JP7689871B2 - Die bonding apparatus and method for manufacturing semiconductor device - Google Patents

Description

This disclosure relates to a die bonding device and is applicable, for example, to a die bonding device equipped with a recoil absorption mechanism.

One type of semiconductor manufacturing equipment is a die bonding device such as a die bonder that bonds semiconductor chips called dies to substrates such as wiring boards and lead frames. In a die bonder, the bonding head vacuum-sucks the die, then rises at high speed, moves horizontally, and descends to mount it on the substrate.

There is a high demand for high precision and high speed for die bonders, especially for the bonding head, which is the heart of bonding. Generally, when the speed of the equipment is increased, the vibration caused by the fast-moving object becomes larger, and this vibration makes it difficult for the equipment to achieve the desired precision.

One example of a recoil absorbing device that reduces this vibration is described in JP 2013-179206 A (Patent Document 1). Patent Document 1 discloses a technology that uses a linear motor as the drive shaft of the bonding head of a die bonder, and allows the fixed integrated part including a fixed magnet part to move freely as a counterweight, so that the movable integrated part including the bonding head and the fixed integrated part move in sync with each other to reduce vibration.

JP 2013-179206 A

However, in a structure in which the fixed integral part (stator) is freely moved by the reaction of the movable integral part (movable part), such as the technology disclosed in Patent Document 1, it is difficult to achieve fine movement control to reduce vibration.

The objective of this disclosure is to provide a die bonding device that can further reduce vibration.

A brief summary of representative aspects of this disclosure is as follows.
That is, the die bonding apparatus includes a driven body and a table for driving the driven body. The table includes a base, a linear motor including a first mover and a stator for moving the driven body, a first linear guide provided between the base and the stator for freely moving the stator, a second linear guide provided between the base and the first mover for freely moving the first mover, a second mover fixed to the base, and a control device for controlling the first mover and the second mover. The control device is configured to move the stator along the first linear guide by the second mover.

The above die bonding device makes it possible to further reduce vibration.

FIG. 1 is a top view of a table according to an embodiment. FIG. 2 is a front view of the table of FIG. FIG. 3 is a cross-sectional view taken along line AA of FIG. FIG. 4 is a cross-sectional view taken along line BB of FIG. FIG. 5 is a perspective view of a table in the embodiment. FIG. 6 is a perspective view illustrating the reaction absorbing operation of the table shown in FIG. FIG. 7 is a perspective view of the table shown in FIG. 6 when the stator is moved in the opposite direction to that in FIG. FIG. 8 is a perspective view illustrating a stroke of the first mover in the table shown in FIG. FIG. 9 is a perspective view of a table in the first modified example. FIG. 10 is a diagram showing the velocity and acceleration of the first mover and the waveform of the acceleration of the stator. FIG. 11 is a perspective view of a table in the second modified example. FIG. 12 is a perspective view of a table in the third modified example. Fig. 13(a) is a cross-sectional view of a table in the fifth modified example taken along line B-B in Fig. 1. Fig. 13(b) is a cross-sectional view of a table in another example of the fifth modified example taken along line B-B in Fig. 1. FIG. 14 is a top view of a table in the fourth modified example. FIG. 15 is a front view of the table of FIG. FIG. 16 is a cross-sectional view taken along line CC of FIG. FIG. 17 is a cross-sectional view taken along line DD of FIG. FIG. 18 is a perspective view illustrating a first reaction absorbing operation of the table in the fourth modified example. FIG. 19 is a perspective view illustrating a second reaction absorbing operation of the table in the fourth modified example. FIG. 20 is a perspective view showing a state in which the second mover of the table in the fourth modified example has been moved to a predetermined position. FIG. 21 is a perspective view showing a state in which the stator of the table in the fourth modified example has been moved in the traveling direction. FIG. 22 is a perspective view showing a state in which a first mover of the table in the fourth modified example has been moved in the traveling direction. FIG. 23 is a top view showing an outline of the die bonder in the first embodiment. FIG. 24 is a diagram for explaining the operation of the pickup head and the bonding head when viewed from the direction of the arrow A in FIG. FIG. 25 is a schematic cross-sectional view showing the main part of the die supply unit of FIG. FIG. 26 is a flow chart showing a method for manufacturing a semiconductor device using the die bonder of FIG. FIG. 27 is a top view showing an outline of the die bonder in the second embodiment. FIG. 28 is a perspective view of a table in the sixth modified example. FIG. 29 is a diagram showing the relationship between the speed of the first mover and the stator and time. FIG. 30 is a top view of a table in the seventh modified example. FIG. 31 is a front view of the table shown in FIG. FIG. 32 is a rear view of the table shown in FIG. FIG. 33 is a left side view of the table shown in FIG. FIG. 34 is a top view of a table in the eighth modified example. FIG. 35 is a rear view of the table shown in FIG.

The following describes the embodiments, modifications, and examples with reference to the drawings. However, in the following description, the same components are given the same reference numerals and repeated description may be omitted. Note that in the drawings, the width, thickness, shape, etc. of each part may be shown diagrammatically compared to the actual embodiment in order to make the description clearer, but these are merely examples and do not limit the interpretation of this disclosure.

The configuration of the table in the embodiment will be described with reference to Figures 1 to 5. Figure 1 is a top view of the table in the embodiment. Figure 2 is a front view of the table in Figure 1. Figure 3 is a cross-sectional view taken along line A-A in Figure 1. Figure 4 is a cross-sectional view taken along line B-B in Figure 1. Figure 5 is a perspective view of the first mover in a die bonding device having the table shown in Figure 1 before it is moved.

In the embodiment, the table 100 uses a linear motor as a driving source. The table 100 includes a base 101, a first linear guide 102 installed on the base 101, a second linear guide 103 arranged on the base 101 parallel to the first linear guide 102, and a stator 104 installed on the first linear guide 102. The base 101 is fixed to a stand (not shown) of the die bonding device 10. The first linear guide 102 and the second linear guide 103 extend in the Y-axis direction. The first linear guide 102 is configured to be longer than the second linear guide 103.

The stator 104 includes a magnet section 104a that is configured by arranging a large number of permanent magnets with alternating north and south poles in the Y direction, a flat yoke 104b that combines the magnetic flux of adjacent permanent magnets, and a first linear slider 104c that moves on the first linear guide 102. The magnet section 104a is provided on the upper surface of the yoke 104b, and the first linear slider 104c is provided on the lower surface of the yoke 104b.

The table 100 further includes a first mover 105 and a second mover 106 provided above the stator 104. The first mover 105 includes a coil portion 105a, a support 105b supporting the coil portion 105a, and a second linear slider 105c that moves on the second linear guide 103. The coil portion 105a includes a coil that generates magnetic flux by current and a yoke that connects the core and adjacent magnetic flux, forming an electromagnet. The support 105b is provided on the second linear slider 105c. The first mover 105 is freely movable on the second linear guide 103.

The second mover 106 includes a coil portion 106a and a support 106b that supports the coil portion 106a. The coil portion 106a has a similar configuration to the coil portion 105a. The support 106b is provided on the base 101. The second mover 106 is fixed to the base 101 and is immobile.

The length in the Y-axis direction of the first mover 105 (coil section 105a) and the second mover 106 (coil section 106a) is shorter than the length in the Y-axis direction of the stator 104 (magnet section 104a). The combined length in the Y-axis direction of the first mover 105 (coil section 105a) and the length in the Y-axis direction of the second mover 106 (coil section 106a) is also shorter than the length in the Y-axis direction of the stator 104 (magnet section 104a).

As shown in FIG. 5, the driven body 108 is connected to the first mover 105. The driven body 108 is, for example, a Z drive shaft that drives the bonding head in the vertical direction. The driven body 108 also includes the bonding head.

The table 100 also includes a scale 107 that is provided over substantially the entire area of the base 101 in the Y-axis direction. A linear sensor is formed by the scale 107 and, for example, an optical detection sensor (not shown) that is provided on the driven body 108. The linear sensor detects the position of the driven body 108 in the Y-axis direction, and movement control to a target position, such as position control or speed control, is performed based on the output of this linear sensor. This makes it possible to control the first mover 105, for example, by the control method described in JP 2015-173551 A.

The operation of the table 100 is controlled by the control device 110. That is, the control device 110 controls the operation of the table 100, for example, by driving I/O and actuators connected to the network to control the current flowing through the coils of the first mover 105 and the second mover 106.

The reaction absorption operation of the table in this embodiment will be explained using Figure 6. Figure 6 is a perspective view explaining the reaction absorption operation of the table shown in Figure 5.

The control device 110 virtually moves the second mover 106 in the same direction as the movement of the first mover 105 (Y-axis direction) in parallel with the movement of the first mover 105. Note that the second mover 106 cannot move because it is fixed to the base 101. If the second mover 106 were not fixed, passing a current so that the second mover 106 moves is called virtually moving the second mover 106.

Here, the mass of the first mover 105 is m1, the mass of the stator 104 is m2, the acceleration of the first mover 105 is a1, the acceleration of the second mover 106 is a2, the acceleration of the stator 104 is a3, the thrust acting on the first mover 105 is F1, the thrust acting on the second mover 106 is F2, and the thrust acting on the stator 104 is F3. The equations of motion for each are expressed by the following formulas.

F1=m1×a1...(1)
F2=m2×a2...(2)
F3=m2×a3...(3)

The reaction absorption (counter) mechanism is effective when the equations of motion of the first mover 105 and the stator 104 are equal. In other words, the following equation holds true:

F1=F3...(4)

Here, the thrust force on the stator 104 when the first mover 105 moves is F', and its acceleration is a'. The acceleration (a3) of the stator 104, which acts as a counterweight, is the sum of the acceleration (a'<a1) of the thrust force (F') on the stator 104 when the first mover 105 moves, and the acceleration (a2) of the second mover 106, which is stationary. In other words, the following equation holds:

a3=a'+a2...(5)
F3=F'+F2...(6)

The acceleration required for the second mover 106 at this time is calculated using the above formula. That is, it is calculated by substituting formulas (1), (3), and (5) into formula (4).

m1×a1=m2×a3
= m2(a'+a2)
∴a2=(m1/m2)×a1-a'...(7)

By setting the acceleration of the second mover 106 to a2 calculated by inputting numerical values into the above formula (7), it is effective as a counter mechanism. However, as described above, since the second mover 106 is fixed to the base 101, the stator 104 moves in the opposite direction to the first mover 105 instead of the second mover 106. This makes it possible to suppress vibration of the table 100.

In this embodiment, a second mover 106 is provided that is fixed to the base 101, and the stator 104 is allowed to move freely. This allows the stator 104 to be used as a counterweight, making it possible to miniaturize the counter mechanism. In addition, because the acceleration of the stator 104 is controlled by the stationary second mover 106, it is possible to adjust the appropriate vibration-damping movement distance for each table, enabling a counter mechanism that is tailored to machine differences.

The calculation of the acceleration and deceleration of the stator 104 in accordance with the acceleration of the first mover 105 is as described above. This will be explained using the V-T diagram shown in FIG. 29. FIG. 29 is a diagram showing the relationship between the speed and time of the first mover and the stator. When the acceleration time, constant speed time, and deceleration time of the first mover 105 are ta, tc, and td, respectively, the stator 104 operated by the second mover 106 also establishes a counter by matching the acceleration time, constant speed time, and deceleration time with the first mover 105. At this time, the stator 104 moved by the second mover 106 needs to move with the same stroke as the mover. However, when the stator 104 is used, it is possible to change the acceleration by the weight ratio, and this makes it possible to freely adjust the operating speed of the stator 104. Therefore, it is also possible to make the stroke range narrower than that of the first mover 105.

The table in this embodiment can freely control the counter operation, so if another table other than this table is mounted on the same device, the second mover of this table can move the stator, and when the other table is in operation, it can generate vibrations that cancel out the vibrations. This allows the table to be used without adding a vibration suppression mechanism to the other table, preventing enlargement and reducing both the space and costs within the device.

The stroke extension operation of the table in this embodiment will be described with reference to Figures 5 to 8. Figure 7 is a perspective view of the table shown in Figure 5 when the stator is moved in the opposite direction to that of Figure 6. Figure 8 is a perspective view explaining the stroke of the first mover in the table shown in Figure 7.

As described above, when the table 100 performs a recoil absorbing operation, as shown in FIG. 6, the control device 110 virtually moves the second movable element 106, which is stationary, in the same direction as the movement of the first movable element 105, causing the stator 104 to move in the opposite direction to the first movable element 105, thereby performing a counter operation. Here, the stroke (movable range) of the first movable element 105 is L1. Also, as shown in FIG. 5, before the first movable element 105 and the stator 104 move, the right end of the second movable element 106 is fixed at a distance of L2 from the right end of the stator 104.

As shown in FIG. 7, when the control device 110 virtually moves the second mover 106 in the direction opposite to the direction in which the first mover 105 moves (Y-axis direction), the stator 104 moves in the same direction as the first mover 105 moves. Since the stator 104 can move a maximum of L2, it is possible to extend the stroke of the first mover 105 from L1 to (L1 + L2), as shown in FIG. 8. In this way, when extending the stroke, the enlargement of the table can be kept to a minimum, and costs can be reduced through a compact design, reduced assembly labor, and a reduced number of parts.

For example, if this table is installed on the bonding table of a die bonding device, product quality and maintainability can be improved by providing a unit for replacing and cleaning consumables that handle dies, such as collets, within the extended stroke range, separate from the stroke for die bonding. Also, the stator can be made compact and inexpensive to drive long strokes, such as in a two-lane device in which two lanes for transporting substrates are arranged in the extension direction of the bonding table (Y-axis direction).

<Modification>
Below, some representative modified examples of the embodiment are exemplified. In the following description of the modified examples, the same reference numerals as those in the above-mentioned embodiment may be used for parts having the same configuration and function as those described in the above-mentioned embodiment. The description of such parts may be appropriately cited within the scope of technical inconsistency. Furthermore, a part of the above-mentioned embodiment and all or a part of the multiple modified examples may be appropriately applied in a composite manner within the scope of technical inconsistency.

(First Modification)
The table in the first modified example will be described with reference to Fig. 9 and Fig. 10. Fig. 9 is a perspective view of the table in the first modified example. Fig. 10 is a diagram showing waveforms of the velocity and acceleration of the first mover and the acceleration of the stator.

As shown in FIG. 9, the table 100 in the first modified example has an acceleration sensor 109 provided at the tip of the driven body 108 connected to the first mover 105 of the table in the embodiment, and the other configuration is the same as the table in the embodiment.

When the first mover 105 accelerates and decelerates as shown in FIG. 10, the stator 104 operates with an acceleration time waveform (FAW) that is in the opposite phase to the acceleration time waveform (MAW) of the first mover 105, thereby establishing a counter. As described above, the control device 110 in the embodiment independently controls the first mover 105 and the second mover 106, and moves the second mover 106 asynchronously in the same direction as the movement of the first mover 105 to perform a counter operation. In the first modified example, during a counter operation similar to that of the embodiment, the acceleration sensor 109 measures the waveform of the swing back that occurs with the acceleration, and reflects it in the standard acceleration waveform in which the second mover 106 is operating the stator 104.

Specifically, the measurement unit and calculation unit of the control device 110 calculate a waveform with an opposite phase from the waveform measured by the acceleration sensor 109, thereby determining the acceleration of the second movable element 106 in real time and establishing a counter operation.

The counter operation in this embodiment is performed for optimal operation evaluated by measuring acceleration, etc., during an operation such as bonding that is performed in advance. For example, a standard value obtained from previously stored measurement data, or a value evaluated by taking a correlation with vibrations caused by previously calculated acceleration, is used. A thrust is calculated from the calculated acceleration of the first mover 105 and the weight of the first mover 105 for the optimal operation obtained from the evaluation results, and kinetic energy is calculated. The required acceleration is calculated from the weight of the entire stator 104 so that the energy is the same as this kinetic energy. The acceleration required for the stator 104 is input to the second mover 106 at the same time as the acceleration time of the first mover 105, and then executed.

When the acceleration is measured in real time by the acceleration sensor 109 as in this modified example, the control device 110 that performs the above calculations performs the calculations each time and corrects them in real time, so that the counter can automatically operate at the appropriate acceleration. The acceleration of the first mover 105 of the bonding head or the like in the embodiment is automatically set from the set speed, but this modified example is effective because it may change due to changes over time in the load of the linear guide or the like.

(Second Modification)
The table in the second modified example will be described with reference to Fig. 11. Fig. 11 is a perspective view of the table in the second modified example.

The table 100 in the second modified example has two or more weight sensors 201 provided parallel to the first linear guide 102 or the second linear guide 103 under a common base 101 on which the first linear guide 102 and the second linear guide 103 in the embodiment are mounted, and the other configuration is the same as the table in the embodiment. If only the counter operation of the Y-axis operation is required, it is sufficient to install them at both ends (two locations) in the Y-axis direction of the base 101, and if the center of gravity of the X-axis is also taken into consideration, they are installed at the four corners (four locations) of the base 101 as shown in FIG. 11.

In the second modified example, the following control is performed in the counter operation in the embodiment. Before the first mover 105 moves, for example, the weights of the two weight sensors 201 are stored, and when the first mover 105 moves, the second mover 106 controls the movement of the stator 104 so as to maintain the weight balance detected by these weight sensors 201. In other words, the second mover 106 applies a thrust to the stator 104, controlling its movement in the opposite direction to that of the first mover 105, so that the combined center of gravity of the first mover 105 and the stator 104 is always in the same position as the center of gravity before the start of operation, even when the first mover 105 moves.

The following is performed in advance by manual operations. Here, the weight balance is, for example, the ratio of the weights detected by the two weight sensors 201, and is not an absolute weight. Also, an example will be described in which the driven body 108 is a bonding head.

(Simple operation)
(1-1) The first mover 105 that drives the bonding head is moved to the die pick-up position (start position) and the weight balance at that position is measured. Here, the stator 104 remains at the start position.
(1-2) The first mover 105 is moved to the die bonding position (stop position) and its weight balance is measured. At this time, the stator 104 is not moved and remains at the starting position.
(1-3) With the first mover 105 moved to the bonding position, the stator 104 is moved until it reaches the weight balance of the pick-up position (start position), and the position is stored.
(1-4) In the same time as the first mover 105 moves (on the Y axis) from the pick-up position (start position) to the bonding position (stop position), the stator 104 is moved between its start position and the position (1-3).

(Detailed operation)
When the bonding head is accelerating, the operation described in the first modified example is performed, and when the bonding head is moving at a low speed, the above-mentioned movement is performed taking into consideration the weight balance, including the amount of movement during acceleration.

The weight sensor 201 may be installed on the base 101 below both ends of the first linear guide 102 and the second linear guide 103.

(Third Modification)
The table in the third modified example will be described with reference to Fig. 12. Fig. 12 is a perspective view of the table in the third modified example.

The table 100 in the third modified example has vibration dampers or balancers (pendulum counters) or other vibration-damping members 202 for absorbing vibrations in the Z direction, which are provided on the base 101 and below both ends of the first linear guide 102 and the second linear guide 103 in the embodiment, and the other configurations are the same as those of the table in the embodiment. Note that the vibration dampers 202 may also be provided on the stand of the device, below the four corners of the base 101.

(Fourth Modification)
The configuration of the table in the fourth modified example will be described with reference to Fig. 14 to Fig. 17. Fig. 14 is a top view of the table in the fourth modified example. Fig. 15 is a front view of the table in Fig. 14. Fig. 16 is a cross-sectional view taken along line CC in Fig. 14. Fig. 17 is a cross-sectional view taken along line DD in Fig. 14.

The table 100 in the fourth modified example further includes an electromagnetic clutch 111 that fixes and moves the stator 104, and a fixed plate 112 that fixes the second mover 106, in addition to the table in the embodiment. The second mover 106 is provided on the second linear guide 103, similar to the first mover 105. Therefore, the second linear guide 103 is configured to extend longer in the Y-axis direction than in the embodiment. The second mover 106 in the third modified example includes a support 106b that supports the coil portion 106a, and a second linear slider 106c that moves on the second linear guide 103. The support 106b is provided on the second linear slider 105c, similar to the support 105b. The other configurations of the table 100 in the third modified example are the same as in the embodiment.

The electromagnetic clutch 111 is composed of a coil, and the electromagnetic force generated by passing current through the coil attracts the yoke 104b of the stator 104, which is made of a ferromagnetic material, and fixes the stator 104. By cutting off the current to the coil, the electromagnetic force disappears, the force attracting the yoke 104b disappears, and the stator 104 becomes movable. The electromagnetic clutch 111 makes it possible to fix the stator 104 at any position.

The fixed plate 112 is made of a ferromagnetic material and is arranged to extend along the second linear guide 103. The support 106b is equipped with a coil similar to the electromagnetic clutch 111, and the electromagnetic force generated by passing current through the coil attracts the fixed plate 112 and fixes the second mover 106. By cutting off the current to the coil, the electromagnetic force disappears and the force attracting the fixed plate 112 disappears, allowing the second mover 106 to move. The electromagnetic clutch function of the support 106b and the fixed plate 112 make it possible to fix the second mover 106 at any position.

The reaction absorbing operation of the table in the fourth modified example will be described with reference to Figures 18 and 19. Figure 18 is a perspective view illustrating the first reaction absorbing operation of the table in the fourth modified example. Figure 19 is a perspective view illustrating the second reaction absorbing operation of the table in the fourth modified example.

When the first mover 105 performs a large movement, as shown in FIG. 18, the second mover 106 is fixed to the fixed plate 112 by the electromagnetic clutch function of the support 106b, and the stator 104 is made movable by the electromagnetic clutch 111, and the counter movement is performed by the stator 104 as in the embodiment.

When the first mover 105 performs a small movement, as shown in FIG. 19, the electromagnetic clutch function of the support 106b allows the second mover 106 to move, and the electromagnetic clutch 111 fixes the stator 104, performing a counter movement by the second mover 106.

The stroke extension operation of the table in the fourth modified example will be described with reference to Figures 20 to 22. Figure 20 is a perspective view showing the state in which the second mover of the table in the fourth modified example has been moved to a predetermined position. Figure 21 is a perspective view showing the state in which the stator of the table in the fourth modified example has been moved in the travel direction. Figure 22 is a perspective view showing the state in which the first mover of the table in the fourth modified example has been moved in the travel direction.

The stator 104 is fixed by the electromagnetic clutch 111, and the second mover 106 is made movable by the electromagnetic clutch function of the support 106b. As shown in FIG. 20, after the second mover 106 is moved a predetermined distance in the direction of movement of the first mover 105, the second mover 106 is fixed by the electromagnetic clutch function of the support 106b. As shown in FIG. 21, when the second mover 106 is virtually moved in the direction opposite to the direction of movement of the first mover 105, the stator 104 moves in the same direction as the direction of movement of the first mover 105. This makes it possible to extend the stroke of the first mover 105, as in the embodiment, as shown in FIG. 22.

(Fifth Modification)
The configuration of the table in the fifth modified example will be described with reference to Figures 13(a) and 13(b). Figure 13(a) is a cross-sectional view of the table in the fifth modified example taken along line B-B in Figure 1. Figure 13(b) is a cross-sectional view of another example of the fifth modified example taken along line B-B in Figure 1.

The table in the fifth modified example further includes a linear sensor that detects the position of the stator 104 relative to the table in the embodiment.

As shown in FIG. 13(a), a linear sensor is formed by a scale 107a installed on the side of the stator 104 facing the second movable element 106, and an optical detection sensor 109a provided on the support 106b of the second movable element 106. As a result, the stator 104 is also controlled to move to a target position, such as by position control or speed control, based on the output of the linear sensor. For example, the second movable element 106 can be controlled by the control method described in JP 2015-173551 A.

As shown in FIG. 13(b), a linear sensor may be formed by an optical detection sensor 109b provided on the stator 104 and a scale 107 provided on the base 101.

(Sixth Modification)
The configuration of the table in the sixth modified example will be described with reference to Fig. 28. Fig. 28 is a perspective view of the table in the sixth modified example.

In the embodiment, an example has been described in which the arrangement of the N poles and S poles of the permanent magnets of the magnet part 104a of the stator 104 is uniform, but as shown in FIG. 28, the arrangement of the N poles and S poles of the permanent magnets of the part of the magnet part 104a of the stator 104 that operates in opposition to the second mover 106 may be made denser or the size of the magnet may be changed to increase the thrust. That is, in the sixth modified example, the N poles and S poles of the magnet part 104a arranged on the yoke 104b are further subdivided without changing the arrangement, thereby enabling detailed operation of the coil part 106a of the second mover 106. Usually, the weight of the stator made of a magnet plate is heavy and the amount of movement is small. The narrower the interval between the S pole and the N pole, the more accurate the movement of the small stroke. As a result, even if the weights of the first mover 105 and the stator 104 are significantly different and the amount of movement is different (very small), they can be operated in synchronization with the same accuracy. For example, with a weight ratio of 5:1, arranging the SN poles at five times the density makes synchronous control easier.

(Seventh Modification)
The configuration of the table in the seventh modified example will be described with reference to Fig. 30 to Fig. 33. Fig. 30 is a top view of the table in the seventh modified example. Fig. 31 is a front view of the table shown in Fig. 30. Fig. 32 is a rear view of the table shown in Fig. 30. Fig. 33 is a left side view of the table shown in Fig. 30.

In the embodiment, the scale 107 of the linear sensor that detects the position of the first mover 105 is provided on the base 101, but in the seventh modified example, a scale 213 for detecting the position of the first mover 105 is provided on the stator 104. In addition, in the seventh modified example, a scale 215 for detecting the position of the stator 104 is also provided on the stator 104. Furthermore, in the seventh modified example, the scales 213 and 215 are provided on the stator 104, so the structure of the stator 104 differs from the embodiment. The table 100 in the seventh modified example has the same configuration as the embodiment, except for the configuration related to the linear sensor. Below, the table 100 in the seventh modified example will be described, focusing on the differences from the embodiment.

First, the stator 104 in the seventh modified example will be described. As shown in FIG. 33, the yoke 104b is U-shaped in side view. The magnet portion 104a is provided on the underside of the upper horizontal portion and the upper side of the lower horizontal portion of the yoke 104b, and the first linear slider 104c is provided on the underside of the lower horizontal portion of the yoke 104b.

Next, the first mover 105 in the seventh modified example will be described. The support 105b is erected on the second linear slider 105c and extends above the upper surface of the upper horizontal part of the yoke 104b. The coil part 105a is supported by the support 105b so as to be located midway between the upper horizontal part and the lower horizontal part of the yoke 104b in the vertical direction.

Next, the second mover 106 in the seventh modified example will be described. The second mover 106 has the same structure as in the embodiment, and the coil portion 106a is supported on the upper side of the support 106b so as to be located midway in the vertical direction between the upper horizontal portion and the lower horizontal portion of the yoke 104b.

Next, a linear sensor in the seventh modified example will be described. A scanning head 212 for the first mover 105 is connected to the upper surface of the support 105b of the first mover 105. A driven body similar to the driven body 108 shown in the embodiment is connected to the scanning head 212. A scanning head 214 for the stator 104 is supported on the upper surface of a support 216 fixed on the base 101.

The table 100 also includes a scale 213 for the first mover 105, which is provided on the upper surface of the upper horizontal portion of the yoke 104b and extends in the Y-axis direction, and a scale 215 for the stator 104, which is provided on the side surface of the vertical portion of the yoke 104b over substantially the entire area in the Y-axis direction. The scale 213 and an optical detection sensor (not shown) provided in the scanning head 212 form a first linear sensor. The scale 215 and an optical detection sensor (not shown) provided in the scanning head 214 form a second linear sensor.

The first linear sensor detects the position of the first mover 105 in the Y-axis direction relative to the stator 104, and the second linear sensor detects the position of the stator 104 in the Y-axis direction relative to the base 101. Based on the outputs of the first and second linear sensors, movement control to a target position, such as position control or speed control, is performed.

Hall sensors are generally used in motors. Hall sensors are sensors that apply the galvanomagnetic effect known as the Hall effect. Typical applications include rotation detection, position detection, open/close detection, current detection, and direction detection. In linear motors, they are used for position detection by converting the strength and direction of a magnetic field into voltage.

To implement a counter mechanism using a linear motor, it is necessary to accurately detect the direction in which the coil part 105a of the first mover 105 moves when the magnet part 104a of the stator 104 moves, and to be able to move the specified distance. If the phases of the first mover 105 and the stator 104 are different, torque shortages and reverse operation may occur.

When using a linear sensor to detect the position (absolute position) of the first mover 105 relative to the base 101, the stator 104 moves during counter operation, so the relative positions of the first mover 105 and the stator 104 cannot be determined. Therefore, it is necessary to use a Hall sensor provided on the coil portion 105a of the first mover 105 to detect the position of the first mover 105 relative to the stator 104, and perform control so that the phases of the first mover 105 and the stator 104 do not differ (are the same).

In the seventh modified example, a scale 215 for the first mover 105 is attached to the stator 104 side to grasp the relative position between the first mover 105 and the stator 104. This allows the position of the scale 215 during the operation of the stator 104 to follow the arrangement of the magnetic poles of the magnet section 104a. Therefore, the relative positional relationship between the first mover 105 and the stator 104 can be grasped without control, and it is possible to flow a current with the correct phase (θ), so that the linear motor can generate a correct thrust. At this time, in order to move the first mover 105 to the target position, it is necessary to take into account the amount of movement of the stator 104 in the counter operation control. The amount of movement of the stator 104 in the counter operation control is calculated from the time-speed change of the stator 104 based on the weight ratio of the first mover 105 and the stator 104.

(Eighth Modification)
The configuration of the table in the eighth modified example will be described with reference to Figures 34 and 35. Figure 34 is a top view of the table in the eighth modified example. Figure 35 is a rear view of the table shown in Figure 34.

In the seventh modified example, separate scales are used for the scale 213 for the first mover 105 and the scale 215 for the stator 104. In the eighth modified example, one scale 213 is provided to cover the entire area of the stator 104, and a first linear sensor on the first mover 105 and a second linear sensor on the second mover 106 fixed to the base 101 each detect different positions of the same scale 213.

Below, we will explain an example in which the table in the embodiment or the modified example is applied to a die bonder, which is an example of a die bonding device.

Figure 23 is a top view showing an outline of the die bonder in the first embodiment. Figure 24 is a diagram explaining the operation of the pickup head and bonding head when viewed from the direction of arrow A in Figure 23.

The die bonder 10 is broadly divided into a die supply section 1 that supplies the die D to be mounted on the substrate S, a pickup section 2, an intermediate stage section 3, a bonding section 4, a transport section 5, a substrate supply section 6, a substrate unloading section 7, and a control device 8 that monitors and controls the operation of each section. The Y-axis direction is the front-to-back direction of the die bonder 10, and the X-axis direction is the left-to-right direction. The die supply section 1 is located at the front side of the die bonder 10, and the bonding section 4 is located at the back side. Here, one or more product areas (hereinafter referred to as package areas P) that will become one final package are printed on the substrate S.

First, the die supply unit 1 supplies a die D to be mounted in the package area P of the substrate S. The die supply unit 1 has a wafer holder 12 that holds a wafer 11, and a peeling unit 13, shown by a dotted line, that peels the die D from the wafer 11. The die supply unit 1 moves in the X and Y axis directions by a driving means (not shown), and moves the die D to be picked up to the position of the peeling unit 13.

The pickup unit 2 has a pickup head 21 that picks up the die D, a pickup head Y drive unit 23 that moves the pickup head 21 in the Y-axis direction, and various drive units (not shown) that raise and lower, rotate, and move the collet 22 in the X-axis direction. The pickup head 21 has a collet 22 (see also FIG. 24) that suctions and holds the peeled die D at its tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has various drive units (not shown) that raise and lower, rotate, and move the collet 22 in the X-axis direction.

The intermediate stage section 3 has an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding unit 4 picks up a die D from the intermediate stage 31 and bonds it on the package area P of the substrate S being transported, or bonds it by stacking it on top of a die already bonded on the package area P of the substrate S. The bonding unit 4 has a bonding head 41 equipped with a collet 42 (see also FIG. 24) that suction-holds the die D at its tip like the pickup head 21, a Y-axis drive unit 43 that moves the bonding head 41 in the Y-axis direction, and a substrate recognition camera 44 that captures an image of a position recognition mark (not shown) in the package area P of the substrate S and recognizes the bonding position. The Y-axis drive unit 43 is configured with a table that is any one of the embodiment and the first to fourth modified examples or a combination of them. The bonding head 41 is the driven body 108 in the embodiment. With this configuration, the bonding head 41 corrects the pickup position and posture based on the image data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and bonds the die D to the substrate based on the image data of the substrate recognition camera 44.

The transport unit 5 has a substrate transport claw 51 that grips and transports the substrate S, and a transport lane 52 along which the substrate S moves. The substrate S moves by driving a nut (not shown) of the substrate transport claw 51 provided on the transport lane 52 with a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 6 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate discharge unit 7 and hands the substrate S over to the substrate discharge unit 7.

The control device 8 corresponds to the control device 110 in the embodiment, and includes a memory that stores a program (software) that monitors and controls the operation of each part of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory.

Next, the configuration of the die supply unit 1 will be described with reference to Figure 25. Figure 25 is a schematic cross-sectional view showing the main parts of the die supply unit in Figure 23.

The die supply unit 1 includes a wafer holder 12 that moves horizontally (XY axis directions) and a peeling unit 13 that moves vertically. The wafer holder 12 has an expand ring 15 that holds a wafer ring 14, and a support ring 17 that horizontally positions a dicing tape 16 held by the wafer ring 14 and having multiple dies D attached thereto. The peeling unit 13 is disposed inside the support ring 17.

When the die D is pushed up, the die supply unit 1 lowers the expand ring 15 holding the wafer ring 14. As a result, the dicing tape 16 held by the wafer ring 14 is stretched, widening the gap between the dies D, and the peeling unit 13 peels the dies D from the dicing tape 16, improving the pick-up of the dies D. The adhesive that bonds the dies to the substrate changes from liquid to film, and a film-like adhesive material called a die attachment film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. In the case of a wafer 11 having a die attachment film 18, dicing is performed on the wafer 11 and the die attachment film 18. Therefore, in the peeling process, the wafer 11 and the die attachment film 18 are peeled off from the dicing tape 16.

Next, a method for manufacturing a semiconductor device using the die bonder in the first embodiment will be described with reference to FIG. 26. FIG. 26 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder in FIG. 23.

(Wafer/substrate loading process: step S11)
The wafer ring 14 holding the dicing tape 16 to which the die D separated from the wafer 11 is affixed is stored in a wafer cassette (not shown) and is carried into the die bonder 10. The control device 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. In addition, the control device 8 prepares the substrate S and carries it into the die bonder 10. The control device 8 attaches the substrate S to the substrate transport claws 51 in the substrate supply unit 6.

(Pickup process: step S12)
The control device 8 peels off the die D as described above, and picks up the peeled die D from the wafer 11. In this way, the die D peeled off from the dicing tape 16 together with the die attachment film 18 is attracted to and held by the collet 22 and transported to the next process (step S13). Then, when the collet 22 that has transported the die D to the next process returns to the die supply unit 1, the next die D is peeled off from the dicing tape 16 according to the above-mentioned procedure, and thereafter, the dies D are peeled off one by one from the dicing tape 16 according to the same procedure.

(Bonding process: step S13)
The control device 8 mounts the picked-up die on the substrate S or stacks it on top of an already bonded die. The control device 8 places the die D picked up from the wafer 11 on the intermediate stage 31, and the bonding head 41 picks up the die D again from the intermediate stage 31 and bonds it to the transported substrate S.

(Substrate removal process: step S14)
The control device 8 removes the substrate S having the bonded die D from the substrate transport claws 51 at the substrate unloading section 7. The control device 8 unloads the substrate S from the die bonder 10.

As described above, the die D is mounted on the substrate S via the die attach film 18 and is carried out from the die bonder. Thereafter, in the wire bonding process, the die D is electrically connected to the electrode of the substrate S via the Au wire. Next, the substrate S on which the die D is mounted is carried into the die bonder, and the second die D is stacked on the die D mounted on the substrate S via the die attach film 18, and after being carried out from the die bonder, is electrically connected to the electrode of the substrate S via the Au wire in the wire bonding process. The second die D is peeled off from the dicing tape 16 by the above-mentioned method, and then transported to the pelleting process and stacked on the die D. After the above process is repeated a predetermined number of times, the substrate S is transported to the molding process, and the multiple dies D and the Au wires are sealed with molding resin (not shown) to complete the stacked package.

Figure 27 is a top view showing an outline of the die bonder in the second embodiment.

The die bonder 10 in the second embodiment is broadly composed of a wafer supply section 301, a work supply and transport section 305, a preform section 302, a die bonding section 304, and a control device 308 that monitors and controls the operation of each section.

The wafer supply section 301 includes a wafer cassette lifter 311 and a wafer ring holder 312. The work supply/transport section 305 includes a frame pusher 353, a loader lifter 354, a frame feeder 355, a loader 356, and an unloader 357. The die bonding section 304 includes a bonding head 341 and a bonding table 343. The preform section 302 includes a preform head 321 and a preform table 323.

A wafer cassette filled with wafer rings 14 is set on the wafer cassette lifter 311, and the wafer rings 14 are supplied to the wafer ring holder 312. In parallel with this, the work supplied by the frame pusher 353 or the loader lifter 354 of the loader 356 is coated with a die adhesive or cleaned by the preform section 302, and is transported on the frame feeder 355 to the bonding point.

In the wafer ring holder 312, as in the first embodiment, the dicing tape (not shown) is stretched (expanded) downward to increase the spacing between the dies (not shown) and improve die pick-up performance. The die is then pushed up from below by the push-up section 313 via the dicing tape, picked up by the bonding head 341, and further bonded to a workpiece (not shown) such as a lead frame. The wafer ring holder 312 is placed on an XY linear motion table, and after pick-up, it moves linearly to the next die position and repeats the die bonding operation.

The bonding head 341 is mounted on a bonding table 343. The bonding table 343 may be any one of the embodiments and the first to fourth modified examples, or a combination of them. The preform table 323 that drives the preform head 321, the XY table that drives the wafer ring holder 312, and the XY table that drives the push-up portion 313 may be any one of the embodiments and the first to fourth modified examples, or a combination of them.

The disclosure made by the present inventors has been specifically described above based on the embodiments, modifications, and examples, but it goes without saying that the present disclosure is not limited to the above embodiments, modifications, and examples, and various modifications are possible.

For example, in the embodiment, an example of a table that moves a driving body in a horizontal direction has been described, but the present invention may also be applied to a table that moves a driving body in a vertical direction.

In the embodiment, an example of a bonding head is described as the driven body, but it may also be an optical system unit used in a die bonding mechanism such as the board recognition camera in the first embodiment.

In the first modified example, an example of suppressing vibration by measuring acceleration has been described, but vibrations within the device may also be suppressed by using a vibration sensor to pick up vibrations from a table or the like of another unit and feeding them back. That is, a vibration sensor is used to pick up vibrations when the other unit is operating, convert them directly into an inverse phase, and send a command to the second mover 106 that moves the stator 104, which is a counter, to suppress vibrations. For example, a similar structure is provided for the three axes X, Y, and Z, and vibrations are suppressed by operating the stator of the axis that is not actually operated so as to cancel out the composite waveform of acceleration calculated from the three-dimensional acceleration sensor and linear sensor. Here, the first mover of the axis that is not operated is operated so as to maintain its original position.

The Y-axis drive unit 23 in the first embodiment may be configured as a table of any one of the embodiments and the first to sixth variants, or a combination of these.

In the first embodiment, a die bonder was described in which a die is picked up from a die supply unit by a pickup head and placed on an intermediate stage, and the die placed on the intermediate stage is bonded to a substrate by a bonding head. However, the present invention can also be applied to a flip chip bonder in which a die is picked up from a die supply unit, the die pickup head is rotated upwards, and the die is transferred to a transfer head or bonding head, and the bonding head bonds the die to a substrate.

10...Die bonder (die bonding device)
REFERENCE SIGNS LIST 101: Base 102: First linear guide 103: Second linear guide 104: Stator 105: First mover 106: Second mover 108: Driven body 110: Control device

Claims (22)

A driven body;
A table that drives the driven body;
Equipped with
The table includes:
With the base,
A linear motor including a first mover and a stator for moving the driven body;
a first linear motion guide provided between the base and the stator to allow the stator to freely move;
a second linear motion guide provided between the base and the first movable element and allowing the first movable element to freely move;
A second mover fixed to the base;
A control device for controlling the first mover and the second mover;
Equipped with
The control device is a die bonding apparatus configured to suppress vibration during operation of the driven body by moving the first movable element along the second linear guide in a first direction and by causing the second movable element to move the stator along the first linear guide in a second direction that is opposite to the first direction. 2. The die bonding apparatus according to claim 1,
a first linear sensor for detecting a position of the first mover;
The control device is a die bonding apparatus configured to perform position control, speed control, or movement control to a target position of the first mover based on an output of the first linear sensor. 3. The die bonding apparatus according to claim 2 ,
a second linear sensor for detecting a position of the stator;
The control device is a die bonding apparatus configured to perform position control, speed control, or movement control of the stator to a target position based on an output of the second linear sensor. A driven body;
A table that drives the driven body;
Equipped with
The table includes:
With the base,
A linear motor including a first mover and a stator for moving the driven body;
a first linear motion guide provided between the base and the stator to move the stator;
A second mover;
a second linear motion guide provided between the base and the first and second movers to move the first and second movers;
A first fixing portion that fixes and releases the stator;
A second fixing portion that fixes and releases the second movable element;
a control device that controls the first mover, the second mover, the first fixed portion, and the second fixed portion;
Equipped with
The control device includes:
The first fixing portion allows the stator to move, and the second fixing portion fixes the second movable element;
The die bonding apparatus is configured to suppress vibration during operation of the driven body by moving the first movable element along the second linear guide in a first direction and by causing the second movable element to move the stator along the first linear guide in a second direction that is opposite to the first direction. A driven body;
A table that drives the driven body;
Equipped with
The table includes:
With the base,
A linear motor including a first mover and a stator for moving the driven body;
a first linear motion guide provided between the base and the stator to move the stator;
A second mover;
a second linear motion guide provided between the base and the first and second movers to move the first and second movers;
A first fixing portion that fixes and releases the stator;
A second fixing portion that fixes and releases the second movable element;
a control device that controls the first mover, the second mover, the first fixed portion, and the second fixed portion;
Equipped with
The control device includes:
The stator is fixed by the first fixing portion, and the second movable element is made movable by the second fixing portion;
The die bonding apparatus is configured to suppress vibration during operation of the driven body by moving the first movable element along the second linear guide in a first direction and moving the second movable element along the second linear guide in a second direction that is opposite to the first direction. 5. The die bonding apparatus according to claim 4 ,
The control device includes:
the stator is fixed by the first fixing portion, and the second movable element is made movable by the second fixing portion, and the second movable element is moved a predetermined distance along the second linear motion guide in the first direction;
The die bonding device is configured to expand the movable range of the first movable element in the first direction by making the stator movable using the first fixing portion, fixing the second movable element using the second fixing portion, and moving the stator along the first linear guide in a second direction that is opposite to the first direction using the second movable element. 6. The die bonding apparatus according to claim 5,
The control device includes:
the stator is fixed by the first fixing portion, and the second movable element is made movable by the second fixing portion, and the second movable element is moved a predetermined distance along the second linear motion guide in the first direction;
The die bonding device is configured to expand the movable range of the first movable element in the first direction by making the stator movable using the first fixing portion, fixing the second movable element using the second fixing portion, and moving the stator along the first linear guide in a second direction that is opposite to the first direction using the second movable element. In the die bonding apparatus according to any one of claims 1 to 3 ,
The control device is a die bonding apparatus configured to expand the movable range of the first movable element in the first direction by moving the stator along the first linear guide in the first direction using the second movable element. 4. The die bonding apparatus according to claim 1,
The stator includes a plurality of permanent magnets and a yoke that couples magnetic fluxes of adjacent permanent magnets,
the first movable element is disposed above the stator and includes a first coil portion forming an electromagnet, and a support body disposed on the second linear motion guide and supporting the first coil portion;
The second movable element is a die bonding apparatus comprising: a second coil portion arranged above the stator and forming an electromagnet; and a support arranged on the base and supporting the second coil portion. 8. The die bonding apparatus according to claim 4 ,
The stator includes a plurality of permanent magnets and a yoke that couples magnetic fluxes of adjacent permanent magnets,
The first mover and the second mover are each provided with a coil portion disposed above the stator and forming an electromagnet, and a support disposed on the second linear motion guide and supporting the coil portion;
The first fixed portion is disposed adjacent to the stator and is configured by an electromagnet,
A die bonding apparatus, wherein the second fixing portion is an electromagnet provided on the support body of the second movable element. In the die bonding apparatus according to any one of claims 1 , 4 and 5 ,
The control device is a die bonding apparatus configured to control the second movable element to move the stator based on a waveform that is in opposite phase to the acceleration time waveform of the first movable element when the first movable element is accelerated or decelerated. 12. The die bonding apparatus according to claim 11 ,
The control device is configured to independently control the first mover and the second mover via a network and to move the stator in the same direction as the operation of the first mover. 13. The die bonding apparatus of claim 12 ,
the driven body is provided with an acceleration sensor at its tip,
The control device is a die bonding device configured to measure the waveform of the rebound swing that occurs due to acceleration when the first movable element is accelerated or decelerated using the acceleration sensor, and to reflect this in a standard acceleration waveform in which the second movable element operates the stator. In the die bonding apparatus according to any one of claims 1 , 4 and 5 ,
The control device is a die bonding device configured to apply a thrust to the stator using the second movable element so that the combined center of gravity of the first movable element and the stator is always in the same position as the center of gravity before the start of operation, even when the first movable element moves. 15. The die bonding apparatus of claim 14 ,
Further, the device includes two or more weight sensors,
The weight sensor is provided below the base in parallel with the first linear guide or the second linear guide, or below both ends of the first linear guide and the second linear guide and above the base;
The control device is a die bonding apparatus configured to store the weight detected by the weight sensor before the first movable element is moved, and to move the stator using the second movable element so as to maintain a weight balance based on the stored weight when the first movable element is in operation. In the die bonding apparatus according to any one of claims 1 , 4 and 5 ,
Further, the present invention includes a table different from the table, and a sensor for detecting vibration of the table different from the table,
The control device is configured to move the stator by the second mover based on the detected vibration. 8. The die bonding apparatus according to claim 1,
The stator includes a plurality of permanent magnets and a yoke that couples magnetic fluxes of adjacent permanent magnets,
A die bonding apparatus, wherein a portion of the stator that overlaps with the second mover in a top view has the permanent magnets arranged more densely than other portions of the stator. In the die bonding apparatus according to any one of claims 1 , 4 and 5 ,
A die bonding apparatus in which balancers or dampers for absorbing vertical vibrations are provided under both ends of the first linear guide. 8. The die bonding apparatus according to claim 1,
The driven body is a bonding head that picks up a die and bonds it to a substrate. 8. The die bonding apparatus according to claim 1,
The driven body is a preform head that applies a die adhesive to a substrate or cleans the substrate. a substrate carrying step of carrying a substrate into a die bonding apparatus including a bonding head, a table for driving the bonding head, a base, a linear motor including a first mover and a stator for moving the bonding head in a horizontal direction, a first linear guide provided between the base and the stator for freely moving the stator, a second linear guide provided between the base and the first mover for freely moving the first mover, and a second mover fixed to the base;
a bonding step of picking up and bonding a die to the substrate;
Equipped with
The bonding process comprises moving the first movable element along the second linear guide in a first direction, and causing the second movable element to move the stator along the first linear guide in a second direction opposite to the first direction, thereby suppressing vibration during operation of the bonding head . 2. The die bonding apparatus according to claim 1,
a first linear sensor for detecting a position of the first mover relative to the stator;
a second linear sensor for detecting a position of the stator relative to the base;
Equipped with
The control device is a die bonding apparatus configured to perform position control, speed control, or movement control to a target position of the first mover based on outputs of the first linear sensor and the second linear sensor.

Images