JP7730671B2 - IC socket and IC module inspection method - Google Patents

Description

The present invention relates to an IC socket and an IC module inspection method. In particular, the present invention relates to a technique for inspecting an IC module attached to an IC socket at a predetermined temperature.

In recent years, increasing communication traffic has led to demand for smaller, lower-power, and faster optical communication transceivers. To achieve these goals, R&D is being conducted on IC modules equipped with optical chips and optical fibers, using BGA (Ball Grid Array) or LGA (Land Grid Array) as electrical signal input/output interfaces. (Patent Document 1)

In pre-shipment inspections of IC modules equipped with such BGAs, optical chips, and optical fibers, IC sockets are used, just as with ICs and IC modules (or IC packages) equipped with BGAs, such as processors and ASICs. Figures 1(a) and (b) show an example of a conventional IC socket 100. Figure 1(a) shows the conventional socket body before mating. Figure 1(b) shows the conventional socket body after mating. The IC socket 100 includes a transposition section 101 equipped with contact pins 104 and a lid 102 attached to the transposition section. An IC module 103 equipped with optical fibers 110 is attached between the contact pins 104 and the lid 102. The lid 102 includes an elastic member 105, such as a spring, on its inside, and also includes a latch 107. When the latch 107 engages with the engagement portion of the transposition portion 101, the elastic force of the elastic member 105 acts on the pusher 106, allowing the pusher 106 to press the IC module 103 against the contact pins 104. This allows the terminals of the IC module 103 to come into contact with the contact pins 104, establishing electrical connection between them. The lid is available in two types: a clamshell type connected to the socket body by a hinge, and a one-touch type (latch type) that engages with the socket body (transposition portion 101 and lid 102) using a latch (claw) 107 on the lid 102 but allows the IC socket 100 itself to be attached and detached. When testing an IC module in a temperature environment, a non-contact temperature adjustment element (not shown) called a Thermostream, which sprays jets of air at temperatures ranging from -100°C to 300°C, is used to change the temperature environment for the IC socket 100 itself.

Japanese Patent Application Laid-Open No. 2020-194041

IC sockets are also used to test IC modules equipped with BGAs, optical chips, and optical fibers, but the thermostream, which ejects jets of air, causes the optical fiber to vibrate. This changes the polarization state of the optical signal passing through the optical fiber, affecting the test results.

The present invention was made in consideration of these problems, and aims to provide an IC socket that can regulate temperature without using a thermostream and allows testing without affecting the IC module installed.

In order to solve the above problem, the invention of an IC socket according to an embodiment of the present invention comprises a transposition section having contact pins for removably mounting an IC module, a lid body attached to the transposition section via the IC module mounted on the transposition section, a pressing body capable of pressing the mounted IC module by attaching it to the transposition section, the pressing body penetrating the lid body with a portion exposed from the lid body, and a Peltier element connected to the portion of the pressing body exposed from the lid body , which enables temperature adjustment by cooling and heating, and is characterized in that the pressing body can bring the terminal portion of the IC module into contact with the contact pins to establish conductivity, and is configured to thermally connect the Peltier element and the mounted IC module.

This invention provides an IC socket that can be temperature controlled without using a thermostream.

1A is a cross-sectional view showing a conventional socket body before mating, and FIG. 1B is a cross-sectional view showing a conventional socket body after mating. 1A is a top view showing an IC socket according to a first embodiment of the present invention, FIG. 1B is a cross-sectional view showing an IC socket according to a first embodiment of the present invention before mating, and FIG. 1C is a cross-sectional view showing an IC socket according to a first embodiment of the present invention after mating. 1A is a top view showing an IC socket according to a second embodiment of the present invention, FIG. 1B is a cross-sectional view showing the IC socket according to the second embodiment of the present invention before mating, and FIG. 1C is a cross-sectional view showing the IC socket according to the second embodiment of the present invention after mating. 1A is a top view showing an IC socket according to a third embodiment of the present invention, FIG. 1B is a cross-sectional view showing the IC socket according to the third embodiment of the present invention before mating, and FIG. 1C is a cross-sectional view showing the IC socket according to the third embodiment of the present invention after mating. 1A is a cross-sectional view showing a process of using an IC socket according to a third embodiment of the present invention; FIG. 1B is a cross-sectional view showing a process of using an IC socket according to a third embodiment of the present invention; FIG. 1C is a cross-sectional view showing a process of using an IC socket according to a third embodiment of the present invention; FIG. 10 is a diagram showing a comparative example.

Embodiments of this technology will be described below with reference to the drawings. Parts with the same functions are designated by the same reference numerals.

(Embodiment 1)
This embodiment relates to an IC socket 200 .

Figure 2(a) is a top view showing an IC socket 200 according to embodiment 1 of the present invention. Figure 2(b) is a cross-sectional view showing an IC socket 200 according to embodiment 1 of the present invention before mating. Figure 2(c) is a cross-sectional view showing an IC socket 200 according to embodiment 1 of the present invention after mating.

The IC socket 200 comprises a transposition section 201 equipped with contact pins 204 and a lid 202 attached to the transposition section, with an IC module 203 equipped with an optical fiber 210 attached between the contact pins 204 and the lid 202. The lid 202 is equipped with an elastic member 205 on its inner side and also with a latch 207. When the latch 207 engages with the engagement section of the transposition section 201, the elastic force of the elastic member 205 acts on a pressing body (pusher) 206, which can press the IC module 203 against the contact pins 204. This allows the terminals of the IC module 203 to come into contact with the contact pins 204, establishing electrical conductivity between them. Lid: The lid is available in clamshell type, connected to the socket body by a hinge, and one-touch type (latch type), which fits with the socket body (transposition part 201 and lid body 202) using a latch (claw) 207 on the lid body 202, but allows the IC socket 200 itself to be attached and detached.

The elastic member 205 may be, for example, a spring or rubber.

The pressing body 206 may be made of, for example, metal or plastic.

For example, the transposition part 201 has a recess on its side for mating with a protrusion, and a latch 207 is provided on the side of the lid 202, including a protrusion extending from the latch, with the recess and protrusion mating. In other words, the transposition part 201 and the lid 202 (socket body) are mated together by the latch (claw) 207 provided on the lid 202.

In Figure 2(a), the end of latch 207 does not coincide with the side of lid 202, but a latch having an end that coincides with the side of lid 202 may also be used. The recess of lid 202 may have any shape that can fit into the protrusion of latch 207.

2(a) to 2(c), in the IC socket 200 of this embodiment, the pressing body 206 penetrates the lid 202, with the upper portion of the pressing body 206 exposed from the lid 202. Therefore, the pressing body 206 connects to the temperature adjustment element 208 at the upper portion of the pressing body 206 on the opposite side of the IC module 203. The pressing body 206 can also connect to the temperature adjustment element 208 in areas on its surface other than the connection area between the temperature adjustment element 208 and the attached IC module 203. In other words, by bringing the pressing body 206 into contact with the temperature adjustment element (Peltier unit) 208, the pressing body 206 can thermally connect the temperature adjustment element 208 and the attached IC module 203. This makes it possible to adjust the temperature of the IC module 203 placed in the IC socket 200.

This allows temperature adjustment without using a thermostream, and makes it possible to prevent fluctuations in the polarization of optical fiber in IC modules from affecting optical signals during testing.

Contact-type temperature adjustment elements 208 include Peltier elements, heat pumps, and heat dissipation fins. In particular, Peltier elements allow for compact and precise temperature adjustment.

(Embodiment 2)
This embodiment relates to an IC socket 300 that is different from the IC socket 200 described in embodiment 1. The method of connecting the temperature adjustment element 208 is different.

Figure 3(a) is a top view showing an IC socket 300 according to a second embodiment of the present invention. Figure 3(b) is a cross-sectional view showing the IC socket 300 according to the second embodiment of the present invention before mating. Figure 3(c) is a cross-sectional view showing the IC socket 300 according to the second embodiment of the present invention after mating.

The IC socket 300 comprises a transposition section 201 equipped with contact pins 204 and a lid 202 attached to the transposition section, with an IC module 203 equipped with an optical fiber 210 attached between the contact pins 204 and the lid 202. The lid 202 is equipped with an elastic member 205 on its inner side and also with a latch 207. When the latch 207 engages with the engagement section of the transposition section 201, the elastic force of the elastic member 205 acts on a pressing body (pusher) 306, allowing the pressing body 206 to press the IC module 203 against the contact pins 204. This allows the terminals of the IC module 203 to come into contact with the contact pins 204, establishing electrical conductivity between them. Lid: The lid is available in clamshell type, connected to the socket body by a hinge, and one-touch type (latch type), which fits with the socket body (transposition section 201 and lid body 202) using a latch (claw) 207 on the lid body 202, but allows the IC socket 300 itself to be attached and detached.

The elastic member 205 may be, for example, a spring or rubber.

The pressing body 206 may be made of, for example, metal or plastic.

As shown in Figures 3(a) to 3(c), the IC socket 300 has a fitting hole 306a at the top of the pressing body 306, allowing for precise connection to the contact-type temperature adjustment element (Peltier unit) 208. The pressing body 306 connects to the temperature adjustment element 208 at the top of the pressing body 306, which is located opposite the IC module 203. The pressing body 306 can also connect to the temperature adjustment element 208 in areas on its surface other than the connection area between the pressing body 306 and the attached IC module 203. In other words, the pressing body 306 comes into contact with the temperature adjustment element 208. In this way, the pressing body 306 can thermally connect the temperature adjustment element 208 to the attached IC module 203. This enables temperature adjustment of the IC module 203 placed in the IC socket 200.

Figures 3(a) to (c) show an example of two mating holes 306a provided in the pressing body 306, but the number is not limited to two. Furthermore, the cross-sectional shape of the mating holes may be circular or rectangular.

This embodiment provides an IC socket that can be temperature controlled without using a thermostream.

(Embodiment 3)
This embodiment relates to an IC socket 400 that is different from the IC sockets of embodiments 1 and 2. The method of connecting the temperature adjustment element 208 and the shape and operation method of the pressing body are different.

Figure 4(a) is a top view showing an IC socket 400 according to a third embodiment of the present invention. Figure 4(b) is a cross-sectional view showing an IC socket 400 according to a second embodiment of the present invention before mating. Figure 4(c) is a cross-sectional view showing an IC socket 400 according to a second embodiment of the present invention after mating.

The IC socket 400 comprises a transposition section 201 equipped with contact pins 204 and a lid 202 attached to the transposition section, with an IC module 203 equipped with an optical fiber 210 attached between the contact pins 204 and the lid 202. The lid 202 is equipped with an elastic member 205 on its inner side and also with a latch 207. When the latch 207 engages with the engagement section of the transposition section 201, the elastic force of the elastic member 205 acts on a pressing body (pusher) 206, which can press the IC module 203 against the contact pins 204. This allows the terminals of the IC module 203 to come into contact with the contact pins 204, establishing electrical conductivity between them. Lid: The lid is available in clamshell type, connected to the socket body by a hinge, and one-touch type (latch type), which fits with the socket body (transposition section 201 and lid body 202) using a latch (claw) 207 on the lid body 202, but allows the IC socket 400 itself to be attached and detached.

The elastic member 205 may be, for example, a spring or rubber.

The pressing body 206 may be made of, for example, metal or plastic.

As shown in Figures 4(a) to (c), the IC socket 400 of the present invention has a through-type pressing body 406 equipped with a hole 406a, such as a screw hole, for connecting a transposition auxiliary jig 409, and the transposition auxiliary jig 409 can be connected to and detached from the lid 202.

The specific configuration of the IC socket 400 of this embodiment includes a mechanism for connecting a transposition auxiliary jig 409 to a pressing body 406 that penetrates the lid body 202. As shown in Figure 5(a), the transposition auxiliary jig 409 can be connected to and detached from the lid body 202, and as shown in Figures 5(b) and 5(c), it also includes a mechanism for vertically raising and lowering the pressing body 406.

For example, in Figure 5, the mechanism for connecting the auxiliary jig 409 for transposition is configured as a screw hole.

Also, as shown in Figure 4(c), the auxiliary jig 409 for transposition is composed of a structure 409a that can be connected to the lid body 202 and a screw 409b.

To use the transposition auxiliary jig 409, first attach the transposition auxiliary jig 409 to the lid 202, and then, as shown in Figure 5(b), turn the screw 409b to pull the pressing body 406 up until it is flat on the underside of the lid 202. Then, the lid 202 with the transposition auxiliary jig 409 attached is fixed to the transposition unit (transposition table). Here, the manner in which it is fixed using the latch 207 is described, but a clamshell type may also be used.

As shown in FIG. 5(c), the screw 409b is loosened to slowly lower the pressing body 406, and the auxiliary jig 409 for transposition is removed, allowing connection to a contact-type temperature adjustment element (Peltier unit). The pressing body 406 connects to the temperature adjustment element at the top of the pressing body 406 on the opposite side of the IC module 203. The pressing body 406 can also connect to the temperature adjustment element (not shown) in areas on its surface other than the connection area between the pressing body 406 and the attached IC module 203. In other words, the pressing body 406 comes into contact with the temperature adjustment element (not shown). In this way, the pressing body 406 can thermally connect the temperature adjustment element (not shown) to the attached IC module 203. This makes it possible to adjust the temperature of the IC module 203 transposed to the IC socket 200.

According to this embodiment, the mechanism described above eliminates the need for the operator to push the lid body in to attach it, and the lid body is not pushed in biasedly when doing so. Furthermore, because the pressing body descends vertically, even modules with optical fiber connected to them are less likely to be displaced biasedly.

As a result, with the IC socket of this embodiment, the auxiliary transposition jig prevents the module from becoming misaligned during transposition, preventing contact failure. Furthermore, because the auxiliary transposition jig is removable, it can be connected to a contact-type temperature adjustment element, and because it does not use a thermostream that emits jets of air to shake the optical fiber, it does not affect the inspection results.

<Comparative Example>
In the conventional IC socket 100 shown in FIG. 1, the IC module 103 may be tilted and displaced, resulting in poor contact with the contact pins 104 and causing poor electrical continuity.

Furthermore, as shown in Figure 6(a), in the case of an IC module 103a equipped with an optical fiber 110a, since the optical fiber 110a is connected, the weight of the optical fiber 110a itself can easily cause it to become biased and displaced.

The present invention is applicable to the technical field of IC socket and IC module inspection methods.

100, 200, 300, 400 IC socket 101, 201 Transposition portion 102, 202 Lid 103, 103a, 203 IC module 104, 204 Contact pin 105, 205 Elastic member 106, 206, 306, 406 Pressing body (pusher)
107, 207 Latch 208 Temperature adjustment element (Peltier unit)
306a fitting hole 309 positioning pin 406a hole 409 auxiliary jig 409a structure 409b screws 110, 110a, 210 optical fiber

Claims (5)

a transposition unit to which an IC module is removably attached and which is provided with contact pins;
a cover attached to the transposition unit via an IC module attached to the transposition unit;
a pressing body that is capable of pressing the mounted IC module by being attached to the transposition section, the pressing body penetrating the lid body and having a portion exposed from the lid body;
a Peltier element connected to a portion of the pressing body exposed from the lid body, the Peltier element enabling temperature adjustment by cooling and heating;
Equipped with
the pressing body is configured to bring the terminal portion of the IC module into contact with the contact pin to establish electrical continuity by pressing the pressing body, and to thermally connect the Peltier element and the attached IC module ;
The apparatus further includes an auxiliary jig for transposition that can be connected to and separated from the lid body and has a mechanism for moving the pressing body up and down, the moving mechanism being a structure that is connected to or separated from the lid body, the structure having a screw hole, a screw that engages with the screw hole of the structure, and a screw hole that is provided in the pressing body and engages with the screw;
An IC socket comprising : The IC socket described in claim 1, characterized in that the lid and the transposition portion are engaged by a latch provided on the lid. The IC socket described in claim 1, characterized in that the connection between the lid and the transposition section is a one-touch type, which is made possible by a latch provided on the lid engaging with the transposition section, or a clamshell type, in which the lid and the transposition section are connected and fitted together by a hinge connecting the lid and the transposition section. An IC socket according to any one of claims 1 to 3, characterized in that the pressing body has a fitting hole that allows connection using the positioning pin of the Peltier element. 1. A method for inspecting an IC module using an IC socket, the method comprising: a transposition section for removably mounting an IC module and having contact pins; a lid body attached to the transposition section via the IC module mounted on the transposition section; a pressing body capable of pressing the mounted IC module by being attached to the transposition section, the pressing body penetrating the lid body with a portion exposed from the lid body; and a Peltier element connected to the portion of the pressing body exposed from the lid body, which enables temperature adjustment by cooling and heating,
a step of pressing the IC module mounted by attachment to the transposition section with the pressing body provided on the lid body, and bringing the terminal section of the IC module into contact with the contact pins by the pressing to establish electrical continuity, thereby thermally connecting the Peltier element and the mounted IC module with the pressing body;
and
The method further includes a step of attaching an auxiliary jig for transposition to the pressing body before attaching the lid body,
The connecting step includes:
The terminal portion of the IC module is brought into contact with the contact pin to establish electrical continuity;
After removing the auxiliary jig for transposition from the pressing body, the Peltier element is connected to the pressing body.
1. A method for inspecting an IC module, comprising :