JP7743546B2 - MEASUREMENT METHOD, LITHOGRAPHY METHOD, ARTICLE MANUFACTURING METHOD, AND LITHOGRAPHY APPARATUS - Google Patents

Description

The present invention relates to a metrology method, a lithography method, an article manufacturing method, and a lithography apparatus.

One type of lithography apparatus used in the manufacturing process of semiconductor devices, flat panel displays (FPDs), and other devices is an exposure apparatus that transfers the pattern of a master mounted on a stage onto a substrate. To accurately transfer the pattern of the master onto the substrate, the exposure apparatus can measure the positional deviation of the master relative to the stage by using a scope to detect a reference mark on the stage and a master mark on the master.

Japanese Patent Application Laid-Open No. 2003-007609

Exposure apparatuses are required to mount various types of originals on the stage. In this case, the relative position between the reference mark and the original mark when the original is mounted on the stage can vary depending on the type of original. Therefore, it is necessary to accurately measure the positional deviation of the original relative to the stage depending on the type of original mounted on the stage.

Patent Document 1 describes using a holder that holds the peripheral portion of the original to mount an original smaller than the specified size that can be mounted on the stage. In Patent Document 1, the positional deviation of the holder relative to the stage is measured by detecting a mark on the holder and a reference mark on the stage, and the positional deviation of the original relative to the stage is determined based on the measurement results. However, because the relative positions of the holder and the original may shift when the original is mounted on the stage using the holder, the method described in Patent Document 1 may not be able to accurately measure the positional deviation of the original relative to the stage.

The present invention therefore aims to provide an advantageous technology for accurately measuring the positional deviation of an original relative to a stage depending on the type of original.

To achieve the above-mentioned object, one aspect of the present invention provides a measurement method for measuring the positional deviation of an original relative to a stage in a lithography apparatus that transfers a pattern from an original mounted on the stage onto a substrate, the measurement method including: an acquisition step for acquiring information indicating the design relative positions of a fiducial mark of the stage and an original mark of the original when the original is mounted on the stage; a selection step for selecting one mode from multiple modes for detecting the fiducial mark and the original mark with a scope based on the information acquired in the acquisition step; and a determination step for detecting the fiducial mark and the original mark with the scope using the one mode selected in the selection step and determining the positional deviation based on the detection results, wherein the multiple modes include a first mode in which the fiducial mark and the original mark are simultaneously positioned within the field of view of the scope for detection, and a second mode in which the fiducial mark and the original mark are individually positioned within the field of view for detection via relative movement between the stage and the scope.

Further objects and other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings.

The present invention can provide, for example, an advantageous technology for accurately measuring the positional deviation of an original relative to a stage depending on the type of original.

FIG. 1 is a schematic diagram showing an example of the configuration of an exposure apparatus according to a first embodiment; A diagram showing an example of a standard-sized master mounted on the master stage. FIG. 1A is a diagram showing the layout of first reference marks on an original stage; FIG. 1B is a diagram showing the layout of original marks on an original of a specified size; A diagram showing an example of a standard-sized master mounted on the master stage via a holder. FIG. 1A is a diagram showing the layout of first fiducial marks on an original stage; FIG. 1B is a diagram showing the layout of original marks on a small-sized original; 1 is a flowchart showing an example of the operation of the exposure apparatus of the first embodiment; 1 is a flowchart showing a measurement process in a first mode in the first embodiment; 10 is a flowchart showing a measurement process in a second mode in the first embodiment; FIG. 1A shows the layout of first fiducial marks on the original stage; FIG. 1B shows the layout of original marks on a small-sized original; and FIG. 1C shows the layout of second fiducial marks on the substrate stage. 10 is a flowchart showing a measurement process in a second mode in the second embodiment. FIG. 10 is a schematic diagram showing an example of the configuration of an exposure apparatus according to a third embodiment.

The following describes the embodiments in detail with reference to the attached drawings. Note that the following embodiments do not limit the scope of the claimed invention. While the embodiments describe multiple features, not all of these features are necessarily essential to the invention, and multiple features may be combined in any desired manner. Furthermore, in the attached drawings, the same reference numbers are used to designate identical or similar components, and redundant explanations will be omitted.

In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system, with the X and Y directions being mutually orthogonal directions in a plane parallel to the holding surface of the master stage that holds the master. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are the X, Y, and Z directions, respectively, and rotation around the X, Y, and Z axes are referred to as θX, θY, and θZ, respectively. Control and drive (movement) about the X, Y, and Z axes refer to control or drive (movement) in directions parallel to the X, Y, and Z axes, respectively. Furthermore, control or drive about the θX, θY, and θZ axes refer to control or drive in rotation around an axis parallel to the X, Y, and Z axes, respectively.

First Embodiment
A first embodiment of the present invention will be described. An exposure apparatus is known as one type of lithography apparatus used in the manufacturing processes of semiconductor devices, flat panel displays (FPDs), and the like. An exposure apparatus performs an exposure process in which a pattern formed on an original is transferred (formed) onto a substrate by exposing the substrate through an original. Methods for performing exposure processes on multiple shot areas on a substrate include the step-and-repeat method and the step-and-scan method. An exposure apparatus employing the step-and-repeat method is sometimes called a stepper, and performs an exposure process in which the pattern on the original is transferred onto the substrate all at once, sequentially for each shot area on the substrate. On the other hand, an exposure apparatus employing the step-and-scan method is sometimes called a scanner, and performs an exposure process in which the pattern on the original is transferred onto the substrate while scanning the original and the substrate relative to each other, sequentially for each shot area on the substrate. In this embodiment, an exposure apparatus employing the step-and-scan method will be described as an example, and the relative scanning direction between the original and the substrate in this exposure apparatus is defined as the Y direction.

Figure 1 is a schematic diagram showing an example configuration of an exposure apparatus EXP of this embodiment. The exposure apparatus EXP can include, for example, an illumination optical system 1, a detection unit 2, an original stage 4 (stage), a projection optical system 5, a substrate stage 7, and a control unit 11.

The illumination optical system 1 illuminates the original 3 using light emitted from a light source (not shown), such as an ultra-high pressure mercury lamp. For example, the illumination optical system 1 may have a wavelength-selective filter, a lens group, a shutter, etc., and may shape the light from the light source into exposure light with a wavelength and shape suitable for exposing the substrate 6, thereby illuminating the original 3.

The original 3 is mounted on the original stage 4. The original stage 4 is configured to hold the original 3 and be movable in the X and Y directions, and is driven in the X and Y directions by an original drive mechanism 12 under the control of the control unit 11. In this embodiment, the original stage 4 is scanned in the Y direction by the original drive mechanism 12 during the exposure process.

The position of the original stage 4 can be constantly measured (monitored) by the first measurement unit 13. The first measurement unit 13 can include, for example, a laser interferometer. In this case, the first measurement unit 13 irradiates measurement light onto a reflecting mirror 13a provided on the original stage 4 and measures the position of the original stage 4 based on the measurement light reflected by the reflecting mirror 13a. This allows the control unit 11 to control the position of the original 3 mounted on the original stage 4 based on the position measured by the first measurement unit 13. Furthermore, the control unit 11 can control the speed of the original 3 mounted on the original stage 4 based on the change over time in the position of the original stage 4 measured by the first measurement unit 13.

The projection optical system 5 has multiple optical elements, such as mirrors and lenses. The projection optical system 5 reflects and refracts the exposure light that has passed through the original 3 using multiple optical elements, thereby projecting an image of the pattern formed on the original 3 onto the substrate 6 at a predetermined magnification.

The substrate 6 is mounted on a substrate stage 7. The substrate stage 7 is configured to hold the substrate 6 and move in the X, Y, Z, and θZ directions, and is driven in each direction by a substrate driving mechanism 14 under the control of the control unit 11. In this embodiment, the substrate stage 7 is scanned in the Y direction by the substrate driving mechanism 14 during exposure processing.

The position of the substrate stage 7 can be constantly measured (monitored) by the second measurement unit 15. The second measurement unit 15 can include, for example, a laser interferometer. In this case, the second measurement unit 15 irradiates measurement light onto a reflecting mirror 15a provided on the substrate stage 7 and measures the position of the substrate stage 7 based on the measurement light reflected by the reflecting mirror 15a. This allows the control unit 11 to control the position of the substrate 6 mounted on the substrate stage 7 based on the position of the substrate stage 7 measured by the second measurement unit 15. The control unit 11 can also control the speed of the substrate 6 mounted on the substrate stage 7 based on the change over time in the position of the substrate stage 7 measured by the second measurement unit 15.

The detection unit 2 (alignment detection unit) has a scope that detects (images) the reference mark 8 provided on the original stage 4 and the original mark 10 provided on the original 3. The detection unit 2 also detects the reference mark 9 provided on the substrate stage 7 and/or a mark (not shown) provided on the substrate 6 via the original 3 and projection optical system 5. The detection unit 2 has a focus adjustment mechanism and can detect each mark by adjusting the focus according to the position of each mark in the Z direction. Note that below, the reference mark 8 provided on the original stage 4 may be referred to as the "first reference mark 8" and the reference mark 9 provided on the substrate stage 7 may be referred to as the "second reference mark 9."

The detection unit 2 is also configured to be movable in the X and Y directions, and is driven in the X and Y directions by the detection drive mechanism 16 under the control of the control unit 11. For example, when the detection unit 2 is to detect the first reference mark 8 and/or original mark 10, the detection unit 2 is driven (moved) by the detection drive mechanism 16 so that the mark is positioned within the field of view of the detection unit 2 (scope). Here, the driving (movement) to position the mark within the field of view of the detection unit 2 may be performed by driving the original stage 4 (original 3) by the original drive mechanism 12. Alternatively, the driving (movement) may be performed by driving the original stage 4 (original 3) and the detection unit 2 relatively by both the detection drive mechanism 16 and the original drive mechanism 12. In other words, the detection drive mechanism 16 and the original drive mechanism 12 constitute a drive mechanism that drives the original stage 4 (original 3) and the detection unit 2 relatively.

The control unit 11 is composed of a computer (information processing device) including, for example, a processor such as a CPU (Central Processing Unit) and a storage unit such as memory, and controls the exposure process by controlling each unit of the exposure apparatus EXP. For example, the control unit 11 functions as a processing unit that determines the drive amount of each drive mechanism during the exposure process based on the position information of each mark obtained from the detection results of the detection unit 2. In this embodiment, the control unit 11 may include a data memory unit 11a, a drive amount calculation unit 11b, and a drive instruction unit 11c. The data memory unit 11a constitutes at least a part of the storage unit of the control unit 11 and stores position information of each mark, drive offsets of various drive axes, drive parameters such as sensitivity, and various measurement data acquired by the exposure apparatus EXP. The drive amount calculation unit 11b constitutes at least a part of the processor of the control unit 11 and determines the drive instruction amounts for various drive axes such as the original stage 4 and substrate stage 7 during the exposure process based on the various data stored in the data memory unit 11a. The drive instruction unit 11c constitutes at least a part of the processor of the control unit 11, and outputs drive instructions to each drive mechanism based on the drive instruction amount determined by the drive amount calculation unit 11b.

In order to accurately transfer the pattern of the original 3 onto the substrate 6 in the exposure apparatus EXP, it is important to accurately drive the original 3 mounted on the original stage 4. As mentioned above, the original 3 is driven by the original drive mechanism 12 based on the position of the original stage 4 measured by the first measurement unit 13. Therefore, in order to accurately control the position of the original 3 mounted on the original stage 4, it is desirable to have information indicating the positional deviation of the original 3 relative to the original stage 4. Therefore, in the exposure apparatus EXP, a measurement process is performed in which the detection unit 2 detects the first reference mark 8 on the original stage 4 and the original mark 10 on the original 3, thereby measuring the positional deviation of the original 3 relative to the original stage 4.

In addition, the exposure apparatus EXP is required to be able to mount various types of originals 3 on the original stage 4. For example, in the exposure apparatus EXP, there is usually a set standard size for the original 3 that can be mounted on the original stage 4, but by using a holder 20 that holds the peripheral portion of the original 3, originals 3 of sizes smaller than the standard size may also be mounted on the original stage 4. In this case, it is desirable for the exposure apparatus EXP to accurately measure the positional deviation of the original 3 relative to the original stage 4 according to the type (e.g., size) of the original 3. Below, an example configuration of the original stage 4 in this embodiment and the mounting of various types of originals 3 on the original stage 4 are described.

Figure 2 shows an example in which a standard-sized master 3a is mounted on the master stage 4. Also, Figure 3 shows (a) the layout of the first reference marks 8 on the master stage 4, and (b) the layout of the master marks 10 on the standard-sized master 3a.

The original stage 4 may include a main body 4a and a chuck 4b. The main body 4a is driven in the X and Y directions by the original drive mechanism 12, and the first reference mark 8 is provided on the main body 4a. The chuck 4b is a mechanism that attracts and holds the original 3a using vacuum suction force, electrostatic suction force, or the like. The original stage 4 also has an opening 4c that allows light from a pattern provided in the center of the original 3a to pass through.

A master mark 10 (first mark) is provided on a master 3a (first master) of a specified size. The master mark 10 is arranged on the master 3a so that, when the master 3a is mounted on the master stage 4, it fits within the field of view of the detection unit 2 (scope) together with the first reference mark 8 on the master stage 4. In the example of Figure 3, the master mark 10 is arranged on the master 3a so that, when the master 3a is mounted on the master stage 4, it at least partially overlaps the first reference mark 8 on the master stage 4. Therefore, the detection unit 2 can detect the first reference mark 8 and the master mark 10 while simultaneously fitting the first reference mark 8 on the master stage 4 and the master mark 10 on the master 3a within its field of view.

For example, as shown in FIG. 3, a standard-sized original 3a may have multiple (two) original marks 10a-10b spaced apart in the X direction. In this case, the control unit 11 moves the original stage 4 and the detection unit 2 relatively to bring the first reference mark 8a and the original mark 10a into the field of view of the detection unit 2 simultaneously, and then causes the detection unit 2 to detect the first reference mark 8a and the original mark 10a. Similarly, the control unit 11 moves the original stage 4 and the detection unit 2 relatively to bring the first reference mark 8b and the original mark 10b into the field of view of the detection unit 2 simultaneously, and then causes the detection unit 2 to detect the first reference mark 8b and the original mark 10b. This allows the control unit 11 to determine the relative position between the first reference mark 8 detected by the detection unit 2 and the corresponding original mark 10, and to determine the positional deviation of the original 3a with respect to the original stage 4 based on the difference between the determined relative position and the designed relative position.

Figure 4 shows an example in which a master 3b smaller than the standard size (hereinafter sometimes referred to as small size) is mounted on the master stage 4 via a holder 20. Also, Figure 5 shows (a) the layout of the first reference marks 8 on the master stage 4, and (b) the layout of the master marks 18 on the small-sized master 3b held by the holder 20. The configuration of the master stage 4 is as described above using Figure 2, so a description thereof will be omitted here.

The holder 20 may include a first portion 21 held by the original stage 4 (chuck 4b), a second portion 22 connected to the first portion for holding (supporting) the small-sized original 3b, and a fixing member 23 for fixing the original 3b held by the second portion 22. The first portion 21 and the second portion 22 of the holder 20 may be made of an opaque material such as metal, but may also be made of an optically transparent material. When the first portion 21 and the second portion 22 are made of an opaque material, the holder 20 has a light-transmitting portion 24 in a position (first portion 21) that overlaps with the first fiducial mark 8 when mounted on the original stage 4. The light-transmitting portion 24 of the holder 20 may be made of a light-transmitting member of the same material and thickness as the original 3, so that the focus of the detection unit 2 is the same when detecting the first fiducial mark 8 via the original 3 and when detecting the first fiducial mark 8 via the light-transmitting portion 24. The fixing member 23 is a member that fixes the small-sized original 3b to the holder 20 (second portion 22) by pressing the original 3b against the second portion 22, and can be formed, for example, from a leaf spring.

A master mark 18 (second mark) is provided on the small-sized master 3b (second master). When a small-sized master 3b is used, the first reference mark 8 on the master stage 4 and the master mark 18 on the master 3b cannot be simultaneously accommodated within the field of view of the detection unit 2 (scope) when the master 3b is mounted on the master stage 4 via the holder 20. Therefore, the detection unit 2 detects the first reference mark 8 on the master stage 4 and the master mark 18 on the master 3b individually within the field of view of the detection unit 2 by moving the master stage 4 and the detection unit 2 relative to each other.

For example, a small-sized original 3b may be provided with multiple (two) original marks 18a-18b spaced apart in the X direction, as shown in FIG. 5. In this case, the control unit 11 moves the original stage 4 and the detection unit 2 relatively to bring the first reference mark 8a into the field of view of the detection unit 2 via the light-transmitting portion 24 of the holder 20, and in this state causes the detection unit 2 to detect the first reference mark 8a. The control unit 11 then moves the original stage 4 and the detection unit 2 relatively to bring the original mark 18a into the field of view of the detection unit 2, and in this state causes the detection unit 2 to detect the original mark 18a. Similarly, the control unit 11 moves the original stage 4 and the detection unit 2 relatively to bring the first reference mark 8b into the field of view of the detection unit 2 via the light-transmitting portion 24 of the holder 20, and in this state causes the detection unit 2 to detect the first reference mark 8b. The control unit 11 then moves the original stage 4 and the detection unit 2 relatively to bring the original mark 18b into the field of view of the detection unit 2, and in this state causes the detection unit 2 to detect the original mark 18b. This allows the control unit 11 to determine the relative position between the first reference mark 8 detected by the detection unit 2 and the corresponding original mark 18, and to determine the positional deviation of the original 3b with respect to the original stage 4 based on the difference between the determined relative position and the designed relative position.

Next, an example of operation (lithography method, exposure method) of the exposure apparatus EXP in this embodiment will be described. Figure 6 is a flowchart showing an example of operation of the exposure apparatus EXP. The flowchart in Figure 6 can be executed by the control unit 11. Here, steps S12 to S15 in the flowchart in Figure 6 may be understood as a measurement process that measures the positional deviation of the original 3 relative to the original stage 4. The measurement process may include step S11 in addition to steps S12 to S15.

In step S11, the control unit 11 identifies the type of master 3 being transported onto the master stage 4 by a master transport unit (not shown). For example, the control unit 11 can identify the type of master 3 being transported onto the master stage 4 by reading an identifier (e.g., a barcode) provided on the master 3.

In step S12, the control unit 11 acquires information indicating the design relative position between the first reference mark 8 on the original stage 4 and the original mark on the original 3 when the original 3 is held on the original stage 4, based on the type of original 3 identified in step S11 (acquisition process). The design relative position between the first reference mark 8 and the original mark refers to, for example, the design relative position between the first reference mark 8 and the original mark when the original 3 is mounted on the original stage 4 so that the center of gravity (center) of the original stage 4 and the center of gravity (center) of the original 3 coincide. Note that, hereinafter, information indicating the design relative position between the first reference mark 8 and the original mark may be referred to as "design information."

In step S13, the control unit 11 selects one mode from multiple modes for detecting the first reference mark 8 on the original stage 4 and the original mark on the original 3, in accordance with the design information acquired in step S12 (selection process). The multiple modes can include a first mode and a second mode. The first mode is a mode in which the first reference mark 8 and the original mark are detected by simultaneously placing them within the field of view of the detection unit 2. The second mode is a mode in which the first reference mark 8 and the original mark are detected by individually placing them within the field of view of the detection unit 2 through relative movement between the original stage 4 and the detection unit 2.

The control unit 11 selects the first mode when it determines, based on the design information acquired in step S12, that the master mark of the master 3 mounted on the master stage 4 can be accommodated (simultaneously) within the field of view of the detection unit 2 together with the first reference mark 8. That is, the first mode is selected when a master 3a of a specified size is mounted on the master stage 4. In this case, the process proceeds to step S14, where the control unit 11 causes the detection unit 2 to detect the first reference mark 8 and master mark in the first mode, and determines the positional deviation of the master 3 relative to the master stage 4 based on the detection results (determination process). That is, the control unit 11 performs measurement processing in the first mode. Details of the first mode step S14 will be described later.

On the other hand, if the control unit 11 determines, based on the design information acquired in step S12, that the master mark of the master 3 mounted on the master stage 4 cannot be accommodated (simultaneously) within the field of view of the detection unit 2 together with the first reference mark 8, the control unit 11 selects the second mode. That is, the second mode is selected when a small-sized master 3b is mounted on the master stage 4. In this case, the process proceeds to step S15, where the control unit 11 causes the detection unit 2 to detect the first reference mark 8 and master mark in the second mode, and determines the positional deviation of the master 3 relative to the master stage 4 based on the detection results (determination step). That is, the control unit 11 performs measurement processing in the second mode. Details of step S15 will be described later.

In step S16, the control unit 11 performs an exposure process in which the substrate 6 is exposed to light to transfer the pattern of the original 3 onto the substrate 6. In the exposure process, the alignment of the original 3 and the substrate 6 is controlled based on the positional deviation determined in step S14 or S15. For example, the control unit 11 controls the alignment of the original 3 and the substrate 6 by controlling the position of the original 3 mounted on the original stage 4 based on the position of the original stage 4 measured by the first measurement unit 13 and the positional deviation determined in step S14 or S15.

Next, the details of step S14 above will be described. Figure 7 is a flowchart showing the measurement process in the first mode performed in step S14. Here, an example will be described in which a master 3a of a specified size is used as the master 3 mounted on the master stage 4, and multiple (two) master marks 10a-10b are provided on the master 3a.

In step S21, the control unit 11 drives (moves) the original stage 4 and the detection unit 2 relatively so that the first reference mark 8 on the original stage 4 and the original mark 10 on the original 3a are simultaneously within the field of view of the detection unit 2. Next, in step S22, the control unit 11 causes the detection unit 2 to detect (image) the first reference mark 8 and the original mark 10 while they are simultaneously within the field of view of the detection unit 2. At this time, the control unit 11 preferably adjusts the focus of the detection unit 2 using the focus adjustment mechanism so that the focus of the detection unit 2 is aligned with the first reference mark 8.

In step S23, the control unit 11 determines the relative positional deviation between the first fiducial mark 8 and the master mark 10 based on the detection result of step S22 (i.e., the image obtained by capturing the image). The relative positional deviation is the deviation from the designed relative position between the first fiducial mark 8 and the master mark 10. Next, in step S24, the control unit 11 determines whether the relative positional deviation has been determined for all pairs of first fiducial marks 8 and master marks 10. In this embodiment, pairs of first fiducial marks 8 and master marks 10 may include the pair of first fiducial mark 8a and master mark 10a, and the pair of first fiducial mark 8b and master mark 10b. If the relative positional deviation has been determined for all pairs, the process proceeds to step S25. On the other hand, if the relative positional deviation has not been determined for all pairs, the process proceeds to step S21, and steps S21 to S23 are performed for pairs for which the relative positional deviation has not yet been determined.

For example, in the first steps S21 and S22, as shown in FIG. 2, the master stage 4 and the detection unit 2 are driven relatively to each other so that the first reference mark 8a and the master mark 10a simultaneously fall within the field of view of the detection unit 2. The detection unit 2 is then caused to detect the first reference mark 8a and the master mark 10a. As a result, in step S23, the relative positional deviation between the first reference mark 8a and the master mark 10a is obtained. Similarly, in the second steps S21 and S22, the master stage 4 and the detection unit 2 are driven relatively to each other so that the first reference mark 8b and the master mark 10b simultaneously fall within the field of view of the detection unit 2. The detection unit 2 is then caused to detect the first reference mark 8b and the master mark 10b. As a result, in step S23, the relative positional deviation between the first reference mark 8b and the master mark 10b is obtained. Note that, if the exposure apparatus EXP is provided with multiple detection units 2 as shown in FIG. 1, steps S21 to S23 for each set may be performed in parallel by the multiple detection units 2.

In step S25, the control unit 11 determines the positional deviation of the master 3a relative to the master stage 4 based on the relative positional deviation between the first reference mark 8 and the master mark 10 obtained in step S23. If there are multiple pairs of first reference marks 8 and master marks 10, the positional deviation of the master 3a relative to the master stage 4 may be determined based on a representative value (e.g., average value, mode, etc.) of the relative positional deviation obtained for each of the multiple pairs.

Next, the above step S15 will be described in detail. Figure 8 is a flowchart showing the measurement process in the second mode performed in step S15. Here, an example will be described in which a small-sized original 3b is used as the original 3 mounted on the original stage 4, and multiple (two) original marks 18a-18b are provided on the original 3b.

In the following explanation, the design positions of the first reference marks 8a-8b on the original stage 4 are expressed as positions in the X and Y directions with the center of gravity (center) of the original stage 4 as the origin, and are designated as (XL1, YL1) and (XR1, YR1), respectively. Furthermore, the design positions of the original marks 18a-18b on the small-sized original 3b are expressed as positions in the X and Y directions with the center of gravity (center) of the original 3b as the origin, and are designated as (XL2, YL2) and (XR2, YR2), respectively. However, in design, it is assumed that the center of gravity of the original stage 4 coincides with the center of gravity of the small-sized original 3b mounted on the original stage 4 via the holder 20.

In step S31, the control unit 11 drives (moves) the original stage 4 and the detection unit 2 relatively so that the first reference mark 8 on the original stage 4 falls within the field of view of the detection unit 2 via the light-transmitting portion 24 of the holder 20. Next, in step S32, the control unit 11 causes the detection unit 2 to detect (image) the first reference mark 8 that falls within the field of view of the detection unit 2. At this time, the control unit 11 preferably adjusts the focus of the detection unit 2 using the focus adjustment mechanism so that the focus of the detection unit 2 is aligned with the first reference mark 8.

In step S33, the control unit 11 drives (moves) the original stage 4 and the detection unit 2 relatively so that the original mark 18 of the original 3b falls within the field of view of the detection unit 2. In this embodiment, the designed relative distance between the first reference mark 8 and the original mark 18 can be used as the relative drive amount between the original stage 4 and the detection unit 2. Next, in step S34, the control unit 11 causes the detection unit 2 to detect (image) the original mark 18 that falls within the field of view of the detection unit 2. At this time, the control unit 11 preferably adjusts the focus of the detection unit 2 using the focus adjustment mechanism so that the focus of the detection unit 2 is on the original mark 18.

In step S35, the control unit 11 determines the relative positional deviation between the first reference mark 8 and the master mark 18 based on the detection results of steps S32 and S34 (i.e., the image obtained by capturing images). This relative positional deviation refers to the deviation from the designed relative position between the first reference mark 8 and the master mark 18. Next, in step S36, the control unit 11 determines whether the relative positional deviation has been determined for all pairs of first reference marks 8 and master marks 18. In this embodiment, pairs of first reference marks 8 and master marks 18 may include pairs of first reference marks 8a and master marks 18a, and pairs of first reference marks 8b and master marks 18b. If the relative positional deviation has been determined for all pairs, the process proceeds to step S37. On the other hand, if the relative positional deviation has not been determined for all pairs, the process proceeds to step S31, and steps S31 to S35 are performed for pairs for which the relative positional deviation has not yet been determined.

For example, in the first step S31-S34, as shown in FIG. 4, the first fiducial mark 8a and the master mark 18a are individually detected by the detection unit 2. In this case, in step S32, the positional deviation in the X and Y directions of the first fiducial mark 8a relative to the center of the field of view of the detection unit 2 is obtained as (dxL1, dyL1). In addition, in step S33, the designed relative distance (XL2-XL1, YL2-YL1) between the first fiducial mark 8a and the master mark 18a is used as the relative drive amount between the master stage 4 and the detection unit 2. Then, in step S35, the positional deviation in the X and Y directions of the master mark 18a relative to the center of the field of view of the detection unit 2 is obtained as (dxL2, dxL2). As a result, in step S35, the relative positional deviation between the first fiducial mark 8a and the master mark 18a is obtained as (dxL2-dxL1, dyL2-dyL1).

Similarly, in the second run of steps S31 to S34, the first fiducial mark 8b and original mark 18b are individually detected by the detection unit 2. In this case, in step S32, the positional deviation in the X and Y directions of the first fiducial mark 8b relative to the center of the field of view of the detection unit 2 is obtained as (dxR1, dyR1). Furthermore, in step S33, the designed relative distance (XR2-XR1, YR2-YR1) between the first fiducial mark 8b and original mark 18b is used as the relative drive amount between the original stage 4 and the detection unit 2. Then, in step S35, the positional deviation in the X and Y directions of the original mark 18a relative to the center of the field of view of the detection unit 2 is obtained as (dxR2, dyR2). As a result, in step S35, the relative positional deviation between the first fiducial mark 8b and original mark 18b is obtained as (dxR2-dxR1, dyR2-dyR1).

Note that, if the exposure apparatus EXP is provided with multiple detection units 2 as shown in FIG. 1, steps S31 to S35 for each set may be performed in parallel by multiple detection units 2.

In step S37, the control unit 11 determines the positional deviation of the master 3b relative to the master stage 4 based on the relative positional deviation between the first reference mark 8 and the master mark 18 obtained in step S35. If there are multiple pairs of first reference marks 8 and master marks 18, the positional deviation of the master 3b relative to the master stage 4 may be determined based on a representative value (e.g., average value, mode, etc.) of the relative positional deviation obtained for each of the multiple pairs.

In the above measurement process, the position of the substrate stage 7 is arbitrary when determining the relative positional deviation between the first reference mark 8 and the original marks 10 and 18. From the perspective of throughput, the above measurement process is preferably performed in parallel with other processes, and may be performed, for example, while the substrate 6 is being replaced on the substrate stage 7.

Furthermore, when adjusting the focus of the detection unit 2 using the focus adjustment mechanism, the mark image may not only change in the Z direction but also shift in the X and Y directions. Therefore, it is advisable to measure in advance the amount of shift of the mark image in the X and Y directions when the focus of the detection unit 2 is changed at an arbitrary pitch using the focus adjustment mechanism, and store the measurement results as a table or function in the data storage unit 11a. This allows the control unit 11 to accurately detect the relative positional deviation between the first reference mark 8 and the original marks 10 and 18 based on the amount of shift of the mark image in the X and Y directions corresponding to the amount of change (adjustment) of the detection unit 2 using the focus adjustment mechanism. The measurement of the amount of shift of the mark image can be performed at any time before starting the flowchart of FIG. 6.

Furthermore, when the detection unit 2 is driven in the X and Y directions, there is a possibility that the actual drive position will shift in the X and Y directions relative to the drive command value. For this reason, it is advisable to measure in advance the amount of shift in the X and Y directions (i.e., the amount of drive error) when the detection unit 2 is driven in the X and Y directions at an arbitrary pitch, and store the measurement results as a table or function in the data storage unit 11a. This allows the control unit 11 to drive the detection unit 2 with high precision based on the amount of shift in the X and Y directions corresponding to the drive position of the detection unit 2. The amount of shift in the drive position can be measured at any time before starting the flowchart of Figure 6.

As described above, in this embodiment, one mode is selected from multiple modes for detecting the first fiducial mark 8 and the original mark based on design information indicating the relative positions of the first fiducial mark 8 and the original mark in terms of design. Then, the position of the original 3 relative to the original stage 4 is determined based on the results of detecting the first fiducial mark 8 and the original mark using the selected mode. The multiple modes include a first mode and a second mode. The first mode is a mode in which the first fiducial mark 8 and the original mark are simultaneously positioned within the field of view of the detection unit 2 for detection, and can be selected when a specified-size original 3a is mounted on the original stage 4. The second mode is a mode in which the first fiducial mark 8 and the original mark are individually positioned within the field of view of the detection unit 2 for detection through relative movement between the original stage 4 and the detection unit 2, and can be selected when a small-sized original 3b is mounted on the original stage 4 via the holder 20. This allows the positional deviation of the original 3 relative to the original stage 4 to be measured with high accuracy according to the type of original 3.

Second Embodiment
A second embodiment of the present invention will be described. In this embodiment, a modified example of the measurement process in the second mode performed in step S15 will be described. Note that this embodiment basically follows on from the first embodiment, and can follow the first embodiment except for the matters mentioned below.

Figure 9 shows (a) the layout of the first reference marks 8 on the original stage 4, (b) the layout of the original marks 18 on the small-sized original 3b held by the holder 20, and (c) the layout of the second reference marks 9 on the substrate stage 7.

In the following explanation, the design positions of the first fiducial marks 8a-8b on the original stage 4 are expressed as positions in the X and Y directions with the center of gravity (center) of the original stage 4 as the origin, and are designated as (XL1, YL1) and (XR1, YR1), respectively. Furthermore, the design positions of the original marks 18a-18b on the small-sized original 3b are expressed as positions in the X and Y directions with the center of gravity (center) of the original 3b as the origin, and are designated as (XL2, YL2) and (XR2, YR2), respectively. Furthermore, the design positions of the second fiducial marks 9a-9b on the substrate stage 7 are expressed as positions in the X and Y directions with the center of gravity (center) of the substrate stage 7 as the origin, and are designated as (XL3, YL3) and (XR3, YR3), respectively. However, in terms of design, the centers of gravity of the original stage 4, the substrate stage 7, and the small-sized original 3b mounted on the original stage 4 via the holder 20 are assumed to coincide. Here, the second reference marks 9a-9b on the substrate stage 7 are arranged at the same intervals as the original marks 18a-18b on the original 3b. When multiple small-sized originals 3b of different sizes are used, the number of second reference marks 9 on the substrate stage 7 may be increased for each type of interval between the original marks 18. Even in this case, the interval between the second reference marks 9 on the substrate stage 7 is assumed to be the same as the interval between the original marks 18.

Figure 10 is a flowchart showing the measurement process in the second mode performed in step S15. In this embodiment, an example is described in which the relative positional deviation between the first reference mark 8 on the original stage 4 and the original mark 18 on the original 3b is determined using the second reference mark 9 on the substrate stage 7 as a reference.

In step S41, the control unit 11 drives (moves) the original stage 4 and the detection unit 2 relatively so that the original mark 18 on the original 3b falls within the field of view of the detection unit 2. At this time, the control unit 11 drives the substrate stage 7 so that the second reference mark 9 on the substrate stage 7 falls within the field of view of the detection unit and the projection area of the projection optical system 5.

In step S42, the control unit 11 causes the detection unit 2 to detect (image) the original mark 18 and second reference mark 9 that are within the field of view of the detection unit 2. The second reference mark 9 is detected by the detection unit 2 via the projection optical system 5. At this time, the control unit 11 may adjust the focus of the detection unit 2 using the focus adjustment mechanism so that the focus of the detection unit 2 is aligned with the original mark 18 and second reference mark 9, or may adjust the position of the second reference mark 9 in the Z direction using the substrate stage 7. Next, in step S43, the control unit 11 determines the positional deviation of the original mark 18 relative to the second reference mark 9 based on the detection result of step S42 (i.e., the image obtained by imaging). At this time, the control unit 11 also determines the positional deviation of the second reference mark 9 relative to the center of the field of view of the detection unit 2.

In step 44, the control unit 11 drives (moves) the original stage 4 and the detection unit 2 relative to each other so that the first reference mark 8 of the original stage 4 falls within the field of view of the detection unit 2 via the light-transmitting portion 24 of the holder 20. In this embodiment, the designed relative distance between the first reference mark 8 and the original mark 18 can be used as the relative drive amount between the original stage 4 and the detection unit 2.

In step S45, the control unit 11 causes the detection unit 2 to detect (image) the first fiducial mark 8 that falls within the field of view of the detection unit 2. At this time, the control unit 11 may adjust the focus of the detection unit 2 using the focus adjustment mechanism so that the focus of the detection unit 2 is aligned with the first fiducial mark 8. Next, in step S46, the control unit 11 determines the positional deviation of the first fiducial mark 8 from the center of the field of view of the detection unit 2 based on the detection result of step S45 (i.e., the image obtained by imaging). Here, steps S44 to S46 are performed to determine the positional relationship between the original stage 4 and the substrate stage 7. Therefore, if the "positional deviation of the first fiducial mark 8 from the center of the field of view of the detection unit 2" is obtained in the first steps S44 to S46, steps S44 to S46 may be omitted from the second and subsequent times.

In step S47, the control unit 11 determines the relative positional deviation between the first reference mark 8 and the original mark 18. The relative positional deviation can be calculated from the "positional deviation of the original mark 18 relative to the second reference mark 9" and "positional deviation of the second reference mark 9 relative to the center of the field of view" determined in step S43, and the "positional deviation of the first reference mark 8 relative to the center of the field of view" determined in step S46.

In step S48, the control unit 11 determines whether the relative positional shift has been calculated for all pairs of the first reference mark 8, the second reference mark 9, and the master mark 18. In this embodiment, the pairs of the first reference mark 8, the second reference mark 9, and the master mark 18 may include the pair of the first reference mark 8a, the second reference mark 9a, and the master mark 18a, and the pair of the first reference mark 8b, the second reference mark 9b, and the master mark 18b. If the relative positional shift has been calculated for all pairs, the process proceeds to step S49. On the other hand, if the relative positional shift has not been calculated for all pairs, the process proceeds to step S41, and steps S41 to S47 are performed for pairs for which the relative positional shift has not yet been calculated.

For example, in the first steps S41 to S47, the first fiducial mark 8a and the original mark 18a are individually detected by the detection unit 2. In this case, in step S41, the drive amount for the substrate stage 7 is "-(XL3 + XR3)/2" in the X direction and "(YL3 + YR3)/2 - (YL1 + YR1)/2" in the Y direction. Then, in step S43, the positional shift of the original mark 18a relative to the second fiducial mark 9a is obtained as (dxL3, dyL3), and the positional shift of the second fiducial mark 9a relative to the center of the field of view of the detection unit 2 is obtained as (dxL4, dyL4). Furthermore, in step S44, the designed relative distance (XL1-XL2, YL1-YL2) between the first fiducial mark 8a and the original mark 18a is used as the relative drive amount for the original stage 4 and the detection unit 2. Then, in step S46, the positional deviation of the first reference mark 8a from the center of the field of view of the detection unit 2 is obtained as (dxL5, dyL5). As a result, in step S47, the relative positional deviation between the first reference mark 8a and the original mark 18a is obtained as (dxL3 + dxL4 - dxL5, dyL3 + dyL4 - dyL5).

Similarly, in the second round of steps S41 to S47, the first reference mark 8b and original mark 18b are individually detected by the detection unit 2. In this case, in step S43, the positional deviation of the original mark 18b relative to the second reference mark 9b is obtained as (dxR3, dyR3), and the positional deviation of the second reference mark 9b relative to the center of the field of view of the detection unit 2 is obtained as (dxR4, dyR4). Furthermore, in step S44, the designed relative distance (XR1-XR2, YR1-YR2) between the first reference mark 8a and original mark 18a is used as the relative drive amount between the original stage 4 and the detection unit 2. Then, in step S46, the positional deviation of the first reference mark 8b relative to the center of the field of view of the detection unit 2 is obtained as (dxR5, dyR5). As a result, in step S47, the relative positional deviation between the first reference mark 8b and the original mark 18b is obtained as (dxR3 + dxR4 - dxR5, dyR3 + dyR4 - dyR5).

Note that if the exposure apparatus EXP is provided with multiple detection units 2 as shown in FIG. 1, steps S41 to S47 for each set may be performed in parallel by multiple detection units 2.

In step S49, the control unit 11 determines the positional deviation of the master 3b relative to the master stage 4 based on the relative positional deviation between the first reference mark 8 and the master mark 18 obtained in step S47. If there are multiple pairs of first reference marks 8 and master marks 18, the positional deviation of the master 3b relative to the master stage 4 may be determined based on a representative value (e.g., average value, mode, etc.) of the relative positional deviation obtained for each of the multiple pairs.

As with the first embodiment, this embodiment also makes it possible to accurately measure the positional deviation of the original 3 relative to the original stage 4 depending on the type of original 3. From the perspective of throughput, the process of determining the relative positional deviation between the first reference mark 8 and the original mark 18 (step S47) is preferably performed in parallel with other processes, and may be performed, for example, while the substrate 6 is being replaced on the substrate stage 7. Therefore, it is preferable that the second reference mark 9 of the substrate stage 7 is provided on the substrate stage 7 so that it at least partially overlaps with the original mark 10 at the position of the substrate stage 7 during substrate 6 replacement.

Third Embodiment
A third embodiment of the present invention will be described. In this embodiment, a specific configuration example of an exposure apparatus EXP for identifying the type of original 3 in step S11 above will be described. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for the matters mentioned below. Furthermore, in this embodiment, the measurement process in the second mode in the second embodiment may be applied instead of the measurement process in the second mode in the first embodiment.

Figure 11 is a schematic diagram showing an example configuration of the exposure apparatus EXP' of this embodiment. Compared to the exposure apparatus EXP of the first embodiment, the exposure apparatus EXP' of this embodiment may further include a master storage unit 50, a master transport robot 51, and a master transport loader 56. The master transport robot 51 and the master transport loader 56 constitute a master transport unit that transports the master 3 from the master storage unit 50 onto the master stage 4.

The master storage unit 50 is a unit that stores masters 3. The master storage unit 50 may include a master stocker 52, a cassette opening device 53, and master cassettes 54-55. The master is removed from the master stocker 52 using the master transport robot 51, and the cassette is opened by the cassette opening device 53 before being handed over to the master transport loader 56. The master transport loader 56 then transports the master to the master stage 4. Multiple masters are held in the master stocker 52. Figure 11 illustrates a master 3 removed from the master cassette 54 and mounted on the master stage 4, and a master 57 stored in the master cassette 55. The master transport robot 51 is equipped with a reader 58 that reads an identifier (e.g., a barcode) provided on each master. The reading unit 58 reads the identifier attached to the original (e.g., on a side surface) while the original transport robot 51 is transporting the original. This allows the control unit 11 to identify the type (e.g., size) of the original to be transported onto the original stage 4 based on the identifier read by the reading unit 58. Information regarding the type of original is stored, for example, in the data storage unit 11a, and is used to obtain design information that indicates the relative positions of the first reference mark 8 and the original mark in terms of design.

<Embodiment of manufacturing method of article>
The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices, such as semiconductor devices, and elements having microstructures. The article manufacturing method of this embodiment includes a transfer step of transferring a pattern from an original onto a substrate using the above-described lithography method (lithography apparatus), a processing step of processing the substrate that has undergone the transfer step, and a manufacturing step of manufacturing an article from the substrate that has undergone the processing step. The transfer step may be understood as a step of exposing the substrate using the above-described exposure method (exposure apparatus). The processing step may also be understood as a step of developing a photosensitive material (photoresist) on the substrate to which the pattern from the original has been transferred as a latent image pattern. Furthermore, the article manufacturing method includes other well-known processes (such as oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, and packaging). The article manufacturing method of this embodiment is advantageous over conventional methods in at least one of article performance, quality, productivity, and production cost.

<Other embodiments>
The present invention can also be realized by supplying a program that realizes one or more of the functions of the above-described embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program.The present invention can also be realized by a circuit (e.g., an ASIC) that realizes one or more of the functions.

<Summary of the embodiment>
The disclosure of this specification includes at least the following metrology method, lithography method, article manufacturing method, and lithography apparatus.
(Item 1)
1. A measurement method for measuring a positional deviation of an original relative to a stage in a lithography apparatus that transfers a pattern of the original mounted on a stage onto a substrate, the method comprising:
an acquiring step of acquiring information indicating a relative position in design between a reference mark of the stage and an original mark of the original when the original is mounted on the stage;
a selection step of selecting one mode from a plurality of modes for detecting the reference mark and the original mark with a scope according to the information acquired in the acquisition step;
a determining step of detecting the reference mark and the original mark with the scope in the one mode selected in the selecting step, and determining the positional deviation based on the detection result;
Including,
a measurement method characterized in that the plurality of modes include a first mode in which the reference mark and the original mark are simultaneously accommodated within the field of view of the scope and detected, and a second mode in which the reference mark and the original mark are individually accommodated within the field of view and detected through relative movement between the stage and the scope.
(Item 2)
In the selection step, the first mode is selected when a first original is mounted on the stage, and the second mode is selected when a second original is mounted on the stage;
the first original has, as the original mark, a first mark that fits within the field of view together with the reference mark when the first original is mounted on the stage;
2. The measurement method according to item 1, wherein the second original has, as the original mark, a second mark that does not fit within the field of view together with the reference mark when the second original is mounted on the stage.
(Item 3)
3. The measurement method according to item 2, wherein the second master has a size smaller than the first master and is mounted on the stage via a holder that holds a peripheral portion of the second master.
(Item 4)
4. The measurement method according to item 3, wherein in the second mode, the reference mark is detected by the scope via the holder.
(Item 5)
5. The measurement method according to item 4, wherein the holder has a light-transmitting portion at a position that overlaps the reference mark when the holder is mounted on the stage.
(Item 6)
6. The measurement method described in any one of items 3 to 5, wherein the holder includes a first part held by a chuck of the stage, a second part connected to the first part and holding the original, and a fixing member that fixes the original by pressing the original against the second part.
(Item 7)
The method further includes a step of identifying the type of the master transferred to the stage by reading an identifier provided on the master,
7. The measurement method according to any one of items 1 to 6, wherein in the acquiring step, the information is acquired based on the type of the original identified in the identifying step.
(Item 8)
A lithography method for transferring a pattern of an original mounted on a stage onto a substrate, comprising:
a measuring step of measuring a positional deviation of the original with respect to the stage by using the measurement method according to any one of items 1 to 7;
a transfer step of transferring the pattern of the original onto the substrate;
Including,
a transfer step of controlling alignment between the original and the substrate based on the positional deviation measured in the measurement step;
(Item 9)
A transfer step of transferring a pattern of an original onto a substrate using the lithography method according to item 8;
a processing step of processing the substrate that has undergone the transfer step;
a manufacturing process for manufacturing an article from the substrate that has undergone the processing process;
A method for manufacturing an article, comprising:
(Item 10)
1. A lithography apparatus that transfers a pattern of an original onto a substrate, comprising:
a stage on which the master is mounted;
a scope for detecting a reference mark of the stage and a master mark of the master;
a control unit that determines a positional deviation of the original relative to the stage;
Equipped with
the control unit selects one mode from a plurality of modes in accordance with information indicating the relative positions of the reference mark and the original mark in design when the original is mounted on the stage, and determines the positional deviation based on a result of detecting the reference mark and the original mark using a scope in the one mode;
the plurality of modes include a first mode in which the reference mark and the original mark are simultaneously positioned within the field of view of the scope and detected, and a second mode in which the reference mark and the original mark are individually positioned within the field of view and detected through relative movement between the stage and the scope.

The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Therefore, the following claims are appended to clarify the scope of the invention.

1: Illumination optical system, 2: Detection unit (scope), 3: Original, 4: Original stage, 5: Projection optical system, 6: Substrate, 7: Substrate stage, 8: First fiducial mark, 9: Second fiducial mark, 10, 18: Original mark, 11: Control unit, EXP: Exposure apparatus (lithography apparatus)

Claims (10)

1. A measurement method for measuring a positional deviation of an original relative to a stage in a lithography apparatus that transfers a pattern of the original mounted on a stage onto a substrate, the method comprising:
an acquiring step of acquiring information indicating a relative position in design between a reference mark of the stage and an original mark of the original when the original is mounted on the stage;
a selection step of selecting one mode from a plurality of modes for detecting the reference mark and the original mark with a scope according to the information acquired in the acquisition step;
a determining step of detecting the reference mark and the original mark with the scope in the one mode selected in the selecting step, and determining the positional deviation based on the detection result;
Including,
a measurement method characterized in that the plurality of modes include a first mode in which the reference mark and the original mark are simultaneously accommodated within the field of view of the scope and detected, and a second mode in which the reference mark and the original mark are individually accommodated within the field of view and detected through relative movement between the stage and the scope. In the selection step, the first mode is selected when a first original is mounted on the stage, and the second mode is selected when a second original is mounted on the stage;
the first original has, as the original mark, a first mark that fits within the field of view together with the reference mark when the first original is mounted on the stage;
2. The measurement method according to claim 1, wherein the second original has, as the original mark, a second mark that does not fit within the field of view together with the reference mark when the second original is mounted on the stage. The measurement method described in claim 2, characterized in that the second master is smaller in size than the first master and is mounted on the stage via a holder that holds the peripheral portion of the second master. The measurement method described in claim 3, wherein in the second mode, the reference mark is detected by the scope via the holder. The measurement method described in claim 4, characterized in that the holder has a light-transmitting portion at a position that overlaps the reference mark when mounted on the stage. The measurement method described in claim 3, characterized in that the holder includes a first portion held by a chuck of the stage, a second portion connected to the first portion and holding the original, and a fixing member that fixes the original by pressing the original against the second portion. The method further includes a step of identifying the type of the master transferred to the stage by reading an identifier provided on the master,
2. The measurement method according to claim 1, wherein in the acquiring step, the information is acquired based on the type of the original identified in the identifying step. A lithography method for transferring a pattern of an original mounted on a stage onto a substrate, comprising:
a measuring step of measuring a positional deviation of the original with respect to the stage by using the measurement method according to any one of claims 1 to 7;
a transfer step of transferring the pattern of the original onto the substrate;
Including,
a transfer step of controlling alignment between the original and the substrate based on the positional deviation measured in the measurement step; a transfer step of transferring a pattern of an original onto a substrate by using the lithography method according to claim 8;
a processing step of processing the substrate that has undergone the transfer step;
a manufacturing process for manufacturing an article from the substrate that has undergone the processing process;
A method for manufacturing an article, comprising: 1. A lithography apparatus that transfers a pattern of an original onto a substrate, comprising:
a stage on which the master is mounted;
a scope for detecting a reference mark of the stage and a master mark of the master;
a control unit that determines a positional deviation of the original relative to the stage;
Equipped with
the control unit selects one mode from a plurality of modes in accordance with information indicating the relative positions of the reference mark and the original mark in design when the original is mounted on the stage, and determines the positional deviation based on a result of detecting the reference mark and the original mark using a scope in the one mode;
the plurality of modes include a first mode in which the reference mark and the original mark are simultaneously positioned within the field of view of the scope and detected, and a second mode in which the reference mark and the original mark are individually positioned within the field of view and detected through relative movement between the stage and the scope.