JP7760055B2 - 発熱素子冷却構造体及びその製造方法 - Google Patents
発熱素子冷却構造体及びその製造方法Info
- Publication number
- JP7760055B2 JP7760055B2 JP2024528489A JP2024528489A JP7760055B2 JP 7760055 B2 JP7760055 B2 JP 7760055B2 JP 2024528489 A JP2024528489 A JP 2024528489A JP 2024528489 A JP2024528489 A JP 2024528489A JP 7760055 B2 JP7760055 B2 JP 7760055B2
- Authority
- JP
- Japan
- Prior art keywords
- upper plate
- lower plate
- heat
- generating element
- cooling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/09—Heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Plasma & Fusion (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本特許出願は、本明細書にその全体が参考として含まれる、2021年11月24日付にて韓国に特許出願した特許出願番号第10-2021-0163821号及び、2022年11月18日付にて韓国に特許出願した特許出願番号第10-2022-0155784号に対して優先権を主張する。
210 上部プレート
211 コラム部
220 下部プレート
230 ウィック部
Claims (7)
- プレス金型方式を用いて複数のコラム部(column unit)を含む上部プレートを製造する過程と、
前記プレス金型方式を用いて下部プレートを製造する過程と、
前記上部プレートと前記下部プレートとが接合される部分と、前記コラム部と前記下部プレートとが接合される部分とを除く残りの部分において、レーザを用いて前記上部プレートの内面及び、前記下部プレートの内面のうちの少なくとも1つにウィック部(wick unit)を形成するウィック部形成過程と、
前記上部プレート及び前記下部プレートを、レーザを用いて接合する過程であって、レーザビームが前記上部プレートは貫通するが前記下部プレートは貫通しないように照射する過程と、
前記コラム部を、レーザを用いて前記下部プレートに接合する過程であって、レーザビームが前記コラム部は貫通するが前記下部プレートは貫通しないように照射する過程と、
を含む、発熱素子冷却構造体の製造方法。 - 前記上部プレートを製造する過程は、
前記コラム部が前記上部プレートの外面に凹んで前記上部プレートの内面に突出されるように形成する過程を含む、請求項1に記載の発熱素子冷却構造体の製造方法。 - さらに、前記発熱素子冷却構造体に冷媒を注入し、前記発熱素子冷却構造体を密閉させる過程を含む、請求項1に記載の発熱素子冷却構造体の製造方法。
- 下部プレートと、
前記下部プレートの内面と直接レーザ接合されて内部空間が形成されるように構成される上部プレートと、
前記上部プレートの外面に凹んで前記上部プレートの内面に突出されるように形成され、前記下部プレートの内面に直接レーザ接合されたコラム部と、
前記上部プレートと前記下部プレートとが接合される部分と、前記コラム部と前記下部プレートとが接合される部分とを除く前記上部プレートの内面及び、前記下部プレートの内面のうちの少なくとも1つに形成されて冷媒を移動させるように構成されるウィック部と、
を含み、前記上部プレートの外面にはレーザ痕が形成されているが、前記下部プレートの外面にはレーザ痕が形成されていない、発熱素子冷却構造体。 - 前記コラム部は、
前記上部プレートと一体に形成される、請求項4に記載の発熱素子冷却構造体。 - 前記下部プレートは、外面が発熱素子に密着されるように配置される、請求項4に記載の発熱素子冷却構造体。
- 前記ウィック部は、毛細管現象を利用して前記冷媒を移動させるように構成される、請求項4に記載の発熱素子冷却構造体。
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20210163821 | 2021-11-24 | ||
| KR10-2021-0163821 | 2021-11-24 | ||
| KR10-2022-0155784 | 2022-11-18 | ||
| KR1020220155784A KR20230077669A (ko) | 2021-11-24 | 2022-11-18 | 발열소자 냉각구조체 및 이의 제조방법 |
| PCT/KR2022/018597 WO2023096336A1 (ko) | 2021-11-24 | 2022-11-23 | 발열소자 냉각구조체 및 이의 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024541367A JP2024541367A (ja) | 2024-11-08 |
| JP7760055B2 true JP7760055B2 (ja) | 2025-10-24 |
Family
ID=86540061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528489A Active JP7760055B2 (ja) | 2021-11-24 | 2022-11-23 | 発熱素子冷却構造体及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240308006A1 (ja) |
| EP (1) | EP4439654A4 (ja) |
| JP (1) | JP7760055B2 (ja) |
| CN (1) | CN219321340U (ja) |
| WO (1) | WO2023096336A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120740353B (zh) * | 2025-09-01 | 2025-11-07 | 长沙理工大学 | 一种超薄硅基均热板及制备方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3050180U (ja) | 1997-12-25 | 1998-06-30 | 超▲しゅう▼實業股▲ふん▼有限公司 | 板状ヒートパイプ |
| US20100108296A1 (en) | 2008-11-05 | 2010-05-06 | Electronics And Telecommunications Research Institute | Thin cooling device |
| JP2014142143A (ja) | 2013-01-24 | 2014-08-07 | Ntec Co Ltd | ヒートパイプ |
| JP2016035348A (ja) | 2014-08-01 | 2016-03-17 | 古河電気工業株式会社 | 平面型ヒートパイプ |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3164518B2 (ja) * | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | 平面型ヒートパイプ |
| US6896039B2 (en) * | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| US6871701B2 (en) * | 2001-04-09 | 2005-03-29 | The Furukawa Electric Co., Ltd. | Plate-type heat pipe and method for manufacturing the same |
| US20090040726A1 (en) * | 2007-08-09 | 2009-02-12 | Paul Hoffman | Vapor chamber structure and method for manufacturing the same |
| JP6101728B2 (ja) * | 2015-03-30 | 2017-03-22 | 株式会社フジクラ | ベーパーチャンバー |
| JP6588599B1 (ja) * | 2018-05-29 | 2019-10-09 | 古河電気工業株式会社 | ベーパーチャンバ |
| US11920868B2 (en) * | 2019-12-24 | 2024-03-05 | Global Cooling Technology Group, Llc | Micro-channel pulsating heat pipe |
| KR102126935B1 (ko) * | 2020-02-18 | 2020-07-07 | 주식회사 디케이 | 커팅된 와이어와 금속 파우더를 이용한 베이퍼챔버 윅 제조방법 및 그 구조물 |
| TWI733623B (zh) * | 2020-11-25 | 2021-07-11 | 建準電機工業股份有限公司 | 具有易銲結構的散熱裝置 |
| JP2024526071A (ja) * | 2021-06-11 | 2024-07-17 | ケーエムダブリュ・インコーポレーテッド | ベーパーチャンバのウィック部形成方法およびベーパーチャンバの製造方法 |
| CN117561140A (zh) * | 2021-06-11 | 2024-02-13 | 株式会社Kmw | 真空腔均热板的芯部形成方法及真空腔均热板的制造方法 |
-
2022
- 2022-11-23 JP JP2024528489A patent/JP7760055B2/ja active Active
- 2022-11-23 WO PCT/KR2022/018597 patent/WO2023096336A1/ko not_active Ceased
- 2022-11-23 EP EP22899018.0A patent/EP4439654A4/en active Pending
- 2022-11-24 CN CN202223131214.1U patent/CN219321340U/zh active Active
-
2024
- 2024-05-23 US US18/672,027 patent/US20240308006A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3050180U (ja) | 1997-12-25 | 1998-06-30 | 超▲しゅう▼實業股▲ふん▼有限公司 | 板状ヒートパイプ |
| US20100108296A1 (en) | 2008-11-05 | 2010-05-06 | Electronics And Telecommunications Research Institute | Thin cooling device |
| JP2014142143A (ja) | 2013-01-24 | 2014-08-07 | Ntec Co Ltd | ヒートパイプ |
| JP2016035348A (ja) | 2014-08-01 | 2016-03-17 | 古河電気工業株式会社 | 平面型ヒートパイプ |
Also Published As
| Publication number | Publication date |
|---|---|
| CN219321340U (zh) | 2023-07-07 |
| EP4439654A4 (en) | 2026-01-14 |
| JP2024541367A (ja) | 2024-11-08 |
| WO2023096336A1 (ko) | 2023-06-01 |
| US20240308006A1 (en) | 2024-09-19 |
| EP4439654A1 (en) | 2024-10-02 |
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