JP7728683B2 - Camera module inspection device, camera module inspection method, and image generating device - Google Patents

Description

The present invention relates to a camera module inspection device, a camera module inspection method, and an image generation device.

An image sensing device is a type of semiconductor device that converts optical information into an electrical signal. Examples of image sensing devices include charge-coupled devices (CCDs) and complementary metal-oxide semiconductor (CMOS) image sensing devices.

CMOS image sensors are abbreviated as CIS (CMOS image sensor). A CIS includes multiple pixels arranged two-dimensionally. Each pixel includes, for example, a photodiode (PD). The photodiode converts incident light into an electrical signal.

Recently, with the development of the computer and communications industries, there has been an increasing demand for improved performance image sensors in a variety of fields, including digital cameras, camcorders, smartphones, game consoles, security cameras, medical microcameras, and robots.

Camera modules used in electronic devices include image sensors. Camera module inspection devices sort camera modules to improve the performance of camera modules containing image sensors and prevent defects. That is, the camera module inspection device determines whether a camera module is defective, and if so, stores correction data corresponding to the defect in the camera module, thereby improving the performance of the camera module.

International Publication No. 2019/096541

The present invention has been made in consideration of the above-mentioned conventional technology, and its object is to provide a camera module inspection device, a camera module inspection method, and an image generation device with improved performance.

In order to achieve the above object, one aspect of the present invention provides a camera module testing system comprising: a coefficient data extractor detachably connected to a camera module; and a testing device detachably connected to the camera module for testing the camera module. The coefficient data extractor includes a coefficient generator that receives an image signal output from the camera module and generates coefficient data corresponding to a ratio between a first color image signal and a second color image signal included in the image signal; and a memory device that stores the coefficient data. The testing device includes an image generator that receives the image signal from the camera module and the coefficient data from the memory device and generates a converted pattern image signal based on the image signal and the coefficient data; and a correction data generator that generates correction data based on the converted pattern image signal.

In order to achieve the above object, one aspect of the present invention provides a camera module inspection device that includes a memory that stores first coefficient data generated based on the ratio between a first color image signal and a second color image signal output by sensing light transmitted through a first color filter having a first arrangement, and second coefficient data generated based on the ratio between a third color image signal and a fourth color image signal output by sensing light transmitted through a second color filter having a second arrangement different from the first arrangement, and an image conversion device that selects one of the first and second coefficient data based on the arrangement of the color filters included in the image sensor of the camera module and converts the image output from the image sensor.

In order to achieve the above object, one aspect of the present invention provides a camera module inspection method, comprising the steps of: providing light to a first camera module; receiving a first image signal output from the first camera module in response to the light; generating coefficient data corresponding to a ratio between a first color image signal and a second color image signal included in the first image signal; storing the generated coefficient data; providing light to a second camera module; receiving a second image signal output from the second camera module in response to the light and the stored coefficient data; generating a first conversion pattern image signal based on the second image signal and the coefficient data; and generating first correction data for the first conversion pattern image signal.

The camera module of the present invention can output an image signal with improved image quality by correcting the image signal using correction data generated from the camera module inspection system.

FIG. 1 is a block diagram of an example of a camera module inspection system according to one embodiment. FIG. 2 is a block diagram of the camera module of FIG. 1 . FIG. 1 illustrates a conceptual layout of an image sensor according to one embodiment. FIG. 2 is a diagram illustrating a pixel array according to an embodiment. 5 is a cross-sectional view of the pixel array taken along line AA in FIG. 4. FIG. 4 is a diagram illustrating an image signal according to an embodiment. FIG. 10 is a diagram illustrating a coefficient data extractor according to an embodiment. FIG. 8 is a block diagram of the coefficient data extractor of FIG. 7. 10 is a flowchart illustrating the operation of a coefficient data extractor according to one embodiment. 1 is a graph illustrating quantum efficiency of an image signal according to an embodiment. 1 is a diagram for explaining a camera module inspection device according to an embodiment; FIG. 12 is a block diagram of the camera module inspection device of FIG. 11. 10 is a flowchart illustrating an operation of the camera module inspection device according to an embodiment. 14 is a diagram for explaining the operation of the camera module inspection device of FIGS. 11 to 13. FIG. 14 is a diagram for explaining the operation of the camera module inspection device of FIGS. 11 to 13. FIG. FIG. 1 is a block diagram of an example of an image sensing device according to one embodiment. FIG. 2 is a block diagram of another example of an image sensing device according to an embodiment. FIG. 10 is a block diagram of another example of a camera module inspection system according to an embodiment. FIG. 19 is a block diagram of the camera module inspection device of FIG. 18. FIG. 10 is a block diagram of an example of a camera module inspection system according to another embodiment. FIG. 10 is a block diagram of another example of a camera module inspection system according to another embodiment. 22 is a flowchart for explaining the operation of the camera module inspection system of FIG. 21. FIG. 10 is a block diagram illustrating an electronic device including a multi-camera module according to another embodiment. FIG. 24 is a detailed block diagram of the camera module of FIG. 23.

Specific examples of embodiments of the present invention will be described in detail below with reference to the drawings.

Embodiments of the present invention, such as those in the general technical field, are described as blocks that perform the described functions. In this specification, blocks, referred to as units, modules, or the like, include logic gates, integrated circuits, microprocessors, microcontrollers, memory circuits, passive electronic components, active electronic components, optical components, wiring circuits, and the like, and are driven by firmware and/or software. For example, circuits may be implemented on one or more semiconductor chips or substrate supports such as printed circuit boards. The circuits constituting the blocks may be implemented by dedicated hardware or processors (e.g., one or more programmed microprocessors and associated circuitry), or a combination of dedicated hardware that performs some of the functions of the block and processors that perform functions different from the dedicated hardware that performs some of the functions of the block. Each block of the embodiments may be physically separated into two or more interacting blocks and individual blocks without departing from the scope of the inventive concept. Similarly, the blocks of the embodiments may be combined into more physically complex blocks without departing from the scope of the inventive concept.

Figure 1 is a block diagram of an example camera module inspection system according to one embodiment. Figure 2 is a block diagram of the camera module of Figure 1.

Referring to FIG. 1, the camera module inspection system 1 includes a coefficient data extractor 10 and a camera module inspection device 50. Here, the coefficient data extractor 10 and the camera module inspection device 50 are shown as separate entities, but embodiments according to the technical concept of the present invention are not limited thereto. For example, the coefficient data extractor 10 and the camera module inspection device 50 may be implemented as a single device and operate in the same environment.

The coefficient data extractor 10 receives the camera module 100 and extracts coefficient data CD for the camera module 100. The camera module 100 is connected to the coefficient data extractor 10. That is, the camera module 100 is not included in or a part of the camera module inspection system 1. For example, the fact that the coefficient data extractor 10 receives the camera module 100 means that the camera module 100 is or will be detachably connected to the coefficient data extractor 10. The coefficient data extractor 10 provides the extracted coefficient data CD to the camera module inspection device 50.

The camera module inspection device 50 accommodates the camera module 100 and converts the image signal output from the camera module 100 into another image signal based on the coefficient data CD. For example, the camera module inspection device 50 accommodating the camera module 100 means that the camera module 100 is detachably connected to the camera module inspection device 50 or is detachably connected to the camera module inspection device 50. In addition, the camera module inspection device 50 generates correction data CRD using the converted image signal.

Here, the camera module 100 used in the camera module inspection device 50 is the same as the camera module 100 used in the coefficient data extractor 10. However, embodiments according to the technical concept of the present invention are not limited to this, and the camera module 100 used in the camera module inspection device 50 may be different from the camera module 100 used in the coefficient data extractor 10.

The camera module inspection device 50 provides the generated correction data CRD to the camera module 100. The correction data CRD includes information on whether or not there is a defect in the camera module 100.

Referring to FIG. 2, the camera module 100 includes an image sensor 101, an image signal processor 180, and a memory device 190.

The image sensor 101 senses an image of a sensing target using light and generates an image signal IS. In one embodiment, the generated image signal IS is, for example, a digital signal, but embodiments according to the technical concepts of the present invention are not limited thereto, and the generated image signal IS may be an analog signal.

The image signal IS is provided to the image signal processor 180 for processing. The image signal processor 180 receives the image signal IS output from the buffer unit 170 of the image sensor 101 and processes or processes the received image signal IS for easy display.

In one embodiment, the image signal processor 180 performs digital binning on the image signal IS output from the image sensor 101. The image signal IS output from the image sensor 101 is either a raw image signal from the pixel array PA that does not undergo analog binning, or an image signal IS that has already undergone analog binning.

In one embodiment, the image sensor 101 and the image signal processor 180 are disposed separately from each other as shown in the drawing. For example, the image sensor 101 is mounted on a first chip, and the image signal processor 180 is mounted on a second chip, communicating via a predetermined interface. However, the embodiment is not limited to this, and the image sensor 101 and the image signal processor 180 may be implemented in a single package, for example, an MCP (multi-chip package).

The image signal processor 180 is connected to a memory device 190. The memory device 190 stores correction data CRD. Here, the correction data CRD is provided from the camera module inspection system 1 of FIG. 1. The memory device 190 includes a non-volatile memory device. For example, the memory device 190 includes a memory chip such as a non-volatile memory (e.g., ROM or flash memory).

The memory device 190 provides the stored correction data CRD to the image signal processor 180. The image signal processor 180 corrects the image signal IS using the correction data CRD and outputs the corrected image signal IS'. The image signal IS' is provided to a display (not shown), and the corresponding image is displayed. However, embodiments according to the technical concept of the present invention are not limited thereto, and the image signal IS may be output and displayed.

The image sensor 101 includes a control register block 110, a timing generator 120, a row driver 130, a pixel array PA, a readout circuit 150, a ramp signal generator 160, and a buffer unit 170.

The control register block 110 controls the overall operation of the image sensor 101. In particular, the control register block 110 transmits operation signals directly to the timing generator 120, the ramp signal generator 160, and the buffer unit 170.

The timing generator 120 generates a signal that serves as a reference for the operation timing of various components of the image sensor 101. The operation timing reference signal generated by the timing generator 120 is transmitted to the row driver 130, readout circuit 150, ramp signal generator 160, etc.

The ramp signal generator 160 generates and transmits a ramp signal used by the readout circuit 150. For example, the readout circuit 150 includes a correlated double sampler (CDS), a comparator, etc., and the ramp signal generator 160 generates and transmits a ramp signal used by the correlated double sampler (CDS), a comparator, etc.

The buffer unit 170 includes, for example, a latch unit. The buffer unit 170 temporarily stores the image signal IS to be provided to the outside and transmits the image signal IS to an external memory or an external device. The buffer unit 170 includes, for example, a DRAM or an SRAM. However, embodiments according to the technical concept of the present invention are not limited thereto, and the buffer unit 170 may also include a memory such as an MRAM.

The pixel array PA senses an external image. The pixel array PA includes a plurality of pixels (or unit pixels). The row driver 130 selectively activates rows of the pixel array PA.

The readout circuit 150 samples the pixel signal provided by the pixel array PA, compares it with the ramp signal, and then converts the analog image signal (data) into a digital image signal (data) based on the comparison result.

Figure 3 shows a conceptual layout of an image sensor according to one embodiment.

Referring to FIG. 3, the image sensor 101 includes a first region S1 and a second region S2 stacked in a first direction (e.g., a vertical direction). The first region S1 and the second region S2 extend in second and third directions perpendicular to the first direction as shown in the drawing, and the blocks shown in FIG. 2 are arranged in the first region S1 and the second region S2.

Although not shown in the drawing, a third region in which memory is disposed is disposed below the second region S2. In this case, the memory disposed in the third region receives image data transmitted from the first region S1 and the second region S2, stores or processes the image data, and retransmits the image data to the first region S1 and the second region S2. In this case, the memory includes memory devices such as DRAM (dynamic random access memory) devices, SRAM (static random access memory) devices, STT-MRAM (spin transfer torque magnetic random access memory) devices, and flash memory devices. When the memory includes, for example, a DRAM device, the memory processes image data transmitted at a relatively high speed. In one embodiment, the memory is disposed in the second region S2.

The first region S1 includes the pixel array PA and the first peripheral region PH1, and the second region S2 includes the logic circuit region LC and the second peripheral region PH2. The first region S1 and the second region S2 are stacked one above the other.

In the first region S1, the pixel array PA is the same as the pixel array PA described with reference to FIG. 2. The pixel array PA includes a plurality of unit pixels arranged in a matrix. Each pixel includes a photodiode and a transistor. This will be described in more detail below.

The first peripheral region PH1 includes multiple pads and is arranged around the pixel array PA. The multiple pads send and receive electrical signals to and from external devices, etc.

In the second region S2, the logic circuit region LC includes electronic elements including a plurality of transistors. The electronic elements included in the logic circuit region LC are electrically connected to the pixel array PA and provide a constant signal or control an output signal to each unit pixel of the pixel array PA.

In the logic circuit region LC, for example, the control register block 110, timing generator 120, row driver 130, readout circuit 150, ramp signal generator 160, buffer unit 170, etc. described with reference to FIG. 2 are arranged. In the logic circuit region LC, for example, the blocks in FIG. 2 other than the pixel array PA are arranged.

In the second region S2, a second peripheral region PH2 is also arranged in an area corresponding to the first peripheral region PH1 in the first region S1, but the embodiment is not limited to this.

Figure 4 is a diagram illustrating a pixel array according to one embodiment. Figure 5 is a cross-sectional view of the pixel array taken along line A-A in Figure 4.

Referring to FIG. 4, the pixel array PA includes a plurality of unit pixels PX. The plurality of unit pixels PX are arranged two-dimensionally. For example, the plurality of unit pixels PX are repeatedly arranged in the second and third directions (see FIG. 3). The unit pixels PX are arranged at regular intervals. For example, the pixel array PA is arranged in a Bayer pattern. However, embodiments according to the technical concept of the present invention are not limited thereto, and the pixel array PA may be arranged in a tetrahedral pattern, a nona pattern, or the like.

Referring to FIG. 5, the pixel array PA includes unit pixels PX1 and PX2. The unit pixels PX1 and PX2 are arranged adjacent to each other.

The pixel array PA includes substrates (146W, 146B), photoelectric transistors (148W, 148B), an anti-reflection film 147, a side anti-reflection film 144, color filters (143W, 143B), an upper planarization film 142, a lower planarization film 145, and microlenses (141-1, 141-2).

The substrates (146W, 146B) may be, for example, P-type or N-type bulk substrates, P-type or N-type epitaxial layers grown on P-type bulk substrates, or N-type epitaxial layers grown on N-type bulk substrates. In addition to semiconductor substrates, organic plastic substrates may also be used for the substrates (146W, 146B).

The phototransistors (148W, 148B) are photodiodes, phototransistors, photogates, pinned photodiodes, or combinations thereof.

The anti-reflection film 147 and the side anti-reflection film 144 prevent light incident on the microlenses (141-1, 141-2) from penetrating into the W and B regions, respectively. The anti-reflection film 147 and the side anti-reflection film 144 are made of insulating films such as silicon oxide, silicon nitride, silicon oxynitride, resin, and combinations or stacks of these, but the embodiment is not limited thereto.

The upper planarization layer 142 and the lower planarization layer 145 are formed flat with the color filters (143W, 143B) interposed therebetween. The upper planarization layer 142 and the lower planarization layer 145 include at least one of a silicon oxide-based material, a silicon nitride-based material, a resin, or a combination thereof, but the embodiment is not limited thereto.

Figure 6 is a diagram illustrating an image signal according to one embodiment.

Referring to FIG. 6, the image signal IS is a signal output by the image sensor 101 after sensing light from the pixel array PA. For example, light passes through the color filters (143W, 143B) of the pixel array PA and reaches the phototransistors (148W, 148B), and in response, the image signal IS is output from the logic circuit region LC.

For example, the image signal IS includes a first white pixel value W1 output by sensing light transmitted through a white color filter 143W. The image signal IS also includes a blue pixel value B1 output by sensing light transmitted through a blue color filter 143B. That is, the white pixel values (W1 to W8), green pixel values (G1 to G4), blue pixel values (B1 and B2), and red pixel values (R1 and R2) shown in FIG. 6 are image signals IS output by the image sensor 101 after sensing light transmitted through color filters of the corresponding colors.

The pixel array PA is arranged in an RGBW Bayer pattern. That is, the color filters of the pixel array PA are a combination of red, green, blue, and white color filters, and the color filters are arranged in a Bayer pattern. However, embodiments according to the technical concept of the present invention are not limited thereto, and the pixel array PA may be arranged in an RGB Bayer pattern, an RGB tetrahedral pattern, a CMY pattern, an RYYB pattern, etc.

The pixel values of the image signal IS are arranged as shown in Figure 6 so that they correspond to the colors of the color filters of the pixel array PA. However, Figure 6 merely shows the arrangement of each pixel value according to the position of each unit pixel PX, and the storage locations of the pixel values of the actual output image signal IS are not limited to the locations shown.

Figure 7 is a diagram illustrating a coefficient data extractor according to one embodiment. Figure 8 is a block diagram of the coefficient data extractor of Figure 7. Figure 9 is a flowchart illustrating the operation of a coefficient data extractor according to one embodiment.

Referring to FIG. 7, the coefficient data extractor 10 included in the camera module inspection system 1 includes a light source emitter 20, a fixing portion 21, and a connecting portion 22.

Referring to Figures 7 to 9, the camera module 100 is housed within the coefficient data extractor 10. That is, the camera module 100 is provided externally to the coefficient data extractor 10 of the camera module inspection system 1. For example, the camera module 100 is externally connected to the coefficient data extractor 10.

The camera module 100 is placed on the fixing part 21 and connected to the connecting part 22. The camera module 100 is fixed on the fixing part 21. The interface or connector of the camera module 100 is connected to the connecting part 22 of the coefficient data extractor 10 to exchange data. For example, as shown in FIG. 8, the image signal IS output from the camera module 100 is transmitted to the connecting part 22. The image signal IS is also transmitted to the coefficient generator 30 via the connecting part 22.

The light source emitter 20 is disposed above the fixed part 21 and the camera module 100. The light source emitter 20 emits light L toward the camera module 100 (step S200 of FIG. 9). Here, the light L includes, for example, EDS light (Electric Die Sorting light). For example, the light L includes white light. That is, the light L emitted from the light source emitter 20 includes light of all wavelengths. The light L includes red component light, green component light, and blue component light. However, embodiments according to the technical concept of the present invention are not limited thereto.

The camera module 100 receives light L emitted from the light source emitter 20. For example, the image sensor 101 of the camera module 100 senses the light L and outputs an image signal IS. Here, the light L that reaches the pixel array PA is converted by the photoelectric transistors (148W, 148B) and output as the image signal IS by the readout circuit 150.

The coefficient generator 30 receives the image signal IS generated from the camera module 100 (step S201).

The coefficient generator 30 generates coefficients based on the image signal IS (step S202). That is, the coefficient generator 30 generates coefficient data CD using the image signal IS.

Figure 10 is a graph illustrating the quantum efficiency of an image signal according to one embodiment.

Referring to FIG. 10, the quantum efficiency (QE) of each color image signal varies depending on the wavelength. For example, the quantum efficiency of the blue color image signal B is high at a short wavelength of 450 nm and low at a long wavelength of 650 nm. For example, the quantum efficiency of the green color image signal G is high at a medium wavelength of 550 nm and low at short wavelengths of 450 nm and long wavelengths of 650 nm. For example, the quantum efficiency of the red color image signal R is high at a long wavelength of 650 nm and low at a short wavelength of 450 nm. Each color image signal varies depending on the wavelength. However, embodiments according to the technical concept of the present invention are not limited thereto.

Here, the magnitude of the white color image signal W corresponds to the integral value of the magnitude of the green color image signal G, the magnitude of the red color image signal R, and the magnitude of the blue color image signal B with respect to wavelength. That is, the magnitude of the white color image signal W is expressed by the following equation 1.

The white color image signal W is linearly represented using the green color image signal G, the red color image signal R, and the blue color image signal B. The magnitude of the white color image signal W is expressed by the following equation 2.

[Equation 2]
W=C1*R+C2*G+C3*B

That is, the white color image signal W is composed of a fixed ratio of the green color image signal G, the red color image signal R, and the blue color image signal B. Here, C1, C2, and C3 are the magnitudes of the red color image signal, the green color image signal, and the blue color image signal, respectively.

Furthermore, the green color image signal G, red color image signal R, and blue color image signal B each have a certain relationship with each other. The relationship between the green color image signal G and the blue color image signal B corresponds to the following equation 3, and the relationship between the red color image signal R and the blue color image signal B corresponds to the following equation 4.

[Equation 3]
G = k1 * B + k2

[Equation 4]
R = k3 * B + k4

Substituting Equation 3 and Equation 4 into Equation 2, we get the following:

[Equation 5]
W=C1*(k3*B+k4)+C2*(k1*B+k2)+C3*B
=(C1*k3+C2*k1+C3)*B+(C1*k4+C2*k2)
= XB * B + KB

As a result, the white color image signal W is represented using the blue color image signal B. That is, the white color image signal W is represented using the blue color coefficient XB and the blue color constant KB.

Furthermore, the white color image signal W is represented using the red color image signal R and the green color image signal G. The mathematical formula for this is as follows:

[Equation 6]
W = XR * R + KR

[Equation 7]
W = XG * G + KG

Here, the white color image signal W is expressed using the red color coefficient XR and the red color constant KR. Also, the white color image signal W is expressed using the green color coefficient XG and the green color constant KG.

Here, if light L includes all wavelengths, the constants in each relational equation are omitted. For example, the blue color constant KB, red color constant KR, and green color constant KG are omitted from each equation. As a result, the relational equations for each color image signal are as follows. However, embodiments according to the technical concept of the present invention are not limited to this.

[Equation 8]
W = XB * B
W = XR * R
W = XG * G

As a result, the coefficient generator 30 generates coefficient data CD based on the image signal IS. Here, the coefficient data CD includes a blue color coefficient XB, a red color coefficient XR, and a green color coefficient XG. That is, the coefficient data relates to the ratio of one color image signal to a different color image signal.

Next, the coefficient data extractor 10 stores the coefficient data CD in the memory device 40. The coefficient generator 30 provides the generated coefficient data CD to the memory device 40. The memory device 40 stores the provided coefficient data CD. Here, the memory device 40 stores the coefficient data CD so that it matches the type of camera module 100 used in the coefficient data extractor 10. For example, if the color filter type of the camera module 100 is RGBW, the memory device 40 stores the coefficient data CD generated for RGBW. However, embodiments according to the technical concept of the present invention are not limited to this.

The method for extracting coefficient data CD described with reference to Figures 7 to 10 is performed before the method for inspecting the camera module 100 is performed. That is, if multiple camera modules 100 must be inspected, the coefficient data CD of only one representative camera module 100 is extracted. Then, the multiple camera modules 100 are inspected using the coefficient data CD. This reduces the inspection time by the camera module inspection device 50, and the camera modules 100 can be inspected without hardware that converts specific image signals into RGB image signals. That is, the performance of the camera module inspection system 1 is improved.

Figure 11 is a diagram illustrating a camera module inspection device according to one embodiment. Figure 12 is a block diagram of the camera module inspection device of Figure 11. Figure 13 is a flowchart illustrating the operation of the camera module inspection device according to one embodiment. Figures 14 and 15 are diagrams illustrating the operation of the camera module inspection devices of Figures 11 to 13.

Referring to FIG. 11, the camera module inspection device 50 included in the camera module inspection system 1 includes a light source emitter 51, a fixing portion 52, and a connecting portion 53.

Referring to Figures 11 to 13, the camera module 100 is housed within the camera module inspection device 50. That is, the camera module 100 is provided to the camera module inspection device 50 of the camera module inspection system 1 from the outside. For example, the camera module 100 is externally connected to the camera module inspection device 50.

The camera module 100 is placed on the fixing part 52 and connected to the connecting part 53. The camera module 100 is fixed on the fixing part 52. The interface or connector of the camera module 100 is connected to the connecting part 53 of the camera module inspection device 50 to exchange data. For example, as shown in FIG. 12, the image signal IS output from the camera module 100 is transmitted to the connecting part 53. The image signal IS is transmitted to the gray image generator 60 via the connecting part 53.

The light source emitter 51 is disposed above the fixed part 52 and the camera module 100. The light source emitter 51 emits light L toward the camera module 100 (step S210 of FIG. 13). Here, the light L includes, for example, white light. The camera module 100 outputs an image signal IS in response to the incident light L.

The gray image generator 60 receives the image signal IS generated from the camera module 100 and the coefficient data CD from the memory device 40 (step S211). The gray image generator 60 receives the coefficient data CD already stored in the memory device 40. Here, the coefficient data CD was generated and stored before the operation of the camera module inspection device 50.

In this embodiment, the camera module inspection device 50 and the coefficient data extractor 10 are shown as being separately arranged, but the camera module inspection device 50 and the coefficient data extractor 10 can be implemented as a single device. That is, the camera module inspection device 50 and the coefficient data extractor 10 operate in the same environment. That is, the light L used in the camera module inspection device 50 and the coefficient data extractor 10 is the same, and the camera module 100 is also the same. However, embodiments according to the technical concept of the present invention are not limited to this.

The gray image generator 60 generates a gray image signal GIS based on the image signal IS and the coefficient data CD (step S212). That is, the gray image generator 60 converts the image signal IS generated from the camera module 100 into a gray image signal GIS using the coefficient data CD. Here, the image signal generated by the gray image generator 60 is not limited to the gray image signal GIS. That is, the gray image generator 60 may generate other conversion pattern image signals. For example, the gray image generator 60 converts the image signal IS into an RGB Bayer pattern image signal using the coefficient data CD. However, embodiments according to the technical concept of the present invention are not limited thereto.

Referring to FIG. 14, the image signal includes white pixel values (W1 to W8), green pixel values (G1 to G4), blue pixel values (B1 and B2), and red pixel values (R1 and R2). The coefficient data CD stored in the memory device 40 includes blue color coefficients (XB1, XB2), red color coefficients (XR1, XR2), and green color coefficients (XG1, XG2, XG3, XG4). Here, the blue color coefficients (XB1, XB2) correspond to the blue pixel values (B1 and B2), the red color coefficients (XR1, XR2) correspond to the red pixel values (R1 and R2), and the green color coefficients (XG1, XG2, XG3, XG4) correspond to the green pixel values (G1 to G4).

The gray image signal GIS is generated by applying coefficient data CD to the image signal IS. For example, the gray pixel value Wg1 is generated based on the blue pixel value B1 and the blue color coefficient XB1 using the following equation 9:

[Equation 9]
Wg1=B1*XB1

Furthermore, the gray pixel value Wg3 is generated based on the green pixel value G1 and the green color coefficient XG1 using the following equation 10:

[Equation 10]
Wg3=G1*XG1

Furthermore, the gray pixel value Wg7 is generated based on the red pixel value R1 and the red color coefficient XR1 using the following formula 11:

[Equation 11]
Wg7=R1*XR1

As a result, a gray image signal GIS is generated based on the image signal IS and the coefficient data CD. The gray image signal GIS contains a gray image. That is, the image signal IS containing the original image is converted into a gray image signal GIS containing a gray image. The gray image signal GIS is provided to the correction data generator 70.

Existing correction data generators 70 process RGB Bayer pattern image signals or gray image signals. However, to generate correction data CRD, hardware is required to convert image signals that are not RGB Bayer pattern image signals or gray image signals into the corresponding signals. However, in an embodiment according to the technical concept of the present invention, a gray image signal GIS is generated by applying pre-stored coefficient data CD to the image signal IS, and the correction data generator 70 generates correction data CRD based on the generated gray image signal GIS.

The correction data generator 70 generates correction data CRD based on the gray image of the gray image signal GIS (step S213 in FIG. 13).

The correction data generator 70 performs shading inspection, bad pixel inspection, FPN inspection, etc. on the generated gray image signal GIS. The correction data generator 70 performs many types of inspections, but in this embodiment of the present invention, bad pixel inspection will be used as an example.

Referring to FIG. 15, in the gray image signal GIS, pixels corresponding to gray pixel value Wg4 and pixels corresponding to gray pixel value Wg8 are inspected as defective pixels. Therefore, pixels corresponding to gray pixel value Wg4 are designated as defective pixels BP1, and pixels corresponding to gray pixel value Wg8 are designated as defective pixels BP2.

As a result, the correction data CRD includes information on whether a pixel is a defective pixel. For example, the correction data CRD includes information indicating that a pixel corresponding to a gray pixel value Wg4 is a defective pixel BP1, and information indicating that a pixel corresponding to a gray pixel value Wg8 is a defective pixel BP2. However, embodiments according to the technical concept of the present invention are not limited thereto.

Referring again to FIGS. 12 and 13, the correction data generator 70 provides the correction data CRD to the camera module 100 (step S214). The correction data generator 70 provides the generated correction data CRD to the memory device 80. Here, the memory device 80 is a volatile memory device such as a DRAM or a non-volatile memory device such as a flash memory. The memory device 80 is the same as the memory device 40. The correction data CRD read from the memory device 80 is transmitted to the camera module 100.

Figure 16 is a block diagram of an example of an image sensing device according to one embodiment. Figure 17 is a block diagram of another example of an image sensing device according to one embodiment.

Referring to Figures 2 and 16, the image sensing device 300a includes a camera module 100 and an application processor AP.

The memory device 190 of the camera module 100 receives the correction data CRD from the memory device 80. The memory device 190 stores the correction data CRD. The memory device 190 provides the correction data CRD to the image signal processor 180 in response to an external request. That is, when the image signal processor 180 performs image processing on the image signal IS, it corrects the image signal IS using the correction data CRD stored in the memory device 190. That is, the camera module 100 corrects the image signal IS using the correction data CRD generated by the camera module inspection system 1, thereby outputting an image signal IS' with improved image quality.

The corrected image signal IS' is provided to the application processor AP. The application processor AP performs additional image processing on the provided image signal IS'. The image-processed image signal IS' is then output via a display.

However, embodiments according to the technical concept of the present invention are not limited to this, and the application processor AP may output the image signal IS' directly via the display without performing additional image processing.

Referring to FIG. 17, the image sensing device 300b includes a camera module 100 and an application processor AP.

The image signal processor 180 of the camera module 100 receives correction data CRD from the memory device 190. The image signal processor 180 provides the image signal IS and the correction data CRD to the application processor AP. That is, the image signal processor 180 does not perform image processing on the image signal IS using the correction data CRD. The application processor AP performs image processing on the image signal IS using the provided correction data CRD.

Below, a camera module inspection system 1a according to another embodiment will be described with reference to Figures 18 and 19.

Figure 18 is a block diagram of another example of a camera module inspection system according to one embodiment. Figure 19 is a block diagram of the camera module inspection device of Figure 18. For ease of explanation, overlapping content with that explained using Figures 1 to 17 will be explained briefly or omitted.

Referring to FIG. 18, the camera module inspection system 1a includes a camera module inspection device 50'. Unlike the camera module inspection system 1 described with reference to FIGS. 1 to 17, which includes the coefficient data extractor 10 and the camera module inspection device 50, the camera module inspection system 1a includes only the camera module inspection device 50'. Here, the function of the coefficient data extractor 10 is realized by the camera module inspection device 50'.

The camera module 100 is housed in the camera module inspection device 50' and is provided with correction data CRD, which is the output of the operation results of the camera module inspection device 50'.

Referring to FIG. 19, the camera module inspection device 50' includes a connection unit 22, a coefficient generator 30, a memory device 40, a gray image generator 60, a correction data generator 70, and a memory device 80.

The coefficient data extraction process and camera module inspection process described with reference to Figures 1 to 17 are performed by the camera module inspection device 50'. That is, unlike Figures 1 to 17, which describe the coefficient data extraction process and camera module inspection process separately, the camera module inspection device 50' performs all of the above processes.

The image signal IS output from the camera module 100 is transmitted to the coefficient generator 30 via the connection unit 22, and the coefficient generator 30 generates coefficient data CD. The coefficient generator 30 then transmits the coefficient data CD to the memory device 40, which stores the coefficient data CD.

In a subsequent process, the image signal IS output from the camera module 100 is transmitted to the gray image generator 60. Also, the coefficient data CD output from the memory device 40 is transmitted to the gray image generator 60. The gray image generator 60 converts the image signal IS into a gray image signal GIS using the coefficient data CD. The correction data generator 70 generates correction data CRD based on the generated gray image signal GIS, and the generated correction data CRD is stored in the memory device 80. In one embodiment, the memory device 40 and the memory device 80 are the same memory device. Also, the correction data CRD is transmitted to and stored in the camera module 100.

In the camera module inspection device 50' according to an embodiment of the present invention, the coefficient data extraction process and the camera module inspection process are performed in the same environment. That is, the coefficient data CD is used in the same environment when the gray image generator 60 generates a gray image.

Below, with reference to Figure 20, we will explain another embodiment of the camera module inspection system 1b.

Figure 20 is a block diagram of an example of a camera module inspection system according to another embodiment. For ease of explanation, overlapping content with that explained using Figures 1 to 17 will be explained briefly or omitted.

Referring to FIG. 20, the camera module inspection system 1b accommodates multiple camera modules (100, 100_1, 100_2, 100_3). For example, the coefficient data extractor 10 accommodates the camera module 100, and the camera module inspection device 50 accommodates multiple camera modules (100, 100_1, 100_2, 100_3).

First, the coefficient data extractor 10 receives the camera module 100 and extracts coefficient data CD from it. The coefficient data CD is transmitted to the camera module inspection device 50.

Next, the camera module inspection device 50 accommodates the used camera module 100, outputs correction data CRD using the image signal IS and coefficient data CD output from the camera module 100, and provides the correction data CRD to the camera module 100.

Furthermore, after the coefficient data CD is provided to the camera module inspection device 50, multiple camera modules (100_1, 100_2, 100_3) are accommodated in the camera module inspection device 50. Here, the multiple camera modules (100_1, 100_2, 100_3) are accommodated simultaneously or sequentially.

For example, camera module 100_1 is accommodated in camera module inspection device 50, and correction data CRD_1 is generated using the image signal output from camera module 100_1 and the stored coefficient data CD. The correction data CRD_1 is provided to and stored in camera module 100_1.

The camera module 100_2 is accommodated in the camera module inspection device 50, and correction data CRD_2 is generated using the image signal output from the camera module 100_2 and the stored coefficient data CD. The correction data CRD_2 is provided to and stored in the camera module 100_2.

Camera module 100_3 is placed in camera module inspection device 50, and correction data CRD_3 is generated using the image signal output from camera module 100_3 and the stored coefficient data CD. The correction data CRD_3 is provided to and stored in camera module 100_3.

Here, the color filter patterns of the image sensors of the multiple camera modules (100_1, 100_2, 100_3) are the same as the color filter pattern of the image sensor of camera module 100. Furthermore, the respective correction data (CRD, CRD_1, CRD_2, CRD_3) are different from each other. However, embodiments according to the technical concept of the present invention are not limited thereto.

After the coefficient data CD is extracted, camera module inspection is performed on multiple camera modules (100_1, 100_2, 100_3), thereby reducing the time consumed in camera module inspection. In other words, more efficient camera module inspection is performed.

Below, a camera module inspection system 1c according to another embodiment will be described with reference to Figures 21 and 22.

Figure 21 is a block diagram of another example of a camera module inspection system according to another embodiment. Figure 22 is a flowchart for explaining the operation of the camera module inspection system of Figure 21. For the sake of convenience, overlapping content with that explained using Figures 1 to 17 will be explained briefly or omitted.

Referring to FIG. 21, the camera module inspection system 1c includes a coefficient data extractor 10, a camera module inspection device 50, and a camera module classifier 90.

Referring to FIGS. 21 and 22, the coefficient data extractor 10 receives the camera modules (100a, 100b, 100c) (step S220). The coefficient data extractor 10 extracts coefficient data (CD1, CD2, CD3) from the camera modules (100a, 100b, 100c) and stores the extracted coefficient data (CD1, CD2, CD3) (step S221). The coefficient data extractor 10 also provides the coefficient data (CD1, CD2, CD3) to the camera module inspection device 50.

Here, each camera module (100a, 100b, 100c) is a different camera module. For example, each camera module (100a, 100b, 100c) includes a different color filter pattern. For example, the color filter pattern of camera module 100a is RGBW, the color filter pattern of camera module 100b is RYYB, and the color filter pattern of camera module 100c is CMY. Therefore, each coefficient data (CD1, CD2, CD3) is also different. However, embodiments according to the technical concept of the present invention are not limited to this.

The camera module inspection device 50 receives one camera module (step S222). Here, the camera module is provided by the camera module classifier 90 and connected to the camera module inspection device 50.

The camera module classifier 90 accommodates a plurality of camera modules (100a, 100b, 100c). In step S222, the camera module classifier 90 provides one of the accommodated camera modules (100a, 100b, 100c) to the camera module inspection device 50.

The camera module inspection device 50 determines whether the provided camera module corresponds to the camera module from which the coefficient data was extracted (step S223). For example, if the camera module inspection device 50 receives camera module 100a, the camera module inspection device 50 determines the coefficient data CD1 to correspond to it.

If the accommodated camera module 100a corresponds to the camera module 100a from which the coefficient data was extracted (Y in step S223), the camera module inspection device 50 inspects the camera module 100a based on the coefficient data CD1 (step S224). That is, the camera module inspection device 50 converts the image signal IS output from the camera module 100a using the corresponding coefficient data CD1. If the accommodated camera module 100a does not correspond to the camera module 100a from which the coefficient data was extracted (N in step S223), the operation returns to step S222, and another camera module is accommodated.

The camera module inspection device 50 generates correction data CRD1 using the generated gray image signal GIS (step S225). Here, correction data CRD1 is generated when the housed camera module is the above-described embodiment of camera module 100a. When camera module 100b is inspected, correction data CRD2 is generated, and when camera module 100c is inspected, correction data CRD3 is generated.

Next, the camera module inspection device 50 provides correction data to the corresponding camera modules (step S226). For example, correction data (CRD1, CRD2, CRD3) is provided to the camera modules (100a, 100b, 100c). For example, the camera module inspection device 50 provides the correction data (CRD1, CRD2, CRD3) to the camera module classifier 90. Next, the camera module classifier 90 provides correction data CRD1 to the camera module 100a, correction data CRD2 to the camera module 100b, and correction data CRD3 to the camera module 100c.

This allows the camera module inspection system 1c to efficiently store correction data (CRD1, CRD2, CRD3) in each camera module (100a, 100b, 100c).

An electronic device 2000 according to another embodiment will now be described with reference to Figures 23 and 24.

Figure 23 is a block diagram illustrating an electronic device including a multi-camera module according to another embodiment. Figure 24 is a detailed block diagram of the camera module of Figure 23. For ease of explanation, overlapping content with that described using Figures 1 to 22 will be briefly explained or omitted.

Referring to FIG. 23, the electronic device 2000 includes a camera module group 2100, an application processor 2200, a power control IC (PMIC) 2300, an external memory 2400, and a display 2500.

Camera module group 2100 includes multiple camera modules (2100a, 2100b, 2100c). While the drawings show an embodiment in which three camera modules (2100a, 2100b, 2100c) are arranged, the embodiment is not limited to this. In one embodiment, camera module group 2100 is modified to include only two camera modules. In another embodiment, camera module group 2100 is modified to include n camera modules (n is a natural number greater than or equal to 4).

Here, one of the three camera modules (2100a, 2100b, 2100c) includes the camera module 100 described using Figures 1 to 22. That is, the camera module 100 inspected by the camera module inspection system (1, 1a, 1b, 1c) is placed in the electronic device 2000.

The detailed configuration of camera module 2100b will be described in more detail below with reference to Figure 24, but the following description also applies to other camera modules (2100a, 2100c) depending on the embodiment.

Referring to FIG. 24, the camera module 2100b includes a prism 2105, an optical path folding element (hereinafter referred to as "OPFE") 2110, an actuator 2130, an image sensing device 2140, and a storage unit 2150.

Prism 2105 includes a reflective surface 2107 made of a light-reflecting material, which deforms the path of light L incident from the outside.

In one embodiment, the prism 2105 changes the path of light L incident in a first direction X to a second direction Y that is perpendicular to the first direction X. The prism 2105 also changes the path of light L incident in the first direction X to the second direction Y, which is perpendicular, by rotating the reflective surface 2107 of the light-reflecting material in the direction A around the central axis 2106 or by rotating the central axis 2106 in the direction B. The OPFE 2110 also moves in a third direction Z that is perpendicular to the first direction X and the second direction Y.

In one embodiment, as shown in the drawing, the maximum rotation angle of prism 2105 in the A direction is less than or equal to 15 degrees in the plus (+) A direction and greater than 15 degrees in the minus (-) A direction, but the embodiment is not limited to this.

In one embodiment, prism 2105 moves in the plus (+) or minus (-) B direction by 20 degrees in or out, between 10 and 20 degrees, or between 15 and 20 degrees, where the angle of movement is the same angle in the plus (+) or minus (-) B direction, or moves to a similar angle within a range of 1 degree in or out.

In one embodiment, the prism 2105 moves the reflective surface 2107 of the light-reflecting material in a third direction (e.g., the Z direction) parallel to the extension direction of the central axis 2106.

OPFE2110 includes, for example, m (where m is a natural number) optical lenses arranged in groups. The m lenses move in the second direction Y to change the optical zoom ratio of camera module 2100b. For example, if the basic optical zoom ratio of camera module 2100b is Zr, moving the m optical lenses included in OPFE2110 changes the optical zoom ratio of camera module 2100b to an optical zoom ratio of 3Zr or 5Zr or more.

The actuator 2130 moves the OPFE 2110 or the optical lens (hereinafter referred to as the optical lens) to a specific position. For example, the actuator 2130 adjusts the position of the optical lens so that the image sensor 2142 is located at the focal length of the optical lens for accurate sensing.

The image sensing device 2140 includes an image sensor 2142, control logic 2144, and memory 2146. The image sensor 2142 senses an image of a sensing target using light L provided through an optical lens. In one embodiment, the image sensor 2142 includes the image sensor 101 described above.

The control logic 2144 controls the overall operation of the camera module 2100b. For example, the control logic 2144 controls the operation of the camera module 2100b in response to a control signal provided via the control signal line CSLb. In one embodiment, the control logic 2144 is a control logic circuit and includes a processor that performs pre-set operations.

The memory 2146 stores information necessary for the operation of the camera module 2100b, such as correction data 2147. The correction data 2147 includes information necessary for the camera module 2100b to generate image data using light L provided from the outside. The correction data 2147 includes, for example, information regarding the degree of rotation, focal length, and optical axis, as previously described. If the camera module 2100b is implemented in the form of a multi-state camera in which the focal length changes depending on the position of the optical lens, the correction data 2147 includes the focal length value for each position (or state) of the optical lens and information related to autofocusing. Here, the memory 2146 includes the memory device 190 of the camera module 100 previously described with reference to FIG. 2, and the correction data 2147 includes the correction data CRD stored in the memory device 190.

The storage unit 2150 stores image data sensed through the image sensor 2142. The storage unit 2150 is disposed outside the image sensing device 2140 and is implemented in a stacked form on the sensor chip that constitutes the image sensing device 2140. In one embodiment, the storage unit 2150 is implemented as an EEPROM (Electrically Erasable Programmable Read-Only Memory), but the embodiment is not limited thereto. The storage unit 2150 is implemented as a memory chip.

Referring to both Figures 23 and 24, in one embodiment, each of the multiple camera modules (2100a, 2100b, 2100c) includes an actuator 2130. As such, each of the multiple camera modules (2100a, 2100b, 2100c) includes the same or different correction data 2147 due to the operation of the actuator 2130 included therein.

In one embodiment, one of the multiple camera modules (2100a, 2100b, 2100c) (e.g., 2100b) is a folded lens type camera module including the prism 2105 and OPFE 2110 described above, and the remaining camera modules (e.g., 2100a, 2100c) are vertical type camera modules that do not include the prism 2105 and OPFE 2110, but the embodiment is not limited thereto.

In one embodiment, one camera module (e.g., 2100c) among the plurality of camera modules (2100a, 2100b, 2100c) is a vertical depth camera that extracts depth information using, for example, infrared rays (IR). In this case, the application processor 1200 merges image data provided from this depth camera with image data provided from a different camera module (e.g., 2100a or 2100b) to generate a 3D depth image.

In one embodiment, at least two camera modules (e.g., 2100a, 2100c) of the plurality of camera modules (2100a, 2100b, 2100c) have different fields of view (field of view angles). In this case, for example, the optical lenses of at least two camera modules (e.g., 2100a, 2100c) of the plurality of camera modules (2100a, 2100b, 2100c) may be different from each other, but this is not limitative.

In one embodiment, the viewing angles of the multiple camera modules (2100a, 2100b, 2100c) are different. In this case, the optical lenses included in the multiple camera modules (2100a, 2100b, 2100c) are also different, but this is not a limitation.

In one embodiment, each of the multiple camera modules (2100a, 2100b, 2100c) is physically separated from the others. That is, instead of the multiple camera modules (2100a, 2100b, 2100c) sharing the sensing area of a single image sensor 2142, an independent image sensor 2142 is disposed within each of the multiple camera modules (2100a, 2100b, 2100c).

Referring again to FIG. 23, the application processor 2200 includes an image processing unit 2210, a memory controller 2220, and an internal memory 2230. The application processor 2200 is implemented separately from the multiple camera modules (2100a, 2100b, 2100c). For example, the application processor 2200 and the multiple camera modules (2100a, 2100b, 2100c) are implemented separately from each other on separate semiconductor chips.

The image processing device 2210 includes multiple sub-image processors (2212a, 2212b, 2212c), an image generator 2214, and a camera module controller 2216.

The image processing device 2210 includes multiple sub-image processors (2212a, 2212b, 2212c) in a number corresponding to the number of camera modules (2100a, 2100b, 2100c).

Image data generated from each camera module (2100a, 2100b, 2100c) is provided to the corresponding sub-image processor (2212a, 2212b, 2212c) via separate image signal lines (ISLa, ISLb, ISLc). For example, image data generated from camera module 2100a is provided to sub-image processor 2212a via image signal line ISLa, image data generated from camera module 2100b is provided to sub-image processor 2212b via image signal line ISLb, and image data generated from camera module 2100c is provided to sub-image processor 2212c via image signal line ISLc. Such image data transmission is performed using, for example, a camera serial interface (CSI) based on the Mobile Industry Processor Interface (MIPI), but the embodiment is not limited thereto.

Meanwhile, in one embodiment, one sub-image processor is arranged to correspond to multiple camera modules. For example, sub-image processor 2212a and sub-image processor 2212c are not implemented separately from each other as shown in the drawing, but are integrated into one sub-image processor, and the image data provided from camera module 2100a and camera module 2100c is selected via a selection element (e.g., a multiplexer) and then provided to the integrated sub-image processor.

The image data provided to each sub-image processor (2212a, 2212b, 2212c) is provided to the image generator 2214. The image generator 2214 generates an output image using the image data provided from each sub-image processor (2212a, 2212b, 2212c) in accordance with image generation information or a mode signal.

Specifically, the image generator 2214 generates an output image by merging at least a portion of the image data generated from the camera modules (2100a, 2100b, 2100c) having different viewing angles in accordance with the image generation information or mode signal. Furthermore, the image generator 2214 selects one of the image data generated from the camera modules (2100a, 2100b, 2100c) having different viewing angles in accordance with the image generation information or mode signal to generate an output image.

In one embodiment, the image generation information includes a zoom signal (zoom signal or zoom factor). Also, in one embodiment, the mode signal is a signal based on a mode selected by a user, for example.

When the image generation information is a zoom signal (zoom factor) and each camera module (2100a, 2100b, and 2100c) has a different observation field of view (viewing angle), the image generator 2214 performs different operations depending on the type of zoom signal. For example, when the zoom signal is a first signal, the image generator 2214 merges the image data output from camera module 2100a and the image data output from camera module 2100c, and then generates an output image using the merged image signal and the image data output from camera module 2100b, which was not used in the merger. When the zoom signal is a second signal different from the first signal, the image generator 2214 does not merge the image data, but instead selects one of the image data output from each camera module (2100a, 2100b, and 2100c) to generate an output image. However, the embodiment is not limited to this, and various modifications can be made to the method of processing the image data as needed.

In one embodiment, the image generator 2214 receives multiple image data with different exposure times from at least one of the multiple sub-image processors (2212a, 2212b, 2212c) and performs HDR (high dynamic range) processing on the multiple image data to generate merged image data with an increased dynamic range.

The camera module controller 2216 provides control signals to each of the camera modules (2100a, 2100b, 2100c). The control signals generated by the camera module controller 2216 are provided to the corresponding camera modules (2100a, 2100b, 2100c) via separate control signal lines (CSLa, CSLb, and CSLc).

One of the multiple camera modules (2100a, 2100b, 2100c) is designated as a master camera (e.g., 2100a) in response to image generation information including a zoom signal or a mode signal, and the remaining camera modules (e.g., 2100b, 2100c) are designated as slave cameras. This information is included in a control signal and provided to the corresponding camera modules (2100a, 2100b, 2100c) via separate control signal lines (CSLa, CSLb, and CSLc).

The camera modules operating as master and slave change depending on the zoom factor or operation mode signal. For example, if the viewing angle of camera module 2100a is wider than that of camera module 2100c and the zoom factor indicates a low zoom magnification, camera module 2100c operates as the master and camera module 2100a operates as the slave. Conversely, if the zoom factor indicates a high zoom magnification, camera module 2100a operates as the master and camera module 2100c operates as the slave.

In one embodiment, the control signals provided from the camera module controller 2216 to each of the camera modules (2100a, 2100b, 2100c) include a sync enable signal. For example, if the camera module 2100b is the master camera and the camera modules (2100a, 2100c) are slave cameras, the camera module controller 2216 transmits a sync enable signal to the camera module 2100b. Upon receiving the sync enable signal, the camera module 2100b generates a sync signal based on the received sync enable signal and provides the generated sync signal to the camera modules (2100a, 2100c) via the sync signal line SSL. The camera module 2100b and the camera modules (2100a, 2100c) synchronize with the sync signal and transmit image data to the application processor 2200.

In one embodiment, the control signals provided from the camera module controller 2216 to the camera modules (2100a, 2100b, 2100c) include mode information according to a mode signal. Based on this mode information, the camera modules (2100a, 2100b, and 2100c) operate in a first operating mode or a second operating mode in relation to the sensing speed.

In a first operating mode, the multiple camera modules (2100a, 2100b, 2100c) generate image signals at a first speed (e.g., generate image signals at a first frame rate), encode the image signals at a second speed higher than the first speed (e.g., encode image signals at a second frame rate higher than the first frame rate), and transmit the encoded image signals to the application processor 2200. In this case, the second speed is 30 times faster than the first speed.

The application processor 2200 stores the received image signal, i.e., the encoded image signal, in its internal memory 2230 or in its external storage 2400, and then reads and decodes the encoded image signal from the memory 2230 or storage 2400, and displays image data generated based on the decoded image signal. For example, a corresponding sub-processor among the multiple sub-processors (2212a, 2212b, 2212c) of the image processing device 2210 performs decoding and image processing on the decoded image signal. For example, the image data generated based on the decoded image signal is displayed on the display 2500.

In the second operating mode, the multiple camera modules (2100a, 2100b, 2100c) generate image signals at a third rate lower than the first rate (e.g., generate image signals at a third frame rate lower than the first frame rate) and transmit the image signals to the application processor 2200. The image signals provided to the application processor 2200 are unencoded signals. The application processor 2200 performs image processing on the received image signals or stores the image signals in the memory 2230 or storage 2400.

PMIC 2300 supplies power, e.g., a power supply voltage, to each of the multiple camera modules (2100a, 2100b, 2100c). For example, under the control of application processor 2200, PMIC 2300 supplies a first power to camera module 2100a via power signal line PSLa, a second power to camera module 2100b via power signal line PSLb, and a third power to camera module 2100c via power signal line PSLc.

In response to a power control signal PCON from the application processor 2200, the PMIC 2300 generates power corresponding to each of the multiple camera modules (2100a, 2100b, 2100c) and adjusts the power level. The power control signal PCON includes a power adjustment signal for each operating mode of the multiple camera modules (2100a, 2100b, and 2100c). For example, the operating mode may include a low power mode, in which case the power control signal PCON includes information on the camera module operating in the low power mode and the power level to be set. The power levels provided to each of the multiple camera modules (2100a, 2100b, 2100c) may be the same or different. Furthermore, the power levels may be dynamically changed.

The above describes in detail an embodiment of the present invention with reference to the drawings, but the present invention is not limited to the above-described embodiment and can be modified in various ways without departing from the technical concept of the present invention.

1, 1a, 1b, 1c Camera module inspection system 10 Coefficient data extractor 20, 51 Light source emitter 21, 52 Fixing part 22, 53 Connection part 30 Coefficient generator 40, 80, 190 Memory device 50, 50' Camera module inspection device 60 Gray image generator 70 Correction data generator 90 Camera module classifier 100, 100_1, 100_2, 100_3, 100a, 100b, 100c, 2100a, 2100b, 2100c Camera module 101, 2142 Image sensor 110 Control register block 120 Timing generator 130 Row driver 141-1, 141-2 Microlens 142, 145 Upper and lower planarization films 143B, 143W Color filter 144 Side anti-reflection coating 146B, 146W Substrate 147, 148B, 148W Phototransistor 150 Readout circuit 160 Ramp signal generator 170 Buffer section 180 Image signal processor (ISP)
300a, 300b, 2140 Image sensing device 2000 Electronic device 2100 Camera module group 2105 Prism 2106 Central axis 2107 Reflective surface 2110 Optical path folding element (OPPE)
2130 Actuator 2144 Control logic 2146, 2230 Memory 2147 Correction data 2150 Storage unit 2200 Application processor 2210 Image processing unit 2212a, 2212b, 2212c Sub-image processor 2214 Image generator 2216 Camera module controller 2220 Memory controller 2230 Internal memory 2300 Power control IC (PMIC)
2400 External memory 2500 Display AP Application processor CD, CD1, CD2, CD3 Coefficient data CRD, CRD_1, CRD_2, CRD_3, CRD1, CRD2, CRD3 Correction data CSLa, CSLb, CSLc Control signal line GIS Gray image signal IS, IS' Image signal ISLa, ISLb, ISLc Image signal line LC Logic circuit area PA Pixel array PCON Power control signal PH1, PH2 First and second peripheral areas PSLa, PSLb, PSLc Power signal line PX, PX1, PX2 Unit pixel S1, S2 First and second areas SSL Sink signal line

Claims (19)

a coefficient data extractor detachably coupled to the camera module;
an inspection device that is detachably connected to the camera module and performs a test on the camera module;
The coefficient data extractor
a coefficient generator configured to receive an image signal output from the camera module and generate coefficient data corresponding to a ratio between an image signal consisting of a first color and an image signal consisting of a second color included in the image signal;
a memory device for storing the coefficient data;
The inspection device includes:
an image generator that receives an image signal from the camera module and coefficient data from the memory device and generates a converted pattern image signal consisting of gray pixel values based on the image signal and the coefficient data;
a correction data generator for generating correction data including information as to whether a pixel is a defective pixel based on the converted pattern image signal. the first color image signal comprises white color pixel values;
2. The camera module inspection system of claim 1, wherein the image signal of the second color comprises at least one of a red color pixel value, a green color pixel value, and a blue color pixel value. 2. The camera module inspection system of claim 1, wherein the image generator generates the gray pixel value by multiplying a pixel value included in the image signal of the second color by the coefficient data. 4. The camera module inspection system of claim 3, wherein the converted pattern image signal includes an image signal of a first color having a white color pixel value from the image signal. The camera module inspection system of claim 1, wherein the camera module outputs the image signal in response to light transmitted through a color filter. The camera module inspection system of claim 5, wherein the color filter pattern does not include an RGB Bayer pattern. The camera module inspection system of claim 5, wherein the correction data generator processes an image signal having an RGB Bayer pattern. The camera module inspection system of claim 1, wherein the camera module includes a non-volatile memory device that stores the correction data generated by the correction data generator. a memory for storing first coefficient data generated based on a ratio between an image signal consisting of a first color and an image signal consisting of a second color, the image signal being output by an image sensor of the camera module sensing light transmitted through a first color filter having a first arrangement, and second coefficient data generated based on a ratio between an image signal consisting of a third color and an image signal consisting of a fourth color, the image signal being output by the image sensor sensing light transmitted through a second color filter having a second arrangement different from the first arrangement;
an image conversion device that selects one of the first and second coefficient data based on an arrangement of color filters included in the image sensor of the camera module and converts the image signal output from the image sensor into a gray image signal . 10. The camera module inspection device of claim 9, wherein when an arrangement of color filters included in the image sensor of the camera module has a first arrangement, the image conversion device converts the image signal output from the image sensor using the first coefficient data. The camera module inspection device of claim 9, wherein the first array of the first color filter includes an RGBW Bayer pattern. the first color image signal comprises white color pixel values;
12. The camera module inspection apparatus of claim 11 , wherein the image signal of the second color comprises at least one of a red color pixel value, a green color pixel value, and a blue color pixel value. The camera module inspection device of claim 9, wherein the first and second arrays do not include an RGB Bayer pattern. a correction data generator for generating correction data for the converted image signal , the correction data including information as to whether a pixel is a defective pixel ;
The camera module inspection device of claim 9 , wherein the generated correction data is transmitted to the camera module. providing light to a first camera module;
receiving a first image signal output from the first camera module in response to the light;
generating coefficient data corresponding to a ratio between an image signal consisting of a first color and an image signal consisting of a second color included in the first image signal;
storing the generated coefficient data;
providing light to a second camera module;
receiving a second image signal output from the second camera module in response to the light and the stored coefficient data;
generating a first converted pattern image signal consisting of gray pixel values based on the second image signal and the coefficient data;
generating first correction data for the first conversion pattern image signal , the first correction data including information as to whether a pixel is a defective pixel or not . 16. The camera module inspection method of claim 15 , wherein a first color filter included in the first camera module is the same as a second color filter included in the second camera module. 16. The camera module inspection method of claim 15 , further comprising transmitting the first correction data to the second camera module. providing light to a third camera module;
receiving a third image signal output from the third camera module in response to the light and the stored coefficient data;
generating a second converted pattern image signal consisting of gray pixel values based on the third image signal and the coefficient data;
generating second correction data including information on whether a pixel is a defective pixel for the second converted pattern image signal;
16. The camera module inspection method of claim 15 , further comprising: transmitting the second correction data to the third camera module. 20. The camera module inspection method of claim 18, wherein a pattern of a first color filter included in the first camera module, a pattern of a second color filter included in the second camera module, and a pattern of a third color filter included in the third camera module are different from each other.