JP7702626B2 - Component mounting system, component mounting device, malfunction detection device, and component mounting method - Google Patents

Description

This disclosure relates to a component mounting system, a component mounting device, a malfunction detection device, and a component mounting method.

Conventionally, in component mounting devices that mount components on a board, efforts have been made to improve the accuracy of the mounting position (attachment position) of components. For example, Patent Document 1 discloses a method of calculating a feedback correction value for each suction holding unit (holding unit) from the amount of positional deviation of a selected component from among the components mounted on a board, and correcting the mounting operation of the component mounting device using the feedback correction value.

JP 2020-113800 A

However, in a component mounting device equipped with a holding unit that adsorbs components, if the holding unit malfunctions, the mounting position of the component will shift, leading to a mounting error. If the state of the holding unit is checked and addressed after a mounting error is detected by an inspection device downstream of the component mounting device, a product with a mounting error will actually be produced, resulting in increased defect costs. For this reason, it is desirable to detect a malfunction of the holding unit early, but Patent Document 1 does not disclose how to detect a malfunction of the holding unit early.

Therefore, the present disclosure provides a component mounting system, a component mounting device, a malfunction detection device, and a component mounting method that can detect malfunctions in the holding part at an early stage.

A component mounting system according to one aspect of the present disclosure includes a component mounting unit that mounts a component on a board, an acquisition unit, and a determination unit. The component mounting unit has a holding unit that holds the component and an imaging unit that images the component. The acquisition unit acquires first positional deviation information of the component relative to the holding unit based on a first image captured by the imaging unit of the component held in the holding unit, and second positional deviation information of the component based on a second image captured by the imaging unit of the component mounted on the board. The determination unit determines a malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information have a predetermined correlation.

A component mounting device according to one aspect of the present disclosure is a component mounting device that mounts a component on a board, and includes a holding unit that holds the component, an imaging unit that images the component, an acquisition unit, and a determination unit. The acquisition unit acquires first positional deviation information of the component relative to the holding unit based on an image captured by the imaging unit of the component held in the holding unit, and second positional deviation information of the component based on an image captured by the imaging unit of the component mounted on the board, and the determination unit determines a malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information have a predetermined correlation.

A malfunction detection device according to one aspect of the present disclosure is a malfunction detection device that detects malfunction of a holding unit in a component mounting device that has a holding unit that holds a component in order to mount the component on a board, and includes an acquisition unit that acquires first positional deviation information of the component with respect to the holding unit based on an image of the component held in the holding unit and second positional deviation information of the component based on an image of the component mounted on the board, and a determination unit that determines the malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information have a predetermined correlation.

A component mounting method according to one aspect of the present disclosure is a component mounting method using a component mounting device having a holding unit that holds a component in order to mount the component on a board, which involves imaging the component held in the holding unit, obtaining first positional deviation information of the component relative to the holding unit based on the captured image, imaging the component mounted on the board, obtaining second positional deviation information of the component mounted on the board based on the captured image, and determining a malfunction of the holding unit based on whether or not there is a predetermined correlation between the first positional deviation information and the second positional deviation information.

According to a component mounting system according to one aspect of the present disclosure, malfunctions in the holding part can be detected early.

FIG. 1 is a diagram showing a schematic configuration of a component mounting system according to an embodiment. FIG. 2 is a block diagram showing a functional configuration of the component mounting system according to the embodiment. FIG. 3 is a plan view showing the component mounting apparatus according to the embodiment. FIG. 4 is a perspective view showing a mounting head unit used in the component mounting apparatus according to the embodiment. FIG. 5 is a diagram for explaining an example of suction variation of the suction nozzle according to the embodiment. FIG. 6 is a diagram for explaining mounting variations of components according to the embodiment. FIG. 7 is a flowchart showing the operation of the component mounting system according to the embodiment. FIG. 8 is a diagram showing an example of the adsorption variation. FIG. 9A is a diagram showing an example of mounting variation when the suction nozzle is normal. FIG. 9B is a diagram showing an example of mounting variation when a suction nozzle is malfunctioning. FIG. 10 is a diagram for explaining another example of the adsorption variation according to the embodiment. FIG. 11A is a diagram showing the correlation between the pickup position deviation and the mounting position deviation when the pickup nozzle is normal. FIG. 11B is a diagram showing the correlation between the pickup position deviation and the mounting position deviation when the pickup nozzle is malfunctioning. FIG. 12 is a diagram showing the relationship between the correlation coefficient and the strength of the correlation.

A component mounting system according to one aspect of the present disclosure includes a component mounting unit that mounts a component on a board, an acquisition unit, and a determination unit. The component mounting unit has a holding unit that holds the component and an imaging unit that images the component. The acquisition unit acquires first positional deviation information of the component relative to the holding unit based on a first image captured by the imaging unit of the component held in the holding unit, and second positional deviation information of the component based on a second image captured by the imaging unit of the component mounted on the board. The determination unit determines a malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information have a predetermined correlation.

As a result, if the first positional deviation information and the second positional deviation information have a predetermined correlation, the determination unit can determine a malfunction of the holding unit even before a defective product is produced. In other words, the determination unit can detect a malfunction of the holding unit before a component mounting error actually occurs. Therefore, the component mounting system can detect a malfunction of the holding unit at an early stage.

Also, for example, the component mounting unit may have a plurality of the holding units, the acquisition unit may acquire the first position deviation information and the second position deviation information corresponding to each of the plurality of holding units, and the determination unit may determine a malfunction of each of the plurality of holding units based on whether the first position deviation information and the second position deviation information corresponding to each of the plurality of holding units have the predetermined correlation.

This makes it possible to identify which of the multiple holding parts is malfunctioning. Therefore, when a malfunctioning holding part occurs, the work required for the worker or manager (hereinafter also referred to as the worker, etc.) to confirm which holding part is malfunctioning can be shortened, making it possible to quickly address the malfunctioning holding part.

In addition, for example, the determination unit may further determine a malfunction of the holding unit and the type of part based on whether or not the first position deviation information and the second position deviation information corresponding to the type of part are in the predetermined correlation for each type of part.

As a result, when the holding unit is determined to be malfunctioning, it can be determined whether the holding unit is actually malfunctioning or whether the holding unit has been determined to be malfunctioning due to the type of part, making it possible to more accurately determine whether the holding unit is malfunctioning. For example, when the holding unit is determined to be malfunctioning when production is performed using a specific part, the determination unit can determine that the holding unit has been determined to be malfunctioning due to the type of part.

Also, for example, the determination unit may determine whether the first positional deviation information and the second positional deviation information are in the predetermined correlation based on an index that indicates the correlation between the first positional deviation information and the second positional deviation information and that is calculated based on the first positional deviation information and the second positional deviation information.

This makes it easy to determine if the holding part is malfunctioning by using an index that shows the correlation.

Also, for example, the index may be a correlation coefficient, and the determination unit may determine that the first position deviation information and the second position deviation information are in the predetermined correlation when the correlation coefficient is equal to or greater than a predetermined value.

As a result, by using a commonly used index such as a correlation coefficient, it is possible to easily determine whether the holding unit is malfunctioning. Therefore, since there is no need to perform special calculations to calculate the index, the amount of processing required to determine whether the component mounting system is malfunctioning can be reduced.

Also, for example, the predetermined value may be a value indicating that there is a weak positive correlation between the first position deviation information and the second position deviation information.

This allows the determination unit to determine if the holding unit is malfunctioning simply by comparing the correlation coefficient with a value indicating a weak positive correlation.

In addition, for example, the device may further include an output unit that outputs a message indicating that the holding unit is malfunctioning when the first position deviation information and the second position deviation information are in the predetermined correlation.

This allows the operator to be notified that the holding unit is malfunctioning.

Also, for example, when the first positional deviation information and the second positional deviation information are in the predetermined correlation, the imaging unit may further image the tip of the holding unit, and the determination unit may further determine whether or not there is an abnormality in the tip based on a third image of the tip captured by the imaging unit, and determine a malfunction of the holding unit based on the determination result.

As a result, if the correlation coefficient is equal to or greater than a predetermined value, it is possible to automatically determine whether or not the holding part is truly malfunctioning based on the image. This makes it possible to more accurately determine whether or not the holding part is malfunctioning. In addition, since there is no need for an operator to determine whether or not the holding part is truly malfunctioning, this contributes to reducing the number of people required on the production line.

Also, for example, the holding unit may be a suction nozzle that suctions and holds the component, and the component mounting unit may further have a measurement unit that measures the vacuum flow rate of air flowing through the suction nozzle, and the measurement unit may further measure the vacuum flow rate when the first positional deviation information and the second positional deviation information are in the predetermined correlation, and the determination unit may further determine whether or not there is an abnormality in the measured vacuum flow rate, and determine whether the holding unit is malfunctioning based on the determination result.

As a result, if the correlation coefficient is equal to or greater than a predetermined value, it is possible to automatically determine whether the suction nozzle is truly malfunctioning based on the flow rate. This makes it possible to more accurately determine whether the holding unit is malfunctioning. In addition, since there is no need for an operator to determine whether the holding unit is truly malfunctioning, this contributes to reducing the number of people required on the production line.

In addition, for example, the device may further include an air supply unit that supplies air to the suction nozzle, and the air supply unit may supply the air to the suction nozzle when the suction nozzle is positioned at a location other than above the substrate if the determination result indicates that there is an abnormality.

As a result, if there is an abnormality in the tip or flow rate, the abnormality can be automatically resolved by supplying air to the holding section. In addition, problems that can be resolved by supplying air can be resolved without manual work, further contributing to reducing the number of people on the production line.

A component mounting device according to one aspect of the present disclosure is a component mounting device that mounts a component on a board, and includes a holding unit that holds the component, an imaging unit that images the component, an acquisition unit, and a determination unit, the acquisition unit acquires first positional deviation information of the component relative to the holding unit based on an image captured by the imaging unit of the component held in the holding unit, and second positional deviation information of the component based on an image captured by the imaging unit of the component mounted on the board, and the determination unit determines a malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information have a predetermined correlation.

This provides the same effect as the component mounting system described above. In addition, since there is no need to communicate with an external device, malfunctions in the holding unit can be detected earlier and more reliably, regardless of the state of the communication network.

A malfunction detection device according to one aspect of the present disclosure is a malfunction detection device that detects malfunction of a holding unit in a component mounting device that has a holding unit that holds a component in order to mount the component on a board, and includes an acquisition unit that acquires first positional deviation information of the component with respect to the holding unit based on an image of the component held in the holding unit and second positional deviation information of the component based on an image of the component mounted on the board, and a determination unit that determines the malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information have a predetermined correlation.

This provides the same effect as the component mounting system described above.

A component mounting method according to one aspect of the present disclosure is a component mounting method using a component mounting device having a holding unit that holds a component in order to mount the component on a board, which involves imaging the component held in the holding unit, obtaining first positional deviation information of the component relative to the holding unit based on the captured image, imaging the component mounted on the board, obtaining second positional deviation information of the component mounted on the board based on the captured image, and determining a malfunction of the holding unit based on whether or not there is a predetermined correlation between the first positional deviation information and the second positional deviation information.

This provides the same effect as the component mounting system described above.

These general or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a non-transitory recording medium such as a computer-readable CD-ROM, or by any combination of the system, method, integrated circuit, computer program, or recording medium. The program may be pre-stored in the recording medium, or may be supplied to the recording medium via a wide area communication network including the Internet.

The following describes the embodiment in detail with reference to the drawings.

The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, components, component placement and connection forms, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not described in an independent claim are described as optional components.

In addition, each figure is a schematic diagram and is not necessarily an exact illustration. Therefore, for example, the scales of each figure do not necessarily match. In addition, in each figure, substantially the same configuration is given the same reference numerals, and duplicate explanations are omitted or simplified.

In addition, in this specification and drawings, the substrate transport direction is defined as the X-axis direction (left-right direction in FIG. 3), the direction perpendicular to the substrate transport direction and parallel to the horizontal plane is defined as the Y-axis direction, and the direction perpendicular to the X-axis direction and Y-axis direction is defined as the Z-axis direction (up-down direction).

In addition, in this specification, terms indicating relationships between elements such as "same" and terms indicating the shape of elements such as "rectangular" or "columnar", as well as numerical values and numerical ranges, are not expressions that only express a strict meaning, but are expressions that include a substantially equivalent range, for example, a difference of about a few percent (e.g., about 10%).

(Embodiment)
Hereinafter, a component mounting system according to the present embodiment will be described with reference to FIGS.

[1. Configuration of component mounting system]
First, the configuration of a component mounting system according to the present embodiment will be described with reference to Figures 1 to 6. Figure 1 is a diagram showing a schematic configuration of a component mounting system 1 according to the present embodiment.

As shown in FIG. 1, the component mounting system 1 is a system for manufacturing a mounted board by mounting a component P (see FIG. 5, FIG. 6) on a board 3 (see FIG. 3, FIG. 6), and includes a solder printing device M1, component mounting devices M2 and M3, an inspection device M4, and a management computer 100. The solder printing device M1, the component mounting devices M2 and M3, the inspection device M4, and the management computer 100 are communicably connected to each other via a communication network 200. Note that the number of the solder printing device M1, the component mounting devices M2 and M3, and the inspection device M4 included in the component mounting system 1 is not limited to the number shown in FIG. 1. For example, the number of the component mounting devices M2 and M3 is not limited to two, and may be one or three or more. The solder printing device M1, the component mounting devices M2 and M3, and the inspection device M4 form a production line (component mounting line).

The solder printing device M1 screen-prints cream solder for joining components onto the substrate 3 to be mounted.

The component mounting devices M2 and M3 are provided downstream of the solder printing device M1, and perform a component mounting operation to transfer and mount the components P taken out from the component supply unit 4 (see Figure 3) onto the board 3 on which cream solder for component joining has been printed by the mounting head unit 8 (see Figures 2 to 4).

The inspection device M4 is provided downstream of the component mounting devices M2 and M3, and inspects the mounting state of the component P on the board 3 on which the component P is mounted (attached) by the component mounting devices M2 and M3, and detects any positional deviation of the component P from the correct position. The component mounting devices M2 and M3 are an example of a component mounting section.

The management computer 100 has a production line management function and a malfunction detection function that detects malfunctions of the suction nozzle 15 (see FIG. 4) of the mounting head unit 8. A malfunction is a state in which the production performance of the suction nozzle 15 is reduced, such as a state in which the original production performance (e.g., the original component holding power) cannot be exhibited, or a state in which the nozzle does not operate (does not function). Malfunctions may also include a state or failure that is within the range of normal production performance but is predicted to be unable to exhibit the original production performance in the future (e.g., within a specified time). Malfunctions may be predicted based on, for example, the gradient of the measurement results of the flow sensor 34 (the degree of change in time-series data).

The solder printing device M1, the component mounting devices M2 and M3, and the inspection device M4 are devices installed, for example, in a factory. The management computer 100 may be installed in the factory, or in a remote location different from the factory.

Next, the functional configuration of the component mounting system 1 will be further described with reference to FIG. 2. FIG. 2 is a block diagram showing the functional configuration of the component mounting system 1 according to the present embodiment. Note that the solder printing device M1 is not shown in FIG. 2.

As shown in FIG. 2, component mounting devices M2 and M3 have, as functional components, a communication unit 20, a mounting control unit 21, a mounting memory unit 22, a recognition processing unit 40, a display unit 50, an input unit 52, and a mounting head unit 8.

The communication unit 20 transmits and receives signals and data between the component mounting devices M2 and M3, the inspection device M4, and the management computer 100 via the communication network 200. The communication unit 20 is a communication circuit (communication module) for communicating via the communication network 200. The communication performed by the communication unit 20 is, for example, wireless communication, but may also be wired communication. There are no particular limitations on the communication standard used for the communication.

The mounting control unit 21 controls each component based on the program, data, etc. stored in the mounting memory unit 22, thereby controlling the mounting operation of the mounting head unit 8 to mount the component P on the board 3. The mounting control unit 21 corrects the mounting operation by the mounting head unit 8 based on the mounting data 23, the position of the board 3, and the position of the component P held by the mounting head unit 8, and mounts the component P on the board 3. The mounting control unit 21 also rotates the component P held by the suction nozzle 15 by a rotation angle specified in the mounting data 23 to mount the component P on the board 3. The mounting control unit 21 is realized by a calculation device such as a CPU (Central Processing Unit).

The mounting memory unit 22 is a storage device that stores mounting data 23, a mounting program (not shown) for executing component mounting work including mounting operations, and the like. The mounting memory unit 22 is realized by, but is not limited to, a semiconductor memory or the like. Note that the component mounting work is the work of mounting components P supplied from the component supply unit 4 onto the board 3, which is performed by component mounting devices M2 and M3.

The mounting data 23 is data that is referenced when mounting the component P on the board 3, and includes information such as the coordinates of the correct position (mounting position) of the component P on the board 3, the rotation angle of the component P when mounting, and the type of the component P to be mounted.

The mounting memory unit 22 further includes suction information related to the suction position of the component P when the mounting head unit 8 has picked up the component P. The suction information includes information related to suction variation (see FIG. 5), including the coordinates of the target normal position (suction position) of the component P, and the position of the component P in the rotational direction when it is picked up. The suction position may be, for example, the target position on the component P when the center position of the suction nozzle 15 picks up the component P. The information related to suction variation is positional deviation amount data including the amount of positional deviation of the component P when it is picked up.

The recognition processing unit 40 detects the position of the board 3 by performing recognition processing on the imaging results (e.g., images) by the board recognition camera 12. The recognition processing unit 40 also detects the position of the component P held by the mounting head unit 8 by performing recognition processing on the imaging results (e.g., images) by the component recognition camera 11. For example, the recognition processing unit 40 detects the positional deviation of the component P held by the mounting head unit 8 by performing recognition processing on the imaging results by the component recognition camera 11. The positional deviation includes, for example, the positional deviation between the center position of the suction nozzle 15 of the mounting head unit 8 and the center position of the component P, the positional deviation in the rotational direction of the component P, etc.

The component recognition camera 11 captures an image of the component P. The component recognition camera 11 is attached, for example, so as to be able to capture an image of the mounting head unit 8 holding the component P from below the component P, but the manner of attachment is not limited to this. The component recognition camera 11 is an example of an imaging unit. In addition, an image captured by the component recognition camera 11 of the component P held by the suction nozzle 15 is an example of a first image.

The board recognition camera 12 captures an image of the board 3 on which the component P is to be mounted.

The display unit 50 displays various information such as an operation screen for operation by the input unit 52. Furthermore, if the suction nozzle 15 is malfunctioning, the display unit 50 displays information indicating that the suction nozzle 15 is malfunctioning. The display unit 50 is realized by a display device such as a liquid crystal panel.

The input unit 52 accepts input of operation commands, data, etc. from a user (e.g., an operator or administrator, hereinafter also referred to as an operator, etc.). The input unit 52 is realized by an input device such as a keyboard, a touch panel, or a mouse, but may also be realized by a device that accepts input by voice (e.g., a microphone).

The mounting head unit 8 performs component mounting work to mount the component P on the board 3.

The mounting head unit 8 will now be described with reference to FIG. 2 as well as FIG. 3 and FIG. 4. FIG. 3 is a plan view showing the component mounting device M2 according to this embodiment. FIG. 4 is a perspective view showing the mounting head unit 8 used in the component mounting device M2 according to this embodiment. Note that the plan view of the component mounting device M3 may be the same as the plan view of the component mounting device M2, and the description thereof will be omitted.

First, the configuration of the component mounting device M2 will be described. The component mounting device M2 includes a base 1a, a board transport unit 2, a component supply unit 4, a Y-axis beam 6, an X-axis beam 7, a mounting head unit 8, a component disposal box 10, a component recognition camera 11, and a board recognition camera 12.

The base 1a is capable of arranging the substrate 3, substrate transport unit 2, etc. The substrate transport unit 2 is disposed on the upper surface of the base 1a and extends along the X-axis direction.

The board transport unit 2 transports the board 3 delivered from an upstream device (e.g., solder printing device M1) and positions and holds the board 3 at the mounting work position. Component supply units 4 are arranged on both sides of the board transport unit 2 in the Y-axis direction.

The component supply unit 4 is a structure for supplying components P to the mounting head unit 8 so that the mounting head unit 8 can pick up the components P. The component supply unit 4 is equipped with multiple tape feeders 5 arranged side by side. The tape feeders 5 feed the carrier tape holding the components P at a pitch, so that the mounting head unit 8, which constitutes the component mounting mechanism, can position the components P at the mounting position. Note that the component supply unit 4 is not limited to being equipped with tape feeders 5, and may be equipped with, for example, a bulk feeder or the like.

A long Y-axis beam 6 is disposed horizontally along the Y-axis direction at one end of the top surface of the base 1a on the positive X-axis side. A pair of long X-axis beams 7 are also attached to the Y-axis beam 6 so as to be able to slide freely along the Y-axis direction.

One of the pair of X-axis beams 7 is disposed on the positive Y-axis side relative to the substrate transport section 2, and the other of the pair of X-axis beams 7 is disposed on the negative Y-axis side relative to the substrate transport section 2. The pair of X-axis beams 7 are also disposed horizontally along the X-axis direction.

The pair of X-axis beams 7 can move in the Y-axis direction by a linear drive mechanism of the Y-axis beam 6. A mounting head unit 8 is slidably attached to each of the pair of X-axis beams 7.

The suction nozzle 15 is a component suction unit that suctions (holds) the component P and rotates the component P at a predetermined angle in a rotational direction (θ direction) parallel to the mounting surface of the board 3 to mount the component P. The mounting head unit 8 also has a component suction unit. Specifically, the mounting head unit 8 has multiple suction nozzles 15, and uses the suction nozzles 15 to rotate the component P in a rotational direction parallel to the mounting surface of the board 3 to mount the component P on the board 3. The suction nozzles 15 are an example of a holding unit.

The mounting head unit 8 has multiple nozzle units 9. The mounting head unit 8 can also move along the X-axis direction by the linear drive mechanism of the X-axis beam 7.

The linear drive mechanism allows the X-axis beam 7 and mounting head unit 8 to move freely in the X-Y plane, and the mounting head unit 8 uses multiple suction nozzles 15 provided in the nozzle unit 9 to vacuum-suction (suction) components P from the tape feeders 5 arranged in each component supply unit 4, removes them, and moves above the board 3 to mount the components P at the mounting position on the board 3.

In addition, a component recognition camera 11 and a component disposal box 10 are disposed on the base 1a between the board transport unit 2 and each component supply unit 4. When the mounting head unit 8 that has taken out a component P from the component supply unit 4 passes above the component recognition camera 11, the component recognition camera 11 captures an image of the component P held by the multiple suction nozzles 15 attached to the mounting head unit 8 at the image capture timing when the mounting head unit 8 passes. This allows the component recognition camera 11 to recognize the component P that has been picked up by the multiple suction nozzles 15. The multiple suction nozzles 15 may be nozzles for picking up the same type of component P, or may be nozzles for picking up different types of components P.

The component disposal box 10 is on the path that the mounting head unit 8 passes above the component recognition camera 11, and is arranged next to the component recognition camera 11 along the X-axis direction. When the mounting head unit 8 picks up the component P and is positioned above the component disposal box 10, it can discard the component P. In this embodiment, air is also blown above the component disposal box 10 to remove any foreign matter adhering to the suction nozzle 15.

The multiple suction nozzles 15 can also pick up (vacuum pick up) the components P and can also separate the picked up components P. The multiple suction nozzles 15 can also blow in addition to vacuum picking.

A board recognition camera 12 is disposed on the coupling plate 8a to which the mounting head unit 8 is attached, the board recognition camera 12 being located on the underside of the X-axis beam 7 and moving integrally with the mounting head unit 8. The board recognition camera 12 is disposed on the coupling plate 8a with the imaging direction facing downward. By moving the mounting head unit 8 above the board 3 held by the board transport unit 2, the board recognition camera 12 images position recognition marks and the like on the board 3, and after component mounting, moves above the board 3 to image the components mounted on the board 3.

By performing image recognition processing on the image data acquired by the component recognition camera 11 and the board recognition camera 12, it is possible to detect the positional misalignment of the component P held by the suction nozzle 15 in the mounting head unit 8, and the positional misalignment of the board 3 held by the board transport unit 2. During the component mounting operation, the mounting head unit 8 takes these positional misalignments into account, corrects the position, and mounts the component P at the mounting position on the board 3.

3 and 4, the mounting head 8 is attached to the X-axis beam 7 via a connecting plate 8a. The mounting head 8 has multiple nozzle units 9 arranged side by side. Each nozzle unit 9 is arranged so that the nozzle shaft 13 extends downward from the nozzle drive unit 9a. Multiple suction nozzles 15 are detachably attached to the nozzle mounting unit 14 connected to the lower end of the nozzle shaft 13. Each nozzle drive unit 9a has a nozzle lifting mechanism that uses a linear motor to lift the lifting shaft connected to the nozzle shaft 13. When the nozzle drive unit 9a is driven, the multiple suction nozzles 15 attached to the nozzle mounting unit 14 are individually lifted and lowered. In addition to the multiple nozzle units 9, the mounting head 8 has a nozzle drive unit 9a, a nozzle shaft 13, a nozzle mounting unit 14, and a suction nozzle 15. The mounting head unit 8 has multiple nozzle units 9, multiple nozzle drive units 9a, multiple nozzle shafts 13, multiple nozzle mounting units 14, and multiple suction nozzles 15, but unless otherwise noted, one nozzle unit 9, one nozzle drive unit 9a, one nozzle shaft 13, one nozzle mounting unit 14, and one suction nozzle 15 will be described.

Several types of suction nozzles 15 are available depending on the size and shape of the part to be vacuum-sucked. For example, for large-sized parts, a suction nozzle 15 with a large suction surface at the bottom end of the suction nozzle 15 is used.

Mounting head units 8 are available in multiple types depending on the type of suction nozzle 15 to be attached. For example, when attaching a large suction nozzle 15 that picks up a large component, a mounting head unit 8 having a large nozzle unit 9 is used.

The nozzle shaft 13 is inserted through the nozzle mounting portion 14 and communicates with the suction nozzle 15. The flow passage hole provided inside the nozzle shaft 13 is connected to an output path that communicates with the suction nozzle 15 via a flow sensor 34. In other words, the suction hole of the nozzle shaft 13 is connected to the output port of the switching valve 36 via the flow sensor 34 and the output path, forming a suction/air blow circuit that connects the switching valve 36 and the suction nozzle 15.

The flow sensor 34 measures the flow rate of air flowing through the suction nozzle 15. For example, the flow sensor 34 measures the flow rate of air flowing inside a specific suction nozzle 15 among the multiple suction nozzles 15. For example, the flow sensor 34 measures the flow rate of air in two directions: the forward direction flowing out from the flow sensor 34 in the direction of the nozzle axis 13, and the negative direction flowing in from the nozzle axis 13 in the direction of the flow sensor 34. In other words, the flow sensor 34 measures the vacuum flow rate (suction flow rate) when the suction nozzle 15 sucks, and the blow flow rate when the suction nozzle 15 blows. The flow sensor 34 outputs the measurement results of the vacuum flow rate and the blow flow rate to at least the management computer 100. The flow sensor 34 is an example of a measurement unit.

The switching valve 36 is composed of an electromagnetic valve or the like having two input ports and one output port. The two input ports include a first input port connected to a vacuum pump (not shown) and a second input port connected to a blow valve 38. The one output port is a first output port connected to an output path leading to the flow sensor 34. In the switching valve 36, a selection signal from the outside switches between a state in which the path from the first input port to the first output port is open and a state in which the path from the second input port to the first output port is open. The vacuum pump can generate negative pressure (vacuum).

The blow valve 38 is composed of an electromagnetic valve or the like having one or more input ports and one output port. The one or more input ports have a third input port connected to the air supply unit 38a. The one output port has a second output port connected to the second input port of the switching valve 36. In the blow valve 38, a state in which the path from the third input port to the second output port is opened and a state in which the path is closed are switched by a selection signal from the outside. The air supply unit 38a is an air supply device that supplies positive pressure air. Note that the one or more input ports may have a fourth input port that is connected to an atmosphere supply unit (not shown) that supplies air at atmospheric pressure. The atmosphere supply unit can also be realized by opening the fourth input port of the blow valve 38.

The switching valve 36 and the blow valve 38 are connected to a valve control unit 31 in the nozzle control unit 30. The measurement results of the flow sensor 34 are input to the nozzle control unit 30. The valve memory unit 32 in the nozzle control unit 30 stores timing information for switching the states of the switching valve 36 and the blow valve 38 by the valve control unit 31, timing information for determining whether the air flow rate measured by the flow sensor 34 is normal, and a predetermined value (e.g., a threshold value used for various determinations). The valve memory unit 32 also stores the flow rate value measured by the flow sensor 34.

The nozzle control unit 30 is disposed in the mounting head unit 8.

When the valve control unit 31 controls the switching valve 36 to open the path from the first input port to the first output port (suction state), the vacuum pump communicates with the suction nozzle 15 via the switching valve 36 and the flow rate sensor 34, and the suction nozzle 15 vacuum-sucks the part P from the suction surface at the lower end.

When the suction nozzle 15 vacuum-sucks the component P while the component P is in contact with the suction surface, the component P is vacuum-sucked by the suction nozzle 15. At this time, the air flow rate (vacuum flow rate) measured by the flow sensor 34 is substantially zero. When the suction nozzle 15 vacuum-sucks the component P while the component P is not in contact with the suction surface, outside air (air) is sucked in by the suction nozzle 15. At this time, the flow sensor 34 measures a negative air flow rate.

When the valve control unit 31 controls the switching valve 36 to open the path from the second input port to the first output port and controls the blow valve 38 to open the path from the third input port to the second output port (blow state), the air supply unit 38a communicates with the suction nozzle 15 via the blow valve 38, the switching valve 36, and the flow sensor 34, and positive pressure air is discharged from the suction nozzle 15. In other words, the air supply unit 38a discharges positive pressure air from the suction nozzle 15. At this time, the flow sensor 34 measures the flow rate of the positive air.

In this way, the switching valve 36 and the blow valve 38 selectively connect the vacuum pump and the air supply unit 38a to the suction nozzle 15. The flow rate sensor 34 is disposed in the suction/air blow circuit that connects the switching valve 36 and the blow valve 38 to the suction nozzle 15, and measures the flow rate of air passing through the suction/air blow circuit in both forward and reverse directions.

Here, the suction variation when the suction nozzle 15 picks up the component P will be further described with reference to FIG. 5. FIG. 5 is a diagram for explaining an example of the suction variation of the suction nozzle 15 according to the present embodiment. Using FIG. 5, the positional deviation amounts ΔX1, ΔY1, and Δθ1 from the normal position of the component P picked up by the suction nozzle 15, which are stored in the mounting memory unit 22, will be described.

Figure 5(a) shows the suction nozzle 15 of the mounting head unit 8 suctioning and lifting up a component P. Figure 5(b) shows an image 11a captured by the component recognition camera 11 of the component P suctioned by the suction nozzle 15. Specifically, Figure 5(b) shows an image 11a captured so that the nozzle center Cn, which is the central position of the suction nozzle 15, coincides with the center 11c of the image 11a. Also, in Figure 5(b), the suction nozzle 15 shown in the image 11a is illustrated as suction nozzle 11b.

As shown in FIG. 5A, the mounting head unit 8, which has the component P sucked and held by the suction nozzle 15, is moved in a predetermined direction above the component recognition camera 11. This allows an image of the component P being sucked and held by the suction nozzle 15 to be acquired. Note that the shape of the component P is not limited to being rectangular, and may be columnar or some other shape.

5B, the image 11a displays, for example, a center line 11x in the X-axis direction and a center line 11y in the Y-axis direction superimposed on each other, and the intersection of the center line 11x in the X-axis direction and the center line 11y in the Y-axis direction is the center 11c of the image 11a. By performing a recognition process on such an image 11a by the recognition processing unit 40, the part center Cp, which is the center position of the part P, is extracted, and further, the positional deviation amounts ΔX1, ΔY1, and Δθ1 at the time of suction, which indicate the positional deviation amounts in the X-axis direction, the Y-axis direction, and the θ direction of the part center Cp from the center 11c of the image 11a, are calculated. The θ direction is the direction of rotation about the axis (Z axis) in the Z-axis direction as the rotation axis. The positional deviation at the time of suction may occur depending on the malfunction of the suction nozzle 15. The suction positional deviation may occur depending on, for example, clogging of the suction nozzle 15, adhesion of foreign matter, etc. In addition, the suction position deviation can also occur due to variations in the stopping position of the carrier tape (target pocket) that is pitch-fed by the tape feeder 5, variations in the position or posture of the component P in the target pocket, variations in the suction position when the suction nozzle 15 picks up the component P, etc.

The positional deviation amounts ΔX1, ΔY1, and Δθ1 may be calculated for each of the multiple suction nozzles 15, for example. The positional deviation amounts ΔX1, ΔY1, and Δθ1 may also be calculated for each type of component P. The positional deviation amounts ΔX1, ΔY1, and Δθ1 are an example of information indicating suction variation (first positional deviation information).

Referring again to FIG. 2, the inspection device M4 includes a communication unit 60, an inspection control unit 61, an inspection camera 63, an inspection memory unit 64, a display unit 67, and an input unit 69.

The communication unit 60 transmits and receives signals and data between the component mounting devices M2 and M3 and the management computer 100 via the communication network 200. The communication unit 60 is a communication circuit (communication module) for communicating via the communication network 200. The communication performed by the communication unit 60 is, for example, wireless communication, but may also be wired communication. There are no particular limitations on the communication standard used for the communication.

The inspection control unit 61 controls each component of the inspection device M4. The inspection control unit 61 also manages the inspections performed by the inspection device M4. The inspection control unit 61 has a position deviation calculation unit 62 as an internal processing function. The inspection control unit 61 is realized by a calculation device such as a CPU.

The misalignment amount calculation unit 62 executes a misalignment amount calculation process to calculate the misalignment amounts ΔX2, ΔY2, and Δθ2 (see FIG. 6) from the correct position of the component P mounted on the board 3 from the image captured by the inspection camera 63. The calculated misalignment amounts ΔX2, ΔY2, and Δθ2 are stored in the inspection memory unit 64 as misalignment amount data 66. The misalignment amounts ΔX2, ΔY2, and Δθ2 are output to the management computer 100 via the communication unit 60. The misalignment amount calculation unit 62 only needs to calculate at least one of the misalignment amounts ΔX2, ΔY2, and Δθ2.

Here, the mounting variation of the component P after the suction nozzle 15 mounts the component P on the board 3 will be further explained with reference to FIG. 6. FIG. 6 is a diagram for explaining the mounting variation of the component P according to this embodiment.

In the mounting operation by the mounting head unit 8, the component P picked up by the suction nozzle 15 of the mounting head unit 8 from the tape feeder 5 of the component supply unit 4 is transferred and mounted with the normal position Cs, which is the mounting position set on the board 3, as the target. At this time, the component center Cp of the component P does not necessarily match the normal position Cs correctly, and the component may be mounted with a positional deviation of △X2 in the X-axis direction, △Y2 in the Y-axis direction, and △θ2 in the θ direction (the rotational direction parallel to the mounting surface).

The misalignment amounts ΔX2, ΔY2, and Δθ2 are obtained by performing misalignment calculation processing on an image of a component P mounted on a board 3 captured by an inspection camera 63 using a misalignment calculation unit 62. The misalignment amounts ΔX2, ΔY2, and Δθ2 are obtained for each of multiple components P mounted on one board 3 and stored as misalignment data 66. The misalignment amounts ΔX2, ΔY2, and Δθ2 are calculated for each of multiple suction nozzles 15, for example. The misalignment amounts ΔX2, ΔY2, and Δθ2 may also be calculated for each type of component P. The misalignment amounts ΔX2, ΔY2, and Δθ2 are an example of information indicating mounting variation (second misalignment information).

The inspection camera 63 captures an image of the component P mounted on the board 3. The inspection camera 63 is attached, for example, so as to be able to capture an image of the board 3 on which the component P is mounted from above the component P, but the manner of attachment is not limited to this. The inspection camera 63 is an example of an imaging unit. Also, the image captured by the inspection camera 63 of the component P mounted on the board 3 is an example of a second image.

The inspection memory unit 64 is a storage device that stores mounting data 65, misalignment data 66, etc. The mounting data 65 is data related to the board 3 on which the component P is mounted, and includes information such as the coordinates of the mounting position (normal position) of the component P on the board 3, the rotation angle of the component P when mounting, and the type of the mounted component P. The inspection memory unit 64 is realized by a semiconductor memory or the like, but is not limited to this.

The display unit 67 displays various information such as an operation screen for operation by the input unit 69. The display unit 67 is configured with a display device such as a liquid crystal panel.

The input unit 69 receives input of operation commands, data, etc. from an operator, etc. The input unit 69 is realized by an input device such as a keyboard, a touch panel, or a mouse, but may also be realized by a device that receives input by voice (e.g., a microphone).

In this way, the inspection device M4 includes an inspection camera 63 that captures an image of the component P, and a positional deviation calculation unit 62 that calculates the positional deviation amounts ΔX2, ΔY2, and Δθ2 of the component P from the normal position Cs from the image captured by the inspection camera 63.

Referring again to FIG. 2, the management computer 100 includes a communication unit 110, a management control unit 120, a management memory unit 130, a determination unit 140, a display unit 150, and an input unit 152. The management computer 100 is an example of a malfunction detection device that detects malfunctions of the suction nozzles 15 in the component mounting devices M2 and M3. The management computer 100 may also be realized by a server device.

The communication unit 110 transmits and receives signals and data between the solder printing device M1, the component mounting devices M2 and M3, and the management computer 100 via the communication network 200. The communication unit 110, for example, acquires mounting data 23 (e.g., suction information) from the component mounting devices M2 and M3, and acquires positional deviation amount data 66 from the inspection device M4. The communication unit 110 is an example of an acquisition unit.

The communication unit 110 is a communication circuit (communication module) for communicating via the communication network 200. The communication performed by the communication unit 110 is, for example, wireless communication, but may also be wired communication. There are no particular limitations on the communication standard used for the communication.

In this embodiment, when the first positional deviation information and the second positional deviation information described below have a predetermined correlation, the communication unit 110 may output information indicating that the suction nozzle 15 is malfunctioning to another device via the communication network 200 or an external communication network (e.g., the Internet). The communication unit 110 may function as an output unit that outputs the information.

The management control unit 120 manages each component of the management computer. The management control unit 120 also manages production on the production line. The management control unit 120 is realized by a calculation device such as a CPU.

The management storage unit 130 is a storage device that stores mounting data 131, component information 132, positional deviation data 133, etc. The management storage unit 130 is realized by a semiconductor memory or the like, but is not limited to this.

The mounting data 131 is data that is referenced when mounting the component P on the board 3, and includes information such as the coordinates of the mounting position (normal position) of the component P on the board 3, the rotation angle of the component P when mounting, and the type of the component P to be mounted.

The component information 132 includes at least one of the shape and size of the component P to be mounted on the board 3, and the gap between the size of the pocket of the component supply unit 4 (e.g., carrier tape) in which the component P is stored and the size of the component P.

The misalignment amount data 133 is data related to the misalignment of the component P. The misalignment amount data 133 includes information related to the pickup variation acquired from the component mounting devices M2 and M3 (first misalignment information), and information related to the mounting variation acquired from the inspection device M4 (second misalignment information). In this embodiment, the misalignment amount data 133 includes the misalignment amounts ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, and Δθ2.

The determination unit 140 determines whether or not a malfunction has occurred in the suction nozzle 15 based on the misalignment amount data 133. Specifically, the determination unit 140 determines whether or not a malfunction has occurred in the suction nozzle 15 based on the suction variation and mounting variation included in the misalignment amount data 133. More specifically, the determination unit 140 determines whether or not a malfunction has occurred in the suction nozzle 15 based on the correlation between the suction variation and the mounting variation. In this embodiment, the correlation between the suction variation and the mounting variation is used to determine the occurrence of a malfunction in the suction nozzle 15.

The determination unit 140 performs this determination during production on the production line. For example, the determination unit 140 may perform this determination each time a component P is mounted on the board 3. The determination method used by the determination unit 140 will be described later.

The display unit 150 displays various information such as an operation screen for operation by the input unit 152. In this embodiment, the display unit 150 may display information indicating that the suction nozzle 15 is malfunctioning when the first positional deviation information and the second positional deviation information described below have a predetermined correlation. The display unit 150 may function as an output unit that outputs the information. The display unit 150 is configured with a display device such as a liquid crystal panel.

The input unit 152 receives input of operation commands, data, etc. from an operator, etc. The input unit 152 is realized by an input device such as a keyboard, a touch panel, or a mouse, but may also be realized by a device that receives input by voice (e.g., a microphone).

2. Operation of component mounting system
Next, the operation of the component mounting system 1 will be described with reference to Fig. 7 to Fig. 12. Fig. 7 is a flowchart showing the operation (component mounting method) of the component mounting system 1 according to the present embodiment. Note that the processes from step S16 to S20 shown in Fig. 7 do not have to be performed.

As shown in FIG. 7, production is first started (S11). For example, the production line operates based on control information from the management computer 100.

Next, the communication unit 110 of the management computer 100 acquires first positional deviation information related to the suction position of the component P from the component mounting devices M2 and M3 (S12). The first positional deviation information is information indicating the deviation of the suction position of the component P relative to the suction nozzle 15 based on the first image. In this embodiment, the communication unit 110 acquires information indicating the suction variation (positional deviation amounts △X1, △Y1, △θ1) as the first positional deviation information.

Figure 8 is a diagram showing an example of suction variation. The horizontal axis of Figure 8 indicates the amount of deviation (ΔX) of the suction position in the X-axis direction, and the vertical axis of Figure 8 indicates the amount of deviation (ΔY) of the suction position in the Y-axis direction. Figure 8 is a diagram in which information indicating suction variation is plotted on a graph. Multiple points are plotted in Figure 8. When there are multiple suction nozzles 15, the position deviation amounts ΔX1, ΔY1, and Δθ1 of each of the multiple suction nozzles 15 may be plotted on the graph. In addition, the position deviation amounts ΔX1, ΔY1, and Δθ1 when one suction nozzle 15 performs multiple suction operations may be plotted on the graph.

The information indicating the suction variation may include identification information of the suction nozzle 15 that measured the suction variation, the time of measurement (e.g., the time when the suction nozzle 15 was imaged), information indicating the type of component P, etc.

The suction variation shown in FIG. 8 is within the range of variation that can occur even when the suction nozzle 15 is normal. In other words, the suction variation shown in FIG. 8 is within the normal range of suction variation. In other words, the positional deviation amounts ΔX1, ΔY1, and Δθ1 are values within the normal range.

The component mounting devices M2 and M3 mount the picked-up components P at predetermined positions on the board 3. The suction nozzle 15 places the picked-up components P on the cream solder of the board 3. The board 3 on which the components P are mounted is transported to the inspection device M4, and the board 3 including the components P is imaged by the inspection camera 63.

Next, the communication unit 110 acquires second positional deviation information related to the mounting position of the component P on the board 3 from the inspection device M4 (S13). The second positional deviation information is information indicating the mounting position deviation (mounting position deviation) of the component P from the correct position Cs on the board 3 based on the second image. In this embodiment, the communication unit 110 acquires information indicating mounting variation (positional deviation amounts △X2, △Y2, △θ2) as the second positional deviation information.

Figure 9A is a diagram showing an example of mounting variation when the suction nozzle 15 is normal. Figure 9B is a diagram showing an example of mounting variation when the suction nozzle 15 is malfunctioning. The horizontal axis of Figures 9A and 9B indicates the amount of deviation of the mounting position in the X-axis direction (ΔX), and the vertical axis of Figures 9A and 9B indicates the amount of deviation of the mounting position in the Y-axis direction (ΔY).

9A and 9B, the degree of mounting variation differs depending on whether or not the suction nozzle 15 is malfunctioning. Specifically, the mounting variation when the suction nozzle 15 is malfunctioning is greater than the mounting variation when the suction nozzle 15 is normal. This is thought to be due to the fact that when the suction nozzle 15 is malfunctioning, the position of the component P shifts due to the movement of the suction nozzle 15 from when the component P is picked up to when the component P is mounted on the board 3. For example, when the suction nozzle 15 is malfunctioning, the suction force of the suction nozzle 15 to pick up the component P (the component holding force to hold the component P) is weak, so the component P shifts from the suction position due to the movement of the suction nozzle 15 in the X-axis direction, Y-axis direction, and Z-axis direction (mainly the X-axis direction and Y-axis direction) and the inertia due to the rotation in the θ direction, air resistance, etc. On the other hand, when the suction nozzle 15 is normal, the suction force of the suction nozzle 15 to pick up the component P is strong, so the component P is unlikely to shift from the suction position due to the movement of the suction nozzle 15 in the X-axis direction, Y-axis direction, and Z-axis direction (mainly the X-axis direction and Y-axis direction), inertia due to rotation in the θ direction, air resistance, etc.

The inventors of the present application have discovered that, as shown in Figures 9A and 9B, the amount of deviation of component P from the suction position associated with the movement of suction nozzle 15 differs depending on whether or not there is a malfunction in suction nozzle 15. Then, component mounting system 1 detects a malfunction of suction nozzle 15 by focusing on the difference in the amount of deviation of component P from the suction position.

The mounting variation shown in FIG. 9B is within the range of variation that can occur even when the suction nozzle 15 is normal. In other words, the mounting variation shown in FIG. 9B is within the normal range of mounting variation. Also, the suction variation shown in FIG. 9B is mounting variation that occurs when the position of the suction nozzle 15 when mounting the component P is normal.

In addition, in steps S12 and S13, the communication unit 110 may acquire first position deviation information and second position deviation information corresponding to each of the multiple suction nozzles 15.

The amount of positional deviation is not limited to the above. Figure 10 is a diagram for explaining another example of the adsorption variation according to the present embodiment.

As shown in FIG. 10, the suction variation may be a positional deviation amount (distance) R calculated based on the positional deviation amounts ΔX1 and ΔY1. The determination unit 140 may calculate the positional deviation amount R at the time of suction (hereinafter also referred to as suction positional deviation Rv) based on the information on the suction variation. The suction positional deviation Rv is an example of first positional deviation information.

Similarly, the suction variation may be a positional deviation amount (distance) R calculated based on the positional deviation amounts ΔX2 and ΔY2. The determination unit 140 may calculate the positional deviation amount R after mounting (hereinafter also referred to as mounting position deviation Rm) based on information related to the mounting variation. The mounting position deviation Rm is an example of second positional deviation information.

The suction position deviation Rv and the mounting position deviation Rm are calculated using, for example, Pythagoras' theorem.

The first positional deviation information and the second positional deviation information may include at least one of the positional deviation amounts in the X-axis direction, the Y-axis direction, the θ direction, and the distance.

Next, the determination unit 140 calculates a correlation coefficient between the first positional deviation information and the second positional deviation information (S14). The determination unit 140 may calculate, for example, a correlation coefficient for each of the positional deviation amounts in the X-axis direction, the Y-axis direction, the θ direction, and the distance. For example, the determination unit 140 may calculate a correlation coefficient between the positional deviation amounts ΔX1 and ΔX2, a correlation coefficient between the positional deviation amounts ΔY1 and ΔY2, a correlation coefficient between the positional deviation amounts Δθ1 and Δθ2, and a correlation coefficient between the pickup positional deviation Rv and the mounting positional deviation Rm.

The determination unit 140 only needs to calculate at least one of the four correlation coefficients. The correlation coefficient is an example of an index showing the correlation between the first position deviation information and the second position deviation information.

The calculation of the correlation coefficient will be explained using the pickup position deviation Rv and the mounting position deviation Rm as an example. If the covariance of the pickup position deviation Rv and the mounting position deviation Rm is SRvRm, the standard deviation of the pickup position deviation Rv is SRv, and the standard deviation of the mounting position deviation Rm is SRm, the correlation coefficient r between the pickup position deviation Rv and the mounting position deviation Rm is calculated by the following formula 1.

r=SRvRm/(SRv×SRm) (Formula 1)

The other three correlation coefficients r are calculated in the same way.

The correlation coefficient r may be calculated for each type of component P. The determination unit 140 may calculate the correlation coefficient r corresponding to the type of component P based on the first positional deviation information and the second positional deviation information corresponding to the type of component P. The determination unit 140 may calculate the correlation coefficient r from the corresponding first positional deviation information and second positional deviation information for each combination of a plurality of suction nozzles 15 and types of component P.

Here, the correlation coefficients when the suction nozzle 15 is normal and when it is malfunctioning will be described with reference to Figs. 11A and 11B. Fig. 11A is a diagram showing the correlation between the suction position deviation Rv and the mounting position deviation Rm when the suction nozzle 15 is normal. Fig. 11B is a diagram showing the relationship between the suction position deviation Rv and the mounting position deviation Rm when the suction nozzle 15 is malfunctioning. The dashed lines shown in Figs. 11A and 11B indicate the regression lines for each point plotted on the diagrams.

As shown in FIG. 11A, when the suction nozzle 15 is normal, no correlation is observed between the suction position deviation Rv (an example of the first position deviation information) and the mounting position deviation Rm (an example of the second position deviation information). This is because, although there is variation in the suction position deviation Rv of the component P during suction, the value of the mounting position deviation Rm becomes small due to correction of the mounting position based on the position (suction position) of the component P held by the mounting head unit 8.

As shown in FIG. 11B, when the suction nozzle 15 is malfunctioning, a certain correlation is observed between the suction position deviation Rv (an example of first position deviation information) and the mounting position deviation Rm (an example of second position deviation information). This is because there is variation in the suction position deviation Rv of the component P during suction, and the suction position of the component P shifts when the component P is transferred to the board 3, resulting in a shift in the mounting position even if the suction nozzle 15 is in the correct position. Therefore, variation occurs in both the suction position deviation Rv and the mounting position deviation Rm, and a certain correlation is observed between the suction position deviation Rv and the mounting position deviation Rm.

Therefore, the determination unit 140 determines whether the suction nozzle 15 is malfunctioning based on whether the first position deviation information and the second position deviation information have a predetermined correlation.

Next, the determination unit 140 determines whether the correlation coefficient is equal to or greater than a predetermined value (S15). The predetermined value is a value indicating that there is a predetermined correlation between the first positional deviation information and the second positional deviation information, and may be, for example, a value indicating that there is a weak positive correlation. The predetermined value is set in advance and stored in the management storage unit 130. The weak positive correlation will be described with reference to FIG. 12. FIG. 12 is a diagram showing the relationship between the correlation coefficient and the strength of the correlation.

As shown in FIG. 12, a weak positive correlation is, for example, any value of the correlation coefficient r between 0.2 and 0.4. The predetermined value may be, for example, the value of the correlation coefficient r of 0.2. The predetermined value is not limited to a value indicating a weak positive correlation, and may be a value other than the value corresponding to the correlation coefficient "almost no relationship" among the values shown in FIG. 12. For example, the predetermined value may be a value other than -0.2 or more and less than 0.2 within the range of the correlation coefficient r between -1 and 1. The predetermined value may be set to a value less than the value of the correlation coefficient r at which defects begin to occur at the mounting position of the component P. The correlation coefficient r at which defects begin to occur is preset, for example, based on past production results. The correlation coefficient r at which defects begin to occur may be set, for example, for each type of component P.

The processing of step S15 is an example of determining whether the first position deviation information and the second position deviation information have a predetermined correlation.

If the correlation coefficient r of any of the multiple positional deviation amounts is equal to or greater than a predetermined value, step S15 is determined to be Yes.

Next, if the determination unit 140 determines that the correlation coefficient r is equal to or greater than a predetermined value (Yes in S15), the imaging unit (e.g., the component recognition camera 11) images the tip 15a of the suction nozzle 15 (S16), and the flow sensor 34 measures the flow rate (e.g., the vacuum flow rate) of the suction nozzle 15 (S17). At least one of steps S16 and S17 may be executed. Note that a Yes determination in step S15 means that the first positional deviation information and the second positional deviation information have a predetermined correlation.

In step S16, the imaging unit images the tip 15a of the suction nozzle 15 having a correlation coefficient r equal to or greater than a predetermined value when the tip 15a is not suctioning a component P. The imaging unit may, for example, image the tip 15a of the suction nozzle 15 from below, that is, from a direction that allows imaging of the inside (flow path) of the suction nozzle 15, or may image the tip 15a from the side of the suction nozzle 15. The captured image (an example of a third image) is output to the management computer 100.

In step S17, the flow rate sensor 34 measures the vacuum flow rate when the suction nozzle 15, whose correlation coefficient r is equal to or greater than a predetermined value, is not suctioning a component P. The measured vacuum flow rate is output to the management computer 100.

Next, the determination unit 140 determines whether or not there is an abnormality in the tip 15a of the suction nozzle 15 or the flow rate (e.g., vacuum flow rate) (S18). The determination unit 140 determines whether or not there is an abnormality in the tip 15a by image analysis of the third image. The determination unit 140 determines that there is an abnormality in the tip 15a if a foreign object is attached to the tip 15a, the tip 15a is clogged, or the tip 15a is deformed (e.g., the tip 15a is chipped, bent, etc.). Furthermore, the determination unit 140 determines that there is an abnormality in the tip 15a if the vacuum flow rate is equal to or greater than a predetermined flow rate (e.g., equal to or greater than a predetermined negative flow rate).

Next, if there is an abnormality in the tip 15a of the suction nozzle 15 or the flow rate (Yes in S18), the determination unit 140 causes the air supply unit 38a to supply air to the suction nozzle 15 (S19). When the suction nozzle 15 (mounting head unit 8) is located in a position other than above the board 3, the determination unit 140 causes the air supply unit 38a to supply air to the suction nozzle 15. For example, the determination unit 140 may cause the air supply unit 38a to supply air to the suction nozzle 15 above the component waste box 10 that the suction nozzle 15 (mounting head unit 8) passes on the movement path from the mounting position back to the suction position. In this case, the processes from steps S14 to S18 may be performed while the suction nozzle 15 (mounting head unit 8) moves from the mounting position to the component waste box 10.

In this way, in step S19, if the determination result in step S18 includes an abnormality, the air supply unit 38a supplies air to the suction nozzle 15 when the suction nozzle 15 is positioned anywhere other than above the substrate 3.

The amount of air supplied from the air supply unit 38a may be, for example, greater than the amount of air supplied from the air supply unit 38a when the suction nozzle 15 places the component P on the board 3 and leaves the board 3. The air supply unit 38a is provided in advance in the component mounting devices M2 and M3 to release air from inside the suction nozzle 15 to the outside when the suction nozzle 15 leaves the board 3. In other words, in step S19, measures are taken to resolve the malfunction of the suction nozzle 15 without adding any additional equipment.

If the tip 15a is deformed and therefore step S18 is determined as Yes, the process of step S19 does not have to be executed. The determination unit 140 may determine whether or not to execute the process of step S19 based on the determination result.

Next, the determination unit 140 determines whether the abnormality in the tip 15a or the flow rate has been resolved according to the determination result in step S18 (S20). For example, if the determination unit 140 determines Yes in step S18 based on the third image, the determination unit 140 may capture an image of the tip 15a of the suction nozzle 15 again in step S20 to determine whether the adhesion of foreign matter, clogging, etc. has been resolved. Also, for example, if the determination unit 140 determines Yes in step S18 based on the vacuum flow rate, the determination unit 140 may measure the vacuum flow rate again in step S20 to determine whether the vacuum flow rate is within the normal range. If the abnormality in the tip 15a or the flow rate has not been resolved, the determination unit 140 determines that the suction nozzle 15 is malfunctioning.

In step S20, a determination may be made as to whether the abnormality has been resolved based on both the image of the tip 15a and the vacuum flow rate.

Next, if the abnormality of the tip 15a or the flow rate is not resolved (No in S20), the determination unit 140 notifies the error (S21). For example, the determination unit 140 may display information indicating that the suction nozzle 15 is malfunctioning on the display unit 150. In addition, when there are multiple suction nozzles 15, the determination unit 140 may further display information specifying the malfunctioning suction nozzle 15 (for example, information indicating the installation position of the malfunctioning suction nozzle 15) on the display unit 150. In addition, the determination unit 140 may display information indicating the cause of the abnormality determined in step S18 (for example, adhesion of foreign matter to the tip 15a, abnormality in the vacuum flow rate, or deformation) on the display unit 150. Note that the notification mode is not limited to display, and may be audio, light emission from a light source such as a lamp, or output of the information to an information terminal (for example, a mobile terminal) of a worker, etc.

If the correlation coefficient r is less than a predetermined value (No in S15), if there is no abnormality in the tip 15a of the suction nozzle 15 or the flow rate (No in S18), and if the abnormality in the tip 15a or the flow rate has been resolved (Yes in S20), the judgment unit 140 judges whether production has ended (S22). If production has ended (Yes in S22), the judgment unit 140 ends the process, and if production has not ended (No in S22), the suction nozzle 15 is normal and the process returns to step S12 to continue production.

The determination unit 140 may determine that the suction nozzle 15 is malfunctioning, for example, if the answer is Yes in step S15. That is, the determination unit 140 may not image the tip 15a and measure the flow rate. In this case, if the answer is Yes in step S15, for example, step S21 is executed. The determination unit 140 may determine that the suction nozzle 15 is malfunctioning, for example, if the answer is Yes in step S18. That is, the determination unit 140 may not cause the air supply unit 38a to supply air. In this case, if the answer is Yes in step S18, for example, step S21 is executed.

As described above, the determination unit 140 determines whether the suction nozzle 15 is malfunctioning based on whether the first position deviation information and the second position deviation information have a predetermined correlation.

The determination unit 140 determines whether the suction nozzle 15 is malfunctioning based on whether there is a predetermined correlation between the first positional deviation information and the second positional deviation information, and therefore, for example, it is possible to determine the malfunction of the suction nozzle 15 more accurately than when the malfunction of the suction nozzle 15 is determined based only on the second positional deviation information (for example, the standard deviation of the mounting position deviation Rm). For example, when detecting a malfunction of the suction nozzle 15 based only on the second positional deviation information, the suction nozzle 15 is determined to be normal if the mounting variation is small. On the other hand, in this embodiment, since the determination is made based on the correlation between the suction variation and the mounting variation, even if the mounting variation is small, it is possible to detect the malfunction of the suction nozzle 15 if there is a predetermined correlation between the suction variation and the mounting variation.

Also, for example, the determination unit 140 may determine whether or not each of the plurality of suction nozzles 15 is malfunctioning based on whether or not the first positional deviation information and the second positional deviation information corresponding to each of the plurality of suction nozzles 15 have a predetermined correlation. In this case, the determination unit 140 determines Yes in step S15 if the correlation coefficient r of at least one suction nozzle 15 is equal to or greater than a predetermined value.

For example, the determination unit 140 may determine a malfunction of the suction nozzle 15 and the type of the component P based on whether or not the first positional deviation information and the second positional deviation information corresponding to the type of component P have a predetermined correlation. In this case, when the determination unit 140 determines that the suction nozzle 15 is malfunctioning with a specific component P, it may determine that the suction nozzle 15 is not malfunctioning, but that the suction nozzle 15 is not corresponding to the specific component P, that is, that the suction nozzle 15 is not compatible with the specific component P, and may report the determination result. In this way, the determination unit 140 can determine whether the cause of the correlation coefficient r being equal to or greater than a predetermined value is the malfunction of the suction nozzle 15 or a poor combination of the suction nozzle 15 and the component P, and therefore can more accurately detect the malfunction of the suction nozzle 15.

Other Embodiments
Although the component mounting system according to one or more aspects has been described based on the embodiment, the present disclosure is not limited to this embodiment. As long as it does not deviate from the spirit of the present disclosure, various modifications conceived by a person skilled in the art to the embodiment and forms constructed by combining components in different embodiments may also be included in the present disclosure.

For example, in the above embodiment, an example was described in which the holding unit is a suction nozzle, but the holding unit is not limited to holding a component by suction. The holding unit may hold a component by, for example, gripping the component. In addition, the holding unit is not limited to being a suction nozzle as long as it is capable of holding a component.

In addition, in step S15 of the above embodiment, whether or not a predetermined correlation exists is determined based on a predetermined value (absolute value), but the determination method is not limited to this. In step S15, the determination unit may determine whether or not a predetermined correlation exists based on whether or not the amount of change in the correlation coefficient over time (e.g., the amount of change within a predetermined time) is equal to or greater than a predetermined value (relative value).

In addition, in the above embodiment, an example was described in which the threshold value (the above-mentioned predetermined value) used to determine whether or not there is a predetermined correlation between the first position deviation information and the second position deviation information is common regardless of the type of part, but this is not limited to the above, and the threshold value may be set for each type of part.

In addition, in the above embodiment, a correlation coefficient is used as an index showing the correlation between the first positional deviation information and the second positional deviation information, but the index is not limited to the correlation coefficient. The index may be another coefficient calculated by a calculation formula other than Formula 1, as long as the relationship between the first positional deviation information and the second positional deviation information is known.

Furthermore, the regression lines shown in Figures 11A and 11B in the above embodiment are not limited to being straight lines passing through the origin.

In addition, in the above embodiment, an example was described in which the object on which the component mounting device mounts components is a substrate, but this is not limited thereto, and the object may be another object on which components can be mounted.

In addition, in the above embodiment, an example was described in which the component recognition camera and the inspection camera are separate, i.e., the imaging unit is realized by two cameras, but the imaging unit may also be realized by a single camera.

The division of functional blocks in the block diagram is one example, and multiple functional blocks may be realized as one functional block, one functional block may be divided into multiple blocks, or some functions may be transferred to other functional blocks. In addition, the functions of multiple functional blocks having similar functions may be processed in parallel or in a time-sharing manner by a single piece of hardware or software.

The malfunction detection device according to the above embodiment may be realized as a single device or may be realized by multiple devices. When the malfunction detection device is realized by multiple devices, the components of the malfunction detection device may be distributed in any manner among the multiple devices. When the malfunction detection device is realized by multiple devices, the communication method between the multiple devices is not particularly limited, and may be wireless communication or wired communication. Furthermore, wireless communication and wired communication may be combined between the devices.

In addition, some of the functions of the management computer (malfunction detection device) according to the above embodiment may be provided in the component mounting device. For example, the judgment unit of the management computer may be provided in the component mounting device or the inspection device. In addition, some of the functions of the component mounting device and the inspection device according to the above embodiment may be provided in the component mounting device. For example, at least one of the recognition processing unit of the component mounting device and the positional deviation calculation unit of the inspection device may be provided in the management computer.

In addition, each component described in the above embodiments may be realized as dedicated hardware, software, or typically as an LSI, which is an integrated circuit. These may be individually integrated into one chip, or may be integrated into one chip to include some or all of them. Here, LSI is used, but depending on the degree of integration, it may be called IC, system LSI, super LSI, or ultra LSI. In addition, the method of integration is not limited to LSI, and may be realized with a dedicated circuit or a general-purpose processor. After LSI manufacture, a programmable FPGA (Field Programmable Gate Array) or a reconfigurable processor that can reconfigure the connection or settings of circuit cells inside the LSI may be used. Furthermore, if an integrated circuit technology that replaces LSI appears due to advances in semiconductor technology or a different derived technology, it is natural that the components may be integrated using that technology.

A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple processing units on a single chip, and is specifically a computer system that includes a microprocessor, ROM (Read Only Memory), RAM (Random Access Memory), etc. Computer programs are stored in the ROM. The system LSI achieves its functions when the microprocessor operates according to the computer program.

Another aspect of the present disclosure may be a computer program that causes a computer to execute each of the characteristic steps included in the component mounting method shown in FIG. 7.

Also, for example, the program may be a program to be executed by a computer. Another aspect of the present disclosure may be a computer-readable non-transitory recording medium on which such a program is recorded. For example, such a program may be recorded on a recording medium and distributed or circulated. For example, the distributed program may be installed in a device having another processor, and the program may be executed by that processor, thereby making it possible to cause that device to perform each of the above processes.

The order in which each step (process) in the flowchart shown in FIG. 7 is executed is merely an example to specifically explain the present disclosure, and an order other than the above may be used. Also, some of the steps (processes) may not be executed.

In addition, each step in the component mounting method described in the above embodiment may be performed in one process or in separate processes. Performed in one process is intended to include each step being performed using one device, each step being performed consecutively, or each step being performed at the same location. Separate processes is intended to include each step being performed using separate devices, each step being performed at different times (e.g., different days), or each step being performed at different locations.

This disclosure is useful for component mounting systems that include a nozzle or other holding unit.

LIST OF SYMBOLS 1 Component mounting system 1a Base 2 Board transport section 3 Board 4 Component supply section 5 Tape feeder 6 Y-axis beam 7 X-axis beam 8 Mounting head section 8a Coupling plate 9 Nozzle unit 9a Nozzle drive section 10 Component disposal box 11 Component recognition camera 11a Image 11b, 15 Suction nozzle 11c Center 11x, 11y Center line 12 Board recognition camera 13 Nozzle axis 14 Nozzle mounting section 15a Tip section 20, 60, 110 Communication section 21 Mounting control section 22 Mounting memory section 23, 65, 131 Mounting data 30 Nozzle control section 31 Valve control section 32 Valve memory section 34 Flow rate sensor 36 Switching valve 38 Blow valve 38a Air supply section 40 Recognition processing section 50, 67, 150 Display unit 52, 69, 152 Input unit 61 Inspection control unit 62 Position deviation amount calculation unit 63 Inspection camera 64 Inspection memory unit 66, 133 Position deviation amount data 100 Management computer (malfunction detection device)
120 Management control unit 130 Management storage unit 132 Component information 140 Determination unit 200 Communication network Cn Nozzle center Cp Component center Cs Regular position M1 Solder printing device M2, M3 Component mounting device (component mounting unit)
M4 Inspection device P Part Rm Mounting position deviation (second position deviation information)
Rv Adsorption position deviation (first position deviation information)
ΔX1, ΔY1, Δθ1, R: positional deviation amount (first positional deviation information)
ΔX2, ΔY2, Δθ2: positional deviation amount (second positional deviation information)

Claims (13)

a component mounting unit that mounts components on a board;
An acquisition unit;
A determination unit,
The component mounting section includes:
A holding portion for holding the component;
an imaging unit that images the component,
the acquisition unit acquires first positional deviation information of the component with respect to the holding unit based on a first image captured by the imaging unit of the component held in the holding unit, and second positional deviation information of the component based on a second image captured by the imaging unit of the component mounted on the board,
the determination unit determines whether the holding unit is malfunctioning based on whether the first positional deviation information and the second positional deviation information have a predetermined correlation.
Component mounting system. the component mounting portion has a plurality of the holding portions,
the acquiring unit acquires the first positional deviation information and the second positional deviation information corresponding to each of the plurality of holding units;
the determination unit determines, for each of the plurality of holding units, a malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information corresponding to each of the plurality of holding units have the predetermined correlation.
The component mounting system according to claim 1 . the determination unit further determines, for each type of component, a malfunction in the holding unit and the type of component based on whether or not the first positional deviation information and the second positional deviation information corresponding to the type of component are in the predetermined correlation.
The component mounting system according to claim 2 . the determination unit determines whether or not the first positional deviation information and the second positional deviation information have the predetermined correlation based on an index indicating a correlation between the first positional deviation information and the second positional deviation information, the index being calculated based on the first positional deviation information and the second positional deviation information.
The component mounting system according to claim 1 . The index is a correlation coefficient,
the determination unit determines that the first positional deviation information and the second positional deviation information have the predetermined correlation when the correlation coefficient is equal to or greater than a predetermined value.
The component mounting system according to claim 4 . the predetermined value is a value indicating that there is a weak positive correlation between the first positional deviation information and the second positional deviation information.
The component mounting system according to claim 5 . an output unit that outputs a message indicating that the holding unit is out of order when the first positional deviation information and the second positional deviation information are in the predetermined correlation;
The component mounting system according to claim 1 . When the first positional deviation information and the second positional deviation information are in the predetermined correlation, the imaging unit further images a tip end of the holding unit,
The determination unit further determines whether or not there is an abnormality in the tip portion based on a third image of the tip portion captured by the imaging unit, and determines a malfunction of the holding unit based on a determination result.
The component mounting system according to claim 1 . the holding unit is a suction nozzle that suctions and holds the component,
the component mounting unit further includes a measurement unit for measuring a vacuum flow rate of air flowing through the suction nozzle,
the measurement unit further measures a vacuum flow rate when the first positional deviation information and the second positional deviation information are in the predetermined correlation;
The determination unit further determines whether or not there is an abnormality in the measured vacuum flow rate, and determines a malfunction of the holding unit based on the determination result.
The component mounting system according to claim 1 . An air supply unit that supplies air to the suction nozzle is further provided,
and when the determination result includes an abnormality, the air supply unit supplies the air to the suction nozzle when the suction nozzle is positioned at a position other than above the substrate.
The component mounting system according to claim 9 . A component mounting apparatus for mounting components on a substrate, comprising:
A holding portion for holding the component;
An imaging unit that images the component;
An acquisition unit;
A determination unit,
the acquisition unit acquires first positional deviation information of the component with respect to the holding unit based on an image captured by the imaging unit of the component held in the holding unit, and second positional deviation information of the component based on an image captured by the imaging unit of the component mounted on the board,
the determination unit determines whether the holding unit is malfunctioning based on whether the first positional deviation information and the second positional deviation information have a predetermined correlation.
Component mounting equipment. A malfunction detection device for detecting a malfunction of a holding unit in a component mounting apparatus including a holding unit for holding a component in order to mount the component on a board, comprising:
an acquisition unit that acquires first positional deviation information of the component with respect to the holding unit based on an image of the component held by the holding unit, and second positional deviation information of the component based on an image of the component mounted on the board;
a determination unit that determines whether the holding unit is malfunctioning based on whether the first positional deviation information and the second positional deviation information have a predetermined correlation.
Malfunction detection device. A component mounting method using a component mounting apparatus having a holding unit that holds a component in order to mount the component on a substrate, comprising:
Taking an image of the component held by the holding unit;
acquiring first positional deviation information of the component with respect to the holder based on the captured image;
Taking an image of the component mounted on the board;
acquiring second positional deviation information of the component mounted on the board based on the captured image;
determining whether the first positional deviation information and the second positional deviation information have a predetermined correlation or not,
Component mounting method.

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