JP7707607B2 - Method for manufacturing a support member and method for manufacturing a semiconductor device - Google Patents

Description

This disclosure relates to a method for manufacturing a support member and a method for manufacturing a semiconductor device.

As one aspect of semiconductor devices, a structure in which a semiconductor chip is stacked on top of another semiconductor chip arranged on a substrate has attracted attention. For example, Patent Document 1 discloses a configuration in which another semiconductor chip is stacked on top of a semiconductor chip via a spacer. Patent Document 2 discloses a semiconductor die assembly including a controller die and a memory die supported by a support member on top of the controller die. This type of structure is also called, for example, a Dolmen structure.

JP 2007-220913 A Special table 2017-515306 publication

For example, the structure of the semiconductor device shown in Patent Document 2 uses a support member that contains an expensive silicon chip. In addition, to manufacture this support member, a process of polishing silicon or the like is required before dicing into individual support members. Therefore, it has been considered to manufacture inexpensive support members that do not contain silicon chips from a resin film, for example, an adhesive film such as DAF (Die Attach Film). However, when a support member is made from a resin film that does not contain silicon, if the resin film is diced, sticky burrs generated by dicing may adhere between the individual support members and hinder picking up of the support members.

Therefore, the present disclosure provides a method for manufacturing a support member that can improve the pick-up ability of the support member, and a method for manufacturing a semiconductor device using the support member manufactured by this manufacturing method.

The present disclosure relates to a method for manufacturing a support member. This manufacturing method includes the steps of preparing a laminated film in which an adhesive film is attached to a base film via an adhesive layer, singulating the adhesive film into a plurality of support members, and picking up each of the plurality of support members from the base film. In the picking up step, each of the plurality of support members is picked up in a state in which the base film is expanded by an expansion amount of 3 mm or more and 9 mm or less.

In the above manufacturing method, when picking up the individualized support members, the base film is expanded by an expansion amount of 3 mm to 9 mm, and each support member is picked up. In this case, since the expansion amount is larger than usual, the burrs adhering to the sides of each individualized support member can be peeled off by the expansion, and the state in which adjacent support members are stuck to each other by the burrs can be eliminated. Therefore, according to this manufacturing method, when picking up each individualized support member, adjacent support members are not connected to each other by burrs, so that the pick-up ability of the individualized support members can be improved. Note that the "expansion amount" referred to here is the amount (distance) by which the base film is lifted when the base film is lifted relative to the fixed end (e.g., the end attached to the ring) to increase the distance between the support members.

The manufacturing method of the support member may further include a step of attaching the base film to the ring via an adhesive layer so that the adhesive film is placed inside the ring for singulation, and in this attaching step, the laminated film may be attached to the ring while applying tension to the laminated film so that the elongation rate of the laminated film is greater than 100%. In this case, before dicing, tension is applied to the laminated film so that it is stretched outward, and the tension is released by dicing. Therefore, even if burrs are formed between adjacent support members by dicing, the burrs are scraped out from the dicing grooves between the support members due to the sudden shrinkage caused by the release of this tension, so that the adjacent support members are not connected by the burrs, and the pick-up ability of the singulated support members can be further improved. Note that the "elongation rate of the laminated film" referred to here is a value indicating the elongation rate of the laminated film when attached to the ring, with the laminated film before being attached to the ring as the reference (100%).

In the above-mentioned method for manufacturing a support member, in the bonding step, the laminate film may be bonded to the ring while applying tension to the laminate film so that the elongation rate of the laminate film is 101% or less. In this case, since the tension applied to the laminate film is not so high, the elongation force applied to the adhesive film constituting the laminate film is also kept low, and when the laminate film is bonded to the ring, peeling of the adhesive film from the base film is reduced. Peeling is particularly likely to occur near the outer periphery of the base film (adhesive layer) and the adhesive film, but the above-mentioned manufacturing method reduces peeling of the adhesive film from the base film. As a result, voids are less likely to occur between the laminate consisting of the base film and the adhesive layer and the adhesive film. By reducing such voids, this manufacturing method makes it possible to suppress chip flying during individualization and to manufacture inexpensive support members with a high yield.

In the above-mentioned method for manufacturing a support member, in the picking up step, each of the multiple support members may be picked up in a state in which the base film is expanded by an expansion amount of 5 mm or more and 9 mm or less. In this case, since the expansion amount is set to a range of values even larger than usual, burrs adhering to the sides, etc. of each individualized support member can be more strongly peeled off, and the state in which adjacent support members are adhered to each other by burrs can be eliminated. Therefore, according to this manufacturing method, when each individualized support member is picked up, the pick-up ability of the individualized support members can be further improved.

In the above-mentioned method for manufacturing a support member, in the picking up step, the base film may be pushed up by a push-up amount of 300 μm or more in a push-up direction intersecting with the expanding direction to pick up each of the multiple support members. In this case, the support members can be spaced farther from the base film when picked up, which further improves the pick-up ability of the individualized support members.

In the above-mentioned method for manufacturing a support member, the adhesive film may have a tensile modulus of elasticity of 8.0 MPa or more. The adhesive film may also contain polyimide. In this case, it is possible to obtain a support member that is inexpensive and has excellent strength.

In the above-mentioned method for producing a support member, the adhesive film may include a pair of surface layers made of a cured product of a thermosetting resin composition and an intermediate layer disposed between the pair of surface layers. In this case, even if the adhesive film has a multilayer structure and is formed to be relatively thick, warping of the adhesive film can be suppressed. By suppressing warping, this production method makes it possible to make the thickness of the adhesive film spreading in the planar direction more uniform, and to make the thickness of the produced support member more uniform. In this embodiment, the intermediate layer may be a polyimide layer or a metal layer. This makes it possible to obtain a support member with excellent strength and heat resistance. The thickness of the intermediate layer may be 50 μm or less. This makes it possible to make the support member thin without making it too thick, even if it has a multilayer structure.

The present disclosure relates to a method for manufacturing a semiconductor device. This manufacturing method is a method for manufacturing a semiconductor device using a support member manufactured by any of the above-mentioned methods for manufacturing a support member. In this case, it is possible to form a semiconductor device at low cost using a support member that has improved pick-up properties and is manufactured at low cost.

The present disclosure provides a method for manufacturing a support member that can improve the pick-up properties of the support member, and a method for manufacturing a semiconductor device using the support member manufactured by the manufacturing method.

FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor device using a support piece manufactured by a manufacturing method according to the present embodiment. 2A and 2B are plan views each showing a schematic example of the positional relationship between a first chip and a plurality of support pieces. FIG. 3(a) is a plan view showing one embodiment of a laminated film for forming a support piece, and FIG. 3(b) is a cross-sectional view of the laminated film taken along line bb in FIG. 3(a). FIG. 4 is a cross-sectional view that typically illustrates a process of bonding a base film to an adhesive film for forming a support piece via an adhesive layer. 5(a) to 5(c) are cross-sectional views that typically show the process of producing the support piece. FIG. 6 is a perspective view that typically illustrates a step of attaching the laminated film to a dicing ring. Figure 7(a) is a cross-sectional view showing the state of a burr that remains between the support pieces when the amount of expansion at the time of picking up is small, and Figure 7(b) is a cross-sectional view showing the state of a burr that has been peeled off from the support pieces when the amount of expansion at the time of picking up is large. FIG. 8(a) is a cross-sectional view showing a schematic state of burrs that remain between support pieces after dicing when the bonding tension in the lamination process is weak, and FIG. 8(b) is a cross-sectional view showing a schematic state of burrs at the time of pick-up following FIG. 8(a). FIG. 9(a) is a cross-sectional view showing a state in which burrs adhering between support pieces when the bonding tension in the lamination process is strong are scraped out of the dicing groove when the tension is released during dicing, and FIG. 9(b) is a cross-sectional view showing a state of the burrs at the time of pick-up following FIG. 9(a). FIG. 10 is a cross-sectional view showing a modified example of the laminated film. FIG. 11 is a diagram showing a step of the method for manufacturing the semiconductor device shown in FIG. 1, and is a cross-sectional view showing a state in which a plurality of support pieces are arranged around the first chip on the substrate. FIG. 12 is a cross-sectional view showing an example of a chip with an adhesive piece used in the method for manufacturing the semiconductor device shown in FIG. 13 is a diagram showing a step of the method for manufacturing the semiconductor device shown in FIG. 1 subsequent to FIG. 11, and is a cross-sectional view typically showing a dolmen structure formed on a substrate.

Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and duplicated explanations will be omitted. Furthermore, unless otherwise specified, the positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings. Furthermore, the dimensional ratios of the drawings are not limited to the ratios shown. In this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, and "(meth)acrylate" means acrylate or the corresponding methacrylate. "A or B" may include either A or B, or may include both.

In this specification, the term "layer" includes structures that are formed over the entire surface when observed in a plan view, as well as structures that are formed on only a portion of the surface. In addition, in this specification, the term "process" includes not only independent processes, but also processes that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved. In addition, a numerical range indicated using "~" indicates a range that includes the numerical values before and after "~" as the minimum and maximum values, respectively.

In this specification, the content of each component in the composition means the total amount of the multiple substances present in the composition when multiple substances corresponding to each component are present in the composition, unless otherwise specified. Furthermore, unless otherwise specified, the example materials may be used alone or in combination of two or more types. Furthermore, in the numerical ranges described in stages in this specification, the upper or lower limit of a certain numerical range may be replaced by the upper or lower limit of a numerical range of another stage. Furthermore, in the numerical ranges described in this specification, the upper or lower limit of the numerical range may be replaced by the values shown in the examples.

(Semiconductor device)
Fig. 1 is a cross-sectional view showing one embodiment of a semiconductor device using a support piece manufactured by the manufacturing method according to this embodiment. As shown in Fig. 1, the semiconductor device 1 includes a substrate 10, a semiconductor chip 20, a semiconductor chip 21, a semiconductor chip 22, a semiconductor chip 23, a plurality of support pieces 30 (a plurality of support members), adhesive pieces 40 to 43, wires 45 to 48, and a sealing material 50. The support piece manufactured by the manufacturing method according to this embodiment may be used in the manufacture of other semiconductor devices.

The substrate 10 may be an organic substrate or a metal substrate such as a lead frame. From the viewpoint of suppressing warping of the semiconductor device 1, the thickness of the substrate 10 is, for example, 90 to 300 μm, and may be 90 to 210 μm.

The semiconductor chip 20 is, for example, a controller chip (hereinafter also referred to as "CTL"), and is disposed on the surface of the substrate 10. The semiconductor chip 20 is adhered to the substrate 10 by an adhesive piece 40 and is electrically connected to the substrate 10 by a wire 45. The shape of the semiconductor chip 20 in a plan view is, for example, a rectangle (square or oblong). The length of one side of the semiconductor chip 20 is, for example, 5 mm or less, and may be 2 to 5 mm or 1 to 5 mm. The thickness of the semiconductor chip 20 is, for example, 10 to 150 μm, and may be 20 to 100 μm.

The semiconductor chip 21 is, for example, a memory chip, and is adhered to the support piece 30 via the adhesive piece 41. As a result, the semiconductor chip 21 is disposed on the semiconductor chip 20. The adhesive piece 41 is sandwiched between the semiconductor chip 21 and the multiple support pieces 30. The semiconductor chip 21 has a size larger than the semiconductor chip 20 in a planar view. The shape of the semiconductor chip 21 in a planar view is, for example, a rectangle (square or oblong). The length of one side of the semiconductor chip 21 is, for example, 20 mm or less, and may be 4 to 20 mm or 4 to 12 mm. The thickness of the semiconductor chip 21 is, for example, 10 to 170 μm, and may be 20 to 120 μm. The semiconductor chips 22 and 23 are, for example, memory chips, like the semiconductor chip 21, and are adhered to the semiconductor chip 21 in order via the adhesive pieces 42 and 43. The length of one side of the semiconductor chips 22 and 23 may be the same as that of the semiconductor chip 21, and the thickness of the semiconductor chips 22 and 23 may be the same as that of the semiconductor chip 21.

The support piece 30 is a member that is arranged around the semiconductor chip 20 on the surface of the substrate 10 and serves as a spacer that forms a space around the semiconductor chip 20. The support piece 30 is made of, for example, a cured product of a thermosetting resin composition. As shown in FIG. 2(a), two support pieces 30 (rectangular shape) may be arranged at positions separated from each other on both sides of the semiconductor chip 20, or as shown in FIG. 2(b), one support piece 30 (square shape, total of four pieces) may be arranged at positions corresponding to the corners of the semiconductor chip 20. The length of one side of the support piece 30 in a plan view is, for example, 20 mm or less, and may be 1 to 20 mm or 1 to 12 mm. The thickness (height) of the support piece 30 is, for example, 10 to 180 μm, and may be 20 to 120 μm.

In this embodiment, a dolmen structure is formed on the substrate 10 by the semiconductor chip 21, a number of support pieces 30, and an adhesive piece 41 located between the support pieces 30 and the semiconductor chip 21. In the semiconductor device 1 shown in FIG. 1, the semiconductor chip 20 is spaced apart from the adhesive piece 41. By appropriately setting the thickness of the support piece 30, it is possible to ensure space for the wire 45 that connects the upper surface of the semiconductor chip 20 to the substrate 10. Note that when the semiconductor chip 20 is flip-chip connected to an electrode on the substrate 10, the adhesive piece 41 may be configured to contact the upper surface of the semiconductor chip 20.

The wires 45-48 electrically connect the electrodes (not shown) on the surface of the substrate 10 to the semiconductor chips 20-23, respectively. The sealing material 50 fills the gap between the semiconductor chips 20 and 21, and seals the substrate 10 so as to entirely cover the semiconductor chips 21-23 and the wires 46-48. The sealing material 50 is, for example, an epoxy resin.

(Method of manufacturing the support piece)
Next, an example of a method for producing a support piece used in the above-mentioned semiconductor device will be described. The support piece 30 shown in Fig. 1 is a product obtained after the thermosetting resin composition has hardened (cured product). On the other hand, the support piece produced by this production method is a product obtained before the thermosetting resin composition has completely hardened.

First, prepare a laminated film 60 for forming a support piece as shown in FIG. 3(a) and FIG. 3(b). The laminated film 60 includes a base film 61, an adhesive layer 62, and an adhesive film 63 for forming a support piece. The base film 61 and the adhesive layer 62 are formed, for example, into a circle by punching or the like (see FIG. 3(a)). The adhesive film 63 is a film that is the material for forming the support piece 30. The adhesive film 63 is formed into a circle by punching or the like, and has a smaller diameter than the base film 61 and the adhesive layer 62 (see FIG. 3(a)).

The base film 61 is, for example, a polypropylene film (PP film) or a polyethylene film (PE film). The adhesive layer 62 is, for example, made of an ultraviolet-curing adhesive. That is, the adhesive layer 62 has a property that the adhesiveness decreases when irradiated with ultraviolet light. The base film 61 and the adhesive layer 62 constitute a first laminate 65 (see FIG. 4). The first laminate 65 is, for example, a dicing tape (DCT), and has at least one of a tensile strength of 15 MPa to 40 MPa and an elongation rate of 300% to 700%. The first laminate 65 can use a base film that is easy to stretch or a base film that is difficult to stretch, depending on the application. When a base film that is easy to stretch is used, the first laminate 65 can have a tensile strength of 15 MPa to less than 30 MPa and an elongation rate of 600% to 700%. When a substrate film that is difficult to stretch is used, the first laminate 65 can have a tensile strength of 30 MPa or more and 40 MPa or less, and an elongation percentage of 300% or more and less than 600%.

The above-mentioned "tensile strength" and "elongation" can be calculated by the following method. First, a test piece is prepared by cutting it so that the test piece size is 10 mm in width and 50 mm in length with a chuck distance. The test equipment used is a tensile tester specified in JIS B7721 or an equivalent tensile tester. The test piece is then set in this test equipment and pulled at a speed of 300±30 mm/min, and the load and elongation until the test piece breaks are measured. From these measured values, the "tensile strength" and "elongation" are calculated based on the following formula.
Tensile strength (MPa) = strength at tape break (N) ÷ tape cross-sectional area (mm ² )
Elongation (%) = (length at break (mm) - initial length (50 mm)) ÷ initial length (50 mm)

The adhesive film 63 is made of, for example, a thermosetting resin composition. The thermosetting resin composition constituting the adhesive film 63 can go through a semi-cured (B stage) state and then become a completely cured (C stage) state by a subsequent curing process. The thermosetting resin composition contains an epoxy resin, a curing agent, and an elastomer (e.g., acrylic resin), and further contains an inorganic filler and a curing accelerator, etc., as necessary. Details of the thermosetting resin composition constituting the adhesive film 63 will be described later.

The laminated film 60 can be produced, for example, by bonding a first laminate 65 having a base film 61 and an adhesive layer 62 on its surface, and a second laminate 66 having a cover film 64 and an adhesive film 63 on its surface (see FIG. 4). The first laminate 65 is obtained through a process of forming an adhesive layer 62 on the surface of the base film 61 by coating, and a process of processing the base film 61 and the adhesive layer 62 into a predetermined shape (e.g., circular) by punching or the like. The second laminate 66 is obtained through a process of forming an adhesive film 63 on the surface of a cover film 64 (e.g., a PET film or a polyethylene film) by coating, and a process of processing the adhesive film 63 into a predetermined shape (e.g., circular) by punching or the like. When using the laminated film 60, the cover film 64 is peeled off at an appropriate time.

Next, as shown in (a) of FIG. 5, a ring frame 100 (ring) for dicing is attached to the laminated film 60 described above. That is, the base film 61 is attached to the ring frame 100 via the adhesive layer 62, and the adhesive film 63 is arranged inside the ring frame 100. As shown in FIG. 6, the ring frame 100 is, for example, a ring having a substantially circular ring shape, and the outer periphery of the laminated body 65 including the base film 61 is attached to the ring frame 100 via the adhesive layer 62. This attachment is performed while pressing from one end 100a of the ring frame 100 to the other end 100b with a pressing member such as a roller. Note that the roller may be fixed so as not to move horizontally (rotational movement is possible), and the ring frame 100 and the laminated film 60 may be configured to move relative to the roller.

In addition, during this attachment, the laminated film 60 consisting of the base film 61, the adhesive layer 62, and the adhesive film 63 is attached to the ring frame 100 so that a certain amount of tension is applied. Specifically, the laminated film 60 is attached to the ring frame 100 by applying tension so that the elongation rate of the laminated film 60 when attached is greater than 100%. Preferably, the laminated film 60 may be attached to the ring frame 100 by applying tension so that the elongation rate of the laminated film 60 when attached is 100.40% or more, and more preferably, the laminated film 60 may be attached to the ring frame 100 by applying tension so that the elongation rate of the laminated film 60 when attached is 101% or more. By attaching the laminated film 60 to the ring frame 100 in this manner while applying a predetermined tension to the laminated film 60, burrs due to dicing are scraped out of the dicing grooves by releasing the tension during dicing, which will be described later (see FIG. 9(a)), and the pick-up property of the support piece can be improved (see FIG. 9(b)). The "elongation rate of the laminated film" referred to here is a value that indicates the ratio of the length (diameter) of the laminated film after application to the length (diameter) of the laminated film before application, which is taken as 100%.

The laminated film 60 may be applied with tension so that the elongation rate of the laminated film 60 is 101% or less when it is applied to the ring frame 100. In this case, since the tension applied to the laminated film 60 is not so high, the elongation force applied to the adhesive film 63 constituting the laminated film 60 is also kept low, and when the laminated film 60 is applied to the ring frame 100, peeling of the adhesive film 63 from the base film 61 is reduced. Peeling is particularly likely to occur near the outer periphery of the base film 61 (adhesive layer 62) and the adhesive film 63, but by keeping the elongation rate of the laminated film 60 within the above range, peeling of the adhesive film 63 from the base film 61 is reduced. Therefore, by applying tension to the laminated film 60 so that the elongation rate of the laminated film 60 is greater than 100% and less than 101% when it is applied to the ring frame 100, it is possible to achieve both improved pick-up properties of the support piece and reduced peeling of the laminated film 60.

Next, when the lamination film 60 has been attached to the ring frame 100, the adhesive film 63 is diced into individual pieces, as shown in FIG. 5(b). This results in a large number of support pieces 63a being obtained from the adhesive film 63. The adhesive layer 62 is then irradiated with ultraviolet light to reduce the adhesive force between the adhesive layer 62 and the support pieces 63a. After the ultraviolet light irradiation is complete, the base film 61 may be expanded horizontally outward to separate the support pieces 63a from each other.

5(c), the substrate film 61 is pushed up by the push-up jig 111 in the expanded state to peel off each support piece 63a from the adhesive layer 62, and the support piece 63a is picked up by suction with the suction collet 112. The amount of expansion performed at this pick-up (expansion amount E) is 3 mm or more and 9 mm or less. More preferably, the expansion amount E may be 5 mm or more and 9 mm or less, or may be 5 mm or more and 7 mm or less. By picking up the support piece 63a while expanding with such an expansion amount E larger than usual, the burrs adhering between the support pieces 63a are peeled off, and the pickup by the suction collet 112 can be easily and reliably performed. Note that the "expansion amount E" here means the amount (distance) by which the center part of the substrate film 61 is lifted by the expansion jig relative to the end part of the substrate film 61 attached to the ring frame 100. The amount of push-up by the push-up jig 111 may be 300 μm or more, and more preferably 400 μm or more. The speed of push-up by the push-up jig 111 may be 0.1 mm/s or more, 1 mm/s or more, or 10 mm/s or more. The adhesive film 63 before dicing or the support piece 63a before picking up may be heated to allow the curing reaction of the thermosetting resin to proceed. The support piece 63a is appropriately cured when picked up, so that excellent pick-up properties can be achieved. In this manner, the support piece 63a is obtained.

Now, referring to Figure 7, the effect of picking up the support pieces 63a while expanding the base film 61 by a predetermined range of expansion amount E in the above-mentioned manufacturing method of the support pieces 30 will be described. Figure 7(a) is a cross-sectional view that shows a schematic state of the burr G that remains attached between the support pieces 63a when the expansion amount E at the time of picking is small, and Figure 7(b) is a cross-sectional view that shows a schematic state of the burr G that has been peeled off from the support pieces 63a when the expansion amount E at the time of picking is large.

As shown in FIG. 7(a), when the adhesive film 63 of the laminated film 60 is diced into individual pieces, adhesive burrs G are attached between the support pieces 63a that have been diced. The burrs G are, for example, parts of the adhesive film 63 that have been scraped off by dicing. In this case, if the expansion amount E at the time of picking up is small, the adhesive burrs G left in the dicing grooves H between the support pieces 63a remain attached to the support pieces 63a, and hinder the picking up of each support piece 63a. On the other hand, as shown in FIG. 7(b), in the manufacturing method according to this embodiment, the base film 61 is in an expanded state at the time of picking up, and the area where the burrs G in the dicing grooves H are peeled off from the support pieces 63a or attached is reduced. Therefore, by expanding the laminated film 60 when picking up the support pieces 63a, the burrs G significantly reduce the hindrance of the picking up of the support pieces 63a to the picking up, and the picking up ability is improved. If the expansion amount E is too large (for example, if the expansion amount is greater than 9 mm), the base film 61 etc. will become hard, and as a result, the ability to follow the push-up jig 111 (pin) when pushing up the support piece 63a will decrease, and the pickup rate will decrease.

Also, referring to Figures 8 and 9, the effect of attaching the laminated film to the ring frame 100 with a predetermined attachment tension in the manufacturing method of the support piece 30 described above will be described. Figure 8(a) is a cross-sectional view that shows the state of the burrs that remain between the support pieces after dicing when the attachment tension in the lamination process is weak, and Figure 8(b) is a cross-sectional view that shows the state of the burrs at the time of picking up following Figure 8(a). Figure 9(a) is a cross-sectional view that shows the state of the burrs that remain between the support pieces when the attachment tension in the lamination process is strong and are scraped out of the dicing groove by releasing the tension at the time of dicing, and Figure 9(b) is a cross-sectional view that shows the state of the burrs at the time of picking up following Figure 9(a).

When the base film 61 is attached to the ring frame 100 with the lamination tension of the laminated film 60 low, as shown in FIG. 8(a), when the adhesive film 63 is diced, the sticky burr G remains in the dicing groove. In this state, as shown in FIG. 8(b), when the support piece 63a is picked up, the pick-up is hindered by the burr G. On the other hand, when the base film 61 is attached to the ring frame 100 with the lamination tension of the laminated film 60 high (for example, when the elongation rate of the laminated film is greater than 100%), as shown in FIG. 9(a), when the adhesive film 63 is diced, the burr G is scraped out of the dicing groove H due to the release of the tension during attachment. Therefore, in this state, as shown in FIG. 9(b), even if the support piece 63a is picked up, the pick-up is not hindered by the burr G, and the support piece 63a can be picked up without any problems. That is, the pick-up performance can be improved.

(Thermosetting resin composition constituting the adhesive film 63)
Next, a detailed description will be given of the thermosetting resin composition constituting the adhesive film 63 for forming the support piece 30. As described above, this thermosetting resin composition contains an epoxy resin, a curing agent, and an elastomer, and further contains an inorganic filler and a curing accelerator, etc., as necessary. According to the study by the present inventors, it is preferable that the support piece 63a and the support piece 30 after curing have the following characteristics.
Characteristic 1: When the support piece 30 is thermocompression-bonded to a predetermined position on the substrate 10, it is difficult for misalignment to occur (the melt viscosity of the support piece 30 at 120° C. is, for example, 4300 to 50000 Pa·s or 5000 to 40000 Pa·s).
Characteristic 2: The support piece 30 exhibits stress relaxation properties within the semiconductor device 1 (the thermosetting resin composition contains an elastomer (rubber component)).
Characteristic 3: The adhesive strength of the chip with the adhesive piece to the adhesive piece 41 is sufficiently high (the die shear strength of the support piece 30 to the adhesive piece 41 is, for example, 2.0 to 7.0 MPa or 3.0 to 6.0 MPa).
Characteristic 4: The shrinkage rate associated with curing is sufficiently small. Characteristic 5: The support piece 63a is easily visible by a camera during the pick-up process (the thermosetting resin composition contains, for example, a coloring agent).
Characteristic 6: The support piece 30 has sufficient mechanical strength

[Epoxy resin]
The epoxy resin is not particularly limited as long as it has an adhesive action when cured. Bifunctional epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin, novolac type epoxy resins such as phenol novolac type epoxy resin and cresol novolac type epoxy resin, etc. can be used. In addition, generally known epoxy resins such as multifunctional epoxy resins, glycidylamine type epoxy resins, heterocyclic epoxy resins, and alicyclic epoxy resins can be applied. These may be used alone or in combination of two or more.

[Curing agent]
Examples of the curing agent include phenolic resins, ester compounds, aromatic amines, aliphatic amines, and acid anhydrides. Of these, phenolic resins are preferred from the viewpoint of achieving high die shear strength. Commercially available phenolic resins include, for example, LF-4871 (trade name, BPA novolac type phenolic resin) manufactured by DIC Corporation, HE-100C-30 (trade name, phenylarakyl type phenolic resin) manufactured by Air Water Inc., Phenolite KA and TD series manufactured by DIC Corporation, Milex XLC-series and XL series (e.g., Milex XLC-LL) manufactured by Mitsui Chemicals, Inc., HE series (e.g., HE100C-30) manufactured by Air Water Inc., MEHC-7800 series (e.g., MEHC-7800-4S) manufactured by Meiwa Kasei Co., Ltd., and JDPP series manufactured by JEF Chemical Co., Ltd. These may be used alone or in combination of two or more types.

From the viewpoint of achieving high die shear strength, the blending ratio of the epoxy equivalent to the hydroxyl equivalent of the epoxy resin and the phenolic resin is preferably 0.6 to 1.5, more preferably 0.7 to 1.4, and even more preferably 0.8 to 1.3. By keeping the blending ratio within the above range, it is easy to achieve a sufficiently high level of both curability and fluidity.

[Elastomer]
Examples of the elastomer include acrylic resin, polyester resin, polyamide resin, polyimide resin, silicone resin, polybutadiene, acrylonitrile, epoxy-modified polybutadiene, maleic anhydride-modified polybutadiene, phenol-modified polybutadiene, and carboxy-modified acrylonitrile.

From the viewpoint of achieving high die shear strength, acrylic resins are preferred as elastomers, and more preferably, acrylic resins such as epoxy group-containing (meth)acrylic copolymers obtained by polymerizing functional monomers having epoxy groups or glycidyl groups as crosslinkable functional groups, such as glycidyl acrylate or glycidyl methacrylate. Among acrylic resins, epoxy group-containing (meth)acrylic acid ester copolymers and epoxy group-containing acrylic rubbers are preferred, and epoxy group-containing acrylic rubbers are more preferred. Epoxy group-containing acrylic rubbers are rubbers having epoxy groups, mainly consisting of acrylic acid esters as the main component, and copolymers of butyl acrylate and acrylonitrile, ethyl acrylate and acrylonitrile, etc. The acrylic resins may have not only epoxy groups, but also crosslinkable functional groups such as alcoholic or phenolic hydroxyl groups and carboxyl groups.

Commercially available acrylic resins include Nagase Chemtec Corporation's SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23, and SG-P3 solvent-modified product (product name: acrylic rubber, weight-average molecular weight: 800,000, Tg: 12°C, solvent: cyclohexanone).

The glass transition temperature (Tg) of the acrylic resin is preferably -50 to 50°C, more preferably -30 to 30°C, from the viewpoint of achieving high die shear strength. The weight average molecular weight (Mw) of the acrylic resin is preferably 100,000 to 3,000,000, more preferably 500,000 to 2,000,000, from the viewpoint of achieving high die shear strength. Here, Mw refers to a value measured by gel permeation chromatography (GPC) and converted using a calibration curve of standard polystyrene. By using an acrylic resin with a narrow molecular weight distribution, it tends to be possible to form adhesive pieces with high elasticity.

The amount of acrylic resin contained in the thermosetting resin composition is preferably 10 to 200 parts by mass, and more preferably 20 to 100 parts by mass, per 100 parts by mass of the epoxy resin and epoxy resin curing agent combined, from the viewpoint of achieving high die shear strength.

[Inorganic filler]
Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whiskers, boron nitride, crystalline silica, and amorphous silica. These may be used alone or in combination of two or more.

The average particle size of the inorganic filler is preferably 0.005 μm to 1.0 μm, more preferably 0.05 to 0.5 μm, from the viewpoint of achieving high die shear strength. The surface of the inorganic filler is preferably chemically modified from the viewpoint of achieving high die shear strength. A silane coupling agent is an example of a suitable material for chemically modifying the surface. Examples of the types of functional groups of the silane coupling agent include vinyl groups, acryloyl groups, epoxy groups, mercapto groups, amino groups, diamino groups, alkoxy groups, and ethoxy groups.

From the viewpoint of achieving high die shear strength, the content of the inorganic filler is preferably 20 to 200 parts by mass, and more preferably 30 to 100 parts by mass, per 100 parts by mass of the resin component of the thermosetting resin composition.

[Curing accelerator]
Examples of the curing accelerator include imidazoles and their derivatives, organic phosphorus compounds, secondary amines, tertiary amines, and quaternary ammonium salts. From the viewpoint of achieving high die shear strength, imidazole compounds are preferred. Examples of imidazoles include 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-methylimidazole. These may be used alone or in combination of two or more.

The content of the curing accelerator in the thermosetting resin composition is preferably 0.04 to 3 parts by mass, and more preferably 0.04 to 0.2 parts by mass, per 100 parts by mass of the epoxy resin and the epoxy resin curing agent in total, from the viewpoint of achieving high die shear strength.

The adhesive film that becomes the support piece 30 may be formed from multiple layers. FIG. 10 is a cross-sectional view showing a laminated film 60A according to a modified example. As shown in FIG. 10, the laminated film 60A has a base film 61, an adhesive layer 62, and an adhesive film 63A. The adhesive film 63A is composed of a pair of surface layers 66a, 66b made of any of the above-mentioned thermosetting resin compositions, and an intermediate layer 67 disposed between the pair of surface layers 66a, 66b. The thickness of the surface layers 66a, 66b is, for example, 5 to 60 μm, and may be 5 to 25 μm or 5 to 20 μm. The thickness of the intermediate layer 67 is, for example, 5 to 75 μm, and may be 10 to 75 μm or 10 to 50 μm. The tensile modulus of the intermediate layer 67 is, for example, 8.0 MPa or more, and may be 9.0 MPa or more, or 10.0 MPa or more. By having the tensile modulus of the intermediate layer 67 be 8.0 MPa or more, the intermediate layer 67 acts like a spring plate in the process of picking up the support piece 63a (see FIG. 5(c)), and excellent pick-up performance can be achieved. The upper limit of the tensile modulus of the intermediate layer 67 is about 15 MPa in terms of the ease of obtaining materials. The intermediate layer 67 is composed of, for example, a resin layer such as polyimide or polyethylene terephthalate (PET), or a metal layer. The intermediate layer 67 may be a layer made of a thermosetting resin composition or a photocurable resin composition that has been cured so that the tensile modulus falls within the above range.

(Method of manufacturing a semiconductor device)
Here, a method for manufacturing a semiconductor device 1 having a three-dimensional mounting structure using the support pieces 30 manufactured by the above-mentioned manufacturing method will be described with reference to Figures 11 to 13. Figure 11 is a diagram showing one step of the manufacturing method for the semiconductor device 1, and is a cross-sectional view showing a state in which a plurality of support pieces 30 are arranged around a semiconductor chip 20 on a substrate 10. Figure 12 is a cross-sectional view showing an example of a chip with adhesive pieces used in the manufacturing method for the semiconductor device 1. Figure 13 is a diagram showing one step of the manufacturing method for the semiconductor device 1 following Figure 11, and is a cross-sectional view showing a schematic diagram of a dolmen structure formed on the substrate 10.

The method for manufacturing a semiconductor device according to this embodiment includes the following steps (A) to (G).
(A) A step of preparing a plurality of support pieces 30 (see (a) to (c) of FIG. 5)
(B) A step of arranging the semiconductor chip 20 on the substrate 10. (C) A step of arranging a plurality of support pieces 30 around the semiconductor chip 20 on the substrate 10 (see FIG. 11).
(D) A step of preparing an adhesive piece-attached chip 21a including a semiconductor chip 21 and an adhesive piece 41 provided on one surface of the semiconductor chip 21 (see FIG. 12 ).
(E) A step of constructing a dolmen structure by placing adhesive chips 21a on the surfaces of a plurality of support pieces 30 (see FIG. 13).
(F) stacking further semiconductor chips 22, 23 on top of semiconductor chip 21 (see FIG. 1);
(G) A process of sealing the substrate 10 with a sealing material 50 so as to fill the gaps between the semiconductor chips 20 and 21 and to cover the semiconductor chips 21 to 23 and the wires 46 to 48 (see FIG. 1).

Steps (A) to (G) are processes for constructing a dolmen structure on a substrate 10 using multiple support pieces 30. In step (A), a predetermined number of support pieces 30 manufactured by the manufacturing method shown in FIG. 5, etc. are prepared. In step (A), the support pieces 30 may be manufactured by the manufacturing method shown in FIG. 5, etc., or the manufactured support pieces 30 may be obtained.

[(B) Process]
Step (B) is a step of placing the semiconductor chip 20 on the substrate 10. For example, first, the semiconductor chip 20 is mounted at a predetermined position on the substrate 10 via an adhesive piece 40. Then, the semiconductor chip 20 is electrically connected to the substrate 10 by a wire 45.

[(C) Process]
Step (C) is a step of arranging a plurality of support pieces 30 around the semiconductor chip 20 on the substrate 10. Through this step, the structure T shown in FIG. 11 is produced. The structure T includes the substrate 10, the semiconductor chip 20 arranged on the surface thereof, and a plurality of support pieces 30. The support pieces 30 may be arranged by a pressure bonding process. The pressure bonding process is preferably carried out for 0.5 to 3.0 seconds under conditions of, for example, 80 to 180° C. and 0.01 to 0.50 MPa. Note that the support pieces 30 may be completely hardened support pieces at the time of step (C), or may not be completely hardened at this time. It is preferable that the support pieces 30 are completely hardened support pieces before the start of step (C).

[(D) Process]
Step (D) is a step of preparing the chip 21a with adhesive pieces shown in Fig. 12. The chip 21a with adhesive pieces includes a semiconductor chip 21 and an adhesive piece 41 provided on one surface of the semiconductor chip 21. The chip 21a with adhesive pieces can be obtained, for example, by using a semiconductor wafer and a dicing/die bonding integrated film, through a dicing step and a pick-up step.

[(E) Process]
Step (E) is a step of arranging the chip 21a with adhesive pieces above the semiconductor chip 20 so that the adhesive pieces 41 contact the upper surfaces of the multiple support pieces 30. Specifically, the semiconductor chip 21 is pressure-bonded to the upper surfaces of the support pieces 30 via the adhesive pieces 41. This pressure-bonding process is preferably carried out for 0.5 to 3.0 seconds under conditions of, for example, 80 to 180°C and 0.01 to 0.50 MPa. Next, the adhesive pieces 41 are hardened by heating. This hardening process is preferably carried out for 5 minutes or more under conditions of, for example, 60 to 175°C and 0.01 to 1.0 MPa. This hardens the adhesive pieces 41. Through this step, a dolmen structure is constructed on the substrate 10 (see FIG. 13).

[(F) Process]
In step (F), the semiconductor chip 22 is placed on the semiconductor chip 21 via an adhesive piece 42, and the semiconductor chip 23 is placed on the semiconductor chip 22 via an adhesive piece 43. The adhesive pieces 42 and 43 may be made of a thermosetting resin composition similar to the adhesive pieces 40 and 41 described above, and become adhesive pieces by heat curing (see FIG. 1). Meanwhile, the semiconductor chips 21, 22, and 23 are electrically connected to the substrate 10 by wires 46 to 48, respectively. The number of chips stacked above the semiconductor chip 20 is not limited to three as in this embodiment, and can be set as appropriate.

[(G) Process]
In step (G), the substrate 10 is sealed with a sealant 50 (see FIG. 1) so as to fill the gaps between the semiconductor chips 20 and 21 and to cover the semiconductor chips 21 to 23 and the wires 46 to 48. The sealant 50 contains, for example, an epoxy resin. Through this step, the semiconductor device 1 shown in FIG. 1 is completed.

As described above, in the manufacturing method of the support piece according to the present embodiment, when picking up the singulated support pieces 63a, the base film 61 is expanded by an expansion amount of 3 mm to 9 mm, and each support piece 63a is picked up. In this case, since the expansion amount is larger than usual, the burrs G adhering to the side surfaces of each singulated support piece 63a can be peeled off by the expansion, and the state in which adjacent support pieces 63a are adhered to each other by the burrs G can be eliminated. Therefore, according to this manufacturing method, when picking up each singulated support piece 63a, adjacent support pieces 63a are not connected to each other by the burrs G, and therefore the pick-up ability of the singulated support pieces 63a can be improved.

The manufacturing method of the support piece according to this embodiment may further include a step of attaching the base film 61 to the ring frame 100 via the adhesive layer 62 so that the adhesive film 63 is positioned inside the ring frame 100 for singulation. In this attaching step, the laminated film 60 is attached to the ring frame 100 while applying tension to the laminated film 60 so that the elongation rate of the laminated film 60 is greater than 100%. In this case, before dicing, tension is applied to the laminated film 60 so that it is stretched outward, and the tension is released by dicing. Therefore, even if a burr G is formed between adjacent support pieces 63a by dicing, the burr G is scraped out from the dicing groove H between the support pieces 63a due to the sudden shrinkage caused by the release of this tension, so that the adjacent support pieces 63a are not connected by the burr G, and the pick-up ability of the singulated support pieces 63a can be further improved.

In addition, in the manufacturing method of the support piece according to this embodiment, in the bonding step, the laminated film 60 may be bonded to the ring frame 100 while applying tension to the laminated film 60 so that the elongation rate of the laminated film 60 is 101% or less. In this case, since the tension applied to the laminated film 60 is not so high, the elongation force applied to the adhesive film 63 constituting the laminated film 60 is also kept low, and when the laminated film 60 is bonded to the ring frame 100, peeling of the adhesive film 63 from the base film 61 is reduced. Peeling is particularly likely to occur near the outer periphery of the base film 61 (adhesive layer 62) and the adhesive film 63, but the above manufacturing method reduces peeling of the adhesive film 63 from the base film 61. As a result, voids are less likely to occur between the laminate consisting of the base film 61 and the adhesive layer 62 and the adhesive film 63. By reducing such voids, this manufacturing method makes it possible to suppress chip flying during individualization and to manufacture inexpensive support members with a high yield.

In addition, in the manufacturing method of the support piece according to this embodiment, in the picking up step, each of the multiple support pieces 63a may be picked up in a state in which the base film 61 is expanded by an expansion amount of 5 mm or more and 9 mm or less. In this case, since the expansion amount is set to a range of values even larger than usual, the burrs G adhering to the sides, etc. of each individualized support piece 63a can be more strongly peeled off, and the state in which adjacent support pieces 63a are adhered to each other by the burrs can be eliminated. Therefore, according to this manufacturing method, when each individualized support piece 63a is picked up, the pick-up ability of the individualized support pieces 63a can be further improved.

In addition, in the manufacturing method of the support piece according to this embodiment, in the picking up process, the base film 61 may be pushed up by a push-up amount of 300 μm or more in a push-up direction perpendicular to the expanding direction to pick up each of the multiple support pieces 63a. In this case, the distance of the support pieces 63a from the base film 61 during pick-up can be increased, thereby further improving the pick-up ability of the individualized support pieces.

In addition, in the manufacturing method of the support piece according to this embodiment, the adhesive film 63 may have a tensile modulus of elasticity of 8.0 MPa or more. The adhesive film 63 may also contain polyimide. In this case, it is possible to obtain a support member that is inexpensive and has excellent strength.

In addition, in the manufacturing method of the support piece according to this embodiment, the adhesive film 63 may include a pair of surface layers 66a, 66b made of a cured product of a thermosetting resin composition, and an intermediate layer 67 arranged between the pair of surface layers 66a, 66b. In this case, even if the adhesive film 63A has a multilayer structure and is formed to be relatively thick, the warping of the adhesive film 63A can be suppressed. By suppressing the warping, this manufacturing method makes it possible to make the thickness of the adhesive film 63A that spreads in the planar direction more uniform, and to make the thickness of the manufactured support piece more uniform. In this modified example, the intermediate layer 67 may be a polyimide layer or a metal layer. This makes it possible to obtain a support piece with excellent strength and heat resistance. The thickness of the intermediate layer 67 may be 50 μm or less. This makes it possible to make the support piece thin without making it too thick, even if it has a multilayer structure.

Although the embodiments of the present disclosure have been described in detail above, the present invention is not limited to the above embodiments. For example, in the above embodiment, a method for manufacturing the support piece 30 used in a semiconductor device with a dolmen structure was described, but the support piece 30 may be used as a component of other semiconductor devices, and is not particularly limited. In addition, although a laminated film 60 having an ultraviolet-curing adhesive layer 62 was exemplified, the adhesive layer 62 may be a pressure-sensitive type.

The present invention will be explained in more detail below with reference to examples, but the present invention is not limited to these examples.

In the following examples, the pick-up properties of the support piece were confirmed when the support piece was made using the laminated film 60A with the configuration shown in Figure 10. Specifically, the laminated film 60A was attached to the ring frame 100, and the adhesive film 63A was diced into individual pieces, after which the individual support pieces were picked up. The equipment used for these was a 12-inch dual dicer (DFD-6362) manufactured by Disco Corporation and a die bonder (DB-830P) manufactured by Fasford Technology Co., Ltd.

The compounds used in each example are as follows:

(Laminate)
As the laminate 65, the following laminate was prepared.

<Preparation of Laminate>
A copolymer was obtained by solution radical polymerization using 78 parts by weight of 2-ethylhexyl acrylate, 20 parts by weight of 2-hydroxyethyl acrylate, and 2 parts by weight of methacrylic acid as raw materials and ethyl acetate as a solvent. Next, this acrylic copolymer was reacted with 8 parts by weight of 2-methacryloyloxyethyl isocyanate to synthesize a radiation-reactive acrylic copolymer having a carbon-carbon double bond. In the above reaction, 0.05 parts of hydroquinone monomethyl ether was used as a polymerization inhibitor. The weight average molecular weight of the synthesized acrylic copolymer was measured by GPC and found to be 800,000.

The acrylic copolymer thus obtained was mixed with 8.0 parts (solids equivalent) of a polyisocyanate compound (Tosoh Corporation, product name: Coronate L) as a curing agent, and 0.5 parts of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator to prepare a radiation-curable adhesive solution. Next, the radiation-curable adhesive solution thus obtained was applied to a polyethylene terephthalate release film (thickness: 38 μm) and dried so that the thickness after drying would be 10 μm. After that, a polyolefin film (thickness: 90 μm) that had been corona discharge-treated on one side was bonded to the adhesive layer. The bonded sample was aged in a thermostatic chamber at 40°C for 72 hours to produce a laminate. The tensile strength of the laminate was 32 MPa and the elongation was 340%.

(Adhesive film)
As described above, the adhesive film used was the three-layer adhesive film 63A shown in Fig. 10. The thermosetting resin composition constituting the surface layers 66a and 66b of the adhesive film 63A contained the following (a) to (h).

(Preparation of Varnish A)
Varnish A for the film for forming the support strip was prepared using the following materials.
(a) Epoxy resin: YDCN-700-10: (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., cresol novolac type epoxy resin, solid at 25°C) 13.2 parts by mass (b) Phenol resin (curing agent): HE-100C-30: (trade name, manufactured by Air Water Inc., phenylarakyl type phenol resin) 11.0 parts by mass (c) Inorganic filler: Aerosil R972: (trade name, manufactured by Nippon Aerosil Co., Ltd., silica, average particle size 0.016 μm) 7.8 parts by mass (d) Elastomer: SG-P3 solvent-change product (trade name, manufactured by Nagase ChemteX Corporation, acrylic (e) Coupling agent 1: A-189: (trade name, manufactured by GE Toshiba Corporation, γ-mercaptopropyltrimethoxysilane) 0.4 parts by mass (f) Coupling agent 2: A-1160: (trade name, manufactured by GE Toshiba Corporation, γ-ureidopropyltriethoxysilane) 1.15 parts by mass (g) Curing accelerator: Curesol 2PZ-CN: (trade name, manufactured by Shikoku Chemical Industry Co., Ltd., 1-cyanoethyl-2-phenylimidazole) 0.03 parts by mass (h) Solvent: Cyclohexane

As described above, cyclohexanone was used as the solvent, and the solid content of varnish A was adjusted to 16% by mass. Varnish A was filtered through a 100-mesh filter and vacuum degassed. A polyethylene terephthalate (PET) film (thickness 38 μm) that had been subjected to a release treatment was prepared as the film to which varnish A was applied. The varnish A after vacuum degassing was applied onto the release-treated surface of the PET film. The applied varnish A was heated and dried in two stages, at 90°C for 5 minutes and then at 140°C for 5 minutes. In this way, a thermosetting resin layer A in a B-stage state (semi-cured state) was produced on the surface of the PET film.

The intermediate layer 67 of the adhesive film 63A was made of polyimide (manufactured by Ube Industries, Ltd., product name: Upilex 50SGA, thickness 50 μm).

Next, thermosetting resin layers 66a and 66b were prepared and laminated to both sides of intermediate layer 67 with a rubber roll on a hot plate at 70°C to form adhesive film 63A, which was then laminated to laminate 65 with a rubber roll at room temperature to obtain laminate film 60A.

Then, the obtained laminated film 60A was attached to the ring frame 100 with a predetermined attachment tension (see FIG. 5(a)), and then the adhesive film 63A was divided into individual pieces by dicing with a dicing device (see FIG. 5(b)). Then, while expanding the base film 61 by a predetermined expansion amount, each support piece was pushed up by the push-up jig 111 and picked up by suction with the suction collet 112. The number of pieces picked up in each test was 20.

The following Tables 1 to 3 show the evaluation results (Examples 1 to 16) in which the expansion amount, application tension, push-up amount, and push-up speed were changed. In Table 1, the application tension was 100.19%, and the kerf width at the time of dicing was 24 μm. In Table 2, the application tension was 100.47%, and the kerf width at the time of dicing was 31 μm. In Table 3, the application tension was 101.00%, and the kerf width at the time of dicing was 33 μm.

As shown in Examples 1 to 16 above, by setting the expansion amount at the time of pickup in the range of 3 mm to 9 mm, the pickup rate of the support piece was nearly 100%, and it was confirmed that the pickup performance was improved. Note that, as shown in Examples 1 and 2, when the expansion amount at the time of pickup is 3 mm, the pickup rate tends to decrease when the push-up amount is 275 mm and 300 mm, but for example, by increasing the push-up amount in Example 2 to 325 μm, the pickup rate could be made 20/20.

Table 4 below shows Examples 17 to 19 in which the expansion amount was set to 7 mm and the attachment tension of the laminate 65A to the ring frame 100 was changed.

As shown in Examples 17 to 19 above, it was confirmed that the number of pick-ups can be improved by increasing the attachment tension of the laminate 65A to the ring frame 100 above 100%. Note that the push-up amount in Examples 17 to 19 was set low in order to confirm the tendency due to changes in attachment tension, and by increasing the push-up amount to 225 μm in the tests corresponding to Examples 18 and 19 (while keeping other conditions unchanged), the pick-up rate was able to be 20/20.

As is clear from the above test results, it was confirmed that the pick-up rate can be increased by picking up each support piece in a state where the base film is expanded by an amount of expansion of 3 mm to 9 mm (more preferably, an amount of expansion of 5 mm to 9 mm). It was also confirmed that the pick-up property can be improved by increasing the attachment tension of the laminate to the ring frame.

1...semiconductor device, 10...substrate, 20...semiconductor chip, 21...semiconductor chip, 30...support piece (support member), 60, 60A...laminated film, 61...base material film, 62...adhesive layer, 63...adhesive film, 63a...support piece, 65...laminated body, 66a, 66b...surface layer, 67...intermediate layer, 100...ring frame (ring), 111...push-up jig, 112...suction collet, E...expansion amount, G...burr, H...dicing groove.

Claims (10)

A step of preparing a laminated film in which an adhesive film is attached to a base film via an adhesive layer;
attaching the base film to a ring via the adhesive layer so that the adhesive film is disposed inside the ring;
singulating the adhesive film into a plurality of support members;
picking up each of the plurality of support members from the base film;
In the attaching step, the laminated film is attached to the ring while applying tension to the laminated film so that the elongation of the laminated film is greater than 100%;
In the picking up step, the base film is expanded by an expansion amount of 3 mm or more and 9 mm or less, and each of the plurality of support members is picked up in that state.
A method for manufacturing a support member. In the attaching step, the laminated film is attached to the ring while applying tension to the laminated film so that the elongation of the laminated film is 101% or less.
A method for manufacturing the support member according to claim 1 . In the attaching step, the laminated film is attached to the ring while applying tension to the laminated film so that the elongation of the laminated film is 101% or more.
A method for manufacturing the support member according to claim 1 . In the picking up step, the base film is expanded by an expansion amount of 5 mm or more and 9 mm or less, and each of the plurality of support members is picked up in that state.
A method for manufacturing a support member according to any one of claims 1 to 3. In the picking up step, the base film is pushed up by a push-up amount of 300 μm or more in a push-up direction intersecting with the expanding direction to pick up each of the plurality of support members.
A method for manufacturing a support member according to any one of claims 1 to 4. The adhesive film has a tensile modulus of 8.0 MPa or more.
A method for manufacturing a support member according to any one of claims 1 to 5. The adhesive film comprises polyimide.
A method for manufacturing a support member according to any one of claims 1 to 6. The adhesive film includes a pair of surface layers made of a cured product of a thermosetting resin composition, and an intermediate layer disposed between the pair of surface layers.
A method for manufacturing a support member according to any one of claims 1 to 7. The intermediate layer is a polyimide layer or a metal layer.
A method for manufacturing a support member according to claim 8. A method for manufacturing a semiconductor device, comprising the steps of: manufacturing a semiconductor device using a support member manufactured by the method for manufacturing a support member according to any one of claims 1 to 9.