JP7747489B2 - Fluid supply device and gas supply method - Google Patents

Description

The present invention relates to a fluid supply device used in a gas supply system for an electrostatic chuck device and a gas supply method using the same.

Conventionally, in semiconductor manufacturing processes using plasma processing equipment such as plasma etching equipment and plasma CVD equipment, electrostatic chuck devices are used to secure samples such as silicon wafers within a vacuum chamber. These electrostatic chuck devices include an attraction plate that attracts the object using electrostatic force and a metal base plate that contacts the back surface of the attraction plate. By using an electrostatic chuck device to attract the back surface (attached surface) of the silicon wafer with the attraction plate, the silicon wafer is secured in place and, for example, plasma heat applied to the silicon wafer is dissipated toward the base plate, cooling it and achieving a uniform surface temperature distribution.

The attracting surface of the chucking plate and the attracted surface of the silicon wafer have minute irregularities. Therefore, even when the silicon wafer is being attracted by the electrostatic chuck device, a minute space about 10 μm thick is created between the attracting surface and the attracted surface, reducing the physical contact area and reducing the efficiency of heat conduction. Therefore, a gas supply system equipped with multiple gas supply ports opening into the attracting surface of the chucking plate has been used to supply a thermally conductive gas (so-called backside gas) into the space between the attracted surface of the silicon wafer and the attracting surface of the chucking plate, thereby efficiently dissipating the plasma heat acting on the silicon wafer toward the chucking plate (Patent Document 1).

Japanese Patent Application Laid-Open No. 2020-053576

In the semiconductor manufacturing process using the above-mentioned plasma processing apparatus, there is a demand for increased uniformity in the surface temperature of objects such as wafers. The uniformity of this wafer surface temperature depends on the pressure and flow rate of the thermally conductive gas in multiple regions between the adsorption surface and the adsorption receiving surface. Therefore, it is desirable for the above-mentioned gas supply system to have multiple gas supply flow paths corresponding to each region, and for the flow rate and pressure of the thermally conductive gas flowing through these multiple flow paths to be individually adjusted by gas control equipment so that it can be supplied from each gas supply flow path.

In addition, in the above-mentioned gas supply system, if the pressure of the thermally conductive gas supplied to the backside of the wafer or the like is too high, there is a risk that the wafer will separate from the adsorption surface, so an exhaust flow path is usually provided to exhaust excess thermally conductive gas flowing through the gas supply flow path.

However, in semiconductor manufacturing equipment equipped with gas supply systems, the physical space available for installing these flow paths and gas control equipment is limited. Therefore, it is necessary to efficiently install multiple gas supply flow paths, exhaust flow paths, and various gas control devices in this limited space.

The present invention was made to meet the above-mentioned demands, and its main objective is to enable efficient arrangement of multiple flow paths and gas control devices in a gas supply system that supplies thermally conductive gas to the chucking surface of an electrostatic chuck device, thereby saving space.

That is, the fluid supply device according to the present invention is for supplying a thermally conductive gas to the chucking surface of an electrostatic chuck device, and includes a block body having multiple flow paths formed therein, with a gas control device installed midway through the path to control the thermally conductive gas flowing therethrough. The multiple flow paths are formed to form a two-layer structure within the block body, and of the multiple flow paths, multiple gas supply flow paths that supply a thermally conductive gas to the chucking surface are formed to form one layer of the two-layer structure, and exhaust flow paths that exhaust the thermally conductive gas from within the multiple gas supply flow paths are formed to form the other layer of the two-layer structure.

In this configuration, by integrating multiple gas supply flow paths, exhaust flow paths, and gas control devices into a block body, the entire fluid supply device can be made smaller. Furthermore, by forming multiple flow paths in a two-layer structure within the block body, with multiple gas supply flow paths forming one layer and exhaust flow paths forming the other layer, the total area occupied by each flow path in the block body can be reduced compared to when all of these flow paths are arranged in the same layer. Furthermore, by forming multiple gas supply flow paths and exhaust flow paths in two layers, the gas supply flow paths and exhaust flow paths can be closer together than when they are arranged in the same layer, thereby shortening the flow path length connecting them. Furthermore, by opening the ends of the flow paths connecting the two layers from the block body, for example, the design can be modified to allow fluid resistance elements such as ceramic restrictors to be inserted at any position. In this way, multiple flow paths and gas control devices can be efficiently arranged in a limited space, thereby saving space.

In this specification, "multiple flow paths are formed to form a two-layer structure inside the block body" means that, in a plan view from the device mounting surface of the block body where the gas control device is mounted, multiple flow paths are formed to allow the thermally conductive gas to flow in the in-plane direction and are offset from each other in the depth direction. The flow paths forming the two-layer structure may or may not have overlapping portions in a plan view.

In addition, in this specification, the phrase "multiple gas supply channels are formed to constitute one layer, and an exhaust channel is formed to constitute the other layer" does not preclude an exhaust channel being formed in one layer and a gas supply channel being formed in the other layer. In other words, it is intended to include a configuration in which a portion of an exhaust channel is formed to constitute one layer together with multiple gas supply channels, or a configuration in which a gas supply channel is formed to constitute the other layer together with a gas supply channel.

The gas supply device is preferably formed so that the plurality of gas supply channels and the exhaust channel overlap each other in a plan view.
This reduces the total area occupied by the flow paths in plan view, thereby achieving further space savings.

The gas supply device preferably has, within the block body, connecting passages that connect the gas supply passages and the exhaust passages to each other at overlapping portions of the passages.
In this way, each gas supply flow path and the exhaust flow path can be connected in the shortest distance, thereby achieving further space saving.

It is preferable that a portion of each of the gas supply flow paths opens onto the mounting surface of the block body on which the gas control device is mounted, and that a fluid resistance element is inserted into each of the gas supply flow paths from the opening on the mounting surface.
In this way, the flow path configuration of the gas supply device can be flexibly changed by, for example, changing the position of the fluid resistance element in accordance with the use or purpose of the gas supply system.

Specific examples of the fluid resistance element include a tubular member and a flow path forming member inserted into the tubular member to form a flow path that provides resistance.

It is preferable that the plurality of gas supply channels are connected to the inside of the block body, and that a common gas channel be formed to introduce the thermally conductive gas into the plurality of gas supply channels.
In this way, gas control devices such as pressure sensors that measure the pressure of the thermally conductive gas introduced into each gas supply flow path can be installed in the common gas flow path and made common rather than being installed individually in each gas supply flow path, which reduces the number of gas control devices attached to the block body and enables further space savings.

In a configuration including a common gas flow path, it is preferable that the gas supply flow paths are formed so as to branch out and extend to the left and right from the common gas flow path in a plan view.
In this way, when there are multiple gas supply passages, by forming the gas supply passages on the left and right of the common gas passage in a balanced manner, it is possible to reduce variations in the pressure and flow rate of the thermally conductive gas introduced into each gas supply passage. Furthermore, by forming the gas supply passages in a balanced manner on the left and right (for example, symmetrically) in this way, the overall size can be made compact, and the distance from each gas supply passage to the attraction surface of the electrostatic chuck device can be shortened. This effect becomes more pronounced as the number of gas supply passages increases.

It is preferable that outlet ports of the plurality of gas supply channels are provided on the opposing left and right side surfaces of the block body.
In this way, when there are many gas supply passages, the piping arrangement can be made simpler than when a plurality of outlet ports are all provided on one side surface.

It is preferable that the block body has a through hole formed therein for inserting a cable of a gas control device along the thickness direction, which is the direction in which the multiple flow paths forming the two-layer structure overlap.
In this way, the cable of the gas control device attached to one surface (for example, the top surface) of the block body can be passed through the through hole of the block body and connected to the control device, etc., provided on the underside, thereby enabling neater cable routing and further space savings.

Furthermore, a gas supply method of the present invention is a method for supplying a thermally conductive gas to an attracting surface of an electrostatic chuck device, and is characterized in that the thermally conductive gas is supplied to the attracting surface of the electrostatic chuck device using a fluid supply apparatus including a block body having a plurality of flow paths formed therein, the flow paths being configured to control the thermally conductive gas flowing therethrough by providing a gas control device therein, the plurality of flow paths being formed to form a two-layer structure within the block body, and among the plurality of flow paths, a plurality of gas supply flow paths for supplying a thermally conductive gas to the attracting surface are formed to form one layer of the two-layer structure, and an exhaust flow path for exhausting the thermally conductive gas from within the plurality of gas supply flow paths are formed to form the other layer of the two-layer structure.
Such a gas supply method can achieve the same effects as the fluid supply device of the present invention described above.

With this configuration, the present invention allows for efficient arrangement of multiple flow paths and gas control devices in a gas supply system that supplies thermally conductive gas to the chucking surface of an electrostatic chuck device, thereby saving space.

1 is a schematic diagram showing the overall configuration of an electrostatic chuck device and a gas supply system according to an embodiment of the present invention; FIG. 2 is a fluid circuit diagram of a gas supply system in the embodiment. FIG. 2 is a perspective view showing the overall configuration of the fluid supply device according to the embodiment. FIG. 2 is a schematic diagram illustrating the fluid supply device in the same embodiment, excluding a gas controller. FIG. 2 is a plan view showing the configuration of an internal flow path of the fluid supply device according to the embodiment. FIG. 2 is a flow isometric view of the fluid supply device according to the embodiment. FIG. 3 is a cross-sectional view showing the configuration of a common gas flow path and an exhaust flow path of the fluid supply device according to the embodiment. FIG. 3 is a cross-sectional view showing the configuration of a gas supply flow path of the fluid supply device in the embodiment. FIG. 3 is a perspective view schematically showing the configuration of a sub-exhaust flow path and a connecting flow path of the fluid supply device in the embodiment.

The fluid supply device 3 according to the present invention will be described below with reference to the drawings.

The fluid supply device 3 of this embodiment constitutes part of a gas supply system 2 for an electrostatic chuck device 1, which supplies a thermally conductive gas to the attraction surface 1s of the electrostatic chuck device 1, which attracts an object such as a wafer W by electrostatic force.

First, as shown in FIG. 1, this electrostatic chuck device 1 is placed in a vacuum chamber VC of, for example, a plasma-based semiconductor manufacturing device, for electrostatically attracting a wafer W to be processed. Specifically, this electrostatic chuck device 1 includes a circular, flat chucking plate 11 made of an insulator such as ceramic or glass, with an attracting surface 1s for electrostatically attracting the wafer W, an internal electrode 12 embedded in the chucking plate 11, and a power supply 13 for applying a voltage to the internal electrode 12. When the power supply 13 applies a voltage to the internal electrode 12, a dielectric polarization phenomenon occurs within the chucking plate 11, and the upper surface of the chucking plate 11 becomes a roughly planar attracting surface 1s. The vacuum chamber VC is configured to be evacuated by a vacuum pump.

Multiple suction areas are pre-defined on the suction surface 1s of the suction plate 11, and multiple gas supply ports 2p are formed in each suction area for blowing out thermally conductive gas. Each gas supply port 2p is formed by a through-hole that penetrates the suction plate 11 in the plate thickness direction.

The gas supply system 2 is used to supply a thermally conductive gas (so-called backside gas) to the space between the attracting surface 1s of the electrostatic chuck device 1 and the attracting surface of the wafer W. This gas supply system 2 is configured to supply a thermally conductive gas, the flow rate and pressure of which are individually adjusted for each region, from gas supply ports 2p provided in each attracting region. The thermally conductive gas may be a single gas such as helium gas or argon gas, or it may be any gas, such as a mixed gas of multiple gases mixed in any ratio.

This gas supply system 2 includes a fluid supply device 3 that adjusts the flow rate and pressure of the thermally conductive gas supplied from the gas supply source and supplies it to each attraction region of the electrostatic chuck device 1, and a control device C that controls each component of the fluid supply device 3. The fluid circuit structure of this fluid supply device 3, including peripheral circuits, will be described with reference to Figure 2.

This fluid supply device 3 is provided with a common gas flow path 31 through which a thermally conductive gas flows, multiple parallel gas supply flow paths 32 whose upstream ends are connected to the common gas flow path 31, exhaust flow paths 33 whose upstream ends are connected to the common gas flow path 31, and connecting flow paths 34 that connect each gas supply flow path 32 to the exhaust flow path 33. Gas control devices such as pressure sensors, fluid control valves, and on-off valves OV are arranged along each flow path.

The common gas flow path 31 introduces thermally conductive gas supplied from a gas supply source into each gas supply flow path 32. A gas introduction port Pi (also called an inlet port) is connected to the upstream end of the common gas flow path 31, and thermally conductive gas is delivered from the gas supply source via an external pipe connected to this gas introduction port Pi.

The common gas flow path 31 is configured to control the total flow rate of the thermally conductive gas introduced into each gas supply flow path 32. Specifically, the common gas flow path 31 is equipped with, in order from upstream, an on-off valve OV that opens and closes the flow path, a first fluid control valve FV1 that changes the flow rate of the thermally conductive gas flowing through the common gas flow path 31, and a first pressure sensor PS1 that measures the pressure of the thermally conductive gas introduced into each gas supply flow path 32. It can be said that the on-off valve OV, first fluid control valve FV1, and first pressure sensor PS1 are common to each gas supply flow path 32.

Each gas supply flow path 32 is provided corresponding to each adsorption region on the adsorption surface 1s. The upstream end of each gas supply flow path 32 is connected downstream of the first fluid control valve FV1 in the common gas flow path 31, and the downstream end is connected to a gas supply port Ps (also referred to as an outlet port). Each gas supply flow path 32 is configured to supply the thermally conductive gas introduced from the common gas flow path 31 to each adsorption region via an external pipe connected to the gas supply port Ps.

Each gas supply flow path 32 is provided, in this order from upstream, with a fluid resistance element R, a second pressure sensor PS2 that measures the pressure of the thermally conductive gas downstream of the fluid resistance element R, a second fluid control valve FV2 that changes the flow rate of the thermally conductive gas passing through, and a third pressure sensor PS3 that measures the pressure of the thermally conductive gas downstream of the second fluid control valve FV2.

The exhaust flow path 33 is used to exhaust excess thermally conductive gas flowing through the common gas flow path 31 and the gas supply flow path 32 at a predetermined flow rate. The upstream end of the exhaust flow path 33 is connected downstream of the first fluid control valve FV1 in the common gas flow path 31, and the downstream end is connected to the gas exhaust port Pe. The exhaust flow path 33 is configured to be exhausted by a vacuum pump attached to an external pipe connected to the gas exhaust port Pe. The exhaust flow path 33 is equipped with, in order from upstream to downstream, a fluid resistance element R, a fourth pressure sensor PS4 that measures the pressure of the thermally conductive gas downstream of the fluid resistance element R, a third fluid control valve FV3 that changes the flow rate of the thermally conductive gas passing through it, and a fifth pressure sensor PS5 that measures the pressure of the thermally conductive gas downstream of the third fluid control valve FV3.

The connecting flow path 34 is used to introduce a portion of the thermally conductive gas flowing through the gas supply flow path 32 into the exhaust flow path 33. Its upstream end is connected to the gas supply flow path 32 downstream of the second fluid control valve FV2, and its downstream end is connected to the exhaust flow path 33. A fluid resistance element R is provided in the connecting flow path 34.

The fluid resistance element R provided in each of the aforementioned flow paths provides resistance to the flow of thermally conductive gas, and has unique flow characteristics that determine the mass flow rate of the passing gas based on the primary pressure, secondary pressure, and gas temperature; for example, it is a laminar flow element resistor.

The first fluid control valve FV1, second fluid control valve FV2, and third fluid control valve FV3 provided in each of the above-mentioned flow paths change the flow rate of the thermally conductive gas flowing through each flow path by changing the valve opening in response to a control signal from the control device C. These valves may be, for example, piezoelectric actuator valves, solenoid actuator valves, or thermal actuator valves.

The control device C is a general-purpose or dedicated computer that incorporates a CPU, internal memory, etc., and performs at least the functions of a flow rate calculation unit C1 and a valve control unit C2 by the CPU and its peripheral devices working together based on a predetermined program stored in the internal memory.

The flow rate calculation unit C1 individually calculates the flow rate _Qin of the thermally conductive gas introduced from the common gas flow path 31 to each gas supply flow path 32, the flow rate _Qvac1 of the thermally conductive gas introduced from the common gas flow path 31 to the exhaust flow path 33, and the flow rate Qvac2 of the thermally conductive gas introduced from each gas supply flow path 32 to the exhaust flow path. Specifically, the flow rate calculation unit C1 is configured to calculate the flow rates Qin, _Qvac1 , and Qvac2 of the thermally conductive gas introduced into each flow path based on the inherent flow characteristics of the fluid resistance elements _R provided in each gas supply flow path ₃₂ and the primary side _pressure and secondary side pressure of each fluid resistance element R.

Specifically, the flow rate calculation unit C1 calculates the mass flow rate Qin based on a flow rate characteristic function indicating the flow rate characteristics of the fluid resistance elements R provided in the gas supply flow paths 32, the primary pressure acquired from the first pressure sensor PS1, and the secondary pressure acquired from the second pressure sensor _PS2 . This flow rate characteristic function is, for example, a map or the like expressed by a function having the primary pressure applied to the fluid resistance elements R, the secondary pressure applied to the fluid resistance elements R, and the temperature of the thermally conductive gas passing through the fluid resistance elements R as input variables, and the mass flow rate passing through the fluid resistance elements R as an output variable, and is stored in advance in a predetermined area of memory. The calculated mass flow rate _Qin is the mass flow rate of the thermally conductive gas passing through the fluid resistance elements R provided in each gas supply flow path 32.

The flow rate calculation unit C1 calculates the mass flow rate Q vac1 based on a flow rate characteristic function indicating the flow rate characteristics of the fluid resistance element R provided in the exhaust flow path 33, the primary side pressure acquired from the first pressure sensor PS1, and the secondary side pressure acquired _{from the fourth pressure sensor PS4. The calculated mass flow rate Q vac1 is} the mass flow rate of the thermally conductive gas passing through the fluid resistance element R provided in the exhaust flow path 33.

The flow rate calculation unit C1 calculates the mass flow rate Q vac2 based on a flow rate characteristic function indicating the flow rate characteristics of the fluid resistance element R provided in the connection flow path 34, the primary pressure acquired from the third pressure sensor PS3, and the secondary pressure acquired _{from the fifth pressure sensor PS5. The calculated mass flow rate Q vac2 is} the mass flow rate of the thermally conductive gas passing through the fluid resistance element R provided in the connection flow path 34.

The valve control unit C2 sends control signals to the first fluid control valve FV1, the second fluid control valve FV2, and the third fluid control valve FV3 to control the valve openings. Specifically, the valve control unit C2 compares the mass flow rates _Qin , _Qvac1 , and _Qvac2 calculated by the flow rate calculation unit C1 with predetermined target values set in advance for each mass flow rate, and feedback-controls the openings of the fluid control valves _FV1 , FV2, and FV3 so that the mass flow rates Qin, _Qvac1 , and _Qvac2 calculated by the flow rate calculation unit C1 coincide with the respective target values.

With this configuration, the thermally conductive gas supplied from the gas supply source is distributed from the common gas flow path 31 to each gas supply flow path 32, where the flow rate and pressure are adjusted and the gas is output from the corresponding gas supply port Ps. Excess thermally conductive gas flowing through the common gas flow path 31 and each gas supply flow path 32 is introduced into the exhaust flow path 33 and exhausted via the gas exhaust port Pe.

Next, the physical configuration of this fluid supply device 3 will be explained using Figures 3 to 9.

The gas supply device, this fluid supply device 3, is an integrated type in which multiple flow paths and gas control devices are integrated. Specifically, this gas supply device comprises a block body 4 in which flow paths such as the common gas flow path 31, gas supply flow path 32, exhaust flow path 33, and connection flow path 34 are formed, each gas control device attached to the block body 4, and additional piping fixtures that form a gas inlet port Pi, gas supply port Ps, and gas exhaust port Pe.

As shown in Figures 3 to 5, the block body 4 is made of resin and has a roughly plate-like shape. The top surface 41 of the block body 4 is rectangular in plan view (or top view) and functions as an equipment mounting surface on which each gas control device is mounted. Specifically, this top surface 41 is formed with multiple valve mounting portions MV0 to MV3 (e.g., recesses) for mounting each fluid control valve and on-off control valve, and multiple sensor mounting portions MS1 to MS5 (e.g., recesses) for mounting each pressure sensor PS1 to PS5. These mounting portions are arranged in a matrix (i.e., a grid pattern along the vertical and horizontal directions), with the direction along one pair of opposing side surfaces of the block body 4 in plan view being the vertical direction (the up-down direction in Figure 5) and the direction along the other pair of opposing side surfaces being the horizontal direction (the left-right direction in Figure 5). More specifically, these mounting portions are arranged at equal intervals along the vertical direction and are symmetrical about the center line of the block body 4 in the horizontal direction.

The aforementioned accessory piping fixtures are attached to the side surfaces of the block body 4. Specifically, multiple accessory piping fixtures (here, a total of 12) are attached to a pair of opposing vertical side surfaces of the block body 4. In plan view, the multiple accessory piping fixtures are formed on both the left and right sides, equally spaced vertically and symmetrically, with the same number (six on each side). Of the multiple accessory piping fixtures, one functions as a gas inlet port Pi, another as a gas exhaust port Pe, and the remaining ten function as gas supply ports Ps. In this example, the upper left accessory piping fixture in plan view functions as a gas inlet port Pi, and the upper right accessory piping fixture functions as a gas exhaust port Pe.

As shown in Figure 5, each flow path is formed in a generally linear fashion along the vertical and horizontal directions in a plan view. Each flow path also has a partial opening at the valve mounting portions MV0-MV3 and sensor mounting portions MS1-MS5 on the top surface 41 of the block body 4, and a fluid control valve or pressure sensor is attached to cover this opening.

As shown in Figures 5 and 6, the common gas flow path 31 includes an inlet flow path portion 311 that extends horizontally from the gas inlet port Pi to the center of the block body 4, and a central flow path portion 312 that is connected to the inlet flow path portion 311 at the center of the block body 4 and extends vertically. As shown in Figure 7, the common gas flow path 31 is formed to communicate between the gas inlet port Pi, valve mounting portions MV0 and MV1 that mount the on-off valve OV and the first fluid control valve FV1, sensor mounting portion MS1 that mounts the first pressure sensor PS1, and the central flow path portion 312.

Each gas supply flow path 32 branches off to the left and right from the central flow path portion 312 of the common gas flow path 31 in the horizontal direction, and its downstream end is connected to the corresponding gas supply port Ps. The gas supply flow paths 32 are arranged parallel to each other in the horizontal direction and at equal intervals in the vertical direction.

As shown in FIG. 8, each gas supply flow path 32 is formed to communicate the central flow path portion 312 of the common gas flow path 31, the sensor mounting portions MS2 and MS3 for mounting the second pressure sensor PS2 and the third pressure sensor PS3, the valve mounting portion MV2 for mounting the second fluid control valve FV2, and the gas supply port Ps. Furthermore, in each gas supply flow path 32, the aforementioned fluid resistance element R is provided between the central flow path portion 312 and the sensor mounting portion MS2 corresponding to the second pressure sensor PS2.

Specifically, this fluid resistance element R is composed of a tubular member made of resin, metal, or the like, and a flow path forming member that is inserted into this tubular member to form a flow path that acts as a resistance (hereinafter also referred to as a resistance flow path). This flow path forming member is cylindrical and made of, for example, ceramic, and the resistance flow path is linear, for example, with a circular cross section, penetrating the flow path forming member in the axial direction. This fluid resistance element R is then inserted and attached (inserted) through the opening of each gas supply flow path 32 formed in the sensor mounting portion MS2 corresponding to the second pressure sensor PS2.

In the fluid supply device 3 of this embodiment, multiple internal flow paths are formed in a two-layer structure, upper and lower, along the thickness direction of the block body 4. More specifically, the multiple gas supply flow paths 32 are formed to constitute one layer (upper layer), and the exhaust flow path 33 is formed to constitute the other layer (lower layer).

As shown in Figures 5 and 6, the exhaust flow path 33 has a main exhaust flow path section 331 whose upstream end is connected to the central flow path section 312 and whose downstream end is connected to the gas exhaust port Pe, a secondary exhaust flow path section 332 that extracts a portion of the thermally conductive gas flowing through each gas supply flow path 32 and directs it to the main exhaust flow path section 331, and a communication flow path section 333 that connects these. Of the exhaust flow paths 33, the main exhaust flow path section 331 is formed to form an upper layer together with the common gas flow path 31 and the gas supply flow path 32, and the secondary exhaust flow path section 332 is formed to form a lower layer.

In a plan view, the main exhaust flow path section 331 is formed in a substantially linear shape along the horizontal direction from the center of the block body 4 toward the gas exhaust port Pe. This main exhaust flow path section 331 is formed symmetrically with the inlet flow path section 311, with the central flow path section 312 as the axis of symmetry, and is formed parallel to each of the gas supply flow paths 32. As shown in FIG. 7 , the main exhaust flow path section 331 is formed to communicate with the central flow path section 312, the valve mounting section MV3 for mounting the third fluid control valve FV3, the sensor mounting sections MS4 and MS5 for mounting the fourth pressure sensor PS4 and the fifth pressure sensor PS5, and the gas exhaust port Pe. A fluid resistance element R is provided between the sensor mounting section MS4 corresponding to the fourth pressure sensor PS4 in this main exhaust flow path section 331 and the central flow path section 312. Similar to the fluid resistance element R in the gas supply flow path 32, this fluid resistance element R is inserted and attached through an opening in the main exhaust flow path section 331 formed in the sensor mounting section MS4 corresponding to the fourth pressure sensor PS4.

As shown in Figures 6, 8, and 9, the sub-exhaust passage section 332 is formed below each gas supply passage 32 in the thickness direction of the block body 4 and is formed to overlap (specifically, intersect) with all of the multiple gas supply passages 32 in a plan view. Specifically, the sub-exhaust passage section 332 has an inlet passage section 332a into which thermally conductive gas flows from the multiple gas supply passages 32. This inlet passage section 332a is formed approximately linearly along the vertical direction in a plan view and intersects with each of the multiple gas supply passages 32 by cutting through the multiple gas supply passages 32. Here, the sub-exhaust passage section 332 has two inlet passage sections 332a formed symmetrically on either side of the central passage section 312, and each inlet passage section 332a intersects with the gas supply passages 32 branching to the left and right from the central passage section 312. In a plan view, the inlet passage section 332a overlaps (intersects with) each gas supply passage 32 at the sensor mounting section MS3 corresponding to the third pressure sensor PS3. That is, the inflow passage 332a is formed to pass directly below the sensor mounting portion MS3 corresponding to the third pressure sensor PS3.

The communicating flow passage 333 connects the main exhaust flow passage 331, which constitutes the upper layer, with the sub-exhaust flow passage 332, which constitutes the lower layer, and is specifically composed of a substantially straight flow passage formed along the thickness direction of the block body 4, as shown in Figure 7. In plan view, the main exhaust flow passage 331 and the sub-exhaust flow passage 332 overlap at the sensor mounting portion MS5 corresponding to the fifth pressure sensor PS5, and the communicating flow passage 333 is formed in this overlapping area.

The auxiliary exhaust flow path section 332 of the exhaust flow path 33 and each gas supply flow path 32 are connected at their overlapping portions (here, intersections) by the aforementioned connecting flow paths 34. Specifically, as shown in Figures 8 and 9, this connecting flow path 34 is configured as a substantially straight pipe-shaped flow path formed along the thickness direction of the block body 4. The lower end of this connecting flow path 34 along the thickness direction is connected to the auxiliary exhaust flow path section 332, and the upper end opens to a sensor mounting portion MS3 on the top surface 41 of the block body 4 that corresponds to the third pressure sensor PS3. A fluid resistance element R is provided in this connecting flow path 34. Similar to the fluid resistance element R in the gas supply flow path 32 and the main exhaust flow path section 331, this fluid resistance element R is inserted and attached through an opening in the main exhaust flow path section 331 that is formed in the sensor mounting portion MS3 that corresponds to the third pressure sensor PS3.

In addition, the block body 4 of this embodiment is provided with a cable insertion portion 5 for inserting the cables of each gas control device attached to the upper surface 41 to the lower surface side. This cable insertion portion 5 includes a first cable insertion portion 51 for inserting the cables of each control device corresponding to the gas supply flow path 32, and a second cable insertion portion 52 for inserting the cables of each control device corresponding to the common gas flow path 31 and the exhaust flow path 33.

Specifically, the first cable insertion portion 51 is a through-hole formed to penetrate vertically along the thickness direction of the block body 4. As shown in FIG. 5 , this first cable insertion portion 51 is an elongated hole extending horizontally in a plan view, and is formed to be parallel to each gas supply flow path 32. Each first cable insertion portion 51 is formed between each gas supply flow path 32.

The second cable insertion section 52 is a notched groove (recess) formed in the side surface of the block body 4 near the common gas flow path 31 and the exhaust flow path 33. This notched groove is formed on the side surface of the block body 4 from the upper surface 41 to the lower surface.

With the fluid supply device 3 of this embodiment configured as described above, the integration of the multiple gas supply flow paths 32, exhaust flow paths 33, and gas control devices allows the entire fluid supply device 3 to be miniaturized. Furthermore, the multiple flow paths are formed in a two-layer structure inside the block body 4, with the multiple gas supply flow paths 32 forming one layer and the exhaust flow paths 33 forming the other layer. This reduces the total area occupied by each flow path in the block body 4 compared to when all of these flow paths are arranged in the same layer. Furthermore, by forming the multiple gas supply flow paths 32 and exhaust flow paths 33 in two layers, the gas supply flow paths 32 and exhaust flow paths 33 can be placed closer to each other than when they are formed in the same layer, thereby shortening the length of the flow paths connecting them. In this way, the multiple flow paths and gas control devices can be efficiently arranged in a limited space, thereby saving space.

In addition, multiple gas supply flow paths 32 and exhaust flow paths 33 are formed so that they overlap in a plan view, and connecting flow paths 34 are formed at these overlapping areas to connect these flow paths to each other. This allows each gas supply flow path 32 and exhaust flow path 33 to be connected over the shortest distance, thereby further reducing space.

Note that the present invention is not limited to the above embodiment.

For example, in the above embodiment, the number and positions of pressure sensors and fluid control valves in each flow path are shown as examples, and in other embodiments, they may be arranged in different positions and in different numbers. Furthermore, while the fluid supply device 3 in the above embodiment had only one common gas flow path 31 that introduces thermally conductive gas into each gas supply flow path 32, multiple common gas flow paths 31 may be provided. Furthermore, the fluid supply device 3 in other embodiments may have multiple exhaust flow paths 33.

In addition, in the above embodiment, the flow paths are configured so that the upper left accessory piping fixture functions as the gas inlet port Pi and the upper right accessory piping fixture functions as the gas exhaust port Pe when viewed from above the block body 4, but this is not limited to this. In other embodiments, the flow paths may be configured so that different accessory piping fixtures function as the gas inlet port Pi and the gas exhaust port Pe.

In addition, in the above embodiment, the communicating flow path portion 333 and the connecting flow path 34 were formed along the thickness direction of the block body 4, but this is not limited to this. In other embodiments, the communicating flow path portion 333 and the connecting flow path 34 may be formed so as to be inclined with respect to the thickness direction, as long as they can communicate between the upper layer and the lower layer.

In addition, in the above embodiment, the sub-exhaust flow path portion 332 is formed so as to intersect with all of the multiple gas supply flow paths 32 at their overlapping portions in a plan view, but this is not limited to this. In other embodiments, the sub-exhaust flow path portion 332 may be formed so as to face in the same direction as some or all of the multiple gas supply flow paths 32 at their overlapping portions in a plan view.

In addition, in the above embodiment, the exhaust flow path portion 332 was formed so as to overlap with all of the multiple gas supply flow paths 32 in a plan view, but in other embodiments, it may be formed so as to overlap with only some of the gas supply flow paths 32.

In other embodiments, the block body 4 may not be provided with a cable insertion portion 5.

It goes without saying that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the invention.

DESCRIPTION OF SYMBOLS 1 Electrostatic chuck device 2 Gas supply system 3 Fluid supply device 31 Common gas flow path 32 Gas supply flow path 33 Exhaust flow path 4 Block body

Claims (10)

A fluid supply device for supplying a thermally conductive gas to an attracting surface of an electrostatic chuck device, the fluid supply device including a block body having a plurality of flow paths formed therein, the flow paths being configured so that a gas control device is provided midway and the thermally conductive gas flowing therethrough can be controlled,
The plurality of flow paths are formed to form a two-layer structure inside the block body, and among the plurality of flow paths,
a plurality of gas supply channels for supplying a thermally conductive gas to the adsorption surface are formed so as to constitute one layer of the two-layer structure;
an exhaust flow path that exhausts the thermally conductive gas in the plurality of gas supply flow paths is formed so as to constitute the other layer of the two-layer structure;
a plurality of connection flow paths are formed in the block body, the connection flow paths connecting each of the plurality of gas supply flow paths to the exhaust flow path;
A fluid supply device in which a fluid resistance element having a ceramic flow path forming member that forms a flow path that acts as a resistance is disposed in at least one of the gas supply flow path and the connecting flow path . The fluid supply device according to claim 1, wherein the plurality of gas supply channels and the exhaust channel are formed so as to overlap in a plan view. 3. The fluid supply device according to claim 2, wherein the connecting flow passages are formed in the block body at overlapping portions between the gas supply flow passages and the exhaust flow passages. a portion of each of the gas supply channels opens to a mounting surface of the block body to which the gas control device is attached,
4. The fluid supply device according to claim 1, wherein the fluid resistance elements are inserted into the gas supply flow paths from openings on the mounting surface. 5. The fluid supply device according to claim 4, wherein the fluid resistance element includes a tubular member and the flow path forming member inserted into the tubular member. A fluid supply device according to any one of claims 1 to 5, wherein the plurality of gas supply channels are connected inside the block body, and a common gas channel is formed to introduce the thermally conductive gas into the plurality of gas supply channels. The fluid supply device according to claim 6, wherein, in a plan view, the gas supply flow paths are formed so as to branch out and extend to the left and right from the common gas flow path. A fluid supply device as described in claim 7, wherein outlet ports for the multiple gas supply channels are provided on the opposing left and right side surfaces of the block body. A fluid supply device according to any one of claims 1 to 8, wherein the block body has a through-hole formed in the thickness direction, i.e., the direction in which the multiple flow paths forming the two-layer structure overlap, for passing a cable of a gas control device through. A method for supplying a thermally conductive gas to an adsorption surface of an electrostatic chuck device,
A fluid supply device including a block body having a plurality of flow paths formed therein, the flow path being configured so that a gas control device is provided midway and the thermally conductive gas flowing therethrough can be controlled,
The plurality of flow paths are formed to form a two-layer structure inside the block body, and among the plurality of flow paths,
a plurality of gas supply channels for supplying a thermally conductive gas to the adsorption surface are formed so as to constitute one layer of the two-layer structure;
an exhaust flow path that exhausts the thermally conductive gas in the plurality of gas supply flow paths is formed so as to constitute the other layer of the two-layer structure;
a plurality of connection flow paths are formed in the block body, the connection flow paths connecting each of the plurality of gas supply flow paths to the exhaust flow path;
a fluid supply device in which a fluid resistance element having a ceramic flow path forming member that forms a flow path that serves as resistance is disposed in at least one of the gas supply flow path and the connecting flow path , and the thermally conductive gas is supplied to the attracting surface of the electrostatic chuck device.