JP7763196B2 - Reset Device - Google Patents

Description

This application relates to a reset device that separates and removes individual laser diode bars and spacers from a stack of alternating laser diode bars and spacers, which is a part of the laser diode manufacturing process, after the sides of the stack have been subjected to a sputtering process all at once. In particular, the application relates to a reset device that can separate thin and highly brittle laser diode bars without damaging them.

With the spread of disc-type recording media such as Blu-ray Discs (BD), DVDs, and CDs, as well as optical communications, laser diodes, which are used to write and read data to these recording media and to send and receive data via optical communications, are becoming increasingly popular.

Laser diodes emit highly coherent, intense light by injecting current into the pn junction and oscillating the resulting light. However, to achieve laser oscillation, the end faces must be made into reflective mirror surfaces (cleavage planes), and the cross sections cut from the wafer must be subjected to a sputtering process. To improve manufacturing efficiency, this sputtering process involves stacking multiple laser diode bars, which are rod-shaped before being individually cleaved and made into laser chips, with their sides aligned to form a laminate, and then processing the sides of the bars all at once.

A loading jig called a bar holder is used to stack multiple laser diode bars and spacers alternately and with their sides aligned. The laser diode bars and spacers, stored in separate locations, are transferred and stacked using a suction collet to form a stack, after which the sides of the stack are subjected to a sputtering process. Then, a removal device (reset device) is used to sequentially remove the laser diode bars and spacers from the stack of laser diode bars and spacers with sputtered films formed on their sides and transfer them to their respective storage locations, yielding individual laser diode bars. These laser diode bars are then cleaved to obtain individual laser diodes.

As a reset device for individually removing laser diode bars and spacers from a stack with sputtered films formed on the sides of them, a reset device has been proposed that presses both ends of the spacer, which is longer than the laser diode bar, downwards in the stack, bending it to cut the sputtered film that straddles the laser diode bar and spacer, and then alternately removes the laser diode bar and spacer using a collet that vacuum-sucks them (see Patent Document 1).

Japanese Patent Application Laid-Open No. 2008-306098

The above-mentioned conventional reset device takes advantage of the fact that the spacer is longer than the laser diode bar by using a separation pusher to press both ends of the spacer downward toward the stack, bending it, and cutting the sputtering film at the interface between the laser diode bar and the spacer, allowing the laser diode bar and spacer to be removed individually.

However, in recent years, advances in technology that uses higher-frequency laser light to increase information density have led to thinner laser diodes being used, inevitably leading to thinner laser diode bars becoming mainstream. When such thin laser diode bars are stacked alternately with spacers, the spacing between the spacers in the stacking direction, which is the thickness of the laser diode bar, becomes narrower. As a result, the spacer bends less when both ends of the spacer are pushed downward toward the stack. In particular, when a laser diode bar is placed on the top layer, even when both ends of a spacer located below the laser diode bar are pushed downward, the spacer does not bend sufficiently, resulting in a problem where the sputtered film is not cut at the boundary between the laser diode bar and the spacer. Furthermore, the force applied by the separation pusher to the stack of laser diode bars and spacers bending them downward toward the stack has also resulted in damage to the thin laser diode bars.

The present application aims to solve the problems of the prior art described above, and to provide a reset device that can reliably cut the sputtering film formed on the side of a stack of laser diode bars and spacers without damaging the laser diode bars, and can transfer the laser diode bars and spacers individually to a designated storage location.

To solve the above-mentioned problems, the reset device disclosed in this application uses a suction collet to alternately remove laser diode bars and spacers from a stack of laser diode bars and spacers mounted on a mounting jig and transfer them to a predetermined storage location. The suction collet suctions the uppermost laser diode bar or spacer in the stack and moves it in a direction within its main surface, thereby cutting the sputtering film formed on the side of the stack.

With the above configuration, the reset device disclosed in this application moves the laser diode bar and spacer in the direction of their main surfaces while they are attached to a suction collet, which is used when removing the laser diode bar and spacer from the stack and transferring them to a storage location, to cut the sputtered film. This effectively prevents deformation caused by the force applied when cutting the sputtered film, even in the case of thin laser diode bars compatible with high-frequency bands.

FIG. 1 is a schematic plan view for explaining the overall configuration of a reset device according to this embodiment. FIG. 2 is an image diagram for explaining the configuration of the bar holder of the reset device according to this embodiment. FIG. 3 is a diagram for explaining the positional relationship between the bar holder, the suction collet, and the laser diode bar to be removed in the reset device according to this embodiment. FIG. 4 is a side view illustrating a first state of the process of removing the laser diode bar from the bar holder in the reset device according to this embodiment. FIG. 5 is a side view illustrating a second state of the process of removing the laser diode bar from the bar holder in the reset device according to this embodiment. FIG. 6 is a side view illustrating a third state of the process of removing the laser diode bar from the bar holder in the reset device according to this embodiment. FIG. 7 is a side view illustrating a fourth state of the process of removing the laser diode bar from the bar holder in the reset device according to this embodiment. FIG. 8 is a side view illustrating a fifth state of the process of removing the laser diode bar from the bar holder in the reset device according to this embodiment. FIG. 9 is an enlarged view illustrating the shape of the tip portion of the suction collet in the reset device according to this embodiment. FIG. 10 is a diagram for explaining the positional relationship between the bar holder, the suction collet, and the laser diode bar to be removed in the reset device of the modified example. FIG. 11 is a diagram illustrating a first state of the process of removing the laser diode bar from the bar holder in the reset device of the modified example. FIG. 12 is a diagram illustrating a second state of the process of removing the laser diode bar from the bar holder in the reset device of the modified example. FIG. 13 is a diagram illustrating a third state of the process of removing the laser diode bar from the bar holder in the modified reset device. FIG. 14 is a diagram illustrating a fourth state of the process of removing the laser diode bar from the bar holder in the modified reset device. FIG. 15 is a diagram illustrating a fifth state of the process of removing the laser diode bar from the bar holder in the modified reset device.

The reset device disclosed herein uses a suction collet to alternately remove laser diode bars and spacers from a stack of laser diode bars and spacers mounted on a mounting jig and transfer them to a predetermined storage location. The suction collet suctions the uppermost laser diode bar or spacer in the stack and moves it in a direction within its main surface, thereby cutting the sputtering film formed on the side of the stack.

By configuring it in this way, the reset device disclosed in this application can cut the sputtering film formed on the side surface while the laser diode bar or spacer to be removed is held by the suction collet that transfers it.

In this specification, the term "direction within the principal plane of the laser diode bar or spacer" refers to the extending direction of the principal plane of the laser diode bar or spacer, i.e., the plane perpendicular to the thickness direction. Furthermore, the term "direction within the principal plane" refers to the approximate principal plane direction, and includes directions inclined at up to 10° upward from the principal plane of the laminate.

In a reset device configured as described above, it is preferable to have a retaining member positioned adjacent to the side of the laser diode bars and spacers other than the laser diode bar or spacer located at the top of the stack, opposite the side facing the mounting jig. This prevents spacers and laser diode bars other than the laser diode bar or spacer to be removed from moving forward, ensuring that the sputtering film formed on the side can be cut reliably.

Furthermore, the direction within the main surface can be the width direction of the laser diode bar and the spacer, or the length direction of the laser diode bar and the spacer.

Furthermore, it is preferable that the tip of the suction collet has a hook-shaped portion that faces the side of the laser diode bar or spacer. This makes it possible to support the side of the laser diode bar or spacer being removed, effectively preventing the laser diode bar or spacer from being deformed by the application of undesired external forces.

Furthermore, it is preferable that the tip of the suction collet be equipped with a first tip and a second tip that is movable relative to the first tip. This allows the laser diode bar or spacer to be removed to be moved in two directions within its main surface, allowing the sputtering film to be cut without placing unnecessary load on the laser diode bar or spacer.

Specific embodiments of the reset device disclosed in this application will be described below with reference to the drawings.

(Embodiment)
FIG. 1 is a schematic plan view showing the overall configuration of a reset device according to this embodiment.

The reset device 100 shown in Figure 1 individually removes laser diode bars and spacers, which have been sputtered on their sides while stacked alternately, from the stack mounted on a bar holder and moves them to a designated storage location.

The reset device 100 shown in FIG. 1 comprises a central stage 10, a first transport unit 20, an intermediate stage 30, a second transport unit 40, and a mounting stage 50. The reset device 100 according to this embodiment includes two sets of transfer mechanisms, each of which connects the first transport unit 20 to the mounting stage 50, and is arranged substantially symmetrically about a left-right center line 1 passing through the central stage 10. The first transfer mechanism on the right side of the figure transfers the laser diode bar from the central stage 10 to the mounting stage 50 on the right side, and the second transfer mechanism on the left side of the figure transfers the spacers, which have been stacked alternately with the laser diode bar in the bar holder, from the central stage 10 to the mounting stage 50' on the left side.

In the reset device 100 of this embodiment, the first transfer mechanism that removes the laser diode bars from the bar holders and moves them to the mounting stage and the second transfer mechanism that removes the spacers from the bar holders and moves them to the mounting stage are identical in configuration, differing only in the target components that are removed and transferred. For this reason, in this specification, the components that make up the second transfer mechanism that transfers the spacers are given the same names as the components of the transfer mechanism that transfers the first laser diode bars: the first transport unit 20', intermediate stage 30', second transport unit 40', and mounting stage 50', respectively, and are distinguished by adding "' to the reference numerals, and detailed descriptions of each component will be omitted as appropriate.

The reset device 100 of this embodiment is equipped with two bar holders (11, 12) serving as mounting jigs on the central stage 10. This is efficient because, while the laser diode bar and spacers are being removed from one bar holder 11 (12) and transferred to the mounting stage 50, 50', another laminate for which the sputtering process has been completed can be mounted on the other bar holder 12 (11). For this reason, arrows A and A', which indicate the range of movement of the first feeders 20, 20', are set so that the laser diode bar and spacers can be transferred from either of the two bar holders 11, 12 to the left and right intermediate stages 30, 30'.

In addition, the reset device of this embodiment cuts the sputtered film formed on the side of the stack of laser diode bars and spacers by moving the laser diode bars or spacers in a direction within their main surfaces while they are held by suction collets 21, 21' of the first transport units 20, 20', which transfer the laser diode bars or spacers from the bar holders 11, 12 to the intermediate stage 30. Details of the cutting of the sputtered film while held by the suction collets 21, 21' and the process of removing the laser diode bars and spacers from the stack mounted on the bar holders 11, 12 by the suction collets 21, 21' will be described later.

The first transport units 20, 20' are components that move left and right within the ranges of arrows A and A' shown in Figure 1, and are equipped with suction heads 21, 21' and cameras 22, 22' that confirm the position of the laser diode bars or spacers. Based on images captured by cameras 22, 22', suction heads 21, 21' confirm the position and angle of the laser diode bars and spacers on bar holders 11, 12, as well as the position of suction heads 21, 21', and are controlled so that the tips of suction heads 21, 21' accurately suction the laser diode bars or spacers to be transferred, cut the sputtering film, and then transfer them to intermediate stages 30, 30'.

The intermediate stage 30 is positioned between the central stage 10, which includes the bar holders 11, 12, and the mounting stages 50, 50', on which the recovery members 51, 51' that house the removed laser diode bars and spacers are placed. It functions as a relay point for changing the angle between the principal surfaces of the laser diode bars and spacers removed from the bar holders 11, 12 by the first transport units 20, 20', and transferring them to the recovery members 51, 51' placed on the mounting stages 50, 50'.

As described below, in the reset device 100 according to this embodiment, the bar holders 11, 12 on which the laser diode bars and spacers, which are alternately stacked and have sputtered films formed on their sides, are placed are arranged on the central stage 10 with the stacking direction (direction in which the laser diode bars and spacers are stacked) tilted at a predetermined angle relative to the vertical axis. Meanwhile, the recovery members 51, 51' for recovering the removed laser diode bars and spacers are placed on the upper surfaces of the mounting stages 50, 50' so that their placement surfaces are horizontal. Therefore, the angles of the main surfaces of the laser diode bars and spacers need to be changed during transfer from the bar holders 11, 12 to the recovery members 51, 51'. However, a method that allows the angle of the suction head to be changed during transfer would result in a complex suction head configuration. For this reason, the reset device 100 of this embodiment is provided with an intermediate stage 30, on which the angles of the main surfaces of the laser diode bar and spacer are changed from the inclined state on the bar holders 11, 12 to the horizontal state when they are placed on the recovery members 51, 51'.

Specifically, in the reset device 100 according to this embodiment, the intermediate stage 30 has a bar mounting stage 32 attached to a rotation axis extending from a guide mechanism 31, an actuator 33 that rotates this rotation axis, and a camera 34 that monitors the laser diode bar placed on the bar mounting stage 32. First, with the upper surface of the bar mounting stage 32 at the same inclination angle as the main surfaces of the laser diode bar and spacer on the bar holder (11, 12), the suction collet 21 of the first transport unit 20 transfers the laser diode bar from the bar holder (11, 12) on the central stage 10 onto the bar mounting stage 32. The actuator 33 then horizontalizes the upper surface of the bar mounting stage 32, and the second transport unit 40 transfers the laser diode bar to a recovery member 51 placed on the mounting stage 50.

As with the laser diode bars described above, the spacers are transferred from the bar holders (11, 12) on the central stage 10 onto the mounting stage 32' by the suction collet 21' of the first transport unit 20' when the top surface of the mounting stage 32', which changes the angle of the spacer on the intermediate stage 30' located on the left side in Figure 1, is at the same inclination angle as the bar holders (11, 12). The actuator 33' then makes the top surface of the mounting stage 32' horizontal, and the second transport unit 40' transfers the spacers to the recovery member 51' located on the mounting stage 50'.

Like the first transport units 20, 20', the second transport units 40, 40' are equipped with suction heads 41, 41' that suction the laser diode bars or spacers and cameras 42, 42' that check the state of the laser diode bars or spacers. They are controlled so that the position of the laser diode bars or spacers on the mounting stages 32, 32' can be confirmed and accurately suctioned by the suction heads 41, 41', and they can also be accurately placed in the specified position on the recovery members 51, 51'.

The mounting stages 50, 50' are equipped with recovery members 51, 51' that recover diode bars or spacers that have been individually removed from the stack. In the reset device 100 of this embodiment, gel pack trays that can hold multiple (six in the example in Figure 1) roughly square gel packs made of a special gel-like polymer material or the like are used as the recovery members 51, 51'. In addition to the gel pack trays described above, circular recovery stages 52, 52' that can hold multiple laser diode bars or spacers aligned like a silicon wafer, as shown by the dashed line in Figure 1, can also be used as the recovery members 51, 51'.

It goes without saying that the configuration of the reset device described above using Figure 1 is merely one example, and the specific configuration of the reset device can take various forms, as long as the laser diode bar and spacer can be individually removed from the stack mounted on the bar holder and each can be transferred to a specified recovery member.

In particular, the configuration adopted in the reset device 100 described above, which includes two bar holders for mounting the laminate, and the configuration in which the intermediate stage and the mounting table are arranged symmetrically on the left and right sides of the central stage on which the bar holders are arranged, are configurations for improving manufacturing efficiency and are not essential configurations for the reset device disclosed in this application.

Next, we will explain the configuration of the bar holder on which the stack of laser diode bars and spacers is mounted in the reset device of this embodiment, and the configuration and operation of the suction collet provided in the first transport unit that removes the laser diode bars and spacers. As mentioned above, the two bar holders and two first transport units of the reset device of this embodiment all have the same configuration, so the following will explain, by way of example, the process of removing a laser diode bar from the first bar holder using the first transport unit in Figure 1.

In addition, the drawings used in the following explanation are intended to clearly explain how to remove the laser diode bar and spacer from the laminate mounted on the bar holder, and therefore the sizes of the laser diode bar, spacer, and other components do not necessarily reflect their actual sizes.

Figures 2 and 3 are conceptual diagrams showing the state in which a laser diode bar is being removed from a stack of laser diode bars and spacers held in a bar holder in the reset device of this embodiment.

Figure 2 shows a perspective view of the bar holder from the side where the stack of laser diode bars and spacers is mounted, and Figure 3 shows a view from the stacking direction of the stack of laser diode bars and spacers.

Furthermore, Figures 2 and 3 show the laser diode bar located at the top of the stack being pulled out in the direction of arrow I shown in the figures.

In the following description, the stacking direction of the laser diode bar and spacer laminate mounted on the bar holder 11, i.e., the stacking direction when forming the laser diode bar and spacer laminate (the direction of arrow C in Figure 2), will be referred to as the upper side (upper side), and the direction in which the laser diode bars and spacers are sequentially removed from the laminate (the direction of arrow D in Figure 2) will be referred to as the lower side (lower side). Furthermore, the left-right direction of the bar holder 11 is defined as viewed from the side of the laser diode bar and spacer laminate, with the direction of arrow E in Figure 2 being the left side (left side) and the direction of arrow F being the right side (right side). Furthermore, the direction perpendicular to the mounting surface 11a on which the laminate is mounted on the bar holder 11, the direction of arrow G in Figure 2, which is the side on which the laser diode bar and spacer laminate is located, will be referred to as the forward direction (near side), and the opposite direction, i.e., the direction of arrow H in Figure 2, will be referred to as the rear direction (rear side).

As shown in Figure 2, the bar holder 11 of the reset device 100 according to this embodiment has a mounting surface 11a, with which the side of the laminate of laser diode bars 60 and spacers 70 comes into contact, inclined at a predetermined angle α with respect to the horizontal. Furthermore, on this mounting surface 11a, there is a support surface 11b, which is formed perpendicular to the mounting surface 11a, i.e., inclined at (90°-α)° with respect to the horizontal, and which supports the underside of the laminate of laser diode bars 60 and spacers 70.

Here, the inclination angle α of the mounting surface 11a is preferably 15° to 45°. If the inclination angle α is less than 15°, the next laminate may tip forward when peeling immediately after resetting, and if the inclination angle α is greater than 45°, the positioning of the laminate becomes unstable. Note that the inclination angle α is preferably set optimally depending on the shape (length, width, thickness) of the laser diode bar 60 and the number of sheets to be loaded.

The stack of laser diode bars 60 and spacers 70 (71, 72) mounted on the reset device 100 described in this embodiment has the thickest thick spacer 72 positioned at the bottom, with the first laser diode bar 60 on top of this thick spacer 72, the first thin spacer 71 on top of that, the second laser diode bar 60, the second thin spacer 71, and so on, stacked alternately in this order. Furthermore, as shown in Figure 2, the thick spacer 72 positioned at the bottom of the stack is positioned on the support surface 11b that protrudes perpendicularly from the mounting surface 11a of the bar holder 11.

In this way, by arranging the thick spacer 72 at the bottom of the stack of laser diode bars 60 and spacers 70 (71, 72), the alternating stack of laser diode bars 60 and thin spacers 71 is formed on the thick spacer 72. This makes it easier to handle the stack of laser diode bars 60 and spacers 70 (71, 72) after lamination in the lamination device, when transferring it to the process for forming a sputtered film, or when transferring it to the sputtering process and then to the reset device for the stack with the sputtered film formed.

The laser diode bar 60 loaded on the bar holder 51 here has, for example, a width (W: see Figure 3) of 150 μm, a length (L: see Figure 3) of 20 mm, and a thickness (not shown) of 100 μm. The spacer 71 is generally made of silicon or the like, and has, for example, a width W of 140 μm, a length L of 25 mm, and a thickness of 100 μm, while the thick spacer 72 has, for example, a width W of 140 μm, a length L of 25 mm, and a thickness of 2000 μm. To avoid complicating the drawings, the widths W and lengths L of the laser diode bars and spacers are all shown the same in the following figures.

Furthermore, in the reset device 100 according to this embodiment, the stack of laser diode bars 60 and spacers 70 (71, 72) is mounted on the bar holder 11 so that the sputtering film (not shown in Figures 2 and 3) formed continuously on the side of the stack faces forward (direction G), i.e., so that the sputtering film does not come into contact with the mounting surface 11a.

As shown in Figures 2 and 3, the bar holder 11 has a recess 11c of a predetermined width formed in the left-right middle portion of the mounting surface 11a, which is inclined at an angle α with respect to the horizontal plane. The stack of laser diode bars 60 and spacers 70 (71, 72) placed on the support surface 11b of the bar holder 11 has its side surfaces (the side surfaces on which the sputtering film is not formed) abutting the mounting surface 11a at both ends in the length L direction, but the side surface in the central portion in the length L direction does not abut anywhere due to the recess 11c formed therein.

As shown in Figure 3, the tip of the suction collet 21 of the first transport unit 20, which suctions and transfers the laser diode bars 60, is split into two parts in the left-right direction, and the suction ports 22 formed on each of the two tip parts, with the leading edge exceeding the width W of the laser diode bar 60, are designed to suction approximately the center of the width of the main surface of the laser diode bar 60. Each of the two leading edges of the suction collet 21 is also formed with a hook-shaped portion 23 that extends downward (in the direction D) from the mounting surface 11a of the bar holder 11 and can abut against the side of the rear side (in the direction H) of the laser diode bar 60 being suctioned.

The width of the tip of the suction collet 21 is smaller than the width of the recess 11c formed in the mounting surface 11a of the bar holder 11. Therefore, when the suction collet 21 advances to the rear, its tip enters the recess 11c and the hook-shaped portion 23 can abut against the rear side of the laser diode bar 60 that it is suctioning. Therefore, when the suction collet 21 is pulled out in the direction of arrow I in the figure, the hook-shaped portion presses against the rear side of the laser diode bar 60, cutting the sputtering film formed on the front side of the laminate.

In this embodiment, the mounting surface 11a of the bar holder 11 has a slit 51d formed in the area where it abuts against the side of the stack of the left and right laser diode bars 60 and spacers 70 (71, 72), allowing the rear side of the stack to be adsorbed. This prevents the stack from tipping forward when mounted on the mounting surface 11a of the bar holder 11.

The reset device 100 described in this embodiment also includes a top cover 80 (shown in FIG. 2 with a two-dot chain line to clearly show the state of the stack) that abuts against both left and right ends of the front side of the stack placed on the bar holder 11. As described below, as the laser diode bars 60 and spacers 71 are sequentially removed from the stack, the relative positional relationship between the stack and the top cover 80 changes, so that the top cover presses down on the front side of the next spacer 71 or laser diode bar 60 stacked immediately below the laser diode bar 60 or spacer 71 being removed by the suction collet 21, as well as the multiple laser diode bars 60 and spacers 71 located further below that. This allows only the laser diode bar 60 or spacer 71 being removed to be pulled forward by the suction collet 21, ensuring that the sputtering film is reliably cut at the boundary with the next spacer 71 or laser diode bar 60, thereby ensuring the removal of the uppermost laser diode bar 60 or spacer 71 from the stack.

Next, using Figures 4 to 8, the process of sequentially removing the laser diode bar 60 and spacer 71 from the laminate in the reset device 100 according to this embodiment will be described in detail. Note that in Figures 4 to 7, the laser diode bar 60 to be removed is shown in black for ease of understanding.

Figure 4 shows the first stage of the process of removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder.

As shown in Figure 4, in the first state, the tip of the suction collet 21 moves perpendicular to the mounting surface 11a, as indicated by arrow a in Figure 4, until the hook-shaped portion 23 formed at the tip enters the recess 11c formed in the mounting surface 11a of the bar holder 11. The position of the top surface of the laser diode bar 60 to be removed (position in the direction of arrow C in Figure 2) is detected by an optical sensor such as a laser sensor (not shown), and the tip of the suction collet 21 is set to advance to a position separated from this top surface position J by a predetermined distance K, for example, 0.5 mm.

In addition, during the process of sequentially removing the laser diode bar 60 and spacer 71 from the stack of laser diode bar 60 and spacer 70 (71, 72) mounted on the bar holder 11, the stack is gently held by slit 11d formed in the mounting surface 11a.

Figure 5 shows a second stage of the process of removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder.

In the second state shown in Figure 5, the tip of the suction collet 21 moves downward from the mounting surface 11a as indicated by arrow b in the figure, and the suction port 22 abuts against the upper surface of the laser diode bar 60.

At this time, the hook-shaped portion 23 at the tip of the suction collet 21 is inserted into the recess 11c formed in the mounting surface 11a of the bar holder 11. Therefore, when the suction port 22 abuts the top surface of the laser diode bar 60, the hook-shaped portion 23 is positioned toward the rear of the laser diode bar 60 (direction H in Figure 2), i.e., further back on the side of the mounting surface 11a.

Figure 6 shows a third stage of the process of removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder.

In the third state shown in Figure 6, the suction port 22 of the suction collet 21 is holding the laser diode bar 60 to be removed by suction, and the suction collet 21 moves slightly in the direction of arrow c, which is toward the front of the mounting surface 11a (direction G in Figure 2). At this time, the amount of movement in the direction of arrow c is preferably approximately 1/4 to 1/2 the width of the laser diode bar 60 to be removed. In the reset device 100 described in this embodiment, as described above, the front side of the spacer 71 stacked immediately below the laser diode bar 60 to be removed is pressed down by the top cover 80. Therefore, by sliding the laser diode bar 60 to be removed in the width W direction by approximately 1/4 to 1/2 of the width W, the sputtering film 90 can be cut at the boundary between the laser diode bar 60 and the spacer 70 located below it.

Note that Figure 6 corresponds to the state shown in Figure 3 above, viewed from the right side of the mounting surface 11a (direction F in Figure 2).

Figure 7 shows the fourth stage of the process of removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder.

In the fourth state shown in Figure 7, with the laser diode bar 60 to be removed being adsorbed, the tip portion 41 of the adsorption collet first moves in the direction indicated by arrow d in the figure, away from the stack, and then moves in the direction indicated by arrow e, away from the bar holder 11.

In this way, the topmost laser diode bar 60 can be removed from the stack of laser diode bars 60 and spacers 70 (71, 72) mounted on the mounting surface 11a of the bar holder 11.

Figure 8 shows the fifth stage of the process of removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder.

After the top laser diode bar 60 of the stack is removed, the bar holder 11 moves upward (in the direction C in Figure 2) along the mounting surface 11a by a predetermined width N, as shown by arrow f in Figure 8. This predetermined width N is the width of the laser diode bar 60 that was just removed, and is controlled by an optical sensor (not shown) so that the position of arrow J in the figure is the position of the top surface of the spacer 71 located at the top of the stack.

At this time, the top cover 80 does not move, so the side of the spacer 71 located at the top of the stack is exposed from the upper end surface of the top cover 80. When the spacer 71 is removed, the sputtering film 90 is reliably cut between the spacer 71 and the side of the next laser diode bar 60 stacked below it.

By repeating the operations shown in Figures 4 to 8, the laser diode bar 60 located at the top of the stack is removed. Furthermore, the spacers 71 stacked on the stack are also removed by the first conveying unit 20' of the second transfer mechanism shown on the left side of Figure 1 using the same process as the removal of the laser diode bar 60 shown in Figures 4 to 8 above, and are stored in the recovery member 51'.

Figure 9 is an enlarged view showing the positional relationship between the hook-shaped portion formed at the tip of the suction collet and the laser diode bar being suctioned.

Figure 9 is an enlarged view of the portion indicated by the symbol M in Figure 7, where Figure 9(a) shows the first shape of the hook-shaped portion and Figure 9(b) shows the second shape of the hook-shaped portion.

In Figure 9, which shows an enlarged view of the portion designated by the symbol M in Figure 7, Figure 9(a) shows the first shape of the hook-shaped portion 23, in which the hook-shaped portion 23 is generally rectangular. By providing a generally rectangular hook-shaped portion 23 as shown in Figure 9(a), the rear side surface 60a of the laser diode bar 60 to be removed comes into contact with the side surface 23a of the hook-shaped portion 23, and when the suction collet moves in the direction of arrow c shown in Figures 9(a) and 6, a strong force pushing the laser diode bar 60 to be removed toward the user is applied, ensuring reliable cutting of the sputtering film 90.

Furthermore, the second-shaped hook-shaped portion 23' shown in Figure 9(b) is shaped so that the side facing the side surface 60a of the laser diode bar 60 to be removed forms an inclined surface 23a' that slopes away from the side surface 60a of the laser diode bar 60. By making the side surface of the hook-shaped portion 23' facing the laser diode bar 60 an inclined surface 23a' in this way, even if the position of the rear side surface 60a of the laser diode bar 60 is slightly shifted toward the rear due to variations in the width direction of the laser diode bar 60, the hook-shaped portion 23' formed at the tip of the suction collet 21' can enter the rear side of the side surface 60a of the laser diode bar 60 to be removed when the tip of the suction collet 21 moves in the direction indicated by arrow b in the figure. Furthermore, because the front side of the hook-shaped portion 23' is an inclined surface 23a', the side surface 23a of the hook-shaped portion 23 and the rear side surface 60a of the laser diode bar 60 to be removed do not come into contact with each other, as with the hook-shaped portion 23 shown in Figure 9(a). However, because the suction collet 21 firmly suctions the top surface of the laser diode bar 60 to be removed via the suction port 22, it is possible to cut the sputtered film 90 at the boundary between the uppermost laser diode bar 60 and the next spacer 71.

As shown in FIG. 6, in the reset device 100 according to this embodiment, the laser diode bar 60 to be removed is adsorbed by the suction collet 21, and the laser diode bar 60 is moved in the direction indicated by arrow c in FIG. 6 to cut the sputtering film 90. For this reason, the thickness t' of the hook-shaped portion 23 formed at the tip of the suction collet 21 is made thinner than the thickness t of the laser diode bar (and spacer 71) to be removed.

As described above, the reset device 100 shown in this embodiment cuts the sputtered film 90 formed on the side surface by moving the laser diode bar 60 or spacer 70, which is adsorbed by the adsorption collets 21, 21', in the width direction of its main surface, which removes the uppermost laser diode bar 60 or spacer 70 from a stack of laser diode bars 60 and spacers 70. In this way, compared to conventional reset devices that cut the sputtered film by pressing and bending the main surface of the laser diode bar 60 or spacer 70, the laser diode bar 60 can be removed from the stack without deforming the laser diode bar 60.

In addition, by placing the top cover 80 on the front side of the side of the laminate, which is the direction in which the side will be removed, the sputtering film 90 can be cut while effectively preventing movement or deformation of the laser diode bar 60 and spacer 70.

(Modification)
Next, a modified embodiment of the reset device disclosed in the present application will be described with reference to the drawings.

The modified reset device cuts the sputtered film formed on the side of the laminate of laser diode bars and spacers by moving the laser diode bars and spacers in the length direction, which differs from the reset device described above, which cuts by moving them in the width direction.

The reset device described below as a modified example differs from the device described above in the shape and operation of the tip of the suction collet, but the bar holder and the stack of laser diode bars and spacers placed on the bar holder have the same configuration. Therefore, the same parts as those in the reset device described above are given the same reference numerals and their description will be omitted.

Figure 10 shows the positional relationship between the suction head of a modified reset device and the stack of laser diode bars and spacers mounted on a bar holder.

Figure 10 shows the state in which the tip of the suction collet is in contact with the top surface of the laser diode bar 60 located at the top of the stack loaded on the bar holder 11, as viewed from above the mounting surface 11a (direction C in Figure 2).

As shown in Figure 10, in the modified reset device, the tip of the suction collet has two tips: a first tip 121 that suctions and transfers the laser diode bar 60 to be removed, and a second tip 131 that cuts the sputtering film 90 at the boundary between the laser diode bar 60 to be removed and the next spacer 71.

The first tip 121 has the same structure as the tip of the suction head 21 of the reset device 100 in the embodiment described above, and the tip is separated into two parts in the left-right direction, each of which has a suction port 122 that contacts and suctions the top surface of the laser diode bar 60, and a hook-shaped portion 123 that contacts the side surface at the rear of the laser diode bar.

The second tip 131 is attached to the same base portion of the suction collet 21 as the first tip 121 and can move left and right independently of the first tip 121. The second tip 131 has a suction port 132 that adheres to the top surface of the laser diode bar 60 and a hook-shaped portion 133 that can abut against the right side of the laser diode bar 60. As shown in FIG. 10, when the suction collet 21 is fully extended toward the bar holder 11, the leading edge of the first tip 121 reaches the rear side, exceeding the width of the laser diode bar 60 to be removed. On the other hand, the leading edge of the second tip 131 does not extend beyond the width W of the laser diode bar 60. Therefore, although the second tip 131 is located in a portion of the mounting surface 11a of the bar holder 11 where the recess 11d is not formed, it does not interfere with the mounting surface 11a.

Next, using Figures 11 to 15, we will explain the process of removing the uppermost laser diode bar 60 from the stack of laser diode bars 60 and spacers (71, 72) mounted on the bar holder 11 in the modified reset device. Note that in Figures 11 to 15, the laser diode bar 60 to be removed is shown in black for ease of understanding.

Figure 11 shows the first stage of the process of removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder in a modified reset device.

In the following Figures 11 to 15, (a) in each figure is a view of the bar holder from the right side. (b) in each figure is a view showing the positional relationship between the stack mounted on the bar holder, the first and second tips of the suction collet, and the top cover, as seen from the front side of the mounting surface 11a of the bar holder 11 (direction G in Figure 2). In addition, in (b) in each figure, the top cover 80 is indicated by a two-dot chain line to show the shape of both the left and right ends of the stack of laser diode bars and spacers.

In the first state shown in Figure 11, the first tip 121 and second tip 131 of the suction head 21 move perpendicular to the mounting surface 11a, as indicated by arrow g in Figure 11, until the hook-shaped portion 123 formed on the first tip 121 enters the recess 11c formed on the mounting surface 11a of the bar holder 11.

As shown in Figure 11(a), the position O of the top surface of the laser diode bar 60 to be removed next (position in the direction of arrow C in Figure 2) is detected by an optical sensor such as a laser sensor (not shown), and the first tip 121 of the suction head 21 is set to advance to a position spaced a predetermined distance P, for example 0.5 mm, from this top surface position O.

At this time, the second tip 131 of the suction collet 21 is located to the right, a predetermined distance from the first tip 121, as shown in Figure 11(b), and the hook-shaped portion 133 formed on the second tip 131 is located on the outer right side of the right side surface of the laser diode bar 60 being removed.

Figure 12 shows a second state of the process of removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder in a modified reset device.

In the second state shown in Figure 12, the first tip 121 and second tip 131 of the suction head 21 move downward below the mounting surface 11a as indicated by arrow h in the figure, and the suction port 122 of the first tip 121 and the suction port 132 of the second tip 131 abut against the upper surface of the laser diode bar 60.

At this time, the hook-shaped portion 123 of the first tip 121 of the suction collet 21 is inserted into the recess 11c formed in the mounting surface 11a of the bar holder 11, so that the suction port 122 is positioned at the rear of the laser diode bar 60 (direction H in Figure 2), i.e., further back on the side of the mounting surface 11a side, while abutting the top surface of the laser diode bar 60.

Also, as shown in Figure 12(b), the hook-shaped portion 133 of the second tip 131 of the suction collet 21 is close to or abuts against the right side surface of the laser diode bar 60.

Figure 13 shows a third state of the process of removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder in a modified reset device.

In the third state shown in Figure 13, as indicated by arrow i in Figure 13(b), the second tip 131 of the suction collet 21 moves closer to the first tip 121, i.e., moves to the left (direction E) in Figure 2. At this time, the suction port 122 of the first tip 121 of the suction collet 21 does not suction the laser diode bar 60, and only the suction port 132 of the second tip 131 suctions the top surface of the laser diode bar 60, so that only the laser diode bar 60 to be removed moves to the left relative to the entire stack. Note that this movement amount is preferably approximately 0.5 mm to 1 mm, or approximately 5% of the length of the laser diode bar 60.

In this way, by moving only the laser diode bar 60 to be removed to the left in Figure 11(b), the sputtering film 90 formed on the front side surface is cut at the boundary with the next spacer 71. At this time, as shown in Figure 11(b), the hook-shaped portion 133 of the second tip 131 of the suction collet 21 is close to or abutting the right side surface of the laser diode bar 60 to be removed, so the laser diode bar 60 to be removed can be reliably moved to the left in Figure 11(b), and the sputtering film 90 can be reliably cut.

Figure 14 shows a fourth state of the process of removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder in a modified reset device.

In the fourth state shown in Figure 14, the first tip 121 and second tip 131 of the suction collet 21 move together in the direction of arrow j shown in Figure 14(a) while adsorbing the laser diode bar 60 to be removed, thereby removing the laser diode bar 60 from the stack. At this time, the top cover 80 is positioned on the front side of the stack, close to the front side of the laser diode bar 60 located below the spacer 71 to be removed next, and the front side of the spacer 71. Therefore, even if the sputtering film 90 remains connected because it was not completely cut in the third state described above using Figure 13, it can be reliably cut and only the laser diode bar 60 can be removed.

Figure 15 shows the fifth state of the process for removing a laser diode bar from a stack of laser diode bars and spacers mounted on a bar holder in a modified reset device.

In the fifth state shown in Figure 15, the first tip 121 and second tip 131 of the suction collet 21 move together in the direction of arrow k shown in Figure 15(a) while holding the laser diode bar 60 to be removed, thereby removing the laser diode bar 60 from the stack. At this time, the top cover 80 is positioned on the front side of the stack, close to the front side of the laser diode bar 60 located below the spacer 71 to be removed next, and the front side of the spacer 71. Therefore, even if the sputtering film 90 remains connected because it was not completely cut in the third state described above using Figure 13, it can be reliably cut and the laser diode bar 60 located at the top of the stack can be removed.

After the fifth state shown in Figure 15, as shown in Figure 8 in the first configuration example above, the bar holder 11, with the stack mounted, moves upward (in the direction C in Figure 2) along the mounting surface 11a by the thickness of the laser diode bar 60 that was just removed. This movement is controlled by an optical sensor so that the position of arrow J shown in Figure 8 is the position of the top surface of the uppermost spacer 71 of the stack. Furthermore, because the top cover 80 does not move at this time, the side of the uppermost spacer 71 of the stack is exposed from the top end surface of the top cover 80, ensuring that the sputtering film 90 is reliably cut between the spacer 71 and the side of the next laser diode bar 60 loaded below it when the spacer 71 is removed.

In addition, in the modified reset device, the shape of the hook-shaped portion 123 formed on the first tip 121 of the suction collet 21 is the same as that of the reset device 100 with the basic configuration shown in Figure 10. Furthermore, like the reset device 100 with the basic configuration described above, the thickness of the hook-shaped portion 123 of the first tip 121 and the thickness of the hook-shaped portion 133 of the second tip 131 are formed to be smaller than the thickness of the laser diode bar 60 and spacer 71 to be removed.

By repeating the operations shown in Figures 11 to 15, the laser diode bar 60 located at the top of the stack in the modified reset device is removed. Furthermore, the spacers 71 stacked on the stack are also removed by the first transport unit 20' of the second transfer mechanism shown on the left side of Figure 1 using the same process as the removal of the laser diode bar 60 shown in Figures 11 to 15 above, and are stored in the recovery member 51'.

As described above, in the reset device of the modified example shown in this embodiment, the uppermost laser diode bar 60 in the stack of laser diode bars 60 and spacers 70 is first moved lengthwise along its main surface, and then moved widthwise to cut the sputtered film 90 formed on the side of the stack. In this way, compared to conventional reset devices that cut the sputtered film by pressing and bending the main surfaces of the laser diode bar 60 or spacer 70, it is possible to remove the laser diode bar 60 from the stack without deforming the laser diode bar 60.

In the modified reset device, the laser diode bar to be removed is moved in two directions, the length and width of its main surface, to more reliably cut the sputtering film that is continuously formed on the side of the laminate.

As explained above, when the reset device disclosed in this application alternately removes laser diode bars or spacers from a stack in which laser diode bars and spacers are stacked, it moves the laser diode bars toward their main surfaces using a suction collet that transfers them from the stack to the recovery member for each component, cutting the sputtered film that has formed continuously on their sides. Therefore, compared to conventional reset devices that cut the sputtered film by bending the laser diode bars, this device can reliably cut the sputtered film and avoid deformation of the laser diode bars.

In the above embodiment, two examples were given of the direction in the main surface in which the laser diode bar or spacer to be removed to cut the sputtered film formed on the side surface is moved: in the width direction, and in the length direction and then in the width direction. However, in the reset device disclosed herein, the direction of movement in the main surface to cut the sputtered film is not limited to the two cases described above. The sputtered film can be cut by moving it in any direction in the main surface, such as moving it only in the length direction, or moving it in an oblique direction that is neither lengthwise nor widthwise. Furthermore, as shown in the above modified example, the movement is not limited to two directions, and the sputtered film can also be cut by moving the laser diode bar or spacer to be removed in three or more directions.

Furthermore, in the above embodiment, as an example of moving the laser diode bar and spacer to be removed in two directions within their main surface, a configuration was given in which the suction collet has two tips, a first tip and a second tip, and the second tip can move independently of the first tip. However, in the reset device disclosed in this application, even when the laser diode bar and spacer to be removed are moved in two directions within the main surface direction, the suction collet may have a single tip, or may be divided into two tips and both may move in the same direction.

Furthermore, in the above embodiment, a configuration was illustrated in which the tip of the suction collet was equipped with a hook-shaped portion that could come into contact with the side of the laser diode bar or spacer to be removed. However, if the sputtering film formed on the side of the laminate can be cut by firmly adhering the laser diode bar and spacer and moving them in the in-plane direction of the main surface, the configuration may not have a hook-shaped portion at the tip of the suction collet. Similarly, as long as the sputtering film can be reliably cut, the configuration may not have a top cover that can come into contact with the front side of the laminate.

Furthermore, compared to thin and fragile laser diode bars, spacers made of silicon or metal materials and capable of being formed thick may be deemed less likely to deform when removed from the stack. In such cases, the conditions for removing the spacer can be set to be different from the conditions for removing the laser diode bar. For example, when removing the laser diode bar, the movement in the direction of its main surface can be set to be performed in multiple small steps, whereas when removing the spacer, the movement in the direction of its main surface can be set to be performed in one relatively large distance.

In addition, while the bar holder shown in the above embodiment has an example in which a slit-shaped suction port is formed on the mounting surface, it is possible that a slit-shaped suction port may not be necessary if, for example, there is no risk of the stack of laser diode bars and spacers being mounted tipping forward due to various conditions such as the inclination angle of the mounting surface. Furthermore, the above-described bar holder configuration is merely one example, and there are no particular restrictions on the shape of the bar holder as long as it is shaped to hold the stack so that the suction collet can move the laser diode bar or spacer in the direction of its surface to cut the sputtering film, and further so that the suction collet can transfer the laser diode bar or spacer from the stack that has been mounted.

Furthermore, in the above embodiment, an example was shown in which the bar holder moves upward by a predetermined amount after the top laser diode bar or spacer is removed, but it is also possible to configure the height of the suction collet to change without changing the position of the bar holder.

The bar holder must have a flat, clean surface and be made of a material with a certain level of rigidity, so it can be effectively formed using metal materials such as stainless steel or iron.

The reset device disclosed in this application can sequentially remove laser diode bars and spacers from a stack of laser diode bars and spacers placed on a mounting jig by cutting the sputtering film formed continuously on the side surfaces. This reset device is particularly useful for thin laser diode bars, as it does not cause problems such as deformation when removed.

11 Bar holder (mounting jig)
21 suction collet 51 recovery member (storage location)
60 Laser diode bar 71 Spacer 90 Sputtering film 100 Reset device

Claims (6)

A reset device that alternately removes laser diode bars and spacers from a stack of laser diode bars and spacers mounted on a mounting jig using a suction collet and transfers the laser diode bars and spacers to a predetermined storage location,
A reset device characterized in that the suction collet adsorbs the laser diode bar or the spacer located at the top of the stack and moves it in a direction within its main surface, thereby cutting the sputtering film formed on the side of the stack. The reset device of claim 1 further includes a retaining member disposed adjacent to the side of each of the laser diode bars and spacers other than the uppermost laser diode bar or spacer in the stack, opposite the side facing the mounting jig. The reset device of claim 1, wherein the direction within the main surface is the width direction of the laser diode bar and the spacer. The reset device of claim 1, wherein the direction within the main plane is the length direction of the laser diode bar and the spacer. The reset device of claim 1, wherein the tip of the suction collet has a hook-shaped portion that faces the side of the laser diode bar or the spacer. The reset device of claim 1, wherein the tip of the suction collet comprises a first tip and a second tip that is movable relative to the first tip.