JP7767720B2 - Coating device, and method for manufacturing power semiconductor module and physical quantity sensor - Google Patents

Description

This invention relates to a coating device and a method for manufacturing a power semiconductor module and a physical quantity sensor.

A power semiconductor module is a power semiconductor device that incorporates one or more power semiconductor chips to form part or all of a conversion connection, and has a structure in which the power semiconductor chips are electrically isolated from the laminated substrate or metal substrate. Power semiconductor modules are used in industrial applications such as motor drive control inverters for elevators, etc. In recent years, they have also become widely used in automotive motor drive control inverters. Automotive inverters must be small and lightweight to improve fuel efficiency, and because they are placed near the drive motor in the engine compartment, they must also be highly reliable even at high temperatures.

Compared to industrial power semiconductor modules, automotive power semiconductor modules must be smaller and lighter due to installation space constraints. Furthermore, as the output power density for driving motors increases, the temperature of semiconductor chips during operation rises, and there is also a growing demand for long-term reliability during high-temperature operation. For this reason, there is a demand for power semiconductor module structures that can operate at high temperatures and have long-term reliability.

In such power semiconductor modules, the top surface of the semiconductor chip is connected to the electrode pattern with a metal wire, and the case of the power semiconductor module is filled with sealing resin to protect the semiconductor chip and metal wire. The sealing resin is, for example, epoxy resin, which is injected into the case in a gel state and then heated to harden.

Furthermore, numerous physical quantity sensors have traditionally been used in automobiles and industrial equipment. Physical quantity sensors include pressure sensors and acceleration sensors, and are often used in harsh environments with high temperatures and humidity. For physical quantity sensor devices, a package construction technology has been proposed in which a resin case with a sense element placed in a recess and a socket portion that serves as an interface for transmitting the sense element signal to the outside are used. In physical quantity sensors, a sensor chip that measures a physical quantity is placed in a resin case. When the physical quantity sensor is a pressure sensor, the sensor chip is a pressure sensor chip that converts the strain that occurs on its front surface when pressure is applied into a resistance value.

Even in such physical quantity sensors, the sensor chip is connected to the lead terminal for extracting the signal externally with a metal wire, and a gel-like liquid is injected into the resin case to protect the sensor chip and metal wire.

When injecting liquid into power semiconductor modules and physical quantity sensors, the liquid may be injected under vacuum to prevent air bubbles in the liquid, reduce injection variations, and shorten injection times. For example, a known technology applies liquid resin to the workpiece from a resin discharge unit inside a vacuum chamber, preventing air bubbles from being trapped at the interface between the liquid resin and the workpiece, resulting in sealing (see Patent Document 1 below).

Figure 7 is a cross-sectional view showing a conventional method for manufacturing a power semiconductor module and a physical quantity sensor. Figure 8 is a flowchart showing a conventional method for manufacturing a power semiconductor module and a physical quantity sensor.

Figures 7 and 8 show the process of injecting gel into a power semiconductor module and a physical quantity sensor in a conventional method for manufacturing a power semiconductor module and a physical quantity sensor. Figure 7 shows an example of an application device 101 equipped with a screw dispenser 110.

In a conventional liquid injection process, first, the syringe 114 is replaced, the switching valve 120 is opened, and the liquid 113 that has become airy during replacement is discharged (step S101). Next, the application pressure and application time of the application device 101 are set (step S102). Next, the device to be coated 112 is placed in the vacuum chamber 123, and the vacuum chamber 123 is evacuated (step S103), creating a vacuum in the vacuum chamber 123. The device to be coated 112 is a power semiconductor module or a physical quantity sensor.

Next, after confirming the initial application amount, application begins (step S104). For example, the switching valve 120 is closed, and the application device 101 injects the liquid 113 in the syringe 114 into the liquid reservoir 115 in the screw dispenser 110. Next, the application device 101 rotates the rotating shaft 119 to rotate the screw-type rotor 117, applying pressure to the liquid pressure-feeding section 116 and injecting the liquid 113 from the nozzle 111 into the device to be applied 112. At this time, the nozzle 111 and the device to be applied 112 are placed in a vacuum chamber 123, so that the liquid 113 is injected under vacuum.

Next, the vacuum chamber 123 is opened to the atmosphere, and the device 112 to be coated is removed (step S105). This completes the injection of the liquid 113 into one device 112 to be coated, and steps S103 to S105 are repeated for each device 112 to be coated.

Japanese Patent Application Laid-Open No. 2005-2170006

However, in conventional methods, the tip of the nozzle 111 and the device to be coated 112 are placed inside a vacuum chamber 123, but the moving parts of the coating device 101, such as the mono pump, screw pump, and plunger pump, are set at atmospheric pressure. In the case of the screw dispenser 110 in Figure 7, the liquid pressure-feeding unit 116 corresponds to the screw pump.

For this reason, surrounding air may be drawn in as the coating device 101 moves. In this case, even if the injection environment into the coated device 112 is under vacuum, surrounding air may be drawn in through tiny gaps in the moving parts during operation, causing air bubbles to become mixed into the coating device 101. For example, in the case of Figure 7, air may enter through the bearing 118 as the rotating shaft 119 rotates, causing air bubbles 124 to become mixed into the liquid storage section 115. If air bubbles become mixed in, the injection amount may vary, the surrounding area may become contaminated, and product quality may be affected.

The purpose of this invention is to provide a coating device that can reduce the entrainment of ambient air from the moving parts of the coating device and reduce the inclusion of air bubbles, in order to resolve the problems associated with the prior art described above, as well as a method for manufacturing a power semiconductor module and a physical quantity sensor.

In order to solve the above-mentioned problems and achieve the object of the present invention, the coating device according to the present invention has the following features: It includes a dispenser having a liquid pressure-feeding unit that dispenses a fixed amount of liquid and a syringe that stores the liquid, and an apparatus vacuum chamber that can maintain a vacuum inside and that accommodates the dispenser and an apparatus to be coated, the apparatus having a case and a semiconductor chip disposed therein. The dispenser has a screw-type rotor, a bearing, and a rotating shaft, and by rotating the rotating shaft, the screw-type rotor is rotated to coat the apparatus to be coated with the liquid.

In order to solve the above-mentioned problems and achieve the object of the present invention, the coating device according to the present invention has the following features: It includes a dispenser having a liquid pressure-feeding unit that dispenses a fixed amount of liquid and a syringe that stores the liquid, a vacuum chamber that can maintain a vacuum inside and in which a coating target device having a case with a semiconductor chip disposed therein is placed, and a movable part vacuum chamber that can maintain a vacuum inside and in which a movable part of the dispenser is placed. The dispenser has a screw-type rotor, a bearing, and a rotating shaft, and within the movable part, the bearing that comes into contact with the atmosphere and the part of the rotating shaft that protrudes outside from a liquid storage part are located within the movable part vacuum chamber, and by rotating the rotating shaft, the screw-type rotor is rotated and the liquid is coated onto the coating target device.

To solve the above-mentioned problems and achieve the object of the present invention, the manufacturing method of a power semiconductor module and a physical quantity sensor according to the present invention has the following features. In a coating apparatus including a dispenser having a liquid pressure-feeding unit that dispenses a fixed amount of liquid and a syringe that stores the liquid, and an apparatus vacuum chamber that can maintain a vacuum inside and that accommodates the dispenser and a coated device consisting of a power semiconductor module or a physical quantity sensor, the apparatus vacuum chamber is placed in a first step of evacuating the apparatus vacuum chamber. After evacuating the apparatus vacuum chamber, the liquid is applied to the coated device in a second step of venting the apparatus vacuum chamber to the atmosphere and removing the coated device. The dispenser has a screw-type rotor, a bearing, and a rotating shaft. In the second step, the rotating shaft is rotated to rotate the screw-type rotor and apply the liquid to the coated device.

In order to solve the above-mentioned problems and achieve the object of the present invention, the manufacturing method of a power semiconductor module and a physical quantity sensor according to the present invention has the following features. In a coating device including a dispenser having a liquid pressure-feeding unit that dispenses a fixed amount of liquid and a syringe that stores the liquid, a vacuum chamber that can hold a vacuum inside and accommodate a device to be coated, which is a power semiconductor module or a physical quantity sensor, and a movable part vacuum chamber that can hold a vacuum inside, the first step is to evacuate the movable part vacuum chamber. Next, the device to be coated is placed in the vacuum chamber and the second step is to evacuate the vacuum chamber. Next, after evacuating the movable part vacuum chamber and the vacuum chamber, the third step is to apply the liquid to the device to be coated. Next, after applying the liquid, the fourth step is to open the vacuum chamber to the atmosphere and remove the device to be coated. The dispenser has a screw-type rotor, a bearing, and a rotating shaft, and within the movable part, the bearing that comes into contact with the atmosphere and the part of the rotating shaft that protrudes outside from the liquid agent storage part are provided within the movable part vacuum chamber, and in the third step, the rotating shaft is rotated to rotate the screw-type rotor and apply the liquid agent to the device to be coated.

Furthermore, the manufacturing method of the power semiconductor module and the physical quantity sensor according to the present invention is characterized in that, in the above-described invention, it includes a fifth step of replacing the syringe before the first step , and discharging the liquid agent that has become air-mixed during the replacement from the syringe.

Furthermore, the manufacturing method for a power semiconductor module and a physical quantity sensor according to the present invention is characterized in that, in the above-mentioned invention, the liquid agent is applied to the areas where the semiconductor chips and metal wires in the power semiconductor module and the physical quantity sensor are connected.

The coating device and the method for manufacturing a power semiconductor module and a physical quantity sensor according to the present invention have the effect of reducing the amount of ambient air entrained by the moving parts of the coating device and reducing the inclusion of air bubbles.

3A to 3C are cross-sectional views showing a method for manufacturing the power semiconductor module and the physical quantity sensor according to the first embodiment. 4 is a flowchart showing a method for manufacturing the power semiconductor module and the physical quantity sensor according to the first embodiment. 1 is a cross-sectional view showing the structure of a power semiconductor module according to a first embodiment; 1 is a cross-sectional view showing a structure of a physical quantity sensor according to a first embodiment; 10A to 10C are cross-sectional views showing a method for manufacturing a power semiconductor module and a physical quantity sensor according to a second embodiment. 10 is a flowchart showing a method for manufacturing a power semiconductor module and a physical quantity sensor according to a second embodiment. 10A and 10B are cross-sectional views showing a conventional method for manufacturing a power semiconductor module and a physical quantity sensor. 10 is a flowchart showing a conventional method for manufacturing a power semiconductor module and a physical quantity sensor.

Below, preferred embodiments of the coating device and the method for manufacturing a power semiconductor module and a physical quantity sensor according to the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below.

(Embodiment 1)
Fig. 1 is a cross-sectional view showing a method for manufacturing a power semiconductor module and a physical quantity sensor according to a first embodiment. Fig. 2 is a flowchart showing a method for manufacturing a power semiconductor module and a physical quantity sensor according to the first embodiment. Fig. 1 and Fig. 2 show a step of injecting gel into the power semiconductor module and the physical quantity sensor in the method for manufacturing a power semiconductor module and a physical quantity sensor according to the first embodiment. Other steps in the method for manufacturing a power semiconductor module and a physical quantity sensor are similar to steps that have been generally performed in the past, and therefore description thereof will be omitted.

Here, the application device 1 is composed of a dispenser that dispenses a fixed amount of liquid 13 and a syringe 14 that stores the liquid 13, and is a device that applies the liquid 13 to a device to be applied 12. Figure 1 shows an example of the application device 1 that includes a screw dispenser 10 as the dispenser. A dispenser is a device that dispenses a fixed amount of liquid and accurately supplies a fixed amount of liquid. In addition to the screw dispenser 10, a mono dispenser or the like may also be used as the dispenser. It may also be a piston-type dispenser that has a piston structure that delivers the liquid 13 by reciprocating drive, or a dispenser using another method not listed here.

The screw dispenser 10 has a screw-type rotor 17, which serves as a liquid pressure-feeding unit 16, and a liquid storage unit 15 that stores the liquid 13. The screw-type rotor 17 is held within the liquid storage unit 15 by a bearing 18 and rotates around a rotation axis 19. The screw dispenser 10 has a nozzle 11 at one end, and the liquid 13 is ejected from the tip of the nozzle 11 by pressure generated by the rotation of the screw-type rotor 17. The liquid 13 may be a viscous liquid that loses its fluidity when heated and hardens into a gel-like substance. The viscous liquid is, for example, a liquid with a viscosity of 0.1 [Pa·s] to 1000 [Pa·s].

The syringe 14 is an instrument used to inject and aspirate liquids and gases. The liquid 13 is stored in the syringe 14 and sent to the liquid reservoir 15. A switching valve 20 is connected to the syringe 14, and the liquid 13 can be discharged to the outside by opening the switching valve 20.

The device vacuum chamber 21 houses the screw dispenser 10 of the coating device 1 and the device to be coated 12. The dispenser of the coating device 1 may also be housed inside. The device vacuum chamber 21 is made of an airtight material, such as glass, and can maintain a vacuum (e.g., 13 Pa to 7000 Pa, more preferably 1.3 Pa to 700 Pa) inside. A vacuum pump (not shown) is connected to the device vacuum chamber 21, and a vacuum space can be created within the device vacuum chamber 21 by operating the vacuum pump. Instead of creating a vacuum within the device vacuum chamber 21, the pressure within the device vacuum chamber 21 may be reduced.

Furthermore, although not shown in FIG. 1, a control unit is provided that controls the position and movement speed of the screw dispenser 10, controls the delivery of the liquid 13, controls the amount of liquid 13 dispensed from the screw dispenser 10, and controls the rotation speed and direction of the screw-type rotor 17.

The control unit is composed of a CPU, RAM, ROM, etc., and performs various controls. The CPU is a central processing unit that executes various programs to achieve various functions. The RAM is used as the CPU's working area and storage area, and the ROM stores the operating system and programs executed by the CPU.

Next, the structures of the power semiconductor module and physical quantity sensor will be described. Figure 3 is a cross-sectional view showing the structure of the power semiconductor module according to the first embodiment. As shown in Figure 3, in the power semiconductor module 44, a first conductive plate 33 made of copper or the like is disposed on one surface (the front surface) of an insulating substrate 32, and a second conductive plate 34 made of copper or the like is disposed on the other surface (the back surface) to form a laminated substrate 35. Multiple power semiconductor chips 31 are mounted on the front surface of the first conductive plate 33 of the laminated substrate 35 via a bonding layer 41 made of solder or the like. Metal terminals 39 that output signals to the outside are bonded to the inside of the case 37. Furthermore, metal wires 40 made of aluminum or the like are attached to the front surface of the power semiconductor chips 31 via the bonding layer 41, electrically connecting the power semiconductor chips 31 and the metal terminals 39. A primer layer 43 is laminated on the sealed components, such as the power semiconductor chips 31, the laminated substrate 35, and the metal wires 40, to improve adhesion. A primer layer 43 is also provided inside the case 37, and sealing resin 38 is filled in contact with the primer layer 43 as a sealing material. The sealing resin 38 is, for example, an epoxy resin, which is injected into the case 37 in a gel state and heated to harden, protecting the power semiconductor chip 31 and metal wire 40 from external moisture, etc.

Figure 4 is a cross-sectional view showing the structure of the physical quantity sensor according to the first embodiment. Figure 4 shows only the sensor element 51 of the pressure sensor as the physical quantity sensor. As shown in Figure 4, the sensor element 51 includes a resin case 52, a pressure sensor chip (semiconductor chip) 53 housed in a recess in the resin case 52, a base member 54, and a diaphragm 59. The base member 54 and the pressure sensor chip 53 are joined by electrostatic bonding. The base member 54 and the resin case 52 are adhered with adhesive 55. A plurality of lead terminals 57 are provided, and are terminal pins for extracting signals from the sensor element 51.

Each lead terminal 57 is molded integrally with the resin case 52. One end of each lead terminal 57 protrudes into the resin case 52 and is connected by bonding wires 55 to each electrode provided on the pad portion on the front surface of the pressure sensor chip 53.

The interior of the resin case 52 is filled with sealing gel 58 as a sealant. The sealing gel 58 is, for example, a fluorine gel, and protects the pressure sensor chip 53, bonding wires 55, and lead terminals 57 from the pressure medium being measured. The liquid injected to provide the sealing gel 58 can be, for example, SIFEL (registered trademark) manufactured by Shin-Etsu Chemical Co., Ltd.

The following provides detailed descriptions of the method for injecting the liquid agent that will become the sealing resin 38 into the power semiconductor module 44 and the method for injecting the liquid agent that will become the gel member 58 into the sensor element 51 of the physical quantity sensor in embodiment 1.

In the process of injecting the liquid agent in embodiment 1, first, the syringe 14 is replaced, the switching valve 20 is opened, and the liquid agent 13 that has become airy during replacement is discharged (step S11: fifth process). By degassing the liquid agent 13 in advance in this way, it is possible to prevent air bubbles from being introduced into the path from the syringe 14 to the screw dispenser 10.

Next, the device 12 to be coated is placed, and the device vacuum chamber 21 is evacuated (step S12: first process), creating a vacuum in the device vacuum chamber 21. Here, the device 12 to be coated is a power semiconductor module 44 or a sensor element 51 of a physical quantity sensor. Next, the coating pressure and coating time of the coating device 1 are set (step S13).

Next, after confirming the initial application amount, application begins (step S14: second process). For example, the switching valve 20 is closed, and the application device 1 injects the liquid 13 in the syringe 14 into the liquid reservoir 15 in the screw dispenser 10. Next, the application device 1 rotates the rotation shaft 19 to rotate the screw-type rotor 17, applying pressure to the liquid pressure-feeding section 16 and injecting the liquid 13 from the nozzle 11 into the device to be applied 12.

Next, the device vacuum chamber 21 is opened to the atmosphere, and the device 12 to be coated is removed (step S15: third process). This completes the injection of the liquid 13 into one device 12 to be coated, and steps S13 to S15 are repeated for each of the 2 devices 12 to be coated.

In embodiment 1, as shown in FIG. 1, the device vacuum chamber 21 is also located in the moving parts of the coating device 1 (in FIG. 1, the liquid storage section 15, the liquid pressure delivery section 16, the screw-type rotor 17, the bearing 18, and the rotating shaft 19). This makes it possible to place the moving parts of the coating device 1 under vacuum, and even if air is entrained during operation of the coating device 1, the amount of entrained air is extremely small. As a result, the reduction in entrained air reduces the likelihood of air bubbles being mixed into the coating device 1. This significantly reduces the impact of air bubbles on product quality, and also makes it possible to reduce variations in the injection amount and suppress surrounding contamination.

The applicator 1 also has a mechanism that prevents dripping from the tip of the nozzle 11 (for example, vacuuming after application and reverse rotation after application), so the liquid 13 does not leak from the applicator 1. The gaps in the applicator 1 include the nozzle 11 and parts that move during application, but even if there is a small air leak from the moving parts during application, the structure does not allow for gaps that would allow the liquid 13, which has a much higher viscosity than air, to leak out.

In addition, a dedicated container such as a syringe 14 or barrel is installed at the inlet for the liquid 13, and the liquid is introduced from the syringe 14 or barrel. Figure 1 shows an example of a syringe 14. The syringe 14 and barrel have threads and are connected to the inlet by tightening them, preventing air from entering the coating device 1. However, when refilling the liquid 13 (when replacing the syringe 14), a small amount of air may enter the connection. In embodiment 1, when replacing the syringe 14, the switching valve 20 near the liquid 13 inlet is opened to discharge any air-mixed liquid 13 that occurs during replacement, preventing air from entering the coating device 1.

As explained above, according to the coating device and the method for manufacturing a power semiconductor module and a physical quantity sensor of embodiment 1, the device vacuum chamber is also located in the moving part of the coating device. This makes it possible to place the moving part of the coating device under vacuum, and even if air is entrained during operation of the coating device, the amount of entrained air is very small. As a result, the reduction in entrained air reduces the introduction of air bubbles into the coating device. This significantly reduces the impact on product quality, and also makes it possible to reduce variations in the injection amount and suppress surrounding contamination.

(Embodiment 2)
Fig. 5 is a cross-sectional view showing a method for manufacturing a power semiconductor module and a physical quantity sensor according to the second embodiment. Fig. 6 is a flowchart showing a method for manufacturing a power semiconductor module and a physical quantity sensor according to the second embodiment. In the second embodiment, as in the first embodiment, Figs. 5 and 6 show the step of injecting gel into the power semiconductor module and the physical quantity sensor. Other steps in the method for manufacturing a power semiconductor module and a physical quantity sensor are the same as those generally performed in the past, and therefore description thereof will be omitted.

In embodiment 2, rather than the entire coating device 1, the nozzle 11 of the coating device 1 and the coated device 12 are provided in the vacuum chamber 23, and the movable parts of the coating device 1, such as the bearing 18, are provided in the movable part vacuum chamber 22. In embodiment 2, of the movable parts of the coating device 1, the bearing 18 that comes into contact with the atmosphere and the part of the rotating shaft 19 that protrudes outside from the liquid agent storage section 15 are provided in the movable part vacuum chamber 22. In addition, a vacuum pump (not shown) is connected to the movable part vacuum chamber 22 and the vacuum chamber 23, and a vacuum space can be formed in the movable part vacuum chamber 22 and the vacuum chamber 23 by operating the vacuum pump. The other configuration is the same as in embodiment 1, so description will be omitted.

In the following, details of the method for injecting the sealing resin 38 into the power semiconductor module 44 and the method for injecting the gel material 58 into the sensor element 51 of the physical quantity sensor in the second embodiment will be described. Here, Figure 5 shows an example of an application device 1 equipped with a screw dispenser 10. Instead of the screw dispenser 10, a mohno dispenser or the like may also be used.

In the process of injecting the liquid agent in embodiment 2, first, the syringe 14 is replaced, the switching valve 20 is opened, and the liquid agent 13 that has become airy during replacement is discharged (step S21: fifth process). By degassing the liquid agent 13 in advance in this way, it is possible to prevent air bubbles from being introduced into the path from the syringe 14 to the screw dispenser 10.

Next, the movable part vacuum chamber 22 is evacuated (step S22: first process), and the movable part vacuum chamber 22 is evacuated. Next, the coating pressure and coating time of the coating device 1 are set (step S23). Next, the coated device 12 is placed in the vacuum chamber 23, and the vacuum chamber 23 is evacuated (step S24: second process), and the vacuum chamber 23 is evacuated. Here, the coated device 12 is a power semiconductor module 44 or a sensor element 51 of a physical quantity sensor.

Next, after confirming the initial application amount, application begins (step S25: third process). For example, the switching valve 20 is closed, and the application device 1 injects the liquid 13 in the syringe 14 into the liquid reservoir 15 in the screw dispenser 10. Next, the application device 1 rotates the rotation shaft 19 to rotate the screw-type rotor 17, applying pressure to the liquid pressure-feeding section 16 and injecting the liquid 13 from the nozzle 11 into the device to be applied 12.

Next, the vacuum chamber 23 is opened to the atmosphere, and the device 12 to be coated is removed (step S26: fourth step). This completes the injection of the liquid 13 into one device 12 to be coated, and steps S24 to S26 are repeated for each of the 2 devices 12 to be coated.

In embodiment 2, as shown in Figure 5, a movable part vacuum chamber 22 is arranged in the movable part of the coating device 1. This makes it possible to place the movable part of the coating device 1 under vacuum, and even if air is entrained during operation of the coating device 1, the amount of entrained air is extremely small. As a result, the reduction in entrained air reduces the likelihood of air bubbles being mixed into the coating device 1. This significantly reduces the impact on product quality, and also makes it possible to reduce variations in the injection amount and suppress surrounding contamination. Furthermore, in embodiment 2, because only the movable part of the coating device 1 is evacuated, the evacuation time can be shortened compared to embodiment 1, and a large-scale vacuum device is not required.

As explained above, according to the coating device and the method for manufacturing a power semiconductor module and a physical quantity sensor of embodiment 2, the movable part vacuum chamber is disposed in the movable part of the coating device. Therefore, the same effects as embodiment 1 are achieved. Furthermore, in embodiment 2, because only the movable part of the coating device is evacuated, the evacuation time can be shortened compared to embodiment 1, and a large-scale vacuum device is not required.

As described above, the coating device and manufacturing method for power semiconductor modules and physical quantity sensors according to the present invention are useful for power semiconductor modules used in power conversion devices such as inverters, power supply devices for various industrial machines, and automotive igniters, as well as physical quantity sensor devices equipped with sensor chips, and are particularly suitable for pressure sensor devices.

1, 101 Coating device 10, 110 Screw dispenser 11, 111 Nozzle 12, 112 Coating target device 13, 113 Liquid agent 14, 114 Syringe 15, 115 Liquid agent storage section 16, 116 Liquid agent pressure delivery section 17, 117 Screw-type rotor 18, 118 Bearing 19, 119 Rotating shaft 20, 120 Switching valve 21 Device vacuum chamber 22 Movable part vacuum chamber 23, 123 Vacuum chamber 31 Power semiconductor chip 32 Insulating substrate 33 First conductive plate 34 Second conductive plate 35 Laminated substrate 37 Case 38 Sealing resin 39 Metal terminal 40 Metal wire 41 Bonding layer 42 Heat dissipation base 43 Primer layer 44 Power semiconductor module 51 Sensor element 52 Resin case 53 Pressure sensor chip 54 Base member 55 Bonding wire 56 Insulating member 57 Lead pin 58 Liquid 59 Diaphragm 124 Air bubble

Claims (6)

a dispenser having a liquid medicine pressure-feeding unit that dispenses a fixed amount of the liquid medicine and a syringe that stores the liquid medicine;
an apparatus vacuum chamber in which the dispenser and an apparatus to be coated, in which a semiconductor chip is disposed in a case, are placed and which can maintain a vacuum inside;
Equipped with
The dispenser has a screw-type rotor, a bearing, and a rotating shaft, and by rotating the rotating shaft, the screw-type rotor is rotated and the liquid agent is applied to the device to be coated. a dispenser having a liquid medicine pressure-feeding unit that dispenses a fixed amount of the liquid medicine and a syringe that stores the liquid medicine;
a vacuum chamber in which a coating target device having a case in which a semiconductor chip is disposed is placed and the inside of the vacuum chamber can be maintained;
a movable part vacuum chamber in which the movable part of the dispenser is disposed and which can maintain a vacuum inside;
Equipped with
the dispenser has a screw-type rotor, a bearing, and a rotating shaft, and the bearing in contact with the atmosphere and a portion of the rotating shaft protruding from a liquid agent storage portion are provided in a vacuum chamber of the movable portion,
A coating device characterized in that the rotation shaft is rotated to rotate the screw-type rotor, thereby coating the liquid agent onto the device to be coated. a dispenser having a liquid medicine pressure-feeding unit that dispenses a fixed amount of the liquid medicine and a syringe that stores the liquid medicine;
a coating apparatus including an apparatus vacuum chamber in which the dispenser and a coated apparatus including a power semiconductor module or a physical quantity sensor are placed and which can maintain a vacuum inside,
a first step of placing the device to be coated in the device vacuum chamber and evacuating the device vacuum chamber;
a second step of applying the liquid agent to the target device after evacuating the device vacuum chamber;
a third step of opening the device vacuum chamber to the atmosphere after applying the liquid agent and removing the device to be coated;
Including,
The dispenser has a screw-type rotor, a bearing, and a rotating shaft;
In the second step, the rotation shaft is rotated to rotate the screw-type rotor and apply the liquid agent to the device to be coated. a dispenser having a liquid medicine pressure-feeding unit that dispenses a fixed amount of the liquid medicine and a syringe that stores the liquid medicine;
a vacuum chamber in which a coating target device including a power semiconductor module or a physical quantity sensor is placed and which can maintain a vacuum inside;
a movable part vacuum chamber in which the movable part of the dispenser is disposed and which can maintain a vacuum inside,
a first step of evacuating the movable part vacuum chamber;
a second step of placing the device to be coated in the vacuum chamber and evacuating the vacuum chamber;
a third step of applying the liquid agent to the device to be coated after evacuating the movable part vacuum chamber and the vacuum chamber;
a fourth step of opening the vacuum chamber to the atmosphere after applying the liquid agent and removing the device to be coated;
Including,
the dispenser has a screw-type rotor, a bearing, and a rotating shaft, and the bearing in contact with the atmosphere and a portion of the rotating shaft protruding from a liquid agent storage portion are provided in a vacuum chamber of the movable portion,
In the third step, the rotation shaft is rotated to rotate the screw-type rotor and apply the liquid agent to the device to be coated. The method for manufacturing a power semiconductor module and a physical quantity sensor according to claim 3 or 4, characterized in that it includes a fifth step, prior to the first step, of replacing the syringe and discharging the liquid agent that has become air-mixed during the replacement from the syringe. A method for manufacturing a power semiconductor module and a physical quantity sensor according to any one of claims 3 to 5, characterized in that the liquid agent is applied to areas where semiconductor chips and metal wires are connected within the power semiconductor module and the physical quantity sensor.