JP7704089B2 - Manufacturing apparatus and method for electronic components - Google Patents

Description

The present invention relates to an apparatus and method for manufacturing electronic components, and in particular to an apparatus and method for manufacturing electronic components having a ceramic laminate formed by stacking multiple ceramic green sheets.

Conventionally, when manufacturing electronic components such as multilayer ceramic capacitors, there is a process in which multiple ceramic green sheets with internal electrodes printed on them are stacked on a stage. In this process, it is necessary to align the positions of the internal electrodes in the stacking direction, so the stage on which the ceramic green sheets are stacked is required to have high flatness. In addition, when stacking the ceramic green sheets, it is required to removably hold the ceramic green sheets on the stage so that they do not shift on the stage.

Patent Document 1 below discloses providing a vacuum suction mechanism plate on the upper surface of the first mold on which the green sheet is laminated. Therefore, in the invention described in Patent Document 1 below, the green sheet can be suctioned onto the vacuum suction mechanism plate, so that the green sheet can be detachably held on the first mold.

JP 2010-287708 A

However, in the case of the invention described in Patent Document 1, a vacuum suction mechanism plate is provided on the first die, which complicates the configuration of the multilayer ceramic capacitor manufacturing device and may affect the layout of other equipment around the location where the first die is provided on the manufacturing device.

The present invention was made in consideration of these problems, and aims to provide an electronic component manufacturing apparatus and manufacturing method that can detachably hold a ceramic green sheet on a stage with a simple configuration.

The electronic component manufacturing apparatus of the present invention is an electronic component manufacturing apparatus having a ceramic laminate formed by stacking a plurality of ceramic green sheets, and includes a preheating means for preheating a stage having a mounting surface on which the plurality of ceramic green sheets are stacked, an attachment means for attaching, while heating, a long holding sheet that develops adhesive strength when heated to the mounting surface of the stage preheated by the preheating means, and a cutting means for cutting the portion of the long holding sheet that is attached to the mounting surface.

The method for manufacturing an electronic component of the present invention is a method for manufacturing an electronic component having a ceramic laminate formed by stacking a plurality of ceramic green sheets, and includes a preheating step of preheating a stage having a mounting surface on which the plurality of ceramic green sheets are stacked by a preheating means, and an attachment step of heating and attaching, by an attachment means, a long holding sheet that develops adhesive strength when heated to the mounting surface of the stage preheated in the preheating step.

The present invention provides an electronic component manufacturing apparatus and method that can detachably hold a ceramic green sheet on a stage with a simple configuration.

1 is a right side view showing a schematic configuration of an electronic component manufacturing apparatus according to an embodiment of the present invention. 1 is a plan view showing a schematic configuration of an electronic component manufacturing apparatus according to an embodiment of the present invention, with some parts omitted. 2 is a right side view showing a schematic configuration of a peeling device that peels a ceramic green sheet from a carrier film. FIG. FIG. 4 is an explanatory diagram showing a state in which the ceramic green sheet peeled off from the carrier film is laminated on a stage. FIG. 2 is a schematic perspective view of an electronic component. This is a cross-sectional view taken along line AA in FIG. 5.

Specific embodiments of the present invention will be described in detail below with reference to the drawings.

Figures 1 and 2 are diagrams showing the schematic configuration of an electronic component manufacturing apparatus according to one embodiment of the present invention, with Figure 1 being a right side view and Figure 2 being a plan view with some parts omitted. The electronic component manufacturing apparatus 1 of this embodiment is an electronic component manufacturing apparatus having a ceramic laminate formed by stacking a plurality of ceramic green sheets, and is equipped with a preheating means 2, an attachment means 3, and a cutting means 4. Each of these means will be described in turn below.

The preheating means 2 is a means for preheating the stage 5 on which multiple ceramic green sheets are laminated. The stage 5 is a metal plate. In this embodiment, the stage 5 is made of SUS and is a plate that is approximately rectangular in plan view. The thickness of the plate-shaped stage 5 is about 0.5 mm. The thickness of the stage 5 is not limited to about 0.5 mm, and may be, for example, about 0.5 mm or more and about 2.0 mm or less. If the thickness of the stage 5 is less than about 0.5 mm, it is difficult to handle the stage 5 using a handling device, and it is difficult to move the stage 5. If the thickness of the stage 5 is more than about 2.0 mm, variation in surface pressure occurs. The stage 5 has a mounting surface 6 on which multiple ceramic green sheets are laminated. This mounting surface 6 is one of the plate surfaces of the plate-shaped stage 5. In this embodiment, the preheating means 2 has a pair of heating plates 7, 7 that can sandwich the stage 5, and a heating plate heater (not shown) that heats the pair of heating plates 7, 7.

The pair of heating plates 7, 7 are each made of metal and have a plate shape that is approximately rectangular in plan view. The thickness of each of the pair of heating plates 7, 7 is preferably 10 mm or more in order to ensure heat capacity. The pair of heating plates 7, 7 are arranged one above the other with the plate surfaces facing up and down. The pair of heating plates 7, 7 can be moved up and down by a driving means (not shown). Therefore, the pair of heating plates 7, 7 can sandwich the stage 5. Each of the pair of heating plates 7, 7 has a built-in heating plate heater. The heating plate heater may be attached externally to the heating plate 7.

Of the pair of upper and lower heating plates 7, 7, the lower heating plate 7 is arranged so as to be movable up and down within the belt conveyor 8 that transports the stage 5. The belt conveyor 8 has a conventionally known configuration. Specifically, the belt conveyor 8 has a left conveyor section 9 located on the left side and a right conveyor section 10 located on the right side. The left conveyor section 9 has two passive shafts 11, 11 whose axes are arranged in the left-right direction, and a drive shaft (not shown) whose axis is arranged in the left-right direction. The two passive shafts 11, 11 are arranged at a distance in the front-rear direction. The drive shaft is arranged below between the two passive shafts 11, 11. A belt 12 is wound around the two passive shafts 11, 11 and the drive shaft arranged in this manner. The tension of the belt 12 is adjusted by a tension roller (not shown). The right conveyor section 10 has two passive shafts 13, 13 whose axes are arranged in the left-right direction, and a drive shaft (not shown) whose axis is arranged in the left-right direction. The two passive shafts 13, 13 are arranged at a distance from each other in the front-rear direction. The drive shaft is arranged below and between the two passive shafts 13, 13. A belt 14 is wound around the two passive shafts 13, 13 and the drive shaft arranged in this manner. The tension of the belt 14 is adjusted by a tension roller (not shown). The drive shaft of the left conveyor unit 9 and the drive shaft of the right conveyor unit 10 are connected to a motor (not shown). Therefore, by driving the motor, the stage 5 can be transported on the belts 12, 14.

In the space between the left conveyor section 9 and the right conveyor section 10, the lower heating plate 7 is arranged so as to be movable up and down. Meanwhile, the upper heating plate 7 is arranged so as to be movable up and down above the belt conveyor 8 so as to face the lower heating plate 7. With this configuration, the pair of upper and lower heating plates 7, 7 can sandwich the stage 5 placed on the stopped belt conveyor 8. As described above, the pair of heating plates 7, 7 can be heated by a heating plate heater. Therefore, by sandwiching the stage 5 between the pair of heated heating plates 7, 7, the stage 5 can be preheated.

In this embodiment, the stage 5 is introduced into the preheating means 2 by the belt conveyor 15. The belt conveyor 15 is located in front of the preheating means 2. The belt conveyor 15 has a conventionally known configuration. Specifically, the belt conveyor 15 has two passive shafts 16, 16 with their axes arranged in the left-right direction, and a drive shaft (not shown) with their axes arranged in the left-right direction. The two passive shafts 16, 16 are arranged at a distance from each other in the front-rear direction. The drive shaft is arranged below and between the two passive shafts 16, 16. A belt 17 is wound around the two passive shafts 16, 16 and the drive shaft arranged in this manner. The tension of the belt 17 is adjusted by a tension roller (not shown). The drive shaft of the belt conveyor 15 is connected to a motor (not shown). Therefore, the stage 5 on the belt 17 can be transported by driving the motor.

Between the belt conveyor 15 and the preheating means 2, a pair of rollers 18, 18 and a pair of rollers 19, 19 are arranged. The pair of rollers 18, 18 are arranged one above the other. At this time, a gap is formed between the roller 18 located on the upper side and the roller 18 located on the lower side. The pair of rollers 18, 18 are each arranged so that their axial direction is along the left-right direction. Each of the pair of rollers 18, 18 can rotate around its axis. The pair of rollers 19, 19 are arranged one above the other. At this time, a gap is formed between the roller 19 located on the upper side and the roller 19 located on the lower side. Each of the pair of rollers 19, 19 are each arranged so that their axial direction is along the left-right direction. Each of the pair of rollers 19, 19 can rotate around its axis.

The pair of rollers 18, 18 are disposed in front of the pair of rollers 19, 19. With this configuration, the stage 5 is transported by the belt conveyor 15 from the belt conveyor 15 through between the pair of rollers 18, 18 and between the pair of rollers 19, 19 to the belt conveyor 8. The stage 5 transported to the belt conveyor 8 is then transported by the belt conveyor 8 to between the pair of heating plates 7, 7. When the stage 5 is positioned between the pair of heating plates 7, 7, the belt conveyor 8 is stopped. The stage 5 is then heated by the preheating means 2. The preheated stage 5 is supplied to the attachment means 3 by the belt conveyor 8.

The attachment means 3 is provided on the rear side, which is the leading end side in the stage transport direction, of the belt conveyor 8 on which the preheating means 2 is provided. The attachment means 3 is a means for attaching a long holding sheet 20 to the mounting surface 6 of the stage 5 preheated by the preheating means 2. The holding sheet 20 exerts its adhesive force when heated. For example, the holding sheet 20 exerts its adhesive force when heated to 40°C or higher. Note that the temperature at which the adhesive force of the holding sheet 20 exerts is not limited to 40°C or higher. The thickness of the holding sheet 20 is approximately 0.1 mm, but is not limited to this.

The holding sheet 20 is attached to the mounting surface 6 of the stage 5 by the adhesive force of the holding sheet 20. Therefore, the attaching means 3 attaches the holding sheet 20 to the mounting surface 6 of the stage 5 while heating it. Therefore, in this embodiment, the attaching means 3 has a pair of heating rollers 21, 21 and a roller heater (not shown) that heats the pair of heating rollers 21, 21. The pair of heating rollers 21, 21 are arranged vertically. At this time, a gap is formed between the heating roller 21 located on the upper side and the heating roller 21 located on the lower side. Each of the pair of heating rollers 21, 21 has a metal roller body 22 and a cylindrical elastic material 23 provided on the roller body 22. The roller body 22 is arranged so that the axial direction is along the left-right direction. The roller body 22 can rotate around its axis. A motor is connected to the roller body 22. Therefore, by driving the motor, the roller body 22 can rotate around its axis. The roller body 22 has a built-in roller heater. The elastic material 23 is cylindrical and is attached to the roller body 22 so as to cover the outer circumferential surface of the roller body 22 and to be non-rotatable. The elastic material 23 is made of, for example, rubber.

The stage 5 conveyed by the belt conveyor 8 is supplied to the gap between the pair of upper and lower heating rollers 21, 21. The long holding sheet 20 supplied through the roll 24 to the gap between the pair of heating rollers 21, 21 is brought into contact with the mounting surface 6 of the stage 5 by the rotation of the pair of heating rollers 21, 21. In this way, the pair of heating rollers 21, 21 can sandwich the stage 5 and the holding sheet 20 and bring the holding sheet 20 into contact with the mounting surface 6. As described above, the pair of heating rollers 21, 21 can be heated by a roller heater. Therefore, by sandwiching the stage 5 and the holding sheet 20 between the pair of heating rollers 21, 21 heated by the roller heater, the adhesive force is exerted on the holding sheet 20, and the holding sheet 20 can be attached to the mounting surface 6 of the stage 5. The stage 5 to which the holding sheet 20 is attached is taken out from the gap between the pair of heating rollers 21, 21 by the rotation of the pair of heating rollers 21, 21.

In this embodiment, the stage 5 to which the holding sheet 20 is attached is taken out by the belt conveyor 25. The belt conveyor 25 is located behind the attachment means 3. The belt conveyor 25 has a conventionally known configuration. Specifically, the belt conveyor 25 has two passive shafts 26, 26 with their axes arranged in the left-right direction, and a drive shaft (not shown) with their axes arranged in the left-right direction. The two passive shafts 26, 26 are arranged at a distance from each other in the front-rear direction. The drive shaft is arranged below and between the two passive shafts 26, 26. A belt 27 is wound around the two passive shafts 26, 26 and the drive shaft arranged in this manner. The tension of the belt 27 is adjusted by a tension roller (not shown). The drive shaft of the belt conveyor 25 is connected to a motor (not shown). Therefore, the stage 5 on the belt 27 can be transported by driving the motor.

A pair of rollers 28, 28 are arranged between the belt conveyor 25 and the attachment means 3. The pair of rollers 28, 28 are arranged one above the other. At this time, a gap is formed between the upper roller 28 and the lower roller 28. The pair of rollers 28, 28 are each arranged so that their axial direction is along the left-right direction. Each of the pair of rollers 28, 28 can rotate around its axis. With this configuration, the stage 5 to which the holding sheet 20 is attached is transported from the attachment means 3 between the pair of rollers 28, 28 to the belt conveyor 25.

After the stage 5 is conveyed by the belt conveyor 25, the portion of the long holding sheet 20 that is attached to the mounting surface 6 of the stage 5 is cut by the cutting means 4. The cutting means 4 is disposed behind the attaching means 3. Specifically, the cutting means 4 is disposed between the attaching means 3 and a pair of rollers 28, 28. The cutting means 4 has a cutting blade 29 that cuts the holding sheet 20. The cutting blade 29 can move up and down. The cutting blade 29 is connected to a motor. Therefore, the cutting blade 29 can be moved up and down by driving the motor. With this configuration, after the stage 5 passes the attaching means 3, the cutting blade 29 can be moved downward and pressed against the holding sheet 20 to cut the holding sheet 20. In this embodiment, the holding sheet 20 is cut by the pushing of the cutting blade 29, but this is not limited to this. For example, the holding sheet 20 may be cut by the rotation of the cutting blade, or the holding sheet 20 may be cut by the pulling of the cutting blade.

After the holding sheet 20 is cut, the stage 5 to which the holding sheet 20 is attached is transported by the belt conveyor 25 from the front side of the belt conveyor 25 to the rear side of the belt conveyor 25. The stage 5 transported to the rear side of the belt conveyor 25 is placed in a peeling device, which will be described later.

Figure 3 is a right side view showing the schematic configuration of the peeling device. Figure 4 is an explanatory diagram showing the state in which the ceramic green sheet peeled from the carrier film is stacked on a stage. The peeling device 30 is a device that peels the ceramic green sheet 31 from the carrier film 32. The peeling device 30 includes a cutting stage 33, a cutting blade 34, and a peeling head 35.

A composite sheet 36 is held on the cutting stage 33. The composite sheet 36 has a carrier film 32 and a ceramic green sheet 31 formed on the carrier film 32. The composite sheet 36 is held on the cutting stage 33 with the carrier film 32 in contact with the cutting stage 33.

The cutting blade 34 is disposed above the cutting stage 33. The cutting blade 34 can cut the ceramic green sheet 31 on the carrier film 32 by moving toward the composite sheet 36 held on the cutting stage 33.

The peeling head 35 is positioned above the composite sheet 36. The peeling head 35 is capable of suction-holding the ceramic green sheet 31 cut by the cutting blade 34. A stage 5 with a holding sheet 20 attached thereto is placed below the peeling head 35.

The peeling device 30 also includes a transport roll 37 and a peeling roll 38. The transport roll 37 can transport the composite sheet 36. In this embodiment, the transport roll 37 is configured to be able to transport the composite sheet 36 intermittently. The peeling roll 38 can peel the carrier film 32 from the ceramic green sheet 31 held by the peeling head 35. Therefore, the peeling roll 38 is configured to be able to move in the opposite direction to the transport direction of the composite sheet 36.

Next, a method for manufacturing electronic components using the peeling device 30 will be described. Here, the case of manufacturing a multilayer ceramic capacitor, which is an example of an electronic component, will be described. Note that electronic components are not limited to multilayer ceramic capacitors.

When manufacturing a multilayer ceramic capacitor, first, a slurry containing dielectric ceramic powder, a binder, and a solvent is formed into a sheet on a carrier film 32. This allows a composite sheet 36 to be produced in which a ceramic green sheet 31 is held on the carrier film 32. After the composite sheet 36 is produced, a conductive paste for forming internal electrodes is printed in a predetermined pattern on the ceramic green sheet 31 by screen printing or the like to form an internal electrode pattern. Then, a peeling device 30 is used to stack ceramic green sheets 31 with and without an internal electrode pattern.

Specifically, first, the composite sheet 36 is transported by the transport roll 37 so that a predetermined area of the ceramic green sheet 31 is placed on the cutting stage 33. When the predetermined area of the ceramic green sheet 31 is placed on the cutting stage 33, the transport roll 37 is temporarily stopped to stop the transport of the composite sheet 36. After the transport roll 37 is stopped, the cutting blade 34 is moved downward to cut the ceramic green sheet 31 on the carrier film 32. Then, the composite sheet 36 is transported by the transport roll 37 so that the cut ceramic green sheet 31 is placed below the peeling head 35. When the cut ceramic green sheet 31 is placed below the peeling head 35, the peeling head 35 is moved downward to suck the cut ceramic green sheet 31 with the peeling head 35. With the cut ceramic green sheet 31 being sucked by the peeling head 35, the peeling roll 38 is moved in the opposite direction to the transport direction of the composite sheet 36. This allows the carrier film 32 to be peeled off from the cut ceramic green sheet 31. The peeling head 35 is then moved downward to stack the ceramic green sheets 31 on the holding sheet 20 of the stage 5. This operation is repeated multiple times to stack multiple ceramic green sheets 31 on the holding sheet 20 of the stage 5. This makes it possible to form a stacked block in which multiple ceramic green sheets 31 are stacked. In this way, the peeling device 30 creates a stacked block.

After the laminated block is formed, multiple laminated chips are cut out from the laminated block. The laminated chips are then fired to form a ceramic laminate. After the ceramic laminate is formed, a conductive paste is applied to the outer surface of the ceramic laminate to form a conductive paste layer on the ceramic laminate. After the conductive paste is formed, the conductive paste layer is fired to form external electrodes on the ceramic laminate. This makes it possible to obtain a multilayer ceramic capacitor having the following configuration. Note that after the laminated chips are cut out from the laminated block, a conductive paste layer may be formed on the laminated chips, and the laminated chips and the conductive paste layer may be fired to produce a multilayer ceramic capacitor having a ceramic laminate.

Figures 5 and 6 show a multilayer ceramic capacitor, which is an electronic component, with Figure 5 being a schematic perspective view and Figure 6 being a cross-sectional view taken along the line A-A of Figure 5. Inside the ceramic laminate 40 of the multilayer ceramic capacitor 39, internal electrodes 41 and 42 are arranged so that adjacent internal electrodes 41 and 42 face each other partially via a ceramic layer. An external electrode 43 connected to the internal electrode 41 is formed on one end surface of the ceramic laminate 40. An external electrode 44 connected to the internal electrode 42 is formed on the other end surface of the ceramic laminate 40.

The laminated ceramic capacitor 39 having such a configuration is manufactured by the manufacturing method described above. At this time, the holding sheet 20 is attached to the stage 5 on which the ceramic green sheets 31 are laminated. The procedure for attaching the holding sheet 20 to the stage 5 in the method for manufacturing electronic components will be described below. Note that the manufacturing method for electronic components of this embodiment uses the manufacturing apparatus 1 described above.

The method for manufacturing an electronic component according to this embodiment is a method for manufacturing an electronic component having a ceramic laminate 40 formed by stacking a plurality of ceramic green sheets 31. In this embodiment, a preheating step, a bonding step, and a cutting step are performed in sequence. Note that before the preheating step, a stage 5 and a holding sheet 20 are prepared. Specifically, the stage 5 is placed on the belt conveyor 15. The holding sheet 20 is set in the manufacturing device 1 so that it is bonded to the stage 5 by the bonding means 3. After the step of preparing the stage 5 and the holding sheet 20 in this manner, the stage 5 is transported by the belt conveyor 15 to the adjacent belt conveyor 8. The stage 5 is then positioned between a pair of heating plates 7, 7 by the belt conveyor 8.

The preheating process is a process in which the stage 5, which has a mounting surface 6 on which a plurality of ceramic green sheets 31 are laminated, is preheated by the preheating means 2. In the preheating process, the stage 5 is heated by sandwiching it between a pair of heating plates 7, 7 heated by a heating plate heater. The temperature of the pair of heating plates 7, 7 of the preheating means 2 is preferably 50°C or higher and 70°C or lower. After the preheating process, the stage 5 is transported between a pair of heating rollers 21, 21 by the belt conveyor 8.

The pasting process is a process of pasting a long holding sheet 20, which develops adhesive force when heated, to the mounting surface 6 of the stage 5 preheated in the preheating process, while heating it with the pasting means 3. In the pasting process, the stage 5 and the holding sheet 20 are sandwiched between a pair of heating rollers 21, 21 heated by a roller heater, so that the holding sheet 20 develops adhesive force and is pasted to the mounting surface 6 of the stage 5. The temperature of the pair of heating rollers 21, 21 of the pasting means 3 is preferably 40°C or higher and 90°C or lower, more preferably 50°C or higher and 70°C or lower. If the temperature of the pasting means 3 is lower than 40°C, there is a risk that the adhesive force of the holding sheet 20 cannot be developed. If the temperature of the pasting means 3 is higher than 90°C, there is a risk that the plate-shaped stage 5 will warp.

After the pasting process, the stage 5 is taken out onto the belt conveyor 25 through the gap between the pair of heating rollers 21, 21 by the rotation of the pair of heating rollers 21, 21. When the stage 5 is taken out onto the belt conveyor 25, the holding sheet 20 is pasted onto the subsequent stage 5 by the pasting means 3. Therefore, the holding sheet 20 pasted onto the stage 5 taken out onto the belt conveyor 25 and the holding sheet 20 pasted onto the subsequent stage 5 are continuous.

The cutting process is a process in which the portion of the long holding sheet 20 that is attached to the mounting surface 6 of the stage 5 is cut by the cutting means 4. In the cutting process, after the stage 5 passes the attaching means 3, the cutting blade 29 is moved downward and pressed against the holding sheet 20, thereby cutting the holding sheet 20. As a result, the long holding sheet 20 is cut between the stage 5 that has been removed onto the belt conveyor 25 and the subsequent stage 5. Note that if there is no subsequent stage 5, the stage 5 is not removed onto the belt conveyor 25.

After the cutting process, the stage 5 with the holding sheet 20 attached thereto is transported by the belt conveyor 25 from the front side of the belt conveyor 25 to the rear side of the belt conveyor 25. In this embodiment, the holding sheet 20 is attached to multiple consecutive stages 5. The stage 5 transported to the rear side of the belt conveyor 25 is placed in the peeling device 30. The peeling device 30 then stacks multiple ceramic green sheets 31 on the holding sheet 20 of the stage 5.

In this embodiment, the holding sheet 20, which develops adhesive strength when heated, is attached to the preheated stage 5 while being heated. Therefore, when the ceramic green sheets 31 are stacked on the holding sheet 20, the ceramic green sheets 31 are held to the stage 5 by the adhesive strength of the holding sheet 20. This prevents the ceramic green sheets 31 from shifting on the stage 5 when the ceramic green sheets 31 are stacked. When the temperature of the holding sheet 20 drops, the adhesive strength of the holding sheet 20 is lost, so that the stacked ceramic green sheets 31 can be easily removed from the stage 5. Thus, according to this embodiment, the ceramic green sheets 31 can be detachably held on the stage 5 with a simple configuration.

In this embodiment, the preheating means 2 has a pair of heating plates 7, 7 and a heating plate heater that heats the pair of heating plates 7, 7. The pasting means 3 has a pair of heating rollers 21, 21 and a roller heater that heats the pair of heating rollers 21, 21. Therefore, the electronic component manufacturing apparatus 1 of this embodiment can be made to have a simpler configuration. In this embodiment, the thickness of each of the pair of heating plates 7, 7 is 10 mm or more. Therefore, according to the electronic component manufacturing apparatus 1 of this embodiment, since the heat capacity of the heating plate 7 is high, the stage 5 can be uniformly heated even if heat is absorbed by the stage 5.

In this embodiment, the heating roller 21 includes a roller body 22 and an elastic material 23. Therefore, heating by the pair of heating rollers 21, 21 can be achieved evenly. In this embodiment, the stage 5 can be preheated by sandwiching it between a pair of heating plates 7, 7. Therefore, warping of the plate-shaped stage 5 can be prevented. In this embodiment, since the stage 5 is preheated in advance, when the holding sheet 20 is attached to the stage 5 by the attachment means 3, the holding sheet 20 can be attached to the stage 5 evenly and without unevenness.

The present invention is not limited to the above-mentioned embodiment, and any modifications or improvements that can achieve the object of the present invention are included in the present invention.

For example, the preheating means 2, the attaching means 3, and the cutting means 4 are not limited to the configurations of the above embodiment.

Reference Signs List 1 Electronic component manufacturing apparatus 2 Preheating means 3 Attachment means 4 Cutting means 5 Stage 6 Mounting surface 7 Heating plate 20 Holding sheet 21 Heating roller 22 Roller body 23 Elastic material 31 Ceramic green sheet 40 Ceramic laminate

Claims (4)

An apparatus for manufacturing electronic components having a ceramic laminate in which a plurality of ceramic green sheets are laminated,
a preheating means for preheating a metal stage having a mounting surface on which the plurality of ceramic green sheets are laminated;
a bonding means for bonding, while heating, a long holding sheet that exhibits adhesive force when heated to the placement surface of the stage that has been preheated by the preheating means;
a cutting means for cutting the portion of the long holding sheet attached to the placement surface;
a head capable of stacking the ceramic green sheet held by suction on the holding sheet at a portion attached to the placement surface of the stage ,
the preheating means includes a pair of metal heating plates capable of sandwiching the stage therebetween, and a heating plate heater that heats the pair of heating plates;
the bonding means includes a pair of heating rollers that sandwich the stage and the holding sheet to bring the holding sheet into contact with the placement surface, and a roller heater that heats the pair of heating rollers;
The electronic component manufacturing apparatus , wherein each of the pair of heating rollers has a roller body and a cylindrical elastic material covering an outer circumferential surface of the roller body . 2. The electronic component manufacturing apparatus according to claim 1 , wherein each of the pair of heating plates has a thickness of 10 mm or more. A method for manufacturing an electronic component having a ceramic laminate in which a plurality of ceramic green sheets are laminated, comprising the steps of:
a preheating step of preheating a metal stage having a mounting surface on which the plurality of ceramic green sheets are laminated, by a preheating means;
a bonding step of bonding, while heating the long holding sheet, which exhibits adhesive strength when heated, by a bonding means, to the mounting surface of the stage preheated in the preheating step;
a cutting step of cutting the portion of the long holding sheet attached to the placement surface by a cutting means,
After the cutting step, the ceramic green sheet held by the head can be laminated on the holding sheet at the portion attached to the placement surface of the stage by a head ,
the preheating means includes a pair of metal heating plates capable of sandwiching the stage therebetween, and a heating plate heater that heats the pair of heating plates;
the bonding means includes a pair of heating rollers that sandwich the stage and the holding sheet to bring the holding sheet into contact with the placement surface, and a roller heater that heats the pair of heating rollers;
A method for manufacturing an electronic component , wherein each of the pair of heating rollers has a roller body and a cylindrical elastic material covering an outer peripheral surface of the roller body . 4. The method for manufacturing an electronic component according to claim 3 , wherein the temperature of the preheating means and the temperature of the attaching means are 50° C. or higher and 70° C. or lower.

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