JP7774802B2 - Light irradiation device - Google Patents

Description

The technology disclosed in this specification relates to a light irradiation device.

Conventionally, an illumination device that emits light is known, for example, as described in Patent Document 1. This device comprises a housing with a bottom cover having an illumination hole and an upper shell, and a board on which an LED facing the illumination hole is mounted and locked within the housing. A heat sink pad (cooling means) is arranged within the housing, and the back surface of the board is connected to this heat sink pad, allowing heat emitted from the LED to dissipate.

JP 2011-238748 A

When using short-wavelength ultraviolet light as a light source, the output is higher than that of conventional visible light irradiation devices or long-wavelength ultraviolet irradiation devices, so there is a demand for even greater heat dissipation than before. However, in a configuration in which the cooling means is installed inside the housing, as in the configuration of Patent Document 1 mentioned above, the thickness of the housing increases. Furthermore, the provision of the cooling means increases the weight. If the cooling means is made thinner to solve this problem, sufficient heat dissipation cannot be achieved.

The technology disclosed in this specification was developed in consideration of the above circumstances, and aims to provide a light irradiation device that is thin, lightweight, and has excellent heat dissipation properties.

The technology disclosed in this specification to solve the above problem is a light irradiation device comprising a substrate on whose mounting surface an irradiation element is mounted, and a housing that houses the substrate and has a light-transmitting portion that allows light emitted from the irradiation element to pass to the outside, the housing being provided with a heat dissipation portion made of a metal material that is exposed inside and outside the housing, and the substrate being attached in contact with the portion of the heat dissipation portion that is located inside the housing.

With the above configuration, the heat from the substrate, which has risen in temperature due to heat generated by the irradiation element, is quickly transferred to the heat dissipation section of the housing and easily dissipated to the outside, resulting in a light irradiation device with excellent heat dissipation properties. Furthermore, by configuring the heat dissipation section to be exposed both inside and outside the housing, the light irradiation device can be made thinner and lighter than conventional configurations in which the heat dissipation section is located inside the housing.

The substrate may be fastened to the heat dissipation unit with a fastening member. In a configuration in which the substrate and heat dissipation unit are simply stacked on top of each other or joined together with adhesive, there is a risk of air gaps forming between the substrate and the heat dissipation unit, which reduces cooling efficiency. With the above configuration, the substrate can be reliably brought into contact with the heat dissipation unit, improving heat dissipation.

The board is accommodated in the housing with the mounting surface facing the heat dissipation portion, and the heat dissipation portion has a fastening portion that rises toward the board and to which a fastening member is fastened, and a standing wall that rises toward the board and has a contact surface that extends along the mounting surface, and when the board is fastened to the fastening portion with the fastening member, the mounting surface may be in contact with the contact surface.

With the above configuration, a heat dissipation section made of a metal material is placed on the part of the housing that is hit by light emitted from the illumination element, preventing deterioration of the housing. Furthermore, even if a gap is formed between the board and the surface of the heat dissipation section facing the board, the board and the heat dissipation section are configured to be in contact not only at the fastening portion but also between the mounting surface of the board and the contact surface of the vertical wall, ensuring sufficient contact area between the two and thereby improving heat dissipation.

Cooling fans for cooling the board may be housed in the housing and aligned horizontally along the surface of the board, and the board may be located in an exhaust path from the air outlet of the cooling fan to an exhaust outlet provided in the housing.

With the above configuration, the board and cooling fan are arranged side by side, allowing for a thinner light irradiation device compared to a configuration in which the board and cooling fan are arranged on top of each other. Furthermore, not only can the board dissipate heat through the heat dissipation section, but it can also be efficiently cooled by the wind from the cooling fan.

The substrate may mount the first and second illumination elements and may have a first portion that mounts the first illumination element and a second portion that mounts the second illumination element, and the first portion and the second portion may extend in directions that intersect with each other.

With the above configuration, the area of the substrate can be increased compared to a configuration in which the first and second portions are arranged flat, thereby improving cooling efficiency. Furthermore, by extending the first and second portions in intersecting directions, the first and second irradiation elements are arranged to face in different directions. In other words, with the above configuration, the irradiation range in the height direction can be expanded compared to a configuration in which the two irradiation elements face only in one direction.

An extension may be provided on the peripheral edge of the substrate, extending outward from the heat dissipation section inside the housing. With this configuration, the extension acts as a heat dissipation fin, allowing heat from the substrate to be dissipated.

The heat dissipation portion may be made of aluminum. The substrate may also be made of aluminum. Because aluminum has high thermal conductivity, this configuration improves cooling efficiency.

The technology disclosed in this specification makes it possible to obtain a light irradiation device that is thin, lightweight, and has excellent heat dissipation properties.

1 is a perspective view of the top side of a deep ultraviolet irradiation device according to an embodiment of the present invention; A perspective view of the bottom side of the deep ultraviolet irradiation device Exploded perspective view of deep ultraviolet irradiation device A perspective view of the inside of a deep ultraviolet irradiation device Partially enlarged perspective view of the inside of the deep ultraviolet irradiation device Partially enlarged plan view of the inside of the deep ultraviolet irradiation device Partially enlarged plan view of deep ultraviolet irradiation equipment Partially enlarged vertical cross-sectional view of the deep ultraviolet irradiation device (II cross-sectional view of Figure 1) Partially enlarged vertical cross-sectional view of the deep ultraviolet irradiation device (II-II cross-sectional view in Figure 1) Cross-sectional view of the deep ultraviolet irradiation device (cross-sectional view of III-III in Figure 1) Cross-sectional view of the deep ultraviolet irradiation device (IV-IV cross-sectional view in Figure 1) A perspective view of a heat dissipation member Plan view of the heat dissipation member Front view of the heat dissipation member

An embodiment in which the light irradiation device disclosed in this specification is applied to a deep ultraviolet irradiation device 10 capable of sterilizing the interior of a vehicle will be described with reference to Figures 1 to 14. Each figure shows the X-axis, Y-axis, and Z-axis, and each axis direction is drawn so that it is a common direction in each figure. In the following description, the X-axis direction will be described as the rightward or widthwise direction, the Y-axis direction as the forward direction, and the Z-axis direction as the upward direction, but the directions are not limited to this embodiment. Furthermore, for multiple identical components, a reference number may be assigned to one component and the reference numbers for the other components may be omitted.

The deep ultraviolet irradiation device 10 is configured to include an LED board (an example of a board) 80 on which LEDs (an example of an irradiation element) 88 are mounted, and a housing 11 that is shaped like a flat box overall and houses the LED board 80 inside.

The housing 11 is made of resin and, as shown in Figure 3, is composed of two covers 12, 22 that cover the front and back (top and bottom) of the plate surface of the approximately rectangular holding member 30. In detail, the holding member 30 comprises a roughly rectangular plate-shaped holding plate portion 31 and a frame-shaped frame portion 32 that rises up and down from the periphery of the holding plate portion 31. The housing 11 is composed of two covers: an upper cover 12 that is shallow and dish-shaped overall, covering the top surface of the holding plate portion 31 and fitting inside the frame portion 32, and a plate-shaped lower cover 22 that covers the bottom surface of the holding plate portion 31 and fitting inside the frame portion 32.

As shown in Figures 8 and 9, the ceiling wall 13 of the upper cover 12 of the housing 11, which is arranged opposite the upper surface of the retaining plate 31, is composed of a front ceiling wall 14 that slopes rearward and upward from its front end and covers approximately one-third of the front of the retaining plate 31, and a rear ceiling wall 15 that extends horizontally from the front ceiling wall 14 and covers approximately two-thirds of the rear of the retaining plate 31 while remaining parallel to the retaining plate 31. The inclination angle of the front ceiling wall 14 is set at an angle of approximately 15 degrees relative to the retaining plate 31.

As shown in Figures 10 and 11, a cover-side peripheral wall 16 that rises downward and outward is provided on the peripheral edge of the ceiling wall 13 of the upper cover 12. The outer periphery of the leading end (lower end) of this cover-side peripheral wall 16 in the rising direction is set to a dimension that allows it to be fitted inside the frame-shaped portion 32 of the holding member 30 described above.

The front wall 17 of the cover-side peripheral wall 16, which extends contiguously with the front end of the front ceiling wall 14, has multiple vertically extending slit-shaped exhaust ports 18 that straddle the front ceiling wall 14 (see Figure 1). The rear wall of the cover-side peripheral wall 16, which extends contiguously with the rear end of the rear ceiling wall 15, has multiple vertically extending slit-shaped intake ports (not shown).

The upper cover 12 is fixed to the holding member 30 by fastening bolts B to a plurality of cylindrical upper cover fastening portions 36 (described later) that rise from the holding plate portion 31 of the holding member 30. When the upper cover 12 is fixed to the holding member 30, a space is formed between the upper cover 12 and the holding plate portion 31. Hereinafter, within the internal space of this housing 11, the space below the front ceiling wall 14 will be referred to as the front space R1, and the space below the rear ceiling wall 15 will be referred to as the rear space R2.

On the other hand, the lower cover 22 of the housing 11 is a roughly rectangular plate that is slightly curved overall, with the central portion bulging slightly downward. The outer periphery of the lower cover 22 is set to a size that allows it to fit inside the frame portion 32 of the holding member 30 described above (see Figures 10 and 11).

As shown in Figure 3, locking portions 23 protrude outward slightly inward from the center of each of the four sides (edges) of the lower cover 22. The lower cover 22 is fixed to the holding member 30 by locking these locking portions 23 into stepped portions within locking holes 41 provided in the holding plate portion 31 of the holding member 30 described above.

A housing-side opening 25, which is rectangular and elongated in the width direction (left-right direction) and penetrates the plate surface, is provided in part of the lower cover 22, which corresponds to the front ceiling wall 14 of the upper cover 12 described above (part of the part corresponding to the front space R1). This housing-side opening 25 is closed by a heat dissipation member 50, which will be described later.

As described above, the holding member 30 comprises a rectangular, plate-shaped holding plate portion 31 and a frame-shaped portion 32 that rises vertically from the periphery of the holding plate portion 31. A holding member-side opening 35 penetrates the plate surface of the holding plate portion 31 at a position that faces the housing-side opening 25 when the lower cover 22 is attached (see Figures 9 and 11). The holding member-side opening 35 is formed to be slightly larger than the housing-side opening 25 in a plan view. In other words, when the lower cover 22 is attached to the holding member 30, the edge of the housing-side opening 25 is exposed inside the holding member-side opening 35.

A partition wall 33 that rises upward and extends in the left-right direction is provided at the rear edge of the holding member-side opening 35. When the upper cover 12 is assembled, the partition wall 33 is located at the boundary between the front space R1 and the rear space R2. The partition wall 33 is provided in the center of the width of the holding plate portion 31, and its width (left-right dimension) is slightly smaller than the width of the holding member-side opening 35. The space to the side of the partition wall 33 is open in the front-to-rear direction. A flat rectangular notch 34 is cut downward at the center of the upper end of the partition wall 33, and the air outlet 92 of the cooling fan 90, described below, is fitted into this notch 34.

On either side (left and right) of the retaining member side opening 35, two columnar upper cover fastening portions 36 rising upward from the retaining plate portion 31, and two plate-shaped positioning walls 37 rising upward from the retaining plate portion 31 and having opposing plate surfaces, are arranged side by side in the front-to-rear direction, with the retaining member side opening 35 in between.

A cylindrical first central positioning protrusion 38 that rises upward is provided at the center of the front edge of the holding member side opening 35. Furthermore, a square pillar-shaped second central positioning protrusion 39 that protrudes inward into the holding member side opening 35 and rises upward is provided at the center of the rear edge of the holding member side opening 35. The back surface of the second central positioning protrusion 39 is integral with the partition wall 33.

When the lower cover 22 and holding member 30 are assembled, the housing-side opening 25 and holding member-side opening 35 are in vertical communication. A portion of a heat dissipation member 50 (an example of a heat dissipation section) is fitted into these openings 25, 35. The lower surface of the heat dissipation member 50 is exposed to the outside of the housing 11, and the upper surface is exposed to the inside of the housing 11 (inside the front space R1).

The heat dissipation member 50 is made of aluminum or an aluminum alloy, and as shown in Figures 12 and 13, it includes a main body 51 that is rectangular in plan view, and four positioning pieces 71, 71, 73, and 75 (described below) that extend outward from each of the four sides of the main body 51 in plan view. The heat dissipation member 50 is bilaterally symmetrical.

The main body 51 has two circular light-transmitting holes (an example of a light-transmitting portion) 52 arranged side by side in the left-right direction, which allow light emitted from two LEDs 88 arranged inside the housing 11 to pass outside the housing 11, as described below. On the underside of the heat dissipation member 50, i.e., on the outer surface of the housing 11, the periphery of each light-transmitting hole 52 is formed as an enlarged diameter portion 53 that widens diagonally downward. In other words, the main body 51 has two roughly bowl-shaped portions that narrow upward when viewed from the bottom (see Figures 2, 9, and 11). Light emitted from the LEDs 88 and transmitted through the light-transmitting holes 52 can be diffused along the underside of the enlarged diameter portion 53.

The two enlarged diameter portions 53, arranged side by side in the left-right direction, are in contact with each other, and the two enlarged diameter portions 53, when connected together, are surrounded by a peripheral wall 54 that is generally rectangular in plan view. The peripheral wall 54 has a two-step shape. Specifically, as shown in FIG. 14 , the outer diameter of the lower portion of the peripheral wall 54 (the outer surface of the housing 11) is the housing insertion portion 55, which is equal to the inner diameter of the housing-side opening 25. On the other hand, the outer diameter of the upper portion of the peripheral wall 54 (the inner surface of the housing 11) is the holding member insertion portion 57, which is larger than the outer diameter of the housing insertion portion 55 and slightly smaller than the inner diameter of the holding member-side opening 35. The housing insertion portion 55 and the holding member insertion portion 57 are connected via a step portion 56 that projects outward from the housing insertion portion 55. With this configuration, the heat dissipation member 50 is configured so that the housing insertion portion 55 is inserted into the housing side opening 25, and the holding member insertion portion 57 is inserted into the holding member side opening 35 with the stepped portion 56 resting on the peripheral edge of the upper surface of the housing side opening 25 (see Figures 8, 9, and 11).

Two cylindrical board fastening portions 61 that rise upward are provided on the upper surface of the expanded diameter portion 53, on the left and right sides of the two light-transmitting holes 52, and inside the peripheral wall 54. As shown in Figure 11, the two board fastening portions 61 are slightly inclined so that their tips approach each other. Each board fastening portion 61 is configured with a large diameter portion 62 located on the base side and a small diameter portion 63 located on the tip side and with a smaller diameter than the large diameter portion 62. The axial length of the small diameter portion 63 is set to be equal to the thickness of the LED board 80, which will be described later.

Upright walls 64 extend upward from the two front and rear lateral walls 58 of the peripheral wall 54 that extend in the left-right direction. The upper ends of the vertical walls 64 are inclined outward (left-right) and upward from the left-right center of the lateral walls 58. In other words, the vertical walls 64 rise from the lateral walls 58 in the form of two flat right-angled triangles lined up in the left-right direction overall, with the upper ends forming a flat V-shape when viewed from the front. The inclination angle of the upper ends of the vertical walls 64 is set at an angle perpendicular to the extension direction of the axis of the board fastening portion 61. The upper ends of the vertical walls 64 and the upper end of the large-diameter portion 62 of the board fastening portion 61 are arranged on the same imaginary plane.

A vertical reinforcing wall 66 that protrudes upward and extends in the front-to-rear direction is provided in the left-to-right central portion of the main body 51, i.e., the portion where the two enlarged diameter portions 53 come into contact with each other (the boundary between the two enlarged diameter portions 53). Furthermore, horizontal reinforcing walls 67 that protrude upward from the upper end of the peripheral wall 54 of the main body 51 and extend in the left-to-right direction are provided at the front and rear ends of the main body 51 in the left-to-right central portion of the main body 51. The vertical reinforcing wall 66 and the two horizontal reinforcing walls 67 are connected to each other, and the reinforcing walls as a whole form an H-shape in plan view.

The main body 51 is provided with lateral positioning pieces 71 that extend outward in the left-right direction, continuing from the front-located upright wall 64 (referred to as the front upright wall 64F). The tip of the lateral positioning piece 71 is provided with a positioning hole 72 that penetrates vertically, and this positioning hole 72 is adapted to fit over the upper cover fastening portion 36 of the holding member 30 described above (see Figures 4 to 6).

Furthermore, of the two lateral reinforcing walls 67 of the main body 51, the front lateral reinforcing wall 67F, which is located at the front, has a front positioning piece 73 extending forward. The front positioning piece 73 is provided with a positioning hole 74 into which the first central positioning protrusion 38 of the holding member 30 described above is fitted.

Furthermore, of the two lateral reinforcing walls 67 of the main body 51, the rear lateral reinforcing wall 67R, which is located at the rear, has a rear positioning piece 75 extending rearward. The rear positioning piece 75 has a recess 76 cut out from its rear end toward the front, inside which the second central positioning protrusion 39 of the holding member 30 described above is fitted.

The heat dissipation member 50 is positioned relative to the holding member 30 by fitting the positioning holes 72 of the lateral positioning pieces 71 onto the upper cover fastening portions 36 of the holding member 30, fitting the first central positioning protrusion 38 into the positioning hole 74 of the front positioning piece 73, and fitting the second central positioning protrusion 39 into the recess 76 of the rear positioning piece 75. In this positioned state, as described above, the housing insertion portion 55 of the peripheral wall 54 of the heat dissipation member 50 is inserted into the housing-side opening 25 of the lower cover 22, the stepped portion 56 rests on the periphery of the housing-side opening 25, and the holding member insertion portion 57 is inserted into the holding member-side opening 35 of the holding member 30.

Two LED boards 80 (an example of a board, a first portion, and a second portion) are attached to the heat dissipation member 50, which is positioned relative to the holding member 30. As shown in Figures 10 and 11, the two LED boards 80 are attached to the heat dissipation member 50 side by side in the left-right direction, crossing each other to form a flat V-shape when viewed from the front. The two LED boards 80 are symmetrical to each other.

The LED board 80 will now be described in detail. The LED board 80 is made of aluminum or an aluminum alloy and, as shown in Figure 5, has a rectangular board main body 81. A fastening hole 82 is formed in the center of the board main body 81, penetrating the board surface, and the board fastening portion 61 of the heat dissipation member 50 described above passes through. The fastening hole 82 has an inner diameter that is smaller than the large diameter portion 62 of the board fastening portion 61 and is equal to or slightly larger than the small diameter portion 63. The LED board 80 is attached to the heat dissipation member 50 by fastening a bolt B with the small diameter portion 63 of the board fastening portion 61 passing through the fastening hole 82.

The front-to-rear dimension of the board main body 81 is slightly larger than the front-to-rear dimension of the peripheral wall 54 of the heat dissipation member 50. When the LED board 80 is attached to the heat dissipation member 50, the front end of the board main body 81 extends forward from the front standing wall 64F of the heat dissipation member 50 and contacts the upper surface (an example of a contact surface) 65F of the front standing wall 64F, thereby being supported from below (see Figures 9 and 10). Furthermore, the rear end of the board main body 81 extends slightly rearward from the rear standing wall 64R and contacts the upper surface (an example of a contact surface) 65R of the rear standing wall 64R, thereby being supported from below (see Figure 9).

As shown in Figures 5 and 6, when the LED board 80 is attached to the heat dissipation member 50, it has an inner extension 83 extending from the board main body 81 toward the center of the heat dissipation member 50 in the left-right direction, and an outer extension (an example of an extension) 85 extending from the board main body 81 toward the opposite side of the inner extension 83 (the outside of the heat dissipation member 50). The inner extension 83 is slightly smaller than the front-to-rear dimension of the board main body 81 and extends to a position slightly rearward from the front-to-rear center of the board main body 81. The outer extension 85 is approximately half the front-to-rear dimension of the board main body 81 and extends toward the rear end of the board main body 81 in the front-to-rear direction.

When the LED board 80 is attached to the heat dissipation member 50, the inner extension 83 is fitted between the front lateral reinforcing wall 67F and the rear lateral reinforcing wall 67R of the heat dissipation member 50. A groove-shaped positioning groove 84 is formed in the center of the tip of the inner extension 83 in the extension direction, and a positioning rib 77 protruding in the left-right direction from the center in the front-to-back direction of the vertical reinforcing portion of the heat dissipation member 50 is fitted into the positioning groove 84, thereby positioning the heat dissipation member 50 in the front-to-back direction.

When the LED board 80 is attached to the heat dissipation member 50, the outer extensions 85 extend diagonally upward and to the left and right (outward) from the ends of the main body 51 of the heat dissipation member 50. In other words, the outer extensions 85 extend away from the main body 51 along the plate surface of the main body 51. When the LED board 80 is housed within the housing 11, the tips of the outer extensions 85 abut against or are in close proximity to the two positioning walls 37 of the holding member 30.

When the LED board 80 is attached to the heat dissipation member 50, an LED 88 is mounted on the underside (an example of a mounting surface) 80L of the board main body 81 at a position facing the light-transmitting hole 52 of the heat dissipation member 50 (see Figure 11). As described above, the two LED boards 80 are arranged crossing each other to form a flat V-shape when viewed from the front, so that the top surface of each LED 88 faces downward and slightly outward (left and right).

The LEDs 88 in this embodiment are deep ultraviolet LEDs 88 that emit deep ultraviolet light (100 to 280 nm), which has a short wavelength among ultraviolet rays. The wavelength of the deep ultraviolet light emitted by these LEDs 88 is preferably in the range of 200 to 280 nm. Note that the LED board 80 may also be equipped with visible light LEDs that emit visible light in addition to the deep ultraviolet LEDs 88.

The LEDs 88 in this embodiment are top-illuminated LEDs 88 that, when mounted on the LED substrate 80, emit light from the end face (top face) opposite the LED substrate 80. The beam angle of these LEDs 88 is within a 120-degree range, centered on an axis perpendicular to the top face.

A cooling fan 90 is housed in the rear space R2 of the housing 11. The cooling fan 90 is arranged side by side with respect to the LED board 80 in a direction along the ceiling wall 13, and is fastened to the holding member 30 with bolts B. Note that "side by side" refers to an arrangement in which the plate surface of the LED board 80 and the cooling fan 90 do not overlap when the deep ultraviolet irradiation device 10 is viewed from above, and also includes cases in which the heights of the cooling fan 90 and the LED board 80 are misaligned in the vertical direction. In this embodiment, the cooling fan 90 is arranged slightly above the LED board 80.

The cooling fan 90 includes a fan body 91 that is generally flat and cylindrical. The fan body 91 is disposed within the rear space R2 of the housing 11 with a pair of bottom surfaces facing vertically, and its upper bottom surface (top surface) abuts against the rear ceiling wall 15 via a cushioning material (not shown) (see Figures 9 and 10). The cooling fan 90 is configured to suck air from below and blow it forward, and includes an air outlet 92 that protrudes forward in the shape of a flat rectangular tube. The air outlet 92 protrudes forward from the upper part of the fan body 91 so that its top surface is flush with the top surface of the fan body 91. In other words, the top surface of the air outlet 92 also abuts against the rear ceiling wall 15 via a cushioning material (not shown).

The air outlet 92 has a width dimension equal to the width dimension of the notch 34 in the partition wall 33 described above, and a height dimension equal to the height dimension of the notch 34, with its tip fitted into the notch 34. As shown in Figures 8 and 9, the air outlet 92 is positioned above and spaced apart from the upper surfaces (an example of opposite surfaces) 80U of the two LED boards 80. With this configuration, the space between the upper surfaces 80U of each LED board 80 and the ceiling surface 13L of the housing 11 forms an exhaust path 45 from the air outlet 92 of the cooling fan 90 to the exhaust port 18 of the housing 11.

In addition, a recessed portion 19 extends widthwise from rear to front at a rearward angle of inclination greater than the angle of inclination of the front ceiling wall 14, guiding the air blown out from the air outlet 92 of the cooling fan 90 and blowing it toward the upper surface 80U of the LED board 80. In this embodiment, the inclination angle of the recessed portion 19 is set at approximately 35 degrees relative to the holding plate portion 31.

Some of the air drawn into the rear space R2 of the housing 11 through the air intake port is drawn into the cooling fan 90. It then passes through the cooling fan 90 and is released forward from the air outlet 92 of the cooling fan 90, and is blown onto the upper surfaces 80U of the two LED boards 80 along the underside of the recessed portion 19, which slopes downward on the front side. The air then passes through the upper surfaces 80U of the LED boards 80 (exhaust path 45) and is exhausted to the outside of the housing 11 through the exhaust port 18.

In addition, some of the air drawn into the rear space R2 of the housing 11 through the air intake port flows forward along the inner wall (cover-side peripheral wall 16) of the housing 11, into the front space R1, and is exhausted to the outside of the housing 11 through the exhaust port 18. The outer extension portion 85 of the LED board 80 described above extends outward beyond both left-right ends of the partition wall 33, and is cooled by the air flowing from the rear space R2 into the front space R1 along the inner wall of the housing 11.

The deep ultraviolet irradiation device 10 of this embodiment described above can be used, for example, for the purpose of sterilizing the passenger compartment (an example of an interior space) of a vehicle such as a taxi. When the deep ultraviolet irradiation device 10 of this embodiment is attached to the ceiling of the passenger compartment (rear seat) of a vehicle such as a taxi, the two LEDs 88 are tilted outward from the horizontal at an angle of 15 degrees, allowing sterilization to be carried out by irradiating high positions on the side of the passenger compartment. Such deep ultraviolet irradiation can be carried out, for example, in a hangar after operation, or, if a separator with a deep ultraviolet-blocking film is installed between the front and rear seats, during operation, while waiting for passengers, or while the vehicle is being driven.

Next, the effects will be explained. The deep ultraviolet irradiation device 10 of this embodiment comprises an LED board 80 on whose underside 80L LEDs 88 are mounted, and a housing 11 that houses the LED board 80 and has light-transmitting holes 52 that allow light emitted from the LEDs 88 to pass to the outside. The housing 11 is provided with a heat dissipation member 50 made of aluminum (metal material) that is exposed on both the inside and outside of the housing 11, and the LED board 80 is attached in contact with the portion of the heat dissipation member 50 that is located on the inside of the housing 11.

With the above configuration, the heat of the LED board 80, which has risen in temperature due to heat generated by the LEDs 88, is easily transferred quickly to the heat dissipation member 50 of the housing 11 and dissipated to the outside, resulting in a deep ultraviolet irradiation device 10 with excellent heat dissipation properties. Furthermore, by configuring the heat dissipation member 50 to be exposed both inside and outside the housing 11, the deep ultraviolet irradiation device 10 can be made thinner and lighter than conventional configurations in which the heat dissipation member is provided inside the housing.

The LED board 80 is fastened to the heat dissipation member 50 with bolts B (fastening members). This configuration ensures that the LED board 80 is in direct contact with the heat dissipation member 50, improving heat dissipation.

The LED board 80 is housed within the housing 11 with its underside 80L facing the heat dissipation member 50. The heat dissipation member 50 has a board fastening portion 61 that rises toward the LED board 80 and to which a bolt B is fastened, and a standing wall 64 that rises toward the LED board 80 and has a contact surface 65 that extends along the underside 80L of the LED board 80. When the LED board 80 is fastened to the board fastening portion 61 with the bolt B, the underside 80L of the LED board 80 comes into contact with the contact surface 65.

With this configuration, the heat dissipation member 50, made of a metal material, is positioned in the portion of the housing 11 that is exposed to light emitted from the LEDs 88, preventing deterioration of the housing 11. Furthermore, even if a gap is formed between the LED board 80 and the surface of the heat dissipation member 50 that faces the LED board 80, the LED board 80 and the heat dissipation member 50 are configured to be in contact not only at the fastening portion but also between the underside 80L of the LED board 80 and the contact surface 65 of the standing wall 64, ensuring sufficient contact area between the two and thereby improving heat dissipation.

Cooling fans 90 for cooling the LED board 80 are housed within the housing 11, arranged side-by-side along the surface of the LED board 80, and the upper surface 80U of the LED board 80 is located in the exhaust path 45 from the air outlet 92 of the cooling fan 90 to the exhaust outlet 18 provided in the housing 11.

With this configuration, the LED board 80 and the cooling fan 90 are arranged side by side, which allows the deep ultraviolet irradiation device 10 to be made thinner than a configuration in which the LED board 80 and the cooling fan 90 are arranged on top of each other. Furthermore, not only can the LED board 80 be dissipated heat from the lower surface 80L by the heat dissipation member 50, but it can also be efficiently cooled from the upper surface 80U by the wind from the cooling fan 90.

It has two LED boards 80 on which LEDs 88 are mounted, and these two LED boards 80 extend in directions that intersect with each other. With this configuration, the area of the LED boards 80 can be made larger compared to a configuration in which the LED boards 80 are arranged flat, thereby improving cooling efficiency. In addition, the two LEDs 88 can be arranged to face in different directions. In other words, with the above configuration, the illumination range in the vertical direction can be expanded compared to a configuration in which the two LEDs 88 face in only one direction.

An outer extension 85 is provided on the periphery of the LED board 80, extending radially outward from the heat dissipation member 50 inside the housing 11. With this configuration, the outer extension 85 acts as a heat dissipation fin, allowing heat from the LED board 80 to be dissipated.

The heat dissipation member 50 and LED substrate 80 are made of aluminum. Because aluminum has high thermal conductivity, this configuration improves cooling efficiency.

<Other Embodiments>
The technology disclosed in this specification is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included in the technical scope.

(1) In the above embodiment, the heat dissipation section is provided by assembling an aluminum heat dissipation member 50 into a resin housing 11. However, the entire housing may be formed from metal, or a metal heat dissipation section may be integrally formed into the housing by insert molding.

(2) In the above embodiment, the LED board 80 is attached to the heat dissipation member 50 by fastening bolts B. However, the board may also be attached to the heat dissipation portion by adhesive or by pressing it with an elastic member such as a leaf spring.

(3) In the above embodiment, the mounting surface (lower surface 80L) of the LED board 80 is positioned facing the heat dissipation member 50, but the technical scope also includes a configuration in which the opposite surface of the board faces the heat dissipation portion.

(4) In the above embodiment, the cooling fans 90 are housed within the housing 11 in a state where they are arranged side by side along the surface of the LED board 80, but the cooling fans may also be configured to overlap the board.

(5) In the above embodiment, two LED boards 80 are arranged side by side so that they intersect with each other. However, the boards may be a single flat board or a single bent board.

(6) In the above embodiment, the deep ultraviolet irradiation device 10 was shown as an example of a light irradiation device, but the technology disclosed in this specification can also be applied to devices that irradiate light other than deep ultraviolet light, such as visible light.

(7) The light irradiation device is not limited to being installed on the ceiling of a vehicle, but can be installed in any location, such as on a side wall, floor, or inside a building.

(8) In the above embodiment, the LED substrate 80 and the heat dissipation member 50 are made of aluminum, but the substrate and heat dissipation member may be made of a metal other than aluminum. Furthermore, the substrate may be made of a material other than metal.

10: Deep UV irradiation device (light irradiation device), 11: Housing, 12: Upper cover (housing), 18: Exhaust port, 22: Lower cover (housing), 30: Retaining member, 45: Exhaust path, 50: Heat dissipation member (heat dissipation portion), 52: Light-transmitting hole (light-transmitting portion), 61: Board fastening portion (fastening portion), 64: Standing wall, 65: Upper surface (contact surface), 80: LED board (board), 80L: Lower surface (mounting surface), 80U: Upper surface (opposite surface), 82: Fastening hole, 85: Outer extension portion (extension portion), 88: Deep UV LED, 90: Cooling fan, 92: Air outlet

Claims (7)

a substrate having an irradiation element mounted on a mounting surface;
a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein;
The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing,
The substrate is attached to a portion of the heat dissipation unit located inside the housing in such a manner that the mounting surface faces and contacts the heat dissipation unit . a substrate having an irradiation element mounted on a mounting surface;
a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein;
The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing,
the substrate is attached in contact with a portion of the heat dissipation unit located inside the housing,
the substrate is fastened to the heat dissipation portion by a fastening member,
the substrate is accommodated in the housing with the mounting surface facing the heat dissipation portion,
the heat dissipation portion has a fastening portion that rises toward the board and to which a fastening member is fastened, and a standing wall that rises toward the board and has a contact surface that extends along the mounting surface,
A light irradiation device in which, when the substrate is fastened to the fastened portion by the fastening member, the mounting surface is in contact with the contact surface . a substrate having an irradiation element mounted on a mounting surface;
a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein;
The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing,
the substrate is attached in contact with a portion of the heat dissipation unit located inside the housing,
cooling fans for cooling the board are accommodated in the housing and arranged side by side in a direction along the board surface,
The substrate is located in an exhaust path from an air outlet of the cooling fan to an exhaust port provided in the housing . a substrate having an irradiation element mounted on a mounting surface;
a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein;
The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing,
the substrate is attached in contact with a portion of the heat dissipation unit located inside the housing,
the substrate mounts the first and second illumination elements and includes a first portion that mounts the first illumination element and a second portion that mounts the second illumination element;
The light irradiation device , wherein the first portion and the second portion extend in directions intersecting each other . a substrate having an irradiation element mounted on a mounting surface;
a housing having a light-transmitting portion that transmits light emitted from the illumination element to the outside and that accommodates the substrate therein;
The housing is provided with a heat dissipation portion made of a metal material and exposed to the inside and outside of the housing,
the substrate is attached in contact with a portion of the heat dissipation unit located inside the housing,
The light irradiation device has an extension provided on the peripheral edge of the substrate, the extension extending outside the heat dissipation unit inside the housing . The light irradiation device according to claim 1 , wherein the heat dissipation portion is made of aluminum. The light irradiation device according to claim 1 , wherein the substrate is made of aluminum.