JP7709877B2 - Edge condition checking device - Google Patents

Description

The present invention relates to an edge inspection device that checks the edge condition of a substrate that has a coating film formed on its outer peripheral edge.

Substrate processing equipment is used to perform various processes on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays or organic EL (Electro Luminescence) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, or substrates for solar cells.

Depending on the processing performed on the substrate, the substrate may be required to have high strength. For this reason, the substrate to be processed may be a substrate made of two substrates bonded together with an adhesive (hereafter referred to as a bonded substrate).

In a bonded substrate, if there are defects (e.g. voids) between the two substrates, the substrate will not have sufficient strength. Therefore, an inspection device has been proposed that checks for defects that occur between the two substrates in a bonded substrate.

In the inspection device described in Patent Document 1, a bonded substrate (superimposed wafer) is brought in and held by chuck. Infrared rays are irradiated onto the bonded substrate held by the chuck, and an image of the entire surface of the bonded substrate is taken. The bonded substrate is inspected based on the image obtained by this imaging.

JP 2013-26260 A

In a bonded substrate, for example, a protective member may be provided on the outer peripheral edge of the bonded substrate so that the boundary between the bonded portions of two substrates having beveled portions is not exposed to the outside. The protective member is formed, for example, by filling a coating liquid for the protective member into the space between the adjacent beveled portions in the stacking direction of the two bonded substrates, and then curing the filled coating liquid.

However, if a part of the protective member formed on the outer peripheral edge of the bonded substrate peels off, it can cause particles to be generated. Peeling of the protective member can occur due to defects (e.g., voids) occurring inside the protective member. Furthermore, defects occurring inside the protective member also reduce the strength of the bonded substrate. Defects occurring inside the protective member cannot be directly observed. For bonded substrates in which a protective member is provided on the outer peripheral edge, in addition to determining the defects that occur when the two substrates are bonded together, it is also desirable to determine the presence or absence of defects occurring inside the protective member.

The object of the present invention is to provide an edge condition inspection device that can determine whether or not there is an internal defect in a protective member formed on the outer peripheral edge of a substrate.

(1) An edge condition confirmation device according to the present invention is an edge confirmation device for confirming the edge condition of a substrate having at least a portion having a circular shape and having a protective member provided at its outer peripheral edge , the substrate being a bonded substrate formed by bonding together a plurality of single substrates, each of the plurality of single substrates constituting the bonded substrate having a bevel portion at the outer peripheral edge of the single substrate, the protective member being provided at the outer peripheral edge of the bonded substrate so as to fill a space between two adjacent bevels in the stacking direction of the plurality of single substrates, the edge confirmation device comprising a substrate holding portion for holding a substrate, a light emitting portion for emitting light of a wavelength capable of passing through the substrate and the protective member toward the outer peripheral edge of the substrate held by the substrate holding portion, and an imaging portion for receiving light emitted from the light emitting portion and transmitted through the outer peripheral edge of the substrate and the protective member to image the outer peripheral edge of the substrate, the imaging portion being positioned so as to receive light that has passed through the outer peripheral edge of the substrate and the protective member and is specularly reflected by one of the two bevel portions .

In the edge condition checking device, light is emitted toward the outer circumferential edge of the substrate held by the substrate holding unit. The emitted light is incident on at least a portion of the substrate and the protective member. Depending on the presence or absence of a defect in the outer circumferential edge of the substrate, the light emitted from the light emitting unit and transmitted through the outer circumferential edge of the substrate and the protective member is received by the imaging unit. By imaging the outer circumferential edge of the substrate using the imaging unit, image data can be obtained that shows the state of the outer circumferential edge of the substrate and the inside of the protective member. As a result, it is possible to determine internal defects in the protective member formed on the outer circumferential edge of the substrate based on the acquired image data.
The substrate is a bonded substrate in which a plurality of single substrates are bonded together, so that it is possible to determine whether or not there is a defect in the boundary portion between the plurality of single substrates bonded together.
Each of the multiple single substrates that make up the bonded substrate has a bevel portion at the outer peripheral edge of the substrate, the protective member is provided at the outer peripheral edge of the bonded substrate so as to fill the space between two adjacent bevels in the stacking direction of the multiple single substrates, and the imaging unit is positioned to receive light that passes through the outer peripheral edge of the substrate and the protective member and is specularly reflected by one of the two bevel portions.
When the protective member is embedded in the space between the two bevel portions without any gaps, the light emitted toward the outer peripheral edge of the bonded substrate passes through each bevel portion without being reflected. On the other hand, when the protective member is not fully embedded in the space between the two bevel portions and a void exists on one of the bevel portions, the light emitted toward the outer peripheral edge of the bonded substrate is reflected on the one of the bevel portions where the void exists. Therefore, according to the above configuration, the presence of a void inside the protective member can be easily determined based on the amount of light received that is incident on the imaging unit from the outer peripheral edge of the bonded substrate.

(2) The imaging unit has an imaging area with a band-like cross section extending in a first direction, the light emitting unit and the imaging unit are arranged in a predetermined positional relationship such that light emitted from the light emitting unit travels toward the imaging area of the imaging unit, the substrate holding unit is configured to be able to rotate the substrate while holding it, and the edge condition checking device may further include a position and attitude adjustment unit that adjusts the position and attitude of the substrate holding unit so that, when the imaging unit images the outer peripheral edge of the substrate, the substrate held by the substrate holding unit rotates such that multiple portions in the circumferential direction of the outer peripheral edge of the substrate sequentially pass through a predetermined reference position in the imaging area in a predetermined reference attitude toward a second direction intersecting the first direction.

In this case, it is possible to capture images of the entire outer edge of the board without increasing the imaging area. This allows the light emitting section and imaging section to be miniaturized, preventing the edge condition confirmation device from becoming too large.

(3) The edge condition checking device may further include an eccentricity shape information acquisition unit that acquires eccentricity information including the amount and direction of eccentricity of the center of the substrate relative to the center of rotation of the substrate held by the substrate holding unit and shape information indicating the shape of the substrate's outer periphery before the imaging unit captures the image of the substrate's outer periphery, and the position and orientation adjustment unit may adjust the position and orientation of the substrate holding unit based on the eccentricity information and shape information acquired by the eccentricity shape information acquisition unit when the imaging unit captures the image of the substrate's outer periphery.

In this case, the position and attitude of the outer edge of the substrate relative to the light emitting section and the imaging section can be more accurately adjusted to the reference position and reference attitude depending on the state in which the substrate is held by the substrate holding section and the shape of the substrate.

(4) The edge condition checking device may further include an image data generating unit that generates image data based on an output signal from the imaging unit, and a defect determining unit that determines whether or not a defect exists at the outer peripheral edge of the substrate based on whether or not the image data generated by the image data generating unit satisfies a predetermined determination condition.

In this case, the presence or absence of defects in the outer peripheral edge of the substrate and inside the protective member can be determined uniformly without the user needing to be highly skilled in defect determination.

( 5 ) The edge condition checking device may further include a protective member forming unit that prepares a substrate by forming a protective member on an outer peripheral edge of the unprocessed substrate while the unprocessed substrate having no protective member formed thereon is held by the substrate holding unit.

In this case, it becomes possible to form a protective member for the outer edge of the substrate using the edge condition checking device. This improves the efficiency of substrate processing.

The present invention makes it possible to determine whether or not there are internal defects in a coating film formed on the outer peripheral edge of a substrate.

1 is a schematic side view of an end state checking device according to a first embodiment; FIG. 2 is a schematic plan view of the end state checking device of FIG. 1 . 1A and 1B are diagrams showing an example of a protective member provided on the outer circumferential edge of a bonded substrate; 4 is a diagram showing an example of a defect that may occur inside the protective member of FIG. 3 . FIG. 4 is a diagram showing an example of an end image obtained by the imaging section of FIG. 1 for a bonded substrate stack on which no protective member is formed. FIG. 4 is a diagram showing an example of an edge image obtained by the imaging section of FIG. 1 for a bonded substrate stack in which no defects exist inside a protective member; FIG. 4 is a diagram showing an example of an edge image obtained by the imaging section of FIG. 1 for a bonded substrate stack having a defect inside a protective member; FIG. 2 is a block diagram showing the configuration of a control system of the edge state confirmation device of FIG. 1 . 10 is a flowchart showing an example of an edge state confirmation process executed in the edge state confirmation device. FIG. 11 is a schematic side view of an end state checking device according to a second embodiment. FIG. 11 is a schematic plan view of the end state checking device of FIG. 10 .

The following describes an edge condition checking device according to one embodiment of the present invention with reference to the drawings. In the following description, the term "substrate" refers to a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic electroluminescence (EL) display device, a semiconductor substrate, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The substrate described below has a circular shape in plan view except for the portion where the notch is formed.

Furthermore, the substrates described below include substrates made by bonding multiple substrates together using an adhesive. In the following description, when distinguishing between a single substrate and a substrate made by bonding multiple substrates together, a single substrate is called a single substrate, and a substrate made by bonding multiple substrates together is called a bonded substrate. At the outer peripheral edge of the bonded substrate, a protective member is provided to protect the boundary between the bonded portions of each of two adjacent single substrates in the stacking direction (the direction in which the substrates overlap). The specific configuration of the protective member will be described later. The edge condition confirmation device described below confirms the condition of the outer peripheral edge of the substrate. This makes it possible to determine whether there is an internal defect in the protective member.

1. First embodiment [1] Configuration of the edge state confirmation device FIG. 1 is a schematic side view of the edge state confirmation device according to the first embodiment, and FIG. 2 is a schematic plan view of the edge state confirmation device 1 of FIG. 1. As shown in FIG. 1, the edge state confirmation device 1 has a configuration in which a tilt device 20, a moving device 30, a rotation holding device 40, an eccentricity detector 50, a height detector 60, a light emitting unit 70, an imaging unit 80, and a control device 90 are mainly housed in a housing 10. The control device 90 may be provided outside the housing 10. The control device 90 includes a CPU (Central Processing Unit) 91 and a memory unit 99 (FIG. 8) described later, and controls the operations of the tilt device 20, the moving device 30, the rotation holding device 40, the eccentricity detector 50, the height detector 60, the light emitting unit 70, and the imaging unit 80. The control device 90 may be configured with a microcomputer instead of the CPU 91 and the memory unit 99.

In order to clarify the positional relationships, arrows indicating the mutually orthogonal X, Y, and Z directions are provided in Figures 1 and 2 and in certain figures described later. The X and Y directions are mutually orthogonal in the horizontal plane, and the Z direction corresponds to the vertical direction.

The housing 10 has a generally rectangular parallelepiped shape including a top surface, a bottom surface, and four side walls. In FIG. 1, one side wall surface is not shown in order to show the configuration of the edge state checking device 1 inside the housing 10. Also, in FIG. 2, the top surface is not shown. At least one of the four side walls has a transport opening formed therein for loading a substrate W into the housing 10 or unloading a substrate W from the housing 10.

The tilt device 20 is provided on the bottom surface of the housing 10. The tilt device 20 includes a tilt stage 21, two support members 22, a rotation axis 22s, and a tilt drive unit 23. As shown in FIG. 2, the two support members 22 are provided near two side wall surfaces that face each other in the X direction, and are aligned in the X direction.

A rotating shaft 22s is provided to connect the two support members 22. The rotating shaft 22s is supported by the two support members 22 so as to be rotatable around its central axis ax1. A tilt drive unit 23 is provided near one of the two support members 22. The tilt drive unit 23 includes a motor and is configured to be able to rotate the rotating shaft 22s around its central axis ax1 and to hold the rotating shaft 22s at any rotation angle around the central axis ax1. An encoder is built into the motor of the tilt drive unit 23. The encoder outputs a signal corresponding to the rotation angle of the motor or a change in the rotation angle to the control device 90.

The tilt stage 21 is composed of, for example, a rectangular plate-like member, a part of which is attached to the rotation axis 22s. The tilt stage 21 is fixed to the rotation axis 22s in a direction around the central axis ax1. As a result, the tilt stage 21 rotates around the central axis ax1 together with the rotation of the rotation axis 22s by the tilt drive unit 23. The tilt stage 21 is also held in a constant posture together with the rotation axis 22s in a state in which the rotation axis 22s is held at an arbitrary rotation angle around the central axis ax1 by the tilt drive unit 23. In this way, the tilt stage 21 is maintained in a state parallel to the horizontal plane and in a state tilted from the horizontal plane depending on the holding state of the rotation axis 22s by the tilt drive unit 23. The Y direction and Z direction shown below respectively indicate the Y direction and Z direction when the tilt stage 21 is parallel to the horizontal plane.

The moving device 30 is provided on the upper surface of the tilt stage 21. The moving device 30 includes a moving stage 31 and a moving drive unit 32. The moving stage 31 has a mounting surface on which a rotation holding device 40 (described later) is mounted, and is configured to be able to move the mounting surface in the X and Y directions on the tilt stage 21. The moving drive unit 32 includes multiple motors, and is configured to be able to move the mounting surface of the moving stage 31 in the X and Y directions on the tilt stage 21 and to hold the mounting surface at any position on the tilt stage 21. The multiple motors of the moving drive unit 32 have built-in encoders. The encoder outputs a signal corresponding to the rotation angle of the motor or a change in the rotation angle to the control device 90.

The rotational holding device 40 is provided on the mounting surface of the moving stage 31. The rotational holding device 40 includes an adsorption holding part 41 and a rotational adsorption driving part 42. The rotational holding device 40 includes a motor. The motor is mounted on the mounting surface. The rotational shaft of the motor extends upward. The adsorption holding part 41 is attached to the upper end of the rotational shaft. The adsorption holding part 41 is connected to an intake system (not shown) and is configured to be able to adsorb and hold the central part of the lower surface of the substrate W.

The rotary suction drive unit 42 switches the intake path between the suction holder 41 and an intake system (not shown) between an open state and a blocked state. This enables the rotary suction drive unit 42 to suction and hold the central portion of the lower surface of the substrate W by the suction holder 41. The rotary suction drive unit 42 can also rotate the substrate W suction-held by the suction holder 41 around the rotation axis of the motor.

In the rotational holding device 40, the center of the substrate W held by the suction holding part 41 does not necessarily coincide with the center of the rotation shaft of the motor of the rotational suction drive part 42, i.e., the center of rotation of the suction holding part 41. Therefore, in the edge state confirmation device 1, the amount of eccentricity and the direction of eccentricity of the substrate W held on the suction holding part 41 are detected. An eccentricity detector 50 is used to detect the amount of eccentricity and the direction of eccentricity of the substrate W. In the following description, information indicating the amount of eccentricity and the direction of eccentricity is referred to as eccentricity information.

A support pillar 59 is provided on the upper surface of the tilt stage 21 near one end of the tilt stage 21 in the Y direction. The support pillar 59 extends upward from the upper surface of the tilt stage 21. An eccentricity detector 50 is attached to the upper end of the support pillar 59. The eccentricity detector 50 includes, for example, a line sensor, and is capable of detecting the position of the outer circumferential edge of the substrate W rotated by the rotation holding device 40 when fixed to the upper end of the support pillar 59.

The motor of the rotating and holding device 40 has a built-in encoder (not shown) that detects the rotation angle of the suction holding unit 41. When detecting eccentricity information, the substrate W is rotated while being held on the suction holding unit 41. At this time, every time the substrate W rotates by a small angle, the encoder built into the motor of the rotating and holding device 40 outputs a signal generated by the rotation of the motor by a small angle. In addition, the eccentricity detector 50 outputs a signal indicating the position of the outer circumferential edge of the substrate W on the tilt stage 21. As a result, based on the detection results of the encoder of the motor of the rotating and holding device 40 and the eccentricity detector 50, multiple rotation angles of the substrate W corresponding to multiple parts of the outer circumferential edge of the substrate W are detected with the notch as a reference. In addition, for each of the multiple detected rotation angles, the difference between the distance from the rotation center of the suction holding unit 41 to the position of the outer circumferential edge of the substrate W detected by the eccentricity detector 50 and the radius of the substrate W is detected as the amount of eccentricity corresponding to the rotation angle.

However, the shape of the outer periphery of the substrate W held by the suction holder 41 is not necessarily flat. Therefore, in the edge state checking device 1, the shape of the outer periphery of the substrate W held on the suction holder 41 is detected. A height detector 60 is used to detect the shape of the outer periphery of the substrate W.

The height detector 60 includes, for example, a laser displacement meter, and is fixed on the upper surface of the tilt stage 21 so as to overlap the outer periphery of the substrate W held by the rotation holding device 40 in a plan view, as shown in FIG. 2. The height detector 60 emits laser light toward the upper side of the tilt stage 21, as shown by the dashed arrow in FIG. 1, and receives the laser light reflected by the lower surface of the substrate W. As a result, the height detector 60 can detect the distance from the upper surface of the tilt stage 21 to the portion of the lower surface of the substrate W that is irradiated with the laser light (hereinafter referred to as the substrate stage distance) based on, for example, the amount of reflected laser light received.

When detecting the shape of the substrate W, the substrate W is rotated while being held on the suction holder 41. At this time, similar to when detecting eccentricity information, the rotation angle of the substrate W is detected every time the substrate W rotates by a small angle. The height detector 60 also detects the distance between the substrate stages. In this way, a number of substrate stage distances corresponding to a number of eccentricity directions are detected as shape information indicating the shape of the outer periphery of the substrate W.

As shown in FIG. 1, a light emitting unit 70 is provided on the top surface of the housing 10 via a support piece 79. The light emitting unit 70 is located above the substrate W held by the rotating and holding device 40. The light emitting unit 70 includes a light source and an emitting unit. The light source generates infrared light as light having a wavelength that can transmit the substrate W and the above-mentioned protective member. The emitting unit emits the infrared light generated by the light source diagonally downward toward the imaging area of the imaging unit 80 described later. In this embodiment, the infrared light emitted from the light emitting unit 70 has a wavelength of about 1000 nm to 2500 nm. The light source of the light emitting unit 70 may be provided outside the housing 10. In this case, the infrared light generated from the light source outside the housing 10 is guided to the emitting unit of the light emitting unit 70 through a light guide such as an optical fiber.

A support pillar 89 is provided on the bottom surface of the housing 10 and extends upward from the bottom surface. As shown in FIG. 1, the height of the upper end of the support pillar 89 in the Z direction is approximately the same as or slightly higher than the substrate W held by the rotation holding device 40. The imaging unit 80 is attached to the upper end of the support pillar 89.

The imaging unit 80 includes an imaging element in which multiple pixels are arranged in a line, one or more focusing lenses, and a shutter. In this example, a CCD (charge-coupled device) line sensor capable of detecting light with an infrared wavelength is used as the imaging element of the imaging unit 80. In this case, the imaging unit 80 has an imaging region with a strip-shaped cross section that extends parallel to the direction in which the multiple pixels are arranged. Note that a CMOS (complementary metal-oxide semiconductor) line sensor capable of detecting light with an infrared wavelength can also be used as the imaging element of the imaging unit 80.

As shown in FIG. 2, the light emitting unit 70 and the imaging unit 80 are arranged side by side in the Y direction in a plan view, and their positional relationship is fixed by the housing 10. The cross section of the imaging area of the imaging unit 80 extends in a strip shape parallel to the Y direction in a plan view.

[2] Basic Operation of the Edge State Checking Device In the edge state checking device 1 according to this embodiment, the substrate W carried into the housing 10 is attracted and held by the rotating holding device 40, and the substrate W is rotated at least 360°. At this time, the eccentricity detector 50 calculates eccentricity information about the substrate W. In addition, the height detector 60 detects shape information about the substrate W.

Next, infrared light is emitted from the light emitting unit 70 toward the imaging area of the imaging unit 80, and the substrate W is further rotated at least 360°. At this time, the operation of the tilt device 20 and the moving device 30 is controlled so that multiple parts of the outer circumferential edge of the substrate W sequentially pass a predetermined position (hereinafter referred to as a specified position) RP in the imaging area of the imaging unit 80 in a predetermined attitude (hereinafter referred to as a specified attitude). Specifically, the angle of the tilt stage 21 with respect to the horizontal plane and the position of the mounting surface of the moving device 30 are adjusted based on the eccentricity information and shape information acquired immediately before so that multiple parts of the outer circumferential edge of the substrate W sequentially pass the specified position RP in the specified attitude.

In addition, each time the substrate W rotates by a small angle, the outer peripheral edge of the substrate W irradiated with infrared light from the light emitting unit 70 is imaged by the imaging unit 80. In the edge state checking device 1, a three-dimensional coordinate system specific to the device is defined in advance. The above-mentioned specified position RP is determined as a fixed position on the predefined three-dimensional coordinate system.

The eccentricity information makes it possible to grasp the position of the notch of the substrate W. Therefore, when imaging of the outer peripheral end of the substrate W begins, the control device 90 controls the rotation holding device 40 based on the eccentricity information, so that the notch of the substrate W is oriented in a predetermined direction.

Finally, image data corresponding to the entire outer peripheral edge of the substrate W is generated based on the distribution of the amount of light received by the imaging element of the imaging unit 80 obtained by imaging at each small angle as the substrate W rotates once. Whether or not a defect exists at the outer peripheral edge of the substrate W is determined based on the generated image data. In the following description, the image data obtained by imaging using the imaging unit 80 while the substrate W rotates once is referred to as edge image data, and the image represented by the edge image data is referred to as an edge image.

[3] Defects that may occur at the outer circumferential edge of the bonded substrate W Fig. 3 is a diagram showing an example of a protective member provided at the outer circumferential edge of the bonded substrate W, and Fig. 4 is a diagram showing an example of a defect that may occur inside the protective member of Fig. 3. Figs. 3 and 4 show enlarged cross-sectional views of the outer circumferential edge of the bonded substrate W.

As shown in FIG. 3, the bonded substrate W according to this embodiment has a configuration in which two single substrates w1 and w2 are bonded together with an adhesive w3. Each of the single substrates w1 and w2 has an outer peripheral end portion that includes a bevel portion.

Each bevel portion includes a first inclined surface e1, an end surface e2, and a second inclined surface e3. The first inclined surface e1 is a surface that inclines from the upper surface of the outer periphery of the single substrate w1, w2 toward the outermost periphery of the single substrate w1, w2 when the single substrate w1, w2 is held in a horizontal position. The second inclined surface e3 is a surface that inclines from the lower surface of the outer periphery of the single substrate w1, w2 toward the outermost periphery of the single substrate w1, w2 when the single substrate w1, w2 is held in a horizontal position. The end surface e2 is a surface that connects the lowermost end of the first inclined surface e1 and the uppermost end of the second inclined surface e3 when the single substrate w1, w2 is held in a horizontal position.

The protective member w4 is formed to fill the space between the second inclined surface e3 of the single substrate w1 and the first inclined surface e1 of the single substrate w2. As a result, the boundary between the single substrate w1 and the single substrate w2 is not exposed, reducing the possibility of the two single substrates w1 and w2 peeling off from the outer periphery. The material of the protective member w4 is, for example, the same material as the adhesive w3. The material of the protective member w4 is not limited to the same material as the adhesive w3, and may be a material used to form a SOG (Spin On Glass) film or a SOC (Spin On Carbon) film.

When forming the protective member w4 at the outer peripheral edge of the bonded substrate W, the space between the second inclined surface e3 of the single substrate w1 and the first inclined surface e1 of the single substrate w2 is filled with a coating liquid for the protective member. The coating liquid is hardened to form the protective member w4.

However, if a sufficient amount of coating liquid is not filled in the space between the second inclined surface e3 and the first inclined surface e1 adjacent to each other in the stacking direction of the substrate, a void vi may be formed inside the protective member w4, as shown in FIG. 4. The presence of such defects such as voids inside the protective member w4 causes the protective member w4 to peel off. It also reduces the bonding strength between the single substrates w1 and w2. The edge condition confirmation device 1 according to this embodiment can easily and accurately determine defects that occur inside the protective member w4 as shown in FIG. 4.

[4] Example of image data acquired by imaging section 80 Fig. 5 is a diagram showing an example of an end image obtained by the imaging section 80 of Fig. 1 for a bonded substrate W on which a protective member w4 is not formed. Fig. 6 is a diagram showing an example of an end image obtained by the imaging section 80 of Fig. 1 for a bonded substrate W on which no defect exists inside the protective member w4. Fig. 7 is a diagram showing an example of an end image obtained by the imaging section 80 of Fig. 1 for a bonded substrate W on which a defect exists inside the protective member w4.

In Figures 5 to 7, the upper part shows a schematic cross-sectional view of the state in which infrared light is irradiated onto the outer peripheral edge of the bonded substrate W. The middle part shows a schematic perspective view of the state in which the outer peripheral edge of the rotating bonded substrate W is imaged by the imaging unit 80. The lower part shows an example of an edge image obtained by imaging the upper and middle parts.

In the end image in the lower part of Figures 5 to 7, the horizontal axis corresponds to the rotation angle of the bonded substrate W, and the vertical axis corresponds to the position of each pixel of the imaging element of the imaging section 80. In this case, the brightness distribution of the reflected light at the outer circumferential end of the bonded substrate W is represented in the direction of the horizontal axis of the end image. Also, the brightness distribution of the reflected light at the outer circumferential end of the bonded substrate W in the approximate radial direction is represented in the direction of the vertical axis of the end image.

Furthermore, in the end images in the lower rows of Figures 5 to 7, the areas in the imaging element of the imaging unit 80 where a large amount of infrared light is received are shown in white, and the areas in the imaging element of the imaging unit 80 where a small amount of infrared light is received or where no infrared light is incident are shown in a dot pattern.

5, the specified position RP and the specified posture are determined so that, for example, in the absence of the protective member w4, only the reflected light that is specularly reflected by the first inclined surface e1 of the single substrate w2 among the infrared light emitted from the light emitting unit 70 enters the imaging unit 80. As a result, as shown in the lower part of FIG. 5, in the end image of the bonded substrate W on which the protective member w4 is not formed, the brightness of the image portion i2 corresponding to the first inclined surface e1 of the single substrate w2 is significantly greater than the brightness of the other image portions i1 and i3. The other image portion i1 corresponds to a circular portion of a certain width located closer to the center of the bonded substrate W than the first inclined surface e1 of the single substrate w2 of the bonded substrate W. The other image portion i3 corresponds to the space outside the bonded substrate W.

The specified position RP and the specified posture are determined as described above. In this case, in an end image of a bonded substrate W in which no defects exist inside the protective member w4, the brightness of the image portion i2 is approximately equal to the brightness of the other image portions i1 and i3, as shown in the lower part of FIG. 6. This is because, as shown in the upper part of FIG. 6, the entire first inclined surface e1 of the single substrate w2 is covered with the protective member w4, and most of the infrared light passes through the first inclined surface e1. Also, even if part of the infrared light is reflected by the first inclined surface e1 of the single substrate w2, the reflected light is attenuated by the protective member w4 or travels toward a position different from the imaging unit 80.

In contrast to the example of Figure 6, in the edge image of the bonded substrate W in which a defect (a void in this example) exists inside the protective member w4, the defect is clearly visible. Specifically, as shown by the thick dotted ellipse in the lower part of Figure 7, the brightness of the part of the image portion i2 that corresponds to the void vi inside the protective member w4 is significantly greater than the brightness of the other parts. This is because, as shown in the upper part of Figure 7, only the infrared light that is incident on the part of the first inclined surface e1 of the single substrate w2 where the void vi occurs is specularly reflected by the first inclined surface e1 and enters the imaging unit 80.

From these, it can be seen that, using the edge image data, it is possible to detect defects inside the protective member w4 based on whether or not the amount of received light corresponding to a specific portion of the bonded substrate W satisfies a predetermined condition (a condition for defect determination). In the examples of Figures 6 and 7, the specific portion of the bonded substrate W is the first inclined surface e1 of the single substrate w2.

The conditions for defect determination include, for example, whether or not the detected amount of received light is greater than a predetermined amount of received light. In this case, if an amount of received light greater than the predetermined amount is detected, it is determined that a defect exists. Alternatively, the conditions for defect determination include, for example, whether or not an amount of received light greater than the predetermined amount is detected in an area greater than a predetermined area. In this case, if an amount of received light greater than the predetermined amount is detected in an area greater than a predetermined area, it is determined that a defect exists.

[5] Control System of Edge State Checking Device 1 Fig. 8 is a block diagram showing the configuration of a control system of the edge state checking device 1 of Fig. 1. As shown in Fig. 8, the control device 90 includes a CPU 91 and a storage unit 99. The CPU 91 includes, as functional units, a rotation and suction control unit 92, a movement control unit 93, a tilt control unit 94, an eccentric shape information acquisition unit 95, an imaging control unit 96, an image data generation unit 97, and a defect determination unit 98. The storage unit 99 stores an edge state checking program for checking the state of the outer circumferential edge of the substrate W in the edge state checking device 1. The storage unit 99 also stores various information input from an operation unit (not shown). The various information includes the above-mentioned specified position RP, specified attitude, and defect determination conditions.

Each functional unit of the CPU 91 is realized by the CPU 91 executing an end state confirmation program stored in the memory unit 99. Note that some or all of the multiple functional units of the CPU 91 may be realized by hardware such as electronic circuits.

The operation of each functional unit of the CPU 91 will be described. The rotation and suction control unit 92 controls the rotation and suction drive unit 42 when acquiring eccentricity information and shape information of the substrate W, and when checking the state of the outer peripheral end of the substrate W. As a result, the substrate W to be checked is suction-held on the suction holder 41. In addition, the substrate W that is suction-held is rotated.

The movement control unit 93 controls the movement drive unit 32 based on a movement command input from an operation unit (not shown). The movement control unit 93 also controls the movement drive unit 32 based on eccentricity information and shape information acquired by an eccentricity shape information acquisition unit 95 (described later) so that the outer circumferential edge of the substrate W passes through a specified position RP in a specified attitude. This causes the mounting surface of the movement stage 31 to move on the tilt stage 21.

The tilt control unit 94 controls the tilt drive unit 23 based on a tilt command input from an operation unit (not shown). The tilt control unit 94 also controls the tilt drive unit 23 based on the eccentricity information and shape information acquired by the eccentricity shape information acquisition unit 95 described below so that the outer circumferential edge of the substrate W passes through a specified position RP in a specified attitude. This adjusts the inclination of the tilt stage 21 with respect to the horizontal plane.

The eccentricity shape information acquisition unit 95 calculates eccentricity information of the substrate W adsorbed and held on the adsorption holder 41 based on the signal output from the encoder of the motor provided in each of the movement drive unit 32 and the rotary adsorption drive unit 42 and the signal output from the eccentricity detector 50. The eccentricity shape information acquisition unit 95 also calculates shape information of the substrate W adsorbed and held on the adsorption holder 41 based on the signal output from the encoder of the motor provided in each of the movement drive unit 32 and the rotary adsorption drive unit 42 and the signal output from the height detector 60.

When checking the condition of the outer peripheral edge of the substrate W, the imaging control unit 96 controls the light emitting unit 70 and the imaging unit 80 so that infrared light is emitted to the imaging area of the imaging unit 80 and the outer peripheral edge of the substrate W is imaged. The image data generating unit 97 generates edge image data based on a signal (pixel data) output from the imaging unit 80. The defect determining unit 98 determines whether or not a defect exists at the outer peripheral edge of the substrate W based on the edge image data generated by the image data generating unit 97 and defect determination conditions stored in advance in the memory unit 99.

9 is a flowchart showing an example of an edge state confirmation process executed in the edge state confirmation device 1. The edge state confirmation process is started by the CPU 91 executing an edge state confirmation program stored in the memory unit 99 when the substrate W is carried into the edge state confirmation device 1.

When the edge condition confirmation process is started, the rotation and adsorption control unit 92 controls the rotation and adsorption drive unit 42 to adsorb and hold the substrate W that has been brought into the edge condition confirmation device 1 and placed on the adsorption holding unit 41 (step S11).

Next, eccentricity information of the substrate W is acquired (step S12). Specifically, when acquiring the eccentricity information, the rotation and adsorption control unit 92 controls the rotation and adsorption driving unit 42 to rotate the substrate W 360°. Then, the eccentricity shape information acquisition unit 95 calculates the eccentricity information based on the output signal from the encoder of the rotation and adsorption driving unit 42 and the output signal from the eccentricity detector 50.

Next, shape information of the substrate W is acquired (step S13). Specifically, when acquiring the shape information, the rotation and adsorption control unit 92 controls the rotation and adsorption driving unit 42 to rotate the substrate W 360°. Then, the eccentricity shape information acquisition unit 95 detects the shape information based on the output signal from the encoder of the rotation and adsorption driving unit 42 and the output signal from the height detector 60. Note that the processes of steps S12 and S13 may be performed in the reverse order or simultaneously.

Next, the outer peripheral edge of the substrate W is imaged (step S14). Specifically, when the outer peripheral edge of the substrate W is imaged, the rotation and adsorption control unit 92 controls the rotation and adsorption driving unit 42 to rotate the substrate W 360°. At this time, the movement control unit 93 and the tilt control unit 94 control the movement driving unit 32 and the tilt driving unit 23 based on the specified position RP and specified attitude stored in the memory unit 99 and the acquired eccentricity information and shape information. As a result, the outer peripheral edge of the substrate W passes through the specified position RP in the specified attitude. In addition, the imaging control unit 96 controls the light emitting unit 70 and the imaging unit 80 to image the entire circumference of the outer peripheral edge of the substrate W. Furthermore, the image data generating unit 97 generates edge image data based on the output signal from the encoder of the rotation and adsorption driving unit 42 and the output signal from the imaging unit 80.

Finally, the defect determination unit 98 determines whether or not a defect exists at the outer peripheral edge of the substrate W based on the edge image data generated in the immediately preceding step S14 and the defect determination conditions pre-stored in the memory unit 99 (step S15). In step S15, in addition to the defect determination, the rotation of the substrate W is stopped and the suction-holding state of the substrate W by the suction-holding unit 41 is released. Thereafter, the series of processes for the edge state confirmation process is completed.

In the above edge condition confirmation process, the defect determination unit 98 may output edge image data to the outside of the edge condition confirmation device 1 instead of determining the presence or absence of a defect in step S15. In this case, the user can evaluate the presence of a defect at the outer peripheral edge of the substrate W by analyzing the edge image data output from the edge condition confirmation device 1.

In addition, in the above-mentioned edge condition confirmation process, if it is determined in step S15 that a defect exists at the outer peripheral edge of the substrate W, the defect determination unit 98 may output an alarm signal indicating the presence of a defect to the outside of the edge condition confirmation device 1.

[7] Effects (1) In the above-described edge state checking device 1, infrared light is emitted from the light emitting unit 70 toward the outer circumferential edge of the substrate W held by the suction holding unit 41. The emitted infrared light is incident on at least a part of the substrate W and the protective member w4. Depending on the presence or absence of a defect in the outer circumferential edge of the substrate W, light that passes through the outer circumferential edge of the substrate W and the protective member w4 is received by the imaging unit 80.

By imaging the outer peripheral edge of the substrate W using the imaging unit 80, edge image data is generated that shows the state of the outer peripheral edge of the substrate W and the inside of the protective member w4. As a result, it is possible to determine internal defects in the protective member w4 formed at the outer peripheral edge of the substrate W based on the generated edge image data.

(2) In the above-mentioned edge status checking device 1, the imaging unit 80 has an imaging area with a band-shaped cross section. In addition, multiple parts of the outer peripheral edge of the substrate W pass through the imaging area of the imaging unit 80, so that the entire outer peripheral edge of the substrate W is imaged. This configuration realizes miniaturization of the light emitting unit 70 and the imaging unit 80, and prevents the edge status checking device 1 from becoming larger.

(3) In the edge condition checking device 1, whether or not a defect exists at the outer peripheral edge of the substrate W is determined based on the edge image data obtained by imaging with the imaging unit 80 and predetermined conditions for defect determination. This allows a uniform determination of whether or not a defect exists at the outer peripheral edge of the substrate W without requiring the user to be skilled in defect determination.

(4) In the edge state checking device 1 according to the first embodiment, as shown in FIG. 2, the central axis ax1 of the rotation axis 22s of the tilt stage 21 overlaps with the specified position RP in plan view. In this case, the outer peripheral edge of the substrate W adsorbed and held by the adsorption holding unit 41 is less likely to move significantly in the vertical direction during operation of the tilt device 20 compared to when the central axis ax1 is significantly separated from the specified position RP in plan view. This makes it easier to control the movement drive unit 32 and the tilt drive unit 23 to pass the outer peripheral edge of the substrate W in a specified attitude at the specified position RP when imaging the outer peripheral edge of the substrate W.

2. Second embodiment Fig. 10 is a schematic side view of an edge state checking device 1 according to a second embodiment, and Fig. 11 is a schematic plan view of the edge state checking device 1 of Fig. 10. The edge state checking device 1 according to the second embodiment will be described with respect to differences from the edge state checking device 1 of Figs. 1 and 2 according to the first embodiment. A bonded substrate W on which no protective member w4 is formed is carried into the edge state checking device 1 according to the present embodiment and held by the suction holding part 41.

As shown in Figures 10 and 11, the edge state checking device 1 according to the second embodiment includes, in addition to the configuration of the edge state checking device 1 according to the first embodiment, a protective member forming unit LN for forming a protective member w4 on the outer peripheral edge of the bonded substrate W. The protective member forming unit LN is connected to a supply system (not shown) that supplies a coating liquid for the protective member, and includes a nozzle member capable of ejecting the coating liquid supplied from the supply system.

The tip of the nozzle member of the protective member forming unit LN is positioned upstream of the imaging area of the imaging unit 80 in the rotation direction of the bonded substrate W and near the outer circumferential edge of the bonded substrate W.

The control device 90 controls a supply system (not shown) connected to the protective member forming unit LN. As a result, before the imaging unit 80 captures an image of the outer peripheral edge of the bonded substrate W, as shown in the balloon in FIG. 10, a coating liquid for the protective member is filled into the space between the bevel portion of the single substrate w1 and the bevel portion of the single substrate w2 of the rotating bonded substrate W. The filled coating liquid hardens to form the protective member w4.

The above configuration allows the formation of the protective member w4 and confirmation of the state of the outer peripheral edge of the bonded substrate W to be performed within the edge state confirmation device 1. This improves the processing efficiency of the bonded substrate W.

3. Other Embodiments (1) In the above embodiment, the specified position RP and the specified posture are determined such that, in a state in which the protective member w4 is not present, only the reflected light that is specularly reflected by the first inclined surface e1 of the single substrate w2 in FIG. 5 out of the infrared light emitted from the light emitting unit 70 is incident on the imaging unit 80; however, the present invention is not limited to this.

The specified position RP and the specified attitude may be determined such that, in the absence of the protective member w4, only the reflected light that is specularly reflected by the second inclined surface e3 of the single substrate w1 in FIG. 5 out of the infrared light emitted from the light emitting section 70 is incident on the imaging section 80. When the specified position RP and the specified attitude are determined in this manner, the detection accuracy of voids vi that occur mainly on the second inclined surface e3 of the single substrate w1 of the bonded substrate W is improved.

The positions of the light emitting unit 70 and the imaging unit 80 in the end state checking device 1 may be changed as appropriate according to the specified position RP and the specified attitude. For example, when the specified position RP and the specified attitude are determined so that only light reflected specularly from the second inclined surface e3 of the single substrate w1 in FIG. 5 is incident on the imaging unit 80, the positions of the light emitting unit 70 and the imaging unit 80 may be changed so as to be inverted in the Z direction relative to the example in FIG. 1.

The edge condition checking device 1 may be provided with multiple light emitting units 70 and multiple imaging units 80 so as to correspond to multiple portions of the outer circumferential edge of the bonded substrate W (such as the second inclined surface e3 of the single substrate w1 and the first inclined surface e1 of the single substrate w2). In this case, it becomes possible to detect internal defects present at the outer circumferential edge of the bonded substrate W with higher accuracy based on the multiple edge image data acquired by the multiple imaging units 80.

When multiple light emitting units 70 and multiple image capturing units 80 are used, it is desirable to synchronize the emission timing of infrared light in the light emitting unit 70 and the release timing of the shutter in the image capturing unit 80 for each corresponding light emitting unit 70 and image capturing unit 80. This prevents infrared light emitted from a light emitting unit 70 corresponding to another image capturing unit 80 from being incident on one image capturing unit 80, preventing erroneous detection of defects.

(2) Depending on the wavelength of the infrared light, the material of the substrate W, the thickness of the substrate W, the material of the protective member w4, etc., it is considered that a discernible difference occurs between the amount of attenuation of the infrared light that passes through a portion where a defect exists and the amount of attenuation of the infrared light that passes through a portion where no defect exists. Therefore, defect determination may be performed based on edge image data obtained by directly receiving the infrared light that has passed through the outer peripheral edge of the substrate W with the imaging unit 80.

In this case, the light emitting unit 70 and the imaging unit 80 may be arranged, for example, to face each other. According to the above defect determination, it is no longer necessary to limit the infrared light for determining defects to infrared light reflected from a specific portion of the substrate W. Therefore, it becomes possible to determine the state of the outer circumferential edge of the substrate W with high accuracy without taking into account the attitude of the outer circumferential edge of the substrate W.

(3) The bonded substrate W is not limited to a structure in which two single substrates w1 and w2 are bonded together, but may have a laminated structure in which three or more single substrates are bonded together. In this case, a protective member w4 is formed between each pair of bevel portions adjacent to each other in the stacking direction.

(4) In the above embodiment, the height detector 60 includes a laser displacement meter, but the present invention is not limited to this. In order to obtain shape information, the height detector 60 may include a detector (such as an ultrasonic displacement sensor) capable of detecting the distance between the tilt stage 21 and the outer periphery of the substrate W in a non-contact manner, instead of a laser displacement meter.

(5) In the above embodiment, the protective member w4 is formed on the outer circumferential edge of the bonded substrate W, but the present invention is not limited to this. When the substrate W held by the suction holder 41 is a single substrate, the protective member w4 may be provided so as to cover the outer circumferential edge (bevel portion) of the single substrate.

(6) In the above embodiment, the eccentricity information and shape information are calculated and detected based on the output from the eccentricity detector 50 and the height detector 60, respectively, but the present invention is not limited to this. The eccentricity shape information acquisition unit 95 may acquire at least one of the eccentricity information and the shape information through an input from outside the end condition confirmation device 1.

(7) In the end condition checking device 1 according to the above embodiment, the imaging unit 80 includes imaging elements arranged in a line, but the present invention is not limited to this. Instead of imaging elements arranged in a line, the imaging unit 80 may include imaging elements in which multiple pixels are arranged in a matrix. In other words, the imaging unit 80 may include an imaging element in which multiple pixels are arranged two-dimensionally.

(8) In the edge condition checking device 1 according to the above embodiment, whether or not a defect exists at the outer peripheral edge of the substrate W is determined based on edge image data obtained by imaging with the imaging unit 80, but the present invention is not limited to this. It is not necessary to determine whether or not a defect exists.

(9) The edge condition checking device 1 according to the above embodiment may be provided with a display device that displays an edge image based on the generated edge image data. In this case, the user can easily grasp the shape and size of defects present at the outer peripheral edge of the substrate W from the edge image.

(10) In the end state checking device 1 according to the above embodiment, a multispectral camera or a hyperspectral camera may be used as the imaging unit 80.

(11) In the edge condition checking device 1 according to the above embodiment, the light emitting unit 70 and the imaging unit 80 are fixed to the housing 10, and the tilt device 20, the moving device 30, and the rotation holding device 40 operate so that the outer peripheral edge of the substrate W passes through a specified position RP in the imaging area of the imaging unit 80 in a specified posture, but the present invention is not limited to this.

For example, with the tilt device 20, the moving device 30 and the rotation holding device 40 all fixed within the housing 10, the light emitting unit 70 and the imaging unit 80 may operate within the housing 10 so that the outer peripheral end of the substrate W passes through a specified position RP in the imaging area of the imaging unit 80 in a specified attitude.

4. Correspondence between each component of the claims and each element of the embodiment Below, examples of correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

In the above embodiment, the edge condition checking device 1 is an example of an edge condition checking device, the rotation holding device 40 is an example of a substrate holding unit, the light emitting unit 70 is an example of a light emitting unit, infrared light is an example of light with a wavelength that can pass through the substrate and the protective member, and the imaging unit 80 is an example of an imaging unit.

In addition, the tilt device 20, the moving device 30, the movement control unit 93, and the tilt control unit 94 are examples of a position and attitude adjustment unit, the eccentricity detector 50, the height detector 60, and the eccentricity shape information acquisition unit 95 are examples of an eccentricity shape information acquisition unit, the image data generation unit 97 is an example of an image data generation unit, the defect determination unit 98 is an example of a defect determination unit, the single substrates w1 and w2 are examples of single substrates, the bonded substrate W is an example of a bonded substrate, and the protective member formation unit LN is an example of a protective member formation unit.
5. Reference form
(1) An edge condition confirmation device in a reference embodiment is an edge confirmation device that confirms the edge condition of a substrate having at least a circular shape in part and a protective member provided at its outer peripheral edge, and includes a substrate holding unit that holds the substrate, a light emitting unit that emits light of a wavelength that can pass through the substrate and the protective member toward the outer peripheral edge of the substrate held by the substrate holding unit, and an imaging unit that images the outer peripheral edge of the substrate by receiving light emitted from the light emitting unit and that has passed through the outer peripheral edge of the substrate and the protective member.
In the edge condition checking device, light is emitted toward the outer circumferential edge of the substrate held by the substrate holding unit. The emitted light is incident on at least a portion of the substrate and the protective member. Depending on the presence or absence of a defect in the outer circumferential edge of the substrate, the light emitted from the light emitting unit and transmitted through the outer circumferential edge of the substrate and the protective member is received by the imaging unit. By imaging the outer circumferential edge of the substrate using the imaging unit, image data can be obtained that shows the state of the outer circumferential edge of the substrate and the inside of the protective member. As a result, it is possible to determine internal defects in the protective member formed on the outer circumferential edge of the substrate based on the acquired image data.
(2) The imaging unit has an imaging area having a band-shaped cross-section extending in a first direction, the light emitting unit and the imaging unit are arranged in a predetermined positional relationship such that light emitted from the light emitting unit travels toward the imaging area of the imaging unit, and the substrate holding unit is configured to be able to rotate while holding the substrate, and the end status confirmation device may further include a position and attitude adjustment unit that adjusts the position and attitude of the substrate holding unit so that, when the imaging unit images the outer peripheral end of the substrate, the substrate held by the substrate holding unit rotates such that multiple portions in the circumferential direction of the outer peripheral end of the substrate sequentially pass a predetermined reference position in the imaging area in a predetermined reference attitude toward a second direction intersecting the first direction.
In this case, it is possible to capture an image of the entire outer peripheral edge of the board without increasing the imaging area, which allows the light emitting unit and the imaging unit to be miniaturized, and prevents the edge state confirmation device from becoming large.
(3) The edge condition confirmation device may further include an eccentricity shape information acquisition unit that acquires eccentricity information including the amount and direction of eccentricity of the center of the substrate relative to the center of rotation of the substrate held by the substrate holding unit, and shape information indicating the shape of the outer periphery of the substrate, before the imaging unit captures the image of the outer periphery of the substrate, and the position and attitude adjustment unit may adjust the position and attitude of the substrate holding unit based on the eccentricity information and shape information acquired by the eccentricity shape information acquisition unit when the imaging unit captures the image of the outer periphery of the substrate.
In this case, the position and attitude of the outer peripheral edge of the substrate relative to the light emitting portion and the imaging portion can be more accurately adjusted to the reference position and attitude depending on the state in which the substrate is held by the substrate holding portion and the shape of the substrate.
(4) The edge condition confirmation device may further include an image data generation unit that generates image data based on an output signal from the imaging unit, and a defect judgment unit that judges whether or not a defect exists at the outer peripheral edge of the substrate based on whether or not the image data generated by the image data generation unit satisfies predetermined judgment conditions.
In this case, the presence or absence of defects in the outer peripheral edge of the substrate and inside the protective member can be uniformly determined without requiring the user to be highly skilled in defect determination.
(5) The substrate may be a bonded substrate in which a plurality of single substrates are bonded together, thereby making it possible to determine whether or not there is a defect in the boundary portion of the plurality of single substrates bonded together.
(6) Each of the multiple single substrates that make up the bonded substrate may have a bevel portion at an outer peripheral edge of the substrate, the protective member may be provided at the outer peripheral edge of the bonded substrate so as to fill a space between two adjacent bevels in the stacking direction of the multiple single substrates, and the imaging unit may be positioned to receive light that passes through the outer peripheral edges of the substrates and the protective member and is reflected by one of the two bevel portions.
When the protective member is embedded in the space between the two bevel portions without any gaps, the light emitted toward the outer peripheral edge of the bonded substrate passes through each bevel portion without being reflected. On the other hand, when the protective member is not fully embedded in the space between the two bevel portions and a void exists on one of the bevel portions, the light emitted toward the outer peripheral edge of the bonded substrate is reflected on the one of the bevel portions where the void exists. Therefore, according to the above configuration, the presence of a void inside the protective member can be easily determined based on the amount of light received that is incident on the imaging unit from the outer peripheral edge of the bonded substrate.
(7) The edge condition checking device may further include a protective member forming unit that prepares a substrate by forming a protective member on an outer peripheral edge of the unprocessed substrate while the unprocessed substrate, on which no protective member has been formed, is held by the substrate holding unit.
In this case, it becomes possible to form a protective member for the outer peripheral edge of the substrate in the edge state checking device, thereby improving the efficiency of substrate processing.

1...End state confirmation device, 10...Housing, 20...Tilt device, 21...Tilt stage, 22...Support member, 22s...Rotation axis, 23...Tilt drive unit, 30...Moving device, 31...Moving stage, 32...Moving drive unit, 40...Rotation holding device, 41...Suction holding unit, 42...Rotation suction drive unit, 50...Eccentricity detector, 59...Support column, 60...Height detector, 70...Light emission unit, 79...Support piece, 80...Imaging unit, 89...Support column, 90...Control device, 91...CPU, 92 ...Rotation and suction control unit, 93...Movement control unit, 94...Tilt control unit, 95...Eccentric shape information acquisition unit, 96...Imaging control unit, 97...Image data generation unit, 98...Defect determination unit, 99...Memory unit, LN...Protective material formation unit, RP...Specified position, W...Substrate, bonded substrate, ax1...Center axis, e1...First inclined surface, e2...End surface, e3...Second inclined surface, i1, i2, i3...Image portion, vi...Void, w1, w2...Single substrate, w3...Adhesive, w4...Protective material

Claims (5)

An edge checking device for checking an edge state of a substrate having at least a portion having a circular shape and having a protective member provided on an outer peripheral edge, comprising:
The substrate is a laminated substrate in which a plurality of single substrates are laminated together,
each of the plurality of single substrates constituting the bonded substrate has a bevel portion at an outer peripheral edge of the single substrate;
the protective member is provided at an outer peripheral end of the bonded substrate stack so as to fill a space between two adjacent bevels in a stacking direction of the plurality of single substrates,
The end confirmation device is
A substrate holder for holding the substrate;
a light emitting unit that emits light having a wavelength that can be transmitted through the substrate and the protective member toward an outer peripheral end of the substrate held by the substrate holding unit;
an imaging unit configured to receive light emitted from the light emitting unit and transmitted through the outer peripheral edge of the substrate and the protective member, and to image the outer peripheral edge of the substrate ;
The imaging unit is disposed so as to receive light that is transmitted through the outer peripheral edge of the substrate and the protective member and specularly reflected by one of the two bevel portions . The imaging unit has an imaging region having a strip-like cross section extending in a first direction,
the light output unit and the imaging unit are disposed in a predetermined positional relationship such that light emitted from the light output unit travels toward the imaging area of the imaging unit;
the substrate holder is configured to be able to rotate the substrate while holding it;
The end state confirmation device is
2. The edge condition checking device of claim 1, further comprising a position and attitude adjustment unit that adjusts the position and attitude of the substrate holding unit so that, when the imaging unit images the outer peripheral edge of the substrate, the substrate held by the substrate holding unit rotates so that multiple portions of the outer peripheral edge of the substrate in the circumferential direction pass predetermined positions in the imaging area in a predetermined attitude toward a second direction intersecting the first direction. an eccentricity shape information acquisition unit that acquires, before the imaging unit captures an image of the outer circumferential edge of the substrate, eccentricity information including an amount and a direction of eccentricity of a center of the substrate relative to a center of rotation of the substrate held by the substrate holding unit, and shape information indicating a shape of the outer circumferential edge of the substrate;
3. The edge condition checking device of claim 2, wherein the position and attitude adjustment unit adjusts the position and attitude of the substrate holding unit based on the eccentricity information and the shape information acquired by the eccentricity shape information acquisition unit when the imaging unit captures the outer peripheral edge of the substrate. an image data generating unit that generates image data based on an output signal from the imaging unit;
The edge condition confirmation device according to any one of claims 1 to 3, further comprising a defect determination unit that determines whether or not a defect exists at the outer peripheral edge of the substrate based on whether or not the image data generated by the image data generation unit satisfies a predetermined determination condition. The edge condition checking device according to any one of claims 1 to 4, further comprising a protective member forming section that prepares the substrate by forming the protective member on an outer peripheral edge of the unprocessed substrate while the unprocessed substrate on which the protective member is not formed is held by the substrate holding section.