JP7725091B2 - Two-stage cooling module and photonic beauty device - Google Patents

Description

The present invention relates to the field of beauty devices, and in particular to a two-stage cooling module and a photonic beauty device.

Photonic beauty devices that use pulsed light, lasers, halogen lamps, other light sources, or radio frequencies to achieve beauty functions generate light waves in a light source module and emit them from the light output window of the working head of the device. These light waves are then applied to the skin surface that is in direct contact with (or not in direct contact with) the end face of the working head, providing beauty treatments such as hair removal, skin rejuvenation, blemish removal, anti-inflammation, vascular softening, wrinkle removal, skin redness removal, acne treatment, vascular lesion treatment, pigmented lesion treatment, or high-frequency physical therapy, either alone or in combination. Some portable or handheld beauty devices currently on the market have insufficient internal heat dissipation, which affects the device's functionality and prevents the desired beauty effects from being achieved. Furthermore, their internal structures are complex, which result in insufficient cooling of the working surface, or the working surface is too hot, causing skin burns and a poor user experience.

The technical problem that this invention aims to solve is to provide a two-stage cooling module and a photonic beauty device, thereby solving the heat dissipation and work surface cooling problems of conventional beauty devices.

In order to solve the above technical problems, the technical solutions provided by the present invention are as follows:
The two-stage cooling module includes a primary semiconductor cooling element, a secondary semiconductor cooling element, and a cooling conduction element. The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and hot and cold surfaces at both ends. The cooling conduction element is connected between the primary semiconductor cooling element and the secondary semiconductor cooling element for rapid cooling conduction. The cooling conduction element is a heat transfer structural element.

Furthermore, both ends of the cooling conduction member are connected to the high-temperature surface of the primary semiconductor cooling member and the low-temperature surface of the secondary semiconductor cooling member, respectively, for rapid heat transfer. The heat transfer structural member is one or a combination of multiple types selected from the group consisting of heat conduction members made of thermally conductive materials, heat pipes, vapor chambers, superheat conduction tubes, and superheat conduction plates.

In some embodiments, the superheat conducting tube is an aluminum superconducting tube. The superheat conducting plate is an aluminum superconducting plate. Both ends of the aluminum superconducting plate or aluminum superconducting tube are sealed, and a working liquid is sealed inside. When the aluminum material is formed, two or more microgrooves are formed on the inner wall of the aluminum superconducting plate or aluminum superconducting tube. When the aluminum material is formed, a microporous structure is formed within the aluminum superconducting plate or aluminum superconducting tube material.

In some embodiments, the cooling module includes a heat conduction structure and a heat dissipation piece. The heat conduction structure is one or a combination of a heat conduction member made of a heat conductive material, a heat pipe, a vapor chamber, a superheat conduction tube, and a superheat conduction plate. The heat conduction structure is connected to the heat dissipation piece for rapid heat transfer. The heat conduction structure is connected to the high-temperature surface of the secondary semiconductor cooling member for rapid heat transfer, or the high-temperature end circuit of the secondary semiconductor cooling member is installed in the heat conduction structure and welded and electrically connected to the electric double layer of the secondary semiconductor cooling member, thereby making the heat conduction structure the high-temperature surface of the secondary semiconductor cooling member, thereby rapidly dissipating heat from the high-temperature surface of the secondary semiconductor cooling member. The cooling module further includes a fan. The fan includes a housing and an impeller within the housing. The heat conduction structure and/or the heat dissipation piece are installed in the fan's air vent or are part of the fan housing.

In some embodiments, the heat conduction structure includes a plurality of aluminum superconducting plates or tubes. The aluminum superconducting plates or tubes are single tubes with a single passage formed therein. The aluminum superconducting plates or tubes are flat-bent or specially shaped 3D bent to accommodate the installation space. The heat conduction structure further includes a heat conduction plate. The plurality of aluminum superconducting plates or tubes are fitted into the heat conduction plate. The plurality of aluminum superconducting plates or tubes are arranged to include at least two different directions or angles, thereby reducing the disadvantage of reduced heat conduction due to the anti-gravity effect. The heat dissipation plate includes one or more sets of heat conduction material fins. The heat conduction plate is installed in the groove of the heat dissipation plate or on the top of the heat dissipation plate, or the heat dissipation plate and the heat conduction plate are installed on another heat conduction member.

In some embodiments, the heat conduction plate is provided with a plurality of opening grooves. The plurality of aluminum superconducting plates or aluminum superconducting tubes are fitted into the plurality of opening grooves and correspondingly mounted within the opening grooves, with their wall surfaces contacting each other to accelerate heat transfer. The aluminum superconducting plates or aluminum superconducting tubes are welded or crimped to the opening grooves to increase the contact area. The secondary semiconductor cooling element is mounted on the heat conduction plate. The high-temperature surface of the secondary semiconductor cooling element is attached by bonding to the outer wall of the heat conduction plate, thereby directly conducting heat from the high-temperature surface to the heat conduction plate; alternatively, the high-temperature surface of the secondary semiconductor cooling element is attached to the outer wall of the heat conduction plate by a heat conduction member, which rapidly conducts heat from the high-temperature surface to the heat conduction plate; or the heat conduction plate functions as the high-temperature surface, and a high-temperature end circuit of the secondary semiconductor cooling element is mounted thereon and welded and electrically connected to the PN galvanic particles of the electric double layer. The multiple aluminum superconducting plates or aluminum superconducting tubes are designed in a circular, staggered, or circulating manner, intersecting at two different directions or angles in the XY plane, or at a fixed angle.

In some embodiments, the secondary semiconductor cooling member dissipates heat through a heat dissipation fan module. The heat dissipation fan module includes a fan housing and an impeller. The interior of the fan housing is a cavity. The impeller is mounted within the cavity. The fan housing has multiple vents. The cavity communicates with a gas path external to the fan through the vents. At least a portion of the fan housing comprises a thermally conductive outer housing. The thermally conductive outer housing is formed as a whole, or is formed by butt-joining multiple components selected from the group consisting of thermally conductive members, heat pipes, vapor chambers, superheat conductive tubes, and superheat conductive plates made of thermally conductive materials. The high-temperature surface of the secondary semiconductor cooling member is connected to the thermally conductive outer housing for heat transfer, or the thermally conductive outer housing itself serves as the high-temperature surface of the secondary semiconductor cooling member.

In some embodiments, the superheat conducting tube is an aluminum superconducting tube. The superheat conducting plate is an aluminum superconducting plate. The heat dissipating fan module includes a heat dissipating plate. The heat dissipating plate is connected to the heat conducting outer housing for rapid heat transfer. The air passage of the heat dissipating plate is connected to the fan vent and cavity. The side housing of the fan housing includes the heat conducting outer housing.

In some embodiments, the side housing of the fan housing includes the heat-conducting outer housing, which is made of a single-passage or multi-passage aluminum superconducting tube or aluminum superconducting plate. The heat sink is installed on the inner wall of the side housing of the fan housing. The airflow direction of the heat sink is the rotational direction or axial direction of the impeller.

The present invention further relates to a photonic beauty device, including a body having multiple ventilation openings. A light source module, a power supply module, and a control circuit board are installed inside the body. The light source module and the power supply module are electrically connected to the control circuit board. The multiple ventilation openings of the body serve as air intakes and exhausts, forming a ventilation passage together with the space inside the body. The front end of the body is a work surface. A two-stage cooling module as described in any of the above embodiments is further installed inside the body. The primary semiconductor cooling piece serves as the work surface itself, or cools the work surface.

Furthermore, when the primary semiconductor cooling piece is used as the work surface, the transparent crystal serves as the cold surface, and the cold surface serves as the work surface. A light-transmitting window is installed on the hot surface and electric double layer of the primary semiconductor cooling piece, making the primary cooling member light-transmitting, or the cold surface, hot surface, and electric double layer of the primary semiconductor cooling piece collectively define the light-transmitting window, allowing photonics generated in the light source module to be transmitted through the light-transmitting window to the outside of the work surface. When the primary semiconductor cooling piece cools the work surface, the cold surface of the primary semiconductor cooling piece contacts the work surface to transfer heat, or the cold surface of the primary cooling member is connected to the work surface by a thermally conductive member to rapidly transfer heat to the work surface.

In some embodiments, the two-stage cooling module includes a fan and is located within the ventilation passage within the body. The light source module includes a lamp tube and a reflecting cup. The ventilation passage within the reflecting cup communicates with the ventilation passage of the fan and with the ventilation passage within the body to form a heat dissipation ventilation passage for the light source module, and the fan promotes heat dissipation from the light source module. A heat dissipation piece or heat conduction member is installed on one side of the reflecting cup. The fan housing is formed with multiple ventilation holes. One ventilation hole is fitted with a heat dissipation piece or heat conduction member for the reflecting cup, connecting the ventilation passage of the fan to the ventilation passage within the body to form a first ventilation passage for dissipating heat from the reflecting cup. The other ventilation hole of the fan communicates with the ventilation passage within the reflecting cup and connects the ventilation passage of the fan to the ventilation passage within the body to form a second ventilation passage for dissipating heat from the reflecting cup and the lamp tube.

In some embodiments, the photonic beauty device is a hair removal device, a photonic skin regeneration device, an import/export beauty device, or a radio frequency beauty device.

The two-stage cooling module of the present invention provides rapid cooling and heat dissipation effects.

The present invention will now be described in more detail with reference to the drawings.

1 is a perspective view of a cosmetic device according to a first embodiment of the present invention; 1 is a perspective view of a cosmetic device according to a first embodiment of the present invention with an upper housing removed. 1 is a diagram showing the internal structure of a cosmetic device according to a first embodiment of the present invention; 3 is a diagram showing a ventilation passage of the cosmetic device according to the first embodiment of the present invention. FIG. 10A and 10B are diagrams showing another embodiment of the ventilation opening of the beauty device according to the present invention. 6 is a diagram showing an internal ventilation path of the cosmetic device according to the embodiment shown in FIG. 5. FIG. FIG. 2 is an exploded view of the cosmetic device according to the embodiment shown in FIG. 1 . 1 is a diagram showing the configuration of a first embodiment of a cooling module according to the present invention; 1 is a perspective view of a first embodiment of a cooling module according to the present invention; 1 is an exploded view of a portion of a cooling module according to the present invention; 1 is a perspective view of a cooling module according to the present invention; 1 is an exploded view of a portion of a cooling module according to the present invention; 1 is a diagram showing a configuration of a part of a cooling module according to the present invention; 14A and 14B are diagrams showing a modified configuration of the cooling module according to the first embodiment of the present invention, and are diagrams showing the configuration when viewed from different directions. 15(a) and 15(b) are diagrams showing the configuration of an alternative embodiment of a semiconductor cooling module according to the present invention, and are different embodiments. FIG. 10 is a perspective view of a cosmetic device according to a second embodiment of the present invention. FIG. 10 is a perspective view of a cosmetic device according to a second embodiment of the present invention with an upper housing removed. FIG. 10 is a diagram showing the internal structure of a cosmetic device according to a second embodiment of the present invention. FIG. 10 is an exploded view of a cosmetic device according to a second embodiment of the present invention. FIG. 10 is a diagram showing a configuration of a second embodiment of a cooling module according to the present invention. FIG. 10 is a diagram showing another configuration of the second embodiment of the cooling module according to the present invention. FIG. 10 is a diagram showing another configuration of the second embodiment of the cooling module according to the present invention. 23(a) and 23(b) are diagrams showing the configuration of an aluminum superconducting plate or an aluminum superconducting tube of a cooling module according to an embodiment of the present invention, in which FIG. 23(a) is a perspective view of one aluminum superconducting plate or one aluminum superconducting tube, and FIG. 23(b) is a cross-sectional view taken along A-A in FIG. 23(a). FIG. 10 is a diagram showing a configuration of a cooling module according to a third embodiment of the present invention. FIG. 10 is a diagram showing another configuration of the cooling module according to the third embodiment of the present invention. FIG. 10 is a diagram showing another configuration of the third embodiment of the cooling module according to the present invention. FIG. 10 is a perspective view of a cosmetic device according to a third embodiment of the present invention with the front housing removed. FIG. 10 is a perspective view of a cosmetic device according to a fourth embodiment of the present invention with the front housing removed. FIG. 10 is an exploded view of a fourth embodiment of a cooling module according to the present invention. FIG. 10 is a perspective view of a fourth embodiment of a cooling module according to the present invention. FIG. 10 is a diagram showing the internal configuration of a cosmetic device according to a fifth embodiment of the present invention. FIG. 10 is an exploded view of a cosmetic device according to a fifth embodiment of the present invention. 1 is a perspective view of a heat-dissipating fan module according to an embodiment of the present invention; FIG. 10 is a perspective view of the heat-dissipating fan module according to the embodiment of the present invention, viewed from another direction. 1 is an exploded view of a heat-dissipating fan module according to an embodiment of the present invention; 1 is a cross-sectional view of a heat-dissipating fan module according to an embodiment of the present invention; 1 is a diagram showing the configuration of a side volute case of a heat dissipation fan module according to an embodiment of the present invention; FIG. 38 is a diagram showing a replacement configuration for the embodiment shown in FIG. 37. FIG. 38 shows another alternative configuration for the embodiment shown in FIG. 37. FIG. 38 illustrates another alternative configuration for the embodiment shown in FIG. 37. 35 is a diagram showing the configuration of an embodiment in which the heat dissipation fan module shown in FIGS. 33 and 34 is replaced; FIG. 35 is a diagram showing the configuration of an embodiment in which the heat dissipation fan module shown in FIGS. 33 and 34 is replaced; FIG. FIG. 10 is a perspective view of a heat-dissipating fan module according to a modified example of the present invention. FIG. 34 is a diagram showing the configuration of a replacement embodiment of FIG. 33. FIG. 10 is a cross-sectional view of a heat-dissipating fan module according to a modified example of the present invention. FIG. 46 is a perspective view of the heat dissipation fan module shown in FIG. 45 with the outer wall of the housing removed. FIG. 46 is an exploded view of the heat dissipation fan module shown in FIG. 45. FIG. 10 is a perspective view of a heat-dissipating fan module according to another modified example of the present invention, viewed from another direction. FIG. 10 is a perspective view of a heat-dissipating fan module according to another modified example of the present invention, viewed from another direction. 49. FIG. 50 is a cross-sectional view of the heat-dissipating fan module shown in FIGS. 48 and 49 at another position. FIG. 50 is a cross-sectional view of the heat dissipation fan module shown in FIGS. 48 and 49 at another position. FIG. 50 is an exploded view of a portion of the heat dissipation fan module shown in FIGS. 48 and 49. FIG. 50 is an exploded view of the heat dissipation fan module shown in FIGS. 48 and 49. FIG. 50 is an exploded view of the heat dissipation fan module shown in FIGS. 48 and 49.

Below, several specific embodiments of the present invention will be described with reference to the drawings. Note that the individual embodiments of the present invention and the characteristic configurations of the embodiments may be used in combination with each other, provided there is no contradiction.

With reference to Figures 1 to 54, the present invention provides a cooling module 1, a heat dissipation fan module 200, and a photonic beauty device 100 using the cooling module/heat dissipation fan module 200. The cooling module 1 includes a semiconductor cooling member 10/10'. The semiconductor cooling member 10/10' includes an electric double layer 12 in the middle and a high-temperature surface 11' and a low-temperature surface 13 at both ends. The cooling module 1 further includes a cooling conduction member 15. One end of the cooling conduction member 15 is connected to the low-temperature surface 13 of the semiconductor cooling member for rapid heat transfer, and the other end is connected to the surface to be cooled for rapid cooling conduction. The cooling conduction member 15 is a heat transfer structural member, a heat pipe, a VC vapor chamber, a superheat conduction tube, or a superheat conduction plate. Preferably, the superheat conduction tube is an aluminum superconducting tube, and the superheat conduction plate is an aluminum superconducting plate. In some embodiments, the cooling conduction member 15 is a first cooling conduction member, and the cooling module 1 further includes a second cooling conduction member 15', which is installed between the first cooling conduction member 15 and the surface to be cooled and connected to rapidly conduct cooling, and which is a heat conductive material pipe, a heat conductive material plate, an aluminum superconducting pipe, an aluminum superconducting plate, a heat pipe, or a VC.

A preferred embodiment of the present invention relates to a two-stage cooling module 1 including a primary semiconductor cooling member 10', a secondary semiconductor cooling member 10, and a cooling conduction member 15. The primary semiconductor cooling member 10' and the secondary semiconductor cooling member 10 each include an intermediate electric double layer 12 and a high-temperature surface 11' and a low-temperature surface 13 at either end. The cooling conduction member 15 is a heat-conducting member connected between the primary semiconductor cooling member 10' and the secondary semiconductor cooling member 10 for rapid cooling conduction. Both ends of the cooling conduction member 15 are connected between the high-temperature surface 11' of the primary semiconductor cooling member 10' and the low-temperature surface 13 of the secondary semiconductor cooling member 10 for rapid heat transfer, respectively. The heat-conducting structural member is one or a combination of a heat-conducting member made of a thermally conductive material, a heat pipe, a vapor chamber, a superheat-conducting tube, and a superheat-conducting plate. The cooling module 1 further includes a heat-conducting structure 19 and a heat-dissipating plate 16. The heat conduction structure 19 is one or a combination of a heat conduction member made of a heat conductive material, a heat pipe, a vapor chamber, a superheat conduction tube, and a superheat conduction plate. The heat conduction structure 19 is connected to the heat dissipation plate 16 for rapid heat transfer. The heat conduction structure 19 is connected to the high-temperature surface 11' of the secondary semiconductor cooling member 10 for rapid heat transfer, or the high-temperature end circuit of the secondary semiconductor cooling member 10 is installed in the heat conduction structure 19 and welded or electrically connected to the electric double layer 12 of the secondary semiconductor cooling member 10, so that the heat conduction structure 19 directly serves as the high-temperature surface 11' of the secondary semiconductor cooling member 10. The two-stage cooling module 1 further includes a fan 18 or a heat dissipation fan module 200. The fan 18 or the heat dissipation fan module 200 includes a fan housing 180/210 and an impeller 181/220 within the housing. The heat conducting structure 19 and/or heat dissipating piece 16 may be installed in the fan vent 182/201 or may be part of the fan housing 180/210.

Referring to Figures 33 to 53, in another preferred embodiment of the present invention, the secondary semiconductor cooling member 10 of the two-stage cooling module 1 dissipates heat using a heat dissipation fan module 200. The heat dissipation fan module 200 includes a fan housing 210 and an impeller 220. The interior of the fan housing 210 is a cavity. The impeller 220 is mounted within the cavity. The fan housing 210 is provided with a plurality of ventilation holes 201. The cavity communicates with a gas path external to the fan through the ventilation holes 201. At least a portion of the housing of the fan housing 210 comprises a thermally conductive outer housing 211. The thermally conductive outer housing 211 is formed as a whole or by butt-joining multiple components selected from a thermally conductive member, heat pipe, vapor chamber, superheat conduction tube, and superheat conduction plate made of a thermally conductive material. The high-temperature surface 11' of the secondary semiconductor cooling member 10 is connected to the heat-conducting outer housing 210 so as to conduct heat therethrough, or the high-temperature end circuit of the secondary semiconductor cooling member 10 is installed in the heat-conducting outer housing 211 and welded and electrically connected to the electric double layer of the secondary semiconductor cooling member 10, thereby making the heat-conducting outer housing 211 the high-temperature surface of the secondary semiconductor cooling member 10.

A preferred embodiment of the present invention relates to a photonic beauty device 100, including a body having multiple ventilation openings 101. A cooling module 1, a light source module 2, a power supply module 3, and a control circuit board 4 are installed inside the body. The light source module 2 and the power supply module 3 are electrically connected to the control circuit board 4. The body's multiple ventilation openings 111 serve as air intakes and exhausts, forming ventilation paths (paths indicated by arrows in Figures 4 to 6) with the space within the body, thereby achieving heat dissipation within the body. The front end of the body is a work surface 113 that can come into direct contact with the skin. Light generated by the light source module 2 is transmitted to and emitted from the work surface 113, thereby providing cosmetic treatment to the skin. A two-stage cooling module 1 according to the above embodiment is also installed inside the body. The primary semiconductor cooling piece 10' serves as the work surface 113 itself, or cools the work surface 113. Specifically, when the primary semiconductor cooling piece 10' serves as the work surface 113, the transparent crystal serves as the low temperature surface 13, and the low temperature surface 13 serves as the work surface 113. A light-transmitting window is installed on the high temperature surface 11' and the electric double layer 12 of the primary semiconductor cooling piece 10', so that the primary cooling member 10' is light-transmitting, or the low temperature surface 13, the high temperature surface 11' and the electric double layer 12 of the primary semiconductor cooling piece 10' jointly define a light-transmitting window, so that the photonics generated by the light source module are transmitted through the light-transmitting window to the outside of the work surface 113 and act on the skin outside the work surface. When the primary semiconductor cooling piece 10' cools the work surface 113, the low temperature surface 13 of the primary semiconductor cooling piece 10' contacts the work surface 113 to transfer heat, or the low temperature surface 13 of the primary semiconductor cooling member 10' is connected to the work surface by a heat-transfer structural member to rapidly transfer heat to the work surface. The two-stage cooling module 1 includes a fan 18 or a heat-dissipating fan module 200 and is located in the ventilation passage within the body. The light source module 2 includes a lamp tube 20 and a light-reflecting cup 21. The ventilation passage within the light-reflecting cup 21 communicates with the ventilation passage of the fan 18 or the heat-dissipating fan module 200 and also communicates with the ventilation passage within the body to form a heat-dissipating ventilation passage for the light source module 2, thereby promoting heat dissipation from the light source module by the fan 18 or the heat-dissipating fan module 200. A heat-dissipating plate or heat-conducting member 22 is installed on one side of the light-reflecting cup 21. A fan housing 180/210 of the fan 18/heat-dissipating fan module 200 is formed with a plurality of ventilation holes 182/201. A heat dissipation piece or heat conduction member 22 of the light reflecting cup is attached to one of the ventilation holes, and the ventilation path of the fan 18/heat dissipation fan module 200 is connected to the ventilation path inside the body of the device, forming a first ventilation path 101 for dissipating heat from the light reflecting cup 21. The other ventilation hole of the fan 18/heat dissipation fan module 200 is connected to the ventilation path inside the light reflecting cup 21, and also connects the ventilation path of the fan 18/heat dissipation fan module 200 to the ventilation path inside the body of the device, forming a second ventilation path 102 for dissipating heat from the light reflecting cup 21 and lamp tube 20.

The two-stage cooling module of the present invention solves the problems of uneven heat conduction efficiency, slow heat conduction, and reduced aging of heat conduction when the primary semiconductor cooling member dissipates heat using a heat transfer structural member, slowing the cooling rate and conducting heat to the heat dissipation piece, which can lead to heat variations at the front and rear, left and right, or top and bottom ends of the heat dissipation piece, as well as affecting the heat dissipation effect of the fan.

Below, several specific examples of the cooling module, heat dissipation fan module 200, and photonic beauty device 100 will be described with reference to the drawings. It is possible to obtain many more examples by combining parts of the various specific examples, all of which are within the scope of the present disclosure.

Referring to Figures 1 to 28, the present invention provides a cooling module 1 and a cosmetic device. The cooling module 1 includes a semiconductor cooling element 10 for cooling the cosmetic device. The semiconductor cooling element 10 includes an electric double layer in the middle, and a high-temperature surface 11' and a low-temperature surface 13 at both ends. The cooling module further includes a heat-conducting structure 19 and a heat-dissipating plate 16. The heat-conducting structure 19 includes a VC vapor chamber, an aluminum superconducting plate, or an aluminum superconducting tube. The heat-conducting structure is connected to the heat-dissipating plate 16 and the high-temperature surface 11' of the semiconductor cooling element 10 for rapid heat transfer, thereby rapidly dissipating heat from the high-temperature surface.

The aluminum superconducting plate or tube is sealed at both ends, a working liquid is enclosed inside, and two or more bone-like microgrooves 1911 are formed on the inner wall. A microporous structure 1912 is formed within the material of the aluminum superconducting plate or tube.

As shown in Figures 1 to 19, a cosmetic device 100 according to an embodiment of the present invention includes a body having multiple ventilation openings 111. The multiple ventilation openings 111 may be located at different positions on the housing 110 or at the same position, and may be located in different forms, such as, but not limited to, honeycomb-shaped holes, gaps, or notches formed in the housing 110. The ventilation openings may be one or more, and function to allow cool air or ambient air to flow into the body through the ventilation openings, absorb heat from the inside of the body, and then be discharged outside the body through the ventilation openings. A cooling module 1, a light source module 2, a power supply module 3, and a control circuit board 4 are installed inside the body. The light source module 2 and the power supply module 3 are electrically connected to the control circuit board 4. The multiple ventilation openings 111 on the body function as air intakes and exhausts, forming a ventilation passage (path indicated by arrows in Figures 4 to 6) with the space within the body, thereby achieving heat dissipation within the body. The front end of the body is a work surface 113 that can come into direct contact with the skin. The light generated by the light source module 2 is transmitted to and emitted from the work surface 113, after which the cosmetic treatment is performed on the skin.

8 to 14, the cooling module 1 according to an embodiment of the present invention primarily cools the work surface 113 of a cosmetic device to achieve a cooling effect on the skin. The cooling module 1 includes a semiconductor cooling element 10. The semiconductor cooling element 10 includes an intermediate electric double layer 12, a high-temperature surface 11' at both ends, and a low-temperature surface 13. The intermediate electric double layer 12 has PN galvanic particles arranged and electrically connected according to a high-temperature end circuit installed on the high-temperature surface and a low-temperature end circuit installed on the low-temperature surface, thereby forming an internal circuit of the semiconductor cooling element. The positive and negative poles are electrically connected to the control circuit board 4 to control the operation of the semiconductor cooling element, or the operation of the semiconductor cooling element is controlled by independent circuit control. In a specific embodiment, the cooling element 10 (specifically, the low-temperature surface 13) may be used directly as the work surface 113 or may be used to cool the work surface 113. If the cooling element 10 is used directly as the work surface 113, those skilled in the art may configure the cooling element 10 in an appropriate shape, such as a transparent crystal or a ring, as needed. When the cooling member 10 is used to cool a work surface 113, the cold surface 13 of the cooling member 10 contacts the work surface 113, for example, by being installed around the work surface. Alternatively, the cold surface 13 of the cooling member 10 contacts the work surface 113 via a heat transfer member (or thermal conduction member). The cooling conduction member (first cooling conduction member) 15 is a heat transfer structural member that rapidly transfers heat from the work surface to the semiconductor cooling member, thereby achieving a cooling effect on the work surface. The heat transfer structural member may be a thermally conductive material, for example, a thermally conductive member made of a metal material (e.g., copper pipe or copper plate), but is not limited thereto. The heat transfer structural member may also be another heat transfer module capable of heat conduction, such as a heat pipe, vapor chamber, superheat conduction tube, superheat conduction plate, or other type of heat transfer module, connected between the semiconductor cooling member (cold surface) and the work surface. The cooling conduction member (first cooling conduction member) 15 may be designed to have an appropriate shape based on the principle of rapid heat dissipation, depending on the shape of the semiconductor cooling member 10, particularly the shape of the low-temperature surface 13 and the shape of the working surface 113. The working surface 113 may be made of transparent crystal or other translucent material. The working surface 113 may be annular, with a central annular through-hole allowing light to pass through. In this case, the material is not limited.

A heat pipe or vapor chamber uses the principle of thermal conduction and the rapid heat transfer characteristics of the cooling medium to rapidly transfer heat from a heat-generating object to the outside. Heat is transferred through the evaporation and condensation of a liquid within a completely sealed vacuum tube or vacuum plate, and the cooling effect is achieved through fluid principles such as capillary action, offering a number of advantages, including high thermal conductivity, excellent heat uniformity, heat flux variability, and reversible heat flow direction. Heat exchangers constructed with heat pipes or vapor chambers offer advantages such as high heat transfer efficiency, a compact structure, and low fluid resistance loss.

Referring also to Figures 7 to 11, in a preferred embodiment, the cold surface 13 and working surface 113 of the cooling member 10 are connected to a heat pipe, which is a cooling conduction member 15, to rapidly conduct heat from the working surface 113 or the environment surrounding the working surface to the cooling member 10 (cold surface 13) for heat dissipation, and then rapidly conduct heat to the cooling piece. Depending on the shape of the working surface 113 and the desired cooling effect, one end of the cooling conduction member (heat pipe) 15 that contacts the working surface 113 may be designed in an annular shape so as to be in close contact with the periphery of the working surface and rapidly absorb heat from the working surface 113 or the environment surrounding the working surface 113. Depending on the shape of the cooling member 10 or the cold surface 13, one end of the cooling conduction member (heat pipe) 15 that contacts the cooling member 10 may be designed to extend a predetermined length from the annular bend and be positioned on the cold surface 13 of the cooling member for close contact with the cold surface 13.

Heat generated at the high-temperature surface 11' of the semiconductor cooling element 10 is discharged outside the device through the ventilation passage within the device. Preferably, the semiconductor cooling element 10 enhances its heat dissipation effect through a heat dissipation unit. The heat dissipation unit includes a VC vapor chamber 11 and a heat dissipation piece 16 installed in the VC vapor chamber 11. The high-temperature surface 11' of the semiconductor cooling element is installed on the outer wall of the VC vapor chamber 11, or the VC vapor chamber 11 itself serves as the high-temperature surface of the semiconductor cooling element. The VC vapor chamber 11 is used to dissipate heat from the cooling element 10. The VC vapor chamber 11 is located within the ventilation passage of the device. The cooling element 10 is installed in the VC vapor chamber 11, and the high-temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the VC vapor chamber by bonding, thereby directly conducting heat from the high-temperature surface to the VC vapor chamber 11; alternatively, the high-temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the VC vapor chamber by a thermally conductive member, which rapidly conducts heat from the high-temperature surface 11' to the VC vapor chamber 11; alternatively, the VC vapor chamber 11 is equipped with a high-temperature end circuit of the semiconductor cooling element, which is welded and electrically connected to the PN galvanic particles of the electric double layer 12. In the VC vapor chamber 11, a sealed flat cavity is formed by the bottom plate, frame, and cover plate, and a capillary structure is formed within the cavity to contain a working fluid. As a non-limiting example, one end of the VC vapor chamber 11 is formed with an extension stage used for installing and mounting the semiconductor cooling element 10. Because the area of the VC vapor chamber 11 is larger than that of the electric double layer 12 and the low-temperature surface 13, the high-temperature surface 11' of the semiconductor cooling element has an extended VC vapor chamber 11, increasing the heat dissipation area.

The heat dissipation unit further includes a heat dissipation piece 16 installed on the VC vapor chamber 11 to increase the VC heat dissipation area. Depending on the heat dissipation needs of the product, the heat dissipation piece 16 may be installed on the top, bottom, or both sides of the VC vapor chamber 11. Preferably, the VC vapor chamber 11 is located behind the ventilation opening of the device body, and the heat dissipation piece of the VC vapor chamber 11 faces the ventilation opening 111 of the device body. The heat dissipation piece 16 is one or more sets of thermally conductive fins, and the position, quantity, and arrangement of the heat dissipation piece are determined according to the internal space of the cosmetic device. 10 to 15, the surface of the VC vapor chamber 11 is provided with a set of parallel linear fins arranged in a matrix, or the VC vapor chamber 11 is a fan frame and the fins 16 are a set of curved fins on the inner wall of the spiral fan frame (Fig. 15(a)), with the airflow path aligned with the spiral direction of the fan frame. Alternatively, the fins 16 are a set of fins arranged in a circular matrix. The fins can be arranged in a linear radial direction or rotated at a fixed angle (Fig. 15(b)).

The cooling module 1 according to the present invention further includes a fan 18 located within the ventilation passage of the aircraft body to improve heat dissipation (cooling) efficiency. The fan 18 includes a fan housing 180 and an impeller 181 mounted within the housing's internal cavity. The fan housing 180 is provided with a plurality of openings serving as a plurality of ventilation holes 182 for the fan 18. The fan 18's ventilation holes 182 communicate with the internal cavity of the fan housing 180 to form a ventilation passage for the fan 18 and communicate with the ventilation passage within the aircraft body. The VC vapor chamber 11 may be part of the fan housing 180 or may be attached to the fan housing 180. The VC vapor chamber 11 and heat sink 16 dissipate heat through the ventilation passage of the fan 18. The fan promotes air flow to improve heat dissipation efficiency.

The VC vapor chamber 11 may be installed as part of the housing of the fan 18. The fan 18 housing includes an upper housing, a lower housing 184, and a middle frame 183. The inner wall of the frame 183 may be provided with heat dissipation teeth to increase the heat dissipation area of the VC vapor chamber 11. As shown in Figures 12 to 14, the VC vapor chamber 11 is installed as the upper (or lower) housing of the fan housing, covering the top (or bottom) of the annular frame. The VC vapor chamber 11 may be installed as an annular flat plate. A central through-hole of the annular flat plate forms one ventilation hole for the fan 18. The heat dissipation piece 16 is installed as a set of parallel heat dissipation fins covering the central through-hole, and the ventilation path between the heat dissipation fins communicates with the central through-hole of the VC vapor chamber 11 and the internal cavity of the fan housing.

The heat dissipation fins shown in Figure 15(b) are arranged around the annular edge of the central through-hole of the VC vapor chamber 1, and differ from the structure shown in Figures 12 to 14 in that they are arranged radially or rotated at a certain angle to form a circle.

As shown in Figure 15(a), the VC vapor chamber 11 may be a frame outside the blades, with the heat dissipation piece 16 installed on the inner wall of the frame, and the semiconductor cooling member 10 installed on the outer wall of the frame.

The cooling module of the present invention is also used to dissipate heat from the light source module 2. The light source module 2 includes a lamp tube 20, a light-reflecting cup 21 outside the lamp tube, and electrode pieces 23 on both ends of the lamp tube. Preferably, the lamp tube 20 is an IPL lamp tube, a halogen lamp, or other suitable light source that generates IPL photons. The ventilation passage of the light source module 2 communicates with the ventilation passage of the fan 18 and also communicates with the ventilation passage inside the body to form a heat-dissipation ventilation passage for the light source module 2, thereby promoting heat dissipation from the light source module 2 by the fan 18. A thermally conductive member 22 may be installed on one side of the light-reflecting cup. For example, the thermally conductive member 22 is a pair of thermally conductive pieces (made of a thermally conductive material) with one end connected to the outer wall of the light-reflecting cup and the other end extending to the ventilation holes 182 of the fan 18. A plurality of ventilation holes 182 are formed in the housing of the fan 18, specifically, in the outer frame of the blades. As shown in Figure 13, three ventilation holes 182 are installed in the frame, and the heat conduction member of the light reflecting cup is attached to one of the ventilation holes (first ventilation hole), and the ventilation path of the fan 18 is connected to the ventilation passage inside the body of the machine, forming a first ventilation path 101 (the line indicated by the arrow in Figure 4) for dissipating heat from the heat conduction member 22 of the light reflecting cup and the VC vapor chamber 11. In this case, external air or cold air flows in through the housing ventilation port 111 (including, but not limited to, a set of honeycomb holes and gaps in the housing) facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the VC vapor chamber 11, and flows into the fan 18 through the central through-hole of the VC vapor chamber 11. The airflow circulates in the internal cavity of the fan due to the rotating blades, passes through the heat conduction member 22 of the light reflecting cup and the VC vapor chamber 11, absorbs heat from the light reflecting cup 21 and the VC vapor chamber 11, and is discharged from the fan through another ventilation port 182 (second ventilation port) in the fan frame, and is discharged to the outside of the main body through a ventilation passage inside the body and through a ventilation port (including, but not limited to, a set of honeycomb holes and gaps in the housing) 111 at the end of the body, thereby realizing heat dissipation from the heat conduction member 22 of the light reflecting cup and the VC vapor chamber 11. Another ventilation opening 182 (third ventilation opening) in the fan frame is connected to the air passage inside the lamp tube, and also connects the ventilation passage of the fan 18 to the ventilation passage inside the body of the machine, forming a second ventilation passage 102, which is used to dissipate heat from the light reflecting cup 21 and the lamp tube 20. In this case, external air or cold air flows in through the housing ventilation port 111 facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the VC vapor chamber 11, and flows into the fan 18 through the central through-hole of the VC vapor chamber 11. The airflow circulates through the internal cavity of the fan via the impeller, passes through the light reflecting cup 21 and the VC vapor chamber 11, absorbs heat from the light reflecting cup 21 and the VC vapor chamber 11, and is discharged from the fan through another ventilation port 182 (second ventilation port) in the fan frame, and is discharged to the outside of the main body through a ventilation passage inside the body and through ventilation ports 111 at the end of the body (including, but not limited to, a set of honeycomb holes and gaps in the housing), thereby realizing heat dissipation from the heat conduction member 22 of the light reflecting cup and the VC vapor chamber 11. Another ventilation hole 182 (third ventilation hole) in the fan frame communicates with the air passage inside the lamp tube and connects the ventilation path of the fan 18 to the ventilation passage inside the body, forming a second ventilation passage 102 for dissipating heat from the reflecting cup 21 and lamp tube 20. In this case, external air or cool air flows in through the housing ventilation hole 111 facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the VC vapor chamber 11, and flows into the fan 18 through the central through-hole of the VC vapor chamber 11. A portion of the airflow is exhausted from the fan through another ventilation hole 182 in the fan frame by the impeller and flows into the reflecting cup 21, absorbing heat from the lamp tube 20 and the reflecting cup inside the reflector lamp and discharging it from the lamp tube, passing through the ventilation passage inside the body and discharging it to the outside of the body through the ventilation hole 111 at the end of the body, further promoting heat dissipation from the lamp tube 20 and the reflecting cup 21.

The ventilation openings 111 on the cosmetic device body housing may be installed in different positions or with different hole structures. For example, as shown in Figures 5 and 6, they may be installed on the lower housing and side of the body, respectively, with the side ventilation openings serving as outlets for the first ventilation passage 101 and the second ventilation passage 102, and the ventilation passages within the body corresponding to and communicating with the side ventilation openings 111.

The beauty device 100 of the present invention uses the semiconductor cooling module 1 of each of the above-mentioned embodiments to cool the work surface 113 of the head of the device. The fan of the cooling module 1 also dissipates heat from the light source module 2. The photonic beauty device may be a hair removal device, photonic skin regeneration device, import/export beauty device, or radio frequency beauty device, and any of these may employ the cooling module of the above-mentioned embodiments.

The beauty device 100 shown in Figures 1 to 7 is described using a straight body as an example, and may also be used as an IPL photonic hair removal device. As shown in Figures 1 to 19, the beauty device 100 according to an embodiment of the present invention includes a housing 110 in which multiple ventilation holes 111 are installed. The housing 110 includes an upper housing 112 and a lower housing 118 that engage with each other to form a cavity inside the device. An upper bracket 114 and a lower bracket 115 that fit into the upper housing 112 and the lower housing 118, respectively, are also installed inside the device. A base bracket 24 is installed inside the front end of the device to mount the cooling module 1, light source module 2, power supply module 3, and control circuit board 4.

The multiple ventilation openings 111 may be installed at different positions on the housing 110 or at the same position, with different hole structures. The illustrated ventilation openings 110 are installed on the lower housing 118, side, or end of the housing. A ventilation passage is formed in the empty space inside the device. Cool air or ambient air flows into the device through the ventilation openings, absorbs heat from inside the device, and is then exhausted to the outside of the device through ventilation openings 111 at the same or different positions. The multiple ventilation openings 111 on the device function as air intake and exhaust, forming a ventilation passage (path indicated by arrows in Figures 4 to 6) with the space inside the device, thereby achieving heat dissipation inside the device. The front end of the device is a work surface 113 that can come into direct contact with the skin. Light generated by the light source module 2 is transmitted to the work surface 113 and emitted, after which it performs cosmetic treatment on the skin.

The light source module 2 is attached to the front end of the aircraft by a base bracket 24. An output light path and output light window are formed within the base bracket 24 for propagating light generated by the light source module. The work surface 113 is attached to the output light window, and the lamp tube 20 is attached to the rear of the base bracket by a light reflecting cup 21, positioned behind the output light path. A filter 25 is installed in the direction of light emitted from the light source module. The heat conducting member 22 of the light reflecting cup extends rearward to the fan ventilation port. If necessary, the base bracket 24 may be provided with a ventilation channel that communicates with the ventilation channel inside the light reflecting cup to facilitate air-cooling and heat dissipation.

The interior of the front end where the upper bracket 114 and lower bracket 115 inside the body engage is formed as a fan accommodating chamber, to which the cooling module 1 is attached. A window is formed at the front end of the lower bracket 115, facing and communicating with the ventilation port 111 formed in the lower bracket 118. The heat dissipation piece 16 of the VC vapor chamber 11 is located in the window and faces the ventilation port 111 of the lower housing 118. A semiconductor cooling element 10 is installed on a stage extending from the front end of the VC vapor chamber 11. The heat transfer element (heat pipe) 15, which serves as a cooling conduction element, is supported by a base bracket, with its front end (annular) connected to the work surface 113 in rapid heat transfer contact, and its rear end (the end of the parallel straight tube) covering the low-temperature surface of the semiconductor cooling element in close contact for rapid heat transfer. The fan is mounted in the fan housing, with the ventilation opening 182 at the front end of the frame corresponding to the heat conduction member 22 of the light reflecting cup, and the ventilation opening at the rear end communicating with the ventilation passage formed after the upper and lower brackets are engaged. For the fan ventilation passage, refer to the air intake and air exhaust symbols shown in Figure 8.

A power module housing chamber is formed inside the rear section of the device where the upper bracket 114 and lower bracket 115 engage. Typically, the power module 3 may be a battery, such as a rechargeable battery or a capacitor cell. The power module further includes a charging stand 31 for connecting to an external power source to charge the battery or to directly power the beauty device. The charging stand 31 is electrically connected to the control circuit board 4, attached to the housing, and connectable to a cable.

On one side of the power module housing, a ventilation passage 101/102 is further defined within the space where the upper bracket 114 and lower bracket 115 are engaged. The ventilation passage 101/102 communicates with the ventilation passage of the fan, communicates with the ventilation passage of the light reflecting cup, and communicates with the ventilation openings (air intake and air exhaust) of the housing, forming a ventilation passage within the aircraft.

The control circuit board 4 is attached to the cavity formed by the engagement of the upper bracket 114 and upper housing 112, and is protected by the upper bracket 114 and upper housing 112. The housing also houses a switch push key 117 electrically connected to the control circuit board 4, and a corresponding switch wiring board 116 attached to the interior, for use in on/off control, etc.

Referring to the embodiments shown in Figures 16 to 19, the cooling module 1 of the above-described embodiment is applied to an L-shaped beauty device, whose function and structure are the same or similar to those of the straight-shaped device shown in Figures 1 to 7. The size, shape, and positional fit of the housing, bracket, power module 3, light source module 2, cooling module 1, and control circuit board 4 are appropriately installed to match only the overall shape of the device. The L-shaped beauty device includes a handle 120 and a base 130. The base 130 is rotatably connected to the top of the handle 120 by a knob 150, a knob holder 140, and a knob retainer plate 151 at the top of the handle. The rotary connection structure between the base 130 and the handle and the handle structure may be conventional. The rear of the handle is a DC line 31', inside which a handle bracket 160 is installed and to which the power module 3 is attached. A cavity on one side of the top of the handle bracket 160 communicates with the interior of the base 130, and the base housing is rotatably attached. The base housing includes a front housing 131 and a front housing cover 132. The front housing cover 132 is fitted with a knob 150, a knob holder 140, and a rotary presser plate 151, thereby rotatably connecting the base 130. A bracket 133 within the base is attached to the front housing cover 132 and fitted into the front housing 131, with the cooling module 1 mounted on one side and the control circuit board 4 mounted on the other side. The front end of the base 130 is a working surface 113, which may be a transparent crystal, an annular working surface, an annular semiconductor cooling element, or a semiconductor cooling element with a transparent crystal cold surface, all of which are conventional structures. A base bracket 24 is installed at the front end inside the base 130, and similar to the structure of the embodiment shown in Figures 1 to 7, the light source module 2 is attached to it. One side of the thermal conduction member 22 of the light reflecting cup of the light source module 2 is installed with a heat pipe and heat dissipation piece unit 26 that protrudes into the ventilation hole 182 of the fan 18, and the front housing 131 is installed with a ventilation hole opposite the heat dissipation piece unit 26. In this embodiment, the cooling module 1 cools the work surface 113 and also dissipates heat from the light source module 2.

In this invention, a semiconductor cooling element 10 is installed in the VC vapor chamber 11, and a heat transfer element (heat pipe) 15, which is a cooling conduction element, connects the cooling element's low-temperature surface 13 to the cosmetic device's work surface 113 for rapid cooling conduction, providing a cooling or cooling effect to the work surface. The VC vapor chamber 11 is equipped with a heat dissipation plate 16 to increase the heat dissipation area. Furthermore, the VC vapor chamber 11 is used in the upper housing, lower housing, or frame of the fan to match the fan, utilizing the transformation effect of evaporation and condensation in the VC vapor chamber, significantly improving the heat dissipation efficiency and speed during fan rotation. Increasing the heat dissipation plate on the upper surface of the VC increases the VC's heat dissipation area, effectively increasing the contact area between the air and the heat dissipation plate during air supply. Increasing the number of heat dissipation plates made of thermally conductive material on the lower surface of the VC fan's upper housing (inner wall of the frame) significantly increases the contact area between the air and the heat dissipation fins, further improving the heat dissipation effect. Depending on the heat dissipation needs of the product, heat dissipation pieces may be installed on the top, bottom, or both sides of the VC vapor chamber.

Referring to Figures 20 to 23, a second embodiment of the cooling module 1 according to the present invention is primarily used to cool the work surface 113 (see the above-mentioned embodiment) of a cosmetic device, thereby achieving a cooling effect on the skin. The cooling module 1 includes a semiconductor cooling member 10. The semiconductor cooling member 10 (see the above-mentioned embodiment) includes an intermediate electric double layer 12, a high-temperature surface 11' at both ends, and a low-temperature surface 13. In a specific embodiment, the cooling member 10 (specifically, the low-temperature surface 13) may be used directly as the work surface 113, or may be used to cool the work surface 113. When the cooling member 10 is used directly as the work surface 113, those skilled in the art may configure the cooling member 10 in an appropriate shape, such as a transparent crystal or a ring, as needed. When the cooling member 10 is used to cool the work surface 113, the low-temperature surface 13 of the cooling member 10 contacts the work surface 113, for example, is configured around the periphery of the work surface. Alternatively, the cold surface 13 of the cooling element 10 contacts the work surface 113 via a heat transfer element (or thermal conduction element). The cooling conduction element 15 is a heat transfer structural element that rapidly transfers heat from the work surface to the semiconductor cooling element, thereby achieving a cooling effect on the work surface. The heat transfer structural element may be a thermal conduction element made of a thermally conductive material, such as, but not limited to, a metal material (e.g., copper/aluminum tube or copper/aluminum plate) or another thermally conductive material (e.g., silicone grease, silicon wafer, elastomer, or soft thermally conductive material), or it may be a heat pipe, a vapor chamber (VC), a superconducting tube, a superconducting plate, or another heat transfer module. A heat pipe or vapor chamber utilizes the principle of heat conduction and the rapid heat transfer characteristics of the cooling medium to rapidly transfer heat from a heat-generating object to an outside heat source. The superheat conduction tube or plate is preferably an aluminum superheat conduction tube/plate. (Aluminum) superheat conduction tubes or plates, also known as ALVC superconducting tubes or plates, rapidly conduct heat through evaporative cooling and gas-liquid phase changes. Referring also to FIG. 23 , unlike conventional heat pipes and VC vapor chambers, aluminum superheat conduction tubes/plates are fabricated by an aluminum processing and forming process, forming microgrooves, microtoothed or micropores on the surface of the superheat conduction tube or plate as a capillary structure inside the superconducting tube or plate. The interior of the aluminum superconducting tube or plate may contain aluminum powder or aluminum silicon powder instead of copper powder, and an aluminum mesh may be added to seal the coolant after adding it. The cooling conduction member 15 is connected between the semiconductor cooling element (cold surface) and the working surface, and may be designed to have an appropriate shape based on the principle of rapid heat dissipation depending on the shape of the semiconductor cooling element 10, particularly the shapes of the cold surface 13 and the working surface 113. In this embodiment, the cooling conduction member 15 is a copper tube, an ALVC aluminum superconducting tube (plate), a heat pipe, or VC.

Depending on the shape of the working surface 113 and the desired cooling effect, the end of the cooling conduction member 15 that contacts the working surface 113 may be formed in a ring shape so that it directly and closely contacts the periphery of the working surface to rapidly absorb heat from the working surface 113 or the surrounding environment. Alternatively, a cooling conduction member (second cooling conduction member) 15' for contact heat transfer may be further installed on the working surface 113 and the cooling conduction member 15. The cooling conduction member 15' may be a copper pipe, an ALVC superconducting pipe (plate), a heat pipe, or VC, and may be designed in a ring shape by being attached to the periphery of the working surface 113 and the ring end of the cooling conduction member 15 to rapidly transfer heat. Depending on the shape of the cooling member 10 or cold surface 13, the end of the cooling conduction member 15 that contacts the cooling member 10 may be designed to extend a predetermined length from the ring bend and be positioned on the cold surface 13 of the cooling piece to be in close contact with the cold surface 13.

Heat generated on the high-temperature surface 11' of the semiconductor cooling member 10 is discharged to the outside of the device through the ventilation passage within the device. Specifically, the semiconductor cooling member 10 enhances its heat dissipation effect through a heat dissipation unit. The heat dissipation unit includes a heat conduction structure 19 and a heat dissipation plate 16. It is located within the ventilation passage of the cosmetic device body and is used to rapidly dissipate heat from the high-temperature surface 11' of the semiconductor cooling member 10. The heat conduction structure 19 includes a heat conduction plate 190 and multiple aluminum VC/ALVC superconducting tubes 191, each of which is a single tube. The high-temperature surface 11' of the semiconductor cooling member is installed on the outer wall of the heat conduction plate 190, or the heat conduction plate 190 itself serves as the high-temperature surface 11' of the semiconductor cooling member 10. The semiconductor cooling member 10 is installed on one side of the outer wall of the heat conduction plate 190, and multiple opening grooves 192 are installed on the other side. The multiple open grooves 192 engage with multiple aluminum VC/ALVC superconducting tubes 191. The aluminum VC/ALVC superconducting tubes 191 are housed within the open grooves 192. The open grooves 192 of the heat conduction plate are connected to the aluminum VC/ALVC superconducting tubes 191 by, for example, crimping or welding, thereby increasing the contact area between the two and achieving rapid heat transfer.

Referring also to Figure 23, aluminum VC/ALVC superconducting tube 191 is formed by processing aluminum material to form microgrooves, microdentations, or micropores on the inner wall surface of the aluminum VC/ALVC superconducting tube, thereby forming capillary action inside the aluminum VC/ALVC superconducting tube. As shown in Figure 23(b), when aluminum material is extruded to form an aluminum VC/ALVC superconducting tube, a single passage 1910 is formed within the tube, and two or more bone-like microgrooves 1911 are formed on the inner wall of the tube. A large number of micropore structures 1912 may also be formed inside the tube wall of the aluminum VC/ALVC superconducting tube. Once the aluminum material is formed into a tubular shape, aluminum powder, aluminum silicon powder, etc. may be added by injecting or extracting liquid into or from the tube. An aluminum mesh may be added, and the sealed end may be sintered after evacuation to obtain an aluminum VC/ALVC superconducting tube with super thermal conductivity. Preferably, each aluminum VC/ALVC superconducting tube is a single passage 1910, which has the advantage of being able to be bent in a plane or in a special 3D shape, allowing for shape changes according to changes in the product's spatial shape, and multiple aluminum VC/ALVC superconducting tubes can be combined in a staggered pattern to eliminate the influence of gravity. In the example shown in Figure 23(a), the aluminum VC/ALVC superconducting tube 191 is bent into an L-shape, and the corresponding opening groove 192 of the heat conduction plate 190 is also formed in an L-shape. The aluminum VC/ALVC superconducting tube 191 is fitted into the opening groove 192 to form an L-shaped heat conduction structure 19. One end of the L-shape is placed on the high-temperature surface 11' of the semiconductor cooling element 10 for close contact and rapid heat transfer, and the other end of the L-shape is attached to the heat sink 16. Heat generated on the high-temperature surface 11' of the semiconductor cooling member 10 is rapidly conducted to the heat dissipation piece 16 by the heat conduction structure 19 and dissipated.

The cooling element 10 is installed on one side of the thermal conduction plate 190, and the high-temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the thermal conduction plate 190, thereby directly conducting heat from the high-temperature surface to the thermal conduction plate 190. Alternatively, the high-temperature surface 11' of the semiconductor cooling element 10 is attached to the outer wall of the thermal conduction plate 190 via a thermal conduction member, which rapidly conducts heat from the high-temperature surface 11' to the thermal conduction plate 190. Alternatively, the high-temperature end circuit of the semiconductor cooling element is installed on the thermal conduction plate 190 and welded and electrically connected to the PN galvanic particles of the electric double layer 12. The thermal conduction plate 190 is a thermal conduction element made of a thermally conductive material, such as, but not limited to, a metal material (e.g., copper/aluminum) or other thermally conductive material (e.g., but not limited to, silicone grease, silicon wafer, elastomer, or soft thermally conductive material). Preferably, the thermal conduction plate 190 is made of a thermally conductive material, such as a copper/aluminum plate.

The heat dissipation piece 16 is attached to the heat conduction plate 190 to increase the heat dissipation area. Preferably, the heat dissipation piece 16 is located behind the ventilation opening of the cosmetic device body, facing the ventilation opening 111 of the body (see Figures 16, 27, and 28). The heat dissipation piece 16 is made of one or more sets of heat-transfer fins, and the position, quantity, and arrangement of the heat dissipation piece are determined according to the internal space of the cosmetic device. The one or more sets of heat dissipation pieces are integrally formed or fixed by welding, crimping, or other fastening mechanisms to form the integral heat dissipation piece 16, or one or more sets of heat-conducting fins are attached to the heat conduction plate to form the integral heat dissipation piece 16. A groove 161 is formed on the top surface of the heat dissipation piece 16, and one end of the heat conduction structure 19 is inserted into the groove 161. The contact area between the two is increased by crimping/welding, achieving rapid heat transfer.

In other embodiments, the thermally conductive structure 19 may be placed directly on the heat dissipation plate 16 or may be connected to one side of the thermally conductive plate of the heat dissipation plate 16 (see Figure 28).

Referring to Figures 24 to 26, the third embodiment of the cooling module 1 is primarily used to cool the working surface 113 (as in the above-described embodiment) of a cosmetic device, achieving a cooling effect on the skin. The cooling module 1 includes a semiconductor cooling member 10, a first cooling conductive member 15, a second cooling conductive member 15', a heat dissipation plate 16, and a thermal conduction structure 19. The structures of the first cooling conductive member 15, the second cooling conductive member 15', and the heat dissipation plate 16 are the same as or similar to those of the second embodiment of the cooling module 1 described above, and the above embodiment is quoted here without modification. The thermal conduction structure 19 includes a thermal conduction plate 190 and multiple aluminum VC/ALVC superconducting tubes 191, each of which is preferably a single tube with a single passage within the tube. The high-temperature surface 11' of the semiconductor cooling member 10 is installed on the outer wall of the thermal conduction plate 190, or the thermal conduction plate 190 serves as the high-temperature surface 11' of the semiconductor cooling member 10. The semiconductor cooling member 10 is installed on one side of the outer wall of the heat conduction plate 190, and a plurality of opening grooves 192 are installed on the other side. The plurality of opening grooves 192 are engaged with a plurality of aluminum VC/ALVC superconducting tubes 191. The aluminum VC/ALVC superconducting tubes 191 are received in the opening grooves 192. The opening grooves 192 of the heat conduction plate are connected to the aluminum VC/ALVC superconducting tubes 191 by, for example, crimping or welding, thereby increasing the contact area between them and achieving rapid heat transfer. In this embodiment, the heat conduction plate 190 includes a circular (not limited to circular) area and a stage extending from one side, and the semiconductor cooling member 10 is installed on the stage. A plurality of opening grooves 190 are installed through the circular area, extending from the center to the periphery, and are uniformly spaced at equal intervals across the circular area. One aluminum VC/ALVC superconducting tube 191 is installed in each opening groove 190. The open grooves 190 and aluminum VC/ALVC superconducting tubes 191 may be arranged at a certain curvature or radian. As a non-limiting example, multiple aluminum VC/ALVC superconducting tubes 191 may be mounted and then arranged radially along a radius or approximately along a radial direction to eliminate the effects of gravity. In another embodiment, multiple aluminum VC/ALVC superconducting tubes 191 may be arranged in a staggered pattern to eliminate the effects of gravity. The open grooves 190 of the heat transfer plate are connected to the aluminum VC/ALVC superconducting tubes 191 by crimping/welding to increase the contact area between them and accelerate heat transfer.

As in the above-mentioned embodiment, the aluminum VC/ALVC superconducting tube 191 uses a single passage, and fine grooves, fine teeth, or fine holes are formed on the inner wall surface of the aluminum VC/ALVC superconducting tube through an aluminum material processing and forming process, and a coolant is sealed inside, and aluminum powder or aluminum silicon powder, etc. may also be added, and an aluminum mesh may also be added.

The cooling element 10 is mounted on one side of the heat conduction plate 190, and the high-temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the heat conduction plate 190, thereby directly transferring heat from the high-temperature surface to the heat conduction plate 190. Alternatively, the high-temperature surface 11' of the semiconductor cooling element is attached to the outer wall of the heat conduction plate 190 via a heat conduction member, which rapidly transfers heat from the high-temperature surface 11' to the heat conduction plate 190. Alternatively, the high-temperature end circuit of the semiconductor cooling element is mounted on the heat conduction plate 190, and is welded and electrically connected to the PN galvanic particles of the electric double layer 12. The heat conduction plate 190 is preferably made of a heat-conducting material, such as a copper/aluminum plate.

The heat dissipation piece 16 is mounted on the heat conduction plate 190 to increase the heat dissipation area. As a non-limiting example, the circular area of the heat conduction structure 19 can be directly mounted on the top of the heat dissipation piece 16 or fixed to the top of the heat dissipation piece 16 by welding or crimping to rapidly transfer heat. The heat dissipation piece 16 protrudes from a stage on one side of the heat conduction plate 190, and the semiconductor cooling element 10 is mounted on the stage.

Referring to Figure 27, the cooling module 1 of the third embodiment described above is applied to a cosmetic device, for example, the cosmetic device shaped as shown in Figures 16 to 19. Other structural components of the cosmetic device are the same as or similar to those of the embodiments shown in Figures 16 to 19, and are hereby quoted. The heat conduction structure 19 is installed in the ventilation opening at the top of the fan 18. Specifically, the circular area of the heat conduction plate 190 is installed to cover the opening at the top of the fan. An aluminum VC/ALVC superconducting tube 191 is attached to the heat conduction plate, facing the fan. The heat dissipation plate 16 is located in the ventilation opening 111, the exterior of which faces the side of the front housing 131. The heat conduction structure 19, fan 18, and heat dissipation plate 16 are all located within the ventilation passages within the device, and the ventilation passages are connected to each other. Cool air is drawn in through the ventilation opening 111 of the device, absorbs heat within the ventilation passage, and then discharges to the outside of the device through another ventilation opening 111.

A semiconductor cooling element 10 is installed on one side of the thermal conduction plate 190, and a cooling conduction element (copper/ALVC/heat pipe/VC) 15 (and a second cooling conduction element 15') connects the low-temperature surface of the cooling element 10 to the working surface 113 of the cosmetic device, rapidly conducting cooling and achieving a cooling or cooling effect on the working surface.

The cosmetic device shown in Figure 27 operates on the same principle as the above-mentioned embodiment, so details will be omitted here.

The cosmetic device of the embodiment shown in Figure 28 uses the cooling module 1 of the third embodiment described above to cool the work surface 113 of the cosmetic device, and other structural components of the cosmetic device are the same as or similar to those of the embodiments shown in Figures 16 to 19, and are quoted here without modification. The heat conduction structure 19 is L-shaped, with one end attached to the heat dissipation plate 16 covering the ventilation hole at the top of the fan 18. An aluminum VC/ALVC superconducting tube 191 is attached to the heat conduction plate 190, facing inward toward the fan, and the semiconductor cooling element 10 is installed at the other end of the heat conduction plate 190, located outside the ventilation hole at the top of the fan 18. The heat dissipation piece 16 is located in a ventilation port 111 whose exterior faces the side of the front housing 131. The heat conduction structure 19, fan 18, and heat dissipation piece 16 are all located within the ventilation passages inside the machine body, and the ventilation passages are connected to each other, so that cool air is drawn in through the ventilation port 111 in the machine body, absorbs heat in the ventilation passage inside the machine body, and then discharged to the outside of the main body through another ventilation port 111.

A semiconductor cooling element 10 is installed on one side of the heat conduction plate 190. A cooling conduction element (copper/ALVC/heat pipe/VC) 15 (and cooling conduction element 15') connects the low-temperature side of the cooling element 10 to the work surface 113 of the cosmetic device for rapid cooling conduction, achieving a cooling or cooling effect on the work surface. In this embodiment, the heat pipe and heat dissipation element unit 26 installed on one side of the heat conduction element 22 of the light-reflecting cup of the light source module 2 may be omitted. A groove 161 (Figure 22) opened in the heat dissipation element 16 is attached to one end of the heat conduction plate 190 and forms a ventilation passage, connecting the air passage between adjacent fins of the heat dissipation element 16 and the fan's air passage, and connecting the light-reflecting cup of the light source module 2 and its internal ventilation passage. The heat conduction element 22 of the light-reflecting cup of the light source module 2 is located in the ventilation opening of the fan 18 or in the ventilation passage within the device body, achieving air-cooled heat dissipation to the light-reflecting cup 21 and the lamp tube 20. In this embodiment, the cooling module 1 cools the work surface 113 and dissipates heat from the light source module 2.

In the heat conduction structure 19 of the above embodiment of the present invention, by aligning multiple aluminum superconducting plates or single tubes of aluminum superconducting pipes 191 with the heat conduction plate (copper plate) 190, the problem of the gravity direction of the product can be effectively solved. The pipes can be installed in two or more different directions/angles in the XY plane or in three dimensions (XYZ). As is known, heat and steam flow from bottom to top. Therefore, when the beauty device is used from bottom to top, the gravity effect of the heat conduction structure is relatively obvious. Due to the anti-gravity effect, the heat conduction effect in this state is reduced, and the desired heat dissipation effect cannot be achieved. In the present invention, the heat dissipation problem can be better solved by designing the pipes in a horizontal/vertical relative installation, a crossing shape at a certain angle, a circular shape (Figures 24-26), a staggered shape, or a circulating shape. The heat conduction structure 19 significantly improves the heat dissipation effect.

Referring to Figures 29 and 30, a fourth embodiment of the cooling module 1 of the present invention uses a two-stage cooling configuration, primarily for cooling the working surface of the photonic beauty device and dissipating heat internally, to enhance cooling efficiency. In a specific embodiment, a primary cooling element is installed on the working surface, which is the end that contacts the skin, to cool the skin. Heat from the primary cooling element 10' is absorbed by the evaporation end of the cooling conduction element (heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate) 15 and flows into the internal passage of the heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate to be transferred to the condensation end. A secondary cooling element 10 is installed at the condensation end to perform active cooling at the condensation end. In this case, the temperature of the condensation end is determined by the power of the secondary cooling element 10. Because the temperature of the condensing end is much lower than the ambient air temperature, the condensation rate and aging time at the condensing end are significantly improved, accelerating the internal phase transformation and circulation of the cooling conduction member (heat pipe/VC/(aluminum) superheat conduction tube or (aluminum) superheat conduction plate) 15, thereby achieving beneficial effects of improving cooling to the front end. The heat dissipation surface (high-temperature surface) 13 of the secondary cooling member 10 is close to the fan's air inlet or outlet. For heat dissipation by the secondary cooling member 10, a copper/aluminum heat conduction plate can be used to directly absorb heat via the fan, or a heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate can be used to conduct heat from the secondary cooling member's heat dissipation surface 13 to the fan housing, and the heat can be absorbed by the fan's air blowing or suction via a heat dissipation plate 16 installed on the fan housing wall. Compared to the cooling module 1 shown in Figures 8 to 15, the installation of a secondary cooling element in this embodiment (Figures 29 and 30) corresponds to the cooling element 10 of the cooling module 1 shown in Figures 8 to 15 being used as a secondary cooling element to cool the primary cooling element 10' connected to the low-temperature end. Two-stage cooling primarily cools the working surface 113 of the cosmetic device to achieve a cooling effect on the skin. The primary cooling element 10' is connected to the working surface 113 or serves as the working surface 113 itself. The secondary cooling element 10 is connected to a heat-dissipating fan module or directly installed in the fan housing. The primary and secondary cooling elements are preferably semiconductor cooling elements. The semiconductor cooling element 10/10' includes an intermediate electric double layer 12 and high-temperature and low-temperature surfaces 11' and 13 at both ends. The intermediate electric double layer 12 is electrically connected with PN galvanic particles arranged according to the high-temperature end circuit installed on the high-temperature surface and the low-temperature end circuit installed on the low-temperature surface, forming an internal circuit of the semiconductor cooling element, and the positive and negative poles are electrically connected to the control circuit board 4 to control the operation of the semiconductor cooling element, or the operation of the semiconductor cooling element is controlled by independent circuit control.

In a specific embodiment, the primary cooling member 10' (specifically, the low-temperature surface 13) may be used directly as the work surface 113 or may be used to cool the work surface 113. When the primary cooling member 10' is used directly as the work surface 113, those skilled in the art can determine the appropriate shape of the primary cooling member 10' as needed. For example, the entire transparent crystal may serve as the low-temperature surface 13, or the low-temperature surface 13 may serve as the work surface 113 itself. Light-transmitting windows may be installed in the high-temperature surface 11' and the electric double layer 12, making the primary cooling member 10' optically transparent. For example, the low-temperature surface 13, the high-temperature surface 11', and the electric double layer 12 may be arranged in a ring shape or jointly define the light-transmitting window. In this case, the material is not limited. When the primary cooling member 10' is connected to the work surface 113 to perform cooling, the low-temperature surface 13 is in contact with the work surface 113, for example, installed around the periphery of the work surface. Alternatively, the low temperature surface 13 of the primary cooling member 10' is in contact with the work surface 113 via a heat transfer member (or heat conduction member).

The cooling conduction member (first cooling conduction member) 15 is connected between the primary semiconductor cooling member 10' (specifically, its high-temperature surface 11') and the secondary semiconductor cooling member 10 (specifically, its low-temperature surface 13) for rapid cooling conduction, rapidly transferring heat from the primary semiconductor cooling member 10' to the secondary semiconductor cooling member 10 to achieve a cooling effect on the working surface. The cooling conduction member 15 is a heat transfer structural member. The heat transfer structural member may be, but is not limited to, a thermally conductive member made of a thermally conductive material, such as a metal material (e.g., copper pipe, copper plate, other heat transfer structure, etc.). Preferably, the heat transfer structural member is a heat pipe, vapor chamber, (aluminum) superheat conduction tube, or (aluminum) superheat conduction plate. The cooling conduction member 15 may be designed to have an appropriate shape based on the principle of rapid heat dissipation, depending on the shapes of the primary semiconductor cooling member 10' and the secondary semiconductor cooling member 10. If the primary semiconductor cooling member 10' is used as the work surface 113, it may be optically transparent or may have a light-transmitting window installed. One end of the cooling conduction member (heat pipe) 15 that contacts the work surface 113 is designed to be annular so as to be in close contact with the periphery of the high-temperature surface 11' of the primary semiconductor cooling member 10' and rapidly absorb heat from the primary semiconductor cooling member 10' or the environment surrounding the primary semiconductor cooling member 10'. One end of the cooling conduction member (heat pipe) 15 that contacts the secondary cooling member 10 may be designed to extend a predetermined length from the annular bend and be positioned on the low-temperature surface 13 of the secondary cooling member 10 and in close contact with the low-temperature surface 13.

The secondary semiconductor cooling member 10 enhances its heat dissipation effect with a heat dissipation unit. The heat dissipation unit includes a heat-conducting outer housing 11, which is formed as a single unit or by butt-joining multiple heat pipes, (aluminum) superheat-conducting tubes, (aluminum) superheat-conducting plates, or vapor chambers, and a heat dissipation piece 16 attached to the heat-conducting outer housing 11. The high-temperature surface 11' of the secondary semiconductor cooling member is attached to the outer wall of the heat-conducting outer housing 11, or the heat-conducting outer housing 11 itself serves as the high-temperature surface of the semiconductor cooling member. The heat-conducting outer housing 11 is used to dissipate heat from the secondary cooling member 10. When applied to a beauty device, the heat-conducting outer housing 11 is positioned within the ventilation passage of the device, the secondary cooling member 10 is installed on the heat-conducting outer housing 11, and the high-temperature surface 11' of the secondary semiconductor cooling member is attached by bonding to the outer wall of the heat-conducting outer housing 11, thereby conducting the heat of the high-temperature surface directly to the heat-conducting outer housing 11; alternatively, the high-temperature surface 11' of the secondary semiconductor cooling member 10 is attached to the outer wall of the heat-conducting outer housing 11 via a heat-conducting member (heat pipe/vapor chamber/(aluminum) superheat-conducting tube/(aluminum) superheat-conducting plate), and the heat of the high-temperature surface 11' is conducted to the heat-conducting outer housing 11 (heat pipe/vapor chamber/(aluminum) superheat-conducting tube/(aluminum) superheat-conducting plate) via the heat-conducting member; alternatively, the high-temperature end circuit of the semiconductor cooling member is installed in the heat-conducting outer housing 11 (heat pipe/vapor chamber/(aluminum) superheat-conducting tube/(aluminum) superheat-conducting plate) and is welded and electrically connected to the PN galvanic particles of the electric double layer 12. Preferably, the thermally conductive outer housing 11 is formed by a single vapor chamber/(aluminum) superheat conductive plate as a whole, or by butt-joining multiple vapor chambers/(aluminum) superheat conductive plates. The thermally conductive outer housing 11 is a sealed, flat cavity formed by a base plate, a frame, and a cover plate, and a capillary structure is installed within the cavity to accommodate a working fluid. As a non-limiting example, one end of the thermally conductive outer housing 11 is formed with an extension stage used for installing or mounting the secondary semiconductor cooling element 10. The thermally conductive outer housing 11 has a larger area than the electric double layer 12 and the low-temperature surface 13, thereby increasing the heat dissipation area of the high-temperature surface 11' of the secondary semiconductor cooling element 10.

The heat-conducting outer housing 11 is fitted with a heat-dissipating piece 16 to increase the heat dissipation area. Depending on the heat dissipation needs of the product, the heat-dissipating piece 16 may be fitted to the top, bottom, or both surfaces of the heat-conducting outer housing 11. Preferably, the heat-conducting outer housing 11 is located behind the ventilation openings on the body of the cosmetic device. The heat-dissipating piece of the heat-conducting outer housing 11 faces the ventilation openings 111 on the body. The heat-dissipating piece 16 is one or more sets of heat-conducting fins.

The heat dissipation unit of the secondary cooling member 10 further includes a fan 18 positioned within the ventilation passage of the cosmetic device body to enhance heat dissipation (cooling) efficiency. The arrangement of the heat dissipation fan 180, secondary cooling member 10, (heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate) heat conductive outer housing 11, and heat dissipation piece 16 in this embodiment is directly quoted in this embodiment with reference to the embodiment shown in Figures 10 to 15 and the above description, and detailed description will be omitted. The fan 18 includes a fan housing 180 and an impeller 181 mounted within the housing's internal cavity. The fan housing 180 has multiple openings as multiple ventilation holes 182 for the fan 18. The multiple ventilation holes 182 for the fan 18 are connected to the internal cavity of the fan housing 180 to form a ventilation path for the fan 18 and communicate with the ventilation passage within the device body for air intake and exhaust. The heat-conducting outer housing 11 (heat pipe/vapor chamber/(aluminum) superheat-conducting tube/(aluminum) superheat-conducting plate) may be part of the fan housing 180 or may be attached to the fan housing 180.

The two-stage cooling module 1 of this embodiment is applied to cooling and heat dissipation of the photonic beauty device 100. Referring to Figures 31 and 32, the heat dissipation unit of the two-stage cooling module 1 is also used to dissipate heat from the light source module 2. The light source module 2 includes a lamp tube 20 and a light-reflecting cup 21 outside the lamp tube. The lamp tube 20 is an IPL lamp tube, halogen lamp, or other suitable light source that generates IPL photons. The ventilation passage of the light source module 2 communicates with the ventilation passage of the fan 18 and also communicates with the ventilation passage inside the device body, forming a heat-dissipating ventilation passage for the light source module 2 and promoting heat dissipation from the light source module 2 by the fan 18. A thermally conductive member 22 may be installed on one side of the light-reflecting cup. For example, the thermally conductive member 22 may be, but is not limited to, a pair of thermally conductive pieces (made of a thermally conductive material). One end of the thermally conductive member is connected to the outer wall of the light-reflecting cup, and the other end extends to the ventilation opening 182 of the fan 18. The housing of the fan 18, specifically the frame outside the blades, is formed with a plurality of ventilation holes 182. As shown in Fig. 13, the frame is provided with three ventilation holes 182, one of which (first ventilation hole) is fitted with the heat conducting member of the light reflecting cup, and the ventilation path of the fan 18 is connected to the ventilation passage inside the machine body, forming a first ventilation path 101 (see arrows in Fig. 4) for dissipating heat from the heat conducting member 22 of the light reflecting cup and the heat conducting outer housing 11 (heat pipe/vapor chamber/(aluminum) superheat conducting tube/(aluminum) superheat conducting plate). In this case, external air or cool air flows in through the housing ventilation openings 111 (including, but not limited to, a set of honeycomb holes and gaps in the housing) facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the (heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate) heat conduction outer housing 11, and flows into the fan 18 through the central through-hole of the (heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate) heat conduction outer housing 11. The airflow circulates in the internal space of the fan due to the impeller, and is then blown through the heat conduction member 22 of the light reflecting cup and the (heat pipe/vapor chamber/(aluminum) superheat conduction tube The heat of the light reflecting cup 21 and the (heat pipe/vapor chamber/(aluminum) super heat conduction tube/(aluminum) super heat conduction plate) heat conductive outer housing 11 is absorbed through the heat pipe/vapor chamber/(aluminum) super heat conduction tube/(aluminum) super heat conduction plate) heat conductive outer housing 11, and is discharged from the fan through another ventilation port 182 (second ventilation port) in the fan frame, and is also discharged to the outside of the body through a ventilation passage inside the body and through ventilation ports (including, but not limited to, a set of honeycomb holes and gaps in the housing) 111 at the end of the body, thereby realizing heat dissipation from the heat conduction member 22 of the light reflecting cup and the (heat pipe/vapor chamber/(aluminum) super heat conduction tube/(aluminum) super heat conduction plate) heat conductive outer housing 11. Another ventilation opening 182 (third ventilation opening) in the fan frame is connected to the air passage inside the lamp tube, and also connects the ventilation passage of the fan 18 to the ventilation passage inside the body of the machine, forming a second ventilation passage 102 for dissipating heat from the light reflecting cup 21 and the lamp tube 20. In this case, external air or cool air flows in through the housing ventilation opening 111 facing the heat dissipation piece 16, passes through the heat dissipation piece 16 and the heat-conducting outer housing 11 (heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate), and flows into the fan 18 through the central through-hole of the vapor chamber 11. A portion of the airflow is expelled from the fan through another ventilation opening 182 in the fan frame by the impeller and flows into the interior of the reflective cup 21, absorbing heat from the lamp tube 20 inside the reflector lamp and the reflective cup, discharging it from the lamp tube, passing through a ventilation passage within the body, and discharging it to the outside of the body through the ventilation opening 111 at the end of the body, further promoting heat dissipation from the lamp tube 20 and the reflective cup 21. The heat dissipation unit and heat dissipation principle are the same as those in the embodiments shown in Figures 1 to 14.

In the beauty device 100 of the present invention, similar to the embodiments shown in Figures 1 to 14, the working surface 113 is formed by the transparent crystalline low-temperature surface of the primary cooling element 10'. The photonic beauty device may be a hair removal device, a photonic skin regeneration device, an import/export beauty device, or a photonic high-frequency beauty device, and any of these may employ the cooling module described in the above embodiments. A primary cooling element 10 for cooling the skin is installed on the working surface, which is the end of the photonic beauty device that contacts the skin. Heat from the primary cooling element 10' (specifically, the high-temperature surface 11') is absorbed by the evaporating end of the cooling conduction element (heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate) 15, enters the internal passage, and is conducted to the condensing end. A secondary cooling element 10 is installed at the condensing end to provide active cooling to the condensing end. In this case, the temperature of the condensing end is determined by the power of the secondary cooling element 10. Because the temperature of the condensing end is much lower than the ambient air temperature, the condensation rate and aging time at the condensing end are significantly improved, accelerating the internal phase transformation and circulation of the cooling conduction member (heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate), thereby achieving the beneficial effects of improving cooling to the front end. The high-temperature surface 11' of the secondary cooling member 10 is located near the fan's air inlet or outlet. For heat dissipation from the secondary cooling member 10, the copper/aluminum heat conduction plate 16 can be used to directly absorb heat through the fan, or the heat from the high-temperature surface 11' of the secondary cooling member 10 can be conducted to the fan housing via the heat pipe/vapor chamber/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate, and the heat can be absorbed by the fan's air blowing or suction via the heat dissipation plate 16 installed on the fan housing wall.

The cosmetic device 100 of the embodiment shown in Figures 31 and 32 has the same configuration as the cosmetic device of the embodiment shown in Figures 1 to 7, and the description of the corresponding embodiment is directly quoted in this embodiment, so detailed description is omitted. According to the principle of a heat pipe, after the evaporation end of the cooling conduction member 15 is vaporized by heat, the heat is conducted to the heat dissipation plate 16 by the condensation end pipe wall and absorbed by the fan 18. Condensation is an active/passive type of heat dissipation. The heat dissipation effect of the condensation end is determined by the ambient temperature of the air drawn in by the fan. For example, the aging and speed of condensation are reduced, adversely affecting the effectiveness of the internal circulation of the heat pipe. When cooling the skin using only the primary cooling member 10', the heat conduction efficiency is uneven, the heat conduction is slow, and the aging of heat conduction is poor. Furthermore, when heat is conducted to the heat dissipation plate, there are problems such as uneven heat distribution at the front and rear ends, left and right ends, or top and bottom ends of the heat dissipation plate, which affects the heat dissipation effect by maximizing a portion of the air drawn in or blown out by the fan. In this embodiment, the two-stage cooling module 1 transfers heat from the primary cooling member 10' to the secondary cooling member 10 using the cooling conduction member 15, effectively resolving the above-mentioned problems caused by the primary cooling member 10' alone.

In another embodiment, the secondary cooling member 10 rapidly dissipates heat using the heat dissipation unit of the cooling module of the embodiment shown in Figures 20 to 26. That is, the primary cooling member 10' (specifically, the high-temperature surface 11') is connected to the secondary cooling member 10 (specifically, the low-temperature surface 13) by a cooling conduction member 15 (15') for rapid heat transfer, thereby achieving rapid cooling conduction. Heat generated at the high-temperature surface 11' of the secondary cooling member 10 is rapidly dissipated by the heat conduction structure 19 and the heat dissipation plate 16. The heat conduction structure 19 includes a heat conduction plate 190 and multiple aluminum VC/ALVC superconducting tubes 191, each of which is a single tube. The high-temperature surface 11' of the secondary semiconductor cooling member 10 is installed on the outer wall of the heat conduction plate 190, or the heat conduction plate 190 serves as the high-temperature surface 11' of the secondary semiconductor cooling member 10. The secondary semiconductor cooling member 10 is installed on one side of the outer wall of the heat conduction plate 190, and a plurality of opening grooves 192 are installed on the other side. The plurality of opening grooves 192 are fitted with a plurality of aluminum VC/ALVC superconducting tubes 191. The aluminum VC/ALVC superconducting tubes 191 are housed in the opening grooves 192. The opening grooves 192 of the heat conduction plate are connected to the aluminum VC/ALVC superconducting tubes 191 by, for example, crimping or welding, thereby increasing the contact area between them and achieving rapid heat transfer. The heat dissipation unit further includes a heat dissipation fan module. The heat dissipation fan may be implemented using the configuration of each of the above embodiments or a conventional fan.

The following embodiments refer to Figures 33 to 54. The secondary cooling member 10 of the above-described embodiments rapidly dissipates heat using a heat dissipation fan module 200. In this embodiment, the heat dissipation fan module 200 includes a fan housing 210 and an impeller 220. The interior of the fan housing 210 is a cavity. The impeller 220 is mounted within the cavity. The fan housing 210 is provided with a plurality of ventilation holes 201. The cavity communicates with the gas path outside the fan through the ventilation holes 201. At least a portion of the housing of the fan housing 210 is made of a heat pipe, a superheat conductive tube, a superheat conductive plate, or VC 211. The fan housing 210 includes side housings. An upper housing and a bottom housing may be selectively installed on the top and bottom of the fan housing 210 depending on the needs of a specific product. The upper housing and the bottom housing may not be separately installed and may be formed from the upper fins or lower fins of the heat dissipation plate described below. The side housing may be the volute case on the outside of the circumference around which the impeller rotates, or it may be a housing that is part of the volute case.

Preferably, the superheat conducting tube is an aluminum superconducting tube, and the superheat conducting plate is an aluminum superconducting plate. The through passage 2110 inside the aluminum superconducting tube or plate is a single passage or multiple passages, and the single passage or multiple passages are porous microgroove passages that communicate with the passage 2110 and the porous microgrooves 2111 in its inner wall. Both ends of the single passage or multiple passages are sealed, and a working liquid is sealed inside.

The fan housing includes a volute case around the impeller, which encloses and forms a cavity inside the fan. An upper housing may be installed on the top of the volute case, or a ventilation opening 201 may be formed on the top. The bottom of the volute case may be a bottom housing, or may have a ventilation opening 201 formed on it. The ventilation openings on the top may be multiple through-holes installed in the upper housing, and the ventilation openings on the bottom may be multiple through-holes installed in the bottom housing. All or part of the volute case, upper housing, or bottom housing may be made of a heat pipe, a superheat conducting tube, a superheat conducting plate, or VC211. The entire unit is formed by butt-joining one or more heat pipes, superheat conducting tubes, superheat conducting plates, or VC211.

The heat dissipation fan module 200 includes a heat dissipation plate 212. The heat dissipation plate 212 is connected to a heat pipe, a superheat conduction tube, a superheat conduction plate, or a VC 211 for rapid heat transfer. The heat dissipation plate 212 is located within a cavity in the fan housing. The heat dissipation plate 212 includes one or more sets of thermally conductive fins. The air passages of the heat dissipation plate, which are the air passages between adjacent fins, communicate with the fan's air vents and the cavity.

Preferably, a heat pipe, superheat conductive tube, superheat conductive plate, or VC211 is installed on the volute case, which is the side of the fan housing. The heat dissipation piece 212 is installed on the inner wall of the side at a predetermined distance from the impeller 220 and does not affect the rotation of the impeller 220. More preferably, a heat conductive outer housing is formed on the side of the volute case using an aluminum superconducting tube or aluminum superconducting plate with a single passage or multiple passages. The heat dissipation piece 212 is installed on the inner wall of the heat conductive outer housing. The fins are arranged radially around the center of rotation of the impeller. The air passage between adjacent fins is in the same direction as the airflow generated by the rotation of the impeller.

Two or more fine bone-like microgrooves 2111 are formed on the inner wall of a single passage or multiple passages 2110 in an aluminum superconducting tube or plate. The groove direction of the microgrooves 2111 is along the radial circumference of the impeller's rotation center, in the same direction as the airflow generated by the rotation of the impeller. A porous structure is formed inside the wall material of the microgrooves 2111. The passages 2110, microgrooves 2111, and the porous structure inside the material are formed in a primary process by extruding the aluminum material.

Preferably, the heat dissipation fan module 200 of the present invention includes a secondary semiconductor cooling member 10. The heat dissipation surface (high-temperature surface) of the secondary semiconductor cooling member 10 is connected to a heat pipe, a superheat conduction tube, a superheat conduction plate, or a VC211 for rapid heat transfer. The heat dissipation surface of the secondary semiconductor cooling member 10 is attached to the heat pipe, the superheat conduction tube, the superheat conduction plate, or the VC211 for heat transfer through contact, or is attached to the heat pipe, the superheat conduction tube, the superheat conduction plate, or the VC211 for heat transfer through contact. Alternatively, the heat dissipation surface of the secondary semiconductor cooling member 10 and the heat pipe, the superheat conduction tube, the superheat conduction plate, or the VC211 are respectively installed at different positions on the fan housing for rapid heat transfer between them.

The heat dissipation fan module 200 includes a drive control circuit board 240 and a drive module 250. The drive control circuit board 240 is electrically connected to the drive module 250. The drive control circuit board 240 and the drive module 250 are electrically connected to an external power source via a power line or a power module. The drive module 250 drives the impeller 220 to rotate. The electrodes of the secondary semiconductor cooling member 10 are electrically connected to the drive control circuit board 240 or an external circuit board.

In some embodiments, the drive control circuit board 240 is installed outside the fan housing to achieve waterproofing. The ventilation openings 201 are provided with waterproof seals. The drive module 250 is installed on the drive control circuit board 240 and attached to the outside of the fan's bottom housing 214. The drive control circuit board 240, drive module 250, and fan impeller 220 are respectively installed inside and outside the fan's bottom housing 214, so that the drive control circuit board 240 and drive module 250 are not affected when water is sucked into or supplied into the fan. The drive module 250 includes a motor. The motor's output shaft is axially connected to the impeller to rotate the impeller 220. Alternatively, the drive module 250 includes a motor stator winding, and a magnetic ring 25 is fitted inside the impeller, and the magnetic ring 25 is fixedly connected to the impeller 220. When power is applied to the drive module 250, a magnetic field is generated, and the rotation of the magnetic ring 25 drives the rotation of the fan impeller.

The heat dissipation fan module 200 is a radial flow fan or an axial flow fan. In a radial flow fan, the airflow generated by the rotation of the impeller 220 circulates along the radial circumference of the impeller's center of rotation before being exhausted through a vent in the volute case. In an axial flow fan, the airflow generated by the rotation of the impeller 220 is exhausted along the central axis from a vent in the volute case or a vent at the bottom.

In some embodiments, a heat sink 212 is installed in the fan vent 201, and the air passage of the heat sink connects the fan cavity to the external environment.

The heat pipe or vapor chamber (VC) of the present invention rapidly transfers heat from a heat-generating object to the outside of the heat source using the principle of thermal conduction and the rapid heat transfer characteristics of the cooling medium. Heat is transferred by the evaporation and condensation of a liquid inside a completely sealed vacuum tube or vacuum plate, and the cooling effect is achieved through fluid principles such as capillary action, offering a number of advantages, including high thermal conductivity, excellent heat uniformity, heat flux variability, and reversible heat flow direction. Heat exchangers constructed with heat pipes or vapor chambers offer advantages such as high heat transfer efficiency, a compact structure, and low fluid resistance loss.

The superheat conduction tube or plate of the present invention is preferably an aluminum superheat conduction tube/plate. (Aluminum) superheat conduction tubes or plates, also known as ALVC superconducting tubes (plates), rapidly conduct heat through evaporative cooling and gas-liquid phase transformation. Compared to conventional heat pipes and VC vapor chambers, aluminum superheat conduction tubes/plates are made by extrusion molding (processing) aluminum material, with microgrooves, microtooths, or micropores formed on the surface of the superheat conduction tube or plate as a capillary structure inside the superconducting tube or plate. The interior of an ALVC aluminum superconducting tube (plate) may contain aluminum powder or aluminum silicon powder instead of copper powder, and an aluminum mesh is added to seal the tube after adding the coolant.

Specific embodiments will be described below with reference to the drawings. The embodiments described below do not limit the present invention, but are intended to enable those skilled in the art to understand and implement the technical solutions of the present invention. The scope of protection of the present invention is governed by the claims. The configurations of the heat dissipation fan module 200 in the embodiments described below may be substituted, combined, or improved, and all such modifications are within the scope of the present disclosure.

Referring to Figures 33 to 40, the heat dissipation fan module 200 of the first embodiment of the present invention is a blower module and includes a fan housing 210 having a cavity formed therein, an impeller 220 mounted within the cavity, and a secondary semiconductor cooling member 10 mounted on the fan housing. The fan housing 210 includes a volute case on the side. A volute case cover is provided on the outside of the impeller 220. The volute case is a heat-conducting outer housing, and a heat dissipation plate 212 is installed on its inner wall. The entire volute case is made up of a heat pipe, a superheat-conducting tube, a superheat-conducting plate, or a VC 211. In this embodiment, the entire volute case is described as being an aluminum superconducting tube or an aluminum superconducting plate.

Vents 201 are installed on the side volute case and top of the fan housing 210. The vents 201 connect the cavity to the gas path outside the fan. For example, air is taken in through the top vent, flows into the cavity, and then the impeller 220 promotes airflow circulation, absorbing heat from the surface of the heat sink 212, and finally discharges through the side vents. Referring to FIG. 34, the bottom housing 214, which is the bottom of the fan housing 210, may be equipped with multiple vents 201 to assist air intake. The fan of this embodiment has a radial flow, taking in air through the vents at the top and bottom of the impeller or fan in the axial direction and discharging it through the side vents. The air intake and air discharge may be interchanged, and are not limited to this.

In this embodiment, the fan housing 210 includes a side volute case and a bottom housing, the top of which is open to form a vent. The side volute case has a single heat pipe, superheat conduction tube, superheat conduction plate, or VC211 (shown in Figures 35 to 37 and 39) as the entire thermally conductive outer housing, or multiple heat pipes, superheat conduction tubes, superheat conduction plates, or VC211 (Figure 38) as the entire thermally conductive outer housing. The heat pipe, superheat conduction tube, superheat conduction plate, or VC211 is closely adjacent to the inner heat dissipation plate 212 for heat conduction, and the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 is connected to the heat dissipation plate 212 by welding, crimping, adhesive, or other means to rapidly transfer heat.

Preferably, the side volute case is a thermally conductive outer housing formed of aluminum superconducting tubes or aluminum superconducting plates 11, either as a single unit or by butt-joining multiple units. Each aluminum superconducting tube or plate 11 has a single or multiple longitudinal through-passages 2110, each sealed at both ends and filled with working liquid. The inner walls of each passage 2110 are formed with multiple bone-like microgrooves 2111. The microgrooves 2111 pass through the passage 2110 in which they are located and allow the working liquid to flow. A porous structure is formed within the material. The pores and microgrooves 2111 create capillary action within the passage 2110. Instead of adding copper powder, aluminum powder or aluminum silicon powder may be added to the passage 2110. An aluminum mesh is then added, and the coolant is added, before sealing. The perforations, microgrooves 2111, and passages 2110 are all manufactured synchronously when the aluminum material is formed into a tubular shape through an extrusion process, and are formed as a capillary structure inside the aluminum superconducting tube or aluminum superconducting plate 11. The groove direction of the microgrooves 2111 and the longitudinal direction of the passages 2110 may be in the direction of rotation of the impeller (as shown in Figures 36 to 39), or may be installed vertically along the axial direction, as shown in Figure 40.

The heat dissipation plate 212 is one or more sets of thermally conductive fins, and the position, number, and arrangement of the heat dissipation plate are determined according to the cavity space of the fan. The one or more sets of thermally conductive fins may be integrally formed, or may be fixed to the entire heat dissipation plate 212 by welding, crimping, or other fastening mechanisms. Alternatively, one or more sets of thermally conductive fins (e.g., aluminum/copper/graphene or other thermally conductive fins) may be attached to a thermally conductive plate to form the heat dissipation plate 212 as an integral structure. The shape of the heat dissipation plate 212 corresponds to the shape of a volute case, heat pipe, superheat conduction tube, superheat conduction plate, or VC211. In this embodiment, the entire heat dissipation plate 212 is cylindrical or annular and is fitted into the inner wall of a thermally conductive outer housing consisting of an annular heat pipe, superheat conduction tube, superheat conduction plate, or VC211. The heat dissipation plate 212 is either directly attached or attached to the inner wall by a thermally conductive member for rapid heat transfer. The side vents may be formed by an air passage between the fins of the heat sink 212, penetrating the outside and the inside of the cavity. The heat sink 212 may be fixed to the outside of the vent by a heat conductive plate, or may be fixed to the inner wall of a heat conductive outer housing made of a heat pipe, a superheat conductive tube, a superheat conductive plate, or VC 211 by a fixing member. Furthermore, the fins at the side vents are disconnected from the heat pipe, the superheat conductive tube, the superheat conductive plate, or VC 211, forming a passage connecting the fan cavity to the outside. In this embodiment, the top heat sink is the upper housing of the fan, and this heat sink forms an air passage together with the bottom housing and impeller group of the fan, resulting in an open top and vents without the need for a separate upper housing for the fan.

The secondary semiconductor cooling member 10 includes an electric double layer in the middle, and high-temperature (heat dissipation) and low-temperature surfaces at both ends. The high-temperature surface of the secondary semiconductor cooling member is connected to the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 for rapid heat transfer. The heat dissipation surface of the secondary semiconductor cooling member 10 is bonded to the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 for heat transfer through contact, or is bonded to the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 for heat transfer through contact. The outer wall of the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 serves as the high-temperature surface of the secondary semiconductor cooling member, and a high-temperature end circuit is installed and electrically connected by welding to the electric double layer to form the internal circuit of the secondary semiconductor cooling member. In this embodiment, the high-temperature surface of the secondary semiconductor cooling member 10 is bonded to the outer wall of the heat pipe, superheat conduction tube, superheat conduction plate, or VC211.

The impeller 220, drive control circuit board 240, and drive module 250 are attached to the bottom housing 214 of the fan. The drive module 250 uses a motor. The motor's output shaft is axially connected to the impeller's central shaft 221, and the impeller rotates when the motor is rotated forward or backward.

Refer to Figures 41 and 42 for an alternative embodiment. The secondary semiconductor cooling member 10 is installed on the outer wall of the fan's bottom housing 214, for example, by being attached to and in contact with the bottom housing 214. The fan's bottom housing 214 is a thermally conductive member made of a thermally conductive material, which may be, for example, a metal plate, heat pipe, VC, or superconducting plate. The fan's bottom housing 214 is connected to the side heat pipe, superconducting pipe, superconducting plate, or VC 211 for rapid heat transfer.

Referring to Figures 33 to 47, the heat dissipation fan module 200 of the second embodiment of the present invention is an axial fan module and includes a fan housing 210 having a cavity formed therein, an impeller 220 mounted in the cavity, and a secondary semiconductor cooling element 10 mounted on the fan housing. The fan housing 210 includes a side volute case. The entire volute case is made up of a heat pipe, a superheat conduction tube, a superheat conduction plate, or a VC 211. The heat pipe, the superheat conduction tube, the superheat conduction plate, or a VC 211 is installed on the volute case, which is the side of the fan housing. More preferably, a heat conduction outer housing is formed on the side of the volute case by a single-passage or multi-passage aluminum superconducting tube or aluminum superconducting plate. A heat dissipation plate 212 is installed on the inner wall of the side. The fins of the heat dissipation plate 212 are arranged in a ring shape along the diameter direction, and the air passages between the fins run along the axial direction. Within the cavity, fins are arranged around the top heat sink 212 above the impeller 220, and fins are arranged around the bottom heat sink 212 below it. The air passages for the two upper and lower heat sinks are preferably aligned, with vents at the top and bottom of the fan serving as air intake and air exhaust, respectively. The impeller 220 rotates to draw air through the air passage (air intake vent) of the top heat sink and exhaust it axially downward along the air passage (air exhaust vent) of the bottom heat sink 212; the air intake and air exhaust directions may be reversed.

In the second embodiment of the heat dissipation fan module 200, as in the first embodiment, the volute case, which serves as the side housing, is a thermally conductive outer housing formed by butt-joining heat pipes, superheat conduction tubes, superheat conduction plates, or VCs 211, either as a single unit or in multiple units, and the heat dissipation pieces on the inner wall are connected for rapid heat transfer by welding, crimping, adhesive bonding, or other fastening methods. Preferably, the side volute case is a thermally conductive outer housing made of an aluminum superconducting tube or aluminum superconducting plate with a single or multiple passages, and two or more thin microgrooves 2111 are formed on the inner wall of the single or multiple passages 2110 of the aluminum superconducting tube or aluminum superconducting plate. A plurality of micropores are formed in the material within the wall of the microgroove 2111. The groove direction of the passages 2110 and the porous microgrooves 2111 is arranged along the axial direction of the impeller's rotation center, and is the same as the direction of the airflow generated by the rotation of the impeller.

The secondary semiconductor cooling member 10 is installed on the outer wall of the side heat conduction outer housing, and its heat dissipation surface (high-temperature surface) is connected to the side heat pipe, superheat conduction tube, superheat conduction plate, or VC211 to rapidly transfer heat, or the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 itself serves as the heat dissipation surface (high-temperature surface) of the secondary semiconductor cooling member 10, and a high-temperature end circuit that is electrically connected and welded to the semiconductor electric double layer is installed on its outer wall.

The impeller 220 is mounted by rotating a fixed bracket 223 and a snap ring 222 installed in the cavity. The fixed bracket 223 is provided with the impeller's central shaft, which is inserted into the central shaft hole of the impeller 220, and its top is engaged and fixed by the snap ring 222.

A drive control circuit board 240 and a drive module 250 are installed on the outside bottom of the volute case. In this embodiment, the drive module 250 uses a motor, and the motor's output shaft is axially connected to the impeller's central shaft 221, rotating the impeller forward and backward.

The heat dissipation fan module 200 of the present invention uses a heat pipe/VC/(aluminum) superheat conduction tube/(aluminum) superheat conduction plate, etc. as the fan housing (which may be the side, top cover, bottom cover, or volute case). Its phase transformation thermal conductivity allows it to rapidly conduct heat into the fan cavity, where it dissipates heat through the airflow generated by the rotation of the fan impeller. The present invention effectively utilizes the internal space of the fan to make the product more compact, achieve higher heat dissipation efficiency, and more effectively integrate with applied products, thereby reducing the cost of the fan's original housing material. It also increases the contact area between the heat dissipation plate and the airflow. For equivalent heat dissipation needs, the present invention improves heat dissipation efficiency and reduces fan speed, current, noise, etc.

Another technical feature of the heat dissipation fan module 200 of the present invention is that when used in an application to cool a semiconductor, the heat dissipation surface of the cooling element is directly attached (contacted) to the fan housing (i.e., the thermal conduction element: heat pipe/VC/(aluminum) super thermal conduction tube/(aluminum) super thermal conduction), effectively shortening the heat transfer distance and accelerating heat transfer, further improving the effectiveness of the application.

Referring to Figures 48 to 54, the heat dissipation fan module 200 of the third embodiment of the present invention may be a waterproof fan, and is preferably a magnetic fan module, and includes a fan housing 210 having an internal cavity, an impeller 220 mounted in the cavity, and a secondary semiconductor cooling element 10 mounted on the fan housing. The fan housing 210 includes a volute case on the side, an upper housing 215 at the top of the volute case, and a bottom housing 214 at the bottom. The volute case on the side, the upper housing 215 at the top of the volute case, and the bottom housing 214 at the bottom enclose and form a cavity inside the fan. The arc-shaped portion of the volute case is made of a heat pipe, a superheat conduction tube, a superheat conduction plate, or VC 211. More preferably, the volute case on the side of the volute case includes an arc-shaped heat conduction outer housing made of a single-passage or multiple-passage aluminum superheat conduction tube or aluminum superheat conduction plate. The heat sink 212 is mounted on the inner wall of the side arc heat-conducting outer housing, with the fins of the heat sink 212 arranged along a diametric arc, and the air passages between the fins run radially. In this embodiment, the fan vent 201 is mounted on the side volute case and is used for air intake and exhaust. The upper and lower housings do not have vents to prevent water leakage.

The heat dissipation fan module 200 of the third embodiment is similar to the first and second embodiments, with the arc-shaped heat-conducting outer housing of the side volute case made of a heat pipe, superheat-conducting tube, superheat-conducting plate, or VC211, which is butt-jointed together to form the heat-conducting outer housing as a whole, and the heat-dissipating plates on the inner wall are connected by welding, crimping, adhesive, or other fastening methods to ensure rapid heat transfer. Preferably, the arc-shaped heat-conducting outer housing of the side volute case is made of a single-passage or multiple-passage aluminum superconducting tube or aluminum superconducting plate, and two or more rib-like micro-grooves 2111 are formed on the inner wall of the single or multiple passages 2110 of the aluminum superconducting tube or aluminum superconducting plate. A plurality of micro-pores are formed in the material within the wall of the micro-groove 2111. The groove direction of the passages 2110 and the porous micro-grooves 2111 is arranged along the radial arc of the impeller's rotation center, and is the same as the direction of the airflow generated by the rotation of the impeller.

The secondary semiconductor cooling member 10 is installed on the outer wall of the side heat conduction outer housing, and its heat dissipation surface (high-temperature surface) is connected to the side heat pipe, superheat conduction tube, superheat conduction plate, or VC211 for rapid heat transfer; alternatively, the heat pipe, superheat conduction tube, superheat conduction plate, or VC211 serves as the heat dissipation surface (high-temperature surface) of the secondary semiconductor cooling member 10, and a high-temperature end circuit that is electrically connected and welded to the semiconductor electric double layer is installed on its outer wall. Alternatively, the secondary semiconductor cooling member 10 is installed on the top housing 215 or bottom housing 214, and the top housing 215 or bottom housing 214 is connected to the arc-shaped heat conduction outer housing for rapid heat transfer. The high-temperature surface of the secondary semiconductor cooling member is attached to and in contact with the fan housing.

The impeller 220 is located within the cavity and attached to the bottom housing 214. An axial hole is provided in the center of the impeller 220. A sleeve 229 is fixedly installed within the axial hole. A convex ring is formed on the inner wall of the sleeve 229. The upper bearing 228 and the lower bearing 226 are mounted within the sleeve 229 and are located above and below the convex ring, respectively. A magnetic ring is fitted inside the impeller 220; specifically, an annular chamber is formed outside the sleeve 229. The magnetic ring is fitted onto the inner wall of the outer ring of the annular chamber inside the impeller and is fixed to the impeller 220.

The bottom housing 214 is provided with the impeller's central shaft 221. A hollow annular boss is formed on the bottom housing. A central shaft is attached to the center of the boss and is resiliently locked to the bottom of the central shaft 221 by a spring 227. The central shaft 221 is inserted into a sleeve in the central shaft hole of the impeller 220 and engages with a bearing and a convex ring. A locking groove is formed on the top of the central shaft 221 and is locked by a snap ring 222 to prevent it from coming loose. The top of the hollow annular boss on the bottom housing 214 is inserted into the annular chamber inside the impeller 220. The drive module 250 is attached to the bottom housing 214 and installed in the hollow cavity defined by the hollow annular boss. The drive control circuit board 240 is located outside the bottom housing 214. In this embodiment, the drive control circuit board 240 and drive module 250 are installed outside the bottom of the volute case. The drive module 250 includes a motor stator winding 251. When energized, the drive module generates a magnetic field, causing the fan impeller 220 to rotate. The drive module 250, drive control circuit board 240, and fan impeller 220 are located on the inside and outside of the fan's bottom housing 214, respectively. Therefore, the drive module 250 and drive control circuit board 240 are not affected when water is sucked into or supplied to the fan. In this embodiment, the drive module 250 and drive control circuit board 240 are separated from the fan module. The drive control circuit board 240 is located outside the fan housing 210 to achieve waterproofing. When wind passes through the air passage, water will not affect the drive control circuit board 240. When applied to a product, a sealing ring may be installed in the air vent of this embodiment. This provides waterproofing between the product and the fan module 200.

In the above examples, "cooling conduction" may be interpreted as meaning the same as "thermal conduction," "heat transfer," or "thermal conduction," all of which mean the conduction of heat and may be used interchangeably. The symbol "/" represents "or."

It should be understood that the directional terms used in the above examples, such as "upper," "lower," "top," "bottom," "left," "right," "vertical," "horizontal," "lateral," "front," and "rear," refer to the relative positions of components shown in the drawings and are not intended to limit absolute geographical orientations.

The technical features of each of the above embodiments can be combined, transformed, or substituted to obtain different embodiments, all of which fall within the scope of the disclosed embodiments of the present invention. Some common or similar structures in the above embodiments are described in some embodiments but not in other embodiments, and these common or similar structures are also applicable to these embodiments, all of which fall within the scope of the disclosed embodiments of the present invention.

In the present invention, unless otherwise clearly specified or limited, terms such as "attached," "coupled," "connected," and "fixed" should be understood to have a broad meaning, and may refer to, for example, fixedly connected, detachably connected, or connected as an integral unit, mechanically connected, electrically connected or connected so that data can be transmitted, directly connected, indirectly connected via an intermediate medium, internal communication between two modules, or a mutually interacting relationship between two modules. Those skilled in the art will be able to understand the meaning of the above terms in the present invention according to specific cases.

Although embodiments of the present invention have been illustrated and described, those skilled in the art may make various changes, modifications, substitutions, and variations to these embodiments without departing from the principles and spirit of the present invention, all of which fall within the scope of the present invention. It will be understood that the scope of the present invention is defined by the appended claims and their equivalents.

Claims (11)

1. A two-stage cooling module including a primary semiconductor cooling element,
further comprising a secondary semiconductor cooling member and a cooling conduction member;
The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and a high-temperature surface and a low-temperature surface at both ends;
the cooling conduction member is coupled between the primary semiconductor cooling member and the secondary semiconductor cooling member for rapid cooling conduction;
the cooling conduction member is a heat transfer structural member,
the ends of the cooling conduction member are connected to the hot surface of the primary semiconductor cooling member and the cold surface of the secondary semiconductor cooling member, respectively, for rapid heat transfer;
the heat transfer structural member is one or a combination of a plurality of members selected from a heat transfer member made of a heat conductive material, a heat pipe, a vapor chamber, a super heat conduction pipe, and a super heat conduction plate;
the superconducting heat tube is an aluminum superconducting tube;
the superconducting plate is an aluminum superconducting plate;
Both ends of the aluminum superconducting plate or aluminum superconducting tube are sealed, and a working liquid is sealed inside;
When the aluminum material is formed, two or more fine grooves are formed on the inner wall of the aluminum superconducting plate or aluminum superconducting tube,
A two-stage cooling module, characterized in that a microporous structure is formed in said aluminum superconducting plate or aluminum superconducting tube material when said aluminum material is formed. The two-stage cooling module includes a heat conduction structure and a heat dissipation piece;
the heat conduction structure is one or a combination of a plurality of heat conduction members made of a heat conduction material, a heat pipe, a vapor chamber, a super heat conduction pipe, and a super heat conduction plate;
The heat-conducting structure is connected to the heat-dissipating piece for rapid heat transfer;
The heat conduction structure is connected to the high temperature surface of the secondary semiconductor cooling member so as to rapidly transfer heat, or a high temperature end circuit of the secondary semiconductor cooling member is installed in the heat conduction structure and is welded and electrically connected to the electric double layer of the secondary semiconductor cooling member, so that the heat conduction structure serves as the high temperature surface of the secondary semiconductor cooling member;
the two-stage cooling module further includes a fan;
the fan includes a housing and an impeller within the housing;
2. The two-stage cooling module according to claim 1, wherein the heat conducting structure and/or the heat dissipating piece are installed at the air outlet of the fan or are part of the fan housing. the heat-conducting structure includes a plurality of aluminum superconducting plates or aluminum superconducting tubes;
The aluminum superconducting plate or aluminum superconducting tube is a single tube unit, and a single passage is formed therein;
The aluminum superconducting plate or aluminum superconducting tube can be flat-bent or specially shaped 3D-bent to fit the installation space.
the heat conduction structure further includes a heat conduction plate;
The plurality of aluminum superconducting plates or aluminum superconducting tubes are fitted to a heat conductive plate;
The plurality of aluminum superconducting plates or aluminum superconducting tubes are arranged to include at least two different directions or angles, thereby suppressing the drawback that the heat conduction effect is reduced due to the effect of anti-gravity direction;
The heat dissipation piece includes one or more sets of thermally conductive fins;
3. The two-stage cooling module of claim 2, wherein the heat conduction plate is installed in the groove of the heat dissipation plate or on the top of the heat dissipation plate, or the heat dissipation plate and the heat conduction plate are installed on another heat conduction member. The heat conduction plate is provided with a plurality of opening grooves,
the plurality of aluminum superconducting plates or aluminum superconducting tubes are fitted into the plurality of opening grooves and correspondingly attached thereto, with their wall surfaces in contact with each other to accelerate heat transfer;
The aluminum superconducting plate or aluminum superconducting tube is welded or caulked to the opening groove to increase the contact area;
The secondary semiconductor cooling member is mounted on a heat conduction plate;
The high temperature surface of the secondary semiconductor cooling element is attached to the outer wall of the heat conduction plate by pasting it, so that the heat of the high temperature surface is directly conducted to the heat conduction plate; or the high temperature surface of the secondary semiconductor cooling element is attached to the outer wall of the heat conduction plate by a heat conduction member, so that the heat of the high temperature surface is rapidly conducted to the heat conduction plate by the heat conduction member; or the heat conduction plate functions as the high temperature surface, and the high temperature end circuit of the secondary semiconductor cooling element is installed on it, and is welded and electrically connected to the PN galvanic particles of the electric double layer;
4. The two-stage cooling module of claim 3, wherein the plurality of aluminum superconducting plates or aluminum superconducting tubes are designed in a circular, staggered, or circulating manner, in a form of crossing at two different directions or angles, or at a fixed angle in the XY plane. 1. A two-stage cooling module including a primary semiconductor cooling element,
further comprising a secondary semiconductor cooling member and a cooling conduction member;
The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and a high-temperature surface and a low-temperature surface at both ends;
the cooling conduction member is coupled between the primary semiconductor cooling member and the secondary semiconductor cooling member for rapid cooling conduction;
the cooling conduction member is a heat transfer structural member,
the secondary semiconductor cooling member dissipates heat by a heat dissipation fan module;
The heat-dissipating fan module includes a fan housing and an impeller;
The interior of the fan housing is a cavity,
The impeller is mounted within a cavity;
The fan housing is provided with a plurality of ventilation openings,
The cavity communicates with a gas passage outside the fan through a ventilation hole;
At least a portion of the fan housing is made of a thermally conductive outer housing,
The heat conductive outer housing is formed by butt-joining one or more of a combination of heat conductive members, heat pipes, vapor chambers, superheat conductive tubes, and superheat conductive plates made of heat conductive materials, either as a whole or in combination;
a high-temperature surface of the secondary semiconductor cooling member connected to the heat-conducting outer housing for heat transfer; or a high-temperature end circuit of the secondary semiconductor cooling member installed in the heat-conducting outer housing and welded and electrically connected to the electric double layer of the secondary semiconductor cooling member, thereby allowing the heat-conducting outer housing to serve as the high-temperature surface of the secondary semiconductor cooling member. the superconducting heat tube is an aluminum superconducting tube;
the superconducting plate is an aluminum superconducting plate;
The heat-dissipating fan module includes a heat-dissipating piece;
the heat dissipation piece is connected to the heat conductive outer housing for rapid heat transfer;
The air passage of the heat sink communicates with the fan vent and the cavity;
The two-stage cooling module of claim 5 , wherein a side housing of a fan housing includes the heat-conducting outer housing. The side housing of the fan housing includes the heat-conducting outer housing made of a single-passage or multi-passage aluminum superconducting tube or aluminum superconducting plate;
The heat dissipation piece is installed on the inner wall of the side housing of the fan housing,
The two-stage cooling module according to claim 6, wherein the airflow direction of the heat dissipating plate is the rotation direction or axial direction of the impeller. Including aircraft in which multiple ventilation openings are installed,
A light source module, a power supply module and a control circuit board are installed inside the body;
the light source module and the power supply module are electrically connected to the control circuit board;
The plurality of ventilation openings of the fuselage form a ventilation passage together with the space within the fuselage as air intakes and air exhausts,
The front end of the body is a photonic beauty device that is a working surface,
a two-stage cooling module including a primary semiconductor cooling member, a secondary semiconductor cooling member, and a cooling conduction member is further installed in the fuselage;
The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and a high-temperature surface and a low-temperature surface at both ends;
the cooling conduction member is coupled between the primary semiconductor cooling member and the secondary semiconductor cooling member for rapid cooling conduction;
the cooling conduction member is a heat transfer structural member,
the ends of the cooling conduction member are connected to the hot surface of the primary semiconductor cooling member and the cold surface of the secondary semiconductor cooling member, respectively, for rapid heat transfer;
the heat transfer structural member is one or a combination of a plurality of members selected from a heat transfer member made of a heat conductive material, a heat pipe, a vapor chamber, a super heat conduction pipe, and a super heat conduction plate;
the superconducting heat tube is an aluminum superconducting tube;
the superconducting plate is an aluminum superconducting plate;
Both ends of the aluminum superconducting plate or aluminum superconducting tube are sealed, and a working liquid is sealed inside;
When the aluminum material is formed, two or more fine grooves are formed on the inner wall of the aluminum superconducting plate or aluminum superconducting tube,
When the aluminum material is formed, a microporous structure is formed in the aluminum superconducting plate or aluminum superconducting tube material,
The photonic beauty device is characterized in that the primary semiconductor cooling member serves as the work surface as it is, or cools the work surface. When the primary semiconductor cooling member is used as a working surface, the transparent crystal is used as a low-temperature surface, and the low-temperature surface is used as a working surface;
a light-transmitting window is provided on the high-temperature surface and the electric double layer of the primary semiconductor cooling member, so that the primary semiconductor cooling member has light transmittance; or the low-temperature surface, the high-temperature surface and the electric double layer of the primary semiconductor cooling member jointly define a light-transmitting window, so that photonics generated in the light source module are transmitted through the light-transmitting window to the outside of the working surface;
9. The photonic cosmetic device according to claim 8, wherein when the primary semiconductor cooling member cools the working surface, the low-temperature surface of the primary semiconductor cooling member contacts the working surface to transfer heat, or the low-temperature surface of the primary semiconductor cooling member is connected to the working surface by a heat transfer structural member to rapidly transfer heat to the working surface. The two-stage cooling module includes a fan and is located in an air passage within the fuselage;
The light source module includes a lamp tube and a light reflector cup;
the ventilation passage inside the light reflecting cup communicates with the ventilation passage of the fan and also communicates with the ventilation passage inside the machine body to form a heat dissipation ventilation passage for the light source module, and the fan promotes heat dissipation from the light source module;
A heat sink or a heat conductive member is provided on one side of the light reflecting cup;
The fan housing has multiple ventilation holes formed in it.
a heat dissipation piece or a heat conduction member of the light reflecting cup is attached to one of the ventilation holes, and a first ventilation path is formed by connecting the ventilation path of the fan to a ventilation passage in the machine body to dissipate heat from the light reflecting cup;
Another ventilation port of the fan communicates with the air passage inside the light reflecting cup, and the air passage of the fan communicates with the ventilation passage inside the machine body, forming a second ventilation passage for dissipating heat from the light reflecting cup and the lamp tube;
The photonic beauty device according to claim 8, wherein the photonic beauty device is a hair removal device, a photonic skin regeneration device, an import/export beauty device, or a high frequency beauty device. Including aircraft in which multiple ventilation openings are installed,
A light source module, a power supply module and a control circuit board are installed inside the body;
the light source module and the power supply module are electrically connected to the control circuit board;
The plurality of ventilation openings of the fuselage form a ventilation passage together with the space inside the fuselage as air intakes and air exhausts,
The front end of the body is a photonic beauty device that is a working surface,
a two-stage cooling module including a primary semiconductor cooling member, a secondary semiconductor cooling member, and a cooling conduction member is further installed in the fuselage;
The primary semiconductor cooling element and the secondary semiconductor cooling element each include an electric double layer in the middle and a high-temperature surface and a low-temperature surface at both ends;
the cooling conduction member is coupled between the primary semiconductor cooling member and the secondary semiconductor cooling member for rapid cooling conduction;
the cooling conduction member is a heat transfer structural member,
the secondary semiconductor cooling member dissipates heat by a heat dissipation fan module;
The heat-dissipating fan module includes a fan housing and an impeller;
The interior of the fan housing is a cavity,
an impeller mounted within the cavity;
The fan housing is provided with a plurality of ventilation openings,
The cavity communicates with a gas passage outside the fan through a ventilation hole;
At least a portion of the fan housing is made of a thermally conductive outer housing,
The heat conductive outer housing is formed by butt-joining one or more of a combination of heat conductive members, heat pipes, vapor chambers, superheat conductive tubes, and superheat conductive plates made of heat conductive materials, either as a whole or in combination;
The photonic beauty device is characterized in that the high-temperature surface of the secondary semiconductor cooling member is connected to the heat-conducting outer housing so as to transfer heat to the secondary semiconductor cooling member, or a high-temperature end circuit of the secondary semiconductor cooling member is installed in the heat-conducting outer housing and is welded and electrically connected to the electric double layer of the secondary semiconductor cooling member, thereby making the heat-conducting outer housing the high-temperature surface of the secondary semiconductor cooling member.