JP7697270B2 - Phased Array Antenna - Google Patents

Description

The present invention relates to a phased array antenna.

A typical phased array antenna is composed of electronic components such as element antennas, a power supply circuit, and a transmission module, and an antenna housing such as a front plate and a frame. In order to stably operate the electronic components of a phased array antenna, such as the element antennas, the power supply circuit, and the transmission module, at or below a specified temperature, there has been a technique for transporting heat generated by the electronic components to a refrigerant for cooling.

Patent Document 1 describes how heat generated in the block 2, which is equipped with multiple transmission modules 21, is transferred to the coolant by contacting the block 2 with a front plate 1 having a coolant flow path inside. However, the surface of the block 2 and/or the surface of the front plate 1 have minute irregularities. The thermal conductivity of the air present in the gaps between these irregularities is smaller than the thermal conductivity of the block 2 and the front plate 1. Therefore, the air present in the gaps between the irregularities acts as a resistance to heat transfer from the block 2 to the coolant. Such resistance to heat transfer at the contact surface is called contact thermal resistance.

JP 2020-036365 A

As in Patent Document 1, simply bringing the block 10 into contact with the front plate 1, which has a refrigerant flow path inside, poses the problem that the efficiency of transferring heat generated in the block 10 to the refrigerant decreases due to the contact thermal resistance between the front plate 1 and the block 10.

The phased array antenna according to this disclosure comprises a front plate, a frame defining one side of the front plate and having a flow path for a heat medium therein, a temperature adjustment unit defining a temperature of the heat medium, a circulation unit defining the heat medium whose temperature has been adjusted by the temperature adjustment unit, within the flow path, a block disposed in a space defined by the frame and mounting a transmission module, and a thermally conductive material containing Ga, In, Sn, or Bi and a lid portion disposed between the frame and the block and restricting the spread of the thermally conductive material in a direction opposite to the front plate, wherein the temperature adjustment unit heats the heat medium to a temperature equal to or higher than the melting point of the thermally conductive material .

The phased array antenna according to this disclosure comprises a front plate, a frame that partitions one side of the front plate and has a flow path for a heat medium inside, a block that is disposed in a space partitioned by the frame and that has a transmission module mounted thereon, a thermally conductive material that is disposed between the frame and the block and has electrical conductivity, and a lid that restricts the spread of the thermally conductive material in a direction facing the front plate, and the thermally conductive material is a metal or an alloy thereof that has a melting point of less than 100°C and is filled between the frame and the block in a fluid state.

The present invention has the effect of providing a phased array antenna that suppresses the decrease in efficiency of heat transport of heat generated in the block to the heat medium due to the contact thermal resistance of the air layer between the frame and the block.

FIG. 1 is a diagram showing a configuration of a phased array antenna according to a first embodiment; FIG. 2 is a diagram showing a frame structure. FIG. 13 is a diagram showing a heat transport path of heat generated within a block. 3 is a cross-sectional view of the frame 11 shown in FIG. 2 in the Y1 direction. 5 is a cross-sectional view of the frame 11 shown in FIG. 4 in the Z1 direction. 5 is a cross-sectional view of the frame 11 shown in FIG. 4 in the X1 direction. 5 is a cross-sectional view of the frame 11 shown in FIG. 4 in the Z1 direction after the block 13 is attached. 1 is a diagram showing the Z direction of the frame 11 to which the block 13 is attached. A diagram showing the lid 14 having an opening 144. A diagram showing the lid 14 having a hinge 146. FIG. 11 is a flow diagram of a process for attaching a block 13 to a frame 11. 1 is a flow diagram of a process for removing a block 13 from a frame 11. FIG. FIG. 2 is a diagram showing the configuration of a frame 11a. 14 is a cross-sectional view of the frame 11a shown in FIG. 13 in the Y1 direction. 15 is a cross-sectional view of the frame 11a shown in FIG. 14 in the X1 direction. 15 is a cross-sectional view of the frame 11a shown in FIG. 14 in the Z1 direction. 15 is a cross-sectional view of the frame 11a shown in FIG. 14 in the Z1 direction after the block 13 is attached. 1 is a diagram showing the Z direction of a frame 11 in which two blocks 13 are attached to one space partitioned by the frame 11. FIG.

The phased array antenna according to the present disclosure is described in detail below with reference to the drawings.

・Embodiment 1.
1 is a diagram showing a configuration of a phased array antenna 1 according to embodiment 1. In this specification, for ease of understanding, the height direction (upward on the paper) of the phased array antenna 1 will be described as the +Y-axis direction, the width direction (rightward on the paper) as the +X-axis direction, and the depth direction (direction perpendicular to the +Y-axis and +X-axis directions) as the +Z-axis direction.

The phased array antenna 1 includes a frame 11, a front plate 12, a block 13, a sealing member 15, a thermally conductive material 16, and a lid 14. An element power supply layer having a plurality of antenna elements is provided on the surface of the front plate 12 in the +Z-axis direction. In addition, a frame 11 arranged in a lattice pattern is provided on one surface (the surface in the -Z-axis direction) of the front plate 12. The block 13 is attached to the phased array antenna 1 by being inserted in the direction indicated by arrow A (+Z-axis direction) into the space partitioned by the frame 11. Electronic components including at least a transmission module are mounted on the block 13. A thermally conductive material 16 having electrical conductivity and a sealing member 15 for restricting the spread of the thermally conductive material 16 are provided between the frame 11 and the block 13. The lid 14 includes a sealing member 142 and a lid 141. The seal member 142 of the lid portion 14 restricts the spread of the thermally conductive material 16 in a direction opposite to the front plate 12. The lid 141 of the lid portion 14 is fixed to the frame 11, for example, by tightening the screw 143 into the screw hole 147.

FIG. 2 is a diagram showing the structure of the frame 11. As shown in FIG.
The frame 11 partitions one surface of the front plate 12 and has a heat medium flow path 113 (a distribution flow path 113a, a temperature control flow path 113b, and a collecting flow path 113c) therein. In FIG. 2, the distribution flow path 113a shown by a long dashed line distributes the heat medium 114 flowing in from an inlet portion 115 to the temperature control flow path 113b. In FIG. 2, the temperature control flow path 113b shown by a dashed line exchanges heat between the heat medium 114 distributed from the distribution flow path 113a and the block 13. The temperature control flow path 113b cools the block 13, for example, by transferring heat from the block 13 to the heat medium 114. In addition, the temperature control flow path 113b may heat the heat conductive material 16 between the block 13 and the frame 11, for example, by transferring heat from the heat medium 114 to the block 13. In Fig. 2, the collecting flow path 113c indicated by a two-dot chain line collects the heat medium 114 that has passed through the temperature control flow path 113b. The collecting flow path 113c also leads to the outlet portion 116. Between the inlet portion 115 and the outlet portion 116, a circulation portion 117 and a temperature control portion 118 are provided. The temperature control portion 118 controls the temperature of the heat medium 114. Specifically, the temperature control portion 118 cools and/or heats the heat medium 114. The temperature control portion 118 also heats the heat medium 114 to a temperature equal to or higher than the melting point of the thermally conductive material 16. The circulation portion 117 circulates the temperature-adjusted heat medium 114 in the flow path 113. Specifically, the circulation section 117 circulates the heat medium 114 through the inlet section 115, the distribution flow path 113a, the temperature control flow path 113b, the collecting flow path 113c, the outlet section 116, and the temperature control section 118, as indicated by the arrows in the figure.

FIG. 3 is a diagram showing a heat transport path of the heat generated in the block 13. As shown in FIG.
The block 13 includes a housing 131, a transmission module 132, and a heat spreader 133. The transmission module 132 is mounted on the surface of the heat spreader 133 in the +Y-axis direction. The transmission module 132 only needs to have at least a transmission function, and may also have a transmission and reception function. The heat spreader 133 has a plate shape whose thickness in the Y-axis direction is thinner than the thickness in the Y-axis direction and the thickness in the Z-axis direction. The heat spreader 133 is also formed of a material with high thermal conductivity. The material of the heat spreader 133 only needs to have a higher conductivity than air. The surface of the heat spreader 133 in the -Y-axis direction constitutes the surface of the housing 131 in the -Y-axis direction. The surface of the heat spreader 133 in the -Y-axis direction is in contact with the thermally conductive material 16 and/or the frame 11. With this configuration, the heat generated in the transmission module 132 is transported to the heat medium inside the frame 11 via the heat spreader 133 , the thermally conductive material 16 , and the frame 11 , that is, is discharged.

The block 13 may include not only one transmission module 132, but also multiple transmission modules 132. The block 13 may also include not only the transmission module 132, but also electronic components such as a power supply circuit.

Generally, the surface of the block 13 (the surface of the heat spreader 133 in the -Y axis direction) and/or the surface of the frame 11 have minute irregularities. The thermal conductivity of the air present in the gaps between these minute irregularities is smaller than the thermal conductivity of the block 13 and the frame 11. Therefore, the air present in the gaps between the minute irregularities acts as a resistance when transporting heat from the block 13 to the heat medium. Such resistance to heat transport at the contact surface is called contact thermal resistance.

In the present disclosure, in order to reduce the contact thermal resistance, the heat conductive material 16 in a fluid state is filled between the frame 11 and the block 13. The heat conductive material 16 in a fluid state penetrates into the fine unevenness gap between the frame 11 and the block 13 and reduces the amount of air present in the fine unevenness gap. The heat conductive material 16 is a material that has a higher thermal conductivity than air and is conductive. The heat conductive material 16 is, for example, a metal material (hereinafter referred to as a low melting point metal) such as gallium (melting point 29.76 degrees, thermal conductivity 40 W/mK). The heat conductive material 16 may also be, for example, an alloy (alloy with a melting point of less than 100°C; hereinafter referred to as a low melting point alloy) combining two or more types of gallium, indium, tin, or bismuth. That is, the heat conductive material 16 may be a low melting point metal with a melting point of less than 100°C, or a low melting point alloy thereof. This configuration reduces the thermal contact resistance between the block 13 and the frame 11.

The thermal conductive material 16 may be in a state of fluidity when the block 13 is attached or detached, and may be in a state of non-fluidity, i.e., solid state, except when the block 13 is attached or detached. Furthermore, the thermal conductive material 16 may be heated to a temperature (melting point) or higher at which the thermal conductive material 16 melts and becomes fluid when the block 13 is attached or detached. For example, the temperature adjustment unit 118 may heat the heat medium 114 to a temperature of the thermal conductive material 16 or higher. Then, the circulation unit 117 may circulate the heated heat medium 114 to the inlet unit 115, the distribution flow path 113a, the temperature adjustment flow path 113b, the collection flow path 113c, and the outlet unit 116. This allows the thermal conductive material 16 to maintain a state of fluidity when the block 13 is attached or detached. As a result, the thermal conductive material 16 is more likely to penetrate into the gaps of the fine unevenness between the frame 11 and the block 13, and the amount of air present in the gaps of the fine unevenness can be reduced, that is, the contact thermal resistance between the block 13 and the frame 11 can be reduced. In addition, since the thermally conductive material 16 does not bond the frame 11 and the block 13, it is possible to suppress a decrease in workability when attaching and detaching the block 13. Here, the melting point of the thermally conductive material 16 may be within the range of the guaranteed temperature when the phased array antenna 1 is not in operation. The guaranteed temperature range is a temperature range that does not adversely affect the electronic components mounted on the block 13. The guaranteed temperature range is preferably less than 100°C, and may be appropriately determined at the design stage. Here, since the thermally conductive material 16 is a low-melting point metal or a low-melting point alloy thereof with a melting point less than 100°C, even if it is filled between the frame 11 and the block 13 in a state heated to its melting point, it does not adversely affect the electronic components mounted on the block 13.

FIG. 4 is a cross-sectional view of the frame 11 shown in FIG. 2 taken along the Y1 direction.
FIG. 5 is a cross-sectional view of the frame 11 shown in FIG. 4 taken along the Z1 direction.
FIG. 6 is a cross-sectional view of the frame 11 shown in FIG. 4 taken along the X1 direction.
The phased array antenna 1 includes sealing members 15L, 15D, and 15R (hereinafter, referred to as sealing members 15 when there is no need to distinguish between them) that restrict the spread of the thermally conductive material 16 having fluidity. The sealing member 15 is interposed between the horizontal frame 111 and the block 13, and is arranged so as to surround the thermally conductive material 16 filled between the horizontal frame 111 and the block 13. The sealing members 15L and 15R are arranged in the region where the horizontal frame 111 and the vertical frame 112 intersect. The sealing member 15D is arranged in the region where the horizontal frame 111 and the front plate 12 intersect. With this configuration, the sealing member 15 can restrict the thermally conductive material 16 filled in a certain section from spreading outside the certain section. That is, according to the configuration of the present disclosure, compared to the case where the sealing member 15 is not provided, it is possible to suppress the deterioration of the cooling performance of the block 13 and the deterioration of workability due to the outflow of the thermally conductive material 16.

FIG. 7 is a cross-sectional view of the frame 11 shown in FIG. 4 in the X1 direction after the block 13 is attached.
The lid 141 of the lid portion 14 has a plate-like shape with a thickness in the Z-axis direction smaller than the thickness in the X-axis direction and the Y-axis direction. The lid 141 of the lid portion 14 also brings the seal member 142 into close contact with the frame 11, the block 13, and the thermally conductive material 16. The seal member 142 of the lid portion 14 restricts the spread of the thermally conductive material 16 filled between the block 13 and the frame 11 (horizontal frame 111) in a direction facing the front plate 12. According to the configuration of the present disclosure, it is possible to restrict the thermally conductive material 16 filled in a certain section from spreading outside the certain section. That is, according to the configuration of the present disclosure, it is possible to suppress the deterioration of the cooling performance of the block 13 and the deterioration of the workability caused by the outflow of the thermally conductive material 16, compared to the case where the lid portion 14 is not provided.

FIG. 8 is a diagram showing the frame 11 in the Z direction after the block 13 is attached.
The lid 141 of the lid portion 14 is detachably attached to the frame 11 using members such as screws 143. The configuration of the present disclosure has an effect of making it easier to fill or remove the thermally conductive material 16 between the block 13 and the frame 11, compared to a case in which the lid 141 is not detachably provided.

However, when using the lid 14 shown in FIG. 8, it is necessary to remove the lid 14 from the frame 11 when filling or removing the thermally conductive material 16, which can be inconvenient for the worker. Therefore, the lid 141 may have an opening 144 between the block 13 and the frame 11 for filling or removing the thermally conductive material 16.

FIG. 9 is a diagram showing the lid 14 having an opening 144 .
The opening 144 communicates the outside of the phased array antenna 1 with the gap between the block 13 and the frame 11. Furthermore, the opening 144 may be provided with a restricting member 145 that restricts the flow of the thermally conductive material 16 to the outside of the phased array antenna 1. The restricting member 145 may be, for example, a member that restricts the flow of the thermally conductive material 16 in one direction, such as a check valve, or a member that restricts the flow of the thermally conductive material 16 itself, such as a cap. In addition, the restricting member 145 may have a mechanism that closes when pressure is applied from the inside (block 13 side) and opens when pressure is applied from the outside. According to the configuration of the present disclosure, compared to a case in which the lid portion 14 does not have the opening 144 and the restricting member 145, it is easier to fill or remove the thermally conductive material 16, so that a decrease in workability can be suppressed.

However, when using the lid portion 14 shown in FIG. 8, the screw 143 must be tightened and loosened when attaching or detaching the lid portion 14, which can be cumbersome for the worker. Therefore, the lid portion 14 may have a hinge 146 that supports the lid 141 and enables it to be opened and closed relative to the frame 11.

FIG. 10 shows the lid 14 having a hinge 146 .
The hinge 146 connects the end of the lid 14 in the -Y-axis direction and the end of the frame 11 in the -Z-axis direction. Furthermore, the hinge 146 is provided on the frame 11 (horizontal frame 111) so as to allow the lid 14 to rotate in the -Z-axis direction, for example. The location to which the hinge 146 is fixed may be any location on the lid 14 or the frame 11, as long as the location is at least capable of supporting the lid 14 in a rotatable manner relative to the frame 11. According to the configuration of the present disclosure, compared to a case in which the lid 14 does not have the hinge 146, there is no need to attach or detach the lid 14, and therefore a decrease in workability can be suppressed.

Next, the process for attaching the block 13 to the frame 11 will be described. Here, the front plate 12, frame 11, and block 13 are assembled using well-known techniques, so a detailed description will be omitted.

FIG. 11 is a flow diagram of the process for attaching the block 13 to the frame 11.
A seal member 15 is provided in the area where the horizontal frame 111 and the vertical frame 112 intersect, and in the area where the horizontal frame 111 and the front plate 12 intersect (intersection area of the frame 11) (step ST11).

The block 13 is inserted into the space partitioned by the frame 11 (step ST12). The block 13 is positioned in the +Y-axis direction (above) of the sealing member 15 provided in step ST11. Furthermore, the block 13 may be fixed so as to be pressed against the frame 11 located in the -Y-axis direction by inserting a wedge mechanism or the like between the block 13 and the frame 11 located in the +Y-axis direction.

The heat conductive material 16 in a fluid state is injected between the block 13 and the frame 11 arranged in step ST12 and into the area surrounded by the sealing member 15 arranged in step ST11 (step ST13). The heat conductive material 16 is injected into the gap between the block 13 and the frame 11 using, for example, a syringe. Here, the heat conductive material 16 may be heated to a temperature (melting point) or higher at which it melts and becomes fluid. Furthermore, the temperature adjustment unit 118 may heat the heat medium 114 to a temperature equal to or higher than the melting point of the heat conductive material 16. Then, the circulation unit 117 may circulate the heated heat medium 114 to the inlet unit 115, the distribution flow path 113a, the temperature adjustment flow path 113b, the collection flow path 113c, and the outlet unit 116.

The lid 14 is placed in a position in close contact with the block 13 and frame 11 placed in step ST12 (step ST14). Here, the order of steps ST13 and ST14 may be reversed. In this case, a lid 14 having an opening 144 may be used, and the thermally conductive material 16 may be injected through the opening 144.

Next, an example of a process for removing the block 13 from the frame 11 will be described.
FIG. 12 is a flow diagram of the process for removing the block 13 from the frame 11.

The heat conductive material 16 between the block 13 and the frame 11 is heated to a temperature (melting point) or higher at which it melts and becomes fluid (step ST21). Here, the circulation unit 117 may circulate the heat medium 114 heated to a temperature above the melting point of the heat conductive material 16 by the temperature adjustment unit 118 to the inlet 115, the distribution flow path 113a, the temperature adjustment flow path 113b, the collection flow path 113c, and the outlet 116. Note that if the heat conductive material 16 has fluidity when the block 13 is removed from the frame 11, step ST21 can be omitted.

The thermally conductive material 16 that has melted between the block 13 and the frame 11 is removed (step ST22). The thermally conductive material 16 may be removed, for example, by removing the lid portion 14 from the frame 11, or by sucking it out through the opening 144 of the lid portion 14 with a syringe or the like.

Pull out the block 13 from the space partitioned by the frame 11 in the direction opposite to the arrow A in Figure 1 (step ST23).

According to the configuration of the present disclosure, the thermally conductive material 16 in a fluid state easily penetrates into the fine unevenness gap between the frame 11 and the block 13, and therefore, compared to when the thermally conductive material 16 does not have fluidity, it is possible to reduce the amount of air present in the fine unevenness gap, i.e., to reduce the contact thermal resistance between the block 13 and the frame 11. In addition, the thermally conductive material 16 in a fluid state does not bond the frame 11 and the block 13, and therefore, compared to when the thermally conductive material 16 does not have fluidity, it is possible to suppress a decrease in workability when attaching and detaching the block 13.

・Embodiment 2.
In the first embodiment, the temperature control passage 113b is provided only in the horizontal frame 111, but it may also be provided in the vertical frame 112.
FIG. 13 is a diagram showing the configuration of the frame 11a.
The frame 11a partitions one surface of the front plate 12, and has a flow path 113 (temperature control flow paths 113b1, 113b2, 113b3) for the heat medium 114 inside. In FIG. 13, the temperature control flow path 113b1 shown by a long dashed line distributes the heat medium 114 flowing in from the inlet portion 115 to the temperature control flow path 113b2. The temperature control flow path 113b1 also exchanges heat between the heat medium 114 and the block 13. In FIG. 13, the temperature control flow path 113b2 shown by a dashed line exchanges heat between the heat medium 114 distributed from the temperature control flow path 113b1 and the block 13. In FIG. 13, the temperature control flow path 113b3 shown by a dashed line exchanges heat between the heat medium 114 and the block 13. In addition, the temperature control flow path 113b3 collects the heat medium 114 that has passed through the temperature control flow path 113b2. The temperature control flow path 113b3 is connected to the outlet 116. Between the inlet 115 and the outlet 116, a circulation section 117 and a temperature control section 118 are provided.

FIG. 14 is a cross-sectional view of the frame 11a shown in FIG. 13 taken along the Y1 direction.
FIG. 15 is a cross-sectional view of the frame 11a shown in FIG. 14 taken in the X1 direction.
FIG. 16 is a cross-sectional view of the frame 11a shown in FIG. 14 taken in the Z1 direction.
The phased array antenna 1 includes sealing members 15L, 15D, and 15R (hereinafter, referred to as sealing member 15, since there is no need to distinguish between them) that restrict the spread of the thermally conductive material 16 having fluidity. The sealing members 15L and 15R have an L-shaped cross section in the short direction. The sealing members 15L and 15R are disposed in an area where the horizontal frame 111a and the vertical frame 112a intersect at a connection portion between one side and the other side of the L shape. The sealing member 15L1 that constitutes one side of the sealing member 15L is disposed on the horizontal frame 111a, and the sealing member 15L2 that constitutes the other side of the sealing member 15L is disposed on the vertical frame 112a. Similarly, the sealing member 15R1 that constitutes one side of the sealing member 15R is disposed on the horizontal frame 111a, and the sealing member 15R2 that constitutes the other side of the sealing member 15L is disposed on the vertical frame 112a. The seal member 15D has seal members 15DM, 15DL, and 15DR. The seal member 15DM is disposed in the area where the horizontal frame 111a and the front plate 12 intersect. The seal members 15DL and 15DR are disposed in the area where the vertical frame 112a and the front plate 12 intersect. The seal member 15 is disposed between the frame 11a and the block 13 so as to surround the thermally conductive material 16 filled between the frame 11a and the block 13. With this configuration, the seal member 15 can prevent the thermally conductive material 16 filled in a certain section from spreading outside the certain section. That is, according to the configuration of this embodiment, it is possible to suppress the deterioration of the cooling performance of the block 13 and the deterioration of the workability caused by the outflow of the thermally conductive material 16, compared to the case where the seal member 15 is not provided.

FIG. 17 is a cross-sectional view of the frame 11a shown in FIG. 14 in the Z1 direction after the block 13 is attached.
In this embodiment, in order to reduce contact thermal resistance, the heat conductive material 16 in a fluid state is filled not only between the horizontal frame 111a and the block 13, but also between the vertical frame 112a and the block 13. As a result, the heat generated in the block 13 is transported not only to the heat medium inside the horizontal frame 111a, but also to the heat medium inside the vertical frame 112a. With this configuration, it is possible to transport heat to a larger number of heat media compared to the configuration of embodiment 1, so it is possible to suppress a decrease in the efficiency of transporting heat generated in the block to the heat medium.

・Embodiment 3.
In the first and second embodiments, one block 13 is attached to the phased array antenna 1 by being inserted into one space partitioned by the frame 11. However, a plurality of blocks 13 may be attached to the phased array antenna 1 by being inserted into one space partitioned by the frame 11.

FIG. 18 is a diagram showing the Z direction of the frame 11 in which two blocks 13 are attached to one space defined by the frame 11. As shown in FIG.
The block 13 is disposed so that the heat spreader 133 faces the temperature control flow passage 113b indicated by the dashed line. Therefore, the block 13a has the heat spreader 133 disposed on the surface in the +Y-axis direction, and the block 13b has the heat spreader 133 disposed on the surface in the -Y-axis direction.

In this embodiment, compared to the configuration of embodiment 1, it is possible to transport the heat generated in block 13 using a larger amount of heat medium, making it possible to suppress a decrease in the efficiency of transporting the heat generated in the block to the heat medium.

Other Application Examples In the first and second embodiments, the seal member 15 is disposed between the block 13 and the frame 11. As a result, the distance over which the heat generated in the block 13 is transported increases by the thickness of the seal member 15, and the efficiency of the heat transport decreases by the increased amount. In order to suppress the decrease in the heat transport efficiency, a recess may be provided on the surface of the block 13 that contacts the seal member 15, the recess having a height less than the thickness of the seal member 15 and a width equal to the width of the seal member 15. With this configuration, the distance over which the heat generated in the block 13 is transported is shortened by the height of the recess, making it possible to suppress the decrease in the efficiency of the heat transport by that amount.

In the first and second embodiments, when inserting the block 13 into the space partitioned by the frame 11, it is necessary to remove or rotate the lid 14 from the frame 11, which may be bothersome for the worker. Therefore, the height H1 in the Y-axis direction of the space partitioned by the frame 11 may be configured to be higher than the sum of the height H2 in the Y-axis direction of the block 13 and the height H3 in the Y-axis direction of the lid 14 (H1>H2+H3). With this configuration, it is possible to insert the block 13 between the frame 11 and the lid 14 arranged in the +Y-axis direction of the space, which reduces the bothersomeness for the worker. In addition, by forming the frame 11 and the lid 14 arranged in the -Y-axis direction of the space into an integral structure, it is possible to simplify the structure of the phased array antenna 1.

Although the above describes the case where a phased array antenna is used, the present invention is not limited to this and may be applied to electronic devices to which a heat transfer medium is supplied to cool mounted electronic components. The heat transfer medium may be either liquid or gas.

The configurations shown in the above embodiments are merely examples of the contents of the present invention, and may be combined with other known technologies. Parts of the configurations may be omitted or modified without departing from the spirit of the present invention.

1 Phased array antenna, 11 Frame, 111 Horizontal frame, 112 Vertical frame, 114 Heat medium, 113 Flow path, 12 Front plate, 13 Block, 131 Housing, 132 Transmission module, 133 Heat spreader, 14 Lid, 141 Lid, 144 Opening, 142 Sealing member, 143 Screw, 144 Opening, 145 Regulating member, 147 Screw hole, 15 Sealing member, 16 Thermally conductive material.

Claims (4)

The front plate and
a frame that defines one surface of the front plate and has a flow path for a heat medium therein;
A temperature adjusting unit that adjusts the temperature of the heat medium;
a circulation unit that circulates the heat medium, the temperature of which has been adjusted by the temperature adjustment unit, through the flow path;
a block disposed in a space partitioned by the frame and having a transmission module mounted thereon;
a thermally conductive material that is disposed between the frame and the block and that includes Ga, In, Sn, or Bi ;
a cover portion that restricts the spread of the thermally conductive material in a direction facing the front plate,
The temperature control unit is
The heat medium is heated to a temperature equal to or higher than the melting point of the thermally conductive material.
A phased array antenna characterized by: The lid portion is
The phased array antenna according to claim 1 , wherein the phased array antenna is detachably mounted on the frame. The lid portion is
3. The phased array antenna according to claim 1 , further comprising an opening for filling the thermally conductive material between the block and the frame. The opening includes:
The phased array antenna according to claim 3 , further comprising a restricting member for restricting outflow of the thermally conductive material filled between the block and the frame.

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