JP7694433B2 - electronic equipment - Google Patents

Description

The present invention relates to an electronic device.

ECUs require a connector structure that allows for the placement of many of them, and for example use terminals known as press-fit terminals. ECU is an abbreviation for Electronic Control Unit. When a press-fit terminal is inserted from above into a hole electrode on a circuit board, there is a risk that the plating on the surface of the press-fit terminal will be scraped off, in which case it is conceivable that metallic foreign matter will adhere to the top of the circuit board. In addition, it is conceivable that metallic foreign matter will remain on the bottom of the circuit board on the opposite side to the insertion side due to the metal plating inside the hole electrode of the circuit board being scraped off.

It is a known fact that metallic foreign objects can lead to unexpected failures. In order to prevent malfunctions caused by metallic foreign objects, it is conceivable to provide an additional component to catch the metallic foreign objects, as in Patent Document 1. As described in Patent Document 1, structures for catching metallic foreign objects have been proposed in the past, but these were limited to dealing with foreign objects that occur on the bottom of the board.

Although it is possible to take protective measures by adding components or using a resin mold, this leads to higher costs and reduced packaging density. If normal terminals are used instead of press-fit terminals to prevent defects caused by metallic foreign matter, the terminals cannot be held in place during reflow, and additional parts for holding the terminals in place are often required.

JP 2016-63202 A

The objective of this disclosure is to provide an electronic device that can prevent malfunctions caused by metal foreign matter when using press-fit terminals.

According to the invention of claim 1, the connector includes a circuit board on which an electronic component is mounted and which is provided with a hole electrode through which a press-fit terminal for electrical connection is inserted, and a housing part for fixing the circuit board. A male connector housing is disposed independently of the press-fit terminal. The connector also includes solder at least partially covering the hole electrode of the circuit board. The solder at least partially covers the hole electrode of the circuit board . Alternatively, the solder partially covers the periphery of the through hole of the hole electrode. This makes it possible to trap metallic foreign matter, and prevents problems caused by metallic foreign matter when using a press-fit terminal.

FIG. 1 is a longitudinal sectional view showing an enlarged view of an assembly structure of a press-fit terminal according to a first embodiment in comparison with a comparative example; An exploded perspective view of the components shown from above. Exploded view of the components from below FIG. 1 is a perspective view showing the assembled structure from above Top view of assembled structure FIG. 1 is a diagram showing one embodiment of the manufacturing process. Part 2 of a diagram showing one embodiment of the manufacturing process FIG. 3 shows one embodiment of the manufacturing process FIG. 4 shows one embodiment of the manufacturing process FIG. 5 shows one embodiment of the manufacturing process FIG. 6 shows one embodiment of the manufacturing process FIG. 7 shows one embodiment of the manufacturing process FIG. 8 shows one embodiment of the manufacturing process 11 is a longitudinal sectional view showing a schematic diagram of a manufacturing process and an assembly structure of a press-fit terminal according to a second embodiment; A perspective view showing the structure from above Exploded view of components Bottom view of assembled structure FIG. 1 is a diagram showing one embodiment of the manufacturing process. Part 2 of a diagram showing one embodiment of the manufacturing process FIG. 3 shows one embodiment of the manufacturing process FIG. 4 shows one embodiment of the manufacturing process FIG. 5 shows one embodiment of the manufacturing process FIG. 6 shows one embodiment of the manufacturing process FIG. 7 shows one embodiment of the manufacturing process FIG. 8 shows one embodiment of the manufacturing process FIG. 13 is an exploded perspective view of components according to a third embodiment; FIG. 13 is a top view showing a typical region where lands are formed in the fourth embodiment;

Below, several embodiments of the electronic device will be described with reference to the drawings. In each embodiment described below, components that perform the same or similar operations will be given the same or similar reference numerals, and descriptions will be omitted as necessary.

First Embodiment
The first embodiment will be described with reference to Figures 1 to 13. As shown in Figures 2 and 3, an electronic device 1 includes a case 2 and a cover 3 as housing components, and is configured by assembling a circuit board 4 inside the case 2 and the cover 3. A side-exit connector 5 is mounted on the circuit board 4, and a press-fit terminal 6 is fixed to a part of the circuit board 4. Although not shown in Figure 2, electronic components 7 and 8 such as chip components and semiconductor components are mounted on the first surface 4a and the second surface 4b of the circuit board 4. See Figures 1 and 7 to 13 for the electronic components 7 and 8. The case 2 and the cover 3 are made of resin or metal.

In this embodiment, the case 2 is made of resin and is integrally molded with the male connector housing 9, and the cover 3 is made by molding a conductive material into a flat plate to hold the earth. The circuit board 4 is made of a printed circuit board or ceramic board made of a specified material. The circuit board 4 is made of an insulating base material with wiring (not shown) formed on or inside the base material.

As shown in Figures 2 to 4, the circuit board 4 is placed on the cover 3, and the case 2 is placed to cover the circuit board 4 from above, and then assembled. At this time, as shown in Figures 3 to 5, the press-fit terminals 6 are attached to the circuit board 4, and the male connector housing 9 is configured in the case 2. Therefore, in this embodiment, the press-fit terminals 6 and the male connector housing 9 are configured independently.

For ease of explanation, the upper surface of the circuit board 4 in FIG. 2 is referred to as the first surface 4a, and the upper surface in FIG. 3 is referred to as the second surface 4b, and FIG. 1 shows a cross section of the circuit board 4. As shown in FIG. 1, a hole electrode 10 is provided between both surfaces of the circuit board 4. The hole electrode 10 is called a through hole, and is formed by forming a conductive member on the inner surface of a through hole of the circuit board 4. The through hole of the hole electrode 10 is configured to be circular when viewed from above. This allows electrical connection across both surfaces of the first surface 4a and the second surface 4b, and allows circuit connection when electronic components 7 and 8 are mounted on both surfaces. A press-fit terminal 6, which serves as a press-fit terminal, is inserted into the hole electrode 10.

The press-fit terminal 6 has a conductive metal plating on its exposed surface. The press-fit terminal 6 has a terminal pin 11 configured as a line, and a deformation portion 12 provided at the tip so as to be connected to the terminal pin 11 and elastically deform. The press-fit terminal 6 also has a protrusion 13 located at the middle of the line terminal pin 11 and protruding laterally, which is integral with the terminal pin 11. When the press-fit terminal 6 is assembled to the circuit board 4, the protrusion 13 is held by a jig and inserted and pressed into the hole-shaped electrode 10 along the longitudinal direction of the terminal pin 11. The deformation portion 12 is configured as a circular ring in cross section, and has a circular or elliptical cavity on the inside of the circular ring. The outer and inner edges of the deformation portion 12 are both configured as a circular or elliptical shape. The shape of the deformation portion 12 is not limited to the shape of this embodiment. It may be configured as an action pin, U-shaped, H-shaped, or M-shaped.

When the deformable portion 12 is inserted and pressed into the hole-shaped electrode 10, the deformable portion 12 exerts a reaction force on the hole-shaped electrode 10 from the inside, causing the cavity inside the deformable portion 12 to deform vertically, and the cavity takes on a more vertically elongated elliptical cross-section. As a result, both the outer and inner edges of the deformable portion 12 deform into a vertically elongated elliptical shape.

The deformation portion 12 presses outward from the inside of the hole electrode 10 with point contact or surface contact. This allows the deformation portion 12 to continue to apply a force from the inside of the hole electrode 10 outward, and the deformation portion 12 can be held within the hole electrode 10.

The deformation portion 12 is configured so that the outer edge height dimension of the ring-shaped portion is higher than the thickness of the circuit board 4. When the deformation portion 12 of the press-fit terminal 6 is inserted into the hole-shaped electrode 10 and fixed, the outer edges of the deformation portion 12 protrude outward from both sides of the circuit board 4.

As shown in FIG. 1, the solder 14 at least partially covers the hole electrode 10 of the circuit board 4. However, in this embodiment, the solder 14 is not printed inside the through hole of the hole electrode 10 of the circuit board 4, but is formed to cover the hole electrode 10 located above the first surface 4a or below the second surface 4b of the circuit board 4. In other words, the solder 14 is not present below the first surface 4a or above the second surface 4b of the circuit board 4.

When the deformed portion 12 of the press-fit terminal 6 is inserted into the through-hole of the hole electrode 10, the conductive material inside the hole electrode 10 is scraped off, generating metallic foreign matter 15 as shown in FIG. 1. The metallic foreign matter 15 adheres to the inside and outside of the hole electrode 10 and to the first surface 4a and second surface 4b of the circuit board 4. For this reason, by configuring the solder 14 to at least partially cover the hole electrode 10 of the circuit board 4, the metallic foreign matter 15 can be trapped and prevented from falling from the circuit board 4.

The assembly process will be described below with reference to Figs. 6 to 13. First, as shown in Fig. 6, a circuit board 4 with hole electrodes 10 and 10b is prepared, and solder 14a is printed on the surface electrode 14z formed on the second surface 4b of the circuit board 4. Next, as shown in Fig. 7, electronic components 8 such as chip components are mounted on the surface electrode 14z on the second surface 4b and fixed by reflow. Next, as shown in Fig. 8, the circuit board 4 is turned over with the first surface 4a facing upward, and solder 14a is printed on the surface electrode 14z formed on the first surface 4a. At this time, solder 14b may also be printed inside the through hole of the hole electrode 10b, as shown in the hole electrode 10b on the right side of Fig. 8.

Next, as shown in FIG. 9, the press-fit terminal 6 is pushed into the through-hole of the hole electrode 10 for mounting. At this time, the protrusion 13 provided at the middle of the press-fit terminal 6 is held by a jig (not shown) and pressed against the circuit board 4, so that the deformation portion 12 can be pressed into the inside of the through-hole of the hole electrode 10. At this time, the deformation portion 12 is held exactly at the middle position of the hole electrode 10. Since the press-fit terminal 6 slides along the inside of the hole electrode 10, as shown in FIG. 9, the metal foreign matter 15 protrudes above the first surface 4a and below the second surface 4b of the circuit board 4 from the part where the press-fit terminal 6 slides.

Next, as shown in FIG. 10, electronic components 7 such as chip components are mounted on the first surface 4a, and the terminals 5a of the side connector 5 are inserted into the through holes of the hole electrode 10b. Although solder 14b is printed on the hole electrode 10b, the solder 14b is not fixed, so that the terminals 5a of the side connector 5 can be inserted into the inside of the through holes of the hole electrode 10b.

As shown in FIG. 11, the electronic component 7 mounted on the first surface 4a of the circuit board 4 and the terminal 5b of the side connector 5 are then fixed to the circuit board 4 by solder 14b through reflow. At this time, even if the foreign metal 15 protrudes above or below the hole-shaped electrode 10, the solder 14 on the first surface 4a and the second surface 4b melts or remelts to capture the foreign metal 15 and solidify along the outer edge of the deformed portion 12 of the press-fit terminal 6, thereby fixing the foreign metal 15. Note that although the embodiment describes a form in which one-sided reflow is performed, double-sided reflow may also be used.

Next, as shown in FIG. 12, the assembly of the circuit board 4 to which the electronic components 7, 8 and the side connector 5 are attached is attached to the case 2. At this time, the terminal pin 11 of the press-fit terminal 6 is inserted into the hole 2a previously machined in the case 2. At this time, the terminal pin 11 of the press-fit terminal 6 can be protected by the male connector housing 9 provided on the outside of the terminal pin 11. See FIG. 13. Also, as shown in FIG. 13, the cover 3 is placed on the assembly of the circuit board 4 attached to the case 2 and assembled. In this way, the electronic device 1 can be constructed as shown in FIG. 4 and FIG. 5.

<Significance of the configuration and manufacturing method of this embodiment>
According to this embodiment, the male connector housing 9 and the multiple terminal pins 11 of the press-fit terminal 6 can be constructed independently, so that the construction can be achieved at low cost without affecting the pitch between the terminals. Furthermore, there is no need to make any changes to the conventional manufacturing process. The solder 14a is printed on the surface electrodes 14z around the portion where the terminal pins 11 are inserted, and is reflowed together with the electronic components 7 and 8 after the press-fit terminal 6 is inserted, so that the press-fit terminal 6 can stand on its own directly on the circuit board 4. In addition, the construction can be configured to trap metal foreign matter 15 generated from above and below the circuit board 4, preventing it from falling onto the circuit board 4.

According to the structure or manufacturing method of this embodiment, it is not necessary to fix the terminal pin 11 of the press-fit terminal 6 with solder 14 or the like, or even if solder 14 is used, the amount of solder 14 can be reduced. In other words, the amount of solder 14a for reflow is less than the amount of solder 14a for fixing the terminal pin 11 of a normal press-fit terminal 6. Therefore, the surface electrode 14z on which the solder 14a is placed does not need to be as large as a surface electrode for fixing a normal terminal pin 11 with solder 14. In the configuration of this embodiment, it is possible to prevent the size of the surface electrode 14z from being a constraint on the spacing of the terminal pins 11 on the circuit board 4. Since the solder 14 around the hole electrode 10 in this embodiment is not intended for electrical connection, the solder 14 does not need to be filled inside the through hole of the hole electrode 10. In addition, since the solder 14 is used in the reflow process, the above-mentioned structure can be realized at low cost.

Second Embodiment
The second embodiment will be described with reference to FIG. 14. As shown in the vertical cross-sectional view in the upper part of FIG. 14, the solder 14 may be printed inside the through-hole of the hole electrode 10 of the circuit board 4. As shown in the lower part of FIG. 14, when the solder 14 is printed on the surface electrode 14z of the first surface 4a, the solder 14 is simultaneously printed on the inside of the hole electrode 10, so that the solder 14a can be left inside the through-hole of the hole electrode 10. Then, as shown in the upper part of FIG. 14, the deformation portion 12 of the press-fit terminal 6 is inserted and pressed into the through-hole of the hole electrode 10. As a result, as shown in the upper part of FIG. 14, the solder 14 can be left inside the hole electrode 10, and the metal foreign matter 15 can be trapped as in the above-mentioned embodiment. This provides the same effect as the first embodiment.

Third Embodiment
The third embodiment will be described with reference to Figures 15 to 25. Note that parts that are the same as or similar to components in the first embodiment will be described by using reference numbers obtained by adding 50 to the reference numbers of the corresponding components in the first embodiment. Figures 15 to 17 show the structure of an electronic device 51 equipped with a side-extending, self-supporting press-fit terminal 56. As shown in Figure 16, a circuit board 54 is housed in a case 52, and a side-extending, self-supporting L-shaped press-fit terminal 56 is fixed to one end of the circuit board 54.

In this embodiment, the case 52 and the male connector housing 59 of the press-fit terminal 56 are configured as separate bodies. The case 52 is configured as a rectangular box with an opening, and a protrusion 52a is integrally configured with the case 52 on the side of the rectangular box of the case 52 on the opening side. A boss 52b (see Figures 24 and 25) is provided at the innermost part of the case 52, and the other end of the circuit board 4 is fitted into the boss 52b to fix the circuit board 4 to the case 52.

On the other hand, as shown in Figures 15 to 17, the male connector housing 59 is mainly composed of a base 53c molded with a U-shaped cross section, and the male connector housing 59 is molded integrally with this base 53c in the shape of a rectangular frame. Inside the rectangular frame of the male connector housing 59, holes 53a (see Figure 25) for inserting the terminal pins 61 of the press-fit terminals 56 are molded in a line.

As shown in FIG. 16, the male connector housing 59 has rectangular fixing holes 53b on the top and bottom flat portions of the U-shape. The fixing holes 53b are configured to fit into protrusions 52a provided on the side of the case 52, thereby allowing the connector housing 59 to be fixed to the opening side of the case 52. This allows the case 52 and the male connector housing 59 to be fixed together. At this time, the tips of the terminal pins 61 of the L-shaped press-fit terminals 56 can be inserted into the multiple individual holes 53a (see FIG. 25) inside the rectangular frame of the male connector housing 59, allowing the tips of the terminal pins 61 to protrude toward the opening side of the male connector housing 59.

The assembly process will be described below with reference to Figures 18 to 25. First, as shown in Figure 18, a circuit board 54 with hole electrodes 60 is prepared, and solder 64a is printed on surface electrodes 64z formed on the second surface 54b of the circuit board 54. Next, as shown in Figure 19, electronic components 58 such as chip components are mounted on the surface electrodes 64z on the second surface 54b and reflowed. Next, as shown in Figure 20, the circuit board 54 is flipped over with the first surface 54a facing up, and solder 64a is printed again on the surface electrodes 64z.

Next, as shown in FIG. 21, the deformed portion 62 of the press-fit terminal 56 is pushed into the through-hole of the hole electrode 60 for mounting. At this time, the protrusion 63 provided in the middle of the press-fit terminal 56 is held by a jig (not shown) and pressed against the circuit board 54, so that the deformed portion 62 can be pressed into the inside of the hole electrode 60. At this time, the deformed portion 62 is held exactly in the middle position of the hole electrode 60. Since the press-fit terminal 56 slides along the inside of the hole electrode 60, as shown in FIG. 21, metal foreign matter 65 may protrude above and below the hole electrode 60 from the part where the press-fit terminal 56 slides.

22, electronic components 57 such as chip components are mounted on the first surface 54a. After that, as shown in FIG. 23, the electronic components 57 mounted on the first surface 54a are fixed to the circuit board 4 with solder 14 by reflowing as shown in FIG. 23. At this time, even if the metal foreign object 65 protrudes above and below the hole-shaped electrode 60, the solder 64 on the first surface 54a and the second surface 54b melts and remelts to capture the metal foreign object 65 and solidify along the outer edge of the deformation portion 62 of the press-fit terminal 56, thereby fixing the metal foreign object 65. As shown in FIG. 23, since the main purpose is to fix the metal foreign object 65, the solder 14 does not need to be in contact with the deformation portion 62. In this way, when the purpose is to fix the metal foreign object 65, the amount of solder 14 can be less than that for the purpose of also fixing the press-fit terminal 56. Note that in FIG. 23, the solder 64 is illustrated not to contact the deformation portion 62, but it may be in contact. In this embodiment, one-sided reflow is shown, but both-sided reflow may also be used.

Next, as shown in FIG. 24, the assembly of the circuit board 54 to which the electronic components 57, 58 and the press-fit terminal 56 are attached is assembled to the case 52. At this time, the circuit board 54 is fixed by fitting it into the boss 52b that is machined in advance on the case 52. Also, as shown in FIG. 25, the assembly of the circuit board 54 assembled to the case 52 is covered with the cover 53 and assembled. At this time, the terminal pin 61 of the press-fit terminal 56 can be inserted into the hole 53a while being surrounded and protected by the male connector housing 59. This allows the electronic device 51 to be constructed as shown in FIG. 15 to FIG. 17. This embodiment also provides the same effects as the previous embodiment.

Fourth Embodiment
The fourth embodiment will be described with reference to Fig. 26. In this embodiment, as shown in Fig. 26, a case 73 and a male connector housing 79 serving as housing parts are configured as separate bodies, and the male connector housing 79 is fixed to a circuit board 74. Fig. 26 shows an exploded perspective view seen from above, in which a cover 72 serving as a housing part, a circuit board 74, a seal member 100, and a case 73 serving as a housing part are arranged in this order from the top, and the cover 72 and the case 73 are fixed together with screws 101, and the case 73 and the circuit board 74 are also fixed together with screws 102.

A male connector housing 79 is mounted on the circuit board 74. The male connector housing 79 is configured as a rectangular frame with an opening on the bottom side. A press-fit terminal 6 formed into a linear shape is inserted inside the male connector housing 79 fixed to the circuit board 74, and the terminal pin 11 of the press-fit terminal 6 is configured to protrude downward. In this embodiment, an example is shown in which the terminal pin 11 of the male connector housing 79 is configured as the press-fit terminal 6. As shown in this embodiment, it may also be applied to a form in which the male connector housing 79 is fixed to the circuit board 74.

Fifth Embodiment
The fifth embodiment will be described with reference to Fig. 27. In the first to third examples of Fig. 27, as shown in a top view of the circuit board 4, the solder 14 only needs to partially cover the periphery of the through hole of the hole electrode 10. As shown in Fig. 27 as a comparative example of a conventional structure, a surface electrode 14z is usually formed around the hole electrode 10 into which the terminal pin 11 of the press-fit terminal 6 is inserted, and it is considered that the solder 14 is placed on this surface electrode 14z to trap the metallic foreign matter 15. However, in this example, the formation area of the surface electrode 14z is wide, and the amount of solder placed on the surface electrode 14z is also large.

As shown in the first example of FIG. 27, the surface electrode 14z may be configured in an elliptical shape to match the area where the metallic foreign matter 15 can be trapped. The terminal pin 11 of the press-fit terminal 6 is configured in a rectangular shape when viewed from above. In other words, since the cross-sectional shape is rectangular, the parts corresponding to the corners of this rectangle often come into contact with the hole electrode 10 and generate metallic foreign matter 15. For this reason, it is preferable to configure the surface electrode 14z on which the solder 14 is placed in an elliptical shape with a major axis along the long side of the rectangle of the press-fit terminal 6 when the press-fit terminal 6 is inserted into the through hole of the hole electrode 10. In this way, the surface electrode 14z can be configured to concentrate on the point where the metallic foreign matter 15 is generated, and the formation area of the surface electrode 14z can be narrowed compared to the comparative example.

When it is sufficient to trap the metal foreign matter 15, as shown in the second example of FIG. 27, the surface electrode 14z on which the solder 14 is placed may be configured only at the base portion around the hole electrode 10. For example, the surface electrode 14z on which the solder 14 is placed may be provided in a semicircular ring shape only on the side of the rectangular contact point where the terminal pin 11 of the press-fit terminal 6 contacts the hole electrode 10. This allows the formation area of the surface electrode 14z to be narrower than in the comparative example.

Furthermore, if it is sufficient to trap the metal foreign matter 15, as shown in the third example of FIG. 27, the surface electrode 14z on which the solder 14 is placed may be partially provided in the area around the hole electrode 10 where the press-fit terminal 6 and the hole electrode 10 make point contact. For example, the surface electrode 14z on which the solder 14 is placed may be provided radially starting from the four-point area where the rectangular contacts of the terminal pin 11 of the press-fit terminal 6 make contact. In this way, the area in which the surface electrode 14z is formed can be made narrower than in the comparative example. The first to third examples of the fifth embodiment are examples that can be realized at low cost, and by reducing the area of the surface electrode 14z on which the solder 14 is placed, the mounting area for other electronic components 7, 8, etc. can be made larger.

Other Embodiments
The present disclosure is not limited to the above-described embodiment, and may be modified or expanded as follows. The electronic device 1, 51 may be configured as an electronic control device for a vehicle mounted on a vehicle. Although the present disclosure has been described based on the above-described embodiment, it is understood that the present disclosure is not limited to the embodiment or structure. The present disclosure also includes various modifications and modifications within the equivalent range. In addition, various combinations and forms, and other combinations and forms including only one element, more than one element, or less than one element, are also within the scope and concept of the present disclosure.

In the drawings, 1 and 51 are electronic devices, 4 and 54 are circuit boards, 2, 52 and 72 are cases (housing parts), 3, 53 and 73 are covers (housing parts), 14 is solder, 6 and 56 are press-fit terminals, 9 and 59 are male connector housings, and 11 and 61 are terminal pins.

Claims (9)

a circuit board (4, 54) on which electronic components are mounted and which is provided with hole-shaped electrodes (10, 60) through which press-fit terminals (6, 56) for electrical connection are inserted;
A housing part (2, 3, 52, 53) for fixing the circuit board;
a male connector housing (9, 59) disposed independently of the press-fit terminal;
a solder (14, 64) at least partially covering a hole electrode of the circuit board ;
The solder partially covers the periphery of the through hole of the hole-shaped electrode . a circuit board (4, 54) on which electronic components are mounted and which is provided with hole-shaped electrodes (10, 60) through which press-fit terminals (6, 56) for electrical connection are inserted;
A housing part (2, 3, 52, 53) for fixing the circuit board;
a male connector housing (9, 59) disposed independently of the press-fit terminal;
a solder (14, 64) at least partially covering a hole electrode of the circuit board ;
When the press-fit terminal has a rectangular shape when viewed from above,
An electronic device in which the surface electrode on which the solder is placed is configured in an elliptical shape with its major axis extending along the longer side of the rectangle of the press-fit terminal . a circuit board (4, 54) on which electronic components are mounted and which is provided with hole-shaped electrodes (10, 60) through which press-fit terminals (6, 56) for electrical connection are inserted;
A housing part (2, 3, 52, 53) for fixing the circuit board;
a male connector housing (9, 59) disposed independently of the press-fit terminal;
a solder (14, 64) at least partially covering a hole electrode of the circuit board ;
The surface electrode on which the solder is placed is formed only on the base portion around the hole-shaped electrode . a circuit board (4, 54) on which electronic components are mounted and which is provided with hole-shaped electrodes (10, 60) through which press-fit terminals (6, 56) for electrical connection are inserted;
A housing part (2, 3, 52, 53) for fixing the circuit board;
a male connector housing (9, 59) disposed independently of the press-fit terminal;
a solder (14, 64) at least partially covering a hole electrode of the circuit board ;
The surface electrode on which the solder is placed is
The electronic device is provided partially around the hole electrode in a portion where the press-fit terminal and the hole electrode make point contact . The electronic device according to claim 1 , wherein the solder is printed also inside the hole electrodes of the circuit board. The electronic device according to claim 1 , wherein the case part and the male connector housing are integrally formed. The housing part and the male connector housing are configured separately,
The electronic device according to claim 1 , wherein the case part and the male connector housing are fixed to each other . The housing part and the male connector housing are configured separately,
The electronic device according to claim 1 , wherein the male connector housing is fixed to the circuit board. The electronic device according to claim 1 , wherein the housing part is made of a resin or a metal.

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