JP7725124B2 - Method for producing a silver nanowire-containing conductive laminate - Google Patents
Method for producing a silver nanowire-containing conductive laminateInfo
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- JP7725124B2 JP7725124B2 JP2025504440A JP2025504440A JP7725124B2 JP 7725124 B2 JP7725124 B2 JP 7725124B2 JP 2025504440 A JP2025504440 A JP 2025504440A JP 2025504440 A JP2025504440 A JP 2025504440A JP 7725124 B2 JP7725124 B2 JP 7725124B2
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Description
本発明は、銀ナノワイヤ含有導電性積層体の製造方法に関するものである。 The present invention relates to a method for producing a conductive laminate containing silver nanowires.
近年、液晶ディスプレイや有機ELディスプレイなどの表示デバイス、タッチパネルなどの入力センサー、ペロブスカイト太陽電池などの利用が増えており、これらのデバイスに必須の部材である透明導電膜の需要も増えている。 In recent years, the use of display devices such as liquid crystal displays and organic light-emitting diode (OLED) displays, input sensors such as touch panels, and perovskite solar cells has increased, leading to increased demand for transparent conductive films, which are essential components for these devices.
この透明導電膜の材料としては、従来、酸化インジウムスズ(以下、ITOと略することがある)が主に用いられてきた。ITOを用いた薄膜は、高い透明性と高い導電性が得られるものの、一般的にはスパッタ装置や蒸着装置により作製されるため、生産速度や製造コストの面に問題があった。さらに、ITOは硬く脆いという性質を有しており、フレキシブル性が必要な用途への使用が制限されるといった問題から、ITOに代わる透明導電膜の材料の開発が求められている。 Traditionally, indium tin oxide (hereinafter sometimes abbreviated as ITO) has been the primary material used for these transparent conductive films. While thin films using ITO offer high transparency and high conductivity, they are typically produced using sputtering or vapor deposition equipment, posing problems in terms of production speed and manufacturing costs. Furthermore, ITO is hard and brittle, limiting its use in applications requiring flexibility. This has led to a demand for the development of a transparent conductive film material to replace ITO.
ITOに代わる透明導電膜の材料として注目されているものの一つとして、銀ナノワイヤが挙げられる。銀ナノワイヤは銀に由来する高い導電性と可撓性を有するだけでなく、その小さな直径から、可視光領域での光透過性が高いため、透明導電膜の材料として注目されている。Silver nanowires are one material that is gaining attention as an alternative to ITO for transparent conductive films. Silver nanowires not only possess the high conductivity and flexibility inherent in silver, but also have high optical transparency in the visible light range due to their small diameter, making them a promising material for transparent conductive films.
銀ナノワイヤを用いた透明導電膜では、一般的に銀ナノワイヤの直径が小さいほど光の散乱が抑えられるため、膜の光学特性が向上する。このことから、より細い銀ナノワイヤの製造方法が検討されており、例えば特許文献1では、平均直径30nm未満の銀ナノワイヤの製造方法及びそれを用いた低曇価透明導体が報告されている。 In transparent conductive films using silver nanowires, the smaller the diameter of the silver nanowires, the less light scattering there is, and the optical properties of the film are generally improved. For this reason, methods for producing thinner silver nanowires are being investigated. For example, Patent Document 1 reports a method for producing silver nanowires with an average diameter of less than 30 nm and a low-haze transparent conductor using such nanowires.
一方で銀ナノワイヤは、ナノサイズの直径を有することにより、安定性が低下しており、例えば、銀ナノワイヤを用いた透明導電膜を高温高湿条件下にさらした場合、徐々に導電性が低下していくことが知られている。そのため、このような問題を解決する方法が検討されており、例えば特許文献2では、特定の化合物の組み合わせた耐候性向上剤を用いることで高温高湿条件下および太陽光長時間暴露下における銀ナノワイヤの劣化を抑制できることを報告している。 However, due to their nano-sized diameter, silver nanowires are less stable. For example, it is known that when a transparent conductive film using silver nanowires is exposed to high-temperature, high-humidity conditions, its conductivity gradually decreases. Therefore, methods to solve this problem have been investigated. For example, Patent Document 2 reports that the use of a weather resistance improver that combines specific compounds can suppress the deterioration of silver nanowires under high-temperature, high-humidity conditions and prolonged exposure to sunlight.
しかしながら、特許文献1で得られるような銀ナノワイヤは、直径が非常に小さいが故にさらに安定性が低下しており、従来の銀ナノワイヤの安定化手法では、高温高湿条件下での銀ナノワイヤの劣化を十分に抑えられないことが判明し、このような問題を解決できる方法が求められていた。However, the silver nanowires obtained in Patent Document 1 have a very small diameter, which further reduces their stability. It has been found that conventional methods for stabilizing silver nanowires are unable to sufficiently prevent the deterioration of silver nanowires under high-temperature, high-humidity conditions, and a method to solve this problem has been sought.
本発明は、前記した従来技術における課題に鑑み、従来法より、高温高湿条件での抵抗値変化率が小さい銀ナノワイヤ含有導電性積層体の製造方法を提供することを課題とする。 In view of the problems with the conventional technology described above, the present invention aims to provide a method for manufacturing a silver nanowire-containing conductive laminate that has a smaller rate of change in resistance value under high-temperature and high-humidity conditions than conventional methods.
本発明者は、前記の課題を解決すべく鋭意研究を行った結果、銀ナノワイヤを用いた透明導電膜に対し、特定の耐候性付与組成物を塗布する工程と特定の条件で熱処理する工程を経ることにより、前記した課題が解決できることを見出し、本発明を完成させるに至った。 As a result of intensive research to solve the above-mentioned problems, the inventors discovered that the above-mentioned problems can be solved by applying a specific weather resistance-imparting composition to a transparent conductive film using silver nanowires and then heat-treating it under specific conditions, thereby completing the present invention.
すなわち、本発明は、
<1>基板と銀ナノワイヤ含有導電層を有する導電性積層体を製造する方法で、
(A)銀ナノワイヤ分散液を塗布し、銀ナノワイヤ含有導電層を形成する工程と、
(B)耐候性付与剤として分子量80~400のメルカプト基を1~3個有する化合物または2-アミノチアゾール誘導体を含む耐候性付与組成物を塗布する工程を有し、
(A)工程の後に(B)工程を有する導電性積層体を製造する方法であって、
(B)工程の後に、
(C)40℃~120℃の温度で30分以上熱処理する工程
を含むことを特徴とする導電性積層体の製造方法、
<2>前記耐候性付与組成物が重合性モノマーおよび/またはマクロモノマーと光重合開始剤を含有し、(B)工程と(C)工程の間に重合性モノマーおよび/またはマクロモノマーを硬化させる工程を含む前記<1>に記載の導電性積層体の製造方法、
<3>前記耐候性付与組成物中に含まれる耐候性付与剤の溶質に占める割合が0.02%~1.5%である前記<2>に記載の導電性積層体の製造方法、
<4>前記銀ナノワイヤの直径が10nm~30nmである前記<1>~<3>のいずれか一項に記載の導電性積層体の製造方法、
<5>前記(C)工程の熱処理の温度T(℃)と時間t(分)によってあらわされる下記式αが500以上である前記<1>~<3>のいずれか一項に記載の導電性積層体の製造方法、
α=t×e0.08×(T-40)
<6>前記耐候性付与剤が炭素数8~20のアルカンチオールである前記<1>~<3>のいずれか一項に記載の導電性積層体の製造方法、
<7>前記耐候性付与剤が2-アミノチアゾール、または、2-アミノベンゾチアゾールである前記<1>~<3>のいずれか一項に記載の導電性積層体の製造方法、
<8>前記耐候性付与剤が、少なくとも2位にメルカプト基が結合している、イミダゾール、2-イミダゾリン、チアゾール、2-チアゾリン、1,3,4-チアジアゾール、ピリミジン、1,3,5-トリアジンから選ばれる複素環構造を持つ化合物、または、5位にメルカプト基が結合しているテトラゾール構造を持つ化合物のいずれかであり、分子内にあるメルカプト基がすべて同一複素環内の不飽和結合を有する炭素に結合し、メルカプト基が結合している不飽和炭素は硫黄または窒素原子とのみ結合している化合物である前記<1>~<3>のいずれか一項に記載の導電性積層体の製造方法、
である。
That is, the present invention provides:
<1> A method for producing a conductive laminate having a substrate and a silver nanowire-containing conductive layer, comprising:
(A) applying a silver nanowire dispersion to form a silver nanowire-containing conductive layer;
(B) applying a weather resistance-imparting composition containing a compound having a molecular weight of 80 to 400 and having 1 to 3 mercapto groups or a 2-aminothiazole derivative as a weather resistance-imparting agent;
A method for producing a conductive laminate, comprising the step (A) followed by the step (B),
After step (B),
(C) a method for producing a conductive laminate, comprising a step of heat treating the laminate at a temperature of 40°C to 120°C for 30 minutes or more;
<2> The method for producing a conductive laminate according to <1>, wherein the weather resistance-imparting composition contains a polymerizable monomer and/or a macromonomer and a photopolymerization initiator, and the method includes a step of curing the polymerizable monomer and/or the macromonomer between the steps (B) and (C).
<3> The method for producing a conductive laminate according to <2>, wherein the proportion of the weather resistance imparting agent contained in the weather resistance imparting composition in the solute is 0.02% to 1.5%.
<4> The method for producing a conductive laminate according to any one of <1> to <3>, wherein the silver nanowires have a diameter of 10 nm to 30 nm.
<5> The method for producing a conductive laminate according to any one of <1> to <3>, wherein the value of the following formula α, which is represented by the temperature T (°C) and the time t (minutes) of the heat treatment in the step (C), is 500 or more:
α=t×e 0.08×(T-40)
<6> The method for producing a conductive laminate according to any one of <1> to <3>, wherein the weather resistance imparting agent is an alkanethiol having 8 to 20 carbon atoms.
<7> The method for producing a conductive laminate according to any one of <1> to <3>, wherein the weather resistance imparting agent is 2-aminothiazole or 2-aminobenzothiazole.
<8> The method for producing a conductive laminate according to any one of <1> to <3>, wherein the weather resistance imparting agent is either a compound having a heterocyclic structure selected from imidazole, 2-imidazoline, thiazole, 2-thiazoline, 1,3,4-thiadiazole, pyrimidine, and 1,3,5-triazine, in which a mercapto group is bonded to at least the 2-position, or a compound having a tetrazole structure in which a mercapto group is bonded to the 5-position, in which all of the mercapto groups in the molecule are bonded to carbon atoms having unsaturated bonds in the same heterocyclic ring, and the unsaturated carbon to which the mercapto group is bonded is bonded only to a sulfur or nitrogen atom;
is.
本発明によれば、特定の耐候性付与組成物を塗布する工程と特定の条件で熱処理する工程を経ることにより、銀ナノワイヤ含有導電膜の高温高湿条件下での導電性の悪化を従来法より抑制することができる。 According to the present invention, by applying a specific weather resistance-imparting composition and then heat-treating the film under specific conditions, the deterioration of the conductivity of a silver nanowire-containing conductive film under high-temperature, high-humidity conditions can be suppressed more effectively than with conventional methods.
以下、本発明について詳細に説明する。 The present invention is described in detail below.
[基板]
基板は、用途に応じて適宜選択し、堅くてもよく、曲がり易くてもよい。また、着色されていてもよい。本発明における基板は、公知の方法で得られる、あるいは市販品の基板であれば特に限りはなく用いることができる。基板の材料の具体例として、ガラス、ポリイミド、ポリカーボネート、ポリエーテルスルホン、ポリアクリレート、ポリエステル、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリオレフィン、ポリ塩化ビニルが挙げられる。基板には、有機機能性材料および無機機能性材料が、さらに形成されても良い。また、基板は多数積層されても良い。
[substrate]
The substrate may be selected appropriately depending on the application, and may be rigid or flexible. It may also be colored. The substrate in the present invention can be any substrate obtained by a known method or commercially available, and there is no particular limitation. Specific examples of substrate materials include glass, polyimide, polycarbonate, polyethersulfone, polyacrylate, polyester, polyethylene terephthalate, polyethylene naphthalate, polyolefin, and polyvinyl chloride. Organic functional materials and inorganic functional materials may also be formed on the substrate. Multiple substrates may also be laminated.
[銀ナノワイヤ]
本発明における「銀ナノワイヤ」とは、直径が1μm未満であり、アスペクト比(長軸長/直径)が10以上である銀構造体をいう。
[Silver nanowires]
In the present invention, the term "silver nanowire" refers to a silver structure having a diameter of less than 1 μm and an aspect ratio (major axis length/diameter) of 10 or more.
[銀ナノワイヤの直径]
銀ナノワイヤを透明導電膜に用いる場合、透明性を高めるため、ワイヤの平均直径は小さい方が有利であり好ましい。本発明での「銀ナノワイヤの直径」とは、走査型電子顕微鏡(SEM;日本電子株式会社製、JSM-5610LV)を用い、計測した直径をいう。また、「銀ナノワイヤの平均直径」とは、100個の銀ナノワイヤを観察し、計測した直径の平均値をいう。本発明においては、銀ナノワイヤの平均直径として100nm以下が好ましく、40nm以下がより好ましく、30nm以下がさらに好ましく、25nm以下が特に好ましい。一方で、銀ナノワイヤの平均直径が大きい方が高温高湿条件での耐久性が高くなるため、銀ナノワイヤの平均直径は10nm以上が好ましく、15nm以上がさらに好ましい。
[Silver nanowire diameter]
When silver nanowires are used in transparent conductive films, a small average wire diameter is advantageous and preferable in order to enhance transparency. In the present invention, the "diameter of silver nanowires" refers to the diameter measured using a scanning electron microscope (SEM; JSM-5610LV, manufactured by JEOL Ltd.). Furthermore, the "average diameter of silver nanowires" refers to the average diameter measured by observing 100 silver nanowires. In the present invention, the average diameter of silver nanowires is preferably 100 nm or less, more preferably 40 nm or less, even more preferably 30 nm or less, and particularly preferably 25 nm or less. On the other hand, since a larger average diameter of silver nanowires increases durability under high-temperature and high-humidity conditions, the average diameter of silver nanowires is preferably 10 nm or more, and more preferably 15 nm or more.
[銀ナノワイヤの長軸長]
銀ナノワイヤを含有する透明電導膜は、銀ナノワイヤが互いに接触し合い、3次元的な導電ネットワーク構造が空間的に広く分布して形成されることにより、導電性を発現するため、導電性の観点からはナノワイヤの平均長軸長は長いほうが好ましい。一方で、長すぎるナノワイヤは絡まりやすくなるため、分散安定性の観点からは短いナノワイヤが好ましい。本発明での「銀ナノワイヤの長軸長」とは、暗視野顕微鏡(商品名:BX51、オリンパス(株)製)を用い、銀ナノワイヤを撮影し、画像処理ソフトウエア(商品名:Image-Pro Premier、Media Cybernetics, Inc製)を用いて算出した値をいう。また、「銀ナノワイヤの平均長軸長」とは、1000個の銀ナノワイヤを観察し、計測した長軸長の平均値をいう。本発明においては、銀ナノワイヤの平均長軸長として1~100μmが好ましく、3~30μmがより好ましく、7~20μmがさらに好ましい。
[Major axis length of silver nanowires]
Transparent conductive films containing silver nanowires exhibit conductivity due to the silver nanowires contacting each other and forming a three-dimensional conductive network structure that is spatially widely distributed. Therefore, from the viewpoint of conductivity, a longer average major axis length of the nanowires is preferable. On the other hand, nanowires that are too long tend to become tangled, so shorter nanowires are preferable from the viewpoint of dispersion stability. In the present invention, the "major axis length of silver nanowires" refers to a value calculated by photographing silver nanowires using a dark-field microscope (product name: BX51, manufactured by Olympus Corporation) and using image processing software (product name: Image-Pro Premier, manufactured by Media Cybernetics, Inc.). Furthermore, the "average major axis length of silver nanowires" refers to the average value of the major axis lengths measured by observing 1,000 silver nanowires. In the present invention, the average major axis length of silver nanowires is preferably 1 to 100 μm, more preferably 3 to 30 μm, and even more preferably 7 to 20 μm.
[銀ナノワイヤの製造方法]
本発明で用いる銀ナノワイヤの製造方法に特に制限はなく、公知の製造方法で得られたものを用いることができる。その中でも、ポリオール中で成長制御剤とハロゲン化物塩の存在下、銀塩を還元することによって銀ナノワイヤを得る製造方法を用いるのが好ましい。
[Method of manufacturing silver nanowires]
The method for producing the silver nanowires used in the present invention is not particularly limited, and those obtained by known production methods can be used. Among them, it is preferable to use a production method in which silver nanowires are obtained by reducing a silver salt in a polyol in the presence of a growth inhibitor and a halide salt.
[ポリオール]
前記のポリオールとしては、銀イオンを還元できる化合物であれば特に制限はなく、2つ以上の水酸基を有する化合物から少なくとも一種類を目的に応じて適宜選択することができる。特に液体であることや、成長制御剤の溶解のし易さ、といった点から、炭素数が1~5である飽和炭化水素のジオール、炭素数が1~5である飽和炭化水素のトリオールが好ましい。中でも、エチレングリコール、1,2-プロパンジオール(プロピレングリコール)、1,3-プロパンジオール、1,3-ブタンジオール、グリセリンを用いることがより好ましく、プロピレングリコールを用いることがさらに好ましい。
[Polyol]
The polyol is not particularly limited as long as it is a compound capable of reducing silver ions, and at least one type can be appropriately selected from compounds having two or more hydroxyl groups depending on the purpose. In particular, from the viewpoints of being liquid and facilitating the dissolution of the growth regulator, saturated hydrocarbon diols having 1 to 5 carbon atoms and saturated hydrocarbon triols having 1 to 5 carbon atoms are preferred. Among these, ethylene glycol, 1,2-propanediol (propylene glycol), 1,3-propanediol, 1,3-butanediol, and glycerin are more preferred, and propylene glycol is even more preferred.
[成長制御剤]
前記の成長制御剤は、特に制限はなく、少なくとも一種類のポリマーを目的に応じて適宜選択することができる。その中でも特に、ポリビニルピロリドン、ポリN置換(メタ)アクリルアミド、またはそれらの共重合体がより好ましく、ポリビニルピロリドンがさらに好ましい。
[Growth Regulators]
The growth regulator is not particularly limited, and at least one polymer can be appropriately selected depending on the purpose. Among them, polyvinylpyrrolidone, poly(N-substituted (meth)acrylamide), or copolymers thereof are particularly preferred, and polyvinylpyrrolidone is even more preferred.
[ハロゲン化物塩]
前記のハロゲン化物塩は、無機塩あるいは有機塩を極性溶媒中に溶解することによってハロゲン化物イオンを解離する化合物であれば特に制限はなく、少なくとも一種類を目的に応じて適宜選択することができる。特に塩化物塩を用いることで銀ナノワイヤの収率が高くなるため、塩化物塩を用いることが好ましく、臭化物塩を用いることでより直径の小さい銀ナノワイヤが得られるため、塩化物塩と臭化物塩を共に用いることがより好ましい。塩化物塩としては、塩化リチウム、塩化ナトリウム、塩化カリウム、オキシ塩化ジルコニウム、塩化アンモニウム、塩化ベンジルトリエチルアンモニウムを用いることが好ましく、塩化ナトリウムを用いることがさらに好ましい。臭化物塩としては、臭化ナトリウム、臭化カリウム、臭化アンモニウム、臭化テトラブチルアンモニウムを用いることが好ましく、臭化ナトリウムを用いることがさらに好ましい。
[Halide salts]
The halide salt is not particularly limited as long as it is a compound that dissociates halide ions by dissolving an inorganic or organic salt in a polar solvent, and at least one type can be appropriately selected depending on the purpose. The use of chloride salts is particularly preferred because the yield of silver nanowires increases. The use of bromide salts results in silver nanowires with smaller diameters, so it is more preferred to use both chloride salts and bromide salts. Preferred chloride salts include lithium chloride, sodium chloride, potassium chloride, zirconium oxychloride, ammonium chloride, and benzyltriethylammonium chloride, with sodium chloride being more preferred. Preferred bromide salts include sodium bromide, potassium bromide, ammonium bromide, and tetrabutylammonium bromide, with sodium bromide being more preferred.
[銀塩]
前記の銀塩としては、ポリオールによって還元される銀化合物であれば特に制限はなく、少なくとも一種類を目的に応じて適宜選択することができる。その中でもポリオールに対する溶解性や入手容易性の観点から硝酸銀を用いることが好ましい。なお、前記ハロゲン化物塩と銀塩は同一物質で併用しても良い。このような化合物として、例えば、塩化銀や臭化銀を挙げることができる。
[Silver halide]
The silver salt is not particularly limited as long as it is a silver compound that can be reduced by a polyol, and at least one type can be appropriately selected depending on the purpose. Among them, silver nitrate is preferably used from the viewpoints of solubility in polyol and ease of availability. The halide salt and silver salt may be used in combination as the same substance. Examples of such compounds include silver chloride and silver bromide.
[銀ナノワイヤの精製]
前記銀ナノワイヤの製造方法で得られた銀ナノワイヤは、反応液を遠沈法、濾過法、傾瀉法、水簸法、溶媒による沈殿後再分散処理する方法等従来公知の方法により精製してから、分散溶媒を用いて銀ナノワイヤ分散液とすることが好ましい。
[Purification of silver nanowires]
The silver nanowires obtained by the above-described method for producing silver nanowires are preferably purified by a conventionally known method such as centrifugation, filtration, decantation, elutriation, or precipitation in a solvent followed by redispersion treatment, and then a dispersion solvent is used to form a silver nanowire dispersion.
[(A)銀ナノワイヤ分散液を塗布し、銀ナノワイヤ含有導電層を形成する工程]
本発明の銀ナノワイヤ含有導電層を有する導電性積層体を製造する方法は、銀ナノワイヤ分散液を基板上に塗布することで銀ナノワイヤ含有導電層を形成する工程を有する。塗布方法の具体例としては、スピンコート法、スリットコート法、ディップコート法、ブレードコート法、バーコート法、スプレー法、凸版印刷法、凹版印刷法、スクリーン印刷法、平板印刷法、ディスペンス法およびインクジェット法等が挙げられる。また、これらの塗布方法を用いて複数回塗り重ねてもよい。
[(A) Step of applying a silver nanowire dispersion to form a silver nanowire-containing conductive layer]
The method for producing a conductive laminate having a silver nanowire-containing conductive layer of the present invention includes a step of forming a silver nanowire-containing conductive layer by applying a silver nanowire dispersion onto a substrate. Specific examples of the application method include spin coating, slit coating, dip coating, blade coating, bar coating, spraying, letterpress printing, intaglio printing, screen printing, lithographic printing, dispensing, and inkjet printing. These application methods may also be used to apply the silver nanowire-containing conductive layer multiple times.
[銀ナノワイヤ分散液]
本発明の銀ナノワイヤ分散液は、銀ナノワイヤが分散溶媒に分散しているものである。この銀ナノワイヤ分散液には、発明の効果を阻害しない程度に必要に応じて各種の添加剤を添加することができる。添加剤の具体例として、界面活性剤や高分子化合物を挙げることができる。
[Silver nanowire dispersion]
The silver nanowire dispersion of the present invention is one in which silver nanowires are dispersed in a dispersion solvent. Various additives can be added to this silver nanowire dispersion as needed, provided that the effects of the present invention are not impaired. Specific examples of additives include surfactants and polymer compounds.
[銀ナノワイヤ分散液の銀ナノワイヤの濃度]
本発明で用いる銀ナノワイヤ分散液の銀ナノワイヤ濃度は、任意に設定できるが、分散安定性の観点から、5質量%以下であることが好ましく、3質量%以下であることがより好ましく、1質量%以下であることがさらに好ましい。また、銀ナノワイヤ濃度が極端に薄い場合は、塗工時に目的の抵抗値にするために、塗工厚を上げることや、複数回の塗工が必要となるなど使用時の手間が増えるため、生産性の観点から0.01質量%以上であることが好ましく、0.03質量%以上であることがより好ましい。
[Concentration of Silver Nanowires in Silver Nanowire Dispersion]
The silver nanowire concentration of the silver nanowire dispersion used in the present invention can be set arbitrarily, but from the viewpoint of dispersion stability, it is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less. Furthermore, if the silver nanowire concentration is extremely low, in order to achieve the target resistance value during coating, the coating thickness must be increased or multiple coatings must be performed, which increases the effort required during use. Therefore, from the viewpoint of productivity, it is preferably 0.01% by mass or more, and more preferably 0.03% by mass or more.
[分散溶媒]
本発明で用いる分散溶媒は、銀ナノワイヤが分散可能であるとともに、高分子化合物等の銀ナノワイヤ分散液に含まれる各種の添加剤を溶解させる化合物であればよい。また、銀ナノワイヤ分散液は銀ナノワイヤ含有導電層の作成にも用いられることから、分散溶媒は銀ナノワイヤを含む導電層を成膜時に蒸発することで均一な塗膜を形成する化合物であることが好ましい。具体例としては、水、メタノール、エタノール、1-プロパノール、2-プロパノール、1-ブタノール、2-ブタノール、2-メチル-1-プロパノール、2-メチル-2-プロパノール、ジアセトンアルコール等のアルコール類、エチレングリコール、プロピレングリコール、1,3-プロパンジオール、1,3-ブタンジオール、1,4-ブタンジオール等のポリオール類、エチレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテル等のグリコールエーテル類、エチレングリコールジメチルエーテル等のグライム類、エチレングリコールモノメチルエーテルアセテート等のグリコールエーテルエステル類、酢酸エチル等のエステル類、アセトン、メチルエチルケトン等のケトン類、トルエン等の芳香族類、およびこれらの2種類以上からなる溶媒が挙げられる。中でも、成膜時の溶媒の乾燥性と銀ナノワイヤの分散性の観点から、水、水酸基を1つもしくは2つ有する沸点が250度未満の化合物であることが好ましく、水、炭素数1~4のアルコール類、炭素数2~4のジオール類、エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノプロピルエーテル、エチレングリコールモノイソプロピルエーテル、プロピレングリコールモノメチルエーテル、ジアセトンアルコールおよびこれらの2種類以上からなる溶媒を用いるのがより好ましい。
[Dispersion solvent]
The dispersion solvent used in the present invention may be any compound that can disperse silver nanowires and dissolve various additives contained in the silver nanowire dispersion, such as polymer compounds. Furthermore, since the silver nanowire dispersion is also used to prepare a silver nanowire-containing conductive layer, the dispersion solvent is preferably a compound that forms a uniform coating film by evaporating during film formation of the conductive layer containing silver nanowires. Specific examples include water, alcohols such as methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 2-methyl-2-propanol, and diacetone alcohol; polyols such as ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, and 1,4-butanediol; glycol ethers such as ethylene glycol monomethyl ether and propylene glycol monomethyl ether; glymes such as ethylene glycol dimethyl ether; glycol ether esters such as ethylene glycol monomethyl ether acetate; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; aromatics such as toluene; and solvents consisting of two or more of these. Among these, from the viewpoint of the drying property of the solvent during film formation and the dispersibility of the silver nanowires, water and compounds having one or two hydroxyl groups and a boiling point of less than 250°C are preferred, and it is more preferred to use water, alcohols having 1 to 4 carbon atoms, diols having 2 to 4 carbon atoms, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monoisopropyl ether, propylene glycol monomethyl ether, diacetone alcohol, and solvents consisting of two or more of these.
[高分子化合物]
本発明の銀ナノワイヤ分散液には銀ナノワイヤの分散安定性向上や塗工適性の向上の目的で高分子化合物を添加することが好ましい。高分子化合物の具体例としては、メチルセルロース、エチルセルロース、ヒドロキシエチルセルロース、ヒドロキシプロピルセルロース、ヒドロキシプロピルメチルセルロース、カルボキシメチルセルロース、ニトロセルロース、酢酸セルロース、グアーガム、キサンタンガム、タマリンドシードガム、サイリウムシードガム、ガティガム、ローカストビーンガム、ヒドロキシエチルグアーガム、ヒドロキシプロピルグアーガム等の多糖類およびその誘導体、ポリ(メタ)アクリル樹脂、ポリウレタン樹脂、ポリエステル樹脂、アルキッド樹脂、エポキシ樹脂、エチレン酢酸ビニル樹脂、ポリビニルピロリドン等のポリ-N-ビニル化合物、ポリ(メタ)アクリルアミド、ポリN置換(メタ)アクリルアミド、ポリビニルアルコールおよびその誘導体等があげられる。その中でも、メチルセルロース、ヒドロキシエチルセルロース、ヒドロキシプロピルセルロース、ヒドロキシプロピルメチルセルロース、ポリN置換(メタ)アクリルアミド、ポリビニルピロリドンが好ましく、ヒドロキシプロピルメチルセルロース、ポリビニルピロリドンがより好ましい。
[Polymer compound]
It is preferable to add a polymer compound to the silver nanowire dispersion of the present invention for the purpose of improving the dispersion stability of the silver nanowires and improving the coating suitability. Specific examples of the polymer compound include polysaccharides and derivatives thereof, such as methyl cellulose, ethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, hydroxypropyl methylcellulose, carboxymethyl cellulose, nitrocellulose, cellulose acetate, guar gum, xanthan gum, tamarind seed gum, psyllium seed gum, ghatti gum, locust bean gum, hydroxyethyl guar gum, and hydroxypropyl guar gum; poly(meth)acrylic resins, polyurethane resins, polyester resins, alkyd resins, epoxy resins, ethylene vinyl acetate resins, and polyvinylpyrrolidone; poly(meth)acrylamide, poly(N-substituted (meth)acrylamide), polyvinyl alcohol, and derivatives thereof. Among these, methyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, hydroxypropyl methylcellulose, poly(N-substituted (meth)acrylamide), and polyvinylpyrrolidone are preferred, with hydroxypropyl methylcellulose and polyvinylpyrrolidone being more preferred.
[銀ナノワイヤ分散液の高分子化合物の濃度]
銀ナノワイヤ分散液中に含まれる高分子化合物の濃度は、銀ナノワイヤの分散性や塗工適性向上の観点から、0.005質量%以上が好ましく、0.02質量%以上がより好ましく、0.05質量%以上がさらに好ましい。また塗膜の導電性の観点から、高分子化合物の含有量は、5質量%以下が好ましく、1質量%以下がより好ましく、0.4質量%以下がさらに好ましい。
[Concentration of polymer compound in silver nanowire dispersion]
From the viewpoint of improving the dispersibility of silver nanowires and coating suitability, the concentration of the polymer compound contained in the silver nanowire dispersion is preferably 0.005% by mass or more, more preferably 0.02% by mass or more, and even more preferably 0.05% by mass or more. From the viewpoint of the conductivity of the coating film, the content of the polymer compound is preferably 5% by mass or less, more preferably 1% by mass or less, and even more preferably 0.4% by mass or less.
[銀ナノワイヤ含有導電層のシート抵抗]
銀ナノワイヤ含有導電層のシート抵抗は、銀ナノワイヤ含有導電性積層体の導電性の指標として用いられる。銀ナノワイヤ含有導電層のシート抵抗は前記導電層に含まれる銀ナノワイヤの量を変化させることにより、使用する用途に応じて任意に設定することができる。好ましく使用できるシート抵抗の範囲として、0.5Ω/□~1000Ω/□であり、より好ましくは1Ω/□~300Ω/□である。
[Sheet resistance of silver nanowire-containing conductive layer]
The sheet resistance of the silver nanowire-containing conductive layer is used as an indicator of the conductivity of the silver nanowire-containing conductive laminate. The sheet resistance of the silver nanowire-containing conductive layer can be set arbitrarily depending on the intended use by changing the amount of silver nanowires contained in the conductive layer. A preferred usable range of sheet resistance is 0.5 Ω/□ to 1000 Ω/□, more preferably 1 Ω/□ to 300 Ω/□.
[(B)特定の耐候性付与剤を含む耐候性付与組成物を塗布する工程]
本発明の銀ナノワイヤ含有導電層を有する導電性積層体を製造する方法は、後述する特定の耐候性付与剤を含む耐候性付与組成物を塗布する工程を有する。耐候性付与組成物の塗布方法としては、公知な塗布方法を用いることができる。塗布方法の具体例としては、スピンコート法、スリットコート法、ディップコート法、ブレードコート法、バーコート法、スプレー法、凸版印刷法、凹版印刷法、スクリーン印刷法、平板印刷法、ディスペンス法およびインクジェット法等が挙げられる。また、これらの塗布方法を用いて複数回塗り重ねてもよい。
[(B) Step of applying a weather resistance imparting composition containing a specific weather resistance imparting agent]
The method for producing a conductive laminate having a silver nanowire-containing conductive layer of the present invention includes a step of applying a weather resistance-imparting composition containing a specific weather resistance-imparting agent described below. A known application method can be used to apply the weather resistance-imparting composition. Specific examples of application methods include spin coating, slit coating, dip coating, blade coating, bar coating, spraying, letterpress printing, intaglio printing, screen printing, lithographic printing, dispensing, and inkjet printing. These application methods may also be used to apply multiple coats.
[銀ナノワイヤ含有導電性積層体の製造]
銀ナノワイヤ含有導電性積層体は、基板と、銀ナノワイヤ含有導電層を有する積層体であって、さらに耐候性付与組成物を塗布する工程を経て得られる積層体である。耐候性付与組成物は銀ナノワイヤ含有導電膜と接触することによって本発明の効果を最大限発揮できるため(A)工程の後に塗布し、さらに直接銀ナノワイヤ含有導電膜の上に塗布することが好ましい。本発明で得られる導電性積層体の効果を阻害しない程度であれば、他の組成物を銀ナノワイヤ含有導電膜の上に塗布した後、耐候性付与組成物を塗布してもよい。
[Production of silver nanowire-containing conductive laminate]
The silver nanowire-containing conductive laminate is a laminate having a substrate and a silver nanowire-containing conductive layer, and is obtained by further applying a weather resistance-imparting composition. Because the weather resistance-imparting composition can maximize the effects of the present invention by contacting the silver nanowire-containing conductive film, it is preferable to apply the weather resistance-imparting composition after step (A) and then directly onto the silver nanowire-containing conductive film. As long as the effects of the conductive laminate obtained by the present invention are not impaired, the weather resistance-imparting composition may be applied after applying another composition onto the silver nanowire-containing conductive film.
[耐候性付与組成物]
耐候性付与組成物は、後述する特定の耐候性付与剤を含む組成物である。耐候性付与組成物には、さらに必要に応じて、溶媒、樹脂、ならびに後述するその他添加剤を含むことができる。本発明の耐候性付与剤は銀ナノワイヤと相互作用することによって効果を発現していると考えられるため遷移金属錯体または遷移金属イオンは少ない方が好ましいと考えられる。そのため、耐候性付与組成物中に含まれる遷移金属錯体または遷移金属イオンの濃度は0.01%未満が好ましく、0.0001%未満がより好ましく、実質的に含まないのがより好ましい。実質的に含まないとは、添加された遷移金属錯体または遷移金属イオンがないことを意味する。本発明では、耐候性付与組成物を基板と銀ナノワイヤ含有導電層を含む導電性積層体に塗布する工程を含む。
[Weather resistance imparting composition]
The weather resistance-imparting composition is a composition containing a specific weather resistance-imparting agent, which will be described later. The weather resistance-imparting composition may further contain a solvent, a resin, and other additives, as necessary. It is believed that the weather resistance-imparting agent of the present invention exerts its effect by interacting with the silver nanowires, and therefore it is believed that a small amount of transition metal complex or transition metal ion is preferable. Therefore, the concentration of transition metal complex or transition metal ion contained in the weather resistance-imparting composition is preferably less than 0.01%, more preferably less than 0.0001%, and even more preferably substantially free. "Substantially free" means that no transition metal complex or transition metal ion has been added. The present invention includes a step of applying the weather resistance-imparting composition to a conductive laminate including a substrate and a silver nanowire-containing conductive layer.
[耐候性付与剤]
耐候性付与剤は、主に、銀ナノワイヤ含有導電層を化学的に保護する目的で用いられる。本発明で用いる耐候性付与剤はメルカプト基を1~3個有する化合物または2-アミノチアゾール誘導体であり、分子量は80~400の範囲である。分子量が80~400であるメルカプト基を1~3個有する化合物の中でも、炭素数8~20のアルカンチオール、少なくとも2位にメルカプト基が結合している、イミダゾール、2-イミダゾリン、チアゾール、2-チアゾリン、1,3,4-チアジアゾール、ピリミジン、1,3,5-トリアジンから選ばれる複素環構造を持つ化合物、5位にメルカプト基が結合しているテトラゾール構造を持つ化合物がより好ましく用いることができる。
[Weather resistance additive]
The weather resistance imparting agent is primarily used for the purpose of chemically protecting the silver nanowire-containing conductive layer. The weather resistance imparting agent used in the present invention is a compound having 1 to 3 mercapto groups or a 2-aminothiazole derivative, and has a molecular weight in the range of 80 to 400. Among compounds having 1 to 3 mercapto groups and a molecular weight of 80 to 400, alkanethiols having 8 to 20 carbon atoms, compounds having a heterocyclic structure with a mercapto group bonded to at least the second position and selected from imidazole, 2-imidazoline, thiazole, 2-thiazoline, 1,3,4-thiadiazole, pyrimidine, and 1,3,5-triazine, and compounds having a tetrazole structure with a mercapto group bonded to the fifth position are more preferably used.
炭素数8~20のアルカンチオールは、1つのメルカプト基に不飽和結合やヘテロ原子を含む官能基を持たないアルキル基が結合した化合物であり、耐候性付与剤として制限なく用いることができる。アルカンチオールは、分子内に持つメルカプト基が銀に配位することによって耐候性を付与していると考えられるため、メルカプト基周辺が立体的に込み合っていない1級のアルカンチオールがより好ましく用いることができ、直鎖のアルカンチオールがさらに好ましく用いることができる。 Alkanethiols with 8 to 20 carbon atoms are compounds in which one mercapto group is bonded to an alkyl group that does not contain unsaturated bonds or functional groups containing heteroatoms, and can be used without restriction as weather resistance additives. It is believed that alkanethiols impart weather resistance by the mercapto group in the molecule coordinating with silver, so primary alkanethiols that are not sterically crowded around the mercapto group are more preferred, and straight-chain alkanethiols are even more preferred.
少なくとも2位にメルカプト基が結合している、イミダゾール、2-イミダゾリン、チアゾール、2-チアゾリン、1,3,4-チアジアゾール、ピリミジン、1,3,5-トリアジンから選ばれる複素環構造を持つ化合物、または、5位にメルカプト基が結合しているテトラゾールから選ばれる複素環構造を持つ化合物は、分子量が80~400の範囲であって、分子内のメルカプト基が1~3個であれば、耐候性付与剤として制限なく用いることができる。メルカプト基は互変異性体のチオカルボニル構造となっていてもよい。その中でも、分子内にあるメルカプト基がすべて同一複素環内の不飽和結合を有する炭素に結合している化合部が好ましく、メルカプト基が結合している不飽和炭素は硫黄または窒素原子とのみ結合している化合物がさらに好ましい。具体例としては、2-メルカプト-1-メチルイミダゾール、2-メルカプトベンゾイミダゾール、2-メルカプト-5-メチルベンゾイミダゾール、2-イミダゾリンチオン、2-メルカプトチアゾール、ロダニン、2-メルカプトベンゾチアゾール、5-クロロ-2-メルカプトベンゾチアゾール、2-メルカプトチアゾリン、5-メチル-1,3,4-チアジアゾール-2-チオール、2-メルカプトピリミジン、2-チオウラシル、6-メチル-2-チオウラシル、2-チオバルビツール酸、チオシアヌル酸、6-(ジブチルアミノ)-1,3,5-トリアジン-2,4-ジチオール、5-メルカプト-1-フェニル-1H-テトラゾール等が挙げられる。その中でも、複素環上に、水素、アルキル基、フェニル基、ヒドロキシル基、アルコキシル基、アミノ基、(ジ)アルキルアミノ基、ニトロ基、アルコキシカルボニル基、フルオロ基、クロロ基、メルカプト基から選ばれる置換基のみを有する化合物がより好ましく用いることができる。Compounds with a heterocyclic structure selected from imidazole, 2-imidazoline, thiazole, 2-thiazoline, 1,3,4-thiadiazole, pyrimidine, and 1,3,5-triazine, each having a mercapto group bonded to at least the second position, or compounds with a heterocyclic structure selected from tetrazole and having a mercapto group bonded to the fifth position, can be used without restriction as weather resistance additives, as long as they have a molecular weight in the range of 80 to 400 and contain one to three mercapto groups in the molecule. The mercapto group may be in the form of a tautomer, a thiocarbonyl structure. Among these, compounds in which all mercapto groups in the molecule are bonded to carbon atoms with unsaturated bonds in the same heterocyclic ring are preferred, and compounds in which the unsaturated carbon atoms to which mercapto groups are bonded are bonded only to sulfur or nitrogen atoms are even more preferred. Specific examples include 2-mercapto-1-methylimidazole, 2-mercaptobenzimidazole, 2-mercapto-5-methylbenzimidazole, 2-imidazolinethione, 2-mercaptothiazole, rhodanine, 2-mercaptobenzothiazole, 5-chloro-2-mercaptobenzothiazole, 2-mercaptothiazoline, 5-methyl-1,3,4-thiadiazole-2-thiol, 2-mercaptopyrimidine, 2-thiouracil, 6-methyl-2-thiouracil, 2-thiobarbituric acid, thiocyanuric acid, 6-(dibutylamino)-1,3,5-triazine-2,4-dithiol, and 5-mercapto-1-phenyl-1H-tetrazole. Among these, compounds having only substituents selected from hydrogen, an alkyl group, a phenyl group, a hydroxyl group, an alkoxyl group, an amino group, a (di)alkylamino group, a nitro group, an alkoxycarbonyl group, a fluoro group, a chloro group, and a mercapto group on a heterocycle can be more preferably used.
本発明の2-アミノチアゾール誘導体は、分子量が80~400の範囲であって、2-アミノチアゾール骨格を有し、2位のアミノ基が1級アミノ基である化合物であれば、耐候性付与剤として制限なく用いることができる。具体例としては、2-アミノチアゾール、2-アミノ-4-メチルチアゾール、2-アミノ-5-メチルチアゾール、2-アミノ-5-ニトロチアゾール、2-アミノチアゾール-4-カルボン酸メチル、2-アミノベンゾチアゾール、2-アミノ-6-メトキシベンゾチアゾール等が挙げられる。その中でも、2-アミノチアゾール、もしくは、2-アミノベンゾチアゾールの芳香環上に、水素、アルキル基、フェニル基、ヒドロキシル基、アルコキシル基、アミノ基、(ジ)アルキルアミノ基、ニトロ基、アルコキシカルボニル基、フルオロ基、クロロ基から選ばれる置換基のみを有する2-アミノチアゾール誘導体が好ましく、2-アミノチアゾール、または、2-アミノベンゾチアゾールがより好ましく、2-アミノチアゾールがさらに好ましく用いることができる。The 2-aminothiazole derivative of the present invention can be used without limitation as a weather resistance additive, as long as it has a molecular weight in the range of 80 to 400, a 2-aminothiazole skeleton, and a primary amino group at the 2-position. Specific examples include 2-aminothiazole, 2-amino-4-methylthiazole, 2-amino-5-methylthiazole, 2-amino-5-nitrothiazole, 2-aminothiazole-4-methylcarboxylate, 2-aminobenzothiazole, and 2-amino-6-methoxybenzothiazole. Among these, 2-aminothiazole or a 2-aminothiazole derivative having only a substituent selected from hydrogen, an alkyl group, a phenyl group, a hydroxyl group, an alkoxyl group, an amino group, a (di)alkylamino group, a nitro group, an alkoxycarbonyl group, a fluoro group, or a chloro group on the aromatic ring of 2-aminobenzothiazole is preferred, with 2-aminothiazole or 2-aminobenzothiazole being more preferred, and 2-aminothiazole being even more preferred.
[耐候性付与剤の分子量]
本発明の耐候性付与剤の分子量は80~400の範囲であるが、分子量が小さいほど、単位重量当たりの分子数が増えるため、必要な添加量を少なくすることができると考えられるため、耐候性付与剤の分子量は350以下がより好ましく、300以下がさらに好ましい。
[Molecular weight of weather resistance agent]
The molecular weight of the weather resistance imparting agent of the present invention is in the range of 80 to 400. It is considered that the smaller the molecular weight, the greater the number of molecules per unit weight, and therefore the smaller the necessary amount to be added can be, and therefore the molecular weight of the weather resistance imparting agent is more preferably 350 or less, and even more preferably 300 or less.
耐候性付与組成物には、耐候性付与組成物の塗布性や組成物中の成分を溶解させる観点から溶媒を含むことが好ましい。溶媒は組成物中の他の成分を溶解させ、製膜時に蒸発することで均一な塗膜を形成する化合物であればよい。溶媒の具体例として、水、メタノール、エタノール、1-プロパノール、2-プロパノール、アセトン、メチルエチルケトン、トルエン、n-ヘキサン、1-ブタノール、ジアセトンアルコール、メチルイソブチルケトン、シクロヘキサノン、酢酸エチル、酢酸ブチル、プロピレングリコールモノメチルエーテルアセテート、エチレングリコールモノエチルエーテル、プロピレングリコールモノメチルエーテル、ジエチレングリコールジエチルエーテル、1,3-ブチレングリコールジアセテート、シクロヘキサノールアセテート、プロピレングリコールジアセテート、テトラヒドロフラン等が挙げられる。その中でも、メタノール、エタノール、1-プロパノール、2-プロパノール、1-ブタノール、ジアセトンアルコール、プロピレングリコールモノメチルエーテル、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン、酢酸エチル、酢酸ブチル、トルエン、テトラヒドロフラン等を用いるのが好ましい。これらは1種または2種以上を組合せて用いることができる。 The weather resistance-imparting composition preferably contains a solvent from the perspective of improving the coatability of the weather resistance-imparting composition and dissolving the components in the composition. The solvent may be any compound that dissolves the other components in the composition and forms a uniform coating film by evaporating during film formation. Specific examples of solvents include water, methanol, ethanol, 1-propanol, 2-propanol, acetone, methyl ethyl ketone, toluene, n-hexane, 1-butanol, diacetone alcohol, methyl isobutyl ketone, cyclohexanone, ethyl acetate, butyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol diethyl ether, 1,3-butylene glycol diacetate, cyclohexanol acetate, propylene glycol diacetate, and tetrahydrofuran. Among these, it is preferable to use methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, diacetone alcohol, propylene glycol monomethyl ether, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl acetate, butyl acetate, toluene, tetrahydrofuran, etc. These can be used alone or in combination of two or more.
耐候性付与組成物には、更に樹脂を含有することができる。耐候性付与組成物に樹脂を含むことにより、耐候性付与組成物に銀ナノワイヤ含有積層体の物理的な保護機能を持たせることができるため好ましい。樹脂は、耐候性付与組成物の溶媒に溶解し、本発明の効果を阻害しないものであれば限定はなく用いることができる。樹脂の具体例としては、エチルセルロース等の多糖類およびその誘導体、ポリ(メタ)アクリル樹脂、ポリウレタン樹脂、ポリエステル樹脂、エポキシ樹脂、ポリビニルピロリドン等のポリ-N-ビニル化合物、ポリビニルアルコールおよびその誘導体等があげられる。その中でも耐水性の観点から非水溶性ポリマーであることが好ましく、例えば、非水溶性のポリ(メタ)アクリル樹脂、ポリウレタン樹脂、ポリエステル樹脂、エチルセルロース、ポリビニルアセタール等が挙げられる。これらは1種または2種以上を組合せて用いることができる。The weather resistance-imparting composition may further contain a resin. Including a resin in the weather resistance-imparting composition is preferable because it can provide the weather resistance-imparting composition with the physical protection function of the silver nanowire-containing laminate. Any resin can be used as long as it dissolves in the solvent of the weather resistance-imparting composition and does not impair the effects of the present invention. Specific examples of resins include polysaccharides such as ethyl cellulose and their derivatives, poly(meth)acrylic resins, polyurethane resins, polyester resins, epoxy resins, poly-N-vinyl compounds such as polyvinylpyrrolidone, polyvinyl alcohol and its derivatives, etc. Among these, water-insoluble polymers are preferred from the perspective of water resistance, such as water-insoluble poly(meth)acrylic resins, polyurethane resins, polyester resins, ethyl cellulose, and polyvinyl acetal. These can be used alone or in combination of two or more.
耐候性付与組成物には、更に重合性モノマーおよび/またはマクロモノマーを含有することができる。耐候性付与組成物に重合性モノマーおよび/またはマクロモノマーを含み、さらに後述する硬化工程を経ることにより、銀ナノワイヤ含有積層体の物理的な保護機能を持たせることができるため好ましい。耐候性付与組成物に重合性モノマーおよび/またはマクロモノマーを含む場合には、さらに光重合開始剤を含むことが好ましい。The weather resistance-imparting composition may further contain a polymerizable monomer and/or a macromonomer. This is preferable because the weather resistance-imparting composition contains a polymerizable monomer and/or a macromonomer and is then subjected to the curing process described below, thereby providing the silver nanowire-containing laminate with a physical protective function. When the weather resistance-imparting composition contains a polymerizable monomer and/or a macromonomer, it is preferable that the weather resistance-imparting composition further contains a photopolymerization initiator.
[光重合開始剤]
光重合開始剤は特に限定なく、公知の方法で得られる、あるいは市販品の光重合開始剤を用いることができる。光重合開始剤の具体例としては、1-ヒドロキシシクロヘキシルフェニルケトン、ジエトキシアセトフェノン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾイル安息香酸、ベンゾイル安息香酸メチル、2-メチル-1-[4-(メチルチオ)フェニル]-2-(4-モルホリニル)-1-プロパノン、キサントン、アントラキノン、2-メチルアントラキノン等が挙げられる。これらは1種または2種以上を組合せて用いることができる。
[Photopolymerization initiator]
The photopolymerization initiator is not particularly limited, and can be obtained by a known method, or a commercially available photopolymerization initiator can be used. Specific examples of the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoylbenzoic acid, methyl benzoylbenzoate, 2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholinyl)-1-propanone, xanthone, anthraquinone, and 2-methylanthraquinone. These can be used alone or in combination of two or more.
[重合性モノマーおよびマクロモノマー]
重合性モノマーおよびマクロモノマーとしては、可視光、または紫外線や電子線のような電離放射線の照射により直接または開始剤の作用を受けて重合反応を生じるモノマーおよびマクロモノマーであれば、特に限定はなく用いることができる。1分子中に1個の重合性不飽和基を有する重合性モノマーの具体例としては、(メタ)アクリル酸、メチル(メタ)アクリレート、エチル(メタ)アクリレート、ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、メトキシ-ジエチレングリコール(メタ)アクリレート、メトキシ-トリエチレングリコール(メタ)アクリレート等の(メタ)アクリル酸エステル類;(メタ)アリルアルコール、グリセロールモノ(メタ)アリルエーテル等の(メタ)アリル化合物;スチレン、メチルスチレン、ブチルスチレン等の芳香族ビニル類;酢酸ビニル等のカルボン酸ビニルエステル類;(メタ)アクリルアミド、N-シクロヘキシル(メタ)アクリルアミド、N-フェニル(メタ)アクリルアミド、N-(2-ヒドロキシエチル)(メタ)アクリルアミド等の(メタ)アクリルアミド類が挙げられる。また、1分子中に2個以上の重合性不飽和基を有する重合性モノマーの具体例としては、ポリエチレングリコールジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジトリメチロールプロパンテトラ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、アルキル変性ジペンタエリスリトール(メタ)アクリレート、エチレンオキサイド変性ビスフェノールAジ(メタ)アクリレート、エチレンオキサイド変性トリメチロールプロパントリ(メタ)アクリレート、プロピレンオキサイド変性トリメチロールプロパントリ(メタ)アクリレート、エチレンオキサイド変性イソシアヌル酸トリ(メタ)アクリレート等が挙げられる。マクロモノマーの具体例としては、1分子あたり平均1個以上重合性不飽和基を有する重合性ウレタンアクリレート樹脂、重合性ポリウレタン樹脂、重合性アクリル樹脂、重合性エポキシ樹脂、重合性ポリエステル樹脂、を用いることができる。これらは1種または2種以上を組合せて用いることができる。
[Polymerizable Monomers and Macromonomers]
The polymerizable monomers and macromonomers that can be used are not particularly limited as long as they undergo a polymerization reaction when irradiated with visible light or ionizing radiation such as ultraviolet light or electron beams, either directly or through the action of an initiator. Specific examples of polymerizable monomers having one polymerizable unsaturated group per molecule include (meth)acrylic acid esters such as (meth)acrylic acid, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, phenoxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, methoxy-diethylene glycol (meth)acrylate, and methoxy-triethylene glycol (meth)acrylate; (meth)allyl compounds such as (meth)allyl alcohol and glycerol mono(meth)allyl ether; aromatic vinyls such as styrene, methylstyrene, and butylstyrene; carboxylic acid vinyl esters such as vinyl acetate; and (meth)acrylamides such as (meth)acrylamide, N-cyclohexyl(meth)acrylamide, N-phenyl(meth)acrylamide, and N-(2-hydroxyethyl)(meth)acrylamide. Specific examples of polymerizable monomers having two or more polymerizable unsaturated groups in one molecule include polyethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, alkyl-modified dipentaerythritol (meth)acrylate, ethylene oxide-modified bisphenol A di(meth)acrylate, ethylene oxide-modified trimethylolpropane tri(meth)acrylate, propylene oxide-modified trimethylolpropane tri(meth)acrylate, and ethylene oxide-modified isocyanuric acid tri(meth)acrylate. Specific examples of macromonomers that can be used include polymerizable urethane acrylate resins, polymerizable polyurethane resins, polymerizable acrylic resins, polymerizable epoxy resins, and polymerizable polyester resins, each of which has an average of one or more polymerizable unsaturated groups per molecule, and these can be used alone or in combination of two or more.
[耐候性付与組成物中の耐候性付与剤の含有量]
本発明で用いる耐候性付与組成物中の耐候性付与剤の含有量は、任意に設定できるが、耐候性付与組成物に樹脂や重合性モノマーおよび/またはマクロモノマーを含む場合、銀ナノワイヤ含有導電膜への物理的な保護機能と耐候性付与剤による高温高湿耐性向上の観点から、耐候性付与組成物中に含まれる耐候性付与剤の溶質に占める割合が0.001%~5%が好ましく、0.01%~3%がより好ましく、0.02%~1.5%がさらに好ましい。耐候性付与組成物中に含まれる耐候性付与剤の溶質に占める割合は、耐候性付与組成物中に含まれる全溶質の質量に対する耐候性付与剤の質量から求めることができる。
[Content of weather resistance imparting agent in weather resistance imparting composition]
The content of the weather resistance-imparting agent in the weather resistance-imparting composition used in the present invention can be set as desired, but when the weather resistance-imparting composition contains a resin, a polymerizable monomer, and/or a macromonomer, from the viewpoints of the physical protection function for the silver nanowire-containing conductive film and the improvement of high-temperature, high-humidity resistance by the weather resistance-imparting agent, the proportion of the weather resistance-imparting agent in the solutes in the weather resistance-imparting composition is preferably 0.001% to 5%, more preferably 0.01% to 3%, and even more preferably 0.02% to 1.5%. The proportion of the weather resistance-imparting agent in the solutes in the weather resistance-imparting composition can be determined from the mass of the weather resistance-imparting agent relative to the mass of all solutes in the weather resistance-imparting composition.
[その他の添加剤]
耐候性付与組成物には、本発明の効果を阻害しない範囲内で各種の添加剤を添加することができる。添加剤としては、例えば、有機の微粒子、難燃剤、難燃助剤、耐酸化安定剤、レベリング剤、滑り賦活剤、帯電防止剤、染料、充填剤などを用いることができる。
[Other additives]
Various additives may be added to the weather resistance-imparting composition within the range that does not impair the effects of the present invention. Examples of additives that can be used include organic fine particles, flame retardants, flame retardant assistants, oxidation stabilizers, leveling agents, slip enhancers, antistatic agents, dyes, and fillers.
[重合性モノマーおよび/またはマクロモノマーを硬化させる工程]
耐候性付与組成物に重合性モノマーおよび/またはマクロモノマーを含む場合、耐候性付与組成物を塗布後に重合性モノマーおよび/またはマクロモノマーを硬化させる工程を含む。重合性モノマーおよび/またはマクロモノマーを硬化させる工程は、重合性モノマーおよび/またはマクロモノマーを含む耐候性付与組成物を塗布後に光を照射することによって実施され、その方法は公知の方法を用いることができる。特に紫外線を用いて光硬化することが好ましい。光を照射する光源は、光重合開始剤の種類によって任意に選択することができ、例えば、高圧水銀ランプ、キセノンランプ、メタルハライドランプ、LED等が挙げられる。
[Step of curing polymerizable monomer and/or macromonomer]
When the weather resistance-imparting composition contains a polymerizable monomer and/or a macromonomer, the method includes a step of curing the polymerizable monomer and/or macromonomer after applying the weather resistance-imparting composition. The step of curing the polymerizable monomer and/or macromonomer is carried out by applying the weather resistance-imparting composition containing the polymerizable monomer and/or macromonomer and then irradiating it with light, and a known method can be used for this. In particular, photocuring using ultraviolet light is preferred. The light source for irradiating light can be selected as desired depending on the type of photopolymerization initiator, and examples include a high-pressure mercury lamp, a xenon lamp, a metal halide lamp, and an LED.
[(C)導電性積層体を熱処理する工程]
本発明において、銀ナノワイヤ含有導電性積層体は耐候性付与組成物の塗布後に後述する条件で熱処理を施すことにより、良好な高温高湿耐性を得ることができる。熱処理のタイミングは耐候性付与組成物の塗布後であれば任意に設定できるが、耐候性付与組成物に重合性モノマーおよび/またはマクロモノマーを含む場合は、(B)工程と(C)工程の間に重合性モノマーおよび/またはマクロモノマーを硬化させる工程を含むことが好ましい。また、早期に銀ナノワイヤ含有導電層の保護機能を高めるという観点から、銀ナノワイヤ含有導電層のエッチングによるパターニング前に熱処理を行うことが好ましい。耐候性付与組成物の塗布後、または、重合性モノマーおよび/またはマクロモノマーを硬化させる工程の後に追加で後述する銀ナノワイヤとは異なる金属層等の、銀ナノワイヤ含有導電層と耐候性付与組成物の層以外の複数の層を積層することも可能であるが、その場合、銀ナノワイヤとは異なる金属層を形成する前に熱処理を行うことが好ましく、追加で層形成を行う前に熱処理を行うことがさらに好ましい。
[(C) Step of Heat-treating the Conductive Laminate]
In the present invention, the silver nanowire-containing conductive laminate can be provided with good high-temperature, high-humidity resistance by heat treatment under the conditions described below after application of the weathering resistance-imparting composition. The timing of the heat treatment can be set arbitrarily as long as it is performed after application of the weathering resistance-imparting composition. However, if the weathering resistance-imparting composition contains a polymerizable monomer and/or a macromonomer, it is preferable to include a step of curing the polymerizable monomer and/or macromonomer between steps (B) and (C). Furthermore, from the viewpoint of quickly enhancing the protective function of the silver nanowire-containing conductive layer, it is preferable to perform the heat treatment before patterning the silver nanowire-containing conductive layer by etching. After application of the weathering resistance-imparting composition or after the step of curing the polymerizable monomer and/or macromonomer, it is also possible to laminate multiple layers other than the silver nanowire-containing conductive layer and the layer of the weathering resistance-imparting composition, such as an additional metal layer other than the silver nanowires described below. In this case, it is preferable to perform the heat treatment before forming the metal layer other than the silver nanowires, and it is even more preferable to perform the heat treatment before forming any additional layers.
[金属層]
銀ナノワイヤ含有導電性積層体には銀ナノワイヤ含有導電層とは異なる金属層を設けることができる。金属層は、例えば、銀ナノワイヤ含有導電層を回路に電気接続するための電極部として用いることができ、この場合、金属層は基板に銀ナノワイヤ含有導電層を形成した後に形成することができる。金属層を銀ナノワイヤ含有導電層形成後に作成する場合、耐候性付与組成物の塗布後、かつ、本発明の熱処理後に金属層を形成することが好ましい。金属層に好適に用いることができる金属としては、銅、銀、金、ニッケル等の金属及び合金材料が挙げられる。
[Metal layer]
The silver nanowire-containing conductive laminate can be provided with a metal layer different from the silver nanowire-containing conductive layer. The metal layer can be used, for example, as an electrode portion for electrically connecting the silver nanowire-containing conductive layer to a circuit. In this case, the metal layer can be formed after forming the silver nanowire-containing conductive layer on the substrate. When forming the metal layer after forming the silver nanowire-containing conductive layer, it is preferable to form the metal layer after applying the weather resistance-imparting composition and after the heat treatment of the present invention. Examples of metals that can be suitably used for the metal layer include metals and alloy materials such as copper, silver, gold, and nickel.
[導電性積層体の熱処理条件]
本発明では、銀ナノワイヤ含有導電性積層体に良好な高温高湿耐性を与えるためには、40℃~120℃の温度範囲で30分以上の時間、熱処理を実施する必要がある。40℃よりも熱処理温度が低い場合、良好な高温高湿耐性を得ることができず、120℃よりも熱処理温度が高い場合、基板や銀ナノワイヤ導電層が劣化してしまうおそれがある。また、熱処理は高い温度で長い時間処理することにより、より良好な高温高湿耐性を得られるため、上記条件に加え、下式(1)で定義されるαの値が100以上となる条件が好ましく、500以上がより好ましく、1500以上がさらに好ましい。一方で、熱処理のαの値は小さい方が基材などの導電性積層体に含まれる成分の劣化や省エネの観点を考えると有利であるため、αの値は1000000以下が好ましく、100000以下がより好ましい。
α=t×e0.08×(T-40) … (1)
t:熱処理時間(分)
T:熱処理温度(℃)
式(1)から分かるように、熱処理温度が高い方が短時間の熱処理で好ましいαの値の条件を満たすことができるため、熱処理温度は50℃以上が好ましく、60℃以上がさらに好ましい。一方で、熱処理温度が低い方が銀ナノワイヤ含有導電性積層体に含まれる基板や他の層に耐熱性の低い材料を利用できるため、熱処理温度は100℃以下が好ましく、80℃以下がより好ましい。また、熱処理を高湿条件で実施した場合、熱処理による高温高湿耐性を与える前に高温高湿条件にさらされることになってしまうため、熱処理を高湿条件で実施することは避けるべきである。このことから熱処理条件における絶対湿度は200g/m3以下であることが好ましく、100g/m3以下であることがより好ましく、50g/m3以下であることがさらに好ましい。
[Heat treatment conditions for conductive laminate]
In the present invention, in order to impart good high-temperature, high-humidity resistance to the silver nanowire-containing conductive laminate, it is necessary to perform heat treatment for 30 minutes or more at a temperature ranging from 40°C to 120°C. Heat treatment temperatures lower than 40°C do not provide good high-temperature, high-humidity resistance, while heat treatment temperatures higher than 120°C may result in deterioration of the substrate and the silver nanowire conductive layer. Furthermore, since better high-temperature, high-humidity resistance can be obtained by performing heat treatment at a high temperature for a long time, in addition to the above conditions, conditions are preferably such that the value of α defined by the following formula (1) is 100 or more, more preferably 500 or more, and even more preferably 1500 or more. On the other hand, a smaller α value for heat treatment is advantageous in terms of preventing deterioration of components contained in the conductive laminate, such as the substrate, and saving energy, so the value of α is preferably 1,000,000 or less, more preferably 100,000 or less.
α=t×e 0.08×(T-40) … (1)
t: heat treatment time (min)
T: Heat treatment temperature (°C)
As can be seen from formula (1), a higher heat treatment temperature allows the preferable α value to be satisfied in a shorter heat treatment time, so the heat treatment temperature is preferably 50°C or higher, and more preferably 60°C or higher. On the other hand, a lower heat treatment temperature allows the use of materials with low heat resistance for the substrate and other layers contained in the silver nanowire-containing conductive laminate, so the heat treatment temperature is preferably 100°C or lower, and more preferably 80°C or lower. Furthermore, if the heat treatment is performed under high-humidity conditions, the product will be exposed to high-temperature, high-humidity conditions before the high-temperature, high-humidity resistance provided by the heat treatment can be imparted, so heat treatment under high-humidity conditions should be avoided. For this reason, the absolute humidity under the heat treatment conditions is preferably 200 g/ m³ or lower, more preferably 100 g/ m³ or lower, and even more preferably 50 g/ m³ or lower.
本発明の製造方法により、高温高湿条件下での導電性の悪化が従来のものより抑制されている導電性積層体を得ることができる。本発明において、導電性積層体の導電性の変化は下式(2)で与えられる抵抗値変化率(%)を算出することにより評価することができる。抵抗値変化率(%)の数値が低いほど高温高湿条件下での導電性の悪化が抑制されており導電性積層体の性能が高いことを意味する。シート抵抗変化率は35%未満が好ましく、25%未満がより好ましく、15%未満がさらに好ましく、10%未満が特に好ましい。導電性積層体のシート抵抗の測定は、非接触式表面抵抗率測定器EC-80P(ナプソン(株)製)等を用いることで行うことができる。
(r2-r1)/r1×100 (%) … (2)
r1:高温高湿試験前の導電性積層体の平均シート抵抗
r2:高温高湿試験後の導電性積層体の平均シート抵抗
The manufacturing method of the present invention can provide a conductive laminate in which deterioration of conductivity under high-temperature, high-humidity conditions is suppressed compared to conventional laminates. In the present invention, the change in conductivity of the conductive laminate can be evaluated by calculating the resistance change rate (%) given by the following formula (2). The lower the resistance change rate (%), the more suppressed the deterioration of conductivity under high-temperature, high-humidity conditions is, and the higher the performance of the conductive laminate is. The sheet resistance change rate is preferably less than 35%, more preferably less than 25%, even more preferably less than 15%, and particularly preferably less than 10%. The sheet resistance of the conductive laminate can be measured using a non-contact surface resistivity meter EC-80P (manufactured by Napson Corporation) or the like.
(r2-r1)/r1×100 (%) … (2)
r1: average sheet resistance of the conductive laminate before high-temperature, high-humidity test r2: average sheet resistance of the conductive laminate after high-temperature, high-humidity test
本発明の製造方法により得られた銀ナノワイヤ含有導電性積層体は、例えば液晶ディスプレイ用電極材、有機ELディスプレイ用電極材、電子ペーパー用電極材、タッチパネル用電極材、色素増感太陽電池用電極材、ペロブスカイト太陽電池用電極材、電磁波シールド材、帯電防止材等の各種デバイスに幅広く適用することができる。 The silver nanowire-containing conductive laminate obtained by the manufacturing method of the present invention can be widely used in various devices, such as electrode materials for liquid crystal displays, electrode materials for organic EL displays, electrode materials for electronic paper, electrode materials for touch panels, electrode materials for dye-sensitized solar cells, electrode materials for perovskite solar cells, electromagnetic wave shielding materials, and antistatic materials.
以下、本発明の実施例に基づいて具体的に説明するが、本発明はこれらの実施例に限定されるものではない。 The present invention will be explained in detail below based on examples, but the present invention is not limited to these examples.
<銀ナノワイヤの作成>
(合成例1)
攪拌装置、温度計、窒素導入管を具備した四つ口フラスコに窒素を送入しながら、1.0質量%のポリビニルピロリドン(BASF社製、Sokalan(登録商標)K90P)のプロピレングリコール溶液666.97質量部、濃度1.5質量%の塩化ナトリウムのプロピレングリコール溶液5.35質量部、濃度2.2質量%の臭化ナトリウムのプロピレングリコール溶液1.87質量部およびプロピレングリコール162.95質量部を加え、室温で30分間攪拌した。次いで、内温を145℃まで昇温した後、2,5-ジメチル-4-ヒドロキシ-3(2H)-フラノン1.06質量部、イオン交換水4.80質量部およびプロピレングリコール30質量部を混合し溶解させた溶液を加え、10分間撹拌した。その後、内温を145℃で保持しながら濃度5.5質量%の硝酸銀のプロピレングリコール溶液127質量部を90分間かけて加え、さらに30分間攪拌した。その後、得られた溶液を冷却することにより、銀ナノワイヤを含む反応液を得た。
<Creating silver nanowires>
(Synthesis Example 1)
A stirrer, a thermometer, and a four-neck flask equipped with a nitrogen inlet tube were charged with nitrogen and 666.97 parts by mass of a 1.0% by mass polyvinylpyrrolidone (BASF, Sokalan (registered trademark) K90P) propylene glycol solution, 5.35 parts by mass of a 1.5% by mass sodium chloride propylene glycol solution, 1.87 parts by mass of a 2.2% by mass sodium bromide propylene glycol solution, and 162.95 parts by mass of propylene glycol were added and stirred at room temperature for 30 minutes. The internal temperature was then raised to 145 ° C., and a solution of 1.06 parts by mass of 2,5-dimethyl-4-hydroxy-3(2H)-furanone, 4.80 parts by mass of ion-exchanged water, and 30 parts by mass of propylene glycol was added and stirred for 10 minutes. Thereafter, 127 parts by mass of a propylene glycol solution of silver nitrate with a concentration of 5.5% by mass was added over 90 minutes while maintaining the internal temperature at 145° C., and the mixture was stirred for an additional 30 minutes. The resulting solution was then cooled to obtain a reaction solution containing silver nanowires.
[銀ナノワイヤ分散液の調製]
銀ナノワイヤを含む反応液1000質量部に水3000質量部を加えて希釈し、メンブレンフィルターで吸引濾過した。さらに残渣上に水を加えて吸引濾過を5回繰り返し、再度水を加えることで0.15質量%の粗精製銀ナノワイヤ分散液を得た。得られた粗精製銀ナノワイヤ分散液を遠心分離機を用いて2000rpmの回転数で10分間処理し、残った上澄みを採取することにより、相対的に直径の大きい銀ナノワイヤを取り除いた。得られた上澄み液はメンブレンフィルターを用いて濃縮し、含有量0.7質量%の銀ナノワイヤ分散液(a)を調製した。得られた銀ナノワイヤは平均長軸長12μm、平均直径25nmであった。ポリ容器に、0.7質量%の銀ナノワイヤ分散液(a)8.57質量部、0.5質量%のヒドロキシプロピルメチルセルロース(ダウ・ケミカル(株)製、メトセル311)水溶液2.40質量部、0.1質量%の1,10-フェナントロリン一水和物の水溶液0.06質量部、イオン交換水8.89質量部、1-プロパノール0.08質量部を仕込んだ後、ふたを閉め、振蕩機で5分間混ぜることにより、銀ナノワイヤ濃度が0.3質量%の銀ナノワイヤ分散液(b)を調製した。
[Preparation of silver nanowire dispersion]
1000 parts by mass of the reaction solution containing silver nanowires was diluted with 3000 parts by mass of water and then suction filtered through a membrane filter. Water was then added to the residue, and suction filtration was repeated five times. Water was then added again to obtain a 0.15% by mass crude silver nanowire dispersion. The obtained crude silver nanowire dispersion was centrifuged at 2000 rpm for 10 minutes, and the remaining supernatant was collected to remove silver nanowires with relatively large diameters. The obtained supernatant was concentrated using a membrane filter to prepare a 0.7% by mass silver nanowire dispersion (a). The obtained silver nanowires had an average major axis length of 12 μm and an average diameter of 25 nm. A plastic container was charged with 8.57 parts by mass of a 0.7% by mass silver nanowire dispersion (a), 2.40 parts by mass of a 0.5% by mass aqueous solution of hydroxypropylmethylcellulose (Methocel 311, manufactured by The Dow Chemical Company), 0.06 parts by mass of a 0.1% by mass aqueous solution of 1,10-phenanthroline monohydrate, 8.89 parts by mass of ion-exchanged water, and 0.08 parts by mass of 1-propanol, and the container was then closed with the lid and mixed for 5 minutes on a shaker to prepare a silver nanowire dispersion (b) with a silver nanowire concentration of 0.3% by mass.
(実施例1)
[(A)銀ナノワイヤ分散液を塗布し、銀ナノワイヤ含有導電層を形成する工程]
銀ナノワイヤ分散液(b)を、膜厚100μmのポリエチレンテレフタレートフィルム(PETフィルム、東レ(株)製、商品名「ルミラー(登録商標)U403」)上に、No.7のワイヤーバーを用いて均一に塗布し、120℃の熱風対流式乾燥機で2分間乾燥することにより銀ナノワイヤ含有導電層を作成した。
Example 1
[(A) Step of applying a silver nanowire dispersion to form a silver nanowire-containing conductive layer]
The silver nanowire dispersion liquid (b) was uniformly applied onto a 100 μm-thick polyethylene terephthalate film (PET film, manufactured by Toray Industries, Inc., product name "Lumirror (registered trademark) U403") using a No. 7 wire bar, and the applied film was dried for 2 minutes in a hot air convection dryer at 120°C to form a silver nanowire-containing conductive layer.
四つ口フラスコに、重合性モノマーおよびマクロモノマーとしてジペンタエリスリトールヘキサアクリレート57.1質量部、トリメチロールプロパントリアクリレート14.3質量部、光重合開始剤として1-ヒドロキシシクロヘキシルフェニルケトン3.6質量部、溶媒としてジアセトンアルコール25質量部を仕込んだ後、均一な溶液になるまで攪拌し、重合性モノマーおよび/またはマクロモノマーを含む組成物(c)を調製した。 A four-neck flask was charged with 57.1 parts by mass of dipentaerythritol hexaacrylate and 14.3 parts by mass of trimethylolpropane triacrylate as polymerizable monomers and macromonomers, 3.6 parts by mass of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator, and 25 parts by mass of diacetone alcohol as a solvent, and the mixture was stirred until a homogeneous solution was obtained, thereby preparing composition (c) containing polymerizable monomers and/or macromonomers.
[耐候性付与組成物の調製]
ポリ容器に、上記組成物(c)1.32質量部、耐候性付与剤として1質量%の2-メルカプトチアゾリンのジアセトンアルコール溶液1.2質量部、溶媒として1-ブタノール17.48質量部を仕込んだ後、均一な溶液になるまで攪拌し、耐候性付与組成物(d)を調製した。
[Preparation of Weather Resistance Imparting Composition]
A plastic container was charged with 1.32 parts by mass of the composition (c), 1.2 parts by mass of a 1% by mass solution of 2-mercaptothiazoline in diacetone alcohol as a weather resistance imparting agent, and 17.48 parts by mass of 1-butanol as a solvent, and the mixture was stirred until a uniform solution was obtained, thereby preparing a weather resistance imparting composition (d).
[(B)特定の耐候性付与剤を含む耐候性付与組成物を塗布する工程]
耐候性付与組成物(d)を上記の通り作成した銀ナノワイヤ含有導電層上にスピンコート法(3000rpm30秒)により均一に塗布し、70℃の熱風対流式乾燥機で2分間乾燥した。その後、紫外線照射装置UV1501C-SZ(センエンジニアリング(株)製)を用いて、PET基板上に、上方から500mJ/cm2の条件でUV光を照射することで重合性モノマーおよび/またはマクロモノマーを硬化させ、導電性積層体(e)を得た。
[(B) Step of applying a weather resistance imparting composition containing a specific weather resistance imparting agent]
The weather resistance-imparting composition (d) was uniformly applied to the silver nanowire-containing conductive layer prepared as described above by spin coating (3000 rpm for 30 seconds) and dried for 2 minutes in a hot air convection dryer at 70° C. Thereafter, the PET substrate was irradiated with UV light from above at 500 mJ/ cm2 using an ultraviolet irradiation device UV1501C-SZ (manufactured by Sen Engineering Co., Ltd.), thereby curing the polymerizable monomer and/or macromonomer, and a conductive laminate (e) was obtained.
[(C)導電性積層体を熱処理する工程]
導電性積層体(e)を80℃の熱風対流式乾燥機で30分間熱処理を行い、導電性積層体(f)を得た。本熱処理は、加湿処理を行っておらず、また、30℃以下での飽和水蒸気量は50g/m3以下であることから、絶対湿度50g/m3以下の熱処理条件となっている。
[(C) Step of Heat-treating the Conductive Laminate]
Conductive laminate (e) was heat-treated for 30 minutes in a hot air convection dryer at 80°C to obtain conductive laminate (f). This heat treatment was not performed with humidification, and the saturated water vapor amount at 30°C or below was 50 g/ m³ or less, so the heat treatment conditions were an absolute humidity of 50 g/ m³ or less.
(実施例2~18、比較例1~5)
表1に記載のように耐候性付与組成物(d)を作成し、表2に記載のように熱処理条件を変更する以外は実施例1と同様にして銀ナノワイヤ含有導電性積層体を作成した。
(Examples 2 to 18, Comparative Examples 1 to 5)
A weather resistance imparting composition (d) was prepared as shown in Table 1, and a silver nanowire-containing conductive laminate was prepared in the same manner as in Example 1, except that the heat treatment conditions were changed as shown in Table 2.
(実施例19)
0.1質量%の2-メルカプトチアゾリンの1-ブタノール溶液を実施例1の(A)工程において作成されたものと同様の銀ナノワイヤ含有導電層上にスピンコート法(3000rpm30秒)により均一に塗布し、70℃の熱風対流式乾燥機で2分間乾燥し、導電性積層体を得た。その後、表2に記載のように熱処理条件を変更する以外は実施例1と同様にして銀ナノワイヤ含有導電性積層体を作成した。
Example 19
A 0.1% by mass solution of 2-mercaptothiazoline in 1-butanol was uniformly applied by spin coating (3000 rpm for 30 seconds) onto the same silver nanowire-containing conductive layer as that prepared in step (A) of Example 1, and then dried for 2 minutes in a hot air convection dryer at 70°C to obtain a conductive laminate. Thereafter, a silver nanowire-containing conductive laminate was prepared in the same manner as in Example 1, except that the heat treatment conditions were changed as shown in Table 2.
(実施例20)
実施例19で用いた0.1質量%の2-メルカプトチアゾリンの1-ブタノール溶液を1質量%の2-アミノチアゾールの1-ブタノール溶液に変更した以外は実施例19と同様にして銀ナノワイヤ含有導電性積層体を作成した。
(Example 20)
A silver nanowire-containing conductive laminate was prepared in the same manner as in Example 19, except that the 0.1 mass% 1-butanol solution of 2-mercaptothiazoline used in Example 19 was changed to a 1 mass% 1-butanol solution of 2-aminothiazole.
(実施例21)
ポリ容器に、非水溶性のポリマーとして10質量%のエチルセルロース(Ashland社製、Aqualon EC N-10)のトルエンと1-ブタノールの7:3溶液9.9質量部、耐候性付与剤として1質量%の2-メルカプトチアゾリンの1-ブタノール溶液1.0質量部、溶媒としてトルエン7.0質量部と1-ブタノール3.0質量部を仕込んだ後、均一な溶液になるまで攪拌して耐候性付与組成物を調整した。この耐候性付与組成物を、実施例19で用いた0.1質量%の2-メルカプトチアゾリンの1-ブタノール溶液の代わりに用いる以外は実施例19と同様にして銀ナノワイヤ含有導電性積層体を作成した。
(Example 21)
A weather resistance-imparting composition was prepared by charging a plastic container with 9.9 parts by mass of a 7:3 solution of 10% by mass ethyl cellulose (Aqualon EC N-10, manufactured by Ashland) as a water-insoluble polymer, 1.0 part by mass of a 1% by mass solution of 2-mercaptothiazoline in 1-butanol as a weather resistance-imparting agent, and 7.0 parts by mass of toluene and 3.0 parts by mass of 1-butanol as a solvent, and stirring until a uniform solution was obtained. A silver nanowire-containing conductive laminate was produced in the same manner as in Example 19, except that this weather resistance-imparting composition was used instead of the 0.1% by mass solution of 2-mercaptothiazoline in 1-butanol used in Example 19.
(実施例22)
ポリ容器に、非水溶性のポリマーとして50質量%のアクリル樹脂溶液(DIC(株)製、アクリディックWXU-880-BA)1.98質量部、耐候性付与剤として1質量%の2-メルカプトチアゾリンの酢酸ブチル溶液1.0質量部、溶媒として酢酸ブチル17.02質量部を仕込んだ後、均一な溶液になるまで攪拌して耐候性付与組成物を調整した。この耐候性付与組成物を、実施例19で用いた0.1質量%の2-メルカプトチアゾリンの1-ブタノール溶液の代わりに用いる以外は実施例19と同様にして銀ナノワイヤ含有導電性積層体を作成した。
Example 22
A weather resistance-imparting composition was prepared by charging a plastic container with 1.98 parts by mass of a 50% by mass acrylic resin solution (manufactured by DIC Corporation, Acrydic WXU-880-BA) as a water-insoluble polymer, 1.0 part by mass of a 1% by mass solution of 2-mercaptothiazoline in butyl acetate as a weather resistance-imparting agent, and 17.02 parts by mass of butyl acetate as a solvent, and then stirring until a homogeneous solution was obtained. A silver nanowire-containing conductive laminate was produced in the same manner as in Example 19, except that this weather resistance-imparting composition was used instead of the 0.1% by mass solution of 2-mercaptothiazoline in 1-butanol used in Example 19.
実施例1~22、比較例1~5で作成した導電性積層体に対し以下の方法で高温高湿試験を行い、高温高湿試験前後の抵抗値変化率の算出結果を表2にあわせて記載した。
[高温高湿試験]
導電性積層体(f)を寸法縦3cm×横10cmに切断した。続いて、光学弾性樹脂(3M(株)製、商品名8146-2、膜厚50μm)を片面のセパレータを剥がして貼り合せたガラス基板(アズワン(株)製、ソーダガラス製スライドガラス)の残る片面のセパレータを剥がし、導電性積層体のPET基板とは反対の面に光学弾性樹脂が配置されるように貼り合わせ、ガラス基板からはみ出した導電性積層体の部分をカッターで切り落とし、PETフィルム、とガラスの間に銀ナノワイヤ含有導電層が配置されたサンプル片を得た。その後、恒温恒湿器試験機(いすゞ製作所製、TPAV-48-20)を用いて、85℃85%RHの環境下で1000時間静置することにより、高温高湿試験を行った。
[抵抗値変化率の算出]
高温高湿試験前後で、サンプル片のPETフィルム面側から異なる5部位のシート抵抗(Ω/□)を測定し、その算術平均値から高温高湿試験前後の導電性積層体の平均シート抵抗と、下式(2)で与えられる抵抗値変化率を求めた。シート抵抗の測定には、非接触式表面抵抗率測定器EC-80P(ナプソン(株)製)を用いた。
(r2-r1)/r1×100 (%) … (2)
r1:高温高湿試験前の導電性積層体の平均シート抵抗
r2:高温高湿試験後の導電性積層体の平均シート抵抗
シート抵抗変化率は本発明においては少なくとも35%未満であることが求められ、25%未満がより好ましく、15%未満がさらに好ましく、10%未満が特に好ましい。
The conductive laminates produced in Examples 1 to 22 and Comparative Examples 1 to 5 were subjected to a high-temperature, high-humidity test by the following method, and the calculated results of the rate of change in resistance value before and after the high-temperature, high-humidity test are also shown in Table 2.
[High temperature and humidity test]
The conductive laminate (f) was cut into a size of 3 cm length x 10 cm width. Subsequently, the separator on one side of a glass substrate (a soda glass slide glass made by AS ONE Corporation) to which an optically elastic resin (manufactured by 3M Corporation, product name 8146-2, film thickness 50 μm) had been peeled off was peeled off, and the conductive laminate was bonded so that the optically elastic resin was disposed on the side opposite the PET substrate. The portion of the conductive laminate that protruded from the glass substrate was cut off with a cutter, yielding a sample piece in which a silver nanowire-containing conductive layer was disposed between the PET film and the glass. Thereafter, a high-temperature, high-humidity test was performed by leaving the sample standing for 1,000 hours in an environment of 85°C and 85% RH using a thermo-hygrostat tester (manufactured by Isuzu Motors, TPAV-48-20).
[Calculation of Resistance Change Rate]
The sheet resistance (Ω/□) was measured at five different locations on the PET film side of the sample piece before and after the high-temperature, high-humidity test, and the average sheet resistance of the conductive laminate before and after the high-temperature, high-humidity test and the rate of change in resistance given by the following formula (2) were calculated from the arithmetic mean value. A non-contact surface resistivity meter EC-80P (manufactured by Napson Co., Ltd.) was used to measure the sheet resistance.
(r2-r1)/r1×100 (%) … (2)
r1: average sheet resistance of the conductive laminate before high-temperature, high-humidity test; r2: average sheet resistance of the conductive laminate after high-temperature, high-humidity test. In the present invention, the rate of change in sheet resistance is required to be at least less than 35%, more preferably less than 25%, even more preferably less than 15%, and particularly preferably less than 10%.
実施例1~22は本発明で規定した耐候性付与剤を含む耐候性付与組成物を塗布し、本発明で規定した加熱処理条件を付しているため、本発明で規定した耐候性付与組成物の塗布を行っていない比較例1や、本発明で規定した熱処理条件を行っていない比較例2、3、4、本発明で規定した耐候性付与剤を用いていない比較例4,5と比べ得られた導電性積層体の高温高湿試験後の抵抗値変化率が抑えられていることがわかる。 In Examples 1 to 22, a weather resistance-imparting composition containing the weather resistance-imparting agent specified in the present invention was applied and the heat treatment conditions specified in the present invention were applied. Therefore, it can be seen that the rate of change in resistance value after high-temperature, high-humidity testing of the resulting conductive laminate was reduced compared to Comparative Example 1, in which the weather resistance-imparting composition specified in the present invention was not applied, Comparative Examples 2, 3, and 4, in which the heat treatment conditions specified in the present invention were not applied, and Comparative Examples 4 and 5, in which the weather resistance-imparting agent specified in the present invention was not used.
実施例3と比べ実施例1、2、4~6は、熱処理条件のαの値がより好ましい範囲にあるため、得られた導電性積層体の高温高湿試験後の抵抗値変化率をより抑制できており、実施例1、5と比べ実施例2、4、6はさらにαの値が好ましい範囲にあるため、得られた導電性積層体の高温高湿試験後の抵抗値変化率をさらに抑制できていることがわかる。 Compared to Example 3, Examples 1, 2, 4 to 6 have a heat treatment condition α value that is in a more preferred range, so the rate of change in resistance of the resulting conductive laminate after high-temperature, high-humidity testing is more effectively suppressed. Compared to Examples 1 and 5, Examples 2, 4 and 6 have an even more preferred α value range, so the rate of change in resistance of the resulting conductive laminate after high-temperature, high-humidity testing is even more effectively suppressed.
実施例16と比べ実施例9は、耐候性付与剤の溶質に占める割合がより好ましい範囲にあるため、得られた導電性積層体の高温高湿試験後の抵抗値変化率をより抑制できていることがわかる。 Compared to Example 16, Example 9 has a more preferable range of the proportion of the weather resistance agent in the solute, and therefore it can be seen that the rate of change in resistance of the resulting conductive laminate after high-temperature, high-humidity testing is more suppressed.
実施例9、21、22で作成した導電性積層体(f)のPET基板とは反対の面に、100g荷重をかけながらベンコット(登録商標)M-1(旭化成(株)製)を5往復させたのち、導電性積層体の表面を目視で観察し、剥がれの有無を確認した。実施例9、21、22で作成した導電性積層体では剥がれは確認できなかった。樹脂や重合性モノマーおよび/またはマクロモノマーを含む実施例9、21、22では十分な導電性積層体の耐擦過性が得られることがわかる。 Bencott (registered trademark) M-1 (manufactured by Asahi Kasei Corporation) was reciprocated five times while applying a load of 100 g to the surface of the conductive laminate (f) prepared in Examples 9, 21, and 22 opposite the PET substrate, and the surface of the conductive laminate was then visually inspected to check for peeling. No peeling was observed in the conductive laminates prepared in Examples 9, 21, and 22. It can be seen that the conductive laminates prepared in Examples 9, 21, and 22, which contain a resin, polymerizable monomer, and/or macromonomer, exhibit sufficient abrasion resistance.
Claims (7)
(A)銀ナノワイヤ分散液を塗布し、銀ナノワイヤ含有導電層を形成する工程と、
(B)耐候性付与剤として分子量80~400のメルカプト基を1~3個有する化合物または2-アミノチアゾール誘導体を含む耐候性付与組成物を塗布する工程を有し、
(A)工程の後にB工程を有する導電性積層体を製造する方法であって、
(B)工程の後に、
(C)40℃~120℃の温度で30分以上熱処理する工程
を含み、下記の(イ)の条件を満たすことを特徴とする導電性積層体の製造方法。
(イ)前記C工程の熱処理の温度T(℃)と時間t(分)によってあらわされる下式(1)で定義されるαが500以上100000以下である。
α=t×e 0.08×(T-40) …(1) A method for manufacturing a conductive laminate having a substrate and a silver nanowire-containing conductive layer, comprising:
(A) applying a silver nanowire dispersion to form a silver nanowire-containing conductive layer;
(B) applying a weather resistance-imparting composition containing a compound having a molecular weight of 80 to 400 and having 1 to 3 mercapto groups or a 2-aminothiazole derivative as a weather resistance-imparting agent;
A method for producing a conductive laminate, comprising step (A) followed by step (B),
After step (B),
(C) A method for producing a conductive laminate, comprising a step of heat treating at a temperature of 40°C to 120°C for 30 minutes or longer, and satisfying the following condition (A):
(a) The value α defined by the following formula (1) expressed by the temperature T (° C.) and time t (minutes) of the heat treatment in the step C is 500 or more and 100,000 or less.
α=t×e 0.08×(T-40) …(1)
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016507400A (en) | 2012-12-13 | 2016-03-10 | ケアストリーム ヘルス インク | Anticorrosive for transparent conductive film |
| WO2015008676A1 (en) | 2013-07-19 | 2015-01-22 | 星光Pmc株式会社 | Silver nanowire aqueous dispersion having excellent storage stability and method for manufacturing same |
| WO2016093120A1 (en) | 2014-12-08 | 2016-06-16 | 日東電工株式会社 | Transparent conductive film with adhesive layer |
| CN108447584A (en) | 2018-03-15 | 2018-08-24 | 合肥微晶材料科技有限公司 | A method of so that nano silver wire conductive film is suitable for etching technics |
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