JP7744517B2 - Bundling protection tape - Google Patents

Description

The present invention relates to a bundling and protection tape. This bundling and protection tape is suitable for use in bundling and protecting high-voltage cables in electric and hybrid vehicles, automotive wire harnesses, and other applications.

For the bundling and protection of automotive wire harnesses, polyvinyl chloride bundling protection tape, which has a substrate made of polyvinyl chloride resin and an adhesive applied to one side, is used because it has moderate flexibility and extensibility, and is excellent in flame retardancy, mechanical strength, heat deformation resistance, electrical insulation, and moldability, as well as being relatively inexpensive (Patent Documents 1 and 2). It is also known that the cut resistance and abrasion resistance of polyvinyl chloride bundling protection tape can be improved by arranging hard wires that are harder than polyvinyl chloride resin in a predetermined cutting direction and embedding them in the substrate (Patent Document 3).

Japanese Patent Application Publication No. 8-259909 JP 2012-184369 A JP 10-264902

The objective of the present invention is to provide a bundling protection tape that has an excellent balance of flexibility and protective performance, and also has excellent film-forming properties for the substrate.

As a result of investigations by the present inventors, it has been found that in a bundling protection tape having a substrate and a pressure-sensitive adhesive layer formed on one side of the substrate, by incorporating a polyvinyl chloride resin, a plasticizer, a filler, and a polyorganosiloxane in the substrate and setting the content of the polyorganosiloxane to 1 to 10 parts by mass per 100 parts by mass of the polyvinyl chloride resin, a bundling protection tape having an excellent balance of flexibility and protective performance and also excellent film-forming properties of the substrate can be obtained.
That is, the present invention provides:
[1] A binding and protection tape having a substrate and a pressure-sensitive adhesive layer formed on one side of the substrate,
the substrate is composed of a resin composition containing a polyvinyl chloride resin, a plasticizer, a filler, and a polyorganosiloxane;
In the resin composition, the content of the polyorganosiloxane is 1 to 10 parts by mass relative to 100 parts by mass of the polyvinyl chloride resin,
Binding protection tape.
[2] The substrate is fixed to a sample stage using Nitto Denko Corporation's No. 5000NS double-sided tape, and the dynamic friction coefficient of the substrate surface is measured using an R contactor based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm/sec, and is 0.06 to 0.26.
The binding protection tape according to [1].
[3] The bundling protection tape is fixed to a sample stage via the pressure-sensitive adhesive layer, and the dynamic friction coefficient of the back surface of the substrate of the bundling protection tape is measured using an R contactor based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm/sec, and is 0.13 to 0.60.
The binding protection tape according to [1].
[4] The binding protection tape according to any one of [1] to [3], wherein the polyorganosiloxane is an acrylic-modified polyorganosiloxane in which (meth)acrylate is copolymerized on the side chain of the polyorganosiloxane.
[5] The binding protection tape according to [4], wherein the weight average molecular weight of the acrylic-modified polyorganosiloxane is 300,000 to 500,000.
[6] The binding protection tape according to any one of [1] to [5], wherein the content of the plasticizer in the resin composition is 38 to 50 parts by mass per 100 parts by mass of the polyvinyl chloride resin.
[7] The binding protection tape according to any one of [1] to [6], wherein the content of the filler in the resin composition is 10 to 60 parts by mass per 100 parts by mass of the polyvinyl chloride resin.
[8] The binding protection tape according to any one of [1] to [7], wherein the thickness of the substrate is 190 to 330 μm.
[9] The binding protection tape according to any one of [1] to [8], wherein the tensile modulus of elasticity converted into thickness of the substrate is 6 to 9 N/mm.
Regarding.

The present invention makes it possible to provide a bundling protection tape that has an excellent balance of flexibility and protective performance, and also has excellent film-forming properties for the substrate.

<Terminology>
In the present specification, for example, the description "A to B" means A or more and B or less.

The following describes in detail the embodiments of the present invention. The present invention is not limited to these, and various modifications are possible without departing from the spirit of the invention. The various features shown in the embodiments below can be combined with each other. Furthermore, each feature can be an invention independently.

<Configuration of bundling protection tape>
The binding protection tape according to one embodiment of the present invention comprises a substrate and a pressure-sensitive adhesive layer formed on one side of the substrate. Each component will be described in detail below.

<Base material>
The substrate according to one embodiment of the present invention contains a polyvinyl chloride resin, a plasticizer, a filler, and a polyorganosiloxane, and the content of the polyorganosiloxane relative to 100 parts by mass of the polyvinyl chloride resin is 1 to 10 parts by mass. It is composed of a resin composition.

<Polyvinyl chloride resin>
In one embodiment of the present invention, the polyvinyl chloride resin preferably has an average degree of polymerization of 1000 to 1500, and two or more polyvinyl chloride resins with different average degrees of polymerization may be used. If the average degree of polymerization is less than 1000, the entanglement of polymer chains may be insufficient, and sufficient strength (abrasion resistance) may not be obtained. If the average degree of polymerization is higher than 1500, gelation may be difficult, and film-forming properties may be deteriorated.

<Plasticizer>
The plasticizer used in one embodiment of the present invention is not particularly limited as long as it can impart flexibility to the substrate. Examples include trimellitic acid esters, adipate esters, phthalate esters, epoxy-based plasticizers, isophthalate esters, terephthalate esters, and phosphate-based plasticizers. Phthalate esters are preferred from the viewpoints of their plasticizing effect on polyvinyl chloride resins and minimal bleed-out. These plasticizers may be used alone or in combination of two or more.

<Phthalate esters>
Examples of phthalate ester plasticizers in one embodiment of the present invention include DINP (diisononyl phthalate), DHP (diheptyl phthalate), DOP (di-2-ethylhexyl phthalate), n-DOP (di-n-octyl phthalate), and diisodecyl phthalate (DIDP). From the viewpoints of plasticizing effect on polyvinyl chloride resin, less bleed-out, and less impact on the human body, diesters of phthalic acid and alcohols having 9 to 10 carbon atoms, such as DINP (diisononyl phthalate) and diisodecyl phthalate (DIDP), are preferred. These plasticizers may be used alone or in combination of two or more.

In one embodiment of the present invention, the content of the plasticizer is preferably 38 to 50 parts by weight, more preferably 40 to 48 parts by weight, per 100 parts by weight of polyvinyl chloride resin. Specifically, for example, 38, 40, 42, 43, 44, 45, 46, 48, or 50 parts by weight is preferred, and may be within a range between any two of the values exemplified here. By using 38 parts by weight or more of the plasticizer, the flexibility of the substrate is improved, and for example, the tracking ability when wrapped around an electric wire or the like is improved, thereby reducing the occurrence of lifting in the bundling protection tape. By using 50 parts by weight or less of the plasticizer, the abrasion resistance of the substrate is improved, resulting in good protective performance.
When a plasticizer is used in combination, the content of the plasticizer means the total amount of the plasticizer used in combination.

<Filler>
The filler in one embodiment of the present invention is not particularly limited as long as it can increase the amount of the base material and improve hardness. For example, inorganic fillers are preferred from the viewpoint of achieving both reinforcing effect and flexibility.

<Inorganic filler>
Examples of inorganic fillers in one embodiment of the present invention include calcium carbonate, aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, calcium hydroxide, potassium hydroxide, barium hydroxide, triphenyl phosphite, ammonium polyphosphate, polyphosphate amide, zirconium oxide, magnesium oxide, zinc oxide, titanium oxide, molybdenum oxide, guanidine phosphate, hydrotalcite, smectite, zinc borate, anhydrous zinc borate, zinc metaborate, barium metaborate, antimony oxide, antimony pentoxide, red phosphorus, talc, alumina, silica, boehmite, bentonite, sodium silicate, calcium silicate, calcium sulfate, magnesium carbonate, and carbon black. From the viewpoint of achieving both reinforcing effect and flexibility, calcium carbonate, silica, and carbon black are preferred. These fillers may be used alone or in combination of two or more.

In one embodiment of the present invention, the content of the filler is preferably 10 to 60 parts by mass, more preferably 20 to 40 parts by mass, per 100 parts by mass of polyvinyl chloride resin. Specifically, for example, it may be 10, 15, 20, 25, 30, 35, 40, 45, 50, or 60 parts by mass, and may be within a range between any two of the values exemplified here. By using 10 parts by mass or more of the filler, the abrasion resistance of the substrate is improved and good protective performance can be obtained. By using 60 parts by mass or less of the filler, the flexibility of the substrate is improved, and the improved conformability when wrapped around, for example, an electric wire can be improved, thereby reducing the occurrence of lifting in the bundling protection tape.
When a filler is used in combination, the content of the filler means the total amount of the fillers used in combination.

<Polyorganosiloxane>
<Polyorganosiloxane structure>
The polyorganosiloxane in one embodiment of the present invention is not particularly limited as long as it has a polyorganosiloxane structure. A polyorganosiloxane structure is a polymer having a repeating unit of -Si-O- in the main chain and an organic group in the side chain. Examples of the repeating unit include those represented by the following structural formula:

In the formula, _R1 and _R2 are each independently an organic group selected from an alkyl group, a polyoxyalkylene group, a fluorine-containing group, and a chlorophenyl group. From the viewpoint of sliding properties, an alkyl group is preferred.
Examples of the alkyl group include a methyl group and an ethyl group from the viewpoint of sliding properties.
These polyorganosiloxane structures may be used alone or in combination of two or more.

<Acrylic-modified polyorganosiloxane>
In one embodiment of the present invention, the polyorganosiloxane may be an acrylic-modified polyorganosiloxane in which (meth)acrylate is copolymerized on the side chain of the polyorganosiloxane from the viewpoint of dispersibility in polyvinyl chloride resin and durability of sliding properties.

In one embodiment of the present invention, examples of the (meth)acrylate introduced into the side chain of the polyorganosiloxane include methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, cyclohexyl methacrylate, phenyl methacrylate, 2-ethylhexyl methacrylate, t-butylcyclohexyl methacrylate, benzyl methacrylate, 2,2,2-trifluoroethyl methacrylate, etc. From the viewpoints of ease of handling and availability, methyl methacrylate is preferred.
These copolymerizable (meth)acrylates may be used alone or in combination of two or more.
In one embodiment of the present invention, the polyorganosiloxane is preferably a methyl methacrylate-modified polyorganosiloxane in which methyl methacrylate is copolymerized with the side chain of polyorganosiloxane, from the viewpoint of dispersibility in polyvinyl chloride resin and durability of sliding properties.

<Weight average molecular weight (Mw) of acrylic-modified polyorganosiloxane>
In one embodiment of the present invention, the weight average molecular weight (Mw) of the acrylic-modified polyorganosiloxane is preferably 300,000 to 500,000, more preferably 350,000 to 450,000. Specifically, for example, it may be 30, 35, 38, 40, 42, 45, or 500,000, and may be within a range between any two of the values exemplified here. By making the weight average molecular weight (Mw) of the acrylic-modified polyorganosiloxane 300,000 or more, it is possible to improve the film-forming properties of the substrate during its production and its stability during storage. By making the weight average molecular weight (Mw) 500,000 or less, it can be uniformly dispersed in the polyvinyl chloride resin.

In one embodiment of the present invention, the weight average molecular weight (Mw) of the acrylic-modified polyorganosiloxane can be measured, for example, using gel permeation chromatography (GPC). The weight average molecular weight (Mw) can be controlled, for example, by adjusting the weight average molecular weight (Mw) of the polyorganosiloxane.
When an acrylic-modified polyorganosiloxane is used in combination, the weight average molecular weight (Mw) refers to the weight average molecular weight (Mw) of the combined acrylic-modified polyorganosiloxane.

<Linear Polyorganosiloxane>
The polyorganosiloxane in one embodiment of the present invention may be a linear polyorganosiloxane in which the siloxane bonds of the main chain are linearly bonded. Examples of linear polyorganosiloxanes include linear polydimethylsiloxane, linear polymethylphenylsiloxane, and linear polymethylhydrogensiloxane. From the viewpoint of sliding properties, linear polydimethylsiloxane is preferred.
These other linear polyorganosiloxanes may be used alone or in combination of two or more.

<Crosslinked Polyorganosiloxane>
In one embodiment of the present invention, the polyorganosiloxane may have a structure in which linear polyorganosiloxane is crosslinked, or a structure in which siloxane bonds are crosslinked in a three-dimensional network form, from the viewpoint of film-forming property of the substrate during the production of the substrate and stability during storage.From the viewpoint of sliding property, polyorganosiloxane in which linear polyorganosiloxane is crosslinked is preferred.
These crosslinked polyorganosiloxanes may be used alone or in combination of two or more.

In one embodiment of the present invention, the content of polyorganosiloxane is 1 to 10 parts by mass, more preferably 3 to 7 parts by mass, per 100 parts by mass of polyvinyl chloride resin. Specifically, for example, it may be 1, 2, 4, 6, 8, or 10 parts by mass, and may be within a range between any two of the values exemplified herein. By making the content of polyorganosiloxane 1 part by mass or more, the abrasion resistance of the substrate is improved and good protective performance is obtained. By making the content of polyorganosiloxane 10 parts by mass or less, the flexibility of the substrate is improved, and for example, the tracking ability when wrapped around an electric wire or the like is improved, thereby reducing the occurrence of lifting in the bundling protection tape. In addition, plate-out (a phenomenon in which part of the resin composition separates and adheres to the molding machine) can be prevented during film formation.
When polyorganosiloxanes are used in combination, the content of polyorganosiloxanes refers to the total amount of polyorganosiloxanes used in combination.

<Other additives>
Furthermore, the resin composition of the present embodiment may contain other additives such as colorants, stabilizers, antioxidants, ultraviolet absorbers, and lubricants, as needed, within the scope of not impairing the effects of the present invention.

<Base material thickness>
The substrate thickness of the bundling protection tape in this embodiment varies depending on the intended use and application, but is preferably 190 to 330 μm, more preferably 190 to 250 μm. Specifically, it may be, for example, 190, 195, 200, 205, 210, 220, 250, 280, 300, or 330 μm, and may be within a range between any two of the values exemplified here. By making the substrate thickness 190 μm or more, the abrasion resistance of the substrate is improved, resulting in good protective performance. By making the substrate thickness 330 μm or less, the flexibility of the substrate is improved, and the improved conformability when wrapped around, for example, an electric wire can reduce the occurrence of lifting in the bundling protection tape.

<Structure of substrate>
The structure of the substrate of the binding protection tape in this embodiment is preferably a single layer structure from the viewpoint of simplifying the manufacturing process and manufacturing equipment.

<Method of manufacturing substrate>
The resin composition for producing the substrate according to this embodiment can be obtained by melt-kneading polyvinyl chloride resin, plasticizer, filler, and polyorganosiloxane, as well as, if necessary, heat stabilizers, light absorbers, pigments, and other additives. The melt-kneading method is not particularly limited, but various mixers and kneaders equipped with heating devices such as twin-screw extruders, continuous and batch kneaders, rolls, and Banbury mixers can be used. The resin composition is mixed to uniformly disperse, and the resulting mixture is molded into a substrate using conventional molding methods such as the calendar method, T-die method, and inflation method. A calendar molding machine is preferred from the perspectives of productivity, color change, and shape uniformity. Known roll arrangement methods, such as L-type, reverse L-type, and Z-type, can be used for calendar molding. The roll temperature is typically set to 150 to 200°C, preferably 155 to 190°C.

<Dynamic friction coefficient of substrate surface>
In one embodiment of the present invention, when the substrate is fixed to a measurement stage with Nitto Denko Corporation's No. 5000NS double-sided tape, the coefficient of dynamic friction of the substrate surface, measured using an R contactor based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm/sec, is preferably 0.06 to 0.26, more preferably 0.10 to 0.25. Specifically, for example, 0.06, 0.08, 0.10, 0.12, 0.14, 0.16, 0.18, 0.20, 0.22, 0.24, or 0.26 is preferred, and may be within a range between any two of the values exemplified here. By making the coefficient of dynamic friction of the substrate surface 0.06 or higher, the flexibility of the bundling protection tape is improved, and the improved followability when wrapped around, for example, an electric wire can be improved, thereby reducing the occurrence of lifting of the bundling protection tape. By making the dynamic friction coefficient of the substrate surface 0.26 or less, the abrasion resistance of the bundling protection tape is improved, and good protection performance can be obtained.

The dynamic friction coefficient of the substrate surface can be controlled by adjusting the type and content of polyorganosiloxane contained in the resin composition used to manufacture the substrate.

<Measurement of the dynamic friction coefficient of the substrate surface>
The dynamic friction coefficient of the substrate surface of the substrate according to this embodiment can be measured, for example, by the following procedure using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd.
A substrate sample is cut to a width of 50 mm and a length of 100 mm, and fixed to a sample stage using double-sided tape (No. 5000NS manufactured by Nitto Denko Corporation).
An R contact based on ASTM D1894 is placed on the back of the bonded substrate sample, and the dynamic friction coefficient is measured under conditions of a load of 200 g and a test speed of 2.5 mm/sec (room temperature 23° C., humidity 50% RH).

<Tensile modulus converted into thickness of substrate>
For the substrate according to this embodiment, the tensile modulus of elasticity, calculated as the thickness of the substrate, is preferably 6 to 9 N/mm, more preferably 7 to 9 N/mm. Specifically, it may be, for example, 6, 7, 8, or 9 N/mm, and may be within a range between any two of the values exemplified here. By setting the tensile modulus of elasticity, calculated as the thickness of the substrate, to 6 N/mm or more, a good balance with the protective performance of the substrate can be achieved. By setting the tensile modulus of elasticity, calculated as the thickness of the substrate, to 9 N/mm or less, the flexibility of the substrate is improved, and the improved conformability when wrapped around, for example, an electric wire can be improved, thereby reducing the occurrence of lifting in the bundling protection tape.
The tensile modulus of elasticity converted into thickness of the substrate can be controlled by adjusting the type and content of the sliding property imparting agent contained in the resin composition used to produce the substrate.

<Measurement of tensile modulus converted into thickness of substrate>
The tensile modulus of elasticity of the substrate according to this embodiment, converted into thickness, can be obtained from the value of the tensile modulus of elasticity by the following procedure.
A 19 mm wide, 200 mm long binding tape test piece is clamped and fixed in the chucks of a tensile tester with a chuck distance of 100 mm. The test piece is pulled at a speed of 300 mm/min in an environment of room temperature 23°C and relative humidity 50% RH, and the tensile stress and strain are measured. The ratio of tensile stress to strain between 0.01 and 0.05% strain is calculated by linear regression and the value is taken as the tensile modulus.
The product of the tensile modulus thus obtained and the total thickness of the tape (unit: mm) is defined as the tensile modulus converted into thickness.

<Adhesive Layer>
The adhesive of the adhesive layer of the bundling protection tape according to this embodiment is preferably a rubber-based adhesive, and may be either a solvent-based or emulsion-based adhesive. The rubber-based adhesive preferably contains one or more rubbers selected from natural rubber or synthetic rubber and a tackifier resin, and more preferably a mixture of natural rubber, synthetic rubber, and tackifier resin. The mixing ratio of the tackifier resin is preferably 50 to 150 parts by mass per 100 parts by mass of the rubber component of the mixture containing natural rubber and synthetic rubber.

Examples of the natural rubber and synthetic rubber include natural rubber-methyl methacrylate copolymer latex, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, and methyl methacrylate-butadiene copolymer. These may be used alone or in combination of two or more.

The tackifying resin can be selected taking into consideration its softening point, compatibility with each component, etc. Examples include emulsions of terpene resin, rosin resin, hydrogenated rosin resin, coumarone-indene resin, styrene-based resin, aliphatic petroleum resin, alicyclic petroleum resin, terpene-phenol resin, xylene-based resin, and other aliphatic hydrocarbon resins or aromatic hydrocarbon resins. These may be used alone or in combination of two or more.

The rubber-based adhesive can be freely selected from solvent-based and emulsion-based types, but emulsion-based types are preferred as they emit less VOCs.

<Primer layer>

Furthermore, if necessary, the binding protection tape of this embodiment may have a primer layer between the substrate and the adhesive layer for the purpose of improving adhesion between the substrate and the adhesive layer, within a range that does not impair the effects of the present invention.
In this case, as will be described later, the thickness of the primer layer is usually 0.1 to 1 μm, more preferably 0.3 to 0.5 μm, and it is preferable that the thickness of the primer layer is smaller than the thickness of the substrate.

The primer used to form the primer layer is preferably composed of 25 to 300 parts by weight of acrylonitrile-butadiene copolymer per 100 parts by weight of a graft polymer obtained by graft polymerizing methyl methacrylate onto natural rubber.

The graft polymer used in the primer, in which methyl methacrylate is graft polymerized onto natural rubber, is preferably one in which 70-50% by mass of natural rubber is graft polymerized with 30-50% by mass of methyl methacrylate. If the proportion of methyl methacrylate in the graft polymer is less than 30% by mass, adhesion between the methyl methacrylate and the film substrate will be poor, which may result in delamination of the bundling protection tape. Furthermore, if the proportion of methyl methacrylate is greater than 50% by mass, the primer itself will harden and be unable to follow deformation of the film substrate, which may result in delamination of the bundling protection tape.

The acrylonitrile-butadiene copolymers used in the primer include medium nitrile types (25-30% by mass of acrylonitrile, 75-70% by mass of butadiene), medium-high nitrile types (31-35% by mass of acrylonitrile, 69-65% by mass of butadiene), and high nitrile types (36-43% by mass of acrylonitrile, 64-57% by mass of butadiene). These may be used alone or in combination of two or more types.

<Method of manufacturing the bundling protection tape>
The bundling protection tape according to this embodiment can be produced, for example, by coating one side of a substrate with a primer, thoroughly removing the solvent in a drying oven, and then coating with an adhesive. Similarly to the primer, the solvent is thoroughly removed in a drying oven, and then the adhesive is coated again to obtain a bundling protection tape. The primer coating method can be a gravure coating method, a spray coating method, a kiss roll coating method, a bar coating method, or a knife coating method. The adhesive coating method can be a comma coating method, a lip die coating method, a gravure coating method, a roll coating method, or a slot die coating method. The thickness of the primer layer is typically 0.1 to 1 μm, more preferably 0.3 to 0.5 μm. The thickness of the adhesive layer varies depending on the intended use and application, but is typically 5 to 50 μm, more preferably 10 to 30 μm.

<Dynamic friction coefficient of back surface of bundling protection tape substrate>
In another embodiment of the present invention, when the bundling protection tape is fixed to a measurement stage via the adhesive layer, the dynamic friction coefficient of the back surface of the bundling protection tape substrate, as measured using an R contactor according to ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm/sec, is preferably 0.13 to 0.60, more preferably 0.23 to 0.58. Specifically, for example, 0.13, 0.15, 0.20, 0.25, 0.30, 0.35, 0.40, 0.45, 0.50, 0.55, or 0.60 is preferred, and it may be within a range between any two of the values exemplified here. By making the dynamic friction coefficient of the back surface of the bundling protection tape substrate 0.13 or more, the flexibility of the bundling protection tape is improved, and the improved followability when wrapped around an electric wire or the like can reduce the occurrence of lifting of the bundling protection tape. By setting the dynamic friction coefficient of the back surface of the bundling protection tape substrate to 0.60 or less, the abrasion resistance of the bundling protection tape is improved, and good protective performance is obtained.
The back surface of the substrate of the bundling and protection tape refers to the surface of the substrate of the bundling and protection tape opposite to the surface on which the pressure-sensitive adhesive layer is formed.

The kinetic friction coefficient of the back surface of the substrate of a bundling protection tape can be controlled by adjusting the kinetic friction coefficient of the substrate surface within the above-mentioned range, since, for example, assuming the substrate thickness is the same, an increase in the kinetic friction coefficient of the substrate surface tends to increase the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape. When a bundling protection tape is formed by providing a pressure-sensitive adhesive layer on the substrate, the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape tends to be higher than the kinetic friction coefficient of the substrate surface. However, due to the above-mentioned relationship, the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape can be controlled within a desired range by adjusting the kinetic friction coefficient of the substrate surface within a specified range. Furthermore, as the substrate thickness increases, the effect of providing a pressure-sensitive adhesive layer on the change in the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape tends to decrease. Therefore, even when the substrate thickness is large, the kinetic friction coefficient of the back surface of the substrate of the bundling protection tape can be controlled by adjusting the kinetic friction coefficient of the substrate surface within the above-mentioned range.

<Measurement of the dynamic friction coefficient on the back surface of the bundling protection tape substrate>
The dynamic friction coefficient of the back surface of the substrate of the bundling protection tape according to this embodiment can be measured, for example, by the following procedure using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd.
A bundling protection tape sample is cut to a width of 50 mm and a length of 100 mm, and fixed to a sample stage via the adhesive layer of the bundling protection tape sample.
An R contact based on ASTM D1894 is placed on the back of the bonded protective tape sample, and the dynamic friction coefficient is measured under conditions of a load of 200 g and a test speed of 2.5 mm/sec (room temperature 23° C., humidity 50% RH).

<Applications of bundling protection tape>
The bundling and protection tape according to this embodiment is suitably used, for example, as a bundling and protection tape for bundling high-voltage cables and wire harnesses in electric vehicles and hybrid vehicles.

The present invention will be explained in more detail below with reference to the following examples. Note that these examples are merely illustrative and are not intended to limit the scope of the present invention.

<Preparation of substrate>
<Materials used>
(1) Polyvinyl chloride resin: Vinyl chloride homopolymer, average polymerization degree 1000: Product name "TH-1000", manufactured by Taiyo Vinyl Co., Ltd. (2) Polyorganosiloxane: Acrylic-modified polyorganosiloxane copolymerized with methyl methacrylate on the side chain (weight average molecular weight 400,000): Product name "Chaline R-170S", manufactured by Nissin Chemical Industry Co., Ltd. Acrylic-modified polyorganosiloxane copolymerized with methyl methacrylate on the side chain (weight average molecular weight 200,000): Product name "Chaline R-175S", manufactured by Nissin Chemical Industry Co., Ltd. Linear polydimethylsiloxane: Product name "GENIOPLAST GUM", manufactured by Asahi Kasei Wacker Silicone Co., Ltd. Cross-linked polydimethylsiloxane (polyorganosiloxane in which linear polyorganosiloxane is cross-linked): Product name "KMP-597", manufactured by Shin-Etsu Chemical Co., Ltd. (3) Plasticizer Phthalate ester plasticizer, diisononyl phthalate: Product name "DINP", manufactured by J-Plus Corporation (4) Filler Calcium carbonate: Product name "Calcise (registered trademark) P", manufactured by Konoshima Chemical Co., Ltd.

Polyvinyl chloride resin, polyorganosiloxane, plasticizer, and filler were melt-kneaded in a Banbury mixer to uniformly disperse the components in the formulations shown in Tables 1 and 2, and then a substrate of the specified thickness was produced using a calendar molding machine at a roll temperature of 165°C.

<Preparation of bundling protection tape>
<Materials used>
(1) Substrate: Substrate prepared by the above process. (2) Primer layer: Mixture of graft polymer latex obtained by graft polymerizing natural rubber with methyl methacrylate and acrylonitrile butadiene copolymer emulsion: Product name KT4612A, manufactured by E-Tech Co., Ltd. (3) Adhesive layer: Mixture of 60 parts by mass (solid content) of natural rubber latex (manufactured by Regtex Co., Ltd., product name: HA LATEX), 40 parts by mass (solid content) of graft polymer latex obtained by graft polymerizing natural rubber with methyl methacrylate (manufactured by Regtex Co., Ltd., product name: MG-40S), and 135 parts by mass (solid content) of petroleum resin emulsion tackifier (manufactured by Arakawa Chemical Industries, Ltd., product name: AP-1100-NT).

A primer was applied to one side of the substrate using the gravure method, and the solvent was thoroughly removed in a drying oven. Then, the adhesive was applied using the comma method, and the solvent was thoroughly removed in the same manner as for the primer in a drying oven to produce a bundling protection tape. The dried thickness of the primer layer was 0.3 μm, and the dried thickness of the adhesive layer was 20 μm.

<Physical properties of substrate and bundling protection tape>
Measurements and evaluations of the physical properties of the substrate and the bundling protection tape were carried out under the measurement conditions shown below. The results are shown in Tables 1 and 2. In the tables, PVC stands for polyvinyl chloride resin, DINP stands for diisononyl phthalate, MMA stands for methyl methacrylate, and PDMS stands for polydimethylsiloxane.

<Dynamic friction coefficient of substrate surface>
Measurement was carried out using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd. according to the following procedure.
The substrate sample was cut to a width of 50 mm and a length of 100 mm, and fixed to a sample stage using double-sided tape (No. 5000NS, manufactured by Nitto Denko Corporation).
An R contact based on ASTM D1894 was placed on the backside of the bonded substrate sample, and the dynamic friction coefficient was measured under conditions of a load of 200 g and a test speed of 2.5 mm/sec (room temperature 23° C., humidity 50% RH).

<Dynamic friction coefficient on the back surface of the substrate of the bundling protection tape>
Measurement was carried out using an automatic friction and wear analyzer TS-501 manufactured by Kyowa Interface Science Co., Ltd. according to the following procedure.
The bundling protection tape sample was cut to a width of 50 mm and a length of 100 mm, and was attached and fixed to a sample stage via an adhesive layer.
An R contact based on ASTM D1894 was placed on the back of the bonded protective tape sample, and the dynamic friction coefficient was measured under conditions of a load of 200 g and a test speed of 2.5 mm/sec (room temperature 23° C., humidity 50% RH).

<Tensile modulus/Tensile modulus converted into thickness>
A 19 mm wide, 200 mm long binding tape test piece was clamped and fixed in the chucks of a tensile tester with a 100 mm inter-chuck distance. The test piece was pulled at a speed of 300 mm/min under an environment of room temperature 23°C and relative humidity 50% RH, and the tensile stress and strain were measured. The ratio of tensile stress to strain between 0.01 and 0.05% strain was calculated by linear regression and used as the tensile modulus.
The product of the tensile modulus and the total thickness of the tape (unit: mm) was taken as the tensile modulus converted into thickness.

<Hardness>
The durometer A hardness of the substrate samples stacked to a thickness of 6 mm or more was measured using an Asker rubber hardness tester Type A (type A indenter based on ASTM D2240) manufactured by Kobunshi Keiki Co., Ltd. (room temperature 23°C, humidity 50% RH).

<Protection performance>
The abrasion resistance was evaluated according to the following procedure.
The test was carried out in accordance with ISO 6722-1 (2001). The substrate sample was wrapped around a cylinder with a diameter of 10 mm twice and fixed with tape or the like. The sample surface was then abraded at a speed of 1500 mm/min using sandpaper with a hard material of fused alumina and a grain size of 150 μm. The abrasion distance (mm) until a hole was formed in the sample was measured (room temperature 23 ° C, humidity 50% RH). The abrasion distance (mm) until a hole was formed in the sample was evaluated according to the following criteria. A substrate with an excellent abrasion distance evaluation has high abrasion resistance, and it can be expected that excellent protective performance can be achieved in a bundling protection tape manufactured using the substrate.
◎: Wear distance is 1000 mm or more ○: Wear distance is 800 mm or more but less than 1000 mm ×: Wear distance is less than 800 mm

<Flexibility>
The wires were evaluated based on whether or not they floated when bound, according to the following procedure.
A bundling protection tape sample was spirally wound around two turns (half wrap) around bundles of electric wires with diameters of 15 mm and 10 mm to bind them. When this bundled electric wire was wound once around a mandrel with a diameter of 50 mm, the presence or absence of lifting (gaps due to peeling) between the bundling protection tape sample and the electric wire bundle was confirmed. The lifting between the bundling protection tape sample and the electric wire bundle was evaluated according to the following criteria.
◎: No floating occurred with either 15 mm or 10 mm wire diameter. ○: No floating occurred with 15 mm wire diameter, but floating occurred with 10 mm wire diameter. ×: Floating occurred with either 15 mm or 10 mm wire diameter.

<Film-forming properties of substrate>
The evaluation was carried out according to the following procedures and evaluation criteria.
When the substrate was formed into a film using a calendar molding machine, the presence or absence of plate-out of polyorganosiloxane on the surface and the presence or absence of adhesion of the substrate film to the surface of the rubber roll were observed.
⊚: Neither plate-out nor adhesion of the base film occurred. ○: Plate-out and adhesion of the base film occurred slightly, but to an extent that did not cause any problems in production. ×: Plate-out and adhesion of the base film occurred.

From the results in Tables 1 and 2, it can be seen that the bundling protection tape using the substrate of the Examples and the bundling protection tape of the Examples have an excellent balance of flexibility and protective performance. Furthermore, it can be seen that the substrate of the Examples has excellent film-forming properties. On the other hand, it can be seen that the bundling protection tape using the substrate of the Comparative Example and the bundling protection tape of the Comparative Example are inferior in one or more aspects of the balance between flexibility and protective performance and the film-forming properties of the substrate.

The bundling and protection tape of the present invention has an excellent balance of flexibility and protective performance, and also has excellent film-forming properties for the substrate. The bundling and protection tape of the present invention can be suitably used for bundling and protecting high-voltage cables in electric and hybrid vehicles, automotive wire harnesses, and other applications, and has industrial applicability.

Claims (9)

A binding and protection tape having a substrate and a pressure-sensitive adhesive layer formed on one side of the substrate,
the substrate is composed of a resin composition containing a polyvinyl chloride resin, a plasticizer, a filler, and a polyorganosiloxane;
In the resin composition, the content of the polyorganosiloxane is 1 to 10 parts by mass relative to 100 parts by mass of the polyvinyl chloride resin,
Binding protection tape. The substrate is fixed to a sample stage using double-sided tape No. 5000NS manufactured by Nitto Denko Corporation, and the dynamic friction coefficient of the surface of the substrate is 0.06 to 0.26, as measured using an R contactor based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm/sec.
The bundling and protection tape according to claim 1 . The bundling protection tape is fixed to a sample stage via the pressure-sensitive adhesive layer, and the dynamic friction coefficient of the back surface of the substrate of the bundling protection tape is measured using an R contactor based on ASTM D1894 under conditions of a load of 200 g and a test speed of 2.5 mm/sec, and is 0.13 to 0.60.
The bundling and protection tape according to claim 1 . A bundling protection tape described in any one of claims 1 to 3, wherein the polyorganosiloxane is an acrylic-modified polyorganosiloxane in which a (meth)acrylate is copolymerized to the side chain of the polyorganosiloxane. The bundling protection tape described in claim 4, wherein the weight average molecular weight of the acrylic-modified polyorganosiloxane is 300,000 to 500,000. A bundling protection tape described in any one of claims 1 to 3, wherein the content of the plasticizer in the resin composition is 38 to 50 parts by mass per 100 parts by mass of the polyvinyl chloride resin. A binding protection tape described in any one of claims 1 to 3, wherein the content of the filler in the resin composition is 10 to 60 parts by mass per 100 parts by mass of the polyvinyl chloride resin. A bundling protection tape described in any one of claims 1 to 3, wherein the thickness of the substrate is 190 to 330 μm. A bundling protection tape described in any one of claims 1 to 3, wherein the tensile modulus of elasticity converted into thickness of the substrate is 6 to 9 N/mm.