application, vertical includes cases where the angle is 80 degrees or more and 100 degrees or less. The usage situation and usage state of the LED lamp described in this application is a situation in which the LED lamp is used so that the lamp cover is hung vertically downward, but other exceptions will be described separately.

As shown in Figs. 1 to 57, the LED lamp of the embodiment of the present application is, for example, a ceiling light that is attached to a ceiling. The upward direction in Figs. 1 to 57 (for example, the positive direction of the z-axis in Fig. 1) corresponds to the direction of the floor surface facing the ceiling. In other words, the LED lamp shown in Figs. 1 to 57 is suitable for a posture opposite to that during normal use.

The LED lamp designed in this application is arranged in a Cartesian coordinate system in which the spatial position is parallel to the central axis of the LED lamp, as shown in FIG. 1. As shown in FIGS. 1 to 57, the LED lamp includes a lamp cover 1 and a base 3 connected to the lamp cover 1, and a photoelectric module 2 is provided in a first storage space formed by the lamp cover 1 and the base 3. In this embodiment, the LED lamp further includes an attachment portion 31 provided on the base 3, a hook ceiling 4, and a relay hook ceiling (or adapter) 5, and the photoelectric module 2 is fixed to the base 3 by the attachment portion 31, and the hook ceiling 4 is connected to the adapter 5. A cushioning member 7 is provided between the LED lamp and the ceiling to suppress shaking of the LED lamp, and the cushioning member 7 may be, for example, a sponge.

As shown in Figures 1 to 57, the photoelectric module 2 includes a light source module 22 and a power supply module 23. In order to prevent the power from being cut off when the external power supply is cut off due to a power supply failure or the like, the power supply module 23 may include a storage battery unit that stores electrical energy. A residual light module is stored in the storage battery unit, and the residual light module automatically emits residual light to ensure safety.

As shown in Figures 1 to 57, the photovoltaic module 2 is arranged as an integral structure and removably fixed to the base 3, so that when the photovoltaic module 2 is broken, only the photovoltaic module 2 can be replaced, which is less costly than replacing the entire lamp. It is necessary to prevent the occurrence of electric shock when replacing the photovoltaic module 2, especially when replacing the photovoltaic module 2, from touching the electronic elements with the hands. Therefore, the photovoltaic module 2 in this embodiment includes electronic elements, and an insulating unit is provided on the outside of all the electronic elements, so that it is possible to prevent touching the electronic elements when replacing the photovoltaic module 2. The photovoltaic module 2 includes a circuit board 201, which may be a PCB single-sided board or a PCB double-sided board. At least some of the electronic elements are provided on the circuit board 201. Furthermore, all the electronic elements are provided on the circuit board 201. Here, the electronic elements include the electronic elements in the light source module 22 (e.g., LED lamp beads) and the electronic elements in the power supply module 23. That is, the electronic elements in the light source module 22 and the electronic elements in the power supply module 23 are integrated on the same circuit board, thereby saving costs and space.

As shown in Figures 3 to 6, the circuit board 201 includes a first surface 2011 facing the lamp cover 1 and a second surface 2012 arranged opposite thereto. In one embodiment, the electronic elements in the light source module 22 can be arranged on the first surface 2011, and all the electronic elements in the power supply module 23 can be arranged on the first surface 2011. This allows the circuit board 201 to have a wiring layer arranged only on the first surface 2011, thereby reducing wiring costs. In some embodiments, as shown in Figures 3 and 4, the electronic elements in the light source module 22 are arranged on the first surface 2011, and all the electronic elements in the power supply module 23 are arranged on the second surface 2012. This allows the electronic elements in the light source module 22 and the electronic elements in the power supply module 23 to be arranged separately. Generally, when the lamp is turned on, the electronic elements in the light source module 22 and the electronic elements in the power supply module 23 may both generate heat, so by arranging them separately, it is possible to avoid concentration of heat sources or mutual influence of heat generated during operation, and in this case, the circuit layers can be arranged simultaneously on the first surface 2011 and the second surface 2012. In this embodiment, the electronic elements in the light source module 22 are arranged on the first surface 2011, some of the electronic components and elements in the power supply module 23 are arranged on the first surface 2011, and the other part of the electronic elements in the power supply module 23 are arranged on the second surface 2012. In this embodiment, by arranging the electronic elements in the power supply module 23 on the first surface 2011 and the second surface 2012, respectively, the layout arrangement of the electronic elements in the power supply module 23 can be better performed. For example, the electronic elements in the power supply module 23 located on the first surface 2011 include elements with a relatively low height, such as an IC (control circuit) and chip components (e.g., chip resistors), so that the light emitted from the light source module 22 is not blocked by obstacles, resulting in less light loss and improved light emission efficiency. The electronic elements in the power supply module 23 located on the second surface 2012 include elements with a relatively high height, such as a transformer, a capacitor, an inductor, etc. Also, for example, the electronic elements in the power supply module 23 located on the first surface 2011 include heat-generating elements (elements that generate a lot of heat when operating, such as ICs and resistors), and the electronic elements in the power supply module 23 located on the second surface 2012 include non-heat-resistant elements (e.g., electrolytic capacitors). By providing the non-heat-resistant elements and the above-mentioned heat-generating elements on the second surface 2012 and the first surface 2011, respectively, the effect of the heat generated by the heat-generating elements when operating on the non-heat-resistant elements can be reduced, and the reliability and service life of the entire power supply module 23 can be improved.

As shown in Figures 7 to 12, the photovoltaic module 2 further includes an insulating unit including a first insulating part 202 and/or a second insulating part 203, where the first insulating part 202 is arranged to allow light generated during operation of the light source module 22 to pass through, and the first insulating part 202 covers all the electronic elements on the first surface 2011, thereby preventing electric shock caused by accidentally touching the electronic elements on the first surface 2011. The second insulating part 203 covers all the electronic elements on the second surface 2012. The material of the second insulating part 203 can be selected from PC or acrylic, which are characterized by being lightweight and low cost. In this embodiment, the electronic elements on the second surface 2012 are located radially inward of the circuit board 201 relative to any of the electronic elements in the light source module 22, that is, the projections of the electronic elements on the second surface 2012 and the electronic elements of the light source module 22 do not overlap in the thickness direction of the circuit board 201. Furthermore, the influence of heat generated during operation of the electronic elements in the light source module 22 on the electronic elements on the second surface 2012 can be prevented, while the size of the second insulating section 203 can be controlled and costs can be reduced by limiting the distribution area of the electronic elements on the second surface 2012.

In this embodiment, the first insulating portion 202 includes a cavity 2021 that accommodates the circuit board 201. The first insulating portion 202 has a side wall 2022 on which a first position restricting portion 2023 is provided, and one or more second position restricting portions 2024 are provided in the cavity 2021 of the first insulating portion 202. When the circuit board 201 is assembled into the first insulating portion 202, both sides in the thickness direction of the circuit board 201 are restricted in position by the first position restricting portion 2023 and the second position restricting portion 2024, respectively. In other words, the circuit board 201 is fixed by being sandwiched between the first position restricting portion 2023 and the second position restricting portion 2024. Then, the circuit board 201 is less likely to shake after installation is completed. The first position restricting portion 2023 may be an engagement member, and the second position restricting portion 2024 may be a columnar body.

In this embodiment, the second insulating portion 203 is fixed to the circuit board 201 by being fastened to the first fastening unit 2031 provided on the second insulating portion 203 and the second fastening unit 2013 provided corresponding to the circuit board 201. The first fastening unit 2031 may be a fastening portion, and the second fastening unit 2013 may be a fastening hole or a fastening portion. The second fastening unit 2013 may be provided on the first insulating portion 202 to fasten the second insulating portion 203 and the first insulating portion 202.

In one embodiment, the circuit board 201 and the first insulating part 202 can be positioned relative to each other via a concave-convex structure, which limits the movement of the first insulating part 202 relative to the circuit board 201 in the horizontal direction (direction parallel to the xy plane), i.e., no displacement occurs between the circuit board 201 and the first insulating part 202. Therefore, no displacement occurs between the light source module 22 and the first insulating part 202, and therefore it is possible to suppress a decrease in light extraction efficiency due to displacement between the light source module and the first insulating part.

In one embodiment, the basic structure of the LED lamp is not described here repeatedly, since the LED lamp includes a lamp cover 1, a photoelectric module 2 and a base 3, similar to the above embodiment. This embodiment differs from the above embodiment in that it provides another form of fixing the insulating unit and the circuit board. As shown in Figures 13 to 17, the power supply module 23 includes a first power supply module 231 (e.g., a part of the electronic elements in the power supply module 23 provided on the above first surface 2011) and a second power supply module 232 (e.g., a part of the electronic elements in the power supply module 23 provided on the above second surface 2012), and the first power supply module 231 may be a surface mounting technology (SMT) device, and the second power supply module 232 may be a dual inline-pin package (DIP) device including, for example, an inductor, a capacitor, etc. The first insulating part 202 is provided with a first engaging member 25, and the first insulating part 202 is engaged with the light source module 22 via the first engaging member 25. The second insulating part 203 is provided with a second engaging member 26, and the second insulating part 203 is engaged with the light source module 22 via the second engaging member 26 to insulate and mechanically protect the power source module 23. There is a certain gap between the power source module 23 and the second insulating part 203, so that an impact force buffering area can be provided for the second insulating part 203 so that the power source module is not damaged when the second insulating part 203 is subjected to an external force impact.

The first insulating part 202 and/or the second insulating part 203 may be provided with reinforcing bars 27. By providing reinforcing bars, the impact resistance strength of the first insulating part and/or the second insulating part can be increased, and damage to the first insulating part and/or the second insulating part can be prevented. The first insulating part and the second insulating part having different structures described above can be combined with each other.

As shown in FIG. 18, the circuit board 201 is provided with several LED chip groups 221, and each LED chip group includes several LED chips 2201. If an arbitrary point on the central axis of the circuit board 201 is taken as the center point, the distance from the LED chip 2201 to the center point in each LED chip group is equal or approximately equal. At least one center point located on the same plane as the LED chip group exists on the central axis of the circuit board, and each LED chip group is located on a circumference with the center point as the center, or approximately located on a circumference with the center point as the center. Each LED chip group is located on a different circumference depending on the size of the radius of the circle. The number of LED chip groups is the same as the number of circumferences, and the number of circumferences can be n (n is 1 or more), and the elevation and depression angle of the LED chip 2201 can be (90/n)°. In this way, the LED lamp can have good light distribution and luminous efficiency. Any two LED chip groups have different emission spectra, which makes the brightness of the LED lamp uniform and improves the color rendering of the LED lamp. Of course, two or more LED chip groups may have the same emission spectrum so that the LED lamp has a good light-emitting effect.

In one embodiment, the average distance between adjacent LED chips 2201 in any radial direction of the circuit board 201 and/or the average distance between adjacent LED chips 2201 located on the same circumference is closer than the distance from the first insulating section 202 to the LED chip 2201 in the thickness direction of the photovoltaic module. This reduces unevenness in brightness in the circumferential direction of the first insulating section, achieving more uniform brightness.

In this embodiment, when the center distance between two adjacent LED chips 2201 in the same LED chip group 221 is L3, and the center distance between any LED chip 2201 in any LED chip group 221 and the closest LED chip 2201 in the adjacent LED chip group 221 is L4, the relationship L3:L4 is 1:0.8 to 2, and preferably 1:1 to 1.5. This achieves the objective of more uniform distribution of the LED chips 2201 and uniform light emission.

In this embodiment, as shown in FIG. 18, in the inner circle, two adjacent LED chips 2201 and the center of the axial direction of the LED lamp form a central angle A1, and in the central circle, two adjacent LED chips 2201 and the center of the axial direction of the LED lamp form a central angle A2, and the angle of the central angle A2 is smaller than the angle of the central angle A1. In the outer circle, two adjacent LED chips 2201 and the center of the axial direction of the LED lamp form a central angle A3, and the angle of the central angle A3 in the outer circle is smaller than the angle of the central angle A2 in the inner circle. As a result, for example, since there are more LED chips 2201 in the outer circle than in the central circle, the pitch of the adjacent LED chips 2201 in the outer circle is not too large compared to the pitch of the adjacent LED chips 2201 in the central circle, and the pitches of both may be close or equal. Therefore, the arrangement of the LED chips 2201 becomes more uniform, and the light emission becomes more uniform. In other words, several LED chip groups 221 are provided, and each LED chip group is provided on the circuit board 201 in a ring shape, and the central angle formed by two adjacent LED chips 2201 of the LED chip group 221 located relatively inside and the center of the axial direction of the LED lamp is larger than the central angle formed by two adjacent LED chips 2201 of the LED chip group 221 located relatively outside and the center of the axial direction of the LED lamp. In other words, the LED chip group 221 located relatively outside has more LED chips 2201 than the LED chip group 221 located relatively inside, and the pitch of the two adjacent LED chips 2201 of the LED chip group 221 located relatively outside is closer to the pitch of the two adjacent LED chips 2201 of the LED chip group 221 located relatively inside, so that the arrangement of the LED chips 2201 becomes more uniform, and the light emission becomes more uniform.

In this embodiment, at least two LED chip groups 221 are provided, which are sequentially arranged in the radial direction of the circuit board 201, and each LED chip group 221 includes at least one LED chip 2201, and any one of the LED chips 2201 in one LED chip group 221 in the radial direction of the circuit board 201 and any one of the LED chips 2201 in another LED chip group 221 adjacent in the radial direction of the circuit board 201 are arranged alternately in the radial direction of the circuit board 201, that is, the LED chips 2201 of different LED chip groups 221 are located in different directions in the radial direction of the LED lamp, that is, when any line extending from the axis of the LED lamp in the radial direction of the LED lamp contacts two or more LED chips 2201, it contacts different positions of these two or more LED chips 2201, that is, it does not contact the same position of two or more LED chips 2201. In this way, if there is convection on the surface of the circuit board 201, when air is convecting in the radial direction of the circuit board 201, due to the air flow path, the air comes into more sufficient contact with the LED chips 2201 in the flow path, resulting in a better heat dissipation effect. From the viewpoint of light emission effect, this arrangement of the LED chips 2201 is more advantageous for light emission uniformity.

In this embodiment, air is allowed to flow between the LED chips 2201, and thus an open area 2202 is provided between two adjacent LED chips 2201 in the same LED chip group 221 to remove heat generated during operation of the LED chips 2201. The open area 2202 between any two adjacent LED chips 2201 in one of the two LED chip groups 221 adjacent in the radial direction of the circuit board 201 and the open area 2202 between any two adjacent LED chips 2201 in the other LED chip group 221 are alternately arranged in the radial direction of the circuit board 201 and communicate with each other. In this way, if air is convected in the radial direction of the circuit board 201, the air and the LED chips 2201 will come into contact with each other more sufficiently in the air flow path, resulting in a better heat dissipation effect. If the open area 2202 between any two adjacent LED chips 2201 in one of two LED chip groups 221 adjacent in the radial direction of the circuit board 201 and the open area 2202 between any two adjacent LED chips 2201 in the other LED chip group 221 are in the same radial direction of the circuit board 201, the air will flow directly along the radial direction of the circuit board, and contact between the air and the LED chips 2201 will be reduced in the air flow path, which is detrimental to heat dissipation from the LED chips 2201.

As an example, three LED chip groups 221 are provided in sequence along the radial direction of the circuit board 201, and accordingly, any open areas 2202 of these three LED chip groups are not positioned in the same radial direction of the circuit board 201. This optimizes the convection flow path on the surface of the circuit board 201 and improves heat dissipation efficiency.

In one embodiment, each LED chip group 221 includes only LED chips 2201 of one type of light color, and the LED chips 2201 on each circumference can be shifted in the circumferential direction, and such an arrangement provides good color mixing and light uniformity. Since the LED chips 2201 have an LED die and a light conversion layer containing adhesive and fluorescent powder, by adjusting the ratio of adhesive and fluorescent powder, the LED chips on the same circumference can emit white light such as warm white light, daylight white light, etc., and the LED chips on the circumference adjacent to the LED chips emitting white light can emit primary color light such as red light, green light, blue light, etc. A first diffusion section and a second diffusion section are provided in the areas of the first insulating section 202 corresponding to the white light and the primary color light, respectively. The first diffusion section has a thickness in the optical axis direction of the LED chip 2201 that is thinner than the thickness in any direction other than the optical axis direction of the LED chip 2201. The white light emitted from the LED chip is diffused uniformly by the first diffusion section, and the second diffusion section has a uniform thickness. The primary color light emitted from the LED chip is emitted with the same light distribution without diffusion by the second diffusion section. Therefore, by adjusting the color temperature and contrast on different circumferences, the sky color can be reproduced and an appropriate lighting space can be provided according to the living situation.

In one embodiment, the LED chips 2201 may be provided with a lens. For example, the circuit board 201 is provided with three LED chip groups, and the three LED chip groups are located on a first circumference, a second circumference, and a third circumference, each of which has the same center and different radii. The LED chips 2201 on the first circumference and the second circumference cover a tubular lens, and each LED chip 2201 on the third circumference covers a single lens, thereby making the illuminance of the LED lamp uniform.

In one embodiment, in order to prevent a dark area from occurring in the center of the LED lamp, some of the LED chip groups may be made to emit light toward the center of the LED lamp (or toward the central axis of the lamp), and some of the LED chip groups may be made to emit light in a direction away from the circuit board 201.

In one embodiment, the circuit board 201 is provided with two LED chip groups 221 arranged on two circumferences having the same center and different radii, with the first LED chip group arranged on one circumference and the second LED chip group arranged on the other circumference. A first absorption area and a second absorption area are provided in the regions of the first insulating section 202 corresponding to the first LED chip group and the second LED chip group, respectively, and when the color temperature of the emitted color of the first LED chip group is lower than the color temperature of the emitted color of the second LED chip group, the wavelength absorption amount of the first absorption area is greater than the wavelength absorption amount of the second absorption area. This improves the color rendering and color temperature of the lamp and reduces color deviation (DUV).

In one embodiment, the circuit board may be provided with at least one heat dissipation hole. Air can flow between the first and second sides of the circuit board, improving the heat dissipation effect of the LED lamp.

In one embodiment, as shown in Figs. 18 to 22, the circuit board has openings 222 that are surrounded by the LED chip group 221, and after the installation of the LED lamp is completed, the openings 222 correspond to the holes 33 (see Figs. 45 to 46) in the base 3 described below. The area of the openings 222 is 2% to 50% of the area of the circuit board 201, preferably 10% to 30%, and more preferably 10% to 20%. Currently, many circuit boards are cut, so if the area of the openings is too large, there will be a lot of scraps, which will waste resources and increase costs. On the other hand, if the area of the openings is too large, when the area of the circuit board is the same and the luminous flux is the same, the distance between adjacent LED chips will be close, and the heat generated when the LED chips are operated will easily affect each other, affecting the quality of the product.

In one embodiment, the light source module 22 further includes a lens unit that covers the circuit board 201, and the lens unit can be provided in various forms. As a first example, the circuit board 201 is provided with a plurality of LED chip groups, and a night light is provided between adjacent LED chip groups. The lens unit includes a lens body that covers the LED chip groups and a communication part that connects the adjacent lens bodies and covers the night light. By making the light-emitting surface of the lens body a curved surface, the light emitted from the night light can be diffused to the center and outside of the LED lamp, thereby realizing uniform irradiation. As a second example, the lens unit has two ridges, and a night light that is used as a spotlight with relative directionality and plays a role in light distribution is provided between the two ridges. As a third example, the lens unit may be provided with a protrusion in order to diffuse and release the light emitted from the LED chip 2201 on the circuit board 201 mainly in a radial direction with the center of the circuit board 201 as the origin, and suppress the occurrence of graininess when the light source module is turned on. As a fourth example, the circuit board 201 is provided with a plurality of LED chip groups, the number of lens units is greater than two, and avoidance parts are provided between the lens units, the circuit board 201 has an aperture, the LED chip groups are provided to surround the aperture, and the avoidance parts have a recess facing the aperture to prevent optical interference of the first insulating part 202. As a fifth example, the lens unit has an accommodating recessed part aligned with the LED chip 2201 to accommodate the LED chip 2201, the lens unit has an incident surface and a projection surface opposite thereto, and the diffusion rate in the regions of the projection surface and the incident surface close to the optical axis of the LED chip 2201 is made higher than the diffusion rate in other regions, thereby smoothing the luminance distribution of the lamp cover and increasing the light transmission efficiency. As a sixth example, the lens unit has a first surface and a second surface, the second surface is a light incident surface on the side closer to the LED chip 2201, the second surface is a surface through which the light incident from the first surface of the LED chip 2201 is transmitted and emitted to the outside, the first surface includes a light control surface that distributes the light emitted from the LED chip 2201 at a large angle, and a plurality of convex portions or concave portions are provided around the light control surface, and the occurrence of bright lines in the lamp cover can be suppressed by diffusing the light by the plurality of convex portions or concave portions. As a seventh example, the lens unit includes a plurality of lenses, each of which covers the LED chip 2201, i.e., the number of lenses is equal to the number of the LED chips 2201, and the first insulating portion 202 has a light-transmitting lens cover that emits the light of the LED chip 2201 to the center of the lamp, and the uniformity can be improved by setting the light distribution peak angle of the lens. As an eighth example, the lens unit has a recess for receiving light emitted from the LED chip 2201 and an LED storage section, and by storing the LED chip, contact between the LED chip and the recess is suppressed, and the LED storage section and the recess are smoothly connected by a convex curved surface protruding from the LED chip. As a ninth example, the lens unit includes a first light distribution area having a first outer surface and a second light distribution area having a second outer surface, and the first outer surface reflects light inward in the optical axis direction of the LED chip 2201, and the second outer surface reflects light outward in the optical axis direction of the LED chip 2201, and by adjusting the position of the LED chip, it is possible to suppress a part of the illuminance and prevent the occurrence of glare. The arrangement form of the LED chip 2201 according to the embodiment of the lens unit in the second to ninth examples above may be the arrangement in the above example, or may be another arrangement.

In one embodiment, the circuit board 201 may have other different forms. For example, the circuit board 201 may include multiple sub-circuit boards 201, and the sub-circuit boards 201 may be configured as various different structures. In one embodiment, at least one sub-circuit board 201 has a certain inclination angle with respect to the base 3. In one embodiment, any one of the sub-circuit boards 201 has an internal region where the LED chips 2201 are not arranged and an external region where the LED chips 2201 are arranged, and for example, the smallest region that can be surrounded by all the LED chips 2201 in any one of the sub-circuit boards forms the external region. By reducing the pitch of the LED chips 2201 close to the internal region and increasing the pitch between the LED chips 2201 away from the internal region, the light emission uniformity of the LED lamp can be achieved. In one embodiment, the sub-circuit boards 201 are arranged along the circumferential direction, and each sub-circuit board 201 is provided with LED chips 2201 of different color lights, and the color lights of the LED chips closest to each other among the adjacent sub-circuit boards 201 are different, and the distance between adjacent LED chips in each sub-circuit board 201 is equal to the shortest distance between the LED chips located on each adjacent sub-circuit board 201. The arrangement of the LED chips of different color lights can achieve light emission uniformity on the light-emitting surface. In one embodiment, the adjacent sub-circuit boards 201 are connected by a connection part, and the protruding part of one sub-circuit board 201 is accommodated in the accommodation part of the other sub-circuit board 201 adjacent thereto, and the light emitted from the LED chips is likely to diffuse in a direction perpendicular to the extension direction of the LED chips, and the center of the connection part is prevented from becoming dark, thereby preventing the occurrence of brightness variations on the light-emitting surface of the LED lamp. In one embodiment, the circuit board 201 is composed of two sub-circuit boards 201, and a reflecting portion is provided in the first insulating portion 202. The reflecting portion has a first reflecting surface that reflects the light emitted from the LED chip in one of the sub-circuit boards 201 at an angle from the vertical direction of the circuit board, and a second reflecting surface that reflects the light emitted from the LED chip in the other sub-circuit board 201 toward the center of the lamp, thereby suppressing the variation in brightness in the first insulating portion.

In one embodiment, the circuit board 201 may have other different forms. For example, the circuit board 201 includes an inner region in which the power supply module 23 is provided and an outer region in which the light source module 22 is provided, and the outer region is farther away from the center of the circuit board 201 than the inner region, and in the outer region, a plurality of first blocks and a plurality of second blocks are alternately arranged so as to be adjacent to each other, and the average value of the distance from the plurality of LED chips 2201 arranged in the first block to the center of the circuit board 201 is greater than the average value of the distance from the plurality of LED chips 2201 arranged in the second block to the center of the circuit board 201, so that it is possible to suppress the light emitted from the LED chips in the outer region from being blocked by the second insulating part 203 covering the power supply module provided in the inner region, and it is possible to ensure the uniformity of the brightness of the light emission surface of the lamp cover.

In some embodiments, the circuit board 201 may have other different forms. As shown in FIGS. 19-20, the second surface 2012 of the circuit board 201 includes a third region 2014b for arranging the power supply module 23, and a fourth region 2015b in which the power supply module 23 is not arranged. In this embodiment, the first region 2014a and the third region 2014b include an opening 222, which connects the first region 2014a and the third region 2014b. For example, the third region is defined as the area of a circle formed with the center of the circuit board as the center and the maximum distance from the electronic element of the power supply module to the center as the radius. The first surface 2011 includes a first region 2014a facing the third region 2014b and a second region 2015a facing the fourth region 2015b, and the number of LED chips located in the first region 2014a is smaller than the number of LED chips located in the second region 2015a, thus significantly reducing the dark area in the center of the LED lamp and improving the light emitting effect of the LED lamp, while reducing the impact of heat from the power supply module on the light source module. In some embodiments, the third region 2014b is close to the central axis of the LED lamp (or the central axis of the photovoltaic module), and the fourth region 2015b is farther away from the central axis of the LED lamp (than the third region 2014b). Since the power supply module 23 is located near the center of the LED lamp, the amplitude of the external force received by the photovoltaic module 2 during transportation is small, and the power supply module 23 is not damaged by the external force. When the power supply module 23 includes the first power supply module 231 and the second power supply module 232 described above, the power supply module described with respect to Figures 19-20 refers to the second power supply module 232. In other embodiments, the first region 2014a and the third region 2014b do not include the aperture 222, and the maximum distance from the end or edge of the aperture 222 to the first region 2014a is less than the distance from the end or edge of the aperture 222 to the LED chip 2201.

In some embodiments, the circuit board 201 may have other different forms. As shown in FIGS. 21 and 22, the second surface 2012 of the circuit board 201 includes a seventh region 2016b and an eighth region 2017b, and the electronic elements of the power supply module 23 include heat-generating elements (elements that generate a lot of heat when operated, such as ICs and resistors) and non-heat-resistant elements (elements whose operating performance is easily affected by heat, such as electrolytic capacitors), and the heat-generating elements and non-heat-resistant elements are located in the seventh region 2016b and the eighth region 2017b, respectively, thereby reducing the effect of heat generated by the heat-generating elements when they are operated on the non-heat-resistant elements, and improving the reliability and service life of the entire power supply module 23. The first surface 2011 includes a fifth region 2016a facing the seventh region 2016b and a sixth region 2017a facing the eighth region 2017b, and the number of LED chips located in the fifth region 2016a is smaller than the number of LED chips located in the sixth region 2017b, thereby reducing the effect of heat from the power supply module on the light source module. When the power supply module 23 includes the first power supply module 231 and the second power supply module 232 described above, the power supply module described with reference to Figures 21-22 refers to the second power supply module 232.

In one embodiment, the circuit board 201 may have other different forms. The circuit board 201 includes an inner region where the power supply module 23 is arranged and an outer region where the light source module 22 is arranged in order to increase the heat dissipation efficiency of the light source module, the outer region being farther away from the center of the circuit board 201 than the inner region, and a weak portion (a gap or groove) is provided between the inner region and the outer region. The weak portion is easily bent, which can increase the adhesion between the circuit board 201 and the base and increase the heat dissipation area.

In one embodiment, the circuit board 201 may have other different forms. The photovoltaic module includes a night light, and the circuit board 201 includes a first region in which the night light is disposed and a second region in which the LED chip 2201 is disposed, the first region being close to the central axis of the LED lamp (or the central axis of the photovoltaic module), and a slit being formed between the night light and the LED chip 2201, thereby ensuring an insulating distance between the night light and the LED chip and preventing a short circuit due to a potential difference between the night light and the LED chip.

In one embodiment, the circuit board 201 may have other different forms. For example, the circuit board 201 is provided with an optical member for controlling the light distribution of the light emitted from the LED chip 2201, and the optical member has a dome-shaped entrance surface, an exit surface, and a medium portion located between the two. The ratio of the distance r from the LED chip to the entrance surface in the optical axis direction to the distance d from the LED chip to the entrance surface in the circumferential direction is r/d<1. By adjusting r and d, it is possible to generate a light space that corresponds to the living situation.

10 to 11, the first insulating part 202 has a constant arc degree from the center of the light source module 22 to the edge along the radial direction of the light source module 22, or the first insulating part 202 has a constant arc degree from one end of the light source module 22 to the other end of the light source module 22 along the radial direction of the light source module 22, or the first insulating part 202 has a constant arc degree from the center of the circuit board 201 to the end of the first insulating part 202 along the radial direction of the circuit board 201. The central angle corresponding to the arc degree is 2° to 50°, and preferably 5° to 15°. By designing the first insulating part 202 to have an arc degree, the stress strength during transportation of the first insulating part can be increased and the integrity of the photovoltaic module 2 can be protected. In addition, the inclination of the first insulating part with respect to the circuit board can be mitigated, and the light beam can be distributed softly. In other embodiments, the first insulating part 202 includes a transparent substrate adjacent to the circuit board 201 and a light-transmitting light-diffusing layer, and a decorative layer having a predetermined pattern is provided between the transparent substrate and the light-diffusing layer. Since the light passing through the decorative layer is not scattered by the light-diffusing layer, when the LED lamp is viewed from the floor side, a clearly outlined pattern can be seen, enhancing the lighting effect.

As shown in Figures 10 to 12, the second insulating part 203 has several first holes 2032, and a space for accommodating electronic elements is formed between the second insulating part 203 and the circuit board 201. The provision of the first holes 2032 has an effect on air convection in the space for accommodating the electronic elements, and thus at least a portion of the heat generated during operation of these electronic elements is discharged through the first holes 2032, enhancing the heat dissipation effect of the electronic elements.

In one embodiment, the second insulating section 203 may have other different forms. The second insulating section 203 may be composed of a plurality of blocks, with overlapping areas between the blocks, and the distance from the overlapping areas to the base 3 is made shorter than the distance from other parts of the second insulating section 203 (areas other than the overlapping areas) to the base 3, thereby preventing contact between the second insulating section and the power supply module, increasing the number of heat dissipation paths, and improving the heat dissipation effect.

In one embodiment, the first insulating section 202 may have other different forms. The first insulating section 202 includes a central area close to the central axis of the LED lamp (or the central axis of the photovoltaic module) and an end area farther away from the central axis of the LED lamp (or the central axis of the photovoltaic module) than the central area, and the end area is provided with a light-guiding reflector that guides the light emitted from the light source module 22 from the central area to the end area and emits it in order to widen the irradiation range of the lamp.

In one embodiment, the first insulating portion 202 may have other different forms. The first insulating portion 202 has an inner area, an outer area, and a middle area located between the inner area and the outer area, the inner area is closer to the central axis of the LED lamp (or the central axis of the photovoltaic module) than the outer area and the middle area, the inner area has a first thick portion that is thicker than the middle area, and the first thick portion provides a lens effect to brighten the central portion of the lamp and reduce light loss.

In one embodiment, the first insulating portion 202 may have other different forms. The surface of the first insulating portion 202 may have a plurality of prisms. Each prism has a first prism surface and a second prism surface that have different inclination angles with respect to the circuit board 201, so that the light emitted from the LED chip is incident on the first prism surface and refracted at the second prism surface. This can reduce discomfort caused by glare.

In one embodiment, the first insulating portion 202 may have other different forms. The first insulating portion 202 has a light transmitting portion with high light transmittance and a lens portion with low light transmittance, and the light transmitting portion surrounds the lens portion and is spaced from the central axis of the LED lamp. This makes it possible to make the illuminance of the lamp cover uniform and increase the light output rate of the lamp. In one embodiment, the first insulating portion 202 is provided with a lens, which controls the light distribution in the radial and circumferential directions of the first insulating portion, suppresses the variation in brightness in the circumferential direction of the lamp, and ensures the light distribution in the radial direction.

In one embodiment, the first insulating part 202 may have other different forms. The photovoltaic module 2 includes a night light provided on the circumference closest to the central axis of the LED lamp (or the central axis of the photovoltaic module), and the night light is provided with a mask that allows light to pass through the design, thereby ensuring the luminous efficiency of the lamp and improving the light design. In addition, when the night light is turned on, bright lines may appear on the lamp cover 1. In order to prevent this phenomenon, a diffusion cover for diffusing light is provided on the outside of the night light, and the area of the first insulating part 202 covering the night light and the light source module 22 is a uniform surface without any unevenness, so that bright lines do not appear.

In one embodiment, the first insulating part 202 and the second insulating part may have other different forms. As shown in FIG. 23 and FIG. 24, in this embodiment, the first insulating part 202 is provided with a lens group 212 corresponding to the LED chip group 221, that is, the lens group 212 is located above the LED chip group 221 so as to cover the LED chip group 221, so that the light distribution is further dispersed and uniform. The lens group is molded in one operation by an injection molding process, and the manufacturing cost is lower than that of attaching a lens alone. The first insulating part 202 is provided with a plurality of heat dissipation hole groups including a plurality of heat dissipation holes 211, and at least one of the heat dissipation hole groups is close to the LED chip group 221, so that the heat of the circuit board 201 can be rapidly dissipated, and the heat dissipation effect is greatly improved. In addition, the second insulating part 203 may be provided with a heat dissipation hole 211, which further reduces the temperature of the power supply module and increases the service life of the lamp. The second insulating part is provided with a plurality of auxiliary parts 2033 distributed in a circumferential manner. Of course, other distribution methods are also possible. When fixing the insulating unit to the circuit board, the auxiliary parts can increase the connection strength between the insulating unit and the circuit board, and also increase the heat dissipation area of the second insulating part to improve the heat dissipation effect. In other embodiments, the heat dissipation hole 211 is provided in the center of the first insulating part 202 (near the central axis of the photovoltaic module), and the outer edge of the first insulating part 202 may be provided with a plurality of notches arranged at intervals, so that air can convect between the circuit board and the first insulating part, thereby improving the heat dissipation effect.

Figure 25 is a structural schematic diagram of another embodiment of the photovoltaic module 2b. As shown in Figure 25, the photovoltaic module 2b includes a light source module 22 and a power supply module 23, and a light reflecting part 29 is provided between the light source module 22 and the power supply module 23. The light source module 22 surrounds the light reflecting part 29, and the light source module 22 includes a circuit board 201 and at least one LED chip group 221 located on the circuit board 201, and each LED chip group includes a plurality of LED chips 2201, and the light emitting surface of the LED chip 2201 faces the central axis of the lamp, thereby effectively eliminating the dark area in the center and improving the light emitting effect of the lamp. As shown in Figures 55-56, a part of the light emitted from the LED chip 2201 is reflected by the light reflecting part 29 and emitted from the lamp cover 1. In one embodiment, the outer surface of the LED chip 2201 may be isolated from the external environment by colloids (e.g., silica gel), thereby avoiding the risk of electric shock. Alternatively, an adhesive layer of uniform thickness may be applied to the entire circuit board 201.

In this embodiment, the LED light source module 22 further includes a heat dissipation component 223 such as an aluminum ring or a copper ring. The circuit board 201 is attached to the heat dissipation component 223. In order to improve the heat dissipation effect, a heat dissipation bar (not shown) may be provided on the surface of the heat dissipation component 223 that is away from the circuit board 201 to increase the heat dissipation area. The heat dissipation bar and the circuit board 201 are located on two opposing surfaces of the heat dissipation component 223.

In this embodiment, the LED light source module 22 can be manufactured by the following method.

1) The pad ends of the circuit board 201 are inserted into the fitting slots of the turntable, and when the turntable is started, the circuit board 201 surrounds the turntable and is adsorbed into the fitting slots of the turntable.

2) Align the dispenser needle with the circuit board 201, rotate the turntable to begin dispensing, and stop rotating the turntable after dispensing is complete.

3) Insert the heat dissipation component 223 into the insertion slot of the turntable, cut the heat dissipation component 223 after the turntable has rotated once, and remove the heat dissipation component 223 and the circuit board 201.

4) The LED chip 2201 is attached to the circuit board 201 to obtain the LED light source module 22. The above manufacturing method is simple to operate, has low equipment costs, and can effectively improve manufacturing efficiency and reduce manufacturing costs.

26 to 28 , the photovoltaic module 2 of the present application further includes a connector terminal 24, which is electrically connected to an external power source (e.g., a commercial power source) for receiving an external power signal and transmitting the power signal to the LED lamp, and is connected to the electronic elements on the second surface 2012 via a conductor 241, and the connection point between the conductor 241 and the circuit board 201 is located on the second surface 2012 of the circuit board 201. In this embodiment, the electronic elements of the power module are all located on the second surface 2012 as an example, but the present invention is not limited to this example. The circuit board 201 is provided with an opening 2018 that communicates the first surface 2011 and the second surface 2012, the opening 2018 is close to the conductor 241, and the distance from the opening 2018 to the conductor 241 in the radial direction of the circuit board is shorter than the length of the conductor 241, and preferably the shortest distance from the opening 2018 to the conductor 241 in the radial direction of the circuit board is shorter than the length of the conductor 241, thereby ensuring a stable electrical connection. The first insulating part 202 is provided with a fastening fastener 2025, and after the assembly of the photoelectric module 2 is completed, the fastening fastener 2025 is located within a range of 30 degrees to 60 degrees with respect to the first surface 2011, and preferably within a range of 30 degrees to 45 degrees, which makes it easy for a user to pass the connector terminal 24 through the opening 2018 and fasten it to the fastening fastener 2025 when assembling the photoelectric module by himself. A portion of the connector terminal 24 is exposed from the first insulating portion 202 to facilitate subsequent electrical connection. Fig. 26 shows a method of assembling an embodiment of the photovoltaic module of the present application. As shown in Figs. 26 to 28, the assembly method includes the following steps:
1) connecting the connector terminals 24 to electronic elements on the circuit board 201 via the conductors 241, and pushing the circuit board 201 into the first insulating portion 202;
2) pushing the connector terminal 24 through the opening 2018 in the circuit board 201 and into the fastener 2025 of the first insulating portion 202 so that a portion of the connector terminal 24 is exposed from the first insulating portion 202;
3) fixing the second insulating portion 203 to the circuit board 201 such that the second insulating portion 203 covers the conductive wires 241 and all of the electronic components on the second surface 2012 .

Currently, when assembling a photovoltaic module, the circuit board is fixed to the base, the connector terminal is fixed to the fastener in the first insulating part, and finally the first insulating part is fixed. However, when such a fixing method of the connector terminal is adopted and the first insulating part is fixed, the position of the first insulating part needs to be adjusted, and the electrical connection point between the connector terminal and the circuit board is likely to loosen during the adjustment, resulting in an unstable electrical connection. In order to solve the problem of the unstable electrical connection, a long conductor needs to be used, but if the conductor is too long, the cost of the conductor material increases. When assembling a photovoltaic module using the assembly method of the present application, it is simple and convenient, and the user can assemble it by himself, and the length of the conductor used in the connector terminal and the circuit board is short, which saves the conductor material. After the assembly is completed, the connector terminal and the circuit board form a certain angle, thereby minimizing the height exposed from the first surface of the connector terminal and not blocking the light emitted from the light source module.

As shown in Figures 29 to 35, a first protrusion 2101 is provided on the outer edge of the first insulating portion 202, and the first protrusion 2101 protrudes relative to the outer edge of the first insulating portion 202. In this embodiment, the first insulating portion 202 may be configured as a rotating body structure, and a plurality of first protrusions 2101 may be provided on the outer edge of the first insulating portion 202 along the circumferential direction of the first insulating portion 202. In this embodiment, the base 3 is provided with an attachment portion 31 for attaching the first protrusion 2101. Specifically, the attachment portion 31 includes a first attachment portion 315 having a first fitting slot 3111. The first insulating part 202 has a fixed position and a detached position, and when in the fixed position, the first protrusion 2101 is fitted into the first fitting slot 3111 and fixed, and when in the detached position, the first protrusion 2101 and the first fitting slot 3111 are separated. In this embodiment, the first insulating part 202 is switched between the fixed position and the detached position so as to rotate (rotate approximately around the axis of the LED lamp). In this embodiment, the first fitting slot 3111 is closed by the first mounting part 315 and the base 3 on both sides in the axial direction of the LED lamp, so that when the first protrusion 2101 is fitted into the first fitting slot 3111, the position of the first protrusion 2101 is restricted on both sides in the thickness direction of the LED lamp. In other embodiments, the first fitting slot 3111 plays the same role as above by being closed by the structure of the first mounting part 315 itself on both sides in the axial direction of the LED lamp. In this embodiment, the first mounting portion 315 has a positioning unit for positioning the first protrusion 2101 fitted into the first fitting slot 3111. Specifically, the positioning unit includes a first elastic arm 3112, and a first groove 3113 is formed between the first elastic arm 3112 and the first mounting portion 315. When in the fixed position, the first protrusion 2101 is fitted into the first groove 3113 at the radial end of the LED lamp, thereby realizing positioning and fixing of the first insulating portion 202. A first stopper portion 31121 is formed on the first elastic arm 3112. By providing the first elastic arm 3112, when the first insulating part 202 is rotated to remove the first protrusion 2101 from the first fitting slot 3111, it is necessary to first overcome the obstruction caused by the first stopper part 31121 (i.e., a force is applied to the first insulating part 202 so that the first protrusion 2101 presses the first elastic arm 3112 to remove it). This can prevent the first insulating part 202 from being removed from the first fitting slot 3111 due to an erroneous operation, a collision, or the like. In this embodiment, when in the fixed position, the first elastic arm 3112 can further tighten the first insulating part 202 by biasing the first protrusion 2101. The first elastic arm 3112 can be integrally molded with the first mounting part 315. The first elastic arm 3112 may be a sheet-like structure and has elasticity due to its own material properties (materials having elasticity in the prior art, such as plastic or metal, can be adopted). The first stopper portion 31121 can be directly molded by bending the first elastic arm 3112 (or by providing a bent portion on the first elastic arm 3112).

In this embodiment, the first mounting portion 315 and the second mounting portion 316 are an integral member, and the first fitting slot 3111 and the second fitting slot 3114 are located on opposite sides of the member. In other embodiments, the first mounting portion 315 and the second mounting portion 316 may be configured as separate structures (not shown).

The photovoltaic module 2 may be connected to the base 3 by other structures. As shown in FIG. 2 and FIG. 36, in some embodiments, the photovoltaic module 2 is fixed to the base 3 by magnetic connection (other basic structures in this embodiment are the same as those in the above embodiment). Specifically, the first insulating part 202 of the photovoltaic module 2 has a first protrusion 2101 on which a magnet 2102 is provided, and the base 3 has an iron part or member, so that the first insulating part 202 can be directly attracted to the base 3 by the magnet 2102 to complete the fixing. In other embodiments, the magnet may be provided at another position, for example, in the light source module, the power supply module, or the second insulating part, and will not be described here repeatedly. As shown in FIG. 37, the photovoltaic module 2 may also be connected to the base 3 by a screw fixing method (other basic structures in this embodiment are the same as those in the above embodiment). Specifically, the first insulating part 202 of the photovoltaic module 2 has a first protrusion 2101 on which a bolt 2103 is provided, and the bolt 2103 is connected to the base 3 to complete the fixing of the photovoltaic module 2. In other embodiments, the bolts may be provided at other positions, such as the light source module, the power supply module, or the second insulating part, and are not described here repeatedly. In one embodiment, as shown in FIG. 38 and FIG. 39, the photovoltaic module 2 may also be connected to the base 3 by adopting other screw fixing methods. The base 3 is provided with a plurality of through holes 3201a that may be located on a circumference, and the first insulating part 202 of the photovoltaic module 2 is provided with a screw hole, and the screw passes through the through hole and reaches the screw hole to fix the photovoltaic module to the base. In some embodiments, as shown in FIG. 40, the base 3 is provided with a plurality of through holes 3201b that may be located on a circumference, and the through hole 3201 is provided with a stud bolt 3202, which is crimped to the base 3. The first insulating part 202 of the photovoltaic module 2 is provided with a screw hole 3203, and the screw passes through the screw hole 3203 and reaches the stud bolt 3202 to fix the photovoltaic module 2 to the base 3.

The LED lamp shown in Fig. 41 has a basic structure similar to that of the lamp (ceiling light) of the above embodiment, but differs in the specific fixing method between the photoelectric module 2 and the base 3. Specifically, as shown in Figs. 41 and 42, the base 3 is provided with an attachment portion 31, which includes a fixing portion 314 and an inclined portion 317 connected to the fixing portion 314, which includes an upper position restricting portion 3141 and a lower position restricting portion 3142 provided opposite the upper position restricting portion 3141, which is connected to the inclined portion 317, and a connecting portion 3143 is provided between the upper position restricting portion 3141 and the lower position restricting portion 3142, which is connected to the positioning portion 313 and the inclined portion 317. After sliding into the lower position restricting portion 3142 along the inclined portion 317, a corner of the photoelectric module 2 is maintained in a fixed state by the positioning portion 313, and the surface of the upper position restricting portion 3141 is in contact with the surface of a portion of the photoelectric module 2.

The spatial position of the mounting part 31 is arranged in the Cartesian coordinate system (x, y, z) shown in FIG. 42, and the x-y plane is parallel to the upper surface of the lower position regulation part 3142. The included angle between the inclined part 317 and the x-y plane is α, and the included angle α ranges from 0<α≦20°, and preferably from 5°<α≦15°. The included angle between the positioning part 313 and the x-z plane is β, and the included angle β ranges from 10°≦β≦50°, and preferably from 20°≦β≦40°. By adjusting β, the light source module can be fixed to the mounting part. The positioning part 313 is provided with a spring plate 3131, and the included angle γ between the spring plate 3131 and the x-z direction ranges from 28°<γ<68°, and preferably from 38°≦γ≦58°. When the photovoltaic module is broken and needs to be replaced, the photovoltaic module can slide out of the fixing part. By designing γ, the user can easily replace the photoelectric module, and the work efficiency can be improved. The maximum length of the positioning portion 313 in the z-axis direction is L1, and the minimum length of the photoelectric module 2 in the z-axis direction when the photoelectric module 2 slides into the lower position regulating portion 3142 is L2. The sum of L1 and L2 is greater than the distance D from the upper position regulating portion 3141 to the lower position regulating portion 3142, so that the fixing effect of the photoelectric module is more suitable.

In one embodiment, an LED lamp is provided as shown in Figures 43 and 44. The LED lamp has a basic structure similar to that of the lamp (ceiling light) of the above embodiment, but differs in the specific fixing method between the photoelectric module 2 and the base 3. Specifically, as shown in Figures 43 and 44, the photoelectric module 2 in this embodiment is provided with mounting holes 28, which may be located at both ends of the photoelectric module 2, and the base 3 is provided with mounting portions 31, and the number of mounting holes 28 is the same as the number of mounting portions 31. The mounting portion 31 includes a support portion 311 and a fastening portion 312 fixed to the support portion 311, and the fastening portion 312 includes an expandable portion 3121 and a position regulating portion 3122. When the photovoltaic module is installed, the mounting hole 28 in the photovoltaic module 2 is aligned with the fastening portion 312, and then a force is applied to the photovoltaic module 2, so that the telescopic portion 3121 is compressed by the force and enters the mounting hole 28 of the photovoltaic module 2, and the photovoltaic module 2 is fitted into the gap between the telescopic portion 3121 and the position restricting portion 3122. The height of the mounting hole 28 is equal to or greater than the minimum distance between the telescopic portion 3121 and the position restricting portion 3122, and is preferably equal to the minimum distance between the telescopic portion 3121 and the position restricting portion 3122. This prevents the photovoltaic module from shaking during transportation, and provides a favorable fixing effect for the photovoltaic module. When the installation is completed, the state shown in FIG. 44 is obtained. By using such an installation method, the operation method is simplified, the user can easily install, the fixing effect is favorable while improving the work efficiency, the manufacturing cost is reduced, and it is suitable for industrialization.

As shown in Figures 29 to 35, the mounting portion 31 further includes a second mounting portion 316 for fixing the lamp cover 1. Specifically, the lamp cover 1 has a wall portion 11, and the lamp cover 1 may be configured as a rotating body structure. The wall portion 11 has an edge, and the edge of the wall portion 11 is provided with a second protrusion portion 1101 that protrudes from the edge of the wall portion 11 toward the inside in the radial direction of the lamp cover 1. A plurality of second protrusion portions 1101 may be provided along the circumferential direction of the lamp cover 1. The second mounting portion 316 has a second fitting slot 3114. When the lamp cover 1 is fixed to the base 3, the second protrusion portion 1101 is fitted into the second fitting slot 3114 and fixed. In this embodiment, the lamp cover 1 rotates (rotates substantially around the axis of the LED lamp) to fit the second protrusion 1101 into the second fitting slot 3114 or detaches it from the second fitting slot 3114. In this embodiment, the second fitting slot 3114 is closed by the second mounting portion 316 and the base 3 on both sides in the axial direction of the LED lamp, so that when the second protrusion 1101 is fitted into the second fitting slot 3114, the position of the second protrusion 1101 is restricted on both sides in the thickness direction of the LED lamp. In other embodiments, the second fitting slot 3114 is closed by the structure of the second mounting portion 316 itself on both sides in the axial direction of the LED lamp, and plays the role described above. In this embodiment, the second mounting portion 316 has a positioning unit to position the second protrusion 1101 fitted into the second fitting slot 3114. Specifically, the positioning unit includes a second elastic arm 3115, and a second groove 3116 is formed between the second elastic arm 3115 and the second mounting portion 316. When the second protrusion 1101 is in the fixed position, the second protrusion 1101 is fitted into the second groove 3116 at the radial end of the LED lamp, thereby realizing the positioning and fixing of the lamp cover 1. The second elastic arm 3115 is formed with a second stopper portion 31151. By providing the second elastic arm 3115, when rotating the lamp cover 1 to remove the second protrusion 1101 from the second fitting slot 3114, it is first necessary to overcome the obstruction caused by the second stopper portion 31151 (i.e., apply a force to the lamp cover 1 so that the second protrusion 1101 presses the second elastic arm 3115 to remove it). This makes it possible to prevent the lamp cover 1 from being removed from the second fitting slot 3114 due to erroneous operation, collision, or the like. In this embodiment, when the lamp cover 1 is fixed, the second elastic arm 3115 can further tighten the lamp cover 1 by biasing the second protrusion 1101. The second elastic arm 3115 can be integrally molded with the second mounting portion 316. The second elastic arm 3115 can be a sheet-like structure and has elasticity due to its own material properties (materials having elasticity in the prior art such as plastic or metal can be adopted). The second stopper portion 31151 can be directly molded by bending the second elastic arm 3115 (or providing a bending portion on the second elastic arm 3115).

The lamp cover 1 in the present application may have various structures. As shown in FIG. 1 to FIG. 51, in one embodiment, the lamp cover 1 has a smooth curved surface to prevent the variation of the light distribution caused by the difference in the refractive index of the cross section of the lamp cover. In one embodiment, the lamp cover 1 includes a central portion and a peripheral portion surrounding the central portion, and the lamp cover 1 has a light diffusion layer including light diffusion particles, and the density of the light diffusion particles in the central portion is greater than the density of the light diffusion particles in the peripheral portion, thereby making the brightness of the center and the periphery of the lamp uniform. In one embodiment, the lamp cover 1 has a plurality of diffusion regions, one of which overlaps with the photovoltaic module 2 in the z-axis direction, and can improve the flicker of the lamp. In one embodiment, the inner surface or outer surface of the lamp cover 1 may be provided with a brightness enhancement film to distribute the light energy of the light radiated from the light source module 2, realize the uniform light output of the LED lamp, and avoid glare. Here, the inner surface and the outer surface are located opposite each other, and the inner surface of the lamp cover 1 is the surface close to the photovoltaic module 2. In one embodiment, the lamp cover 1 is provided with a through hole, and the mounting screw for attaching the lamp cover 1 to the base 3 is inserted into the through hole of the lamp cover 1 with a clearance and screwed into the base 3. As a result, even if the lamp cover and the base expand or contract due to temperature changes caused by opening and closing the lamp, the clearance reduces the stress caused by the expansion or contraction, and it is possible to prevent the lamp cover and the device from bursting or generating noise.

In other embodiments, a light guide plate may be provided between the lamp cover 1 and the first insulating part 202. The light guide plate is, for example, a transparent acrylic resin molding, and various structures can be used for the light guide plate. In one embodiment, the light emitting intensity of the end of the light guide plate (one end close to the edge of the base 3) is the light emitting intensity at an angle corresponding to 30% of the light emitting intensity (maximum light emitting intensity) in the main light emitting direction of the LED chip 2201. In one embodiment, the light guide plate covering the circuit board 201 has an asymmetric first bend portion and a second bend portion, and a part of the light emitted from the LED chip 2201 is guided to the first bend portion and a part is guided to the second bend portion, so that the light emitted by the lamp becomes uniform. In one embodiment, a dot-shaped scatterer may be formed on the surface of the light guide plate to realize uniform light emission on the light emitting surface. In one embodiment, the light guide plate includes a main light guide portion that guides the light emitted from the LED chip 2201 to the outer periphery of the light guide plate, and an auxiliary light guide portion that guides the light from the LED chip 2201 to the center part of the lamp and disperses it. In one embodiment, the light guide plate includes an inlet unit for inletting light into the lamp and an outlet unit for guiding light to the outside of the lamp, and can suppress luminance variations and glare of the light guide plate. In one embodiment, the light guide plate has an inner surface and a corresponding outer surface, and the radius of curvature of the inner surface is larger than the radius of curvature of the outer surface, and can suppress the occurrence of luminance unevenness in the lamp cover. In one embodiment, a plurality of LED chip groups 221 are provided on the circuit board, the LED chip group 221 includes a plurality of LED chips 2201, the light emitting surface of the LED chips 2201 faces the incident end surface of the light guide plate, the plurality of LED chip groups 221 are arranged in a straight line in the longitudinal direction of the circuit board 201, and the first LED chip group, the second LED chip group, and the third LED chip group are attached in this order in a straight line from the longitudinal edge of the circuit board 201 toward the center line, and when the distance between the edge of the circuit board 201 and the first LED chip group is a first separation dimension L1, the distance between the first LED chip group and the second LED chip group is a second separation dimension L2, and the distance between the second LED chip group and the third LED chip group is a third separation dimension L3, by making L1<L2<L3, dark areas are less likely to occur in the light guide plate. In one embodiment, the light guide plate has a light-transmitting substrate, and a plurality of concave prism portions are provided on the main surface of the light-transmitting substrate. The concave prism portions are covered with a coating to prevent dust from accumulating on the main surface and in the prism portions, and the thickness of the coating is sufficiently thin to suppress deterioration of the optical performance of the light guide plate. The arrangement of the light guide plate can be combined with the arrangement of the LED chips on the circuit board so as not to interfere with each other.

In one embodiment, the circuit board 201 is annular like the circuit board 201 of the photovoltaic module 2b in the above embodiment. A light guide plate may be provided between the lamp cover 1 and the first insulating part 202. The light emitting surface of the LED chip 2201 faces the center of the lamp, and the light guide plate may have various structures. In one embodiment, the thickness of the light guide plate is formed in an inclined shape, and the thickness gradually decreases from the outer periphery to the center, making the brightness of the light guide plate uniform. In one embodiment, the circuit board 201 is provided with a first LED chip group and a second LED chip group, the light emitted from the first LED chip group is incident on the incident end surface of the first light guide plate, the light emitted from the second LED chip group is incident on the incident end surface of the second light guide plate, the incident light is emitted toward the upper and lower surfaces of the first light guide plate and the second light guide plate, and the first light guide plate and the second light guide plate have optical transparency along their thickness direction, so that the lamp has a three-dimensional light-emitting effect. In one embodiment, the annular circuit board 201 is covered in order by a reflective cover, a light guide plate, and a light collecting cover, the protruding portion of the light guide plate is inserted into the recessed portion of the reflective cover, the light collecting cover has a lens area covering the inner exit surface of the light guide plate, and the lens area is located optically opposite to the recessed reflecting portion in the light guide plate, narrowing the orientation of the light emitted from the lamp.

The base in the LED lamp of the present application can have various structures. FIG. 45 is a structural schematic diagram of one embodiment of the base in the LED lamp of the present application. The base is arranged in a spatial Cartesian coordinate system (x, y, z) in which the z-axis is parallel to the central axis of the LED lamp, and the base 3 is a disk-shaped one manufactured from, for example, an aluminum plate or a steel plate. As shown in FIG. 45 and FIG. 46, a hole 33 is formed in the center of the base 3, and a support portion 34 and an edge portion 35 are formed around the hole 33. There is a gap between the support portion 34 and the edge portion 35, and the gap extends in the negative direction of the z-axis to form a concave groove portion 36, and the support portion 34 and the edge portion 35 are at the same position in the positive direction of the z-axis. Of course, in other embodiments, the support portion 34 and the edge portion 35 are at different positions in the positive direction of the z-axis, and for example, the height of the support portion 34 in the positive direction of the z-axis is higher than that of the edge portion 35. The photovoltaic module 2 has an upper surface and a lower surface opposite to the upper surface, and the lower surface of the photovoltaic module 2 is separated from the lamp cover 1, and the lower surface of the lamp cover 1 and the support part 34 are in surface contact with each other, so that the heat generated by the photovoltaic module is transferred to the outside through the base, and the heat dissipation speed is increased. In other embodiments, the photovoltaic module 2 and the support part 34 are not completely bonded to each other in surface contact, and there is a gap between the photovoltaic module 2 and the support part 34, but a certain amount of a thermally conductive adhesive layer can be filled in the gap. This allows the heat generated during the operation of the LED chip 2201 to be quickly transferred to the base 3 through the circuit board 201 and the thermally conductive adhesive layer, improving the heat dissipation performance.

In one embodiment, the base 3 may be provided with a brightness sensor. The brightness sensor is attached to a position that is not exposed to direct light from the lamp, and continuously adjusts the lighting conditions of the lamp according to an increase in brightness due to external light, thereby realizing energy savings and reducing environmental impact, and appropriately suppressing excessive power consumption. In one embodiment, the base 3 is provided with reinforcing bars, which increase the strength of the base and reduce its thickness.

The user normally sets the time to wake the user up using the remote control. Currently, to confirm that the lamp has received a signal from the remote control, the user is generally notified by an electronic buzzer. However, the buzzer is usually placed on a circuit board with double-sided wiring. In the case of a circuit board with single-sided wiring, the sound generating element must be attached to one side of the circuit board close to the ceiling, and the volume of the sound emitted from the sound generating element when transmitted to the user is low due to obstacles such as the circuit board. In one embodiment, the base 3 is provided with a facing portion that faces the circuit board 201, the circuit board 201 is provided with an opening corresponding to the facing portion, and the sound generating element is attached to the surface on the other side from the LED chip 2201. When the sound generating element emits sound, the sound is reflected by the facing portion and then transmitted through the opening, ensuring that the user can obtain the desired volume.

Figure 47 is a structural schematic diagram of an embodiment of the photovoltaic module of the present application. As shown in Figures 45 to 48, the photovoltaic module 2 is provided with a power supply module 23 at a position opposite to the groove 36, and the power supply module 23 includes a first power supply module 231 and a second power supply module 232, and the height of the second power supply module 232 in the positive direction of the Z axis is higher than the height of the LED chip 2201. After the ceiling light is installed, the second power supply module 232 is located in the groove portion 36 of the base, and preferably the second insulating part 203 and the side wall of the groove portion 36 are in contact with each other. This increases the contact area and improves thermal conductivity. The base does not require a storage space for storing, for example, the second power supply module, which makes the LED lamp thinner (i.e., the height in the Z axis direction is shorter), and reduces packaging and storage costs. In addition, the photovoltaic module can be separated from the lamp cover, which increases the amount of light reaching the edge of the lamp cover from the light source module. In other words, when the lamp cover is viewed in plan, the edge of the lamp cover can be illuminated very brightly. As a result, the light emitted from, for example, an LED lamp can illuminate a wider area.

Figure 49 is a structural schematic diagram of one embodiment of an LED lamp of the present application. As shown in Figures 49, 50A to 50B, 51, and 52A to 52C, the light source module includes a first chip area 2211 and a second chip area 2212, and at least a portion of the power supply module 23 is located between the first chip area 2211 and the second chip area 2212. In some embodiments, the circuit board 201 includes a first surface 2011 and a second surface 2012 facing each other, the first surface 2011 is provided with a first chip area 2211 and a second chip area 2212, the first chip area 2211 and the second chip area 2212 include at least one LED chip 2201, the power supply module 23 includes a first power supply module 231 and a second power supply module 232 located on the first surface 2011 and the second surface 2012 of the circuit board 201, respectively, and the first power supply module 231 is located between the first chip area 2211 and the second chip area 2212 in the radial direction of the circuit board 201 (the first power supply module 231 is also located on the first surface 2011). The power supply module 23 includes a power supply unit 3a, a voltage step-up unit 3b, and a voltage step-down unit 3c, the power supply unit 3a includes a first driving element 3a1, the voltage step-down unit 3c includes a second driving element 3c1, and the voltage step-up unit 3b includes a third driving element 3b1, and the first driving element 3a1, the second driving element 3c1, and the third driving element 3b1 are located on a first surface 2011 of the circuit board 201. After the LED lamp is turned on for a time t (t≧0.5), the temperature of the first driving element 3a1 and the temperature of the third driving element 3b1 are lower than the temperature of the second driving element 3c1, and preferably the temperature of the first driving element 3a1 is lower than the temperature of the third driving element 3b1, that is, the temperature of the first driving element 3a1<the temperature of the third driving element 3b1<the temperature of the second driving element 3c1. The second drive element 3c1 is closer to the second chip area 2212 than the first drive element 3a1, and the third drive element 3b1 is farther from the second chip area 2212 than the second drive element 3c1. The drive elements in the power supply module are designed to be distributed, reducing the effect of the heat on the first chip area and the second chip area.

In this embodiment, the first chip area 2211 has a first edge S1 and a second edge S2 facing each other, the first edge S1 is close to the central axis of the LED lamp, and the surfaces of at least two LED chips 2201 close to the first power supply module 231 in the first chip area 2211 are in contact with the second edge S1. The second chip area 2212 has a third edge S3 and a fourth edge S4 facing each other, the second edge S2 is located between the first edge S1 and the third edge S3, and the third edge S3 is located between the second edge S2 and the fourth edge S4. The perimeters of the shapes (e.g., circles, ellipses, etc.) surrounded by the first edge S1, the second edge S2, the third edge S3, and the fourth edge S4 are C1, C2, C3, and C4 in this order, and C1<C2<C3<C4. In the second chip area 2212, the surfaces of at least two LED chips 2201 close to the first power supply module 231 are in contact with the third edge S3. If the distance from the first edge S1 to the second edge S2 is d1, the distance from the first edge S1 to the third edge S3 is d2, and the distance from the first edge S1 to the fourth edge S4 is d3, then d1+d2<d3, and preferably 2d1+d2<d3. The first chip area is close to the center of the circuit board, which can effectively reduce the dark area in the center of the lamp. In addition, the first chip area is far from the first light source module, which reduces the influence of the first power supply module on the first chip group.

Between the first insulating part 202 and the base 3, a second storage space is formed located in the first storage space, and the circuit board 201 is located in the second storage space, and the first insulating part 202 includes a light processing unit 202b and a partition unit 202c. When the light source module emits light, some or all of the light passes through the light processing unit 202b, and the light processing unit 202b is for controlling the uniformity of the light emission of the LED lamp. The partition unit 202c includes a first area 202c1 and a second area 202c2, and the light processing unit 202b connects the first area 202c1 and the second area 202c2, and the first area 202c1 and the second area 202c2 are provided opposite each other in the radial direction of the first insulating part 202. In one embodiment, the extension direction of the second area 202c2 intersects with the direction of the central axis of the LED lamp. Such an inclined design increases the area in the second area that receives force, improving resistance to deformation. The angle between the second area 202c2 and the central axis of the LED lamp is preferably 0 degrees to 80 degrees, and more preferably 30 degrees to 60 degrees.

The first insulating part 202 is provided with at least one fixing unit for fixing the circuit board 201, and the fixing unit may be in a fixing form such as an engagement connection, a screw connection, etc. In one embodiment, the fixing unit 2027 is located between the light processing unit 202b and the partition unit 202c.

Figure 53A is a schematic diagram of an embodiment of a photoelectric module. As shown in Figures 53A to 53H, the fixing unit includes at least one first fixing unit 2027a and/or at least one second fixing unit 2027b, and the first fixing unit 2027a and the second fixing unit 2027b may have a similar structure. Of course, in some embodiments, the first fixing unit 2027a and the second fixing unit 2027b may have different structures. In this embodiment, the first fixing unit 2027a is located between the second area 202c2 and the light processing unit 202b, and the second fixing unit 2027b is located between the first area 202c1 and the light processing unit 202b. The circuit board 201 includes a first side portion 201b and a second side portion 201c facing each other, and in the above embodiment, the first edge S1 can correspond to the first side portion 201b, and the fourth edge S4 can correspond to the second side portion 201c. The first chip area 2211 and the second chip area 2212 are located between the first side portion 201b and the second side portion 201c, the first fixing unit 2027a extends in a direction approaching the central axis of the LED lamp, and the second fixing unit 2027b extends in a direction away from the central axis of the LED lamp. The first fixing unit 2027a includes a first fixing surface 2027a1, and the circuit board 201 is located between the first fixing surface 2027a1 and the first insulating portion 202 to fix the second side portion 201c of the circuit board 201. The second fixing unit 2027b includes a second fixing surface 2027b1, and the circuit board 201 is located between the second fixing surface 2027b1 and the first insulating portion 202 to fix the first side portion 201b of the circuit board 201. Both sides of the circuit board 201 are fixed to the first insulating portion 202 by the fixing unit, improving the stability of the circuit board. In this embodiment, the first fixing surface 2027a1 and the second fixing surface 2027b1 are located on the same horizontal plane, but this is not limited. The pitch between the first fixing unit 2027a and the second fixing unit 2027b is closer than the distance between the first side portion 201b and the second side portion 201c, so that the circuit board can be firmly supported. In some embodiments, the first fixing surface 2027a1 and the second fixing surface 2027b1 contact the circuit board 201, and the hardness of the portion where the first fixing unit 2027a and the second fixing unit 2027b contact the circuit board 201 is stronger than the other portions that do not contact the circuit board 201, thereby enhancing the fixing effect of the circuit board.

In other embodiments, only the first fixing unit 2027a or the second fixing unit 2027b may be used to fix the circuit board 201. As shown in Figures 50A to 50B, 51, and 52A to 52C, in this embodiment, only the first fixing unit 2027a is used to fix the circuit board 201. The structure of the first fixing unit 2027a described above will not be described again here. The first insulating part 202 has a third opening 2025c connected to the first fixing surface 2027a1, and the circuit board 201 is located between the first fixing unit 2027a and the first insulating part 202, and the first insulating part 202 exposes a part of the circuit board 201, thereby dissipating a part of the heat from the second chip area and lowering the temperature of the electronic elements on the first surface of the circuit board.

As shown in FIG. 50A, the first insulating portion 202 includes at least one first opening 2025a and at least one second opening 2025b, and the first opening 2025a and the second opening 2025b are located in the first area 202c1 and the second area 202c2, respectively. The first opening 2025a and the second opening 2025b connect the second housing space to the outside, so that heat generated during operation of the electronic elements on the circuit board can be dissipated through the first opening and the second opening.

49, 50A-50C, 51, 52A-52C, in one embodiment, the first area 202c1 includes a partition plate 2028, which has a first end and a second end opposite to each other, the first end being adjacent to the light processing unit 202b, and the partition plate 2028 is provided around the circumference of the first area 202c1 and extends to the central axis of the LED lamp. In the height direction of the LED lamp, there is a first height difference between the partition plate 2028 and the light processing unit 202b, and after the first insulating part 202 is fixed to the base 3, there is a second height difference between the base 3 and the partition plate 2028 in the height direction of the LED lamp, and the first height difference and the second height difference allow the adapter 5 to be placed at the first end or the second end of the partition plate 2028 to meet different installation needs of users. In one embodiment, the first opening 2025a connects the first end of the partition plate 2028 to the second end of the partition plate 2028, and the height of the first opening 2025a is higher than the height of the circuit board 201 in the height direction of the LED lamp, and the first opening 2025a and the third opening 2025c form a first heat dissipation path, and the first opening 2025a and the second opening 2025b form a second heat dissipation path, and the first surface 2011 of the circuit board 201 and the second surface 2012 of the circuit board 201 are dissipated through the first heat dissipation path and the second heat dissipation path, thereby improving the service life of the power supply module and the light source module. In one embodiment, the height difference between the partition plate 2028 and the circuit board 201 in the height direction of the LED lamp can improve the heat dissipation effect of the circuit board. In one embodiment, there is a gap between the first opening 2025a and the circuit board 201, the second opening 2025b is located in the groove portion 36 of the base 3, and the first insulating portion 202 forms a heat dissipation path through the first opening 2025a and the second opening 2025b, thereby dissipating heat from the electronic elements on the circuit board and increasing the service life of the power supply module and the light source module. In one embodiment, at least one reinforcing portion 2028a may be provided at the second end of the partition plate 2028 to improve the structural strength of the first area 202c1.

As shown in FIG. 54N, a first sub-area 202c3 is formed between two adjacent first openings 2025a, the number of first sub-areas 202c3 is one less than the number of first openings 2025a, and each first sub-area 202c3 has at least one reinforcing portion 2028a.

As shown in Figures 54A to 54N, the structure of the circuit board in Figures 54A to 54N is similar to the structure of the circuit board shown in Figure 51. As shown in Figures 51 and 54A to 54N, the LED lamp includes a connector terminal 24 connected to the power supply unit 3a, and the connector terminal 24 is electrically connected to the power supply unit 3a via a conductor 241. A wiring unit 202d is provided in the first insulating portion 202, and the wiring unit 202d is used to fix the conductor 241 and protect the conductor from being pulled. The wiring unit 202d includes a first conductor slot 202b1 in the optical processing unit 202b, a second conductor slot 202c4 in one of the first sub-areas 202c3, a fourth opening 202c5 communicating with the first conductor slot 202b1, and a fifth opening 2028b in the partition plate 2028, where the fourth opening 202c5 and the fifth opening 2028b communicate with each other, the first conductor slot 202b1 and the second conductor slot 202c4 communicate with each other, and the conductor 241 passes through the first conductor slot 202b1 and the second conductor slot 202c4, and then passes through the fourth opening 202c5 and the fifth opening 2028b.

In one embodiment, as shown in Figures 54A to 54N, the fixing unit 2027 further includes at least one positioning post 2027c, which is located between the light processing unit 202b and the second area 202c2 and extends toward the first area 202c1, and the circuit board 201 is provided with at least one positioning hole 201d. During installation, the mounting position of the circuit board is provisionally determined by aligning the positioning hole with the positioning post 2027c.

In one embodiment, as shown in FIG. 54A to FIG. 54N, the fixing unit 2027 further includes at least one first step 2027d, which is located in the light processing unit 202b and extends in a direction approaching the first area 202c1, thereby regulating the mounting position of the circuit board with a certain distance between the light source module and the light processing unit, and preventing the circuit board from being pressed excessively and the LED chip from interfering with the first insulating part, which may cause an impact on use. In one embodiment, the fixing unit 2027 may further include at least one second step 2027e, which is located in the light processing unit 202b and extends in a direction away from the first area 202c1. Depending on the force receiving situation of the circuit board, the LED lamp may be provided with only the first step 2027d or the second step 2027e, or may be provided with both the first step 2027d and the second step 2027e.

As shown in FIG. 49, 50A to 50C, the first insulating part 202 further includes a transition part 2026, and the first insulating part 202 is connected to the base 3 through the transition part 2026. In one embodiment, the connection unit 202e includes a transition part 2026 located in the second area 202c2, and the transition part 2026 is connected to the base 3 through a fixing structure, which may be a fastening structure, a bolt structure (screw and screw), a fastening structure, or a magnetic adsorption structure. Specifically, the transition part 2026 is connected to the mounting part 31 in the base 3 through a fixing structure. When the base structure shown in FIG. 45 is used in FIG. 49, as shown in FIG. 45, 49, and 50A to 50C, there is a gap between the transition part 2026 and the groove part 36 (the groove part is not filled with the transition part in the radial direction of the LED lamp), which can increase the fluidity of heat by the LED lamp and reduce the temperature of the electronic element in the LED lamp. In one embodiment, the transition portion 2026 includes a connection area 2026a and a reinforcement area 2026b, the connection area 2026a extends from the second area 202c2 toward the edge portion 35, the connection area 2026a has a highest point and a lowest point in the height direction of the LED lamp, and the lowest point contacts the groove portion 36, thereby increasing the contact area between the first insulating portion and the base and improving the fixing effect of the photovoltaic module. The reinforcement area 2026b extends from the second area 202c2 toward the edge portion 35, and the reinforcement area 2026b connects the second area 202c2 and the connection area 2026a, thereby improving the mechanical strength of the transition portion. A part of the above fixing structure may be located in the connection area 2026a.

As shown in Figures 50A to 50C, 51, and 52A to 52C, the light processing unit 202b includes a first light processing area 2a, a second light processing area 2b, and a third light processing area 2f, where the first light processing area 2a corresponds to the first chip area 2211, and the second light processing area 2b corresponds to a part of the power supply module, in this embodiment, the second light processing area 2b corresponds to the first power supply module 231, and the third light processing area 2f corresponds to the second chip area 2212, and in one embodiment, the cross section of the first light processing area 2a and/or the third light processing area 2f is different from the cross section of the second light processing area 2b, and the light processing unit 202b may be the above-mentioned light absorption area or lens unit. In this embodiment, the second chip area 2212 includes two LED chip groups 221, and sub-light processing areas may be provided corresponding to each LED chip group 221. The first insulating part 202 has a first light processing area 2a and a second light processing area 2b at locations corresponding to the first chip area 2211 and the first power supply module 231, respectively, and the first insulating part 202 has a third light processing area 2f corresponding to the second chip area 2212, and the third light processing area 2f includes sub-light processing areas 2c and 2d. In one embodiment, the light processing area 2b can be frosted, and the refractive index of the light processing area 2b is smaller than that of the light processing area 2a and the sub-light processing areas 2c and 2d, and a part of the light emitted from the first chip area and the second chip area is reflected by the light processing area 2b, so that the lamp can have a uniform light distribution by frosting the light processing area 2b. As shown in Figures 54A to 54N, the first conductor slot 202b1 is located in the first light processing area 2a. In some embodiments, the light processing unit is frosted to improve the light emission effect of the LED lamp, or the first insulating part is frosted to improve the appearance of the first insulating part and improve the light emission effect of the LED lamp. In some embodiments, in the height direction of the LED lamp (for example, the positive direction of the Z axis shown in FIG. 49), the height of the second light processing area 2b is equal to or higher than the heights of the first light processing area 2a and the third light processing area 2f. In the height direction of the LED lamp, the height of some electronic elements in the first power supply module is greater than the height of the LED chip, so that the second light processing area 2b can suitably cover the first power supply module. Meanwhile, the light from the first chip area 2211 and the second chip area 2212 is partially radiated to the second light processing area 2b, and part or all of the light is refracted by the second light processing area 2b, so that the generation of dark areas in the first chip area 2211 and the second chip area 2212 is avoided.

The distance from the first chip area 2211 to the base 3 is closer than the distance from the second chip area 2212 to the base 3, and the distance between adjacent LED chips in the first chip area 2211 is closer than the distance between adjacent LED chips in the second chip area 2212. Since the first chip area 2211 is closer to the base 3 and the first opening 2025a than the second chip area 2212, heat from the first chip area 2211 is more likely to dissipate than from the second chip area 2212.

As shown in Figures 53A to 53H, the second chip area 2212 includes at least one LED chip group. The difference between this embodiment and the photovoltaic module shown in Figure 50 is that the second chip area 2212 includes three LED chip groups: a first LED chip group 221a, a second LED chip group 221b, and a third LED chip group 221c. The first LED chip group 221a, the second LED chip group 221b, and the third LED chip group 221c are located on different circumferences, and each of the first LED chip group 221a, the second LED chip group 221b, and the third LED chip group 221c includes at least one LED chip 2201, and the second LED chip group 221b is located between the first LED chip group 221a and the third LED chip group 221c. In one embodiment, the number of LED chips in the second chip group 221b is smaller than the number of LED chips in the first chip group 221a and the third chip group 221b, and preferably, the number of LED chips in the second chip group 221b < the number of LED chips in the first chip group 221a < the number of LED chips in the third chip group 221c. This makes the light distribution in the second chip area more uniform and reduces the area of the dark area. In one embodiment, the pitch between adjacent LED chips in the second chip group 221b is larger than the pitch between adjacent LED chips in the first chip group 221a and the third chip group 221b, and by increasing the pitch between adjacent LED chips in the second chip group, it is possible to reduce the mutual influence of heat by adjacent LED chips in the second chip area. Preferably, each of the first chip group 221a and the third chip group 221c has two LED chips adjacent to one LED chip in the second chip group 221b. Between two adjacent LED chips in the first chip group 221a, there are center points _O1 , _O2 , ..., _On (n≧1), and between two adjacent LED chips in the third chip group 221c, there are center points _Q1 , _Q2 , ..., _Qm (m≧1), where n and m are both integers, the distance between _O1 and _Q1 is closer than the distance between _O1 and _Qm (m>1), and the connection line between center point _O2n-1 and center point Q3m _-2 (n=m; n, m≧1; n and m are both integers) passes through at least one LED chip 2201 in the second chip group 221b. This increases the luminous flux of the LED lamp and prevents dark areas from occurring in the first chip area 2211 and the second chip area 2212, while reducing the mutual thermal influence of adjacent LED chips in the first LED chip group 221a, the second chip group 221b, and the third chip group 221c.

As shown in Figures 54A to 54N, in one embodiment, the number of LED chips in the first chip group 221a and the second chip group 221b is smaller than the number of LED chips in the third chip group 221c, and preferably, the number of LED chips in the first chip group 221a is equal to the number of LED chips in the second chip group 221b, and the number of LED chips in the second chip group 221b is smaller than the number of LED chips in the third chip group 221c. This makes the light distribution in the second chip area more uniform, and the area of the dark part can be reduced. In one embodiment, the pitch between adjacent LED chips in the second chip group 221b is larger than the pitch between adjacent LED chips in the first chip group 221a, and by increasing the pitch between adjacent LED chips in the second chip group, the mutual influence of heat by adjacent LED chips in the second chip area can be reduced. Preferably, each of the first chip group 221a and the third chip group 221c has two LED chips adjacent to one LED chip in the second chip group 221b. Between two adjacent LED chips in the first chip group 221a, there are center points _O1 , _O2 , ..., _On (n≧1), and between two adjacent LED chips in the third chip group 221c, there are center points _Q1 , _Q2 , ..., _Qm (m≧1), where n and m are both integers, the distance between _O1 and _Q1 is closer than the distance between _O1 and _Qm (m>1), and the connection line between center point _On and center point _Q2m-1 (n=m; n, m≧1; n and m are both integers) passes through at least one LED chip 2201 in the second chip group 221b. This increases the luminous flux of the LED lamp, and can avoid the generation of dark areas in the first chip area 2211 and the second chip area 2212, while reducing the mutual thermal influence of adjacent LED chips in the first LED chip group 221a, the second chip group 221b, and the third chip group 221c. In one embodiment, the photovoltaic module 2 further includes a connector terminal 24, which is electrically connected to an external power source (e.g., a commercial power source) for receiving an external power signal and transmitting the power signal to the LED lamp, and which is connected to an electronic element on the circuit board 201 via a conductor 241, and the connection point between the conductor 241 and the circuit board 201 is located on the first surface 2011 of the circuit board 201, and the connection point between the conductor 241 and the circuit board 201 is located between the first chip area 2211 and the second chip area 2212, thereby shortening the transmission distance of the power signal, reducing power loss, and stabilizing power. In one embodiment, at least one of the lines connecting one LED chip in first chip area 2211 and one LED chip 2201 in second chip area 2212 passes through an electrical connection point between conductive wire 241 and circuit board 201 (if there is more than one electrical connection point, the line passes through at least one of the electrical connection points). Since the electrical connection point is located on the line connecting one LED chip in the first chip area and one LED chip in the second chip area, it is possible to prevent the occurrence of dark spots or dark areas in the areas corresponding to the electrical connection points in the lamp cover due to light emitted from the first chip area and the second chip area.

The LED lamp includes sub-light sources 2203 and main light sources, and the number of main light sources may be greater than the number of sub-light sources. When the main light source does not emit light, the sub-light sources can emit light to provide illumination. For example, when sleeping at night, the main light source is turned off and the sub-light sources are turned on for a certain period of time, or the sub-light sources are selected by the user to provide a sense of security of light irradiation. The sub-light sources may include night-light beads and/or afterglow beads. In one embodiment, the sub-light source 2203 is located outside the second edge S2 of the first chip area 2211 or inside the fourth edge S4 of the second chip area 2212, or the sub-light source 2230 is located between the first chip area 2211 and the second chip area 2212. In some embodiments, a connection line between the electrical connection point between the conductive wire 241 and the circuit board 201 and the sub-light source 2203 passes through at least one LED chip 2201 of the first chip area 2211. In one embodiment, the shortest distance from the sub-light source 2203 to the first chip area 2211 is shorter than the distance from the sub-light source 2203 to the second chip area 2212, so that the light emission effect of the sub-light source 2203 emitted from the lamp cover can be improved. In one embodiment, the first chip area 2211 and/or the second chip area 2212 includes at least two different types of LED chips (LED chip a ₁ , LED chip a ₂ , LED chip a ₃ , ..., LED chip _an ; n represents the number of types of LED chips). The different LED chips (LED chip a ₁ , LED chip a ₂ , LED chip a ₃ , ..., LED chip _an ; n represents the number of types of LED chips, n is an integer) have, for example, different standard sizes, color temperatures, or luminous fluxes, but may also have different LED chip parameter indexes. In one embodiment, the first chip area 2211 includes LED chips _a1 , _a2 , and _a3 , and the second chip area 2212 includes LED chips _a1 and _a2 . Here, the total number of LED chips _a1 on the circuit board is greater than the total number of LED chips _a2 . For example, the LED chips _a1 are high color temperature LED chips, and the LED chips _a2 are low color temperature LED chips, and the high color temperature chip and the low color temperature chip are arranged to sufficiently mix light from the two types of color temperature chips. In addition, the ratio of the driving currents of the two types of color temperature chips may be adjusted to achieve adjustment of the overall color temperature. In one embodiment, the number of LED chips _a1 in the first chip area 2211 is less than the number of LED chips _a1 and/or LED chips _a2 in the second chip area 2212. In one embodiment, the number of LED chips _a1 in the first chip area 2211 and/or the second chip area 2212 is less than the number of LED chips _a2 on the circuit board 201. In one embodiment, the number of LED chips _a1 and/or LED chips _a2 is greater than the number of LED chips _a3 . The LED chips _a1 and _a2 in the embodiment may be the main light source described above, and the LED chip _a3 may be the sub-light source described above.

In some embodiments, the LED lamp includes at least one LED chip group (LED chip group _b1 , LED chip group _b2 , LED chip group _b3 , ..., LED chip group _bm ; m is an integer), each LED chip group includes at least one LED chip, and each LED chip group is located on the circuit board 201. In this embodiment, each LED chip group is located on the first surface of the circuit board 201, and the LED chips of the same LED chip group are located or approximately located on the same circumference (are provided around the opening of the circuit board 201). The LED chips of each LED chip group are located on different circumferences and are provided around the same or approximately the same central axis, which may be the central axis of the circuit board 201 or the central axis of the hook ceiling or adapter. Some power supply modules (e.g., the first power supply module) are located between adjacent LED chip groups in the radial direction of the circuit board 201. At least one LED chip group includes a main light source and a sub-light source. The luminous flux of the sub-light source when turned on may be 0.1% to 10% of the luminous flux of the main light source when turned on. When no light is emitted from the main light source, the sub-light source can emit light to provide illumination. For example, when sleeping at night, the main light source is turned off and the sub-light source is turned on for a certain period of time, or the sub-light source is selected by the user to provide a sense of security of light irradiation. The sub-light source may include night-light beads and/or afterglow beads. The number of the main light sources is greater than the number of the sub-light sources. The distance between adjacent main light sources is equal to or greater than the distance between adjacent main light sources and sub-light sources. In one embodiment, the central angle of the arc formed by adjacent main light sources is equal to or greater than the central angle of the arc formed by adjacent main light sources and sub-light sources. In some embodiments, the same chip group includes n LED chips, the central angle between adjacent LED chips or the average central angle a between adjacent LED chips is (360/n) degrees, the connecting line between the electrical connection point of the conductor 241 and the circuit board 201 and the center o of the circle is line La, the connecting line between the sub-light source and the center o of the circle is line Lb, and the included angle between line La and line Lb ranges from 0.3*a to 5*a. In some embodiments, the included angle between line La and line Lb ranges from [360/(n+3)] degrees to [360/(n-5)] degrees, the wiring distance from the sub-light source to the connector terminal is short, and the heat generated by the LED chip adjacent to the sub-light source has little effect on the sub-light source. In one embodiment, the LED lamp includes LED chip group _b1 , LED chip group _b2 , LED chip group _b3 , and LED chip group _b4 in order of decreasing radius, that is, LED chip group _b1 is closer to the opening 222 of the circuit board 201 than LED chip group _b2 , LED chip group _b3 , and LED chip group _b4 . In this embodiment, LED chip group _b1 includes a sub-light source, and the wiring distance from the sub-light source to the connector terminal 24 is short and the electrical resistance of the conductor is small, so that the power loss during operation is low and the signal transmission is stable. In another embodiment, LED chip group _b4 includes a sub-light source and is separated from the ceiling hook or adapter, so that the light generated when the sub-light source is turned on is not absorbed by the ceiling hook or adapter, and therefore the light loss is low.

As shown in Figures 53A to 53H, the light processing unit 202b includes a first light processing area 2a, a second light processing area 2b, and a third light processing area 2f, where the first light processing area 2a corresponds to the first chip area 2211, and the second light processing area 2b corresponds to a part of the power supply module, and in this embodiment, the second light processing area 2b corresponds to the first power supply module 231, and the third light processing area 2f corresponds to the second chip area 2212. The light processing unit 202b may be the above-mentioned light absorption area or lens unit. In this embodiment, the second chip area 2212 includes three LED chip groups, and sub-light processing areas may be provided corresponding to the respective LED chip groups 221a, 221b, and 221c. The light processing areas 2a and 2b are provided at the locations of the first insulating portion 202 corresponding to the first chip area 2211 and the first power supply module 231, respectively, and the third light processing area 2f includes sub-light processing areas 2c, 2d, and 2e, which correspond to the LED chip groups 221a, 221b, and 221c of the second chip area, respectively. The sub-light processing areas 2a, 2c, 2d, and 2e include a lens 202a provided opposite the LED chip 2201, and the light processing area 2b includes at least one left inclined portion 2b1 and at least one right inclined portion 2b2, and the left inclined portion 2b1 and the right inclined portion 2b2 are connected to each other, and when the left inclined portion 2b1 and the right inclined portion 2b2 are connected to each other, a V-shape or an inverted V-shape can be formed. When external light passes through the light processing area 2b, a part of the light is reflected by the left inclined portion 2b1 and the right inclined portion 2b2, thereby reducing the visibility of the first power supply module 231 and improving the appearance of the LED lamp. Meanwhile, after the light emitted from the LED chip adjacent to the first power supply module 231 is refracted by the lens 202a, a part of the light passes through the first insulating portion 202 via the left inclined portion 2b1 and the right inclined portion 2b2, thereby further reducing the dark area between the first chip area 2211 and the second chip area 2212. The light processing area 2b is provided with at least one extension 2b3 that contacts at least one left inclined portion 2b1 and at least one right inclined portion 2b2, and the circuit board 201 is provided with a through hole 201a that faces the extension 2b3. The extension 2b3 passes through the through hole 201a in the circuit board 201, thereby fixing the relative positions of the circuit board 201 and the first insulating portion 202 and preventing the circuit board 201 from rotating in the circumferential direction.

The base may have other different structures. In one embodiment, the diameter of the base 3 is longer than the diameter of the lamp cover 1, and a sub-light-emitting section is provided in an area of the base 3 located outside the lamp cover 1, thereby effectively widening the irradiation range of the lamp. In one embodiment, a pad is provided on the base 3, and multiple convex portions protrude from the surface of the pad, and the lamp cover 1 is provided with concave portions corresponding to the convex portions, and the depth of the concave portions is greater than the height at which the convex portions protrude from the surface of the pad. When the convex portions are assembled into the concave portions, the periphery of the lamp cover 1 is pressed against the pad, and the gap between them is eliminated, effectively preventing insects from entering the lamp cover. .

55 and 56 are structural schematic diagrams of an embodiment of the LED lamp of the present application. The LED lamp includes a lamp cover 1, a photoelectric module 2, and a base 3, and its basic structure is similar to the above embodiment, so it will not be described again here. This LED lamp differs from the above embodiment in that it employs the above photoelectric module 2b. The structure of the photoelectric module 2b refers to the above embodiment. As shown in Figs. 55 and 56, the LED lamp is located in a spatial Cartesian coordinate system (X, Y, Z) in which the Y axis is parallel to the central axis of the LED lamp. The LED lamp further includes a chassis 6 connected to the base 3. Since the light reflecting part 29 has an end point A located between the LED light source module 22 and the power supply module 23, and a vertex B which is the highest point in the Z-axis direction, the height of the light reflecting part 29 (or the distance from the vertex B to the end point A in the Z-axis direction) is z = (a ² + b ^{2 -} 2abcosα) ^1/2 * sinβ, where a is the linear distance from the LED chip 2201 to the end point A, b is the linear distance from the LED chip 2201 to the vertex B, α is the included angle between the line from the LED chip 2201 to the end point A and the line from the LED chip 2201 to the vertex B, α is smaller than the light emission angle of the LED chip 2201, i.e., 0 < α < 120°, and β is the included angle between the line AB (the connecting line between the end point A and the vertex B) and the X-axis direction. By setting a and β, the height of the light reflecting part can be adjusted to obtain an excellent light reflection effect and a suitable light distribution. In one embodiment, the light reflecting part 29 is raised in a direction away from the power module 23 (i.e., in the negative direction of the y-axis). This can increase the heat dissipation space of the power module, while completely covering the power module, playing an insulating role, and preventing electric shock. In one embodiment, the power module 23 can be fixed to the base 3 by adhesion or engagement. In one embodiment, as shown in FIG. 56, the base 3 may be provided with a groove 32, and the electronic elements (e.g., inductors, capacitors, etc.) in the power module 23 may be located in the groove 32, which can increase the heat dissipation space of the electronic elements, shorten the heat dissipation path, and lower the temperature of the power module.

The LED chip 2201 includes an LED lamp bead. As shown in FIG. 57, the light emitted from the LED lamp bead passes through four interfaces, namely, interface C, interface D, interface E and interface F. The interface C is the interface between the packaging layer of the LED lamp bead and air, the interface D is the interface between the air and the light emitting member, the interface E is the interface between the air and the lamp cover, and the interface F is the interface between the lamp cover and air. The refractive index of the packaging layer of the LED lamp bead is n1, the refractive index of the lamp cover is n2, and the refractive index of the air is n3. In order to improve the light utilization rate, the reflection is mainly reduced at the interfaces C, E and F, and the reflection is increased at the interface D. The reflection at the interfaces C, E and F will reduce the luminous flux of the LED lamp, so it is necessary to select the materials of the packaging layer of the LED lamp bead and the lamp cover. According to the relationship between reflectance and refractive index, when light is vertically incident on interfaces C and F, 1-(n1-1) ² /(n1+1) ^2- (n2-1) ² /(n2+1) ² >0.9 can be satisfied, and by selecting a material with an appropriate refractive index, the luminous flux of the LED lamp can be effectively increased.

In addition, since both n1 and n2 are larger than n3, total reflection occurs when the incident angle is larger than the critical angle. In order to reduce the reflection at the interface C and the interface E, a first refractive index matching layer and a second refractive index matching layer may be provided on the surface of the LED chip 2201 and the inner surface of the lamp cover, respectively. The refractive index of the first refractive index matching layer is n4=(n1*n3) ^1/2 , and the refractive index of the second refractive index matching layer is n5=(n2*n3) ^1/2 . In one embodiment, since n1 is in the range of 1.4 to 1.53, n4 is in the range of 1.18 to 1.24. In one embodiment, n2 is in the range of 1.5 to 1.7, and therefore n5 is in the range of 1.22 to 1.3, where 0.16≦n1−n4≦0.35, 0.18≦n4−n3≦0.24, 0.2≦n2−n5≦0.48, and 0.22≦n5−n1≦0.3. As can be seen from the above, the provision of the first refractive index matching layer and the second refractive index matching layer can effectively reduce light reflection and increase the light utilization rate.

The thickness d1 of the first refractive index matching layer and the thickness d2 of the second refractive index matching layer can offset the interference of reflected light and further reduce the reflection of light. Since n1>n4>n3, there is no half-wave loss. Since the wavelength range of visible light is 400-760 nm, it is necessary to increase the reflection of blue light and reduce the reflection of red light in order to reduce the damage to human eyes caused by blue light and improve the optical comfort of the human body. For the first refractive index matching layer, it can mainly increase the reflection of blue light, so the thickness d1 of the first refractive index matching layer=(2k+1)λ/[4*((n4 ² -n1 ² *sinα ² ) ^1/2 )] (k=0,1,2,3...), where α is the incident angle at which light enters the first refractive index matching layer from the package layer of the LED lamp bead, and λ is the wavelength of blue light.

For the second refractive index matching layer, the reflection of red light is mainly reduced, so the thickness of the second refractive index matching layer is d2=kλ/[2*(n5 ² -n2 ² *sinβ ² ) ^1/2 ] (k=1,2,3...), where β is the incident angle of the light from the lamp cover to the second refractive index matching layer, and λ is the wavelength of the red light. By setting the thicknesses of the above two layers, a suitable color temperature of the LED lamp can be obtained, and a warm and comfortable atmosphere can be created in the room.

In another embodiment, the first index matching layer may be configured to mainly reduce the reflection of red light, where d1=kλ/[2*(n4 ² -n1 ² *sinα ² ) ^1/2 ] (k=1,2,3...), where α is the angle of incidence of light from the package layer of the LED lamp bead to the first index matching layer, and λ is the wavelength of the red light. The second index matching layer may be configured to mainly increase the reflection of blue light, where d2=(2k+1)λ/[4*((n5 ² -n2 ² *sinβ ² ) ^1/2 )] (k=0,1,2,3...), where β is the angle of incidence of light from the lamp cover to the second index matching layer, and λ is the wavelength of the blue light.

In one embodiment, the outer surface of the lamp cover 1 may be provided with a multilayer optical film. In the direction of light propagation from the lamp cover 1 to the air, the refractive index of the multilayer optical film is _nH , _nL , _nH , _nL , ..., _nH , in that order, where H represents a high refractive index film and L represents a low refractive index film. In another embodiment, in the direction of light propagation from the lamp cover 1 to the air, the optical thickness of the multilayer optical film is 0.5λ1, 0.25λ2, 0.5λ1, 0.25λ2, ..., 0.5λ1, respectively, where λ1 is the wavelength of blue light and λ2 is the wavelength of red light. Due to the wide wavelength range of visible light, the single-layer optical film cannot achieve a good transmittance improvement effect or reflectance improvement effect. By adopting the multilayer optical film, it is possible to improve the transmittance or increase the reflectance of light of various wavelengths according to the requirements of the color rendering and color temperature of the lamp, and obtain an excellent light emission effect.

The LED lamp of the present application may be provided with several other structures. In one embodiment, the LED lamp is provided with an auxiliary light source for improving the brightness of the space by emitting light obliquely upward and radiating it to the ceiling. In one embodiment, the height (h) and width (w) of the lamp satisfy the relational expression 4≦d/h≦9. This makes it possible to realize a lighting fixture that can obtain illumination light having a desired brightness and light distribution as a ceiling light, and can reduce deep indentations caused by the fixture body. In one embodiment, the lamp cover 1 and the base 3 are connected by an engagement member, and a pesticide holding layer containing an insect repellent is provided in the connection gap between the two to effectively prevent insects from entering the inside of the lamp. In one embodiment, a backlight light source is provided at a position perpendicular to the circuit board 201, and the number of LED chips of the backlight light source on the side away from the base 3 is greater than the number of LED chips of the backlight light source on the side closer to the base 3, so that the illuminance of the light-emitting surface can be made uniform.

The lamp in the embodiment of the present invention can realize an answering function in addition to a normal lighting function. Specifically, it mainly includes the following three functions. The first function is that when the resident goes out for a certain period of time, usually more than one day, and uses the lamp to light up the house, the lamp simulates the resident's usual lamp usage during this period, giving the outside the impression that the resident is at home. This function helps thieves to mistakenly think that there is someone in the house and give up stealing because they are scared. The second function is to provide information to the outside, for example, the resident or a designated other person, when a suspicious person breaks into the house when the resident is absent. The third function is to monitor the resident, determine whether there is an abnormality in the body based on the resident's physical condition, and provide information to the designated other person. In order to realize the above functions, it may be realized by a remote control of the lamp, or man-machine interaction may be realized by providing buttons, a display, a touch panel, etc. on the lamp body, or it may be operated by an application of a smart device such as a smartphone or a tablet computer. The invention of the embodiment of the present invention will be specifically described below.

Figure 58 is a schematic diagram of the main components of a lamp according to an embodiment of the present invention. As shown in Figure 58, in addition to a normal light-emitting element 1111 and a first power supply module 1112 for supplying power thereto, the LED lamp includes a processing module 1113, a light sensor 1114, an infrared sensor 1115, a communication module 1116, and a second power supply module 1117 for supplying power to these four components.

The light emitting element 1111 may be, for example, a light emitting diode (LED) array such as the light source module 22 in this application, or an element such as an incandescent light bulb or a fluorescent tube. Accordingly, the first power supply module 1112 may include a corresponding circuit for converting a 220V commercial power source into a form applicable to the light emitting element. For example, in the case of an LED array, the first power supply module 1112 includes a corresponding rectifier circuit, and in the case of an incandescent light bulb, the first power supply module 1112 is mainly composed of components for electrical connection such as wires and connecting devices.

The processing module 1113 mainly includes a processor that realizes logical processing of information from the light sensor 1114, the infrared sensor 1115, and the communication module 1116, and other auxiliary circuits and elements. The light sensor 1114 is mainly used to sense the intensity of the ambient light, and the processor determines whether the light needs to be turned on. The infrared sensor 1115 senses the physical condition of the occupant by obtaining an infrared sensing image of the environment. The communication module 1116 can perform two-way communication with the outside via a wireless communication network, such as a wireless or wired local area network and/or a 3G/4G/5G network, and is also used to communicate with the above remote control at the same time.

The second power supply module 1117 may include a conversion circuit such as a rectifier filter and a battery. When the commercial power supply is normal, the conversion circuit supplies power to the processing module 1113, the light sensor 1114, the infrared sensor 1115, and the communication module 1116 from the commercial power supply. When an abnormality occurs in the commercial power supply or power supply is not possible, power is supplied from a battery. Note that when the light emitting element 1111 is an LED array, power can be supplied from the battery.

In the following, an invention for realizing the above-mentioned first function in an embodiment of the present invention will first be described. When the resident goes out, the lamp can be set to "home alone mode". In the home alone mode, the lamp operates to simulate the resident being at home under the control of the processing module 1113. If the ambient light illumination intensity is sufficiently dark, for example, the preset value of the first light intensity is 100 lx, and the current time is not a preset break time, the light is turned on. When the break time arrives, the light is turned off, or is operated at a low illumination brightness level for a certain period of time and then turned off.

Then, do not turn on the lights for a preset fairly long period of time, for example 6-8 hours. This period is a rest period. Or, turn on the lights briefly once or several times in a preset manner during the rest period to simulate the user getting up in the middle of the night to go to the bathroom. They may be turned on at random times or at preset times. The period may be a preset period or a random period less than a preset value.

Depending on the season, lighting may or may not be needed after waking up in the morning. To this end, the processing module 1113 determines whether lighting is needed after the rest period ends based on the ambient light illumination intensity, or what time in the morning to turn on based on the current date. If lighting is needed, it will be turned off when the ambient light illumination is strong enough, e.g., greater than the preset value of the second light intensity. The preset value of the second light intensity here must be greater than the preset value of the first light intensity described above.

After the resident returns, the above-mentioned answering mode can be ended by performing any operation on the lamp.

The following describes an invention for realizing the second function in an embodiment of the present invention. This function is designed for cases of trespassing, and if it is detected that someone has moved within the rest period but has not operated the lamp, it is deemed that someone has trespassed. The user turns on this function before going out, realizing the monitoring function, i.e., entering the monitoring mode.

In the monitoring mode, the processing module 1113 monitors the infrared signals from the infrared sensor 1115, which are typically infrared sensing images. The infrared sensor 1115 can provide these images to the processing module at a certain sampling frequency. If a heat source area is present in the image, it is determined to be an intruder, and the processing module 1113 then controls the communication module 1116 to transmit information to the outside. Specifically, the information may be transmitted to the resident or another designated person, such as a contact person provided by the resident, or a real estate management company for a housing complex, a police station, etc. Therefore, when the answering mode is turned on, it is desirable to also turn on the monitoring mode at the same time.

When the resident returns home, he or she can end the monitoring mode. At this time, the resident can end the monitoring mode by performing any operation on the lamp. Also, at this time, if multiple lamps are all in monitoring mode, the resident can end the monitoring mode of some or all of the lamps. Since the resident himself or herself becomes a heat source during the period when the resident has just returned to the room and has not yet ended the monitoring mode, the lamp will also send information to the outside at this time. Therefore, a certain delay time, for example about 30 seconds, can be set so that the resident ends the monitoring mode of the lamp in this room before deciding to send information to the outside. In other words, the resident can set a room in which he or she is not present to monitoring mode.

In the case of pets (mainly warm-blooded animals such as cats, dogs, rabbits, birds, etc.), the infrared sensing image includes the heat source area even when the resident is not at home. In this case, the processing module 1113 needs to perform a filtering operation on the image, and for this purpose, the height and/or width of the heat source shape in the image, i.e., the size condition, can be set according to the body shape characteristics of the pet in the house. If a heat source in the image simultaneously meets this size condition, the heat source area in the image is ignored and then the image is judged. For example, by setting both the height and width to small values, interference by cats, small dogs, rabbits, birds, etc. can be eliminated. Also, for the body shape of a large dog, the width can be set to be significantly larger than the height.

Below, an invention for realizing the above-mentioned third function in an embodiment of the present invention will be described. This function can be realized by an infrared sensor, and the state of people in the house is judged mainly by the infrared sensing image provided by the infrared sensor 1115. If a person has not moved for a long period of time, this indicates that an abnormality may have occurred, and in this case, information should be sent to the outside, for example, to the relatives of the person in the house. Therefore, this function is called a monitoring mode.

The monitoring area is the area in the room that can be covered by the infrared sensor 1115. Taking into account the difference in the time people spend in sub-areas such as the floor area, sofa area, table area, and bed area, the range of the above areas can be set and a preset value for the duration can be set for each sub-area. These settings are stored as monitoring setting information. When judging the image, the time that the heat source area in the image and the above sub-areas overlap and remain stationary is checked, and if the respective preset values are exceeded, information is transmitted. A threshold value can be set for the overlap here, and for example, overlap is recognized when the ratio of the overlap area to the heat source area reaches a set value.

Several check setting information can be stored to check whether people in the house go to bed or wake up on time. Specifically, the bedtime and/or wake-up time can be set as the check time, and a delay time can be preset. If the heat source area in the image does not overlap with the bed area during the preset delay time after the bedtime, it indicates that the person in the house has not gone to bed on time, and in this case, information can be sent to the outside. If the heat source area in the image still overlaps with the bed area during the preset delay time after the wake-up time, it indicates that the person in the house has not woken up on time, and in this case, information can also be sent to the outside.

This function can also be used to alert people when they fall in the house for various reasons and are unable to get up. Specifically, several settings (herein called fall settings) can be made, mainly including the setting of the fall area, the fall time, and the fall target. The fall area is generally a ground area that avoids places where people can lie down, such as sofas and heads. The setting of the fall target refers to setting according to the difference in posture when a person is standing and when they fall (in the heat source area, this generally appears in the change in height and width of the heat source area). Therefore, it is possible to set the height and width of the shape of the heat source area, or to set the relationship between the size of the two, such as setting the height to half the width. This setting is made taking into consideration that if the height of the heat source area is less than half the width, it is considered that a person has fallen. Since the viewing angle of the lamp varies depending on the position, the relationship between the height and width here also needs to take the position of the lamp into account. In addition, the influence of pets can be eliminated by setting the size of the heat source area as described above.

The heat source area in the image is judged according to the above settings. If it is located in the floor area and its shape matches the fall target, i.e., the size of the shape is within the range of the size of the fall target, for example, its height is less than half the width, and the elapsed time from the time such an image is received reaches the preset value of the duration mentioned above, it is determined that a person in the house has fallen to the floor and is unable to get up, and at that time, the information should be transmitted to the outside.

The third function can also be realized by a visual sensing function. That is, a camera is used instead of (or in addition to) the infrared sensor 1115, and the environmental image collected by the camera is analyzed by the processing module 1113. In such an analysis, the state of a specific object in the environment can be determined by techniques such as pattern recognition. This method can not only more accurately recognize the state of a person's posture indoors, but also realize human gesture recognition. In a specific application, the environmental image is collected by the camera, and then identified by the processing module 1113. If it is determined that the environmental image contains an image of a human body, the posture of the human body is determined. The determination here refers to a determination of several preset conditions, such as whether the human body has fallen, and can be analyzed by adopting pattern recognition. If the posture of the human body meets the preset condition, information is sent to the outside.

In a method that employs a camera to collect images, gesture recognition can also be performed on images of the human body. In this case, specific information corresponding to a specific gesture made by a person can be transmitted to the outside.

The lamp in the embodiment of the present invention may be a ceiling light, a desk lamp, a floor lamp, a wall lamp, etc. In a house with multiple rooms, the multiple lamps are connected to the same local area network, and the multiple lamps may be set together or individually. When there are multiple lamps in the same room, one of them can be designated as a main lamp, and information can be transmitted from that lamp to the outside. When setting the mode for multiple lamps, they may be set in a linked manner or separately. For example, when the answering mode of a lamp is started or ended, the answering mode of all other lamps can be started or ended. When the monitoring mode or watching mode of a lamp is started or ended, the other lamps may be left unaffected or may be linked, i.e., start or end the mode at the same time. The lamps may be divided into groups, and the lamps in the same group may be set in a linked manner, and the lamps in different groups may not be set in a linked manner.

According to an embodiment of the present invention, the lamp is equipped with a light sensor, an infrared sensor, and a communication module, and by using an appropriate program, it can realize functions such as simulating the presence of people in the house, detecting intruders, and watching over the household members, expanding the uses of the lamp and increasing safety in every aspect of the home.

The features of the various embodiments of the present application described above can be combined and transformed in any way without being inconsistent with each other, and are not limited to one particular embodiment. For example, the embodiment shown in FIG. 46 does not describe these features as described in the embodiment shown in FIG. 18, but it can also include the features described in the embodiment of FIG. 18. It is clear to a person skilled in the art that these features can be applied to FIG. 46 without inventive step based on the description of FIG. 18. Also, for example, although various inventions are described in the present application using LED ceiling lights as examples, it is clear that any of these designs can be applied to other shapes or types of lamps without inventive step, and will not be listed here.

Each embodiment of the lamp cover, photoelectric module, base and LED lamp using them in this application is realized as described above. Please note that the features described in each embodiment above, such as the "lamp cover", "circuit board", "insulation unit", "LED chip arrangement method", "base", etc., may include one, two, multiple or all of the technical features without contradicting each other. The corresponding related content may be selected from those including one or a combination of the technical features in the corresponding embodiment.

Although the present application has been disclosed as a preferred embodiment above, those skilled in the art can understand that this embodiment is merely for the purpose of illustrating the present application and should not be construed as limiting the scope of the present application. Please note that all modifications and replacements equivalent to this embodiment are intended to be included within the scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope limited by the appended claims.

Claims (4)

The photovoltaic module includes a lamp cover and a base connected to the lamp cover, and a first accommodating space formed by the lamp cover and the base is provided with a photovoltaic module including a circuit board, the circuit board has a first surface and a second surface opposite to each other, a first chip area and a second chip area are provided on the first surface of the circuit board, and a distance from the first chip area to the base is shorter than a distance from the second chip area to the base,
the first chip area and the second chip area include at least one LED chip;
the second chip area includes a first LED chip group, a second LED chip group, and a third LED chip group, the first LED chip group, the second LED chip group, and the third LED chip group being located on different circumferences, respectively;
between two adjacent LED chips in the first LED chip group, there are center points O1 _, O2 _, ..., On ₍ where n > 1), between two adjacent LED chips in the third LED chip group, there are center points Q1 _, Q2 _, ..., Qm ₍ where m > 1), where n and m are both integers, and when m > 1, the distance between _O1 and Q1 _is closer than the distance between _O1 and Qm _,
When n=m, n, m≧1, and n and m are all integers, the connecting line between the center point O _2n−1 and the center point Q _3m−2 passes through at least one LED chip in the second LED chip group.
An LED lamp characterized by: 2. The LED lamp according to claim 1, wherein a distance between adjacent LED chips in the first chip area is closer than a distance between adjacent LED chips in the second chip area. 3. The LED lamp of claim 2, wherein the number of LED chips in the second LED chip group is less than the number of LED chips in the first LED chip group, and the number of LED chips in the first LED chip group is less than the number of LED chips in the third LED chip group. The LED lamp of claim 2, characterized in that the photovoltaic module further includes a power supply module, and a portion of the power supply module is located between the first chip area and the second chip area.