JP7687166B2 - Metal fingerprint card - Google Patents

Description

The present invention relates to a metal fingerprint authentication card for use in credit cards, debit cards, cash cards, access control cards, etc.

In recent years, fingerprint authentication devices such as fingerprint authentication smart cards have started to become popular. Examples of fingerprint authentication smart cards include credit cards and access cards. Fingerprint authentication methods are broadly divided into three types: "capacitive," "optical," and "ultrasonic." Currently, the most common fingerprint authentication method is the "capacitive" method.

Passive capacitive fingerprint sensors detect fingerprint patterns by measuring the capacitance that varies with the distance between the surface of a finger in contact with a conductive structure located near the sensor array and a sensing structure located on the sensor array. When passively reading the capacitance between the finger surface and the sensing structure, a relatively large capacitance is required, which requires a very thin protective layer, which makes it quite sensitive to scratching and ESD (electrostatic discharge).

Active capacitive fingerprint sensors include those that supply an excitation signal to a finger via a conductive structure and measure the charge fluctuations carried by the sensing structure of the sensor array (see Patent Document 1). The potential difference between the surface of the finger touching the sensor array and the sensing structure of the sensor array is low for dry fingers, which reduces the sensitivity of fingerprint pattern acquisition.

In another active capacitive fingerprint sensor, when an excitation signal is supplied to a finger from a sensing electrode, a conductive drive structure is not used, and the low potential (sensor ground) and high potential of the sensor's power supply voltage are varied with respect to the device reference potential (device ground), and the reference potential (sensor ground) of the sensor array is swung with respect to the potential of the finger. When the sensor ground is swung, the potential of the sensing structure of the sensor array is swung up and down with respect to the device reference potential, and is also swung up and down with respect to the potential of the finger touching the sensor array. By measuring the variation in the charge carried by the sensing structure due to the change in voltage between the finger and the sensing structure, the distance between the surface of the finger and the sensing structure can be estimated. In this way, a fingerprint can be sensed without a conductive structure that supplies an excitation signal to the finger (see Patent Document 2).

Because the fingerprint sensing relies on the varying electrical potential of the finger, it is the same for fingers at different electrical potentials, improving the quality of the fingerprint pattern on dry fingers. Also, the finger can be grounded by a conductive portion of the device. The amplitude of the finger excitation signal is not limited by the supply voltage to the sensor array, allowing the use of a thicker protective film over the sensing structure, resulting in a more robust fingerprint sensor.

Also, in the case of an electronic device with an active capacitive fingerprint sensing system and a conductive housing, the conductive housing can be arranged to at least intermittently maintain the potential of the conductive housing at the reference potential of the electronic device, e.g. electrical ground, thereby assisting in the acquisition of fingerprint patterns under common mode noise and different electrical characteristics of fingers (wet/dry) while fulfilling any additional electrical functions of the electronic device. And the housing connection circuitry can include ESD protection circuitry to prevent electrostatic discharge from damaging the fingerprint sensing circuitry and other parts of the metal card.

Also, an active circuit configuration can be provided that makes it possible to control switching between a signal tracking state in which the potential of the conductive housing can track the finger excitation signal when acquiring a fingerprint pattern and a reference potential state in which the potential of the conductive housing is maintained at the reference potential of the electronic device. By making the potential of the conductive housing track the finger excitation signal, the functionality as an active capacitive fingerprint sensing system can be improved.

U.S. Pat. No. 7,864,992 Special table 2017-525004 publication

When mounting the above-mentioned passive capacitive fingerprint sensor on a metal card,
Since the capacitance between the surface of the finger and the sensing structure is passively read, the sensitivity is low with dry fingers. In addition, the protective layer of the fingerprint sensor is very thin, which causes a problem of high sensitivity to scratching and ESD. In addition, when a passive capacitive fingerprint sensor is mounted on a metal card using a metal plate on the front side of the card, a conductive finger contact structure must be provided around the fingerprint sensor in addition to the metal plate that is part of the metal card, for conductive contact with the user's finger when the fingerprint sensing system is used. The conductive finger contact structure must be insulated from the metal plate, which causes a problem of affecting the design of the card.

In addition, when mounting an active capacitive fingerprint sensor on a metal card,
Connecting the ground of the internal circuit to the metal plate acting as a conductive housing is advantageous for acquiring fingerprint patterns under common mode noise and different electrical characteristics of fingers (wet/dry). Furthermore, the housing connection circuitry is provided with an ESD protection circuitry, which can prevent electrostatic discharge from damaging the fingerprint sensing circuitry and other parts of the metal card. Also, since there is no need to provide a separate conductive finger contact structure, more freedom in card design can be realized.

In a metal card capable of contactless communication, in order to obtain sufficient power from the antenna, it is preferable to insert a magnetic sheet, such as a ferrite sheet, between the metal plate and the antenna circuit, which can suppress eddy currents generated on the metal surface and effectively focus the magnetic flux from the antenna. A metal fingerprint authentication card requires more power than a normal metal card to operate the fingerprint sensor, read and acquire the user's fingerprint, and verify it against registered fingerprint data for authentication, so it is preferable to insert a magnetic sheet for this purpose. However, if a magnetic sheet is provided between the film-like substrate on which the antenna circuit is arranged and the metal plate, in order to electrically connect the ground and metal plate arranged on the same film-like substrate, it is necessary to contact and conduct the ground on the film-like substrate and the metal plate via a conductor that penetrates the magnetic sheet in some way.

In view of the above problems, the present invention aims to provide a metal fingerprint authentication card that is advantageous for obtaining fingerprint patterns in the presence of common mode noise and different electrical characteristics of fingers (wet/dry) by contacting and conducting a ground pattern formed on a film-like substrate with a metal plate that acts as a conductive housing, and further, by providing an ESD protection circuit configuration in the circuit configuration inside the film-like substrate, it is possible to prevent electrostatic discharge from damaging the fingerprint sensing circuit configuration or other parts of the metal card.

In order to solve the above problems, the first aspect of the present invention is
A metal fingerprint authentication card that is integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate between front and back card base materials,
At least a portion of the front card substrate of the front and back card substrates includes a metal plate,
The film-like substrate is provided with an IC module including an external connection terminal for communicating with an external device, an active capacitive fingerprint sensor for acquiring a user's fingerprint data, a wiring pattern for connecting each component, a loop antenna circuit for performing contactless communication, a fingerprint registration unit which is a memory for registering the user's fingerprint data, and a fingerprint matching processing unit for comparing and matching the user's fingerprint read by the fingerprint sensor with the fingerprint data registered in the fingerprint registration unit, and a ground pattern;
a U-shaped slit is provided in the film-like substrate so as to surround the ground pattern, and an opening is provided in the magnetic sheet at a position where the ground pattern is mounted when the magnetic sheet is laminated on the film-like substrate;
A spacer for adjusting the height of the ground pattern may be provided on the rear surface of the film substrate at the position where the ground pattern is arranged, so that the metal plate and the ground pattern are in contact with each other.

By sandwiching the film-like substrate and the magnetic sheet laminated on the film-like substrate between the front and back card substrates, the layer structure inside the card is the front card substrate/magnetic sheet/film-like substrate/back card substrate. In this layer structure, in order to directly connect the metal plate included in the front card substrate and the ground pattern mounted on the film-like substrate, it is necessary to provide an opening at the position of the ground pattern on the magnetic sheet and expose the top surface of the ground pattern above the magnetic sheet. Then, by providing a spacer on the back surface of the film-like substrate (the side opposite to the surface with the ground pattern), the height of the ground pattern can be adjusted to make conductive contact with the metal plate. Note that in order to reduce the effect of deformation in the height direction of the film-like substrate caused by providing a spacer, it is desirable to provide a U-shaped slit around the ground pattern on the film-like substrate.

The second aspect of the present invention is
A metal fingerprint authentication card that is integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate between front and back card base materials,
At least a portion of the front card substrate of the front and back card substrates includes a metal plate,
The film-like substrate is provided with an IC module including an external connection terminal for communicating with an external device, an active capacitive fingerprint sensor for acquiring a user's fingerprint data, a wiring pattern for connecting each component, a loop antenna circuit for performing contactless communication, a fingerprint registration unit which is a memory for registering the user's fingerprint data, and a fingerprint matching processing unit for comparing and matching the user's fingerprint read by the fingerprint sensor with the fingerprint data registered in the fingerprint registration unit, and a ground pattern;
a U-shaped slit is provided in the film-like substrate so as to surround the ground pattern, and an opening is provided in the magnetic sheet at a position where the ground pattern is mounted when the magnetic sheet is laminated on the film-like substrate;
The thickness of the ground pattern itself may be adjusted so that the metal plate and the ground pattern are in contact with each other.

As another example of a configuration in which the metal plate and the ground pattern are directly connected, the plating thickness used to join the ground pattern can be adjusted to bring the metal plate and the ground pattern into contact.

Moreover, the third aspect of the present invention is
A metal fingerprint authentication card that is integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate between front and back card base materials,
At least a portion of the front card substrate of the front and back card substrates includes a metal plate,
The film-like substrate is provided with an IC module including an external connection terminal for communicating with an external device, an active capacitive fingerprint sensor for acquiring a user's fingerprint data, a wiring pattern for connecting each component, a loop antenna circuit for performing contactless communication, a fingerprint registration unit which is a memory for registering the user's fingerprint data, and a fingerprint matching processing unit for comparing and matching the user's fingerprint read by the fingerprint sensor with the fingerprint data registered in the fingerprint registration unit, and a ground pattern;
a U-shaped slit is provided in the film-like substrate so as to surround the ground pattern, and an opening is provided in the magnetic sheet at a position where the ground pattern is mounted when the magnetic sheet is laminated on the film-like substrate;
A metal foil may be provided on the rear surface of the film-like substrate at the position where the ground pattern is disposed, and the plating thickness of the metal foil may be adjusted to bring the metal plate and the ground pattern into contact with each other.

As another example of a configuration in which the metal plate and the ground pattern are directly connected, a metal foil can be provided on the back surface of the film-like substrate at the position where the ground pattern is located, and the plating thickness of the metal foil can be adjusted to bring the metal plate and the ground pattern into contact.

Moreover, a fourth aspect of the present invention is
The circuit configuration inside the film substrate may include an ESD protection circuit configuration.

Integrated circuits (ICs) are sensitive to ESD, and the high peak voltage and current of ESD can cause destruction to the IC. To protect static-sensitive ICs from ESD, an ESD protection circuit can be created to prevent electrostatic discharge from damaging the fingerprint sensing circuitry and other parts of the metal card by directing the current to ground.

The present invention provides a metal fingerprint authentication card that is advantageous for acquiring fingerprint patterns in the presence of common mode noise and different electrical characteristics of fingers (wet/dry) by bringing a ground pattern formed on a film-like substrate into intimate contact with a metal plate that serves as a conductive housing, and that can prevent electrostatic discharge from damaging the fingerprint sensing circuit configuration or other parts of the metal card by providing an ESD protection circuit configuration for the circuit configuration inside the film-like substrate. Because the ground pattern formed on the film-like substrate is used, there is no need to provide a separate conductor that penetrates the magnetic sheet, and the metal plate and the circuit substrate can be made conductive while suppressing costs and uneven thickness in the thickness direction of the card. In addition, since there is no need to provide a separate conductive finger contact structure, more flexible card design can be achieved.

1 is a plan view of a metal fingerprint authentication card according to a first embodiment of the present invention. FIG. 1 is a plan view of a film substrate according to a first embodiment of the present invention. 1 is a plan view of a magnetic sheet according to a first embodiment of the present invention. FIG. 2 is a plan view of a state in which a magnetic sheet is superimposed on a film-like substrate according to the first embodiment of the present invention. 1A is a plan view of a metal fingerprint authentication card according to a first embodiment of the present invention, and FIG. 1B is a schematic cross-sectional view taken along the line XX' and YY'. 11 is a schematic cross-sectional view of a metal fingerprint authentication card according to a second embodiment of the present invention taken along the YY' plane. FIG. 11 is a schematic cross-sectional view of a metal fingerprint authentication card according to a third embodiment of the present invention taken along the YY' plane. FIG.

An embodiment of a metal fingerprint authentication card according to the present invention will be described with reference to the drawings. The drawings are schematic and the planar dimensions and thickness ratios of each layer may differ from the actual dimensions.
Furthermore, the embodiments described below are illustrative of configurations for embodying the technical ideas of the present invention, and the technical ideas of the present invention are not limited to the materials, shapes, structures, etc. of the components described below.

<Embodiment 1>
(Basic configuration)
1 is a plan view showing a metal fingerprint authentication card 1 according to a first embodiment of the present invention. An external connection terminal 3 for contact communication and an active capacitance type fingerprint sensor 4 for reading a fingerprint and acquiring fingerprint data are exposed on a substrate 2 on the front side of the card. An IC module 5 (see FIG. 2) is provided inside the card, which stores fingerprint data, compares fingerprint data generated by the fingerprint sensor 4 for a user's finger with the stored fingerprint data to determine whether they match, and communicates with an external device according to the comparison result. In this embodiment, both contact data communication and non-contact data communication are provided as communication means for communicating with an external device, but non-contact data communication alone may be used.

The card surface substrate 2 includes a metal plate with at least a portion of the layer made of a metal material such as stainless steel or titanium with a thickness of 100 to 500 μm, and openings for exposing the external connection terminal board 3 and the fingerprint sensor 4 are provided in advance in the metal plate by laser or cutting. The contact terminals 3 and the fingerprint sensor 4 are exposed through the openings in the metal plate in the card surface substrate 2. A resin sheet (intermediate resin layer, exterior resin layer) may be provided on the outside of the metal plate, and the surface of the metal plate or the resin sheet may be printed, but it is necessary that there is no printing around the fingerprint sensor 4, or that there are areas without printing at regular intervals, so that the metal plate and the user's finger always come into direct contact when the user touches the fingerprint sensor 4.

Figure 2 is a plan view showing components mounted on a film-like substrate 10 arranged inside the front and back card substrates. As shown in Figure 2, an IC module 5 is provided with an external connection terminal 3 for communicating with an external device, a capacitive fingerprint sensor 4 for reading and acquiring a user's fingerprint data, a fingerprint registration section which is a memory in which the user's fingerprint data is registered, and a fingerprint matching processing section which compares and matches the user's fingerprint acquired by the fingerprint sensor with the fingerprint data registered in the fingerprint registration section, and a wiring pattern 7 connecting each component is mounted on the front surface of the film-like substrate 10 with a conductive bonding material such as solder or ACP, and a loop antenna circuit 8 and a ground pattern 6 for non-contact communication are provided.

The IC module 5 is contained within the card 1 and is not exposed on the surface of the card 1. As shown in FIG. 5(a), a concave cavity is formed in the area of the metal plate located above the IC module 5 to accommodate the IC module 5.

The film-like substrate 10 is made of a plastic substrate such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyether ether ketone (PEEK), or polyimide (PI), on the front and back of which circuit patterns are formed by etching aluminum or copper. The loop antenna circuit 8 uses copper wire (wound coil) or aluminum (etched antenna), while the external connection terminal substrate 3 uses a substrate such as glass epoxy or polyimide on both sides of which copper patterns are formed, and the copper patterns are plated with nickel, palladium, gold, or the like.

A U-shaped slit 9 is arranged so as to surround the ground pattern 6 arranged on the front surface of the film-like substrate 10 and connected to the circuit ground. The ground pattern 6 is preferably 1 ^cm2 or more in size to reduce contact resistance with the metal plate and to ensure electrical continuity. It is also preferable to arrange the ground pattern 6 away from the center line of the card 1 to minimize the stress applied to the ground pattern 6 when the card 1 is bent.

Figure 3 shows the magnetic sheet 20 of this embodiment. By inserting the magnetic sheet 20 between the metal plate 22 (see Figure 5) included in the front card substrate 2 and the film-like substrate 10, the generation of eddy currents on the metal surface is suppressed, and the magnetic flux from the antenna is well focused, making it possible to obtain the power required for a series of operations for fingerprint authentication (operating the fingerprint sensor, reading and acquiring the user's fingerprint, and authenticating it by comparing it with registered fingerprint data) from non-contact communication. The magnetic sheet 20 has openings (13, 14, 15, and 16, respectively) for exposing the external connection terminal substrate 3, the fingerprint sensor 4, the IC module 5, and the ground pattern 6. The thickness of the magnetic sheet 20 is 50 μm to 200 μm.

Figure 4 is a plan view showing the state in which the magnetic sheet 20 is laminated on the film-like substrate 10 of this embodiment. When the magnetic sheet 20 is laminated on the film-like substrate 10, each component mounted on the film-like substrate 10 is exposed from each opening of the magnetic sheet 20, so that by adjusting the height of the ground pattern 6 on the film-like substrate 10, the metal plate and the ground pattern 6 can be directly contacted and electrically connected. Furthermore, by applying an adhesive to both sides of the magnetic sheet 20 during lamination, the adhesion during lamination can be improved.

The film-like substrate 10 is laminated with a magnetic sheet 20, which is then sandwiched between a metal plate 22 and an exterior resin such as PI or PET, and laminated by heat pressing to integrate the card substrate. Here, instead of laminating by heat pressing, the card substrate can also be integrated by laminating using a cold press method using a two-component curing resin, room temperature curing resin, or UV curing resin. The sheet-like card substrate integrated by lamination is formed into the shape of individual cards by laser or cutting.

Although not shown in the diagram of this embodiment, the circuit configuration of the film-like substrate 10 can be provided with an ESD protection circuit configuration to prevent electrostatic discharge from damaging the fingerprint sensing circuit configuration or other parts of the metal card.

(Conductive contact configuration between metal plate and ground pattern)
A method of making a conductive contact between the metal plate 22 and the ground pattern 6 by adjusting the height of the ground pattern 6 on the film-like substrate 10 will be described with reference to FIG.

Figure 5(b) shows a plan view of the metal fingerprint authentication card and a schematic cross-sectional view on the Y-Y' plane. As shown in Figure 5(b), in the area of the ground pattern 6, the ground pattern 6 is exposed from the opening 16 of the magnetic sheet 20, so that by adjusting the height of the ground pattern 6 with the spacer 30, the metal plate 22 and the ground pattern 6 can be brought into direct contact with each other to provide electrical continuity.

As a method of conductive contact between the ground pattern 6 and the metal plate 22, as shown in 5(b), a spacer 30 for adjusting the height of the ground pattern is provided on the back surface of the film-like substrate 10 (the surface opposite to the surface with the ground pattern 6). In this case, by providing a U-shaped slit 9 surrounding the ground pattern 6 in the film-like substrate 10, the load caused by deformation of the ground pattern 6 in the height direction can be reduced. When adjusting the height using the spacer 30, the bottom surface positions of each component (the connection surface with the film-like substrate 10) are at different heights, so the circuit on the film-like substrate 10 curves in the card thickness direction. In this case, by cutting out the excess portion of the film-like substrate 10 (such as the periphery of the circuit portion) in a U-shape, it is possible to reduce the load on the circuit on the film-like substrate 10 when it is curved.

In order to electrically connect the ground pattern 6 on the film-like substrate 10 to the metal plate 22, it is necessary to form a punched hole in the magnetic sheet 20 that exists between them. The size of the punched hole is desirably larger than the outer size of the spacer. This is because the film-like substrate 10 is curved in the height direction due to the installation of the spacer, and the necessary space must be sufficiently secured.

The spacer 30 may have any shape, but it is desirable that the outer diameter size of the spacer 30 is larger than the outer size of the ground pattern 6. This is to reduce the effect of stress changes on the film-like substrate 10 and the ground pattern 6 caused by the spacer 30. The height of the spacer 30 is desirably 150 to 250 μm, since the magnetic sheet 20, the ground pattern 6, the adhesive layer 23, and the metal plate 22 are malleable.

<Embodiment 2>
Next, a second embodiment will be described with reference to Fig. 6. Fig. 6 is a schematic cross-sectional view of a metal fingerprint authentication card according to the second embodiment taken along the YY' plane. The basic configuration of the second embodiment is the same as that of the first embodiment.

(Conductive contact configuration between metal plate and ground pattern)
As a method of conductive contact between the ground pattern 6 and the metal plate 22 in the second embodiment, as shown in FIG. 6, a configuration in which the thickness of the plating for joining the ground pattern 6 on the film-like substrate 10 is increased, thereby increasing the thickness of the ground pattern 6 itself. Compared to the configuration in which the spacer 30 is provided in the first embodiment, the advantages include a small stress change in the film-like substrate 10, a small punched hole formed in the magnetic sheet 20, and a small number of manufacturing steps. The disadvantage is that the cost increases due to the increase in the plating thickness on the circuit. Since the magnetic sheet 20, the adhesive layer 23, and the metal plate 22 are malleable, the thickness of the ground pattern 6 is preferably 200 to 300 μm.

<Embodiment 3>
Next, a third embodiment will be described with reference to Fig. 7. Fig. 7 is a schematic cross-sectional view of a metal fingerprint authentication card according to the third embodiment taken along the YY' plane. The basic configuration of the third embodiment is the same as that of the first embodiment.

(Conductive contact configuration between metal plate and ground pattern)
As a method of electrically conductive contact between the ground pattern 6 and the metal plate 22 in the third embodiment, as shown in FIG. 7, a metal foil 31 for adjusting the height of the ground pattern 6 is provided on the back surface of the film-like substrate 10 (the surface opposite to the surface on which the ground pattern 6 is present). Since the circuit on the film-like substrate 10 exists on both sides, it is possible to form the metal foil 31 for adjusting the height on the surface opposite to the surface on which the ground pattern 6 is present, as shown in FIG. 7. At this time, a resist layer may be formed on the metal foil 31 on the back surface of the film-like substrate 10. The configuration of the third embodiment has the advantage that the mounting position accuracy is higher than that when the spacer 30 is used. Since the magnetic sheet 20, the adhesive layer 23, and the metal plate 22 have malleability, the total thickness of the ground pattern 6 and the height-adjusting metal foil 31 is preferably 200 to 300 μm.

Below, examples of cards that specifically embody the present invention will be shown.
Card dimensions: JIS X6301:2005 (ISO/IEC)
Long side: 85.47-85.72 mm (nominal value 85.6 mm)
Thickness: 0.68-0.84 mm (nominal value 0.76 mm)

1... Metal fingerprint authentication card 2... Surface substrate of metal fingerprint authentication card 3... External connection terminal 4... Active capacitive fingerprint sensor 5... IC module 6... Ground pattern 7... Wiring pattern 8... Loop antenna circuit 9... Slit (inside film substrate)
REFERENCE SIGNS LIST 10: Film-like substrate 13: Opening for external connection terminal 14: Opening for fingerprint sensor 15: Opening for IC module 16: Opening for ground pattern 20: Magnetic sheet 21: Exterior resin layer (surface)
22...Metal plate 23...Adhesive layer 24...Intermediate resin layer 25...Exterior resin layer (back side)
30: Spacer 31: Metal foil

Claims (4)

A metal fingerprint authentication card that is integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate between front and back card base materials,
At least a portion of the front card substrate of the front and back card substrates includes a metal plate,
The film-like substrate is provided with an IC module including an external connection terminal for communicating with an external device, an active capacitive fingerprint sensor for acquiring a user's fingerprint data, a wiring pattern for connecting each component, a loop antenna circuit for performing contactless communication, a fingerprint registration unit which is a memory for registering the user's fingerprint data, and a fingerprint matching processing unit for comparing and matching the user's fingerprint read by the fingerprint sensor with the fingerprint data registered in the fingerprint registration unit, and a ground pattern;
a U-shaped slit is provided in the film-like substrate so as to surround the ground pattern, and an opening is provided in the magnetic sheet at a position where the ground pattern is mounted when the magnetic sheet is laminated on the film-like substrate;
A metal fingerprint authentication card characterized in that a spacer for adjusting the height of the ground pattern is provided on the back side of the film-like substrate at the position where the ground pattern is arranged, and the metal plate and the ground pattern are brought into contact with each other. A metal fingerprint authentication card that is integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate between front and back card base materials,
At least a portion of the front card substrate of the front and back card substrates includes a metal plate,
The film-like substrate is provided with an IC module including an external connection terminal for communicating with an external device, an active capacitive fingerprint sensor for acquiring a user's fingerprint data, a wiring pattern for connecting each component, a loop antenna circuit for performing contactless communication, a fingerprint registration unit which is a memory for registering the user's fingerprint data, and a fingerprint matching processing unit for comparing and matching the user's fingerprint read by the fingerprint sensor with the fingerprint data registered in the fingerprint registration unit, and a ground pattern;
a U-shaped slit is provided in the film-like substrate so as to surround the ground pattern, and an opening is provided in the magnetic sheet at a position where the ground pattern is mounted when the magnetic sheet is laminated on the film-like substrate;
A metal fingerprint authentication card, characterized in that the thickness of the ground pattern itself is adjusted to bring the metal plate and the ground pattern into contact with each other. A metal fingerprint authentication card that is integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate between front and back card base materials,
At least a portion of the front card substrate of the front and back card substrates includes a metal plate,
The film-like substrate is provided with an IC module including an external connection terminal for communicating with an external device, an active capacitive fingerprint sensor for acquiring a user's fingerprint data, a wiring pattern for connecting each component, a loop antenna circuit for performing contactless communication, a fingerprint registration unit which is a memory for registering the user's fingerprint data, and a fingerprint matching processing unit for comparing and matching the user's fingerprint read by the fingerprint sensor with the fingerprint data registered in the fingerprint registration unit, and a ground pattern;
a U-shaped slit is provided in the film-like substrate so as to surround the ground pattern, and an opening is provided in the magnetic sheet at a position where the ground pattern is mounted when the magnetic sheet is laminated on the film-like substrate;
A metal fingerprint authentication card, characterized in that a metal foil is provided on the back surface of the film-like substrate at the position where the ground pattern is arranged, and the plating thickness of the metal foil is adjusted to bring the metal plate into contact with the ground pattern. 4. The metal fingerprint authentication card according to claim 1, wherein the circuit configuration inside the film substrate includes an ESD protection circuit configuration.

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