JP7704638B2 - processing equipment - Google Patents

Description

The present invention relates to a processing device.

When dividing a semiconductor wafer or a package substrate into multiple chips, a cutting device equipped with a cutting blade or a laser processing device that irradiates a laser beam is used. These processing devices are usually equipped with a camera for capturing images of the workpiece. By capturing images of the processing marks formed on the workpiece with this camera, the processing device automatically recognizes processing defects such as chipping associated with the processing marks, meandering processing marks, and misalignment between the position of the processing marks and the position to be processed (kerf check), and takes measures such as correcting the processing position, interrupting processing, and calling an operator (see, for example, Patent Document 1).

Patent No. 4542223

In kerf checks, depending on the settings of the photography conditions, for example, changes in the amount of light (dirt on the microscope, deterioration of the light source, etc.), the presence or absence of the influence of water remaining in the kerf (which changes depending on the air blow settings), and focus deviation (the focal position differs from the height of the workpiece), the inspection result can change from pass to fail even for the same machining mark. In addition, the amount of light can gradually become dimmer due to deterioration of the lighting, etc., and even if the values set on the device (voltage and current values) are the same, the actual amount of light changes, so the operator needs to adjust the amount of light to an appropriate level, but inexperienced operators may not notice this, resulting in frequent failures and frequent machining stoppages.

The present invention was made in consideration of these problems, and its purpose is to provide a processing device that allows even an inexperienced operator to easily reproduce appropriate shooting conditions and can reduce frequent rejects and processing stoppages due to inappropriate shooting conditions.

In order to solve the above-mentioned problems and achieve the object, the processing device of the present invention is a processing device comprising a chuck table for holding a workpiece having a plurality of planned division lines, and a processing unit for processing the workpiece held on the chuck table along the planned division lines, the processing device further comprising a camera equipped with lighting for photographing the workpiece held on the chuck table, an inspection unit for detecting processing marks formed by the processing unit from an image of the planned division lines and inspecting the state of the processing marks with predetermined inspection items, and a processing unit for detecting the inspection conditions of the inspection unit, including the light intensity of the lighting when photographing the processing marks, and a processing unit for detecting the processing marks. The device is equipped with a recording unit that records each processing condition forming the light intensity, a display, and a control unit that controls each component. When the inspection unit determines that the contrast of the image taken with the set light intensity is clear, the control unit records the image as a sample image linked to the processing conditions of the workpiece, and when the inspection unit determines that the contrast of the image taken with the set light intensity is unclear, the control unit displays on the display the image determined to be unclear and the sample image recorded linked to the processing conditions, and displays a review screen that allows the lighting conditions to be compared and reviewed.

The inspection conditions of the inspection unit may further include air blow conditions by an air blow nozzle provided below the camera when photographing the processing marks, and the inspection unit may photograph the image under the set light intensity and air blow conditions.

The inspection conditions of the inspection unit may further include the distance of the camera from the workpiece when photographing the processing marks, and the inspection unit may photograph the image at the set light intensity and distance from the workpiece.

The processing unit may be a cutting unit in which a cutting blade is attached to a spindle, or a laser beam application unit that applies a laser beam, and the processing marks may be cutting grooves or laser processing marks.

The present invention makes it easy for even inexperienced operators to reproduce appropriate shooting conditions, and can reduce frequent rejects and processing stoppages caused by inappropriate shooting conditions.

FIG. 1 is a perspective view illustrating an example of the configuration of a processing device according to a first embodiment. FIG. 2 is a perspective view showing a main part of the processing apparatus of FIG. FIG. 3 is a cross-sectional view showing details of the camera of FIG. FIG. 4 is a diagram showing inspection conditions for the processing apparatus of FIG. FIG. 5 is a diagram showing a display screen of the processing apparatus of FIG. FIG. 6 is a diagram showing a display screen of the processing apparatus of FIG. FIG. 7 is a diagram showing a display screen of the processing apparatus of FIG. FIG. 8 is a diagram showing a display screen of the processing apparatus of FIG. FIG. 9 is a perspective view illustrating an example of the configuration of a processing device according to the second embodiment.

The following describes in detail the form (embodiment) for carrying out the present invention with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. The components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications of the configuration can be made without departing from the spirit of the present invention.

[Embodiment 1]
A processing device 1 according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of the processing device 1 according to the first embodiment. Fig. 2 is a perspective view showing a main part of the processing device 1 in Fig. 1. Fig. 3 is a cross-sectional view showing details of the camera 40 in Fig. 1. As shown in Fig. 1, the processing device 1 includes a chuck table 10, a processing unit 20, a moving unit 30, a camera 40, an inspection unit 50, a recording unit 60, a display 70, and a control unit 80.

In the first embodiment, the workpiece 100, which is the object to be processed by the processing device 1, is, for example, a disk-shaped semiconductor device wafer or an optical device wafer made of a base material such as silicon, sapphire, silicon carbide (SiC), or gallium arsenide. As shown in FIG. 1, the workpiece 100 has a plurality of planned division lines 102 formed in a lattice shape on a flat surface 101, and devices 103 are formed in the areas partitioned by the plurality of planned division lines 102. In the first embodiment, the workpiece 100 has an adhesive tape 105 attached to a back surface 104 on the back side of the front surface 101, and an annular frame 106 attached to the outer edge of the adhesive tape 105, but the present invention is not limited to this. In the present invention, the workpiece 100 may be a rectangular package substrate having a plurality of devices sealed with resin, a ceramic plate, a glass plate, or the like.

The chuck table 10 has a disk-shaped frame body with a recess formed therein and a disk-shaped suction part fitted into the recess. The suction part of the chuck table 10 is formed from a porous porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the suction part of the chuck table 10 is a holding surface 11 on which the workpiece 100 is placed and which suction-holds the placed workpiece 100. In the first embodiment, the holding surface 11 is a surface on which the workpiece 100 is placed with the front surface 101 facing upward, and suction-holds the placed workpiece 100 from the back surface 104 side via an adhesive tape 105. The holding surface 11 and the upper surface of the frame body of the chuck table 10 are arranged on the same plane and are formed parallel to the XY plane, which is a horizontal plane. The chuck table 10 is movable in the X-axis direction, which is one horizontal direction, by the X-axis movement unit 31 of the movement unit 30, and is rotatable around an axis parallel to the Z-axis direction, which is vertical and perpendicular to the holding surface 11, by a rotation drive source (not shown).

In the first embodiment, the processing unit 20 is a cutting unit equipped with a spindle 22 to which a cutting blade 21 is attached at its tip, as shown in FIG. 1. The cutting blade 21 attached to the tip of the spindle 22 is rotated around an axis parallel to the Y-axis direction, which is another horizontal direction and perpendicular to the X-axis direction, by the rotation of the spindle 22, to cut the workpiece 100 held on the chuck table 10. The processing unit 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving unit 32 of the moving unit 30 relative to the workpiece 100 held on the chuck table 10, and is also provided so as to be movable in the Z-axis direction (up and down direction) by the Z-axis moving unit 33 of the moving unit 30. As shown in FIG. 1, the processing device 1 is provided with two processing units 20 (cutting units), that is, a two-spindle dicer, a so-called facing dual type cutting device.

In the first embodiment, the machining unit 20 includes a blade cover 25. The blade cover 25 is attached to the tip side of the spindle housing that rotatably supports the spindle 22, and covers the upper, front, and rear of the cutting blade 21 attached to the tip of the spindle 22. The blade cover 25 has multiple water channels formed therein. The water channel formed inside the blade cover 25 has the other upper end connected to a cutting water supply source (not shown) and one lower end connected to a processing water supply nozzle that supplies processing water (cutting water) toward the processing point. The processing water (cutting water) that the cutting water supply source supplies to the processing point through the water channel inside the blade cover 25 and the processing water supply nozzle is, for example, pure water.

The moving unit 30 includes an X-axis moving unit 31, a Y-axis moving unit 32, and a Z-axis moving unit 33. The X-axis moving unit 31 moves the chuck table 10 along the X-axis direction relative to the processing unit 20. The Y-axis moving unit 32 and the Z-axis moving unit 33 move the processing unit 20 along the Y-axis direction and the Z-axis direction, respectively, relative to the chuck table 10.

The X-axis moving unit 31, the Y-axis moving unit 32 and the Z-axis moving unit 33 are each provided with an X-axis position detection unit (not shown) that detects the position of the chuck table 10 in the X-axis direction, a Y-axis position detection unit (not shown) that detects the position of the processing unit 20 in the Y-axis direction, and a Z-axis position detection unit that detects the position of the processing unit 20 in the Z-axis direction. The X-axis position detection unit, the Y-axis position detection unit and the Z-axis position detection unit each output the detected positions to the control unit 80. The X-axis position detection unit, the Y-axis position detection unit and the Z-axis position detection unit can each be configured with a linear scale parallel to the X-axis direction, the Y-axis direction or the Z-axis direction, and a reading head that is movable in the X-axis direction, the Y-axis direction and the Z-axis direction by the X-axis moving unit 31, the Y-axis moving unit 32 and the Z-axis moving unit 33, respectively, and that reads the graduations of the linear scale. In addition, in the present invention, the X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit are not limited to a configuration having a linear scale and a read head, and may be encoders installed on the motors of the X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit, respectively.

The processing device 1 uses the X-axis movement unit 31, the Y-axis movement unit 32, and the Z-axis movement unit 33 to set the cutting blade 21 at a predetermined position relative to the workpiece 100 held on the chuck table 10, and while supplying processing water, rotates and moves the cutting blade 21 relatively along the planned division line 102, so that the cutting blade 21 cuts the workpiece 100 along the planned division line 102 and forms processing marks 110 along the planned division line 102. In the first embodiment, the processing marks 110 are cutting grooves.

As shown in FIG. 2, the camera 40 photographs the workpiece 100 held on the chuck table 10. In the first embodiment, the camera 40 is fixed to the processing unit 20 so as to move integrally with the processing unit 20 as shown in FIG. 1. The camera 40 is moved along the Z-axis direction together with the processing unit 20 by the Z-axis moving unit 33, and the height of the camera 40 is adjusted to a distance at which the camera 40 focuses on the photographing area on the surface 101 side of the workpiece 100 held by the chuck table 10.

3, the camera 40 includes an illumination (light source) 41, an illumination (light source) 42, a half mirror 43, an objective lens 44, an image sensor 45, and an air blow nozzle 46. The camera 40 captures the image of the surface 101 side of the workpiece 100 using an epi-illumination 48 formed by the illumination 41, the half mirror 43, and the objective lens 44, which irradiates light along the Z-axis direction toward the image of the surface 101 side of the workpiece 100, and an oblique illumination 49 formed by the illumination 42, which irradiates light from a direction inclined with respect to the Z-axis direction toward the image of the surface 101 side of the workpiece 100.

As shown in FIG. 3, the incident illumination 48 is formed by light supplied from an illumination 41 arranged on the side of the lens barrel of the camera 40 being guided into the lens barrel from the side, being reflected downward by a half mirror 43 arranged inside the lens barrel and on the side of the illumination 41, being focused by an objective lens 44 arranged below the half mirror 43 inside the lens barrel, passing through a cover member 47 that protects the inside of the lens barrel and is arranged at the bottom end of the lens barrel below the objective lens 44, and being guided along the Z-axis direction toward the shooting area on the surface 101 side of the workpiece 100 held by the chuck table 10 below the cover member 47.

As shown in FIG. 3, the oblique light illumination 49 is formed by guiding a ring-shaped light emitted from a ring-shaped illumination 42 arranged on the outer periphery of the cover member 47 at the same height as the cover member 47, toward the shooting area on the surface 101 side of the workpiece 100 in a direction inclined with respect to the Z-axis direction.

The formed incident light 48 and oblique light 49 reflect the photographing area on the surface 101 side of the workpiece 100 to form reflected light, which passes through the objective lens 44 and the half mirror 43 and is guided to the image sensor 45 above. The image sensor 45 receives the reflected light from the photographing area on the surface 101 side of the workpiece 100, photographs the photographing area on the surface 101 side of the workpiece 100, and obtains an image. The image sensor 45 is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor.

As shown in FIG. 3, the air blow nozzle 46 is disposed on the outer periphery of the cover member 47, with its tip facing the center of the cover member 47. An air supply source (not shown) is connected to the base end of the air blow nozzle 46. The air blow nozzle 46 sprays air supplied from the air supply source from its tip toward the imaging area on the surface 101 side of the workpiece 100 held by the chuck table 10, performing air blowing to blow off and remove any adhering processing water.

The camera 40 is electrically connected to the inspection section 50 and the control unit 80 so as to be able to communicate information. Under the control of the control unit 80, the camera 40 photographs the planned division line 102 of the workpiece 100 before machining held by the chuck table 10, obtains images for performing alignment to align the workpiece 100 with the cutting blade 21 of the machining unit 20, and outputs the obtained images to the control unit 80. Under the control of the inspection section 50, the camera 40 photographs the planned division line 102 and machining marks 110 of the workpiece 100 after machining held by the chuck table 10, obtains images for automatically inspecting the state of the machining marks 110 with a predetermined inspection item, so-called kerf check, and outputs the obtained images to the inspection section 50. Here, kerf checking means detecting the machining mark 110 based on an image of the machining mark 110, and detecting chipping associated with the machining mark 110, meandering of the machining mark 110, and deviation between the position of the machining mark 110 and the position to be machined.

Figure 4 is a diagram showing the inspection conditions 200 of the processing device 1 of Figure 1. Based on the inspection conditions 200 shown in Figure 4, the inspection unit 50 acquires an image of the processing mark 110 for performing a kerf check with the camera 40, detects the processing mark 110 formed by the processing unit 20 from the acquired image of the processing mark 110, and inspects the state of the processing mark 110 with a predetermined inspection item. In this way, the inspection conditions 200 are the shooting conditions when the inspection unit 50 captures the image of the processing mark 110 with the camera 40. The inspection unit 50 can adjust the inspection conditions 200 (shooting conditions). That is, the inspection unit 50 can acquire information on the light intensity of the illuminations 41, 42 (epi-illumination 48 and oblique illumination 49) of the camera 40 and adjust the light intensity. In addition, the inspection unit 50 can acquire the flow rate of air ejected from the tip of the air blow nozzle 46 of the camera 40 and the length of time for which air is ejected (air blow length), and adjust these. The inspection unit 50 can obtain the height of the objective lens 44 of the camera 40 relative to the holding surface 11 of the chuck table 10 from the Z-axis movement unit 33, and adjust the height of the camera 40 to a distance (height) at which the focus of the camera 40 is on the object to be photographed (workpiece 100). Hereinafter, the distance (height) at which the focus of the camera 40 is on the workpiece will be referred to as the distance of the camera 40 from the workpiece 100.

In the inspection section 50, a skilled operator of the processing device 1 sets in advance inspection conditions 200 (photographing conditions) under which the processing marks 110 can be clearly detected, and performs a kerf check by photographing the surface 101 of the workpiece 100 with the camera 40 under the inspection conditions 200. The inspection section 50 registers in the control unit 80 an image of the processing marks 110 that passes all of the predetermined inspection items (kerf check inspection items) inspected in the kerf check as a sample image 322 (for example, as shown in FIG. 7). The inspection section 50 then performs a kerf check in which the processing marks 110 are photographed and inspected under the registered inspection conditions 200, and if any of the kerf check inspection items are failed, it temporarily determines that the contrast of the image of the processing marks 110 is unclear, and causes the control unit 80 to display on the display 70 a sample image that has been registered in advance for comparison with the image of the processing marks 110. The operator compares the image of the processing marks 110 displayed on the display 70 with the sample image, and if it is determined that the inspection conditions 200 (photography conditions) are inappropriate due to factors such as deterioration of lighting rather than simply a processing defect, the operator adjusts the inspection conditions 200. If a processing defect has actually occurred, the operator stops processing or modifies the processing conditions.

The specified inspection items inspected by the inspection unit 50 in the kerf check are, for example, kerf width, Max chipping size, cut position deviation, etc. The kerf width is the distance (spacing) in the width direction of the processing mark 110 between both ends of the processing mark 110 in the area of the image checked in the kerf check. The Max chipping size is the maximum chipping size in the width direction of the processing mark 110 in the area of the image checked in the kerf check. The cut position deviation is the deviation in the width direction (distance, spacing) between the position where the processing mark 110 is actually formed by processing and the position where the processing mark 110 should be formed, for example, the deviation in the width direction from the center of the planned division line 102 at the center of the width direction of the processing mark 110. The inspection unit 50 evaluates the product as pass if it is within the range of the tolerance preset for each of these specified inspection items, and as fail (result error) if it is outside the range of the tolerance.

The recording unit 60 records the inspection conditions 200 when the inspection unit 50 photographs the machining marks 110 with the camera 40 for each machining condition that forms the machining marks 110. That is, the recording unit 60 records the inspection conditions 200 when the inspection unit 50 photographs the machining marks 110 with the camera 40, linked to the machining conditions of the workpiece 100 stored in the corresponding control unit 80. Here, the machining conditions that form the machining marks 110 in the first embodiment include, for example, the shape of the workpiece 100 (whether it is circular or rectangular, etc.), the outer diameter of the workpiece 100, the thickness of the workpiece 100, the machining feed rate that is the movement speed of the chuck table 10 during machining, the cutting depth that is the height of the lower end of the cutting edge of the cutting blade 21 from the holding surface 11 of the chuck table 10 during machining, and the index amount that indicates the distance between adjacent planned division lines 102. In the present invention, the inspection conditions 200 include at least the light intensity of the illumination 41, 42 (epi-illumination 48 and oblique illumination 49) of the camera 40, and in the first embodiment, as shown in FIG. 4, further include the air blow conditions by the air blow nozzle 46 and the distance of the camera 40 from the workpiece 100.

In the example of the inspection condition 200 shown in FIG. 4, the light intensity of the lighting 41, 42 (incident lighting 48 and oblique lighting 49) is specified as an output ratio when the maximum output is 100% for each of the lighting 41, 42 (incident lighting 48 and oblique lighting 49). In the example of the inspection condition 200 shown in FIG. 4, the air blow condition by the air blow nozzle 46 is specified as the air flow rate and the air blow length. In the example of the inspection condition 200 shown in FIG. 4, the distance of the camera 40 from the workpiece 100 is specified as a height value to be added to the thickness of the workpiece 100 based on the holding surface 11 of the chuck table 10. Note that these items of the inspection condition 200 are not limited to this in the present invention and may be specified in a different form.

The display 70 is provided on an exterior cover (not shown) of the processing device 1 with the display surface facing outward, and displays a screen for setting the processing conditions of the processing device 1, an image of the processing marks 110, a screen showing the processing results such as kerf checks, etc., so that the operator can see them. The display 70 is composed of a liquid crystal display device or the like. The display 70 is provided with an input unit 71 that the operator uses to input the processing conditions and inspection conditions 200 of the processing device 1, command information related to the display of images and the screen, etc. The input unit 71 provided on the display 70 is composed of at least one of a touch panel provided on the display 70, a keyboard, etc.

The control unit 80 controls the operation of each component of the processing device 1, and causes the processing device 1 to perform processing by the processing unit 20, kerf checking using the camera 40, and the like. The control unit 80 stores the processing conditions of the workpiece 100 and sample images 322 of the processing marks 110 that are appropriately photographed so that the processing marks 110 are normally detected for each processing condition.

In this embodiment, the control unit 80 includes an inspection unit 50 and a recording unit 60. In embodiment 1, the control unit 80 includes a computer system. The computer system included in the control unit 80 includes an arithmetic processing unit having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input/output interface device. In embodiment 1, the function of the inspection unit 50 is realized by the storage device of the computer system storing the width of the processing mark 110 and the shapes of both ends in the width direction required for the processing of the inspection unit 50, and the arithmetic processing device of the computer system executing a computer program stored in the storage device of the computer system. In embodiment 1, the function of the recording unit 60 is realized by the storage device of the computer system recording the inspection conditions 200 for each processing condition. In the first embodiment, the function of the control unit 80 is realized by the storage device of the computer system storing information necessary for the processing of the control unit 80, such as the processing conditions of the workpiece 100 and a sample image 322 of the processing marks 110, and the arithmetic processing device of the computer system performing arithmetic processing according to a computer program stored in the storage device of the computer system, and outputting control signals for controlling the processing device 1 to each component of the processing device 1 via the input/output interface device of the processing device 1.

As shown in FIG. 1, the processing device 1 further includes a cassette placement section 91, a cleaning unit 92, and a transport unit (not shown). The cassette placement section 91 is a placement table on which a cassette 95, which is a container for storing multiple workpieces 100, is placed, and the cassette 95 placed thereon is raised and lowered in the Z-axis direction. The cleaning unit 92 cleans the workpiece 100 after processing by the processing unit 20, and removes foreign matter such as processing debris adhering to the workpiece 100. The transport unit (not shown) transports the workpiece 100 before processing from the cassette 95 onto the chuck table 10, transports the workpiece 100 after processing from the chuck table 10 to the cleaning unit 92, and transports the workpiece 100 after cleaning from the cleaning unit 92 into the cassette 95.

Next, this specification describes an example of the operation process when the processing device 1 according to the first embodiment performs a kerf check on the processing mark 110. FIGS. 5 to 8 are all diagrams showing the display screen of the processing device 1 in FIG. 1. FIG. 5 shows the display screen in a first example of the operation process, and FIGS. 6 to 8 show the display screen in a second example of the operation process.

In the first example, the inspection unit 50 of the processing device 1 refers to the inspection conditions 200 in the recording unit 60, sets the light intensity of the incident light illumination 48 and the oblique light illumination 49 to 80% and 0%, respectively, and captures an inspection image 302 (see FIG. 5) that is an image of the processing mark 110 under air blow conditions and distances from the workpiece 100 based on the inspection conditions 200 (neither of which are shown in the figure), performs a kerf check on the inspection image 302, obtains a kerf check result 304 (see FIG. 5), determines whether the contrast is clear or unclear from the result 304, obtains a contrast determination result 305 (see FIG. 5), and outputs this information to the control unit 80. The control unit 80 of the processing device 1 obtains this information from the inspection unit 50, and displays a screen 301 on the display 70 showing the inspection image 302, the inspection conditions 200, the kerf check result 304, the contrast determination result 305, and buttons 306 and 307, as shown in FIG. 5, for example.

In the first example, the screen 301 shows that the inspection image 302 is taken based on the inspection conditions 200, the kerf check result 304 is obtained based on the inspection image 302, and the contrast of the inspection image 302 is determined to be clear, as shown in the judgment result 305 as "OK". In this way, when the control unit 80 judges that the contrast of the inspection image 302 taken by the inspection section 50 is clear, the control unit 80 records the inspection image 302 as a sample image 322 (see FIG. 7) in association with the processing conditions of the workpiece 100 on which the processing mark 110 is formed. Note that, in the example shown in FIG. 5, the screen 301 shows only the light intensity of the epi-illumination 48 and oblique illumination 49 as the inspection conditions 200, but the present invention is not limited to this, and the air blow conditions and the distance from the workpiece 100 may also be displayed.

In the second example, the inspection unit 50 of the processing device 1 refers to the same inspection conditions 200 of the recording unit 60 as in the first example, and captures an inspection image 312, which is an image of a processing mark 110 different from that in the first example, with the light intensity of the epi-illumination 48 and oblique illumination 49 set to 80% and 0%, respectively, as in the first example. In the second example, the processing conditions of the workpiece 100 on which the processing mark 110 is formed are also the same as in the first example. In the second example, although the inspection unit 50 refers to the same inspection conditions 200 as in the first example, it obtains a kerf check result 314 (see FIG. 6) instead of the kerf check result 304, and a contrast judgment result 315 (see FIG. 6) instead of the contrast judgment result 305 from the result 314. In the second example, the control unit 80 displays on the display 70 a screen 311 showing an inspection image 312, inspection conditions 200, kerf check results 314, contrast judgment results 315, and buttons 306 and 307, as shown in FIG. 6, for example.

In the second example, the screen 311 shows that the inspection image 312 is taken based on the inspection conditions 200, the kerf check result 314 is obtained based on the inspection image 312, and the contrast of the inspection image 312 is determined to be unclear as indicated by the judgment result 315 "NG". In this way, when the control unit 80 judges that the contrast of the inspection image 312 taken by the inspection section 50 is unclear, it displays on the display 70 an examination screen 321 that simultaneously shows the inspection image 312 and a sample image 322 that is linked to the processing conditions of the workpiece 100 used when the detected processing mark 110 was formed, as shown in FIG. 7, for example. In the second example of the first embodiment, the control unit 80 switches the screen 311 displayed on the display 70 to the examination screen 321 when the operator or the like selects the button 306 labeled "Sample Image Display" on the screen 311.

The examination screen 321 shows the inspection image 312 and the sample image 322, which are determined to have unclear contrast, side by side, and also shows the inspection conditions 200, 323, the kerf check results 314, 324, and the contrast determination results 315, 325 side by side below the inspection image 312 and the sample image 322. The examination screen 321 also shows buttons 306 and 307 similar to those in the screen 311. Therefore, the examination screen 321 allows the operator to compare and examine the differences between the inspection image 312 and the sample image 322, and the differences between the inspection conditions 200 and the inspection conditions 323, such as the state of the illuminations 41, 42 (epi-illumination 48 and oblique illumination 49). The examination screen 321 thus encourages the operator to appropriately examine which items of the inspection conditions 200 should be changed and modified in order to reproduce the capture of an image of the processing marks 110 with the same contrast as the sample image 322.

As shown in the example of FIG. 7, when there is no difference between the inspection conditions 200 and the inspection conditions 323 but there is a clear difference between the inspection image 312 and the sample image 322, it is highly likely that the difference is due to deterioration of each component constituting the inspection conditions 200, for example, the lighting 41, 42. In this way, the processing device 1 according to the first embodiment can prompt the operator to take appropriate measures using the review screen 321, even if the operator sets the inspection conditions 200 incorrectly and the components constituting the inspection conditions 200, such as the lighting 41, 42 of the camera 40, deteriorate. Similarly, when the inspection conditions 200 are changed after the inspection conditions 200 are set and used as they are, the processing device 1 according to the first embodiment can display the image acquired under the inspection conditions 200 before the change side by side with the sample image 322 and the inspection image at the time of the failure, so that the effect of the changed inspection conditions 200 on the shooting results can be clearly presented to the operator, which serves as a reference when setting the inspection conditions 200, and the inspection conditions 200 can be optimized.

When the control unit 80 determines that the contrast of the inspection image 312 captured by the inspection section 50 is unclear, the control unit 80 may display on the display 70 an inspection result screen 331 showing the inspection image 312 and a graph 336 of the time series change in the results of past kerf checks side by side, as shown in FIG. 8, for example. In a second example of the first embodiment, the control unit 80 switches the screen 311 displayed on the display 70 to the inspection result screen 331 when the operator or the like selects a button 307 labeled "Inspection Results" on the screen 311.

Graph 336 displayed on inspection result screen 331 shows the time series changes in the inspection items of the kerf check obtained from inspection images 302 and 312, and in the second example of embodiment 1, shows the time series changes of the kerf width and the maximum chipping size. Note that in the second example of embodiment 1, inspection image 312 is photographed with the machining marks 110 and the TEG at the same brightness, so the part corresponding to the TEG is mistakenly recognized as the machining marks 110 and chipping, and as a result, the maximum chipping size of kerf check result 314 is 0.020 mm/0.010 mm, which is abnormally large compared to the maximum chipping size of 0.005 mm/0.010 mm of the kerf check results 304 and 324 of inspection image 302.

The test result screen 331 shows the test image 312 in which the contrast was determined to be unclear and the graph 336 side by side, and below the test image 312, the test conditions 200, the kerf check result 314, and the contrast determination result 315. The test result screen 331 also shows buttons 306 and 307 similar to those of the screen 311 and the review screen 321. For this reason, the test result screen 331 prompts the operator to recognize, for example, how long ago an abnormal kerf check test item in the kerf check result 314 has been abnormal in the graph 336, and thereby prompts the operator to recognize how long ago the test conditions 200 became abnormal such that the contrast determination result 315 is determined to be unclear. In the example of the test result screen 331 shown in FIG. 8, the Max chipping size in the graph 336 changes to a nearly constant value, so it can be recognized that the Max chipping size was abnormal during the display period of this graph 336, and that the test conditions 200 may have been such that this abnormality in the Max chipping size was induced.

In the processing device 1 according to the first embodiment having the above configuration, the control unit 80 records the image (inspection image 302) of the processing mark 110 when the inspection unit 50 normally detects the processing mark 110 as the sample image 322, and when the inspection unit 50 cannot normally detect the processing mark 110, the control unit 80 simultaneously displays the image (inspection image 312) of the processing mark 110 and the sample image 322 on the display 70. Therefore, the processing device 1 according to the first embodiment allows the operator to visually recognize the sample image 322 of the processing mark 110 that is appropriate for normally detecting the processing mark 110, so that even an operator with little experience in kerf checking can easily reproduce the shooting conditions (inspection conditions) of the image of the processing mark 110 that is appropriate for normally detecting the processing mark 110, thereby achieving the effect of suppressing frequent failure evaluations of the inspection items of the kerf check due to inappropriate shooting conditions (inspection conditions) and frequent stoppage of processing of the workpiece 100 associated therewith.

In the processing device 1 according to the first embodiment, the inspection conditions 200 (photographing conditions) when the inspection unit 50 photographs the image of the processing mark 110 include the light intensity of the incident illumination 48 and the oblique illumination 49, as well as the air blowing conditions by the air blow nozzle 46 and the distance of the camera 40 from the workpiece 100. Therefore, the processing device 1 according to the first embodiment can appropriately suppress not only the case where an inappropriate image of the processing mark 110 is photographed due to the light intensity of the incident illumination 48 and the oblique illumination 49 and the processing mark 110 cannot be detected normally, but also the case where an inappropriate image of the processing mark 110 is photographed due to processing water adhering to the photographing area on the surface 101 side of the workpiece 100 held by the chuck table 10 due to the air blowing conditions and the processing mark 110 cannot be detected normally, or the case where an inappropriate image of the processing mark 110 is photographed due to the focus (focus) of the camera 40 being shifted due to the distance from the workpiece 100 and the processing mark 110 cannot be detected normally.

[Embodiment 2]
A processing device 1-2 according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 9 is a perspective view showing a configuration example of a processing device 1-2 according to the second embodiment. In Fig. 9, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 9, the processing device 1-2 of the second embodiment is the processing device 1 of the first embodiment, in which the processing unit 20 is changed to a processing unit 20-2, and the layout and functions of the other components are changed accordingly.

In the second embodiment, as shown in FIG. 9, the processing unit 20-2 is a laser beam application unit that applies a laser beam to the workpiece 100 held on the chuck table 10 and laser processes the workpiece 100 with the laser beam. The processing unit 20-2 applies a laser beam with a wavelength that is absorbed by the workpiece 100, and performs so-called ablation processing in which the workpiece 100 is ablated (sublimated or evaporated) with the laser beam.

In the second embodiment, the chuck table 10 is provided above the X-axis moving unit 31 and the Y-axis moving unit 32 with the holding surface 11 facing upward, so that it can be moved in the X-axis and Y-axis directions by the X-axis moving unit 31 and the Y-axis moving unit 32, respectively. In the second embodiment, the processing unit 20-2 is provided fixedly within the processing device 1-2. In the second embodiment, the moving unit 30 omits the Z-axis moving unit 33.

The processing device 1-2 uses the X-axis movement unit 31 and the Y-axis movement unit 32 to move the workpiece 100 along the planned division line 102 relative to the processing unit 20-2 while irradiating the laser beam with the processing unit 20-2, thereby laser processing the workpiece 100 along the planned division line 102 with the laser beam and forming processing marks 110 along the planned division line 102. In the second embodiment, the processing marks 110 are laser processing marks.

In the second embodiment, the camera 40 adjusts the distance from the workpiece 100 to the shooting area on the surface 101 side of the workpiece 100 held by the chuck table 10 by a mechanism (not shown) different from that in the first embodiment. The camera 40 is provided with an air blow nozzle 46 similar to that in the first embodiment in order to remove processing chips (debris) of the workpiece 100 generated during laser processing. In the second embodiment, the camera 40 has the same configuration and functions as the first embodiment, such as the epi-illumination 48 and oblique illumination 49.

In the second embodiment, the processing conditions for forming the processing marks 110 are changed to include the wavelength and focal height of the laser beam during processing instead of the cutting depth in the first embodiment. The operation process when the processing device 1-2 in the second embodiment performs a kerf check on the processing marks 110 is the same as in the first embodiment.

The processing device 1-2 according to the second embodiment having the above-mentioned configuration is the same as the first embodiment, since the processing unit 20, which is a cutting unit in the first embodiment, is changed to a processing unit 20-2, which is a laser beam application unit that applies a laser beam, and the processing marks 110 are changed from cutting grooves to laser processing marks.

The present invention is not limited to the above embodiment. In other words, various modifications can be made without departing from the gist of the present invention. For example, the laser beam may have a wavelength that is transparent to the workpiece, in which case the modified layer formed inside the workpiece is the inspection target for the kerf check. In addition, multiple sample images may be registered for one processing condition, and the multiple sample images may be displayed on the review screen, or a sample image selected from the multiple sample images may be displayed.

REFERENCE SIGNS LIST 1, 1-2 Machining device 10 Chuck table 20, 20-2 Machining unit 21 Cutting blade 22 Spindle 40 Camera 41, 42 Lighting 46 Air blow nozzle 48 Incident lighting 49 Oblique lighting 50 Inspection section 60 Recording section 70 Display 80 Control unit 100 Workpiece 102 Planned division line 200, 323 Inspection conditions 302, 312 Inspection image 321 Examination screen 322 Sample image

Claims (4)

A processing apparatus including a chuck table for holding a workpiece having a plurality of planned dividing lines, and a processing unit for processing the workpiece held on the chuck table along the planned dividing lines,
A camera equipped with lighting for photographing the workpiece held on the chuck table;
an inspection unit that detects processing marks formed by the processing unit from an image of the division line and inspects the state of the processing marks by predetermined inspection items;
a recording unit that records the inspection conditions of the inspection unit, including the light intensity of the illumination, for each processing condition that forms the processing mark when the processing mark is photographed;
A display and
A control unit for controlling each of the components,
The control unit
When the inspection unit determines that the contrast of the image captured at the set light intensity is clear, the inspection unit records the image as a sample image in association with the processing conditions of the workpiece;
When the inspection unit determines that the contrast of the image captured with the set light intensity is unclear, the processing device displays on the display the image determined to be unclear and the sample image recorded in association with the processing conditions, and displays an examination screen on which the lighting conditions can be compared and examined. The inspection conditions of the inspection unit further include air blow conditions by an air blow nozzle provided below the camera when photographing the processing marks,
2. The processing device according to claim 1, wherein the inspection unit captures the image under the set light intensity and air blowing conditions. The inspection conditions of the inspection unit further include a distance of the camera from the workpiece when photographing the processing mark,
2. The processing apparatus according to claim 1, wherein the inspection unit captures the image at a set light intensity and at a set distance from the workpiece. The processing device according to claim 1, wherein the processing unit is a cutting unit in which a cutting blade is attached to a spindle, or a laser beam application unit that applies a laser beam, and the processing marks are cutting grooves or laser processing marks.

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