JP7756535B2 - Positioning apparatus, lithographic apparatus, and article manufacturing method - Google Patents

Description

The present invention relates to a positioning apparatus, a lithography apparatus, and an article manufacturing method.

Lithography equipment such as exposure devices require high-precision, high-speed control of substrate positioning. As substrates have become larger and thinner in recent years, distortion in substrates has become more significant than ever before. Substrate distortion occurs during substrate transport and can remain even after the substrate is placed on the substrate placement unit, or even after the substrate is adsorbed after placement. If a substrate is exposed while it is distorted, the exposure results will also be distorted, potentially reducing overlay accuracy. It is also possible to add a sequence to reduce distortion in the substrate, but such a sequence would also increase the takt time.

Patent Document 1 discloses a technology (θ correction drive) in which a substrate is suction-supported and rotated while being levitated by air. Patent Document 2 discloses a technology in which a spoke-shaped suction holder that drives in the direction normal to the substrate suction-holds and rotates the substrate above a substrate placement unit.

JP 2013-221961 A Japanese Patent Application Laid-Open No. 2000-100895

However, with conventional technology, the substrate is rotated by suction-holding it at a single central point on the substrate or on the substrate placement part. This places a large load on the suction-holding part, which can lead to misalignment between the substrate and the suction-holding part.

The present invention provides a positioning device that is advantageous for, for example, reducing misalignment between a substrate and a suction holder.

According to one aspect of the present invention, there is provided a positioning device comprising: a substrate support section that supports the substrate in a non-contact state by blowing gas against the underside of the substrate to levitate the substrate; a plurality of suction holders that suck the underside of the substrate supported in a non-contact state by the substrate support section, thereby regulating displacement of the substrate in a first direction parallel to the substrate surface; a support member that supports the plurality of suction holders; and a rotation section that rotates the support member around an axis that intersects the substrate surface, thereby rotating the substrate via the plurality of suction holders without rotating the substrate support section, wherein the plurality of suction holders are arranged at a plurality of positions away from the center of rotation of the support member, and the support member is an elongated member that extends in the first direction through the center of the substrate support section in a planar view when the substrate support section is viewed from above .
According to another aspect of the present invention, there is provided a substrate support section that supports the substrate in a non-contact state by blowing gas against a bottom surface of the substrate to levitate the substrate; a plurality of suction holders that suck the bottom surface of the substrate supported in a non-contact state by the substrate support section to restrict displacement of the substrate in a first direction parallel to the substrate surface; a support member that supports the plurality of suction holders; a rotation section that rotates the support member about an axis that intersects with the substrate surface to rotate the substrate via the plurality of suction holders without rotating the substrate support section; Provided is a positioning device comprising: a drive mechanism for moving the substrate in one direction; and a fixed member arranged below the support member; the support member is rotated in parallel with the movement of the substrate by the drive mechanism; the rotating unit is fixed on the fixed member and arranged to rotate the support member; the device further comprises an air pad arranged on the fixed member and ejecting gas onto the underside of the support member; the air pad ejects gas to rotate the support member while the support member and the air pad are in a non-contact state or with reduced frictional resistance.

The present invention provides a positioning device that is advantageous in reducing misalignment between the substrate and the suction holder.

FIG. 1 is a diagram showing the configuration of an exposure apparatus. FIG. FIG. 2 is a diagram showing the configuration of a θ correction drive mechanism. FIG. 3 is a diagram showing the configuration of a suction and holding unit. 10 is a flowchart showing a θ correction driving method. FIG. 10 is a diagram showing a control state in θ correction driving. FIG. 10 is a diagram showing a control state in θ correction driving. FIG. 10 is a diagram showing a control state in θ correction driving. FIG. 10 is a diagram showing a control state in θ correction driving. FIG. 10 is a diagram showing a control state in θ correction driving. FIG. 2 is a diagram showing the configuration of a θ correction drive mechanism. FIG. 10 is a diagram showing a configuration including a plurality of θ correction drive mechanisms.

The following describes the embodiments in detail with reference to the attached drawings. Note that the following embodiments do not limit the scope of the claimed invention. While the embodiments describe multiple features, not all of these features are necessarily essential to the invention, and multiple features may be combined in any desired manner. Furthermore, in the attached drawings, the same reference numbers are used to designate identical or similar components, and redundant explanations will be omitted.

Figure 1 is a schematic diagram of an exposure apparatus 1 according to an embodiment. In this specification and drawings, directions are indicated in an XYZ coordinate system, with the horizontal plane being the XY plane. Generally, the substrate W to be exposed is placed on a substrate stage 5 so that its surface is parallel to the horizontal plane (XY plane). Therefore, hereinafter, the directions that are perpendicular to each other in a plane along the surface of the substrate W will be referred to as the X-axis and Y-axis, and the direction perpendicular to the X-axis and Y-axis will be referred to as the Z-axis. Furthermore, hereinafter, the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system will be referred to as the X-direction, Y-direction, and Z-direction, respectively, and the directions of rotation around the X-axis, Y-axis, and Z-axis will be referred to as the θx-direction, θy-direction, and θz-direction, respectively.

First Embodiment
In the embodiments, an example will be described in which the substrate positioning device is used in a lithography apparatus (such as an exposure apparatus or an imprinting apparatus) that transfers a pattern from an original onto a substrate. The imprinting apparatus forms a pattern on the substrate by bringing a mold (original) into contact with an imprinting material supplied on the substrate and curing the imprinting material. The exposure apparatus exposes a photoresist supplied on the substrate through an original (reticle) that serves as an exposure mask, thereby forming a latent image corresponding to the pattern of the original in the photoresist. The substrate processed by these apparatuses may be, for example, a silicon wafer, but may also be a glass substrate, a copper substrate, a resin substrate, a SiC substrate, a sapphire substrate, or the like. In the following, to provide a concrete example, an example will be described in which the lithography apparatus is configured as an exposure apparatus.

(Configuration of exposure device)
FIG. 1 shows a schematic configuration of an exposure apparatus 1 to which the positioning apparatus of the present invention is applied. The exposure apparatus 1 is an apparatus that transfers a pattern formed on a mask onto a photosensitive substrate (e.g., a glass plate with a photoresist layer formed on its surface) via a projection optical system during a lithography process, which is a manufacturing process for semiconductor devices, liquid crystal display devices, and the like. The exposure apparatus 1 may include a light source unit L, an illumination optical system 2, a mask stage 3 that supports a mask M (master), a projection optical system 4, a substrate stage 5 that supports a substrate W, a detector 19, and a controller 6. The controller 6 is electrically connected to and controls the light source unit L, the mask stage 3, the substrate stage 5, and the detector 19. The controller 6 may be configured, for example, by a PLD such as an FPGA, an ASIC, a general-purpose computer with a built-in program, or a combination of all or part of these. For example, the controller 6 may include a processor 6 and a memory 62 that stores programs and data.

The illumination optical system 2 uses light from the light source unit L to illuminate the mask M, on which a circuit pattern to be transferred is formed. The illumination optical system 2 can have the function of uniformly illuminating the mask M and the function of modified illumination. The light source unit L uses, for example, a laser. The laser can be an ArF excimer laser with a wavelength of approximately 193 nm or a KrF excimer laser with a wavelength of approximately 248 nm, but the type of light source is not limited to an excimer laser. For example, an F2 laser with a wavelength of approximately 157 nm or EUV (Extreme Ultraviolet) light with a wavelength of 20 nm or less can also be used.

Mask M is made of, for example, quartz, and has the circuit pattern to be transferred formed thereon. It is supported and driven by mask stage 3. Diffracted light emitted from mask M passes through projection optical system 4 and is projected onto substrate W. Mask M and substrate W are positioned so that they are optically conjugate. The pattern on mask M is transferred onto substrate W by scanning mask M and substrate W at a speed ratio that is the reduction magnification ratio.

The mask stage 3 supports the mask M via a mask chuck (not shown) and is connected to a movement mechanism (not shown). The movement mechanism is composed of a linear motor or the like and has multiple degrees of freedom (e.g., three axes: X, Y, and θz, or preferably six axes: X, Y, Z, θx, θy, and θz), and can move the mask M by driving the mask stage 3.

The projection optical system 4 has the function of imaging light from the object plane onto an image plane, and images diffracted light that has passed through the pattern formed on the mask M onto the substrate W. The projection optical system 4 can be an optical system consisting of multiple lens elements, an optical system having multiple lens elements and at least one concave mirror (catadioptric optical system), or an optical system having multiple lens elements and at least one diffractive optical element such as a kinoform.

The substrate stage 5 has multiple degrees of freedom (e.g., three axes: X, Y, and θz, or preferably six axes: X, Y, Z, θx, θy, and θz) and moves the substrate W. In this embodiment, the substrate stage 5 is equipped with a drive mechanism 13 that moves the substrate W in directions parallel to the substrate surface (X and Y directions), and a θ correction drive mechanism 14 (rotation mechanism) that rotates (θ correction drive) the substrate W about an axis (e.g., the Z axis) that intersects the substrate surface. After placing the substrate W on the substrate placement section at the receiving position, the substrate stage 5 can move the substrate W in the X and Y directions to the exposure start position using the drive mechanism 13 while performing θ correction drive using the θ correction drive mechanism 14.

The detector 19 detects the X, Y, and θ positions of the substrate W. In one example, the detector 19 may include a light irradiation unit that irradiates the side surface of the substrate W with light, and a detection unit that detects light reflected from the side surface of the substrate W. As shown in FIG. 2A, multiple detectors 19 may be arranged. The control unit 6 determines the X, Y, and θ positions of the substrate W based on the detection results of each detector 19.

First, a conventional θ correction drive method will be described. Conventionally, θ correction drive is performed by rotating the substrate holder holding the substrate in the θz direction. During θ correction drive, the substrate holder is placed in a state where frictional resistance is reduced or in a non-contact state by ejecting compressed gas from air pads formed on the upper surface of the holder that supports the substrate holder from below. After θ correction drive, the air pads are switched to suction, and the substrate holder is restrained by the holder. The above series of operations, from θ correction drive to restraining the substrate holder, is performed in parallel with the XY drive of the substrate stage.

However, if the substrate stage is driven in the XY direction while the restraining force of the air pads (frictional force between the air pads) does not reach the inertial force generated by the XY drive, the inertial force will cause the substrate placement section to shift. This can result in reduced substrate alignment accuracy and reduced exposure performance. Therefore, after the substrate stage has moved to the exposure start position, time is required to wait for complete restraint by the air pads, which hinders efforts to reduce takt time.

Since this problem is caused by misalignment of the substrate holder, one possible solution is to rotate the substrate while the substrate holder is fixed by a holder. One technique for correcting the θ angle of the substrate on the substrate stage is to suction-hold and rotate the substrate above the substrate holder. However, with conventional substrate θ correction mechanisms, the substrate is suction-held at a single point in the center, which places a large load on the suction holder and creates the risk of misalignment between the substrate and the suction holder.

Furthermore, because conventional suction holders are simply mechanisms that move up and down, when the substrate placement unit picks up the substrate after the θ correction drive, distortion occurs in the substrate by the height that the suction holder protrudes from the substrate placement unit. To prevent distortion in the substrate, a sequence is required in which the substrate placement unit picks up the substrate, the suction holder is driven below the substrate placement unit, and then compressed gas is sprayed onto the entire underside of the substrate. However, because the substrate is not restrained while the sequence for spraying compressed gas is being performed, the substrate will drift (move horizontally) if the substrate stage is driven horizontally.

In this embodiment, the mechanism shown below is used to perform XY drive of the substrate stage and θ correction drive of the substrate in parallel, thereby shortening the takt time.

(Configuration of θ correction drive mechanism)
FIG. 2A is a plan view of the substrate stage 5 (viewed from above in the Z direction). FIG. 2B is a cross-sectional view (viewed from the X direction) along line A-A shown in FIG. 2A, showing the configuration of the θ correction drive mechanism 14. The substrate stage 5 has a substrate support part 7 that supports the substrate W. The substrate support part 7 may also be called a substrate placement part or a substrate chuck. The substrate support part 7 can support the substrate W in a non-contact state by blowing gas onto the lower surface of the substrate W to levitate the substrate W. The substrate support part 7 can also support the substrate W in a contact state by sucking in gas below the substrate W. The control part 6 can switch between non-contact support and contact support of the substrate W by the substrate support part 7.

The substrate support portion 7 has multiple holes 28 formed through its upper and lower surfaces. The multiple holes 28 communicate with a passage 33. The passage 33 is connected to the first pressure adjustment portion 29.

2A, the θ correction drive mechanism 14 is disposed below the substrate support 7. The θ correction drive mechanism 14 may include multiple suction holders 24. The multiple suction holders 24 suck the underside of the substrate W, which is supported in a non-contact state by the substrate support 7, to restrict displacement of the substrate W in a direction (first direction) parallel to the substrate surface (typically the XY direction). The multiple suction holders 24 are supported by a support member 23. As described below, the support member 23 is supported by a rotating unit 25 so as to be rotatable about an axis intersecting the substrate surface. In the example of FIGS. 2A and 2B, four suction holders 24 are disposed at positions away from the center of rotation of the support member 23. The positions away from the center of rotation may be determined depending on the size of the gap provided in the center of the substrate support 7, the amount of drive required for θ correction of the substrate, etc. The number of suction holders 24 can be determined by the coefficient of friction between the pads 24g (FIG. 3) and the substrate W and the pressure applied by the vacuum source 30, in relation to the inertial force when the substrate stage 17 for the substrate W is driven in the XYθ directions. In the example of FIG. 2A, the support member 23 can be an elongated member that passes through the center of the substrate support member 7 and extends in the Y direction when viewed from above.

Figure 3 shows an example configuration of the suction holder 24. The suction holder 24 comprises a shaft 24d extending in the Z direction and a pad 24g, which is a contact member provided at the upper end of the shaft 24d and contacts the underside of the substrate W. The shaft 24d is a hollow member having an air flow path formed therein for vacuum suction of the substrate W via the pad 24g, and is also a member for moving the pad 24g up and down. The shaft 24d can move freely in the Z direction while being guided by a guide portion 24e formed on the holder 24f. The shaft 24d (i.e., the pad 24g) is driven in the +Z direction by an actuator 24a. The actuator 24a may be composed of an air cylinder, a linear motor, a servo motor, or the like. Even if the actuator 24a returns to its standby position after the pad 24g is driven by the actuator 24a to a position where it can come into contact with the substrate W and the pad 24g is attracted to the substrate W, the pad 24g can continue to be attracted to the substrate W due to the action of the guide 24e. At this time, there is no pressing force from the suction holder 24 against the substrate W, so the substrate W can be placed on the substrate support 7 and sucked therefrom after the θ correction drive in a highly smooth state. This allows the pad 24g to displace in accordance with the displacement of the substrate W in a direction (second direction) intersecting the substrate surface (typically the Z direction).

The center of the support member 23, which supports multiple suction holders 24, is connected to the fixed member 18, located below the support member 23, via the rotating unit 25. The rotating unit 25 allows the support member 23 to rotate in the θz direction relative to the fixed member 18. The end of the fixed member 18 and the end of the support member 23 are connected via the θ drive source 15. When the θ drive source 15 drives the support member 23 in the drive direction 21, the support member 23 can rotate in the θz direction with the rotating unit 25 as the center of rotation. In other words, the θ correction drive is performed by rotating the support member 23 relative to the fixed member 18 using the θ drive source 15. Therefore, it can be understood that the rotating unit 25 constitutes the rotation support unit, and the rotation support unit and the θ drive source 15 constitute the rotation unit.

Furthermore, multiple air pads 22 are arranged on the upper surface of the fixed member 18, and multiple pads 27 are arranged on the lower surface of the support member 23 so as to face the multiple air pads 22. The multiple air pads 22 are configured to eject gas toward the lower surface (pads 27) of the support member 23. The multiple air pads 22 are also configured to suck gas below the support member 23, causing the air pads 22 and pads 27 to adhere to each other. The control unit 6 can switch between ejecting and suctioning gas by the air pads 22. θ correction drive is performed when compressed gas is ejected from the air pads 22, causing the support member 23 and air pads 22 to be in a non-contact state or with reduced frictional resistance. The ejection of compressed gas from the air pads 22 and their suction action move the members of the θ correction drive mechanism 14, which is configured above the fixed member 18, in the Z direction. Therefore, the rotating unit 25 may be configured to expand and contract in the Z direction in accordance with such movement in the Z direction using a leaf spring or the like. This prevents deformation of the support member 23.

The pad 24g of the suction holder 24 is connected to a vacuum source 30, such as a vacuum pump, via the shaft 24d so that gas can flow through it. When the suction holder 24 supports the substrate W, the vacuum source 30 performs gas suction (vacuum drawing), allowing the pad 24g to adhere to the underside of the substrate W. The upper part (contact part) of the pad 24g is preferably made of a material (e.g., resin) that conforms to the substrate W when it comes into contact with the substrate W.

The first pressure adjustment unit 29 performs one of the following operations: supplying (spraying) compressed gas into the hole 28; opening the hole 28 to the atmosphere by connecting the hole 28 to the atmospheric space (outside); and sucking gas from the hole 28. These operations can be performed by the control unit 6 switching an electromagnetic valve (not shown). The first pressure adjustment unit 29 evacuates the space between the substrate W and the substrate support unit 7 by sucking in gas, thereby adsorbing the substrate W. The flatness of the surface of the substrate W can be adjusted by changing the strength of the gas suction at this time.

The second pressure adjustment unit 31 performs one of the following operations: supplying (spraying) compressed gas to the air pad 22, opening the air pad 22 to the atmosphere by connecting the air pad 22 to the atmospheric space (outside), and sucking gas from the air pad 22. These operations can be performed by the control unit 6 switching a solenoid valve (not shown).

(Regarding the θ correction driving method for the board)
A method for driving the substrate W for θ correction using the θ correction drive mechanism 14 will now be described. The θ correction drive is performed by the control unit 6 executing a program in accordance with the flowchart shown in Fig. 4. Also, Figs. 5 to 9 are diagrams each showing a process of holding the substrate W. In Figs. 5 to 9, the same members as those in Figs. 1, 2A and 2B are designated by the same reference numerals, and detailed descriptions thereof will be omitted.

At the start of the program, the substrate stage 5 is stationary at the substrate receiving position. For the θ correction drive mechanism 14, the pad 24g is positioned below the upper surface of the substrate support part 7, and the pad 24g is not adsorbing the substrate W (S101). Compressed gas is being ejected in the +Z direction through the hole 28 (S102). Note that the air pad 22 is ejecting compressed gas, and is in a non-contact state or a state in which frictional resistance is reduced.

In S103, the actuator 24a of the suction holder 24 pushes the holder 24f upward in the +Z direction, causing the pad 24g to move above the substrate support 7. At this time, the position of the tip or edge of the pad 24g is at a height where the dynamic pressure of the compressed gas ejected from the hole 28 toward the substrate W acts, and where the weight of the substrate W can be supported by the compressed gas from the hole 28 and the suction holder 24.

In S104, after the substrate W is placed on the pad 24g, or immediately before it is placed on the pad 24g, the vacuum source 30 begins to adsorb the substrate W to the pad 24g. This prevents the substrate W from shifting horizontally. Figure 5 shows the state at the end of step S104.

In S105, the substrate stage 5 begins XY movement. Concurrently, in S106, the detector 19 detects the X, Y, and θ positions of the substrate W. In S107, the actuator 24a is driven in the -Z direction to move to the standby position while the pad 24g is attached to the substrate W. At this time, only the compressed gas from the hole 28 exerts a force on the substrate W in the +Z direction. Because the substrate W is attached to the pad 24g, no horizontal displacement occurs. The substrate W is supported by the weight of the pad 24g and shaft 24d. By moving the actuator 24a to the standby position, distortion of the substrate W caused by the force from the suction holder 24 can be reduced. Because the pad 24g is made of a material that conforms to the substrate W, the upper part of the pad 24g expands and contracts slightly, allowing it to follow even slight movements of the substrate W in the Z direction. Figure 6 shows the state at the end of step S107.

In S108, θ correction drive of the substrate W is performed based on the detection results from the detector 19. As described above, θ correction drive is performed by rotating the rotation unit 25 around the center by driving the θ drive source 15 in the drive direction 21. During θ correction drive, horizontal deviation may occur in the pad 24g due to the inertial force caused by the XY drive and θ correction drive of the substrate stage 5. In this embodiment, to address the cause of reduced θ correction accuracy due to this deviation, the suction holder 24 may be positioned as far away from the center of rotation as possible. This reduces the load on the rotation unit 25. Furthermore, by positioning the suction holder 24 away from the center of rotation, the resolution of the θ correction drive is higher than near the center of rotation, and the effect of deviation caused by deformation of the pad 24g on θ correction accuracy can be minimized or negligible.

In S109, the first pressure adjustment unit 29 is opened to the atmosphere through the hole 28. As a result, the air supplied to the substrate support 7 of the substrate W is exhausted to the atmosphere almost uniformly through the hole 28. This allows the substrate W to be placed on the substrate support 7 in a highly smooth state. When the substrate W is placed on the substrate support 7, it descends in the -Z axis direction by the height to which it was floated by the compressed gas. At this time, the pad 24g adsorbed to the substrate W follows the descent of the substrate W and descends while being guided by the guide 24e. Figure 7 shows the state at the end of step S109.

Next, in S110, the first pressure adjustment unit 29 begins vacuuming through the hole 28, thereby starting to suction the substrate W. In S110, the vacuum source 30 stops suction of the substrate W to the pad 24g. In other words, the exhaust operation is stopped.

In S111, due to the evacuation operation being stopped in S110, the pad 24g is guided by the guide 24e and lowered to the standby position by the weight of the pad 24g and shaft 24d until it reaches the same height as the holder 24f. Figure 8 shows the state at the end of step S111.

In step S112, the pad 22 is sucked onto the fixing member 18 by the second pressure adjusting unit 31. Fig. 9 shows the state at the end of step S112.
In this way, after the rotation of the support member 23 in S108 is completed, the substrate support section 7 switches to supporting the substrate in a contact state in S110, and the air pad 22 switches to supporting the support member 23 in a contact state in S112.

This completes the θ correction drive of the substrate W. In S113, the substrate stage 5 moves the substrate W to the exposure start position.

In this way, multiple suction holders 24 are positioned away from the center of rotation, and θ correction drive is performed with all suction holders 24 supported by a single support member. This makes it possible to achieve highly accurate θ correction drive even in situations where inertial forces generated by XY drive of the substrate stage 17 are present. Furthermore, the above-mentioned operation can be performed without leaving any distortion on the substrate.

Second Embodiment
10 shows the configuration of the θ correction drive mechanism 14 in the second embodiment. In the θ correction drive mechanism 14 of the second embodiment, each of the plurality of suction and hold units 24 does not include an actuator 24a. Instead, an actuator 32 is disposed on the fixed member 23 so as to apply a force to the support member 23. The actuator 32 drives the support member 23 in the Z direction to raise and lower each of the plurality of suction and hold units 24.

Third Embodiment
There are cases where the exposure apparatus 1 handles a plurality of substrates simultaneously. In such cases, the substrate stage 5 may be provided with a plurality of θ correction drive mechanisms 14 corresponding to the respective substrates, as shown in FIG.

Fourth Embodiment
2A , the support member 23 is shown as an elongated member that passes through the center of the substrate support portion 7 in a plan view when the substrate support portion 7 is viewed from above and extends in the Y direction. However, the extension direction of the support member 23 is not limited to the Y direction. The extension direction of the support member 23 may be set according to, for example, the exposure layout or shape of the substrate W.

Furthermore, the support member 23 is not limited to a long rectangular shape. The support member 23 may have a radial, lattice, circular, or other shape, for example.

<Other embodiments>
The actuator 24 a in the first embodiment or the actuator 32 in the second embodiment may be omitted. For example, a configuration may be employed in which the initial position of the pad 24 g is set as close as possible to the upper surface of the substrate support part 7, and the pad 24 g is raised by the vacuum pressure of the vacuum source 30 and adsorbed to the substrate W.

<Embodiment of an article manufacturing method>
The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices, such as semiconductor devices, and elements having microstructures. The article manufacturing method according to this embodiment includes a step of transferring a pattern of an original onto a substrate using the above-described lithography apparatus (such as an exposure apparatus, an imprint apparatus, or a drawing apparatus), and a step of processing the substrate onto which the pattern has been transferred. Furthermore, this manufacturing method includes other well-known steps (such as oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, and packaging). The article manufacturing method according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Therefore, the following claims are appended to clarify the scope of the invention.

7: Substrate support unit, 14: θ correction drive mechanism, 23: Support member, 24: Suction holding unit, 25: Rotation unit

Claims (11)

a substrate support unit that supports the substrate in a non-contact state by ejecting gas onto a lower surface of the substrate to levitate the substrate;
a plurality of suction holders configured to suck a lower surface of the substrate supported by the substrate support unit in a non-contact state, thereby restricting displacement of the substrate in a first direction parallel to the surface of the substrate;
a support member that supports the plurality of suction-holding units;
a rotation unit that rotates the support member around an axis that intersects with the surface of the substrate, thereby rotating the substrate via the plurality of suction holders without rotating the substrate support unit;
and
the plurality of suction-holding units are arranged at a plurality of positions spaced apart from the rotation center of the support member,
the support member is an elongated member that passes through a center of the substrate support portion and extends in the first direction in a plan view when the substrate support portion is seen from above;
A positioning device characterized by: 2. The positioning device according to claim 1, wherein each of the plurality of suction holding units has a contact member that contacts the underside of the substrate by suction of gas, and the contact member is configured to displace in accordance with displacement of the substrate in a second direction that intersects with the substrate surface. 3. The positioning device according to claim 2 , wherein each of the plurality of suction holders has an actuator that brings the contact member into contact with the lower surface of the substrate. 3. The positioning device according to claim 2 , further comprising an actuator that drives the support member so as to bring the contact member into contact with the lower surface of the substrate. a drive mechanism for moving the substrate in the first direction;
rotating the support member in parallel with the movement of the substrate by the driving mechanism;
5. The positioning device according to claim 1, wherein the positioning device is a positioning device for positioning a plurality of objects. The device further includes a fixing member disposed below the support member,
the rotating portion is fixed on the fixed member and is disposed to rotate the support member;
an air pad disposed on the fixing member and configured to eject gas onto a lower surface of the support member;
The air pads blow out gas to rotate the support member in a state where the support member and the air pads are not in contact with each other or where frictional resistance is reduced.
6. The positioning device according to claim 5 . the substrate support is further configured to suck gas beneath the substrate to support the substrate in contact therewith;
The air pad is further configured to suck gas under the support member to support the support member in contact therewith;
After the rotation of the support member is completed, the substrate support portion switches to supporting the substrate in the contact state, and the air pad switches to supporting the support member in the contact state.
7. The positioning device according to claim 6 . a substrate support unit that supports the substrate in a non-contact state by ejecting gas onto a lower surface of the substrate to levitate the substrate;
a plurality of suction holders configured to suck a lower surface of the substrate supported by the substrate support unit in a non-contact state, thereby restricting displacement of the substrate in a first direction parallel to the surface of the substrate;
a support member that supports the plurality of suction-holding units;
a rotation unit that rotates the support member around an axis that intersects with the surface of the substrate, thereby rotating the substrate via the plurality of suction holders without rotating the substrate support unit;
a drive mechanism that moves the substrate in the first direction;
a fixing member disposed below the support member;
and
rotating the support member in parallel with the movement of the substrate by the driving mechanism;
the rotating portion is fixed on the fixed member and is disposed to rotate the support member;
an air pad disposed on the fixing member and configured to eject gas onto a lower surface of the support member;
The air pads blow out gas to rotate the support member in a state where the support member and the air pads are not in contact with each other or where frictional resistance is reduced.
A positioning device characterized by: A positioning device according to any one of claims 1 to 8 ,
A lithography apparatus configured to transfer a pattern of an original onto a substrate positioned by the positioning device. The lithographic apparatus according to claim 9 , configured as an exposure apparatus or an imprint apparatus. Transferring a pattern onto a substrate using a lithographic apparatus according to claim 9 or 10 ;
processing the substrate onto which the pattern has been transferred;
and manufacturing an article from the processed substrate.