JP7733005B2 - Control device including image processing device - Google Patents

Description

The present invention relates to an image processing device that performs image processing based on image data of parts scattered on a stage.

Some image processing devices perform image processing based on image data of parts scattered on a stage, as described in the following patent document:

Patent No. 6542353

The objective of this specification is to perform appropriate image processing based on image data of parts scattered on a stage.

In order to solve the above problem, this specification discloses a control device including an image processing device, which calculates a brightness difference between the brightness of a component identified based on image data obtained by capturing an image of a component placed at a predetermined first position on a stage and the stage at a predetermined second position different from the first position, and if the value of the brightness difference is less than a first threshold, provides a guide to replace the stage with a stage of a color different from the color of the component, if the value of the brightness difference is equal to or greater than the first threshold and less than a second threshold that is greater than the first threshold, causes the image processing device to perform image processing to increase the difference between the brightness of the component in the image data obtained by capturing an image of the components scattered on the stage and the brightness of the stage, and if the value of the brightness difference is equal to or greater than a third threshold that is greater than the second threshold, changes the exposure time .

According to the present disclosure, image processing can be performed appropriately based on image data of parts scattered on the stage.

FIG. 2 is a perspective view showing a component mounter. FIG. 2 is a perspective view showing a component mounting device of the component mounter. FIG. FIG. 2 is a perspective view showing a component supply unit. FIG. FIG. FIG. FIG. FIG. 2 is a perspective view showing a component holding head. FIG. 10 is a view showing the component receiving member in a state where an electronic circuit component is housed therein; FIG. 2 is a block diagram showing a control device of the component mounter. FIG. 10 is a diagram showing a state in which lead components are scattered on a stage. FIG. 10 is a diagram showing a lead component recognized by pattern matching. FIG. 10 is a diagram showing a state in which lead components are scattered on a stage. FIG. 10 is a diagram showing a state in which lead components are scattered on a stage. FIG. 10 is a flowchart of a program. FIG. 10 is a flowchart of a program. FIG. 10 is a flowchart of a program. FIG. 10 is a diagram showing an image of a stage displayed on a display panel. FIG. 10 is a diagram showing an image of a stage displayed on a display panel.

Below, an embodiment of the present invention will be described in detail with reference to the drawings as a mode for carrying out the present invention.

Figure 1 shows a component mounter 10. The component mounter 10 is a device for performing component mounting operations on a circuit board 12. The component mounter 10 includes a device main body 20, a substrate transport and holding device 22, a component mounting device 24, imaging devices 26 and 28, a component supply device 30, a bulk component supply device 32, and a control device (see Figure 11) 34. Examples of the circuit board 12 include a circuit board, a substrate with a three-dimensional structure, etc., and examples of the circuit board include a printed wiring board, a printed circuit board, etc.

The device main body 20 is composed of a frame 40 and a beam 42 suspended from the frame 40. The substrate transport and holding device 22 is disposed in the center of the frame 40 in the front-to-rear direction and includes a transport device 50 and a clamping device 52. The transport device 50 transports the circuit board 12, and the clamping device 52 holds the circuit board 12. As a result, the substrate transport and holding device 22 transports the circuit board 12 and securely holds it in a predetermined position. In the following description, the transport direction of the circuit board 12 is referred to as the X direction, the horizontal direction perpendicular to that direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. In other words, the width direction of the component mounter 10 is the X direction, and the front-to-rear direction is the Y direction.

The component mounting device 24 is mounted on the beam 42 and includes two work heads 60, 62 and a work head moving device 64. Each work head 60, 62 has a suction nozzle 66 (see Figure 2) that holds the component. The work head moving device 64 also includes an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The X-direction moving device 68 and the Y-direction moving device 70 move the two work heads 60, 62 together to any position on the frame 40. As shown in Figure 2, each work head 60, 62 is removably positioned on sliders 74, 76 without the need for tools by the operator, and the Z-direction moving device 72 moves the sliders 74, 76 individually up and down. As a result, the work heads 60, 62 are moved individually up and down by the Z-direction moving device 72.

The imaging device 26 is attached to the slider 74 facing downward on a vertical line and moves in the X, Y, and Z directions together with the work head 60. This allows the imaging device 26 to capture an image of any position on the frame 40. As shown in FIG. 1, the imaging device 28 is disposed on the frame 40 between the substrate material transport and holding device 22 and the component supply device 30 facing upward on a vertical line. This allows the imaging device 28 to capture an image of a component held by the suction nozzle 66 of the work heads 60 and 62.

The component supply device 30 is disposed at one end of the frame 40 in the front-to-rear direction. The component supply device 30 has a tray-type component supply device 78 and a feeder-type component supply device (not shown). The tray-type component supply device 78 is a device that supplies components placed on a tray. The feeder-type component supply device is a device that supplies components using a tape feeder (not shown) or a stick feeder (not shown).

The bulk component supply device 32 is disposed at the other end of the frame 40 in the front-to-rear direction. The bulk component supply device 32 aligns multiple components that are scattered loosely and supplies the aligned components. In other words, it aligns multiple components in any orientation into a predetermined orientation and supplies the components in the predetermined orientation. The configuration of the component supply device 32 is described in detail below. Components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components with leads and components without leads.

As shown in Figure 3, the bulk component supply device 32 has a main body 80, a component supply unit 82, an imaging device 84, and a component delivery device 86.

The component supply unit 82 includes a component supply device 88, a component scattering device (see Figure 4) 90, and a component returning device (see Figure 4) 92, with the component supply device 88, component scattering device 90, and component returning device 92 being configured as an integrated unit. The component supply unit 82 is removably attached to the base 96 of the main body 80, and in the bulk component supply device 32, five component supply units 82 are arranged in a row in the X direction.

The component supply device 88 is generally shaped like a rectangular box and is arranged to extend in the Y direction, as shown in Figures 4 and 5. The Y direction is referred to as the front-to-rear direction of the component supply device 88, and the direction toward the side of the component supply unit 82 where the component return device 92 is arranged is referred to as the front, and the direction toward the side where the component supply device 88 is arranged is referred to as the rear.

The component supply device 88 has openings on the top and front, with the opening on the top serving as a component inlet 97 and the opening on the front serving as a component outlet 98. A sloping plate 104 is disposed below the inlet 97 of the component supply device 88. The sloping plate 104 is disposed so as to slope downward from the rear end face of the component supply device 88 toward the center.

As shown in Figure 5, a conveyor device 106 is disposed on the front side of the inclined plate 104. The conveyor device 106 is disposed so as to slope upward from the front end of the inclined plate 104 toward the front of the component supply device 88. The conveyor belt 112 of the conveyor device 106 rotates counterclockwise in Figure 5. In other words, the conveying direction of the conveyor device 106 is diagonally upward from the front end of the inclined plate 104 toward the front.

An inclined plate 126 is also provided below the front end of the conveyor device 106. The inclined plate 126 extends from the front end face of the component supply device 88 toward the bottom of the conveyor device 106, with its rear end slanted diagonally downward. Furthermore, an inclined plate 128 is also provided below the inclined plate 126. The inclined plate 128 is inclined from below the center of the conveyor device 106 toward the discharge outlet 98 of the component supply device 88, with its front end positioned downward.

As shown in Figure 4, a pair of side frames 130 are also attached to the base 96. The pair of side frames 130 are erected facing each other, parallel to each other, and extending in the Y direction. The distance between the pair of side frames 130 is slightly larger than the width dimension of the component supplier 88, and the component supplier 88 is removably attached between the pair of side frames 130.

The component scattering device 90 includes a component support member 150 and a component support member moving device 152. The component support member 150 is composed of a stage 156 and a pair of side walls 158. The stage 156 is generally elongated and plate-shaped, and is disposed so as to extend forward from below the component supply device 88, which is mounted between a pair of side frames 130. The upper surface of the stage 156 is generally horizontal, and as shown in FIG. 5, it is disposed with a slight clearance from the front end of the inclined plate 128 of the component supply device 88. The stage 156 is removably positioned and attached to the base (not shown) of the component support member 150 by bolts. The pair of side walls 158 are fixed in an upright position on both longitudinal sides of the stage 156, as shown in FIG. 4, and the upper ends of each side wall 158 extend above the upper surface of the stage 156.

The component support member moving device 152 also slides the component support member 150 in the Y direction by operating an air cylinder (see Figure 11) 166. During this operation, the component support member 150 moves between a stored state (see Figure 6) in which it is stored below the component supply device 88 and an exposed state (see Figure 5) in which it is exposed from below the component supply device 88.

As shown in Figure 7, the component returning device 92 includes a component storage container 180 and a container shaking device 181. The component storage container 180 is generally box-shaped with an arc-shaped bottom. The component storage container 180 is held swayably at the front end of the stage 156 of the component support member 150, and is swung by the operation of the container shaking device 181. In this case, the component storage container 180 swings between a storage position (see Figure 7) in which the opening faces upward and a return position (see Figure 8) in which the opening faces the upper surface of the stage 156 of the component support member 150.

As shown in FIG. 3, the imaging device 84 includes a camera 290 and a camera moving device 292. The camera moving device 292 includes a guide rail 296 and a slider 298. The guide rail 296 is fixed to the main body 80 above the component supplier 88 and extends in the width direction (X direction) of the bulk component supply device 32. The slider 298 is slidably attached to the guide rail 296 and can slide to any position by the operation of an electromagnetic motor (see FIG. 11) 299. The camera 290 is attached to the slider 298 while facing downward.

As shown in Figure 3, the component transfer device 86 includes a component holding head moving device 300, a component holding head 302, and two shuttle devices 304.

The component holding head moving device 300 includes an X-direction moving device 310, a Y-direction moving device 312, and a Z-direction moving device 314. The Y-direction moving device 312 has a Y-slider 316 arranged above the component supply unit 82 so as to extend in the X direction. The Y-slider 316 is moved to any position in the Y direction by driving an electromagnetic motor (see FIG. 11) 319. The X-direction moving device 310 has an X-slider 320 arranged on the side of the Y-slider 316. The X-slider 320 is moved to any position in the X direction by driving an electromagnetic motor (see FIG. 11) 321. The Z-direction moving device 314 has a Z-slider 322 arranged on the side of the X-slider 320. The Z-slider 322 is moved to any position in the Z direction by driving an electromagnetic motor (see FIG. 11) 323.

As shown in Figure 9, the component holding head 302 includes a head main body 330, a suction nozzle 332, a nozzle swiveling device 334, and a nozzle rotating device 335. The head main body 330 is integrally formed with the Z-slider 322. The suction nozzle 332 holds the component and is detachably attached to the lower end of the holder 340. The holder 340 is bendable on a support shaft 344, and operation of the nozzle swiveling device 334 causes the holder 340 to bend 90 degrees upward. As a result, the suction nozzle 332 attached to the lower end of the holder 340 rotates 90 degrees and is positioned at the swiveled position. In other words, operation of the nozzle swiveling device 334 causes the suction nozzle 332 to rotate between a non-swiveled position and a swiveled position. Of course, it is also possible to position and stop the suction nozzle 332 at an angle between the non-swiveled position and the swiveled position. The nozzle rotating device 335 also rotates the suction nozzle 332 around its axis.

As shown in FIG. 3, each of the two shuttle devices 304 includes a component carrier 388 and a component carrier moving device 390, which are fixed to the main body 80 and aligned horizontally in front of the component supply unit 82. Five component receiving members 392 are attached to the component carrier 388 and aligned horizontally in a row, and components are placed on each component receiving member 392.

The bulk component supply device 32 is capable of supplying a variety of components, and various component receiving members 392 are available depending on the shape of the components. Here, as an example of an electronic circuit component supplied by the bulk component supply device 32, we will explain the component receiving member 392 corresponding to a lead component 410 having leads, as shown in Figure 10. The lead component 410 is composed of a block-shaped component body 412 and two leads 414 protruding from the bottom surface of the component body 412.

The component receiving member 392 is also formed with a component receiving recess 416 shaped to accommodate the lead component 410. The component receiving recess 416 is a stepped recess, consisting of a main body receiving recess 418 that opens onto the top surface of the component receiving member 392, and a lead receiving recess 420 that opens onto the bottom surface of the main body receiving recess 418. The lead component 410 is inserted into the component receiving recess 416 with the lead 414 facing downward. As a result, the lead 414 is inserted into the lead receiving recess 420, and the lead component 410 is placed inside the component receiving recess 416 with the component body 412 inserted into the main body receiving recess 418.

As shown in FIG. 3, the component carrier moving device 390 is a plate-shaped longitudinal member that is disposed in front of the component supply unit 82 and extends in the front-to-rear direction. A component carrier 388 is disposed on the upper surface of the component carrier moving device 390 so as to be slidable in the front-to-rear direction, and is slid to any position in the front-to-rear direction by the drive of an electromagnetic motor (see FIG. 11) 430. When the component carrier 388 slides toward the component supply unit 82, it slides to a component receiving position located within the range of movement of the component holding head 302 by the component holding head moving device 300. On the other hand, when the component carrier 388 slides away from the component supply unit 82, it slides to a component supply position located within the range of movement of the work heads 60, 62 by the work head moving device 64.

As shown in FIG. 11, the control device 34 includes an overall control device 450, multiple individual control devices (only one of which is shown in the figure), and an image processing device 454. The overall control device 450 is primarily configured as a computer and is connected to the substrate conveying and holding device 22, component mounting device 24, imaging device 26, imaging device 28, component supply device 30, and bulk component supply device 32. As a result, the overall control device 450 comprehensively controls the substrate conveying and holding device 22, component mounting device 24, imaging device 26, imaging device 28, component supply device 30, and bulk component supply device 32. The multiple individual control devices 452 are primarily configured as computers and are provided corresponding to the substrate conveying and holding device 22, component mounting device 24, imaging device 26, imaging device 28, component supply device 30, and bulk component supply device 32 (only the individual control device 452 corresponding to the bulk component supply device 32 is shown in the figure).

The individual control device 452 of the bulk component supply device 32 is connected to the component scattering device 90, component return device 92, camera moving device 292, component holding head moving device 300, component holding head 302, and shuttle device 304. As a result, the individual control device 452 of the bulk component supply device 32 controls the component scattering device 90, component return device 92, camera moving device 292, component holding head moving device 300, component holding head 302, and shuttle device 304. In addition, the image processing device 454 is connected to the imaging device 84 and processes the image data captured by the imaging device 84. The image processing device 454 is connected to the individual control device 452 of the bulk component supply device 32. As a result, the individual control device 452 of the bulk component supply device 32 acquires the image data captured by the imaging device 84.

The bulk component supply device 32 also has a memory device 458. This memory device 458 is connected to the individual control device 452, and stores various information in accordance with commands from the individual control device 452. The individual control device 452 is also connected to a display panel 460. As shown in FIG. 1, the display panel 460 is disposed on the end face of the bulk component supply device 32, and displays any screen in accordance with commands from the individual control device 452.

The component mounter 10, with the above-described configuration, mounts components on a circuit board 12 held by the substrate transport and holding device 22. Specifically, the circuit board 12 is transported to the work position and fixedly held at that position by the clamp device 52. Next, the imaging device 26 moves above the circuit board 12 and captures an image of the circuit board 12. This provides information regarding any errors in the holding position of the circuit board 12. The component supply device 30 or bulk component supply device 32 supplies components at a predetermined supply position. The supply of components by the bulk component supply device 32 will be described in detail later. Next, one of the work heads 60, 62 moves above the component supply position and holds the component with the suction nozzle 66. Next, the work head 60, 62 holding the component moves above the imaging device 28, and the imaging device 28 captures an image of the component held by the suction nozzle 66. This provides information regarding any errors in the holding position of the component. Then, the work heads 60, 62 holding the components move above the circuit board 12, correcting for errors in the circuit board 12 holding position and errors in the component holding position, and then mount the components on the circuit board 12.

In the bulk component supply device 32, the lead component 410 is inserted by the operator through the inlet 97 of the component supply device 88, and the inserted lead component 410 is then supplied by the component supply unit 82 and the component delivery device 86 while placed on the component receiving member 392 of the component carrier 388.

Specifically, the worker inserts lead components 410 through the insertion port 97 on the top surface of the component supply device 88. At this time, the component support member 150 has been moved below the component supply device 88 by the operation of the component support member moving device 152, and is in a stored state (see Figure 6). Note that when the component support member 150 is in the stored state, the component storage container 180 disposed at the front end of the component support member 150 is positioned in front of the component supply device 88, with the opening of the component storage container 180 facing upward (storage position).

Lead components 410 inserted through the inlet 97 of the component supply device 88 fall onto the inclined plate 104 of the component supply device 88 and roll down to the lower front edge of the inclined plate 104. At this time, the lead components 410 that have rolled down to the lower front edge of the inclined plate 104 are piled up between the lower front edge of the inclined plate 104 and the lower rear edge of the conveyor device 106. Then, when the conveyor device 106 is operated, the conveyor belt 112 of the conveyor device 106 rotates counterclockwise in Figure 6. As a result, the lead components 410 piled up between the inclined plate 104 and the conveyor belt 112 are transported diagonally upward by the conveyor belt 112.

The lead components 410 transported by the conveyor belt 112 then fall from the upper front end of the conveyor device 106 onto the inclined plate 126. The lead components 410 that have fallen onto the inclined plate 126 roll backward along the inclined plate 126 and fall onto the inclined plate 128. The lead components 410 that have fallen onto the inclined plate 128 roll forward and are discharged from the discharge port 98 on the front side of the component supply device 88.

As a result, the lead components 410 discharged from the discharge port 98 of the component supply device 88 are stored inside the component storage container 180. Then, when a predetermined amount of lead components 410 has been discharged from the component supply device 88, that is, when the conveyor device 106 has operated a certain amount, the conveyor device 106 stops. Next, the component support member 150 moves forward from its stored state due to operation of the component support member moving device 152.

Then, when the component support member 150 has moved a predetermined distance forward from the stored state, the container shaking device 181 of the component returning device 92 is activated, shaking the component storage container 180. This causes the orientation of the component storage container 180 to change vigorously from an orientation in which the opening faces upward (storage orientation) to an orientation in which the opening faces the stage 156 (return orientation). At this time, the lead components 410 stored in the component storage container 180 are forcefully released toward the stage 156. As a result, the lead components 410 are scattered from the component storage container 180 onto the stage 156.

When the lead components 410 are scattered on the stage 156 of the component support member 150, as shown in FIG. 12, the lead components 410 are scattered on the stage 156 in roughly three positions. Specifically, in the first position, the lead components 410 are scattered in a position where the extending surfaces of the leads 414 face sideways and the two leads 414 are aligned generally horizontally. In the second position, the lead components 410 are scattered in a position where the extending surfaces of the leads 414 face sideways and the two leads 414 are aligned generally vertically. In the third position, the lead components 410 are scattered in a position where two or more lead components 410 overlap. When distinguishing the lead components 410 based on their scattered positions, they are referred to as lead components 410a in the first position, lead components 410b in the second position, and lead components 410c in the third position.

When the lead components 410 are scattered on the stage 156 as described above, the camera 290 of the imaging device 84 is moved above the component support member 150 by the operation of the camera moving device 292. The lead components 410 scattered on the stage 156 are then imaged by the camera 290. Note that because the viewing angle of the camera 290, i.e., the imaging range, is wider than that of the stage 156, the entire stage 156, i.e., all of the lead components 410 scattered on the stage 156, are imaged in a single image. Then, based on the imaging data captured by the camera 290, the lead components to be picked up (hereinafter sometimes abbreviated as "components to be picked up") are identified by pattern matching.

Specifically, the individual control device 452 identifies the outline of each of the lead components 410 based on the image data of the lead components 410 captured by the camera 290. The individual control device 452 identifies the outline of each of the lead components 410 based on the brightness of the pixels (picture elements) that make up the image data. Specifically, a brightness threshold value is set between the brightness of the lead component 410 and the brightness of the stage 156. The individual control device 452 then determines whether the brightness of each of the pixels that make up the image data exceeds the threshold value, and identifies the boundary between pixels whose brightness exceeds the threshold and pixels whose brightness does not exceed the threshold value as the outline of the lead component 410. In this way, by identifying the outline of the lead component 410, the individual control device 452 calculates the shape of the top surface of the lead component 410, i.e., the shape of the lead component 410 as viewed from above. Note that brightness is a numerical value that indicates the brightness of a color; the higher the brightness value, the brighter the color, approaching white. On the other hand, the smaller the brightness value, the darker the color, closer to black. Also, for example, the greater the difference in brightness between adjacent pixels, the higher the contrast, and the clearer the boundaries between adjacent pixels. On the other hand, the smaller the difference in brightness between adjacent pixels, the lower the contrast, and the less clear the boundaries between adjacent pixels.

Furthermore, as shown in FIG. 13, the individual control device 452 stores image data of the shape corresponding to the outline of the lead component 410a in the first orientation (hereinafter referred to as "first orientation component image data"). The individual control device 452 then determines whether the shape of the top surface of the multiple lead components 410 calculated based on the image data (hereinafter referred to as "imaged component shape") matches the shape of the lead component 410 based on the first orientation component image data (hereinafter referred to as "first stored component shape"). If the individual control device 452 determines that the imaged component shape matches the first stored component shape among the multiple imaged lead components, it recognizes the lead component 410 corresponding to the imaged component shape as the component to be picked up.

In other words, the individual control device 452 recognizes the lead component 410a in the first position as the component to be picked up, but does not recognize the lead component 410b in the second position or the lead component 410c in the third position as the component to be picked up. This is because the area of the surface facing upward in the second position of the lead component 410b is small, and therefore the lead component 410b cannot be properly held by the suction nozzle 332. Furthermore, the lead component 410c in the third position cannot be properly held by the suction nozzle 332 because the top surface of the lead component 410c is not horizontal, for example.

Then, the individual control device 452 calculates the position information of the lead component 410 that has been identified as the component to be picked up based on the image data. Next, based on the calculated position information of the multiple components to be picked up, the component holding head 302 is moved above the component to be picked up selected by the individual control device 452 by operation of the component holding head moving device 300, and the component to be picked up is sucked and held by the suction nozzle 332. Note that when the component to be picked up is sucked and held by the suction nozzle 332, the suction nozzle 332 is positioned in a non-rotation position.

Next, after the lead component 410 is held by the suction nozzle 332, the component holding head 302 moves above the component carrier 388. At this time, the component carrier 388 has been moved to the component receiving position by the operation of the component carrier moving device 390. Also, when the component holding head 302 moves above the component carrier 388, the suction nozzle 332 is rotated to a pivot position. Note that the suction nozzle 332 is rotated by the operation of the nozzle rotation device 335 so that the leads 414 of the lead component 410 held by the suction nozzle 332 in the pivot position face vertically downward.

When the component holding head 302 moves above the component carrier 388, the lead component 410, with its leads 414 facing vertically downward, is inserted into the component receiving recess 416 of the component receiving member 392. As a result, the lead component 410 is placed on the component receiving member 392 with its leads 414 facing vertically downward, as shown in Figure 10.

Once the lead component 410 is placed on the component receiving member 392, the component carrier 388 is moved to the component supply position by the operation of the component carrier moving device 390. Since the component carrier 388 has moved to the component supply position, it is located within the movement range of the work heads 60, 62, and the bulk component supply device 32 supplies the lead component 410 to the component mounter 10 at this position. In this way, the bulk component supply device 32 supplies the lead component 410 with its leads 414 facing downward and its top surface, opposite the bottom surface to which the leads 414 are connected, facing upward. This allows the suction nozzles 66 of the work heads 60, 62 to properly hold the lead component 410.

In this way, the bulk component supply device 32 identifies the outline of the lead components 410 based on the image data of the lead components 410 scattered on the stage 156, and calculates the shape of the top surface of the lead components 410, i.e., the imaged component shape. At this time, it is determined whether the imaged component shape matches the first stored component shape stored in the individual control device 452, and lead components 410 whose imaged component shape matches the first stored component shape are identified as the components to be picked up. The identified lead components 410 are then held by the component holding head 302 and supplied to the work heads 60, 62 of the component mounter 10 via the component carrier 388.

However, if the color of the stage 156 and the color of the lead component 410 are similar, it may not be possible to properly identify the component to be picked up. Specifically, as shown in FIG. 12, if the stage 156 is generally black and the lead component 410 is generally white, the outline of the lead component 410 is clear, and it is possible to properly identify the component to be picked up. On the other hand, as shown in FIG. 14, if the stage 156 is generally black and the lead component 410 is also generally black, the outline of the lead component 410 is unclear, and it is not possible to properly identify the component to be picked up.

For this reason, the bulk component supply device 32 is provided with multiple stages of different colors, and any color stage can be attached to the component support member 150. Specifically, as described above, the stage 156 is detachable from the component support member 150. The bulk component supply device 32 also has two types of stages: a stage 156a with a black component support surface and a stage 156b with a white component support surface. Therefore, if the lead components 410 to be supplied by the bulk component supply device 32 are white, the black stage 156a is attached to the component support member 150 as shown in FIG. 12. On the other hand, if the lead components 410 to be supplied by the bulk component supply device 32 are black, the white stage 156b is attached to the component support member 150 as shown in FIG. 15. This increases the difference between the background color (the color of the stage 156) and the object color (the color of the lead components 410), making the outline of the lead components 410 clearer and enabling the components to be picked up to be properly identified.

However, if the lead component 410 is black or white, it is clear whether the worker will select the black stage 156a or the white stage 156b. However, if the lead component 410 is an intermediate color between black and white, such as gray, the color of the stage selected by each worker may differ. In such cases, variations in the image data may occur, and the accuracy of identifying the component to be picked up may vary from worker to worker. In addition, the exposure time needs to be adjusted depending on the color of the stage 156, but the exposure time adjustment may also differ from worker to worker. In such cases, variations in the image data may occur, and the accuracy of identifying the component to be picked up may vary from worker to worker.

Furthermore, even without changing the stage color, it is possible to clarify the outline of the lead component 410 by processing the image data of the lead component 410. Therefore, in addition to replacing the stage 156, image processing of the image data should also be considered. In light of this, program 500 (see Figure 11) is stored in the individual control device 452, and program 500 automatically sets the stage color, exposure time during imaging, whether or not to perform image processing, and so on. The processing by program 500 is explained below using the flowcharts shown in Figures 16 to 18.

First, before component mounting is performed in the mounter 10, the operator attaches either the black stage 156a or the white stage 156b to the component support member 150 as preparation for processing by the program 500. The operator does not place anything on the stage 156 attached to the component support member 150. Then, as the program 500 is executed, an image capture process of the stage 156 is performed in the main routine shown in FIG. 16 (S100). In this image capture process, the camera 290 moves above the stage 156 by operating the camera movement device 292, and an image of the stage without any components placed on it is captured by the camera 290. An image of the stage based on the image capture data, i.e., an image of the stage without any components placed on it, is then displayed on the display panel 460, as shown in FIG. 19.

The image displays a roughly square first frame 510 near the center and a second frame 512 above the first frame 510. The first frame 510 indicates the imaging location of the target component, i.e., the lead component 410, and the second frame 512 indicates the imaging location of the stage 156. Therefore, the worker places only one lead component 410 on the stage 156 so that the component body 412 of the lead component 410 is displayed within the first frame 510. The worker does not place anything above the portion of the stage 156 corresponding to the second frame 512. After the worker places only one lead component 410 on the stage 156, the camera 290 captures an image of the stage 156, and an image of the stage based on the captured image data is displayed on the display panel 460, as shown in FIG. 20. In this image, the component body 412 of the lead component 410 is displayed within the first frame 510, and the stage 156 is displayed within the second frame 512. The imaging data of the stage 156 on which that one lead component 410 is placed is then set as the imaging data to be analyzed. This completes the processing of S100, i.e., the imaging processing of the stage 156. Note that in the processing of S100, the exposure time during imaging is set to 40,000 μmsec.

Next, the individual control device 452 determines the color of the stage based on the imaging data of the image shown in Figure 20 (S102). More specifically, the individual control device 452 extracts pixels that correspond to the inside of the second frame 512 from all pixels included in the imaging data to be analyzed. The individual control device 452 then determines the color of the stage by identifying the hue of the extracted pixels. At this time, if the stage color is black (S104: black), the black stage determination process execution subroutine is executed (S106).

In the black stage discrimination process execution subroutine, as shown in FIG. 17, the individual control device 452 calculates the difference between the brightness of the component body 412 of the lead component 410 and the brightness of the stage 156 (hereinafter referred to as the "brightness difference") (S200). Specifically, the individual control device 452 extracts pixels corresponding to the inside of the first frame 510 from all pixels included in the imaging data to be analyzed and determines the brightness of the extracted pixels. This determines the brightness of the component body 412 of the lead component 410. The individual control device 452 also extracts pixels corresponding to the inside of the second frame 512 from all pixels included in the imaging data and determines the brightness of the extracted pixels. This determines the brightness of the stage 156. The individual control device 452 then calculates the difference between the brightness of the component body 412 of the identified lead component 410 and the brightness of the identified stage 156, thereby calculating the brightness difference.

Next, the individual control device 452 determines whether the calculated brightness difference is 10 or greater (S202). If the brightness difference is 10 or greater (S202: YES), the individual control device 452 determines whether the calculated brightness difference is 31 or greater and less than 110 (S204). If the calculated brightness difference is 31 or greater and less than 110 (S204: YES), the black stage discrimination process execution subroutine ends and the process returns to the main routine shown in FIG. 16. Next, in the main routine, the individual control device 452 calculates a brightness threshold value (hereinafter referred to as the "brightness threshold value") used to identify the outline of the lead component 410 (S108). Specifically, the brightness threshold value is calculated as the median value between the brightness of the component body 412 of the lead component 410 identified during the process of S200 and the brightness of the stage 156. That is, for example, if the brightness of the component body 412 of the lead component 410 is 100 and the brightness of the stage 156 is 70, the brightness threshold value (85 = (100 + 70)/2) is calculated.

Next, the individual control device 452 analyzes the imaging data to be analyzed using the brightness threshold calculated in S108 (S110). Specifically, the individual control device 452 determines whether the brightness of each of the multiple pixels constituting the imaging data to be analyzed exceeds the brightness threshold, and identifies the boundary between pixels whose brightness exceeds the brightness threshold and pixels whose brightness does not exceed the threshold as the outline of the lead component 410. If the outline of the lead component 410 can be properly identified (S112: YES), the individual control device 452 stores the stage color, exposure time, brightness threshold, etc. identified by the above process as imaging information (hereinafter referred to as "imaging information") in the storage device 458 in association with information indicating the type of the target component, i.e., the lead component 410 (S114). In other words, in the above processing, the stage color is black, the exposure time is 40,000 μmsec, and the brightness threshold is the value calculated in the processing of S108, so the individual control device 452 stores information indicating these as imaging information in the storage device 458 in association with information indicating the type of lead component 410. Processing by the program 500 then ends. Note that if the outline of the lead component 410 cannot be properly identified (S112: NO), an error screen is displayed on the display panel 460 (S116).

Furthermore, in S204 of the black stage discrimination process execution subroutine shown in FIG. 17, if the calculated brightness difference is greater than or equal to 31 and not less than 110 (S204: NO), the individual control device 452 determines whether the calculated brightness difference is greater than or equal to 110 (S206). If the calculated brightness difference is greater than or equal to 110 (S206: YES), there is a risk of halation occurring in the image of the imaging data set as the analysis target. Therefore, if the calculated brightness difference is greater than or equal to 110 (S206: YES), the individual control device 452 changes the exposure time to 25,000 μmsec (S208) and executes the imaging process again (S210). That is, as shown in FIG. 20, the stage 156 on which one lead component 410 is placed is re-imaged by the camera 290 with an exposure time of 25,000 μmsec. The image data captured with an exposure time of 25,000 μmsec is then reset as the image data to be analyzed. This ends the black stage discrimination process execution subroutine, and the program returns to the main routine shown in FIG. 16.

Next, in the main routine, the individual control device 452 calculates the brightness threshold value used when identifying the outline of the lead component 410 (S108). That is, the individual control device 452 identifies the brightness of the component body 412 of the lead component 410 and the brightness of the stage 156 based on the image data re-imaged in the processing of S210, and calculates the median value of the identified brightness of the component body 412 of the lead component 410 and the brightness of the stage 156 as the brightness threshold value.

Next, the individual control device 452 analyzes the image data re-imaged in the process of S210 using the brightness threshold calculated in S108 (S110). That is, the individual control device 452 determines whether the brightness of each of the multiple pixels constituting the re-imaged image data exceeds the brightness threshold, and identifies the boundary line between pixels whose brightness exceeds the brightness threshold and pixels whose brightness does not exceed the threshold as the outline of the lead component 410. At this time, if the outline of the lead component 410 can be properly identified (S112: YES), the individual control device 452 stores the stage color, exposure time, brightness threshold, etc. identified by the above process as imaging information in the storage device 458 in association with information indicating the type of lead component 410 (S114). In other words, in the above processing, the stage color is black, the exposure time is 25,000 μmsec, and the brightness threshold is the value calculated in the processing of S108, so the individual control device 452 stores information indicating these as imaging information in the storage device 458 in association with information indicating the type of lead component 410. Processing by the program 500 then ends. Note that if the outline of the lead component 410 cannot be properly identified (S112: NO), an error screen is displayed on the display panel 460 (S116).

Furthermore, in S206 of the black stage discrimination process execution subroutine shown in FIG. 17, if the calculated brightness difference is not 110 or greater (S206: NO), the individual control device 452 executes background cut processing (S212). That is, if the brightness difference is 10 or greater (S202: YES), if the brightness difference is 31 or greater and not less than 110 (S204: NO), or if the brightness difference is not 110 or greater (S206: NO), the individual control device 452 executes background cut processing (S212). Therefore, if the brightness difference is greater than 10 and less than 31, background cut processing is executed.

Background removal processing is image processing to clarify the target component in the image data, i.e., the lead component 410, and is processing that increases the difference in brightness between multiple pixels that make up the image data to be analyzed, as set in the processing of S100. Specifically, for example, if the processing of S200 identifies that the brightness of the component body 412 of the lead component 410 is 100 and the brightness of the stage 156 is 80, the brightness difference is calculated to be 20. In this way, when the difference in brightness between the component body 412 of the lead component 410 and the brightness of the stage 156 is 20, the brightness difference is not large, and it may be difficult to identify the outline of the lead component 410. Therefore, the difference in brightness between the multiple pixels that make up the image data is increased.

One method for increasing the difference in brightness between multiple pixels that make up the imaging data is, for example, to multiply the brightness of each of the multiple pixels that make up the imaging data by a predetermined factor, such as 5 times. In this case, if the brightness of one pixel that makes up the imaging data is 80 and the brightness of the pixel adjacent to that pixel is 81, the brightness difference between the two adjacent pixels in the imaging data is 1. Then, if the brightness of each of the multiple pixels that make up the imaging data is multiplied by 5 as background removal processing, the brightness of the one pixel becomes 400 (= 80 x 5), and the brightness of the pixel adjacent to that pixel becomes 405 (= 81 x 5). In this way, when background removal processing is performed, the brightness difference between two adjacent pixels in the imaging data that has undergone background removal processing is 5. Increasing the brightness difference between two adjacent pixels in this way allows the individual control device 452 to more easily identify the boundary between the stage 156 and the lead component 410 in the imaging data, i.e., the outline of the lead component 410.

In addition, a different method can be used than the method of multiplying the brightness of each of the multiple pixels that make up the image data by a predetermined multiple. Specifically, the brightness scale (gradation) of the multiple pixels that make up the image data is multiplied by a predetermined multiple, for example, 5. In other words, brightness can be expressed as 266 values ranging from 0 to 255 in the RGB color model, with the brightness scale being 1. Therefore, as a background removal process, the brightness of the image data is changed so that the brightness scale is 5. If the brightness scale is set to 5 in this background removal process, even if the brightness difference between two adjacent pixels in image data that has not undergone background removal processing is 1, the brightness difference between the two adjacent pixels in the image data that has undergone background removal processing will be 5. In this way, by multiplying the brightness scale of the multiple pixels that make up the image data by a predetermined multiple as a background removal process, it is possible to increase the brightness difference between two adjacent pixels, thereby clarifying the outline of the lead component 410 in the image data.

When background removal processing is performed using the above-described method (S212), the imaging data that has undergone background removal processing is reset as the imaging data to be analyzed. This ends the black stage discrimination processing execution subroutine, and processing returns to the main routine shown in FIG. 16. Next, in the main routine, the individual control device 452 calculates a brightness threshold value to be used when identifying the outline of the lead component 410 (S108). That is, the individual control device 452 identifies the brightness of the component body 412 of the lead component 410 and the brightness of the stage 156 based on the imaging data that has undergone background removal processing in S212, and calculates the median value of the brightness of the component body 412 of the lead component 410 and the brightness of the stage 156 as the brightness threshold value.

Next, the individual control device 452 analyzes the image data that underwent background removal processing in S212 using the brightness threshold calculated in S108 (S110). That is, the individual control device 452 determines whether the brightness of each of the multiple pixels that make up the image data that underwent background removal processing exceeds the brightness threshold, and identifies the boundary line between pixels whose brightness exceeds the brightness threshold and pixels whose brightness does not exceed the threshold as the outline of the lead component 410. At this time, if the outline of the lead component 410 can be properly identified (S112: YES), the individual control device 452 stores the stage color, exposure time, brightness threshold, execution of background removal processing, etc. identified by the above processing as image information in the storage device 458 in association with information indicating the type of lead component 410 (S114). In other words, in the above processing, the stage color is black, the exposure time is 40,000 μmsec, the brightness threshold is the value calculated in the processing of S108, and background cut processing has been performed, so the individual control device 452 stores information indicating these as imaging information in the storage device 458 in association with information indicating the type of lead component 410. Processing by the program 500 then ends. Note that if the outline of the lead component 410 cannot be properly identified (S112: NO), an error screen is displayed on the display panel 460 (S116).

Furthermore, in S202 of the black stage discrimination process execution subroutine shown in FIG. 17, if the calculated brightness difference is not 10 or more (S202: NO), that is, if the brightness difference is less than 10, the individual control device 452 outputs a display instruction for a stage replacement screen (not shown) to the display panel 460. This causes the stage replacement screen to be displayed on the display panel 460 (S214). This stage replacement screen displays a comment indicating that a white stage will be attached to the component support member 150 instead of the black stage. This is because the difference in brightness between the black stage and the component body of the lead component placed on that stage is very small, and therefore the individual control device 452 assumes that it will not be able to identify the component. Then, when the operator views the stage replacement screen and completes the stage replacement (S216: YES), processing is executed again from S100.

Furthermore, in S104 of the main routine shown in FIG. 16, if the stage color is white (S104: White), the white stage determination process execution subroutine is executed (S118).

In the white stage discrimination process execution subroutine, as shown in FIG. 18, the individual control device 452 changes the exposure time to 25,000 μmsec (S300) and executes the image capture process again (S302). This is because when a white stage 156b is attached to the component support member 150, the background color of the lead component 410 becomes white, which may cause halation in the image of the image data set as the analysis target in S100. For this reason, as shown in FIG. 20, the stage 156 with one lead component 410 placed on it is re-imaged by the camera 290 with an exposure time of 25,000 μmsec. The image data captured with an exposure time of 25,000 μmsec is then reset as the image data to be analyzed.

Next, the individual control device 452 calculates the brightness difference between the brightness of the component body 412 of the lead component 410 and the brightness of the stage 156 based on the imaging data re-imaged in the processing of S302 (S304). That is, the individual control device 452 extracts pixels corresponding to the inside of the first frame 510 from all pixels included in the reset imaging data, and identifies the brightness of the extracted pixels as the brightness of the component body 412 of the lead component 410. The individual control device 452 also extracts pixels corresponding to the inside of the second frame 512 from all pixels included in the imaging data, and identifies the brightness of the extracted pixels as the brightness of the stage 156. The individual control device 452 then calculates the brightness difference by calculating the difference between the brightness of the component body 412 of the identified lead component 410 and the brightness of the identified stage 156.

The individual control device 452 then determines whether the calculated brightness difference is 50 or greater (S306). If the calculated brightness difference is 50 or greater (S306: YES), the white stage determination process execution subroutine ends and processing returns to the main routine shown in FIG. 16. Next, in the main routine, the individual control device 452 calculates a brightness threshold value to be used when identifying the outline of the lead component 410 (S108). That is, the individual control device 452 identifies the brightness of the component body 412 of the lead component 410 and the brightness of the stage 156 based on the image data re-imaged in the processing of S302, and calculates the median value of the brightness of the component body 412 of the lead component 410 and the brightness of the stage 156 as the brightness threshold value.

Next, the individual control device 452 analyzes the image data re-imaged in the process of S302 using the brightness threshold calculated in the process of S108 (S110). That is, the individual control device 452 determines whether the brightness of each of the multiple pixels constituting the re-imaged image data exceeds the brightness threshold, and identifies the boundary line between pixels whose brightness exceeds the brightness threshold and pixels whose brightness does not exceed the threshold as the outline of the lead component 410. At this time, if the outline of the lead component 410 can be properly identified (S112: YES), the individual control device 452 stores the stage color, exposure time, brightness threshold, etc. identified by the above process as imaging information in the storage device 458 in association with information indicating the type of lead component 410 (S114). In other words, in the above processing, the stage color is white, the exposure time is 25,000 μmsec, and the brightness threshold is the value calculated in the processing of S108, so the individual control device 452 stores information indicating these as imaging information in the storage device 458 in association with information indicating the type of lead component 410. Processing by the program 500 then ends. Note that if the outline of the lead component 410 cannot be properly identified (S112: NO), an error screen is displayed on the display panel 460 (S116).

Furthermore, in S306 of the white stage discrimination process execution subroutine shown in FIG. 18, if the calculated brightness difference is not 50 or more (S306: NO), that is, if the brightness difference is less than 50, the individual control device 452 outputs a display instruction for a stage replacement screen (not shown) to the display panel 460. This causes the stage replacement screen to be displayed on the display panel 460 (S308). This stage replacement screen displays a comment indicating that a black stage will be attached to the component support member 150 instead of the white stage. This is because the difference in brightness between the white stage and the component body of the lead component placed on that stage is very small. Then, when the operator views the stage replacement screen and completes the stage replacement (S310: YES), processing is executed again from S100.

In this way, by executing the processing of program 500, the stage color, exposure time, and brightness threshold value used to identify the outline of the target part are stored as imaging information in storage device 458 for each type of part placed on the stage. Then, before and during the component supply operation by bulk component supply device 32, imaging information corresponding to the type of part to be supplied is read, and the supply operation is performed under conditions corresponding to the read imaging information. In other words, before the bulk component supply device 32 performs the component supply operation, the operator attaches a stage corresponding to the stage color included in the imaging information to the component support member 150. Furthermore, during the component supply operation by bulk component supply device 32, the camera 290 captures images of the parts scattered on stage 156 using the exposure time included in the imaging information. The brightness threshold value included in the imaging information is then used to identify the outline of the part based on the imaging data. This makes it possible to prevent variations in the exposure time set by the operator and variations in the color of the stage attached by the operator to the component support member 150, thereby reducing variations in the accuracy of identifying the part to be picked up. In addition, the brightness threshold used to identify the outline of the target part is set according to the part type and stage color, allowing the outline of the target part to be identified appropriately.

The imaging information also includes whether or not background removal processing has been performed. As mentioned above, background removal processing is image processing performed based on the brightness of the imaging data being analyzed, and does not involve changing the imaging conditions for imaging a part placed on a stage, such as changing the background color (changing the stage) or exposure time. Therefore, by performing background removal processing, it is possible to properly identify the outline of the part being imaged without having to change the stage, exposure time, etc.

Furthermore, stage 156 is an example of a stage. Lead component 410 is an example of a component. Individual control device 452 is an example of an image processing device. Display panel 460 is an example of an alarm device. Furthermore, the process of executing the process of S100 is an example of an imaging data acquisition process. The process of executing the process of S100 is an example of an imaging data acquisition process. The process of executing the process of S110 is an example of an identification process. The process of executing the process of S212 is an example of an image processing process.

The present invention is not limited to the above-described embodiment, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, background removal processing is performed based on the brightness of the image data of the component placed on the stage. In other words, background removal processing is performed based on the brightness of the component in the image data of the component placed on the stage and the brightness of the stage. Alternatively, background removal processing may be performed based only on the brightness of the component in the image data of the component placed on the stage. In other words, for example, only the brightness of the component in the image data may be multiplied by a predetermined factor, for example, five times. In this way, by multiplying only the brightness of the component, for example, by five times, the background, i.e., the boundary between the stage and the component, becomes clear, and the outline of the component can be properly identified.

In addition, in the above embodiment, the background removal process increases the brightness difference between adjacent pixels in the image data, thereby making the components clearer in the image data. However, components can also be made clearer in the image data by blurring the background, i.e., the stage, making it transparent, or changing it to a color different from the components. In other words, the brightness of the components in the image data can be used as a reference, and the brightness of pixels that differ from that reference brightness can be changed to a brightness that is extremely different from the brightness of the components. In this way, components can be made clearer in the image data by using the brightness of the components as a reference, i.e., by performing image processing based on the brightness of the components.

In addition, in the above embodiment, the stage change screen is displayed on the display panel 460 when the difference between the brightness of the component and the brightness of the stage is small in the image data of the component placed on the stage. However, the stage change screen may also be displayed on the display panel 460 when the outline of the component cannot be properly identified in the processing of S110. In other words, for example, the stage change screen may be displayed on the display panel 460 when the outline of the component cannot be properly identified based on image data that has undergone background cutting processing. This makes it possible to clearly identify the component in the image data by changing the stage when the component cannot be clearly identified even in image data that has undergone background cutting processing.

In addition, in the above embodiment, the individual control device 452 and the display panel 460 are independent devices, and the individual control device 452 outputs a display instruction to the display panel 460, causing the display panel 460 to display the stage change screen. On the other hand, if the individual control device 452 is equipped with a display panel, the individual control device 452 may output a display instruction to the display panel, causing the display panel to display the stage change screen.

In addition, in the above embodiment, the stage replacement screen is displayed on the display panel 460 to notify the operator of the stage replacement, but the operator may also be notified of the stage replacement by other methods, such as by audio notification or by turning on a warning lamp.

In addition, in the above embodiment, the outline of the part, i.e., the part's orientation and position, are calculated based on image data of the part placed on the stage, but the part's type, color, etc. may also be calculated.

In addition, in the above embodiment, background cutting processing is performed when the difference between the brightness of the part and the brightness of the stage is within a predetermined range, but background cutting processing may also be performed when other conditions are met. For example, background cutting processing may be performed when the outline of the part cannot be properly identified based on the image data. Furthermore, background cutting processing may be performed each time a part placed on the stage is imaged by the camera 290, regardless of whether the conditions are met.

In addition, while in the above embodiment the present invention is applied to a method for identifying lead components 410 on a stage, the present invention may also be applied to a method for identifying various types of components on a stage. Specifically, for example, the present invention may be applied to a method for identifying components of solar cells, components of power modules, electronic circuit components without leads, etc. on a stage.

In addition, in the above embodiment, the image processing device 454 is connected to the individual control device 452 of the bulk component supply device 32, but it may be connected to any control device, including the overall control device 450. Alternatively, it may be connected via wireless communication to a control device other than the overall control device. Alternatively, the image processing device 454 may be part of any of these control devices.

156: Stage 410: Lead component (component) 452: Individual control device (image processing device) 460: Display panel (alarm device)

Claims (1)

A control device including an image processing device,
calculating a brightness difference between the brightness of the component identified based on image data obtained by capturing an image of a component placed at a predetermined first position on a stage and the stage at a predetermined second position different from the first position, and the brightness of the stage;
If the value of the brightness difference is less than a first threshold, a message is displayed indicating that the stage will be replaced with a stage having a different color from the stage color;
when the value of the brightness difference is equal to or greater than a first threshold and less than a second threshold, the second threshold being a value greater than the first threshold, cause the image processing device to perform image processing to increase the difference between the brightness of the components and the brightness of the stage in image data acquired by imaging the components scattered on the stage;
The control device changes the exposure time when the value of the brightness difference is equal to or greater than a third threshold value that is greater than the second threshold value .