JP7699635B2 - Evaporation mask - Google Patents

Description

The present invention relates to a deposition mask, and can be applied to, for example, a deposition mask for an organic EL element used when forming a light-emitting layer of the organic EL element by a deposition mask method.

The deposition mask method is often used as a method for forming the light-emitting layer of an organic EL (Electroluminescence) element. In this deposition mask method, a deposition mask with holes removed at the locations of the substrate corresponding to the deposition sites is used to deposit an organic light-emitting material at desired locations on a substrate made of a transparent material such as glass.

In a deposition apparatus for performing deposition, a deposition mask is set in a state where it is correctly aligned with a substrate to be deposited, and deposition is performed. However, since heating is generally performed during deposition to create an environment in the deposition apparatus suitable for deposition, if the deposition mask and the glass substrate are in different thermal deformation states, the relative positional relationship between the deposition mask and the substrate changes, and there is a problem that the required precision of the formed light-emitting layer cannot be satisfied.

In recent years, a deposition mask has been proposed that employs a mask structure in which a reinforcing frame made of a material having the same thermal expansion coefficient as the substrate to be deposited (e.g., glass) or a material with a low thermal expansion coefficient is attached to the outer edge of a thin mask body. This allows the mask body to change shape in response to the expansion of the frame having the same thermal expansion coefficient as the substrate to be deposited, or to remain unaffected by the frame having a low thermal expansion coefficient, even when a mask body made of a material having a different thermal expansion coefficient from the substrate to be deposited is used. This ensures accurate alignment of the mask body with the substrate to be deposited when the temperature is increased in the deposition apparatus, and enables the formation of a light-emitting layer on the substrate to be deposited with high precision.

An example of such a conventional deposition mask is disclosed in Japanese Patent Application Laid-Open No. 2005-15908.

JP 2005-15908 A

Conventional deposition masks have the configurations shown in the above-mentioned patent documents, which can suppress relative deformation between the mask and the substrate due to differences in thermal expansion coefficients and prevent significant deterioration in the positional accuracy of the deposition product.

However, there is a demand for even higher precision in the market, and it is necessary to further suppress the occurrence of misalignment due to the displacement of the mask. However, in the case of a conventional combination structure of a mask body and a frame, the reinforcing frame must also be thin, so there is a limit to how much strength can be achieved with such a thin frame, and it is not possible to ensure the rigidity of the frame alone to avoid even slight deformation due to the stress on the mask body. For this reason, with the conventional mask structure, it is difficult to keep the displacement of the mask body within the tolerance range that becomes stricter as precision increases, and there is a problem that a decrease in yield due to the positional deviation of the deposition formation is unavoidable.

The present invention has been made to solve the above problems, and aims to provide a deposition mask that makes it difficult for the mask body and frame to deform, suppresses deviation of the mask body from the correct position, and improves the accuracy of deposition.

The deposition mask disclosed in the present invention includes a mask body having a large number of independent deposition through-holes arranged in a predetermined pattern, and a frame body disposed integrally with the mask body, the frame body having a holding frame portion connected and integrated with the mask body, and a reinforcing frame portion disposed integrally with the holding frame portion.

Thus, according to the disclosure of the present invention, a reinforcing frame portion is provided to reinforce the holding frame portion that holds the mask body in the frame, and the rigidity of the frame portion against stress from the mask body is increased, thereby enabling the mask body to be fixedly installed in the deposition apparatus while suppressing deviation of each part of the mask body from its original position, ensuring alignment between the mask and the substrate to be deposited, and enabling deposition to be performed with high precision in the appropriate position on the substrate to be deposited.

Furthermore, in the deposition mask disclosed herein, if necessary, a separation processing portion is provided at the boundary portion between the retaining frame portion and the reinforcing frame portion of the frame body, in which at least one of through holes or recesses is arranged in a regular or irregular line, or grooves are arranged in a continuous line.

As described above, according to the disclosure of the present invention, by providing a separation processing portion at the boundary between the retaining frame portion and the reinforcing frame portion of the frame body, and making it the processing target position when separating the reinforcing frame portion from the retaining frame portion, when it is no longer necessary to ensure the rigidity of the frame body by the reinforcing frame portion, such as after positioning and fixing the frame body holding frame portion and the mask body to the deposition apparatus, the reinforcing frame portion can be separated easily and naturally from the holding frame portion, allowing for a smooth transition to the deposition process using the deposition apparatus, and the reinforcing frame portion can be separated without affecting the shape of the holding frame portion that remains as the frame body or the reinforcement state of the mask body by the holding frame portion, allowing the subsequent deposition process to proceed without any problems.

In addition, in the deposition mask according to the present disclosure, the mask body is integrated with a holding frame part of a frame in a state in which a stress that causes the mask body to contract inwardly with respect to the frame remains, as necessary,
The predicted deformation amount of each part of the frame body is calculated in advance assuming a state in which a force based on the stress is applied to the frame body, and the detachment processing portion is set to a shape such that the larger the predicted deformation amount at the location where the detachment processing portion of the frame body is to be provided, the smaller the ratio of the size of the portion removed at that location as the through hole, recess, or groove to the remaining portion that is not removed.

Thus, according to the disclosure of the present invention, the frame body is one in which the predicted amount of deformation of each part of the frame body due to a force based on the stress of the mask body has been estimated in advance, and the removed portion in the cutting-off processed portion of this frame body is set so that the ratio of the removed portion to the unremoved remainder is reduced in locations where the predicted amount of deformation of the frame body due to the stress of the mask body is large, while the ratio of the removed portion to the unremoved remainder is set so that the ratio of the removed portion to the unremoved remainder is increased in locations where the predicted amount of deformation of the frame body due to the stress of the mask body is small, and the cutting-off processed portion is shaped to have an increased or decreased removed portion adjusted according to the deformability of each part of the frame body. Thus, in locations where the frame body is expected to deform significantly due to the stress of the mask body, the ratio of the removed portion of the cut-off processed portion, such as recesses, is reduced to ensure sufficient strength of the frame body, while in locations of the frame body where the stress of the mask body is less likely to be applied, the ratio of the removed portion of the cut-off processed portion is increased, thereby ensuring appropriate strength and improving the processing efficiency during the reinforcing frame portion cutting-off process, and enabling the reinforcing frame portion to be quickly separated, allowing a smooth transition to the vapor deposition process.

Furthermore, in the deposition mask disclosed in the present invention, as necessary, the separation processing portion has a combined shape of a groove that is continuously arranged in a line at the boundary portion between the holding frame portion and the reinforcing frame portion, and a plurality of through holes that are drilled in the groove at a predetermined interval in the groove continuing direction, and the through hole has an acute-angled notch portion at the end of the through hole in the direction in which the groove continues.

Thus, according to the disclosure of the present invention, the separation processing portion of the frame body has a combined structure of a groove and a through hole, and the through hole is partially extended in the continuous direction of the groove to create an acute-angled notch. Therefore, when the separation processing portion is cut to separate the reinforcing frame portion of the frame body, a cut surface is smoothly generated starting from the notch along the separation processing portion, making it less likely that burrs or the like will remain on the holding frame portion, and does not adversely affect the various operations associated with the vapor deposition process.

Further, a deposition mask installation method according to the present disclosure is a deposition mask installation method for installing a deposition mask at a preset position in a deposition apparatus, the deposition mask comprising:
The mask is manufactured by arranging a frame body, each of which has a holding frame portion that can be integrally connected to the outer periphery of the mask body and a reinforcing frame portion that is disposed integrally with the holding frame portion in an arrangement that continuously surrounds the outside of the holding frame portion, so as to surround the outside of a plurality of mask bodies each having a large number of independent deposition through-holes provided in a predetermined pattern, so as to surround the outside of the mask body, and the holding frame portion of the frame body of the deposition mask is fixed integrally to a frame for supporting the deposition mask in the deposition apparatus, and the reinforcing frame portion is cut off and removed from the holding frame portion of the frame body in a state where it is fixed to the frame.

According to the disclosure of the present invention, the deposition mask is formed by connecting a frame body and a plurality of mask bodies, the strength of which is increased by a reinforcing frame portion disposed on the outer side of the holding frame portion, and the frame body is made less likely to deform. The holding frame portion of the frame body is fixed to the frame of the deposition apparatus, whereby the deposition mask is supported by the deposition apparatus.
The deposition mask can be installed in the deposition device while the frame keeps the mask body from deforming,
By preventing the displacement of the mask body, the alignment state between the mask and the substrate to be deposited is ensured, and the deposition precision is improved, thereby improving the yield of deposition products. In addition, by separating the reinforcing frame from the holding frame after the frame body is fixed to the deposition device, the reinforcing frame does not become an obstacle to the process after the deposition mask is fixed and supported.
Deposition can be carried out without any problems using the deposition device.

In addition, the deposition mask installation method according to the disclosure of the present invention includes a first step of measuring, in a completed state of the deposition mask, displacements in two directions parallel to each side of an outer periphery of the rectangular frame at each position of the frame and the mask main body; a second step of applying, when the inward displacement of a predetermined position does not fall within a preset allowable range, a predetermined outward tensile force parallel to the direction of the maximum displacement to the outer periphery of the frame that is outside the position where the maximum displacement has occurred, with the magnitude of the force such that the displacement of the position falls within the allowable range; and a third step of measuring the displacements in the two directions at each position of the frame and the mask main body again in a state where the tensile force has been applied.
a fourth step of applying a predetermined outward tensile force parallel to the direction of the new maximum displacement to the outer periphery of the frame outside the position where the new maximum displacement occurred while maintaining the state where the tensile force is being applied, the force being of such magnitude that the displacement of the position falls within the allowable range; and a fifth step of adjusting the tensile force to be applied to the outer periphery of the frame outside the position where the new maximum displacement occurred, the fifth step of adjusting the tensile force to be applied to the outer periphery of the frame outside the position where the tensile force is already applied, so that the displacement of the position falls within the allowable range, the fifth step of adjusting the tensile force to be applied to the outer periphery of the frame outside the position ...

As described above, according to the disclosure of the present invention, a process of applying an external tensile force to a predetermined portion of the frame body where significant deformation may occur due to stress of the mask body, and bringing the displacement within an acceptable range is repeated until the displacement is within the acceptable range at both positions of the frame body and the mask body, and then, leaving the state of the frame body and the mask body where the displacement is within the acceptable range, the holding frame portion of the frame body is fixed to the frame, and the evaporation mask is placed in the evaporation device, and then the tensile force applied to the frame body is released.This reliably prevents the mask body from shifting from the correct position due to deformation of the frame body in the evaporation mask by a method of suppressing deformation of the frame body by applying an external force, and fixes the frame body to the frame, thereby ensuring the appropriate installation of the deposition mask in the deposition device, and further improving the accuracy of deposition.

In addition, a manufacturing method of a deposition mask according to the disclosure of the present invention includes a plurality of metal mask bodies each having a large number of deposition through holes, and a metal frame body arranged to surround the outside of the mask bodies, and includes a first electroforming step of forming primary electrodeposition layers corresponding to the mask bodies by metal electroforming at a plurality of predetermined positions on a matrix, a frame disposing step of disposing the frame body on the matrix while aligning the primary electrodeposition layers so as to be located within a plurality of openings previously provided in the frame body, and a frame processing step of providing the frame body with a separation processing portion by performing a predetermined removal processing on the frame body, such that at least one of through holes or recesses is arranged in a regular or irregular linear arrangement, or grooves are arranged in a linear continuous arrangement;
A predetermined area extending from a part or the entire surface of the frame to the outer peripheral surface of the primary electrodeposition layer,
It includes a second electroforming process in which a metal layer is formed by electroforming and the frame body and the primary electrodeposition layer are integrally connected via the metal layer so that they do not separate, and a peeling process in which the integrated primary electrodeposition layer, frame body and metal layer are peeled off from the mother mold.

Thus, according to the disclosure of the present invention, a primary electrodeposition layer that will become the mask body is formed on a matrix, a frame is disposed so as to be positioned around this primary electrodeposition layer, and a metal layer is formed in a predetermined range from the surface of the frame to the outer peripheral surface of the primary electrodeposition layer to connect the frame and the primary electrodeposition layer, and during this process, a separation processing portion is provided on the frame by a predetermined removal processing,
When the deposition mask is obtained by peeling the primary electrodeposition layer, frame, and metal layer together from the master mold, an inner region that holds the mask body together and an outer region that reinforces the entire frame can be set on the frame, with the separation processing portion as the boundary. If the region outside the frame processing portion for separation is made sufficiently large, the rigidity of the frame against the force applied to the frame from the mask body based on the stress of the mask body can be increased. The deposition mask can be fixed and installed in the deposition apparatus with the deviation of each part of the mask body from its original position suppressed, ensuring alignment between the mask and the substrate to be deposited, and deposition can be performed with high precision in the appropriate position on the substrate to be deposited. In addition, after the deposition mask is fixed to the deposition apparatus, if it is no longer necessary to ensure the rigidity of the frame body by the area outside the cutting processing section of the frame body, the outer area of the frame body can be easily and effortlessly separated by performing cutting processing at the cutting processing section, allowing for a smooth transition to the deposition process using the deposition apparatus.In addition, the outer area can be separated without affecting the shape of the inner area portion that remains as the frame body and the resulting holding state of the mask body, allowing the subsequent deposition process to be carried out without any problems.

1 is a schematic plan view of a deposition mask according to a first embodiment of the present invention. 1 is a diagram illustrating a configuration of a main part of a deposition mask according to a first embodiment of the present invention; 1 is a schematic cross-sectional view of a main part of a deposition mask according to a first embodiment of the present invention. 2 is a plan view of a frame in the deposition mask according to the first embodiment of the present invention. FIG. 4 is a partial enlarged view of a cut-off processed portion of a frame of the deposition mask according to the first embodiment of the present invention. FIG. 3A to 3C are diagrams illustrating a primary pattern resist formation process in the manufacture of a deposition mask according to the first embodiment of the present invention. 4A to 4C are diagrams illustrating a primary electrodeposition layer forming step in the manufacture of a deposition mask according to the first embodiment of the present invention. 5A to 5C are diagrams illustrating a secondary pattern resist formation process in the manufacture of a deposition mask according to the first embodiment of the present invention. 5A to 5C are diagrams illustrating a metal layer forming step and a separation state of the deposition mask and the matrix in the manufacture of the deposition mask according to the first embodiment of the present invention. 5A to 5C are explanatory views of a process of placing the deposition mask on a frame of the manufacturing apparatus according to the first embodiment of the present invention. 4 is an explanatory view showing a state in which the deposition mask according to the first embodiment of the present invention is fixed to a frame of a manufacturing apparatus. FIG. 5 is an explanatory diagram showing a state in which a reinforcing frame portion is separated from a frame body in the deposition mask according to the first embodiment of the present invention. FIG. FIG. 4 is a schematic configuration explanatory diagram of another manufacturing apparatus frame on which a deposition mask according to the first embodiment of the present invention is installed. 6 is an explanatory view showing a state in which the deposition mask according to the first embodiment of the present invention is fixed to a frame of another manufacturing apparatus. FIG. 10 is a schematic explanatory diagram of an arrangement state of another separation processing portion of the frame in the deposition mask according to the first embodiment of the present invention. FIG. 13A to 13C are explanatory views of a removal processing step for a frame in a manufacturing method of a deposition mask according to a second embodiment of the present invention. 13A to 13C are explanatory views of a deformed state of a frame when the manufacturing of a deposition mask according to a third embodiment of the present invention is completed. 13 is an explanatory view showing a state in which a first stage of tensile force is applied to a frame when the deposition mask according to the third embodiment of the present invention is installed in a manufacturing apparatus. FIG. 13 is an explanatory view showing a state in which a second stage of tensile force is applied to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. FIG. FIG. 13 is an explanatory view of a third stage of tensile force application to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. FIG. 13 is an explanatory view of a fourth stage of tensile force application to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. FIG. 13 is an explanatory view of a fifth stage of tensile force application to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. FIG. 13 is an explanatory view of a sixth stage of tensile force application to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. FIG. 13 is an explanatory view of a seventh stage of application of tensile force to the frame when the deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus.

(First embodiment of the present invention)
1 to 12. In this embodiment, an example in which the deposition mask is applied to an organic EL element deposition mask will be described.

In each of the drawings, the deposition mask 1 according to the present embodiment includes a plurality of mask bodies 2 each having a large number of deposition through-holes 8 formed in a predetermined pattern, and a frame 3 arranged to surround the outside of the mask body 2.
The configuration includes the following:

The mask body 2 is made of nickel, nickel alloys such as nickel-cobalt, or other electrodeposited metals, and is formed into a sheet shape by electroforming, and is configured to have a large number of independent deposition through holes 8 formed in a predetermined pattern to allow the deposition material to pass through.

The mask body 2 includes an internal pattern formation region 2a in which a large number of deposition through-holes 8 are provided, and an outer periphery 2b which is integrally joined to the frame body 3 via a metal layer 7 formed by electroforming. In the pattern formation region 2a, the large number of deposition through-holes 8 form a deposition pattern 9 for forming a light-emitting layer.

The thickness of the mask body 2 is preferably in the range of 10 to 100 μm, and in this embodiment, it is 20
Each vapor deposition through-hole 8 has a rectangular shape with a front-to-back length of 70 μm and a left-to-right width of 170 to 200 μm in plan view, for example, and these vapor deposition through-holes 8 are grouped into rows of a plurality of through-hole groups that are linearly arranged in the front-to-back direction, and these rows form a matrix-like vapor deposition pattern 9 in which a plurality of rows are arranged in parallel in the left-to-right direction.

The frame 3 is a frame-shaped rectangular thin plate that is thicker than the mask body 2, and is disposed on the outer periphery of the mask body 2 to reinforce the mask body 2, and is connected and integrated with the mask body 2 via a metal layer 7. In detail, the frame 3 has a holding frame 4 that is connected and integrated with the outer periphery of the mask body 2, and a reinforcing frame 5 that is disposed integrally with the holding frame 4 in a position that continuously surrounds the outside of the holding frame 4.

The frame 3 is made of a material with a low thermal expansion coefficient, such as Invar, which is a nickel-iron alloy, or Super Invar, which is a nickel-iron-cobalt alloy, etc. The frame 3 is connected and integrated with the outer periphery 2b of the pattern formation region 2a of the mask body 2 by a metal layer 7 formed by electroforming so that they do not separate from each other.

When an Invar material or a Super Invar material is used as the material of the frame body 3, the extremely small thermal expansion coefficient of the material can satisfactorily suppress dimensional changes in the mask body 2 due to the thermal influence in the deposition process. That is, as in the case of the mask body 2 made of, for example, nickel, whose thermal expansion coefficient is larger than that of the general glass substrate (not shown), there is no deviation between the through-hole position relative to the substrate when the deposition mask 1 is aligned with the substrate at room temperature and the deposition position of the deposition material during actual deposition due to the difference in thermal expansion coefficient caused by the high temperature during deposition, and the small thermal expansion coefficient of the frame body 3 holding the mask body 2 effectively suppresses dimensional changes and shape changes caused by the expansion of the mask body 2 when the temperature rises, and the alignment accuracy at room temperature can be well maintained even when the temperature rises during deposition.

The frame 3 may be made of a material having a low thermal expansion coefficient similar to that of the glass substrate, such as glass or ceramic. In this case, at least the surface of the material is made conductive.

As shown in Fig. 4, the frame 3 is formed in a rectangular frame shape made of a thin plate with six openings 3a corresponding to the mask bodies 2, and six mask bodies 2 are held by one frame 3. That is, the frame 3 has six openings 3a aligned on its plate surface, and one mask body 2 is attached to each opening 3a. The width of the wide outer peripheral portion of the frame 3 where the reinforcing frame 5 is located is, for example, about 60 mm, of which the width of the holding frame 4 is set to about 10 mm, and the width of the reinforcing frame 5 is set to about 50 mm. The thickness of the frame 3 is, for example, about 0.1 to 5.0 mm, and is set to 1.0 mm in this embodiment.

At the boundary between the holding frame portion 4 and the reinforcing frame portion 5 of the frame body 3, a linear continuous groove 3c is formed.
and a plurality of through holes 3d are combined to form a separation processed portion 3b. The width of the separation processed portion 3b is set to about 2 mm, for example.

The separation processing portion 3b is formed by combining a groove 3c that is continuously arranged linearly at the boundary between the holding frame portion 4 and the reinforcing frame portion 5, and a plurality of through holes 3d that are bored in the groove 3c at predetermined intervals in the groove continuing direction. Of these, the through holes 3d are provided with an acute-angled notch portion 3e at the end of the through hole in the direction in which the groove 3c continues.

In addition, it is preferable to set the position of the tip (acute corner) of the cutout portion 3e so that it is shifted from the center position in the width direction of the cutting-off processing portion 3b toward the holding frame portion 4 or the reinforcing frame portion 5, and it is even more preferable to shift it toward the holding frame portion 4 on the mask body 2 side.

The cut-off processed portion 3b can be provided by etching the frame 3, or by removing unnecessary portions by mechanical processing or laser processing.
The cut-off processed portion 3b is not limited to a through hole 3d having a cross-sectional shape with a notch 3e, but may be a through hole having a simple rectangular or circular cross section. The cut-off processed portion 3b may be a shape combining a groove 3c and a through hole 3d, or may be a groove in which no through holes are arranged at a predetermined interval, and the groove is arranged in a linear continuous manner.
The separation processed portion 3b may be configured such that at least one of through holes and recesses is arranged in a regular or irregular manner in a plurality of lines.

The frame body 3 having the cut-off processing portion 3b already provided thereon is provided in the manufacturing process of the deposition mask 1, and after the primary electrodeposition layer 15 that becomes the mask body is formed, it is placed on the matrix 10 so as to be positioned around the primary electrodeposition layer 15. Alternatively, the unprocessed frame body 3 can be placed on the matrix 10, and the cut-off processing portion 3b can be provided on the frame body 3 at an intermediate stage in the subsequent manufacturing process.

The deposition mask 1 is manufactured by providing a primary pattern resist 14 on the surface of a mother mold 10 in correspondence with non-positioned portions of the primary electrodeposition layer 15, forming the primary electrodeposition layer 15 on the mother mold 10 by electroforming of an electrodeposited metal, arranging a frame body 3 so as to surround this primary electrodeposition layer 15, forming a secondary pattern resist 18 covering the portion of the primary electrodeposition layer 15 corresponding to the pattern formation region 2a, and then forming a metal layer 7 by electroforming so as to cover the surface of the frame body 3 and the surface of the outer circumferential edge 2b of the primary electrodeposition layer 15, and separating the primary electrodeposition layer 15, the frame body 3 and the metal layer 7 from the mother mold 10 while the primary electrodeposition layer 15 and the frame body 3 are connected together via the metal layer 7 so as not to separate.

The matrix 10 used in the manufacturing process of the deposition mask 1 according to this embodiment is made of a conductive material such as stainless steel, brass, or steel, and supports the primary electrodeposition layer 15 constituting the mask body 2 and other components until separation in the manufacturing process of the deposition mask, and a primary pattern resist 14, a primary electrodeposition layer 15, a secondary pattern resist 18, and a metal layer 7 are formed on the front surface side at each stage of the manufacturing process of the deposition mask. When the primary electrodeposition layer 15 or the metal layer 7 is formed, electricity is passed through the matrix 10, and the primary electrodeposition layer 15 or the metal layer 7 is formed by electroforming in the electrically conductive parts of the surface of the matrix 10 that are not covered by the resist.

The matrix 10 may be made of a material with a low thermal expansion coefficient, such as 42 alloy (42% nickel-iron alloy), Invar (36% nickel-iron alloy), SUS 430, etc. Alternatively, the matrix may be an insulating substrate, such as a glass plate or a resin plate, on whose surface a metal film made of a conductive metal, such as chromium or titanium, is formed.

In the manufacturing process of the deposition mask 1, after the metal layer 7 is formed on the matrix 10 by electroforming (FIG. 9),
9B), and the matrix 10 is separated and removed therefrom (see FIG. 9C). When the matrix 10 is made of stainless steel, it is preferable to use a method in which it is physically peeled off from the deposition mask side by applying force to remove it, and when the matrix 10 is made of other metal materials, it is preferable to use an etching method in which it is dissolved and removed using a chemical solution. In the case of etching, an etching solution is used that has a selective etching property such that the matrix 10 dissolves but the materials constituting the primary electrodeposition layer 15, the frame 3, and the metal layer 7 are not damaged.

The primary electrodeposition layer 15 is made of nickel or a nickel alloy such as nickel-cobalt that is suitable for electroforming, and is formed by electroforming in a portion of the matrix 10 where there is no primary pattern resist 14. In the deposition mask 1, the primary electrodeposition layer 15 is formed to constitute a mask body 2 that covers the surface of the deposition target substrate, except for deposition through holes 8 that correspond to deposition target portions of the deposition target substrate, such as a light-emitting layer.

The primary pattern resist 14 is made of an insulating material that is resistant to dissolution in an electrolyte used in electroforming of the primary electrodeposition layer 15, and is a pattern of the primary electrodeposition layer 15 that is set in advance on the matrix 10.
The insulating layer 14 is disposed in correspondence with the non-placed portions of the primary electrodeposition layer 15 and is removed after the primary electrodeposition layer 15 is formed (see FIGS. 6 and 7).

The primary pattern resist 14 is disposed on the mother mold 10 prior to the formation of the primary electrodeposition layer 15, and a photosensitive resist, for example, a negative type photosensitive dry film resist, is applied to the mother mold 1.
0 to a predetermined thickness, for example, about 20 μm, and with a mask film 12 of a predetermined pattern placed thereon corresponding to the position of the mask body 2 of the deposition mask 1, i.e., the position of the primary electrodeposition layer 15, the mask film 12 is hardened by exposure to ultraviolet light, and developed to remove the resist from the non-irradiated portions, and then formed into a shape corresponding to the non-positioned portions of the primary electrodeposition layer 15.

The secondary pattern resist 18 is formed from an insulating material that is resistant to dissolution in the electrolyte used in electroforming of the metal layer 7, is arranged in correspondence with the predetermined non-placement portions of the metal layer 7, and is removed after the metal layer 7 is formed (see Figures 8 and 9).

This secondary pattern resist 18 is disposed prior to the formation of the metal layer 7, and is formed by disposing a photosensitive resist, for example a negative-type photosensitive dry film resist, on the mold 10 and the already disposed primary electrodeposition layer 15 to a predetermined thickness, for example a thickness of about 15 μm, and then, with a mask film 17 of a predetermined pattern corresponding to the metal layer 7 and frame 3 positions of the deposition mask 1 placed thereon, hardening by exposure to ultraviolet light, development to remove the photosensitive material in the non-irradiated portions, and the like, to form a shape corresponding to the non-disposed portions of the metal layer 7 (the pattern formation regions 2 a of the mask body 2).

The metal layer 7 is formed by electroforming and is made of nickel, a nickel-cobalt alloy, or the like, and is configured to be formed by electroforming on the exposed portions of the master mold 10, the already arranged primary electrodeposition layer 15, and the frame body 3 where the secondary pattern resist 18 is not provided.

This metal layer 7 connects the mask body 2 and the frame body 3. The metal layer 7 is laminated by electroforming on the upper surface of the mask body 2 that is connected to the outer periphery 2b of the pattern formation region.
The metal layer 7 is formed on the upper surface of the outer periphery 2b of the pattern forming region 2a of the mask body 2 and on the frame 3.
and the side surface on the pattern formation region 2a side, and in the gap between the mask body 2 and the frame 3, thereby integrally connecting the outer periphery 2b of the pattern formation region 2a and the opening periphery of the frame 3 so that they do not separate.

The metal layer 7 can be formed on the entire surface (upper surface) of the frame 3 including both the holding frame portion 4 and the reinforcing frame portion 5. However, the metal layer 7 can be formed on the entire surface (upper surface) of the frame 3 including both the holding frame portion 4 and the reinforcing frame portion 5 by cutting at the separation processing portion 3b later.
Since the metal layer 7 is separated and removed, the metal layer 7 may be formed only on the surface of the holding frame 4 .

Next, a manufacturing process of the deposition mask according to this embodiment and a process of installing the deposition mask in a deposition apparatus will be described.
In the manufacturing process of the deposition mask, first, a resist layer 11 is provided on the matrix 10 so as to correspond to the deposition through-holes 8 of the mask body 2, i.e., the non-positioned portions of the primary electrodeposition layer 15, which are set in advance on the matrix 10 (see FIG. 6). Specifically, for example, one or several sheets of negative-type photosensitive dry film resist are laminated on the front surface side of the matrix 10 to a predetermined thickness (e.g., about 20 μm) corresponding to the height of the primary electrodeposition layer 15 to be formed, and the resist layer 11 is formed by thermocompression bonding (see FIG. 6(A)).

Then, a mask film (glass mask) 12 having a predetermined pattern corresponding to the arrangement position of the primary electrodeposition layer 15, such as having light transmitting holes 12a corresponding to the deposition through holes 8, is attached to the surface of the resist layer 11, and then various processes are performed, such as curing by exposure to ultraviolet light (see Figures 6(B) and (C)), development to remove the resist from the masked non-irradiated parts, and drying. In this way, a primary pattern resist 14 corresponding to the non-arrangement parts of the primary electrodeposition layer 15 is applied to the mother mold 10.
(See FIG. 7A).

Incidentally, such primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or by any other method, and the method of formation is not limited to the above.

The matrix 10 having the primary pattern resist 14 is placed in an electroforming tank prepared under predetermined conditions, and the primary pattern resist 14 of the matrix 10 is electroformed within the range of the thickness of the primary pattern resist 14.
A primary electrodeposition layer 15, which will become the mask body 2, is formed on the surface (exposed area) not covered with the mask layer 12 by electroforming a metal such as a nickel alloy (see FIG. 7B).

Thereafter, the primary pattern resist 14 is dissolved and removed to leave a predetermined deposition pattern 9
A primary electrodeposition layer 15 is obtained which will become the mask body 2 having a large number of independent deposition through holes 8 (see FIG. 7C).

After the primary electrodeposition layer 15 is obtained, a resist layer 16 is provided on the entire surface of the matrix 10 including the portion where the primary electrodeposition layer 15 is to be formed. Specifically, for example, a negative type photosensitive dry film resist is applied to the surface side of the matrix 10 to a predetermined thickness (for example, about 15 μm).
One or several sheets are laminated according to the length of the substrate 11, and a resist layer 16 is formed by thermocompression bonding (FIG. 8(A)
)reference).

8(B), a mask film 17 having light-transmitting holes 17a corresponding to the pattern-forming regions 2a of the mask body 2 is adhered to the surface of the resist layer 16, and then a process of curing the resist layer by exposure to ultraviolet light is performed (see FIGS. 8(B) and 8(C)). As a result, the portions corresponding to the pattern-forming regions 2a become exposed resist layer 16a, and the other portions become unexposed resist layer 16b.

Here, the frame 3, which is provided in advance with a cut-off processing portion 3b, is positioned on the matrix 10 so as to surround the primary electrodeposition layer 15 (see FIG. 8(C)).
The frame 3 here can be temporarily fixed onto the matrix 10 by the adhesiveness of the unexposed resist layer 16b so that it does not move easily.

After the frame 3 is placed, a process is carried out to dissolve and remove the unexposed resist layer 16b exposed on the surface, thereby forming a secondary pattern resist 18 that covers the pattern formation region (see FIG. 9(A)).
The unexposed resist layer 16b present on the underside of the frame 3 is not removed because it is not exposed to the surface, but remains on the matrix 10 and continues to play a role in fixing the frame 3.

Thereafter, a metal layer 7 is formed by electroforming an electrodeposited metal on the upper surface of the primary electrodeposition layer 15 that is not covered with the secondary pattern resist 18 and is exposed on the surface relating to the outer periphery 2b of the pattern formation region 2a, on the surface of the matrix 10 that is exposed between the frame 3 and the primary electrodeposition layer 15, and on the surface of the frame 3 (see FIG. 9(B)). This metal layer 7 can connect the primary electrodeposition layer 15 and the frame 3 together so that they do not separate.

In this case, the metal layer 7 is formed so that its thickness is 30 μm on the upper surface of the primary electrodeposition layer 15 exposed on the surface relating to the outer peripheral edge 2b of the pattern formation region 2a and on the surface of the matrix 10 exposed on the surface between the primary electrodeposition layer 15 and the frame 3. On the other hand, the thickness of the metal layer 7 on the surface of the frame 3 is 15 μm. This difference in thickness occurs because the metal layer 7 is successively layered from the surface of the matrix 10, and it is only when the metal layer 7 reaches the frame 3 beyond the height dimension of the unexposed resist layer 16b and reaches the matrix 10.
This is because the metal layer 7 starts to be formed on the surface of the frame 3 .

After the formation of the metal layer 7 is completed, the final step is to remove the integral primary electrodeposition layer 15 from the matrix 10.
The frame 3 and the metal layer 7 are peeled off (see FIG. 9C).
The unexposed resist layer 16b present on the lower side of the frame 3 is removed to form the deposition mask 1.
The production is completed.

The deposition mask 1 obtained through the above-mentioned manufacturing steps is configured to generate a stress F in the mask body 2 in a direction in which the mask body 2 contracts inward relative to the outer frame 3 .
In detail, by forming the primary electrodeposition layer 15 by electroforming using a material with a large thermal expansion coefficient relative to the master mold 10, the primary electrodeposition layer 15 is formed on the master mold surface in a state of linear expansion exceeding that of the master mold in an environment at a temperature higher than room temperature during electroforming, and since deformation is restricted on the master mold 10, although the primary electrodeposition layer 15 tries to shrink more than the master mold 10 in an environment at room temperature, no shrinkage actually occurs, and a stress is generated in the primary electrodeposition layer 15 that causes it to shrink inward.

On the other hand, since the frame 3 is disposed in a room temperature environment relative to the matrix 10, and the frame itself is formed of a material with a low thermal expansion coefficient, the primary electrodeposition layer 15 retains an internal stress in a direction of inward contraction even in a state in which the primary electrodeposition layer 15 and the frame 3 are connected by forming the metal layer 7. For this reason, when the integrated primary electrodeposition layer 15 and the frame 3 are separated from the matrix 10, the primary electrodeposition layer 15, i.e., the mask body 2, attempts to contract inward relative to the frame 3, exerting an inward tensile force on the frame 3.

Next, a process of installing the deposition mask according to this embodiment in a deposition apparatus will be described.
As described above, the mask body 2 is formed in a state in which a stress is generated in the direction of inward contraction with respect to the frame body 3, so that a force is applied from the mask body 2 to deform the frame body 3. Here, the frame body 3 has a configuration in which the reinforcing frame part 5 is integrally disposed on the outside of the holding frame part 4, and the frame body 3
The reinforcing frame 5 is structured to reinforce the holding frame 4 that holds the mask body 2 on the inside from the outside. This increases the rigidity of the frame 3 against a force that tends to deform the frame 3 due to stress in the mask body 2, and the frame 3 that receives the force does not deform significantly. Since the frame 3 is less likely to deform, the mask body 2 is also less likely to deform.

The deposition mask 1, which is a combination of the mask body 2 and the frame 3, is installed in a deposition apparatus such as a deposition tank so that deposition can be performed. When installing, the deposition mask 1 is first appropriately positioned and then fixed to a frame 50 provided in the deposition apparatus for supporting the deposition mask (see Figs. 10 and 11). The frame 50 is a frame-shaped member made of a material with a low thermal expansion coefficient such as Invar, and is formed to have a thickness of 10 to 25 mm.
This fixing is achieved by integrating the holding frame portion 4 of the frame body 3 of the deposition mask 1 to the frame 50 by welding such as spot welding in a strong manner and in a state capable of withstanding heat during deposition.

In addition, the fixing of the holding frame portion 4 to the frame 50 by welding can be performed not only to the frame 50 installed in the deposition apparatus, but also to the frame 50 that has been removed from the deposition apparatus for easier handling if the frame 50 is removable from the deposition apparatus.

The frame 50 has a significantly higher rigidity than the frame 3 of the deposition mask 1, and when the holding frame 4 is fixed to the frame 50, the holding frame 4 is completely integrated with the frame 50 without shifting or deforming, and the mask body 2 connected to and held on the inside of the holding frame 4 is also not deformed by stress and can maintain its positional relationship with the frame 50.
A bar 51 may be provided across the middle of the frame (see Figs. 13 and 14).
In this case, it is possible to suppress bending of the central portion of the deposition mask 1 due to its own weight while the deposition mask 1 is fixed to the frame 50. The bars 51 may be oriented vertically, horizontally, or diagonally with respect to the frame 50, and may be arranged in any manner, such as by combining them in a lattice pattern. However, since overlapping with the mask body 2 would be an obstacle to deposition, the bars 51 are arranged so as to overlap with the frame 3.
Bar 51 may be formed at the same time as frame 50 so as to be integrated with frame 50 from the beginning, but it may also be formed independently of frame 50 and attached to frame 50 later to be combined as an integral unit. Bar 51 is made of a material with a low thermal expansion coefficient, such as Invar or ceramic, and has a thickness of 5 to 8 mm, but the material of bar 51 may be the same as that of frame 50 or a different material from that of frame 50.

After the holding frame is fixed to the frame 50, the rigidity of the holding frame 4 of the frame 3 is ensured by the structure of the frame 3 itself, that is, it is no longer necessary to maintain the configuration in which the holding frame 4 is reinforced by the reinforcing frame 5 on the outside. In the deposition process, since it is convenient for the deposition mask 1 to be small, there is no need to leave it for reinforcement purposes, and the reinforcing frame 5 that has become an unnecessary part is cut at the separation processing portion 3b provided at the boundary with the holding frame 4, and separated and removed from the holding frame 4 (FIG. 12
reference).

In removing this retaining frame portion 4, a cutting processing portion 3b is provided in advance on the frame body 3, and this is the processing position to be processed when separating the reinforcing frame portion 5 from the retaining frame portion 4. This makes it possible to easily perform the separation process without any difficulty, and to separate the reinforcing frame portion 5 without affecting the shape of the retaining frame portion 4 that remains as the frame body or the state in which the mask body 2 is held by the retaining frame portion 4, allowing for a smooth transition to the deposition process using a deposition apparatus.

In addition, the cutting processing portion 3b to be processed is a groove 3c arranged continuously in a line and a groove 3
The shape of the cutout portion 3b is combined with a plurality of through holes 3d bored at predetermined intervals in the continuous direction of the cutout portion 3c, and the through holes 3d are structured to have an acute-angled notch 3e. Therefore, when the cutout portion 3b is cut to separate the reinforcing frame 5, a cut surface is smoothly generated along the cutout portion 3b starting from the notch 3e, and burrs are unlikely to remain on the holding frame 4 side, and various operations associated with the deposition process are not adversely affected.

In this way, the deposition mask of this embodiment is provided with a reinforcing frame portion 5 that reinforces the holding frame portion 4 that holds the mask body 2 inside the frame body 3 from the outside, thereby increasing the rigidity of the frame body 3 against the force applied to the frame body 3 from the mask body 2 based on the stress of the mask body 2. Therefore, the mask body 2 can be fixedly installed in the deposition apparatus while preventing each part of the mask body 2 from shifting from its original position, ensuring an alignment between the mask and the substrate to be deposited, and deposition can be performed with high precision in the appropriate position on the substrate to be deposited.

In addition, when the deposition mask 1 is installed, the holding frame portion 4 of the frame body 3 of the deposition mask 1 is
Since the deposition mask 1 can be installed in the deposition apparatus by fixing the mask 1 to the frame 50 of the deposition apparatus by welding or the like, the frame 3 can keep the mask body 2 from deforming, and the mask body 2 is prevented from being displaced, ensuring a good alignment between the mask and the deposition substrate, improving the deposition accuracy and the yield of the deposition product.
This does not impede the processes subsequent to the fixation, and deposition can be carried out without any problems using a deposition device.

In the deposition mask according to the embodiment, the cut-off processed portion 3b of the frame body 3 is a combination of a linearly continuous groove 3c and a plurality of through holes 3d drilled at a predetermined interval in the groove continuous direction, and is configured to have a uniform shape at any location of the boundary between the holding frame part 4 and the reinforcing frame part 5. However, the shape of the cut-off processed portion 3b can be changed for each position on the frame body 3. For example, the frame body 3 can be configured to have a shape corresponding to the mask body 2 that is integrated with the frame body 3 while leaving a stress that tends to shrink inwardly, in which the predicted deformation amount of each part of the frame body is calculated in advance assuming a state in which a force based on the stress is applied to the frame body, and the cut-off processed portion 3b can be configured to have a shape in which the larger the predicted deformation amount at a predetermined location of the frame body 3 where the cut-off processed portion 3b is provided, the smaller the ratio of the size of the part to be removed as the through hole, recess, or groove that constitutes the cut-off processed portion 3b at this location to the remaining part that is not removed.

In this case, the cut-off processed portion 3b of the frame body 3 is shaped so that the removed portion is increased or decreased depending on the deformation possibility of each part of the frame body. In other words, the removed portion of the cut-off processed portion 3b is set so that the ratio of the removed portion to the unremoved remainder is small in the area where the deformation amount of the frame body 3 due to the force applied to the frame body 3 based on the stress of the mask body 2 is large, while the ratio of the removed portion to the unremoved remainder is large in the area where the deformation amount of the frame body is small.
In locations where large deformation of the frame body 3 is expected, the proportion of the removed portion such as recesses in the cutting-off processed portion 3b is reduced to ensure sufficient strength of the frame body 3, while in locations where deformation of the frame body 3 is difficult to predict, the proportion of the removed portion of the cutting-off processed portion 3b is increased, thereby improving the processing efficiency during the cutting-off process while ensuring appropriate strength, and enabling the reinforcing frame portion 5 to be quickly separated, allowing a smooth transition to the vapor deposition process.

15, in the frame 3, in the cut-off processed portions 3b near the middle positions of the edges along each side of the rectangular mask body 2, which have a relatively low rigidity and are easily affected by the force due to the stress of the mask body 2, the portions removed as through holes, recesses, or grooves are reduced as much as possible, the proportion of the portions not removed is increased, and the reduction in rigidity due to the removed portions is minimized, making it difficult for actual deformation to occur. On the other hand, in the cut-off processed portions 3b near the corners where the frame sides of the frame 3 intersect, which have a high rigidity and are not easily affected by the force due to the stress of the mask body 2, the proportion of the size of the portions removed as through holes, recesses, or grooves to the remaining portions not removed is increased, making it possible to reduce the effort required for the cut-off processing.

In addition, in the manufacturing of the deposition mask according to the embodiment, the metal layer 7 is formed so as to contact the primary electrodeposition layer 15 and the frame body 3, and the primary electrodeposition layer 15 and the frame body 3 are integrated by the metal layer 7. However, the present invention is not limited to this. Before arranging the frame body, the primary electrodeposition layer 15 may be formed so as to reach the frame body arrangement position, and the frame body 3 may be placed on the lower primary electrodeposition layer 15 with an adhesive interposed therebetween, and the primary electrodeposition layer 15 and the frame body 3 may be integrated by adhesion. In this way, the integration of the primary electrodeposition layer, i.e., the mask body 2 and the frame body 3 can be easily performed, and the manufacturing efficiency of the mask can be improved. In addition, by forming the metal layer 7 so as to cover the surface of the mask body 2 and the surface of the frame body 3, the bonding state of the mask body 2 and the frame body 3 can be made more preferable. In particular, by covering the surface (side portion) of the adhesive with the metal layer 7, it is possible to effectively prevent the adhesive from deteriorating due to cleaning treatment or temperature rise, and the bonding state of the mask body 2 and the frame body 3 can be maintained for a long period of time.

In addition, in the manufacture of the deposition mask according to the above embodiment, after the frame body 3 is placed on the matrix 10, the metal layer 7 is formed on the surface of the frame body 3. However, this is not limited to the above. Before forming the metal layer 7 by electroforming, a resist may be disposed on a part or all of the upper surface of the frame body, so that the metal layer 7 is not formed on the entire upper surface of the frame body, and the metal layer 7 may be provided only on a part of the upper surface of the frame body or omitted except in necessary areas, thereby providing a stress relaxation portion on the surface of the frame body 3.

In this case, the metal layer 7 on the upper surface of the frame body 3 is not uniformly continuous but is partial and fragmentary, so that even if internal stress is generated in the metal layer, it will act partially and fragmentarily rather than on the entire frame body 3, making the frame body 3 less susceptible to adverse effects such as deformation, and ensuring a flat shape.

In addition, in the manufacturing of the deposition mask according to the above embodiment, after the primary electrodeposition layer 15 is formed, the metal layer 7 is formed without performing any particular surface treatment on the primary electrodeposition layer. However, the present invention is not limited to this. After the primary electrodeposition layer 15 is formed, and before the resist layer 16 is formed, an activation treatment such as acid immersion or electrolysis may be performed on a predetermined area of the primary electrodeposition layer 15 where the metal layer 7 is to be disposed.

In this case, compared to the case where no treatment is performed, it is possible to significantly improve the bonding strength between the activation treated portion of the primary electrodeposition layer 15 and the metal layer 7 thereon. Also, instead of the activation treatment, a thin layer of strike nickel, matte nickel, or the like may be formed on a predetermined area of the primary electrodeposition layer 15. This also improves the bonding strength between the thin layer formed portion of the primary electrodeposition layer 15 and the metal layer 7 thereon.

In addition, in the manufacture of the deposition mask according to the above embodiment, the areas where the primary electrodeposition layer 15 or the frame body 3 and the metal layer 7 overlap are configured to simply be in contact with each other through flat surfaces. Alternatively, a configuration can be used in which a large number of through holes or recesses are provided around the entire outer periphery 2b of the pattern formation region 2a in the primary electrodeposition layer 15 (mask body 2), and the metal layer 7 formed on the outer periphery 2b of the primary electrodeposition layer 15 is formed so that the through holes or recesses are filled and the metal layer 7 partially embeds into the outer periphery 2b.

In this case, the metal layer 7 is present not only on the upper surface of the outer periphery 2b of the pattern forming region 2a but also in each through hole or recess of the outer periphery 2b, so that the metal layer 7 is formed on the outer periphery 2b of the primary electrodeposition layer 15.
b. This increases the bonding strength between the mask body 2 and the metal layer 7.
This makes it possible to more firmly connect and integrate the mask body 2 with the frame body 3, thereby reliably preventing the mask body 2 from accidentally falling off or shifting out of position relative to the frame body 3, thereby improving the deposition accuracy and the reproducibility of the deposited product.

Second Embodiment of the Invention
In the manufacturing of the deposition mask in the first embodiment, in the step of placing the frame body 3 on the matrix 10, a frame body 3 having a cut-off processed portion 3b provided thereon in advance is used. Alternatively, in a second embodiment, as shown in FIG. 16, after the frame body 3 is placed on the matrix 10, the frame body 3 can be provided with a cut-off processed portion 3b as one step in the manufacturing of the mask.

In this case, a method of dissolving the frame 3 placed on the matrix 10 by immersing it in an etching solution can be used as a method of providing the cut-off processed portion 3b by removal processing. In this etching, an etching solution having selective etching properties is used that dissolves the frame 3 but does not damage the material of the matrix 10 and other portions other than the frame, or a masking material 19 is provided on the portions of the frame 3 other than a predetermined range that is to be removed (see FIG. 16(B)).

Specifically, for example, a photosensitive film resist is disposed by thermocompression bonding or the like so as to cover the areas not to be etched, and this resist is subjected to processes such as disposing a mask on the areas to be removed, curing by exposure to ultraviolet light, and development, thereby hardening and forming the masking material 19. Alternatively, as the masking material, a protective film having resistance to the etching solution may be disposed so as to cover the areas not to be etched.

After the masking material 19 is formed, the frame body 3 together with the matrix 10 is immersed in an etching solution, and the part of the exposed surface side of the frame body 3 that is not covered with the masking material 19 is dissolved and removed to a predetermined depth by etching (see FIG. 16(C)). The part of the frame body 3 that has been removed by this etching becomes the cut-off processing part 3b that is thinner than the other parts of the frame body 3 and easier to cut.

After etching to obtain the cutting-off processing portion 3b of the desired depth and shape, the masking material 19 is dissolved and removed with a specified remover, exposing the frame body 3 and the primary electrodeposition layer 15, making it possible to form a metal layer by electroforming. After this, the process of forming a metal layer by electroforming and subsequent steps will proceed as in the first embodiment.

In addition to providing the cut-off processed portion 3b on the frame body 3 by etching, it is also possible to provide the cut-off processed portion 3b by removing unnecessary portions of the frame body 3 placed on the mother mold 10 by mechanical processing or laser processing.

In this manner, in the method for manufacturing a deposition mask according to the present embodiment, the primary electrodeposition layer 15 that becomes the mask body is formed on the matrix 10, the frame 3 is disposed so as to be positioned around the primary electrodeposition layer 15, and the metal layer 7 for connecting the frame 3 and the primary electrodeposition layer 15 is formed in a predetermined range extending from the surface of the frame 3 to the surface of the outer periphery 2b of the primary electrodeposition layer 15. In this process, the frame 3 is provided with a cut-off processed portion 3b by a predetermined removal process. Therefore, in a state in which the primary electrodeposition layer 15, the frame 3, and the metal layer 7 that are peeled off together from the matrix 10 form the deposition mask 1, the frame 3 has an inner region (holding frame portion 4) that holds the mask body 2 together, with the cut-off processed portion 3b as a boundary.
) and an outer region (reinforcing frame portion 5) that reinforces the entire frame body while being detachable when not needed; by making the reinforcing frame portion 5 outer than the detachment processing portion 3b of the frame body 3 sufficiently large, the rigidity of the frame body 3 against the stress of the mask body 2 can be increased; and by fixing the deposition mask 1 to the deposition apparatus while suppressing deviation of each part of the mask body from its original position, a state of alignment between the mask and the substrate to be deposited can be ensured, and deposition can be performed with high precision at the appropriate position on the substrate to be deposited.

Furthermore, after the deposition mask 1 is fixed to the deposition apparatus, when it becomes unnecessary to ensure the rigidity of the frame body 3 by the reinforcing frame portion 5 outside the cutting processing portion 3b of the frame body 3, the reinforcing frame portion 5 can be easily and naturally detached by performing a cutting processing at the cutting processing portion 3b, allowing for a smooth transition to the deposition process using the deposition apparatus. In addition, the reinforcing frame portion 5 can be detached without affecting the shape of the holding frame portion 5 that remains as the frame body 3 or the resulting holding state of the mask main body 2, allowing the subsequent deposition process to be carried out without any problems.

Third embodiment of the present invention
In the first embodiment, when the deposition mask 1 is installed in the deposition apparatus, after the manufacturing of the deposition mask is completed, the deposition mask 1 is fixed to the frame 50 of the deposition apparatus as it is.
In the deposition mask, a tensile force is applied to each portion of the outer periphery of the frame 3 of the deposition mask 1, and the deposition mask can be placed in the deposition apparatus after the displacement of the frame 3 and the mask body 2 is kept within an allowable range, as shown in FIGS. 17 to 24 as a third embodiment.

In the deposition mask 1 in a completed manufacturing state before being installed in a deposition apparatus, as in the first embodiment, the mask body 2 is formed in a state in which a stress is generated in a direction in which the mask body 2 contracts inward relative to the frame body 3, and a force that tries to deform the frame body 3 is applied from the mask body 2. Here, the frame body 3 has a configuration in which the reinforcing frame part 5 is integrally arranged on the outside of the holding frame part 4, and the reinforcing frame part 5 is structured to reinforce from the outside the holding frame part 4 that holds the mask body 2 on the inside of the frame body 3. As a result, the rigidity of the frame body 3 against the force that tries to deform the frame body 3 due to the stress of the mask body 2 is increased, and the frame body 3 that receives the force does not deform significantly. And, since the frame body 3 is less likely to deform, the mask body 2 is also less likely to deform.

However, since the frame body 3 needs to be formed thin as part of the deposition mask 1, it cannot be made too thick, and there is also a certain restriction on the size of the reinforcing frame portion 5 due to the handling considerations when fixing it to the frame 50. Therefore, there is a limit to how much the rigidity of the frame body 3 can be strengthened, and deformation of the frame body 3 cannot be completely suppressed.

For this reason, if the force applied from the mask body 2 is large, a part of the frame 3 may deform slightly inward, allowing the mask body 2 integrated with the frame 3 to deform and shrink, resulting in the slight deformation of the mask body 2 being unable to be suppressed. In this case, if the dimensional accuracy conditions of the deposition product are strict and the tolerance range for the positional deviation of the mask body 2 is small, a displacement exceeding the tolerance range may occur at a predetermined location of the mask body 2, which may lead to a decrease in the yield of the deposition product.

In response to this, in installing the deposition mask 1 in the deposition apparatus, a process is adopted in which a force opposing the force that tries to deform the frame body 3 based on the stress of the mask body 2 is applied to the frame body 3 to keep the displacement of the frame body 3 within an allowable range, and while maintaining the state in which the displacement of the frame body 3 is kept within the allowable range, the holding frame part 4 of the frame body 3 is fixed to the frame 50. This suppresses deformation of the frame body 3, and at the same time, suppresses deviation of the mask body 2 from the correct position that would accompany deformation of the frame body 3.

The specific installation process is as follows: first, the displacement of the frame 3 and the mask body 2 constituting the deposition mask 1 from their original states is measured; a tensile force is applied from the outside to a predetermined portion of the outer periphery of the frame 3 that is outside the position where the large displacement has occurred, and a series of processes to bring the displacement within an allowable range are repeated until the displacement is within the allowable range at both positions of the frame 3 and the mask body 2. Then, while maintaining the state of the frame 3 and the mask body 2 in which the displacement is within the allowable range due to the application of the tensile force, the holding frame portion 4 of the frame 3 is fixed to the frame 50. After that, the tensile force applied to the frame 3 is released. Note that the position at which the tensile force is applied on the outer periphery of the frame is a position excluding the outer periphery of the frame that is outside (on the extension line) of the lattice-shaped portion inside the frame. This is because the portion of the outer periphery of the frame that is outside the lattice-shaped portion inside the frame has high rigidity due to the connection with the lattice-shaped portion, and deformation due to the stress of the mask body is unlikely to occur in the first place;
This is because if deformation does occur, even if a tensile force is applied from the outside, it is difficult to impart an opposite deformation that will offset the deformation.

In detail, in a first step, displacements in two directions parallel to each side of the rectangular frame are measured at each position of the frame 3 and the mask body 2 of the deposition mask 1. Then, in a second step, when the inward displacement at a predetermined location does not fall within a preset allowable range, a predetermined outward tensile force parallel to the direction of the maximum displacement is applied to the outer periphery of the frame 3 that is outside the location where the maximum displacement occurs, as a force of such magnitude that the displacement at the location falls within the allowable range.

Next, in the third step, the displacements in the two directions at each position of the frame and the mask body are measured again while the tensile force is being applied. After this measurement, in the fourth step, if a new location is generated where the inward displacement is not within the allowable range, a predetermined outward tensile force parallel to the direction of the new maximum displacement is further applied to the outer periphery of the frame that is outside the new maximum displacement location while maintaining the state where the tensile force is being applied, with a magnitude such that the displacement of the new location falls within the allowable range.

In addition, as a fifth step, if it is measured that the outward displacement at any point inside the outer periphery of the frame body to which a tensile force has already been applied does not fall within a preset tolerance range due to the subsequent application of another tensile force, an adjustment is made to reduce the tensile force applied to the outer periphery of the frame body outside of that point so that the displacement at that point falls within the tolerance range.

The third to fifth steps are then repeated until the measured displacements at each position of the frame 3 and the mask body 2 fall within the allowable range.

To explain this using a specific example, in the deposition mask after the manufacturing process, the position A of the mask body 2
The maximum displacement is −6.1 μm in the vertical direction (y-axis direction) of the frame 3, that is, 6.
A displacement of 1 μm has been confirmed by measurement (see FIG. 17). This displacement is within the allowable range (±1 μm).
Since the maximum displacement does not fall within the range of 100 mm, a tensile force of 40 N is applied to the outer periphery of frame 3 (the center of the upper side and the center of the lower side) which is outside the y-axis direction of position A where the maximum displacement occurred, in each direction toward the outside of the frame in the y-axis direction which is parallel to the direction of the maximum displacement (see Figure 18).

However, when the displacement of each position of the frame and the mask body was measured after applying this tensile force of 40 N, the maximum displacement was still −1 at position A of the mask body 2 in the y-axis direction of the frame 3.
A displacement of 3.0 μm was confirmed (see FIG. 18 ). Since this displacement does not fall within the allowable range, a tensile force of 80 N is applied to two locations on the outer periphery of frame 3 (the center of the upper side and the center of the lower side) that are on the outside of position A in the y-axis direction in the same manner as above, in each direction toward the outside of the frame in the y-axis direction, as a force of a magnitude that will bring the displacement of position A within the allowable range (see FIG. 19 ).

After applying a tensile force of 80 N in the y-axis direction, the displacement of each position on the frame was measured. The maximum displacement at position B on the mask body 2 was −2.4 μm in the lateral direction (x-axis direction) of the frame 3.
m, that is, a displacement of 2.4 μm inside the frame was confirmed (see FIG. 19). Since this displacement was not within the allowable range, the tensile force (80 N) in the y-axis direction was maintained as it was, and the outer periphery (
A tensile force of 40 N is applied to a total of four locations (two locations near the center of the left side and two locations near the center of the right side) in each direction toward the outside of the frame in the x-axis direction parallel to the direction of maximum displacement, so that the displacement of position B falls within the allowable range (see Figure 20).

After applying a tensile force of 40N in the x-axis direction, the displacement of each position on the frame and mask body was measured, and a new maximum displacement was found at position C on the mask body 2, a displacement of -1.
A displacement of 1.5 μm into the frame was confirmed (see FIG. 20). Since this displacement was not within the allowable range, while maintaining the above-mentioned tensile force (80 N) in the y-axis direction and tensile force (40 N) in the x-axis direction, a tensile force of 20 N was applied to four locations on the outer periphery of frame 3 (two locations slightly away from the center of the upper side and two locations slightly away from the center of the lower side) that are outside the y-axis direction of position C where the maximum displacement occurred, in each direction toward the outside of the frame in the y-axis direction parallel to the direction of the maximum displacement, as a force of a magnitude such that the displacement of position C falls within the allowable range (see FIG. 21).

After applying a tensile force of 20N in the y-axis direction, the displacement of each position on the frame and mask body was measured, and a new maximum displacement of +1.
A displacement of 1 μm, i.e., 1.1 μm outward from the frame was confirmed (see FIG. 21). Since this displacement does not fall within the allowable range, while maintaining the previous tensile force (40 N) in the x-axis direction, the tensile force (80 N) previously applied in each direction outward from the frame in the y-axis direction at two locations on the outer periphery of the frame 3 (the center of the upper side and the center of the lower side) that are outside the y-axis direction of the position D where the maximum displacement occurred is reduced to 60 N, and the tensile force (20 N) previously applied in each direction outward from the frame in the y-axis direction at a total of four locations on the outer periphery of the frame 3 (two locations slightly away from the center of the upper side and two locations slightly away from the center of the lower side) is increased to 30 N (see FIG. 22), so that the displacement at position D falls within the allowable range.

After increasing or decreasing the tensile force applied in the y-axis direction in this way, the displacements at each position on the frame and mask body were measured. A new maximum displacement of -1.1 μm in the x-axis direction of the frame 3, i.e., a displacement of 1.1 μm inwardly of the frame, was confirmed at position E on the mask body 2 (see FIG. 22).
Since this displacement is not within the allowable range, the tensile force in the y-axis direction (60N, 30N
While maintaining the applied tensile force (40 N) in the x-axis direction and the x-axis direction, a tensile force of 20 N is applied to four locations on the outer periphery of frame 3 (two locations slightly away from the center of the left side and two locations slightly away from the center of the right side) that are outside the x-axis direction of position E where the maximum displacement occurred, in each direction toward the outside of the frame in the x-axis direction that is parallel to the direction of the maximum displacement (see Figure 23).

After applying a tensile force of 20N in the x-axis direction, the displacement of each position on the frame and mask body was measured, and a new maximum displacement was found at position F on the mask body 2, a displacement of -1.
A displacement of 2 μm, i.e., 1.2 μm inwardly into the frame was confirmed (see FIG. 23). Since this displacement does not fall within the allowable range, while maintaining the previous tensile force (80 N) in the y-axis direction and the tensile force (40 N, 20 N) in the x-axis direction, the tensile force (30 N) previously applied in each direction outwardly of the frame in the y-axis direction at four locations (two locations slightly away from the center of the upper side and two locations slightly away from the center of the lower side) of the outer periphery of the frame 3 that are outside the y-axis direction of the position F where the maximum displacement occurred is reduced to 20 N (see FIG. 24), so that the displacement at position F falls within the allowable range.

After adjusting the tensile force applied in the y-axis direction in this way, the displacement of each position of the frame body and the mask body was measured. The maximum displacement of the frame body 3 and the mask body 2 was −0.8 μm in the x-axis direction at position G, that is, a displacement of 0.8 μm inwardly of the frame body (see FIG. 24).
Since this displacement falls within the allowable range, the repeated process of measuring, applying tension, and adjusting is completed.

When the displacement falls within the allowable range by repeating the above steps, the holding frame 4 of the frame 3 of the deposition mask 1 is fixed to a frame 50 located inside or outside the deposition apparatus while applying a tensile force to the frame 3. The holding frame 4 is fixed to the frame 50, and the frame 3 is
After the mask body 2 is held in the correct position without shifting, the tension applied to the frame 3 is released, and the reinforcing frame portion 5 of the frame 3 is pulled in the same manner as in the first embodiment.
The frame 50 is cut at a separation processing portion 3b provided at the boundary with the holding frame 4, and separated and removed from the holding frame 4. When the frame 50 is inside the deposition apparatus, the deposition mask 1 is installed in this state, and when the frame 50 is outside the deposition apparatus, the installation process of the deposition mask 1 is completed by installing the frame 50 and the deposition mask 1 in the deposition apparatus.

In this manner, in the deposition mask installation method according to the present embodiment, a process of applying an external tensile force to a predetermined portion of the frame body 3 where significant deformation may occur due to the stress of the mask body 2 in the deposition mask 1, to bring the displacement within an allowable range is repeated until the displacement falls within the allowable range at all positions of the frame body 3, and then fixing the holding frame portion 4 of the frame body 3 to the frame 50 while leaving the state of the frame body 3 where the displacement falls within the allowable range, and installing the evaporation mask 1 in the evaporation apparatus, and then releasing the tensile force applied to the frame body 3. This fixes the frame body 3 to the frame 50 while reliably preventing the displacement of the mask body 2 from the correct position, which is accompanied by deformation of the frame body 3, in the evaporation mask 1, by a method of suppressing deformation of the frame body 3 together with the application of an external force, thereby making it possible to ensure an appropriate installation state of the deposition mask 1 in the deposition apparatus, and further improve the accuracy of deposition.

REFERENCE SIGNS LIST 1 deposition mask 2 mask body 2a pattern forming region 2b outer periphery 3 frame 3a opening 3b separation processing portion 3c groove 3d through hole 3e notch portion 4 holding frame portion 5 reinforcing frame portion 7 metal layer 8 deposition through hole 9 deposition pattern 10 matrix 11 resist layer 12 mask film 13 thin portion 14 primary pattern resist 15 primary electrodeposition layer 16 resist layer 17 mask film 18 secondary pattern resist 19 masking material 50 frame 51 bar

Claims (4)

A deposition mask including a mask body having a large number of independent deposition through-holes formed in a predetermined pattern, and a frame body integrally disposed with the mask body,
The frame body is provided with a separation processing portion,
The separation processing portion has a plurality of through holes arranged in a line,
The through holes have notches at ends in a direction in which the through holes are arranged in a line,
The mask body is integrated with the frame body in a state in which a stress that tends to shrink inwardly with respect to the frame body remains,
The frame has an expected deformation amount of each portion of the frame calculated in advance on the assumption that a force based on the stress is applied to the frame,
The cutting processing portion has a shape in which the removal portion is increased or decreased according to the deformability of each portion of the frame body,
a deposition mask, characterized in that the removed portion in the separation processing portion is set so that a ratio of the removed portion to a remainder that is not removed is small in a location where the deformation amount of the frame body due to a force applied to the frame body based on a stress of the mask body is large, and a ratio of the removed portion to a remainder that is not removed is large in a location where the deformation amount of the frame body is small . 2. The deposition mask according to claim 1, wherein the frame body has a holding frame portion that is integrally connected with the mask body, and a reinforcing frame portion that is integrally disposed with the holding frame portion, and is formed into a frame shape that is thicker than the mask body. 3. The deposition mask according to claim 2 , wherein a separation processing portion is provided at a boundary portion between the holding frame portion and the reinforcing frame portion. 4. The deposition mask according to claim 2 , wherein the reinforcing frame is removable from the holding frame.