JP7752482B2 - Electroformed Blade - Google Patents

Description

The present invention relates to an electroformed blade.

The electroformed blade has a circular shape and is attached via a flange to the spindle of a processing device that processes electronic and optical components. When the electroformed blade attached to the processing device rotates around its central axis, the cutting edge on the outer periphery cuts the electronic material.
In recent years, high processing accuracy has been required in the manufacture of electronic materials, and the development of electroformed blades that enable high processing accuracy has been progressing.

As shown in Patent Documents 1 and 2, for example, electroformed blades have been proposed in which a filler made of a fluororesin such as polytetrafluoroethylene is dispersed in a metal plating phase such as nickel, thereby reducing the abrasive grain retention force while maintaining the rigidity of the metal plating phase and promoting self-sharpening.

Patent Document 1 discloses an electroformed blade having a circular, thin plate-shaped blade body in which superabrasive grains and a filler made of fluororesin are dispersed in a metal plating phase whose main component is nickel. The blade body has a co-deposited amount of the filler in the range of 10 to 30 vol%, a concentration of the superabrasive grains in the range of 25 to 50, and a hardness of the metal plating phase in the range of HV 400 to 550.

Patent Document 2 also discloses an electroformed blade comprising a circular plate-shaped blade body and a cutting edge formed on the outer periphery of the blade body, wherein the blade body comprises a metal plating phase made of Ni-B, abrasive grains dispersed in the metal plating phase that are harder than the metal plating phase, and a filler dispersed in the metal plating phase that is made of fluororesin, with the volume of the filler accounting for 10 to 30% of the total volume of the blade body.

JP 2013-132705 A JP 2015-116638 A

The electroformed blades described in Patent Documents 1 and 2 have improved sliding properties due to the co-deposited fluororesin, which allows for improved machining accuracy. However, the strength of the electroformed blades described in Patent Documents 1 and 2 is reduced by the fluororesin contained in the metal plating phase, and in high-load machining, straightness may decrease or the electroformed blade may break, leaving room for improvement.

The present invention was made in light of these circumstances, and aims to provide an electroformed blade that can be machined with high quality.

After extensive research into electroformed blades containing fluororesin, the inventors discovered that conventional electroformed blades containing fluororesin contain coarse fluororesin particles in the metal plating phase. The inventors discovered that the coarse fluororesin particles reduce the mechanical strength of the electroformed blade, and that the mechanical strength of the electroformed blade can be improved by appropriately controlling the dispersion state of the fluororesin in the metal plating phase. They then found that by keeping the dispersion state of the fluororesin, the co-deposited amount of fluororesin, and the concentration of abrasive grains within specified ranges, high sliding properties and strength can be achieved, resulting in an electroformed blade that can be processed with high quality.

The present invention was made based on these findings, and the gist of the present invention is as follows.
[1] An electroformed blade according to one embodiment of the present invention is a thin, annular plate-shaped electroformed blade comprising a metal plating phase, abrasive grains dispersed in the metal plating phase that are harder than the metal plating phase, and a granular filler dispersed in the metal plating phase that contains a fluororesin, wherein the abrasive grains contain superabrasive grains that are one or more types selected from the group consisting of natural diamond grains, synthetic diamond grains, and cubic boron nitride grains, the concentration of the superabrasive grains is 25 or more and 50 or less, the content of the filler is 10 volume % or more and 40 volume % or less relative to the volume of the electroformed blade, and the maximum particle size of the filler is 10.0 μm or less.
[2] In the electroformed blade described in [1] above, it is preferable that the Vickers hardness of the metal plating phase is 200 HV or more and 400 HV or less.
[3] In the electroformed blade described in [1] or [2] above, it is preferable that the abrasive grains contain hexagonal boron nitride particles, and that the content of the hexagonal boron nitride particles relative to the volume of the electroformed blade is 1 volume % or more and 30 volume % or less.
[4] In the electroplated blade described in any one of [1] to [3] above, it is preferable that the abrasive grains contain silicon carbide particles, and that the content of the silicon carbide particles relative to the volume of the electroplated blade is 1 volume % or more and 30 volume % or less.

The electroformed blade of the present invention enables high-quality machining.

FIG. 1 is a side view showing an electroformed blade according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing the AA cross section of FIG. FIG. 3 is an enlarged schematic view of part B in FIG. 2. 10 is an example of an SEM image of the surface of the electroformed blade according to the embodiment. 1 is an example of an SEM image of the surface of a conventional electroformed blade.

<Electroformed Blade 1>
An electroformed blade 1 according to one embodiment of the present invention will be described below with reference to Figures 1 to 3. Figure 1 is a side view showing an electroformed blade 1 according to one embodiment of the present invention. Figure 2 is a cross-sectional view showing the A-A cross section in Figure 1. Figure 3 is a schematic diagram showing an enlarged view of part B in Figure 2. Note that the dimensions and ratios of each component in the figures do not represent the actual dimensions and ratios of each component.

(Schematic configuration of electroformed blade 1)
First, the schematic configuration of an electroformed blade 1 according to this embodiment will be described. As shown in Figure 1, the electroformed blade 1 according to this embodiment has a circular thin plate shape. In detail, the electroformed blade 1 has an outer surface 11 and an inner surface 12 that are concentrically arranged about a central axis O. A through hole 13 is formed inside the inner surface 12, penetrating in a direction along the central axis O.
In this specification, the direction along the central axis O of the electroformed blade 1 is referred to as the width direction.

The thickness (length in the width direction) of the electroformed blade 1 is not particularly limited and can be, for example, 0.01 mm or more and 5.0 mm or less. However, from the perspective of the processing area of the workpiece, it is preferably 0.20 mm or less, and more preferably 0.10 mm or less. On the other hand, from the perspective of ensuring mechanical strength, the thickness of the electroformed blade 1 is preferably 0.02 mm or more, and more preferably 0.05 mm or more.

As shown in FIG. 3, the electroformed blade 1 comprises a metal plating phase 101, abrasive grains 102 dispersed in the metal plating phase 101 and made of a material harder than the metal plating phase 101, and granular filler 103 dispersed in the metal plating phase 101 and containing fluororesin. The metal plating phase 101, abrasive grains 102, and filler 103 are described in detail below.

(Metal plating phase 101)
The metal plating phase 101 is a plating phase containing Ni, Co, Cu, Fe, Zn, or Sn as a main component. The metal plating phase 101 may be formed only of the above elements, or may contain any of the above elements plus other elements such as P, W, Mo, or B. The metal plating phase 101 may contain, for example, B (boron), with the balance being Ni and impurities. When the metal plating phase 101 contains B, the B content is 0.3 mass% or more and 1.0 mass% or less with respect to the total mass of the metal plating phase 101.

Impurities are substances that may be unintentionally mixed into the metal plating phase 101 during the manufacture of the electroformed blade 1, such as Na, K, or S.

The Vickers hardness of the metal plating phase 101 is preferably 200 HV or more and 400 HV or less. If the Vickers hardness of the metal plating phase 101 is 200 HV or more, the mechanical strength of the electroformed blade 1 can be more reliably ensured. Therefore, the Vickers hardness of the metal plating phase 101 is preferably 200 HV or more. The Vickers hardness of the metal plating phase 101 is more preferably 300 HV or more. On the other hand, while there is no particular upper limit on the Vickers hardness of the metal plating phase 101, if the Vickers hardness of the metal plating phase 101 is 400 HV or less, spontaneous sharpening occurs while maintaining the mechanical strength of the electroformed blade 1, and chipping can be suppressed. Therefore, the Vickers hardness of the metal plating phase 101 is preferably 400 HV or less.

The Vickers hardness of the metal plating phase 101 is measured in accordance with JIS Z 2244:2009, with a test force of 0.3 kgf and a test force holding time of 10 seconds, at five points on the metal plating phase 101 located 1 mm from the cutting edge, and the average value is taken as the Vickers hardness of the metal plating phase 101.

(Abrasive grain 102)
The abrasive grains 102 are dispersed in the metal plating phase 101 and are composed of a material harder than the metal plating phase 101. The abrasive grains 102 contain superabrasive grains that are one or more types selected from the group consisting of natural diamond particles, synthetic diamond particles, and cubic boron nitride (cBN) particles.

In the electroformed blade 1 according to this embodiment, the concentration of the superabrasive grains is 25 or more and 50 or less. The concentration is an index showing the proportion of superabrasive grains contained in the volume of the electroformed blade 1, and more specifically, the proportion of the volume of superabrasive grains to 1/4 of the volume of the electroformed blade 1. For example, if the content of superabrasive grains is 25% by volume relative to the volume of the electroformed blade 1, the concentration is 100.

If the concentration is 25 or more and 50 or less, the mechanical strength of the electroformed blade 1 is improved while favorably promoting the self-sharpening action, and significant wear of the electroformed blade 1 can be suppressed. As a result, the life of the electroformed blade 1 can be extended. If the concentration is less than 25, the effect of improving the mechanical strength of the electroformed blade 1 due to the dispersion of superabrasive grains is not achieved, and wear of the electroformed blade 1 progresses more rapidly. Furthermore, if the concentration is less than 25, the amount of work required for processing the workpiece by the superabrasive grains cannot be secured, resulting in a decrease in sharpness and a decrease in processing quality. Therefore, the concentration of the superabrasive grains is 25 or more. The concentration of the superabrasive grains is preferably 30 or more. On the other hand, if the concentration of the superabrasive grains exceeds 50, the mechanical strength of the electroformed blade 1 becomes too high, the self-sharpening action is weakened, and chipping becomes more likely to occur. Therefore, the concentration of the superabrasive grains is 50 or less. The concentration of the superabrasive grains is preferably 45 or less.

The concentration is measured through component analysis using X-ray diffraction. Specifically, a Rigaku Corporation fully automated multipurpose horizontal X-ray diffraction analyzer, SmartLab, is used to obtain X-ray peaks under conditions of a tube voltage of 45 kV, a tube current of 200 mA, and a scan speed of 10°/min. The content of each component is calculated using the RIR (Reference Intensity Ratio) method using the maximum intensity of the peaks attributable to the components of the metal plating phase 101, the maximum intensity of the peaks attributable to the components of the abrasive grains 102, and the maximum intensity of the peaks attributable to the filler 103 in the obtained diffraction pattern. The calculated content of superabrasive grains is used as the concentration. If the metal plating phase 101 is composed of multiple elements, the maximum peak intensity of each element is used.

The abrasive grains 102 further contain at least one of hexagonal boron nitride (hBN) particles or silicon carbide (SiC) particles, and it is preferable that the content of each of the hexagonal boron nitride particles and silicon carbide particles relative to the volume of the electroformed blade 1 be 1% by volume or more and 30% by volume or less. If the abrasive grains 102 contain hBN, the sliding properties of the electroformed blade 1 are improved. Furthermore, if the abrasive grains 102 contain SiC, the strength of the electroformed blade 1 is improved. To achieve the above effect, it is preferable that the content of each of the hBN particles and SiC particles relative to the volume of the electroformed blade 1 be 1% by volume or more. Even if the content of each of the hBN particles and SiC particles relative to the volume of the electroformed blade 1 exceeds 30% by volume, the above effect saturates. Therefore, it is preferable that the content of each of the hBN particles and SiC particles relative to the volume of the electroformed blade 1 be 30% by volume or less. The content of each of the hBN particles and SiC particles is more preferably 5% by volume or more relative to the electroformed blade 1. Furthermore, the content of each of the hBN particles and SiC particles is more preferably 20% by volume or less relative to the electroformed blade 1.

When only hBN particles are contained among the hBN particles and SiC particles, the content is preferably 1% by volume or more and 30% by volume or less of the electroformed blade 1. When only SiC particles are contained among the hBN particles and SiC particles, the content is preferably 1% by volume or more and 30% by volume or less of the electroformed blade 1.

The particles of each material that make up the abrasive grains 102 can be commercially available and essentially contain the respective components, but may also contain other components as impurities.

The content of hBN particles and SiC particles relative to the volume of the electroformed blade 1 is measured using a method similar to that used to measure concentration.

The average particle size of the abrasive grains 102 is, for example, 1 μm or more and 100 μm or less.

The average particle size of the abrasive grains 102 refers to the particle size measured and calculated using the following method. That is, the volume average particle size measured using a laser diffraction particle size distribution analyzer is taken as the average particle size of the abrasive grains 102. Specifically, a Microtrac laser diffraction/scattering analyzer MT3300EXII-SDC is used, and the sample is placed in water (25°C, pH 7). The transmittance of the measurement sample is set to transparent, the particle refractive index is 1.81, and the shape is aspherical, and the average particle size is measured based on the volume-based particle size distribution. The solvent refractive index is set to 1.333, the measurement time is 30 seconds, and the average of two measurements is taken as the measured value.

The abrasive grains 102 are dispersed within the metal plating phase 101. The dispersion state of the abrasive grains 102 may be similar to the dispersion state of the abrasive grains 102 in electroformed blades manufactured using known manufacturing methods.

(Filler 103)
The filler 103 is a granular fluororesin dispersed in the metal plating phase 101. The fluororesin improves the sliding properties of the electroformed blade 1. The fluororesin used for the filler 103 is preferably polytetrafluoroethylene (PTFE). The filler 103 is essentially made of a fluororesin, but may contain impurities contained in the fluororesin that is the raw material for the filler 103. Known fluororesins other than PTFE may also be used as the filler 103.

The filler 103 is contained in an amount of 10% by volume or more and 40% by volume or less relative to the volume of the electroformed blade 1. Hereinafter, the ratio of the volume of the filler 103 to the volume of the electroformed blade 1 is referred to as the co-deposition amount (content) of the filler 103. If the co-deposition amount of the filler 103 is less than 10% by volume, the self-sharpening effect resulting from the co-deposition of the filler 103 is difficult to achieve, and chipping of the workpiece is more likely to occur. Therefore, the co-deposition amount of the filler 103 is 10% by volume or more. The co-deposition amount of the filler 103 is preferably 20% by volume or more, and more preferably 25% by volume or more. On the other hand, if the co-deposition amount of the filler 103 exceeds 40% by volume, the electroformed blade 1 becomes embrittled, and the mechanical strength of the electroformed blade 1 cannot be ensured. Therefore, the co-deposition amount of the filler 103 is 40% by volume or less. The co-deposited amount of filler 103 is preferably 35% by volume or less, and more preferably 30% by volume or less.

The amount of co-deposition is measured using a method similar to that used to measure concentration.

Here, the dispersion state of the filler 103 in the metal plating phase 101 will be described with reference to Figures 4 and 5. Figure 4 is an example of an SEM image of the surface of an electroformed blade according to this embodiment. Figure 5 is an example of an SEM image of the surface of a conventional electroformed blade. In the electroformed blade according to this embodiment, the filler 103 is dispersed in the metal plating phase 101, as shown in Figure 4, and coarse agglomerates with a maximum particle size of 10.0 μm or more are not generated. On the other hand, in Figure 5, the filler has aggregated, resulting in the presence of coarse agglomerates. In conventional electroformed blades using PTFE as a filler, the presence of PTFE agglomerates is presumed to be the starting point for fracture of the electroformed blade.

Therefore, the maximum particle size of the filler 103 is 10.0 μm or less. Because the filler 103 is softer than the metal plating phase 101 and the abrasive grains 102, if coarse fillers 103 are present in the electroformed blade 1, the electroformed blade 1 is more likely to break from the coarse fillers 103. If the maximum particle size of the filler 103 is 10.0 μm or less, breakage of the electroformed blade 1 from the fillers 103 is suppressed. Therefore, the maximum particle size of the filler 103 is 10.0 μm or less. The maximum particle size of the filler 103 is preferably 5 μm or less, and more preferably 1 μm or less. On the other hand, if fine fillers 103 are dispersed in the metal plating phase 101, the local load on the electroformed blade 1 when machining the workpiece is reduced. Therefore, there is no particular lower limit on the maximum particle size of the filler 103. However, the maximum particle size of the filler 103 in the electroformed blade 1 according to this embodiment may be, for example, 0.5 μm or more, or 0.2 μm or more.

Here, a method for measuring the maximum particle size of the filler 103 will be described. Using a scanning electron microscope (SEM), images are taken at a position 1 mm from the cutting edge of the electroformed blade 1 at a magnification of 500x and at 2 mm intervals, covering a total of 10 fields of view. For each image, the circle-equivalent diameter based on the area of the filler 103 is calculated, and the maximum particle size is calculated. A digital microscope VHX-D500 manufactured by Keyence Corporation is used to calculate the circle-equivalent diameter.
The filler 103 is identified in the SEM image by the following method. That is, the metal plating phase 101, the abrasive grains 102, and the filler 103 can be distinguished by color and shape. Specifically, the metal plating phase 101 is displayed brightly because it is conductive, whereas the abrasive grains 102 and the filler 103 are displayed darkly because they are not conductive, and therefore the metal plating phase 101 can be distinguished. Next, the abrasive grains 102 have an angular shape, whereas the filler 103 has an irregular shape, and therefore the two can be distinguished.

Furthermore, it is preferable that the average particle size of the filler 103 is equal to or smaller than the average particle size of the abrasive grains 102. If the average particle size of the filler 103 is equal to or smaller than the average particle size of the abrasive grains 102, the excellent sharpness provided by the abrasive grains 102 is maintained while the filler 103 ensures that the abrasive grains 102 have a self-sharpening action, further suppressing chipping.

So far, we have explained the metal plating phase 101, abrasive grains 102, and filler 103. In the electroformed blade 1 according to this embodiment, the outer surface 11 and side surfaces function as cutting edges. More specifically, a spindle of a processing device is inserted into the through-hole 13 via a flange (not shown), and the electroformed blade 1 is fixed to the spindle. The spindle rotates about the central axis O, and the outer surface 11 of the rotating electroformed blade 1 comes into contact with the workpiece, thereby processing the workpiece. Furthermore, if the electroformed blade 1 according to this embodiment is a hub-equipped blade fixed to a base metal during electroforming, the electroformed blade 1 is fixed to the spindle via this base metal, and the spindle rotates about the central axis O, and the outer surface 11 of the rotating electroformed blade 1 comes into contact with the workpiece, thereby processing the workpiece.

The electroformed blade 1 according to this embodiment is suitable for precisely machining workpieces made of hard and brittle materials such as glass, quartz, and ceramics, as well as semiconductor silicon, compound wafers, and various electronic component materials. Specifically, the electroformed blade 1 according to this embodiment is suitable for groove machining, which forms grooves in the workpiece, and cutting, which cuts the workpiece into individual pieces. Note that the workpiece is not limited to glass, quartz, and ceramics, and may be made of materials other than those listed above.

As such, according to this embodiment, the mechanical strength of the electroformed blade 1 is ensured, thereby suppressing meandering of the electroformed blade 1 when processing a workpiece. Furthermore, because the abrasive grains 102 have excellent self-sharpening properties, the electroformed blade 1 according to this embodiment has excellent sharpness. As a result, processing quality can be improved.

<Method of manufacturing electroformed blade 1>
Next, an example of a method for manufacturing the electroformed blade according to this embodiment will be described. The electroformed blade 1 according to this embodiment is manufactured by a known electroforming method. The method for manufacturing the electroformed blade 1 according to this embodiment includes, for example, a plating step, an etching step, and an inner and outer diameter adjustment step.

In the plating process, abrasive grains and filler having the above average particle size are dispersed in a plating solution primarily composed of nickel. The abrasive grains and filler are dispersed by attaching a circular, annular base metal, which serves as the cathode, to the tip of a rotatable shaft and rotating the shaft around its central axis to rotate the base metal. The plating solution may be, for example, a sulfamic acid bath. The circular, annular base metal, which serves as the cathode, and an anode are immersed in the plating solution containing the dispersed abrasive grains and filler. A voltage is applied between the cathode and anode to deposit a metal plating layer of a predetermined thickness on the surface of the base metal while incorporating the abrasive grains and filler. This is then peeled off from the base metal to produce a metal plating layer (intermediate material) incorporating the abrasive grains and filler. If the electroformed blade 1 is to be a hub-equipped blade, as described below, a predetermined area of the base metal can be masked, and a metal plating layer incorporating the abrasive grains and filler can be deposited in areas other than the masked area.

In the etching process, at least the side of the intermediate material that was in contact with the cathode is etched after being peeled off from the cathode, causing abrasive grains to protrude from that side. For example, nitric acid may be used as an etchant for the etching process.

In the inner and outer diameter adjustment process, the inner and outer diameters of the intermediate material after the etching process are processed using known methods to achieve the specified dimensions.

The present invention will be explained in more detail below using examples. However, the present invention is not limited to these examples.

First, abrasive grains and filler were dispersed in a sulfamic acid bath. The abrasive grains used were synthetic diamond, cBN, natural diamond, and a mixture of synthetic diamond with at least one of hBN and SiC. The average particle size of the abrasive grains was 9 μm. The filler used was PTFE (product name Metaflon, model number FKY-2-A) manufactured by Uemura Kogyo Co., Ltd. The average particle size of the PTFE was 8 μm. The temperature of the plating solution was 50°C. A circular annular base metal serving as the cathode and an anode were immersed in the plating solution containing the dispersed abrasive grains and filler, and a voltage was applied between the cathode and anode. The current density was 5 A/ ^cm3 , and the voltage application time was 80 minutes. The plated sheet formed on the base metal was then peeled off from the base metal. Both sides of the peeled intermediate material were etched using nitric acid as an etchant. The inner and outer diameters of the intermediate material after the etching process were then adjusted by machining. As a result of the above, an electroformed blade having an outer diameter of 55 mm, an inner diameter (diameter of the mounting hole) of 40 mm, and a thickness of 0.08 mm was manufactured.

The Vickers hardness of the metal plating layer of each manufactured electroformed blade was measured using the following method. Specifically, in accordance with JIS Z 2244:2009, a test force of 0.3 kgf was applied and the test force was held for 10 seconds. Measurements were taken at five points on the metal plating layer 101 located 1 mm from the cutting edge, and the average value was used as the Vickers hardness of the metal plating layer 101.

The superabrasive grain concentration, hBN content, SiC content, and filler co-deposition amount of each electroformed blade were measured using the following method. Specifically, the superabrasive grain concentration and hBN and SiC content in each electroformed blade were measured through component analysis using X-ray diffraction. Specifically, a Rigaku Corporation fully automated multipurpose horizontal X-ray diffractometer, SmartLab, was used to obtain X-ray peaks under conditions of a tube voltage of 45 kV, a tube current of 200 mA, and a scan speed of 10°/min. The peak intensities of the lattice planes with the highest detected intensities for Ni, diamond, SiC, and BN were used to calculate the content of each component using the RIR (Reference Intensity Ratio) method.

The average particle size of the abrasive grains in each electroformed blade was measured using the following method. Specifically, a Microtrac laser diffraction/scattering measuring device, model MT3300EXII-SDC, was used. The sample was placed in water (25°C, pH 7). The transmittance of the measurement sample was set to transparent, the particle refractive index was 1.81, and the shape was aspherical. The average particle size was measured based on the volume-based particle size distribution. The solvent refractive index was set to 1.333, the measurement time was 30 seconds, and the average of two measurements was used as the measured value.

The maximum particle size of the filler in each electroformed blade was measured using the following method. Using a scanning electron microscope, images of a total of 10 fields of view were taken at 2 mm intervals at a magnification of 500x, 1 mm from the cutting edge of each electroformed blade. In each image, the bright areas were determined to be the metal plating phase, the angular areas in the dark areas were determined to be abrasive grains, and the irregularly shaped areas in the dark areas were determined to be filler. For each image, the circle-equivalent diameter based on the filler's area was calculated, and the maximum particle size was calculated. A Keyence VHX-D500 digital microscope was used to calculate the circle-equivalent diameter. The average particle size shown in Table 1 is the average particle size of the filler as raw material.

In addition, the average particle size of the filler in each electroformed blade manufactured was measured using the same method as that used to measure the average particle size of the abrasive grains.

Each electroformed blade was attached to a cutting device via a flange, and the maximum chipping size of the cut surface was measured after cutting 2 m of the workpiece. The workpiece was glass, 150 mm square and 0.7 mm thick. The flange diameter was 49.6 mm, the rotation speed of the electroformed blade was 15,000 min ^-1 , and the feed rate of the electroformed blade was 5 mm/s.

The maximum chipping size was used as an indicator of processing quality. The maximum chipping size was measured using the following method. Specifically, the workpiece was observed from the back side using an optical microscope, and the size of chipping generated by processing in the direction perpendicular to the cut surface was measured as the chipping size. If the maximum chipping size measured in this way was 50 μm or less, the processability was rated as extremely good (◎); if the maximum chipping size was greater than 50 μm and less than or equal to 100 μm, the processability was rated as good (◯); and if the maximum chipping size was greater than 100 μm or if the electroformed blade was damaged, the processability was judged to be poor (×). The results are shown in Table 1.

As shown in Table 1, good workability was achieved when the abrasive grains contained at least superabrasive grains, the concentration of the superabrasive grains was 25 to 50, the filler content was 10 to 30 volume percent relative to the volume of the electroformed blade 1, and the maximum particle size of the filler was 10.0 μm or less.

REFERENCE SIGNS LIST 1 Electroformed blade 11 Outer surface 12 Inner surface 13 Through hole 101 Metal plating layer 102 Abrasive grains 103 Filler

Claims (4)

An electroformed blade in the form of a circular thin plate,
The electroformed blade comprises a metal plating phase, abrasive grains dispersed in the metal plating phase and harder than the metal plating phase, and a granular filler dispersed in the metal plating phase , containing a fluororesin and containing classified agglomerates ,
The abrasive grains contain superabrasive grains of one or more types selected from the group consisting of natural diamond grains, synthetic diamond grains, and cubic boron nitride grains, and the concentration of the superabrasive grains is 25 or more and 50 or less;
the content of the filler is 10% by volume or more and 40% by volume or less relative to the volume of the electroformed blade,
An electroformed blade, wherein the particle size of the largest agglomerated particle of the filler is 10.0 μm or less. The electroformed blade according to claim 1, wherein the Vickers hardness of the metal plating phase is 200 HV or more and 400 HV or less. An electroformed blade according to claim 1 or 2, wherein the abrasive grains contain hexagonal boron nitride particles, and the content of the hexagonal boron nitride particles relative to the volume of the electroformed blade is 1% by volume or more and 30% by volume or less. An electroformed blade according to any one of claims 1 to 3, wherein the abrasive grains contain silicon carbide particles, and the content of the silicon carbide particles relative to the volume of the electroformed blade is 1% by volume or more and 30% by volume or less.