JP7684239B2 - Laser Processing Equipment - Google Patents

Description

The present invention relates to a laser processing device.

Conventionally, a laser processing device has been disclosed that realizes trepanning processing that improves both processing throughput and processing quality by providing a scanner that performs a positioning operation for a specified processing position on a printed circuit board and a scanner that performs a trepanning operation that traces the outline of a via hole separately (see Patent Document 1).

More specifically, when performing trepanning, the laser processing device described in Patent Document 1 positions the galvanometer scanner that performs the positioning operation so that the irradiation position of the processing beam coincides with the center coordinates of the processing hole, and controls the galvanometer scanner that performs the trepanning operation so that the laser beam constantly and repeatedly traces the trepanning trajectory.

JP 2007-237242 A

However, when trepanning multiple via holes with the laser processing device described in Patent Document 1, it is necessary to perform a positioning operation using the galvanometer scanner each time a hole is processed. If the positioning operation takes a long time, the processing speed cannot be increased, and the processing efficiency decreases.

Therefore, the present invention aims to provide a laser processing device with high processing efficiency.

One aspect of the present invention is a laser processing apparatus comprising: a laser oscillator; a first deflection means capable of deflecting a laser beam emitted from the laser oscillator; a second deflection means arranged in series with the first deflection means on the optical path of the laser beam and capable of deflecting the laser beam; and a control unit for controlling the first deflection means and the second deflection means, wherein the first deflection means has a faster response speed than the second deflection means, and when a first coordinate is made to coincide with the center of the scanning range of the first deflection means, when machining a plurality of machining holes whose center coordinates are located within the scanning range of the first deflection means, the control unit sets the first coordinate to the center of gravity position coordinate of the center coordinates of the plurality of machining holes and sets the target coordinate of the second deflection means to the first coordinate, and in this state, the laser beam is scanned by the first deflection means to machine the plurality of machining holes.
One aspect of the present invention is a laser processing apparatus comprising: a laser oscillator; a first deflection means capable of deflecting a laser beam emitted from the laser oscillator; a second deflection means arranged in series with the first deflection means on the optical path of the laser beam and capable of deflecting the laser beam; and a control unit for controlling the first deflection means and the second deflection means, wherein the first deflection means has a faster response speed than the second deflection means, and the control unit, when a first coordinate and the center of the scanning range of the first deflection means are made to coincide with each other, when machining a plurality of machining holes whose center coordinates are located within the scanning range of the first deflection means, sets the first coordinate to the coordinate of the midpoint between the center coordinate of the machining hole whose center coordinate is closest to the origin position and the center coordinate of the machining hole whose center coordinate is farthest from the origin position among the plurality of machining holes, and sets the target coordinate of the second deflection means to the first coordinate, and in this state, scans the laser beam using the first deflection means to machine the plurality of machining holes.

The present invention provides a laser processing device with high processing efficiency.

1 is a schematic diagram of a laser processing apparatus according to an embodiment of the present invention. 1A is a diagram showing a processing path of the trepanning process of a comparative example, FIG. 1B is an enlarged view of FIG. 1A, and FIG. 1C is a diagram showing a processing path of the trepanning process of the present embodiment. FIG. 1 is an explanatory diagram for explaining AOD trepanning processing. 4A is a timing chart of the trepanning process of a comparative example, and FIG. 4B is a timing chart of the trepanning process of the present embodiment. 13 is a flowchart of a grouping process. FIG. 13 is a diagram showing command values after grouping processing.

The laser processing device according to the embodiment of the present invention will be described below with reference to the drawings. Note that in the following description, the X-axis direction and the Y-axis direction are based on the state when the processing object is viewed in a plan view.

<General configuration of laser processing device>
As shown in FIG. 1, the laser processing apparatus 1 according to this embodiment is a laser processing apparatus that performs hole drilling on a printed circuit board W as a processing object placed on a processing table that is movable in the XY axis directions, and in addition to the processing table described above, it is equipped with a laser oscillator 2, a first positioning mechanism 3, a second positioning mechanism 5, a focusing (Fθ) lens 6, a control unit 7, etc.

The laser oscillator 2 is, for example, an ultraviolet (UV) laser or a carbon dioxide (CO ₂ ) laser oscillator, and the generated laser beam is emitted from the laser oscillator 2 as a laser pulse.

The first positioning mechanism 3 is a deflection means (first deflection means) that includes a pair of acousto-optic elements 31, 32 (Acousto-Optics Deflectors, hereinafter referred to as AODs) and that deflects the laser beam emitted from the laser oscillator 2 by these AODs 31, 32 to position the irradiation position. The first AOD 31 and the second AOD 32 are arranged in series on the optical path, and the first AOD 31 is configured to be able to deflect the laser beam in the X-axis direction on the processing surface of the printed circuit board W. The second AOD 32 is configured to be able to deflect the laser beam in the Y-axis direction on the processing surface of the printed circuit board W.

The second positioning mechanism 5 is disposed in series downstream of the first positioning mechanism 3, and is a deflection means (second deflection means) that deflects the laser pulse that has passed through the first positioning mechanism 3 by a pair of galvanometer scanners 51, 52. The first galvanometer scanner 51 is configured to be able to deflect the laser beam in the X-axis direction on the processing surface of the printed circuit board W. The second galvanometer scanner 52 is configured to be able to deflect the laser beam in the Y-axis direction on the processing surface of the printed circuit board W.

Furthermore, since the response speed of an AOD is about 100 times faster than that of a galvanometer scanner, the first positioning mechanism 3 has a faster response speed than the second positioning mechanism 5. In addition, the scanning range of the laser beam of a pair of AODs is generally a square with sides of 200 to 600 μm on the surface to be processed, whereas a galvanometer scanner has a larger scanning range in comparison. For this reason, the first positioning mechanism 3 has a narrower scanning range of the laser beam than the second positioning mechanism 5.

The laser beam emitted from the laser oscillator 2 is deflected by the first positioning mechanism 3 and the second positioning mechanism 5, and the irradiation position in the X- and Y-axis directions on the printed circuit board W is positioned. Specifically, the sum of the displacement by the first AOD 31 and the displacement by the first galvano scanner 51 is the displacement in the X-axis direction of the laser pulse on the processing surface of the printed circuit board W. In addition, the sum of the displacement by the second AOD 32 and the displacement by the second galvano scanner 52 is the displacement in the Y-axis direction of the laser pulse on the processing surface of the printed circuit board W.

The control unit 7 that controls the laser processing device 1 includes a positioning control unit 71, a first AOD control unit 72, a first driver 74, a second AOD control unit 73, a second driver 75, a first scanner control unit 76, a second scanner control unit 77, and the like. The positioning control unit 71 is configured to read the processing program P and generate and output command values for the first positioning mechanism 3 and the second positioning mechanism 5 based on the read processing program P. Specifically, the positioning control unit 71 outputs an X-axis command value Xa to the first AOD control unit 72 and outputs a Y-axis command value Ya to the second AOD control unit 73. It also outputs an X-axis command value Xs to the first scanner control unit 76 and outputs a Y-axis command value Ys to the second scanner control unit 77.

The first AOD control unit 72 and the second AOD control unit output AOD drive signals to the first AOD 31 and the second AOD 32 via the first and second drivers 74 and 75 based on the command values Xa and Ya. The first scanner control unit 76 and the second scanner control units 76 and 77 control the rotation angles of the mirrors of the first galvano scanner 51 and the second galvano scanner 52 based on the command values Xs and Ys.

In addition, the positioning control unit 71 also functions as a laser oscillation control unit, outputting a shot signal to the laser oscillator 2 to command the oscillation and attenuation of the laser beam, and controlling the intensity and pulse width of the laser pulse emitted from the laser oscillator 2.

When the laser processing device 1 irradiates a laser pulse to a printed circuit board W to perform hole drilling, the positioning control unit 71 reads the processing program P and performs hole drilling according to the loaded processing program P. The processing program P describes a list of the center coordinates of each hole to be processed. The positioning control unit 71 sequentially reads the center coordinates of the holes from the list of center coordinates of the holes, analyzes the coordinates, creates command values (target coordinates) Xa, Ya, Xs, Ys for the galvanometer scanners 51, 52 and AODs 31, 32, and transmits them to the respective control units 72, 73, 76, 77. Each control unit 72, 73, 76, 77 controls the AODs 31, 32 of the first positioning mechanism 3 and the galvanometer scanners 51, 52 of the second positioning mechanism 5 based on the command values (target coordinates) Xa, Ya, Xs, Ys.

When the laser irradiation position is determined, a shot signal is output from the positioning control unit 71, and the laser oscillator 2 emits a laser pulse with a laser intensity and pulse width according to the shot signal. The laser pulse emitted from the laser oscillator 2 is sequentially incident on the first positioning mechanism 3 and the second positioning mechanism 5, deflected in the XY axis direction by the AODs 31 and 32 and the galvano scanners 51 and 52, and then incident on the focusing lens 6. The light is then focused at a predetermined position on the printed circuit board W, and holes are drilled in the printed circuit board W.

The above-mentioned positioning control unit 71, AOD control units 72, 73, drivers 74, 75, and scanner control units 76, 77 may each be realized as a function (process) of the control program of the laser processing device 1, or may be realized as an independent circuit. For this reason, the control unit 7 includes at least one memory unit in which the above-mentioned control program is stored, and at least one CPU (calculation unit) that executes the control program.

<Drilling process control>
Next, the hole drilling control in this embodiment will be described by taking as an example a case where multiple holes are drilled by trepanning, which is a processing method in which a laser beam is irradiated in pulses multiple times on a concentric circle to drill holes having a diameter equal to or larger than the spot diameter of the laser beam.

In more detail, when performing trepanning, the laser beam positioning mechanism performs a positioning (PTP; point-to-point) operation to position the irradiation position of the laser beam, and then performs a trajectory tracking (CP; continuous path) operation to move the irradiation position of the laser beam to match the shape of the hole to be machined. Then, one hole is trepanned by emitting the pulsed laser multiple times during this CP operation (hereinafter, this operation is called the trepanning operation). When multiple holes are trepanned, the PTP and CP operations are repeated to trepan each hole.

Figure 2(a) shows the machining path of the trepanning process in the comparative example. The black dots in Figure 2(a) show the command values (target coordinates) of the galvanometer scanners 51 and 52, the circles show the trepanned machining holes, and the arrows show the movement of the galvanometer scanners 51 and 52. The pitch between the machining holes is 100 [μm], and the machining hole diameter is 30 [μm].

In this comparative example, the PTP operation employs an algorithm (program) that sets the center coordinates of each machined hole as the target coordinates. The PTP operation is performed by the galvanometer scanners 51 and 52 of the second positioning mechanism 5, and the CP operation is performed by the AODs 31 and 32 of the first positioning mechanism 3. For this reason, as shown in FIG. 2(b), in this comparative example, the command values Xs and Ys of the galvanometer scanners 51 and 52 in the PTP operation are the center coordinates of the machined hole.

That is, when the positioning control unit 71 reads the processing program P, the positioning control unit 71 generates one command value Xs, Ys for the galvano scanners 51, 52 for each of the center coordinates of the processed hole described in the processing program P. Then, after the PTP operation is performed based on the generated command values Xs, Ys, the trepanning operation is performed by the AODs 31, 32 and the laser oscillator 2. In FIG. 2(a), 32 holes are trepanned, so in this case, the movement operation (PTP operation) of the galvano scanners 51, 52 and the trepanning operation are repeated 32 times (i.e., the same number as the number of holes to be processed) to process multiple holes. Note that one command value Xa, Ya for the AODs 31, 32 is also generated for each center coordinate of the processed hole, but in this comparative example, the PTP operation is performed only by the galvano scanners 51, 52, so the command values Xa, Ya are always (0, 0).

However, unlike the PTP operation performed by the galvano scanners 51 and 52, the trepanning operation is performed by the AODs 31 and 32 and the laser oscillator 2. As described above, the response speed of the AODs 31 and 32 is about 100 times faster than that of the galvano scanners 51 and 52, and is comparable to the laser oscillation period. Therefore, as shown in FIG. 3, when the laser beam diameter is 10 [μm] and the processing pitch is 5 [μm] in both the radial and circumferential directions, 20 shots of the laser beam are required to trepan a hole with an outer diameter of 30 [μm], but when the oscillation frequency of the laser oscillator 2 is 500 [kHz], trepanning is possible in 40 [μs], which is the minimum time calculated from the shot period.

The time required for the above trepanning process can be calculated as follows. That is, when the oscillation frequency is 500 kHz, the time required to emit one shot of the laser beam is 1/500 kHz = 2 μs. Therefore, it can be calculated as 2 μs x 20 shots = 40 μs. In the case of trepanning using a galvano scanner, such high-speed trepanning cannot be achieved due to the limitations of the response characteristics of the galvano scanner.

Figure 4(a) is a timing chart of the trepanning process in the above comparative example. Given the current positioning speed performance of the galvanometer scanners, the time Ta required for the PTP operation of the galvanometer scanners 51 and 52 in this comparative example is a minimum of 300 [μs] and a maximum of 400 [μs]. Therefore, the time required to machine one hole, including the PTP operation, is 340 to 440 [μs], including the 40 [μs] required for the above trepanning process.

The above results show that the time Ta required for the PTP operation is the bottleneck in the time required to machine one hole. When the time required for the trepanning process is clearly longer than the time Ta required for the PTP operation, the time Ta required for the PTP operation does not pose a problem, but in the comparative example, combined with the need to perform the PTP operation the same number of times as the number of holes to be machined, the positioning time by the galvano scanners 51 and 52 limits the machining speed.

For this reason, in this embodiment, the positioning control unit 71 functions as a command value grouping processing calculation unit and executes command value grouping processing, thereby reducing the number of positioning operations of the galvanometer scanners 51 and 52 compared to the comparative example described above.

Specifically, as shown in FIG. 5, when the positioning control unit 71 receives the machining program P (step S1 in FIG. 5), it first initializes the machining hole number (step S2). Then, if the machining program P describes the machining hole center coordinates (Yes in step S3), it reads the first machining hole center coordinates (X1, Y1) in the described machining hole center coordinate list (step S4).

After reading the machining hole center coordinates (X1, Y1), the positioning control unit 71 then reads the next machining hole center coordinates (X2, Y2) in the machining hole center coordinate list (steps S5, Yes in S6, S7), and calculates the center of gravity coordinates (Xc, Yc) of the coordinate group of the machining hole center coordinates (X1, Y1) and the machining hole center coordinates (X2, Y2) (step S8).

Once the center coordinates (Xc, Yc) are found, the stroke (ΔXk, ΔYk) is calculated, which is the deviation from the center coordinates (Xc, Yc) to the center coordinates of the machined holes of the coordinate group. It is then determined whether the calculated stroke (ΔXk, ΔYk) is within the stroke range (scanning range) of AODs 31 and 32, starting with the center coordinates of the machined holes that were read in first (No in steps S10 to S13).

If the stroke (ΔXk, ΔYk) from the center coordinate (Xc, Yc) to any of the center coordinates of the machined hole in the coordinate group is within the stroke range of the AODs 31 and 32 (|ΔXk|≦AODxmax and |ΔYk|≦AODymax) (Yes in step S13), the next center coordinate of the machined hole in the list of center coordinates of the machined hole is read and added to the above coordinate group (Yes in steps S6, S7), and the value of the center coordinate (Xc, Yc) is updated (step S8). Note that AODymax and AODymax are the maximum displacements on one side in the X-axis and Y-axis directions from the center of the scanning range (AOD scan area) of the AODs 31 and 32, respectively.

Then, the process of updating the center coordinates (Xc, Yc) (steps S6 to S14) is repeated until the stroke (ΔXk, ΔYk) from the center coordinates (Xc, Yc) to the center coordinates of the machined hole falls outside the stroke range of AODs 31 and 32 (No in step S11).

When the stroke (ΔXk, ΔYk) from the center coordinate (Xc, Yc) to the center coordinate of the machined hole falls outside the stroke range of AOD 31, 32 (No in step S11), the positioning control unit 71 stops the update process of the center coordinate (Xc, Yc) (step S15), and the center coordinates of the machined hole that were read up to the center coordinate of the machined hole that falls outside the stroke range of AOD 31, 32 are grouped together (step S16).

Then, the barycentric coordinates (Xc, Yc) of the center coordinates of the machined holes in the group are set as the command values Xs, Ys of the galvanometer scanners 51, 52, and the strokes (ΔXk, ΔYk) from the barycentric coordinates (Xc, Yc) to the center coordinates of each machined hole are set as the command values Xa, Ya of the AODs 31, 32. The set of the command values Xs, Ys of the galvanometer scanners 51, 52 and the command values Xa, Ya of the AODs 31, 32 is set as a grouping command value (step S17).

Then, the positioning control unit 71 repeatedly executes the above-mentioned grouping process (steps S18, S3 to S18) until the last machining hole center coordinate in the machining hole center coordinate list of the machining program P is grouped, and when all machining hole center coordinates in the machining hole center coordinate list have been grouped (No in step S6), the grouping process ends.

When the AOD scan area is 200 μm square on each side, if a hole similar to that in the comparative example is machined using the method of this embodiment, the command values (Xak, Yak) (k = 1, 2, ...) of the four AODs 31, 32 are grouped in pairs for the command values (Xsi, Ysi) (i = 1, 2, ...) of one galvano scanner 51, 52, as shown in Figure 6. Note that when grouping is performed, multiple AOD commands Xa, Ya are sent to the AOD control units 72, 73, so the receiving AOD control units 72, 73 are equipped with hardware and software interfaces so that they can perform AOD trepanning processing according to the multiple commands.

When grouping processing is performed in this manner, the PHP operation from the center of gravity coordinates (Xc, Yc) to the center coordinates of each machined hole is performed by the AODs 31 and 32, which is faster than performing the PHP operation using only the galvanometer scanners 51 and 52. In addition, since the command values of the galvanometer scanners 51 and 52 are calculated so that as many machined holes as possible are included in the scan area of the AODs 31 and 32, for example, as shown in FIG. 2(c), the PHP operation of the galvanometer scanners 51 and 52 only needs to be performed once for every four holes machined, and the frequency of the PHP operation by the galvanometer scanners 51 and 52 can be reduced. For example, in the comparative example, the PHP operation by the galvanometer scanners 51 and 52 had to be performed 32 times, but in the method of this embodiment, the PHP operation by the galvanometer scanners 51 and 52 only needs to be performed eight times.

As shown in FIG. 4(b), the time Tb required for one PHP operation by the galvano scanners 51 and 52 is longer than the time Ta required for the PTP operation of the galvano scanners 51 and 52 in the comparative example (Tb≧Ta, where Tb is also about 300 to 400 μs), but since the number of positioning operations by the galvano scanners 51 and 52 can be significantly reduced as described above, the processing time can be significantly reduced compared to the comparative example.

That is, since the AODs 31 and 32 move between holes in the same group at high speed, the time required to trepan four holes consecutively can be considered to be 40 [μs] x 4 = 160 [μs]. Even if the time Tb required for the PHP operation by the galvano scanners 51 and 52 is considered to be the worst value of 400 [μs], the processing time for four holes is 560 [μs]. Converting this to the processing time per hole, it is 560 [μs] / 4 = 140 [μs], which is a significant reduction in processing time compared to the comparative example of 340 to 400 [μs]. In particular, considering the recent trend toward smaller diameter and higher density holes in printed circuit boards, the higher the density of the holes to be processed, the greater the above processing time reduction effect.

As described above, in this embodiment, instead of creating one command value for the galvanometer scanners 51, 52 and the AODs 31, 32 from one center coordinate of the machining hole as in the comparative example, the machining holes within the range that can be positioned by the AODs 31, 32 are grouped together, one galvanometer scanner command value is created for this group, and for each machining hole in the group, a command value for the AODs 31, 32 is created from the difference between the center coordinate of the machining hole and the galvanometer scanner command value, and trepanning is performed using the AODs 31, 32, including the movement between the machining holes. When the machining holes are densely packed, a group containing multiple machining holes can be created, so multiple holes can be machined with one positioning of the galvanometer scanner. As a result, when executed through a machining program, the number of movements of the galvanometer scanner is reduced, and the machining speed can be improved.

In this embodiment, the center of gravity coordinates (Xc, Yc) are used in the grouping process, but this is not limited to this, and it is possible to use a representative point calculated from multiple other machined holes. For example, the midpoint of the maximum and minimum coordinates in the group may be used. In other words, when the maximum and minimum values of the X coordinate in the group are Xmax and Xmin, and the maximum and minimum values of the Y coordinate are Ymax and Ymin, respectively, the midpoint coordinates of the maximum and minimum values (Xc', Yc') = ((Xmax + Xmin) / 2, (Ymax + Ymin) / 2) may be used instead of the center of gravity coordinates (Xc, Yc), and the stroke range may be checked and grouped according to the processing flow shown in FIG. 5. The formula to be used for calculating the representative point may be determined based on the ease of calculation, calculation speed, or requirements related to the processing speed and machined hole quality, and any formula may be used.

<Summary>
The laser processing apparatus (1) according to the present embodiment is
A laser oscillator (2);
a first deflection means (3) capable of deflecting a laser beam emitted from the laser oscillator (2);
a second deflection means (5) arranged in series with the first deflection means (3) on an optical path of the laser beam and capable of deflecting the laser beam;
a control unit (7) that controls the first deflection means (3) and the second deflection means (5),
The first deflection means (3) has a faster response speed than the second deflection means (5),
The control unit (7)
When the first coordinates and the center of the scanning range of the second deflection means (5) are made to coincide with each other, in order to machine a plurality of holes whose center coordinates are located within the scanning range of the second deflection means (5),
a target coordinate of the second deflection means (5) is set to the first coordinate, and in this state, the laser beam is scanned by the first deflection means (3) to machine the plurality of holes;
The laser processing device is characterized by the above.

For this reason, in this embodiment, for example, as shown in FIG. 2(c), for machining holes whose center coordinates are located within the scan area (scanning range) of the AODs 31 and 32, the laser beam can be scanned and machined by the first deflection means (3) with a fast response speed. At the same time, it is possible to reduce the number of PTP operations by the second deflection means (5) with a relatively slow response speed, thereby increasing the machining speed and improving the machining efficiency of the laser machining device (1).

the plurality of machining holes is a first group of machining holes,
When the first coordinate and the center of the scanning range of the second deflection means are made to coincide with each other, the center coordinates are located outside the scanning range of the second deflection means (5), and when the center of the scanning range of the second deflection means (5) is made to coincide with a second coordinate different from the first coordinate, a plurality of machining holes whose center coordinates are located within the scanning range of the second deflection means (5) are set as a second group of machining holes, and the plurality of machining holes of the second group are machined after the plurality of machining holes of the first group,
The control unit (7)
A target coordinate of the second deflection means (5) is set to the first coordinate, and in this state, the laser beam is scanned by the first deflection means to machine a plurality of holes of the first group;
Thereafter, the target coordinates of the second deflection means (5) are set to the second coordinates, and in this state, the laser beam is scanned by the first deflection means (3) to machine the second group of holes.

In this way, for holes within the scanning range of the first deflection means (3) centered on the first coordinates and the second coordinates, the first deflection means (3) scans and drills the holes, so the number of PTP operations by the second deflection means (5) can be reduced.

The control unit (7) scans the laser beam using the first deflection means (3) to trepan each of the multiple machining holes.

In this way, by performing the trepanning operation using the first deflection means (3) with its high response speed, the time required for the trepanning process can be shortened.

The first coordinates are the center of gravity coordinates of the center coordinates of the multiple machined holes.

By setting the first coordinate or the second coordinate as the center of gravity of the central coordinates of the machined holes in the group, the first coordinate or the second coordinate is located in an area with a large number of holes, so that it is possible to use the center of the scanning range of the first deflection means (3), which requires relatively little correction, and to improve the machining accuracy of the machined holes.

The first coordinate is the coordinate of the midpoint between the center coordinate of the machined hole whose center coordinate is closest to the origin position and the center coordinate of the machined hole whose center coordinate is farthest from the origin position.

The first deflection means (3) is a deflection means that deflects the laser beam by a pair of AODs (31, 32),
The second deflection means (5) is a deflection means for deflecting the laser beam by a pair of galvanometer mirrors (51, 52).

In the above embodiment, a deflection means equipped with an AOD is used as the first positioning mechanism 3, but it may also be configured with, for example, a laser positioning mechanism using a piezo-driven mirror, a galvanometer scanner, etc. Also, for machining hole patterns with particularly narrow pitches, the machining speed can be improved by introducing the above-mentioned grouping process not only in trepanning but also in punching.

2: Laser oscillator 3: First deflection means (first positioning mechanism)
5: Second deflection means (second positioning mechanism)
7: Control unit

Claims (5)

A laser oscillator;
a first deflection means capable of deflecting a laser beam emitted from the laser oscillator;
a second deflection means arranged in series with the first deflection means on an optical path of the laser beam and capable of deflecting the laser beam;
a control unit that controls the first deflection means and the second deflection means,
the first deflection means has a faster response speed than the second deflection means;
The control unit is
When a first coordinate and a center of a scanning range of the first deflection means are aligned with each other, in order to machine a plurality of holes whose center coordinates are located within the scanning range of the first deflection means,
the first coordinates are set as coordinates of a center of gravity of central coordinates of the plurality of holes, and target coordinates of the second deflection means are set to the first coordinates, and in this state, the laser beam is scanned by the first deflection means to machine the plurality of holes;
A laser processing device characterized by: A laser oscillator;
a first deflection means capable of deflecting a laser beam emitted from the laser oscillator;
a second deflection means arranged in series with the first deflection means on an optical path of the laser beam and capable of deflecting the laser beam;
a control unit that controls the first deflection means and the second deflection means,
the first deflection means has a faster response speed than the second deflection means;
The control unit is
When a first coordinate and a center of a scanning range of the first deflection means are aligned with each other, in order to machine a plurality of holes whose center coordinates are located within the scanning range of the first deflection means,
the first coordinates are set as coordinates of a midpoint between the center coordinates of a hole whose center coordinates are closest to an origin position and the center coordinates of a hole whose center coordinates are farthest from the origin position among the plurality of holes, and the target coordinates of the second deflection means are set to the first coordinates, and in this state, the laser beam is scanned by the first deflection means to machine the plurality of holes;
A laser processing device characterized by: the plurality of machining holes is a first group of machining holes,
When a plurality of processed holes different from the first group of processed holes are set as the second group of processed holes, the central coordinates of each processed hole are outside the scanning range of the first deflection means when the center of the scanning range of the first deflection means is at the first coordinates, and the central coordinates of each processed hole are included within the scanning range of the first deflection means when the center of the scanning range of the first deflection means is at second coordinates different from the first coordinates ,
The control unit is
setting target coordinates of the second deflection means to the first coordinates, and in this state, scanning the laser beam by the first deflection means to machine a plurality of holes of the first group;
Thereafter, the target coordinates of the second deflection means are set to the second coordinates, and in this state, the laser beam is scanned by the first deflection means to machine the plurality of holes in the second group.
3. The laser processing apparatus according to claim 1 or 2 . The control unit scans the laser beam using the first deflection means to trepan each of the plurality of processing holes.
4. The laser processing apparatus according to claim 1 , wherein the laser processing apparatus is a laser processing apparatus having a plurality of laser beams . the first deflection means is a deflection means that deflects the laser beam by a pair of AODs,
the second deflection means is a deflection means that deflects the laser beam by a pair of galvanometer mirrors;
5. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is a laser processing apparatus having a laser beam.

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