JP7729382B2 - Exposure apparatus, exposure method, and manufacturing method of electronic device - Google Patents

Description

The present invention relates to an exposure apparatus, an exposure method, and a method for manufacturing an electronic device.
This application claims priority based on Japanese Patent Application No. 2021-111770, filed on July 5, 2021, the contents of which are incorporated herein by reference.

Conventionally, as an exposure apparatus that irradiates a substrate with illumination light via an optical system, there has been known an exposure apparatus that uses a spatial light modulator to modulate light, passes the modulated light through a projection optical system, and forms an image of this light on a resist coated on the substrate to perform exposure (see, for example, Patent Document 1).

Japanese Patent Application Publication No. 2005-266779

According to a first aspect of the present invention, there is provided an illumination optical system, a spatial light modulator illuminated by light from the illumination optical system, a projection optical system that irradiates an exposure object with the light emitted from the spatial light modulator, a stage on which at least one of a first exposure object and a second exposure object different from the first exposure object is placed and which moves at least one of the first exposure object and the second exposure object relative to the projection optical system in a predetermined scanning direction, and a control unit that controls the spatial light modulator, wherein the spatial light modulator has a plurality of mirrors that can be switched between an ON state in which light can be emitted to the projection optical system by adjusting the tilt and an OFF state in which light is not emitted to the projection optical system, The control unit controls the spatial light modulator to switch between a first state and a second state for the plurality of mirrors, and the first state and the second state are different from each other in that at least one of the mirrors is turned on, and during a first period in which the first exposure object is scanned and exposed, light emitted from the spatial light modulator in the first state forms a first exposure pattern on the first exposure object, and during a second period in which the second exposure object is scanned and exposed, which is different from the first period, light emitted from the spatial light modulator in the second state forms a second exposure pattern on the second exposure object, the second exposure pattern having the same shape as the first exposure pattern.

According to a second aspect of the present invention, there is provided an exposure method for exposing the exposure object using the above-described exposure apparatus.

According to a third aspect of the present invention, there is provided a method for manufacturing an electronic device, which includes exposing the exposure object by the above-described exposure method.

1 is a diagram showing an outline of the external configuration of an exposure apparatus according to the present embodiment; FIG. 2 is a diagram showing an outline of the configuration of a lighting module and a projection module. FIG. 1 is a diagram illustrating an outline of the configuration of a lighting module. FIG. 2 is a diagram illustrating an outline of the configuration of an optical modulation unit. FIG. 2 is a diagram showing an outline of the configuration of the light modulation unit, illustrating the on state of the mirror at the center of the page. FIG. 10 is a diagram showing an outline of the configuration of the light modulation unit, illustrating the off state of the mirror at the center of the page. FIG. 2 is a diagram illustrating an outline of the configuration of an optical modulation unit. FIG. 2 is a diagram showing an exposure field on an exposure object. FIG. 2 is a diagram illustrating an outline of the configuration of an optical modulation unit. FIG. 2 is a diagram showing an exposure field on an exposure object.

DETAILED DESCRIPTION OF THE INVENTION [0013] The present invention will now be described with reference to the accompanying drawings, in which: [0014] The following detailed description of the present invention is illustrative only and not limiting; [0015] The same or similar reference numerals are used throughout the drawings and the following detailed description.

[Exposure equipment]
FIG. 1 is a diagram showing an outline of the external configuration of an exposure apparatus 1 according to this embodiment. The exposure apparatus 1 is an apparatus that irradiates an exposure object with modulated light. In a specific embodiment, the exposure apparatus 1 is a step-and-scan projection exposure apparatus, a so-called scanner, that uses a rectangular (square) glass substrate used in electronic devices such as liquid crystal display devices (flat panel displays) as the exposure object. The glass substrate as the exposure object may have at least one side length or diagonal length of 500 mm or more. The glass substrate as the exposure object may be a substrate for a flat panel display. The exposure object (e.g., a substrate for a flat panel display) exposed by the exposure apparatus 1 is developed and then used as a product. A resist is formed on the surface of the exposure object.
The main body of the exposure apparatus 1 is configured in the same manner as the main body of the exposure apparatus 1 disclosed in, for example, US Patent Application Publication No. 2008/0030702.

The exposure apparatus 1 includes a base 11, a vibration isolation table 12, a main column 13, a stage 14, an optical surface plate 15, an illumination module 16, a projection module 17 (projection optical system), a light source unit 18, an optical fiber 19, an optical modulation unit 20 (not shown in FIG. 1), and a control unit 21.
In the following, the explanation will be made as necessary using a three-dimensional Cartesian coordinate system in which the direction parallel to the optical axis direction of the projection module 17 that irradiates the exposure object with light modulated by the light modulation unit 20 is defined as the Z-axis direction, and the directions of a predetermined plane perpendicular to the Z-axis are defined as the X-axis direction and the Y-axis direction. The X-axis direction and the Y-axis direction are perpendicular to each other (intersect each other).

The base 11 is a base of the exposure apparatus 1, and is placed on a vibration isolation table 12. The base 11 supports a stage 14, on which an object to be exposed is placed, so that the stage 14 is movable in the X-axis and Y-axis directions.

The stage 14 supports an object to be exposed. During scanning exposure, the stage 14 positions the object with high precision relative to multiple partial images of a circuit pattern projected via the projection module 17. The stage 14 drives the object to be exposed in six degrees of freedom (the above-mentioned X-axis, Y-axis, and Z-axis directions and rotational directions about each axis).

The stage 14 is moved in the X-axis direction during scanning exposure, and is moved in the Y-axis direction when changing the exposure target area on the exposure target. Note that multiple exposure target areas are formed on the exposure target. The stage 14 moves the exposure target and the projection module 17 relative to each other in the scanning direction.

The exposure apparatus 1 is capable of exposing multiple exposure target regions on a single exposure target. The configuration of the stage 14 is not particularly limited, but a stage device such as that disclosed in U.S. Patent Application Publication No. 2012/0057140 can be used. The stage device is, for example, a so-called coarse/fine movement stage device that includes a gantry-type two-dimensional coarse movement stage and a fine movement stage that is finely driven relative to the two-dimensional coarse movement stage. In a coarse/fine movement stage device, the coarse movement stage can move the exposure target in three degrees of freedom in a horizontal plane, and the fine movement stage can finely move the exposure target in six degrees of freedom.

The main column 13 supports an optical surface plate 15 above the stage 14 (in the positive direction of the Z axis). The optical surface plate 15 supports an illumination module 16, a projection module 17, and a light modulation unit 20.

FIG. 2 is a diagram showing an outline of the configuration of the illumination module 16, the projection module 17, and the light modulation unit 20. As shown in FIG.
The lighting modules 16 are disposed above the optical base 15 and connected to the light source units 18 via optical fibers 19. In one example of this embodiment, the lighting modules 16 include a first lighting module 16A, a second lighting module 16B, a third lighting module 16C, and a fourth lighting module 16D. In the following description, when there is no need to distinguish between the first lighting module 16A to the fourth lighting module 16D, they will be collectively referred to as the lighting modules 16.

Each of the first to fourth lighting modules 16A to 16D guides light emitted from the light source unit 18 via an optical fiber 19 to each of the first light modulation section 20A, the second light modulation section 20B, the third light modulation section 20C, and the fourth light modulation section 20D. The lighting module 16 illuminates the light modulation section 20.

As will be described in further detail later, the light modulation unit 20 is controlled based on the circuit pattern to be transferred onto the exposure object, and modulates the illumination light from the illumination module 16. The modulated light modulated by the light modulation unit 20 is guided to the projection module 17. The first light modulation unit 20A to the fourth light modulation unit 20D are disposed at different positions on the XY plane. In the following description, when there is no need to distinguish between the first light modulation unit 20A to the fourth light modulation unit 20D, they will be collectively referred to as the light modulation unit 20.

The projection module 17 is disposed below the optical surface plate 15 and irradiates the exposure object placed on the stage 14 with modulated light modulated by the spatial light modulator 201. The projection module 17 forms an image of the light modulated by the light modulation unit 20 on the exposure object, thereby exposing the exposure object. In other words, the projection module 17 projects the pattern on the light modulation unit 20 onto the exposure object. In one example of this embodiment, the projection module 17 includes first projection module 17A to fourth projection module 17D, which correspond to the first illumination module 16A to fourth illumination module 16D and first light modulation unit 20A to fourth light modulation unit 20D described above. In the following description, when the first projection module 17A to fourth projection module 17D are not to be distinguished from one another, they will be collectively referred to as the projection module 17.

A unit consisting of the first illumination module 16A, the first light modulation unit 20A, and the first projection module 17A is called the first exposure module. Similarly, a unit consisting of the second illumination module 16B, the second light modulation unit 20B, and the second projection module 17B is called the second exposure module. Each exposure module is provided at a different position on the XY plane and can expose a pattern at a different position on an exposure object placed on the stage 14. The stage 14 can scan and expose the entire surface of the exposure object or the entire surface of the exposure target area by moving relative to the exposure modules in the X-axis direction, which is the scanning direction.

The illumination module 16 is also referred to as an illumination system. The illumination module 16 (illumination system) illuminates a spatial light modulator 201 (spatial light modulation element) of the light modulation unit 20, which will be described later.
The projection module 17 is also referred to as a projection unit. The projection module 17 (projection unit) may be a life-size system that projects an image of the pattern on the light modulation unit 20 at life-size, or may be a magnification system or a reduction system. The projection module 17 is preferably made of one or two types of glass material (particularly, quartz or fluorite).

1, a pair of light source units 18 (light source unit R18R and light source unit L18L) are provided. As the light source unit 18, a light source unit using a highly coherent laser as a light source, a light source unit using a light source such as a semiconductor laser type UV-LD, or a light source unit using a lens relay type retarder can be used. Examples of the light source 18a included in the light source unit 18 include a lamp or laser diode that emits light with a wavelength of 405 nm or 365 nm.

In addition to the above-mentioned components, the exposure apparatus 1 also includes a position measurement unit (not shown) that is configured with an interferometer, an encoder, etc., and measures the relative position of the stage 14 with respect to the optical surface plate 15 .
In addition to the above-mentioned components, the exposure apparatus 1 is equipped with an AF (Auto Focus) unit (not shown) that measures the position in the Z-axis direction of the stage 14 or the exposure object on the stage 14. The exposure apparatus 1 is further equipped with an alignment unit (not shown) that measures the relative position of each pattern when exposing a different pattern on top of a pattern that has already been exposed on the exposure object. The AF unit and/or the alignment unit may be configured as a TTL (Through the Lens) unit that performs measurement via the projection module 17.

3 is a diagram showing an outline of the configuration of the exposure module. Taking the first exposure module as an example, an example of a specific configuration of the illumination module 16, the light modulation section 20, and the projection module 17 will be described.

The illumination module 16 includes a module shutter 161 and an illumination optical system 162 .
The module shutter 161 switches whether or not the pulsed light supplied from the optical fiber 19 is guided to the illumination optical system 162 .

The illumination optical system 162 emits pulsed light supplied from the optical fiber 19 to the light modulation unit 20 via a collimator lens, a fly's eye lens, a condenser lens, etc., thereby almost uniformly illuminating the light modulation unit 20. The fly's eye lens divides the wavefront of the pulsed light incident on the fly's eye lens, and the condenser lens superimposes the wavefront-divided light on the light modulation unit. Note that the illumination optical system 162 may include a rod integrator instead of a fly's eye lens.

The light modulation unit 20 includes a mask, which is a spatial light modulator (SLM).

The light modulation unit 20 includes a spatial light modulator 201 and an off-light absorbing plate 202. The spatial light modulator 201 is a digital mirror device (digital micromirror device, DMD). The spatial light modulator 201 can modulate illumination light spatially and temporally.

FIG. 4 is a diagram showing an outline of the configuration of the spatial light modulator 201 of this embodiment. In this figure, a three-dimensional Cartesian coordinate system of Xm, Ym, and Zm axes will be used for explanation. The spatial light modulator 201 includes a plurality of micromirrors 203 (mirrors) arranged on an XmYm plane. The micromirrors 203 constitute the elements (pixels) of the spatial light modulator 201. The spatial light modulator 201 can change the tilt angle around the Xm and Ym axes. For example, as shown in FIG. 5, the micromirrors 203 are turned on by tilting around the Ym axis, and turned off by tilting around the Xm axis as shown in FIG. 6. When the micromirrors 203 are turned on, they emit light toward the projection module 17. When the micromirrors 203 are turned off, they do not emit light toward the projection module 17.

The spatial light modulator 201 controls the direction in which incident light is reflected for each element by switching the tilt direction of each micromirror 203. As an example, the digital micromirror device of the spatial light modulator 201 has a pixel count of about 4 Mpixels and can switch the micromirrors 203 between an on state and an off state at a frequency of about 10 kHz.
The spatial light modulator 201 has a plurality of elements that are individually controlled at predetermined time intervals. When the spatial light modulator 201 is a DMD, the elements are micromirrors 203, and the predetermined time interval is a period (for example, a period of 10 kHz) at which the micromirrors 203 are switched between an on state and an off state.

3 , the off-light absorbing plate 202 absorbs light (off light) emitted (reflected) from elements that are turned off in the spatial light modulator 201. The light emitted from elements that are turned on in the spatial light modulator 201 is guided to the projection module 17.

The projection module 17 projects the light emitted from the turned-on elements of the spatial light modulator 201 onto an exposure object. The projection module 17 includes a magnification adjustment unit 171 and a focus adjustment unit 172. Light modulated by the spatial light modulator 201 (modulated light) is incident on the magnification adjustment unit 171.

The magnification adjustment unit 171 adjusts the magnification of the image on the focal plane 163 of the modulated light emitted from the spatial light modulator 201, that is, on the surface of the exposure object, by driving some of the lenses in the optical axis direction.

The focus adjustment unit 172 adjusts the imaging position, i.e., the focus, by driving the entire lens group in the optical axis direction so that the modulated light emitted from the spatial light modulator 201 is imaged on the surface of the exposure object measured by the AF unit described above.

The projection module 17 projects only the image of light emitted from the ON elements of the spatial light modulator 201 onto the surface of the exposure object. Therefore, the projection module 17 can project and expose the image of the pattern formed by the ON elements of the spatial light modulator 201 onto the surface of the exposure object. In other words, the projection module 17 can form spatially modulated modulated light on the surface of the exposure object. Furthermore, as described above, the spatial light modulator 201 can switch the ON state and OFF state of the micromirror 203 at a predetermined cycle (frequency), so the projection module 17 can form temporally modulated modulated light on the surface of the exposure object.
That is, the exposure apparatus 1 performs exposure by changing the substantial pupil state at any exposure position.

4 to 6, the Xm axis is parallel to the X axis, and the Ym axis is parallel to the Y axis, so that the micromirror 203 in the ON state (the micromirror 203 tilted around the Ym axis) is tilted with respect to the X axis direction, which is the scanning direction.

The Ym axis is also referred to as the first tilt axis T1. In the spatial light modulator 201, the plurality of micromirrors 203 each rotate around the first tilt axis T1 (Ym axis), and the plurality of micromirrors 203 adjust their tilt with respect to the scanning direction to be turned on, thereby emitting light to the projection module 17.
In the spatial light modulator 201, the plurality of micromirrors 203 are aligned linearly in the scanning direction, and are also aligned in the direction of the first tilt axis T1.

2, the control unit 21 is configured by, for example, a computer having a calculation unit such as a CPU and a storage unit. The computer controls each unit of the exposure apparatus 1 in accordance with a program that executes control of each unit that operates in the exposure process. The control unit 21 controls the operation of, for example, the illumination module 16, the light modulation unit 20, the projection module 17, and the stage 14.

The storage unit is configured using a computer-readable storage medium device such as a memory. The storage unit stores various information related to the exposure process. The storage unit stores, for example, information related to the exposure pattern during the exposure process. The storage unit stores, for example, information input via the communication unit or the input unit. The communication unit is configured to include a communication interface for connecting the exposure apparatus to an external device. The input unit is configured to include input devices such as a mouse, keyboard, or touch panel. The input unit accepts input of various information for the exposure apparatus.

[Exposure Method]
The stage 14 moves the exposure object relative to the projection module in a predetermined scanning direction, so that the light emitted by the projection module scans the exposure object based on the information about the exposure pattern stored in the memory unit, forming a predetermined exposure pattern.

Fig. 7 is a diagram showing an outline of the configuration of the spatial light modulator 201. Fig. 8 is a diagram showing an exposure field PI on the exposure object 23.
7, the spatial light modulator 201 includes a plurality of micromirrors 203 (mirrors) arranged on an XmYm plane. In FIG. 7, the micromirrors 203 are arranged in a 5×5 matrix.

Hereinafter, one micromirror 203 included in the spatial light modulator 201 may be referred to as a pixel. The micromirror 203 is turned on by tilting it around the Ym axis, for example, and turned off by tilting it around the Xm axis. A micromirror 203 that is turned on is referred to as an "ON pixel." A micromirror 203 that is turned off is referred to as an "OFF pixel."

In the exposure apparatus 1 of this embodiment, the spatial light modulator 201 switches between a first state in which a predetermined exposure pattern is irradiated onto the exposure object 23 and a second state.

In the first state, the control unit 21 turns on one or more predetermined micromirrors 203 among the plurality of micromirrors 203. In FIG. 7 , of the five micromirrors 203 constituting the third row (third row from the top), the second to fourth micromirrors 203 from the left are in the on state. Of the five micromirrors 203 constituting the third column (third column from the left), the second to fourth micromirrors 203 from the top are in the on state. The total of five micromirrors 203 in the on state are arranged in a cross shape as a whole. These five micromirrors 203 are referred to as a first micromirror group 205.

8, the exposure field PI (exposure pattern) on the exposure object 23 has a cross shape corresponding to the on-state micromirrors 203. The exposure field PI is located at the center of the exposure object 23.

Fig. 9 is a diagram showing an outline of the configuration of the spatial light modulator 201. Fig. 10 is a diagram showing an exposure field PI on the exposure object 23.
9 shows the second state of the spatial light modulator 201, in which of the five micromirrors 203 constituting the third row (third row from the top), the third to fifth micromirrors 203 from the left are in the ON state. Of the five micromirrors 203 constituting the fourth column (fourth column from the left), the second to fourth micromirrors 203 from the top are in the ON state. The five micromirrors 203 in the ON state are arranged in a cross shape as a whole. The control unit 21 can switch between the first state and the second state.

The five micromirrors 203 in the ON state are referred to as the second micromirror group 206. The second micromirror group 206 has the same shape as the first micromirror group 205 in the first state (see FIG. 7 ), but some of the micromirrors 203 constituting the second micromirror group 206 are different from the micromirrors 203 constituting the first micromirror group 205. Specifically, the second micromirror group 206 is composed of micromirrors 203 that are shifted one pixel to the right relative to the first micromirror group 205. That is, although at least one micromirror that is turned ON differs between the first and second states of the spatial light modulator 201, an exposure pattern of the same shape can be formed in either the first or second state. Note that exposure patterns of the same shape also include exposure patterns with different magnifications and defocused exposure patterns. For example, exposure patterns with different magnifications can be formed by adjusting the magnification adjustment unit 171 of the projection module 17. For example, a defocused exposure pattern can be formed by adjusting the focus adjustment unit 172 of the projection module 17.

As shown in FIG. 10 , the exposure field PI (exposure pattern) on the exposure object 23 has a cross shape corresponding to the micromirrors 203 in the ON state. The exposure field PI shown in FIG. 10 and the exposure field PI shown in FIG. 8 have the same shape. By moving the stage 14 rightward in response to a change in position from the first micromirror group 205 (see FIG. 7 ) to the second micromirror group 206 (see FIG. 9 ), the exposure object 23 can also be moved rightward. This allows the irradiation position to be changed. Furthermore, by moving the optical members in the projection module 17 or by moving the stage on which the spatial light modulator 201 is mounted in the X direction and/or Y direction in response to a change in position from the first micromirror group 205 (see FIG. 7 ) to the second micromirror group 206 (see FIG. 9 ), the irradiation position can be changed. That is, the position of the exposure field PI on the exposure object 23 can be centered, as in the first state.

There is no particular limitation on the timing of switching between the first state and the second state of the spatial light modulator 201. The switching between the first state and the second state may be performed for each scanning exposure, may be performed periodically at a predetermined timing, may be performed between the end of exposure of the exposure object 23 and the start of scanning exposure of the next exposure object, or may be performed at an even longer interval.

If the micromirror 203 remains in the on state for a long period of time, the micromirror 203 may become stuck in that state. If a micromirror 203 is stuck in the on state, a specific position on the exposure object 23 may be unnecessarily exposed. That is, although the micromirror 203 should be in the off state, it may be stuck in the on state and expose a position that should not be exposed. However, in this embodiment, by exposing the spatial light modulator 201 by switching between the first state and the second state (see FIGS. 8 and 10 ), it is possible to prevent the micromirror 203 from remaining in the on state for a long period of time. This makes it possible to prevent the micromirror 203 from becoming stuck.

If the micromirror 203 becomes stuck, unnecessary exposure of a specific position on the exposure object 23 may occur. In this case, a light-shielding member (shutter) may be provided to block light from the micromirror 203, thereby preventing unnecessary exposure of the specific position. The light-shielding member may be provided to block at least a portion of the light emitted from the spatial light modulator 201, or may be provided to block at least a portion of the light incident on the spatial light modulator 201. The light-shielding member may be provided between the optical fiber 19 and the illumination optical system 162, within the illumination optical system 162, between the illumination optical system 162 and the spatial light modulator 201, within the projection module 17, or between the projection module 17 and the exposure object 23.
Furthermore, if the micromirror 203 becomes stuck, the exposure object 23 may be scanned and exposed using another exposure module provided in the exposure apparatus 1. The exposure module to be used in this case is preferably an exposure module provided next to the exposure module having the spatial light modulator 201 to which the micromirror 203 has become stuck, and the exposure module to be used may be set in advance. This makes it possible to prevent the exposure apparatus 1 from having to stop in order to replace the spatial light modulator 201, for example, and allows exposure of the exposure object 23 to continue.

The micromirror 203 may be switched between an on state and an off state at times other than during the exposure process. The ratio of the on state time to the off state time may be, for example, 1:2 to 2:1, and is preferably 1:1. The switching between the on state and the off state may be performed continuously throughout the time other than during the exposure process, or may be performed only for a predetermined period of time.

The micromirror 203 may be maintained in a neutral state between the ON state and the OFF state during times other than the exposure process. The neutral state may be maintained continuously throughout the time other than the exposure process, or only for a predetermined period of time.
Furthermore, the micro-mirror 203 may be switched between an ON state and an OFF state at times other than during the exposure process, in an opposite phase to the ON state and OFF state during scanning exposure. That is, during scanning exposure, the micro-mirror 203 is switched between an ON state and an OFF state while exposure is being performed, but the micro-mirror 203 may be operated at a time equal to or shorter than the exposure holding time so that the ON state is switched to the OFF state and the OFF state is switched to the ON state.
These factors make it difficult for the micromirror 203 to stick.

When a spatial light modulator capable of adjusting the tilt of a mirror is used, the spatial light modulator may calibrate the tilt angle of the mirror by applying a voltage, or may measure the power (illuminance) of light from the mirror and calibrate the fluctuation.

As described above, if the same micromirror 203 is in the on state for a long time, the micromirror 203 is likely to stick. In contrast, the exposure apparatus 1 of this embodiment can prevent the micromirror 203 from being in the on state for a long time, making it less likely for the micromirror 203 to stick. This allows the micromirror 203 to operate normally. As a result, good exposure processing is possible.

If the micromirror 203 is left in the off state for a long period of time, the micromirror 203 is more likely to stick, but in the exposure apparatus 1 of this embodiment, it is possible to prevent the micromirror 203 from being left in the off state for a long period of time, making it less likely for the micromirror 203 to stick.

In the exposure method using the exposure apparatus 1 of this embodiment, a part of the micromirror 203 that is turned on differs between the first state and the second state of the spatial light modulator 201. This makes it difficult for the micromirror 203 to stick. This allows the micromirror 203 to operate normally. This enables good exposure processing.

The exposure apparatus 1 of this embodiment may be equipped with a master clock (an oscillator that generates a master clock) (not shown) that serves as a reference for synchronization. In the exposure apparatus 1, devices such as the stage 14, the illumination module 16, the projection module 17, and the light modulation unit 20 may be driven based on the master clock. The control unit 21 can control the operation of each device based on the master clock. By referring to the master clock, the operation timing of each device is appropriately adjusted individually, and the relationship between the operation timings of multiple devices is appropriately set.

In the exposure apparatus 1 of this embodiment, the second micromirror group 206 (see FIG. 9 ) is configured by micromirrors 203 that are slid one pixel to the right relative to the first micromirror group 205 (see FIG. 7 ). However, the position of the second micromirror group relative to the first micromirror group is not limited to this. The second micromirror group may be slid two or more pixels relative to the first micromirror group. The direction of the sliding movement is not limited to the rightward direction on the paper of FIGS. 7 and 9 , but may also be leftward or up and down. The second micromirror group may be located at a position that is rotationally displaced around the center of the first micromirror group. The second micromirror group may have a reduced or enlarged shape compared to the first micromirror group. The first micromirror group and the second micromirror group may differ in at least one micromirror, or all micromirrors may be different.

10, in the above-described exposure method, the control unit 21 moves the exposure object 23 to the right by moving the stage 14 to the right in response to a change in position from the first micromirror group 205 (see FIG. 7) to the second micromirror group 206 (see FIG. 9). In this way, exposure positioning on the exposure object 23 can be performed by adjusting the position of the stage 14.
The method of aligning the exposure position on the exposure object 23 is not limited to this. For example, the control unit 21 may align the exposure position on the exposure object 23 by adjusting the position of the spatial light modulator 201. The control unit 21 may align the exposure position on the exposure object 23 by adjusting the projection position of the projection module 17.

In the exposure apparatus 1, one projection module 17 (for example, the first projection module 17A) and another projection module 17 (for example, the second projection module 17B) may perform sequential exposure.

(Method for manufacturing electronic devices)
The exposure apparatus 1 can manufacture electronic devices such as liquid crystal display devices (flat panel displays) using the above-described exposure method.

The disclosures of all US patent application publications and US patent specifications relating to exposure apparatuses and the like cited in the above embodiments are incorporated herein by reference.

One embodiment of the present invention has been described in detail above with reference to the drawings, but the specific configuration is not limited to that described above, and various design changes and the like are possible within the scope that does not deviate from the gist of the present invention.

1 Exposure apparatus 14 Stage 17 Projection module (projection optical system)
162 illumination optical system 201 spatial light modulator 203 micromirror

Claims (16)

an illumination optical system;
a spatial light modulator illuminated by light from the illumination optical system;
a projection optical system that irradiates an exposure target with light emitted from the spatial light modulator;
a stage on which at least one of a first exposure target and a second exposure target different from the first exposure target is placed, the stage moving at least one of the first exposure target and the second exposure target relative to the projection optical system in a predetermined scanning direction;
a control unit for controlling the spatial light modulator;
Equipped with
the spatial light modulator has a plurality of mirrors that can be switched between an ON state in which light can be emitted to the projection optical system by adjusting the tilt and an OFF state in which light is not emitted to the projection optical system;
the control unit controls the spatial light modulator to switch the plurality of mirrors between a first state and a second state;
the first state and the second state are different from each other in at least one of the mirrors that is turned on;
During a first period in which the first exposure object is scanned and exposed, the light emitted from the spatial light modulator in the first state forms a first exposure pattern on the first exposure object, and during a second period in which the second exposure object is scanned and exposed, which is different from the first period, the light emitted from the spatial light modulator in the second state forms a second exposure pattern on the second exposure object, the second exposure pattern having the same shape as the first exposure pattern.
Exposure equipment. The exposure apparatus of claim 1, wherein the control unit switches from the first state to the second state and adjusts the position of the stage in accordance with the change in the position of the mirror in the on state, thereby aligning the exposure position on the second exposure target. The exposure apparatus of claim 1, wherein the control unit switches from the first state to the second state and adjusts the position of the spatial light modulator in accordance with the change in the position of the mirror in the on state, thereby aligning the exposure position on the second exposure target. The exposure apparatus of claim 1, wherein the control unit switches from the first state to the second state and adjusts the position of light irradiated by the projection optical system in response to a change in the position of the mirror in the on state, thereby aligning the exposure position on the second exposure target. The exposure apparatus according to any one of claims 1 to 4, wherein the control unit switches between the first state and the second state each time a scanning exposure is performed. The exposure apparatus according to any one of claims 1 to 4, wherein the control unit switches from the first state to the second state between the end of exposure of the first exposure target and the start of exposure of the second exposure target. The exposure apparatus according to any one of claims 1 to 4, wherein the control unit switches between the first state and the second state at a preset timing. The exposure apparatus according to any one of claims 1 to 4, wherein the control unit switches the multiple mirrors between the on state and the off state at times other than during exposure processing. The exposure apparatus of claim 8, wherein the ratio of the time of the on state to the time of the off state is 1:2 to 2:1. The exposure apparatus of claim 8, wherein the switching between the on state and the off state is in the opposite phase to the switching between the on state and the off state performed during scanning exposure. The exposure apparatus according to any one of claims 1 to 4, wherein the control unit maintains the multiple mirrors in a neutral state between the on state and the off state at times other than during exposure processing. The exposure apparatus described in any one of claims 1 to 4, further comprising a light-blocking member that blocks at least a portion of the light incident on the spatial light modulator. The exposure apparatus described in any one of claims 1 to 4, further comprising a light-blocking member that blocks at least a portion of the light emitted from the spatial light modulator. The exposure apparatus according to any one of claims 1 to 4, comprising a plurality of the projection optical systems. An exposure method for exposing an exposure object using the exposure apparatus described in any one of claims 1 to 4. A method for manufacturing an electronic device, comprising exposing an exposure object using the exposure method described in claim 15.