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JP7726944B2 - Manufacturing method of circuit-embedded substrate - Google Patents
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JP7726944B2 - Manufacturing method of circuit-embedded substrate - Google Patents

Manufacturing method of circuit-embedded substrate

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Publication number
JP7726944B2
JP7726944B2 JP2023073829A JP2023073829A JP7726944B2 JP 7726944 B2 JP7726944 B2 JP 7726944B2 JP 2023073829 A JP2023073829 A JP 2023073829A JP 2023073829 A JP2023073829 A JP 2023073829A JP 7726944 B2 JP7726944 B2 JP 7726944B2
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electrode pad
film
wiring
main surface
conductive wire
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JP2024158544A (en
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寿文 黒▲崎▼
崇 横山
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Nissha Co Ltd
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Nissha Co Ltd
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Priority to JP2023073829A priority Critical patent/JP7726944B2/en
Priority to CN202480014768.6A priority patent/CN120752997A/en
Priority to DE112024000428.8T priority patent/DE112024000428T5/en
Priority to KR1020257018548A priority patent/KR20260002585A/en
Priority to PCT/JP2024/008747 priority patent/WO2024224827A1/en
Publication of JP2024158544A publication Critical patent/JP2024158544A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0019—Circuit arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/03—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

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  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Surface Heating Bodies (AREA)

Description

本発明は、回路埋込基板の製造方法に関する。 The present invention relates to a method for manufacturing a circuit-embedded substrate.

１つの金属細線が任意のパターンでフィルムに埋め込まれた、フィルムヒータなどが知られている（例えば、特許文献１参照）。図１２を参照して、このようなフィルムヒータ１００は、フィルム２００と、フィルム２００の周縁部に、Ｙ方向に沿って間隔を空けて互いに平行に配置された四角形状の第１電極パッド５００及び第２電極パッド６００と、フィルム２００に埋め込まれた１つの金属細線３００からなる回路４００とを備えている。
回路４００は、任意のパターンを有するヒータ部４５０と、ヒータ部４５０の両端からそれぞれ引き出された第１配線部４３０及び第２配線部４４０と、第１配線部４３０及び第２配線部４４０からそれぞれヒータ部４５０とは反対側（図の＋Ｘ方向）に延びて、第１電極パッド５００及び第２電極パッド６００にそれぞれ重なる第１端部４１０及び第２端部４２０とを有している。回路４００は、超音波溶着機を用いて超音波振動を与えることにより、フィルム２００の金属細線３００との接触面を溶融させて埋め込まれている。例えば、第１端部４１０から、第１配線部４３０、ヒータ部４５０、第２配線部４４０、第２端部４２０の順で埋め込んでいくことができる。 A film heater in which a single thin metal wire is embedded in a film in an arbitrary pattern is known (see, for example, Patent Document 1). Referring to Fig. 12, such a film heater 100 includes a film 200, a rectangular first electrode pad 500 and a second electrode pad 600 arranged parallel to each other and spaced apart along the Y direction on the periphery of the film 200, and a circuit 400 made of a single thin metal wire 300 embedded in the film 200.
The circuit 400 includes a heater section 450 having an arbitrary pattern, a first wiring section 430 and a second wiring section 440 drawn out from both ends of the heater section 450, and a first end section 410 and a second end section 420 extending from the first wiring section 430 and the second wiring section 440 in the opposite direction from the heater section 450 (the +X direction in the figure) and overlapping with a first electrode pad 500 and a second electrode pad 600, respectively. The circuit 400 is embedded by applying ultrasonic vibrations using an ultrasonic welding machine to melt the contact surface between the film 200 and the thin metal wires 300. For example, the circuit 400 can be embedded in the film 200 in the following order: first end section 410, first wiring section 430, heater section 450, second wiring section 440, and second end section 420.

第１端部４１０及び第２端部４２０は、それぞれ第１電極パッド５００及び第２電極パッド６００をＸ方向に跨いでいる。第１電極パッド５００及び第２電極パッド６００の上面と、第１端部４１０及び第２端部４２０のうち上面に接する金属細線３００とを電気的に接続する。第１電極パッド５００及び第２電極パッド６００に電圧を印加すると、回路４００に電流が生じ、ヒータ部４５０が発熱する。 The first end 410 and the second end 420 straddle the first electrode pad 500 and the second electrode pad 600, respectively, in the X direction. The upper surfaces of the first electrode pad 500 and the second electrode pad 600 are electrically connected to the thin metal wires 300 that contact the upper surfaces of the first end 410 and the second end 420. When a voltage is applied to the first electrode pad 500 and the second electrode pad 600, a current is generated in the circuit 400, causing the heater section 450 to generate heat.

特開２０２２－０６６７０６号公報Japanese Patent Application Laid-Open No. 2022-066706

従来のフィルムヒータ１００の製造方法では、フィルム２００上にまず電極パッド５００，６００を配置し、そのフィルム２００の角を治具（図示せず）に当ててセットする。その後に、第１端部４１０及び第２端部４２０が電極パッド５００，６００に重なるように金属細線３００をフィルム２００に埋め込む。電極パッド５００，６００の配置と金属細線３００の埋め込みとが別工程であるため、次のような位置ずれが生じる。すなわち、（１）電極パッドの位置ずれ（２）金属細線の埋め込みの位置ずれ（３）電極パッド及び金属細線埋め込みの位置ずれである。この製造方法において、例えば電極パッド５００，６００の配置箇所が図１３（ａ）の＋Ｙ方向にずれてしまうと、相対的に金属細線３００の埋め込み位置は図１３（ａ）の－Ｙ方向にずれてしまう。つまり、従来の製造方法では、電極パッド５００，６００と回路４００との位置合わせが難しいため良品率が上がりにくいという問題があった。 In the conventional manufacturing method for the film heater 100, the electrode pads 500, 600 are first placed on the film 200, and the corners of the film 200 are then placed against a jig (not shown). The thin metal wires 300 are then embedded in the film 200 so that the first end 410 and second end 420 overlap the electrode pads 500, 600. Because the placement of the electrode pads 500, 600 and the embedding of the thin metal wires 300 are separate processes, the following misalignments occur: (1) misalignment of the electrode pads, (2) misalignment of the embedded thin metal wires, and (3) misalignment of the electrode pads and the embedded thin metal wires. In this manufacturing method, if the placement locations of the electrode pads 500, 600 are misaligned in the +Y direction in Figure 13(a), for example, the embedded position of the thin metal wires 300 will be relatively misaligned in the -Y direction in Figure 13(a). In other words, with conventional manufacturing methods, it was difficult to align the electrode pads 500, 600 with the circuit 400, making it difficult to increase the yield rate.

本発明は、上記のような課題を解決するためになされたものであり、回路と電極パッドとの位置合わせ精度を上げることにより、良品率の向上を図ることができる回路埋込基板の製造方法を提供することを目的とする。 The present invention was made to solve the above-mentioned problems, and aims to provide a method for manufacturing circuit-embedded substrates that can improve the yield rate by increasing the alignment accuracy between the circuit and electrode pads.

上記の目的を達成するための第１の発明は、
フィルムを準備する準備工程と、
フィルムの第１主面上の周縁部に、第１方向に沿って第１電極パッド及び第２電極パッドを間隔を空けて互いに平行に配置する配置工程と、
フィルムの第１主面上に配置され、金属細線が絶縁被覆された導電線からなり、任意のパターンを有する機能部と、機能部の両端の一方から機能部の外に引き出された第１配線部と、機能部の両端の他方から機能部の外に引き出された第２配線部と、第１配線部から第１電極パッド及び第２電極パッドに一部が重なるように第１方向に延びる第１端部と、第２配線部から第１電極パッド及び第２電極パッドに一部が重なるように第１端部に沿って延びる第２端部とを有する回路を、機能部と、第１配線部及び第２配線部と、第１端部及び第２端部のうち第１電極パッド及び第２電極パッドに重ならない部分とを超音波溶着機を用いてフィルムの第１主面に埋め込んで形成する回路形成工程と、
第１電極パッドの上に位置する導電線の絶縁被覆を除去するとともに、露出した金属細線と第１電極パッドとを電気的に接続する第１接続工程と、
第２電極パッドの上に位置する導電線の絶縁被覆を除去するとともに、露出した金属細線と第２電極パッドとを電気的に接続する第２接続工程とを備え、
第１端部の両端のうち第１配線部と接続された一端と、第２端部の両端のうち第２配線部と接続された一端とが、平面視で第１電極パッド及び第２電極パッドに対して同じ側に配置され、
超音波溶着機は、超音波振動を与えることによりフィルムの導電線との接触面を溶融させるとともに導電線をフィルムの第１主面に埋め込むホーンと、ホーンの内部を通りホーンの先端からフィルムの第１主面上に連続的に引き出される導電線とを有しており、
第１端部及び第２端部は、第１電極パッド及び第２電極パッドと回路との第１方向の位置ずれを吸収する長さを有する、回路埋込基板の製造方法である。 The first invention to achieve the above object is:
a preparation step of preparing a film;
an arrangement step of arranging first electrode pads and second electrode pads parallel to each other at intervals along a first direction on a peripheral edge portion of a first main surface of the film;
a circuit forming process for forming a circuit having: a functional section arranged on a first main surface of the film, the functional section being made of conductive wires with insulating coating of thin metal wires and having an arbitrary pattern; a first wiring section drawn out from one of both ends of the functional section to the outside of the functional section; a second wiring section drawn out from the other of both ends of the functional section to the outside of the functional section; a first end section extending from the first wiring section in a first direction so as to overlap the first electrode pads and the second electrode pads; and a second end section extending from the second wiring section along the first end section so as to overlap the first electrode pads and the second electrode pads;
a first connecting step of removing the insulating coating of the conductive wire located on the first electrode pad and electrically connecting the exposed thin metal wire and the first electrode pad;
a second connecting step of removing the insulating coating of the conductive wire located on the second electrode pad and electrically connecting the exposed thin metal wire to the second electrode pad;
one end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are arranged on the same side with respect to the first electrode pad and the second electrode pad in a plan view;
The ultrasonic welding machine has a horn that applies ultrasonic vibrations to melt the contact surface of the film with the conductive wire and embed the conductive wire in the first main surface of the film, and a conductive wire that passes through the inside of the horn and is continuously drawn out from the tip of the horn onto the first main surface of the film,
In this method for manufacturing a circuit-embedded substrate, the first end and the second end have lengths that can absorb misalignment in a first direction between the first electrode pads and the second electrode pads and the circuit.

上記の目的を達成するための第２の発明は、
フィルムを準備する準備工程と、
フィルムの第１主面上の周縁部に、第１方向に沿って第１電極パッド及び第２電極パッドを間隔を空けて互いに平行に配置する配置工程と、
フィルムの第１主面上に配置され、金属細線が絶縁被覆された導電線からなり、任意のパターンを有する機能部と、機能部の両端の一方から機能部の外に引き出された第１配線部と、機能部の両端の他方から機能部の外に引き出された第２配線部と、第１配線部から第１電極パッド及び第２電極パッドに一部が重なるように第１方向に延びる第１端部と、第２配線部から第１電極パッド及び第２電極パッドに一部が重なるように第１端部に沿って延びる第２端部とを有する回路を、機能部と、第１配線部及び第２配線部と、第１端部及び第２端部のうち第１電極パッド及び第２電極パッドに重ならない部分とを超音波溶着機を用いてフィルムの第１主面に埋め込んで形成する回路形成工程と、
第１電極パッドの上に位置する導電線の絶縁被覆を除去するとともに、露出した金属細線と第１電極パッドとを電気的に接続する第１接続工程と、
第２電極パッドの上に位置する導電線の絶縁被覆を除去するとともに、露出した金属細線と第２電極パッドとを電気的に接続する第２接続工程とを備え、
第１端部の両端のうち第１配線部と接続された一端と、第２端部の両端のうち第２配線部と接続された一端とが、平面視で第１電極パッド及び第２電極パッドを挟む位置に配置され、
超音波溶着機は、超音波振動を与えることによりフィルムの導電線との接触面を溶融させるとともに導電線をフィルムの第１主面に埋め込むホーンと、ホーンの内部を通りホーンの先端からフィルムの第１主面上に連続的に引き出される導電線とを有しており、
第１端部及び第２端部は、第１電極パッド及び第２電極パッドと回路との第１方向の位置ずれを吸収する長さを有する、回路埋込基板の製造方法である。 The second invention to achieve the above object is:
a preparation step of preparing a film;
an arrangement step of arranging first electrode pads and second electrode pads parallel to each other at intervals along a first direction on a peripheral edge portion of a first main surface of the film;
a circuit forming process for forming a circuit having: a functional section arranged on a first main surface of the film, the functional section being made of conductive wires with insulating coating of thin metal wires and having an arbitrary pattern; a first wiring section drawn out from one of both ends of the functional section to the outside of the functional section; a second wiring section drawn out from the other of both ends of the functional section to the outside of the functional section; a first end section extending from the first wiring section in a first direction so as to overlap the first electrode pads and the second electrode pads; and a second end section extending from the second wiring section along the first end section so as to overlap the first electrode pads and the second electrode pads;
a first connecting step of removing the insulating coating of the conductive wire located on the first electrode pad and electrically connecting the exposed thin metal wire and the first electrode pad;
a second connecting step of removing the insulating coating of the conductive wire located on the second electrode pad and electrically connecting the exposed thin metal wire to the second electrode pad;
one end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are disposed at positions sandwiching the first electrode pad and the second electrode pad in a plan view;
The ultrasonic welding machine has a horn that applies ultrasonic vibrations to melt the contact surface of the film with the conductive wire and embed the conductive wire in the first main surface of the film, and a conductive wire that passes through the inside of the horn and is continuously drawn out from the tip of the horn onto the first main surface of the film,
In this method for manufacturing a circuit-embedded substrate, the first end and the second end have lengths that can absorb misalignment in a first direction between the first electrode pads and the second electrode pads and the circuit.

第１及び第２の発明のような製造方法によれば、第１電極パッド及び第２電極パッドと、第１端部及び第２端部の埋め込み位置とが相対的に第１方向にずれた場合であっても、第１端部及び第２端部が、２つの電極パッドと回路との第１方向の位置ずれを吸収する長さをそれぞれ有しているため、第１端部及び第２端部はそれぞれ２つの電極パッドと重なる部分を有する。したがって、回路と２つの電極パッドとの位置合わせ精度が上がるため、良品率の向上を図ることができる。 According to the manufacturing methods of the first and second inventions, even if the embedded positions of the first and second electrode pads and the first end and second end are misaligned relative to each other in the first direction, the first end and second end each have a length that absorbs the misalignment in the first direction between the two electrode pads and the circuit, so the first end and second end each have a portion that overlaps with the two electrode pads. This improves the alignment accuracy between the circuit and the two electrode pads, thereby improving the yield rate.

上記の目的を達成するための第３の発明は、
フィルムを準備する準備工程と、
フィルムの第１主面上の周縁部に、第１方向に沿って第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドを間隔を空けて互いに平行に配置する配置工程と、
フィルムの第１主面上に配置され、金属細線が絶縁被覆された第１導電線からなり、任意のパターンを有する第１機能部と、第１機能部の両端の一方から第１機能部の外に引き出された第１配線部と、第１機能部の両端の他方から第１機能部の外に引き出された第２配線部と、第１配線部から第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに一部が重なるように第１方向に延びる第１端部と、第２配線部から第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに一部が重なるように第１端部に沿って延びる第２端部とを有する第１回路を、第１機能部と、第１配線部及び第２配線部と、第１端部及び第２端部のうち第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに重ならない部分とを超音波溶着機を用いてフィルムの第１主面に埋め込んで形成する第１回路形成工程と、
フィルムの第１主面上に配置され、金属細線が絶縁被覆された第２導電線からなり、任意のパターンを有する第２機能部と、第２機能部の両端の一方から第２機能部の外に引き出された第３配線部と、第２機能部の両端の他方から第２機能部の外に引き出された第４配線部と、第３配線部から第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに一部が重なるように第１方向に延びる第３端部と、第４配線部から第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに一部が重なるように第３端部に沿って延びる第４端部とを有する第２回路を、第２機能部と、第３配線部及び第４配線部と、第３端部及び第４端部のうち第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに重ならない部分とを超音波溶着機を用いてフィルムの第１主面に埋め込んで形成する第２回路形成工程と、
第１電極パッドの上に位置する第１導電線の絶縁被覆を除去するとともに、露出した金属細線と第１電極パッドとを電気的に接続する第１接続工程と、
第２電極パッドの上に位置する第１導電線の絶縁被覆を除去するとともに、露出した金属細線と第２電極パッドとを電気的に接続する第２接続工程と、
第３電極パッドの上に位置する第２導電線の絶縁被覆を除去するとともに、露出した金属細線と第３電極パッドとを電気的に接続する第３接続工程と、
第４電極パッドの上に位置する第２導電線の絶縁被覆を除去するとともに、露出した金属細線と第４電極パッドとを電気的に接続する第４接続工程とを備え、
第１端部の両端のうち第１配線部と接続された一端と、第２端部の両端のうち第２配線部と接続された一端と、第３端部の両端のうち第３配線部と接続された一端と、第４端部の両端のうち第４配線部と接続された一端とが、平面視で第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに対して同じ側に配置され、
第１回路形成工程では、超音波溶着機は、超音波振動を与えることによりフィルムの第１導電線との接触面を溶融させるとともに第１導電線をフィルムの第１主面に埋め込むホーンと、ホーンの内部を通りホーンの先端からフィルムの第１主面上に連続的に引き出される第１導電線とを有し、
第２回路形成工程では、超音波溶着機は、超音波振動を与えることによりフィルムの第２導電線との接触面を溶融させるとともに第２導電線をフィルムの第１主面に埋め込むホーンと、ホーンの内部を通りホーンの先端からフィルムの第１主面上に連続的に引き出される第２導電線とを有し、
第１端部、第２端部、第３端部及び第４端部は、第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドと、第１回路及び第２回路との第１方向の位置ずれを吸収する長さを有する、回路埋込基板の製造方法である。 The third invention to achieve the above object is:
a preparation step of preparing a film;
an arrangement step of arranging a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad in parallel to one another at intervals along a first direction on a peripheral edge portion of a first main surface of the film;
a first circuit forming step of embedding the first functional unit, the first wiring unit, the second wiring unit, and portions of the first end and second end that do not overlap with the first electrode pads, the second electrode pads, the third electrode pads, and the fourth electrode pads in the first main surface of the film using an ultrasonic welding machine to form a first circuit having: a first functional unit arranged on the first main surface of the film, the first conductive line being an insulating-coated thin metal wire and having an arbitrary pattern; a first wiring unit drawn from one of both ends of the first functional unit to the outside of the first functional unit; a second wiring unit drawn from the other of both ends of the first functional unit to the outside of the first functional unit; a first end extending from the first wiring unit in a first direction to partially overlap with the first, second, third, and fourth electrode pads; and a second end extending from the second wiring unit along the first end to partially overlap with the first, second, third, and fourth electrode pads;
a second circuit forming step of embedding the second functional section, the third wiring section, the fourth wiring section, and portions of the third end and fourth end that do not overlap with the first electrode pads, the second electrode pads, the third electrode pads, and the fourth electrode pads in the first main surface of the film using an ultrasonic welding machine to form a second circuit having: a second functional section arranged on the first main surface of the film, the second functional section being made of second conductive wires with an insulating coating of thin metal wires and having an arbitrary pattern; a third wiring section drawn out from one of both ends of the second functional section to the outside of the second functional section; a fourth wiring section drawn out from the other of both ends of the second functional section to the outside of the second functional section; a third end portion extending from the third wiring section in the first direction to partially overlap with the first, second, third, and fourth electrode pads; and a fourth end portion extending from the fourth wiring section along the third end to partially overlap with the first, second, third, and fourth electrode pads;
a first connecting step of removing an insulating coating from a first conductive wire located on a first electrode pad and electrically connecting the exposed thin metal wire to the first electrode pad;
a second connecting step of removing the insulating coating of the first conductive wire located on the second electrode pad and electrically connecting the exposed thin metal wire to the second electrode pad;
a third connecting step of removing the insulating coating of the second conductive wire located on the third electrode pad and electrically connecting the exposed thin metal wire and the third electrode pad;
a fourth connecting step of removing the insulating coating of the second conductive wire located on the fourth electrode pad and electrically connecting the exposed thin metal wire and the fourth electrode pad;
one end of the first end connected to the first wiring portion, one end of the second end connected to the second wiring portion, one end of the third end connected to the third wiring portion, and one end of the fourth end connected to the fourth wiring portion are arranged on the same side of the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view;
In the first circuit forming step, the ultrasonic welding machine has a horn that applies ultrasonic vibrations to melt the contact surface of the film with the first conductive wire and embed the first conductive wire in the first main surface of the film, and the first conductive wire passes through the inside of the horn and is continuously drawn out from the tip of the horn onto the first main surface of the film,
In the second circuit forming step, the ultrasonic welding machine has a horn that applies ultrasonic vibrations to melt the contact surface of the film with the second conductive wire and embed the second conductive wire in the first main surface of the film, and the second conductive wire passes through the inside of the horn and is continuously drawn out from the tip of the horn onto the first main surface of the film,
A method for manufacturing a circuit-embedded substrate, wherein the first end, second end, third end, and fourth end have lengths that absorb misalignment in a first direction between the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad and the first circuit and the second circuit.

上記の目的を達成するための第４の発明は、
フィルムを準備する準備工程と、
フィルムの第１主面上の周縁部に、第１方向に沿って第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドを間隔を空けて互いに平行に配置する配置工程と、
フィルムの第１主面上に配置され、金属細線が絶縁被覆された第１導電線からなり、任意のパターンを有する第１機能部と、第１機能部の両端の一方から第１機能部の外に引き出された第１配線部と、第１機能部の両端の他方から第１機能部の外に引き出された第２配線部と、第１配線部から第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに一部が重なるように第１方向に延びる第１端部と、第２配線部から第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに一部が重なるように第１端部に沿って延びる第２端部とを有する第１回路を、第１機能部と、第１配線部及び第２配線部と、第１端部及び第２端部のうち第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに重ならない部分とを超音波溶着機を用いてフィルムの第１主面に埋め込んで形成する第１回路形成工程と、
フィルムの第１主面上に配置され、金属細線が絶縁被覆された第２導電線からなり、任意のパターンを有する第２機能部と、第２機能部の両端の一方から第２機能部の外に引き出された第３配線部と、第２機能部の両端の他方から第２機能部の外に引き出された第４配線部と、第３配線部から第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに一部が重なるように第１方向に延びる第３端部と、第４配線部から第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに一部が重なるように第３端部に沿って延びる第４端部とを有する第２回路を、第２機能部と、第３配線部及び第４配線部と、第３端部及び第４端部のうち第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに重ならない部分とを超音波溶着機を用いてフィルムの第１主面に埋め込んで形成する第２回路形成工程と、
第１電極パッドの上に位置する第１導電線の絶縁被覆を除去するとともに、露出した金属細線と第１電極パッドとを電気的に接続する第１接続工程と、
第２電極パッドの上に位置する第１導電線の絶縁被覆を除去するとともに、露出した金属細線と第２電極パッドとを電気的に接続する第２接続工程と、
第３電極パッドの上に位置する第２導電線の絶縁被覆を除去するとともに、露出した金属細線と第３電極パッドとを電気的に接続する第３接続工程と、
第４電極パッドの上に位置する第２導電線の絶縁被覆を除去するとともに、露出した金属細線と第４電極パッドとを電気的に接続する第４接続工程とを備え、
第１端部の両端のうち第１配線部と接続された一端と、第２端部の両端のうち第２配線部と接続された一端とが、平面視で第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに対して同じ側に配置され、
第３端部の両端のうち第３配線部と接続された一端と、第４端部の両端のうち第４配線部と接続された一端とが、平面視で第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドに対して同じ側に配置され、
第３端部及び第４端部のそれぞれの一端と、第１端部及び第２端部のそれぞれの一端とが、平面視で第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドを挟む位置に配置され、
第１回路形成工程では、超音波溶着機は、超音波振動を与えることによりフィルムの第１導電線との接触面を溶融させるとともに第１導電線をフィルムの第１主面に埋め込むホーンと、ホーンの内部を通りホーンの先端からフィルムの第１主面上に連続的に引き出される第１導電線とを有し、
第２回路形成工程では、超音波溶着機は、超音波振動を与えることによりフィルムの第２導電線との接触面を溶融させるとともに第２導電線をフィルムの第１主面に埋め込むホーンと、ホーンの内部を通りホーンの先端からフィルムの第１主面上に連続的に引き出される第２導電線とを有し、
第１端部、第２端部、第３端部及び第４端部は、第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドと第１回路及び第２回路との第１方向の位置ずれを吸収する長さを有する、回路埋込基板の製造方法である。 The fourth invention to achieve the above object is:
a preparation step of preparing a film;
an arrangement step of arranging a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad in parallel to one another at intervals along a first direction on a peripheral edge portion of a first main surface of the film;
a first circuit forming step of embedding the first functional unit, the first wiring unit, the second wiring unit, and portions of the first end and second end that do not overlap with the first electrode pads, the second electrode pads, the third electrode pads, and the fourth electrode pads in the first main surface of the film using an ultrasonic welding machine to form a first circuit having: a first functional unit arranged on the first main surface of the film, the first conductive line being an insulating-coated thin metal wire and having an arbitrary pattern; a first wiring unit drawn from one of both ends of the first functional unit to the outside of the first functional unit; a second wiring unit drawn from the other of both ends of the first functional unit to the outside of the first functional unit; a first end extending from the first wiring unit in a first direction to partially overlap with the first, second, third, and fourth electrode pads; and a second end extending from the second wiring unit along the first end to partially overlap with the first, second, third, and fourth electrode pads;
a second circuit forming step of embedding the second functional section, the third wiring section, the fourth wiring section, and portions of the third end and fourth end that do not overlap with the first electrode pads, the second electrode pads, the third electrode pads, and the fourth electrode pads in the first main surface of the film using an ultrasonic welding machine to form a second circuit having: a second functional section arranged on the first main surface of the film, the second functional section being made of second conductive wires with an insulating coating of thin metal wires and having an arbitrary pattern; a third wiring section drawn out from one of both ends of the second functional section to the outside of the second functional section; a fourth wiring section drawn out from the other of both ends of the second functional section to the outside of the second functional section; a third end portion extending from the third wiring section in the first direction to partially overlap with the first, second, third, and fourth electrode pads; and a fourth end portion extending from the fourth wiring section along the third end to partially overlap with the first, second, third, and fourth electrode pads;
a first connecting step of removing an insulating coating from a first conductive wire located on a first electrode pad and electrically connecting the exposed thin metal wire to the first electrode pad;
a second connecting step of removing the insulating coating of the first conductive wire located on the second electrode pad and electrically connecting the exposed thin metal wire to the second electrode pad;
a third connecting step of removing the insulating coating of the second conductive wire located on the third electrode pad and electrically connecting the exposed thin metal wire and the third electrode pad;
a fourth connecting step of removing the insulating coating of the second conductive wire located on the fourth electrode pad and electrically connecting the exposed thin metal wire and the fourth electrode pad;
one end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are arranged on the same side with respect to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view;
one end of the third end portion connected to the third wiring portion and one end of the fourth end portion connected to the fourth wiring portion are arranged on the same side with respect to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view;
one end of each of the third end and the fourth end and one end of each of the first end and the second end are arranged at positions sandwiching the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view;
In the first circuit forming step, the ultrasonic welding machine has a horn that applies ultrasonic vibrations to melt the contact surface of the film with the first conductive wire and embed the first conductive wire in the first main surface of the film, and the first conductive wire passes through the inside of the horn and is continuously drawn out from the tip of the horn onto the first main surface of the film,
In the second circuit forming step, the ultrasonic welding machine has a horn that applies ultrasonic vibrations to melt the contact surface of the film with the second conductive wire and embed the second conductive wire in the first main surface of the film, and the second conductive wire passes through the inside of the horn and is continuously drawn out from the tip of the horn onto the first main surface of the film,
A method for manufacturing a circuit-embedded substrate, wherein the first end, second end, third end, and fourth end have lengths that absorb misalignment in a first direction between the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad and the first circuit and the second circuit.

第３及び第４の発明のような製造方法によれば、４つの電極パッドと４つの端部の埋め込み位置とが相対的に第１方向にずれた場合であっても、第１端部、第２端部、第３端部及び第４端部が、第１回路及び第２回路と４つの電極パッドとの第１方向の位置ずれを吸収する長さをそれぞれ有しているため、４つの端部はそれぞれ４つの電極パッドと重なる部分を有する。したがって、第１回路及び第２回路と４つの電極パッドとの位置合わせ精度が上がるため、良品率の向上を図ることができる。 According to manufacturing methods such as those of the third and fourth inventions, even if the embedded positions of the four electrode pads and the four ends are misaligned relative to each other in the first direction, the first end, second end, third end, and fourth end each have lengths that absorb the misalignment in the first direction between the first circuit and second circuit and the four electrode pads, so each of the four ends has a portion that overlaps with the four electrode pads. This improves the alignment accuracy between the first circuit and second circuit and the four electrode pads, thereby improving the yield rate.

本発明の回路埋込基板の製造方法によれば、回路と電極パッドとの位置合わせ精度を上げて、良品率の向上を図ることができる。 The manufacturing method for circuit-embedded substrates of the present invention can improve the alignment accuracy between the circuit and the electrode pads, thereby improving the yield rate.

回路埋込基板の製造方法の第１実施形態を示す模式的な斜視図。1A and 1B are schematic perspective views showing a first embodiment of a method for manufacturing a circuit-embedded substrate. （ａ）第１端部及び第２端部の一例を示す部分拡大図。（ｂ）（ａ）のＡ－Ａ断面図。(a) is a partially enlarged view showing an example of a first end portion and a second end portion, (b) is a cross-sectional view taken along the line AA in (a). 電極パッドが＋Ｘ方向に位置ずれした状態を示す拡大図。FIG. 10 is an enlarged view showing a state in which the electrode pad is misaligned in the +X direction. 電極パッドが－Ｘ方向に位置ずれした状態を示す拡大図。FIG. 10 is an enlarged view showing a state in which the electrode pad is misaligned in the −X direction. 導電線の模式的な断面図。FIG. 回路埋込基板の製造方法の第２実施形態を示す模式的な斜視図。FIG. 10 is a schematic perspective view showing a second embodiment of a method for manufacturing a circuit-embedded substrate. （ａ）第１端部及び第２端部の別の例を示す部分拡大図。（ｂ）（ａ）のＡ－Ａ断面図。(a) is a partially enlarged view showing another example of the first end portion and the second end portion, (b) is a cross-sectional view taken along the line AA in (a); 電極パッドが＋Ｘ方向に位置ずれした状態を示す拡大図。FIG. 10 is an enlarged view showing a state in which the electrode pad is misaligned in the +X direction. 電極パッドが－Ｘ方向に位置ずれした状態を示す拡大図。FIG. 10 is an enlarged view showing a state in which the electrode pad is misaligned in the −X direction. 回路埋込基板の製造方法の第３実施形態を示す模式的な斜視図。FIG. 10 is a schematic perspective view showing a third embodiment of the method for manufacturing a circuit-embedded substrate. 回路埋込基板の製造方法の第４実施形態を示す模式的な斜視図。FIG. 10 is a schematic perspective view showing a fourth embodiment of a method for manufacturing a circuit-embedded substrate. （ａ）従来のフィルムヒータを示す模式的な平面図。（ｂ）（ａ）のＡ－Ａ断面図。(a) A schematic plan view showing a conventional film heater, (b) A cross-sectional view taken along the line AA in (a).

＜第１実施形態＞
（回路埋込基板の概要）
図１（ｆ）を参照して、第１実施形態の回路埋込基板１は、フィルム２と、フィルム２の第１主面２ａ上に配置された導電線３からなる回路４と、第１電極パッド６と、第２電極パッド７とを備えている。
回路４は、機能部４５と、第１配線部４３と、第２配線部４４と、第１端部４１と、第２端部４２とを有する。機能部４５は、任意のパターンを有する。第１配線部４３は、機能部４５の両端の一方４５ａから引き出されている。第２配線部４４は、機能部４５の両端の他方４５ｂから引き出されている。第１端部４１は、第１配線部４３から第１電極パッド６及び第２電極パッド７に一部が重なるように＋Ｘ方向（第１方向）に延びている。第２端部４２は、第２配線部４４から第１電極パッド６及び第２電極パッド７に一部が重なるように第１端部に沿って延びている。そして、図２（ａ）を参照して、第１端部４１の両端のうち第１配線部４３と接続された一端４１ａと、第２端部４２の両端のうち第２配線部４４と接続された一端４２ａとが、平面視で第１電極パッド６及び第２電極パッド７に対して同じ側に配置されている。換言すれば、第１端部４１及び第２端部４２のそれぞれの一端４１ａ，４２ａは、どちらも平面視で２つの電極パッド６，７より－Ｘ方向の位置に配置されている。
なお、機能部４５の両端の他方４５ｂと第２配線部４４との境界は、図１（ｆ）のように明確でなくてもよいし、機能部４５の両端の一方４５ａのように明確であってもよい。 First Embodiment
(Outline of circuit-embedded board)
Referring to FIG. 1( f ), the circuit-embedded substrate 1 of the first embodiment includes a film 2, a circuit 4 consisting of conductive lines 3 arranged on a first main surface 2 a of the film 2, a first electrode pad 6, and a second electrode pad 7.
The circuit 4 has a functional section 45, a first wiring section 43, a second wiring section 44, a first end section 41, and a second end section 42. The functional section 45 has an arbitrary pattern. The first wiring section 43 is drawn out from one end section 45a of the functional section 45. The second wiring section 44 is drawn out from the other end section 45b of the functional section 45. The first end section 41 extends from the first wiring section 43 in the +X direction (first direction) so as to partially overlap the first electrode pad 6 and the second electrode pad 7. The second end section 42 extends from the second wiring section 44 along the first end section so as to partially overlap the first electrode pad 6 and the second electrode pad 7. 2A, one end 41a of the first end 41 that is connected to the first wiring portion 43 and one end 42a of the second end 42 that is connected to the second wiring portion 44 are arranged on the same side of the first electrode pad 6 and the second electrode pad 7 in a plan view. In other words, each of the ends 41a, 42a of the first end 41 and the second end 42 is arranged in a position in the −X direction from the two electrode pads 6, 7 in a plan view.
The boundary between the other end 45b of the functional section 45 and the second wiring section 44 does not have to be clear as in FIG. 1(f), or it may be clear as in one end 45a of the functional section 45.

機能部４５、第１配線部４３及び第２配線部４４は、フィルム２の第１主面２ａに埋め込まれている。図２を参照して、第１端部４１及び第２端部４２のうち電極パッド６，７に重なっている部分は第１主面２ａに埋め込まれておらず、それ以外の部分は埋め込まれている。より詳細には、フィルム２に埋め込まれている部分は、例えば図２（ｂ）のようにＬｄで示された部分である。フィルム２に埋め込まれない部分は、電極パッド６，７の上面に接する部分、及び電極パッド６，７の上面と埋め込み部分（Ｌｄ）との間で斜めになっている部分である。導電線３は２つの電極パッド６，７を跨ぐ必要があるところ、電極パッド６，７の際まで埋め込んで電極パッド６，７を跨ぐのは困難なため、図２（ｂ）に示すような斜めの部分（導電線３がフィルム２に埋め込まれていない部分）が生じる。 The functional portion 45, the first wiring portion 43, and the second wiring portion 44 are embedded in the first main surface 2a of the film 2. Referring to FIG. 2, the portions of the first end portion 41 and the second end portion 42 that overlap the electrode pads 6, 7 are not embedded in the first main surface 2a, while the remaining portions are embedded. More specifically, the portions embedded in the film 2 are, for example, the portions indicated by Ld as shown in FIG. 2(b). The portions not embedded in the film 2 are the portions in contact with the upper surfaces of the electrode pads 6, 7 and the portions that are oblique between the upper surfaces of the electrode pads 6, 7 and the embedded portions ( Ld ). The conductive wire 3 needs to straddle the two electrode pads 6, 7, but it is difficult to embed it all the way to the edge of the electrode pads 6, 7 and straddle the electrode pads 6, 7, resulting in the oblique portions (portions where the conductive wire 3 is not embedded in the film 2) shown in FIG. 2(b).

本実施形態では、機能部４５は発熱部であり、回路埋込基板１はフィルムヒータである。例えば第１電極パッド６にプラスの電圧を印加し、第２電極パッド７にマイナスの電圧を印加することにより、導電線３からなる回路４に電流が生じ、機能部４５が発熱する。機能部４５は、第１配線部４３及び第２配線部４４にそれぞれ接続された両端４５ａ，４５ｂを有し、ループ状のパターン形状を有する。より詳細には、機能部４５は、第１配線部４３との接続部４５ａから＋Ｘ方向に延びた後、＋Ｙ方向、－Ｘ方向、－Ｙ方向へと延びて第２配線部４４との接続部４５ｂに到達するパターン形状である。このように機能部４５は、第１配線部４３及び第２配線部４４との接続部４５ａ，４５ｂを有し、接続部４５ａ，４５ｂからＸＹ平面に広がる任意のパターンを有する。 In this embodiment, the functional portion 45 is a heat-generating portion, and the circuit-embedded substrate 1 is a film heater. For example, applying a positive voltage to the first electrode pad 6 and a negative voltage to the second electrode pad 7 generates a current in the circuit 4 made up of the conductive wires 3, causing the functional portion 45 to heat up. The functional portion 45 has two ends 45a, 45b connected to the first wiring portion 43 and the second wiring portion 44, respectively, and has a loop-shaped pattern. More specifically, the functional portion 45 has a pattern shape that extends from the connection portion 45a with the first wiring portion 43 in the +X direction, then extends in the +Y direction, the -X direction, and the -Y direction to reach the connection portion 45b with the second wiring portion 44. In this way, the functional portion 45 has connection portions 45a, 45b with the first wiring portion 43 and the second wiring portion 44, and has an arbitrary pattern that extends from the connection portions 45a, 45b in the XY plane.

フィルム２は任意の形状とすることができ、本実施形態では矩形状である。フィルム２は透明、不透明又は着色透明のものを用いることができる。フィルム２の材料としては、例えば、エチレン系樹脂、プロピレン系樹脂、ポリオレフィン系樹脂、熱可塑性ポリエステル系樹脂、ポリアミド系樹脂、ポリ塩化ビニル、ポリカーボネート、ＡＢＳ樹脂などの熱可塑性樹脂を用いることができる。これらを２種以上含有するものであってもよい。フィルム２には無機微細粉末あるいは有機フィラー、分散剤、酸化防止剤、相溶化剤、紫外線安定剤、アンチブロッキング剤、帯電防止剤などを適宜添加することができる。フィルム２の厚みは、例えば０．０５ｍｍ～１ｍｍである。 Film 2 can be any shape, and in this embodiment is rectangular. Film 2 can be transparent, opaque, or colored and transparent. Examples of materials that can be used for film 2 include thermoplastic resins such as ethylene-based resins, propylene-based resins, polyolefin-based resins, thermoplastic polyester-based resins, polyamide-based resins, polyvinyl chloride, polycarbonate, and ABS resin. Films containing two or more of these may also be used. Film 2 can contain inorganic fine powders or organic fillers, dispersants, antioxidants, compatibilizers, UV stabilizers, antiblocking agents, antistatic agents, and the like, as appropriate. The thickness of film 2 is, for example, 0.05 mm to 1 mm.

図５を参照して、導電線３は、金属細線３３が絶縁被覆層３４により被覆されたものである。金属細線３３には、例えば、銅、鉄、金、銅ニッケル、ニッケルクロム、鉄ニッケルクロムなど導電性を有する材料を用いることができる。電気抵抗や耐久性、コストの観点から、銅又は銅に亜鉛や鉛、錫、銀、アルミ、ニッケル、ベリリウム、ジルコニウムなどを単独もしくは複数組み合わせた銅合金を用いることが好ましい。金属細線３３の直径は、例えば０．０１ｍｍ～０．５ｍｍである。 Referring to Figure 5, the conductive wire 3 is a thin metal wire 33 coated with an insulating coating layer 34. The thin metal wire 33 can be made of a conductive material such as copper, iron, gold, copper-nickel, nickel-chromium, or iron-nickel-chromium. From the standpoints of electrical resistance, durability, and cost, it is preferable to use copper or a copper alloy made by combining copper with zinc, lead, tin, silver, aluminum, nickel, beryllium, zirconium, or other elements, either singly or in combination. The diameter of the thin metal wire 33 is, for example, 0.01 mm to 0.5 mm.

絶縁被覆層３４は絶縁性の樹脂であり、例えばポリエステル、ポリエチレン、ポリウレタン、ポリ塩化ビニル、ポリアミド、ポリイミド、ポリエステルイミド、ポリアミドイミド、フッ素樹脂等を用いることができる。導電線３の直径は、例えば０．０５ｍｍ～０．３ｍｍである。 The insulating coating layer 34 is made of an insulating resin, such as polyester, polyethylene, polyurethane, polyvinyl chloride, polyamide, polyimide, polyesterimide, polyamideimide, or fluororesin. The diameter of the conductive wire 3 is, for example, 0.05 mm to 0.3 mm.

２つの電極パッド６，７は例えば、銅、リン青銅、黄銅、コルソン合金、ニッケル、モリブデンなど導電性を有する材料を用いることができる。これら材料を母材とし、母材にニッケル、スズ、金、銀、銅などをメッキしたものを用いてもよい。電極パッド６，７の大きさは、例えば５ｍｍ×１０ｍｍである。厚みは、例えば０．１ｍｍである。
なお、本実施形態では電極パッド６，７は四角形状であるが、これに限定されない。例えば、四角形以外の多角形状、円形状、楕円形状、Ｌ字形状などでもよい。 The two electrode pads 6 and 7 can be made of conductive materials such as copper, phosphor bronze, brass, Corson alloy, nickel, and molybdenum. These materials may be used as a base material plated with nickel, tin, gold, silver, copper, or the like. The electrode pads 6 and 7 each have a size of, for example, 5 mm x 10 mm and a thickness of, for example, 0.1 mm.
In this embodiment, the electrode pads 6 and 7 are rectangular, but are not limited to this. For example, they may be polygonal, circular, elliptical, or L-shaped.

（回路埋込基板の製造方法）
このような回路埋込基板１の製造方法の一実施形態を、図１を参照して説明する。
回路埋込基板１の製造方法は、フィルム２を準備する準備工程（図示せず）と、第１電極パッド６及び第２電極パッド７をフィルム２の第１主面２ａ上の周縁部に配置する配置工程（図１（ａ））と、超音波溶着機８を用いて回路４を形成する回路形成工程（図１（ｂ）～図１（ｅ））と、回路４の第１端部４１及び第２端部４２と電極パッド６，７とをそれぞれ電気的に接続する第１及び第２接続工程（図１（ｆ））とを備えている。 (Method for manufacturing circuit-embedded substrate)
An embodiment of a method for manufacturing such a circuit-embedded substrate 1 will be described with reference to FIG.
The manufacturing method of the circuit-embedded substrate 1 includes a preparation step (not shown) of preparing the film 2, an arrangement step (FIG. 1(a)) of arranging the first electrode pads 6 and the second electrode pads 7 on the peripheral portion of the first main surface 2a of the film 2, a circuit formation step (FIGS. 1(b) to 1(e)) of forming the circuit 4 using an ultrasonic welder 8, and first and second connection steps (FIG. 1(f)) of electrically connecting the first end 41 and the second end 42 of the circuit 4 to the electrode pads 6 and 7, respectively.

準備工程では、フィルム２をステージ（図示せず）の上に固定するとよい。また、フィルム２の位置合わせを容易にするために治具（図示せず）を用いてもよい。配置工程では、第１電極パッド６及び第２電極パッド７を、フィルム２の第１主面２ａ上の周縁部に配置する。換言すれば、フィルム２のＸ方向（第１方向）に平行な一辺に沿って、Ｘ方向に並んで配置する。２つの電極パッド６，７は四角形状であり、Ｘ方向に沿って間隔を空けて互いに平行に配置する。２つの電極パッド６，７が、それぞれ回路埋込基板１の端子部となる。２つの電極パッド６，７は、例えば接着剤などを用いて第１主面２ａ上に固定することができる。 In the preparation step, the film 2 may be fixed on a stage (not shown). A jig (not shown) may also be used to facilitate alignment of the film 2. In the placement step, the first electrode pad 6 and the second electrode pad 7 are placed on the periphery of the first main surface 2a of the film 2. In other words, they are placed side by side in the X direction (first direction) along one side of the film 2 that is parallel to the X direction. The two electrode pads 6, 7 are rectangular and are placed parallel to each other with a gap in between along the X direction. The two electrode pads 6, 7 each serve as a terminal portion of the circuit-embedded substrate 1. The two electrode pads 6, 7 can be fixed to the first main surface 2a using, for example, an adhesive.

図１（ｂ）を参照して、回路形成工程で用いる超音波溶着機８は、超音波振動を発生させる発振器（図示せず）と、発振器からの超音波振動を伝播させるホーン８１と、導電線３とを備えている。ホーン８１は、超音波振動を与えることによりフィルム２の導電線３との接触面を溶融させるとともに、導電線３をフィルム２の第１主面２ａに埋め込むことができる。導電線３は、ホーン８１の内部を通り、ホーン８１の先端８１ａからフィルム２の第１主面２ａ上に連続的に引き出される。 Referring to Figure 1(b), the ultrasonic welding machine 8 used in the circuit formation process includes an oscillator (not shown) that generates ultrasonic vibrations, a horn 81 that propagates the ultrasonic vibrations from the oscillator, and conductive wire 3. By applying ultrasonic vibrations, the horn 81 melts the contact surface of the film 2 with the conductive wire 3 and can embed the conductive wire 3 into the first main surface 2a of the film 2. The conductive wire 3 passes through the inside of the horn 81 and is continuously drawn out from the tip 81a of the horn 81 onto the first main surface 2a of the film 2.

回路形成工程は、まず、図１（ｂ）に示すように、ホーン８１から導電線３を所定長さだけ引き出しつつフィルム２の第１主面２ａに埋め込み、第１電極パッド６及び第２電極パッド７の上を－Ｘ方向（第１方向）に跨ぎ、跨ぎ終わりをフィルム２の第１主面２ａに埋め込むことで、第１端部４１を形成する。このとき、第１電極パッド６及び第２電極パッド７に重なる導電線３は第１主面２ａに埋め込まれず、第１電極パッド６及び第２電極パッド７の上面に接触する。
次に、図１（ｃ）～（ｄ）に示すように、第１端部４１の埋め込み終端から＋Ｙ方向に向かって導電線３を所定長さだけ引き出しつつ第１主面２ａに埋め込んで、第１配線部４３を形成する。次に、第１配線部４３の埋め込み終端４３ａから導電線３を所定長さだけ引き出しつつ、ＸＹ平面に広がる任意のパターンで第１主面２ａに埋め込んで機能部４５を形成する。第１配線部４３の埋め込み終端４３ａは、機能部４５の始端となる。換言すると、第１配線部４３の終端４３ａは、機能部４５の両端の一方４５ａとなる（図１（ｄ）参照）。
次に、図１（ｅ）に示すように、ホーン８１から導電線３を所定長さだけ引き出しつつ、機能部４５の終端４５ｂから－Ｙ方向に延びて第１主面２ａに埋め込んで、第２配線部４４を形成する。機能部４５の終端は、第２配線部４４の始端であり、機能部４５の両端の他方４５ｂとなる。第２配線部４４の埋め込み終端４４ａから導電線３を所定長さだけ引き出しつつ、第１端部４１に沿って第１主面２ａに埋め込み、第１電極パッド６及び第２電極パッド７の上を跨ぎ、跨ぎ終わりをフィルム２の第１主面２ａに埋め込むことで、第２端部４２を形成する。このとき、第１電極パッド６及び第２電極パッド７に重なる導電線３は第１主面２ａに埋め込まれず、第１電極パッド６及び第２電極パッド７の上面に接触する。第２端部４２を形成した後、第２端部４２の埋め込み終端で導電線３を切断する。切断方法としては、例えば、カッターやニッパーを用いることができる。
最後に第１及び第２接続工程では、図１（ｆ）の点Ｐに示すように、２つの電極パッド６，７と、２つの電極パッド６，７の上に位置する（上面に接触している）導電線３とをそれぞれ電気的に接続する。接続には、公知の金属接合技術である、溶接（抵抗溶接、超音波溶接、レーザ溶接など）、半田付け、ロウ付けなどを用いることができる。これらの接続方法により、第１端部４１及び第２端部４２の絶縁被覆層３４を熱により溶融して、金属細線３３を露出させるとともに、露出した金属細線３３と各電極パッド６，７の上面とを電気的に接続することができる。なお、第１接続工程と第２接続工程は別々に行ってもよいが、生産効率が向上するため同時に行う方が好ましい。
このようにして、回路埋込基板１を得ることができる。 1(b), the circuit formation process begins by drawing out a predetermined length of conductive wire 3 from horn 81 and embedding it in first main surface 2a of film 2, spanning over first electrode pad 6 and second electrode pad 7 in the −X direction (first direction), and embedding the spanning end in first main surface 2a of film 2, thereby forming first end 41. At this time, the conductive wire 3 overlapping first electrode pad 6 and second electrode pad 7 is not embedded in first main surface 2a, but comes into contact with the upper surfaces of first electrode pad 6 and second electrode pad 7.
1(c) and 1(d), the conductive wires 3 are extracted a predetermined length from the buried terminal end of the first end portion 41 in the +Y direction and embedded in the first main surface 2a to form a first wiring portion 43. Next, the conductive wires 3 are extracted a predetermined length from the buried terminal end 43a of the first wiring portion 43 and embedded in the first main surface 2a in an arbitrary pattern extending in the XY plane to form a functional portion 45. The buried terminal end 43a of the first wiring portion 43 becomes the starting end of the functional portion 45. In other words, the terminal end 43a of the first wiring portion 43 becomes one of both ends 45a of the functional portion 45 (see FIG. 1(d)).
Next, as shown in FIG. 1( e), a predetermined length of the conductive wire 3 is pulled out from the horn 81, extending from the terminal end 45b of the functional portion 45 in the −Y direction and embedded in the first main surface 2a to form the second wiring portion 44. The terminal end of the functional portion 45 is the starting end of the second wiring portion 44, which becomes the other end 45b of the functional portion 45. The conductive wire 3 is pulled out a predetermined length from the embedded terminal end 44a of the second wiring portion 44, embedded in the first main surface 2a along the first end 41, straddling the first electrode pad 6 and the second electrode pad 7, and embedding the end of the bridge in the first main surface 2a of the film 2 to form the second end 42. At this time, the conductive wire 3 overlapping the first electrode pad 6 and the second electrode pad 7 is not embedded in the first main surface 2a but contacts the upper surfaces of the first electrode pad 6 and the second electrode pad 7. After forming the second end 42, the conductive wire 3 is cut at the embedded terminal end of the second end 42. The cutting can be performed using, for example, a cutter or nippers.
Finally, in the first and second connection steps, as shown by point P in FIG. 1( f ), the two electrode pads 6, 7 are electrically connected to the conductive wires 3 located above (in contact with) the two electrode pads 6, 7. For the connection, known metal joining techniques such as welding (resistance welding, ultrasonic welding, laser welding, etc.), soldering, brazing, etc. can be used. These connection methods melt the insulating coating layers 34 of the first end 41 and the second end 42 with heat to expose the thin metal wires 33, and electrically connect the exposed thin metal wires 33 to the upper surfaces of the electrode pads 6, 7. The first and second connection steps may be performed separately, but are preferably performed simultaneously to improve production efficiency.
In this manner, the circuit-embedded substrate 1 can be obtained.

図２（ａ）を参照して、第１端部４１及び第２端部４２は、それぞれ長さＬ４１及びＬ４２を有する。ここで、図２（ｂ）に示すように、第１端部４１は各電極パッド６，７を跨いで、その両端がフィルム２に埋め込まれている。導電線３が埋め込まれる予定の箇所に各電極パッド６，７を配置することはできないため、埋め込み長さをＬｄとすると、各電極パッド６，７の位置ずれ許容長さはＬ４１－２Ｌｄとなる。つまり、この長さＬ４１－２Ｌｄが、各電極パッド６，７と回路４とのＸ方向（第１方向）の位置ずれを吸収する、第１端部４１の実質的な長さである。第２端部４２の長さＬ４２については、第２電極パッド７は第１端部４１の一端４１ａを－Ｘ方向に越えて配置されることはできないため、実質的な位置ずれ許容長さはＬ４１－２Ｌｄである。
なお、図２は、第１電極パッド６及び第２電極パッド７と、第１端部４１及び第２端部４２との位置ずれがない状態を示している。 Referring to FIG. 2( a), the first end 41 and the second end 42 have lengths L41 and L42 , respectively. Here, as shown in FIG. 2( b), the first end 41 straddles the electrode pads 6 and 7, and both ends of the first end 41 are embedded in the film 2. Because the electrode pads 6 and 7 cannot be positioned where the conductive wires 3 are to be embedded, if the embedded length is Ld , the allowable length of misalignment for each electrode pad 6 and 7 is L41-2Ld . In other words, this length L41-2Ld is the effective length of the first end 41 that absorbs misalignment in the X direction (first direction) between the electrode pads 6 and 7 and the circuit 4. Regarding the length L42 of the second end 42, because the second electrode pad 7 cannot be positioned beyond one end 41a of the first end 41 in the -X direction, the effective allowable length of misalignment is L41-2Ld .
FIG. 2 shows a state in which there is no misalignment between the first electrode pads 6 and the second electrode pads 7 and the first end 41 and the second end 42 .

例えば、電極パッド６，７の幅Ｗ６，Ｗ７がそれぞれ５ｍｍ、電極パッド６，７どうしの間隔ＳＰが２ｍｍのとき、第１端部４１の長さＬ４１は２２ｍｍ、第２端部４２の長さＬ４２は２７ｍｍとすることができ、導電線間距離ＳＷは５ｍｍとすることができる。 For example, when the widths W6 and W7 of the electrode pads 6 and 7 are 5 mm, respectively, and the spacing SP between the electrode pads 6 and 7 is 2 mm, the length L41 of the first end 41 can be 22 mm, the length L42 of the second end 42 can be 27 mm, and the distance between the conductive lines SW can be 5 mm.

図３に示すように、電極パッド６，７の位置が＋Ｘ方向にｄだけずれて配置された場合であっても、第１端部４１及び第２端部４２がそれぞれｄよりも大きい長さＬ４１，Ｌ４２を有しているため、電極パッド６，７の位置ずれを吸収することができる。なお、第１電極パッド６の位置ずれ量は、厳密にはｄから埋め込み長さＬｄを差し引いた値（ｄ－Ｌｄ）である。図３では便宜上、位置ずれ後の第１電極パッド６のみを実線で示している。
また、図４に示すように、電極パッド６，７の位置が－Ｘ方向にｄだけずれて配置された場合であっても、第１端部４１及び第２端部４２がそれぞれｄよりも大きい長さＬ４１，Ｌ４２を有しているため、電極パッド６，７の位置ずれを吸収することができる。図４では便宜上、位置ずれ後の第２電極パッド７のみを実線で示している。 3, even if the positions of the electrode pads 6, 7 are shifted by d in the +X direction, the first end 41 and the second end 42 have lengths L 41 and L 42 , respectively, which are greater than d, and therefore the positional shift of the electrode pads 6, 7 can be absorbed. Strictly speaking, the amount of positional shift of the first electrode pad 6 is the value (d-L d ) obtained by subtracting the embedded length L d from d. For convenience, only the first electrode pad 6 after the shift is shown by a solid line in FIG. 3.
4, even if the positions of the electrode pads 6 and 7 are shifted by d in the −X direction, the first end 41 and the second end 42 have lengths L 41 and L 42 that are greater than d, respectively, and therefore can absorb the positional shift of the electrode pads 6 and 7. For convenience, only the second electrode pad 7 after the shift is shown by a solid line in FIG.

このように、第１端部４１及び第２端部４２がそれぞれ長さＬ４１，Ｌ４２を有することにより、フィルム２に対する電極パッド６，７の位置がＸ方向にｄだけずれたとしても、第１端部４１及び第２端部４２は電極パッド６，７に重なる。そのため、第１端部４１及び第２端部４２の埋め込み位置は、電極パッド６，７の位置ずれを考慮する必要がない。つまり、第１端部４１及び第２端部４２は、回路埋込基板１を製造する度に、毎回同じ位置に埋め込めば良い。電極パッド６，７の位置ずれを考慮せずとも、第１端部４１及び第２端部４２と電極パッド６，７との位置合わせが可能になるため、良品率を向上することができる。 In this way, because the first end 41 and the second end 42 have lengths L41 and L42 , respectively, the first end 41 and the second end 42 overlap the electrode pads 6 and 7 even if the positions of the electrode pads 6 and 7 relative to the film 2 are shifted by d in the X direction. Therefore, the embedding positions of the first end 41 and the second end 42 do not need to take into account the positional shift of the electrode pads 6 and 7. In other words, the first end 41 and the second end 42 can be embedded in the same positions every time the circuit-embedded substrate 1 is manufactured. Since it is possible to align the first end 41 and the second end 42 with the electrode pads 6 and 7 without considering the positional shift of the electrode pads 6 and 7, the yield rate can be improved.

＜第２実施形態＞
（回路埋込基板の概要）
図６（ｆ）を参照して、第２実施形態の回路埋込基板１は、フィルム２と、フィルム２の第１主面２ａ上に配置された導電線３からなる回路４と、第１電極パッド６と、第２電極パッド７とを備えている。第１実施形態と異なる点は、機能部４５のパターン形状と、第１端部４１の一端４１ａ及び第２端部４２の一端４２ａの位置である。それ以外の構成については、第１実施形態で説明した内容と同じであるため、説明を省略する。以下、第１実施形態と異なる点を中心に説明する。
第２実施形態では、機能部４５のパターン形状はミアンダ形状である。なお、機能部４５の両端の一方４５ａと第１配線部４３との境界、及び機能部４５の両端の他方４５ｂと第２配線部４４との境界は、図６（ｄ）のように明確でなくてもよいし、両端４５ａ，４５ｂを境に明確であってもよい。 Second Embodiment
(Outline of circuit-embedded board)
6(f), the circuit-embedded board 1 of the second embodiment includes a film 2, a circuit 4 consisting of conductive lines 3 arranged on a first main surface 2a of the film 2, a first electrode pad 6, and a second electrode pad 7. The differences from the first embodiment are the pattern shape of the functional portion 45 and the positions of one end 41a of the first end 41 and one end 42a of the second end 42. The rest of the configuration is the same as that described in the first embodiment, and therefore a description thereof will be omitted. The following description will focus on the differences from the first embodiment.
In the second embodiment, the pattern shape of the functional portion 45 is a meander shape. Note that the boundary between one end 45 a of the functional portion 45 and the first wiring portion 43 and the boundary between the other end 45 b of the functional portion 45 and the second wiring portion 44 do not have to be clear as shown in FIG. 6D , or may be clear at the ends 45 a, 45 b.

（回路埋込基板の製造方法）
このような回路埋込基板１の製造方法の一実施形態を、図６を参照して説明する。
回路埋込基板１の製造方法は、フィルム２を準備する準備工程（図示せず）と、第１電極パッド６及び第２電極パッド７をフィルム２の第１主面２ａ上の周縁部に配置する配置工程（図６（ａ））と、超音波溶着機８を用いて回路４を形成する回路形成工程（図６（ｂ）～図６（ｅ））と、回路４の第１端部４１及び第２端部４２と電極パッド６，７とをそれぞれ電気的に接続する第１及び第２接続工程（図６（ｆ））とを備えている。なお、準備工程、配置工程、回路形成工程の一部（図６（ｂ））、及び第１・第２接続工程（図６（ｆ））は第１実施形態と同様であるため、説明を省略し、図６（ｃ）から説明する。 (Method for manufacturing circuit-embedded substrate)
An embodiment of a method for manufacturing such a circuit-embedded substrate 1 will be described with reference to FIG.
The manufacturing method of the circuit-embedded substrate 1 includes a preparation step (not shown) of preparing the film 2, an arrangement step (FIG. 6(a)) of arranging the first electrode pads 6 and the second electrode pads 7 on the peripheral portion of the first main surface 2a of the film 2, a circuit formation step (FIGS. 6(b) to 6(e)) of forming the circuit 4 using an ultrasonic welder 8, and a first and second connection step (FIG. 6(f)) of electrically connecting the first end 41 and the second end 42 of the circuit 4 to the electrode pads 6, 7, respectively. Note that the preparation step, the arrangement step, part of the circuit formation step (FIG. 6(b)), and the first and second connection steps (FIG. 6(f)) are the same as those in the first embodiment, so their explanation will be omitted and the description will begin with FIG. 6(c).

図６（ｃ）～（ｄ）に示すように、第１端部４１の埋め込み終端４１ａから＋Ｙ方向に向かって導電線３を所定長さだけ引き出しつつ第１主面２ａに埋め込んで、第１配線部４３を形成する。次に、第１配線部４３の埋め込み終端４３ａから導電線３を所定長さだけ引き出しつつ、ＸＹ平面に広がるミアンダ形状で第１主面２ａに埋め込んで機能部４５を形成する。第１配線部４３の埋め込み終端４３ａは、機能部４５の始端となる。換言すると、第１配線部４３の終端４３ａは、機能部４５の両端の一方４５ａとなる（図６（ｄ）参照）。
次に、図６（ｄ）に示すように、ホーン８１から導電線３を所定長さだけ引き出しつつ、機能部４５の終端４５ｂから－Ｙ方向に延びて第１主面２ａに埋め込んで、第２配線部４４を形成する。機能部４５の終端は、第２配線部４４の始端であり、機能部４５の両端の他方４５ｂとなる。
次に、図６（ｅ）に示すように、第２配線部４４の埋め込み終端４４ａから導電線３を所定長さだけ引き出しつつ、第１端部４１に沿って第１主面２ａに埋め込み、第１電極パッド６及び第２電極パッド７の上を跨ぎ、跨ぎ終わりをフィルム２の第１主面２ａに埋め込むことで、第２端部４２を形成する。このとき、第１電極パッド６及び第２電極パッド７に重なる導電線３は第１主面２ａに埋め込まれず、第１電極パッド６及び第２電極パッド７の上面に接触する。第２端部４２を形成した後、第２端部４２の埋め込み終端で導電線３を切断する。 6(c) and 6(d), the conductive wire 3 is extracted a predetermined length from the buried termination 41a of the first end 41 in the +Y direction and embedded in the first main surface 2a to form the first wiring portion 43. Next, the conductive wire 3 is extracted a predetermined length from the buried termination 43a of the first wiring portion 43 and embedded in the first main surface 2a in a meandering shape extending in the XY plane to form the functional portion 45. The buried termination 43a of the first wiring portion 43 becomes the starting end of the functional portion 45. In other words, the termination 43a of the first wiring portion 43 becomes one of both ends 45a of the functional portion 45 (see FIG. 6(d)).
6(d), the conductive wire 3 is pulled out by a predetermined length from the horn 81, and is embedded in the first main surface 2a, extending from the end 45b of the functional portion 45 in the −Y direction, to form the second wiring portion 44. The end of the functional portion 45 is the starting end of the second wiring portion 44, and becomes the other end 45b of the functional portion 45.
6( e), the conductive wire 3 is pulled out by a predetermined length from the buried end 44 a of the second wiring portion 44 and buried in the first main surface 2 a along the first end 41, straddling over the first electrode pad 6 and the second electrode pad 7, and the straddling end is buried in the first main surface 2 a of the film 2, thereby forming the second end 42. At this time, the conductive wire 3 overlapping the first electrode pad 6 and the second electrode pad 7 is not buried in the first main surface 2 a, but is in contact with the upper surfaces of the first electrode pad 6 and the second electrode pad 7. After the second end 42 is formed, the conductive wire 3 is cut at the buried end of the second end 42.

図７（ａ）を参照して、第１端部４１の両端のうち第１配線部４３と接続された一端４１ａと、第２端部４２の両端のうち第２配線部４４と接続された一端４２ａとは、平面視で第１電極パッド６及び第２電極パッド７を挟む位置に配置されている。換言すれば、第１端部４１の一端４１ａは平面視で各電極パッド６，７よりも＋Ｘ方向の位置に配置され、第２端部４２の一端４２ａは平面視で各電極パッド６，７よりも－Ｘ方向の位置に配置されている。 Referring to FIG. 7(a), one end 41a of the first end 41 connected to the first wiring portion 43 and one end 42a of the second end 42 connected to the second wiring portion 44 are positioned to sandwich the first electrode pad 6 and the second electrode pad 7 in a planar view. In other words, one end 41a of the first end 41 is positioned in the +X direction relative to the electrode pads 6 and 7 in a planar view, and one end 42a of the second end 42 is positioned in the -X direction relative to the electrode pads 6 and 7 in a planar view.

第１端部４１及び第２端部４２は、それぞれ長さＬ４１及びＬ４２を有する（Ｌ４１＜Ｌ４２）。ここで、図７（ｂ）に示すように、第１端部４１は各電極パッド６，７を跨いで、その両端がフィルム２に埋め込まれている。導電線３が埋め込まれる予定の箇所に各電極パッド６，７を配置することはできないため、埋め込み長さをＬｄとすると、各電極パッド６，７の位置ずれ許容長さはＬ４１－２Ｌｄとなる。つまり、この長さＬ４１－２Ｌｄが、各電極パッド６，７と回路４とのＸ方向（第１方向）の位置ずれを吸収する、第１端部４１の実質的な長さである。第２端部４２の長さＬ４２については、第２電極パッド７は第１端部４１の他端４１ｂを－Ｘ方向に越えて配置されることはできないため、実質的な位置ずれ許容長さはＬ４１－２Ｌｄである。
なお、図７は、第１電極パッド６及び第２電極パッド７と、第１端部４１及び第２端部４２との位置ずれがない状態を示している。 The first end 41 and the second end 42 have lengths L41 and L42 , respectively ( L41 < L42 ). Here, as shown in FIG. 7(b), the first end 41 straddles the electrode pads 6 and 7, and both ends of the first end 41 are embedded in the film 2. Because the electrode pads 6 and 7 cannot be positioned in the locations where the conductive wires 3 are to be embedded, if the embedded length is Ld , the allowable length of misalignment for each electrode pad 6 and 7 is L41 - 2Ld . In other words, this length L41 - 2Ld is the effective length of the first end 41 that absorbs misalignment in the X direction (first direction) between the electrode pads 6 and 7 and the circuit 4. As for the length L42 of the second end 42 , because the second electrode pad 7 cannot be positioned beyond the other end 41b of the first end 41 in the -X direction, the effective allowable length of misalignment is L41 - 2Ld .
7 shows a state in which there is no misalignment between the first electrode pads 6 and the second electrode pads 7 and the first end 41 and the second end 42. In FIG.

例えば、電極パッド６，７の幅Ｗ６，Ｗ７がそれぞれ５ｍｍ、電極パッド６，７どうしの間隔ＳＰが２ｍｍのとき、第１端部４１の長さＬ４１は２２ｍｍ、第２端部４２の長さＬ４２は２７ｍｍとすることができ、導電線間距離ＳＷは５ｍｍとすることができる。 For example, when the widths W6 and W7 of the electrode pads 6 and 7 are 5 mm, respectively, and the spacing SP between the electrode pads 6 and 7 is 2 mm, the length L41 of the first end 41 can be 22 mm, the length L42 of the second end 42 can be 27 mm, and the distance between the conductive lines SW can be 5 mm.

図８に示すように、電極パッド６，７の位置が＋Ｘ方向にｄだけずれて配置された場合であっても、第１端部４１及び第２端部４２がそれぞれｄよりも大きい長さＬ４１，Ｌ４２を有しているため、電極パッド６，７の位置ずれを吸収することができる。図８では便宜上、位置ずれ後の第１電極パッド６のみを実線で示している。
また、図９に示すように、電極パッド６，７の位置が－Ｘ方向にｄだけずれて配置された場合であっても、第１端部４１及び第２端部４２がそれぞれｄよりも大きい長さＬ４１，Ｌ４２を有しているため、電極パッド６，７の位置ずれを吸収することができる。なお、このとき、第２電極パッド７の位置ずれ量は、厳密にはｄから埋め込み長さＬｄを差し引いた値（ｄ－Ｌｄ）である。図９では便宜上、位置ずれ後の第２電極パッド７のみを実線で示している。 8, even if the positions of the electrode pads 6 and 7 are shifted by d in the +X direction, the first end 41 and the second end 42 have lengths L41 and L42 , respectively, which are greater than d, and therefore can absorb the positional shift of the electrode pads 6 and 7. For convenience, only the first electrode pad 6 after the shift is shown by a solid line in FIG.
9, even if the positions of the electrode pads 6 and 7 are shifted by d in the −X direction, the first end 41 and the second end 42 have lengths L 41 and L 42 , respectively, which are greater than d, and therefore the positional shift of the electrode pads 6 and 7 can be absorbed. Strictly speaking, the amount of positional shift of the second electrode pad 7 is the value (d−L d ) obtained by subtracting the embedded length L d from d. For convenience, only the second electrode pad 7 after the shift is shown by a solid line in FIG.

このように、第１端部４１及び第２端部４２がそれぞれ長さＬ４１，Ｌ４２を有することにより、フィルム２に対する電極パッド６，７の位置がＸ方向にｄだけずれたとしても、第１端部４１及び第２端部４２は電極パッド６，７に重なる。そのため、第１端部４１及び第２端部４２の埋め込み位置は、電極パッド６，７の位置ずれを考慮する必要がない。つまり、第１端部４１及び第２端部４２は、回路埋込基板１を製造する度に、毎回同じ位置に埋め込めば良い。電極パッド６，７の位置ずれを考慮せずとも、第１端部４１及び第２端部４２と電極パッド６，７との位置合わせが可能になるため、良品率を向上することができる。 In this way, because the first end 41 and the second end 42 have lengths L41 and L42 , respectively, the first end 41 and the second end 42 overlap the electrode pads 6 and 7 even if the positions of the electrode pads 6 and 7 relative to the film 2 are shifted by d in the X direction. Therefore, the embedding positions of the first end 41 and the second end 42 do not need to take into account the positional shift of the electrode pads 6 and 7. In other words, the first end 41 and the second end 42 can be embedded in the same positions every time the circuit-embedded substrate 1 is manufactured. Since it is possible to align the first end 41 and the second end 42 with the electrode pads 6 and 7 without considering the positional shift of the electrode pads 6 and 7, the yield rate can be improved.

＜第３実施形態＞
（回路埋込基板の概要）
図１０（ｆ）を参照して、第３実施形態の回路埋込基板１は、フィルム２と、フィルム２の第１主面２ａ上に配置された、第１導電線３１からなる第１回路４と、第２導電線３２からなる第２回路５と、第１電極パッド６と、第２電極パッド７と、第３電極パッド９と、第４電極パッド１０とを備えている。
第１回路４は、第１機能部４５と、第１配線部４３と、第２配線部４４と、第１端部４１と、第２端部４２とを有する。第１機能部４５は、任意のパターンを有する。第１配線部４３は、第１機能部４５の両端の一方４５ａから引き出されている。第２配線部４４は、第１機能部４５の両端の他方４５ｂから引き出されている。第１端部４１は、第１配線部４３から４つの電極パッド６，７，９，１０に一部が重なるように＋Ｘ方向（第１方向）に延びている。第２端部４２は、第２配線部４４から４つの電極パッド６，７，９，１０に一部が重なるように第１端部４１に沿って延びている。
第２回路５は、第２機能部５５と、第３配線部５３と、第４配線部５４と、第３端部５１と、第４端部５２とを有する。第２機能部５５は、任意のパターンを有する。第３配線部５３は、第２機能部５５の両端の一方５５ａから引き出されている。第４配線部５４は、機能部５５の両端の他方５５ｂから引き出されている。第３端部５１は、第３配線部５３から４つの電極パッド６，７，９，１０に一部が重なるように＋Ｘ方向（第１方向）に延びている。第４端部５２は、第４配線部５４から４つの電極パッド６，７，９，１０に一部が重なるように第３端部５１に沿って延びている。
そして、第１端部４１の両端のうち第１配線部４３と接続された一端４１ａと、第２端部４２の両端のうち第２配線部４４と接続された一端４２ａと、第３端部５１の両端のうち第３配線部５３と接続された一端５１ａと、第４端部５２の両端のうち第４配線部５４と接続された一端５２ａとが、平面視で４つの電極パッド６，７，９，１０に対して同じ側に配置されている。換言すれば、４つの端部４１，４２，５１，５２のそれぞれの一端４１ａ，４２ａ，５１ａ，５２ａは、いずれも平面視で４つの電極パッド６，７，９，１０より－Ｘ方向の位置に配置されている。
なお、第２機能部５５の両端の他方５５ｂと第４配線部５４との境界は、図１０（ｅ）のように明確でなくてもよいし、第２機能部５５の両端の一方５５ａのように明確であってもよい。 Third Embodiment
(Outline of circuit-embedded board)
Referring to Figure 10(f), the circuit-embedded substrate 1 of the third embodiment includes a film 2, a first circuit 4 consisting of a first conductive wire 31, a second circuit 5 consisting of a second conductive wire 32, a first electrode pad 6, a second electrode pad 7, a third electrode pad 9, and a fourth electrode pad 10, all of which are arranged on a first main surface 2a of the film 2.
The first circuit 4 has a first functional unit 45, a first wiring unit 43, a second wiring unit 44, a first end 41, and a second end 42. The first functional unit 45 has an arbitrary pattern. The first wiring unit 43 is drawn out from one end 45a of the first functional unit 45. The second wiring unit 44 is drawn out from the other end 45b of the first functional unit 45. The first end 41 extends from the first wiring unit 43 in the +X direction (first direction) so as to partially overlap the four electrode pads 6, 7, 9, and 10. The second end 42 extends from the second wiring unit 44 along the first end 41 so as to partially overlap the four electrode pads 6, 7, 9, and 10.
The second circuit 5 has a second functional portion 55, a third wiring portion 53, a fourth wiring portion 54, a third end portion 51, and a fourth end portion 52. The second functional portion 55 has an arbitrary pattern. The third wiring portion 53 is drawn out from one end 55a of the second functional portion 55. The fourth wiring portion 54 is drawn out from the other end 55b of the functional portion 55. The third end portion 51 extends from the third wiring portion 53 in the +X direction (first direction) so as to partially overlap the four electrode pads 6, 7, 9, and 10. The fourth end portion 52 extends from the fourth wiring portion 54 along the third end portion 51 so as to partially overlap the four electrode pads 6, 7, 9, and 10.
One end 41a of the first end 41 that is connected to the first wiring portion 43, one end 42a of the second end 42 that is connected to the second wiring portion 44, one end 51a of the third end 51 that is connected to the third wiring portion 53, and one end 52a of the fourth end 52 that is connected to the fourth wiring portion 54 are arranged on the same side of the four electrode pads 6, 7, 9, and 10 in a planar view. In other words, the ends 41a, 42a, 51a, and 52a of the four end portions 41, 42, 51, and 52 are all arranged in the −X direction from the four electrode pads 6, 7, 9, and 10 in a planar view.
The boundary between the other end 55b of the second functional section 55 and the fourth wiring section 54 does not have to be clear as in Figure 10 (e), or it may be clear as in one end 55a of the second functional section 55.

（回路埋込基板の製造方法）
このような回路埋込基板１の製造方法の一実施形態を、図１０を参照して説明する。
回路埋込基板１の製造方法は、フィルム２を準備する準備工程（図示せず）と、第１電極パッド６、第２電極パッド７、第３電極パッド９及び第４電極パッド１０を、フィルム２の第１主面２ａ上の周縁部に配置する配置工程（図１０（ａ））と、超音波溶着機８を用いて第１回路４を形成する第１回路形成工程（図１０（ｂ）～図１０（ｃ））と、超音波溶着機８を用いて第２回路５を形成する第２回路形成工程（図１０（ｄ）～図１０（ｅ））と、第１端部４１、第２端部４２、第３端部５１及び第４端部５２と、４つの電極パッド６，７，９，１０とをそれぞれ電気的に接続する第１～第４接続工程（図１０（ｆ））とを備えている。なお、準備工程、配置工程、第１回路形成工程（図１０（ｂ）～図１０（ｃ））、及び第１～第４接続工程（図１０（ｆ））は第１実施形態と同様であるため、説明を省略し、第２回路形成工程（図１０（ｄ）～図１０（ｅ））を説明する。 (Method for manufacturing circuit-embedded substrate)
An embodiment of a method for manufacturing such a circuit-embedded substrate 1 will be described with reference to FIG.
The manufacturing method of the circuit-embedded substrate 1 includes a preparation step (not shown) of preparing the film 2, an arrangement step (FIG. 10(a)) of arranging the first electrode pad 6, the second electrode pad 7, the third electrode pad 9, and the fourth electrode pad 10 on the peripheral portion of the first main surface 2a of the film 2, a first circuit formation step (FIGS. 10(b) to 10(c)) of forming the first circuit 4 using an ultrasonic welder 8, a second circuit formation step (FIGS. 10(d) to 10(e)) of forming the second circuit 5 using the ultrasonic welder 8, and first to fourth connection steps (FIG. 10(f)) of electrically connecting the first end 41, the second end 42, the third end 51, and the fourth end 52 to the four electrode pads 6, 7, 9, and 10, respectively. The preparation process, placement process, first circuit formation process (FIGS. 10(b) to 10(c)), and first to fourth connection processes (FIG. 10(f)) are the same as those in the first embodiment, so their explanations will be omitted and only the second circuit formation process (FIGS. 10(d) to 10(e)) will be explained.

まず、ホーン８１から第２導電線３２を所定長さだけ引き出しつつフィルム２の第１主面２ａに埋め込み、４つの電極パッド６，７，９，１０の上を－Ｘ方向（第１方向）に跨ぎ、跨ぎ終わりをフィルム２の第１主面２ａに埋め込むことで、第３端部５１を形成する。第３端部５１は、第１端部４１及び第２端部４２と平行に形成される。
次に、第３端部５１の埋め込み終端から＋Ｙ方向に向かって第２導電線３２を所定長さだけ引き出しつつ第１主面２ａに埋め込んで、第３配線部５３を形成する。次に、第３配線部５３の埋め込み終端５３ａから第２導電線３２を所定長さだけ引き出しつつ、ＸＹ平面に広がる任意のパターンで第１主面２ａに埋め込んで第２機能部５５を形成する。第３配線部５３の埋め込み終端５３ａは、第２機能部５５の始端となる。換言すると、第３配線部５３の終端５３ａは、第２機能部５５の両端の一方５５ａとなる（図１０（ｅ）参照）。
次に、図１０（ｅ）に示すように、ホーン８１から第２導電線３２を所定長さだけ引き出しつつ、第２機能部５５の終端５５ｂから－Ｙ方向に延びて第１主面２ａに埋め込んで、第４配線部５４を形成する。第２機能部５５の終端は、第４配線部５４の始端であり、第２機能部５５の両端の他方５５ｂとなる。第４配線部５４の埋め込み終端５４ａから第２導電線３２を所定長さだけ引き出しつつ、第３端部５１に沿って第１主面２ａに埋め込み、４つの電極パッド６，７，９，１０の上を＋Ｘ方向に跨ぎ、跨ぎ終わりをフィルム２の第１主面２ａに埋め込むことで、第４端部５２を形成する。 First, the second conductive wire 32 is pulled out from the horn 81 by a predetermined length and embedded in the first main surface 2a of the film 2, and then straddles the four electrode pads 6, 7, 9, and 10 in the −X direction (first direction). The end of the straddle is then embedded in the first main surface 2a of the film 2, thereby forming the third end 51. The third end 51 is formed parallel to the first end 41 and the second end 42.
Next, the second conductive wires 32 are pulled out a predetermined length from the buried terminal end of the third end portion 51 in the +Y direction and embedded in the first main surface 2a to form a third wiring portion 53. Next, the second conductive wires 32 are pulled out a predetermined length from the buried terminal end 53a of the third wiring portion 53 and embedded in the first main surface 2a in an arbitrary pattern extending in the XY plane to form a second functional portion 55. The buried terminal end 53a of the third wiring portion 53 becomes the starting end of the second functional portion 55. In other words, the terminal end 53a of the third wiring portion 53 becomes one of both ends 55a of the second functional portion 55 (see FIG. 10E).
10( e), the second conductive wire 32 is pulled out a predetermined length from the horn 81, and extends from the end 55b of the second functional portion 55 in the −Y direction and embedded in the first main surface 2a to form the fourth wiring portion 54. The end of the second functional portion 55 is the starting end of the fourth wiring portion 54, and becomes the other end 55b of the second functional portion 55. The second conductive wire 32 is pulled out a predetermined length from the embedded end 54a of the fourth wiring portion 54, and embedded in the first main surface 2a along the third end 51, and extends over the four electrode pads 6, 7, 9, and 10 in the +X direction, and the end of the spanning portion is embedded in the first main surface 2a of the film 2 to form the fourth end 52.

第３実施形態では、第１実施形態と同様に、４つの端部４１，４２，５１，５２のそれぞれの一端４１ａ，４２ａ，５１ａ，５２ａが、平面視で４つの電極パッド６，７，９，１０に対して同じ側に配置されている。そのため、第１実施形態と同様の効果を奏する。すなわち、４つの端部４１，４２，５１，５２は、回路埋込基板１を製造する度に、毎回同じ位置に埋め込めば良い。４つの電極パッド６，７，９，１０の位置ずれを考慮せずとも、４つの端部４１，４２，５１，５２と４つの電極パッド６，７，９，１０との位置合わせが可能になるため、良品率を向上することができる。 In the third embodiment, as in the first embodiment, one end 41a, 42a, 51a, 52a of each of the four end portions 41, 42, 51, 52 is positioned on the same side of the four electrode pads 6, 7, 9, 10 in a plan view. This achieves the same effect as the first embodiment. That is, the four end portions 41, 42, 51, 52 can be embedded in the same position each time a circuit-embedded substrate 1 is manufactured. Since it is possible to align the four end portions 41, 42, 51, 52 with the four electrode pads 6, 7, 9, 10 without having to consider misalignment of the four electrode pads 6, 7, 9, 10, the yield rate can be improved.

＜第４実施形態＞
（回路埋込基板の概要）
図１１（ｆ）を参照して、第４実施形態の回路埋込基板１は、フィルム２と、フィルム２の第１主面２ａ上に配置された、第１導電線３１からなる第１回路４と、第２導電線３２からなる第２回路５と、第１電極パッド６と、第２電極パッド７と、第３電極パッド９と、第４電極パッド１０とを備えている。第３実施形態と異なる点は、２つの端部４１，４２のそれぞれの一端４１ａ，４２ａと、２つの端部５１，５２のそれぞれの一端５１ａ，５２ａの位置である。それ以外の構成については、第３実施形態で説明した内容と同じであるため、説明を省略する。以下、第３実施形態と異なる点を中心に説明する。 Fourth Embodiment
(Outline of circuit-embedded board)
11( f), the circuit-embedded substrate 1 of the fourth embodiment includes a film 2, a first circuit 4 consisting of a first conductive wire 31, a second circuit 5 consisting of a second conductive wire 32, a first electrode pad 6, a second electrode pad 7, a third electrode pad 9, and a fourth electrode pad 10, all of which are arranged on a first main surface 2 a of the film 2. The fourth embodiment differs from the third embodiment in the positions of the ends 41 a, 42 a of the two end portions 41, 42, respectively, and the ends 51 a, 52 a of the two end portions 51, 52, respectively. The remaining configuration is the same as that described in the third embodiment, and therefore a description thereof will be omitted. The following description will focus on the differences from the third embodiment.

図１１（ｃ）を参照して、第１端部４１の両端のうち第１配線部４３と接続された一端４１ａと、第２端部４２の両端のうち第２配線部４４と接続された一端４２ａとは、平面視で４つの電極パッド６，７，９，１０よりも＋Ｘ方向の位置に配置されている。そして、図１１（ｆ）を参照して、第３端部５１の両端のうち第３配線部５３と接続された一端５１ａと、第４端部５２の両端のうち第４配線部５４と接続された一端５２ａとは、平面視で４つの電極パッド６，７，９，１０よりも－Ｘ方向の位置に配置されている。つまり、第１端部４１及び第２端部４２のそれぞれの一端４１ａ，４２ａと、第３端部５１及び第４端部５２のそれぞれの一端５１ａ，５２ａとは、４つの電極パッド６，７，９，１０を挟む位置に配置されている。 Referring to FIG. 11(c), one end 41a of the first end 41 connected to the first wiring portion 43 and one end 42a of the second end 42 connected to the second wiring portion 44 are positioned in the +X direction relative to the four electrode pads 6, 7, 9, and 10 in a planar view. Also, referring to FIG. 11(f), one end 51a of the third end 51 connected to the third wiring portion 53 and one end 52a of the fourth end 52 connected to the fourth wiring portion 54 are positioned in the -X direction relative to the four electrode pads 6, 7, 9, and 10 in a planar view. In other words, the ends 41a and 42a of the first end 41 and the second end 42, and the ends 51a and 52a of the third end 51 and the fourth end 52, are positioned so as to sandwich the four electrode pads 6, 7, 9, and 10 therebetween.

（回路埋込基板の製造方法）
このような回路埋込基板１の製造方法の一実施形態を、図１１を参照して説明する。
回路埋込基板１の製造方法は、第１電極パッド６、第２電極パッド７、第３電極パッド９及び第４電極パッド１０を、フィルム２の第１主面２ａ上の周縁部に配置する配置工程（図１１（ａ））と、超音波溶着機８を用いて第１回路４を形成する第１回路形成工程（図１１（ｂ）～図１１（ｃ））と、超音波溶着機８を用いて第２回路５を形成する第２回路形成工程（図１１（ｄ）～図１１（ｅ））と、第１端部４１、第２端部４２、第３端部５１及び第４端部５２と、４つの電極パッド６，７，９，１０とをそれぞれ電気的に接続する第１～第４接続工程（図１１（ｆ））とを備えている。なお、準備工程、配置工程、第２回路形成工程（図１１（ｄ）～図１１（ｅ））、及び第１～第４接続工程（図１１（ｆ））は第３実施形態と同様であるため、説明を省略し、第１回路形成工程（図１１（ｂ）～図１１（ｃ））を説明する。 (Method for manufacturing circuit-embedded substrate)
An embodiment of a method for manufacturing such a circuit-embedded substrate 1 will be described with reference to FIG.
The manufacturing method of the circuit-embedded substrate 1 includes an arrangement step (FIG. 11(a)) of arranging the first electrode pad 6, the second electrode pad 7, the third electrode pad 9, and the fourth electrode pad 10 on the peripheral portion of the first main surface 2a of the film 2, a first circuit formation step (FIGS. 11(b) to 11(c)) of forming the first circuit 4 using an ultrasonic welder 8, a second circuit formation step (FIGS. 11(d) to 11(e)) of forming the second circuit 5 using the ultrasonic welder 8, and first to fourth connection steps (FIG. 11(f)) of electrically connecting the first end 41, the second end 42, the third end 51, and the fourth end 52 to the four electrode pads 6, 7, 9, and 10, respectively. The preparation process, placement process, second circuit formation process (FIGS. 11(d) to 11(e)), and first to fourth connection processes (FIG. 11(f)) are the same as those in the third embodiment, so their explanations will be omitted and only the first circuit formation process (FIGS. 11(b) to 11(c)) will be explained.

まず、ホーン８１から第１導電線３１を所定長さだけ引き出しつつフィルム２の第１主面２ａに埋め込み、４つの電極パッド６，７，９，１０の上を＋Ｘ方向（第１方向）に跨ぎ、跨ぎ終わりをフィルム２の第１主面２ａに埋め込むことで、第１端部４１を形成する。
次に、第１端部４１の埋め込み終端から＋Ｙ方向に向かって第１導電線３１を所定長さだけ引き出しつつ第１主面２ａに埋め込んで、第１配線部４３を形成する。次に、第１配線部４３の埋め込み終端４３ａから第１導電線３１を所定長さだけ引き出しつつ、ＸＹ平面に広がる任意のパターンで第１主面２ａに埋め込んで第１機能部４５を形成する。第１配線部４３の埋め込み終端４３ａは、第１機能部４５の始端となる。換言すると、第１配線部４３の終端４３ａは、第１機能部４５の両端の一方４５ａとなる（図１１（ｂ）参照）。
次に、図１１（ｃ）に示すように、ホーン８１から第１導電線３１を所定長さだけ引き出しつつ、第１機能部４５の終端４５ｂから－Ｙ方向に延びて第１主面２ａに埋め込んで、第２配線部４４を形成する。第１機能部４５の終端は、第２配線部４４の始端であり、第１機能部４５の両端の他方４５ｂとなる。第２配線部４４の埋め込み終端４４ａから第１導電線３１を所定長さだけ引き出しつつ、第１端部４１に沿って第１主面２ａに埋め込み、４つの電極パッド６，７，９，１０の上を－Ｘ方向に跨ぎ、跨ぎ終わりをフィルム２の第１主面２ａに埋め込むことで、第２端部４２を形成する。第２端部４２は第１端部４１に平行に形成される。 First, the first conductive wire 31 is pulled out from the horn 81 by a predetermined length and embedded in the first main surface 2 a of the film 2, and then straddles the four electrode pads 6, 7, 9, and 10 in the +X direction (first direction), and the end of the straddle is embedded in the first main surface 2 a of the film 2 to form the first end 41.
Next, the first conductive wire 31 is pulled out a predetermined length from the buried terminal end 43a of the first end portion 41 in the +Y direction and embedded in the first main surface 2a to form the first wiring portion 43. Next, the first conductive wire 31 is pulled out a predetermined length from the buried terminal end 43a of the first wiring portion 43 and embedded in the first main surface 2a in an arbitrary pattern extending in the XY plane to form the first functional portion 45. The buried terminal end 43a of the first wiring portion 43 becomes the starting end of the first functional portion 45. In other words, the terminal end 43a of the first wiring portion 43 becomes one of both ends 45a of the first functional portion 45 (see FIG. 11B).
Next, as shown in FIG. 11C , a predetermined length of the first conductive wire 31 is pulled out from the horn 81, and then extends from the end 45b of the first functional portion 45 in the −Y direction and embedded in the first main surface 2a to form the second wiring portion 44. The end of the first functional portion 45 is the starting end of the second wiring portion 44, and becomes the other end 45b of the first functional portion 45. The first conductive wire 31 is pulled out a predetermined length from the embedded end 44a of the second wiring portion 44, and then embedded in the first main surface 2a along the first end 41, spanning over the four electrode pads 6, 7, 9, and 10 in the −X direction. The end of the spanning portion is then embedded in the first main surface 2a of the film 2 to form the second end 42. The second end 42 is formed parallel to the first end 41.

第４実施形態では、第２実施形態と同様に、２つの端部４１，４２のそれぞれの一端４１ａ，４２ａが、平面視で４つの電極パッド６，７，９，１０に対して同じ側（＋Ｘ）に配置されている。また、２つの端部５１，５２のそれぞれの一端５１ａ，５２ａが、平面視で４つの電極パッド６，７，９，１０に対して同じ側（－Ｘ）に配置されている。つまり、２組の一端（４１ａ，４２ａ及び５１ａ，５２ａ）が、平面視で４つの電極パッド６，７，９，１０を挟む位置に配置されている。そのため、第２実施形態と同様の効果を奏する。すなわち、４つの端部４１，４２，５１，５２は、回路埋込基板１を製造する度に、毎回同じ位置に埋め込めば良い。４つの電極パッド６，７，９，１０の位置ずれを考慮せずとも、４つの端部４１，４２，５１，５２と４つの電極パッド６，７，９，１０との位置合わせが可能になるため、良品率を向上することができる。 In the fourth embodiment, as in the second embodiment, one end 41a, 42a of each of the two end portions 41, 42 is located on the same side (+X) of the four electrode pads 6, 7, 9, and 10 in a planar view. Furthermore, one end 51a, 52a of each of the two end portions 51, 52 is located on the same side (-X) of the four electrode pads 6, 7, 9, and 10 in a planar view. In other words, the two sets of one ends (41a, 42a and 51a, 52a) are located in positions sandwiching the four electrode pads 6, 7, 9, and 10 in a planar view. Therefore, the same effects as in the second embodiment are achieved. In other words, the four end portions 41, 42, 51, and 52 can be embedded in the same positions each time the circuit-embedded substrate 1 is manufactured. It is possible to align the four ends 41, 42, 51, 52 with the four electrode pads 6, 7, 9, 10 without having to consider misalignment of the four electrode pads 6, 7, 9, 10, thereby improving the yield rate.

１ ：回路埋込基板
２ ：フィルム
２ａ ：第１主面
３ ：導電線
３１ ：第１導電線
３２ ：第２導電線
３３ ：金属細線
３４ ：絶縁被覆層
４ ：（第１）回路
４１ ：第１端部
４２ ：第２端部
４３ ：第１配線部
４４ ：第２配線部
４５ ：（第１）機能部
５ ：第２回路
５１ ：第３端部
５２ ：第４端部
５３ ：第３配線部
５４ ：第４配線部
５５ ：第２機能部
６ ：第１電極パッド
７ ：第２電極パッド
８ ：超音波溶着機
８１ ：ホーン
９ ：第３電極パッド
１０ ：第４電極パッド
１００：フィルムヒータ
２００：フィルム
３００：金属細線
４００：回路
４１０：第１端部
４２０：第２端部
４３０：第１配線部
４４０：第２配線部
４５０：ヒータ部
５００：第１電極パッド
６００：第２電極パッド
７００：接着層 REFERENCE SIGNS LIST 1: Circuit-embedded substrate 2: Film 2a: First main surface 3: Conductive wire 31: First conductive wire 32: Second conductive wire 33: Thin metal wire 34: Insulating coating layer 4: (First) circuit 41: First end 42: Second end 43: First wiring section 44: Second wiring section 45: (First) functional section 5: Second circuit 51: Third end 52: Fourth end 53: Third wiring section 54: Fourth wiring section 55: Second functional section 6: First electrode pad 7: Second electrode pad 8: Ultrasonic welder 81: Horn 9: Third electrode pad 10: Fourth electrode pad 100: Film heater 200: Film 300: Thin metal wire 400: Circuit 410: First end portion 420: Second end portion 430: First wiring portion 440: Second wiring portion 450: Heater portion 500: First electrode pad 600: Second electrode pad 700: Adhesion layer

Claims (4)

フィルムを準備する準備工程と、
前記フィルムの第１主面上の周縁部に、第１方向に沿って第１電極パッド及び第２電極パッドを間隔を空けて互いに平行に配置する配置工程と、
前記フィルムの前記第１主面上に配置され、金属細線が絶縁被覆された導電線からなり、任意のパターンを有する機能部と、前記機能部の両端の一方から前記機能部の外に引き出された第１配線部と、前記機能部の両端の他方から前記機能部の外に引き出された第２配線部と、前記第１配線部から前記第１電極パッド及び前記第２電極パッドに一部が重なるように前記第１方向に延びる第１端部と、前記第２配線部から前記第１電極パッド及び前記第２電極パッドに一部が重なるように前記第１端部に沿って延びる第２端部とを有する回路を、前記機能部と、前記第１配線部及び前記第２配線部と、前記第１端部及び前記第２端部のうち前記第１電極パッド及び前記第２電極パッドに重ならない部分とを超音波溶着機を用いて前記フィルムの前記第１主面に埋め込んで形成する回路形成工程と、
前記第１電極パッドの上に位置する前記導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第１電極パッドとを電気的に接続する第１接続工程と、
前記第２電極パッドの上に位置する前記導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第２電極パッドとを電気的に接続する第２接続工程とを備え、
前記第１端部の両端のうち前記第１配線部と接続された一端と、前記第２端部の両端のうち前記第２配線部と接続された一端とが、平面視で前記第１電極パッド及び前記第２電極パッドに対して同じ側に配置され、
前記超音波溶着機は、超音波振動を与えることにより前記フィルムの前記導電線との接触面を溶融させるとともに前記導電線を前記フィルムの前記第１主面に埋め込むホーンと、前記ホーンの内部を通り前記ホーンの先端から前記フィルムの前記第１主面上に連続的に引き出される前記導電線とを有しており、
前記第１端部及び前記第２端部は、前記第１電極パッド及び前記第２電極パッドと前記回路との前記第１方向の位置ずれを吸収する長さを有する、回路埋込基板の製造方法。 a preparation step of preparing a film;
an arrangement step of arranging first electrode pads and second electrode pads parallel to each other at intervals along a first direction on a peripheral edge portion of the first main surface of the film;
a circuit forming process for forming a circuit including: a functional section disposed on the first main surface of the film, the functional section being made of conductive wires with an insulation coating of thin metal wires and having an arbitrary pattern; a first wiring section drawn out from one of both ends of the functional section to the outside of the functional section; a second wiring section drawn out from the other of both ends of the functional section to the outside of the functional section; a first end section extending from the first wiring section in the first direction to partially overlap the first electrode pads and the second electrode pads; and a second end section extending from the second wiring section along the first end section to partially overlap the first electrode pads and the second electrode pads; and
a first connecting step of removing the insulating coating of the conductive wire located on the first electrode pad and electrically connecting the exposed thin metal wire and the first electrode pad;
a second connecting step of removing the insulating coating of the conductive wire located on the second electrode pad and electrically connecting the exposed thin metal wire and the second electrode pad,
one end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are disposed on the same side with respect to the first electrode pad and the second electrode pad in a plan view,
the ultrasonic welding machine includes a horn that applies ultrasonic vibrations to melt a contact surface of the film with the conductive wire and embed the conductive wire in the first main surface of the film, and the conductive wire passes through the inside of the horn and is continuously drawn out from a tip of the horn onto the first main surface of the film,
The first end and the second end have a length that absorbs misalignment in the first direction between the first electrode pad and the second electrode pad and the circuit. フィルムを準備する準備工程と、
前記フィルムの第１主面上の周縁部に、第１方向に沿って第１電極パッド及び第２電極パッドを間隔を空けて互いに平行に配置する配置工程と、
前記フィルムの前記第１主面上に配置され、金属細線が絶縁被覆された導電線からなり、任意のパターンを有する機能部と、前記機能部の両端の一方から前記機能部の外に引き出された第１配線部と、前記機能部の両端の他方から前記機能部の外に引き出された第２配線部と、前記第１配線部から前記第１電極パッド及び前記第２電極パッドに一部が重なるように前記第１方向に延びる第１端部と、前記第２配線部から前記第１電極パッド及び前記第２電極パッドに一部が重なるように前記第１端部に沿って延びる第２端部とを有する回路を、前記機能部と、前記第１配線部及び前記第２配線部と、前記第１端部及び前記第２端部のうち前記第１電極パッド及び前記第２電極パッドに重ならない部分とを超音波溶着機を用いて前記フィルムの前記第１主面に埋め込んで形成する回路形成工程と、
前記第１電極パッドの上に位置する前記導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第１電極パッドとを電気的に接続する第１接続工程と、
前記第２電極パッドの上に位置する前記導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第２電極パッドとを電気的に接続する第２接続工程とを備え、
前記第１端部の両端のうち前記第１配線部と接続された一端と、前記第２端部の両端のうち前記第２配線部と接続された一端とが、平面視で前記第１電極パッド及び前記第２電極パッドを挟む位置に配置され、
前記超音波溶着機は、超音波振動を与えることにより前記フィルムの前記導電線との接触面を溶融させるとともに前記導電線を前記フィルムの前記第１主面に埋め込むホーンと、前記ホーンの内部を通り前記ホーンの先端から前記フィルムの前記第１主面上に連続的に引き出される前記導電線とを有しており、
前記第１端部及び前記第２端部は、前記第１電極パッド及び前記第２電極パッドと前記回路との前記第１方向の位置ずれを吸収する長さを有する、回路埋込基板の製造方法。 a preparation step of preparing a film;
an arrangement step of arranging first electrode pads and second electrode pads parallel to each other at intervals along a first direction on a peripheral edge portion of the first main surface of the film;
a circuit forming process for forming a circuit including: a functional section disposed on the first main surface of the film, the functional section being made of conductive wires with an insulation coating of thin metal wires and having an arbitrary pattern; a first wiring section drawn out from one of both ends of the functional section to the outside of the functional section; a second wiring section drawn out from the other of both ends of the functional section to the outside of the functional section; a first end section extending from the first wiring section in the first direction to partially overlap the first electrode pads and the second electrode pads; and a second end section extending from the second wiring section along the first end section to partially overlap the first electrode pads and the second electrode pads; and
a first connecting step of removing the insulating coating of the conductive wire located on the first electrode pad and electrically connecting the exposed thin metal wire and the first electrode pad;
a second connecting step of removing the insulating coating of the conductive wire located on the second electrode pad and electrically connecting the exposed thin metal wire and the second electrode pad,
one end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are disposed at positions sandwiching the first electrode pad and the second electrode pad in a plan view,
the ultrasonic welding machine includes a horn that applies ultrasonic vibrations to melt a contact surface of the film with the conductive wire and embed the conductive wire in the first main surface of the film, and the conductive wire passes through the inside of the horn and is continuously drawn out from a tip of the horn onto the first main surface of the film,
The first end and the second end have a length that absorbs misalignment in the first direction between the first electrode pad and the second electrode pad and the circuit. フィルムを準備する準備工程と、
前記フィルムの第１主面上の周縁部に、第１方向に沿って第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドを間隔を空けて互いに平行に配置する配置工程と、
前記フィルムの前記第１主面上に配置され、金属細線が絶縁被覆された第１導電線からなり、任意のパターンを有する第１機能部と、前記第１機能部の両端の一方から前記第１機能部の外に引き出された第１配線部と、前記第１機能部の両端の他方から前記第１機能部の外に引き出された第２配線部と、前記第１配線部から前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに一部が重なるように前記第１方向に延びる第１端部と、前記第２配線部から前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに一部が重なるように前記第１端部に沿って延びる第２端部とを有する第１回路を、前記第１機能部と、前記第１配線部及び前記第２配線部と、前記第１端部及び前記第２端部のうち前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに重ならない部分とを超音波溶着機を用いて前記フィルムの前記第１主面に埋め込んで形成する第１回路形成工程と、
前記フィルムの前記第１主面上に配置され、金属細線が絶縁被覆された第２導電線からなり、任意のパターンを有する第２機能部と、前記第２機能部の両端の一方から前記第２機能部の外に引き出された第３配線部と、前記第２機能部の両端の他方から前記第２機能部の外に引き出された第４配線部と、前記第３配線部から前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに一部が重なるように前記第１方向に延びる第３端部と、前記第４配線部から前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに一部が重なるように前記第３端部に沿って延びる第４端部とを有する第２回路を、前記第２機能部と、前記第３配線部及び前記第４配線部と、前記第３端部及び第４端部のうち前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに重ならない部分とを前記超音波溶着機を用いて前記フィルムの前記第１主面に埋め込んで形成する第２回路形成工程と、
前記第１電極パッドの上に位置する前記第１導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第１電極パッドとを電気的に接続する第１接続工程と、
前記第２電極パッドの上に位置する前記第１導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第２電極パッドとを電気的に接続する第２接続工程と、
前記第３電極パッドの上に位置する前記第２導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第３電極パッドとを電気的に接続する第３接続工程と、
前記第４電極パッドの上に位置する前記第２導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第４電極パッドとを電気的に接続する第４接続工程とを備え、
前記第１端部の両端のうち前記第１配線部と接続された一端と、前記第２端部の両端のうち前記第２配線部と接続された一端と、前記第３端部の両端のうち前記第３配線部と接続された一端と、前記第４端部の両端のうち前記第４配線部と接続された一端とが、平面視で前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに対して同じ側に配置され、
前記第１回路形成工程では、前記超音波溶着機は、超音波振動を与えることにより前記フィルムの前記第１導電線との接触面を溶融させるとともに前記第１導電線を前記フィルムの前記第１主面に埋め込むホーンと、前記ホーンの内部を通り前記ホーンの先端から前記フィルムの前記第１主面上に連続的に引き出される前記第１導電線とを有し、
前記第２回路形成工程では、前記超音波溶着機は、超音波振動を与えることにより前記フィルムの前記第２導電線との接触面を溶融させるとともに前記第２導電線を前記フィルムの前記第１主面に埋め込む前記ホーンと、前記ホーンの内部を通り前記ホーンの先端から前記フィルムの前記第１主面上に連続的に引き出される前記第２導電線とを有し、
前記第１端部、前記第２端部、前記第３端部及び前記第４端部は、前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドと、前記第１回路及び前記第２回路との前記第１方向の位置ずれを吸収する長さを有する、回路埋込基板の製造方法。 a preparation step of preparing a film;
an arrangement step of arranging a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad in parallel to one another at intervals along a first direction on a peripheral edge portion of the first main surface of the film;
a first circuit forming step of embedding, in the first main surface of the film using an ultrasonic welding machine, the first circuit including: a first functional unit arranged on the first main surface of the film, the first conductive line being made of an insulatingly coated thin metal wire and having an arbitrary pattern; a first wiring unit drawn from one of both ends of the first functional unit to the outside of the first functional unit; a second wiring unit drawn from the other of both ends of the first functional unit to the outside of the first functional unit; a first end portion extending from the first wiring unit in the first direction to partially overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; and a second end portion extending from the second wiring unit along the first end portion to partially overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad;
a second circuit forming step of embedding, in the first main surface of the film, the second functional unit, the third wiring unit, the fourth wiring unit, and portions of the third end and fourth end that do not overlap with the first electrode pads, the second electrode pads, the third electrode pads, and the fourth electrode pads, in the first main surface of the film using the ultrasonic welding machine to form a second circuit having a second functional unit arranged on the first main surface of the film, the second functional unit being made of a second conductive wire having an arbitrary pattern and made of an insulating-coated thin metal wire; a third wiring unit drawn from one of both ends of the second functional unit to the outside of the second functional unit; a fourth wiring unit drawn from the other of both ends of the second functional unit to the outside of the second functional unit; a third end portion extending from the third wiring unit in the first direction to partially overlap with the first electrode pads, the second electrode pads, the third electrode pads, and the fourth electrode pads;
a first connecting step of removing the insulating coating of the first conductive wire located on the first electrode pad and electrically connecting the exposed thin metal wire and the first electrode pad;
a second connecting step of removing the insulating coating of the first conductive wire located on the second electrode pad and electrically connecting the exposed thin metal wire and the second electrode pad;
a third connection step of removing the insulating coating of the second conductive wire located on the third electrode pad and electrically connecting the exposed thin metal wire and the third electrode pad;
a fourth connecting step of removing the insulating coating of the second conductive wire located on the fourth electrode pad and electrically connecting the exposed thin metal wire and the fourth electrode pad;
one end of the first end portion connected to the first wiring portion, one end of the second end portion connected to the second wiring portion, one end of the third end portion connected to the third wiring portion, and one end of the fourth end portion connected to the fourth wiring portion are arranged on the same side with respect to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view;
In the first circuit forming step, the ultrasonic welding machine has a horn that applies ultrasonic vibrations to melt a contact surface of the film with the first conductive wire and embed the first conductive wire in the first main surface of the film, and the first conductive wire passes through the inside of the horn and is continuously drawn out from a tip of the horn onto the first main surface of the film,
In the second circuit forming step, the ultrasonic welding machine has the horn that applies ultrasonic vibrations to melt a contact surface of the film with the second conductive wire and embed the second conductive wire in the first main surface of the film, and the second conductive wire passes through the inside of the horn and is continuously drawn out from a tip of the horn onto the first main surface of the film,
a first end portion, a second end portion, a third end portion, and a fourth end portion each having a length that absorbs misalignment in the first direction between the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad and the first circuit and the second circuit; フィルムを準備する準備工程と、
前記フィルムの第１主面上の周縁部に、第１方向に沿って第１電極パッド、第２電極パッド、第３電極パッド及び第４電極パッドを間隔を空けて互いに平行に配置する配置工程と、
前記フィルムの前記第１主面上に配置され、金属細線が絶縁被覆された第１導電線からなり、任意のパターンを有する第１機能部と、前記第１機能部の両端の一方から前記第１機能部の外に引き出された第１配線部と、前記第１機能部の両端の他方から前記第１機能部の外に引き出された第２配線部と、前記第１配線部から前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに一部が重なるように前記第１方向に延びる第１端部と、前記第２配線部から前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに一部が重なるように前記第１端部に沿って延びる第２端部とを有する第１回路を、前記第１機能部と、前記第１配線部及び前記第２配線部と、前記第１端部及び前記第２端部のうち前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに重ならない部分とを超音波溶着機を用いて前記フィルムの前記第１主面に埋め込んで形成する第１回路形成工程と、
前記フィルムの前記第１主面上に配置され、金属細線が絶縁被覆された第２導電線からなり、任意のパターンを有する第２機能部と、前記第２機能部の両端の一方から前記第２機能部の外に引き出された第３配線部と、前記第２機能部の両端の他方から前記第２機能部の外に引き出された第４配線部と、前記第３配線部から前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに一部が重なるように前記第１方向に延びる第３端部と、前記第４配線部から前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに一部が重なるように前記第３端部に沿って延びる第４端部とを有する第２回路を、前記第２機能部と、前記第３配線部及び前記第４配線部と、前記第３端部及び第４端部のうち前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに重ならない部分とを前記超音波溶着機を用いて前記フィルムの前記第１主面に埋め込んで形成する第２回路形成工程と、
前記第１電極パッドの上に位置する前記第１導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第１電極パッドとを電気的に接続する第１接続工程と、
前記第２電極パッドの上に位置する前記第１導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第２電極パッドとを電気的に接続する第２接続工程と、
前記第３電極パッドの上に位置する前記第２導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第３電極パッドとを電気的に接続する第３接続工程と、
前記第４電極パッドの上に位置する前記第２導電線の前記絶縁被覆を除去するとともに、露出した前記金属細線と前記第４電極パッドとを電気的に接続する第４接続工程とを備え、
前記第１端部の両端のうち前記第１配線部と接続された一端と、前記第２端部の両端のうち前記第２配線部と接続された一端とが、平面視で前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに対して同じ側に配置され、
前記第３端部の両端のうち前記第３配線部と接続された一端と、前記第４端部の両端のうち前記第４配線部と接続された一端とが、平面視で前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドに対して同じ側に配置され、
前記第３端部及び前記第４端部のそれぞれの前記一端と、前記第１端部及び前記第２端部のそれぞれの前記一端とが、平面視で前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドを挟む位置に配置され、
前記第１回路形成工程では、前記超音波溶着機は、超音波振動を与えることにより前記フィルムの前記第１導電線との接触面を溶融させるとともに前記第１導電線を前記フィルムの前記第１主面に埋め込むホーンと、前記ホーンの内部を通り前記ホーンの先端から前記フィルムの前記第１主面上に連続的に引き出される前記第１導電線とを有し、
前記第２回路形成工程では、前記超音波溶着機は、超音波振動を与えることにより前記フィルムの前記第２導電線との接触面を溶融させるとともに前記第２導電線を前記フィルムの前記第１主面に埋め込む前記ホーンと、前記ホーンの内部を通り前記ホーンの先端から前記フィルムの前記第１主面上に連続的に引き出される前記第２導電線とを有し、
前記第１端部、前記第２端部、前記第３端部及び前記第４端部は、前記第１電極パッド、前記第２電極パッド、前記第３電極パッド及び前記第４電極パッドと前記第１回路及び前記第２回路との前記第１方向の位置ずれを吸収する長さを有する、回路埋込基板の製造方法。 a preparation step of preparing a film;
an arrangement step of arranging a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad in parallel to one another at intervals along a first direction on a peripheral edge portion of the first main surface of the film;
a first circuit forming step of embedding, in the first main surface of the film using an ultrasonic welding machine, the first circuit including: a first functional unit arranged on the first main surface of the film, the first conductive line being made of an insulatingly coated thin metal wire and having an arbitrary pattern; a first wiring unit drawn from one of both ends of the first functional unit to the outside of the first functional unit; a second wiring unit drawn from the other of both ends of the first functional unit to the outside of the first functional unit; a first end portion extending from the first wiring unit in the first direction to partially overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; and a second end portion extending from the second wiring unit along the first end portion to partially overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad;
a second circuit forming step of embedding, in the first main surface of the film, the second functional unit, the third wiring unit, the fourth wiring unit, and portions of the third end and fourth end that do not overlap with the first electrode pads, the second electrode pads, the third electrode pads, and the fourth electrode pads, in the first main surface of the film using the ultrasonic welding machine to form a second circuit having a second functional unit arranged on the first main surface of the film, the second functional unit being made of a second conductive wire having an arbitrary pattern and made of an insulating-coated thin metal wire; a third wiring unit drawn from one of both ends of the second functional unit to the outside of the second functional unit; a fourth wiring unit drawn from the other of both ends of the second functional unit to the outside of the second functional unit; a third end portion extending from the third wiring unit in the first direction to partially overlap with the first electrode pads, the second electrode pads, the third electrode pads, and the fourth electrode pads;
a first connecting step of removing the insulating coating of the first conductive wire located on the first electrode pad and electrically connecting the exposed thin metal wire and the first electrode pad;
a second connecting step of removing the insulating coating of the first conductive wire located on the second electrode pad and electrically connecting the exposed thin metal wire and the second electrode pad;
a third connecting step of removing the insulating coating of the second conductive wire located on the third electrode pad and electrically connecting the exposed thin metal wire and the third electrode pad;
a fourth connecting step of removing the insulating coating of the second conductive wire located on the fourth electrode pad and electrically connecting the exposed thin metal wire and the fourth electrode pad;
one end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are arranged on the same side with respect to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view;
one end of the third end portion connected to the third wiring portion and one end of the fourth end portion connected to the fourth wiring portion are arranged on the same side with respect to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view;
the one end of each of the third end portion and the fourth end portion and the one end of each of the first end portion and the second end portion are disposed at positions sandwiching the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view,
In the first circuit forming step, the ultrasonic welding machine has a horn that applies ultrasonic vibrations to melt a contact surface of the film with the first conductive wire and embed the first conductive wire in the first main surface of the film, and the first conductive wire passes through the inside of the horn and is continuously drawn out from a tip of the horn onto the first main surface of the film,
In the second circuit forming step, the ultrasonic welding machine has the horn that applies ultrasonic vibrations to melt a contact surface of the film with the second conductive wire and embed the second conductive wire in the first main surface of the film, and the second conductive wire passes through the inside of the horn and is continuously drawn out from a tip of the horn onto the first main surface of the film,
a first end portion, a second end portion, a third end portion, and a fourth end portion each having a length that absorbs misalignment in the first direction between the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad and the first circuit and the second circuit;
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DE112024000428.8T DE112024000428T5 (en) 2023-04-27 2024-03-07 METHOD FOR MANUFACTURING A CONDUCTOR BOARD WITH EMBEDDED CIRCUIT
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096125A (en) 2012-11-12 2014-05-22 Toppan Tdk Label Co Ltd Method of manufacturing non-contact communication medium, non-contact communication medium, and method of connecting antenna and circuit device
JP2019169417A (en) 2018-03-26 2019-10-03 株式会社トッパンインフォメディア Film heater
JP2022066706A (en) 2020-10-19 2022-05-02 東京特殊電線株式会社 Film heater and manufacturing method thereof

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JPH0628793Y2 (en) * 1988-06-30 1994-08-03 日本電気株式会社 Sheet heater

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096125A (en) 2012-11-12 2014-05-22 Toppan Tdk Label Co Ltd Method of manufacturing non-contact communication medium, non-contact communication medium, and method of connecting antenna and circuit device
JP2019169417A (en) 2018-03-26 2019-10-03 株式会社トッパンインフォメディア Film heater
JP2022066706A (en) 2020-10-19 2022-05-02 東京特殊電線株式会社 Film heater and manufacturing method thereof

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