JP7774238B2 - Management device and management method - Google Patents

Description

The present invention relates to a management device and a management method for a mounting board manufacturing line including a reflow device.

In a printed circuit board production line, a printing device prints solder onto a board, a component mounting device mounts components onto the solder-printed board, and a reflow device heats the board while transporting it to solder the components to the board, thereby producing a printed circuit board (see, for example, Patent Document 1). The reflow device described in Patent Document 1 is equipped with a heating device that can adjust the temperature for each of multiple furnaces, and an atmosphere adjustment unit that adjusts the atmosphere, including the oxygen concentration, and the temperature and oxygen concentration of each furnace are controlled to match preset reflow conditions based on the results of temperature and oxygen concentration measurements.

Japanese Patent Application Laid-Open No. 2016-219636

However, with prior art including Patent Document 1, although the temperature and oxygen concentration inside the furnace of the reflow device are controlled to match specified reflow conditions, the actual temperature and oxygen concentration fluctuate due to the influence of the substrates that are sequentially placed inside the furnace, and because it is not possible to detect the position of the substrate inside the reflow device, there is room for further improvement in order to manage the quality of mounted substrates based on the temperature and oxygen concentration when the substrate was located in the furnace, and to more precisely control the temperature and oxygen concentration of the reflow device.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a control device and a control method that can identify the temperature or oxygen concentration when a substrate was placed in a furnace.

The management device of the present invention is a management device for a mounting substrate manufacturing line that includes at least a reflow device that heats substrates while transporting them, and includes: an acquisition unit that acquires atmospheric history information including measurement results of at least the temperature or oxygen concentration inside a furnace of the reflow device, and transport history information of the substrate in the reflow device; an identification unit that identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmospheric history information and the transport history information; and an analysis unit that analyzes the fluctuation trend of the oxygen concentration with respect to the transport interval of the substrate based on the oxygen concentration included in the atmospheric history information and the transport history information , and when the analysis unit determines that the oxygen concentration is on the rise, it commands at least one of increasing the interval at which substrates are loaded into the reflow device or decreasing the oxygen concentration in the furnace .
Furthermore, the management device of the present invention is a management device for a mounting substrate manufacturing line that includes at least a reflow device that heats a substrate while transporting it, and includes an acquisition unit that acquires atmospheric history information including measurement results of at least the temperature or oxygen concentration inside a furnace of the reflow device and transport history information of the substrate in the reflow device, an identification unit that identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmospheric history information and the transport history information, and an analysis unit that analyzes the trend of temperature fluctuations relative to the transport interval of the substrate based on the temperature included in the atmospheric history information and the transport history information, and when the analysis unit determines that the temperature is on a decreasing trend, it commands the reflow device to increase the interval at which substrates are loaded.

The management method of the present invention is a management method for identifying the temperature or oxygen concentration inside a furnace of a reflow apparatus that heats a substrate while transporting it, when the substrate was located in the furnace, and obtains atmospheric history information including measurement results of at least the temperature or oxygen concentration inside the furnace and transport history information of the substrate in the reflow apparatus, and identifies the temperature or oxygen concentration when the substrate was located in the furnace based on the atmospheric history information and the transport history information , analyzes the trend of change in the oxygen concentration relative to the transport interval of the substrate based on the oxygen concentration included in the atmospheric history information and the transport history information, and if it determines that the oxygen concentration is on the rise, issues a command to at least one of increasing the interval between loading substrates into the reflow apparatus or lowering the oxygen concentration inside the furnace .
Furthermore, the management method of the present invention is a management method for identifying the temperature or oxygen concentration inside a furnace of a reflow device that heats a substrate while transporting it, when the substrate was located in the furnace, and obtains atmospheric history information including measurement results of at least the temperature or oxygen concentration inside the furnace, and transport history information of the substrate in the reflow device, and identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmospheric history information and the transport history information, analyzes the trend of temperature fluctuations relative to the transport interval of the substrate based on the temperature included in the atmospheric history information and the transport history information, and if it is determined that the temperature is on a decreasing trend, commands the reflow device to increase the interval at which substrates are loaded .

The present invention makes it possible to determine the temperature or oxygen concentration when the substrate was in the furnace.

FIG. 1 is a diagram illustrating the configuration of a mounting substrate manufacturing system according to an embodiment of the present invention; FIG. 1 is an explanatory diagram showing the structure of a main part of a reflow device provided in a mounting substrate manufacturing line according to an embodiment of the present invention; FIG. 1 is a block diagram showing a configuration of a mounting substrate manufacturing system according to an embodiment of the present invention. FIG. 10 is an explanatory diagram of an example of atmosphere history information used in the management device according to an embodiment of the present invention. FIG. 10 is an explanatory diagram of an example of transport history information used in the management device according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of the relationship between a substrate being transported in a furnace of a reflow apparatus according to an embodiment of the present invention and measurement time. 1A and 1B are explanatory diagrams illustrating an example of a method for determining the oxygen concentration of a substrate being transported in a furnace of a reflow apparatus according to an embodiment of the present invention. FIG. 10 is an explanatory diagram of an example of board-specific history information created by the management device according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of an example of a method for managing the oxygen concentration in the furnace of a reflow apparatus according to an embodiment of the present invention. 1 is a flow diagram of a management method according to an embodiment of the present invention; FIG. 10 is a block diagram showing the configuration of a mounting substrate manufacturing system including another example of the reflow apparatus according to the embodiment of the present invention. FIG. 10 is a block diagram showing the configuration of a mounting substrate manufacturing system including another example of the reflow apparatus according to the embodiment of the present invention. FIG. 10 is an explanatory diagram of the relationship between the substrate being transported in the furnace of another example of the reflow apparatus according to the embodiment of the present invention and the measurement time. FIG. 10 is a flow chart of another example of the management method according to the embodiment of the present invention.

An embodiment of the present invention will be described in detail below using the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the mounting board manufacturing system, management device, and reflow device. Corresponding elements in all drawings will be given the same reference numerals below, and duplicate explanations will be omitted. In Figure 2, the X-axis (left-right direction in Figure 2) indicates the board transport direction, and the Z-axis (up-down direction in Figure 2) indicates the height direction perpendicular to the horizontal plane. The Z-axis is the up-down direction or perpendicular direction when the reflow device is installed on a horizontal plane.

First, referring to Figure 1, the configuration of the mounted board manufacturing system 1 will be described. The mounted board manufacturing system 1 is configured to connect the mounted board manufacturing line PL1 via a communications network 2 and be managed by a management device 3. The mounted board manufacturing system 1 has the function of continuously manufacturing mounted boards, each with components mounted on it. The mounted board manufacturing line PL1 is configured by connecting production equipment that performs production tasks, such as a board supply device M1, a printing device M2, component mounting devices M3-M6, a reflow device M7, and a board removal device M8, in series from upstream (left side of the page) to downstream (right side of the page) in the board transport direction.

Board supply device M1, printing device M2, component mounting devices M3-M6, reflow device M7, and board removal device M8 are connected to management device 3 via communication network 2. Management device 3 stores production data including the control programs used by each device, and controls the manufacturing work performed by each device. Note that mounted board production line PL1 is a group of production equipment connected via communication network 2, and the production equipment does not need to be physically connected to each other.

In Figure 1, board supply device M1 has a storage unit such as a rack that stores multiple boards, and performs board supply work by removing boards from the storage unit and supplying them to downstream equipment. Board supply device M1 also has a built-in reader (not shown) that reads board labels such as barcodes or two-dimensional codes attached to boards to read board identification information (board ID) that identifies the board. Board supply device M1 reads the board identification information from the board label and sends it to management device 3. Printing device M2 performs solder printing work by printing solder on boards brought in from upstream using a screen mask attached to the printing work unit.

Component mounting devices M3-M6 perform component mounting work by using mounting heads to mount components supplied by component supply devices onto boards with solder printed on them. Note that the mounted board manufacturing system 1 is not limited to a configuration with four component mounting devices M3-M6; it may have one to three, or five or more component mounting devices M3-M6. Reflow device M7 performs a board heating operation by using a heating unit to heat a board carried into the device, melting and then hardening the solder on the board, thereby joining the electrodes of the board to the electrodes of the components. Board removal device M8 has a storage unit such as a rack that can store multiple boards, and performs a board removal operation by receiving boards carried out by upstream equipment and returning them to the storage unit.

Next, referring to Figure 2, the configuration and functions of the reflow apparatus M7 will be described. The reflow apparatus M7 is equipped with six furnaces F1 to F6. A substrate transport unit 5, which moves substrates B from upstream to downstream in the reflow apparatus M7, is arranged along the X-axis on the base 4 of the reflow apparatus M7. Each furnace F1 to F6 is equipped with a heating unit H1 to H6 that heats the interior of the furnace F1 to F6, and a temperature sensor S1 to S6 that measures the temperature within the furnace F1 to F6. Hereinafter, from upstream to downstream, these furnaces will be referred to as the first furnace F1, second furnace F2, third furnace F3, fourth furnace F4, fifth furnace F5, and sixth furnace F6. Furthermore, within each furnace F1 to F6, the areas where substrates B are heated while moving will be referred to as zones Z1 to Z6. The distances transported by substrates B within each zone Z1 to Z6 (the lengths of zones Z1 to Z6) are transport distances L1 to L6, respectively.

The board B unloaded from the component mounting device M6 is loaded into the reflow device M7 through the loading port 6. The board B loaded through the loading port 6 is heated while being transported sequentially through zones Z1 to Z6 by the board transport unit 5 at a constant transport speed V, and is then unloaded through the unloading port 7 toward the board removal device M8. The fifth furnace F5 is equipped with a gas inlet 8 that introduces an inert gas such as nitrogen into the fifth furnace F5, and an oxygen concentration sensor 9 that measures the oxygen concentration within the fifth furnace F5. That is, the gas inlet 8 introduces an inert gas into the fifth furnace F5, where the oxygen concentration is measured. The gas inlet 8 and oxygen concentration sensor 9 may also be installed in furnaces other than the fifth furnace F5 (for example, the fourth furnace F4).

In Figure 2, an inlet sensor 10, such as a light-shielding sensor, is located above the inlet 6 to detect substrates B being introduced through the inlet 6. The inlet sensor 10 may be located below the inlet 6 or to the side of the inlet 6. Additionally, a sensor may be located within each furnace F1 to F6 to detect when a substrate B has passed a predetermined position within the furnace F1 to F6.

Next, the configuration of the control system of the mounted substrate manufacturing system 1 will be described with reference to Figure 3. Here, we will focus on the functions of the mounted substrate manufacturing system 1, which identify the temperature and oxygen concentration within the furnaces F1-F6 of the reflow device M7 and manage them to maintain specified conditions. The management device 3, substrate supply device M1, printing device M2, component mounting devices M3-M6, reflow device M7, and substrate removal device M8 are interconnected via the communication network 2.

The reflow soldering device M7 is equipped with a reflow soldering control device 20, a substrate transport unit 5, heating units H1-H6, a gas introduction unit 8, an oxygen concentration sensor 9, a carry-in sensor 10, temperature sensors S1-S6, and a touch panel 27. The reflow soldering control device 20 is equipped with a reflow soldering memory unit 21, a substrate detection processing unit 22, a temperature measurement processing unit 23, an oxygen measurement processing unit 24, a reflow soldering control unit 25, and a reflow soldering communication unit 26. The reflow soldering communication unit 26 transmits and receives data via the communication network 2 between the management device 3 and the component mounting device M6, which carries out the substrate B toward the reflow soldering device M7. The touch panel 27 displays various information on its display, and the operator inputs data and operates the reflow soldering device M7 using operation buttons and other controls displayed on the display.

In FIG. 3, the reflow memory unit 21 is a storage device that stores reflow conditions 21a, temperature history 21b, oxygen concentration history 21c, and substrate loading history 21d. The reflow conditions 21a include the set temperature values inside each of the furnaces F1 to F6 (set furnace temperature), the set oxygen concentration value inside the fifth furnace F5, which is equipped with a gas inlet 8 and an oxygen concentration sensor 9 (set oxygen concentration), the set transport speed V (set transport speed) at which the substrate transport unit 5 of the reflow device M7 transports the substrate B, and the minimum interval (set loading interval) for loading substrates B from the load entrance 6 into the reflow device M7.

The board detection processing unit 22 detects board B passing through the entrance 6 of the reflow device M7 based on the detection results of the entrance sensor 10. The board detection processing unit 22 associates the identification information of board B input into the reflow device M7, sent from the management device 3, with the time (second time) when board B was detected at the entrance 6, and stores this as board entry history 21d in the reflow memory unit 21. In this way, the entrance sensor 10 and board detection processing unit 22 constitute a board detection unit 30 that detects board B passing through a predetermined position (board detection position DP) in the reflow device M7 before the furnaces F1 to F6.

In FIG. 3, the temperature measurement processing unit 23 measures the temperature inside each furnace F1 to F6 based on the temperature measurement results from temperature sensors S1 to S6 installed in each furnace F1 to F6. The temperature measurement processing unit 23 measures the temperature inside the furnace at predetermined times (e.g., one-minute intervals) and stores the temperature history 21b in the reflow memory unit 21 in association with the measurement time. In this way, the temperature sensors S1 to S6 and the temperature measurement processing unit 23 constitute a temperature measurement unit 31 that measures the temperatures (furnace temperatures) inside furnaces F1 to F6 (zones Z1 to Z6).

The oxygen measurement processing unit 24 measures the oxygen concentration inside the fifth furnace F5 based on the oxygen concentration measurement results obtained by the oxygen concentration sensor 9 installed in the fifth furnace F5. The oxygen measurement processing unit 24 measures the oxygen concentration inside the furnace at predetermined times (e.g., every minute) and stores the measured oxygen concentration in the reflow memory unit 21 as oxygen concentration history 21c, linked to the measurement time. In this way, the oxygen concentration sensor 9 and oxygen measurement processing unit 24 constitute an oxygen concentration measurement unit 32 that measures the oxygen concentration (furnace oxygen concentration) inside the fifth furnace F5 (in zone Z5). Note that the measurement times and measurement intervals of the temperature measurement unit 31 and the oxygen concentration measurement unit 32 do not necessarily have to be the same.

In FIG. 3, the reflow control unit 25 controls the substrate transport unit 5, gas introduction unit 8, and heating units H1 to H6 based on various setting values included in the reflow conditions 21a, the furnace temperature measured by the temperature measurement unit 31, the furnace oxygen concentration measured by the oxygen concentration measurement unit 32, and various commands sent from the management device 3.

Specifically, the reflow control unit 25 controls the substrate transport unit 5 so that the transport speed V of the substrate B transported through the reflow device M7 is the set transport speed included in the reflow conditions 21a. Furthermore, the reflow control unit 25 performs feedback control of the heating units H1 to H6 based on the furnace temperatures measured by the temperature measurement unit 31 so that the furnace temperatures of each of the furnaces F1 to F6 are maintained at the set furnace temperatures included in the reflow conditions 21a.

The reflow control unit 25 also performs feedback control of the amount of inert gas introduced by the gas introduction unit 8 so that the oxygen concentration in the fifth furnace F5 is maintained at the set oxygen concentration included in the reflow conditions 21a, based on the oxygen concentration in the furnace measured by the oxygen concentration measurement unit 32. The reflow control unit 25 also increases the amount of inert gas introduced from the gas introduction unit 8 based on a command sent from the management device 3 to lower the oxygen concentration in the fifth furnace F5.

As such, the reflow device M7 is equipped with furnaces F1-F6 for heating the board B, measurement units (temperature measurement unit 31, oxygen concentration measurement unit 32) that measure at least the temperature or oxygen concentration within the furnaces F1-F6, a board transport unit 5 that transports the board B, and a board detection unit 30 that detects the board B passing a predetermined position (board detection position DP) before the furnaces F1-F6.The reflow device M7 heats the board B with components mounted on it while transporting it, solidifying the solder.

In FIG. 3, the management processing device 40 provided in the management device 3 includes a management memory unit 41, an acquisition unit 42, an identification unit 43, a calculation unit 44, an analysis unit 45, an input unit 46, a display unit 47, and a management communication unit 48. The input unit 46 is an input device such as a keyboard, touch panel, or mouse, and is used to input operation commands and data. The display unit 47 is a display device such as an LCD panel, and displays various information such as various screens, including an operation screen for operation using the input unit 46. The management communication unit 48 is a communication interface, and sends and receives signals and data between the board supply device M1, the printing device M2, the component mounting devices M3-M6, the reflow device M7, and the board recovery device M8 via the communication network 2.

The management memory unit 41 is a storage device that stores production data 41a, board information 41b, atmosphere history information 41c, transport history information 41d, transport speed information 41e, transport distance information 41f, and board-specific history information 41g. The production data 41a includes information such as the production model name (board name) of the mounted board, the type of component (component name) to be mounted on board B, component size, mounting position (XY coordinates), and mounting direction (θ direction).

In FIG. 3, board information 41b stores the position of board B in mounted board production line PL1 linked to the identification information based on the identification information of board B transported toward printing device M2 sent from board supply device M1, and board B carry-in and carry-out information sent from printing device M2, component mounting devices M3-M6, reflow device M7, and board recovery device M8. Based on board information 41b, management communication unit 48 transmits identification information of board B transported from upstream devices to printing device M2, component mounting devices M3-M6, reflow device M7, and board recovery device M8. For example, identification information of board B transported from upstream component mounting device M6 is transmitted to reflow device M7.

The acquisition unit 42 acquires the temperature history 21b and oxygen concentration history 21c from the reflow apparatus M7 and stores them as atmosphere history information 41c in the management memory unit 41. The acquisition unit 42 may acquire only one of the temperature history 21b and oxygen concentration history 21c, rather than both, and store them as atmosphere history information 41c. In other words, the acquisition unit 42 acquires atmosphere history information 41c that includes measurement results of at least the temperature (furnace temperature) or oxygen concentration (furnace oxygen concentration) inside the furnaces F1 to F6 of the reflow apparatus M7, measured at predetermined time intervals.

Here, an example of the atmosphere history information 41c will be described with reference to Figure 4. The atmosphere history information 41c records, for each measurement time 50, the furnace temperature 51 of the first furnace F1, the furnace temperature 52 of the second furnace F2, the furnace temperature 53 of the third furnace F3, the furnace temperature 54 of the fourth furnace F4, the furnace temperature 55 of the fifth furnace F5, the furnace oxygen concentration 56 of the fifth furnace F5, and the furnace temperature 57 of the sixth furnace F6.

In FIG. 3, the acquisition unit 42 acquires the board loading history 21d from the reflow apparatus M7 and stores it in the management memory unit 41 as transport history information 41d. That is, the acquisition unit 42 acquires the passage time (second time) at which the board B passed through the loading entrance 6 (board detection position DP) of the reflow apparatus M7 as transport history information 41d for the board B in the reflow apparatus M7.

Now, with reference to Figure 5, an example of the transport history information 41d will be described. In the transport history information 41d, the passage time 59 at which the board B passed through the carry-in entrance 6 (board detection position DP) is recorded for each identification information 58 of the board B. In this example, the identification information 58 of the board B is displayed in the order in which the board B passed through the carry-in entrance 6. In this way, the transport history information 41d includes the second time (passage time 59) at which the board B passed through a predetermined position (board detection position DP) of the reflow device M7.

If the only purpose is to create the board-specific history information 41g described below, the acquisition unit 42 acquires the atmosphere history information 41c and the transport history information 41d, for example, at the end of production of the mounted board. Furthermore, if the purpose is to control the furnace temperature and oxygen concentration in the reflow apparatus M7 in addition to creating the board-specific history information 41g, the acquisition unit 42 acquires the atmosphere history information 41c and the transport history information 41d at predetermined intervals (for example, each time the furnace temperature or oxygen concentration is measured).

In FIG. 3, transport speed information 41e stores the transport speed V at which reflow apparatus M7 transports board B. That is, transport speed information 41e includes information related to the transport speed V of board B in reflow apparatus M7. Transport distance information 41f stores transport distances L1 to L6 (see FIG. 2) over which board B is transported while being heated in each of furnaces F1 to F6, and transport distance L0 from board detection position DP, where input sensor 10 detects board B, to the first furnace F1. That is, transport distance information 41f includes information related to transport distances L0 to L6 of board B in reflow apparatus M7.

The calculation unit 44 calculates the first time when the substrate B passed a predetermined position in the furnaces F1 to F6 based on the second time when the substrate B, included in the transport history information 41d, passed a predetermined position (substrate detection position DP) in the reflow apparatus M7, the transport speed V of the substrate B, included in the transport speed information 41e, and the transport distances L0 to L6, included in the transport distance information 41f. The identification unit 43 identifies the furnace temperature (specific furnace temperature) or furnace oxygen concentration (specific oxygen concentration) when the substrate B was located in one of the multiple furnaces F1 to F6, based on the first time calculated from the atmosphere history information 41c and the transport history information 41d.

Here, with reference to FIG. 6, we will explain how the calculation unit 44 calculates the first time, and how the identification unit 43 identifies the furnace temperature when substrate B is located in multiple furnaces F1 to F6 and the oxygen concentration in the furnace when substrate B is located in the fifth furnace F5. Here, we will explain an example where the transport distances L1 to L6 of substrate B in each zone Z1 to Z6 of reflow apparatus M7 are equal. Furthermore, the time when substrate B passes a predetermined position within each furnace F1 to F6 (for example, the boundary between the first furnace F1 and the second furnace F2, or the center of the first furnace F1) is defined as the first time.

In Figure 6, the positional relationship from the entrance 6 to the exit 7 in the reflow device M7 is shown from top to bottom on the page. Time is also shown from left to right on the page. Figure 6 shows the relationship between the position and time within the reflow device M7 of five boards B that were loaded into the reflow device M7. Hereinafter, the board B with identification information 58 of "B01" will be simply referred to as "board B01", etc.

In this example, zones Z1 to Z3 are preheating sections with a set furnace temperature of 160°C. Zones Z4 and Z5 are the main heating sections, with the set furnace temperature of zone Z4 being 240°C, the set furnace temperature of zone Z5 being 230°C, and the set oxygen concentration of zone Z5 being 1000 ppm. Zone Z6 is a cooling section with a set furnace temperature of 150°C. Note that the set furnace temperatures and set oxygen concentrations for zones Z1 to Z6 are examples and can be changed as appropriate depending on the board, solder, etc.

In FIG. 6, the calculation unit 44 calculates that board B01, detected by the incoming sensor 10 at board detection position DP at second time TD01, will pass through zone Z1 at first time TC11, which is ((transport distance L0 + transport distance L1)/transport speed V) after second time TD01. Similarly, the calculation unit 44 calculates that board B01 will pass through zone Z2 at first time TC21, which is ((transport distance L0 + transport distance L1 + transport distance L2)/transport speed V) after second time TD01. The same applies below, and detailed explanations will be omitted. That is, the calculation unit 44 calculates first times TC11 to TC65 assuming that boards B01 to B05 will pass through zones Z1 to Z6 after the transport time (transport distance/transport speed V) from second times TD01 to TD05, when they passed board detection position DP.

The identification unit 43 identifies the temperature or oxygen concentration when substrate B was located in the furnaces F1-F6 based on the temperature or oxygen concentration measured inside the furnaces F1-F6 at the first time or at least before and after the first time. For example, substrate B01 passes through the fifth furnace F5 at the first time between measurement times TM03 and TM04. Therefore, the identification unit 43 identifies the furnace temperature (specific furnace temperature) when substrate B01 was located in the fifth furnace F5 based on the furnace temperatures (230°C and 228°C) of the fifth furnace F5 at measurement times TM03 and TM04. Furthermore, the identification unit 43 identifies the furnace oxygen concentration (specific oxygen concentration) when substrate B01 was located in the fifth furnace F5 based on the furnace oxygen concentrations (1000 ppm and 1200 ppm) of the fifth furnace F5 at measurement times TM03 and TM04.

Here, referring to Figures 7(a) and 7(b), an example of a method by which the identification unit 43 identifies the specific oxygen concentration when substrates B01-B05 were located in the fifth furnace F5 based on the in-furnace oxygen concentration (vertical axis) of the fifth furnace F5 measured at measurement times TM01-TM10 (horizontal axis) will be described. That is, a method for identifying (approximating) the in-furnace oxygen concentration (specific oxygen concentration) of the fifth furnace F5 at first times TC51-TC55 when substrates B01-B05 were located in the fifth furnace F5 will be described.

In FIG. 7(a), the in-furnace oxygen concentration of the fifth furnace F5 at first times TC51 to TC55 is determined in a stepwise manner based on the in-furnace oxygen concentration measurement values at measurement times TM01 to TM10. That is, the determination unit 43 determines the in-furnace oxygen concentrations measured immediately before (or at) first times TC51 to TC55 when substrates B01 to B05 pass through the fifth furnace F5 as the specific oxygen concentrations CC51 to CC55 when substrates B01 to B05 were located in the fifth furnace F5. For example, the determination unit 43 determines the in-furnace oxygen concentration C53 measured at measurement time TM03, immediately before the first time TC51, as the specific oxygen concentration CC51 when substrate B01 was located in the fifth furnace F5.

In FIG. 7(b), the in-furnace oxygen concentration of the fifth furnace F5 at the first times TC51 to TC55 is determined by linear interpolation based on the in-furnace oxygen concentration measurement values at measurement times TM01 to TM10. That is, the determination unit 43 linearly interpolates the in-furnace oxygen concentrations measured before and after the first times TC51 to TC55 when the substrates B01 to B05 pass through the fifth furnace F5, to determine the specific oxygen concentrations CC51 to CC55 when the substrates B01 to B05 were located in the fifth furnace F5. For example, the determination unit 43 linearly interpolates the in-furnace oxygen concentration C53 measured at the measurement time TM03 immediately before the first time TC51 and the in-furnace oxygen concentration C54 measured at the measurement time TM04 immediately after the first time TC51, to determine the specific oxygen concentration CC51 when the substrate B01 was located in the fifth furnace F5.

In FIG. 3, the identification unit 43 associates the identified specific furnace temperatures HC11-HC65 or specific oxygen concentrations CC51-CC55 with the identification information 58 of boards B01-B05 and stores them in the management memory unit 41 as board-specific history information 41g. In other words, the management memory unit 41 is a memory unit that stores the identified temperatures (specific furnace temperatures HC11-HC65) or oxygen concentrations (specific oxygen concentrations CC51-CC55) in association with the identification information 58 of boards B01-B05. The stored board-specific history information 41g is used, for example, as tracing information for quality control of mounted boards.

Now, with reference to Figure 8, an example of the substrate-specific history information 41g will be described. The substrate-specific history information 41g stores, for each identification information 58 of substrate B, a specific furnace temperature 60 for zone Z1, a specific furnace temperature 61 for zone Z2, a specific furnace temperature 62 for zone Z3, a specific furnace temperature 63 for zone Z4, a specific furnace temperature 64 for zone Z5, and a specific furnace temperature 65 for zone Z6. The substrate-specific history information 41g also stores, for each identification information 58 of substrate B, a specific oxygen concentration 66 for zone Z5.

In FIG. 3, the analysis unit 45 analyzes the fluctuation trend of the oxygen concentration in the furnace relative to the transfer interval of substrate B, based on the oxygen concentration in the furnace included in the atmosphere history information 41c and the transfer interval of substrate B calculated from the transfer history information 41d. If the analysis unit 45 determines that the oxygen concentration in the furnace is on the rise, it issues a command to at least one of increasing the interval at which substrate B is loaded into the reflow device M7 or decreasing the oxygen concentration in the furnace in the fifth furnace F5.

The reflow control unit 25 of the reflow device M7, which has received a command to increase the interval between the introduction of boards B, changes its control so that the interval between sending board removal permission commands to the upstream component mounting device M6 increases. Furthermore, the reflow control unit 25 of the reflow device M7, which has received a command to decrease the oxygen concentration in the fifth furnace F5, changes its control so that the amount of inert gas introduced by the gas introduction unit 8 of the fifth furnace F5 increases.

Now, referring to Figure 9, we will explain how the analysis unit 45 analyzes the fluctuation trend of the oxygen concentration inside the fifth furnace F5 relative to the transport interval of substrates B passing through the fifth furnace F5. Here, the oxygen concentration inside the fifth furnace F5 is measured at predetermined time intervals. In Figure 9, rectangles represent the time when substrates B11 to B25 are present in the fifth furnace F5. That is, the left edge of the rectangle indicates the time when the front ends of substrates B11 to B25 enter the fifth furnace F5, and the right edge of the rectangle indicates the time when the rear ends of substrates B11 to B25 exit the fifth furnace F5. Substrates B13 to B22 are loaded from the upstream component mounting device M6 into the reflow device M7 at 30-second intervals. Substrates B23 to B25 are loaded into the reflow device M7 at 45-second intervals.

The analysis unit 45 analyzes whether the in-furnace oxygen concentration 56 of the fifth furnace F5 included in the atmosphere history information 41c is higher or lower than the set oxygen concentration (1000 ppm). The analysis unit 45 also analyzes whether the in-furnace oxygen concentration 56 of the fifth furnace F5 exceeds the upper limit (2000 ppm). The analysis unit 45 also analyzes whether the in-furnace oxygen concentration 56 of the fifth furnace F5 is continuously increasing or decreasing.

In FIG. 9, if the oxygen concentration 56 in the fifth furnace F5 is greater than the set oxygen concentration and has increased three consecutive times (measured value indicated by ellipse a), the analysis unit 45 determines that the oxygen concentration is on the rise. In other words, during this time period, the amount of oxygen flowing into the fifth furnace F5 when substrate B enters it exceeds the amount of inert gas introduced through the gas inlet 8. Therefore, the analysis unit 45 instructs the reflow unit M7 to increase the interval between introductions of substrate B or to lower the oxygen concentration in the fifth furnace F5. In this example, the introduction interval is changed from 30 seconds to 45 seconds from the time substrate B23 is introduced into the reflow unit M7. Furthermore, as soon as it is determined that the oxygen concentration is on the rise, the amount of inert gas introduced through the gas inlet 8 of the fifth furnace F5 is increased.

Then, the oxygen concentration 56 in the fifth furnace F5 tends to decrease due to the increased amount of inert gas being introduced (measurement value indicated by ellipse b). When the oxygen concentration 56 in the fifth furnace F5 decreases after the increase in the amount of inert gas and falls below the set oxygen concentration (measurement value indicated by circle c), the analysis unit 45 commands the gas introduction unit 8 of the fifth furnace F5 to return the amount of inert gas introduced to its original state. At that time, the interval between introductions of substrate B is maintained at 45 seconds. This prevents the oxygen concentration 56 in the fifth furnace F5 from decreasing excessively. Thereafter, the analysis unit 45 commands changes to the interval between introductions of substrates into the reflow apparatus M7 and the amount of inert gas introduced by the gas introduction unit 8 based on the trend in the oxygen concentration in the furnace.

In FIG. 3, the analysis unit 45 analyzes the trend in furnace temperature fluctuations relative to the transfer interval of substrate B, based on the furnace temperature included in the atmosphere history information 41c and the transfer interval of substrate B calculated from the transfer history information 41d. If the analysis unit 45 determines that the furnace temperature in furnaces F1 to F6 is on a downward trend, it instructs the reflow device M7 to increase the interval at which substrate B is loaded. This prevents the decrease in the furnace temperature in furnaces F1 to F6. In other words, if the furnace temperature is on a downward trend due to substrates B entering furnaces F1 to F6, the number of substrates B entering furnaces F1 to F6 per unit time is reduced to prevent further decrease in the furnace temperature. The analysis of the trend in furnace temperature fluctuations by the analysis unit 45 is similar to the analysis of the trend in oxygen concentration fluctuations in the furnace, and a detailed description will be omitted.

In this way, the management device 3 of this embodiment is equipped with an acquisition unit 42 that acquires atmosphere history information 41c including measurement results of at least furnace temperatures 51-55, 57 or furnace oxygen concentration 56 in furnaces F1-F6 of reflow apparatus M7, and transport history information 41d of board B in reflow apparatus M7, and an identification unit 43 that identifies the specific furnace temperature 60-65 or specific oxygen concentration 66 when board B was located in furnaces F1-F6 based on the atmosphere history information 41c and transport history information 41d, and manages a mounting board production line PL1 that includes at least reflow apparatus M7, which heats board B while transporting it. This makes it possible to identify the temperature or oxygen concentration when board B was located in furnaces F1-F6.

Next, following the flow chart in Figure 10, we will explain a management method for determining the temperature or oxygen concentration within furnaces F1 to F6 of reflow equipment M7 when substrate B is positioned in one of these furnaces. Here, we will explain a management method for determining the temperature or oxygen concentration within furnaces F1 to F6 of reflow equipment M7 while mounting substrates are being manufactured in mounting substrate manufacturing line PL1, and providing feedback to the manufacturing operations of mounting substrate manufacturing line PL1.

First, the acquisition unit 42 of the management device 3 acquires the temperature history 21b and oxygen concentration history 21c from the reflow apparatus M7 and stores them as atmosphere history information 41c, which includes measurement results of the furnace temperatures 51-55, 57 or the furnace oxygen concentration 56 in the furnaces F1-F6. The acquisition unit 42 also acquires the board loading history 21d from the reflow apparatus M7 and stores it as transport history information 41d for the board B in the reflow apparatus M7 (ST1: acquisition process). The acquisition process (ST1) is performed, for example, when the furnace temperature or furnace oxygen concentration is measured in the reflow apparatus M7.

In FIG. 10, the calculation unit 44 of the management device 3 then calculates the first times TC11 to TC61 at which the boards B01 to B05 passed through the predetermined positions in the furnaces F1 to F6 based on the second times TD01 to TD05 at which the boards B01 to B05 passed through the predetermined positions (board detection position DP) in the reflow device M7, which are included in the transport history information 41d, the transport speed V of the boards B01 to B05 in the reflow device M7, and the transport distances L0 to L6 of the boards B01 to B05 in the reflow device M7 (ST2: calculation step) (see FIG. 6).

Then, the identification unit 43 of the management device 3 identifies the specific in-furnace temperature 60-65 or the specific oxygen concentration 66 when the substrates B01-B05 were located in the furnaces F1-F6 based on the calculated in-furnace temperatures 51-55, 57 or in-furnace oxygen concentration 56 in the furnaces F1-F6 measured before and after the first times TC51-TC55 (ST3: identification step) (see Figures 7 and 8). That is, in the identification step (ST3), the specific in-furnace temperature 60-65 or the specific oxygen concentration 66 when the substrates B01-B05 were located in the furnaces F1-F6 is identified based on the atmosphere history information 41c and the transport history information 41d.

In FIG. 10, the identification unit 43 associates the identified specific furnace temperature 60-65 or specific oxygen concentration 66 with the identification information 58 of the substrates B01-B05 and stores it as substrate-specific history information 41g (ST4: first storage step). This makes it possible to identify the temperature or oxygen concentration when the substrates B01-B05 were located in the furnaces F1-F6 for each substrate B01-B05.

Next, the analysis unit 45 of the management device 3 analyzes the trend of fluctuations in the in-furnace oxygen concentration 56 relative to the transfer interval of substrates B11-B25 based on the in-furnace oxygen concentration 56 contained in the atmosphere history information 41c and the transfer history information 41d (ST5: oxygen concentration analysis step) (see Figure 9). If the analysis shows that the in-furnace oxygen concentration 56 is on the rise (Yes in ST5) (ellipse a in Figure 9), the analysis unit 45 issues a command to the reflow device M7 to either increase the interval between the introduction of substrates B23-B25 or to reduce the oxygen concentration in the fifth furnace F5 (ST6: first command step). Based on this command, the introduction interval is changed from 30 seconds to 45 seconds, and the amount of inert gas introduced by the gas introduction unit 8 of the fifth furnace F5 is increased.

In FIG. 10, the analysis unit 45 then analyzes the fluctuation trends of the furnace temperatures 51-55, 57 relative to the transfer interval of the boards B11-B25 based on the furnace temperatures 51-55, 57 included in the atmosphere history information 41c and the transfer history information 41d (ST7: temperature analysis step). If the analysis shows that the furnace temperatures 51-55, 57 are on a downward trend (Yes in ST7), the analysis unit 45 instructs the reflow device M7 to increase the interval between loading the boards B19-B25 (ST8: second command step).

In this way, the interval at which boards B19-B25 are loaded into reflow machine M7 or the amount of inert gas introduced by gas inlet 8 of fifth furnace F5 is changed (ST6, ST8) based on the trend in fluctuations in furnace oxygen concentration 56 or furnace temperatures 51-55, 57 relative to the transfer interval of boards B11-B25 analyzed based on atmosphere history information 41c, including atmospheric history information 41c, and transfer history information 41d. This precisely controls fluctuations in furnace oxygen concentration 56 and furnace temperatures 51-55, 57, suppressing variations in the quality of the manufactured mounted boards.

In Figure 10, if the production of mounted boards on the mounted board production line PL1 has not finished (No in ST9), the process returns to the acquisition process (ST1) and repeatedly acquires atmosphere history information 41c and transport history information 41d (ST1), creates and stores board-specific history information 41g (ST2-ST4), and provides feedback (ST5-ST8) on the interval at which boards B19-B25 are introduced into the reflow device M7 and the amount of inert gas introduced into the fifth furnace F5, etc.

Next, with reference to Figure 11, the configuration of a reflow apparatus according to another embodiment of the present invention (hereinafter simply referred to as "reflow apparatus M7A") will be described using a block diagram of a mounted substrate manufacturing system 1A equipped with reflow apparatus M7A. Reflow apparatus M7A differs from reflow apparatus M7 shown in Figure 3 in that it is equipped with a function for creating board-specific history information 41g equipped in management apparatus 3 shown in Figure 3. Hereinafter, parts that are the same as those in reflow apparatus M7 will be assigned the same reference numerals, and detailed description will be omitted.

The reflow control device 20A provided in the reflow device M7A includes a reflow memory unit 21A, a substrate detection processing unit 22, a temperature measurement processing unit 23, an oxygen measurement processing unit 24, a reflow control unit 25, a reflow communication unit 26, an identification unit 33, a calculation unit 34, and an analysis unit 35. The reflow memory unit 21A also stores reflow conditions 21a, temperature history 21b, oxygen concentration history 21c, substrate loading history 21d, substrate information 21e, transport distance information 21f, and substrate-specific history information 21g. The substrate information 21e and transport distance information 21f are the same as the substrate information 41b and transport distance information 41f stored in the management memory unit 41 of the management device 3, and detailed description thereof will be omitted.

In FIG. 11, the calculation unit 34 calculates the first time based on the second time included in the substrate loading history 21d, the transport speed V included in the reflow conditions 21a, and the transport distances L0 to L6 included in the transport distance information 21f. Other than this, the calculation unit 34 is the same as the calculation unit 44 of the management device 3, and a detailed description thereof will be omitted. The identification unit 33 is the same as the identification unit 43 of the management device 3, and a detailed description thereof will be omitted. Other than this, the identification unit 33 identifies a specific furnace temperature and a specific oxygen concentration based on the furnace temperatures of the furnaces F1 to F6 included in the temperature history 21b, the furnace oxygen concentration of the fifth furnace F5 included in the oxygen concentration history 21c, and the substrate loading history 21d.

The analysis unit 35 is the same as the analysis unit 45 of the management device 3, except that it analyzes the trends in the temperature and oxygen concentration in the furnace relative to the substrate transport interval based on the furnace temperatures in the furnaces F1 to F6 contained in the temperature history 21b, the oxygen concentration in the fifth furnace F5 contained in the oxygen concentration history 21c, and the substrate loading history 21d, and so a detailed description will be omitted.

As described above, the reflow soldering apparatus M7A of another example of this embodiment includes furnaces F1 to F6 for heating substrates, measurement units (temperature measurement unit 31, oxygen concentration measurement unit 32) that measure at least the furnace temperature or oxygen concentration within the furnaces F1 to F6, and an identification unit 33 that identifies the specific furnace temperature or specific oxygen concentration when the substrate was located in the furnaces F1 to F6 based on the measured furnace temperature or furnace oxygen concentration and substrate transport information (substrate carry-in history 21d) in the reflow soldering apparatus M7A. This allows the reflow soldering apparatus M7A to independently identify the temperature or oxygen concentration when the substrate was located in the furnaces F1 to F6.

Next, with reference to Figure 12, the configuration of a reflow apparatus according to another embodiment of the present invention (hereinafter simply referred to as "reflow apparatus M7B") will be described using a block diagram of a mounted substrate manufacturing system 1B equipped with reflow apparatus M7B. Reflow apparatus M7B differs from reflow apparatus M7 and reflow apparatus M7A in that it measures the temperature and oxygen concentration inside the furnace when a substrate is transported into furnaces F1 to F6. Hereinafter, parts that are the same as those in reflow apparatus M7 and reflow apparatus M7A will be assigned the same reference numerals, and detailed description will be omitted.

The reflow control device 20B provided in the reflow device M7B includes a reflow memory unit 21B, a substrate detection processing unit 22, a temperature measurement processing unit 23B, an oxygen measurement processing unit 24B, a reflow control unit 25, a reflow communication unit 26, and an analysis unit 35B. The reflow memory unit 21A also stores reflow conditions 21a, substrate information 21e, and substrate-specific history information 21g, as well as measurement conditions 21h.

In Figure 12, measurement condition 21h stores transport distances L1B to L6B from substrate detection position DP, where input sensor 10 detects substrates B08 to B09 being introduced into reflow device M7B, to temperature sensors S1 to S6 or oxygen concentration sensor 9 installed in each furnace F1 to F6 (see Figure 13). Alternatively, measurement condition 21h stores the transport time (transport distances L1B to L6B/transport speed V) required for substrates B08 to B09 to pass substrate detection position DP and reach temperature sensors S1 to S6 or oxygen concentration sensor 9, calculated from transport distances L1B to L6B and transport speed V of substrates B08 to B09 included in reflow condition 21a.

The temperature measurement unit 31B measures the temperature inside the furnace a predetermined time (transport time) after the substrate detection unit 30 detects substrates B08-B09 passing through the substrate detection position DP. The oxygen concentration measurement unit 32B measures the oxygen concentration inside the furnace a predetermined time (transport time) after the substrate detection unit 30 detects substrates B08-B09 passing through the substrate detection position DP. The predetermined time (transport time) is calculated based on the transport speed V at which the substrate transport unit 5 transports the substrates B08-B09 and the transport distances L1B-L6B from the substrate detection position DP at which the substrate detection unit 30 detects the substrates B08-B09 to the positions measured by the sensors (temperature sensors S1-S6, oxygen concentration sensor 9) of the measurement units (temperature measurement unit 31, oxygen concentration detection unit 32).

The second time when substrate detection unit 30 detects substrates B08-B09, the furnace temperature and measurement time measured by temperature measurement unit 31B, and the furnace oxygen concentration and measurement time measured by oxygen concentration measurement unit 32B are linked to identification information 58 of measured substrates B08-B09 and stored in reflow memory unit 21B as substrate-specific history information 21g. In other words, reflow memory unit 21B is a memory unit that links and stores the second time when substrates B08-B09 were detected and the measurement time when the furnace temperature or furnace oxygen concentration was measured, respectively.

Now, with reference to Figure 13, we will explain how the temperature measurement unit 31B and oxygen concentration measurement unit 32B measure the furnace temperature and oxygen concentration. Substrate B08 is detected by the substrate detection unit 30 (incoming sensor 10) at substrate detection position DP at second time TD08. Thereafter, at measurement time TM18 when substrate B10 reaches the position of temperature sensor S1 in zone Z1, the furnace temperature HC18 is measured by temperature measurement unit 31B (temperature sensor S1).

Similarly, at measurement times TM28 to TM68 when substrate B10 reaches the positions of temperature sensors S2 to S6 in zones Z2 to Z6, temperature measurement unit 31B (temperature sensors S2 to S6) measures furnace temperatures HC28 to HC68. Furthermore, at measurement time TM58 when substrate B10 reaches the position of oxygen concentration sensor 9 in zone Z5, oxygen concentration measurement unit 32B (oxygen concentration sensor 9) measures furnace oxygen concentration CC58.

In FIG. 12, the analysis unit 35B analyzes the trend of the furnace temperatures HC18-HC69 relative to the transfer interval of boards B08-B09 based on the second times TD08-TD09, furnace temperatures HC18-HC69, and measurement times TM18-TM69 for boards B08-B09 contained in the board-specific history information 21g stored in the reflow memory unit 21B (memory unit). If the analysis unit 35B determines that the furnace temperatures HC18-HC69 are on a downward trend, it instructs the reflow device M7B to increase the interval at which boards B08-B09 are loaded.

The analysis unit 35B also analyzes the trend in the in-furnace oxygen concentrations CC58-CC69 relative to the transfer interval for substrates B08-B09 based on the second times TD08-TD09, in-furnace oxygen concentrations CC58-CC69, and measurement times TM18-TM69 for substrates B08-B09 contained in the substrate-specific history information 21g stored in the reflow memory unit 21B (memory unit). If the analysis unit 35B determines that the in-furnace oxygen concentrations CC58-CC69 are on the rise, it issues a command to either increase the interval between loading substrates B08-B09 into the reflow device M7B or to increase the amount of inert gas introduced by the gas introduction unit 8.

Next, following the flow chart in Figure 14, we will explain the control method for measuring the temperature or oxygen concentration inside furnaces F1 to F6 of reflow equipment M7B when boards B08 to B09 are located in those furnaces. Below, the same steps as those in the control method shown in Figure 10 are given the same reference numerals, and detailed explanations will be omitted.

First, when the board detection unit 30 detects boards B08-B09 being loaded into the reflow unit M7B (Yes in ST11), it calculates the measurement times TM18-TM69 at which the boards B08-B09 will reach the temperature sensors S1-S6 or oxygen concentration sensor 9 in each furnace F1-F6 (ST12: Measurement time calculation process). Next, the temperature measurement unit 31B and oxygen concentration measurement unit 32B measure the furnace temperatures HC18-HC69 and the furnace oxygen concentrations CC58-CC69 at measurement times TM18-TM69 (ST13: Third measurement process).

In FIG. 14, the second time when the substrate detection unit 30 detects substrates B08-B09, the measured furnace temperatures HC18-HC69, the furnace oxygen concentrations CC58-CC69, and the measurement times TM18-TM69 are linked to the identification information 58 of substrates B08-B09 and stored as substrate-specific history information 21g (ST14: second storage process). Thereafter, based on the substrate-specific history information 21g, the oxygen concentration analysis process (ST5), first command process (ST6), temperature analysis process (ST7), and second command process (ST8) are executed, and the interval at which substrates B08-B09 are introduced into the reflow device M7B or the amount of inert gas introduced by the gas introduction unit 8 of the fifth furnace F5 is changed.

As explained above, the reflow soldering apparatus M7B according to another example of this embodiment includes furnaces F1-F6 for heating substrates B08-B09, measurement units (temperature measurement unit 31B, oxygen concentration measurement unit 32B) that measure at least the furnace temperatures HC18-HC69 or the furnace oxygen concentrations CC58-CC69 in the furnaces F1-F6, a substrate transport unit 5 that transports substrates B08-B09, and a substrate detection unit 30 that detects substrates B08-B09 as they pass through a predetermined position (substrate detection position DP) before the furnaces F1-F6.

Then, the measurement unit measures the furnace temperatures HC18-HC69 or the furnace oxygen concentrations CC58-CC69 a predetermined time later (measurement times TM18-TM69) after the substrate detection unit 30 detects substrates B08-B09. This makes it possible to identify (measure) in real time the temperatures or oxygen concentrations when substrates B08-B09 were located in furnaces F1-F6.

The control device, reflow device, and control method of the present invention have the effect of being able to identify the temperature or oxygen concentration when a substrate was in a furnace, and are useful in the field of mounting components to substrates.

1, 1A, 1B Mounting board manufacturing system 3 Management device 5 Board transport section 8 Gas introduction section B, B01 to B05, B08 to B09, B11 to B25 Board DP Board detection position (predetermined position of reflow device)
F1 1st furnace F2 2nd furnace F3 3rd furnace F4 4th furnace F5 5th furnace F6 6th furnace L0 to L6, L1B to L6B Conveying distance M7, M7A, M7B Reflow equipment PL1 Mounting board production line V Conveying speed

Claims (10)

A management device for a mounting substrate manufacturing line including at least a reflow device that heats a substrate while transporting it,
an acquisition unit that acquires atmospheric history information including measurement results of at least the temperature or oxygen concentration in a furnace of the reflow apparatus and transport history information of the substrate in the reflow apparatus;
an identifying unit that identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmosphere history information and the transfer history information;
an analysis unit that analyzes a tendency of fluctuation in the oxygen concentration relative to a transfer interval of the substrate based on the oxygen concentration included in the atmosphere history information and the transfer history information ,
When the analysis unit determines that the oxygen concentration is on the rise, it instructs the management device to at least one of increasing the interval between placing substrates in the reflow device or decreasing the oxygen concentration in the furnace . The management device of claim 1 further includes a memory unit that stores the identified temperature or oxygen concentration in association with identification information for the substrate. the reflow apparatus has a plurality of the furnaces,
The management device according to claim 1 , wherein the specifying unit specifies the temperature or the oxygen concentration when the substrate was located in each of the plurality of furnaces. The management device described in any one of claims 1 to 3, wherein the identification unit identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on a first time when the substrate passed a predetermined position within the furnace. A calculation unit is further provided,
the transport history information includes a second time when the substrate passed through a predetermined position in the reflow apparatus;
5. The management device according to claim 4, wherein the calculation unit calculates the first time based on the second time, transport speed information relating to a transport speed of the substrate in the reflow apparatus, and transport distance information relating to a transport distance of the substrate in the reflow apparatus. The management device described in claim 4 or 5, wherein the determination unit determines the temperature or oxygen concentration when the substrate was located in the furnace based on the temperature or oxygen concentration inside the furnace measured at the first time or at least before and after the first time. The management device described in any one of claims 1 to 6, wherein the atmospheric history information includes at least the temperature or the oxygen concentration measured at predetermined time intervals. A management device for a mounting substrate manufacturing line including at least a reflow device that heats a substrate while transporting it,
an acquisition unit that acquires atmospheric history information including measurement results of at least the temperature or oxygen concentration in a furnace of the reflow apparatus and transport history information of the substrate in the reflow apparatus;
an identifying unit that identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmosphere history information and the transfer history information;
an analysis unit that analyzes a tendency of fluctuation in the temperature relative to a transfer interval of the substrate based on the temperature included in the atmosphere history information and the transfer history information ,
When the analysis unit determines that the temperature is decreasing, the management device instructs the reflow device to increase the interval at which the boards are loaded. 1. A management method for identifying a temperature or an oxygen concentration in a furnace of a reflow device that heats a substrate while transporting the substrate, when the substrate is positioned in the furnace, comprising:
Acquire atmospheric history information including measurement results of at least the temperature or oxygen concentration inside the furnace and transportation history information of the substrate in the reflow apparatus;
Identifying the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmosphere history information and the transport history information;
analyzing a variation trend of the oxygen concentration relative to a transfer interval of the substrate based on the oxygen concentration included in the atmosphere history information and the transfer history information;
When it is determined that the oxygen concentration is on the rise, the control method instructs at least one of increasing the intervals between placing substrates in the reflow device and lowering the oxygen concentration in the furnace . 1. A management method for identifying a temperature or an oxygen concentration in a furnace of a reflow device that heats a substrate while transporting the substrate, when the substrate is positioned in the furnace, comprising:
Acquire atmospheric history information including measurement results of at least the temperature or oxygen concentration inside the furnace and transportation history information of the substrate in the reflow apparatus;
Identifying the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmosphere history information and the transport history information;
analyzing a tendency of fluctuation in the temperature relative to a transfer interval of the substrate based on the temperature included in the atmosphere history information and the transfer history information;
When it is determined that the temperature is decreasing, a control method is provided in which an instruction is given to increase the interval at which the boards are put into the reflow device.