JP7726770B2 - Support member placement determination device, support member placement determination method, support member placement determination program, and recording medium - Google Patents

Description

This invention relates to technology for determining the placement of support members that support a board on which components are mounted in a component mounter.

Conventionally, component mounters are known that mount components on a board by transferring components supplied by a feeder onto the board using a mounting head. In such component mounters, backup pins are arranged on the underside of the board and support the board. Patent Documents 1 and 2 propose techniques for determining the placement of backup pins. In particular, Patent Document 1 determines the placement of backup pins while avoiding components mounted on the back surface (bottom surface) of the board. Patent Document 2 displays a superimposed image in which an image of the front surface (top surface) of the board is superimposed on an image of the back surface (bottom surface), and the worker determines the placement of the backup pins by checking this superimposed image and specifying the positions of the backup pins.

Japanese Patent Application Laid-Open No. 2017-216415 WO2004/103054

However, with component mounters like those described above, it is necessary to firmly support the board against the force applied to it when the mounting head mounts components in the component mounting area on the front surface of the board. In contrast, in Patent Document 1, the placement of support members is determined only by taking into account the components mounted on the back surface of the board, leaving room for improvement in this regard. Furthermore, in Patent Document 2, the placement of support members can be determined based on images of both the front and back surfaces of the board, addressing this issue. However, this requires the operator to determine the placement of support members while checking the images, placing a significant burden on the operator.

This invention was developed in consideration of the above-mentioned problems, and aims to make it possible to determine the placement of support members that can firmly support a board against the forces applied to the board when mounting components in the component mounting area of the board, without placing any burden on the worker.

The support member placement determination device according to the present invention includes a data acquisition unit that acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite the first surface, the component mounting area being provided as an area for mounting components, and a placement determination unit that determines, based on the component mounting area, the placement of a support member that supports the board by abutting the second surface from below with the first surface facing upward.

The support member placement determination method according to the present invention includes a step in which a data acquisition unit acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite the first surface, the component mounting area being set as an area for mounting components; and a step in which a placement determination unit determines, based on the component mounting area, the placement of a support member that supports the board by abutting the second surface from below with the first surface facing upward.

The support member placement determination program of the present invention causes a computer to function as a support member placement determination device that includes a data acquisition unit that acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite the first surface, the component mounting area being set up as an area for mounting components, and a placement determination unit that determines, based on the component mounting area, the placement of a support member that supports the board by abutting the second surface from below with the first surface facing upward.

The recording medium according to the present invention records the support member placement determination program in a computer-readable manner.

In the inventions configured in this manner (support member placement determination device, support member placement determination method, support member placement determination program, and recording medium), the board has a first surface and a second surface opposite the first surface. The data acquisition unit acquires board configuration information indicating a component mounting area on the first surface of the board, which is set up as an area for mounting components. Furthermore, the placement determination unit determines the placement of support members that support the board by abutting the second surface from below with the first surface facing upward, based on the component mounting area. In other words, the placement of support members that support the board is determined independently of the worker, based on the component mounting area on the first surface of the board where the components are to be mounted. Therefore, it is possible to determine the placement of support members that can firmly support the board against the force applied to the board when mounting components in the component mounting area, without imposing any burden on the worker.

The support member placement determination device may also be configured so that the board configuration information indicates component sizes, which are the sizes of components to be mounted in the component mounting areas, and the placement determination unit determines the placement of support members based on the component mounting areas and component sizes. With this configuration, the board can be firmly supported by support members whose placement is determined based on the sizes of components to be mounted in the component mounting areas of the board.

The support member placement determination device may also be configured so that the placement determination unit determines that the support member should be placed so that it abuts against the second surface at a large support position facing a component mounting area where components larger than a predetermined standard size are mounted. With this configuration, the support member can firmly support the board against the force applied to the board when a large component is mounted on the board.

The support member placement determination device may also be configured so that the large support position is a position opposite the center of the component mounting area where components larger than a predetermined standard size are mounted. This allows the support member to more firmly support the board against the force applied to the board when a large component is mounted on the board.

The support member placement determination device may also be configured so that the placement determination unit virtually divides the second surface into a plurality of grids and determines to place the support members so that they abut against the second surface at small support positions inside the grids that overlap with component mounting areas where components whose component size is equal to or smaller than a predetermined standard are mounted. With this configuration, the support members can firmly support the board against the force applied to the board when small components are mounted on the board.

The support member placement determination device may also be configured so that the small support position is a position opposite the center of a grid that overlaps with a component mounting area where components whose component size is equal to or smaller than a predetermined standard are mounted. This allows the support member to more firmly support the board against the force applied to the board when small components are mounted on the board.

The support member placement determination device may also be configured so that the small support position is a position inside a grid that overlaps the center of the component mounting area where components whose component size is equal to or smaller than a predetermined standard are mounted. This allows the support member to more firmly support the board against the force applied to the board when small components are mounted on the board.

The support member placement determination device may also be configured so that the placement determination unit sets a plurality of candidate positions arranged two-dimensionally on the second surface, selects a target position from the plurality of candidate positions where the support member abutting the second surface at the candidate position is spaced apart from both the support member abutting the second surface at the large support position and the support member abutting the second surface at the small support position, and determines to place the support member so that it abuts the second surface at the target position. This allows further support members to be placed while preventing interference with support members placed according to component mounting areas where large or small components are mounted, and allows the board to be firmly supported by a large number of support members.

The support member placement determination device may also be configured so that the board configuration information indicates boundary areas including slits provided in the board or dividing lines for dividing the board, and the placement determination unit virtually divides the second surface into multiple ranges based on the boundary areas, and performs a placement determination process for each of the multiple ranges to determine the placement of support members that abut the second surface at a position facing one target range of the multiple ranges in accordance with the component mounting area within the target range. With this configuration, the placement of support members for each range divided by boundary areas such as slits or dividing lines can be determined based on the component mounting area within that range, allowing each range divided by the boundary areas to be firmly supported by the support members.

The support member placement determination device may also be configured so that the placement determination unit determines representative positions that represent the positions of each component mounting area within the target range, and determines that the support members will be placed so that they abut the second surface at representative support positions that face the representative positions. In this configuration, the board can be firmly supported by the support members at representative support positions that face the representative positions that represent the positions of component mounting areas in each range divided by the boundary areas.

The support member placement determination device may also be configured so that the board configuration information includes component volume, which is the volume of the component to be mounted in the component mounting area, and the placement determination unit determines the representative support position based on the component mounting area and the component volume. With this configuration, the board can be firmly supported by the support members at the representative support position that reflects the component volume.

The support member placement determination device may also be configured so that the board configuration information includes component weight, which is the weight of the component to be mounted in the component mounting area, and the placement determination unit determines the representative support position based on the component mounting area and the component weight. With this configuration, the board can be firmly supported by the support members at the representative support position that reflects the component weight.

The support member placement determination device may also be configured so that the placement determination unit sets a plurality of candidate positions arranged two-dimensionally on the second surface, selects a target position from the plurality of candidate positions where the support member contacting the second surface at the candidate position is spaced apart from the support member contacting the second surface at the representative support position, and determines to place the support member so that the support member contacts the second surface at the target position. This allows further support members to be placed while preventing interference with the support member supporting the substrate at the representative support position, and enables the substrate to be securely supported by a large number of support members.

The support member placement determination device may also be configured so that the board configuration information indicates support prohibition areas including slits in the board, dividing lines for dividing the board, or component presence areas on the second surface where components are mounted, and the placement determination unit determines not to place support members in positions opposite support prohibition areas. This configuration can prevent support members from being placed in support prohibition areas such as slits or dividing lines on the board.

The support member placement determination device may also be configured so that the placement determination unit sets a temporary placement position where the support member that abuts the second surface is to be placed based on the component mounting area, and if the temporary placement position does not overlap with the support prohibited area, determines to place the support member at the temporary placement position, but if the temporary placement position overlaps with the support prohibited area, determines to place the support member at a position that has a predetermined positional relationship with the temporary placement position within an area away from the support prohibited area. With this configuration, the support member can be placed near the support prohibited area while avoiding support prohibited areas such as slits and parting lines on the board, allowing the support member to firmly support the board.

As described above, the present invention makes it possible to determine the placement of support members that can firmly support a board against the forces applied to the board when mounting components in the component mounting area of the board, without placing any burden on the worker.

FIG. 1 is a partial plan view schematically showing a component mounter according to the present invention. FIG. 2 is a front view schematically showing a part of the component mounter of FIG. 1 . FIG. 2 is a block diagram showing an example of a component mounting system including the component mounter of FIG. 1 . FIG. 4 is a perspective view schematically showing the contents indicated by board configuration information. 10 is a flowchart showing a first example of pin placement determination. FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5 . FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5 . FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5 . FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5 . FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5 . 10 is a flowchart showing a second example of pin placement determination. FIG. 8 is a plan view schematically showing the contents of calculations executed in the second example of pin placement determination in FIG. 7 . FIG. 8 is a plan view schematically showing the contents of calculations executed in the second example of pin placement determination in FIG. 7 . FIG. 8 is a plan view schematically showing the contents of calculations executed in the second example of pin placement determination in FIG. 7 . 10 is a flowchart showing an example of a prohibited area evacuation arrangement. FIG. 10 is a plan view schematically showing the contents of the calculation executed in the prohibited area save arrangement of FIG. 9 .

Figure 1 is a partial plan view showing a component mounter according to the present invention, and Figure 2 is a front view showing a portion of the component mounter shown in Figure 1. In Figure 1 and the following figures, the horizontal X direction, the horizontal Y direction perpendicular to the X direction, and the vertical Z direction are indicated as appropriate.

As shown in FIG. 1, the component mounter 1 has a pair of conveyors 12, 12 mounted on a base 11. Each conveyor 12 is composed of a belt conveyor arranged parallel to the X direction, and transports the board 9 in the X direction. Specifically, the component mounter 1 mounts components onto the board 9 that has been transported by the conveyor 12 from the upstream side in the X direction (board transport direction) to a work position P (the position of the board 9 in FIG. 1), and then transports the board 9, after component mounting has been completed, from the work position P to the downstream side in the X direction by the conveyor 12.

Two component supply units 25 are lined up in the X direction on each side of the pair of conveyors 12, 12 in the Y direction, and each component supply unit 25 has multiple tape feeders 26 lined up in the X direction. Each tape feeder 26 is provided with a component supply reel wound with component storage tape that stores small pieces of components E, such as integrated circuits, transistors, and capacitors, at a predetermined pitch. Each tape feeder 26 intermittently feeds out the component storage tape pulled out from the component supply reel, supplying components E to the component supply position at the tip of the tape.

The component mounter 1 is also provided with a pair of Y-axis rails 21, 21 extending in the Y direction, a Y-axis ball screw 22 extending in the Y direction, and a Y-axis motor My that rotates and drives the Y-axis ball screw 22. An X-axis rail 23 is supported on the pair of Y-axis rails 21, 21 so as to be movable in the Y direction and is fixed to the nut of the Y-axis ball screw 22. An X-axis ball screw 24 extending in the X direction and an X-axis motor Mx that rotates and drives the X-axis ball screw 24 are attached to the X-axis rail 23. The head unit 3 is supported on the X-axis rail 23 so as to be movable in the X direction and is fixed to the nut of the X-axis ball screw 24. Therefore, the Y-axis motor My can rotate the Y-axis ball screw 22 to move the head unit 3 in the Y direction, or the X-axis motor Mx can rotate the X-axis ball screw 24 to move the head unit 3 in the X direction.

The head unit 3 has multiple (six) mounting heads 31 lined up in the X direction. Furthermore, the head unit 3 has a Z-axis motor (not shown) for each mounting head 31 that raises and lowers the mounting head 31. Each mounting head 31 has an elongated shape that extends in the Z direction (vertical direction), and has a detachable nozzle at its bottom end for suctioning components. Component mounting is then performed by the mounting head 31 as follows:

That is, the X-axis motor Mx and Y-axis motor My position the nozzle of the mounting head 31 to face the component E supplied to the component supply position from above. Next, the Z-axis motor lowers the mounting head 31, bringing the nozzle into contact with the component E supplied to the component supply position by the tape feeder 26. The mounting head 31 then applies negative pressure to the nozzle to adsorb the component E to the nozzle, and the Z-axis motor raises the mounting head 31. Once the mounting head 31 has finished picking up the component E from the component supply position, the X-axis motor Mx and Y-axis motor My move the mounting head 31 above the board 9. The Z-axis motor then lowers the mounting head 31, bringing the component E adsorbed by the nozzle of the mounting head 31 into contact with the top surface of the board 9. Next, the mounting head 31 releases the component E from adsorption and mounts it on the board 9.

When the mounting head 31 brings the component E into contact with the board 9, a force is applied to the board 9 in the component mounting area where the component E and the board 9 come into contact. Therefore, the component mounter 1 uses backup pins 4 to support the board 9 from below against the force applied to the component mounting area. Specifically, as shown in FIG. 2 , the board 9 has a work surface 91 and a non-work surface 92 opposite the work surface 91. The board 9 is supported at the work position P by the conveyor 12 with the work surface 91 facing upward and the non-work surface 92 facing downward. The component mounter 1 includes a pin placement table 27 below the board 9 supported at the work position P. The pin placement surface 271 (upper surface) of the pin placement table 27 faces the board 9 from below. A backup pin 4 is placed on the pin placement surface 271 of the pin placement table 27 and supported on the pin placement surface 271 by, for example, magnetic force. In this way, the upper ends 41 of the backup pins 4 arranged on the pin arrangement surface 271 abut against the non-work surface 92 of the board 9 from below, thereby supporting the board 9. The mounting head 31 mounts the component E on the work surface 91 of the board 9 supported by the backup pins 4 in the above-described procedure.

The mounter 1 also includes a pin stocker 28 that stores backup pins 4. The mounting head 31 transfers the backup pins 4 picked up from the pin stocker 28 onto the pin placement surface 271, thereby placing the backup pins 4 on the pin placement surface 271. On the other hand, the mounting head 31 transfers the backup pins 4 picked up from the pin placement surface 271 onto the pin stocker 28, thereby recovering the backup pins 4 in the pin stocker 28. The mounting head 31 may hold the backup pins 4 not by suction with a nozzle, but by gripping them with a suction chuck that opens and closes using pressure (negative pressure or atmospheric pressure). Alternatively, the backup pins 4 may be manually placed on the pin placement surface 271 by an operator.

Figure 3 is a block diagram showing an example of a component mounting system including the component mounter of Figure 1. The component mounting system S includes the component mounter 1 described above and a server computer 7 that controls the component mounter 1. The component mounter 1 also includes a control unit 51 and a communication unit 52. The control unit 51 is, for example, a processor, and controls the drive of the mounting head 31 by the X-axis motor Mx, Y-axis motor My, and Z-axis motor described above, while controlling the pressure (negative pressure/atmospheric pressure) generated in the nozzle of the mounting head 31, thereby mounting the component E on the board 9 and transferring the backup pins 4. In particular, the control unit 51 acquires board data from the server computer 7 indicating the procedure for mounting the component E in the component mounting area R of the board 9 in the component mounter 1, and controls these in accordance with the board data to mount the component E on the board 9. The communication unit 52 also communicates with the server computer 7.

The server computer 7 comprises a calculation unit 71, a communication unit 72, a UI (User Interface) 73, and a memory unit 74. The calculation unit 71 is, for example, a processor, and performs calculations to determine the placement of the backup pins 4, which will be described later. The communication unit 72 communicates with the communication unit 52 of the component mounter 1. This communication may be performed wirelessly or wired. The UI 73 has input devices such as a keyboard and mouse, and an output device such as a display. The input and output devices do not need to be configured separately; they may be integrated into a single device, such as a touch panel display. The memory unit 74 is configured as a storage device such as an HDD (Hard Disk Drive) or SSD (Solid State Drive), and stores the placement determination program 81 and board configuration information 82, which will be described later. The placement determination program 81 is supplied to the server computer 7 by a recording medium RM separate from the server computer 7. This recording medium RM records the placement determination program 81 so that it can be read by the server computer 7, and is, for example, a USB (Universal Serial Bus) memory or a storage device installed in another computer. The server computer 7 reads the placement determination program 81 from the recording medium RM and stores it in the memory unit 74.

Figure 4 is a perspective view that schematically illustrates the contents of the board configuration information. As shown in Figure 4, a component mounting area R in which a component E is to be mounted is provided on the work surface 91 of the board 9. The component E to be mounted in the component mounting area R has a height Eh in the height direction Dh (Z direction), a length El in the length direction Dl perpendicular to the height direction Dh, and a width Ew in the width direction Dw perpendicular to the height direction Dh and the length direction Dl. The component mounting area R is defined, for example, by the lands to which the electrodes of the component E are bonded, and has a length Rl and a width Rw equal to the length El and width Ew, respectively, of the component E. In other words, the component mounting area R is an area that overlaps the component E to be mounted at the position of the component mounting area R in a plan view. In contrast, the board configuration information 82 indicates the component mounting area R provided on the work surface 91 of the board 9 and the dimensions (height Eh, length El, and width Ew) of the component E to be mounted in the component mounting area R. Note that the board configuration information 82 does not necessarily need to indicate all of the height Eh, length El, and width Ew, and may selectively indicate values required for determining the pin placement described below. There are also variations in the manner in which the board configuration information 82 indicates the component mounting area R. For example, the board configuration information 82 may indicate the position (X and Y coordinates indicating the center position of the component mounting area R) and dimensions (length Rl and width Rw) of the component mounting area R in a planar view, or it may indicate only the former, the position of the component mounting area R.

Such board configuration information 82 can be acquired using various methods and stored in the memory unit 74. For example, the calculation unit 71 can determine the board configuration information 82 based on the board data described above. The calculation unit 71 may also determine the board configuration information 82 based on an image of the work surface 91 of the board 9. This image can be captured by various imaging devices, such as a camera provided in the component mounter 1 or a camera provided in an inspection device that inspects the board 9. Alternatively, the calculation unit 71 may determine the board configuration information 82 based on data (Gerber data) that indicates the configuration of the board 9 in Gerber format.

The placement determination program 81 defines the calculations for determining the placement of the backup pins 4 that support the board 9 based on the board configuration information 82. In other words, by executing the placement determination program 81, the calculation unit 71 determines the placement of the backup pins 4 in accordance with the pin placement determination described below.

Figure 5 is a flowchart showing a first example of pin placement determination, and Figures 6A to 6E are plan views schematically showing the content of the calculations performed in the first example of pin placement determination in Figure 5. As shown in Figures 6A to 6E, a slit SL is provided in the board 9, penetrating between the work surface 91 and the non-work surface 92, and the slit SL has a rectangular shape extending parallel to the Y direction. In order to determine the placement of backup pins 4 for such a board 9, each step in Figure 5 is executed by the calculation unit 71.

In step S101, each component mounting area R indicated by the board configuration information 82 is sorted in descending order of the size of the component E to be mounted in the component mounting area R. The size of component E can be, for example, the area calculated by multiplying the length El of component E by the width Ew (the area of the top surface of component E). However, the volume of component E (the product of the length El, width Ew, and height Eh) may also be used as the size of component E. Then, variable Ia, which indicates the sorting order of component mounting areas R, is reset to zero (step S102), and variable Ia is incremented by 1 (step S103).

In step S104, it is determined whether component E to be mounted in the Iath component mounting area R (Ia) is a large component. Here, component E whose area is larger than a predetermined threshold area is determined to be a large component, and component E whose area is equal to or smaller than the threshold area is determined to be a small component (i.e., not a large component). However, if the volume of component E is used as the size of component E, component E whose volume is larger than the threshold volume is determined to be a large component, and component E whose volume is equal to or smaller than the threshold volume is determined to be a small component. If component E to be mounted in the Iath component mounting area R (Ia) is a large component (if "YES" in step S104), it is determined that the backup pin 4 should be positioned so that its upper end 41 faces the center (geometric center of gravity) of the component mounting area R (Ia) in the Z direction (step S105).

In this way, steps S103 to S105 are performed in descending order of the size of the component E to be mounted. Once steps S103 to S105 have been performed for all large components, it is determined that a backup pin 4 will be placed at the center of each of the component mounting areas R(1) to R(6) where the large components are to be mounted, as shown in Figure 6A. Note that while backup pins 4 are shown in Figure 6A, the pin placement determination in Figure 5 only determines the position where the backup pins 4 will be placed, and does not actually place the backup pins 4. The same applies to the notations in Figures 6B to 6E shown below and other similar drawings.

Furthermore, once steps S103 to S105 have been performed for all large components, a "NO" determination is made in step S104, and the process proceeds to step S106, where the placement of backup pins 4 for small components is determined. In step S106, the non-work surface 92 is virtually divided into multiple lattices L (Figure 6B). These lattices L are arranged at a pitch Plx in the X direction and at a pitch Ply in the Y direction; that is, the multiple lattices L are arranged two-dimensionally in the X and Y directions. Note that in Figure 6B, each lattice L virtually created on the non-work surface 92 is shown through the work surface 91. In step S107, a variable Ib used to identify each lattice L is reset to zero, and in step S108, the variable Ib is incremented by one.

In step S109, whether a component E (small component) is to be mounted in the lattice L (Ib) is determined by determining whether the lattice L (Ib) overlaps the center of the component mounting area R in a plan view. For example, in FIG. 6B, the center of the component mounting area R does not overlap with the lattice L (Ib1), while the centers of the component mounting areas R (7) and R (8) overlap with the lattice L (Ib2). Similarly, the center of the component mounting area R does not overlap with the lattice L (Ib3), while the centers of the component mounting areas R (9) and R (10) overlap with the lattice L (Ib4). If the lattice L (Ib) overlaps with the center of the component mounting area R and it is determined that a small component is to be mounted in the lattice L (Ib) (YES in step S109), the backup pin 4 is positioned so that its upper end 41 faces the center of the lattice L (Ib) in the Z direction (step S110).

On the other hand, if the lattice L (Ib) does not overlap the center of the component mounting area R (step S109: NO), it is determined whether the variable Ib has reached the number Ibx of lattices L (step S111). Steps S108 through S110 are then executed until the variable Ib reaches the number Ibx. When steps S108 through S110 are completed for all small components, it is determined that the backup pin 4 will be placed in a position facing, from the Z direction, the center of the lattices L (Ib2) and L (Ib4), which overlap the centers of the component mounting areas R (7), R (8), R (9), and R (10) where the small components are to be mounted, as shown in Figure 6C.

If the variable Ib reaches the number Ibx of lattices L (YES in step S111), the process proceeds to step S112. In step S112, multiple candidate positions C are virtually set on the non-work surface 92 (Figure 6D). These candidate positions C are potential locations for placing backup pins 4, and correspond to the locations occupied by backup pins 4 placed at candidate positions C. These candidate positions C are arranged at a pitch Pcx in the X direction and a pitch Pcy in the Y direction. In other words, the multiple candidate positions C are arranged two-dimensionally in the X and Y directions. Here, the pitch Pcx at which candidate positions C are arranged in the X direction is wider than the pitch Plx at which lattices L are arranged, and the pitch Pcy at which candidate positions C are arranged in the Y direction is wider than the pitch Ply at which lattices L are arranged. However, the magnitude relationship between these pitches may differ from the example shown here. In Figure 6D, each candidate position C, which is virtually set on the non-work surface 92, is shown through the work surface 91. In step S113, the variable Ic for identifying each candidate position C is reset to zero, and in step S114, the variable Ic is incremented by 1.

In step S115, assuming that the backup pin 4 is positioned so that its upper end 41 abuts candidate position C, it is determined whether the backup pin 4 positioned at the position previously determined in steps S105 and S110 will be separated from the backup pin 4 abutting candidate position C. For example, in FIG. 6D, the backup pin 4 abutting candidate position C (Ic1) is separated from all other backup pins 4 to be placed according to the determination in steps S105 and S110, while the backup pin 4 abutting candidate position C (Ic2) interferes with and does not separate from the other backup pins 4 placed according to the determination in steps S105 or S110. If the backup pin 4 abutting candidate position C (Ic) is separated from the backup pin 4 positioned at the previously determined position (YES in step S115), it is determined that the backup pin 4 will be placed at a position abutting candidate position C (Ic) (step S116).

On the other hand, if the backup pin 4 abutting against the candidate position C (Ic) interferes with a backup pin 4 placed at a previously determined position ("NO" in step S115), a determination is made as to whether the variable Ic has reached the number Icx of candidate positions C (step S117). In other words, in this case, a backup pin 4 is not placed at that candidate position C (Ic). Then, steps S114 to S116 are executed until the variable Ic reaches the number Icx. As a result, as shown in FIG. 6E, it is determined that a backup pin 4 is to be selectively placed at one of the multiple candidate positions C that is separated from the other backup pins 4 to be placed in a planar view.

In the embodiment described above, the board 9 has a work surface 91 (first surface) and a non-work surface 92 (second surface) opposite the work surface 91. The calculation unit 71 (data acquisition unit) acquires board configuration information 82 indicating a component mounting area R on the work surface 91 of the board 9, which is set as an area for mounting component E. Furthermore, the calculation unit 71 (placement determination unit) determines the placement of backup pins 4 (support members) that support the board 9 by abutting the non-work surface 92 from below while the work surface 91 faces upward, based on the component mounting area R (steps S101 to S111). In other words, the placement of the backup pins 4 supporting the board 9 is determined independently of the operator based on the component mounting area R on the work surface 91 of the board 9 where component E is to be mounted. Therefore, it is possible to determine the placement of backup pins 4 that can firmly support the board 9 against the force applied to the board 9 when mounting component E in the component mounting area R of the board 9, without requiring any burden on the operator.

The board configuration information 82 also indicates the length El and width Ew (component size) of the component E to be mounted in the component mounting area R, and the calculation unit 71 determines the placement of the backup pins 4 based on the component mounting area R and the length El and width Ew of the component E (steps S104, S105, S109, S110). With this configuration, the board 9 can be firmly supported by the backup pins 4, the placement of which is determined based on the length El and width Ew of the component E to be mounted in the component mounting area R of the board 9.

The calculation unit 71 also determines that the backup pin 4 should be positioned so that it abuts the non-work surface 92 at a position (large support position) opposite the component mounting area R where a component E is mounted, whose area (component size) given by the product of the length El and width Ew is larger than a threshold area (predetermined standard) (steps S104 and S105). This configuration allows the backup pin 4 to firmly support the board 9 against the force applied to the board 9 when the large component E is mounted on the board 9.

Furthermore, the position facing the center of the component mounting area R where a component E (large component) having an area larger than the threshold area is to be mounted is determined as the position (large support position) where the component mounting area R is supported by the backup pins 4 (steps S104 and S105). This allows the backup pins 4 to more firmly support the board 9 against the force applied to the board 9 when the large component E is mounted on the board 9.

The calculation unit 71 also virtually divides the non-work surface 92 into multiple grids L and determines to position the backup pins 4 so that they abut the non-work surface 92 at positions (small support positions) inside the grids L that overlap with the component mounting region R where the component E having an area equal to or smaller than the threshold area will be mounted (steps S109, S110). With this configuration, the backup pins 4 can firmly support the board 9 against the force applied to the board 9 when the small component E is mounted on the board 9.

Furthermore, the position facing the center of the grid L that overlaps with the component mounting area R where the component E having an area equal to or smaller than the threshold area is mounted is determined as the position (small support position) where the backup pin 4 supports the component mounting area R (step S110). This allows the backup pin 4 to more firmly support the board 9 against the force applied to the board 9 when the small component E is mounted on the board 9.

Furthermore, the position inside the grid L that overlaps the center of the component mounting area R where the component E having an area equal to or smaller than the threshold area is mounted is determined as the position (small support position) where the backup pin 4 supports the component mounting area R (step S110). This allows the backup pin 4 to more firmly support the board 9 against the force applied to the board 9 when the small component E is mounted on the board 9.

The calculation unit 71 also sets multiple candidate positions C, two-dimensionally arranged at a predetermined pitch, on the non-work surface 92 (step S112). The calculation unit 71 then selects from the multiple candidate positions C a candidate position C (target position) where the backup pin 4 abutting the non-work surface 92 at candidate position C is spaced apart from both the backup pin 4 abutting the non-work surface 92 at the large support position and the backup pin 4 abutting the non-work surface 92 at the small support position (steps S114 and S115). The calculation unit 71 then determines to position the backup pin 4 so that it abuts the non-work surface 92 at the selected candidate position C (step S116). This allows for the placement of additional backup pins 4 while preventing interference with backup pins 4 positioned according to component mounting regions R where large or small components E are mounted, thereby enabling the board 9 to be firmly supported by a large number of backup pins 4.

Figure 7 is a flowchart showing a second example of pin placement determination, and Figures 8A to 8C are plan views showing the details of the calculations performed in the second example of pin placement determination in Figure 7. Each step in Figure 7 is executed by calculation unit 71. The following explanation will focus on the differences from the first example, and points in common with the first example will be denoted by the corresponding reference numerals and will not be explained as appropriate.

In step S201, the calculation unit 71 virtually divides the non-work surface 92 into multiple (two) ranges A(1) and A(2), using the slit SL (boundary area) extending in the Y direction as a boundary. This divides the non-work surface 92 of the board 9 into range A(1) on one side of the slit SL and range A(2) on the other side in the X direction (the direction perpendicular to the extension direction of the slit SL). In step S202, the variable Id used to identify each range A is reset to zero, and in step S203, the variable Id is incremented by 1.

In step S204, the representative position of the multiple component mounting areas R included in the target range A (Id) is calculated. Here, the volume-based center of gravity position Gv given by the following equation 1 is obtained as the representative position.

In Equation 1, n is a variable that identifies the component mounting area R included in the target range A(Id). If range A(Id) includes five component mounting areas R, n is an integer between 1 and 5. Furthermore, _{x_n} is the X coordinate of the nth component mounting area R, _{y_n} is the Y coordinate of the nth component mounting area R, and _{V_n} is the volume of the component E to be mounted in the nth component mounting area R. In this example, the board configuration information 82 indicates the volume V of the component E to be mounted in each component mounting area R. The board configuration information 82 may include a value that directly indicates the volume V of the component E, or may include values that indirectly indicate the volume V of the component E (such as the length El, width Ew, and height Eh). Furthermore, Σ indicates the summation over n. Using Equation 1, the X and Y coordinates of the volume-based center of gravity position Gv are calculated (step S204).

Then, in step S205, it is determined that the backup pin 4 will be positioned so that it abuts the non-work target surface 92 at a representative support position Pg that faces this volume-based center of gravity position Gv from the Z direction. In other words, as shown in Figure 8A, it is determined that the backup pin 4 will be positioned at the representative support position Pg found for the target range A(1) among the multiple ranges A.

In subsequent steps S112 to S117, similar to the first example described above, it is determined that the backup pin 4 will be placed at candidate position C, which is spaced apart from the backup pin 4 placed at the position previously determined in step S205. Note that in the first example, the entire non-work surface 92 is the target, but in the second example, range A (Id) of the non-work surface 92 is the target. In other words, the placement of the backup pin 4 that supports the board 9 in range A (Id) is determined. As a result, as shown in Figure 8B, it is determined that the backup pin 4 will be placed at candidate position C, which is spaced apart from the backup pin 4 placed at the representative support position Pg.

In step S206, it is determined whether the variable Id has reached the number Idx of ranges A. If the variable Id is less than the number Idx, the process returns to step S203, and steps S203 to S205, S112 to S117, and S206 are repeated. As a result, as shown in FIG. 8C, for each of the multiple ranges A, it is determined that a backup pin 4 is to be placed at the representative support position Pg opposite the volume reference center of gravity position Gv (steps S204 to S205), and it is further determined that a backup pin 4 is to be placed at a candidate position C spaced apart from the backup pin 4 placed at the representative support position Pg.

In the embodiment described above, the calculation unit 71 (data acquisition unit) acquires board configuration information 82 indicating the component mounting region R, which is set as the region where component E is to be mounted, on the work surface 91 of the board 9. Furthermore, the calculation unit 71 (placement determination unit) determines the placement of backup pins 4 (support members) that support the board 9 by abutting the non-work surface 92 from below while the work surface 91 is facing upward, based on the component mounting region R (steps S201 to S205, S206). In other words, the placement of the backup pins 4 that support the board 9 is determined independently of the worker, based on the component mounting region R on the work surface 91 of the board 9 where component E is to be mounted. Therefore, it is possible to determine the placement of backup pins 4 that can firmly support the board 9 against the force applied to the board 9 when mounting component E in the component mounting region R of the board 9, without imposing any burden on the worker.

The board configuration information 82 also indicates slits SL (boundary areas) provided on the board 9. In response to this, the calculation unit 71 (placement determination unit) virtually divides the non-work surface 92 into multiple ranges A based on the slits SL, and performs a placement determination process (steps S204-S205) for each of the multiple ranges A. The placement determination process determines the placement of backup pins 4 that abut the non-work surface 92 at a position facing one of the multiple ranges A (Id) in accordance with the component mounting area R within the target area A (Id). With this configuration, the placement of backup pins 4 for each range A divided by the slits SL can be determined based on the component mounting area R within that range A, allowing each range A divided by the slits SL to be firmly supported by the backup pins 4.

The calculation unit 71 also determines a volume-based center of gravity position Gv (representative position) that represents the position of each component mounting area R within the target range A (Id), and determines to position the backup pin 4 so that it abuts the non-work target surface 92 at a representative support position Pg opposite the volume-based center of gravity position Gv (steps S204-S205). With this configuration, the backup pin 4 can firmly support the board 9 at the representative support position Pg opposite the volume-based center of gravity position Gv that represents the position of the component mounting area R in each range A divided by the slit SL.

The board configuration information 82 also includes the volume V (component volume) of the component E to be mounted in the component mounting area R. In response to this, the calculation unit 71 determines the representative support position Pg based on the component mounting area R and the volume V of the component E (step S205). With this configuration, the backup pins 4 can firmly support the board 9 at the representative support position Pg that reflects the volume V of the component E.

The calculation unit 71 also sets a plurality of two-dimensionally arranged candidate positions C on the non-work surface 92 (step S112). Furthermore, the calculation unit 71 selects a candidate position C (target position) from the plurality of candidate positions C at which the backup pin 4 abutting the non-work surface 92 at candidate position C is spaced apart from the backup pin 4 abutting the non-work surface 92 at the representative support position Pg (steps S114, S115). The calculation unit 71 then determines to position the backup pin 4 so that it abuts the non-work surface 92 at the selected candidate position C (step S116). This allows additional backup pins 4 to be positioned while preventing interference with the backup pins 4 supporting the board 9 at the representative support position Pg, enabling the board 9 to be firmly supported by a large number of backup pins 4.

The above embodiment is based on the assumption that no component E is present on the non-work surface 92 (i.e., it is not mounted). However, the above embodiment can also be implemented in a similar manner when a component E is present on the non-work surface 92 (i.e., it is mounted). In particular, by using the prohibited area evacuation arrangement described below in combination, it is possible to determine the placement of the backup pin 4 while avoiding interference between the backup pin 4 and the component E present on the non-work surface 92. Furthermore, it is also possible to determine the placement of the backup pin 4 so as to avoid slits SL, parting lines, etc. on the board 9.

9 is a flowchart showing an example of the prohibited area relocation, and FIG. 10 is a plan view showing the details of the calculations performed in the prohibited area relocation of FIG. 9. Note that in FIG. 10, component E mounted on the non-work surface 92 of the board 9 is shown through the work surface 91 of the board 9. Each step in FIG. 9 is executed by the calculation unit 71. The prohibited area relocation of FIG. 9 can be executed in place of the above calculations, for example, in steps S105 and S110 of the first example of pin placement determination in FIG. 5 or step S205 of the second example of pin placement determination in FIG. 7. Furthermore, to enable the prohibited area relocation of FIG. 9 to be executed, the board configuration information 82 indicates a support prohibited area Rp on the non-work surface 92 of the board 9 where support by the backup pins 4 is prohibited. As shown in FIG. 10, the range on the non-work surface 92 where component E exists and the range of the slit SL correspond to the support prohibited area Rp.

In step S301, a temporary placement position Pp is set based on the component mounting area R indicated by the board configuration information 82. For example, in the first example of pin placement determination, if a prohibited area evacuation placement is performed in step S105, the temporary placement position Pp is set to a position facing the center of the component mounting area R (Ia) where the large component is to be mounted from the Z direction. If a prohibited area evacuation placement is performed in step S110, the temporary placement position Pp is set to a position facing the center of the grid L (Ib) where the small component is to be mounted from the Z direction. Furthermore, in the second example of pin placement determination, if a prohibited area evacuation placement is performed in step S205, the temporary placement position Pp is set to a position facing the representative position (volume-based center of gravity position Gv) of range A (Id) from the Z direction.

In step S302, it is determined whether the temporary placement position Pp overlaps the support prohibition area Rp. If the temporary placement position Pp does not overlap the support prohibition area Rp (step S302: NO), it is determined that a backup pin 4 is to be placed at the temporary placement position Pp (step S303).

On the other hand, if the temporary placement position Pp overlaps the support prohibition region Rp (step S302: YES), a search is made for a retraction position Pe from around the temporary placement position Pp (step S304). For example, a calculation is performed to determine whether a position a predetermined distance away from the temporary placement position Pp in a predetermined direction (e.g., the X direction) is moving away from the support prohibition region Rp. This calculation is repeated while gradually increasing the predetermined distance, and the first position confirmed to be moving away from the support prohibition region Rp can be determined as the retraction position Pe. Note that the predetermined direction in this case is not limited to the X direction, but can also be the Y direction, or a direction inclined relative to the X and Y directions. Once the retraction position Pe is found, as shown in FIG. 10, for example, it is determined that the backup pin 4 should be placed at the retraction position Pe (step S305). This prevents the backup pin 4 from being placed in a position opposite the support prohibition region Rp.

The prohibited area evacuation arrangement in FIG. 9 can also be performed in place of the above calculation, for example, in step S116 of the first example of pin placement determination in FIG. 5 or step S116 of the second example of pin placement determination in FIG. 7. In this case, in step S301, candidate position C (Ic) is set as the temporary placement position Pp. Then, steps S302 to S305 are performed in the same manner as described above, and the placement of the backup pin 4 is determined.

In the embodiment described above, the board configuration information 82 indicates support prohibited areas Rp corresponding to the slits SL provided in the board 9 and the areas of the non-work surface 92 where components E are mounted (component presence areas). In response, the calculation unit 71 (placement determination unit) determines that backup pins 4 will not be placed in positions facing the support prohibited areas Rp (steps S302, 304, S305). With this configuration, it is possible to prevent backup pins 4 from being placed in support prohibited areas Rp, such as the slits SL in the board 9 or the areas of the non-work surface 92 where components E are mounted.

The calculation unit 71 also sets a temporary placement position Pp, based on the component mounting area R, at which the backup pin 4 is to be placed, which will abut against the non-work surface 92 (step S301). If the temporary placement position Pp does not overlap the support prohibition area Rp, the calculation unit 71 determines to place the backup pin 4 at the temporary placement position Pp (steps S302 and S303). On the other hand, if the temporary placement position Pp overlaps the support prohibition area Rp, the calculation unit 71 determines to place the backup pin 4 at a position in an area away from the support prohibition area Rp that has a predetermined positional relationship with the temporary placement position Pp (i.e., a position that only moves away from the support prohibition area Rp after being gradually moved away from the temporary placement position Pp in a predetermined direction in a plan view) (steps S302, S304, and S305). With this configuration, the backup pins 4 are positioned near the support prohibited areas Rp, while avoiding the support prohibited areas Rp, such as the slits SL in the board 9 and the areas on the non-work surface 92 where components E are mounted, allowing the backup pins 4 to firmly support the board 9.

As explained above, in this embodiment, the backup pin 4 corresponds to an example of a "support member" of the present invention, the server computer 7 corresponds to an example of a "support member placement determination device" of the present invention, the server computer 7 corresponds to an example of a "computer" of the present invention, the calculation unit 71 corresponds to an example of a "data acquisition unit" of the present invention, the calculation unit 71 corresponds to an example of an "placement determination unit" of the present invention, the placement determination program 81 corresponds to an example of a "support member placement determination program" of the present invention, the board configuration information 82 corresponds to an example of "board configuration information" of the present invention, the board 9 corresponds to an example of a "board" of the present invention, the work target surface 91 corresponds to an example of a "first surface" of the present invention, and the non-work target surface 92 corresponds to an example of a "first surface" of the present invention. The image surface 92 corresponds to an example of a "second surface" of the present invention, the range A corresponds to an example of a "range" of the present invention, the candidate position C corresponds to an example of a "candidate position" of the present invention, the component E corresponds to an example of a "component" of the present invention, the component mounting area R corresponds to an example of a "component mounting area" of the present invention, the grid L corresponds to an example of a "grid" of the present invention, the temporary placement position Pp corresponds to an example of a "temporary placement position" of the present invention, the representative support position Pg corresponds to an example of a "representative support position" of the present invention, the support prohibited area Rp corresponds to an example of a "support prohibited area" of the present invention, the recording medium RM corresponds to an example of a "recording medium" of the present invention, and the slit SL corresponds to an example of a "slit" and "boundary area" of the present invention.

The present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the invention. For example, in the first example of pin placement determination in Figure 5, large components may not be distinguished from small components, but large components may be treated the same as small components, and the placement of backup pins 4 may be determined based on the relationship between component mounting area R and grid L. In this case, steps S101 to S105 may be omitted, and the flowchart in Figure 5 may be executed from step S106.

In addition, in the second example of pin placement determination, the non-work surface 92 of the board 9 is virtually divided into multiple ranges A, with slits SL provided in the board 9 as boundaries. However, step S201 of the second example of pin placement determination may also be configured to divide the board 9 into multiple ranges A, with dividing lines for dividing the board 9, such as perforations or cut grooves (V-cuts) provided in a so-called split board, as boundaries. In this case, the board configuration information 82 indicates the dividing lines provided on the board 9, and the calculation unit 71 divides the board 9 into multiple ranges A, with the dividing lines indicated by the board configuration information 82 as boundaries.

Furthermore, the number of slits SL provided in the substrate 9 is not limited to two, but may be three or more. Furthermore, the direction in which the substrate 9 is virtually divided at the boundaries of the slits SL is not limited to the X direction described above, but may also be the Y direction. The same applies to the case in which the substrate 9 is virtually divided based on division lines provided on the substrate 9.

Also, in the prohibited area evacuation arrangement of FIG. 9, the division line of the board 9 may be set as the support prohibited area Rp, prohibiting the placement of backup pins 4 on the division line. In this case, the board configuration information 82 indicates the division line provided on the board 9, and the calculation unit 71 treats the division line indicated by the board configuration information 82 as the support prohibited area Rp.

Furthermore, in the second example of component placement determination, the volume-based center of gravity position Gv is set as the position representing range A (Id). However, the weight-based center of gravity position Gm given by the following equation 2 may also be determined as the representative position.

In Expression 2, the meanings of notations common to Expression 1 are the same as those in Expression 1. Furthermore, _Mn is the weight of the component E to be mounted in the nth component mounting area R. In this example, the board configuration information 82 indicates the weight M of the component E to be mounted in each component mounting area R. According to this modification, in step S205, it is determined that the backup pin 4 is to be positioned so that the backup pin 4 abuts against the non-work target surface 92 at the representative support position Pg that faces the weight reference center of gravity position Gm from the Z direction.

Furthermore, the configuration in which the backup pins 4 are supported by the pin arrangement surface 271 of the pin arrangement table 27 may be configured so that they are supported by inserting the backup pins 4 into the pin holes, as in Patent Document 1, for example, rather than by magnetic force. In this case, for example, the above-mentioned multiple grids L may be virtually arranged in correspondence with the arrangement of the multiple pin holes on the pin arrangement surface 271.

The placement of the backup pins 4 determined by the calculation unit 71 of the server computer 7 according to the flowchart shown in FIG. 5, FIG. 7, or FIG. 9 may also be transmitted from the communication unit 72 of the server computer 7 to the communication unit 52 of the mounter 1. In this case, the control unit 51 of the mounter 1 executes control according to the placement of the backup pins 4 received by the communication unit 52, thereby placing the backup pins 4 in the pin placement table 27. As a result, the backup pins 4 are placed in the pin placement table 27 according to the determination made by the server computer 7.

Furthermore, the determination of the placement of the backup pins 4 does not need to be performed by a server computer 7 separate from the component mounter 1; it may be performed by the control unit 51 of the component mounter 1, or by a device (e.g., an inspection device) different from the server computer 7 or the component mounter 1.

4...Backup pin (support member)
7...Server computer (support member placement determination device, computer)
71...Calculation unit (data acquisition unit, placement determination unit)
81... Placement determination program (support member placement determination program)
82...Board configuration information 9...Board 91...Work surface (first surface)
92...Non-work surface (second surface)
A...Range C...Candidate position E...Component R...Component mounting area L...Grid Pp...Temporary placement position Pg...Representative support position Rp...Support prohibited area RM...Recording medium SL...Slit (boundary area)

Claims (12)

a data acquisition unit that acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite to the first surface, the component mounting area being an area for mounting components, and a component size that is the size of the component to be mounted in the component mounting area ;
a placement determination unit that determines the placement of a support member that supports the board by contacting the second surface from below with the first surface facing upward, based on the component mounting area and the component size ;
The placement determination unit determines to place the support member so that the support member abuts the second surface at a large support position facing the component mounting area where the component whose size is larger than a predetermined standard is mounted . 2. The support member placement determination device according to claim 1 , wherein the large support position is a position facing the center of the component mounting area where the component having a size larger than the predetermined standard is mounted. a data acquisition unit that acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite to the first surface, the component mounting area being an area for mounting components, and a component size that is the size of the component to be mounted in the component mounting area ;
a placement determination unit that determines the placement of a support member that supports the board by contacting the second surface from below with the first surface facing upward, based on the component mounting area and the component size ;
the placement determination unit determines to place the support member such that the support member abuts on the second surface at a large support position facing the component mounting area in which the component having a component size larger than a predetermined standard is mounted;
The placement determination unit virtually divides the second surface into a plurality of grids, and determines to place the support member so that it abuts the second surface at a small support position inside the grid that overlaps with the component mounting area in which the component whose size is equal to or smaller than the specified standard is mounted. 4. The support member placement determination device according to claim 3 , wherein the small support position is a position facing the center of the grid that overlaps the component mounting area in which the component whose size is equal to or smaller than the predetermined standard is mounted. 5. The support member placement determination device according to claim 3, wherein the small support position is a position inside the grid that overlaps with the center of the component mounting area where the component whose size is equal to or smaller than the predetermined standard is mounted. 6. The support member placement determination device of claim 3, wherein the placement determination unit sets a plurality of candidate positions arranged two-dimensionally on the second surface, selects a target position from the plurality of candidate positions at which the support member abutting the second surface at the candidate position is spaced apart from both the support member abutting the second surface at the large support position and the support member abutting the second surface at the small support position, and determines to place the support member so that it abuts the second surface at the target position. the board configuration information indicates a support prohibition area including a slit provided in the board, a division line for dividing the board, or a component presence area on the second surface where a component is mounted,
The support member placement determination device according to claim 1 , wherein the placement determination unit determines that the support member will not be placed in a position facing the support prohibited area. The support member placement determination device of claim 7, wherein the placement determination unit sets a temporary placement position where a support member abutting the second surface is to be placed based on the component mounting area, and if the temporary placement position does not overlap the support prohibited area, determines to place the support member at the temporary placement position, while if the temporary placement position overlaps the support prohibited area, determines to place the support member at a position in an area separated from the support prohibited area that has a predetermined positional relationship with the temporary placement position. The support member placement determination device according to any one of claims 1 to 8, wherein the placement determination unit performs a process for determining, for each of the plurality of large support positions, that the support member be placed so that the support member abuts the second surface at the large support position. a step in which a data acquisition unit acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite to the first surface, the component mounting area being an area for mounting components, and a component size being the size of the component to be mounted in the component mounting area ;
a step in which a placement determination unit determines a placement of a support member that supports the board by contacting the second surface from below with the first surface facing upward, based on the component mounting area and the component size ;
A support member placement determination method in which the placement determination unit determines to place the support member so that the support member abuts the second surface at a large support position facing the component mounting area in which the component whose component size is larger than a predetermined standard is mounted . a data acquisition unit that acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite to the first surface, the component mounting area being an area for mounting components, and a component size that is the size of the component to be mounted in the component mounting area ;
a support member placement determination unit that determines, based on the component mounting area and the component size , a placement of a support member that supports the board by abutting the second surface from below with the first surface facing upward;
The placement determination unit is a support member placement determination program that determines to place the support member so that the support member abuts the second surface at a large support position facing the component mounting area where the component whose size is larger than a predetermined standard is mounted . A recording medium for recording the support member arrangement determination program according to claim 11 in a computer-readable manner.