JP7764264B2 - Processing method of workpiece - Google Patents

Description

The present invention relates to a workpiece processing method that is applied when processing plate-shaped workpieces such as wafers.

In order to create small, lightweight device chips, there are increasing opportunities to thin wafers that have integrated circuits or other devices mounted on their front side. For example, the front side of the wafer is held by a chuck table, and the chuck table and a grinding wheel with abrasive grains attached to it are rotated relative to each other. The grinding wheel is pressed against the back side of the wafer while a liquid such as pure water is supplied, thereby grinding and thinning the wafer.

However, when a wafer is ground with a grinding wheel (grinding stone) like the one described above, damaged areas containing scratches and distortions are formed on the ground surface, which can easily result in a lack of mechanical strength (such as flexural strength) of the wafer. Therefore, after the wafer is ground, the ground surface of the wafer is polished with a polishing pad, for example, to remove these damaged areas. In recent years, multi-tasking processing equipment has been proposed that is designed to perform grinding and polishing continuously so that such processing can be carried out efficiently (see, for example, Patent Document 1).

Japanese Patent Application Laid-Open No. 2005-153090

In the above-mentioned integrated processing equipment, the chuck table moves from the grinding area, where the grinding wheel is located, to the polishing area, where the polishing pad is located, allowing the wafer to be continuously ground and polished. However, after grinding, small amounts of debris generated during grinding may remain on the wafer and chuck table. If the wafer is polished in this state, the wafer will be scraped by the debris, reducing the flatness of the polished surface.

Therefore, an object of the present invention is to provide a method for processing a workpiece that can efficiently process the workpiece while achieving high flatness of the polished surface.

According to one aspect of the present invention, there is provided a method for processing a workpiece that is applied when processing a plate-shaped workpiece having a first surface and a second surface opposite to the first surface, the method including: a grinding step in which the workpiece is ground from the second surface side with a grinding wheel; a cleaning step in which the grinding surface of the workpiece is cleaned after the grinding step; and a polishing step in which the workpiece is polished from the grinding surface side with a polishing pad after the cleaning step , wherein in the cleaning step, a cleaning fluid is supplied from a cleaning nozzle while the cleaning nozzle moves together with the polishing pad .

According to another aspect of the present invention, there is provided a method for processing a workpiece that is applied when processing a plate-shaped workpiece having a first surface and a second surface opposite to the first surface, the method including: a holding step in which the first surface side of the workpiece is held by a chuck table; a grinding step in which, after the holding step, the workpiece held by the chuck table is ground from the second surface side with a grinding wheel; a cleaning step in which, after the grinding step, the surface to be ground of the workpiece held by the chuck table is cleaned together with the chuck table; and a polishing step in which, after the cleaning step, the workpiece held by the chuck table is polished from the surface to be ground with a polishing pad, wherein in the cleaning step, a cleaning nozzle is moved together with the polishing pad while a cleaning fluid is supplied from the cleaning nozzle .

In one aspect of the present invention, a method for processing a workpiece involves grinding the workpiece with a grinding wheel, cleaning the workpiece's grinding surface, and then polishing the workpiece with a polishing pad. Therefore, when the workpiece is polished with the polishing pad, any debris generated during grinding has been sufficiently removed from the grinding surface.

As a result, even when grinding and polishing are performed consecutively, a high level of flatness can be achieved on the polished surface. In other words, according to one aspect of the present invention, a method for processing a workpiece can be used to efficiently process the workpiece while achieving a high level of flatness on the polished surface.

Similarly, in a method for processing a workpiece according to another aspect of the present invention, after the workpiece is ground with a grinding wheel, the grinding surface of the workpiece is cleaned together with the chuck table, and the workpiece is then polished with a polishing pad. Therefore, when the workpiece is polished with the polishing pad, any debris generated during grinding has been sufficiently removed from the grinding surface and the chuck table.

As a result, even when grinding and polishing are performed consecutively, debris is prevented from getting caught between the polishing pad and the workpiece, achieving a high level of flatness on the polished surface. In other words, according to a method for processing a workpiece according to another aspect of the present invention, it is possible to efficiently process the workpiece while achieving a high level of flatness on the polished surface.

FIG. 1 is a perspective view showing a schematic view of a protective member being attached to a disk-shaped workpiece. FIG. 2 is a cross-sectional view schematically showing a state in which a workpiece is held on a chuck table via a protective member. FIG. 3 is a cross-sectional view that schematically shows how a workpiece held on a chuck table is ground by a grinding wheel. FIG. 4 is a cross-sectional view showing a schematic view of how the grinding surface of the workpiece and the chuck table are cleaned. FIG. 5 is a cross-sectional view that schematically shows how a workpiece held on a chuck table is polished by a polishing pad. FIG. 6 is a front view showing a polishing unit moving mechanism which is also used as a nozzle swinging mechanism.

Embodiments of the present invention will now be described with reference to the accompanying drawings. In the method for processing a workpiece according to this embodiment, first, a protective member is attached to a disk-shaped workpiece to be processed (attaching step). Figure 1 is a perspective view schematically showing how a protective member 21 is attached to a disk-shaped workpiece 11.

The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor such as silicon (Si). That is, the workpiece 11 has a circular front surface (first surface) 11a and a circular back surface (second surface) 11b opposite the front surface 11a. The front surface 11a of the workpiece 11 is divided into multiple small regions by multiple intersecting streets (planned division lines) 13, and a device 15 such as an integrated circuit (IC) is formed in each small region.

In the method for processing a workpiece according to this embodiment, the workpiece 11 is processed from the back surface 11b side so that the entire workpiece 11 becomes thinner. More specifically, in the method for processing a workpiece according to this embodiment, the workpiece 11 is ground from the back surface 11b side with a grinding wheel, and then polished with a polishing pad.

In this embodiment, a disk-shaped wafer made of a semiconductor such as silicon is used as the workpiece 11, but the material, shape, structure, size, etc. of the workpiece 11 are not limited to this. For example, a substrate made of other semiconductors, ceramics, resin, metal, or other materials may also be used as the workpiece 11. Similarly, the type, number, shape, structure, size, arrangement, etc. of the devices 15 are not limited to the above. The devices 15 do not have to be formed on the workpiece 11.

The protective member 21 attached to the workpiece 11 is typically a circular resin tape (resin film) with roughly the same diameter as the workpiece 11, a resin substrate, or a wafer of the same or different type as the workpiece 11. For example, an adhesive layer that exhibits adhesive strength to the workpiece 11 is provided on the surface 21a of this protective member 21. Therefore, as shown in Figure 1, the protective member 21 is attached to the surface 11a of the workpiece 11 by bringing the surface 21a of the protective member 21 into close contact with the surface 11a of the workpiece 11.

As a result, the protective member 21 absorbs the impact applied when the workpiece 11 is processed from the back surface 11b side, protecting the device 15 and the like on the front surface 11a side. Note that if the protective member 21 can be attached to the workpiece 11 in close contact without an adhesive layer, the protective member 21 does not need to have an adhesive layer. Also, if the impact applied to the front surface 11a side when the workpiece 11 is processed is not a problem, the protective member 21 does not necessarily need to be affixed to the workpiece 11.

After the protective member 21 is attached to the surface 11a of the workpiece 11, the surface 11a of the workpiece 11 is held on the chuck table via the protective member 21 (holding step). Figure 2 is a cross-sectional view that schematically shows how the workpiece 11 is held on the chuck table 4 of the processing device 2 via the protective member 21. Note that the composite processing device 2 shown in Figure 2 and elsewhere is used in each of the following steps.

The processing device 2 is equipped with a chuck table 4 configured to hold a workpiece 11. The chuck table 4 includes a disk-shaped frame 6 made of, for example, ceramics. A recess 6a with a circular opening at its upper end is formed on the top surface of the frame 6, and a porous disk-shaped holding plate 8 made of, for example, ceramics is fixed to the recess 6a.

The upper surface 8a of the holding plate 8 is configured, for example, in a shape corresponding to the side of a cone, and functions as a holding surface for holding the workpiece 11, etc. The difference in height (height difference) between the center 8b of the upper surface 8a of the holding plate 8, which corresponds to the apex of the cone, and the outer periphery of the upper surface 8a of the holding plate 8, is approximately 10 μm to 30 μm. In this embodiment, the back surface 21b of the protective member 21 contacts the upper surface (holding surface) 8a of the holding plate 8.

The underside of the holding plate 8 is connected to a suction source (not shown), such as an ejector, via a flow path 6b provided inside the frame 6 or a valve (not shown) located outside the frame 6. Therefore, when the back surface 21b of the protective member 21 is in contact with the upper surface 8a of the holding plate 8 and the valve is opened to apply negative pressure from the suction source, the back surface 21b of the protective member 21 is sucked by the chuck table 4. In other words, the workpiece 11 is held on the chuck table 4 via the protective member 21 so that the back surface 11b is exposed upward.

A rotary drive source (not shown), such as a motor, is connected to the bottom of the frame 6. The force generated by this rotary drive source causes the chuck table 4 to rotate around an axis along the vertical direction or an axis slightly tilted relative to the vertical direction, with the center 8b of the upper surface 8a as the center of rotation. The frame 6 is also supported by a chuck table movement mechanism (not shown), typically a turntable that can be rotated by a rotary drive source such as a motor, and the force generated by this chuck table movement mechanism causes the chuck table 4 to move horizontally.

After the workpiece 11 is held by the chuck table 4 via the protective member 21, the workpiece 11 held by the chuck table 4 is ground from the back surface 11b side (grinding step). Figure 3 is a cross-sectional view that schematically shows how the workpiece 11 held by the chuck table 4 is ground. Note that for ease of explanation, Figure 3 shows the sides of some elements.

As shown in FIG. 3, a grinding unit 10 is disposed above the chuck table 4 of the processing device 2. The grinding unit 10 includes, for example, a cylindrical spindle housing (not shown). A columnar spindle 12 is housed in the space inside the spindle housing. A disk-shaped mount 14, for example, is provided at the lower end of the spindle 12. An annular grinding wheel 16 with roughly the same diameter as the mount 14 is fixed to the underside of the mount 14 with a bolt (not shown) or the like.

The grinding wheel 16 includes an annular wheel base 18 made of a metal such as stainless steel or aluminum. A plurality of grinding stones 20 are fixed to the annular underside of the wheel base 18 along the circumferential direction of the wheel base 18. In other words, the plurality of grinding stones 20 are arranged in an annular pattern. Each grinding stone 20 has a structure in which abrasive grains made of, for example, diamond or the like are dispersed in a binder made of, for example, resin.

A rotary drive source (not shown), such as a motor, is connected to the upper end of the spindle 12. The force generated by this rotary drive source causes the grinding wheel 16 to rotate about an axis that is aligned vertically or slightly tilted relative to the vertical. The spindle housing is supported by, for example, a ball-screw type grinding unit movement mechanism (not shown), and the force generated by this grinding unit movement mechanism causes the grinding unit 10 to move vertically.

A grinding fluid supply nozzle 22 is located next to the grinding wheel 16, which can supply a grinding liquid (grinding fluid) 31, such as water, to the area where the workpiece 11 and grinding wheel 20 come into contact. Instead of, or in addition to, this grinding fluid supply nozzle 22, a grinding fluid supply port used to supply the liquid 31 may be provided on the grinding wheel 16, etc.

When grinding the workpiece 11 with the grinding unit 10 (grinding wheel 16), the chuck table 4 first moves to a position directly below the grinding unit 10. More specifically, when the grinding wheel 16 is rotated, the chuck table movement mechanism adjusts the horizontal position of the chuck table 4 so that multiple grinding wheels 20 pass through the space directly above the center 8b of the chuck table 4.

Then, the chuck table 4 and grinding wheel 16 each rotate, and the grinding unit 10 (grinding wheel 16) descends. In other words, the grinding wheel 16 and workpiece 11 rotate relative to each other while moving relatively in a vertical direction that intersects with the back surface 11b of the workpiece 11. At this time, grinding liquid 31 is supplied from the grinding fluid supply nozzle 22 to the workpiece 11, grinding wheel 20, etc. As a result, as shown in Figure 3, the grinding wheel 20 comes into contact with the workpiece 11 from the back surface 11b side, and grinding of the workpiece 11 begins.

There are no significant limitations on the specific grinding conditions. For example, if the grinding wheel 20 is made of relatively large abrasive grains and the workpiece 11 is roughly ground using this grinding wheel 20, the rotation speed of the chuck table 4 is set to 100 rpm to 600 rpm, typically 300 rpm, the rotation speed of the grinding wheel 16 is set to 1000 rpm to 7000 rpm, typically 4500 rpm, and the descent speed of the grinding unit 10 (grinding feed rate) is set to 1.0 μm/s to 10.0 μm/s, typically 6.0 μm/s.

Furthermore, when the grinding wheel 20 is made of relatively small abrasive grains and the workpiece 11 is ground with high precision using this grinding wheel 20, the rotation speed of the chuck table 4 is set to 100 rpm to 600 rpm, typically 300 rpm, the rotation speed of the grinding wheel 16 is set to 1000 rpm to 7000 rpm, typically 4000 rpm, and the descent speed of the grinding unit 10 is set to 0.1 μm/s to 1.5 μm/s, typically 0.5 μm/s.

Of course, the workpiece 11 may be ground using both a grinding wheel containing relatively large abrasive grains and a grinding wheel containing relatively small abrasive grains. That is, the workpiece 11 may be roughly ground using a grinding wheel containing relatively large abrasive grains, and then the workpiece 11 may be ground with high precision using a grinding wheel containing relatively small abrasive grains. When the workpiece 11 has thinned to a predetermined finishing thickness, the grinding unit 10 rises, and grinding of the workpiece 11 is completed.

When the workpiece 11 is ground, liquid 31 is supplied from the grinding fluid supply nozzle 22, and this liquid 31 removes most of the debris generated during grinding from the workpiece 11 and chuck table 4. However, the grinding fluid supply nozzle 22 is designed primarily to supply liquid 31 to the area where the grinding wheel 20 and workpiece 11 come into contact, and is not necessarily optimized for cleaning the workpiece 11 and chuck table 4. As a result, small amounts of debris may remain on the workpiece 11 and chuck table 4.

In a composite processing device 2 designed to perform grinding and polishing continuously, the workpiece 11 is moved after grinding while held on the chuck table 4, and is polished in that state. However, if the workpiece 11 is polished while there is debris remaining on the workpiece 11 or chuck table 4, the debris can scratch the workpiece 11, reducing the flatness of the polished surface.

Therefore, in this embodiment, after the workpiece 11 has been ground, the grinding surface of the workpiece 11 held by the chuck table 4 and the chuck table 4 are cleaned (cleaning step). Figure 4 is a cross-sectional view that schematically shows how the grinding surface 11c of the workpiece 11 and the chuck table 4 are cleaned. Note that for ease of explanation, Figure 4 shows the side views of some elements.

As shown in FIG. 4, a cleaning nozzle 24 used to clean the grinding surface 11c of the workpiece 11 and the chuck table 4 is located above the chuck table 4 of the processing device 2. The cleaning nozzle 24 is supported, for example, by a ball-screw type nozzle swing mechanism (not shown), and can spray cleaning fluid 33 downward while moving horizontally due to the force generated by this nozzle swing mechanism. As the cleaning fluid 33, for example, a mixed fluid (two-fluid) of water and air is used.

When the cleaning nozzle 24 is used to clean the grinding surface 11c of the workpiece 11 and the chuck table 4, the chuck table 4 first moves to a position directly below the cleaning nozzle 24. More specifically, the chuck table movement mechanism adjusts the horizontal position of the chuck table 4 so that the nozzle swing mechanism can swing the cleaning nozzle 24 between above the center 8b of the chuck table 4 and above the outer periphery of the chuck table 4.

Then, while the chuck table 4 is rotating at a speed of, for example, approximately 10 to 500 rpm, the cleaning nozzle 24 oscillates while spraying fluid 33 at a high pressure of approximately 0.05 to 0.15 MPa. This causes the fluid 33 to be sprayed onto the entire grinding surface 11c of the workpiece 11 and the exposed portion of the chuck table 4, thoroughly removing debris from the grinding surface 11c and the chuck table 4.

In this embodiment, a so-called two-fluid nozzle capable of spraying a mixed fluid of water and air is used as the cleaning nozzle 24. However, a so-called water curtain nozzle capable of spraying a cleaning liquid (typically water) in a curtain-like manner to form a water curtain may also be used as the cleaning nozzle 24.

In this case, for example, the water curtain nozzle is fixed in a predetermined position and does not swing. As the chuck table 4 moves through the water curtain formed by the water curtain nozzle, liquid is sprayed onto the entire grinding surface 11c of the workpiece 11 and the exposed portion of the chuck table 4, sufficiently removing debris from the grinding surface 11c and the chuck table 4.

The water curtain nozzle may be positioned near the boundary between the grinding area and the polishing area within the processing device 2. In this case, by forming a water curtain with the water curtain nozzle when grinding the workpiece 11, scattering of debris from the grinding area to the polishing area is suppressed.

After the grinding surface 11c of the workpiece 11 and the chuck table 4 have been cleaned, the workpiece 11 held by the chuck table 4 is polished from the grinding surface 11c side using a method such as chemical mechanical polishing (CMP) (polishing step). Figure 5 is a cross-sectional view that schematically shows how the workpiece 11 held on the chuck table 4 is polished. Note that for ease of explanation, Figure 5 shows the side faces of some elements.

As shown in FIG. 5, a polishing unit 26 is disposed above the chuck table 4 of the processing device 2. The polishing unit 26 includes, for example, a cylindrical spindle housing (not shown). A columnar spindle 28 is housed in the space inside the spindle housing. A disk-shaped mount 30, for example, is provided at the lower end of the spindle 28. A disk-shaped polishing pad 32 is fixed to the underside of the mount 30 with a bolt (not shown) or the like.

The polishing pad 32 is formed in a disk shape from, for example, abrasive-free nonwoven fabric or polymer foam, and has a polishing liquid supply port (not shown) in its center that is used to supply polishing liquid (polishing liquid), such as a chemical solution containing abrasive particles. The polishing liquid supply port is connected to a polishing liquid source via, for example, a flow path provided in the mount 30 or spindle 28. The polishing pad 32 may contain abrasive particles. In that case, a chemical solution containing no abrasive particles is used as the polishing liquid.

A rotary drive source (not shown), such as a motor, is connected to the upper end of the spindle 28. The force generated by this rotary drive source causes the polishing pad 32 to rotate about an axis that is aligned vertically or slightly tilted relative to the vertical. The spindle housing is supported by, for example, a ball-screw type polishing unit movement mechanism (not shown), and the polishing unit 26 moves vertically due to the force generated by this polishing unit movement mechanism.

When the grinding surface 11c of the workpiece 11 is polished with the polishing unit 26 (polishing pad 32), the chuck table 4 first moves to a position directly below the polishing unit 26. More specifically, the chuck table movement mechanism adjusts the horizontal position of the chuck table 4 so that the entire grinding surface 11c of the workpiece 11 held on the chuck table 4 overlaps with the polishing pad 32 when viewed from above.

Then, the chuck table 4 and polishing pad 32 each rotate, and the polishing unit 26 (polishing pad 32) descends. In other words, the polishing pad 32 and workpiece 11 rotate relative to each other while moving relatively in a vertical direction that intersects with the grinding surface 11c of the workpiece 11. At this time, polishing liquid is supplied to the workpiece 11, polishing pad 32, etc. from the polishing liquid supply port.

As a result, as shown in Figure 5, the polishing pad 32 comes into contact with the workpiece 11 from the side of the surface 11c to be ground, and polishing of the workpiece 11 begins. Note that for ease of explanation, Figure 5 shows the polishing pad 32 contacting only part of the surface 11c to be ground. However, as mentioned above, there is only a small difference in height between the center 8b of the upper surface 8a of the chuck table 4 and the outer periphery of the upper surface 8a. Therefore, in reality, the polishing pad 32 comes into contact with the entire surface 11c to be ground.

There are no significant limitations on the specific polishing conditions. For example, the rotation speed of the chuck table 4 is set to 10 rpm to 600 rpm, typically 500 rpm, the rotation speed of the polishing pad 32 is set to 200 rpm to 600 rpm, typically 500 rpm, and the load applied by the polishing pad 32 to the workpiece 11 is set to 10 kPa to 35 kPa, typically 25 kPa. After a preset time has elapsed, the polishing pad 32 rises, completing the polishing of the workpiece 11.

In this embodiment, after the workpiece 11 is ground and before it is polished, the grinding surface 11c of the workpiece 11 and the chuck table 4 are cleaned, and debris generated during grinding is thoroughly removed from the grinding surface 11c and the chuck table 4. As a result, debris remaining on the grinding surface 11c will not scratch the workpiece 11. Furthermore, debris remaining on the chuck table 4 will not get caught between the polishing pad 32 and the workpiece 11 and scratch the workpiece 11.

As described above, in the workpiece processing method according to this embodiment, after the workpiece 11 is ground with the grinding wheel 16, the grinding surface 11c of the workpiece 11 is cleaned along with the chuck table 4, and then the workpiece 11 is polished with the polishing pad 32. Therefore, when the workpiece 11 is polished with the polishing pad 32, debris generated during grinding has been sufficiently removed from the grinding surface 11c and the chuck table 4.

As a result, even when grinding and polishing are performed consecutively, debris is prevented from getting caught between the polishing pad 32 and the workpiece 11, achieving a high level of flatness on the polished surface. In other words, the workpiece processing method according to this embodiment makes it possible to efficiently process the workpiece 11 while achieving a high level of flatness on the polished surface.

The present invention is not limited to the above-described embodiment and can be implemented with various modifications. For example, in the above-described embodiment, the cleaning nozzle 24 is swung horizontally by a nozzle swinging mechanism that is independent of the polishing unit movement mechanism, etc., but the polishing unit movement mechanism, etc., may also be used as the nozzle swinging mechanism.

Figure 6 is a side view showing a polishing unit movement mechanism 34, which is also used as a nozzle swing mechanism. As shown in Figure 6, the polishing unit movement mechanism 34 has a pair of guide rails 36 that are generally parallel to the horizontal direction. These guide rails 36 are fixed, for example, to the front side of a columnar support structure (not shown). A horizontal movement plate 38 is attached to the guide rails 36 in a slidable manner.

A nut (not shown) that constitutes a ball screw is provided on the rear side of the horizontal movement plate 38, and a screw shaft 40 that is generally parallel to the guide rail 36 is rotatably connected to this nut. A rotational drive source 42 such as a motor is connected to one end of the screw shaft 40. By rotating the screw shaft 40 with the rotational drive source 42, the horizontal movement plate 38 moves along the guide rail 36.

A pair of guide rails 44, which are generally parallel to the vertical direction, are fixed to the front side of the horizontal movement plate 38. A vertical movement plate 46 is attached to the guide rails 44 in a sliding manner.

A nut portion (not shown) that constitutes a ball screw is provided on the back side of the vertical movement plate 46, and a screw shaft 48 that is generally parallel to the guide rail 44 is rotatably connected to this nut portion. A rotational drive source 50 such as a motor is connected to one end of the screw shaft 48. By rotating the screw shaft 48 with the rotational drive source 50, the vertical movement plate 46 moves along the guide rail 44.

A support 52 is provided on the front side of the vertical movement plate 46. The support 52 supports the spindle housing 54 that constitutes the polishing unit 26 in the above-described embodiment. The support 52 also supports the base end of the cleaning nozzle 24 in the above-described embodiment. Therefore, the polishing unit movement mechanism 34 can swing the cleaning nozzle 24 horizontally together with the polishing unit 26.

When the polishing unit movement mechanism 34 according to this modified example is used, for example, when polishing the workpiece 11 (polishing step), the polishing unit movement mechanism 34 oscillates the polishing unit 26 in the horizontal direction. This allows the entire workpiece 11 to be polished evenly with the polishing pad 32, further improving the flatness of the polished surface.

Furthermore, when the workpiece 11 or chuck table 4 is cleaned (cleaning step), the polishing unit movement mechanism 34 swings the cleaning nozzle 24 horizontally. In other words, the cleaning nozzle 24 moves together with the polishing pad 32 while supplying cleaning fluid.

In addition, the structures, methods, etc. of the above-described embodiments and variations may be modified as appropriate without departing from the scope of the present invention.

11: Workpiece 11a: Surface (first surface)
11b: Back side (second side)
11c: grinding surface 13: street (planned division line)
15: Device 21: Protective member 21a: Front surface 21b: Back surface 31: Liquid (grinding fluid)
33: Fluid (cleaning fluid)
2: Processing device 4: Chuck table 6: Frame 6a: Recess 6b: Flow path 8: Holding plate 8a: Upper surface (holding surface)
8b: Center 10: Grinding unit 12: Spindle 14: Mount 16: Grinding wheel 18: Wheel base 20: Grinding stone 22: Grinding fluid supply nozzle 24: Cleaning nozzle 26: Polishing unit 28: Spindle 30: Mount 32: Polishing pad 34: Polishing unit movement mechanism 36: Guide rail 38: Horizontal movement plate 40: Screw shaft 42: Rotation drive source 44: Guide rail 46: Vertical movement plate 48: Screw shaft 50: Rotation drive source 52: Support 54: Spindle housing

Claims (2)

A method for processing a workpiece that is applied when processing a plate-shaped workpiece having a first surface and a second surface opposite to the first surface,
a grinding step of grinding the workpiece from the second surface side with a grinding wheel;
a cleaning step of cleaning the ground surface of the workpiece after the grinding step;
a polishing step of polishing the workpiece from the grinding surface side with a polishing pad after the cleaning step ,
In the cleaning step, a cleaning nozzle is moved together with the polishing pad while a cleaning fluid is supplied from the cleaning nozzle . A method for processing a workpiece that is applied when processing a plate-shaped workpiece having a first surface and a second surface opposite to the first surface,
a holding step of holding the first surface side of the workpiece on a chuck table;
a grinding step of grinding the workpiece held by the chuck table from the second surface side with a grinding wheel after the holding step;
a cleaning step of cleaning the grinding surface of the workpiece held by the chuck table together with the chuck table after the grinding step;
a polishing step of polishing the workpiece held by the chuck table from the grinding surface side with a polishing pad after the cleaning step ,
In the cleaning step, a cleaning nozzle is moved together with the polishing pad while a cleaning fluid is supplied from the cleaning nozzle .