JP7684678B2 - Adhesive application method - Google Patents

Description

The present invention relates to a method for applying an adhesive.

Traditionally, surface components such as tiles and protective materials have been attached and integrated with adhesives to impart design and durability to structural components such as exterior wall materials, interior materials, and floor surfaces of architectural structures.

For example, Patent Document 1 discloses a method for forming a tiled surface by attaching multiple tiles with a three-dimensional surface pattern to the surface of a structural body, and an adhesive is used to attach the tiles to the surface of the structural body.

Japanese Unexamined Patent Publication No. 1983-133245

On the other hand, in recent years, from the viewpoint of reducing the cost and construction period of architectural structures, instead of attaching surface materials such as tiles to the structural surface of an architectural structure (structural frame) at the construction site, surface materials such as tiles are attached and laid in advance using adhesive to base materials such as exterior and interior wall materials and floor materials that make up the floor surface in a factory, etc., and the base materials with the surface materials laid are then transported to the construction site and installed on the architectural structure.

When attaching a surface member to a substrate using an adhesive, the adhesive is applied to the substrate using a coating roll, brush or spray, and the surface member is placed on the adhesive, and the surface member is attached and integrated onto the substrate via the adhesive.

However, there are problems with this method, such as the difficulty in applying the adhesive to a uniform thickness onto the substrate, and the time required to apply the adhesive onto the substrate.

The present invention provides a method for applying an adhesive that can apply the adhesive to a substrate in a short period of time with a substantially uniform thickness.

The adhesive coating method of the present invention comprises the steps of:
a jig disposing step of disposing a mesh-like jig on the base material, the mesh jig having a frame body and a mesh member made of wires stretched within the frame body, the mesh member having an opening ratio of 40 to 90%;
an adhesive supplying step of supplying a liquid adhesive onto the substrate within the frame of the mesh-shaped jig;
and removing the mesh jig from the base material.

The adhesive application method of the present invention involves placing a specified mesh-like jig on the substrate and supplying liquid adhesive to the inside of the frame of this mesh-like jig, which allows the liquid adhesive to be accurately supplied to the desired location on the substrate and generally prevents the liquid adhesive from adhering to locations other than the desired location on the substrate.

The amount of liquid adhesive supplied onto the substrate can be determined using the mesh member of the mesh jig as a guide, allowing a precise amount of liquid adhesive to be supplied onto the substrate, and liquid adhesive can be applied to the substrate with a precise thickness.

The liquid adhesive can be applied to the substrate by the simple task of placing a mesh jig on the substrate and then supplying the liquid adhesive into the frame of the mesh jig, so the liquid adhesive can be applied to the substrate easily and in a short time to the desired thickness, regardless of the skill of the worker.

FIG. 2 is a perspective view showing a mesh-like jig and a substrate used in the adhesive coating method. FIG. 11 is a cross-sectional view showing a state of a jig installation process. FIG. 4 is a cross-sectional view showing a state of an adhesive supplying step. FIG. 2 is a cross-sectional view showing a state in which an adhesive layer is formed on a substrate. FIG. 2 is a cross-sectional view showing a state in which a surface member is bonded and integrated onto a substrate.

The adhesive application method of the present invention will be described with reference to the drawings. In the adhesive application method, first, a mesh-shaped jig is arranged on a substrate (jig arrangement process), the mesh jig having a frame and a mesh member made of wire stretched within the frame, the mesh member having an opening ratio of 40 to 90%.

The substrate 1 is placed on any surface so that the coating surface 11 onto which the adhesive is applied is roughly horizontal, and is adjusted so that the liquid adhesive supplied onto the coating surface 11 does not flow excessively and leak out of the substrate 1.

The substrate to which the adhesive is applied by the adhesive application method is not particularly limited as long as it is an object to which the adhesive can be applied, and examples include wall members that form the walls of architectural structures, floor finishing materials, and floor underlayment materials.

Examples of wall components include exterior wall components, interior wall components, and ceiling components. Examples of exterior wall components include mortar boards, concrete boards, ceramic siding boards, metal siding boards, ALC boards, metal plates, and sashes.

Floor finishing materials include, for example, wood-based materials such as plywood and medium density fiberboard (MDF), tiles, polyvinyl chloride sheets, and stone.

Examples of materials that make up the floor underlayment include plywood, particle board, wooden joists, gypsum board, slate boards, and concrete boards.

Next, a mesh-like jig 2 is placed on the coating surface 11 of the substrate 1. As shown in FIG. 1, the mesh-like jig 2 has a frame 21 with a flat rectangular shape and a constant thickness, and a mesh member 22 stretched within this frame 21. Note that, although FIG. 1 shows the frame 21 formed in a flat rectangular shape, it may be formed to match the shape of the substrate 1, and may be a polygonal shape such as a flat circular shape, a flat elliptical shape, a flat triangular shape, or a flat pentagonal shape.

The mesh member 22 is formed by assembling wires 22a vertically and horizontally at a predetermined interval, and between the wires 22a, a countless number of openings 22b are formed that penetrate in the vertical direction, and the liquid adhesive can be supplied through these openings 22b onto the coating surface 11 of the substrate 1. The method of forming the mesh member 22 is not particularly limited, and examples include a plain weave shape.

The diameter of the wire 22a constituting the mesh member 22 is preferably 0.1 to 1.0 mm, more preferably 0.15 to 0.7 mm, and more preferably 0.20 to 0.60 mm. When the diameter of the wire 22a is 0.1 mm or more, the shape retention of the mesh member 22 is improved, and when the mesh-shaped jig 2 is placed on the substrate 1, the mesh member 22 of the mesh-shaped jig 2 can be stably received on the substrate 1 without being deformed as a whole, and an accurate amount of liquid adhesive can be supplied onto the substrate 1, and an adhesive layer having a desired thickness can be applied and formed on the substrate 1. When the diameter of the wire 22a is 0.6 mm or less, the fluidity of the liquid adhesive in the frame 21 of the mesh-shaped jig 2 is not hindered, and the liquid adhesive can be smoothly flowed and diffused in the frame 21, and the liquid adhesive can be uniformly filled in the frame 21. The diameter of the wire 22a refers to the diameter of the smallest circle that can enclose the cross section of the wire along a plane perpendicular to the length direction.

The opening rate of the mesh member 22 is adjusted to 40-90%, and by adjusting the opening rate of the mesh member 22 to 40-90%, the liquid adhesive can be caused to flow appropriately on the substrate after the jig removal process described below, and the liquid adhesive can be applied in an even state onto the substrate 1. This allows the surface member to be bonded and integrated onto the substrate by the liquid adhesive, and the liquid adhesive can be applied accurately to desired locations on the substrate 1.

By making the opening ratio of the mesh member 22 of the mesh jig 2 40% or more, the liquid adhesive supplied into the frame 21 of the mesh jig 2 can flow and spread smoothly within the frame 21 despite the presence of the wire material that constitutes the mesh member 22. Even after the jig removal process, the liquid adhesive supplied onto the base material can flow smoothly to form an adhesive layer with a smooth surface, and the surface member can be bonded and integrated onto the base material by the liquid adhesive.

By setting the opening rate of the mesh member 22 of the mesh-shaped jig 2 to 90% or less, an adhesive layer with a smooth surface and desired thickness can be formed on the substrate after the jig removal process, and the surface member can be bonded and integrated onto the substrate with the liquid adhesive.

The opening ratio (%) of the mesh member 22 refers to a value calculated based on the area _S1 of the mesh member as viewed from a plane and the total area _S2 of the wires as viewed from a plane, according to the following formula (1).
Opening ratio of mesh member (%)=100×(S ₁ −S ₂ )/S ₁

As shown in FIG. 2, the mesh jig 2 configured as described above is placed on the coated surface 11 of the substrate 1. The mesh jig 2 is placed on the coated surface 11 of the substrate 1 with the lower surface 21a of its frame 21 in contact with the coated surface 11 of the substrate 1 all around, and is adjusted so that the liquid adhesive supplied into the frame 21 does not leak out of the frame 21.

In addition, when the mesh jig 2 is placed on the coated surface 11 of the substrate 1, the underside of the central portion of the mesh member 22 of the mesh jig 2 when viewed from above is in a state of abutting against the coated surface 11 of the substrate 1. By abutting the underside of the central portion of the mesh member 22 of the mesh jig 2 on the coated surface 11 of the substrate, the mesh member 22 is supported on the coated surface 11 of the substrate 1, and the entire mesh member 22 of the mesh jig 2 can be accurately disposed on the coated surface 11 of the substrate 1, making it possible to supply an accurate amount of liquid adhesive onto the substrate 1.

Next, liquid adhesive is supplied into the frame 21 of the mesh jig 2 (adhesive supplying process). The liquid adhesive supplied into the frame 21 of the mesh jig 2 flows and diffuses inside the frame 21 through the openings 22b of the mesh member 22 and the gaps formed between the opposing surfaces of the mesh member 22 and the substrate 1, and is uniformly filled throughout the frame 21. Because the opening ratio of the mesh member 22 of the mesh jig 2 is adjusted to 40-90%, the liquid adhesive supplied into the frame 21 can flow smoothly inside the frame 21 despite the presence of the wire material that constitutes the mesh member 22 of the mesh jig 2, and the frame 21 is filled with the liquid adhesive without any gaps.

The amount of liquid adhesive supplied into the frame 21 of the mesh jig 2 is adjusted so that the upper surface 31 of the liquid adhesive 3 supplied into the frame 21 of the mesh jig 2 roughly matches the upper end surface of the mesh member 22 of the mesh jig 2, as shown in FIG. 3. The mesh member 22 is mesh-shaped, so it is stretched with some flexure within the frame 21. Therefore, the upper end surface of the mesh member 22 fluctuates slightly up and down when viewed as a whole. Therefore, it is preferable to adjust the upper surface 31 of the liquid adhesive 3 supplied into the frame 21 of the mesh jig 2 so that it roughly matches the upper end surface of the wire 22a located at the top of the mesh member 22 of the mesh jig 2.

When the liquid adhesive 3 supplied inside the frame body 21 of the mesh-shaped jig 2 is spread and filled inside the frame body 21, a smoothing tool such as a spatula may be used to actively spread the liquid adhesive 3 supplied inside the frame body 21.

In this way, the amount of liquid adhesive 3 supplied into the frame 21 of the mesh jig 2 can be easily adjusted so that it roughly matches the upper end surface of the mesh member 22 of the mesh jig 2. By previously adjusting the height of the upper end surface of the mesh member 22 of the mesh jig 2 according to the thickness of the adhesive layer 4 to be formed on the substrate 1, the desired amount of liquid adhesive can be accurately supplied onto the substrate 1, and an adhesive layer 4 having the desired thickness can be easily and accurately formed on the substrate 1.

The liquid adhesive 3 only needs to be liquid in the atmosphere in which it is supplied into the frame 21 of the mesh jig 2, and it only needs to have fluidity when it is supplied into the frame 21 of the mesh jig 2.

The viscosity of the liquid adhesive 3 at 10 rpm at 25°C according to JIS K6833 is preferably 10 Pa·s or more, more preferably 20 Pa·s or more, and more preferably 30 Pa·s or more. The viscosity of the liquid adhesive 3 at 10 rpm at 25°C according to JIS K6833 is preferably 100 Pa·s or less, more preferably 90 Pa·s or less, and more preferably 70 Pa·s or less. If the viscosity of the liquid adhesive 3 is 10 Pa·s or more, after the jig removal process, the liquid adhesive is prevented from flowing and diffusing beyond the intended adhesive coating area on the substrate due to excessive flow of the liquid adhesive, and an adhesive layer can be accurately formed in the desired area on the substrate. If the viscosity of the liquid adhesive 3 is 100 Pa·s or less, the liquid adhesive flows with good fluidity after the jig removal process, smoothly filling the spaces where the wires of the mesh member were located, forming an adhesive layer with a flat surface on the substrate, and the surface member can be firmly bonded and integrated onto the substrate by the liquid adhesive.

The viscosity of the liquid adhesive is measured in accordance with JIS K6833 using a BS type viscometer and rotor No. 5 at 25°C, 50% relative humidity, and 10 rpm.

The liquid adhesive is not particularly limited, and examples include liquid adhesives containing polyoxyalkylene polymers having hydrolyzable silyl groups, epoxy adhesives, and urethane adhesives.

A preferred example of the polyoxyalkylene polymer having a hydrolyzable silyl group is a polymer whose main chain contains a repeating unit represented by the general formula: -(R ¹ -O)n- (wherein R ¹ represents an alkylene group having 1 to 14 carbon atoms, and n is a positive integer representing the number of repeating units). The main chain skeleton of the polyalkylene oxide (A) may be composed of only one type of repeating unit, or may be composed of two or more types of repeating units.

Examples of the main chain skeleton of polyoxyalkylene polymers include polyethylene oxide, polypropylene oxide, polybutylene oxide, polytetramethylene oxide, polyethylene oxide-polypropylene oxide copolymer, and polypropylene oxide-polybutylene oxide copolymer.

Hydrolyzable silyl groups include, for example, silicon-containing groups that have a hydrolyzable group bonded to a silicon atom, and groups such as silanol groups that undergo a condensation reaction in the presence of moisture or a crosslinking agent, and if necessary, using a catalyst. Note that a silanol group is a functional group (≡Si-OH) in which a hydroxyl group (-OH) is directly bonded to a silicon atom.

Examples of hydrolyzable silyl groups include monoalkoxysilyl groups such as methoxysilyl, ethoxysilyl, dimethylmethoxysilyl, and dimethylethoxysilyl groups, dialkoxysilyl groups such as dimethoxysilyl, methyldimethoxysilyl, and methyldiethoxysilyl groups, trialkoxysilyl groups such as trimethoxysilyl and triethoxysilyl groups, and halogenated silyl groups to which halogen is bonded, such as trichlorosilyl groups.

The viscosity of the liquid adhesive may be adjusted by a known method. Examples of methods for adjusting the viscosity of the liquid adhesive include (1) adjusting the viscosity of the liquid adhesive by adding inorganic fine particles to the liquid adhesive, and (2) adjusting the viscosity of the liquid adhesive by adjusting the number average molecular weight of the polymer that constitutes the liquid adhesive.

In the above method (1), the viscosity of the liquid adhesive can be increased by adding inorganic fine particles with a small average particle size (for example, an average particle size of 0.1 μm or less). The viscosity of the liquid adhesive can be decreased by adding inorganic fine particles with a large average particle size (for example, an average particle size of 0.5 to 1.0 μm).

The average particle size of the inorganic microparticles is a value measured using a laser diffraction/scattering type particle size analyzer. For example, inorganic microparticles are put into methanol so that the concentration is 10% by mass, and then ultrasonic waves are irradiated for 10 minutes at an output of 1 kW using an ultrasonic homogenizer to obtain a suspension. The volumetric particle size distribution of the inorganic microparticles in this suspension is measured using a laser diffraction/scattering type particle size analyzer (for example, Shimadzu Corporation's product name "SACD-2100"), and the cumulative 50% value of this volumetric particle size distribution is taken as the average particle size of the inorganic microparticles.

Examples of inorganic fine particles include calcium carbonate, magnesium carbonate, calcium oxide, hydrated silicic acid, anhydrous silicic acid, finely powdered silica, calcium silicate, titanium dioxide, clay, talc, carbon black, and glass balloons.

In the above method (2), the viscosity of the liquid adhesive can be increased by increasing the number average molecular weight of the polymer that constitutes the liquid adhesive. The viscosity of the liquid adhesive can be decreased by decreasing the number average molecular weight of the polymer that constitutes the liquid adhesive.

Next, the mesh jig 2 is removed from the substrate 1 (jig removal process). The mesh jig 2 placed on the substrate 1 is lifted upward to remove it from the substrate 1.

When the mesh jig 2 on the substrate 1 is removed from the substrate 1, the liquid adhesive is not filled in the area where the wire 22a of the mesh member 22 of the mesh jig 2 was located, leaving a void. However, since the liquid adhesive has a predetermined viscosity and excellent fluidity, the liquid adhesive smoothly flows into the void formed by the wire 22a, filling the void, and an adhesive layer 4 with a flat surface (top surface) and no voids is formed on the substrate 1 (see Figure 4).

The adhesive layer 4 formed on the substrate 1 is formed after the liquid adhesive 3 flows into the above-mentioned gap, and the liquid adhesive 3 also flows onto the substrate 1 on which the frame 21 of the mesh jig 2 is placed, so that the thickness is thinner than the thickness of the liquid adhesive 3 supplied into the frame 21 when the mesh jig 2 is placed on the substrate 1. Therefore, it is necessary to form in advance the height of the upper end surface of the mesh member 22 of the mesh jig 2 slightly higher than the thickness of the adhesive layer 4 to be formed on the coating surface 11 of the substrate 1.

In this way, the adhesive application method uses a mesh-like jig 2 equipped with a mesh member having a predetermined opening ratio, making it possible to easily and accurately form an adhesive layer 4 having a desired thickness on the coating surface 11 of the substrate 1.

As shown in FIG. 5, a surface member such as a tile or decorative sheet is placed on the adhesive layer 4 formed on the coated surface 11 of the substrate 1, and the adhesive layer 4 is cured as necessary to bond and integrate the surface member 5 onto the substrate 1 via the adhesive layer 4 or the cured product of the adhesive layer.

As described above, the adhesive layer 4 formed on the substrate 1 has a smooth surface, which increases the contact area between the surface member 5 and the adhesive layer 4, and the surface member 5 can be firmly bonded and integrated onto the substrate 1 via the adhesive layer 4 or the cured product of the adhesive layer.

The following examples further illustrate aspects of the present invention, but the present invention is not limited to these examples.

The compounds used in the examples and comparative examples are listed below.

- Polyoxyalkylene polymer having a hydrolyzable silyl group (polyoxyalkylene polymer, Kaneka Corporation, product name "MS Polymer S-303")
Epoxy resin (product name "Epicoat 828" manufactured by Japan Epoxy Resins Co., Ltd.)
Ketimine compound (manufactured by Nitto Kasei Co., Ltd., product name "Eponit K-100")
- Curing catalyst (organotin, product name "Neostan U-130" manufactured by Nitto Kasei Co., Ltd.)
・ Dehydrating agent (manufactured by Nippon Unika Co., Ltd., product name "NUC Silicone A171")
Epoxy silane coupling agent (glycidoxytrimethoxysilane, product name "KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.)
Antioxidant (pentaerythrityl-tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate])
Colloidal calcium carbonate (manufactured by Shiraishi Kogyo Co., Ltd., product name "CCR", average particle size: 0.12 μm)
Heavy calcium carbonate (manufactured by Shiraishi Calcium Co., Ltd., product name "Whiten SB", average particle size: 0.68 μm)

[Preparation of Liquid Adhesives A to E]
A polyoxyalkylene polymer having a predetermined amount of hydrolyzable silyl group shown in Table 1, an epoxy resin, a ketimine compound, a curing catalyst, a dehydrating agent, an epoxy silane coupling agent, an antioxidant, colloidal calcium carbonate, and heavy calcium carbonate were kneaded for 60 minutes in a vacuum atmosphere using a planetary mixer to obtain a one-component liquid adhesive. Note that liquid adhesives A to E were liquid and had fluidity in the atmosphere in which the adhesive supplying step described below was performed. For each liquid adhesive, the viscosity at 10 rpm at 25°C in accordance with JIS K6833 was measured in the manner described above, and is shown in the "10 rpm viscosity" column in Table 1.

[Mesh-like jig]
Mesh-like jigs A to F were prepared. The diameter of the wire material constituting the mesh-like jigs and the opening ratio of the mesh member for the mesh-like jigs A to F are shown in Table 2. The mesh-like jigs A to E were provided with a flat rectangular frame body 21 having a constant height of 10 mm and a flat lower end surface, and a mesh member 22 stretched over the entire inside of the frame body 21 and formed by weaving metal wire material having a diameter of 0.25 to 0.5 mm in a plain weave pattern. The lower end surface of the mesh member 22 (the lower end surface of the wire material 22a) and the lower end surface of the frame body 21 were located on the same plane. The thickness of the frame member constituting each side of the frame body 21 was 10 mm. The frame body was formed into a flat rectangular frame shape with an overall (outer shape) of 1515 mm in length and 910 mm in width.

[Examples 1 to 11, Comparative Examples 1 to 4]
A ceramic siding board was prepared as the substrate 1. The siding board was formed into a flat rectangular shape with a length of 1515 mm and a width of 910 mm. Both sides of the siding board were formed into flat surfaces. The substrate 1 was placed on a placement surface so that its upper surface was horizontal.

The mesh-like jig 2 was placed on the upper surface (coated surface 11) of the substrate 1 (jig placement process). The outer peripheral edge of the substrate 1 and the outer peripheral edge of the frame 21 of the mesh-like jig 2 were aligned, and the entire lower end surface of the frame 21 of the mesh-like jig 2 was in contact with the coated surface 11 of the substrate 1. In addition, the lower end surface of the mesh member 22 of the mesh-like jig 2 was in contact with the coated surface 11 of the substrate 1.

Next, liquid adhesive 3 was supplied into the frame 21 of the mesh jig 2 (adhesive supplying process). The liquid adhesive 3 supplied into the frame 21 of the mesh jig 2 flowed and diffused inside the frame 21 through the openings 22b of the mesh member 22 and the gaps formed between the opposing surfaces of the mesh member 22 and the substrate 1, and was filled entirely inside the frame 21.

The amount of liquid adhesive supplied to the frame 21 of the mesh jig 2 was adjusted so that the upper surface 31 of the liquid adhesive 3 supplied to the frame 21 of the mesh jig 2 approximately coincides with the upper end surface of the mesh member 22 of the mesh jig 2, as shown in FIG. 3.

Then, the mesh jig 2 placed on the substrate 1 was lifted upward to remove it from the substrate 1 (jig removal step), and the substrate was left for 30 seconds. The liquid adhesive smoothly flowed into the voids formed by the wires 22a, filling the voids and forming an adhesive layer 4 on the substrate 1 (see FIG. 4). The thickness of the adhesive layer 4 was measured at 10 random locations, and the arithmetic mean value (average thickness) and standard deviation of the thicknesses at the 10 locations were calculated.

Then, as shown in Figure 5, 20 ceramic tiles (length: 4.5 cm, width: 25 cm, thickness: 1 cm) were placed on the adhesive layer 4 formed on the coated surface 11 of the substrate 1 and left for 120 seconds.

Of the 20 ceramic tiles placed on the adhesive layer 4, 10 ceramic tiles were peeled off from the adhesive layer 4. For the rear surfaces of the peeled 10 ceramic tiles, the ratio of the total area S4 to which the adhesive was attached to the total area _S3 of the ₁₀ ceramic tiles (adhesive attachment rate) was calculated based on the following formula.
Adhesive adhesion rate (%) = 100 x _S4 / _S3

The adhesive layer 4 on the substrate 1 was then cured for 28 days in an atmosphere of 23°C and 50% relative humidity to harden the adhesive layer 4. The ceramic tile was bonded and integrated onto the substrate 1 via the hardened adhesive layer.

The flat tensile strength of each ceramic tile was measured in accordance with JIS A5557, and the arithmetic mean of the flat tensile strength of each ceramic tile was taken as the "adhesive strength."

1 Base material
11 Coating surface 2 Mesh-shaped jig
21 Frame
21a Bottom side
22 Mesh material
22a wire rod
22b Opening 3 Liquid adhesive 4 Adhesive layer 5 Surface member

Claims (4)

a jig disposing step of disposing a mesh-like jig on the base material, the mesh jig having a frame body and a mesh member made of wires stretched within the frame body, the mesh member having an opening ratio of 40 to 90%;
an adhesive supplying step of supplying a liquid adhesive onto the base material within the frame of the mesh jig up to an upper end of the wire material constituting the mesh member of the mesh jig, thereby filling the frame with the liquid adhesive without leaving any gaps ;
a jig removal step of removing the mesh-like jig from the substrate , and flowing the liquid adhesive into voids formed in the portion of the mesh member of the mesh-like jig where the wire was located, thereby filling the voids and forming an adhesive layer having a flat surface on the substrate . a jig disposing step of disposing a mesh-like jig on the base material, the mesh jig having a frame body and a mesh member made of wires stretched within the frame body, the mesh member having an opening ratio of 40 to 90%;
an adhesive supplying step of supplying a liquid adhesive onto the substrate within the frame of the mesh-shaped jig;
a jig removing step of removing the mesh jig from the base material ;
The method for applying an adhesive , wherein the liquid adhesive contains a polymer having a hydrolyzable silyl group . 3. The method for applying an adhesive according to claim 1, wherein the liquid adhesive has a viscosity of 10 to 100 Pa·s at 25° C. and 10 rpm in accordance with JIS K6833. 2. The method for applying an adhesive according to claim 1 , wherein the liquid adhesive contains a polymer having a hydrolyzable silyl group.

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