JP7698295B2 - RFID labels and methods for using RFID labels - Google Patents

Description

The present invention relates to RFID labels and methods for using RFID labels.

A method of using labels has been proposed in which, when information relating to an object to be adhered is updated or added to a label that has already been printed on it, a label with the updated information printed on it is affixed over the label already attached to the object, rendering the information printed on the label already attached to the object unusable (see Patent Document 1).

In Patent Document 1, a label with a barcode containing updated information is affixed over an already affixed label so as to cover the barcode printed on the label, making it impossible to read the barcode on the already affixed label. This makes it possible to update information about the adherend.

JP 2009-98494 A

In recent years, in fields such as product manufacturing, management, and distribution, RFID media such as RFID tags and RFID labels that support RFID (Radio Frequency Identification) technology, which transmits and receives information by contactless communication from IC chips that contain product-related and identification information, have become widespread.

RFID labels are read using non-contact communication. Therefore, when the label usage method described in Patent Document 1 is applied to an RFID label, multiple RFID labels may be present on the adherend, and it may be impossible to read any of the RFID labels, or information from an undesired RFID label may be read.

The present invention aims to make it possible to read an RFID label containing updated information by making the information before the update unusable when the information on the adherend is updated on the RFID label on which the information is printed.

According to one aspect of the present invention, there is provided an RFID label comprising a first substrate having, on one surface thereof , an RFID antenna and an IC chip connected to the RFID antenna , and a second substrate attached to one surface of the first substrate via a laminating adhesive layer , wherein the RFID label has an adhesive portion consisting of an adhesive layer for an adherend provided on the other surface of the first substrate, a non-adhesive portion where the adhesive layer for an adherend is not disposed, and a pair of cut lines formed from one side to the other side of the RFID label at a position overlapping with the non-adhesive portion, and a part of the RFID antenna including the IC chip is located between the pair of cut lines.

According to the present invention, the breaking of the RFID label progresses from one side of the RFID label to the other side along a pair of cutting lines, and a part of the RFID antenna including the IC chip located between the pair of cutting lines is broken, and the non-adhesive portion is cut off. Therefore, in an RFID label on which information about an adherend is printed, when that information is updated, the information before the update can be made unusable. Furthermore, even if an RFID label containing updated information is affixed to an adherend, it can be made readable.

1 is a plan view of a continuous RFID label sheet in which RFID labels according to an embodiment of the present invention are temporarily attached in a continuous manner to a long strip-shaped separator, as viewed from the front side. FIG. 2 is an enlarged plan view showing one of the RFID labels shown in FIG. 1 . 3 is a cross-sectional view taken along line III-III shown in FIG. 2. 1 is a plan view of the RFID label after it has been peeled off the separator, viewed from the side of the surface that will be attached to the adherend. FIG. 11A and 11B are schematic diagrams illustrating an operation of cutting off a detached portion of a first RFID label attached to a test tube. FIG. 13 is a schematic diagram illustrating a state in which a detached portion of a first RFID label attached to a test tube has been cut off. 13A and 13B are schematic diagrams illustrating the operation of attaching a second RFID label to a test tube to which a first RFID label has been attached and from which a separation portion has been cut off. 10 is a schematic diagram illustrating a state in which a second RFID label is attached to and overlapped with a first RFID label from which a separation portion has been cut off. FIG. 1A to 1C are schematic diagrams illustrating application examples of an RFID label according to an embodiment of the present invention. FIG. 11 is a plan view of an RFID label according to a first modified example, as viewed from the front surface side. FIG. 11 is a plan view of an RFID label according to a second modified example, as viewed from the front side. FIG. 13 is a plan view of an RFID label according to a third modified example, as viewed from the front side. FIG. 13 is a plan view of an RFID label according to a fourth modified example, as viewed from the front side. FIG. 13 is a plan view of an RFID label according to a fifth modified example, as viewed from the front side. FIG. 13 is a plan view of an RFID label according to a sixth modified example, as viewed from the front side. FIG. 11 is a cross-sectional view illustrating an RFID label according to another embodiment of the present invention. FIG. 17 is a cross-sectional view illustrating a modified example of the RFID label shown in FIG. 16 .

[RFID label]
An RFID label 1 according to an embodiment of the present invention will be described.

Figure 1 is a plan view of a continuous RFID label body 10 in which RFID labels 1 according to this embodiment are temporarily attached in succession to a long strip-shaped separator S, as viewed from the front side. Figure 2 is a plan view showing an enlarged view of one RFID label 1. In Figure 2, a portion of the label base material 30 is cut away.

Figure 3 is a cross-sectional view taken along line III-III in Figure 2. Figure 4 is a plan view of the RFID label 1 after it has been peeled off from the separator S, seen from the side of the surface to be attached to the substrate.

As shown in FIG. 1, the RFID label strip 10 has multiple RFID labels 1 arranged on a long strip-shaped separator S. The multiple RFID labels 1 are arranged in the longitudinal direction of the separator S (the Y direction shown in FIG. 1).

The RFID label 1 is an RFID label that includes a first substrate having an RFID antenna and an IC chip connected to the RFID antenna, a second substrate attached to one surface of the first substrate via an adhesive layer for lamination, and an adhesive layer for an adherend provided on the other surface of the first substrate. As shown in FIG. 3, the RFID label 1 is formed by bonding an RFID inlay 20 as the first substrate and a label substrate 30 as the second substrate with an adhesive layer for lamination A1. In the RFID label 1, an adhesive layer for an adherend A2 is provided on the side of the RFID inlay 20 opposite to the side to which the label substrate 30 is bonded, and is temporarily attached to a separator S.

The RFID inlay 20 comprises an inlay substrate 21, an antenna pattern 22 which is an RFID antenna formed on the inlay substrate 21, and an IC chip 23 connected to the antenna pattern 22. In this embodiment, the antenna pattern 22 is formed from metal foil. The antenna pattern 22 may also be formed by printing. FIG. 3 shows an example in which a label substrate 30 is disposed on the surface of the inlay substrate 21 on which the antenna pattern 22 is formed. The antenna pattern 22 may also be disposed on the surface opposite to the surface on which the label substrate 30 is disposed.

The inlay substrate 21 can be, for example, a single resin film such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, or polyethylene naphthalate, or a multilayer film made by laminating multiple such resin films.

In this embodiment, in addition to the above-mentioned resin film substrate, paper substrates such as high-quality paper, medium-quality paper, or coated paper formed using these can be used as the inlay substrate 21.

In this embodiment, the inlay substrate 21 can have a thickness of 10 μm to 200 μm.

As shown in Figures 1 and 2, the antenna pattern 22 includes a loop portion 210 on which an IC chip 23 is mounted, meanders 211 and 212 extending symmetrically from the loop portion 210 across the width of the RFID label 1 (X direction), and capacitor hats 213 and 214 connected to the ends of the meanders 211 and 212.

In this embodiment, the antenna pattern 22 is, as an example, a UHF band RFID antenna designed to have an antenna length and antenna line width compatible with the UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz).

The antenna pattern 22 is also adhered to the inlay substrate 21 by a laminating adhesive layer (not shown) made of, for example, an acrylic, urethane, silicone, or rubber-based adhesive or bonding agent.

The antenna pattern 22 is formed of metal foil. Metals that can be used for the antenna pattern 22 include, for example, copper and aluminum. In this embodiment, aluminum foil is used to reduce manufacturing costs.

From the viewpoint of the overall thickness of the RFID inlay 20 or the thickness of the RFID label 1, and manufacturing costs, the thickness of the metal foil is preferably 3 μm or more and 50 μm or less. In this embodiment, as an example, aluminum foil having a thickness of 20 μm is used.

The IC chip 23 is a semiconductor package that supports the UHF band and is designed to be capable of communicating with a reader (not shown) that is a reading device for the IC chip 23.

Although not shown, the IC chip 23 is electrically and mechanically connected to a portion of the loop portion 210 of the antenna pattern 22 by an anisotropic conductive material such as an anisotropic conductive adhesive or an anisotropic conductive film.

As shown in Figures 2 and 3, in the RFID label 1, the label substrate 30 is attached to the surface of the inlay substrate 21 on the side of the antenna pattern 22 on which the IC chip 23 is mounted, using a lamination adhesive layer A1. The lamination adhesive layer A1 serves to laminate the label substrate 30 to the RFID inlay 20.

As shown in FIG. 3, the surface of the inlay substrate 21 opposite to the surface on which the IC chip 23 is mounted is temporarily attached to the separator S by the adhesive layer A2 for the adherend. The RFID label 1 is peeled off from the separator S and attached to the adherend by the adhesive layer A2 for the adherend.

In this embodiment, the adhesive layer A2 for the adherend is a frozen adhesive that maintains its adhesive strength by maintaining its flexibility even in a low-temperature environment.

The RFID label 1 has a non-adhesive portion 44 formed in a portion of the adhesive layer A2 for the adherend, and a cut line 41 formed from one side of the RFID label 1 to the other side at a position overlapping with the non-adhesive portion 44. The cut line 41 has a pair of cut lines 41a, 41b, and is formed so that a portion of the RFID antenna including the IC chip 23 (loop portion 210) is located between the pair of cut lines 41a, 41b. In this embodiment, the cut line 41 further has a cut line 41c that connects the ends of the cut lines 41a, 41b on the other side of the RFID label 1, and together with the cut lines 41a, 41b, defines a portion of the RFID label 1 including the entire loop portion 210 (hereinafter referred to as the separated portion 40).

In this embodiment, the cut line 41 is a so-called perforation process that has a cut portion (cut portion) of a predetermined length and a portion without a cut (uncut portion). Figures 1 to 3 show the cut line 41 in an easy-to-understand manner and do not show the details precisely, but the cut line 41 is formed so that the cut portion does not overlap the antenna pattern 22 so as not to impair the function of the antenna pattern 22. Also, as shown in Figure 3, the cut line 41 is formed to penetrate the label substrate 30, the laminate adhesive layer A1, the inlay substrate 21, and the adherend adhesive layer A2, but not to penetrate the separator S.

In this embodiment, the cut line 41 is formed in a U-shape that opens on one of a pair of opposing sides in the Y direction that intersects with the width direction of the RFID label 1.

The straight portion of the cut line 41 is formed to pass between the loop portion 210 and the meander 211, and between the loop portion 210 and the meander 212.

In the separated portion 40 defined by the cut line 41, the portion that constitutes the outer edge of the RFID label 1 has recesses 42, 43 that are recessed toward the inside of the RFID label 1 in the Y direction of the RFID label 1. The recesses 42, 43 are formed by curves that bulge outward from the RFID label 1.

As shown in FIG. 4, a non-adhesive portion 44 is formed in a portion of the adhesive layer A2 for the adherend in the separation portion 40 defined by the cut line 41. In this embodiment, the non-adhesive portion 44 can be formed by printing or applying a medium, varnish, or the like to the surface of the adhesive layer A2 for the adherend. This causes the adhesive layer A2 for the adherend to lose its adhesiveness.

In this embodiment, the separated portion 40 is formed so that the adhesive layer A2 for the adherend is exposed in a portion other than the area where the non-adhesive portion 44 is formed. As shown in FIG. 4, by leaving the adhesive area 45 in the separated portion 40, the separated portion 40 separated from the RFID label 1 can be attached to another adherend.

＜Effects＞
The RFID label 1 having the above-mentioned configuration has a non-adhesive portion 44 in a part of the adhesive layer A2 for the adherend, and a separation portion 40 is formed in the non-adhesive portion 44, which is partitioned by a cut line 41 so as to include the entire loop portion 210. Therefore, the separation portion 40 can be easily separated from the RFID label 1 after it has been attached to the adherend.

In addition, since the separation portion 40 including the entire loop portion 210 is divided by the cut line 41, when the separation portion 40 is separated, the IC chip 23 connected to the loop portion 210 is also separated along with the loop portion 210.

Therefore, when the RFID label 1 is used with information about the adherend printed on it, by separating the separation portion 40, the information cannot be read from the RFID label 1 that remains on the adherend by non-contact communication using RFID.

In addition, in the separated portion 40, recesses 42, 43 that are recessed toward the inside of the RFID label 1 are formed in the portion that constitutes the outer edge of the RFID label 1. This makes it easier for the user to grasp the separated portion 40, and the separated portion 40 can be easily cut off.

In addition, when a frozen glue is used as an adhesive layer for the adherend, as in this embodiment, it is difficult to peel off the RFID label, and the peeling process is cumbersome. In contrast, with the RFID label 1 according to this embodiment, a portion of the detached portion 40 is not attached to the adherend, so that the detached portion 40 can be easily peeled off from the RFID label 1.

In addition, in this embodiment, the adhesive area 45 remains in a portion of the separated portion 40 other than the area where the non-adhesive portion 44 is formed. Therefore, the separated portion 40 separated from the RFID label 1 can be attached to another adherend and used. The separated portion 40 includes the entire loop portion 210 to which the IC chip 23 is connected, making contactless communication using RFID possible. Therefore, for example, the separated portion 40 cut off from the RFID label 1 can be attached to a management document or ledger for storage or used for management purposes, separate from the adherend to which the RFID label 1 is attached.

[How to use RFID labels]
Next, a method of using the above-mentioned RFID label 1 will be described.

Figures 5 to 8 are diagrams explaining how to use the RFID label 1 when a test tube P is used as the adherend.

Figure 5 is a schematic diagram illustrating the operation of cutting off the detached portion 40A of the first RFID label 1A attached to the test tube P, and Figure 6 is a schematic diagram illustrating the state after the detached portion 40A of the first RFID label 1A attached to the test tube P has been cut off.

Figure 7 is a schematic diagram illustrating the operation of attaching a second RFID label 1B to a test tube P to which a first RFID label 1A with its detached portion 40A cut off has been attached. Also, Figure 8 is a schematic diagram illustrating the state in which a second RFID label 1B has been attached and superimposed on the first RFID label 1A with its detached portion 40A cut off.

Note that the first RFID label 1A and the second RFID label 1B are both labels with the same structure as the RFID label 1 described above.

In the method of using the RFID label 1 according to this embodiment, as shown in Figures 5 and 6, the separation portion 40A of the first RFID label 1A attached to the test tube P is separated.

Next, as shown in FIG. 7, a second RFID label 1B is affixed to the test tube P to which the first RFID label 1A has been affixed, from which the separated portion 40A has been separated. Here, as an example, updated information is written to the second RFID label 1B from the information recorded in the IC chip of the first RFID label 1A.

In this embodiment, as shown in FIG. 8, when the second RFID label 1B is attached to the test tube P, the outer edge of the second RFID label 1B overlaps with the outer edge of the first RFID label 1A.

In this embodiment, as described above, the first RFID label 1A and the second RFID label 1B are attached in an overlapping manner, so that visibility of the inside of the test tube P is not impaired.

In addition, since the positions of the meanders 211, 212 and the capacitor hats 213, 214 can be overlapped in the first RFID label 1A and the second RFID label 1B, a boost effect that amplifies the radio wave sensitivity of the second RFID label 1B can be obtained.

As another attachment method, when attaching the second RFID label 1B to the test tube P, the second RFID label 1B and the first RFID label 1A may be attached in a state where they are shifted from each other in the longitudinal direction. This may provide a boost effect.

The second RFID label 1B and the first RFID label 1A may also be attached with a shift in the short-side direction from each other. This may provide a boost effect.

Figure 9 is a schematic diagram illustrating an application example of the RFID label 1 according to this embodiment. Figure 9 shows RFID labels 1A and 1B on which information for identifying the adherend is printed.

RFID label 1A is printed with a barcode 100A for identifying it as RFID label 1A, a two-dimensional code 101A, and character information 102A corresponding to these codes. In addition, character information 103A linked to character information 102A is printed on separation portion 40A of RFID label 1A.

Furthermore, RFID label 1B is printed with barcode 100B for identifying it as RFID label 1B, two-dimensional code 101B, and character information 102B corresponding to these codes. Furthermore, character information 103B linked to character information 102B is printed on separation portion 40B of RFID label 1B.

As described with reference to Figures 5 to 8, such RFID labels 1A and 1B can be manufactured by first attaching the RFID label 1A to the test tube P. Then, when it becomes necessary to change the information contained in the IC chip 23 of the RFID label 1A, the separation portion 40A is cut off to make the information recorded in the IC chip 23 before the update unreadable, and then a second RFID label 1B on which the updated information is recorded is attached to the test tube P.

As a result, even if it becomes necessary to update the information for identifying the test tube P, there will be no confusion with the old information. In addition, it is possible to prevent problems such as the IC chip 23 becoming unreadable due to mutual interference caused by multiple RFID labels 1A, 1B being attached.

[Modification of RFID label]
10 is a plan view of the RFID label 2 according to the first modification, seen from the front side. In the RFID label 2, the end 61 constituting the outer edge of the RFID label 2 is formed in a triangular shape in the detached portion 51. This makes it easy for a user to grasp the detached portion 51, and therefore the detached portion 51 can be easily cut off.

Figure 11 is a plan view of the RFID label 3 according to the second modified example, viewed from the front side. In the RFID label 3, the end 62 that constitutes the outer edge of the RFID label 3 is formed in a trapezoidal shape in the detached portion 52. This makes it easier for the user to grasp the detached portion 52, and therefore allows the detached portion 52 to be easily cut off.

Figure 12 is a plan view of an RFID label 4 according to a third modified example, viewed from the front side. In the RFID label 4, an end 63 that constitutes the outer edge of the RFID label 4 is formed in the separation portion 53 so as to protrude outward from the RFID label 4 beyond the side of the RFID label 4 adjacent to the separation portion 53. This makes the separation portion 53 even easier for the user to grasp, and therefore allows the user to easily cut off the separation portion 53.

Figure 13 is a plan view of the RFID label 5 according to the fourth modified example, viewed from the front side. In the RFID label 5, a cut line 64 is formed across the RFID label 5 in the Y direction. In the RFID label 5, such a cut line 64 allows the separation portion 54 to be easily cut off.

Figure 14 is a plan view of an RFID label 6 according to a fifth modified example, viewed from the front side. The RFID label 6 has a pair of cut lines 141, 142 formed from one side of the RFID label 6 where the recesses 42, 43 are formed to the other side. In this modified example, the end points of the pair of cut lines 141, 142 are located beyond a part of the antenna pattern 22 extending from the loop portion 210 to which the IC chip 23 is connected, and the loop portion 210 to which the IC chip 23 is connected is formed to be located between the pair of cut lines 141, 142.

According to the RFID label 6 of the fifth modified example, even if the separated portion 40 is not defined by a cut line, the user can cut off the separated portion 40 by cutting the RFID label 6 from the end points of the pair of cut lines 141, 142 toward the other side, thereby cutting off the separated portion 40.

Figure 15 is a plan view of an RFID label 7 according to a sixth modified example, viewed from the front side. The RFID label 7 has a pair of cut lines 241, 242 formed from one side of the RFID label 7 on which the recesses 42, 43 are formed to the other side. In this modified example, the end points of the pair of cut lines 241, 242 are located in front of a portion of the antenna pattern 22 extending from the loop portion 210 to which the IC chip 23 is connected.

According to the RFID label 7 of the sixth modified example, there is no need to take care to ensure that the cut portion of the perforation that passes through the antenna pattern 22 does not overlap with the antenna pattern 22. According to the RFID label 7, when the user cuts out the separation portion 40, the RFID label 7 breaks from the end points of the pair of cutting lines 241, 242 toward the other side, thereby dividing the antenna pattern 22 and cutting out the separation portion 40.

Figure 16 is a cross-sectional view illustrating an RFID label 8 according to another embodiment of the present invention.

The RFID label 8 shown in FIG. 16 has a different layer structure from the RFID label 1. That is, in the RFID label 8, the inlay substrate 21 in the RFID inlay 20 also serves as the label substrate 30 in the RFID label 1. In the RFID label 8, the separator S is temporarily attached to the surface on which the antenna pattern 22 is formed via the adhesive layer A2 for the adherend.

In this way, the layer structure that makes up the RFID label can be modified as needed.

When the RFID label 8 is applied to a printer that uses, for example, a thermal head and a platen roller, the IC chip 23 is structured so as to face the platen roller, thereby reducing the impact on the IC chip 23 caused by the thermal head coming into contact with the RFID label 8.

In addition, because the RFID label 8 has the adhesive layer A2 for the adherend laminated on the surface on which the antenna pattern 22 is formed, when the RFID label 8 is used in the manner described with reference to Figures 5 to 8, the IC chip 23 portion of the second RFID label 1B fits within the thickness of the first RFID label 1A. Therefore, when the second RFID label 1B is attached in an overlapping state, protrusion by the second RFID label 1B can be suppressed.

[Other embodiments]
Although the embodiments of the present invention have been described above, the above-mentioned embodiments merely illustrate some of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above-mentioned embodiments.

In this embodiment, the entire area of the separation portion 40 may be the non-adhesive portion 44. The non-adhesive portion 44 can also be realized by not applying the adhesive layer A2 for the adherend to the corresponding area on the back side of the inlay substrate 21, that is, by performing a so-called "glue-free process."

In this embodiment, the first RFID label 1A and the second RFID label 1B are attached in overlapping positions at the same position on the test tube P. However, if visibility of the inside of the test tube P is required, the two labels may be attached in offset positions relative to each other as long as this visibility is not impaired.

In addition, in this embodiment, if visibility of the inside of the test tube P is not required, both may be attached to the same test tube P in non-overlapping positions.

In addition, in this embodiment, the surfaces of the RFID labels 1 to 8 may be printed with marks to guide the placement of the RFID labels 1 to 8 when they are stacked and attached.

In this embodiment, the antenna pattern 22 is described as an RFID antenna for a UHF band inlet, but it may also be an RFID antenna for a microwave band.

In this embodiment, the case where the adherend is a test tube P has been described, but the adherend is not limited to a test tube P. In addition to a test tube, the adherend may be a bag, a box, or the like.

The RFID label 1 may be a linerless label with a release agent layer provided on the surface of the label substrate 30. In this case, the separator S is not necessary.

The RFID label 9 shown in FIG. 17 is a cross-sectional view illustrating a further modified example of the RFID label 8 shown in FIG. 16. In the modified example shown in FIG. 17, an adhesive paper made of a label substrate 70 as a second substrate and a laminating adhesive layer A3 is laminated on the side opposite to the side on which the antenna pattern 22 of the RFID label 8 shown in FIG. 16 is formed. After the RFID label 9 is attached to an adherend, the separation portion 40 can be easily separated from the RFID label 9.

REFERENCE SIGNS LIST 1, 1A, 1B, 2, 3, 4, 5, 6, 7, 8, 9 RFID label 10 RFID label continuum 20 RFID inlay 21 Inlay substrate 22 Antenna pattern 23 IC chip 30, 70 Label substrate 40, 40A, 40B Separated portion 41, 41a, 41b, 41c Perforation line 42, 43 Recess 44 Non-adhesive portion 45 Adhesive region 50 Separated portion 51, 52, 53, 54 Separated portion 61, 62, 63 End 64 Perforation line 100A, 100B Barcode 101A, 101B Two-dimensional code 102A, 102B, 103A, 103B Character information 141, 142 Perforation line 210 Loop portion 211, 212 Meander 213, 214 Capacitor hat 241, 242 Cutting line A1, A3 Laminating adhesive layer A2 Adhesive layer for adherend

Claims (23)

An RFID label comprising: a first substrate having an RFID antenna and an IC chip connected to the RFID antenna on one surface thereof ; and a second substrate attached to one surface of the first substrate via a pressure-sensitive adhesive layer for lamination ,
The RFID label comprises:
a pressure-sensitive adhesive portion formed of a pressure-sensitive adhesive layer for an adherend provided on the other surface of the first base material, and a non-adhesive portion not provided with the pressure-sensitive adhesive layer for an adherend;
a pair of cut lines formed from one side to the other side of the RFID label at a position overlapping the non-adhesive portion,
A portion of the RFID antenna including the IC chip is located between a pair of the cut lines.
RFID label. 2. The RFID label of claim 1,
the RFID antenna has a loop portion to which the IC chip is connected,
the pair of perforations, together with a perforation line connecting the ends of each pair of perforations on the other side, define a part of the RFID label including the entire loop portion;
RFID label. 3. The RFID label according to claim 1,
The cut line is a perforation having a cut portion of a predetermined length and a non-cut portion, and the cut portion is formed so as not to overlap the RFID antenna.
RFID label. 4. The RFID label according to claim 1,
the pressure-sensitive adhesive layer for an adherend and a separator are laminated in this order on a surface of the first substrate on the RFID antenna side;
RFID label. 3. The RFID label of claim 2,
The RFID antenna comprises:
The loop portion, a meander having one end connected to the loop portion and extending from the loop portion, and a capacitor hat connected to each of the meanders,
RFID label. 6. The RFID label of claim 5,
The tear line is formed between the loop portion and the meander.
RFID label. 7. The RFID label according to claim 1,
A recess is formed at the position of the cut line on the one side, the recess being recessed toward the inside of the RFID label.
RFID label. 8. The RFID label according to claim 1,
The pressure-sensitive adhesive layer for an adherend is formed from a frozen glue suitable for a low-temperature environment.
RFID label. 9. The RFID label according to claim 1,
The RFID antenna is a UHF band RFID antenna.
RFID label. An RFID label comprising a first substrate having an RFID antenna and an IC chip connected to the RFID antenna, and a pressure-sensitive adhesive layer for an adherend on a surface of the first substrate facing the RFID antenna,
The RFID label comprises:
an adhesive portion formed of the adhesive layer for an adherend and provided on a surface of the first substrate on the RFID antenna side, and a non-adhesive portion in which the adhesive layer for an adherend is not provided ;
a pair of cut lines formed from one side to the other side of the RFID label at a position overlapping the non-adhesive portion,
A portion of the RFID antenna including the IC chip is located between a pair of the cut lines.
RFID label. 11. The RFID label of claim 10,
the RFID antenna has a loop portion to which the IC chip is connected,
the pair of perforations, together with a perforation line connecting the ends of each pair of perforations on the other side, define a part of the RFID label including the entire loop portion;
RFID label. 12. The RFID label according to claim 10,
The cut line is a perforation having a cut portion of a predetermined length and a non-cut portion, and the cut portion is formed so as not to overlap the RFID antenna.
RFID label. 12. The RFID label of claim 11,
The RFID antenna comprises:
The loop portion, a meander having one end connected to the loop portion and extending from the loop portion, and a capacitor hat connected to each of the meanders,
RFID label. 14. The RFID label of claim 13,
The tear line is formed between the loop portion and the meander.
RFID label. 15. The RFID label according to claim 10,
A recess is formed at the position of the cut line on the one side, the recess being recessed toward the inside of the RFID label.
RFID label. 16. An RFID label according to any one of claims 10 to 15,
The pressure-sensitive adhesive layer for an adherend is formed from a frozen glue suitable for a low-temperature environment.
RFID label. 17. An RFID label according to any one of claims 10 to 16,
The RFID antenna is a UHF band RFID antenna.
RFID label. 1. A method of using an RFID label, comprising:
The RFID label comprises:
An RFID label comprising: a first substrate having an RFID antenna and an IC chip connected to the RFID antenna; and a pressure-sensitive adhesive layer for an adherend provided on the first substrate, the pressure-sensitive adhesive layer for an adherend having a non-adhesive portion formed on at least a portion of the pressure-sensitive adhesive layer for an adherend; and a pair of cut lines formed from one side to the other side of the RFID label at a position overlapping with the non-adhesive portion, wherein a portion of the RFID antenna including the IC chip is located between the pair of cut lines,
Separating the portion of the first RFID label that is cut along the pair of cutting lines from the first RFID label attached to the adherend;
a second RFID label is attached to the first RFID label from which the part has been separated;
How to use RFID labels. 20. A method of using the RFID label of claim 18, comprising:
When the second RFID label is attached to the substrate, the second RFID label is attached so that an outer edge of the second RFID label overlaps an outer edge of the first RFID label.
How to use RFID labels. 10. The RFID label according to claim 1 ,
a separation portion defined by the pair of cut lines and a cut line connecting ends of the pair of cut lines,
The pressure-sensitive adhesive layer for an adherend is disposed on a part of the separation portion on the side of the cut lines connecting the ends of the pair of cut lines.
RFID label. 21. The RFID label of claim 20,
The non-adhesive portion is formed to extend to the outside of the pair of cut lines in the separation portion.
RFID label. 18. An RFID label according to any one of claims 10 to 17,
a separation portion defined by the pair of cut lines and a cut line connecting ends of the pair of cut lines;
The pressure-sensitive adhesive layer for an adherend is disposed on a part of the separation portion on the side of the cut lines connecting the ends of the pair of cut lines.
RFID label. 23. The RFID label of claim 22,
The non-adhesive portion is formed to extend to the outside of the pair of cut lines in the separation portion.
RFID label.

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