JP7685403B2 - Component mounter and electronic component mounting method - Google Patents

Description

This specification relates to a component mounter that mounts electronic components and a method for mounting electronic components. In particular, it relates to a technology for mounting electronic components in cavities provided in a sheet.

Some component mounting machines that mount electronic components adsorb electronic components to a nozzle and move them from the electronic component supply position to the mounting position. In this type of component mounting machine, the electronic components adsorbed to the nozzle must be separated from the nozzle at the mounting position. For this reason, technology has been developed to ensure that electronic components are separated from the nozzle. For example, Patent Document 1 discloses a method of applying ultrasonic vibrations to an electronic component while it is in contact with paste applied to the mounting position in order to separate the electronic component from the nozzle. In Patent Document 1, ultrasonic vibrations are applied to the electronic component while it is in contact with the paste, so that the adhesive force of the electronic component to the paste is greater than the adsorption force of the electronic component to the nozzle. This separates the electronic component from the nozzle.

JP 2002-158495 A

The method disclosed in Patent Document 1 uses the adhesive force of the electronic component to the paste and ultrasonic vibration to separate the electronic component from the nozzle. However, to use this method, paste must be applied to the mounting position. Electronic components are sometimes mounted in cavities provided in a sheet, and in this case paste may not be applied to the mounting position (i.e., inside the cavity). For this reason, the method disclosed in Patent Document 1 cannot separate the electronic component from the nozzle.

This specification discloses a technique for optimally mounting electronic components in cavities provided in a sheet.

The first component mounter disclosed in this specification mounts electronic components in cavities provided in a sheet. The component mounter includes a nozzle that picks up electronic components, a moving device that allows the nozzle to move between a supply position and a mounting position for the electronic components, and a control device that controls the moving device and moves the nozzle so that the electronic component is pressed against the inner wall of the cavity while the electronic component is positioned within the cavity when the electronic component picked up by the nozzle is moved away from the nozzle.

The second component mounting machine disclosed in this specification mounts electronic components in cavities provided in a sheet. The component mounting machine includes a nozzle having an end surface for adsorbing electronic components and a communication passage communicating with the end surface, a moving device for moving the nozzle between a supply position and a mounting position for electronic components, a negative pressure generating device for creating a negative pressure in the communication passage, an air supplying device for supplying air into the communication passage, and a control device for controlling the moving device, the negative pressure generating device, and the air supplying device to stop generating negative pressure in the communication passage and supply air at a first flow rate into the communication passage so as to eliminate the negative pressure in the communication passage when the electronic component is located in the cavity, and to supply air at a second flow rate smaller than the first flow rate into the communication passage when the electronic component is located in the cavity, when the electronic component adsorbed to the nozzle is separated from the nozzle.

In the first and second component mounting machines described above, when an electronic component that has been attracted to the nozzle is separated from the nozzle, the movement of the nozzle after the electronic component is positioned in the cavity and the negative pressure in the communication passage provided in the nozzle are suitably controlled. This makes it possible to mount an electronic component in a cavity provided in a sheet even if, for example, a paste or the like has not been applied to the mounting position.

The mounting method disclosed in this specification is a method for mounting an electronic component in a cavity provided in a sheet. The mounting method includes a suction step of suctioning the electronic component with a nozzle, a movement step of positioning the electronic component suctioned to the nozzle in the cavity, and a pressing step of pressing the electronic component against the inner wall of the cavity while the electronic component is positioned in the cavity when moving the electronic component suctioned to the nozzle away from the nozzle after the movement step.

FIG. 1 is a diagram showing a schematic configuration of a component mounter according to first and second embodiments. FIG. 2 is a cross-sectional view taken along line II-II of FIG. FIG. 4 is a diagram showing the configuration of a communication passage of a nozzle, and a negative pressure generating device and an air supply device connected to the communication passage. FIG. 4 is a block diagram showing a control system of the component mounters according to the first and second embodiments. 6 is a flowchart showing an example of a process for mounting electronic components in cavities provided in a sheet. 5A to 5C are diagrams for explaining a process of mounting an electronic component in a cavity in the first embodiment. 13 is a diagram showing the timing of control of each component when an electronic component is moved away from a nozzle in order to mount the electronic component in a cavity, and a change in pressure value within a communication passage. FIG. 13A to 13C are diagrams for explaining a process of mounting an electronic component in a cavity in the second embodiment.

The main features of the embodiment described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

In the first component mounting machine disclosed in this specification, the electronic component can be pressed against the inner wall of the cavity, which can trigger the electronic component to move away from the nozzle. In addition, since the electronic component is moved away from the nozzle while positioned within the cavity, the electronic component can be mounted within the cavity.

In addition, in the second component mounting machine disclosed in this specification, the generation of negative pressure in the communication passage is stopped and a first flow rate of air is supplied into the communication passage so as to eliminate the negative pressure in the communication passage when the electronic component is located in the cavity, making it easier to move the electronic component away from the nozzle. On the other hand, if the first flow rate of air is continued to be supplied into the communication passage, the first flow rate of air is supplied into the communication passage even after the electronic component is separated from the nozzle, and a large amount of air is discharged outside the communication passage. If an electronic component is previously mounted around the electronic component, there is a risk that the previously mounted electronic component will be moved by the air discharged from the communication passage. When the electronic component is located in the cavity, a second flow rate of air smaller than the first flow rate is supplied into the communication passage, thereby reducing the flow rate of air discharged from the communication passage after the electronic component is separated from the nozzle. This makes it possible to prevent the previously mounted electronic component from being moved by the air discharged from the communication passage.

In the component mounter disclosed in this specification, when an electronic component adsorbed to a nozzle is separated from the nozzle, the control device may control the movement device to move the nozzle parallel to the upper surface of the sheet with the electronic component positioned inside the cavity, to press the electronic component against the inner wall of the cavity. With this configuration, the electronic component can be suitably pressed against the inner wall of the cavity.

In the component mounting machine disclosed in this specification, the moving device may be capable of rotating the nozzle around its axis. When moving the electronic component adsorbed to the nozzle away from the nozzle, the control device may control the moving device to rotate the nozzle and press the electronic component against the inner wall of the cavity while the electronic component is positioned within the cavity. With this configuration, the electronic component can be suitably pressed against the inner wall of the cavity.

In the component mounting machine disclosed in this specification, the nozzle may have a communication passage provided therein and communicating with the end face that adsorbs the electronic component. The component mounting machine may further have a negative pressure generating device that is controlled by the control device and creates a negative pressure in the communication passage. The control device may generate negative pressure in the communication passage at the supply position to adsorb the electronic component to the nozzle, while controlling the negative pressure generating device to stop generating negative pressure in the communication passage when the nozzle is at the mounting position and the electronic component is located in the cavity. With this configuration, when the electronic component is located in the cavity, a state in which negative pressure is not generated is achieved. In other words, a state in which negative pressure is not generated when the electronic component is pressed against the inner wall of the cavity. As a result, negative pressure is not generated during the operation of pressing the electronic component against the inner wall of the cavity, so that the electronic component can be suitably separated from the nozzle by pressing the electronic component against the inner wall of the cavity.

The component mounter disclosed in this specification may further include an air supply device controlled by the control device and configured to supply air into the communication passage. The control device may control the negative pressure generating device and the air supply device to stop the generation of negative pressure into the communication passage and supply air at a first flow rate into the communication passage when the electronic component adsorbed to the nozzle is separated from the nozzle so as to eliminate the negative pressure in the communication passage when the electronic component is located in the cavity, and to supply air at a second flow rate smaller than the first flow rate into the communication passage when the electronic component is located in the cavity.

Example 1
A component mounter 10 according to an embodiment will be described with reference to the drawings. The component mounter 10 is a device that mounts electronic components 4 in cavities 52 provided in a sheet 50. In this embodiment, the sheet 50 is a graphite sheet, and a plurality of cavities 52 are formed on the upper surface of the sheet 50 (see FIGS. 6 and 8). The cavities 52 are formed to be able to accommodate the electronic components 4, and specifically, are formed to have a size and shape slightly larger than the outer shape of the electronic components 4. As shown in FIGS. 1 and 2, the component mounter 10 includes a plurality of component feeders 12, a feeder holding unit 14, a mounting head 16, an imaging device 30, a moving device 18 that moves the mounting head 16 and the imaging device 30, a negative pressure generating device 34, an air supply device 38, a sheet conveying device 20, a control device 26, and a touch panel 24. A management device 80 that is configured to be able to communicate with the component mounter 10 is disposed outside the component mounter 10.

Each component feeder 12 stores a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holder 14 and supplies the electronic components 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 may be, for example, a tape feeder that supplies a plurality of electronic components 4 stored on a tape, a tray feeder that supplies a plurality of electronic components 4 stored on a tray, or a bulk feeder that supplies a plurality of electronic components 4 randomly stored in a container.

The feeder holding unit 14 has multiple slots, and a component feeder 12 can be removably installed in each of the multiple slots. The feeder holding unit 14 may be fixed to the component mounter 10, or may be removably attached to the component mounter 10.

The mounting head 16 is fixed to the moving base 18a and moves integrally with the moving base 18a. The mounting head 16 has a nozzle 6 that picks up the electronic component 4. The nozzle 6 is detachably attached to the mounting head 16. The mounting head 16 can move the nozzle 6 in the Z direction (here, the vertical direction) and move the nozzle 6 closer to and farther from the component feeder 12 and the sheet 50. The mounting head 16 can also rotate the nozzle 6 around its axis (axis extending in the Z direction). The mounting head 16 can pick up the electronic component 4 from the component feeder 12 with the nozzle 6 and move the electronic component 4 picked up by the nozzle 6 into the cavity 52. The mounting head 16 rotates the nozzle 6 around its axis, so that the electronic component 4 rotates in a plane (XY plane) perpendicular to the axis of the nozzle 6. The mounting head 16 is not limited to one having a single nozzle 6, and may have multiple nozzles 6.

3, the nozzle 6 is provided with a communication passage 7 extending in the axial direction inside the nozzle 6. The communication passage 7 extends from the upper end surface of the nozzle 6 to the lower end surface 8. One end of the communication passage 7 (i.e., the end on the upper end surface side of the nozzle 6) is connected to the switching valve 40. The communication passage 70 is connected to the air supply device 38 via the switching valve 40, and is connected to the negative pressure generator 34 via the switching valve 40 and the on-off valve 36. The switching valve 40 is controlled by the control device 26. The switching valve 40 switches the flow path to which the communication passage 70 is connected between the flow path on the air supply device 38 side and the flow path on the negative pressure generator 34 side (specifically, the negative pressure generator 34 via the on-off valve 36). When the switching valve 40 is switched to the air supply device 38 side, the communication passage 7 is connected to the air supply device 38, and when the switching valve 40 is switched to the negative pressure generator 34 side, the communication passage 7 is connected to the negative pressure generator 34 via the on-off valve 36.

The negative pressure generator 34 is, for example, a vacuum pump, and when connected to the communication passage 7, it draws in the air in the communication passage 7, creating a negative pressure in the communication passage 7. The on/off of the negative pressure generator 34 is controlled by the control device 26. When the negative pressure generator 34 is turned on, it operates at a constant speed.

Between the negative pressure generator 34 and the switching valve 40, an on-off valve 36 is installed. The opening and closing of the on-off valve 36 is controlled by the control device 26. When the on-off valve 36 is opened, the negative pressure generator 34 and the switching valve 40 are connected. Therefore, when the on-off valve 36 is opened with the switching valve 40 switched to the negative pressure generator 34 side, the communication passage 7 and the negative pressure generator 34 are connected, and the air in the communication passage 7 can be sucked in by the negative pressure generator 34. By installing the on-off valve 36, the connection between the communication passage 7 and the negative pressure generator 34 is controlled by opening and closing the on-off valve 36 while the negative pressure generator 34 is turned on. In this embodiment, the on-off valve 36 is opened and closed while the negative pressure generator 34 is turned on. Therefore, when the switching valve 40 is switched to the negative pressure generator 34 side, when the on-off valve 36 is opened, the air in the communication passage 7 is sucked in, and when the on-off valve 36 is closed, the suction of the air in the communication passage 7 is stopped.

The communication passage 7 is open at the end on the lower end surface 8 side of the nozzle 6. When the electronic component 4 is brought into contact with the lower end surface 8 of the nozzle 6, the end of the communication passage 7 on the lower end surface 8 side of the nozzle 6 is closed, and the communication passage 7 is sealed. With the electronic component 4 in contact with the lower end surface 8 of the nozzle 6, when the switching valve 40 is switched to the negative pressure generator 34 side and the opening/closing valve 36 is opened while the negative pressure generator 34 is on, negative pressure is created inside the communication passage 7. The nozzle 6 then adsorbs the electronic component 4.

The air supply device 38 is, for example, a compressor, and sends compressed air (hereinafter, also referred to as air) into the communication passage 7. The flow rate of air sent out from the air supply device 38 is controlled by the control device 26. When air is sent out from the air supply device 38 with the switching valve 40 switched to the air supply device 38 side, air is supplied into the communication passage 7. When air is supplied into the communication passage 7 with the electronic component 4 adsorbed to the nozzle 6, the electronic component 4 adsorbed to the nozzle 6 is easily separated from the nozzle 6. When air is supplied into the communication passage 7, the switching valve 40 is switched from the negative pressure generating device 34 side to the air supply device 38 side, so that the suction of air into the communication passage 7 is stopped. When air is supplied into the communication passage 7 with the suction of air into the communication passage 7 stopped, the pressure in the communication passage 7 increases and the negative pressure in the communication passage 7 is released. Even if the generation of negative pressure in the communication passage 7 is stopped while the electronic component 4 is adsorbed to the nozzle 6, the negative pressure state is maintained in the communication passage 7 for a while. By supplying air into the communication passage 7, the electronic component 4 can be separated from the nozzle 6 in a short time after the generation of negative pressure in the communication passage 7 is stopped.

1, the imaging device 30 is fixed to the moving base 18a by a fixing member 29 and moves integrally with the moving base 18a. The imaging device 30 includes a camera 32, an illumination light source (not shown), and a prism (not shown). The camera 32 captures an image of the nozzle 6 from the horizontal direction (i.e., the -Y direction) so that the entire axial direction (i.e., the Z direction) of the nozzle 6 is included. When the nozzle 6 is adsorbing an electronic component 4, the camera 32 captures an image of the nozzle 6 as well as the electronic component 4 adsorbed to the nozzle 6. For example, a CCD camera is used for the camera 32. The illumination light source is composed of an LED and illuminates the imaging surface of the nozzle 6 (in this embodiment, the side surface in the ZX plane direction). The prism aligns the optical axis of the camera 32 with the imaging target. The illumination light source illuminates the entire axial direction of the nozzle 6, and the reflected light is reflected by the prism and guided to the camera 32, so that the camera 32 captures the nozzle 6 (and the electronic component 4 adsorbed to the nozzle 6). Image data of the image captured by the camera 32 is stored in the memory (not shown) of the control device 26.

The moving device 18 moves the mounting head 16 and the imaging device 30 between the component feeder 12 and the sheet 50. As an example, the moving device 18 in this embodiment is an XY robot that moves a moving base 18a in the X and Y directions, and the mounting head 16 and the imaging device 30 are fixed to the moving base 18a. The moving device 18 can translate the nozzle 6 and the imaging device 30 in a plane (XY plane) parallel to the surface of the sheet 50. Note that the mounting head 16 is not limited to being fixed to the moving base 18a, and may be detachably attached to the moving base 18a.

As shown in Figures 1 and 2, the sheet conveying device 20 is a device that carries in, positions, and carries out the sheet 50. As an example, the sheet conveying device 20 in this embodiment has a pair of belt conveyors and a support device (not shown) that supports the sheet 50 from below.

The control device 26 is configured using a computer having a CPU and a storage device. The control device 26 controls the operation of each part of the component mounter 10 based on the production program transmitted from the management device 80. As shown in FIG. 4, the control device 26 is connected to the mounting head 16, the moving device 18, the sheet conveying device 20, the touch panel 24, and the imaging device 30, and controls each part of the mounting head 16, the moving device 18, the sheet conveying device 20, the touch panel 24, and the imaging device 30. The control device 26 is also connected to the negative pressure generating device 34, the opening and closing valve 36, the air supply device 38, and the switching valve 40. The control device 26 controls the on/off of the negative pressure generating device 34, adjusts the flow rate of air supplied from the air supply device 38, and controls the opening and closing of the opening and closing valve 36 and the switching of the switching valve 40. The touch panel 24 is a display device that provides the operator with various information about the component mounter 10, and is also an input device that accepts instructions and information from the operator.

Next, a process for mounting the electronic component 4 in the cavity 52 will be described. In this embodiment, the electronic component 4 is mounted in the cavity 52 by accommodating the electronic component 4 in the cavity 52 provided in the sheet 50. For example, when mounting the electronic component 4 on a flat sheet that does not have a cavity, such as a circuit board, paste may be applied to the mounting position and the electronic component 4 may be mounted on top of it. In this embodiment, if paste is applied to the mounting position to mount the electronic component 4 in the cavity 52, the paste will be applied inside the cavity 52, and the electronic component 4 will not fit inside the cavity 52. For this reason, in this embodiment, the electronic component 4 is mounted in the cavity 52 by accommodating the electronic component 4 in the cavity 52 without applying paste to the mounting position.

As shown in FIG. 5, first, the control device 26 moves the nozzle 6 above the supply position (S10). Specifically, the control device 26 moves the nozzle 6 above the supply position of the component feeder 12 that supplies the electronic components 4 to be mounted. Next, the control device 26 lowers the nozzle 6 (S12). Then, the bottom end surface 8 of the nozzle 6 comes into contact with the top surface of the electronic component 4.

Next, the control device 26 switches the switching valve 40 to the negative pressure generator 34 side (S14). If the switching valve 40 is switched to the negative pressure generator 34 side, the process of step S14 is skipped. Next, the control device 26 opens the on-off valve 36 (S16). By switching the switching valve 40 to the negative pressure generator 34 side in step S14 and opening the on-off valve 36 in step S16, the communication passage 7 is connected to the negative pressure generator 34 via the switching valve 40 and the on-off valve 36. As described above, in this embodiment, the on-off valve 36 is opened while the negative pressure generator 34 is turned on, so that when the communication passage 7 is connected to the negative pressure generator 34, the air in the communication passage 7 is sucked in. Since the air in the communication passage 7 is sucked in with the lower end surface 8 of the nozzle 6 in contact with the upper surface of the electronic component 4, the communication passage 7 becomes negative pressure, and the nozzle 6 adsorbs the electronic component 4. Note that the above steps S12 to S16 do not have to be performed in the above order. As long as the nozzle 6 can adsorb the electronic component 4, for example, the process of switching the switching valve 40 in step S14 may be performed after the process of opening the on-off valve 36 in step S16. Also, the process of switching the switching valve 40 in step S14 and the process of opening the on-off valve 36 in step S16 may be performed before the lower end surface 8 of the nozzle 6 comes into contact with the electronic component 4 in step S12.

Next, the control device 26 raises the nozzle 6 and moves it above the mounting position (S18). That is, the control device 26 moves the nozzle 6 above the cavity 52 in which the electronic component 4 is to be mounted. Because the nozzle 6 is holding the electronic component 4 by suction, by moving the nozzle 6 above the mounting position, the electronic component 4 held by the nozzle 6 also moves above the mounting position (see FIG. 6(a)).

Then, the control device 26 lowers the nozzle 6 (S20). Then, while executing the process of lowering the nozzle 6 in step S20, the control device 26 closes the on-off valve 36 (S22), switches the switching valve 40 to the air supply device 38 side (S24), and supplies air from the air supply device 38 (S26). Then, when the control device 26 has lowered the nozzle 6 to a predetermined height, it stops the descent of the nozzle 6 (S28), and thereafter stops the supply of air from the air supply device 38 (S28).

The process of steps S22 to S28 will be described in detail with reference to FIG. 7. FIG. 7 shows the timing of control of each component when the electronic component 4 is separated from the nozzle 6 in order to mount the electronic component 4 in the cavity 52, and the change in the pressure value in the communication passage 7. In FIG. 7, graph 60 shows the change in the Z-direction position of the lower surface of the electronic component 4 adsorbed to the nozzle 6, and graph 62 shows the change in the output of a sensor that detects whether the Z-direction position of the lower surface of the electronic component 4 coincides with the surface of the sheet 50 (i.e., whether the lower surface of the electronic component 4 contacts the bottom surface of the cavity 52 of the sheet 50). Graph 64 shows a control signal that controls the opening and closing of the opening and closing valve 36, and specifically shows the change from an open state (control signal is on) to a closed state (control signal is off) of the opening and closing valve 36. Graph 66 shows a control signal that controls whether air is supplied from the air supply device 38. In this embodiment, the flow rate of air supplied from the air supply device 38 is controlled by turning the air supply device 38 on and off (on and off of the control signal 66). Specifically, when the air supply device 38 is turned on (e.g., from time t2 to t5), a constant flow rate of air is supplied from the air supply device 38, and when the air supply device 38 is turned off (e.g., at time t5), the supply of air from the air supply device 38 is stopped. Graph 68 shows the pressure at the bottom end of the nozzle 6 (i.e., the pressure in the communication passage 7), and graph 70 shows the atmospheric pressure. That is, when the graph 68 is smaller than the atmospheric pressure of graph 70, it indicates that the electronic component 4 is adsorbed to the nozzle 6, and when the graph 68 is larger than the atmospheric pressure of graph 70, it indicates that the electronic component 4 is separated from the nozzle 6 and air is blowing out of the communication passage 7.

First, at time t1, the control device 26 changes the control signal 64 from on to off, and executes the process of closing the on-off valve 36 in step S22. This stops the generation of negative pressure in the communication passage 7. As shown in graph 68, in this state, the pressure in the communication passage 7 hardly changes, and the negative pressure state is maintained in the communication passage 7.

Then, the control device 26 executes the process of switching the switching valve 40 to the air supply device 38 side in step S24, and then at time t2, turns the control signal 66 from OFF to ON and executes the process of supplying air from the air supply device 38 in step S26. Then, as shown in graph 68, air is supplied into the communication passage 7, and the pressure in the communication passage 7 gradually increases. Then, as shown in graph 68, at time t4, the pressure in the communication passage 7 matches atmospheric pressure. That is, in FIG. 7, at time t4, the negative pressure in the communication passage 7 is released, and the electronic component 4 moves away from the nozzle 6.

As shown in graph 60, while air is being supplied into the communication passage 7 (between time t2 and time t5), at time t3 the electronic component 4 descends to the surface of the sheet 50, and at time t4 the electronic component 4 is housed in the cavity 52 (see FIG. 6(b)). That is, at time t4 the bottom surface of the electronic component 4 comes into contact with the bottom surface of the cavity 52, and the sensor signal 62 changes from OFF to ON. Therefore, at time t4 (when the electronic component 4 is housed in the cavity 52), the control device 26 executes the process of step S28 to stop the descent of the nozzle 6. Note that the nozzle 6 continues to descend slightly due to its inertia even after time t4.

Next, at time t5, the control device 26 executes the process of stopping the supply of air from the air supply device 38 in step S30. The time between time t5 and time t4 is set to be short. That is, the process of step S28 is set to be executed as early as possible after the negative pressure in the communication passage 7 is released at time t4. At time t4, the negative pressure in the communication passage 7 is released and the electronic component 4 moves away from the nozzle 6, so that the pressure in the communication passage 7 becomes greater than atmospheric pressure after time t4, as shown in graph 68. As shown by the dashed lines in graphs 66 and 68 of FIG. 7, if air continues to be supplied from the air supply device 38 without stopping the supply of air after time t4, air will blow out from the communication passage 7. As described above, in this embodiment, since paste is not applied to the mounting position, the mounted electronic component 4 may move from the mounting position due to external factors after mounting. For example, if air continues to be blown out from the communication passage 7, the previously mounted electronic component 4 (e.g., the electronic component 4 on the right side of FIG. 6D) may be moved by the air blown out from the communication passage 7 of the nozzle 6 (e.g., the nozzle 6 above the electronic component 4 on the left side of FIG. 6D) during the mounting process. In this embodiment, as shown by the solid lines in graphs 66 and 68 in FIG. 7, the supply of air from the air supply device 38 is stopped at time t5, a short time after time t4 when the pressure in the communication passage 7 matches the atmospheric pressure. As a result, the electronic component 4 is separated from the nozzle 6 at time t4, and only a small amount of air is blown out from the communication passage 7 in the short time from time t4 to time t5. Therefore, it is possible to prevent the previously mounted electronic component 4 from being blown out by the air from the communication passage 7. In addition, by blowing air out of the communication passage 7 from time t4 to time t5, although it is a short time, the electronic component 4 can be reliably separated from the nozzle 6.

The timing for executing each of steps S22 to S30 is set in advance to match the graph shown in FIG. 7. That is, the generation of negative pressure in the communication passage 7 is stopped (i.e., the on-off valve 36 is closed) and air is supplied into the communication passage 7 before the electronic component 4 is accommodated in the cavity 52 so that the negative pressure in the communication passage 7 is released when the nozzle 6 is lowered and the electronic component 4 is accommodated in the cavity 52. For this reason, the processes of steps S22 to S26 may be set to be executed before the process of lowering the nozzle 6 in step S20.

Next, the control device 26 moves the nozzle 6 parallel to the surface of the sheet 50 (S32). Specifically, the control device 26 causes the moving device 18 to slightly move (translate) the moving base 18a (i.e., the nozzle 6) in a plane (XY plane) parallel to the surface of the sheet 50. For example, as shown by the dashed lines in the graphs 66 and 68 of FIG. 7, if air continues to be supplied from the air supply device 38 after time t4, the electronic component 4 will certainly move away from the nozzle 6. However, in this embodiment, in order to prevent air from being blown out from the communication passage 7, the supply of air is stopped at time t5, which is a short time after the timing (time t4) when the negative pressure in the communication passage 7 is predicted to be eliminated. Therefore, there is a possibility that the negative pressure in the communication passage 7 has not actually been eliminated and the electronic component 4 will not be separated from the nozzle 6. Therefore, as shown in FIG. 6(c), the control device 26 translates the nozzle 6. Then, if the electronic component 4 is not separated from the nozzle 6, the electronic component 4 moves in parallel with the nozzle 6, and the electronic component 4 is pressed against the inner wall 53 of the cavity 52. As described above, the negative pressure in the communication passage 7 is small, and even if the electronic component 4 is not separated from the nozzle 6, the force with which the nozzle 6 attracts the electronic component 4 is small. Therefore, by pressing the electronic component 4 against the inner wall 53, the electronic component 4 is reliably separated from the nozzle 6.

Then, the control device 26 raises the nozzle 6 (S34). Note that the negative pressure in the communication passage 7 is eliminated by the processes from step S22 to step S30. However, even if the electronic component 4 does not move away from the nozzle 6 and the negative pressure in the communication passage 7 is not eliminated, the nozzle 6 moves in parallel by the process of step S32, so that the electronic component 4 moves away from the nozzle 6. Because the electronic component 4 is separated from the nozzle 6, when the nozzle 6 is raised, the electronic component 4 does not rise with the nozzle 6, but is accommodated (mounted) in the cavity 52.

Next, the control device 26 uses the imaging device 30 to image the nozzle 6 from the side (-Y direction in FIG. 1) (S36). Then, the control device 26 judges whether the electronic component 4 is imaged in the image captured in step S36 (S38). This makes it possible to confirm whether the electronic component 4 is separated from the nozzle 6. If the electronic component 4 is imaged (YES in step S38), the control device 26 judges that the electronic component 4 is not separated from the nozzle 6. Then, the control device 26 lowers the nozzle 6 again (S40) and repeats the processes of steps S28 to S38. In this case, since air is not supplied from the air supply device 38, the process of step S30 is skipped. As described above, even if the electronic component 4 is not separated from the nozzle 6, the force with which the nozzle 6 adsorbs the electronic component 4 is reduced. Therefore, the processes of steps S28 to S38 (excluding step S30) can be repeated to press the electronic component 4 against the inner wall 53 of the cavity 52 again, thereby separating the electronic component 4 from the nozzle 6.

If the electronic component 4 has not been imaged (NO in step S38), the control device 26 determines that the electronic component 4 has been moved away from the nozzle 6. That is, the control device 26 determines that the electronic component 4 has been mounted in the cavity 52. Next, the control device 26 determines whether or not all of the electronic components 4 have been mounted in the cavity 52 (S42). If all of the electronic components 4 have not been mounted in the cavity 52 (NO in step S42), the process returns to step S10 and repeats the processes of steps S10 to S42. If all of the electronic components 4 have been mounted in the cavity 52 (YES in step S42), the mounting process ends.

Example 2
In the above-described first embodiment, the nozzle 6 is translated in step S32, but the present invention is not limited to such a configuration. It is sufficient that the electronic component 4 can be pressed against the inner wall 53 of the cavity 52 when the negative pressure in the communication passage 7 is not eliminated. For example, in step S32, the control device 26 may rotate the nozzle 6 around its axis.

8(c), when the nozzle 6 is rotated in the axial direction in step S32, the electronic component 4 rotates together with the nozzle 6. Then, except when the electronic component 4 has a circular disk shape when viewed from above, the electronic component 4 is pressed against the inner wall 53 of the cavity 52. The electronic component 4 is often substantially rectangular, and in most cases, the electronic component 4 has a shape that presses against the inner wall 53 when rotated while housed in the cavity 52. As described above, the negative pressure in the communication passage 7 is small, and when the electronic component 4 is pressed against the inner wall 53, this triggers the electronic component 4 to move away from the nozzle 6. Therefore, the electronic component 4 can be moved away from the nozzle 6 by rotating the electronic component 4 and pressing it against the inner wall 53.

In the above-mentioned first and second embodiments, a constant flow rate of air is supplied from the air supply device 38 in step S26, and the supply of air from the air supply device 38 is stopped in step S30, but the present invention is not limited to such a configuration. For example, a first flow rate of air may be supplied from the air supply device 38 in step S26, and a second flow rate of air smaller than the first flow rate may be supplied from the air supply device 38 in step S30. As shown by the dashed lines in the graphs 66 and 68 of FIG. 7, if the first flow rate of air is continued to be supplied even after the negative pressure in the communication passage 7 is released (after time t4), there is a risk that the electronic component 4 previously mounted will be blown away by the large amount of air blown out from the communication passage 7. By changing the air supplied from the air supply device 38 from the first flow rate to the second flow rate (a flow rate smaller than the first flow rate) in step S30, the supply of air to the communication passage 7 is continued, and the flow rate of air blown out from the communication passage 7 becomes smaller than when the first flow rate of air is continuously supplied. By continuing to supply air to the communication passage 7, the electronic component 4 can be more reliably separated from the nozzle 6. In addition, by reducing the flow rate of air blown out of the communication passage 7, the possibility that the previously mounted electronic component 4 will be blown away by the air blown out of the communication passage 7 can be reduced.

In addition, in the above-mentioned Examples 1 and 2, the nozzle 6 is translated or rotated to press the electronic component 4 against the inner wall 53, but this configuration is not limited to this. In step S30, in addition to or instead of the operation of moving the nozzle 6 so as to press the electronic component 4 against the inner wall 53, the nozzle 6 may be moved finely left and right, or the electronic component 4 may be vibrated (e.g., ultrasonic vibration) to separate the electronic component 4 from the nozzle 6.

Specific examples of the technology disclosed in this specification have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exert technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings achieves multiple objectives simultaneously, and achieving one of those objectives is itself technically useful.

4: Electronic component 6: Nozzle 10: Component mounter 12: Component feeder 14: Feeder holder 16: Mounting head 18: Moving device 20: Sheet conveying device 24: Touch panel 26: Control device 30: Imaging device 34: Negative pressure generating device 36: Opening/closing valve 38: Air supply device 40: Switching valve 50: Sheet 52: Cavity 53: Inner wall

Claims (5)

A component mounter that mounts electronic components into cavities provided in a sheet, comprising:
a nozzle for suctioning the electronic component;
a moving device that enables the nozzle to move between a supply position and a mounting position of the electronic component;
a control device for controlling the moving device, the control device being configured to move the nozzle so as to press the electronic component against an inner wall of the cavity while the electronic component is positioned within the cavity, when the electronic component sucked by the nozzle is separated from the nozzle;
Equipped with
the nozzle has a communication passage provided therein and communicating with an end surface that sucks the electronic component,
a negative pressure generating device that generates a negative pressure in the communication passage and is controlled by the control device;
an air supply device controlled by the control device to supply air into the communication passage,
The control device includes:
At the supply position, a negative pressure is generated in the communication passage to suck the electronic component onto the nozzle.
controlling the negative pressure generating device to stop generating negative pressure in the communication passage when the nozzle is located at the mounting position and the electronic component is located within the cavity;
When the control device separates the electronic component sucked by the nozzle from the nozzle,
stopping generation of negative pressure in the communication passage and supplying air at a first flow rate into the communication passage so as to eliminate the negative pressure in the communication passage with the electronic component positioned in the cavity;
the component mounter controls the negative pressure generating device and the air supplying device so as to supply air at a second flow rate smaller than the first flow rate into the communication passage when the electronic component is positioned within the cavity . The component mounter according to claim 1, wherein the control device controls the moving device to move the nozzle parallel to the upper surface of the sheet and press the electronic component against the inner wall of the cavity while the electronic component is positioned within the cavity when the electronic component adsorbed to the nozzle is separated from the nozzle. The moving device is capable of rotating the nozzle around its axis,
2. The component mounter according to claim 1, wherein the control device controls the moving device so that, when the electronic component adsorbed to the nozzle is separated from the nozzle, the nozzle is rotated while the electronic component is positioned within the cavity to press the electronic component against an inner wall of the cavity. A component mounter that mounts electronic components into cavities provided in a sheet, comprising:
a nozzle including an end surface for sucking the electronic component and a communication passage communicating with the end surface;
a moving device that enables the nozzle to move between a supply position and a mounting position of the electronic component;
a negative pressure generating device for generating a negative pressure in the communication passage;
an air supply device for supplying air into the communication passage;
When the electronic component sucked by the nozzle is separated from the nozzle,
stopping generation of negative pressure in the communication passage and supplying air at a first flow rate into the communication passage so as to eliminate the negative pressure in the communication passage with the electronic component positioned in the cavity;
a control device that controls the moving device, the negative pressure generating device, and the air supply device so as to supply air at a second flow rate smaller than the first flow rate into the communication passage when the electronic component is located within the cavity;
A component mounting machine comprising: A method for mounting electronic components in a cavity provided in a sheet, comprising the steps of:
a suction step of suctioning the electronic component with a nozzle;
a moving step of positioning the electronic component sucked by the nozzle in the cavity;
a pressing step of pressing the electronic component against an inner wall of the cavity while the electronic component is positioned within the cavity, when the electronic component sucked by the nozzle is separated from the nozzle after the moving step;
Equipped with
In the suction step, a negative pressure is generated in a communication passage that is provided inside the nozzle and communicates with an end face that suctions the electronic component, thereby suctioning the electronic component to the nozzle, while in the pressing step, when the electronic component is positioned within the cavity, generation of the negative pressure in the communication passage is stopped;
In the pressing step, when the electronic component sucked by the nozzle is separated from the nozzle,
stopping generation of negative pressure in the communication passage and supplying air at a first flow rate into the communication passage so as to eliminate the negative pressure in the communication passage with the electronic component positioned in the cavity;
In a state in which the electronic component is positioned within the cavity, air is supplied into the communication passage at a second flow rate smaller than the first flow rate .

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