JP7774209B2 - Production equipment and data management method - Google Patents

Description

This disclosure relates to a production device and data management method for producing circuit boards with components mounted on them.

Patent Document 1 discloses a component mounting information collection device that can collect component mounting information that occurs during the process of mounting components on a board in order to analyze problems that occur during the process of mounting components on a board.

Japanese Patent Application Laid-Open No. 2006-165127

However, the component mounting information collection device disclosed in Patent Document 1 collects a huge amount of data, requiring a large-capacity storage device. Furthermore, if the collected data is transferred to an external device, the external device will require a large-capacity storage device.

This disclosure therefore provides production equipment and the like that allows for reduced storage capacity.

A production device according to one aspect of the present disclosure is a production device for producing circuit boards on which components are mounted, and includes: a memory unit that stores log data related to operations for producing the circuit boards; a receiving unit that receives inspection results for the circuit boards; a deletion unit that, if the inspection results received by the receiving unit indicate a good result, deletes the log data corresponding to the inspection results from the memory unit; and a transfer unit that transfers the log data stored in the memory unit to an external device.

Note that these general or specific aspects may be realized as a system, device, method, recording medium, or computer program, or as any combination of a system, device, method, recording medium, and computer program.

The production device disclosed herein makes it possible to reduce storage capacity.

1 is a side view of a component mounting system according to an embodiment; 1 is a top view of a component mounting device according to an embodiment; 1 is a side view of a component mounting device according to an embodiment; 1 is a block diagram showing a configuration of a component mounting device according to an embodiment; 10 is a flowchart showing an operation when data is collected by the component mounting device according to the embodiment. 10 is a timing chart showing data collection in the component mounting devices according to the embodiment and the comparative example; 6 is a flowchart showing an operation when data of the component mounting device according to the embodiment is stored in association with a board. 6 is a flowchart showing an operation when data is transferred from the component mounting device according to the embodiment;

The production device disclosed herein is a production device for producing circuit boards with components mounted thereon, and includes a memory unit that stores log data related to operations for producing the circuit boards, a receiving unit that receives inspection results for the circuit boards, a deletion unit that deletes the log data corresponding to the inspection results from the memory unit if the inspection results received by the receiving unit indicate a good result, and a transfer unit that transfers the log data stored in the memory unit to an external device.

If the inspection results for a board are good, there is no need to analyze the log data corresponding to those inspection results, and it is often safe to delete it. Therefore, deleting log data corresponding to good inspection results can reduce storage capacity.

For example, the receiving unit may receive the inspection results of the board from an inspection machine that inspects the board. Alternatively, for example, the receiving unit may receive the inspection results of the board from an external device.

For example, the inspection of the substrate may be performed using multiple types of inspection devices, the production device may further include a selection unit that selects one of the multiple types of inspection devices, and the deletion unit may delete the log data corresponding to the inspection results from the storage unit when the inspection results received by the receiving unit using the inspection device selected by the selection unit indicate that the inspection results are good.

This allows you to select which of multiple types of inspection devices will produce the inspection results used to determine whether or not to delete log data.

For example, the production device may further include a switching unit that switches whether or not the deletion unit deletes log data from the storage unit.

This allows you to toggle whether or not to enable the function to delete log data.

The data management method disclosed herein is a data management method executed by a production device for producing circuit boards having components mounted thereon. The production device has a memory for storing log data related to operations for producing the circuit boards. The data management method includes receiving inspection results for the circuit boards, and, if the received inspection results indicate a good result, deleting the log data corresponding to the inspection results from the memory and transferring the log data stored in the memory to an external device.

The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step order shown in the following embodiments are merely examples and are not intended to limit the scope of this disclosure.

(Embodiment)
Hereinafter, an embodiment will be described with reference to FIGS. 1 to 8. FIG.

Figure 1 is a side view of a component mounting system according to an embodiment.

The component mounting system has the function of producing mounted boards by mounting and attaching components such as electronic components to a board using solder bonding or the like. Note that mounted boards may also be produced by bonding and attaching components to a board using adhesive or the like. To produce boards with mounted components, the component mounting system includes a production line configured to link various production devices and various inspection devices, and a management device 3 connected to the production line via network 2.

The component mounting system includes a board supply device M1, a screen printing device M2, a component mounting device M3-M6, a reflow device M7, a board removal device M8, a board visual inspection device M9, and a board shipping inspection device M10. The screen printing device M2, the component mounting devices M3-M6, and the reflow device M7 are examples of production devices. The board visual inspection device M9 and the board shipping inspection device M10 are examples of inspection devices. The board supply device M1, the screen printing device M2, the component mounting devices M3-M6, the reflow device M7, the board removal device M8, the board visual inspection device M9, and the board shipping inspection device M10 form a production line. The production line is connected to a management device 3 via a network 2, and the management device 3 controls production management on the production line. The management device 3 is an example of an external device. The network 2 is, for example, a wired network, but may also be a wireless network. The production devices and inspection devices on the production line may be connected to external devices such as an external server via a wired or wireless network. The production line is equipped with a transport conveyor, which transports substrates and other materials from upstream (left side of Figure 1) to downstream (right side of Figure 1).

Board supply device M1 has a storage section such as a rack that stores multiple boards, and performs board supply work by removing boards from the storage section and supplying them to downstream equipment. Screen printing device M2 performs solder printing work by printing solder onto boards brought in from the upstream side through a screen mask attached to the printing work section. Note that the production line may also include a solder application device that applies solder to boards using a dispenser, installed alongside screen printing device M2 or in place of screen printing device M2. Screen printing device M2 and solder application devices are printing devices that deposit solder on boards.

Component placement devices M3-M6 perform component mounting work, using a mounting head to mount components onto boards on which solder has been deposited. Note that the production line is not limited to a configuration with four component placement devices M3-M6; it may have one to three, or even five or more. Reflow device M7 performs a board heating operation, using a board heating unit to heat boards carried into the device, hardening the solder on the board and bonding the board's electrodes to the components. Board removal device M8 has a storage unit such as a rack that can store multiple boards, and performs a board removal operation, receiving boards carried out by upstream devices and removing them to the storage unit.

Board visual inspection device M9 and board shipping inspection device M10 inspect boards on which components are mounted. Board visual inspection device M9 performs a visual inspection of the board. Specifically, board visual inspection device M9 uses a camera or other device to inspect for the presence of solder bridges and dust on the board. Board shipping inspection device M10 performs continuity inspections of the board, etc.

Next, the configuration of component mounting devices M3 to M6 will be described with reference to Figures 2 and 3. Note that the following description focuses on component mounting device M3, and component mounting devices M4 to M6 will not be described as they are basically configured in the same way as component mounting device M3.

Figure 2 is a top view of the component mounting device M3 according to an embodiment.

Figure 3 is a side view of the component mounting device M3 according to the embodiment.

Component mounting device M3 has the function of mounting components D onto board B. In Figure 2, a board transport mechanism 7 is installed in the X direction at the center of base 6. The board transport mechanism 7 transports board B carried in from the upstream side in the X direction, and positions and holds it at a mounting operation position by mounting head 12, which will be described below. The board transport mechanism 7 also transports board B downstream after component mounting operation has been completed. Component supply units 8 are installed on both sides of the board transport mechanism 7.

The component supply unit 8 is fitted with carts 5 on which multiple feeders (tape feeders) 9 are mounted in parallel in the X direction. The feeders 9 feed carrier tape, which has pockets for storing components D, at intervals from the outside of the component supply unit 8 toward the board transport mechanism 7 (tape feed direction), to supply components D to the component removal position where the mounting head 12 picks up the components D. Note that the feeders that supply components D may be feeders 9 (tape feeders), or may be tray feeders that supply components D placed on a tray, or stick feeders that supply components D aligned and held on hollow sticks. The feeders 9 are an example of a unit for mounting components onto a board.

In Figure 2, a Y-axis table 10 equipped with a linear drive mechanism is disposed on both ends in the X direction of the top surface of the base 6. A beam 11, similarly equipped with a linear drive mechanism, is connected to the Y-axis table 10 so that it can move freely in the Y direction. A mounting head 12 is attached to the beam 11 so that it can move freely in the X direction. The mounting head 12 is equipped with multiple (eight in this example) nozzle units 12a. For example, the mounting head 12 has two rows of four nozzle units 12a. For example, multiple types of mounting heads 12 are available, each with a different number of nozzle units 12a. The mounting head 12 is an example of a unit for mounting components on a board.

In Figure 3, a suction nozzle 12b that vacuum-sucks and holds a component D is attached to the lower end of each nozzle unit 12a. There are multiple types of suction nozzles 12b available, each with a different nozzle shape, to accommodate the size and shape of the component D to be sucked.

In Figure 2, the Y-axis table 10 and beam 11 constitute a mounting head moving mechanism 13 that moves the mounting head 12 horizontally (X direction, Y direction). The mounting head moving mechanism 13 is an example of a unit for mounting components on a board. The mounting head moving mechanism 13 and mounting head 12 pick up component D by suction using the suction nozzle 12b from the component removal position of the feeder 9 attached to the component supply unit 8. The mounting head moving mechanism 13 then transports the mounting head 12 to the mounting position on board B held by the board transport mechanism 7 and performs the component mounting operation.

The time it takes for the mounting head 12 to pick up components D from the feeder 9 and mount them on the board B depends on the position of the feeder 9 on the carriage 5 (the configuration of the component mounting device). For example, by positioning the feeder 9 that supplies components D, which are mounted in large numbers on the board B, near the center of the carriage 5, the movement distance of the mounting head 12 can be reduced, thereby shortening the mounting time.

In Figures 2 and 3, the beam 11 is fitted with a head camera 14 that is positioned on the underside of the beam 11 and moves integrally with the mounting head 12. As the mounting head 12 moves, the head camera 14 moves above the board B positioned at the mounting operation position of the board transport mechanism 7, and captures an image of a board mark (not shown) provided on the board B to recognize the position of the board B.

A component recognition camera 15 is installed between the component supply unit 8 and the board transport mechanism 7. As the mounting head 12 moves upward after picking up a component D from the component supply unit 8, the component recognition camera 15 captures an image of the component D held by the suction nozzle 12b and recognizes the holding position, etc. When the mounting head 12 mounts the component D on the board B, the mounting position is corrected taking into account the recognition results of the board B by the head camera 14 and the recognition results of the component D by the component recognition camera 15.

In Figure 3, a reel 17 around which a carrier tape 16 containing a component D is wound is held at the front of the carriage 5. The feeder 9 transports the carrier tape 16 stored on the reel 17 in the tape feed direction, supplying the component D to the component pick-up position by the mounting head 12. Several types of feeders 9 are available, each with different widths corresponding to the width of the carrier tape 16 to be transported.

Next, the configuration of the control system for component mounting device M3 will be explained with reference to Figure 4.

Figure 4 is a block diagram showing the configuration of the component mounting device M3 according to an embodiment.

Component mounting device M3 includes a main controller 100. Figure 4 also shows the mounting head 12, mounting head movement mechanism 13, and feeder 9, which are units for mounting components on boards, as well as the component recognition camera 15 and board transport mechanism 7, all of which are controlled by the main controller 100. Multiple feeders 9 are also shown. For example, each unit is controlled based on communication commands issued by the main controller 100. The main controller 100 includes a control unit 110 and a memory unit 120. The control unit 110 controls the units (such as the mounting head 12, mounting head movement mechanism 13, and feeder 9). The control unit 110 is a CPU device that controls components such as the collection unit 111, selection unit 112, switching unit 113, reception unit 114, deletion unit 115, and transfer unit 116, which are described below, based on various programs and data stored in the memory unit 120.

The mounting head 12 has a memory 131 in which log data related to the operation of the mounting head 12 is stored. The log data related to the operation of the mounting head 12 stored in the memory 131 includes, for example, data on the air flow rate when the suction nozzle 12b sucks in and blows out air, and data on the responsiveness of the valve that switches between suction and blowing air.

The mounting head moving mechanism 13 has a memory 132 in which log data related to the operation of the mounting head moving mechanism 13 is stored. The log data related to the operation of the mounting head moving mechanism 13 stored in memory 132 includes servo motor torque data, data on the difference between the movement command value and the current value, and motor vibration data.

Feeder 9 has memory 133 in which log data related to the operation of feeder 9 is stored. The log data related to the operation of feeder 9 stored in memory 133 includes torque data when feeding out parts, etc.

Collection unit 111 collects log data stored in memories 131, 132, and 133. Specifically, collection unit 111 collects log data at a time that does not affect the operation of component mounting device M3 to mount components on a board.

The selection unit 112 selects one of multiple types of inspection devices. In Figure 1, the multiple types of inspection devices are shown as a board visual inspection device M9 and a board shipping inspection device M10. For example, board inspection is performed by the board visual inspection device M9 and the board shipping inspection device M10, and the selection unit 112 selects one of the inspection devices, board visual inspection device M9 and board shipping inspection device M10.

The switching unit 113 switches whether or not the deletion unit 115 deletes log data from the storage unit 120. The switching unit 113 can switch whether or not the function for deleting log data is enabled.

The receiving unit 114 receives the inspection results of the board. The receiving unit 114 may receive the inspection results of the board from an inspection machine that inspects the board (e.g., board visual inspection device M9 or board shipping inspection device M10), or may receive the inspection results of the board from an external device. When receiving the inspection results of the board from an external device, the external device acquires the inspection results of the board from the board visual inspection device M9 or board shipping inspection device M10, etc.

If the inspection results received by the receiving unit 114 indicate a good result, the deletion unit 115 deletes the log data corresponding to the inspection results from the storage unit 120. For example, if the inspection results received by the receiving unit 114 by the inspection device selected by the selection unit 112 indicate a good result, the deletion unit 115 deletes the log data corresponding to the inspection results from the storage unit 120. For example, if board visual inspection device M9 is selected and the inspection results by board visual inspection device M9 indicate a good result, the deletion unit 115 deletes the log data corresponding to the good inspection results by board visual inspection device M9 from the storage unit 120. Furthermore, for example, if board shipping inspection device M10 is selected and the inspection results by board shipping inspection device M10 indicate a good result, the deletion unit 115 deletes the log data corresponding to the good inspection results by board shipping inspection device M10 from the storage unit 120.

The transfer unit 116 transfers the log data stored in the memory unit 120 to an external device (e.g., the management device 3 or an external server).

The memory unit 120 stores mounting data 121, component data 122, log data 123, and inspection result data 124. Mounting data 121 is data referenced when mounting components on a board, and includes data on the board type being mounted, data on the suction nozzle 12b used for mounting, and data on the component mounting position. Component data 122 includes data on the type and size of the component to be mounted at each mounting position. Log data 123 is log data collected by the collection unit 111. Log data corresponding to good inspection results is deleted by the deletion unit 115, and log data that has not been deleted (i.e., log data corresponding to poor inspection results) is transferred to an external device by the transfer unit 116. Inspection result data 124 is inspection results received by the reception unit 114. Each inspection result is associated with the inspected board.

Next, the operation of component mounting device M3 will be described in detail with reference to Figures 5 to 8.

Figure 5 is a flowchart showing the operation of component mounting device M3 when collecting data in accordance with an embodiment of the present invention.

First, the control unit 110 moves the mounting head 12 so that the first row of four suction nozzles 12b on the mounting head 12 is positioned above the component removal position of the feeder 9, and the four suction nozzles 12b in the first row pick up the four components supplied from the feeder 9 (step S11).

Next, the control unit 110 moves the mounting head 12 so that the second row of four suction nozzles 12b of the mounting head 12 is positioned above the component removal position of the feeder 9 (step S12).

Next, the control unit 110 causes the four suction nozzles 12b in the second row to pick up the four components supplied from the feeder 9 (step S13).

Next, the control unit 110 moves the mounting head 12 above the component recognition camera 15 (step S14).

The control unit 110 performs component recognition by having the component recognition camera 15 photograph the component picked up by the suction nozzle 12b of the mounting head 12 located above the component recognition camera 15, thereby determining whether the component has been picked up correctly (specifically, whether the component has been picked up and in the correct orientation, etc.) (step S15). For example, if the component has not been picked up correctly, an error may be reported.

The control unit 110 sets the variable i to 1 (step S16). The variable i is incremented each time a component picked up by one suction nozzle 12b is placed on the board. If there are eight suction nozzles 12b and eight components to be placed on the board, the variable i is incremented up to 8, which is the number of suction nozzles 12b on the mounting head 12 (in other words, the number of components to be placed on the board from the mounting head 12).

Next, the control unit 110 moves the mounting head 12 so that the suction nozzle 12b that has picked up the component is positioned above the position where the component should be mounted on the board being transported from upstream on the production line (here, screen printing device M2) (step S17).

The control unit 110 places the component picked up by the suction nozzle 12b located above the position on the board where the component is to be placed (step S18). At this time, the mounting head 12 stores log data related to the operation of the mounting head 12 in the memory 131 (step S19).

The control unit 110 determines whether the variable i is 8 (step S20). If the variable i is not 8 (No in step S20), the control unit 110 increments the variable i (step S21) and performs the process from step S17 for any of the eight suction nozzles 12b that are still picking up components. As a result, the picked-up components are placed and log data is stored for each of the eight suction nozzles 12b.

When the variable i is 8 (Yes in step S20), the control unit 110 moves the mounting head 12 to the feeder 9 to supply the next component to the suction nozzle 12b of the mounting head 12, while the collection unit 111 collects log data stored in the memory 131 of the mounting head 12 (step S22). In this way, the collection unit 111 collects log data while the mounting head 12 is moving, specifically, while the mounting head 12 is moving to a predetermined location (e.g., feeder 9) after placing a component on the board. As will be explained in more detail in Figure 6 below, by collecting log data while the mounting head 12 is moving to the feeder 9 after placing a component on the board, data collection can be performed while minimizing the impact on takt time.

Then, the control unit 110 determines whether there is a next turn (step S23). For example, there may be many components to be mounted on a single board, and one mounting head 12 may be used to repeatedly pick up components from the feeder 9 and mount the components on the board. Here, one turn refers to an example operation of picking up a component from the feeder 9, moving it to the board, mounting the component on the board, and then moving it back to the feeder 9. If there is a next turn (Yes in step S23), i.e., if there are still components to be mounted on the board, processing continues from step S11. If there is no next turn (No in step S23), i.e., if there are no components to be mounted on the board, processing ends.

Next, using Figure 6, we will explain how collecting log data while the mounting head 12 is moving to the feeder 9 after placing components on the board makes it possible to collect data while minimizing the impact on takt time.

Figure 6 is a timing chart showing data collection for component mounting apparatus M3 according to the embodiment and the comparative example. Figure 6(a) is a timing chart showing data collection for component mounting apparatus M3 according to the comparative example, and Figure 6(b) is a timing chart showing data collection for component mounting apparatus M3 according to the embodiment. In Figure 6, the "pickup" section indicates the time when the suction nozzle 12b picks up a component from the feeder 9, the "place" section indicates the time when the suction nozzle 12b places a component on the board, the dotted hatched section indicates the time when the mounting head 12 is moving, and the diagonal hatched section indicates the time when log data is being collected. Note that if there are eight suction nozzles 12b, there will also be eight placement times in one turn in Figure 6, but this is omitted here and only three placement times in one turn are shown.

In the comparative example, the mounting head 12 does not have memory 131. In the comparative example, the mounting head 12 does not have memory 131 and is unable to store log data. Therefore, as shown in Figure 6(a), log data for mounting components, which change from moment to moment, must be collected each time a component is mounted. As a result, time is required to collect log data when mounting a component, and a wait time for data collection occurs before starting to move to the location where the next component is to be mounted. Therefore, as shown in Figure 6(a), a delay occurs, which may affect the takt time.

In contrast, in this embodiment, because the mounting head 12 has memory 131, as shown in FIG. 6(b), log data for component placement, which changes from moment to moment, does not need to be collected each time a component is placed; it can be stored in memory 131. After the mounting head 12 has placed all of the components to be placed in one turn onto the board, the collection unit 111 collects log data from memory 131 while it moves to feeder 9 to pick up the components to be placed in the next turn. This time does not affect the component placement operation of component placement device M3 on the board, so by collecting log data during this time, data collection can be performed while minimizing the impact on takt time. It can be seen that the delay that occurred in the comparative example in FIG. 6(a) does not occur in the embodiment in FIG. 6(b).

In this way, because the mounting head 12 used to mount components on a board has memory 131 in which log data related to the operation of the mounting head 12 is stored, the log data stored in memory 131 can be collected at any time. In other words, log data can be collected at times that have little or no impact on takt time. Therefore, data can be collected while minimizing the impact on takt time.

When collecting log data from the memory 132 of the mounting head moving mechanism 13, the collection unit 111 collects the log data at a time that does not affect the operation of component placement device M3 to place components on the board. Specifically, the collection unit 111 collects the log data during the waiting time until the board is transported to the position where the components will be placed on the board.

For example, if the mounting head movement mechanism 13 does not have memory 132, it will not be able to store log data, so the mounting head movement mechanism 13 will need to move the mounting head 12 in the X direction, collect log data (such as torque data) about that X-direction movement, then move it in the Y direction, and collect log data about that Y-direction movement. This means that time is required to collect log data each time the mounting head 12 changes direction, resulting in a wait time for data collection before starting to move in the next direction. This can cause delays and potentially affect takt time.

In contrast, if the mounting head movement mechanism 13 has memory 132, log data for moving the mounting head 12 does not need to be collected each time the direction of movement of the mounting head 12 is changed, and can be stored in memory 132. Then, for example, log data is collected from memory 132 during the waiting time until the board is transported to the position where the components will be mounted on the board. This time does not affect the operation of component mounting device M3 to mount components on the board, so by collecting log data during this time, data can be collected while minimizing the impact on takt time.

Furthermore, when collecting log data from the memory 133 of the feeder 9, the collection unit 111 collects the log data at a time that does not affect the operation of the component mounting device M3 to mount components on the board. Specifically, the collection unit 111 collects the log data after the feeder 9 has completed supplying components to all of the suction nozzles 12b of the mounting head 12.

For example, if the feeder 9 does not have memory 133, it cannot store log data, so after a part is fed out, it is necessary to collect log data about that feeding (such as torque data), and then after the next part is fed out, it is necessary to collect log data about that feeding. As a result, time is required to collect log data each time a part is fed out, and there is a wait time for data collection before the next part can be fed out. This can cause delays and affect takt time.

In contrast, if the feeder 9 has memory 133, the log data for feeding components does not need to be collected each time a component is fed, but can be stored in memory 133. Then, for example, the log data is collected from memory 133 after the feeder 9 has completed supplying components to all of the suction nozzles 12b of the mounting head 12. This time does not affect the component mounting device M3's operation of mounting components onto the board, so by collecting the log data at this time, data can be collected while minimizing the impact on the takt time.

Figure 7 is a flowchart showing the operation of the component mounting device M3 according to the embodiment when data is stored in association with a board.

The control unit 110 mounts the component on the board (step S31). Step S31 corresponds to steps S11 to S23 shown in Figure 5.

Next, the control unit 110 stores the log data from when the components were placed on the board in step S31, in association with the board (step S32).

Next, the control unit 110 determines whether or not there is a next board (step S33). If there is a next board (Yes in step S33), the process from step S31 is performed for the next board. As a result, log data for each board is stored in association with each board. If there is no next board (No in step S33), the process ends.

Figure 8 is a flowchart showing the operation of component mounting device M3 when transferring data in this embodiment.

The receiving unit 114 determines whether or not the test results have been received (step S41). For example, the receiving unit 114 determines whether or not the test results have been received from an inspection device selected from among multiple types of inspection devices by the selecting unit 112. The selecting unit 112 can select which of the multiple types of inspection devices the test results from will be used to determine whether or not to delete the log data. If the test results have not been received (No in step S41), the process in step S41 is performed again. That is, in step S41, the receiving unit waits for the test results to be received.

When the receiving unit 114 receives the test results (Yes in step S41), the deletion unit 115 determines whether the test results received by the receiving unit 114 indicate a good result (step S42).

If the inspection results indicate a good result (Yes in step S42), the deletion unit 115 deletes the log data corresponding to the inspection results from the storage unit 120 (step S43). For example, if the inspection results indicate a good result for a board inspected by the board visual inspection device M9 or the board shipping inspection device M10, the deletion unit 115 deletes from the storage unit 120 the log data stored in association with the board inspected by the board visual inspection device M9 or the board shipping inspection device M10. This log data is log data related to the operation of the production equipment (such as the screen printing device M2, component mounting device M3, or reflow device M7) used to produce the inspected board. If the inspection results for the board are good, analysis of the log data corresponding to the inspection results is unnecessary, and deletion of the log data is often not problematic. In this way, log data corresponding to good inspection results is deleted from the log data stored in the storage unit 120, thereby reducing the storage capacity of the storage unit 120.

If the inspection results indicate that the inspection is not good (No in step S42), the processing in step S43 is not performed. In other words, the log data corresponding to the inspection results that indicate that the inspection is not good is not deleted from the memory unit 120. If the inspection results of the board are not good, it is often necessary to analyze the log data corresponding to the inspection results, so the log data corresponding to the inspection results that are not good is not deleted.

Next, the transfer unit 116 determines whether a predetermined condition is met (step S44). The predetermined condition is met, for example, when a predetermined amount of log data stored in the storage unit 120 has been reached, when a transfer request has been received, or when a predetermined timing has occurred. If the predetermined condition is not met (No in step S44), steps S41 to S43 are repeated until the predetermined condition is met.

If the predetermined condition is met (Yes in step S44), the transfer unit 116 transfers the log data stored in the memory unit 120 to the external device (step S45). As described above, log data corresponding to good test results is deleted from the log data stored in the memory unit 120, reducing the amount of log data transferred to the external device and enabling a reduction in the storage capacity of the external device.

Note that if the switching unit 113 has switched so that the log data is not deleted from the storage unit 120, the processing from step S41 onwards does not need to be performed. In other words, in this case, even if the test results indicate a good result, the log data corresponding to the test results does not need to be deleted.

As explained above, if the inspection results for a board are good, there is often no need to analyze the log data corresponding to those inspection results, and it can be deleted without causing any problems. Therefore, deleting log data corresponding to good inspection results can reduce storage capacity.

(Other embodiments)
The production apparatuses (component mounting apparatus M3, screen printing apparatus M2, reflow apparatus M7, etc.) of the present disclosure have been described above based on the embodiments, but the present disclosure is not limited to the above-described embodiments. As long as they do not deviate from the spirit of the present disclosure, various modifications that a person skilled in the art can make to the present embodiments, and configurations constructed by combining components of different embodiments, are also included within the scope of the present disclosure.

For example, in the above embodiment, an example was described in which the control unit 110 includes the selection unit 112, but the control unit 110 does not necessarily have to include the selection unit 112. For example, the test results used to determine whether or not to delete log data do not need to be selected, and may instead be the test results of a predetermined test device.

For example, in the above embodiment, an example was described in which the control unit 110 includes the switching unit 113, but the control unit 110 does not need to include the switching unit 113. For example, the deletion unit 115 does not need to be able to switch whether or not to delete log data from the storage unit 120.

For example, the present disclosure can be realized not only as a production device, but also as a data management method that includes steps (processing) performed by each component that makes up the production device.

The data management method is executed by a production device for producing circuit boards having components mounted thereon. The production device has a memory unit that stores log data related to operations for producing the circuit boards. As shown in FIG. 8, the data management method includes the steps of receiving inspection results for the circuit boards (Yes in step S41), and, if the received inspection results indicate a good result (Yes in step S42), deleting the log data corresponding to the inspection results from the memory unit (step S43), and transferring the log data stored in the memory unit to an external device (step S45).

For example, the steps in the data management method may be executed by a computer (computer system). The present disclosure can be realized as a program for causing a computer to execute the steps included in the data management method. Furthermore, the present disclosure can be realized as a non-transitory computer-readable recording medium, such as a CD-ROM, on which the program is recorded.

For example, if the present disclosure is realized as a program (software), each step is performed by running the program using hardware resources such as a computer's CPU, memory, and input/output circuits. In other words, each step is performed by the CPU obtaining data from memory or input/output circuits, etc., performing calculations, and outputting the calculation results to memory or input/output circuits, etc.

Furthermore, each component included in the production device of the above embodiment may be realized as a dedicated or general-purpose circuit.

Furthermore, each component included in the production device of the above embodiment may be realized as an LSI (Large Scale Integration), which is an integrated circuit (IC).

Furthermore, the integrated circuit is not limited to an LSI, but may be realized using a dedicated circuit or a general-purpose processor. A programmable FPGA (Field Programmable Gate Array) or a reconfigurable processor, in which the connections and settings of circuit cells within the LSI can be reconfigured, may also be used.

Furthermore, if advances in semiconductor technology or other derivative technologies result in the emergence of integrated circuit technology that can replace LSI, that technology may naturally be used to integrate each component included in the production equipment.

In addition, this disclosure also includes forms obtained by applying various modifications to the embodiments that would occur to those skilled in the art, as well as forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the spirit of this disclosure.

This disclosure is useful in fields where production equipment such as component mounting devices is used to produce circuit boards and other products with components mounted thereon.

DESCRIPTION OF SYMBOLS 2 Network 3 Management device 5 Cart 6 Base 7 Board transport mechanism 8 Component supply unit 9 Feeder 10 Y-axis table 11 Beam 12 Mounting head 12a Nozzle unit 12b Suction nozzle 13 Mounting head moving mechanism 14 Head camera 15 Component recognition camera 16 Carrier tape 17 Reel 100 Main controller 110 Control unit 111 Collection unit 112 Selection unit 113 Switching unit 114 Reception unit 115 Deletion unit 116 Transfer unit 120 Storage unit 121 Mounting data 122 Component data 123 Log data 124 Inspection result data 131, 132, 133 Memory M1 Board supply device M2 Screen printing device M3, M4, M5, M6 Component mounting device M7 Reflow device M8 Board recovery device M9 Board appearance inspection device M10 Board shipping inspection device

Claims (6)

A production apparatus for producing a board on which components are mounted,
a storage unit that stores log data related to operations for producing the substrate;
a receiving unit that receives the inspection results of the substrate;
a deletion unit that deletes log data corresponding to the inspection result from the storage unit when the inspection result received by the receiving unit indicates that the inspection result is good;
a transfer unit that transfers the log data stored in the storage unit to an external device.
Production equipment. the receiving unit receives inspection results of the substrate from an inspection machine that inspects the substrate;
The production device according to claim 1 . the receiving unit receives the inspection result of the substrate from an external device.
The production device according to claim 1 . The inspection of the substrate is performed by a plurality of types of inspection devices,
the production device further includes a selection unit for selecting one of the plurality of types of inspection devices;
the deletion unit, when the inspection result received by the receiving unit and obtained by the inspection device selected by the selecting unit indicates a good result, deletes the log data corresponding to the inspection result from the storage unit;
The production device according to any one of claims 1 to 3. The production device further includes a switching unit that switches whether or not the deletion unit deletes the log data from the storage unit.
The production device according to any one of claims 1 to 4. 1. A data management method executed by a production device for producing a board on which components are mounted, comprising:
the production device includes a storage unit that stores log data related to operations for producing the substrate;
The data management method includes:
receiving an inspection result of the substrate;
If the received test result indicates a good result, delete the log data corresponding to the test result from the storage unit;
transferring the log data stored in the storage unit to an external device;
Data management methods.