JP7748819B2 - Processing data creation device - Google Patents

Description

The present invention relates to a processing data creation device .

Patent Document 1 discloses a processing system equipped with a processing machine that performs laser cutting using a laser beam emitted from a processing head. The processing machine can cut out a product from a workpiece by irradiating the workpiece with a laser beam along an outline cutting line for cutting out the product's outline. This processing machine can irradiate the workpiece with the laser beam in two dimensions by combining movement of the workpiece along a first axis direction with movement of the processing head along a second axis direction perpendicular to the first axis direction.

The products cut from the workpiece are removed by the product discharge device and transported to a designated loading location.

Japanese Patent Application Laid-Open No. 2006-192465

However, when laser cutting using such a processing system, depending on the final cutting path, which is the last cut by the laser beam along the outline cutting line, the product may shift and fall under the workpiece during processing. Furthermore, if the length of the final cutting path is short, the rigidity of the uncut portion before the final cutting path is low, which can result in processing defects such as waviness when cutting along the final cutting path. This can cause the product to get caught on the remaining workpiece material when being removed, making it impossible to remove the product stably.

One aspect of the present invention is a processing data creation device that creates processing data for a processing system that performs laser cutting to cut a plate-shaped workpiece to produce a product. The processing system includes a processing machine that two-dimensionally irradiates the workpiece with a laser beam output from the processing head by combining movement of the workpiece in a first axial direction along the workpiece plane and movement of the processing head in a second axial direction along the workpiece plane, perpendicular to the first axial direction, to cut the workpiece according to the shape of the product, and a product removal device that moves to a first side, which is one side of the first axial direction, and advances toward the processing head to remove the cut product from the workpiece. The processing data creation device includes an acquisition unit that acquires product data including the shape of the product, a cutting line setting unit that sets an outline cutting line for cutting the outline of the product from the workpiece based on the product data, and an allocation setting unit that allocates a cutting path of the laser beam to the outline cutting line to create product processing data. The allocation setting unit identifies, as a reference line segment, a line segment on the first side of the outline cutting line in the first axis direction that is parallel to the second axis direction and has a length equal to or greater than the determined length, and allocates, to the reference line segment, the final cutting path, which is the path along which the laser beam last cuts on the outline cutting line.

A machining data creation device according to one embodiment of the present invention assigns the final cutting path to a line segment (reference line segment) that is parallel to the second axis direction and long among the line segments on the first side of the outline cutting line in the first axis direction. Because the length of the final cutting path is longer, the rigidity of the uncut portion before cutting along the final cutting path increases. As a result, it is possible to prevent machining defects such as waviness from occurring when cutting along the final cutting path. Furthermore, because the final cutting path is parallel to the Y-axis direction, when cutting along the final cutting path, the machining head only moves in the second axis direction, and the workpiece does not move in the first axis direction. Therefore, it is possible to prevent the product from shifting and slipping under the workpiece during machining.

According to one aspect of the present invention, the product can be transported stably without getting caught on the remaining workpiece.

FIG. 1 is a block diagram showing the configuration of a processing data generating device and a processing system according to this embodiment. FIG. 2 is an explanatory diagram showing a simplified configuration of the laser processing unit provided in the processing machine. FIG. 3 is an explanatory diagram showing a simplified configuration of a product carrying-out device provided in the processing system. FIG. 4 is an explanatory diagram of the outline cutting line. FIG. 5 is an explanatory diagram showing a method for allocating a cutting path of a laser beam to an outline cutting line. FIG. 6 is an explanatory diagram showing the setting of the relief. FIG. 7 is an explanatory diagram showing the laser cutting method according to this embodiment. FIG. 8 is an explanatory diagram showing the shape of a product in which no reference line segment exists in the outline cutting line.

The processing data creation device and laser cutting method according to this embodiment will be described below with reference to the drawings.

Figure 1 is a block diagram showing the configuration of a processing data creation device and a processing system according to this embodiment. Figure 2 is a simplified explanatory diagram showing the configuration of a laser processing unit provided in a processing machine. Figure 3 is a simplified explanatory diagram showing the configuration of a product discharge device provided in a processing machine. In the following explanation, directions are defined as the X-axis direction (first axis) and the Y-axis direction (second axis), which are orthogonal to the horizontal direction, and the Z-axis direction, which is orthogonal to the X-axis and Y-axis directions. The X-axis direction corresponds to the left-right direction, with one side being the left side (first side) and the other side opposite the one side being the right side (second side). The Y-axis direction corresponds to the front-to-back direction, with one side being the front side and the other side being the rear side. The Z-axis direction corresponds to the up-down direction, with one side being the top side and the other side being the bottom-rear side. Note that these directions are used merely for convenience of explanation.

The processing data creation device 21 according to this embodiment creates processing data for a processing system 40 that performs laser cutting processing to cut a plate-shaped workpiece (e.g., sheet metal) W to produce a product P. The processing system 40 includes a processing machine 50 that two-dimensionally irradiates the workpiece W with a laser beam output from the processing head 52a by combining movement of the workpiece W in the X-axis direction along the workpiece plane and movement of the processing head 52a in the Y-axis direction along the workpiece plane, which is perpendicular to the X-axis direction, to cut the workpiece W according to the shape of the product P, and a product removal device 60 that moves to the left in the X-axis direction and advances toward the processing head 52a to remove the cut product P from the workpiece W.

The processing data creation device 21 includes an acquisition unit 21a that acquires product data including the shape of the product P; a cutting line setting unit 21b that sets an outline cutting line CL for cutting out the outline of the product P from the workpiece W based on the product data; and an allocation setting unit 21c that allocates a laser beam cutting path to the outline cutting line CL to create processing data for the product P. The allocation setting unit 21c identifies, as a reference line segment CLs, a line segment that is parallel to the Y axis and has a length equal to or greater than a reference line segment CLs, among the line segments on the left side of the X axis direction on the outline cutting line CL. The allocation setting unit 21c allocates, to the reference line segment CLs, a final cutting path Rcf, which is the path along which the laser beam will last cut on the outline cutting line CL.

The following describes the overall system that includes the machining data creation device and machining system. The overall system is primarily composed of a CAD (Computer Aided Design) 10, a CAM (Computer Aided Manufacturing) 20, a control device 30, and a machining machine 50.

CAD 10 is a computer equipped with CAD functions. CAD 10 is composed of a computer having a hardware processor such as a CPU (Central Processing Unit), memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of CAD 10 are realized by having the hardware processor execute programs stored in the memory.

The CAD 10 functions as a product data creation device 11 by executing a computer program. The product data creation device 11 creates product data relating to the product P to be cut out from the workpiece W. The product data includes information such as the shape, size, and weight of the product P. The product data created by the product data creation device 11 is input into the CAM 20.

CAM 20 is a computer equipped with CAM functions. CAM 20 is composed of a computer having a hardware processor such as a CPU, memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of CAM 20 are realized by having the hardware processor execute programs stored in the memory.

By executing a computer program, the CAM 20 functions as a machining data creation device 21. The machining data creation device 21 creates data used by the control device 30, which controls the machining system 40. The CAM 20 is connected to an input device 22 for inputting information to the CAM 20, and a display device 23 for displaying information created by the CAM 20.

Product data created by the product data creation device 11 is input to the processing data creation device 21. Work data including the size, thickness, material, etc. of the workpiece W is input to the processing data creation device 21 from the input device 22. Equipment data including information about the processing machine 50 of the processing system 40 is input to the processing data creation device 21. The equipment data may be acquired from the processing machine 50 or the control device 30, or may be acquired from an external device that holds information about the processing machine 50.

The processing data creation device 21 creates processing data for the product P. The processing data for the product P is data that assigns the cutting path of the laser beam to the outline cutting line CL used to cut out the outline of the product P from the workpiece W. The processing data creation device 21 creates a processing program based on the processing data. The processing program is composed of machine control codes that the control device 30 uses to control the processing system 40.

The machining program created by the machining data creation device 21 is stored in the control device 30. The machining data creation device 21 may store the created machining program in a database in a data management server (not shown). In this case, the control device 30 may read out the machining program stored in the database of the data management server.

In relation to this embodiment, the processing data creation device 21 includes an acquisition unit 21a, a cutting line setting unit 21b, and an allocation setting unit 21c. The acquisition unit 21a acquires product data, for example, from the product data creation device 11. The cutting line setting unit 21b sets an outline cutting line CL for cutting out the outline of the product P from the workpiece W based on the product data. The allocation setting unit 21c allocates a cutting path for the laser beam to the outline cutting line CL to create processing data for the product P.

The control device 30 is a device that controls the machining system 40 based on a machining program, and is, for example, an NC device (numerical control device). The control device 30 is composed of a computer that has a hardware processor such as a CPU, memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of the control device 30 are realized by having the hardware processor execute the program stored in the memory.

For example, the control device 30 controls the processing machine 50 to cut out the product P from the workpiece W based on the processing program. When the processing machine 50 cuts out the product P from the workpiece W, the product P is produced. The control device 30 also controls the product delivery device 60 to remove and deliver the product P cut from the workpiece W based on the processing program. When the product delivery device 60 delivers the product P, the product P is accumulated on an accumulation pallet (not shown).

The processing system 40 includes a processing machine 50 and a product delivery device 60.

The processing machine 50 is equipped with a punch processing unit 51 and a laser processing unit 52. The punch processing unit 51 performs punch processing on the workpiece W using a mold consisting of a punch and a die. The laser processing unit 52 performs laser cutting processing on the workpiece W using a laser beam. The processing machine 50 of this embodiment is presumed to be a multi-tasking machine equipped with a punch processing unit 51 and a laser processing unit 52, but since its main feature is the laser processing unit 52, the following explanation will focus on the laser processing unit 52.

A table that is movable in the Y-axis direction is placed on the base of the processing machine 50, and the workpiece W is placed horizontally on the table with the workpiece plane facing up and down. A carriage 50a that is movable in the X-axis direction is provided near the table, and multiple clamp members 50b that hold the workpiece W are provided on the carriage 50a. By moving the carriage 50a in the X-axis direction, the workpiece W can be moved along the X-axis direction.

The laser processing unit 52 cuts out the product P from the workpiece W by laser cutting. The laser processing unit 52 is equipped with a processing head 52a that irradiates the workpiece W with a laser beam. The processing head 52a is configured to be freely movable in the Y-axis direction and the Z-axis direction. When performing laser cutting, under the control of the control device 30, the processing machine 50 combines movement of the workpiece W in the X-axis direction with movement of the processing head 52a in the Y-axis direction, thereby irradiating the workpiece W with the laser beam output from the processing head 52a in two dimensions. In this way, the laser processing unit 52 cuts the workpiece W according to the outer shape of the product P.

The product discharge device 60 removes and discharges the product P cut from the workpiece W. The product discharge device 60 discharges the product P each time the laser processing unit 52 cuts the product P from the workpiece W. The product discharge device 60 has a pair of discharge arms 61 that separate the product P cut from the workpiece W from the remaining workpiece material and discharge it. Each discharge arm 61 has a plurality of suction pads 61a for suctioning the product P on the surface facing the workpiece W. When discharging the product P, under the control of the control device 30, the product discharge device 60 moves the pair of discharge arms 61 to the left in the X-axis direction and advances the pair of discharge arms 61 toward the processing head 52a. When the pair of discharge arms 61 reach the product P, the product discharge device 60 uses the pair of discharge arms 61 to suction the product P, separate it from the remaining workpiece material, and discharge it. The product discharge device 60 transports the removed product P to a collection pallet (not shown) for collection.

Next, the procedure by which the processing data creation device 21 creates processing data will be explained. Figure 4 is an explanatory diagram of the outline cutting line. Figure 5 is an explanatory diagram showing the method of allocating the cutting path of the laser beam to the outline cutting line.

First, the cutting line setting unit 21b sets an outline cutting line CL based on the product data acquired by the acquisition unit 21a. The outline cutting line CL is a cutting line for cutting out the outline of the product P from the workpiece W, and corresponds to the outline shape of the product P. The cutting line setting unit 21b identifies the outline shape of the product P from the product data and sets an outline cutting line CL that corresponds to the outline shape of the product P. The outline cutting line CL is made up of multiple line segments that are connected in series to form a single closed figure. The individual line segments that make up the outline cutting line CL are made up of straight lines or arcs (curves).

The allocation setting unit 21c allocates a cutting path for the laser beam to the outline cutting line CL. The cutting path for the laser beam is the path along which the laser beam travels when cutting the workpiece W. The cutting path for the laser beam includes a cutting path that cuts the outline cutting line CL and an approach path Ra that cuts from the pierce Pa toward the outline cutting line CL.

Specifically, the layout setting unit 21c sets the search range Rs to the range that is the outermost position on the left side of the outline cutting line CL in the X-axis direction, that is, the reference distance from the left end of the outline cutting line CL to the right. Within the search range Rs, the layout setting unit 21c identifies as the reference line segment CLs a line segment that is parallel to the Y-axis direction and has a determination length Lth or greater. In this way, the reference line segment CLs is identified from the line segments on the left side of the outline cutting line CL in the X-axis direction.

If there are multiple line segments that meet the requirements within the search range Rs, the allocation setting unit 21c identifies the longest line segment among the multiple line segments as the reference line segment CLs. If there are multiple longest line segments, the allocation setting unit 21c identifies the leftmost line segment among those line segments as the reference line segment CLs.

The reference distance and judgment length Lth that define the search range Rs for searching the reference line segment CLs can be preset fixed values. However, the allocation setting unit 21c may also use values entered by the operator using the input device 22 as the reference distance and judgment length Lth of the search range Rs.

Once the reference line segment CLs is identified, the allocation setting unit 21c allocates a cutting path for the laser beam to the outline cutting line CL so that the reference line segment CLs becomes the final cutting path Rcf. The final cutting path Rcf is the last path the laser beam takes to cut the outline cutting line CL, and is the path along which the product P is separated from the workpiece W. As shown in FIG. 5, the allocation setting unit 21c allocates, as the cutting path for the laser beam, a path that starts from the cutting start point Ps, goes around the outline cutting line CL, passes through the final cutting path Rcf, and returns to the cutting start point Ps. In other words, the final cutting path Rcf is a path in which the end of the final cutting path Rcf reaches the cutting start point Ps.

In the processing system 40 according to this embodiment, the product discharge device 60 discharges the product P each time the laser processing unit 52 cuts out the product P. The discharge arm 61 of the product discharge device 60 waits at a position a certain distance to the right of the processing head 52a during laser cutting by the laser processing unit 52. When the product P is cut from the workpiece W and the processing head 52a rises, the discharge arm 61 moves from the standby position to the left. This causes the discharge arm 61 to advance below the processing head 52a and remove the cut-out product P. In this embodiment, taking into account the manner in which the product P is removed by the discharge arm 61, the reference line segment CLs and the final cutting path Rcf are set with respect to the line segment on the left side of the outline cutting line CL.

In addition to the cutting path for cutting the outline cutting line CL, the allocation setting unit 21c also allocates a pierce Pa and an approach Ra for cutting from the pierce Pa toward the outline cutting line CL. The approach Ra is set to lead from the pierce Pa to the cutting start point Ps of the outline cutting line CL.

Figure 6 is an explanatory diagram showing how to set the clearance. The layout setting unit 21c can allocate the clearance CLr in addition to the cutting path for cutting the outline cutting line CL, the pierce Pa, and the approach Ra. In this case, the layout setting unit 21c preferably sets the clearance CLr so that it extends straight along the Y-axis direction from the end point of the final cutting path Rcf. Note that if the clearance CLr cannot be set along the Y-axis direction, the layout setting unit 21c preferably sets the clearance CLr in any direction as long as it does not interfere with the product P.

In this way, the allocation setting unit 21c creates processing data for the product P by allocating the cutting path of the laser beam to the outline cutting line CL. The allocation setting unit 21c also creates processing data that allocates the suction positions of the pair of carry-out arms 61 to the product P so that the product P cut from the workpiece W can be removed by the product discharge device 60. The allocation setting unit 21c allocates the suction positions of the pair of carry-out arms 61 to the product P based on the final cutting path Rcf and the product data. The processing data creation device 21 creates a processing program based on this processing data. The created processing program is used by the control device 30.

Figure 7 is an explanatory diagram showing the laser cutting method according to this embodiment. The control device 30 controls the processing machine 50 and the product discharge device 60 based on a processing program. First, the processing machine 50 uses the laser processing unit 52 to cut the workpiece W according to the outer shape of the product P through laser cutting. Specifically, the laser processing unit 52 begins emitting a laser beam from the processing head 52a at the piercing position to open a pierce Pa, and then cuts until it reaches a cutting start point Ps on the outer cutting line CL to form an approach Ra. The laser processing unit 52 moves the processing head 52a clockwise along the outer cutting line CL from the cutting start point Ps. The laser processing unit 52 then cuts the final cutting point (cutting start point Ps), which is the end of the final cutting path Rcf, stops emitting the laser beam, and raises the processing head 52a.

When the final cutting path Rcf is cut by the laser beam, the product P is completely separated from the workpiece W. The product discharge device 60 moves the discharge arm 61 to the left in the X-axis direction, advancing it toward the processing head 52a. When the product discharge device 60 advances each discharge arm 61 to a predetermined suction position, it begins suction operation using the suction pad 61a, and separates and removes the product P from the remaining workpiece. The product discharge device 60 transports the removed product P to a collection pallet (not shown) and collects it.

Through this series of steps, the laser cutting method according to this embodiment is realized. This laser cutting method is performed each time a product P assigned to the workpiece W is cut.

As described above, according to this embodiment, the allocation setting unit 21c identifies, among the line segments on the left side of the outline cutting line CL in the X-axis direction, a line segment that is parallel to the Y-axis direction and has a determination length Lth or greater as the reference line segment CLs. The allocation setting unit 21c then allocates, to the reference line segment CLs, the final cutting path Rcf, which is the path along which the laser beam last cuts the outline cutting line CL.

In this way, according to the machining data creation device 21 of this embodiment, the longest line segment on the left side of the outline cutting line CL that is parallel to the Y-axis direction is assigned as the final cutting path Rcf. Because the length of the final cutting path Rcf is increased, the rigidity of the uncut portion before cutting along the final cutting path Rcf increases. As a result, it is possible to prevent machining defects such as waviness from occurring when cutting along the final cutting path Rcf. Furthermore, because the final cutting path Rcf is parallel to the Y-axis direction, when cutting along the final cutting path Rcf, the machining head 52a only moves in the Y-axis direction, and does not move the workpiece W in the X-axis direction. Therefore, it is possible to prevent the product P from shifting and slipping under the workpiece W during machining. This prevents the product P from getting caught on the remaining workpiece material when the product P is being removed, allowing the product P to be removed stably.

Furthermore, with the machining data creation device 21 according to this embodiment, as described above, the final cutting path Rcf is automatically assigned to the reference line segment CLs that meets certain requirements. Without the ability to automatically assign the final cutting path Rcf to the reference line segment CLs, the operator would need to modify the final cutting path Rcf themselves. Assigning the final cutting path Rcf requires appropriate knowledge and experience, such as knowledge about the removal of the product P by the product removal device 60. Furthermore, modifying the final cutting path Rcf requires modifying the suction position of the removal arm 61, which takes a lot of time to create the machining data. However, with this embodiment, manual modification is not required, eliminating this inconvenience.

Furthermore, according to the laser cutting method of this embodiment, the longest line segment on the left side of the contour cutting line CL that is parallel to the Y-axis direction is cut last. This increases the length of the final cutting path Rcf, increasing the rigidity of the uncut portion before cutting the final cutting path Rcf. As a result, it is possible to prevent processing defects such as waviness from occurring when cutting the final cutting path Rcf. Furthermore, because the final cutting path Rcf is parallel to the Y-axis direction, when cutting the final cutting path Rcf, the processing head 52a only moves in the Y-axis direction, and does not involve movement of the workpiece W in the X-axis direction. Therefore, it is possible to prevent the product P from shifting and slipping under the workpiece W during processing. This prevents the product P from getting caught on the remaining workpiece material when the product P is being removed, allowing the product P to be removed stably.

In the processing data creation device 21 according to this embodiment, the layout setting unit 21c sets a search range Rs within a range that is a reference distance to the right in the X-axis direction, based on the outermost position on the left side of the outline cutting line CL. The layout setting unit 21c then identifies a reference line segment CLs within the search range Rs.

With this configuration, the allocation setting unit 21c performs processing to identify the reference line segment CLs by limiting the line segments that exist within the search range Rs among the multiple line segments that make up the outline cutting line CL. The allocation setting unit 21c does not need to determine whether all line segments that make up the outline cutting line CL correspond to the reference line segment CLs, thereby reducing the computational load. Furthermore, by setting the search range Rs, line segments that exist on the left side of the outline cutting line CL are extracted, making it possible to identify the reference line segment CLs on the left side of the outline cutting line CL.

In the processing data creation device 21 according to this embodiment, the allocation setting unit 21c sets a clearance CLr along the Y-axis direction from the final cutting point (cutting start point Ps) where the laser beam last cuts on the outline cutting line CL.

With this configuration, cutting the recess CLr involves only moving the machining head 52a in the Y-axis direction, and does not involve moving the workpiece W in the X-axis direction. This prevents the product P from shifting and slipping under the workpiece W when cutting the recess CLr. This prevents the product P from getting caught on the remaining workpiece when the product P is being transported, allowing the product P to be transported stably.

Note that, according to the above-described embodiment, it is assumed that the outer shape of the product P has a line segment that is parallel to the Y-axis direction and has a length equal to or greater than the judgment length Lth. However, depending on the outer shape of the product P, there may be a line segment that is parallel to the Y-axis direction but does not have a length equal to or greater than the judgment length Lth. In such cases, the reference line segment CLs can be set for the line segment that is parallel to the Y-axis direction. This allows the final cutting path Rcf to be set taking into account the product discharge by the product discharge device 60.

Figure 8 is an explanatory diagram showing the shape of a product for which there is no reference line segment on the outline cutting line. Depending on the outline shape of the product P, such as a circle, triangle, or trapezoid, there may be no line segment parallel to the Y-axis direction. In this case, the allocation setting unit 21c preferably allocates the cutting path of the laser beam so that the final cutting point (cutting start point Ps) where the laser beam last cuts on the outline cutting line CL is located at the outermost position on the left side of the outline cutting line CL.

With this configuration, the cutting path of the laser beam can be assigned taking into account the product discharge by the product discharge device 60.

As described above, an embodiment of the present invention has been described. However, the descriptions and drawings that form part of this disclosure should not be understood as limiting this invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure.

10 CAD
11 Product data creation device 20 CAM
21 Processing data creation device 21a Acquisition unit 21b Cutting line setting unit 21c Allocation setting unit 22 Input device 23 Display device 30 Control device 40 Processing system 50 Processing machine 50a Carriage 50b Clamp member 51 Punch processing unit 52 Laser processing unit 52a Processing head 60 Product carrying-out device 61 Carry-out arm 61a Suction pad

Claims (4)

In a processing data creation device for creating processing data for a processing system that performs laser cutting processing to cut a plate-shaped workpiece to manufacture a product,
The processing system includes:
a processing machine that two-dimensionally irradiates the workpiece with a laser beam output from the processing head by combining movement of the workpiece in a first axial direction along a workpiece plane and movement of the processing head in a second axial direction along the workpiece plane that is perpendicular to the first axial direction, and cuts the workpiece according to the shape of the product;
a product carrying-out device that moves to a first side that is one side in the first axial direction and advances toward the processing head, thereby removing the product cut from the workpiece every time the processing machine cuts the product ;
The processing data creation device includes:
an acquisition unit that acquires product data including the shape of the product;
a cutting line setting unit that sets an outline cutting line for cutting out the outline of the product from the workpiece based on the product data;
an allocation setting unit that allocates a cutting path of the laser beam to the outline cutting line and creates processing data for the product,
The allocation setting unit
a search range is set within a range that is a reference distance from a first side of the outline cutting line in the first axis direction toward a second side opposite to the first side in the first axis direction;
Identifying a plurality of line segments that are parallel to the second axis direction and have a length equal to or greater than a determination length from among the line segments within the search range;
Identifying the longest line segment among a plurality of line segments that are parallel to the second axis direction and have a length equal to or greater than a determination length as a reference line segment;
a final cutting path, which is the path along which the laser beam cuts last on the outline cutting line, is assigned to the reference line segment; The allocation setting unit
The processing data creating device according to claim 1 , wherein, when there are a plurality of the longest line segments, the line segment located furthest to the first side among the plurality of longest line segments is specified as the reference line segment. The allocation setting unit
2. The processing data creating device according to claim 1 , wherein a relief is set along the second axis from a final cutting point where the laser beam last cuts the outline cutting line. The allocation setting unit
3. The processing data creation device according to claim 1, wherein, when it is determined that the reference line segment does not exist on the outline cutting line, the cutting path of the laser beam is allocated to the outline cutting line so that a final cutting point where the laser beam last cuts on the outline cutting line is located outermost on the first side of the outline cutting line in the first axial direction.