JP7746220B2 - Component Mounting System - Google Patents

Description

The present invention relates to a component mounting system equipped with a component mounter that mounts components on a board.

Conventionally, component mounting systems equipped with component mounters that mount electronic components (hereinafter simply referred to as "components") on substrates such as printed circuit boards to produce component-mounted boards have been known. The component mounters in this type of component mounting system are equipped with a mounting head that holds the components and mounts them on the board. The mounting head performs a component mounting operation by moving downward to a preset height position, thereby mounting the held components at the target mounting position on the board.

When a board is warped, tilted, or otherwise deformed, the height of the target mounting position on the board's top surface may differ for each target mounting position. For example, if a mounting head performs a component mounting operation corresponding to a target mounting position that is located at a height above the reference height on the board, there is a risk that the component held by the downward-moving mounting head may be pressed excessively against the board and damaged. Therefore, it has been proposed to measure the height of the board's top surface before the component mounting operation is performed, and then, based on the measurement results, control the component mounting operation of the mounting head so that the component is mounted with the appropriate amount of pressure against the board (see, for example, Patent Document 1).

JP 2016-111298 A

By the way, printed materials such as solder paste are printed on the boards on which components are to be mounted by component mounters. That is, the mounting head in a component mounter mounts components at target mounting positions on the board on which the printed material has been printed. In this case, to mount components with the appropriate push-in amount relative to the target mounting position on the board, it is necessary to control the component mounting operation of the mounting head based on the top surface height of the target mounting position on the board where the printed material is located nearby. However, it is difficult to accurately measure the top surface height of the target mounting position on the board where the printed material is located nearby. For this reason, it is difficult to mount components with the appropriate push-in amount relative to the target mounting position on the board.

The object of the present invention is to provide a component mounting system that can mount components with the appropriate amount of pressure relative to the target mounting position on the board.

A component mounting system according to one aspect of the present invention comprises a printing machine having a print head that prints printing material at multiple print target points within a component mounting area, including target mounting positions that indicate target positions for component mounting on the upper surface of a substrate, and a component mounter having a mounting head that performs a component mounting operation to mount components at the target mounting positions on the upper surface of the substrate after printing of the printing material. The printing machine further comprises a printing-side measurement unit that measures, on the upper surface of the substrate before printing of the printing material by the print head, a pre-printing mounting height that indicates the substrate upper surface height of the target mounting positions within the component mounting area, and a pre-printing reference height that indicates the substrate upper surface height at a predetermined reference position outside the component mounting area. The component mounter further includes a mounting-side measurement unit that measures a post-printing reference height indicating the substrate top surface height at the reference position on the top surface of the substrate after printing of the printing material, and a control unit that calculates a post-printing mounting height indicating the substrate top surface height at the target mounting position on the top surface of the substrate after printing of the printing material based on the pre-printing mounting height, the pre-printing reference height, and the post-printing reference height, and controls the component mounting operation of the mounting head based on the post-printing mounting height.

According to this component mounting system, a mounting head in a component mounter mounts components at target mounting positions on a board on which printing material has been printed by a printer. In the printer, a printing-side measurement unit measures a pre-printing mounting height corresponding to the target mounting position within the component mounting area and a pre-printing reference height corresponding to a reference position outside the component mounting area for the board before the printing material is printed. Meanwhile, in the component mounter, a mounting-side measurement unit measures a post-printing reference height corresponding to a reference position outside the component mounting area for the board after the printing material has been printed. Then, a control unit in the component mounter calculates a post-printing mounting height corresponding to the target mounting position on the board after the printing material has been printed, based on the pre-printing mounting height, pre-printing reference height, and post-printing reference height, and controls the component mounting operation of the mounting head based on this post-printing mounting height.

The post-printing mounting height is calculated based on the pre-printing mounting height and pre-printing reference height measured on the board before the printing material is printed, and the post-printing reference height measured on the board after the printing material has been printed. Therefore, the post-printing mounting height is an accurate indicator of the board top surface height corresponding to the target mounting position on the board after the printing material has been printed. Therefore, by the control unit controlling the component mounting operation of the mounting head based on the post-printing mounting height, components can be mounted with the appropriate push-in amount at the target mounting position on the board near the printing material.

In the above-mentioned component mounting system, the component mounter may further include a communication unit that acquires information regarding the pre-printing loading height and the pre-printing reference height.

In this aspect, the pre-printing mounting height and pre-printing reference height used by the control unit in the mounter when calculating the post-printing mounting height can be obtained by the communication unit.

In the above-mentioned component mounting system, the control unit may calculate the post-printing mounting height based on the difference between the pre-printing mounting height and the pre-printing reference height and the post-printing reference height.

In this aspect, the control unit in the mounter can easily calculate the post-printing mounting height based on the difference between the pre-printing mounting height measured on the board before printing of the printing material and the pre-printing reference height, and the post-printing reference height measured on the board after printing of the printing material.

In the above-described component mounting system, the printing-side measurement unit may measure, as the pre-printing reference height, a first pre-printing reference height and a second pre-printing reference height indicating the board top surface heights at a first reference position and a second reference position located on either side of the component mounting area on the top surface of the board before printing of the printing material. In this case, the mounting-side measurement unit measures, as the post-printing reference height, a first post-printing reference height and a second post-printing reference height indicating the board top surface heights at the first reference position and the second reference position on the top surface of the board after printing of the printing material. The control unit then calculates the post-printing mounting height on the top surface of the board after printing of the printing material based on the pre-printing mounting height, the first pre-printing reference height, the second pre-printing reference height, the first post-printing reference height, and the second post-printing reference height, and controls the component mounting operation of the mounting head based on the post-printing mounting height.

In this aspect, the printing-side measurement unit in the printing press measures, for the board before printing of the printing material, a pre-printing mounting height corresponding to the target mounting position within the component mounting area, and a first pre-printing reference height and a second pre-printing reference height corresponding to the first and second reference positions located on either side of the component mounting area, respectively. Meanwhile, the mounting-side measurement unit in the component mounter measures, for the board after printing of the printing material, a first post-printing reference height and a second post-printing reference height corresponding to the first and second reference positions located on either side of the component mounting area, respectively. The control unit in the component mounter then calculates a post-printing mounting height corresponding to the target mounting position on the board after printing of the printing material based on the pre-printing mounting height, first pre-printing reference height, second pre-printing reference height, first post-printing reference height, and second post-printing reference height, and controls the component mounting operation of the mounting head based on this post-printing mounting height.

The post-printing mounting height is calculated based on the pre-printing mounting height, first pre-printing reference height, and second pre-printing reference height measured on the board before the printing material is printed, and the first post-printing reference height and second post-printing reference height measured on the board after the printing material is printed. Therefore, the post-printing mounting height is an indicator that more accurately indicates the board top surface height corresponding to the target mounting position on the board after the printing material is printed. Therefore, by having the control unit control the component mounting operation of the mounting head based on the post-printing mounting height, components can be mounted with a more appropriate push-in amount at the target mounting position on the board near the printing material.

In the above-described component mounting system, the printing-side measurement unit and the mounting-side measurement unit may be laser length measuring devices that irradiate the upper surface of the substrate with laser light. The mounting target position within the component mounting area on the upper surface of the substrate is located between two of the printing target points, and the distance between the two printing target points is smaller than the spot diameter of the spot formed by the laser light on the upper surface of the substrate.

If the distance between two printing target points on the board that sandwich the target mounting position within the component mounting area is smaller than the spot diameter of the laser light emitted from the laser length measuring device, it is considered difficult to accurately measure the mounting height corresponding to the target mounting position using the laser length measuring device when the printing material is printed at the printing target point, due to the presence of the printing material in the optical path of the laser light. Therefore, for the board before the printing material is printed, the target mounting position within the component mounting area and the reference position outside the component mounting area are measured by the printing-side measurement unit, while for the board after the printing material is printed, the mounting-side measurement unit measures only the reference position, not the target mounting position. In this case, the post-printing mounting height corresponding to the target mounting position on the board after the printing material has been printed can be calculated based on the pre-printing mounting height and pre-printing reference height measured by the printing-side measurement unit and the post-printing reference height measured by the mounting-side measurement unit.

As described above, the present invention provides a component mounting system that can mount components with the appropriate amount of pressure relative to the target mounting position on the board.

1 is a diagram illustrating a schematic configuration of a component mounting system according to an embodiment of the present invention. FIG. 2 is a plan view showing the configuration of a printing machine provided in the component mounting system. FIG. 2 is a diagram illustrating a process performed by a print control unit of the printing press. FIG. 2 is a plan view showing the configuration of a component mounter provided in the component mounting system. FIG. 2 is an enlarged view of a mounting head unit of the component mounter. 10A and 10B are diagrams illustrating processing performed by a mounting control unit of a component mounter. 10A and 10B are diagrams illustrating a modified example of the processing performed by the print control unit of the printing press. 10A and 10B are diagrams illustrating a modified example of processing performed by a mounting control unit of a component mounter.

The component mounting system according to an embodiment of the present invention will be described below with reference to the drawings. Note that directional relationships will be described below using XY Cartesian coordinates, which are orthogonal to each other on a horizontal plane. The vertical direction, which is orthogonal to the X-axis direction and Y-axis direction, will be referred to as the Y-axis direction.

[Overall configuration of component mounting system]
1 , the component mounting system 100 according to this embodiment includes a printer 1 and a mounter 2 connected in a line, and a management device MU. The management device MU is configured, for example, by a personal computer, and is connected to the printer 1 and the mounter 2 so as to enable data communication. The management device MU receives information output from the printer 1 and transmits the received information to the mounter 2.

The component mounting system 100 does not necessarily have to include a management device MU. In this case, the printer 1 and mounter 2 are connected so that data communication is possible. Furthermore, the component mounting system 100 is not particularly limited in the number of mounters 2 installed; one mounter 2 may be installed, or two or more mounters 2 may be installed. Furthermore, the component mounting system 100 may also have a print inspection device installed downstream of the printer 1, a coating device installed downstream of the print inspection device, a coating inspection device installed downstream of the coating device, a mounting inspection device installed downstream of the mounter 2, a reflow device installed downstream of the mounting inspection device, and a reflow inspection device installed downstream of the reflow device.

[About the printing press]
The printer 1 provided in the component mounting system 100 will be described with reference to FIGS. 2 and 3 . The printer 1 is a device that prints a printing material 621 at a plurality of printing target points 62 within a component mounting area 6 on the upper surface of a substrate 5. The structure of the printer 1 is not particularly limited as long as it is capable of printing the printing material 621 at the printing target points 62 on the substrate 5. The printer 1 is, for example, a screen printer that prints the printing material 621 at the printing target points 62 on the substrate 5 using a mask with printing pattern holes formed therein. Note that the mask is not illustrated in FIGS. 2 and 3 . The printing material 621 is used to fix components to the printing target points 62 on the substrate 5, and examples of the printing material include a conductive paste such as solder paste. Furthermore, if an applicator is installed downstream of the printer 1 and upstream of the component mounter 2, the applicator applies a coating material such as an adhesive to fix the components within the component mounting area 6 on the substrate 5. The component mounting area 6 on the top surface of the substrate 5 is an area surrounding a plurality of mounting target positions 61, and within the component mounting area 6, a plurality of mounting target positions 61, a plurality of printing target points 62, a silk section 63, etc. are set. Each mounting target position 61 indicates a target position for mounting a component on the top surface of the substrate 5. Printing target points 62 are set to sandwich each mounting target position 61. In other words, each mounting target position 61 is located between two printing target points 62. The printing target points 62 indicate positions where printing material 621 is printed, and are, for example, lands such as copper foil to which terminal electrodes of the component are connected. The silk section 63 is a portion formed by silk printing.

As shown in FIG. 2, the printing machine 1 includes a main frame 11, a conveyor 12, a print head unit 13, a print control unit 17, and a print communication unit 18.

The main frame 11 is a structure on which the various components of the printing machine 1 are arranged, and is formed in a roughly rectangular shape when viewed in a plan view from the Z-axis direction. The conveyor 12 extends in the X-axis direction and is arranged on the main frame 11. The conveyor 12 is a transport unit that transports the substrate 5 in a transport direction along the X-axis direction. The substrate 5 is transported on the conveyor 12 and positioned at a predetermined work position (a printing position where printing material 621 is printed at each printing target point 62 on the substrate 5). The conveyor 12 transports the substrate 5 so that it is positioned at the printing position.

The print head unit 13 is mounted on a movable frame 14. The movable frame 14 extends in the X-axis direction and is supported by the main frame 11 so that it can move in the Y-axis direction. The movable frame 14 is moved in the Y-axis direction by a first drive mechanism 15. The first drive mechanism 15 is configured to include, for example, a drive motor, a ball screw shaft that extends in the Y-axis direction and is connected to the drive motor, and a ball nut that is mounted on the movable frame 14 and threadedly engages with the ball screw shaft. The first drive mechanism 15 configured in this way moves the movable frame 14 in the Y-axis direction as the ball nut advances and retreats along the ball screw shaft as the ball screw shaft is rotated and driven by the drive motor.

The print head unit 13 is mounted on the moving frame 14 so that it is movable in the X-axis direction. That is, the print head unit 13 is movable in the Y-axis direction as the moving frame 14 moves, and is movable in the X-axis direction along the moving frame 14. The print head unit 13 is moved along the moving frame 14 by the second drive mechanism 16. Similar to the first drive mechanism 15, the second drive mechanism 16 is configured to include, for example, a drive motor, a ball screw shaft extending in the X-axis direction and connected to the drive motor, and a ball nut mounted on the print head unit 13 and threadedly engaged with the ball screw shaft. The second drive mechanism 16 configured in this way moves the print head unit 13 in the X-axis direction as the ball nut advances and retreats along the ball screw shaft as the ball screw shaft is rotated and driven by the drive motor.

The print head unit 13 moves to each print target point 62 on the substrate 5, thereby performing a printing operation to print print material 621 at each print target point 62. The print head unit 13 is equipped with a print head 131. The print head 131 has a squeegee 1311 attached to its tip portion (lower portion). The print head 131 ejects the print material 621, thereby supplying the print material 621 to the upper surface of a mask (not shown) placed above the substrate 5. With the print material 621 supplied to the upper surface of the mask, the print head unit 13 moves so that the squeegee 1311 attached to the print head 131 slides over the upper surface of the mask. As a result, the print material 621 supplied from the print head 131 to the upper surface of the mask passes through the mask's printing pattern holes and is printed onto the print target points 62 on the substrate 5. That is, in the print head unit 13, the print head 131 ejects the printing material 621, printing it onto the printing target point 62 on the substrate 5 through the printing pattern holes in the mask. The print head 131 is movable in the Z-axis direction relative to the frame of the print head unit 13. While positioned at a printing reference position above the printing target point 62 on the substrate 5, the print head 131 moves downward until the tip of the squeegee 1311 reaches a predetermined height position, ejecting the printing material 621 and performing a printing operation to print the printing material 621 onto the printing target point 62. After printing the printing material 621, the print head 131 moves upward toward the printing reference position.

The print head unit 13 is equipped with a print-side measurement unit 132. As shown in FIG. 3, the print-side measurement unit 132 measures a pre-printing mounting height H1 and a pre-printing reference height H2 on the top surface of the substrate 5 before printing of the printing material 621 by the print head 131. The pre-printing mounting height H1 indicates the substrate top surface height of the mounting target position 61 within the component mounting area 6 on the substrate 5 before printing of the printing material 621. The pre-printing mounting height H1 is a measured value indicating the distance along the Z-axis direction from the reference height portion A1 of the print head 131 to the mounting target position 61 on the substrate 5 when the print head 131 is positioned at the printing reference position so that the print-side measurement unit 132 is positioned above the mounting target position 61 on the substrate 5. The pre-printing reference height H2 indicates the substrate top surface height of a predetermined reference position 64 outside the component mounting area 6 on the substrate 5 before printing of the printing material 621. The pre-printing reference height H2 is a measurement value that indicates the distance along the Z-axis direction from the reference height portion A1 of the print head 131 to the reference position 64 on the substrate 5 when the print head 131 is positioned at the print reference position so that the printing-side measurement unit 132 is positioned above the reference position 64 on the substrate 5.

In this embodiment, the printing-side measurement unit 132 is a laser length measuring device that measures the pre-printing loading height H1 and the pre-printing reference height H2 by irradiating the upper surface of the substrate 5 with laser light LB. In this case, the printing-side measurement unit 132 measures the pre-printing loading height H1 and the pre-printing reference height H2 by irradiating the upper surface of the substrate 5 with laser light LB and receiving the light reflected from the upper surface of the substrate 5.

The distance between two printing target points 62 on the substrate 5 that sandwich the mounting target position 61 within the component mounting area 6 is smaller than the spot diameter of the spot SP formed on the substrate 5 by the laser light LB irradiated from the printing-side measurement unit 132. In this case, when the printing material 621 is printed at the printing target point 62, it is considered difficult to accurately measure the mounting height corresponding to the mounting target position 61 using the printing-side measurement unit 132, due to the presence of the printing material 621 in the optical path of the laser light LB. Therefore, the printing-side measurement unit 132 measures the mounting target position 61 within the component mounting area 6 on the substrate 5 before printing of the printing material 621, and the reference position 64 outside the component mounting area 6.

The printing communication unit 18 transmits information regarding the pre-printing mounting height H1 and pre-printing reference height H2 measured by the printing side measurement unit 132 to the component mounter 2.

The print control unit 17 is composed of a CPU (Central Processing Unit), a storage area such as a HDD (Hard Disk Drive) or flash memory that stores the control program, and RAM (Random Access Memory) used as the CPU's working area. The print control unit 17 performs the height measurement process and printing process shown in Figure 3 by having the CPU execute the control program stored in the HDD or flash memory.

The print control unit 17 performs height measurement processing when the print-side measurement unit 132 measures the pre-printing mounting height H1 and the pre-printing reference height H2. When the print-side measurement unit 132 measures the pre-printing mounting height H1, the print control unit 17 controls the movement operation of the print head unit 13 so that the print head unit 13 moves toward the mounting target position 61 within the component mounting area 6 on the substrate 5 before printing of the printing material 621. When the print head 131 is positioned at the printing reference position so that the print-side measurement unit 132 is positioned above the mounting target position 61 on the substrate 5, the print control unit 17 controls the print-side measurement unit 132 to measure the pre-printing mounting height H1. Similarly, when the print-side measurement unit 132 measures the pre-printing reference height H2, the print control unit 17 controls the movement operation of the print head unit 13 so that the print head unit 13 moves toward the reference position 64 outside the component mounting area 6 on the substrate 5 before printing of the printing material 621. When the print head 131 is positioned at the print reference position so that the print-side measurement unit 132 is positioned above the reference position 64 on the substrate 5, the print control unit 17 controls the print-side measurement unit 132 to measure the pre-printing reference height H2.

The printing control unit 17 performs a printing process when the print head 131 ejects the printing material 621 and prints the printing material 621 at the printing target point 62 on the substrate 5 through the printing pattern holes in the mask. The mask is not shown in Figure 3. The printing control unit 17 controls the movement of the print head unit 13 so that the print head unit 13 moves toward the printing target point 62 in the component mounting area 6 on the substrate 5 before printing the printing material 621. When the print head 131 is positioned at a printing reference position that is higher than a mask (not shown) positioned above the substrate 5, the print control unit 17 moves the print head 131 downward until the tip of the squeegee 1311 reaches a predetermined height position based on the pre-printing mounting height H1. When the tip of the squeegee 1311 reaches the predetermined height position, the print control unit 17 ejects the printing material 621 from the print head 131 toward the mask and moves the print head unit 13 so that the squeegee 1311 slides over the top surface of the mask. As a result, the printing material 621 ejected from the print head 131 and supplied to the upper surface of the mask is printed onto the printing target points 62 on the substrate 5 through the printing pattern holes in the mask. Once the printing material 621 has been printed onto the printing target points 62 on the substrate 5, the print control unit 17 moves the print head 131 upward toward the printing reference position.

[About component mounters]
The board 5 on which the printing material 621 has been printed by the printer 1 is carried into the component mounter 2. This component mounter 2 will be described with reference to FIGS. 4 to 6 . The component mounter 2 is an apparatus that produces a component-mounted board by mounting components 7 at target mounting positions 61 within a component mounting area 6 on the upper surface of the board 5 after the printing material 621 has been printed. Note that, if a coating device is installed downstream of the printer 1, the component mounter 2 produces a component-mounted board by mounting components 7 at target mounting positions 61 within the component mounting area 6 on the upper surface of the board 5 after the printing material 621 has been printed and after an adhesive or other coating material has been applied by the coating device. As shown in FIG. 4 , the component mounter 2 includes a main frame 21, a conveyor 23, a component supply unit 24, a mounting head unit 25, a board support unit 28, a mounting control unit 30, and a mounting communication unit 31.

The main frame 21 is a structure on which the various components of the component mounter 2 are arranged, and is formed in a roughly rectangular shape in a plan view from the Z-axis direction. The conveyor 23 extends in the X-axis direction and is arranged on the main frame 21. The conveyor 23 transports the board 5 in the X-axis direction after printing with the printing material 621. The board 5 transported on the conveyor 23 stops at a predetermined work position (a component mounting position where components 7 are mounted on the board 5) and is positioned by the board support unit 28. The board support unit 28 positions the board 5 on the conveyor 23 by supporting the board 5 from below.

The component supply units 24 are arranged in regions on both ends of the main frame 21 in the Y-axis direction, sandwiching the conveyor 23. The component supply unit 24 is an area of the main frame 21 where multiple feeders 24F are installed side by side, and a set position for each feeder 24F is defined for each component 7 to be held by the mounting head 251 provided on the mounting head unit 25 (described below). The feeders 24F are detachably attached to the component supply unit 24. Each feeder 24F holds multiple components 7 and supplies the held components 7 to a predetermined component supply position set within the feeder. The component supply method of the feeder 24F is not particularly limited as long as it is configured to supply components 7. Examples of feeders 24F that can be used include tape feeders that use tape as a carrier to supply components 7, tray feeders that supply components 7 by moving a tray on which the components 7 are placed, and stick feeders that supply components 7 stored in a cylindrical stick by pushing the components 7 out of the stick.

The mounting head unit 25 is held by a moving frame 27. A fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotated by a Y-axis servo motor 263 are arranged on the main frame 21. The moving frame 27 is placed on the fixed rail 261, and a nut portion 271 provided on this moving frame 27 is threaded onto the ball screw shaft 262. The moving frame 27 also has a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by an X-axis servo motor 274. The mounting head unit 25 is movably held by this guide member 272, and a nut portion provided on this mounting head unit 25 is threaded onto the ball screw shaft 273. The moving frame 27 moves in the Y-axis direction due to operation of the Y-axis servo motor 263, and the mounting head unit 25 moves in the X-axis direction relative to the moving frame 27 due to operation of the X-axis servo motor 274. In other words, the mounting head unit 25 can move in the Y-axis direction in conjunction with the movement of the moving frame 27, and can also move in the X-axis direction along the moving frame 27. The mounting head unit 25 can move between the component supply unit 24 and the board 5 supported by the board support unit 28. By moving between the component supply unit 24 and the board 5, the mounting head unit 25 performs a component mounting operation to mount components 7 onto the board 5.

As shown in FIG. 5, the mounting head unit 25 has multiple mounting heads 251. Each mounting head 251 has a holding nozzle 2511 attached to its tip (lower end). The holding nozzle 2511 holds the component 7 supplied by the feeder 24F. The holding nozzle 2511 is a nozzle capable of suction-holding the component 7 supplied by the feeder 24F. The holding nozzle 2511 performs a component suction operation to suction-hold the component 7. The holding nozzle 2511 can be connected to either a negative pressure generator, a positive pressure generator, or the atmosphere via an electric switching valve. In other words, supplying negative pressure to the holding nozzle 2511 enables the holding nozzle 2511 to suction-hold the component 7, and then supplying positive pressure releases the suction-holding of the component 7. Each mounting head 251 performs a component mounting operation to mount a component 7 held by suction by a holding nozzle 2511 onto a substrate 5, corresponding to each of a plurality of target mounting positions 61 within a component mounting area 6 on the substrate 5. Each mounting head 251 obtains a component-mounted substrate by performing the component mounting operation on the substrate 5.

The mounting head 251 is movable in the Z-axis direction relative to the frame of the mounting head unit 25. The mounting head 251 moves downward while positioned at a mounting reference position above the mounting target position 61 on the board 5 after printing of the printing material 621, thereby performing a component mounting operation to mount the component 7 held by the holding nozzle 2511 at the mounting target position 61 on the board 5. After mounting the component 7, the mounting head 251 moves upward toward the mounting reference position.

As shown in FIG. 4, a first imaging unit 291 is installed on the main frame 21 between the component supply unit 24 and the conveyor 23, and a second imaging unit 292 is installed on the mounting head unit 25. The first imaging unit 291 and the second imaging unit 292 are imaging cameras equipped with imaging elements such as a CMOS (Complementary Metal-Oxide-Semiconductor) or a CCD (Charged-Coupled Device). While the mounting head unit 25 moves from the component supply unit 24 toward the board 5 supported by the board support unit 28, the first imaging unit 291 captures an image of the component 7 held by the holding nozzle 2511 of the mounting head 251 from below to obtain a component recognition image. The component recognition image is used to recognize the posture of the component 7 held by the holding nozzle 2511, the amount of deviation in the holding position of the component 7 relative to the holding nozzle 2511, etc. Before the mounting head 251 performs the component mounting operation, the second imaging unit 292 captures images of the marks from above in order to recognize the various marks affixed to the top surface of the board 5 supported by the board support unit 28. By recognizing the marks on the board 5 by the second imaging unit 292, the amount of positional deviation of the board 5 from the origin coordinates is detected.

The mounting head unit 25 is also equipped with a mounting-side measuring unit 293. As shown in FIG. 6, the mounting-side measuring unit 293 measures a post-printing reference height H3 on the top surface of the board 5 after printing of the printing material 621. The post-printing reference height H3 indicates the height of the board top surface at a predetermined reference position 64 outside the component mounting area 6 on the board 5 after printing of the printing material 621. The post-printing reference height H3 is a measured value indicating the distance along the Z-axis direction from the reference height portion A2 of the mounting head 251 to the reference position 64 on the board 5 when the mounting head 251 is positioned at the mounting reference position so that the mounting-side measuring unit 293 is positioned above the reference position 64 on the board 5.

In this embodiment, the mounting-side measurement unit 293 is a laser length measuring device that measures the post-printing reference height H3 by irradiating the upper surface of the substrate 5 with laser light LB. In this case, the mounting-side measurement unit 293 measures the post-printing reference height H3 by irradiating the upper surface of the substrate 5 with laser light LB and receiving the light reflected from the upper surface of the substrate 5.

As previously mentioned, the distance between two printing target points 62 on the board 5 that sandwich the mounting target position 61 in the component mounting area 6 is smaller than the spot diameter of the spot SP formed on the board 5 by the laser light LB irradiated from the mounting-side measurement unit 293. In this case, when the printing material 621 is printed at the printing target point 62, it is considered difficult to accurately measure the mounting height corresponding to the mounting target position 61 using the mounting-side measurement unit 293, due to the presence of the printing material 621 in the optical path of the laser light LB. Therefore, for the board 5 after printing the printing material 621, the mounting-side measurement unit 293 does not measure the mounting target position 61 within the component mounting area 6, but only measures the reference position 64 outside the component mounting area 6.

The mounting communication unit 31 receives and acquires information regarding the pre-printing loading height H1 and pre-printing reference height H2 transmitted from the printing communication unit 18 of the printing press 1.

The mounting control unit 30 is composed of a CPU, a storage area such as a HDD or flash memory that stores the control program, and RAM used as a working area for the CPU. The mounting control unit 30 performs the height measurement process and component mounting process shown in Figure 6 by the CPU executing the control program stored in the HDD or flash memory.

The mounting control unit 30 performs height measurement processing when the mounting side measurement unit 293 measures the post-printing reference height H3. When the mounting side measurement unit 293 measures the post-printing reference height H3, the mounting control unit 30 controls the movement operation of the mounting head unit 25 so that the mounting head unit 25 moves toward the reference position 64 outside the component mounting area 6 on the board 5 after printing of the printing material 621. When the mounting head 251 is positioned at the mounting reference position so that the mounting side measurement unit 293 is positioned above the reference position 64 on the board 5, the mounting control unit 30 controls the mounting side measurement unit 293 to measure the post-printing reference height H3.

The mounting control unit 30 performs a component mounting process when the mounting head 251 mounts a component 7 at a mounting target position 61 on the board 5. In this case, to mount the component 7 at the mounting target position 61 on the board 5 with the appropriate push-in amount, it is necessary to control the component mounting operation of the mounting head 251 based on the top surface height of the mounting target position 61 on the board 5 to which the printing material 621 is nearby. However, it is difficult to accurately measure the top surface height of the mounting target position 61 to which the printing material 621 is nearby on the board 5. For example, if the distance between two printing target points 62 on the board 5 that sandwich the mounting target position 61 within the component mounting area 6 is smaller than the spot diameter of the spot SP of the laser light LB irradiated from the mounting-side measurement unit 293, when the printing material 621 is printed at the printing target point 62, it is considered difficult to accurately measure the mounting height corresponding to the mounting target position 61 using the mounting-side measurement unit 293, due to the presence of the printing material 621 in the optical path of the laser light LB irradiated toward the board 5 and the optical path of the laser light LB reflected from the board 5. For this reason, it is difficult to place the component 7 at the target placement position 61 on the board 5 with the appropriate amount of pressure.

The mounting control unit 30 therefore calculates the post-printing mounting height H4 based on the pre-printing mounting height H1 and pre-printing reference height H2 acquired by the mounting communication unit 31 and the post-printing reference height H3 measured by the mounting-side measurement unit 293. The post-printing mounting height H4 indicates the height of the board's upper surface at the mounting target position 61 within the component mounting area 6 on the board 5 after printing of the printing material 621. The post-printing mounting height H4 is a calculated value indicating the distance along the Z-axis direction from the reference height portion A2 of the mounting head 251 to the mounting target position 61 on the board 5 after printing of the printing material 621. The post-printing mounting height H4 corresponding to the mounting target position 61 on the board 5 after printing of the printing material 621 can be calculated based on the pre-printing mounting height H1 and pre-printing reference height H2 measured by the printing-side measurement unit 132 and the post-printing reference height H3 measured by the mounting-side measurement unit 293.

Specifically, the mounting control unit 30 calculates the post-printing mounting height H4 based on the difference between the pre-printing mounting height H1 and the pre-printing reference height H2 and the post-printing reference height H3 according to the following formula (1).
H4=H3-(H2-H1)...(1)

This allows the mounting control unit 30 to easily calculate the post-printing mounting height H4 based on the difference between the pre-printing mounting height H1 and the pre-printing reference height H2 measured on the board 5 before printing the printing material 621, and the post-printing reference height H3 measured on the board 5 after printing the printing material 621.

The post-printing mounting height H4 is calculated based on the pre-printing mounting height H1 and pre-printing reference height H2 measured on the substrate 5 before printing of the printing material 621, and the post-printing reference height H3 measured on the substrate 5 after printing of the printing material 621. Therefore, the post-printing mounting height H4 is an index that accurately indicates the substrate top surface height corresponding to the mounting target position 61 on the substrate 5 after printing of the printing material 621.

Once the post-printing mounting height H4 has been calculated, the mounting control unit 30 controls the movement operation of the mounting head unit 25 so that the mounting head unit 25 moves toward the mounting target position 61 within the component mounting area 6 on the board 5 after printing of the printing material 621. Once the mounting head 251 is positioned at the mounting reference position so that the holding nozzle 2511 holding the component 7 is positioned above the mounting target position 61 on the board 5, the mounting control unit 30 controls the component mounting operation of the mounting head 251 based on the calculated post-printing mounting height H4, and moves the mounting head 251 downward so that the component 7 held by the holding nozzle 2511 is mounted at the mounting target position 61 on the board 5. Once the component 7 has been mounted at the mounting target position 61 on the board 5, the mounting control unit 30 moves the mounting head 251 upward toward the mounting reference position.

The mounting control unit 30 controls the component mounting operation of the mounting head 251 based on the post-printing mounting height H4, which serves as an index that accurately indicates the board top surface height corresponding to the target mounting position 61 on the board 5 after printing of the printing material 621. This allows the mounting head 251 to mount the component 7 with an appropriate amount of pressure onto the target mounting position 61 on the board 5 near the printing material 621. This prevents the component 7 held by the mounting head 251, which moves downward during the component mounting operation, from being pressed excessively against the board 5 and being damaged.

The component mounting system 100 according to an embodiment of the present invention has been described above, but the present invention is not limited to this, and the following modified embodiments can be adopted, for example.

In the above embodiment, a configuration has been described in which the printing-side measurement unit 132 in the printing machine 1 measures the pre-printing reference height H2, and the mounting-side measurement unit 293 in the component mounter 2 measures the post-printing reference height H3, corresponding to one reference position 64 outside the component mounting area 6 on the board 5. However, this configuration is not limited to this.

A modified embodiment will be described with reference to Figures 7 and 8. In this modified embodiment, as shown in Figure 7, the printing-side measurement unit 132 in the printing press 1 measures a pre-printing mounting height H1 corresponding to the target mounting position 61 in the component mounting area 6, and a first pre-printing reference height H21 and a second pre-printing reference height H22 as pre-printing reference heights H2, for the board 5 before printing of the printing material 621. The first pre-printing reference height H21 and the second pre-printing reference height H22 respectively indicate the board top surface heights at the first reference position 641 and the second reference position 642 located on either side of the component mounting area 6 on the board 5 before printing of the printing material 621. The first pre-printing reference height H21 indicates the board top surface height corresponding to the first reference position 641, and the second pre-printing reference height H22 indicates the board top surface height corresponding to the second reference position 642.

On the other hand, as shown in FIG. 8, the mounting side measurement unit 293 in the component mounter 2 measures the first post-printing reference height H31 and second post-printing reference height H32 as the post-printing reference height H3 for the board 5 after printing of the printing material 621. The first post-printing reference height H31 and second post-printing reference height H32 respectively indicate the board top surface heights at the first reference position 641 and second reference position 642 located on either side of the component mounting area 6 on the board 5 after printing of the printing material 621. The first post-printing reference height H31 indicates the board top surface height corresponding to the first reference position 641, and the second post-printing reference height H32 indicates the board top surface height corresponding to the second reference position 642.

Then, in the component mounter 2, the mounting control unit 30 calculates the post-printing mounting height H4 corresponding to the mounting target position 61 on the board 5 after printing of the printing material 621, based on the pre-printing mounting height H1, first pre-printing reference height H21, and second pre-printing reference height H22 measured by the printing-side measurement unit 132, and the first post-printing reference height H31 and second post-printing reference height H32 measured by the mounting-side measurement unit 293.

Specifically, the mounting control unit 30 calculates the post-printing mounting height H4 based on the pre-printing mounting height H1, the first pre-printing reference height H21, the second pre-printing reference height H22, the first post-printing reference height H31, and the second post-printing reference height H32 according to the following formula (2).
H4=H31+(H32-H31)×(H1-H21)/(H22-H21)
...(2)

The post-printing mounting height H4 is an indicator that more accurately indicates the substrate top surface height corresponding to the target mounting position 61 on the substrate 5 after printing of the printing material 621.

Then, the mounting control unit 30 controls the component mounting operation of the mounting head 251 based on the calculated post-printing mounting height H4, and moves the mounting head 251 downward so that the component 7 held by the holding nozzle 2511 is mounted at the target mounting position 61 on the board 5.

The mounting control unit 30 controls the component mounting operation of the mounting head 251 based on the post-printing mounting height H4, which serves as an index that accurately indicates the board top surface height corresponding to the mounting target position 61 on the board 5 after printing of the printing material 621. This allows the mounting head 251 to mount the component 7 with the appropriate push-in amount relative to the mounting target position 61 on the board 5 near the printing material 621.

REFERENCE SIGNS LIST 1 Printing machine 13 Print head unit 131 Print head 132 Printing side measurement unit 2 Component mounter 25 Mounting head unit 251 Mounting head 293 Mounting side measurement unit 30 Mounting control unit 31 Mounting communication unit 5 Board 6 Component mounting area 61 Mounting target position 62 Printing target point 621 Printing material 64 Reference position 641 First reference position 642 Second reference position 7 Component 100 Component mounting system H1 Mounting height before printing H2 Pre-printing reference height H21 First pre-printing reference height H22 Second pre-printing reference height H3 Post-printing reference height H31 First post-printing reference height H32 Second post-printing reference height H4 Post-printing mounting height

Claims (5)

a printing machine having a print head that prints a printing material at a plurality of print target points within a component mounting area, the print target points including a mounting target position that indicates a target position for mounting a component on an upper surface of a substrate;
a component mounter having a mounting head that performs a component mounting operation to mount components at the target mounting positions on the upper surface of the substrate after the printing material has been printed,
The printing press comprises:
a printing-side measurement unit that measures a pre-printing mounting height indicating the height of the substrate upper surface at the mounting target position within the component mounting area, and a pre-printing reference height indicating the height of the substrate upper surface at a predetermined reference position outside the component mounting area, on the upper surface of the substrate before printing of the printing material by the print head;
The component mounter includes:
a mounting-side measuring unit for measuring a post-printing reference height indicating the height of the substrate upper surface at the reference position on the upper surface of the substrate after printing of the printing material;
a control unit that calculates a post-printing mounting height that indicates the substrate upper surface height of the target mounting position on the upper surface of the substrate after printing of the printing material based on the pre-printing mounting height, the pre-printing reference height, and the post-printing reference height, and controls the component mounting operation of the mounting head based on the post-printing mounting height. The component mounting system described in claim 1, wherein the component mounter further includes a communication unit that acquires information regarding the pre-printing loading height and the pre-printing reference height. The component mounting system of claim 1, wherein the control unit calculates the post-printing mounting height based on the difference between the pre-printing mounting height and the pre-printing reference height and the post-printing reference height. the printing-side measurement unit measures, as the pre-printing reference height, a first pre-printing reference height and a second pre-printing reference height, which respectively indicate the heights of the board upper surface at a first reference position and a second reference position located on both sides of the component mounting area on the upper surface of the board before printing of the printing material;
the mounting-side measuring unit measures, as the post-printing reference height, a first post-printing reference height and a second post-printing reference height that indicate substrate upper surface heights at the first reference position and the second reference position, respectively, on the upper surface of the substrate after printing of the printing material;
2. The component mounting system of claim 1, wherein the control unit calculates the post-printing mounting height on the top surface of the substrate after printing of the printing material based on the pre-printing mounting height, the first pre-printing reference height, the second pre-printing reference height, the first post-printing reference height, and the second post-printing reference height, and controls the component mounting operation of the mounting head based on the post-printing mounting height. the printing-side measurement unit and the mounting-side measurement unit are laser length measuring devices that irradiate a laser beam onto an upper surface of the substrate,
the mounting target position in the component mounting area on the upper surface of the substrate is located between two of the printing target points;
5. The component mounting system according to claim 1, wherein the distance between the two print target points is smaller than the spot diameter of the spot formed by the laser light on the upper surface of the substrate.