JP7766744B2 - deposition mask - Google Patents

Description

The present invention relates to a vapor deposition mask, and in particular to a vapor deposition mask in which the mask body is supported by a frame. The present invention is applicable to a vapor deposition mask that is preferably used, for example, when forming the light-emitting layer of an organic EL element.

In mobile devices with display devices, such as smartphones and tablet computers, the adoption of lighter, less power-consuming organic electroluminescent (EL) displays has begun in place of liquid crystal displays (LCDs) in order to reduce device weight and extend operating times. Organic EL displays are manufactured by forming the light-emitting layer (deposition layer) of an organic EL element on a substrate (the target of deposition) using a deposition mask method. By using a larger deposition mask with more mask bodies to produce more products in a single deposition run, the manufacturing cost of organic EL displays can be reduced. For this reason, manufacturers of organic EL displays are increasingly demanding larger deposition masks.

A deposition mask used in the deposition mask method is disclosed, for example, in Patent Document 1. In Patent Document 1, the deposition mask is composed of a metal mask (mask body) with multiple mask portions (deposition patterns) and a frame (frame body) made of Invar material that is shaped like a picture frame and holds the metal mask in place under tension. The metal mask is joined to the frame by spot welding.

This type of vapor deposition mask has also been proposed by the present applicant and is disclosed, for example, in Patent Document 1. This vapor deposition mask consists of multiple mask bodies each having a vapor deposition pattern and a reinforcing frame body joined to the mask bodies. The frame body is made of Invar (a material with a low coefficient of linear thermal expansion), and the outer periphery of each mask body is integrally joined with a metal layer formed on the frame body that surrounds the mask body.

Japanese Patent Application Laid-Open No. 2004-323888 Japanese Patent Application Laid-Open No. 2005-15908

As with the deposition masks in Patent Documents 1 and 2, by constructing the frame that securely holds the metal mask and the frame that reinforces the mask body from Invar material, expansion of the deposition mask can be suppressed, even in high-temperature working environments during deposition, ensuring the reproducibility and deposition accuracy of the deposition layer (light-emitting layer). However, although the metal mask in the deposition mask in Patent Document 1 is secured to the frame in a tensed state, when the deposition mask is made larger, the area of the metal mask that is not supported by the frame increases, causing the metal mask to warp and deform due to its own weight. This inevitably leads to a decrease in reproducibility and deposition accuracy.

In contrast, in the deposition mask of Patent Document 2, each mask body is joined to a frame surrounding the mask body. This means that even when the deposition mask is enlarged, the mask body is less likely to warp or deform due to its own weight, ensuring the reproducibility and deposition accuracy of the deposition layer. However, even frames made of Invar material undergo slight expansion during deposition. Furthermore, while the frame is formed from an Invar metal plate, commonly available metal plate materials typically have thickness variations, resulting in variations in thickness across different parts of the frame. This difference in expansion can manifest as distortion across the entire deposition mask. Distortion in the deposition mask reduces its flatness, significantly reducing reproducibility and deposition accuracy. This distortion becomes more pronounced as the frame is enlarged. While distortion resulting from thickness variations in the base material can be suppressed by controlling the manufacturing process of the metal plate and exclusively manufacturing and using base materials with minimal thickness variations, this increases the cost of the base material and increases the manufacturing costs of the deposition mask. Here, thickness deviation refers to the variation in thickness relative to the standard dimensions of the metal plate material.

The object of the present invention is to provide a deposition mask in which the mask body is supported by a frame, which suppresses deformation of the mask body even when affected by expansion of various parts due to heat, enables the deposition mask to be made larger, maintains its flatness, has excellent heat resistance, and ensures good reproducibility and deposition accuracy of the deposition layer.

The vapor deposition mask of the present invention comprises a vapor deposition mask body 50 consisting of a mask body 2 having a vapor deposition pattern 6 consisting of a large number of independent vapor deposition through-holes 5 and a frame body 3 arranged around the mask body 2, a support frame 46 arranged on the underside of the vapor deposition mask body 50 to support multiple vapor deposition mask bodies 50, and an auxiliary frame 47 arranged on the underside of the support frame 46. The support frame 46 has frame openings 48 formed therein that correspond to the mask openings 11 in the frame body 3. The periphery of the support frame 46 is supported by the auxiliary frame 47.

The frame body 3 comprises a peripheral frame 10, and vertical and horizontal frames 12 and 13 that define the mask opening 11 within the peripheral frame 10, with the entire vertical and horizontal frames 12 and 13 being supported by a support frame 46.

The frame opening 48 is formed with an opening shape that is slightly larger than the mask opening 11.

The frame body 3, support frame 46, and auxiliary frame 47 are integrated by welding.

Welding points 49 are provided at the four corners and on the peripheral edges of the frame 3 along the extensions of the vertical and horizontal frames 12 and 13.

Each vapor deposition mask body 50 is formed in a strip shape, and the outer shape of the support frame 46 is formed in a rectangular shape. Multiple vapor deposition mask bodies 50 are supported by the support frame 46 in a state where they are arranged side by side along the short length direction of the strips. The four peripheral edges of the support frame 46 are supported by rectangular auxiliary frames 47.

The deposition mask of the present invention includes a mask body 2 having a deposition pattern 6 consisting of a large number of independent deposition through-holes 5, and a frame body 3 arranged around the mask body 2. A support frame 46 is fixed to the lower surface side of the frame body 3. The support frame 46 is formed with a frame opening 48 corresponding to the mask opening 11 of the frame body 3, and the frame opening 48 is formed with an opening shape slightly larger than the mask opening 11. An auxiliary frame 47 is also fixed to the lower surface side of the support frame 46.

The frame body 3 includes a peripheral frame 10, and vertical frames 12 and horizontal frames 13 that define a mask opening 11 within the peripheral frame 10. The entire vertical frames 12 and horizontal frames 13 are supported by a support frame 46, and the auxiliary frame 47 is formed in a frame shape, and the periphery of the support frame 46 is supported by the auxiliary frame 47.

The frame body 3, the support frame 46, and the auxiliary frame 47 are integrated by welding, and the welding points 49 are provided at the four corners and on the peripheral portions of the frame body 3 on the extension lines of the vertical frames 12 and horizontal frames 13.

The mask body 2 and the frame body 3 are characterized by being integrally joined via a metal layer 8 .

A plurality of frame bodies 3, 3 are stacked, and the frame bodies 3, 3 adjacent to each other in the stacking direction are joined together via an adhesive layer 19.

The deposition mask according to the deposition mask manufacturing method of the present invention includes a mask body 2 having a deposition pattern 6 consisting of a large number of independent deposition through-holes 5, and a frame 3 arranged around the mask body 2. The deposition mask manufacturing method is characterized by including the steps of: preparing the mask body 2 and the frame 3; integrally joining the mask body 2 and the frame 3; joining a support frame 46 to the lower surface of the frame 3; and joining an auxiliary frame 47 to the lower surface of the support frame 46.

The process for preparing the mask body 2 and the frame body 3 includes a frame body forming process for forming the frame body 3, a primary patterning process for forming a primary pattern resist 29 having resist bodies 29a corresponding to the vapor deposition through-holes 5 on the surface of the matrix 24, and a first electroforming process for electroforming an electrodeposited metal on the surface of the matrix 24 that is not covered by the resist body 29a to form a primary electroforming layer 30, and the process for integrally bonding the mask body 2 and the frame body 3 is characterized in that the mask body 2 and the frame body 3 are integrally bonded via a metal layer formed by electroforming.

A plurality of deposition mask bodies 50 are prepared, each having a mask body 2 and a frame body 3 integrally joined via a metal layer, and the deposition mask bodies 50 are joined one by one to a support frame 46, and then an auxiliary frame 47 is joined to the side of the support frame 46 opposite to the side to which the deposition mask bodies 50 are fixed.

The frame body 3, the support frame 46, and the auxiliary frame 47 are joined together by welding, and the welded points 49 are located at the four corners and on the peripheral edges of the vertical and horizontal frames 12 and 13 of the frame body 3.

In the deposition mask according to the present invention, the support frame 46 supports the entire frame 3 (vertical frames 12 and horizontal frames 13), further increasing the structural strength and rigidity of the entire deposition mask, preventing the deposition mask from flexing and maintaining flatness, and improving the reproducibility and deposition accuracy of the deposition layer. Furthermore, by supporting the support frame 46 (periphery) with the auxiliary frame 47, the reproducibility and deposition accuracy of the deposition layer can be further improved.

FIG. 1 is a vertical sectional front view showing a main part of a deposition mask according to a first reference example. FIG. 1 is a perspective view showing an entire deposition mask according to a first reference example. FIG. 10 is a plan view showing a main part of a deposition mask according to a first reference example. FIG. 10 is a plan view of a frame of a vapor deposition mask according to a first reference example. 10A to 10C are explanatory views showing a frame forming step in the method for manufacturing a deposition mask according to a first reference example. 10A and 10B are explanatory views showing a modified example of a frame body forming step in the method for manufacturing a deposition mask according to the first reference example. FIG. 10 is a plan view showing a modified example of the frame of the deposition mask according to the first reference example. 10A to 10C are explanatory views showing a primary patterning step and a first electroforming step in a method for manufacturing a deposition mask according to a first reference example. 10A to 10C are explanatory views showing an activation treatment step in the method for manufacturing a deposition mask according to a first reference example. 10A to 10C are explanatory views showing a secondary patterning step, a frame providing step, a second electroforming step, and a peeling step in the method for manufacturing a deposition mask according to the first reference example. FIG. 10 is a vertical sectional front view showing a main part of a deposition mask according to a second reference example. 10A to 10C are explanatory views showing a frame providing step, a second electroforming step, and a peeling step of a deposition mask according to a second reference example. FIG. 11 is a vertical sectional front view showing a main part of a deposition mask according to a third reference example. 10A to 10C are explanatory views showing a primary patterning step and a first electroforming step in a method for manufacturing a deposition mask according to a third reference example. 11A to 11C are explanatory views showing a secondary patterning step, a frame providing step, a second electroforming step, and a peeling step in the method for manufacturing a deposition mask according to a third reference example. FIG. 11 is a vertical sectional front view showing a main part of a deposition mask according to a fourth reference example. 10A to 10C are explanatory views showing a method for manufacturing a deposition mask according to a fourth reference example. FIG. 11 is a longitudinal sectional front view showing a deposition mask according to a fifth reference example. FIG. 13 is an exploded perspective view of a deposition mask according to a fifth reference example. FIG. 13 is a plan view of a deposition mask according to a fifth reference example. 1 is an exploded perspective view showing a deposition mask according to a first embodiment of the present invention.

(First Reference Example) Figures 1 to 10 show a first reference example of a vapor deposition mask and its manufacturing method. Note that the dimensions such as thickness and width in Figures 1 to 10 of this reference example are not actual dimensions, but are shown schematically. The same applies to the following reference examples and the figures of the first embodiment.

As shown in Figures 2 and 3, the deposition mask 1 includes multiple mask bodies 2 and a reinforcing frame 3 arranged around the mask bodies 2. The mask bodies 2 are formed in a rectangular shape with rounded corners, and include a pattern formation region 4 inside. In the pattern formation region 4, a deposition pattern 6 consisting of multiple independent deposition through-holes 5 through which the deposition material from the deposition source passes is formed. As shown in Figure 3, the mask bodies 2 are provided with multiple connection through-holes 7 along the entire periphery 4a of the pattern formation region 4.

The mask body 2 is formed by electroforming using an electrodeposited metal material made of nickel or a nickel alloy such as nickel-cobalt. The thickness of the mask body 2 is preferably in the range of 3 to 20 μm, and in this example was set to 8 μm. Furthermore, the dimensions of the mask body 2 in a plan view are set to 108 mm in the longitudinal direction and 62 mm in the lateral direction, with 30 mask bodies 2 arranged in a matrix of 6 rows and 5 columns. When the vapor deposition mask 1 of this example is used as a vapor deposition mask for an organic EL element, the vapor deposition pattern 6 is formed to correspond to the light-emitting layer of the organic EL element.

As shown in FIG. 4, the frame 3 includes a peripheral frame 10 and lattice-shaped vertical and horizontal frames 12 and 13 that define the mask opening 11 within the peripheral frame 10. The vertical frame 12 is arranged parallel to the long sides of the mask body 2, and the horizontal frame 13 is arranged parallel to the short sides of the mask body 2. The frame 3 can be made of a variety of materials, including metals such as aluminum and iron, and resins, and can take on a variety of shapes and dimensions. However, the frame 3 in this reference example is made of a metal plate material with a low coefficient of linear thermal expansion made of Invar, a nickel-iron alloy, and is formed to be significantly thicker than the mask body 2. Its thickness ranges from 0.5 to 5 mm, and in this reference example, it was set to 1.0 mm. Furthermore, in a plan view, the dimensions of the frame 3 are set to 460 x 730 mm, and the dimensions of the mask opening 11 are set to 110 mm in the longitudinal direction and 64 mm in the lateral direction. The frame 3 may be made of Super Invar, a nickel-iron-cobalt alloy, ceramic, or other materials. The reason for using Invar, Super Invar, or ceramic as the material for the frame 3 is that they have an extremely low coefficient of linear thermal expansion, which effectively prevents dimensional changes in the mask body 2 due to the heat caused by the vapor deposition process.

When the width dimension of the vertical frame 12 is W1 and the width dimension of the horizontal frame 13 is W2, the width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are set to satisfy the inequality (W1≦W2≦W1×1.1). In this reference example, the width dimension W1 of the vertical frame 12 is set to 10 mm, and the width dimension W2 of the horizontal frame 13 is set to 10.64 mm. In this way, by setting the width dimension W2 of the horizontal frame 13 appropriately larger than the width dimension W1 of the vertical frame 12, the cross-sectional area of the horizontal frame 13 can be made larger than the cross-sectional area of the vertical frame 12, and the length of the horizontal frame 13 is shorter than the length of the vertical frame 12. Therefore, the vertical frame 12 is firmly supported by the horizontal frame 13, preventing the long vertical frame 12 from sagging and deforming under its own weight. Therefore, deformation of the frame 3 due to its own weight can be prevented, allowing for a larger deposition mask 1. Furthermore, the flatness of the deposition mask 1 can be maintained, resulting in higher deposition pattern reproduction accuracy and deposition accuracy. Furthermore, the rigidity of the vertical frames 12 and horizontal frames 13 can be made substantially uniform throughout. Therefore, when an external force that causes deflection and deformation of the deposition mask 1 is applied, the external force can be evenly dispersed and prevented from concentrating locally, effectively preventing deformation and damage to the deposition mask 1. Additionally, the width dimension W2 of the horizontal frames 13 is set to (W2≦W1×1.1), which suppresses an increase in the weight of the frame 3 due to an unnecessarily large cross-sectional area of the horizontal frames 13. This prevents unnecessary weight increases for the entire deposition mask, while enhancing the structural strength and rigidity of the frame 3.

While the frame 3 may be cut from a single sheet of metal, in this embodiment, as shown in Figures 1 and 5(a), it is composed of an upper frame 16 and a lower frame 17 formed to the same shape and thickness. The upper frame 16 and the lower frame 17 are joined together via an adhesive layer 18. Specifically, as shown in Figure 5(b), the upper frame 16 and the lower frame 17 are joined with their protruding arc surfaces facing each other, resulting in a flat frame 3 with the two-dimensional curved warp offset. Note that the two-dimensional curved warp is a slight warp resulting from the metal plate material, and may also be a three-dimensional curved warp. In this embodiment, the adhesive layer 18 is a sheet of uncured photosensitive dry film resist. After joining the upper frame 16 and the lower frame 17, the unnecessary portions of the adhesive layer 18 are removed. Various commercially available adhesives may be used for the adhesive layer 18. The upper and lower frames 16 and 17 that make up the frame body 3 have the same thickness so that they can be joined together in a state where the two-dimensional curved warp is offset, making it easier to form the frame body 3 flat. The convex arc surfaces may be concave arc surfaces, or they may include both. Note that the thicknesses of the upper and lower frames 16 and 17 may be different as long as they can be joined together in a flat state with the two-dimensional curved warp offset. In this way, joining the upper and lower frames 16 and 17 in a state where the two-dimensional curved warp is offset and forming the frame body 3 flat eliminates slight warping inherent in the metal plate material, further improving flatness and ensuring better reproducibility and deposition accuracy of the vapor deposition layer.

As described above, by joining the upper frame 16 and the lower frame 17 in a state where the two-dimensional curved warp is offset and forming the frame body 3 into a flat shape, the slight warp caused by the metal plate material can be eliminated, further improving flatness and ensuring even better reproducibility and deposition accuracy of the vapor deposition layer.

As shown in Figures 6 and 7, the frame body 3 can be formed by stacking a pair (or multiple) of frame bodies 3 formed using the above method, with adjacent frame bodies 3 bonded together in the stacking direction via an adhesive layer 19. The thicknesses of the upper and lower frame bodies 3 can be the same or different. If the thicknesses of the upper and lower frame bodies 3 are the same, for example, the thicknesses of the upper and lower frames 16 and 17 that make up the upper frame body 3, along with the thicknesses of the upper and lower frames 16 and 17 that make up the lower frame body 3, can be set to 0.25 mm. If the thicknesses of the upper and lower frame bodies 3 are different, for example, the thicknesses of the upper and lower frames 16 and 17 that make up the upper frame body 3 can each be set to 0.2 mm, and the thicknesses of the upper and lower frames 16 and 17 that make up the lower frame body 3 can each be set to 0.3 mm.

In FIG. 1, the reference numeral 8 denotes a metal layer formed on the upper surface of the outer periphery 4a of the pattern formation region 4 of the mask body 2. The metal layer 8 is formed by plating (electroforming) nickel. Each mask body 2 is disposed in the mask opening 11 of the frame 3, and the outer periphery 4a of the pattern formation region 4 of the mask body 2 is inseparably bonded to the frame 3 by the metal layer 8 formed by plating (electroforming). As shown in FIGS. 1 and 4, the metal layer 8 has a hat-shaped cross section and extends over the upper surface of the outer periphery 4a of the pattern formation region 4, the upper surface of the frame 3, the side surface facing the pattern formation region 4, and the gap between the mask body 2 and the frame 3. The metal layer 8 is also formed within the bonding through-holes 7, thereby improving the bonding strength between the mask body 2 and the frame 3. Like the mask body 2, the metal layer 8 can be formed from nickel, copper, or other electrodeposited metals or alloys in addition to nickel alloys.

Figure 5 shows the frame formation process for forming the reinforcing frame 3. Figures 8 to 10 show the manufacturing method for the vapor deposition mask 1 according to this reference example, using the frame 3 obtained in the frame formation process.

(Frame body formation process)
First, a cutting process is performed using, for example, a wire electric discharge machine or the like, which has little thermal effect on the metal plate material, to cut out pieces of the upper frame 16 and the lower frame 17. Next, a mask opening forming process is performed in which the cut upper frame 16 and lower frame 17 are etched or laser processed to form multiple openings that become mask openings 11, as shown in FIG. 5( a). Next, a joining process is performed in which the upper frame 16 and the lower frame 17, which originate from the metal plate material, are joined with an adhesive layer 18 with their protruding arc surfaces facing each other, as shown in FIG. 5( b), to form the frame body 3 into a flat shape with the two-dimensional curved surface warpage offset. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Next, as shown in Figure 5(c), a fixing process is performed in which the mask is passed through upper and lower rolling rolls 22, 22 arranged with a predetermined distance between the rolls and pressed against each other. Furthermore, unnecessary portions of the adhesive layer 18 (portions exposed outside the mask opening 11 and peripheral frame 10) are removed (developed) to obtain the frame 3. The reason for using a sheet-like uncured photosensitive dry film resist for the adhesive layer 18 is that uncured photosensitive dry film resist has adhesive properties and is also used in the primary patterning process described below, eliminating the need for a commercially available adhesive or the like, thereby reducing the manufacturing cost of the deposition mask 1. In the cutting process, the upper and lower frames 16, 17 can also be cut out while the metal plate is cooled using a laser cutting machine.

Here, for example, metal plates of different thicknesses are prepared, and the above-mentioned processes are carried out to produce a pair of frames 3, 3 as shown in FIG. 6(a). These frames 3, 3 are then stacked as shown in FIG. 6(b), and the frames 3, 3 are joined together with an adhesive layer 19 made of a sheet of uncured photosensitive dry film resist. Then, as shown in FIG. 6(c), a lamination process is carried out in which the frames are passed between upper and lower rolling rolls 22, 22 arranged with a predetermined distance between the rolls to press them together, thereby obtaining a pair of stacked frames 3, 3 as shown in FIG. 7. In this case, the pair of stacked frames 3, 3 may be made by stacking frames 3, 3 of the same thickness.

(Patterning precursor formation process)
As shown in Figure 8(a), a photoresist layer 25 is formed on the surface of a conductive matrix 24 made of, for example, stainless steel or brass. This photoresist layer 25 is formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them to a predetermined thickness. Next, a pattern film 26 (glass mask) having light-transmitting holes 26a corresponding to the vapor deposition through-holes 5 and the bonding through-holes 7 (primary patterning) is adhered to the photoresist layer 25, thereby obtaining a patterning precursor 27.

(Preheating process)
The patterning precursor 27 (particularly the matrix 24 and pattern film 26) is preheated to the temperature inside the oven of the ultraviolet irradiation device (exposure device) during the exposure operation, for example, using a heater plate, a preheating oven, etc. At this time, it is advisable to preheat the oven of the ultraviolet irradiation device to the temperature inside the oven during the exposure operation in parallel with the preheating of the patterning precursor 27.

(Primary patterning process)
After preheating the ultraviolet irradiation apparatus furnace and the patterning pre-stage 27, the patterning pre-stage 27 is placed in the ultraviolet irradiation apparatus furnace, and as shown in FIG. 8( a), ultraviolet light is applied from an ultraviolet lamp 28 for exposure, followed by development and drying. Next, the unexposed portions are dissolved and removed, forming a primary pattern resist 29 on the matrix 24, as shown in FIG. 8( b), having resist bodies 29a corresponding to the vapor deposition through-holes 5 and the bonding through-holes 7. By preheating the ultraviolet irradiation apparatus furnace and the patterning pre-stage 27 to the furnace temperature during the exposure process, the patterning pre-stage 27 is heated and expanded by ultraviolet irradiation, eliminating the problem of the exposure process being performed with the relative positional relationship between the three elements 24, 25, and 26 shifted. Therefore, the primary pattern resist 29 can be provided on the matrix 24 with high positional accuracy and in the intended shape, contributing to high accuracy in reproducing the vapor deposition layer and high accuracy in vapor deposition.

(First electroforming process)
Next, the matrix 24 was placed in an electroforming tank, and as shown in Figure 8(c), a nickel electrodeposited metal was primarily electroformed on the surface of the matrix 24 not covered by the resist layer 29a, within the height range of the resist layer 29a, to form a primary electroformed layer 30, i.e., a layer that would become the mask body 2. Next, the resist layer 29a was dissolved and removed, yielding the mask body 2, as shown in Figure 8(d), which has a vapor deposition pattern 6 consisting of numerous independent vapor deposition through-holes 5 and connecting through-holes 7. In Figure 8(d), reference numeral 30a denotes a primary electrodeposited layer formed between the mask bodies 2, 2, which will be removed in the peeling process described below.

(Activation treatment step)
Here, an activation treatment process can be performed to improve the bonding strength between the mask body 2 (primary electroformed layer 30) and the metal layer 8. Specifically, as shown in FIG. 9( a), a photoresist layer 33 is formed on the entire surface of the primary electroformed layers 30 and 30a. Then, a pattern film 34 having light-transmitting holes 34a corresponding to the peripheral portions of the bonding through-holes 7 is adhered to the primary electroformed layers 30 and 30a. The pattern film 34 is then placed in a furnace of an ultraviolet irradiation device, exposed to ultraviolet light from an ultraviolet lamp 28, and then developed and dried. The photoresist layer 33 here is formed by laminating one or more sheets of negative-type photosensitive dry film resist using thermocompression bonding, as described above, to a predetermined thickness. Next, the unexposed portions of the photoresist layer 33 are dissolved and removed to obtain a pattern resist 35 having openings 35a corresponding to the peripheral portions of the bonding through-holes 7, as shown in FIG. 9( b). In other words, the pattern resist 35 is formed so that only the peripheral portions of the bonding through-holes 7 are exposed to the surface.

Next, the portion of the primary electroformed layer 30 exposed through the opening 35a of the pattern resist 35, i.e., the primary electroformed layer 30 around the joining through-hole 7, was subjected to an activation treatment such as acid treatment or electrolysis, and then the pattern resist 35 was dissolved and removed as shown in Figure 9(c). In Figure 9(c), the reference numeral 36 indicates the activated portion. Specifically, the activation treatment was performed on the inner wall surface of the joining through-hole 7 and the upper surface of the primary electroformed layer 30 around the joining through-hole 7. Performing the activation treatment around the joining through-hole 7 in this manner significantly improves the bond strength between the primary electroformed layer 30 and the metal layer 8 formed in the second electroforming process described below, compared to when no treatment is performed. Alternatively, instead of the activation treatment, a thin layer may be formed on the primary electroformed layer 30 around the joining through-hole 7 using strike nickel plating, matte nickel plating, or the like. This also improves the bond strength between the area around the joining through-hole 7 and the metal layer 8.

(Secondary patterning process and frame placement process)
As shown in Figure 10(a), a photoresist layer 38 is formed on the entire surface of the matrix 24, including the areas where the primary electroforming layers 30 and 30a are to be formed. This photoresist layer 38 was formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them together to a predetermined thickness, as described above. Next, a pattern film 39 having light-transmitting holes 39a corresponding to the pattern-forming region 4 is tightly attached to the matrix 24, and the matrix 24 is then placed in the oven of an ultraviolet irradiation device. The matrix 24 is then exposed to ultraviolet light from the ultraviolet lamp 28, and the layers are then developed and dried. In this state, the photoresist layer 38 is obtained, with the portion (38a) corresponding to the pattern-forming region 4 exposed and the remaining portion (38b) remaining unexposed (see Figure 10(b)).

Next, as shown in Figure 10(b), the frame 3 was aligned and placed on the matrix 24 so as to surround the primary electroforming layer 30. Here, the adhesive properties of the unexposed photoresist layer 38b were utilized to temporarily fix the frame 3 onto the matrix 24 (primary electroforming layer 30a). Furthermore, as shown in Figure 10(c), the unexposed photoresist layer 38b exposed on the surface was dissolved and removed to form a secondary pattern resist 40 having a resist body 40a covering the pattern formation region 4. At this time, the unexposed photoresist layer 38b on the underside of the frame 3 is covered by the frame 3 and is not dissolved and removed, remaining on the matrix 24. Alternatively, a frame 3 with an adhesive layer formed in advance may be prepared, and the frame 3 may be placed on the matrix 24 before or after forming the secondary pattern resist 40.

(Second electroforming process)
10(d), a metal layer 8 was formed by electroforming a nickel electrodeposited metal on the upper surface of the primary electroformed layer 30 facing the outer peripheral edge 4a of the pattern formation region 4, on the surface of the frame 3, on the surface of the matrix 24 exposed between the frame 3 and the primary electroformed layer 30, and in the bonding through-holes 7. This allows the primary electroformed layer 30 and the frame 3 to be bonded inseparably by the metal layer 8.

(Peeling process)
The primary electroforming layer 30 and the metal layer 8 were peeled off from the matrix 24, and then the primary electroforming layer 30a located on the lower surface of the frame 3 was peeled off from both the layers 30 and 8. Finally, the secondary pattern resist 40 and the unexposed photoresist layer 38b were removed, thereby obtaining the deposition mask 1 shown in FIG.

In this reference example, the temperature range of the electroforming liquid in the first electroforming process was set to a temperature range higher than room temperature (normal temperature) and the temperature range of the electroforming liquid in the second electroforming process. This allows the mask body 2 to be held against the frame 3 under tension that applies stress in an inward contracting direction. Therefore, the expansion of the mask body 2 that occurs when the temperature rises in the vapor deposition furnace is absorbed by this tension, preventing the mask body 2 from shifting position relative to the frame 3 or the occurrence of wrinkles due to expansion. Another method for applying tension to the mask body 2 such that stress acts in an inward contraction direction can be to use a matrix 10 made of a material with a low coefficient of linear thermal expansion (e.g., Invar, 42 alloy, or SUS430) and then utilize the difference in thermal expansion coefficient between the matrix 10 and the primary electroformed layer 30 (electrodeposited metal) due to the temperature difference caused by the increase in the temperature in the electroforming tank during the formation of the primary electrodeposition layer 15, or to adjust the carbon content of the additive (brightener) added to the electroforming tank when forming the primary electrodeposition layer 30 that will become the mask body 2. Furthermore, by adjusting the carbon content of the additive (brightener) added to the electroforming tank in the second electroforming step, the metal layer 8 can be formed under tension such that stress acts to pull the mask body 2 (primary electroformed layer 30) toward the frame 3. Therefore, the expansion of the mask body 2 due to the temperature increase during vapor deposition can be absorbed by this tension, preventing the mask body 2 from shifting position relative to the frame 3 or wrinkling due to the expansion.

(Second Reference Example) Figures 11 and 12 show a second reference example of a vapor deposition mask and a method for manufacturing the same. In this reference example, as shown in Figure 11, in order to prevent distortion of the frame body 3 resulting from internal stress in the metal layer 8 that bonds the mask main body 2 and the frame body 3 together, the metal layer 8 is not formed on the upper surface of the frame body 3 except on the periphery of the mask opening 11, but is instead divided to provide a stress relief portion 42, and a pair of frame bodies 3, 3 are stacked, and adjacent frame bodies 3, 3 in the stacking direction are joined together via an adhesive layer 19.

The frame 3 in the first reference example is surrounded by the metal layer 8 on three sides, including its top surface and both edges of the mask opening 11 that are continuous with the top surface. Therefore, if the metal layer 8 is formed by electroforming while internal stress is present, the internal stress can cause distortion in the frame 3, adversely affecting the flatness of the deposition mask 1. However, by providing the stress relief portions 42 as in this reference example, the internal stress of the metal layer 8 can be released by the stress relief portions 42, preventing distortion in the frame 3. Note that "dividing the metal layer 8" here means that the metal layer 8 is not formed in a continuous state across the entire top surface of the frame 3, and this aspect is not limited to this reference example. Since the rest is the same as in the first reference example, the same components are designated by the same reference symbols and their description is omitted. This also applies to the following reference examples and the first embodiment.

In the manufacturing method of the vapor deposition mask 1 according to this reference example, a step of forming a resist body 42a corresponding to the stress relief portion 42 on the upper surface of the frame body 3 is performed in the final stage of the frame body formation step, and the resist body 42a is provided on the upper surface of the frame body 3. The subsequent patterning precursor body formation step through the secondary patterning step are the same as the methods described in the first reference example and shown in Figures 8(a) to (d), 9(a) to (c), and 10(a).

(Frame body installation process)
As shown in Figure 12(a), a frame 3 provided with a resist body 42a was positioned on the matrix 24 so as to surround the primary electroforming layer 30. Here, the frame 3 was temporarily fixed to the matrix 24 by utilizing the adhesiveness of the unexposed photoresist layer 38b. Furthermore, as shown in Figure 12(b), the unexposed photoresist layer 38b exposed on the surface was dissolved and removed to form a secondary pattern resist 40 having a resist body 40a covering the pattern formation region 4. At this time, the unexposed photoresist layer 38b on the underside of the frame 3 was covered by the frame 3 and was not dissolved and removed, remaining on the matrix 24.

(Second electroforming process)
The matrix 24 was placed in an electroforming tank, and as shown in FIG. 12( c), a nickel electrodeposited metal was electroformed on the upper surface of the primary electroformed layer 30 facing the outer periphery 4 a of the pattern formation region 4, the surface of the frame 3 not covered with the resist body 42 a, the surface of the matrix 24 exposed between the frame 3 and the primary electroformed layer 30, and the inside of the bonding through-holes 7 to form a metal layer 8. This allows the primary electroformed layer 30 and the frame 3 to be inseparably bonded together by the metal layer 8. In this reference example, the temperature ranges of the electroforming liquid used in the first electroforming step and the second electroforming step were set to be approximately the same (temperature difference of ±3°C). This minimizes the thermal expansion of the primary electroformed layer 30, i.e., the mask body 2, when bonded to the frame 3. This improves the positional accuracy of the bonding position of the mask body 2 relative to the frame 3, resulting in a deposition mask with higher accuracy in the reproducibility and deposition accuracy of the deposition layer. In both the first and second electroforming steps, the lower the temperature of the electroforming liquid in the electroforming tank is set, the more effectively the thermal expansion of the primary electroformed layer 30 and the metal layer 8 can be suppressed.

(Peeling process)
The primary electroforming layer 30 and the metal layer 8 were peeled off from the matrix 24, and then the primary electroforming layer 30a located on the lower surface of the frame 3 was peeled off from both the layers 30 and 8. Finally, the secondary pattern resist 40, the resist body 42a, and the unexposed photoresist layer 38b were removed to obtain the deposition mask 1 provided with the stress relaxation portion 42 shown in FIG.

(Third Reference Example) Figures 13 to 15 show a third reference example of a vapor deposition mask and its manufacturing method. As shown in Figure 13, this reference example differs from the first reference example in that the bonding through-holes 7 in the mask body 2, through which the metal layer 8 penetrates, have been eliminated. The upper frame 16 and lower frame 17 that make up the frame body 3 in this reference example are formed using a metal plate as the base material, and the frame body 3 has the same thickness dimensions as the first reference example.

Figures 14 and 15 show a manufacturing method for the vapor deposition mask 1 according to this reference example. First, a frame formation process is performed to form a reinforcing frame 3. Note that this frame formation process is the same as that shown in Figure 5 of the first reference example, and its description will be omitted.

(Patterning precursor formation process)
14(a), a photoresist layer 25 is formed on the surface of a conductive matrix 24 made of, for example, stainless steel or brass. This photoresist layer 25 is formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them to a predetermined thickness. Next, a pattern film 26 (glass mask) having light-transmitting holes 26a corresponding to the vapor deposition through-holes 5 is adhered to the photoresist layer 25, thereby obtaining a patterning precursor 27.

(Preheating process)
The patterning pre-stage body 27 is preheated to the furnace temperature of the ultraviolet irradiation device (exposure device) during the exposure operation, for example, using a heater plate, a preheating furnace, etc. At this time, it is preferable to preheat the furnace of the ultraviolet irradiation device to the furnace temperature during the exposure operation in parallel with the preheating of the patterning pre-stage body 27.

(Primary patterning process)
After preheating the ultraviolet irradiation apparatus furnace and the patterning pre-stage 27, the patterning pre-stage 27 is placed in the ultraviolet irradiation apparatus furnace, and as shown in FIG. 14( a), ultraviolet light is applied from an ultraviolet lamp 28 for exposure, followed by development and drying. Next, the unexposed portions are dissolved and removed, forming a primary pattern resist 29 on the matrix 24, as shown in FIG. 14( b), having resist bodies 29a corresponding to the vapor deposition through-holes 5 (primary patterning). In this way, if the exposure operation is performed while the ultraviolet irradiation apparatus furnace and the patterning pre-stage 27 are preheated to the furnace temperature during the exposure operation, the patterning pre-stage 27 is heated and expanded by ultraviolet irradiation, eliminating the problem of the exposure operation being performed with the relative positional relationship between the three elements 24, 25, and 26 being misaligned. Therefore, the primary pattern resist 29 can be provided on the matrix 24 with high positional accuracy and in the intended shape, contributing to high accuracy in reproducing the vapor deposition layer and high vapor deposition precision.

(First electroforming process)
Next, the matrix 24 was placed in an electroforming tank, and as shown in Figure 14(c), a nickel electrodeposited metal was primarily electroformed on the surface of the matrix 24 not covered by the resist layer 29a, within the height range of the resist layer 29a, to form a primary electroformed layer 30, i.e., a layer that would become the mask body 2. Next, the resist layer 29a was dissolved and removed, yielding the mask body 2, as shown in Figure 14(d), which has a vapor deposition pattern 6 consisting of a large number of independent vapor deposition through-holes 5. Alternatively, as in the first reference example, a primary electroformed layer 30a may be formed between the mask bodies 2, and a frame 3 may be placed on the primary electroformed layer 30a.

(Secondary patterning process and frame placement process)
As shown in FIG. 15( a), a photoresist layer 38 was formed on the entire surface of the matrix 24, including the area where the primary electroforming layer 30 was to be formed. This photoresist layer 38 was formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them together to a predetermined thickness, as described above. Next, a pattern film 39 having light-transmitting holes 39a corresponding to the pattern-forming region 4 was placed in close contact with the matrix 24, and the matrix 24 was then placed in the oven of an ultraviolet irradiation device and exposed to ultraviolet light from an ultraviolet lamp 28. In this state, the photoresist layer 38 was obtained with the portion (38a) corresponding to the pattern-forming region 4 exposed and the remaining portion (38b) unexposed (see FIG. 15( b)). In this example, prior to the secondary patterning step, the outer periphery 4a of the pattern-forming region 4 of the primary electroforming layer 30 was subjected to an activation treatment or strike plating to improve the bonding strength between the primary electroforming layer 30 and the metal layer 8, which will be described later.

Next, as shown in Figure 15(b), the frame 3 was aligned and placed on the matrix 24 so as to surround the primary electroforming layer 30. Here, the adhesive properties of the unexposed photoresist layer 38b were utilized to temporarily fix the frame 3 to the matrix 24. Then, as shown in Figure 15(c), the unexposed photoresist layer 38b exposed on the surface was dissolved and removed to form a secondary pattern resist 40 having a resist body 40a covering the pattern formation region 4. At this time, the unexposed photoresist layer 38b on the underside of the frame 3 is covered by the frame 3 and is not dissolved and removed, remaining on the matrix 24.

(Second electroforming process)
15(d), a metal layer 8 was formed by electroforming a nickel electrodeposited metal onto the upper surface of the primary electroformed layer 30 facing the outer peripheral edge 4a of the pattern formation region 4, the surface of the frame 3, and the surface of the matrix 24 exposed between the frame 3 and the primary electroformed layer 30. This allows the primary electroformed layer 30 and the frame 3 to be inseparably bonded together by the metal layer 8.

(Peeling process)
The primary electroforming layer 30 and the metal layer 8 were peeled off from the matrix 24, and then the primary electroforming layer 30a located on the lower surface of the frame 3 was peeled off from both the layers 30 and 8. Finally, the secondary pattern resist 40 and the unexposed photoresist layer 38b were removed to obtain the deposition mask 1 shown in FIG.

(Fourth Reference Example) Figures 16 and 17 show a fourth reference example of a vapor deposition mask and its manufacturing method. In this reference example, as shown in Figure 16, the mask body 2 and the frame body 3 are inseparably joined by a metal layer 8, but it differs from the previous reference examples in that the primary electroforming layer 30 that constitutes the mask body 2 and the metal layer 8 are integrally formed. In this way, forming the metal layer 8 integrally with the mask body 2 eliminates the need to separately form the metal layer 8 and join the mask body 2 and the frame body 3, thereby omitting steps required for manufacturing and shortening time, and thereby reducing the manufacturing cost of the vapor deposition mask 1.

Figure 17 shows a method for manufacturing a vapor deposition mask 1 according to this reference example. First, a frame formation process is performed to form a reinforcing frame 3. Note that this frame formation process is the same as that shown in Figure 5 described in the first reference example, and therefore its description will be omitted.

(Patterning precursor formation process)
17(a), a photoresist layer 25 is formed on the surface of a conductive matrix 24 made of, for example, stainless steel or brass. This photoresist layer 25 is formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them to a predetermined thickness. Next, a pattern film 26 (glass mask) having light-transmitting holes 26a corresponding to the mask body 2 is adhered to the photoresist layer 25, thereby obtaining a patterning precursor 27.

(Preheating process)
The patterning pre-stage body 27 is preheated to the temperature inside the oven of the ultraviolet irradiation device (exposure device) during the exposure operation, for example, using a heater plate, a preheating oven, etc. At this time, it is preferable to preheat the oven of the ultraviolet irradiation device to the temperature inside the oven during the exposure operation in parallel with the preheating of the patterning pre-stage body 27.

(Primary patterning process)
After preheating the ultraviolet irradiation apparatus furnace and the patterning pre-stage 27, the patterning pre-stage 27 is placed in the ultraviolet irradiation apparatus furnace, and as shown in FIG. 17( a), ultraviolet light is applied from an ultraviolet lamp 28 for exposure, followed by development and drying. Next, the unexposed portions are dissolved and removed, forming a primary pattern resist 29 on the matrix 24, as shown in FIG. 17( b), which has a resist body 29a corresponding to the mask body 2 (primary patterning). In this way, if the exposure operation is performed while the ultraviolet irradiation apparatus furnace and the patterning pre-stage 27 are preheated to the furnace temperature during the exposure operation, the patterning pre-stage 27 is heated and expanded by ultraviolet irradiation, eliminating the problem of the exposure operation being performed with the relative positional relationship between the three elements 24, 25, and 26 being misaligned. Therefore, the primary pattern resist 29 can be provided on the matrix 24 with high positional accuracy and in the intended shape, contributing to high accuracy in reproducing the deposition layer and high deposition precision.

(Frame body installation process)
As shown in Figure 17(c), an adhesive resist 43 was formed on the entire surface of the matrix 24, including the area where the primary pattern resist 29 was to be formed. As before, this adhesive resist 43 was formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them to a predetermined thickness. Next, a frame 3 was positioned on the matrix 24 so as to surround the primary pattern resist 29. Here, the adhesive properties of the unexposed adhesive resist 43 were utilized to temporarily fix the frame 3 to the matrix 24. Furthermore, as shown in Figure 17(d), the unexposed adhesive resist 43 exposed on the surface was dissolved and removed. At this time, the adhesive resist 43 on the underside of the frame 3 was covered by the frame 3 and was not dissolved and removed, remaining on the matrix 24.

(integrated electroforming process)
17( e), the master mold 24 was placed in an electroforming tank, and a metal layer 8 was formed by electroforming a nickel electrodeposited metal onto the surface of the master mold 24 not covered with the resist body 29 a and onto the surface of the frame body 3. This allows the primary electroformed layer 30 that constitutes the mask body 2 and the metal layer 8 that joins the mask body 2 and the frame body 3 to be integrally formed.

(Peeling process)
The primary electroforming layer 30, the metal layer 8, and the frame 3 were peeled off together from the mold 24, and the adhesive resist 43 located on the underside of the frame 3 was removed from both the layers 30 and 8, thereby obtaining the deposition mask 1 shown in Figure 16.

The manufacturing method of the fourth reference example described above eliminates the need to form the metal layer 8, eliminating the manufacturing steps and shortening the manufacturing time, while also increasing the rigidity of the frame 3 in the same manner as described above. Therefore, it is possible to obtain a deposition mask 1 that can be made larger while further suppressing increases in manufacturing costs, and that can maintain flatness and ensure good reproducibility and deposition accuracy of the deposition layer.

(Fifth Reference Example) Figures 18 to 20 show a fifth reference example of a vapor deposition mask. As shown in Figure 18, the vapor deposition mask 1 in this reference example includes a support frame 46 fixed to the underside (the substrate side) of the frame body 3 and an auxiliary frame 47 fixed to the underside (the substrate side) of the support frame 46. That is, the frame body 3 is provided on one side (the vapor deposition source side) of the support frame 46, and the auxiliary frame 47 is provided on the other side (the substrate side) of the support frame 46. The outer shapes of the support frame 46 and the auxiliary frame 47 match those of the frame body 3. As shown in Figures 19 and 20, the support frame 46 has a frame opening 48 formed therein that corresponds to the mask opening 11 of the frame body 3. The frame opening 48 is formed to have an opening shape that is the same as or slightly larger than the mask opening 11. The vertical frames 12 and horizontal frames 13 of the frame body 3 are entirely supported by the support frame 46. Furthermore, the auxiliary frame 47 is formed in a frame-like shape, and supports the four peripheral edges of the support frame 46. The frame body 3, support frame 46, and auxiliary frame 47 are aligned and then joined together by spot welding the three elements 3, 46, and 47. Spot welding points 49 are provided at the four corners and on the four peripheral edges of the vertical and horizontal frames 12 and 13 (see Figure 20).

As described above, by using the support frame 46 to support the entire vertical frame 12 and horizontal frame 13 of the frame body 3, and further supporting the four peripheral edges of the support frame 46 with the auxiliary frame 47, the structural strength and rigidity of the entire deposition mask are further increased, preventing the deposition mask 1 from bending and deforming, maintaining flatness, and further improving the reproduction accuracy and deposition accuracy of the deposition layer.

(First embodiment)
FIG. 21 shows a first embodiment of a deposition mask according to the present invention. The deposition mask 1 in this embodiment is manufactured by manufacturing three deposition mask bodies 50, each of which includes ten mask bodies 2 arranged in a two-row, five-column matrix and a frame body arranged around the mask bodies 2 and inseparably joined together with a metal layer. These three deposition mask bodies 50 are supported by a support frame 46 and an auxiliary frame 47. Specifically, one deposition mask body 50 is first prepared, and its position and tension are adjusted using a tensioning device before it is fixed to the support frame 46. This fixation is achieved by spot welding the corners of the frame body 3 and the peripheral edges of the vertical and horizontal frames 12 and 13 on the extension lines. The remaining two deposition mask bodies 50 are fixed to the support frame 46 in the same manner. Finally, an auxiliary frame 47 is fixed (spot welded) to the side of the support frame 46 opposite to the side to which the deposition mask bodies 50 are fixed. In this manner, when multiple deposition mask bodies 50 are supported by the support frame 46 and the auxiliary frame 47, the relative positions of adjacent deposition mask bodies 50 can be finely adjusted and positioned, thereby improving the relative positional accuracy of the mask bodies 2 of adjacent deposition mask bodies 50. Therefore, good reproducibility and deposition accuracy can be ensured. Furthermore, the deposition mask 1 can be freely set to a desired size. Note that the smaller the shape of the deposition mask body 50, the better the dimensional accuracy, so significant adjustment is not required, fine adjustments are easier, and positional accuracy can be more easily ensured. Furthermore, if the shape of the deposition mask body 50 is rectangular, fine adjustments are easier to make.

As described above, in the deposition masks and deposition mask manufacturing methods of the above-mentioned reference examples, the frame 3 is composed of an upper frame 16 and a lower frame 17, and these upper and lower frames 16 and 17 are joined together via an adhesive layer 18. Therefore, when forming a frame 3 of the same thickness as conventional methods, a thinner metal plate can be used to form the frame 3, thereby reducing the thickness variation of the entire frame 3. This is because, as the thickness of commonly available metal plate materials used as the base material for the frame 3 decreases, the number of times they pass through the rolling rolls in the manufacturing process increases, and therefore, the thinner the plate thickness, the smaller the thickness tends to be. Therefore, even with a large deposition mask 1, distortion due to thermal expansion resulting from thickness variation in the metal plate can be suppressed. Furthermore, because the base material is simply a commonly available thin metal plate, there is no need to use a dedicated metal plate to form the frame 3. As described above, the deposition masks of the above-mentioned reference examples enable the deposition mask 1 to be enlarged while suppressing increases in manufacturing costs. Furthermore, the flatness of the deposition mask 1 can be maintained, ensuring good reproducibility and deposition accuracy. Furthermore, with a frame 3 having an adhesive layer 18 interposed between the upper frame 16 and the lower frame 17, when an external force that causes deflection deformation of the deposition mask 1 is applied, the frame 3 flexibly and elastically deforms by the amount of the adhesive layer 18, effectively preventing damage to the deposition mask 1. Furthermore, by joining the upper frame 16 and the lower frame 17 in a state where the two-dimensional or three-dimensional curved warpage of the frames is offset, and forming the frame 3 into a flat shape, slight warpage derived from the metal plate material can be eliminated, further improving flatness and ensuring better deposition layer reproduction accuracy and deposition accuracy. This can also contribute to realizing larger masks while suppressing increases in manufacturing costs.

In addition, in the deposition masks of the first, second, fourth, and fifth reference examples, multiple frame bodies 3 are stacked and adjacent frame bodies 3 are bonded to each other in the stacking direction via adhesive layers 19. This allows for the frame body 3 to be formed using a thinner metal plate when forming a frame body 3 of the same thickness as conventional frames, thereby further suppressing the occurrence of distortion due to thermal expansion resulting from thickness variations in the metal plate. This allows for the deposition mask to be made larger, and the flatness of the deposition mask can be maintained, ensuring better deposition layer reproduction accuracy and deposition accuracy. Furthermore, the increased number of adhesive layers 18 and 19 bonding the frame bodies 3 to each other allows for more flexible elastic deformation in response to external forces, more effectively preventing damage to the deposition mask.

As in the above-described reference examples and the first embodiment, the number and arrangement of the mask bodies 2 of the deposition mask 1 are not limited to those shown in the reference examples and the first embodiment. The mask body 2 does not need to be multiple; it can be a single mask body. The material of the mask body 2 is not limited to metal; it may be formed from resin, or even formed by etching or laser. Furthermore, prior to the joining process of the upper and lower frames 16 and 17, the frame body 3 can be formed into a two-dimensional or three-dimensional curved surface by press-forming the cut upper and lower frames 16 and 17 using upper and lower molds for imparting curved surfaces. In this case, imparting a two-dimensional or three-dimensional curved surface that is line-symmetrical facilitates forming the frame body 3 into a flat shape in the subsequent joining process. Furthermore, the metal layer 8 may have a multilayer structure of two or more layers, like the mask body 2 (primary electroforming layer 30) described above.

In the above reference examples and the first embodiment, the support frame 46 and auxiliary frame 47, like the frame body 3, can be made of various materials, including resins and not limited to metals such as aluminum and iron. However, it is preferable to use materials with a low coefficient of linear thermal expansion, such as Invar, Super Invar, or ceramic. The support frame 46 and auxiliary frame 47 may also be composed of upper and lower frames, like the frame body 3, and these upper and lower frames may be joined together via an adhesive layer. Furthermore, multiple support frames 46 and auxiliary frames 47 may be prepared, and adjacent support frames 46/46 and auxiliary frames 47/47 in the stacking direction may be joined together via an adhesive layer. This reduces the thickness variation of the support frames 46 and auxiliary frames 47. The frame body 3 and support frame 46 may be made of different materials for the outer periphery and the frame borders defining the openings (mask opening 11, frame opening 48).

REFERENCE SIGNS LIST 1 deposition mask 2 mask body 3 frame body 4 pattern forming area 4a outer periphery 5 deposition through-hole 6 deposition pattern 8 metal layer 10 outer periphery frame 11 mask opening 12 vertical frame 13 horizontal frame 16 upper frame 17 lower frame 18 adhesive layer 19 adhesive layer 24 matrix 25 photoresist layer 26 pattern film 26a light-transmitting hole 27 patterning precursor body 29 primary pattern resist 29a resist body 30 primary electroforming layer 43 adhesive resist 46 support frame 47 auxiliary frame 48 frame opening 50 deposition mask body W1 width dimension of vertical frame W2 width dimension of horizontal frame

Claims (6)

a deposition mask body (50) including a mask body (2) having a deposition pattern (6) consisting of a large number of independent deposition through-holes (5), and a frame body (3) formed thicker than the mask body (2) and arranged around the mask body (2);
a support frame (46) arranged on the underside of the deposition mask body (50) and supporting a plurality of the deposition mask bodies (50);
An auxiliary frame (47) arranged on the underside of the support frame (46);
Equipped with
The support frame (46) is formed with a frame opening (48) corresponding to the mask opening (11) of the frame body (3),
A deposition mask characterized in that the peripheral edge of the support frame (46) is supported by the auxiliary frame (47). The deposition mask according to claim 1, wherein the frame body (3) comprises a peripheral frame (10), and vertical frames (12) and horizontal frames (13) that define the mask opening (11) within the peripheral frame (10), and the entire vertical frames (12) and horizontal frames (13) are supported by the support frame (46). The deposition mask according to claim 1 or 2, wherein the frame opening (48) is formed in an opening shape that is slightly larger than the mask opening (11). The deposition mask of claim 2, wherein the frame (3), the support frame (46), and the auxiliary frame (47) are integrated by welding. The deposition mask of claim 4, wherein the welded portions (49) are provided at the four corners and on the peripheral edge of the frame (3) on the extension lines of the vertical frame (12) and the horizontal frame (13). Each deposition mask body (50) is formed in a strip shape,
The outer shape of the support frame (46) is formed in a rectangular shape, and a plurality of the deposition mask bodies (50) are supported by the support frame (46) in a state where they are arranged side by side along the short length direction of the strips,
2. The deposition mask according to claim 1, wherein four peripheral edges of the support frame (46) are supported by auxiliary frames (47) in the form of square frames.