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JP7705240B2 - Holding method and holding device - Google Patents
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JP7705240B2 - Holding method and holding device - Google Patents

Holding method and holding device Download PDF

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JP7705240B2
JP7705240B2 JP2020203672A JP2020203672A JP7705240B2 JP 7705240 B2 JP7705240 B2 JP 7705240B2 JP 2020203672 A JP2020203672 A JP 2020203672A JP 2020203672 A JP2020203672 A JP 2020203672A JP 7705240 B2 JP7705240 B2 JP 7705240B2
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fluid
held
holding
support surface
hardening
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JP2022091010A (en
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忠知 山田
利彰 毛受
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Lintec Corp
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Lintec Corp
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Priority to JP2020203672A priority Critical patent/JP7705240B2/en
Priority to KR1020210156884A priority patent/KR102936768B1/en
Priority to TW110143507A priority patent/TWI899386B/en
Priority to CN202111489668.3A priority patent/CN114628284A/en
Publication of JP2022091010A publication Critical patent/JP2022091010A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0442Apparatus for placing on an insulating substrate, e.g. tape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10Arrangements for cooling or lubricating tools or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/12Arrangements for cooling or lubricating parts of the machine
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)

Description

本発明は、保持方法および保持装置に関する。 The present invention relates to a holding method and a holding device.

保持対象物を支持面で保持する保持方法が知られている(例えば、特許文献1参照)。 A holding method is known in which an object is held on a support surface (see, for example, Patent Document 1).

特開2011-096929号公報JP 2011-096929 A

特許文献1に記載された半導体素子の製造方法(保持方法)では、仮載置台3の上面(支持面)に供給された液体50(流体)を、支持面側から凍結させる(硬化させる)冷却処理(硬化処理)を行い、半導体素子チップ1A(保持対象物)を支持面で保持するため、仮載置台3のような支持面を有する部材ごと硬化処理を施さなければならず、エネルギーの無駄な消費を引き起こすという不都合がある。 In the semiconductor element manufacturing method (holding method) described in Patent Document 1, a cooling process (hardening process) is performed in which liquid 50 (fluid) supplied to the upper surface (support surface) of the temporary mounting table 3 is frozen (hardened) from the support surface side, and the semiconductor element chip 1A (object to be held) is held on the support surface. Therefore, the hardening process must be performed on the entire member having a support surface, such as the temporary mounting table 3, which has the disadvantage of causing unnecessary energy consumption.

本発明の目的は、エネルギーの無駄な消費を極力低減することができる保持方法および保持装置を提供することにある。 The object of the present invention is to provide a holding method and device that can minimize the waste of energy.

本発明は、請求項に記載した構成を採用した。 The present invention employs the configuration described in the claims.

本発明によれば、流体を介して支持面に支持された保持対象物側から当該流体に硬化処理を施すので、支持面を有する部材ごと硬化処理を施さなくてもよく、エネルギーの無駄な消費を極力低減することができる。
また、流体前処理工程を実施しておけば、保持対象物を支持面で支持した後の流体硬化時間を短縮することができる。
According to the present invention, the hardening treatment is applied to the fluid from the side of the object to be held that is supported on the support surface via the fluid, so that it is not necessary to apply the hardening treatment to the entire member having the support surface, and it is possible to minimize wasteful consumption of energy.
Furthermore, if the fluid pretreatment step is carried out, the fluid hardening time after the object to be held is supported on the support surface can be shortened.

本発明の一実施形態に係る保持装置の説明図。FIG. 2 is an explanatory diagram of a holding device according to an embodiment of the present invention.

以下、本発明の一実施形態を図面に基づいて説明する。
なお、本実施形態におけるX軸、Y軸、Z軸は、それぞれが直交する関係にあり、X軸およびY軸は、所定平面内の軸とし、Z軸は、前記所定平面に直交する軸とする。さらに、本実施形態では、Y軸と平行な図1の手前方向から観た場合を基準とし、方向を示した場合、「上」がZ軸の矢印方向で「下」がその逆方向、「左」がX軸の矢印方向で「右」がその逆方向、「前」がY軸の矢印方向で「後」がその逆方向とする。
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X-axis, Y-axis, and Z-axis are mutually orthogonal, the X-axis and Y-axis are axes within a specified plane, and the Z-axis is an axis orthogonal to the specified plane. Furthermore, in this embodiment, the view from the front direction of Fig. 1 parallel to the Y-axis is used as a reference, and when indicating directions, "up" is the direction of the Z-axis arrow, "down" is the opposite direction, "left" is the direction of the X-axis arrow, "right" is the opposite direction, "front" is the direction of the Y-axis arrow, and "rear" is the opposite direction.

本発明の保持装置EAは、保持対象物WKの一方の面WK1側から当該保持対象物WKを支持面12Aで支持する支持手段10と、支持面12Aに流体としての水WTを供給する流体供給手段20と、水WTを硬化すなわち凍結させる硬化処理としての冷却処理を施して当該水WTを凍結させ、保持対象物WKを支持面12Aで保持する硬化手段30とを備えている。
なお、保持対象物WKは、母材WKBから形成されるものであり、当該母材WKB(保持対象物WK)には、他方の面WK2に接着シートASが貼付されて、一体物UPを形成している。
本実施形態の場合、保持装置EAは、保持対象物WKから接着シートASを剥離する剥離手段40と、接着シートASに張力を付与し、当該母材WKBから所定の間隔を空けて複数の保持対象物WKを形成する離間手段50との近傍に配置されている。
The holding device EA of the present invention comprises a support means 10 that supports the object to be held WK on one side WK1 of the object to be held WK with a support surface 12A, a fluid supply means 20 that supplies water WT as a fluid to the support surface 12A, and a hardening means 30 that applies a cooling treatment as a hardening treatment to harden, i.e., freeze, the water WT, thereby freezing the water WT and holding the object to be held WK on the support surface 12A.
The object to be held WK is formed from a base material WKB, and an adhesive sheet AS is attached to the other surface WK2 of the base material WKB (object to be held WK) to form an integrated object UP.
In this embodiment, the holding device EA is positioned near a peeling means 40 that peels off the adhesive sheet AS from the holding object WK, and a spacing means 50 that applies tension to the adhesive sheet AS and forms multiple holding objects WK at a predetermined interval from the base material WKB.

支持手段10は、駆動機器としての直動モータ11と、直動モータ11の出力軸11Aに支持され、支持面12Aを有する支持部材としてのテーブル12とを備えている。
テーブル12は、上面に設けられた凹部12Bと連通する流路12Cと、凹部12B内に配置され、その上面が支持面12Aとされた樹脂や金属等で構成された多孔質部材12Dとを備えている。
支持面12Aには、図1(A)中AAを付した図に示すように、疎水性を有する疎水部12Eが格子状に形成され、当該疎水部12Eによって親水部12Fが区画されている。疎水部12Eには、支持面12Aに格子状に形成された溝の内面に、樹脂や金属等の撥水性を有する部材が配置され、親水部12Fには、粗面加工やブラスト加工等の粗面処理によって、粗い面となる粗面処理が施されている。
The support means 10 includes a linear motor 11 as a driving device, and a table 12 as a support member supported by an output shaft 11A of the linear motor 11 and having a support surface 12A.
The table 12 has a flow path 12C that communicates with a recess 12B provided on the upper surface, and a porous member 12D that is arranged within the recess 12B and has an upper surface that serves as a support surface 12A and is made of resin, metal, etc.
As shown in the drawing marked with AA in Fig. 1(A) , hydrophobic portions 12E having hydrophobic properties are formed in a lattice pattern on the support surface 12A, and hydrophilic portions 12F are partitioned by the hydrophobic portions 12E. In the hydrophobic portions 12E, a water-repellent material such as resin or metal is disposed on the inner surface of grooves formed in a lattice pattern on the support surface 12A, and the hydrophilic portions 12F are subjected to a roughening treatment such as a roughening process or a blasting process to form a rough surface.

流体供給手段20は、水WTを収容するタンク21と、加圧ポンプやタービン等の加圧手段22と、減圧ポンプや真空エジェクタ等の減圧手段23と、タンク21に対する加圧手段22および減圧手段23の連通状態を切り替える切替弁24と、配管25Aを介して流路12Cに接続されるとともに、タンク21に接続された加圧側配管21Aおよび減圧側配管21Bの連通状態を切り替える切替弁25とを備えている。 The fluid supply means 20 includes a tank 21 that stores water WT, a pressurizing means 22 such as a pressurizing pump or a turbine, a decompression means 23 such as a decompression pump or a vacuum ejector, a switching valve 24 that switches the communication state of the pressurizing means 22 and the decompression means 23 with respect to the tank 21, and a switching valve 25 that is connected to the flow path 12C via piping 25A and switches the communication state of the pressurized side piping 21A and the decompressed side piping 21B that are connected to the tank 21.

硬化手段30は、複数のアームによって構成され、その作業範囲内において、作業部である先端アーム31Aで支持したものを何れの位置、何れの角度にでも変位可能な駆動機器としての所謂多関節ロボット31と、先端アーム31Aに支持された支持プレート32と、支持プレート32に形成された貫通孔32Aに挿通され、上端側にフランジ部33Aが設けられた複数のガイド部材33と、ガイド部材33の下端側に支持され、ペルチェ素子やヒートパイプの冷却側等の図示しない冷却手段によって冷却処理が可能な冷却プレート34と、冷却プレート34を支持プレート32から離間する方向に付勢する付勢手段としての複数のばね35とを備え、水WTを介して支持面12Aに支持された保持対象物WK側から当該水WTに冷却処理を施す構成となっている。 The hardening means 30 is composed of multiple arms, and is equipped with a so-called articulated robot 31 as a driving device that can displace what is supported by the tip arm 31A, which is the working part, to any position and any angle within its working range, a support plate 32 supported by the tip arm 31A, multiple guide members 33 that are inserted into through holes 32A formed in the support plate 32 and have flanges 33A on their upper ends, a cooling plate 34 that is supported on the lower end of the guide member 33 and can be cooled by cooling means (not shown), such as a Peltier element or the cooling side of a heat pipe, and multiple springs 35 as biasing means that bias the cooling plate 34 in a direction away from the support plate 32, and is configured to perform a cooling process on the water WT from the side of the held object WK supported on the support surface 12A via the water WT.

剥離手段40は、直動モータ11を備え、当該直動モータ11を支持手段10と兼用する構成となっている。 The peeling means 40 is equipped with a linear motor 11, which also serves as the support means 10.

離間手段50は、駆動機器としての複数の直動モータ51と、各直動モータ51の出力軸51Aにそれぞれ支持され、一対の把持部材52Aを有する保持手段であって駆動機器としてのチャックシリンダ52とを備えている。 The separation means 50 includes a plurality of linear motors 51 as driving devices, and a chuck cylinder 52 as a holding means having a pair of gripping members 52A, each supported by the output shaft 51A of each linear motor 51.

以上の保持装置EAの動作を説明する。
先ず、図1(A)中実線で示す初期位置に各部材が配置された保持装置EAに対し、当該保持装置EAの使用者(以下、単に「使用者」という)が、操作パネルやパーソナルコンピュータ等の図示しない操作手段を介して自動運転開始の信号を入力する。すると、流体供給手段20が切替弁24、25を駆動し、図1(B)に示すように、加圧手段22とタンク21とを連通させるとともに、加圧側配管21Aを介してタンク21と凹部12Bとを連通させた後、当該加圧手段22を駆動し、タンク21内の圧力を上昇させて支持面12Aの親水部12Fに水WTを供給する(流体供給工程)。なお、親水部12Fに供給された水WTは、カメラや投影機等の撮像手段や、光学センサや超音波センサ等の各種センサ等で構成された図示しない流体検知手段によって監視され、流体供給手段20は、この図示しない流体検知手段の監視状態を基にして、親水部12Fに供給した水WTが疎水部12Eにあふれ出ないように、タンク21内の圧力を調整する。次いで、硬化手段30が、支持手段10で保持対象物WKを支持する前に、水WTが凍結しない程度に当該水WTに冷却処理を施す流体前処理工程を実施しておく。すなわち、硬化手段30が多関節ロボット31および図示しない冷却手段を駆動し、図1(B)中二点鎖線で示すように、冷却プレート34を支持面12Aに接近させ、水WTが凍結しない程度の温度としての2℃~3℃になるように、当該水WTに冷却処理を施す(流体前処理工程)。なお、支持面12A上の水WTは、熱電対や赤外線センサ等の図示しない温度検知手段によって温度が監視され、硬化手段30は、この図示しない温度検知手段の監視状態を基にして、水WTの温度を調整する。その後、硬化手段30が図示しない冷却手段の駆動を停止した後、多関節ロボット31を駆動し、冷却プレート34を初期位置に復帰させる。次に、多関節ロボットやベルトコンベア等の図示しない搬送手段が、図1(A)に示すように、一体物UPをテーブル12上方の所定位置に搬送すると、離間手段50が直動モータ51およびチャックシリンダ52を駆動し、同図中二点鎖線で示すように、一対の把持部材52Aで接着シートASを把持する。そして、離間手段50が直動モータ51を駆動し、接着シートASを引っ張って母材WKBから複数の保持対象物WKを形成する(離間工程)。この際、各保持対象物WKは、支持面12Aの各親水部12Fそれぞれに対応するように、相互間隔が広げられる。
The operation of the above-mentioned holding device EA will now be described.
First, a user of the holding device EA (hereinafter, simply referred to as "user") inputs a signal to start automatic operation via an operation means (not shown) such as an operation panel or a personal computer to the holding device EA in which each member is arranged at the initial position shown by the solid line in Fig. 1 (A). Then, the fluid supplying means 20 drives the switching valves 24, 25, and as shown in Fig. 1 (B), the pressurizing means 22 communicates with the tank 21, and the tank 21 communicates with the recess 12B via the pressurizing side piping 21A. Then, the pressurizing means 22 is driven to increase the pressure in the tank 21 and supply water WT to the hydrophilic portion 12F of the support surface 12A (fluid supplying step). The water WT supplied to the hydrophilic portion 12F is monitored by a fluid detection means (not shown) composed of an imaging means such as a camera or a projector, and various sensors such as an optical sensor or an ultrasonic sensor, and the fluid supply means 20 adjusts the pressure in the tank 21 based on the monitoring state of the fluid detection means (not shown) so that the water WT supplied to the hydrophilic portion 12F does not overflow into the hydrophobic portion 12E. Next, before the hardening means 30 supports the holding object WK with the support means 10, a fluid pretreatment step is performed in which the water WT is cooled to a temperature that does not freeze. That is, the hardening means 30 drives the articulated robot 31 and the cooling means (not shown) to bring the cooling plate 34 close to the support surface 12A as shown by the two-dot chain line in FIG. 1B, and cools the water WT to a temperature of 2°C to 3°C, which is a temperature at which the water WT does not freeze (fluid pretreatment step). The temperature of the water WT on the support surface 12A is monitored by a temperature detection means (not shown), such as a thermocouple or an infrared sensor, and the hardening means 30 adjusts the temperature of the water WT based on the monitoring state of the temperature detection means (not shown). After that, the hardening means 30 stops driving the cooling means (not shown), and then drives the articulated robot 31 to return the cooling plate 34 to its initial position. Next, when a conveying means (not shown), such as an articulated robot or a belt conveyer, conveys the integrated object UP to a predetermined position above the table 12, as shown in FIG. 1(A), the separating means 50 drives the linear motor 51 and the chuck cylinder 52, and grips the adhesive sheet AS with a pair of gripping members 52A, as shown by the two-dot chain line in the figure. Then, the separating means 50 drives the linear motor 51 to pull the adhesive sheet AS to form a plurality of holding objects WK from the base material WKB (separating process). At this time, the mutual intervals between the objects to be held WK are increased so as to correspond to the respective hydrophilic portions 12F of the support surface 12A.

次いで、支持手段10が直動モータ11を駆動し、図1(C)に示すように、テーブル12を上昇させて支持面12Aで保持対象物WKを支持する(支持工程)。この際、各保持対象物WKは、各親水部12Fに供給された水WTを介して当該各親水部12Fにそれぞれ支持される。その後、硬化手段30が多関節ロボット31および図示しない冷却手段を駆動し、図1(C)に示すように、冷却プレート34を接着シートASに接近させることで、保持対象物WK側から水WTに冷却処理を施して当該水WTを凍結させ、当該保持対象物WKを支持面12Aで保持する(硬化工程)。この際、硬化手段30は、冷却プレート34を接着シートASに当接させてもよいし、当接させなくてもよい。また、例えば、水WTが凍結して当該水WTの体積が膨張し、保持対象物WKが冷却プレート34側に押し当てられたとしても、支持プレート32との間に設けられたばね35によって、保持対象物WKに加わる負荷が低減される。次に、硬化手段30が図示しない冷却手段の駆動を停止するとともに、多関節ロボット31を駆動し、冷却プレート34を初期位置に復帰させる。そして、剥離手段40が直動モータ11を駆動し、図1(D)に示すように、テーブル12を下降させて保持対象物WKから接着シートASを剥離する(剥離工程)。 Next, the support means 10 drives the linear motor 11, and as shown in FIG. 1(C), the table 12 is raised to support the holding object WK on the support surface 12A (support process). At this time, each holding object WK is supported by each hydrophilic portion 12F via the water WT supplied to each hydrophilic portion 12F. After that, the hardening means 30 drives the articulated robot 31 and the cooling means (not shown), and as shown in FIG. 1(C), the cooling plate 34 is brought close to the adhesive sheet AS, so that the water WT is subjected to a cooling process from the holding object WK side to freeze the water WT, and the holding object WK is held on the support surface 12A (hardening process). At this time, the hardening means 30 may or may not abut the cooling plate 34 against the adhesive sheet AS. In addition, even if the water WT freezes and expands in volume, for example, and the object to be held WK is pressed against the cooling plate 34, the spring 35 provided between the water WT and the support plate 32 reduces the load on the object to be held WK. Next, the hardening means 30 stops driving the cooling means (not shown) and drives the articulated robot 31 to return the cooling plate 34 to its initial position. Then, the peeling means 40 drives the linear motor 11, and as shown in FIG. 1(D), the table 12 is lowered to peel the adhesive sheet AS from the object to be held WK (peeling process).

全ての保持対象物WKから接着シートASが剥離され、テーブル12が初期位置に復帰すると、剥離手段40が直動モータ11の駆動を停止した後、離間手段50が直動モータ51およびチャックシリンダ52を駆動し、把持部材52Aを初期位置に復帰させる。なお、把持部材52Aによる支持を失った接着シートASは、使用者や図示しない搬送手段に受け渡されて廃棄される。次いで、コイルヒータやヒートパイプの加熱側等の図示しない加熱手段によって加熱したり、自然解凍したりして、凍結した水WTを解凍する(流体化工程)。この際、親水部12Fで支持された各保持対象物WKは、水WTの作用によって所定の位置、所定の角度で位置決めされる。その後、流体供給手段20が切替弁24、25を駆動し、図1(E)に示すように、減圧手段23とタンク21とを連通させるとともに、減圧側配管21Bを介してタンク21と凹部12Bとを連通させた後、当該減圧手段23を駆動し、タンク21内の圧力を下降させる(流体回収工程)。これにより、支持面12A上にあった水WTが回収され、保持対象物WKが所定の位置、所定の角度が位置決めされた状態で支持面12Aに支持される。次に、使用者や図示しない搬送手段が支持面12A上から保持対象物WKを全て取り去り(除去工程)、以降上記同様の工程が繰り返される。 When the adhesive sheet AS has been peeled off from all the objects to be held WK and the table 12 has returned to its initial position, the peeling means 40 stops driving the linear motor 11, and then the separation means 50 drives the linear motor 51 and the chuck cylinder 52 to return the gripping member 52A to its initial position. The adhesive sheet AS that has lost support from the gripping member 52A is handed over to the user or a transport means (not shown) for disposal. The frozen water WT is then thawed by heating it with a heating means (not shown), such as a coil heater or the heating side of a heat pipe, or by natural thawing (fluidization process). At this time, each object to be held WK supported by the hydrophilic portion 12F is positioned at a predetermined position and angle by the action of the water WT. Thereafter, the fluid supply means 20 drives the switching valves 24 and 25, and as shown in FIG. 1(E), the pressure reducing means 23 communicates with the tank 21, and the tank 21 communicates with the recess 12B via the pressure reducing side piping 21B, and then the pressure reducing means 23 is driven to lower the pressure in the tank 21 (fluid recovery process). As a result, the water WT that was on the support surface 12A is recovered, and the held object WK is supported on the support surface 12A with the held object WK positioned at a predetermined position and a predetermined angle. Next, the user or a transport means (not shown) removes all of the held object WK from the support surface 12A (removal process), and the same process as above is repeated thereafter.

以上のような実施形態によれば、水WTを介して支持面12Aに支持された保持対象物WK側から当該水WTに冷却処理を施すので、支持面12Aを有する部材(テーブル12、多孔質部材12D)ごと冷却処理を施さなくてもよく、エネルギーの無駄な消費を極力低減することができる。 According to the above embodiment, the water WT is cooled from the side of the object to be held WK supported on the support surface 12A via the water WT, so there is no need to cool the entire member having the support surface 12A (table 12, porous member 12D), and unnecessary energy consumption can be reduced as much as possible.

以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。すなわち、本発明は、主に特定の実施形態に関して特に図示され、かつ説明されているが、本発明の技術的思想および目的の範囲から逸脱することなく、以上述べた実施形態に対し、形状、材質、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。また、上記に開示した形状、材質などを限定した記載は、本発明の理解を容易にするために例示的に記載したものであり、本発明を限定するものではないから、それらの形状、材質などの限定の一部もしくは全部の限定を外した部材の名称での記載は、本発明に含まれる。 As described above, the best configurations and methods for implementing the present invention have been disclosed in the above description, but the present invention is not limited thereto. That is, the present invention has been illustrated and described mainly with respect to specific embodiments, but those skilled in the art can make various modifications to the above-described embodiments in terms of shape, material, quantity, and other detailed configurations without departing from the scope of the technical idea and purpose of the present invention. Furthermore, the descriptions limiting the shapes, materials, etc. disclosed above are provided as examples to facilitate understanding of the present invention, and do not limit the present invention. Therefore, descriptions of the names of components that remove some or all of the limitations on the shapes, materials, etc. are included in the present invention.

例えば、支持手段10は、解凍した水WTを回収した後で、減圧手段23または流体供給手段20から独立した別の減圧手段によって、支持面12Aで保持対象物WKを吸着保持してもよいし、直動モータ11を剥離手段40と兼用しなくてもよいし、親水部12Fには水WTが通過する孔が形成され、疎水部12Eには水WTが通過する孔が形成されていなくてもよいし、親水部12Fおよび疎水部12Eの両方に水WTが通過する孔が形成されていてもよいし、疎水性や親水性を有するシート、フィルム、テープ等を支持面12Aに貼付したり、疎水性や親水性を発揮する表面処理やコーティングを支持面12Aに施したりして疎水部12Eや親水部12Fを形成してもよいし、支持面12Aに疎水部12Eや親水部12Fが形成されていなくてもよい。 For example, after recovering the thawed water WT, the support means 10 may adsorb and hold the object WK to be held on the support surface 12A by the pressure reducing means 23 or another pressure reducing means independent of the fluid supply means 20, the linear motor 11 may not also serve as the peeling means 40, the hydrophilic portion 12F may have holes through which the water WT passes and the hydrophobic portion 12E may not have holes through which the water WT passes, both the hydrophilic portion 12F and the hydrophobic portion 12E may have holes through which the water WT passes, a sheet, film, tape, etc. having hydrophobic or hydrophilic properties may be attached to the support surface 12A, or a surface treatment or coating that exhibits hydrophobicity or hydrophilicity may be applied to the support surface 12A to form the hydrophobic portion 12E or the hydrophilic portion 12F, or the hydrophobic portion 12E or the hydrophilic portion 12F may not be formed on the support surface 12A.

流体供給手段20は、ノズルやホース等の供給部材でテーブル12の外側から支持面12Aに水WTを供給してもよいし、流路12Cとは別の回収用の流路をテーブル12に設け、当該回収用の流路から水WTを回収してもよいし、切替弁24、25を採用せずに、例えば、加圧手段22および減圧手段23を個別にタンク21と接続したり、タンク21から個別に凹部12Bに接続したりしてもよい。
流体供給手段20で供給する流体は、水WTに限らず、アルコール溶液やオイル等の液体の他、ジェル体でもよいし、冷却処理によって昇華する単体ガス、混合ガス等の気体でもよく、具体的には、例えば、接着剤、ドライアイス、UV硬化樹脂、セメント等でもよく、硬化処理によって硬化するものであれば何でもよく、硬化処理が施される前の状態の時よりも硬くなることで、保持対象物WKに対する所望の保持力が得られるものであれば何でもよい。なお、本願で言う「硬さ」とは、ブリネル硬さ、ビッカース硬さ、ロックウェル硬さ等で表される硬さのことであってもよいし、ヤング率、剛性率、引張強さ、圧縮強さ、せん断強さ等で表される硬さのことであってもよい。
The fluid supply means 20 may supply water WT to the support surface 12A from outside the table 12 using a supply member such as a nozzle or hose, or a recovery flow path separate from the flow path 12C may be provided in the table 12 and the water WT may be recovered from the recovery flow path, or, without using the switching valves 24, 25, the pressurizing means 22 and the depressurizing means 23 may be connected individually to the tank 21, or individually from the tank 21 to the recess 12B, for example.
The fluid supplied by the fluid supplying means 20 is not limited to water WT, but may be liquid such as alcohol solution or oil, gel, or gas such as a simple gas or mixed gas that sublimates by cooling treatment, specifically, for example, adhesive, dry ice, UV curing resin, cement, etc. Anything that hardens by hardening treatment is acceptable, and anything that can obtain a desired holding force for the object to be held WK by becoming harder than the state before the hardening treatment is applied is acceptable. Note that the "hardness" referred to in this application may refer to hardness expressed by Brinell hardness, Vickers hardness, Rockwell hardness, etc., or may refer to hardness expressed by Young's modulus, rigidity modulus, tensile strength, compressive strength, shear strength, etc.

硬化手段30は、冷却空気や冷却ガス等の冷却媒体で水WTを凍結させてもよいし、流体が硬化処理としての加熱処理で硬化するもの、例えば、熱硬化性樹脂や加熱硬化剤等の場合、コイルヒータやヒートパイプの加熱側等の加熱手段を採用してもよいし、流体が硬化処理としての紫外線やX線等のエネルギー線照射処理で硬化するもの、例えば、エネルギー線硬化性樹脂やエネルギー線硬化剤等の場合、エネルギー線を照射可能な高圧水銀ランプやLED(発光ダイオード、Light Emitting Diode)ランプ等のエネルギー線照射手段を採用してもよいし、流体が硬化処理としての乾燥処理によって硬化するもの、例えば、接着剤やセメント等の場合、送風機や加熱手段を採用してもよく、流体の特性、特質、性質、材質、組成および構成や、雰囲気の条件、その他の要因等の諸条件を考慮して流体を硬化させることができるものであれば何を採用してもよいし、前記実施形態では、保持対象物WKの他方の面WK2側(上方)から水WTに冷却処理を施したが、例えば、保持対象物WKの左方、前方、右斜め後方、左斜め前方、右斜め上方または、左斜め上方といった保持対象物WK側から水WTに冷却処理を施してもよい。
硬化手段30は、上記した冷却手段や冷却媒体によって、タンク21内の水WTや配管21A、25A内の水WTを直接冷却したり、タンク21、配管21A、25Aおよび支持面12Aのうち少なくとも1つを介して間接的に水WTを冷却したりすることで、支持手段10で保持対象物WKを支持する前に、流体前処理工程を実施しておくようにしてもよいし、硬化工程を実施するものと流体前処理を実施するものとを同じもので構成してもよいし、異なるもので構成してもよい。なお、流体前処理工程を実施しておく場合、流体が硬化しない程度の温度としては、流体が水WTである場合、2℃以下でもよいし、3℃以上でもよいし、流体が加熱処理によって硬化するものの場合、例えば、当該流体を60℃や120℃といった温度に加熱処理してもよく、流体の特性、特質、性質、材質、組成および構成や、雰囲気の条件、その他の要因等の諸条件を考慮して流体が硬化しない温度であれば何度でもよい。
The hardening means 30 may freeze the water WT using a cooling medium such as cooling air or cooling gas, or may employ a heating means such as a coil heater or the heating side of a heat pipe when the fluid is hardened by a heat treatment as a hardening process, such as a thermosetting resin or a heat hardener, or may employ a high pressure mercury lamp or LED (Light Emitting Diode) capable of emitting energy rays when the fluid is hardened by an energy ray irradiation process such as ultraviolet rays or X-rays, such as an energy ray hardening resin or an energy ray hardening agent. Alternatively, in the case of a fluid that hardens by a drying process as a hardening process, such as an adhesive or cement, a blower or heating means may be used. Any means may be used as long as it can harden the fluid taking into consideration various conditions such as the characteristics, properties, properties, material, composition and configuration of the fluid, atmospheric conditions, and other factors. In the above embodiment, the water WT is cooled from the other surface WK2 side (above) of the object to be held WK, but the water WT may be cooled from, for example, the left, front, right rear, left front, right upper, or left upper side of the object to be held WK.
The hardening means 30 may perform a fluid pretreatment step before supporting the object WK to be held with the support means 10 by directly cooling the water WT in the tank 21 or the water WT in the pipes 21A and 25A using the above-mentioned cooling means or cooling medium, or by indirectly cooling the water WT via at least one of the tank 21, the pipes 21A and 25A, and the support surface 12A. The hardening step and the fluid pretreatment step may be the same or different. In the case where the fluid pretreatment step is performed, the temperature at which the fluid does not harden may be 2° C. or lower or 3° C. or higher if the fluid is water WT, or may be heated to a temperature of, for example, 60° C. or 120° C. if the fluid is one that hardens by heat treatment. Any temperature may be used as long as the fluid does not harden, taking into consideration various conditions such as the characteristics, properties, properties, material, composition, and configuration of the fluid, the atmospheric conditions, and other factors.

剥離手段40は、テーブル12を下降させずにまたは下降させつつ、チャックシリンダ52を上昇させて保持対象物WKから接着シートASを剥離してもよいし、支持面12A内で保持対象物WKと接着シートASとを相対回転させて保持対象物WKから接着シートASを剥離してもよいし、超音波振動装置やバイブレータ等の振動手段でテーブル12を振動させて保持対象物WKから接着シートASを剥離し易くしてもよいし、支持手段10と兼用されることのない駆動機器を採用してもよいし、上記で例示したものに代えてまたは併用して、枚葉または帯状の接着テープや粘着テープ等の剥離用テープを接着シートASに貼付し、当該剥離用テープに張力を付与して保持対象物WKから接着シートASを剥離してもよいし、本発明の保持装置EAに備わっていてもよいし、備わっていなくてもよく、剥離手段40が備わっていない場合、他の装置で保持対象物WKから接着シートASを剥離してもよい。 The peeling means 40 may peel off the adhesive sheet AS from the holding object WK by raising the chuck cylinder 52 without lowering the table 12 or while lowering it, or may peel off the adhesive sheet AS from the holding object WK by rotating the holding object WK and the adhesive sheet AS relative to each other within the support surface 12A, or may vibrate the table 12 with a vibration means such as an ultrasonic vibration device or a vibrator to make it easier to peel off the adhesive sheet AS from the holding object WK, or may adopt a driving device that is not also used as the support means 10, or may be used in place of or in combination with the above-mentioned examples, by attaching a peeling tape such as a sheet or strip of adhesive tape or pressure-sensitive adhesive tape to the adhesive sheet AS and applying tension to the peeling tape to peel off the adhesive sheet AS from the holding object WK, or may be provided in the holding device EA of the present invention or may not be provided, and if the peeling means 40 is not provided, the adhesive sheet AS may be peeled off from the holding object WK by another device.

離間手段50は、接着シートASの面内において1方向または2方向以上の方向に張力を付与し、保持対象物WKの相互間隔を広げてもよいし、接着シートASを介して保持対象物WKと一体化されたリングフレーム等のフレーム部材が用いられる場合、フレーム部材を支持して接着シートASに張力を付与することで、保持対象物WKの相互間隔を広げてもよいし、本発明の保持装置EAに備わっていてもよいし、備わっていなくてもよく、離間手段50が備わっていない場合、他の装置で保持対象物WKの相互間隔を広げてもよい。 The spacing means 50 may apply tension in one or more directions within the plane of the adhesive sheet AS to widen the spacing between the objects to be held WK, or, if a frame member such as a ring frame integrated with the objects to be held WK via the adhesive sheet AS is used, the frame member may be supported to apply tension to the adhesive sheet AS to widen the spacing between the objects to be held WK, and may or may not be included in the holding device EA of the present invention, and if the spacing means 50 is not included, the spacing between the objects to be held WK may be widened by another device.

保持装置EAは、支持面12A上に残された流体やその他の塵等の塵埃を除去するブレード、ワイパーまたは流体を吹き飛ばすブロア等の塵埃除去手段を採用し、支持面12Aに流体を供給する前や、支持面12Aから流体を回収した後に、支持面12A上から塵埃を除去してもよいし、母材WKBに対し、厚み方向に貫通する切込または、張力が付与されることで母材WKBが分裂し、当該母材WKBが複数の保持対象物WKとなる厚み方向に貫通することのない切込を形成するカッター刃やレーザカッタ等の母材切断手段が備わっていてもよいし、張力が付与されることで母材WKBが分裂し、当該母材WKBが複数の保持対象物WKとなる脆弱な改質層を母材WKBに形成するレーザ照射装置や薬液投与手段等の脆弱層形成手段が備わっていてもよいし、母材WKBを研削して当該母材WKBの厚みを薄くするグラインダや砥石等の研削手段が備わっていてもよいし、厚み方向に貫通することのない切込が形成された母材WKBに対し、当該切込が形成された面の反対側の面から当該切込に達するまで研削することで、母材WKBから複数の保持対象物WKを形成するグラインダや砥石等の研削個片化手段が備わっていてもよい。
保持装置EAは、支持工程の前段で流体供給工程を実施してもよいし、支持工程の後段で流体供給工程を実施してもよいし、支持工程の前段と当該支持工程の後段との両方で流体供給工程を実施してもよいし、流体前処理工程、離間工程、剥離工程、流体化工程、流体回収工程および除去工程のうち少なくとも1つの工程は実施しなくてもよいし、実施してもよい。
The holding device EA may employ a dust removal means such as a blade, wiper, or blower that blows away fluid to remove dust such as fluid remaining on the support surface 12A, and may remove dust from the support surface 12A before supplying fluid to the support surface 12A or after recovering fluid from the support surface 12A. The holding device EA may also be equipped with a base material cutting means such as a cutter blade or laser cutter that forms a cut that penetrates the base material WKB in the thickness direction, or a cut that does not penetrate the base material WKB in the thickness direction by applying tension, so that the base material WKB splits into multiple holding objects WK when tension is applied. The apparatus may be equipped with a fragile layer forming means such as a laser irradiation device or a chemical solution administration means that forms a fragile modified layer on the base material WKB, whereby the base material WKB splits and the base material WKB becomes a plurality of holding objects WK, or a grinding means such as a grinder or grindstone that grinds the base material WKB to reduce the thickness of the base material WKB, or a grinding individualization means such as a grinder or grindstone that grinds the base material WKB so as to form a plurality of holding objects WK from the surface opposite to the surface on which the notch is formed, until the notch is reached, for a base material WKB on which a notch that does not penetrate in the thickness direction is formed.
The holding device EA may perform a fluid supply step before the supporting step, may perform a fluid supply step after the supporting step, may perform a fluid supply step both before the supporting step and after the supporting step, or may not perform at least one of the fluid pretreatment step, separation step, peeling step, fluidization step, fluid recovery step and removal step.

母材WKBは、厚み方向に貫通する切込が形成され、当該切込によって複数の保持対象物WKが形成されているものでもよいし、張力が付与されることで分裂し、複数の保持対象物WKとなる厚み方向に貫通することのない切込が形成されたものでもよいし、張力が付与されることで分裂し、複数の保持対象物WKとなる脆弱な改質層が形成されたものでもよいし、接着シートASが貼付されていなくてもよい。
保持対象物WKは、接着シートASが貼付されていなくてもよいし、母材WKBから形成されたものでなく、予め所定の間隔を空けて配置されたものであってもよい。
一体物UPは、接着シートASがフレーム部材に支持されていてもよい。
フレーム部材は、リングフレーム以外に、環状でない(外周が繋がっていない)ものや、円形、楕円形、多角形、その他の形状であってもよい。
前記実施形態では、保持対象物として複数の保持対象物WKを例示したが、保持対象物は1つであってもよい。
The base material WKB may have a cut that penetrates in the thickness direction and a plurality of holding objects WK are formed by the cut, or it may have a cut that does not penetrate in the thickness direction and that splits when tension is applied to become a plurality of holding objects WK, or it may have a fragile modified layer that splits when tension is applied to become a plurality of holding objects WK, or it may not have an adhesive sheet AS attached.
The holding object WK may not have an adhesive sheet AS attached thereto, and may not be formed from a base material WKB, but may be arranged at a predetermined interval in advance.
The integrated body UP may have the adhesive sheet AS supported by a frame member.
The frame member may be a ring frame or may be a non-annular frame (not connected at the outer periphery) or may be a circular, elliptical, polygonal, or other shape.
In the above embodiment, a plurality of holding objects WK are exemplified as the holding object, but the number of holding objects may be one.

本発明における手段および工程は、それら手段および工程について説明した動作、機能または工程を果たすことができる限りなんら限定されることはなく、まして、前記実施形態で示した単なる一実施形態の構成物や工程に全く限定されることはない。例えば、支持工程は、保持対象物の一方の面側から当該保持対象物を支持面で支持する工程であればどのような工程でもよく、出願当初の技術常識に照らし合わせてその技術範囲内のものであればなんら限定されることはない(その他の手段および工程も同じ)。 The means and steps of the present invention are not limited in any way as long as they can perform the operations, functions or steps described for those means and steps, and are in no way limited to the components and steps of a single embodiment shown in the above embodiment. For example, the supporting step may be any step that supports the object to be held with a supporting surface from one side of the object to be held, and is not limited in any way as long as it is within the scope of the technical common knowledge at the time of filing (the same goes for other means and steps).

接着シートAS、母材WKB、保持対象物WKおよび剥離用テープの材質、種別、形状等は、特に限定されることはない。例えば、接着シートAS、母材WKB、保持対象物WKおよび剥離用テープは、円形、楕円形、三角形や四角形等の多角形、その他の形状であってもよいし、接着シートASおよび剥離用テープは、感圧接着性、感熱接着性等の接着形態のものであってもよく、感熱接着性のものが採用された場合は、接着シートASや剥離用テープを加熱する適宜なコイルヒータやヒートパイプの加熱側等の加熱手段を設けるといった適宜な方法で接着されればよい。また、このような接着シートASや剥離用テープは、例えば、接着剤層だけの単層のもの、基材と接着剤層との間に中間層を有するもの、基材の上面にカバー層を有する等3層以上のもの、さらには、基材を接着剤層から剥離することのできる所謂両面接着シートのようなものであってもよく、両面接着シートは、単層又は複層の中間層を有するものや、中間層のない単層又は複層のものであってよい。また、母材WKBおよび保持対象物WKとしては、例えば、食品、樹脂容器、シリコン半導体ウエハや化合物半導体ウエハ等の半導体ウエハ、回路基板、光ディスク等の情報記録基板、ガラス板、鋼板、陶器、木板または樹脂等の単体物であってもよいし、それら2つ以上で形成された複合物であってもよく、任意の形態の部材や物品なども対象とすることができる。なお、接着シートASは、機能的、用途的な読み方に換え、例えば、情報記載用ラベル、装飾用ラベル、保護シート、ダイシングテープ、ダイアタッチフィルム、ダイボンディングテープ、記録層形成樹脂シート等の任意のシート、フィルム、テープ等でもよい。 The material, type, shape, etc. of the adhesive sheet AS, the base material WKB, the object to be held WK, and the peeling tape are not particularly limited. For example, the adhesive sheet AS, the base material WKB, the object to be held WK, and the peeling tape may be circular, elliptical, polygonal such as a triangle or a square, or other shape, and the adhesive sheet AS and the peeling tape may be pressure-sensitive adhesive, heat-sensitive adhesive, etc., and when a heat-sensitive adhesive is used, the adhesive sheet AS and the peeling tape may be adhered by an appropriate method such as providing a heating means such as a suitable coil heater or the heating side of a heat pipe for heating the adhesive sheet AS and the peeling tape. In addition, such adhesive sheet AS and peeling tape may be, for example, a single layer with only an adhesive layer, a layer with an intermediate layer between the substrate and the adhesive layer, a layer with three or more layers such as a cover layer on the upper surface of the substrate, or even a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer, and the double-sided adhesive sheet may be a single layer or a multi-layered one with a single or multi-layered intermediate layer, or a single or multi-layered one without an intermediate layer. The base material WKB and the object to be held WK may be, for example, a single object such as food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as an optical disk, a glass plate, a steel plate, a ceramic, a wooden board, or a resin, or may be a composite formed of two or more of these, and may be any type of member or article. The adhesive sheet AS may be interpreted in terms of its function and use, and may be any sheet, film, tape, etc., such as an information label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, or a recording layer-forming resin sheet.

前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、2軸または3軸以上の関節を備えた多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的又は間接的に組み合せたものを採用することもできる。
前記実施形態において、支持(保持)手段や支持(保持)部材等の被支持部材(被保持部材)を支持(保持)するものが採用されている場合、メカチャックやチャックシリンダ等の把持手段、クーロン力、接着剤(接着シート、接着テープ)、粘着剤(粘着シート、粘着テープ)、磁力、ベルヌーイ吸着、吸引吸着、駆動機器等で被支持部材を支持(保持)する構成を採用してもよいし、切断手段や切断部材等の被切断部材を切断または、被切断部材に切込や切断線を形成するものが採用されている場合、上記で例示したものに代えてまたは併用して、カッター刃、レーザカッタ、イオンビーム、火力、熱、水圧、電熱線、気体や液体等の吹付け等で切断するものを採用したり、適宜な駆動機器を組み合わせたもので切断するものを移動させて切断するようにしたりしてもよいし、付勢手段が採用されている場合、ばね、ゴム、樹脂または駆動機器等で構成してもよい。
The driving equipment in the above-described embodiments may be electric equipment such as a rotary motor, a linear motor, a single-axis robot, or a multi-joint robot having joints on two or more axes, or an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, or a rotary cylinder, or a direct or indirect combination of these may also be used.
In the above-described embodiments, when a supporting (holding) means or a supporting (holding) member that supports (holds) a supported member (held member) is used, a configuration may be adopted in which the supported member is supported (held) by gripping means such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), pressure sensitive adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, driving equipment, or the like. When a cutting means or a cutting member that cuts a member to be cut or forms an incision or cutting line in a member to be cut is used, a cutter blade, a laser cutter, an ion beam, fire, heat, water pressure, an electric heating wire, or a blowing of gas or liquid, or the like may be used instead of or in combination with the above-described examples. Alternatively, a combination of appropriate driving equipment may be used to move the cutting means to perform the cutting. When a biasing means is used, the biasing means may be composed of a spring, rubber, resin, driving equipment, or the like.

EA…保持装置
10…支持手段
12A…支持面
20…流体供給手段
30…硬化手段
WK…保持対象物
WK1…一方の面
WT…水(流体)
EA: Holding device 10: Supporting means 12A: Supporting surface 20: Fluid supplying means 30: Hardening means WK: Holding object WK1: One surface WT: Water (fluid)

Claims (2)

保持対象物の一方の面側から当該保持対象物を支持面で支持する支持工程と、
前記支持工程の前段または後段で前記支持面に流体を供給する流体供給工程と、
前記流体を硬化させる硬化処理を施して当該流体を硬化させ、前記保持対象物を前記支持面で保持する硬化工程とを実施し、
前記硬化工程では、前記支持工程で前記保持対象物を支持する前に、前記流体が硬化しない程度に当該流体に前記硬化処理を施す流体前処理工程を実施しておくとともに、前記流体を介して前記支持面に支持された前記保持対象物側から当該流体に前記硬化処理を施すことを特徴とする保持方法。
A supporting step of supporting the object to be held from one surface side of the object to be held with a supporting surface;
a fluid supplying step of supplying a fluid to the support surface before or after the supporting step;
A hardening process is carried out to harden the fluid, thereby holding the object to be held on the support surface;
The hardening process is a holding method characterized in that, before supporting the object to be held in the supporting process, a fluid pretreatment process is carried out in which the hardening treatment is applied to the fluid to an extent that the fluid does not harden, and the hardening treatment is applied to the fluid from the side of the object to be held supported on the supporting surface via the fluid.
保持対象物の一方の面側から当該保持対象物を支持面で支持する支持手段と、
前記支持面に流体を供給する流体供給手段と、
前記流体を硬化させる硬化処理を施して当該流体を硬化させ、前記保持対象物を前記支持面で保持する硬化手段とを備え、
前記硬化手段は、前記支持手段で前記保持対象物を支持する前に、前記流体が硬化しない程度に当該流体に前記硬化処理を施す流体前処理工程を実施しておくとともに、前記流体を介して前記支持面に支持された前記保持対象物側から当該流体に前記硬化処理を施すことを特徴とする保持装置。
A support means for supporting the object to be held from one surface side of the object to be held with a support surface;
a fluid supply means for supplying a fluid to the support surface;
and hardening means for performing a hardening process to harden the fluid and hold the object to be held on the support surface,
The hardening means is a holding device characterized in that it performs a fluid pretreatment process in which the hardening treatment is performed on the fluid to a degree that the fluid does not harden before supporting the object to be held with the support means, and performs the hardening treatment on the fluid from the side of the object to be held supported on the support surface via the fluid.
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