JP7756331B2 - Component mounting device and paste transfer method - Google Patents

Description

This disclosure relates to a component mounting device that mounts components on a workpiece, and a pin that transfers paste to a workpiece or a paste transfer method that transfers paste to a component.

A technology has been disclosed in which the presence or absence of untransferred sections on the paste transfer stage is determined by referencing component information indicating the size of the component to be mounted and transfer information indicating sections that have already been subjected to paste transfer on the paste transfer stage used to transfer paste to the component, and film formation is performed only if it is determined that there are no untransferred sections (see, for example, Patent Document 1).

JP 2010-182983 A

However, with the technology disclosed in Patent Document 1, even in untransferred sections, if there are chips or air bubbles, the transfer may not be performed properly, which may result in reduced transfer quality.

This disclosure therefore provides a component mounting device and the like that can suppress deterioration in transfer quality.

A component mounting device according to one aspect of the present disclosure is a component mounting device that mounts components on a workpiece, and includes: a mounting unit having pins that transfer paste to the workpiece or suction nozzles that suck the components; a paste transfer unit in which a film of paste is formed to be transferred to the tip of the pin or the electrode of the component; an imaging unit that images the paste transfer area of the paste transfer unit; a determination unit that determines whether paste can be transferred to the tip or the electrode at a transfer setting position in the transfer area based on an image obtained by imaging the transfer area, the transfer setting position being set so that paste can be transferred to the tip or the electrode; and a control unit that controls the mounting unit to transfer paste to the tip or the electrode at the transfer setting position when it is determined that paste can be transferred to the tip or the electrode at the transfer setting position.

Note that these general or specific aspects may be realized as a system, device, method, recording medium, or computer program, or as any combination of a system, device, method, recording medium, and computer program.

The component mounting device and other devices disclosed herein can prevent a decline in transfer quality.

1 is a plan view of a component mounting device according to an embodiment; FIG. 2 is a perspective view of a mounting head according to an embodiment. FIG. 2 is a perspective view of a paste transfer unit according to the embodiment. 3A and 3B are explanatory diagrams illustrating the structure of a paste transfer unit according to an embodiment. 10A to 10C are diagrams for explaining the operation of the paste transfer unit according to the embodiment. FIG. 2 is a functional configuration diagram of the component mounting device according to the embodiment. 4 is a flowchart illustrating a first example of the operation of the component mounting device according to the embodiment. FIG. 10 is a diagram showing an example of a transfer-prohibited area. FIG. 10 is a diagram illustrating an example of a transferable area. FIG. 2 is a diagram for explaining a first size of a component and a second size of a pin. 10A to 10C are diagrams for explaining a procedure for placing components on a board using a mounting head having pins and nozzles. 10 is a flowchart illustrating a second example of the operation of the component mounting device according to the embodiment. 10A and 10B are diagrams for explaining normal and abnormal paste transferred to a substrate. FIG. 10 shows a component mounted on normal paste transferred to a substrate. 10 is a flowchart illustrating a third example of the operation of the component mounting device according to the embodiment.

The component mounting device disclosed herein is a component mounting device that mounts components on a workpiece and includes: a mounting unit having pins that transfer paste to the workpiece or suction nozzles that suck the components; a paste transfer unit in which a film of paste is formed to be transferred to the tip of the pin or the electrode of the component; an imaging unit that images the paste transfer area of the paste transfer unit; a determination unit that determines whether paste can be transferred to the tip or electrode at a transfer setting position in the transfer area based on an image obtained by imaging the transfer area, which is set so that paste can be transferred to the tip or electrode; and a control unit that controls the mounting unit to transfer paste to the tip or electrode at the transfer setting position when it is determined that paste can be transferred to the tip or electrode at the transfer setting position.

This means that the image obtained by capturing an image of the transfer area is used to determine whether or not the paste can be transferred to the tip of the pin or the electrode of the component, making it possible to determine whether or not there are any chips or air bubbles in the paste in the transfer area. If chips or air bubbles are present, the transfer can be prevented, preventing a decline in transfer quality.

Furthermore, when the determination unit determines that the paste cannot be transferred to the tip portion or the electrode at the transfer setting position, the determination unit determines whether there is an area in the transfer area excluding the transfer setting position where the paste can be transferred to the tip portion or the electrode, and when it determines that such an area exists, the control unit may control the attachment unit to transfer the paste to the tip portion or the electrode in that area.

This means that even if paste cannot be transferred to the tip of the pin or the electrode of the component at the transfer setting position, if there is an area in the transfer area excluding the transfer setting position where paste can be transferred, paste can be transferred to the tip of the pin or the electrode of the component in that area. This reduces the number of film formation operations and increases productivity.

The determination unit may also determine whether or not the area exists based on the image and a first size of the component or a second size of the pin. For example, the determination unit may determine whether or not the area exists that is larger than the first size or the second size.

This allows paste to be transferred to the tip of the pin or the electrode of the component in an area larger than the first size of the component or the second size of the pin.

The device may further include a notification unit and a film-forming feasibility determination unit, wherein the film-forming feasibility determination unit determines whether a paste film can be formed in the paste transfer unit when it is determined that the area does not exist, and the notification unit may issue an error notification when it is determined that a paste film cannot be formed in the paste transfer unit.

This means that if there is no area available for transfer in the transfer area and it is not possible to deposit a paste film in the paste transfer unit, a manager or other person can be notified of this. For example, the paste necessary for film deposition can be added to the paste transfer unit, making it possible to deposit a film.

The paste transfer unit may further include a film-forming unit that forms a film of paste, and the control unit may control the film-forming unit to perform a film-forming operation when it is determined that the paste transfer unit can form a film of paste.

This allows paste to be deposited in the paste transfer section if it is possible to do so.

The paste transfer method disclosed herein is a paste transfer method for transferring paste to a pin or component that transfers paste to a workpiece, and includes capturing an image of a paste transfer area of a paste transfer unit where a film of paste to be transferred to the tip of the pin or the electrode of the component is formed; determining whether or not paste can be transferred to the tip or electrode at a transfer setting position in the transfer area set so that paste can be transferred to the tip or electrode based on the image obtained by capturing the image of the transfer area; and transferring paste to the tip or electrode at the transfer setting position if it is determined that paste can be transferred to the tip or electrode at the transfer setting position.

This provides a paste transfer method that can suppress deterioration in transfer quality.

The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step order shown in the following embodiments are merely examples and are not intended to limit the scope of this disclosure.

(Embodiment)
Hereinafter, an embodiment will be described with reference to FIGS. 1 to 15. FIG.

First, the structures of the component mounting device 1, mounting head 10A, and paste transfer unit 7 will be explained using Figures 1 to 5.

Figure 1 is a plan view of a component mounting device 1 according to an embodiment.

Figure 2 is a perspective view of the mounting head 10A according to the embodiment.

Figure 3 is a perspective view of the paste transfer unit 7 according to the embodiment.

Figure 4 is an explanatory diagram of the structure of the paste transfer unit 7 in this embodiment.

Figure 5 is a diagram illustrating the operation of the paste transfer unit 7 according to the embodiment.

As shown in FIG. 1, a board transport mechanism 2 is disposed on the base 1a of the component mounting device 1 in the board transport direction (X direction). The board transport mechanism 2 transports a board 3 that is the target of a component mounting operation (e.g., component mounting using solder or component attachment using adhesive). The board 3 is an example of a workpiece. Note that the workpiece may also be a component. For example, the component mounting device 1 may mount additional components on the components mounted on the board 3. Below, the term "board 3" can be replaced with "component" (e.g., a component mounted on the board 3). Component supply units that supply components are disposed on both sides of the board transport mechanism 2. The front-side component supply unit 4A is equipped with multiple tape feeders 6A that supply electronic components held on tape, and a paste transfer unit 7 that is compatible with other part feeders such as the tape feeder 6A, which is detachably mounted in parallel with the tape feeder 6A. The paste transfer unit 7 (specifically, the film-forming stage 24 (see FIG. 3) described below) forms a film of paste 25 (see FIG. 3) that is transferred and supplied (applied) to components picked up by pins 51 or nozzles 52 of the mounting head 10A described below. The pins 51 are transfer pins that transfer the paste to the substrate 3, and the nozzles 52 are suction nozzles that pick up components to be mounted on the substrate 3. The rear-side component supply unit 4B also has, for example, multiple tape feeders 6B detachably attached. Note that the component supply unit 4B does not have a paste transfer unit 7, but may have one. Furthermore, a tray feeder may be provided instead of the tape feeder 6B.

As shown in FIG. 2, the bottom of the mounting head 10A is provided with multiple tool mounting portions 53 that can be protruded and retracted downward. The tool mounting portions 53 are arranged in a matrix of six by two rows, with two pins 51 and four nozzles 52 detachably attached to one row (six) of the tool mounting portions 53, and six pins 51 detachably attached to the other row (six). Although not shown, the bottom of the mounting head 10B is provided with one row of six tool mounting portions 53, with six nozzles 52 detachably attached to the six tool mounting portions 53. Mounting heads 10A and 10B are examples of mounting portions having pins 51 that transfer paste to the substrate 3 or nozzles 52 that suction-attach components. Mounting head 10A is also an example of a mounting portion having pins 51 that transfer paste to the substrate 3 and nozzles 52 that suction-attach components. Note that the separate mounting heads 10A and 10B may be combined into a mounting unit.

At one end of the base 1a in the X direction, a Y-axis table 8 is disposed in the Y direction perpendicular to the substrate transport mechanism 2. Two X-axis tables 9A and 9B are connected to the Y-axis table 8 for free movement in the Y direction, with a mounting head 10A attached to the X-axis table 9A and a mounting head 10B attached to the X-axis table 9B. By driving the X-axis table 9A and the Y-axis table 8, the pins 51 and nozzles 52 attached to the lower part of the mounting head 10A are moved in the XY plane. In addition, by controlling the tool mounting portion 53 of the mounting head 10A, the pins 51 and nozzles 52 are raised and lowered (moved in the Z direction (see Figure 4)) and rotated about the Z axis) relative to the mounting head 10A. By driving the X-axis table 9B and the Y-axis table 8, the nozzles 52 attached to the lower part of the mounting head 10B are moved in the XY plane. Additionally, by controlling the tool mounting portion 53 of the mounting head 10B, the nozzle 52 is raised and lowered relative to the mounting head 10B and rotated around the Z axis.

X-axis table 9A is equipped with recognition camera 11A, which moves integrally with mounting head 10A, and X-axis table 9B is equipped with recognition camera 11B, which moves integrally with mounting head 10B. As mounting heads 10A and 10B move above substrate 3, recognition cameras 11A and 11B also move to capture images of substrate 3. As mounting heads 10A and 10B move above paste transfer unit 7, recognition cameras 11A and 11B also move to capture images of paste transfer unit 7 (paste transfer area 26 of film formation stage 24 (see Figure 3)). Recognition cameras 11A and 11B are an example of an imaging unit that captures images of transfer area 26. Recognition camera 11A is an example of an imaging unit that captures images of paste transferred to substrate 3.

On base 1a, component recognition cameras 12A and 12B and nozzle stockers 13A and 13B are disposed between component supply units 4A and 4B and board transport mechanism 2. Nozzle stocker 13A stores nozzles 52 for multiple component types to be attached to mounting head 10A. By having mounting head 10A access nozzle stocker 13A and perform a predetermined nozzle replacement operation, the nozzles 52 on mounting head 10A can be replaced according to the component type. Similarly, nozzle stocker 13B stores nozzles 52 for multiple component types to be attached to mounting head 10B. By having mounting head 10B access nozzle stocker 13B and perform a predetermined nozzle replacement operation, the nozzles 52 on mounting head 10B can be replaced according to the component type.

By moving mount head 10A holding a component relative to component recognition camera 12A in the X direction above mount head 10A, component recognition camera 12A reads an image of the component from below, thereby recognizing the type and shape of the component as it is held by mount head 10A. Note that component recognition camera 12A may also read an image of pins 51 from below, thereby recognizing the state of paste transferred to the tips of pins 51. During component mounting by mount head 10A, the mounting position on board 3 is corrected taking into account the board recognition results from recognition camera 11A and component recognition camera 12A. Similarly, by moving mount head 10B holding a component relative to component recognition camera 12B in the X direction above component recognition camera 12B, component recognition camera 12B reads an image of the component from below, thereby recognizing the type and shape of the component as it is held by mount head 10B. During component mounting by mount head 10B, the mounting position on board 3 is corrected taking into account the board recognition results from recognition camera 11B and component recognition camera 12B.

As shown in Figures 3 and 4, the paste transfer unit 7 is configured with an elongated base portion 20 on which the various components described below are mounted. The base portion 20 is detachably attached to the feeder base 16 (see Figure 4(a)) provided in the component supply section 4A, with its longitudinal direction aligned in the Y direction. The front side shown in Figure 3 corresponds to the right side in Figure 4(a), and the rear side shown in Figure 3 corresponds to the left side in Figure 4(a). Note that while an example is described here in which mounting head 10A accesses the paste transfer unit 7, mounting head 10B may also access the paste transfer unit 7.

The paste transfer unit 7 is provided with an engagement portion 20a that engages with the feeder base 16 to secure the base portion 20, and a handle 21 protrudes rearward from the engagement portion 20a. When attaching the paste transfer unit 7 to the feeder base 16, the underside of the base portion 20 is aligned with the upper surface of the feeder base 16, and the handle 21 is grasped and pushed forward, causing the engagement portion 20a to engage with the rear end of the feeder base 16, thereby attaching the base portion 20 to the specified position.

A guide rail 22 is arranged longitudinally on the upper surface of the base part 20, and a slider 23 slidably fitted onto the guide rail 22 is fixed to the underside of the film deposition stage 24. As shown in Figure 4, a feed screw 32 is threadedly engaged with a nut 34 connected to the underside of the film deposition stage 24, and the feed screw 32 is driven to rotate by a motor 31 located on the rear end side of the base part 20. Therefore, by driving the motor 31, the film deposition stage 24 reciprocates longitudinally on the upper surface of the base part 20.

In other words, the guide rail 22, slider 23, nut 34, feed screw 32, and motor 31 form a stage drive means that moves the film formation stage 24 back and forth in the longitudinal direction relative to the base portion 20. This stage drive means is covered with a safety cover 33 to ensure the safety of the operator. Here, the motor 31, which serves as the drive source for the stage drive means, is positioned on the opposite side of the access direction of the mounting head 10A (the left side of Figure 4(a)), so that access of the mounting head 10A to the paste transfer unit 7 is not obstructed. Note that the mounting head 10A accesses the paste transfer unit 7 from the right side of Figure 4(a), for example.

The film-forming stage 24 has a structure in which a recess with a smooth bottom is formed on the upper surface of a rectangular member, and the bottom surface of this recess serves as a film-forming surface 24a for forming (depositing) a film of paste 25. The film-forming stage 24 is an example of a paste transfer unit in which a film of paste 25 is formed to be transferred to the tips of the pins 51 or to the electrodes of the components. The film-forming stage 24 is also an example of a paste supply unit for supplying paste to the tips of the pins 51. The paste may be, for example, solder, adhesive, or flux. The film-forming surface 24a is provided with a transfer area 26 for transferring paste to components adsorbed on the pins 51 or nozzles 52 provided on the mounting head 10A. The size of the transfer area 26 is set so that paste can be transferred simultaneously to multiple components adsorbed on the multiple pins 51 and/or multiple nozzles 52 of the mounting head 10A. In this case, because the film formation stage 24 is rectangular, it is possible to set the transfer area 26 as large as possible relative to the width dimension of the film formation stage 24, making it possible to minimize the overall width of the paste transfer unit 7.

The paste transfer unit 7 includes a film-forming squeegee unit 28 and a scraping unit 29, which are positioned behind the transfer area 26 and do not interfere with the mounting head 10A. The film-forming squeegee unit 28 and the scraping unit 29 are an example of a film-forming section that forms a film of paste on the film-forming stage 24. A needle 30a of a paste supply syringe 30 is inserted between the film-forming squeegee unit 28 and the scraping unit 29. The film-forming squeegee unit 28 is held by a bracket 27 erected on the base 20, which fixes its horizontal position relative to the base 20.

The detailed structure of the film-forming squeegee unit 28 will be described with reference to Figures 4(a) and (b). Note that Figure 4(b) shows cross section A in Figure 4(a).

As shown in Figure 4(a), the film-forming squeegee unit 28 includes a squeegee 28a that extends downward and whose lower end maintains a film-forming gap g (see Figure 5(a)) between itself and the film-forming surface 24a. The squeegee 28a is connected to a connecting member 35. The connecting member 35 is attached to the bracket 27 via a slide unit 37, allowing the squeegee 28a to move up and down freely relative to the bracket 27.

By moving the film formation stage 24, with paste 25 supplied to the film formation surface 24a, horizontally in the Y direction using the stage drive means described above, the squeegee 28a spreads the paste 25 on the film formation surface 24a, forming a film with a thickness corresponding to the film formation gap g. Then, by moving the film formation stage 24 after film formation toward the access direction of the mounting head 10A (to the right in Figure 4(a)), the transfer area 26 on which the film-like paste 25 has been formed can be positioned at the paste transfer operation position by the mounting head 10A, as shown in Figure 4(a).

The scraper unit 29 is equipped with a scraper 29a that extends downward. The scraper 29a is biased downward so that it is always in contact with the film formation surface 24a regardless of the height position of the film formation stage 24. By reciprocating the film formation stage 24 in the Y direction using a stage drive means, the scraper 29a scrapes the paste 25 on the film formation stage 24.

A reflective optical sensor 14 is disposed above the film-forming stage 24, between the squeegee 28a and the scraper 29a. The detection direction of the inspection optical axis 14a of the reflective optical sensor 14 faces the film-forming surface 24a. The optical sensor 14 irradiates the film-forming surface 24a with inspection light and receives the reflected light. This received light signal is detected and processed by the detection processing unit 15 to detect the remaining amount of paste 25 on the film-forming surface 24a. The control/drive unit 45 then receives this detection result and determines whether or not paste needs to be replenished.

The optical sensor 14, detection processing unit 15, and control/drive unit 45 therefore constitute a paste remaining amount detection means that detects the remaining amount of paste 25 using the optical sensor 14, which is disposed between the squeegee 28a and the scraper 29a with its detection direction facing the film formation surface 24a, and determines whether replenishment is required. This paste remaining amount detection means is configured to detect the paste 25 using the optical sensor 14 after the film formation stage 24 begins to move when the scraper 29a scrapes off the paste 25. If the paste remaining amount detection means determines that paste replenishment is required, paste is supplied to the film formation stage 24 by the paste supply means consisting of the paste supply syringe 30 and needle 30a. The detection processing unit 15 is an example of a film formation feasibility determination unit.

A vertically disposed lifting member 36 is connected to the connecting member 35, and a cam follower 38 is connected to the lower end of the lifting member 36 that penetrates into the base portion 20. A motor 40 is disposed horizontally inside the base portion 20, and a disc cam 39 connected to the rotation shaft of the motor 40 abuts against the cam follower 38. By driving the motor 40 to rotate in this state, the lifting member 36 rises and falls in accordance with the cam characteristics of the disc cam 39, causing the squeegee 28a to rise and fall relative to the film formation surface 24a.

In other words, the lifting member 36, cam follower 38, disc cam 39, and motor 40 constitute a squeegee position adjustment means for adjusting the vertical position of the squeegee 28a. During the film formation operation described below, the vertical position of the squeegee 28a can be adjusted to change the film formation gap g between the lower end of the squeegee 28a and the film formation surface 24a, thereby varying the thickness of the paste 25 film on the film formation surface 24a. Note that, although a cam mechanism combining the cam follower 38 and disc cam 39 is used as the squeegee position adjustment means here, any drive system other than a cam mechanism can be used as long as it is a linear motion mechanism that can raise and lower the lifting member 36 as desired.

As shown in Figure 4(a), the engaging portion 20a on the underside of the base portion 20 is provided with an air coupler 41a and an electrical connector 41b that constitute the unit-side connecting portion 41. The air coupler 41a and the electrical connector 41b are connected to a control and drive unit 45 built into the paste transfer unit 7 by air piping and electrical wiring, respectively. The control and drive unit 45 controls and drives the motor 31 that drives the stage drive means and the motor 40 that drives the film-forming squeegee unit 28, supplies and controls compressed air to eject paste from the paste supply syringe 30, and further determines whether paste needs to be replenished on the film-forming surface 24a using the optical sensor 14 and the detection processing unit 15.

The rear end of the feeder base 16 is provided with a base-side connection 42 consisting of an air coupler 42a and an electrical connector 42b. The air coupler 42a and electrical connector 42b are connected to the control/power supply unit 43 and compressed air supply source 44 by air piping and electrical wiring, respectively. When the paste transfer unit 7 is slid forward along the feeder base 16 and installed, the unit-side connection 41 engages with the base-side connection 42. This electrically connects the control/power supply unit 43 to the control/drive unit 45, and further enables compressed air to be supplied to the control/drive unit 45 from the compressed air supply source 44. These connections are then interrupted by sliding the paste transfer unit 7 rearward.

In other words, the paste transfer unit 7 is connected to a base-side connection part 42 provided on the feeder base 16 and is configured with a unit-side connection part 41 that transmits control signals and supplies power. As a result, simply by attaching the paste transfer unit 7 to the feeder base 16, control signals are transmitted and driving power is supplied from the control and power supply part 43 to the control and drive unit 45 without any additional connection work, and compressed air for driving is supplied to the control and drive unit 45 from the compressed air supply source 44.

Next, referring to Figure 5, the film formation operation and scraping operation performed by the paste transfer unit 7 will be described. First, Figure 5(a) shows the state in which the film formation stage 24 is in the retracted position, and before the start of the film formation operation, the squeegee 28a and scraper 29a are positioned at the end of the film formation surface 24a on the film formation start side (the right end in this example), and paste 25 is supplied between the squeegee 28a and scraper 29a via the needle 30a. When the film formation operation starts, the film formation gap g between the lower end of the squeegee 28a and the film formation surface 24a is set to a film thickness t appropriate for transferring the paste to the electrode of the component.

Next, the stage moving means is driven to advance the film-forming stage 24 (arrow b), as shown in Figure 5(b). As a result, the paste 25 is spread by the squeegee 28a on the film-forming surface 24a, and paste 25 with a film thickness of t is formed on the film-forming surface 24a. Then, as shown in Figure 5(c), the mounting head 10A moves above the film-forming stage 24, and the pins 51 and/or the nozzles 52 holding the components are raised and lowered (arrow c) to perform a transfer operation, transferring (supplying) the paste to the tips of the pins 51 and/or the electrodes of the components.

Then, the paste 25 is scraped. That is, as shown in Figure 5(d), the squeegee 28a is raised (arrow d) and the film-forming stage 24 is retracted (arrow e). As a result, the paste 25 present on the film-forming surface 24a is scraped to one side by the scraper 29a and accumulated between the squeegee 28a and the scraper 29a, returning to the state shown in Figure 5(a). Thereafter, the film-forming operation and the scraping operation are repeated in the same manner.

Next, the control system configuration of the component mounting device 1 will be explained using Figure 6.

Figure 6 is a functional configuration diagram of the component mounting device 1 according to the embodiment.

The control unit 100 includes a mounting control unit 101 and a transfer control unit 102. The mounting control unit 101 controls the operations of the X-axis tables 9A and 9B, the Y-axis table 8, and the mounting heads 10A and 10B via the mechanism drive unit 200. The transfer control unit 102 controls the transfer operation of transferring paste to the electrodes of the component adsorbed to the pins 51 and/or nozzles 52, as well as the film formation operation in the paste transfer unit 7, by lowering the pins 51 and/or nozzles 52 of the mounting head 10A toward the paste 25 in the transfer area 26 of the film formation stage 24 via the mechanism drive unit 200. The control/drive unit 45 shown in Figure 4(a) is an example of the control unit 100.

The recognition processing unit 300 performs recognition processing on images obtained by imaging with the recognition cameras 11A and 11B and the component recognition cameras 12A and 12B. The recognition processing unit 300 is an example of a judgment unit that judges, based on images obtained by imaging the transfer area 26, whether paste can be transferred to the tips of the pins 51 or the electrodes of the component adsorbed to the nozzle 52 at a transfer setting position (transfer setting area) in the transfer area 26 that is set so that paste can be transferred to the tips of the pins 51 or the electrodes of the component adsorbed to the nozzle 52. The recognition processing unit 300 is also an example of a judgment unit that determines, based on images obtained by imaging the paste transferred to the substrate 3, whether there is an abnormality in the paste transferred to the substrate 3.

The operation/input unit 400 accepts operations or inputs from the operator to the component mounting device 1. The operation/input unit 400 is, for example, a keyboard, mouse, or touch panel.

The display unit 500 is a display or the like that displays information to the worker. There are no particular limitations on the content displayed on the display unit 500, but for example, the status of the component mounting device 1, the work to be performed by the worker, errors, etc. may be displayed on the display unit 500. For example, if the display unit 500 issues an error notification, the display unit 500 is an example of a notification unit.

The storage unit 600 includes a component information storage unit 601 and a transfer information storage unit 602. The component information storage unit 601 stores component information about components to be mounted by the component mounting device 1. This component information includes data about the component size. The transfer information storage unit 602 stores transfer setting positions according to the component size (first size) or the pin 51 size (second size). The transfer setting positions are positions in the transfer area 26 of the film formation stage 24 where paste is transferred to the electrodes of the component or the tips of the pins 51, and are set according to the size of the component or the pins 51, and the positions in the transfer area 26 where transfer has already occurred after film formation. In other words, the transfer setting positions are set according to the size of the component or pins to which paste is to be transferred, from positions in the transfer area 26 where transfer has not yet occurred after film formation.

Next, a first example of the operation of the component mounting device 1 will be explained using Figure 7.

Figure 7 is a flowchart showing a first example of the operation of the component mounting device 1 according to the embodiment.

First, the control unit 100 controls the mounting head 10A to pick up the component to be mounted on the component mounting device 1 (step S101).

Next, the component recognition camera 12A captures an image of the component picked up by the nozzle 52 of the mounting head 10A, and the recognition processing unit 300 performs a component recognition process to determine whether the component has been correctly picked up by the nozzle 52 based on the image obtained by capturing the component (step S102). For example, if there is an error in the component recognition process, such as the component not being correctly picked up by the nozzle 52, an error notification may be issued to indicate this. The error notification may be issued by emitting a buzzer sound, turning on or blinking a lamp, or displaying an error on the display unit 500.

Next, the recognition camera 11A captures an image of the transfer area 26 of the film-forming stage 24 where the paste 25 is formed in a film form (step S103).

Next, the recognition processing unit 300 determines whether or not paste can be transferred to the electrodes of the component attracted to the nozzle 52 at the transfer setting position, based on the image obtained by capturing the transfer area 26 (step S104). Here, examples of transfer-prohibited areas where paste cannot be transferred and transfer-possible areas where paste can be transferred are described using Figures 8 and 9.

Figure 8 shows an example of a transfer-prohibited area.

Figure 9 shows an example of a transferable area.

For example, as shown in FIG. 8, a transfer-prohibited area is an area where chips or bubbles have occurred in the paste 25. The occurrence of chips or bubbles can be recognized based on the image obtained by capturing the transfer area 26. In this case, the recognition processing unit 300 can determine that paste cannot be transferred to the electrodes of the component at the transfer setting position. As shown in the upper part of FIG. 9, the transfer-possible area may be an area surrounded by depressions corresponding to the electrodes of a QFP (Quad Flat Package) component that are formed in the transfer area 26 of the deposition stage 24 after transfer to the electrodes of the QFP component. For example, when transferring paste to the electrodes of a BGA (Ball Grid Array) component, it may be possible to transfer the paste to the electrodes of the BGA component in such a transfer-possible area, as shown in the lower part of FIG. 9.

The components to be mounted by the component mounting device 1, which have paste transferred to their electrodes, include various types of lead components and surface mount components. Lead components also include axial components, DIP (Dual Inline Package) components, SIP (Single Inline Package) components, and PGA (Pin Grid Array) components. In addition to the QFP and BGA components mentioned above, surface mount components include SOP (Small Outline Package) components, SSOP (Shrink Small Outline Package) components, SOJ (Small Outline J-leaded) components, chip components, QFN (Quad Flat No-Leads) components, and CSP (Chip Size Package) components. Component sizes vary depending on the type of component, but component size information is stored in the component information storage unit 601. The recognition processing unit 300 obtains component size information from the component information storage unit 601 and, based on the size of the component to which the paste is to be transferred, determines whether the paste can be transferred to the component electrodes at the transfer setting position.

Here, the component size (first size) will be explained using Figure 10. Note that Figure 10 also shows the size of the pin 51 (second size).

Figure 10 is a diagram illustrating the first size of the part and the second size of the pin 51.

If the component is a lead component, the first size of the component may be an area that extends beyond the outer periphery of the component body (package) and surrounds all of the component's electrodes, as shown in Figure 10(a). Also, although not shown, if the component is a surface-mount component, the first size of the component may be an area that is smaller than the outer periphery of the component body (package) and surrounds all of the component's electrodes.

The second size of the pin 51 may be the size of a cross section of the pin 51 perpendicular to the axial direction of the pin 51, or may be a square enclosing the cross section, with one side equal to the diameter of the pin, as shown in Figure 10 (b).

Returning to the explanation in Figure 7, if it is determined that paste can be transferred to the electrodes of the component adsorbed to the nozzle 52 at the transfer setting position (Yes in step S104), the control unit 100 controls the mounting head 10A to transfer paste to the electrodes of the component adsorbed to the nozzle 52 at the transfer setting position (step S105).

Next, the component recognition camera 12A captures an image of the component that has been adsorbed onto the nozzle 52 of the mounting head 10A and has paste transferred to its electrode. Based on the image obtained by capturing the component, the recognition processing unit 300 performs a component recognition process to determine whether the component has been properly adsorbed onto the nozzle 52, whether the component has fallen, whether the paste has been properly transferred to the electrode, etc. (Step S106). For example, if there is an error in the component recognition process, such as the component not being properly adsorbed onto the nozzle 52 or the paste not being properly transferred to the electrode, an error notification indicating this may be issued.

Then, the control unit 100 controls the mounting head 10A to mount the component on the board 3 (step S107).

On the other hand, if the recognition processing unit 300 determines that paste cannot be transferred to the electrodes of the component adsorbed to the nozzle 52 at the transfer setting position (No in step S104), it determines whether there is an area in the transfer area 26 excluding the transfer setting position where paste can be transferred to the electrodes of the component (step S108). That is, the recognition processing unit 300 determines whether paste can be transferred to the electrodes of the component in an area other than the transfer setting position in the transfer area 26. For example, the recognition processing unit 300 determines whether there is an area where paste can be transferred to the electrodes of the component based on an image obtained by capturing the transfer area 26 and the first size of the component. Specifically, the recognition processing unit 300 determines whether there is an area of the component that is larger than the first size of the component where paste can be transferred to the electrodes of the component. The area where paste can be transferred to the electrodes of the component is, for example, not a transfer-prohibited area as shown in FIG. 8, but a transfer-possible area as shown in FIG. 9.

If it is determined that there is an area where paste can be transferred to the electrodes of the component (Yes in step S108), the control unit 100 controls the mounting head 10A to transfer paste to the electrodes of the component adsorbed by the nozzle 52 in that area (step S105).

If it is determined that there is no area on the component electrode to which the paste can be transferred (No in step S108), the detection processing unit 15 determines whether or not a film of paste 25 can be formed on the film-forming stage 24 (step S109). For example, if the remaining amount of paste 25 is less than a predetermined amount, it is determined that a film of paste 25 cannot be formed. The predetermined amount is set as appropriate.

The method for determining whether or not a film of paste 25 can be formed on the film-forming stage 24 is not limited to a method based on the remaining amount of paste 25. For example, whether or not a film of paste 25 can be formed on the film-forming stage 24 may be determined based on whether the number of film-forming operations since the last time paste was supplied to the film-forming stage 24 is less than a predetermined number. In this case, the component mounting device 1 does not need to be equipped with an optical sensor 14.

If it is determined that a film of paste 25 can be formed on the film-forming stage 24 (Yes in step S109), the control unit 100 controls the film-forming squeegee unit 28 and the scraping unit 29 to perform a film-forming operation (step S110). As a result, a film of paste 25 is formed on the film-forming stage 24, as shown in (b) of Figure 5.

If it is determined that it is not possible to form a film of paste 25 on the film-forming stage 24 (No in step S109), the display unit 500 notifies (displays) an error indicating that it is not possible to form a film of paste 25 on the film-forming stage 24 (step S111). Note that the error notification is not limited to the display unit 500, and may be made by voice from a buzzer or speaker, as an example of a notification unit, or by lighting or flashing a lamp, as an example of a notification unit.

In addition, paste may be transferred to the electrodes of a component adsorbed by the nozzle 52 of the mounting head 10B, and the mounting head 10A described in the first example may be replaced by mounting head 10B, the recognition camera 11A by recognition camera 11B, and the component recognition camera 12A by component recognition camera 12B. In this case, the mounting head 10B is an example of a mounting unit.

In the first example above, paste is transferred to the electrodes of a component adsorbed to the nozzle 52, and the component with the paste transferred to the electrodes is mounted on the board 3, but this is not limited to this. For example, as shown in FIG. 11, paste may be transferred to the tip of a pin 51, and the pin 51 with the paste transferred to its tip may then transfer the paste to the location on the board 3 where the component will be mounted, and the component adsorbed to the nozzle 52 may be mounted on top of the paste transferred to the board 3.

Figure 11 is a diagram illustrating the procedure for mounting a component onto a board 3 using a mounting head 10A having pins 51 and nozzles 52.

The control unit 100 moves the mounting head 10A, which has pins 51 with paste transferred to their tips and nozzles 52 holding components, above the board 3, and positions the tips of the pins 51 directly above component mounting position R on the board 3 (FIG. 11(a)). The control unit 100 then causes the pins 51 to protrude and retract downward relative to the mounting head 10A, transferring the paste Bd attached to the tips of the pins 51 to component mounting position R on the board 3. This transfer of paste Bd is specifically achieved by lowering the pins 51 relative to the mounting head 10A (arrow C1 in FIG. 11(b)), and then raising the pins 51 when the paste Bd attached to the tips of the pins 51 comes into contact with the board 3 (arrow C2 in FIG. 11(c)).

After the control unit 100 applies the paste Bd to the component mounting position R on the board 3 using the pins 51, it slides the mounting head 10A horizontally (arrow D1 in FIG. 11(d)) to position the lower end of the nozzle 52 directly above the component mounting position R (FIG. 11(d)). The control unit 100 then retracts the nozzle 52 downward relative to the mounting head 10A, thereby mounting the component Cp adsorbed by the nozzle 52 at the component mounting position R on the board 3 where the paste Bd was transferred. Specifically, the control unit 100 lowers the nozzle 52 relative to the mounting head 10A (arrow E1 in FIG. 11(e)), releases the nozzle 52 from adsorption of the component Cp when the component Cp adsorbed to the lower end of the nozzle 52 comes into contact with the board 3, and then raises the nozzle 52 (arrow E2 in FIG. 11(f)). When mounting component Cp at component mounting position R on board 3, position correction (including rotation correction) of nozzle 52 relative to board 3 may be performed to correct the previously determined positional deviation of board 3 and the adsorption deviation of component Cp.

Next, a second example of the operation of the component mounting device 1 will be explained in detail using Figure 12.

Figure 12 is a flowchart showing a second example of the operation of the component mounting device 1 according to the embodiment.

The processing from steps S201 to S203 is the same as the processing from steps S101 to S103 in the first example described using Figure 7, so a detailed description will be omitted.

The recognition processing unit 300 determines whether or not paste can be transferred to the tip of the pin 51 at the transfer setting position based on the image obtained by capturing the transfer area 26 (step S204). For example, the recognition processing unit 300 obtains information on the size of the pin 51 from the memory unit 600, etc., and determines whether or not paste can be transferred to the tip of the pin 51 at the transfer setting position based on the size of the pin 51 to which the paste is to be transferred.

If it is determined that paste can be transferred to the tip of the pin 51 at the transfer setting position (Yes in step S204), the control unit 100 controls the mounting head 10A to transfer paste to the tip of the pin 51 at the transfer setting position (step S205).

Next, the component recognition camera 12A captures an image of the component and pin 51 adsorbed to the nozzle 52 of the mounting head 10A, and the recognition processing unit 300 performs a component and pin 51 recognition process based on the image obtained by capturing the component and pin 51 to determine whether the component is correctly adsorbed to the nozzle 52, whether the component has fallen off due to the transfer operation, and whether the paste has been correctly transferred to the tip of the pin 51 (step S206). For example, if there is an error in the component recognition process, such as the component not being correctly adsorbed to the nozzle 52, an error notification indicating this may be issued. Furthermore, if there is an error in the pin recognition process, such as the paste not being correctly transferred to the tip of the pin 51, an error notification indicating this may be issued.

Next, the control unit 100 controls the mounting head 10A so that the paste transferred (supplied) to the tip of the pin 51 is transferred to the substrate 3, as shown in (a) to (c) of Figure 11 (step S207).

Next, the recognition camera 11A captures an image of the paste transferred to the substrate 3 (step S208).

Next, the recognition processing unit 300 determines whether or not there is an abnormality in the paste transferred to the substrate 3 based on the image obtained by imaging the paste transferred to the substrate 3 (step S209). For example, the recognition processing unit 300 may determine whether or not there is an abnormality based on the size or position of the paste transferred to the substrate 3 in the image obtained by imaging the paste transferred to the substrate 3.

For example, the recognition processing unit 300 can determine the edges of the paste in an image captured by a black-and-white camera or the like, thereby determining the size (area) of the paste. Alternatively, the recognition processing unit 300 can determine the size (volume) of the paste by acquiring three-dimensional information using any method, such as a stereo method, a ToF (Time of Flight) method, or a method using structured illumination. For example, the recognition processing unit 300 can determine that there is no abnormality if the outer diameter of the paste is equal to or greater than a first predetermined value and equal to or less than a second predetermined value. In other words, it can determine that there is no abnormality if the outer diameter of the paste is neither too small nor too large compared to the target outer diameter. Furthermore, for example, the recognition processing unit 300 can determine that there is no abnormality if the volume of the paste is equal to or greater than a third predetermined value and equal to or less than a fourth predetermined value. In other words, it can determine that there is no abnormality if the volume of the paste is neither too small nor too large compared to the target volume.

Furthermore, for example, the recognition processing unit 300 may determine that there is no abnormality if the distance between the transfer setting position of the paste to be transferred to the substrate 3 (e.g., the central coordinates of the land on which the electrode of the component is mounted) and the position of the paste transferred to the substrate 3 (e.g., the central coordinates of the paste) is equal to or less than a fifth predetermined value. In other words, it can be determined that there is no abnormality if the position of the paste is not too far away from the land, etc. by more than a predetermined value. The first, second, third, fourth, and fifth predetermined values are not particularly limited and may be set appropriately depending on, for example, the size of the pin 51 or the size of the component.

Here, normal and abnormal paste transferred to substrate 3 will be explained using Figures 13 and 14.

Figure 13 is a diagram illustrating normal and abnormal paste transferred to substrate 3.

Figure 14 shows a component mounted on normal paste transferred to substrate 3.

Figure 13(a) shows normal paste transferred to board 3, while Figures 13(b) and (c) show abnormal paste transferred to board 3. For example, as shown in Figure 13(a), if the paste does not overflow from the lands on which the component electrodes are mounted and is not too small, it is determined that there is no abnormality in the paste transferred to board 3. For example, as shown in Figure 13(b), if the paste size is too small for the lands on which the component electrodes are mounted, it is determined that there is an abnormality in the paste transferred to board 3. For example, as shown in Figure 13(c), if the center of the paste is too far from the center of the lands on which the component electrodes are mounted, it is determined that there is an abnormality in the paste transferred to board 3. As shown in Figure 14, if there is no abnormality in the paste transferred to board 3, the component is mounted on normal paste, which prevents a decrease in component mounting quality.

Returning to the explanation in Figure 12, if it is determined that there is no abnormality in the paste transferred to the substrate 3 (No in step S209), the control unit 100 controls the mounting head 10A to mount a component on the paste transferred to the substrate 3 (step S210).

If it is determined that there is an abnormality in the paste transferred to the substrate 3 (Yes in step S209), the display unit 500 notifies (displays) an error indicating that there is an abnormality in the paste transferred to the substrate 3 (step S211). Note that the error notification is not limited to the display unit 500, and may be made by voice from a buzzer or speaker (example of a notification unit), or by lighting or flashing a lamp (example of a notification unit).

On the other hand, if the recognition processing unit 300 determines that paste cannot be transferred to the tip of the pin 51 at the transfer setting position (No in step S204), it determines whether there is an area in the transfer area 26 excluding the transfer setting position where paste can be transferred to the tip of the pin 51 (step S212). In other words, the recognition processing unit 300 determines whether paste can be transferred to the tip of the pin 51 in an area other than the transfer setting position in the transfer area 26. For example, the recognition processing unit 300 determines whether there is an area where paste can be transferred to the tip of the pin 51 based on the image obtained by capturing the transfer area 26 and the second size of the pin 51. Specifically, the recognition processing unit 300 determines whether there is an area larger than the second size of the pin 51 where paste can be transferred to the tip of the pin 51.

If it is determined that there is an area where paste can be transferred to the tip of the pin 51 (Yes in step S212), the control unit 100 controls the mounting head 10A to transfer paste to the tip of the pin 51 in that area (step S205).

The processing from step S212 to step S214 is the same as the processing from step S108 to step S110 in the first example described using Figure 7, so further explanation will be omitted.

In the second example above, the transfer of paste from the pins 51 to the board 3 and the placement of components from the nozzles 52 on the board 3 are performed by a single mounting head 10A that has both the pins 51 and the nozzles 52, but this is not limited to this. For example, the transfer of paste from the pins 51 to the board 3 and the placement of components from the nozzles 52 on the board 3 may each be performed by different mounting heads. This will be explained using Figure 15. For example, in the third example described in Figure 15, the pins 51 of mounting head 10A and the nozzles 52 of mounting head 10B are used. In this case, mounting head 10A does not have to have a nozzle 52.

Figure 15 is a flowchart showing a third example of the operation of the component mounting device 1 according to the embodiment.

First, the control unit 100 controls the rear mounting head 10B to pick up the component to be mounted on the component mounting device 1 (step S301).

Next, the rear-side component recognition camera 12B captures an image of the component picked up by the nozzle 52 of the mounting head 10B, and the recognition processing unit 300 performs component recognition processing based on the image obtained by capturing the component (step S302).

Next, the front-side recognition camera 11A captures an image of the transfer area 26 where the paste 25 is formed in a film form (step S303).

Next, the recognition processing unit 300 determines whether or not paste can be transferred to the tip of the pin 51 of the mounting head 10A at the transfer setting position based on the image obtained by capturing the transfer area 26 (step S304).

If it is determined that paste can be transferred to the tip of the pin 51 of the mounting head 10A at the transfer setting position (Yes in step S304), the control unit 100 controls the mounting head 10A to transfer paste to the tip of the pin 51 of the front mounting head 10A at the transfer setting position (step S305).

Next, the front-side component recognition camera 12A captures an image of the pin 51 on the mounting head 10A, and the recognition processing unit 300 performs pin 51 recognition processing to determine whether the paste has been correctly transferred to the tip of the pin 51, based on the image obtained by capturing the pin 51 (step S306).

Next, the control unit 100 controls the mounting head 10A so that the paste transferred (supplied) to the tip of the pin 51 is transferred to the substrate 3 (step S307).

Next, the rear-side recognition camera 11B captures an image of the paste transferred to the board 3 (step S308). The recognition camera 11B is provided on the mounting head 10B, which has the nozzle 52 that is picking up the component, and the recognition camera 11B captures an image as the mounting head 10B moves above the board 3 and places the component on the board 3.

Next, the recognition processing unit 300 determines whether there is any abnormality in the paste transferred to the substrate 3 based on the image obtained by capturing the paste transferred to the substrate 3 (step S309).

If it is determined that there is no abnormality in the paste transferred to the substrate 3 (No in step S309), the control unit 100 controls the mounting head 10B to mount a component on the paste transferred to the substrate 3 (step S310).

The processing in step S311 is the same as the processing in step S211 in the second example described using Figure 12, and the processing from step S312 to step S314 is the same as the processing from step S212 to step S214 in the second example described using Figure 12, so explanations for each will be omitted.

In the first and second examples, mounting head 10A was described as an example of a mounting unit, but in the third example, mounting heads 10A and 10B are collectively referred to as the mounting unit. Specifically, in the third example, the mounting unit has a first mounting unit (mounting head 10A) equipped with pins 51, and a second mounting unit (mounting head 10B) provided separately from the first mounting unit and equipped with nozzles 52. The control unit 100 controls the first mounting unit (mounting head 10A) so that paste supplied to the tips of the pins 51 is transferred to the substrate 3, and if it is determined that there is no abnormality in the paste transferred to the substrate 3, controls the second mounting unit (mounting head 10B) so that a component is mounted on the paste transferred to the substrate 3.

As shown in FIG. 2, mounting head 10A may have multiple pins 51 and nozzles 52, and mounting head 10B may have multiple nozzles 52. In this case, paste may be transferred to multiple locations on board 3 by each of the multiple pins. The recognition processing unit 300 may determine whether or not there is an abnormality in the paste transferred to board 3 by each of the multiple pins 51 based on images obtained by capturing the paste at multiple locations transferred to board 3, and the control unit 100 may control mounting head 10A or 10B to mount components on each of the pastes transferred to board 3 by each of the multiple pins 51, excluding the paste determined to be abnormal.

As explained above, when determining whether paste can be transferred to the tip of the pin 51 or the electrode of the component attracted to the nozzle 52, the image obtained by imaging the transfer area 26 is used, making it possible to determine whether chips or air bubbles have occurred in the paste in the transfer area 26. If chips or air bubbles have occurred, transfer can be prevented, preventing a decline in transfer quality.

(Other embodiments)
While the component mounting apparatus 1 of the present disclosure has been described above based on the embodiment, the present disclosure is not limited to the above embodiment. As long as it does not deviate from the spirit of the present disclosure, various modifications conceivable by those skilled in the art to the present embodiment and configurations constructed by combining components of different embodiments are also included within the scope of the present disclosure.

For example, the present disclosure can be realized not only as a component mounting device 1, but also as a paste transfer method that includes steps (processing) performed by each component that makes up the component mounting device 1.

The paste transfer method is a method for transferring paste to a pin or component that transfers paste to a workpiece, and includes the steps of: capturing an image of a paste transfer unit in which a film of paste to be transferred to the tip of the pin or electrode of the component is formed (step S103 of FIG. 7, step S203 of FIG. 12, or step S303 of FIG. 15); determining whether paste can be transferred to the tip of the pin or electrode of the component at a transfer setting position in the paste transfer unit set to transfer paste to the tip of the pin or electrode of the component based on the image obtained by capturing the paste transfer unit (step S104 of FIG. 7, step S204 of FIG. 12, or step S304 of FIG. 15); and, if it is determined that paste can be transferred to the tip of the pin or electrode of the component at the transfer setting position, transferring paste to the tip of the pin or electrode of the component at the transfer setting position (step S105 of FIG. 7, step S205 of FIG. 12, or step S305 of FIG. 15).

For example, the steps in the paste transfer method may be executed by a computer (computer system). The present disclosure can be realized as a program for causing a computer to execute the steps included in the paste transfer method. Furthermore, the present disclosure can be realized as a non-transitory computer-readable recording medium, such as a CD-ROM, on which the program is recorded.

For example, if the present disclosure is realized as a program (software), each step is performed by running the program using hardware resources such as a computer's CPU, memory, and input/output circuits. In other words, each step is performed by the CPU obtaining data from memory or input/output circuits, etc., performing calculations, and outputting the calculation results to memory or input/output circuits, etc.

Furthermore, each component included in the component mounting device 1 of the above embodiment may be realized as a dedicated or general-purpose circuit.

Furthermore, each component included in the component mounting device 1 of the above embodiment may be realized as an LSI (Large Scale Integration), which is an integrated circuit (IC).

Furthermore, the integrated circuit is not limited to an LSI, but may be realized using a dedicated circuit or a general-purpose processor. A programmable FPGA (Field Programmable Gate Array) or a reconfigurable processor, in which the connections and settings of circuit cells within the LSI can be reconfigured, may also be used.

Furthermore, if advances in semiconductor technology or derivative technologies result in the emergence of integrated circuit technology that can replace LSIs, that technology may naturally be used to integrate the various components included in the worker assistance system.

In addition, this disclosure also includes forms obtained by applying various modifications to the embodiments that would occur to those skilled in the art, as well as forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the spirit of this disclosure.

This disclosure is useful in fields where components are mounted on circuit boards and the like using component mounting devices.

REFERENCE SIGNS LIST 1 Component mounting device 1a Base 2 Substrate transport mechanism 3 Substrate 4A, 4B Component supply section 6A, 6B Tape feeder 7 Paste transfer unit 8 Y-axis table 9A, 9B X-axis table 10A, 10B Mounting head 11A, 11B Recognition camera 12A, 12B Component recognition camera 13A, 13B Nozzle stocker 14 Optical sensor 14a Inspection optical axis 15 Detection processing section 16 Feeder base 20 Base section 20a Engagement section 21 Handle 22 Guide rail 23 Slider 24 Film formation stage 24a Film formation surface 25 Paste 26 Transfer area 27 Bracket 28 Film formation squeegee unit 28a Squeegee 29 Scraper unit 29a Scraper 30 Paste supply syringe 30a Needle 31, 40 Motor 32 Feed screw 33 Safety cover 34 Nut 35 Connecting member 36 Lifting member 37 Slide unit 38 Cam follower 39 Disc cam 41 Unit side connecting portion 41a, 42a Air coupler 41b, 42b Electrical connector 42 Base side connecting portion 43 Control and power supply portion 44 Compressed air supply source 45 Control and drive unit 51 Pin 52 Nozzle 53 Tool mounting portion 100 Control portion 101 Mounting control portion 102 Transfer control portion 200 Mechanism drive portion 300 Recognition processing portion 400 Operation and input portion 500 Display portion 600 Storage portion 601 Part information storage portion 602 Transfer information storage portion

Claims (4)

A component mounting device that mounts components on a workpiece,
a mounting unit having a pin for transferring paste to the workpiece or a suction nozzle for suctioning the component;
a paste transfer section in which a paste to be transferred to the tip of the pin or the electrode of the component is formed in a film form;
an imaging unit that images a paste transfer area of the paste transfer unit;
a determination unit that determines whether or not the paste can be transferred to the tip portion or the electrode at a transfer setting position in the transfer area, the transfer setting position being set so that the paste can be transferred to the tip portion or the electrode, based on an image obtained by imaging the transfer area;
a control unit that controls the attachment unit to transfer the paste to the tip portion or the electrode at the transfer setting position when it is determined that the paste can be transferred to the tip portion or the electrode at the transfer setting position ,
when it is determined that the paste cannot be transferred to the tip portion or the electrode at the transfer setting position, the determination unit determines, based on the image and the first size of the component or the second size of the pin, whether or not there is an area in the transfer area excluding the transfer setting position that is larger than the first size or the second size and that can transfer the paste to the tip portion or the electrode;
When it is determined that the area exists, the control unit controls the attachment unit to transfer paste to the tip portion or the electrode in the area.
Component placement device. The notification department,
a film formation possibility determination unit,
the film-forming possibility determination unit determines whether or not a paste film can be formed in the paste transfer unit when it is determined that the area does not exist;
the notification unit notifies an error when it is determined that the paste cannot be deposited in the paste transfer unit.
2. The component mounting device according to claim 1 . The paste transfer unit further includes a film forming unit that forms a film of the paste,
the control unit controls the film forming unit to perform a film forming operation when it is determined that the paste can be formed in the paste transfer unit.
3. The component mounting device according to claim 2 . A pin for transferring paste to a workpiece or a paste transfer method for transferring paste to a component, comprising:
taking an image of a paste transfer area of a paste transfer portion where the paste to be transferred to the tip of the pin or the electrode of the component is formed in a film form;
determining whether or not the paste can be transferred to the tip portion or the electrode at a transfer setting position in the transfer area that is set so that the paste can be transferred to the tip portion or the electrode based on an image obtained by imaging the transfer area;
When it is determined that the paste can be transferred to the tip portion or the electrode at the transfer setting position, the paste is transferred to the tip portion or the electrode at the transfer setting position;
when it is determined that the paste cannot be transferred to the tip portion or the electrode at the transfer setting position, based on the image and the first size of the component or the second size of the pin, determine whether or not there is an area in the transfer area excluding the transfer setting position that is larger than the first size or the second size and that can transfer the paste to the tip portion or the electrode;
When it is determined that the area exists, a paste is transferred to the tip portion or the electrode in the area.
Paste transfer method.