JP7705833B2 - Semiconductor component manufacturing method and semiconductor component manufacturing device - Google Patents

Description

The present invention relates to a method for manufacturing semiconductor components and an apparatus for manufacturing semiconductor components.

Patent Document 1 discloses a method for manufacturing multiple semiconductor devices from a lead frame. Multiple molded resins are arranged on the lead frame, and multiple lead terminals protrude from each molded resin. The multiple molded resins are arranged in a lattice pattern. The multiple lead terminals protruding from the multiple molded resins arranged in each row are connected by tie bars. The multiple tie bars are connected to a frame body. By separating the multiple lead terminals from each tie bar in the lead frame, a semiconductor device in which multiple lead terminals protrude from a common molded resin is manufactured.

JP 2000-12752 A

However, Patent Document 1 does not take into consideration the length of the lead terminals. For example, if the lead terminals are long, the number of molding resins that can be formed on a lead frame with a fixed size is small. In this case, the number of semiconductor devices that can be manufactured from one lead frame is small.

The present invention aims to provide a manufacturing method and manufacturing apparatus that can produce a large number of semiconductor components from a single lead frame.

A method for manufacturing a semiconductor component according to one aspect of the present invention is a method for manufacturing a semiconductor component having a resin portion in which a semiconductor chip is sealed with resin and a plurality of lead portions protruding in a common direction from one surface of the resin portion, and includes the steps of: cutting a lead frame in which the plurality of resin portions are formed to separate the plurality of resin portions; and extending the lengths of the plurality of lead portions protruding from the separated resin portions, in which in the lead frame, the protruding surface of each resin portion from which the lead portions protrude faces the protruding surface of the other resin portion, and the protruding ends of the two lead portions protruding from each of the two opposing protruding surfaces are connected to each other.

The semiconductor component manufacturing apparatus according to one aspect of the present invention is a semiconductor component manufacturing apparatus used in the manufacturing method described above, and includes a resin molding module that forms the resin portions by sealing each of the semiconductor chips fixed to the lead frame with resin, a singulation module that singulates the resin portions by cutting the lead frame after the resin molding module has formed the resin portions, and an extension module that extends the length of the lead portions protruding from the resin portions singulated by the singulation module.

According to the above aspect, a large number of semiconductor components can be manufactured from a single lead frame.

1 is a schematic diagram of a manufacturing apparatus according to a first embodiment. FIG. 2 is an explanatory diagram of the external appearance of a semiconductor component. FIG. 2 is an explanatory diagram of the appearance of a lead frame before being sealed with resin. FIG. 2 is a cross-sectional view of a molding die used for resin sealing. FIG. 2 is an explanatory diagram of the appearance of the lead frame after resin sealing. FIG. 13 is an explanatory diagram of the appearance of an individual resin portion. 11A to 11C are explanatory diagrams of a method for extending a lead portion using a laser beam. 4 is a flowchart showing the steps of a method for manufacturing a semiconductor component. 13 is an explanatory diagram of storage performed by a component storage module according to the second embodiment. FIG. 13 is an explanatory diagram of the appearance of a crimp terminal in embodiment 3. FIG. 1 is an explanatory diagram of a method for extending a lead portion using a crimp terminal. FIG. 13 is an explanatory diagram of the appearance of an electric device for extension in embodiment 4. FIG. 13 is an explanatory diagram of a method for extending a lead portion using an electric device.

Below, an embodiment of a semiconductor component manufacturing method and semiconductor component manufacturing apparatus according to the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiment, and various modifications are possible without departing from the gist of the present invention.

(Embodiment 1)
1 is a schematic diagram of a manufacturing apparatus 1 according to a first embodiment. The manufacturing apparatus 1 includes a resin molding module 10, a singulation module 11, an extension module 12, and a component storage module 13. Each module is detachably connected to the other modules. In the example of FIG. 1, the resin molding module 10, the singulation module 11, the extension module 12, and the component storage module 13 are connected in this order.

Other modules may be added to the manufacturing apparatus 1. As a first example, the manufacturing apparatus 1 may include a plurality of resin molding modules 10. As a second example, a plurality of singulation modules 11 may be connected between the resin molding modules 10 and the extension module 12. As a third example, one module may be omitted. For example, the extension module 12 may be omitted. In this case, the singulation module 11 is connected to the component storage module 13.

The resin molding module 10, the singulation module 11, and the extension module 12 each perform processing to manufacture a plurality of semiconductor components 2 (see FIG. 2). The component storage module 13 stores the manufactured semiconductor components 2 in a case (not shown).

Figure 2 is an explanatory diagram of the external appearance of the semiconductor component 2. In Figure 2, the top, side, and bottom surfaces of the semiconductor component 2 are shown. In the semiconductor component 2, a semiconductor chip 25 (see Figure 3) is placed on the wide surface of a rectangular plate-like mounting piece 20 that has electrical conductivity and thermal conductivity. The wide surface is a surface different from the end surface of the mounting piece 20. The mounting piece 20 is a part of the lead frame 3 (see Figure 3). The lead frame 3 is made of copper or a copper alloy containing copper. The wide surface of the mounting piece 20 is provided with a through hole 20a that penetrates the mounting piece 20 in the thickness direction. The semiconductor chip 25 and the through hole 20a are aligned along the longitudinal direction of the mounting piece 20.

In the semiconductor component 2, the semiconductor chip 25 is disposed in a rectangular parallelepiped resin portion 21. In the resin portion 21, the semiconductor chip 25 is sealed with resin. The resin portion 21 covers a portion of the mounting piece 20. The wide surface of the mounting piece 20 opposite the wide surface on which the semiconductor chip 25 is disposed is exposed from the resin portion 21 (see FIG. 5). The thermal conductivity of the mounting piece 20 is higher than that of the resin portion 21. Therefore, heat generated by the semiconductor chip 25 is released to the outside via the mounting piece 20. The mounting piece 20 also functions as a heat sink.

As described above, the mounting piece 20 protrudes from one surface of the resin portion 21. A through hole 20a is provided in the portion of the mounting piece 20 that protrudes from the resin portion 21.

With respect to the resin portion 21, a plurality of rod-shaped lead portions 22 protrude in a common direction from the surface opposite to the surface from which the mounting piece 20 protrudes. Each lead portion 22 is conductive. Like the mounting piece 20, each lead portion 22 is a part of the lead frame 3. As described above, the lead frame 3 is manufactured from copper or a copper alloy or the like. FIG. 2 shows an example in which the number of lead portions 22 is three. The plurality of lead portions 22 are aligned in a direction along the wide surface of the mounting piece 20. The direction along the wide surface of the mounting piece 20 is the left-right direction of the semiconductor component 2, the top and bottom surfaces of which are shown in FIG. 2.

Examples of the semiconductor chip 25 include a field effect transistor, a bipolar transistor, an IGBT (Insulated Gate Bipolar Transistor), and a regulator. When the semiconductor chip 25 is a field effect transistor, a bipolar transistor, or an IGBT, for example, the number of lead portions 22 is three. When the semiconductor chip 25 is a field effect transistor, the three lead portions 22 are, for example, a drain terminal, a source terminal, and a gate terminal. When the semiconductor chip 25 is a bipolar transistor, the three lead portions 22 are, for example, a collector terminal, an emitter terminal, and a base terminal. When the semiconductor chip 25 is an IGBT, the three lead portions 22 are, for example, a collector terminal, an emitter terminal, and a gate terminal.

When the semiconductor chip 25 is a regulator, for example, the number of the leads 22 is three. In this case, the three leads 22 are, for example, a current input terminal, a current output terminal, and a control terminal.
The number of leads 22 of the semiconductor chip 25 is not limited to three, but may be two, four or more.

Each lead portion 22 is connected to a rod-shaped extension conductor 23. For this reason, the connection portion 24 between the lead portion 22 and the extension conductor 23 is realized by welding. At the connection portion 24, a part of the lead portion 22 is melted, and the molten metal is bonded to the extension conductor 23. Each lead portion 22 is electrically connected to the extension conductor 23 to which it is connected. The axial direction of each lead portion 22 coincides with the axial direction of the extension conductor 23.

Note that the alignment of two axial directions does not mean only exact alignment, but also includes substantial alignment. Therefore, when the angle between the two axial directions is within the error range, the two axial directions are aligned.

The total axial length of the connected lead portion 22 and extension conductor 23 is longer than the axial length of the lead portion 22. Therefore, by connecting the extension conductor 23 to the lead portion 22, the length of the lead portion 22 is extended.

Next, the processing of the resin molding module 10 will be described. FIG. 3 is an explanatory diagram of the appearance of the lead frame 3 before resin sealing. The lead frame 3 before resin sealing is inserted into the resin molding module 10. The lead frame 3 has a rectangular frame 30. Inside the frame 30, a plurality of mounting pieces 20 are arranged in a lattice pattern. In each mounting piece 20, the semiconductor chip 25 is fixed by a conductive adhesive, for example, silver paste. In each mounting piece 20, the through holes 20a and the semiconductor chips 25 are lined up in a column direction. The column direction is the up-down direction in FIG. 3.

In each column, a number of lead portions 22 corresponding to two mounting pieces 20 are arranged between the mounting piece 20 in the (2·N-1)th row and the mounting piece 20 in the (2·N)th row. Here, N is a natural number. "·" indicates a product. For the two mounting pieces 20 arranged in the (2·N-1)th row and the (2·N)th row in each column, two semiconductor chips 25 are arranged between the two through holes 20a. Therefore, in FIG. 3, in the mounting piece 20 in the (2·N-1)th row, the semiconductor chip 25 is arranged below the through hole 20a. In the mounting piece 20 in the (2·N)th row, the semiconductor chip 25 is arranged above the through hole 20a.

One of the multiple lead portions 22 corresponding to the mounting piece 20 in the (2.N-1)th row is connected to the mounting piece 20 in the (2.N-1)th row. Similarly, one of the multiple lead portions 22 corresponding to the mounting piece 20 in the (2.N)th row is connected to the mounting piece 20 in the (2.N)th row. In each column, the ends of the multiple lead portions 22 corresponding to the mounting piece 20 in the (2.N-1)th row are each connected to the ends of the multiple lead portions 22 corresponding to the mounting piece 20 in the (2.N)th row. Therefore, in the lead frame 3, one conductor is formed by two lead portions 22.

Of the multiple lead parts 22 corresponding to each mounting piece 20, the remaining lead parts 22 except for the lead parts 22 connected to the mounting piece 20 are separated from the mounting piece 20. The semiconductor chip 25 is connected to each of the remaining lead parts 22 separated from the mounting piece 20 by conductive wires 26. In the example of FIG. 3, the number of lead parts 22 is three, and the semiconductor chip 25 is connected to each of the two lead parts 22 separated from the mounting piece 20 by wires 26.

The multiple lead portions 22 corresponding to the multiple mounting pieces 20 arranged in the (2·N-1)th row are connected by a common tie bar 31 extending in the row direction. The row direction is the left-right direction in FIG. 3. The multiple lead portions 22 corresponding to the multiple mounting pieces 20 arranged in the (2·N)th row are also connected by a common tie bar 31 extending in the row direction. Each tie bar 31 is connected to the middle of the lead portion 22. Both ends of each tie bar 31 are connected to the frame body 30.

The resin molding module 10 uses a molding die 4 (see FIG. 4) to seal each of the multiple semiconductor chips 25 fixed to the mounting piece 20 of the lead frame 3 with resin. This forms multiple resin portions 21. The molding die 4 is, for example, a metal mold. FIG. 4 is a cross-sectional view of the molding die 4 used for resin sealing. The molding die 4 has an upper die 40 and a lower die 41. The lead frame 3 is sandwiched between the upper die 40 and the lower die 41. At this time, a cavity 42 is formed in the molding die 4. The semiconductor chip 25, a portion of the mounting piece 20, and each portion of the multiple lead portions 22 are arranged in the cavity 42.

For example, a thermosetting resin is used for resin sealing. When using this resin, the upper mold 40 and the lower mold 41 are heated. After heating, the resin melts and becomes liquid, which is then injected into the cavity 42. After the resin is injected, the arrangement of the upper mold 40 and the lower mold 41 is maintained for a certain period of time. This causes the resin to harden. As a result, the semiconductor chip 25 is sealed with the resin, and the resin portion 21 is formed.

The resin molding module 10 may be configured to include a supply module that supplies the lead frame 3 and the resin material, and a press module that clamps the molding die 4. In this case, the resin molding module 10 may include multiple press modules.

Figure 5 is an explanatory diagram of the appearance of the lead frame 3 after resin sealing. Figure 5 shows the plan and side views of the lead frame 3 after resin sealing. A resin portion 21 is formed at each position where the multiple semiconductor chips 25 are arranged. Therefore, the multiple resin portions 21 are arranged in a lattice pattern. As described above, the resin portion 21 is rectangular, and the mounting piece 20 is exposed from the resin portion 21. The mounting piece 20 protrudes from one surface of the resin portion 21. One resin portion 21 covers a portion of each of the multiple lead portions 22 corresponding to one mounting piece 20. The multiple lead portions 22 protrude in a common direction from the surface of the resin portion 21 opposite the surface from which the mounting piece 20 protrudes.

In the resin portion 21, the surface from which the multiple lead portions 22 protrude is referred to as the protruding surface. In the lead frame 3, the protruding surface of the resin portion 21 in the (2·N-1)th row faces the protruding surface of the resin portion 21 in the (2·N)th row. The protruding ends of the two lead portions 22 protruding from each of the two opposing protruding surfaces are directly connected to each other. Therefore, the protruding ends of the two lead portions 22 are in contact with each other.

After the resin molding module 10 forms a plurality of resin portions 21 in the lead frame 3, it passes the lead frame 3 on which the plurality of resin portions 21 have been formed to the singulation module 11. The singulation module 11 singulates the plurality of resin portions 21 by cutting the lead frame 3 received from the resin molding module 10.

Specifically, the tie bar 31 is cut along each lead portion 22. As a result, multiple sets of resin portions 21 are extracted. One set of resin portions 21 includes two resin portions 21 that are connected to each other. For each set of resin portions 21, one conductor formed by the two lead portions 22 is cut. If the number of lead portions 22 is three, three conductors are cut. As a result, multiple resin portions 21 are separated into individual pieces.

Figure 6 is an explanatory diagram of the appearance of the singulated resin portion 21. In Figure 6, the top, side, and bottom surfaces of the resin portion 21 are shown. The singulated resin portion 21 is the semiconductor component 2 before the multiple extension conductors 23 are connected. Therefore, a mounting piece 20 protrudes from one surface of the resin portion 21, and multiple lead portions 22 protrude in a common direction from the protruding surface of the resin portion 21. The singulation module 11 passes the multiple singulated resin portions 21 to the extension module 12.

The extension module 12 uses laser light to extend each of the multiple lead portions 22 protruding from the resin portion 21 received from the singulation module 11. This produces the semiconductor component 2 shown in FIG. 1.

Figure 7 is an explanatory diagram of a method for extending the lead portion 22 using laser light. The extension module 12 has an irradiator 50 and a controller 51. The irradiator 50 is connected to the controller 51. The controller 51 has a processing element (not shown) that executes processing, such as a CPU (Central Processing Unit). The processing element of the controller 51 controls the operation of the irradiator 50 by executing a program.

The irradiator 50 performs pulsed or continuous irradiation of laser light according to instructions from the controller 51. The irradiator 50 is a _CO2 laser, a YAG laser, a fiber laser, or the like. Pulse irradiation is intermittent irradiation of laser light. Continuous irradiation is continuous irradiation of laser light. The irradiator 50 starts or stops irradiation of laser light according to instructions from the controller 51. When the irradiator 50 is irradiating laser light, the irradiator 50 adjusts the output intensity of the irradiated laser light according to instructions from the controller 51.

When pulse irradiation is being performed, the irradiator 50 periodically starts irradiating the laser light. The proportion of the irradiation period during which the laser light is irradiated in one cycle is referred to as the duty. The higher the duty, the longer the irradiation period in one cycle. When pulse irradiation is being performed, the irradiator 50 adjusts the duty according to instructions from the controller 51.

The extension module 12 overlaps a portion of the lead portion 22 with a portion of the rod-shaped extension conductor 23. As described above, the axial direction of the lead portion 22 coincides with the axial direction of the extension conductor 23. As described above, the coincidence of the two axial directions does not mean only strict coincidence, but also includes substantial coincidence. The irradiator 50 irradiates the portion of the lead portion 22 where the extension conductor 23 overlaps with a laser beam. This melts a portion of the lead portion 22, and the molten metal adheres to the extension conductor 23. This connects the extension conductor 23 to the lead portion 22. As described above, the extension conductor 23 is welded to the lead portion 22.

The extension module 12 uses laser light to weld multiple extension conductors 23 to each of the multiple lead portions 22 protruding from the protruding surface of the individualized resin portion 21. This extends the length of the multiple lead portions 22. The extension conductors 23 may be bent. In this case, the number of times the extension conductors 23 are bent is not limited to one time, and may be two or more times.

The extension module 12 passes the semiconductor components 2 created by extending the length of the multiple lead portions 22 to the component storage module 13. The component storage module 13 stores the multiple semiconductor components 2 received from the extension module 12 in a case (not shown).

Figure 8 is a flowchart showing the steps of the method for manufacturing the semiconductor component 2. As described above, the resin molding module 10 of the manufacturing device 1 first forms multiple resin portions by sealing each of the multiple semiconductor chips 25 fixed to the lead frame 3 with resin (step S1). After step S1 is performed, the singulation module 11 of the manufacturing device 1 singulates the multiple resin portions 21 by cutting the lead frame 3 on which the multiple resin portions 21 are formed (step S2).

After step S2 is performed, the extension module 12 of the manufacturing device 1 extends the length of the multiple lead portions 22 protruding from the individualized resin portion 21 (step S3). This produces a semiconductor component 2. After step S3 is performed, the component storage module 13 of the manufacturing device 1 stores the multiple manufactured semiconductor components 2 in a case (step S4). After step S4 is performed, the manufacturing method for the semiconductor component 2 ends.

In the manufacturing device 1 configured as described above, after the multiple resin portions 21 are separated into individual pieces, the lengths of the multiple lead portions 22 protruding from the protruding surfaces of the resin portions 21 are extended. Therefore, in the lead frame 3, the two lead portions 22 connecting the two resin portions 21 whose protruding surfaces face each other may be short. When the two lead portions 22 are short, the resin molding module 10 can form a large number of resin portions 21 in the lead frame 3.

The extension module 12 uses laser light to weld the extension conductor 23 to the lead portion 22. Because laser light is highly directional, the area of the lead portion 22 on which the laser light strikes is small. This allows localized heating to be achieved. As a result, the extension module 12 can extend the length of the lead portion 22 in a short time. In addition, because light is used as the heat source, no large current flows through the semiconductor chip 25 via the lead portion 22 during welding. For the same reason, no large voltage is applied to the semiconductor chip 25 via the lead portion 22 during welding. Therefore, there is a low possibility that the semiconductor chip 25 will fail while the extension module 12 is extending the length of the lead portion 22.

The shape of the extension conductor 23 is not limited to a rod shape, but may be, for example, a long plate shape.

(Embodiment 2)
In the first embodiment, the component storage module 13 stores the semiconductor components 2 in a case. However, the objects stored in the component storage module 13 are not limited to the semiconductor components 2.
The following describes the differences between embodiment 2 and embodiment 1. Except for the configuration described below, the configuration is the same as embodiment 1. For this reason, components that are the same as those in embodiment 1 are given the same reference numerals as those in embodiment 1, and descriptions of those components are omitted.

Figure 9 is an explanatory diagram of the storage performed by the component storage module 13 in the second embodiment. In the second embodiment, the component storage module 13 stores in the case 6, not a plurality of semiconductor components 2, but a plurality of resin parts 21 singulated by the singulation module 11. The case 6 is cylindrical. One end face of the case 6 is closed. The other end face of the case 6 is open. This forms an insertion opening 60 in the other end face. The component storage module 13 inserts the singulated resin parts 21 into the case 6 sequentially from the insertion opening 60.

The case 6 has a recess 61. The recess 61 extends along the axial direction of the case 6. Within the case 6, one surface of the resin portion 21 from which the mounting piece 20 protrudes is supported by the recess 61. The case 6 is sometimes called a tube.

As described in the description of the first embodiment, the multiple lead portions 22 protruding from the protruding surface of the resin portion 21 may be short. If the multiple lead portions 22 are short, there is a low possibility that the lead portions 22 protruding from the resin portion 21 will hit the insertion opening 60 of the case 6 when the resin portion 21 is stored in the case 6. Therefore, there is a low possibility that the shape of the lead portions 22 will be deformed when the resin portion 21 is stored.

For example, a resin molding module 10, a singulation module 11, and a component storage module 13 are installed in a first factory. An extension module 12 is arranged in a second factory where the semiconductor components 2 are mounted. As described above, in the first factory, the component storage module 13 stores the multiple resin parts 21 singulated by the singulation module 11 in the case 6. The case 6 storing the multiple singulated resin parts 21 is transported from the first factory to the second factory. In the second factory, the extension module 12 extends the multiple lead parts 22 of the resin part 21 stored in the case 6. The semiconductor components 2 are manufactured in the second factory.
The manufacturing apparatus 1 in the second embodiment achieves the same effects as those achieved in the first embodiment.

(Embodiment 3)
In the extension module 12 according to the first embodiment, the length of the lead portion 22 is extended by welding the extension conductor 23 to the lead portion 22. However, the method of extending the length of the lead portion 22 is not limited to the method of welding the extension conductor 23.
The following describes the differences between embodiment 3 and embodiment 1. Except for the configuration described below, the configuration is the same as embodiment 1. For this reason, components that are the same as those in embodiment 1 are given the same reference numerals as those in embodiment 1, and descriptions of those components are omitted.

Figure 10 is an explanatory diagram of the appearance of the crimp terminal 7 in the third embodiment. The extension module 12 in the third embodiment uses the crimp terminal 7 to extend the length of the lead portion 22. Figure 10 shows the top and bottom surfaces of the crimp terminal 7. In the crimp terminal 7, a cylindrical body 70 with both end faces open is arranged. Therefore, the cylindrical body 70 is provided with a through hole 70a that penetrates in the axial direction of the cylindrical body 70. A long plate body 71 protrudes from the end of the cylindrical body 70 along the axial direction of the cylindrical body 70. The cylindrical body 70 and the long plate body 71 are conductive. The longitudinal direction of the long plate body 71 coincides with the axial direction of the cylindrical body 70.

Note that the coincidence of the longitudinal direction and the axial direction does not mean only exact coincidence, but also includes substantial coincidence. Therefore, when the angle between the longitudinal direction and the axial direction is within the error range, the longitudinal direction and the axial direction are coincident.

Figure 11 is an explanatory diagram of a method for extending the lead portion 22 using a crimp terminal 7. As shown in the upper part of Figure 11, the extension module 12 passes each of the multiple lead portions 22 protruding from the resin portion 21 through the through holes 70a of the multiple crimp terminals 7. With the lead portions 22 passing through the through holes 70a of the cylindrical body 70, the cylindrical body 70 is crimped using a tool, for example, crimping pliers. This causes the cylindrical body 70 to deform and a portion of the cylindrical body 70 to become recessed, as shown in the lower part of Figure 11. As a result, the cylindrical body 70 is crimped to the lead portion 22, and the lead portion 22 is conductive to the crimp terminal 7.

As described above, in step S2 of the method for manufacturing the semiconductor component 2, the extension module 12 crimps the multiple crimp terminals 7 to the multiple lead portions 22, respectively. This extends the length of the multiple lead portions 22. The crimp terminals 7 function as second conductors.

The extension module 12 extends the lead portion 22 by crimping the crimp terminal 7 to the lead portion 22, so that while the length of the lead portion 22 is being extended, no voltage is applied to the semiconductor chip 25 and no current flows through the semiconductor chip 25. Therefore, the possibility of the semiconductor chip 25 failing while the length of the lead portion 22 is being extended is low.

The manufacturing apparatus 1 in the third embodiment provides the same effects as the manufacturing apparatus 1 in the first embodiment, except for the effect obtained by performing welding using a laser beam.
In the component storage module 13 according to the third embodiment, similarly to the second embodiment, the plurality of individual resin portions 21 may be stored in the case 6 before the length of the lead portion 22 is extended. The long plate body 71 may be bent. In this case, the number of times of bending is not limited to one, and may be two or more.

(Embodiment 4)
In the extension module 12 according to the first embodiment, the length of the lead portion 22 is extended by welding the extension conductor 23 to the lead portion 22. However, the method of extending the length of the lead portion 22 is not limited to the method of welding the extension conductor 23.
The following describes the differences between embodiment 4 and embodiment 1. Except for the configuration described below, the configuration is the same as embodiment 1. For this reason, components that are the same as those in embodiment 1 are given the same reference numerals as those in embodiment 1, and descriptions of those components are omitted.

Figure 12 is an explanatory diagram of the appearance of an extension electric device 8 in embodiment 4. The extension module 12 in embodiment 4 uses an electric device 8 to extend the length of the lead portion 22. Figure 12 shows a side and a plan view of the electric device 8. As shown in Figure 12, the electric device 8 has an outlet 81 in the device body 80 into which multiple lead portions 22 are inserted. The area of the opening of the outlet 81 is larger than the cross-sectional area of the lead portion 22.

In addition, multiple rod-shaped appliance terminals 82 protrude from one side of the appliance body 80. Each side wall of the multiple sockets 81 is electrically connected to the multiple appliance terminals 82.

Figure 13 is an explanatory diagram of a method for extending the lead portion 22 using an electric appliance 8. Figure 13 shows the state before the multiple lead portions 22 are inserted into the electric appliance 8, and the state after the multiple lead portions 22 are inserted into the electric appliance 8. As shown in Figure 13, the extension module 12 inserts each of the multiple lead portions 22 protruding from the resin portion 21 into a plurality of sockets 81 provided in the appliance body 80. As a result, each of the multiple lead portions 22 is conductive to a plurality of appliance terminals 82, and the length of the multiple lead portions 22 is extended.

As described above, in step S2 of the method for manufacturing the semiconductor component 2, the extension module 12 inserts each of the multiple lead portions 22 into a common electrical device 8. This extends the length of the multiple lead portions 22. This makes it easy to extend the length of the lead portions 22.

The manufacturing apparatus 1 in the fourth embodiment provides the same effects as the manufacturing apparatus 1 in the first embodiment, except for the effect obtained by performing welding using a laser beam.
In the component storage module 13 according to the fourth embodiment, similarly to the second embodiment, the plurality of individual resin portions 21 may be stored in the case 6 before the length of the lead portion 22 is extended.

In the fourth embodiment, the shape of the appliance terminal 82 is not limited to a rod shape, and may be, for example, a long plate shape. The appliance terminal 82 may also be bent. In this case, the number of times of bending is not limited to one time, and may be two or more times.

In embodiments 1 to 4, the shape of the resin portion 21 is not limited to a rectangular parallelepiped shape and may be, for example, a cylindrical shape.

The following provides an overview of the semiconductor component 2 manufacturing device 1 and the semiconductor component 2 manufacturing method disclosed herein.

(1) The manufacturing method of the semiconductor component 2 disclosed herein is a manufacturing method of a semiconductor component 2 having a resin portion 21 in which a semiconductor chip 25 is sealed with resin and a plurality of lead portions 22 protruding in a common direction from one side of the resin portion 21, and includes the steps of cutting a lead frame 3 in which the plurality of resin portions 21 are formed to separate the plurality of resin portions 21, and extending the lengths of the plurality of lead portions 22 protruding from the separated resin portions 21, in which in the lead frame 3, the protruding surface of each resin portion 21 from which the lead portions 22 protrude faces the protruding surface of the other resin portion 21, and the protruding ends of the two lead portions 22 protruding from each of the two opposing protruding surfaces are connected to each other.

According to the manufacturing method described in (1) above, after the multiple resin portions 21 are diced into individual pieces, the lengths of the multiple lead portions 22 protruding from the resin portions 21 are extended. Therefore, in the lead frame 3, the two lead portions 22 connecting the two resin portions 21 whose protruding surfaces face each other may be short. When the lead portions 22 provided on the lead frame 3 are short, a large number of resin portions 21 can be formed in the lead frame 3.
For example, before extending the length of the lead portion 22, the plurality of resin portions 21 are housed in the case 6. If the lead portion 22 is short, there is a low possibility that the lead portion 22 will hit the insertion opening of the case 6. Therefore, there is a low possibility that the shape of the lead portion 22 will be deformed when the resin portion 21 is housed.

(2) The manufacturing method described in (1) above may further include a step of forming a plurality of resin portions 21 by sealing each of the plurality of semiconductor chips 25 fixed to the lead frame 3 with resin.

According to the manufacturing method described in (2) above, each of the multiple semiconductor chips 25 fixed to the lead frame 3 is sealed with resin, and then the multiple resin portions 21 are separated into individual pieces.

(3) With respect to the manufacturing method described in (1) or (2) above, in the step of extending the length of the multiple lead portions 22, multiple extension conductors 23 may be welded to each of the multiple lead portions 22 using laser light.

According to the manufacturing method (3) above, the extension conductor 23 is welded to the lead portion 22 using laser light. Laser light is highly directional, so the area on which the laser light hits is small. This allows localized heating to be achieved. As a result, the length of the lead portion 22 can be extended in a short time. Also, because the heat source is light, no large current flows through the semiconductor chip 25 during welding. Furthermore, no large voltage is applied to the semiconductor chip 25 during welding. Therefore, there is a low possibility that the semiconductor chip 25 will break down while the length of the lead portion 22 is being extended.

(4) With respect to the manufacturing method described in (1) or (2) above, in the step of extending the length of the multiple lead portions 22, multiple crimp terminals 7 (second conductors) may be crimped to each of the multiple lead portions 22.

According to the manufacturing method (4) above, the crimp terminal 7 is crimped to the lead portion 22. Therefore, while the length of the lead portion 22 is being extended, no voltage is applied to the semiconductor chip 25, and no current flows through the semiconductor chip 25. Therefore, the possibility of the semiconductor chip 25 failing while the length of the lead portion 22 is being extended is low.

(5) In the manufacturing method described in (1) or (2) above, in the step of extending the length of the multiple lead portions 22, the multiple lead portions 22 may be inserted into a common electrical device 8.

According to the manufacturing method described in (5) above, the length of the lead portion 22 can be easily extended by inserting multiple lead portions 22 into a common electrical device 8.

(6) The manufacturing apparatus 1 for manufacturing semiconductor components 2 of the present disclosure is a manufacturing apparatus for semiconductor components used in any one of the manufacturing methods described in (1) to (5) above, and includes a resin molding module 10 that forms multiple resin portions 21 by sealing each of multiple semiconductor chips 25 fixed to a lead frame 3 with resin, a singulation module 11 that singulates the multiple resin portions 21 by cutting the lead frame 3 after the resin molding module 10 has formed the multiple resin portions 21, and an extension module 12 that extends the length of multiple lead portions 22 protruding from the resin portions 21 singulated by the singulation module 11.

According to the manufacturing apparatus described in (6) above, similarly to the manufacturing method described in (1) above, the two lead portions 22 connecting the two resin portions 21 whose protruding surfaces face each other may be short. When the lead portions 22 provided on the lead frame 3 are short, a large number of resin portions 21 can be formed on the lead frame 3.
For example, in the component storage module 13, a plurality of resin portions 21 are stored in the case 6 before the length of the lead portion 22 is extended. If the lead portion 22 is short, there is a low possibility that the lead portion 22 will hit the insertion opening of the case 6. Therefore, there is a low possibility that the shape of the lead portion 22 will be deformed when the resin portion 21 is stored.

1 Manufacturing device 2 Semiconductor component 3 Lead frame 7 Crimp terminal (second conductor)
8 Electrical appliance 10 Resin molding module 11 Singulated module 12 Extension module 12
21 resin portion 22 lead portion 23 conductor (extension conductor)
25 Semiconductor chips

Claims (6)

1. A method for manufacturing a semiconductor component having a resin portion in which a semiconductor chip is sealed with resin, and a plurality of lead portions protruding in a common direction from one surface of the resin portion, comprising:
cutting the lead frame on which the resin portions are formed to separate the resin portions;
and extending lengths of the plurality of lead portions protruding from the individualized resin portion,
In the lead frame, the protruding surface of each resin portion from which the lead portions protrude faces the protruding surface of the other resin portion, and the protruding ends of the two lead portions protruding from each of the two opposing protruding surfaces are connected to each other. The method for manufacturing a semiconductor component according to claim 1 , further comprising the step of forming a plurality of said resin portions by sealing each of the plurality of said semiconductor chips fixed to the lead frame with a resin. The method for manufacturing a semiconductor component according to claim 1 , wherein in the step of extending the lengths of the plurality of lead portions, a plurality of conductors are welded to each of the plurality of lead portions using a laser beam. 2. The method for manufacturing a semiconductor component according to claim 1 , wherein in the step of extending the lengths of the plurality of lead portions, a plurality of second conductors are crimped to each of the plurality of lead portions. The method for manufacturing a semiconductor component according to claim 1 , wherein the step of extending the lengths of the plurality of lead portions includes inserting the plurality of lead portions into a common electric device. 6. A semiconductor component manufacturing apparatus for use in the manufacturing method according to claim 1,
a resin molding module in which a plurality of the resin portions are formed by sealing each of the plurality of semiconductor chips fixed to the lead frame with resin;
a singulation module that singulates the plurality of resin portions by cutting the lead frame after the resin molding module has formed the plurality of resin portions; and
an extension module that extends a length of the plurality of lead portions protruding from the resin portion singulated by the singulation module.

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