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JP7782130B2 - Package of electrode plate for plasma etcher and packaging method for the package of electrode plate for plasma etcher - Google Patents
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JP7782130B2 - Package of electrode plate for plasma etcher and packaging method for the package of electrode plate for plasma etcher - Google Patents

Package of electrode plate for plasma etcher and packaging method for the package of electrode plate for plasma etcher

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Publication number
JP7782130B2
JP7782130B2 JP2021014909A JP2021014909A JP7782130B2 JP 7782130 B2 JP7782130 B2 JP 7782130B2 JP 2021014909 A JP2021014909 A JP 2021014909A JP 2021014909 A JP2021014909 A JP 2021014909A JP 7782130 B2 JP7782130 B2 JP 7782130B2
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Prior art keywords
mirror
resin film
finished
bag
inner resin
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JP2021014909A
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JP2022118410A (en
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和生 廣瀬
佑樹 松澤
一郎 塩野
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2021014909A priority Critical patent/JP7782130B2/en
Priority to PCT/JP2022/003011 priority patent/WO2022168718A1/en
Priority to TW111103564A priority patent/TW202245163A/en
Publication of JP2022118410A publication Critical patent/JP2022118410A/en
Priority to JP2025161323A priority patent/JP2025178379A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B31/00Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
    • B65B31/02Filling, closing, or filling and closing, containers or wrappers in chambers maintained under vacuum or superatmospheric pressure or containing a special atmosphere, e.g. of inert gas
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/02Wrappers or flexible covers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • B65D65/40Applications of laminates for particular packaging purposes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Vacuum Packaging (AREA)
  • Packages (AREA)
  • Wrappers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)

Description

本発明は、高清浄度が要求されるプラズマエッチャー用の電極板や半導体向けスパッタリングターゲット等の鏡面加工体が梱包された鏡面加工体の梱包体及び鏡面加工体の梱包体の梱包方法に関する。 The present invention relates to a package containing mirror-finished objects, such as electrode plates for plasma etchers and sputtering targets for semiconductors, which require high levels of cleanliness, and a packaging method for the package of mirror-finished objects.

従来、プラズマエッチャー用の電極板が知られている。このような電極板は、鏡面加工がなされた鏡面(鏡面加工面)に異物が付着した状態で使用すると不具合が生じるため、予め使用する前に鏡面加工面を洗浄して異物を除去している。このような異物の付着を抑制するため、例えば、鏡面加工体を袋体内に真空状態で密封して搬送している。しかしながら、鏡面加工体を真空状態で密封した状態で搬送しても、依然として異物の発生を抑制できていないため、さらなる解決方法が模索されている。 Electrode plates for plasma etchers are known. Such electrode plates can cause problems if used with foreign matter adhering to the mirror-finished surface (mirror-finished surface). Therefore, the mirror-finished surface is cleaned to remove the foreign matter before use. To prevent such foreign matter from adhering, for example, the mirror-finished object is transported sealed in a vacuum bag. However, transporting the mirror-finished object sealed in a vacuum bag still does not prevent the generation of foreign matter, so further solutions are being sought.

例えば、技術分野が異なるものの、鏡面加工面を有する半導体ウェーハ(以下、ウェーハという)では、以下のような取り組みがなされている。
このウェーハの搬送等での取扱は、単一のプラスチック容器に複数枚のウェーハを収納し、この容器を複数個、各容器の間にクッション材を介在させて箱詰めして梱包し、その箱を搬送していた。このため、梱包工程が煩雑さを伴うとともに、複数の収納容器等が必要であり、コスト的にも無駄が多かった。そして、梱包を解く際にも、これらの工程において付着したダストや、容器内で付着した汚染物を除去するために、超純水による洗浄処理が必要であった。
For example, although the technical field is different, the following efforts have been made in the field of semiconductor wafers (hereinafter referred to as wafers) having mirror-finished surfaces.
To handle these wafers, multiple wafers were placed in a single plastic container, and multiple such containers were packed in a box with cushioning material between each container, and then the box was transported. This made the packaging process complicated and required multiple storage containers, which was costly and wasteful. Furthermore, when unpacking the wafers, a cleaning process with ultrapure water was required to remove dust that had accumulated during these processes and contaminants that had accumulated inside the container.

これらの難点を解決するために、半導体ウェーハと超純水(DIW)の氷から作られた氷板とを交互に積層配置し、容器に収納する梱包方法や、特許文献1及び2に記載の方法が知られている。この特許文献1に記載の方法では、複数枚の半導体ウェーハを超純水(イオン交換とフィルタ通過だけを行わせた純水をさらに逆浸透圧法等により純度を高めたもの)中に所定の間隔をおいて配置した状態で凍結させた後に容器に収納する梱包方法が提案されている。また、特許文献2に記載の方法では、鏡面研磨後の半導体ウェーハの全表面をポリエチレングリコールWAXで被膜している。 To overcome these difficulties, known packaging methods include stacking semiconductor wafers and ice sheets made from ultrapure water (DIW) ice alternately and storing them in a container, as well as the methods described in Patent Documents 1 and 2. The method described in Patent Document 1 proposes a packaging method in which multiple semiconductor wafers are frozen in ultrapure water (pure water that has been subjected to ion exchange and filtering, and then further purified using methods such as reverse osmosis) while spaced at a predetermined distance from one another, and then stored in a container. Furthermore, the method described in Patent Document 2 involves coating the entire surface of mirror-polished semiconductor wafers with polyethylene glycol wax.

特開平4-128173号公報Japanese Patent Application Publication No. 4-128173 特開平6-204315号公報Japanese Patent Application Publication No. 6-204315

上述した特許文献1や2に記載の方法は、梱包方法が煩雑であり、開梱も容易ではないことから、結局、鏡面加工体の梱包方法として、袋体内に真空状態で密封した状態で梱包することが一般的になっている。しかしながら、袋体が樹脂フィルムにより形成されている場合、樹脂フィルムで梱包された梱包体を開梱すると目視で鏡面加工面にシミ、曇り、粒子状白点等の微小異物が生じる。このため、樹脂フィルムで梱包するような簡易な梱包方法であっても鏡面加工体の鏡面加工面に微小異物が生じることを抑制できる鏡面加工体の梱包方法が望まれている。 The methods described in Patent Documents 1 and 2 above involve complicated packaging methods and are not easy to unpack, so the general practice for packaging mirror-finished objects is to pack them in a vacuum-sealed bag. However, if the bag is made of resin film, tiny foreign matter such as stains, cloudiness, and white particles will be visible on the mirror-finished surface when the packaged object is opened. For this reason, there is a demand for a packaging method for mirror-finished objects that can prevent tiny foreign matter from appearing on the mirror-finished surface of the mirror-finished object, even when using a simple packaging method such as packaging in resin film.

本発明は、このような事情に鑑みてなされたもので、鏡面加工体の鏡面加工面に微小異物が生じることを抑制できる鏡面加工体の梱包体及び鏡面加工体の梱包方法を提供することを目的とする。 The present invention was made in consideration of these circumstances, and aims to provide a package for a mirror-finished object and a packaging method for a mirror-finished object that can prevent the occurrence of minute foreign matter on the mirror-finished surface of the mirror-finished object.

本発明の鏡面加工体の梱包体は、鏡面加工面を有する鏡面加工体が真空状態で樹脂フィルム製の袋体に密封された梱包体であって、前記鏡面加工面には、前記袋体を構成する樹脂フィルムが接触しており、前記樹脂フィルムの結晶化度は、40%以上60%以下である。 The packaged product of the present invention for a mirror-finished object is a packaged product in which a mirror-finished object having a mirror-finished surface is sealed in a bag made of resin film under a vacuum, the mirror-finished surface being in contact with the resin film that constitutes the bag, and the crystallinity of the resin film is 40% or more and 60% or less.

本発明の樹脂フィルムの結晶化度が40%未満であると、鏡面加工面に接触する樹脂フィルムがやわらか過ぎて、アモルファス状の分子(例えば、樹脂フィルムがポリエチレンからなる場合にはPE分子)が鏡面加工面にこびりついて微小異物となる。一方、樹脂フィルムの結晶化度が60%を超えると、鏡面加工面に接触する樹脂フィルムが硬くてもろくなることから、袋体内に鏡面加工体を収納する際に樹脂フィルムに接触すると、一部が剥がれて微小異物となる。これに対し、本発明では、樹脂フィルムの結晶化度が40%以上60%以下と適切な範囲に設定されているので、鏡面加工体の鏡面加工面に接触する樹脂フィルム由来の微小異物が生じることを抑制できる。 If the crystallinity of the resin film of the present invention is less than 40%, the resin film in contact with the mirror-finished surface will be too soft, and amorphous molecules (for example, PE molecules if the resin film is made of polyethylene) will adhere to the mirror-finished surface and become micro-foreign matter. On the other hand, if the crystallinity of the resin film exceeds 60%, the resin film in contact with the mirror-finished surface will become hard and brittle, and when it comes into contact with the resin film when storing a mirror-finished object inside the bag, a portion of it will peel off and become micro-foreign matter. In contrast, in the present invention, the crystallinity of the resin film is set within an appropriate range of 40% to 60%, which prevents the generation of micro-foreign matter originating from the resin film in contact with the mirror-finished surface of the mirror-finished object.

本発明の鏡面加工体の梱包体の好ましい態様としては、前記樹脂フィルムの結晶化度は、44%以上54%以下であるとよい。 In a preferred embodiment of the packaging for mirror-finished products of the present invention, the crystallinity of the resin film is 44% or more and 54% or less.

本発明の鏡面加工体の梱包体は、鏡面加工面を有する鏡面加工体が真空状態で袋体に密封された梱包体であって、前記鏡面加工面と前記袋体の内面との間に前記鏡面加工面を被覆する内側樹脂フィルムが設けられ、前記内側樹脂フィルムの周縁部は、前記鏡面加工体の周縁からはみ出すように配置されている。 The packaged product for a mirror-finished object of the present invention is a packaged product in which a mirror-finished object having a mirror-finished surface is sealed in a bag under vacuum, with an inner resin film covering the mirror-finished surface disposed between the mirror-finished surface and the inner surface of the bag, and the peripheral portion of the inner resin film being positioned so as to extend beyond the peripheral edge of the mirror-finished object.

本発明では、内側樹脂フィルムで鏡面加工面を被覆した状態の鏡面加工体を袋体内に収納する際に、内側樹脂フィルムの周縁部が鏡面加工体の周縁からはみ出すように配置されているので、鏡面加工体のエッジが袋体に直接接触して微小異物が発生することを抑制できる。また、鏡面加工体が袋体と内側樹脂フィルムとの2層構造で保護されるので、鏡面加工体をより確実に保護できる。 In this invention, when a mirror-finished object with its mirror-finished surface covered with an inner resin film is stored in a bag, the peripheral edge of the inner resin film is positioned to extend beyond the peripheral edge of the mirror-finished object, preventing the edge of the mirror-finished object from coming into direct contact with the bag and generating minute foreign matter. Furthermore, because the mirror-finished object is protected by a two-layer structure consisting of the bag and the inner resin film, the mirror-finished object can be more reliably protected.

本発明の鏡面加工体の梱包体の好ましい態様としては、前記内側樹脂フィルムの前記袋体側の面と前記袋体の内面との第1摩擦係数は、前記鏡面加工面と前記内側樹脂フィルムの前記鏡面加工面に接触する側の面との第2摩擦係数より小さい。 In a preferred embodiment of the mirror-finished package of the present invention, the first coefficient of friction between the surface of the inner resin film facing the bag body and the inner surface of the bag body is smaller than the second coefficient of friction between the mirror-finished surface and the surface of the inner resin film that comes into contact with the mirror-finished surface.

上記態様では、第2摩擦係数が第1摩擦係数より大きいので、内側樹脂フィルムで鏡面加工面を被覆した鏡面加工体を袋体内に収容する際、及び袋体内を真空引きする際に、鏡面加工面と内側樹脂フィルムとの間では相対移動が生じず、内側樹脂フィルムと袋体の内面との間で相対移動する。つまり、鏡面加工体と内側樹脂フィルムとが擦れることがないので、鏡面加工体と内側樹脂フィルムとが擦れることにより生じる微小異物の発生を抑制できる。
なお、第1摩擦係数が第2摩擦係数より大きいと、収容時や真空引き時に内側樹脂フィルムと袋体の内面とが密着した状態となり、鏡面加工体と内側樹脂フィルムとの間にずれが生じて鏡面加工面と内側樹脂フィルムとが擦れることにより微小異物が発生する可能性がある。
In the above-described embodiment, since the second friction coefficient is greater than the first friction coefficient, when a mirror-finished object whose mirror-finished surface is covered with an inner resin film is placed in a bag and when the bag is evacuated, relative movement does not occur between the mirror-finished surface and the inner resin film, but occurs between the inner resin film and the inner surface of the bag. In other words, since there is no rubbing between the mirror-finished object and the inner resin film, the generation of minute foreign matter caused by rubbing between the mirror-finished object and the inner resin film can be suppressed.
Furthermore, if the first friction coefficient is greater than the second friction coefficient, the inner resin film and the inner surface of the bag body will be in close contact with each other when the bag is stored or evacuated, which may cause a misalignment between the mirror-finished body and the inner resin film, resulting in the mirror-finished surface rubbing against the inner resin film and the generation of tiny foreign matter.

本発明の鏡面加工体の梱包体の好ましい態様としては、前記第2摩擦係数/前記第1摩擦係数が1.2以上であるとよい。
上記態様では、内側樹脂フィルムと鏡面加工面との間よりも、内側樹脂フィルムと袋体との間でより滑りやすくなるので、収容時や真空引き時に鏡面加工体と内側樹脂フィルムとが擦れることにより生じる微小異物の発生を確実に抑制できる。
In a preferred embodiment of the package of mirror-finished objects of the present invention, the second friction coefficient/first friction coefficient is 1.2 or more.
In the above embodiment, the inner resin film and the bag body are more easily slippery than the inner resin film and the mirror-finished surface, so that the generation of minute foreign matter caused by friction between the mirror-finished body and the inner resin film during storage or vacuuming can be reliably suppressed.

本発明の鏡面加工体の梱包体の好ましい態様としては、前記内側樹脂フィルムの結晶化度は、40%以上60%以下であるとよい。
上記態様では、内側樹脂フィルムの結晶化度が40%以上60%以下と適切な範囲に設定されているので、鏡面加工体の鏡面加工面に接触する内側樹脂フィルム由来の微小異物が生じることを抑制できる。
In a preferred embodiment of the package of mirror-finished products of the present invention, the crystallinity of the inner resin film is 40% or more and 60% or less.
In the above embodiment, the crystallinity of the inner resin film is set to an appropriate range of 40% or more and 60% or less, thereby preventing the generation of minute foreign matter originating from the inner resin film that comes into contact with the mirror-finished surface of the mirror-finished body.

本発明の鏡面加工体の梱包体の梱包方法は、鏡面加工面を有する鏡面加工体を結晶化度が40%以上60%以下の樹脂フィルム製の袋体内に配置し、前記鏡面加工面に前記袋体を構成する樹脂フィルムを接触させた状態で真空引きして密封する。 The packaging method for a packaged mirror-finished object of the present invention involves placing a mirror-finished object having a mirror-finished surface inside a bag made of a resin film with a crystallinity of 40% to 60%, and then vacuum sealing the bag with the resin film constituting the bag in contact with the mirror-finished surface.

本発明の鏡面加工体の梱包体の梱包方法は、鏡面加工面を有する鏡面加工体の前記鏡面加工面を内側樹脂フィルムで被覆した状態で、袋体内に収納して密封する。 The packaging method for a packaged mirror-finished object of the present invention involves enclosing a mirror-finished object having a mirror-finished surface in a bag with the mirror-finished surface covered with an inner resin film and sealing the bag.

本発明によれば、簡易な方法で鏡面加工体の鏡面加工面に微小異物が生じることを抑制できる。 This invention provides a simple method for preventing minute foreign particles from appearing on the mirror-finished surface of a mirror-finished object.

本発明の第1実施形態に係る鏡面加工体の梱包体を示す平面図である。1 is a plan view showing a package of mirror-finished objects according to a first embodiment of the present invention; 上記第1実施形態の鏡面加工体を示す斜視図である。FIG. 2 is a perspective view showing the mirror-finished body of the first embodiment. 上記第1実施形態の鏡面加工体の梱包方法を示す概略図である。3 is a schematic diagram showing a packaging method for the mirror-finished body of the first embodiment. FIG. 本発明の第2実施形態に係る鏡面加工体の梱包体を示す平面図である。FIG. 10 is a plan view showing a package of mirror-finished objects according to a second embodiment of the present invention. 上記第2実施形態に係る鏡面加工体の梱包方法における内側樹脂フィルムを配置する様子を示す概略図である。10 is a schematic diagram showing the arrangement of an inner resin film in the packaging method for the mirror-finished body according to the second embodiment. FIG. 上記第2実施形態に係る鏡面加工体の梱包方法における袋体内に内側樹脂フィルムにより挟持された鏡面加工体を収納する様子を示す概略図である。10 is a schematic diagram showing how a mirror-finished body sandwiched between inner resin films is stored in a bag body in the packaging method for a mirror-finished body according to the second embodiment. FIG. 樹脂フィルム1の上から樹脂フィルム2を擦りつけた場合のシリコン板の擦り付け範囲を示す画像である。1 is an image showing the rubbing range of a silicon plate when a resin film 2 is rubbed on top of a resin film 1. 樹脂フィルム1を用いることなく樹脂フィルム2を擦りつけたシリコン板の上記範囲を示す画像である。1 is an image showing the above-mentioned area of a silicon plate onto which a resin film 2 is rubbed without using a resin film 1. スマッジ及びパーティクルの検出条件を示すための図である。FIG. 10 is a diagram showing detection conditions for smudges and particles.

以下、本発明の鏡面加工体の梱包体及び鏡面加工体の梱包体の梱包方法の各実施形態について図面を用いて説明する。 Each embodiment of the package for a mirror-finished object and the packaging method for the package for a mirror-finished object of the present invention will be described below with reference to the drawings.

[第1実施形態]
本実施形態の鏡面加工体10の梱包体30(以下、梱包体30という)は、図1に示すように、鏡面加工面11を有する鏡面加工体10が真空状態で樹脂フィルム製の袋体20に密封された梱包体である。この鏡面加工体10は、例えば、Si(シリコン)や金属間化合物、セラミックスにより形成されるプラズマエッチャー用の電極板であり、図2に示すように、円板状に形成されている。鏡面加工面11は、鏡面加工体10の表面側及び裏面側のそれぞれに形成されている。
例えば、鏡面加工体10の直径が203mm~530mm、厚さが3mm~19mmとされ、鏡面加工面11の算術平均粗さRaが0.01~0.2とされている。
[First embodiment]
As shown in Fig. 1, a package 30 for a mirror-finished body 10 of this embodiment (hereinafter referred to as package 30) is a package in which the mirror-finished body 10 having a mirror-finished surface 11 is sealed in a bag 20 made of resin film under a vacuum. This mirror-finished body 10 is an electrode plate for a plasma etcher made of, for example, Si (silicon), an intermetallic compound, or ceramics, and is formed in a disk shape as shown in Fig. 2. The mirror-finished surface 11 is formed on both the front and back sides of the mirror-finished body 10.
For example, the diameter of the mirror-finished body 10 is 203 mm to 530 mm, the thickness is 3 mm to 19 mm, and the arithmetic mean roughness Ra of the mirror-finished surface 11 is 0.01 to 0.2.

袋体20は、図1に示すように、平面視で鏡面加工体10の鏡面加工面11よりも大きく形成され、内部に鏡面加工体10を収容した状態で密封している。このような袋体20を構成する樹脂フィルムは、例えば、ポリエチレン等により構成される。この場合、酸化防止剤や滑剤等の添加剤を含まない無添加タイプの樹脂を用いるのが好ましい。また、袋体20を構成する樹脂フィルムは、インフレーション成形等によってフィルム状に成形される。
例えば、袋体20は、その平面サイズが100mm~700mm×150mm~800mm、厚さが70μm~130μmmmとされている。
As shown in Fig. 1, the bag 20 is formed larger than the mirror-finished surface 11 of the mirror-finished body 10 in a plan view, and seals the mirror-finished body 10 inside. The resin film constituting the bag 20 is made of, for example, polyethylene. In this case, it is preferable to use an additive-free resin that does not contain additives such as antioxidants or lubricants. The resin film constituting the bag 20 is formed into a film shape by inflation molding or the like.
For example, the bag body 20 has a planar size of 100 mm to 700 mm x 150 mm to 800 mm and a thickness of 70 μm to 130 μm.

また、袋体20を構成する樹脂フィルムの結晶化度は、40%以上60%以下に設定されている。この結晶化度は、結晶部分の割合であり、樹脂フィルムの物性、例えば機械的強度、密度、耐熱性、透明性などを表す尺度でもある。本実施形態では、袋体20を構成する樹脂フィルムの結晶化度は、40%以上60%以下と適切な範囲に設定されている。この結晶化度は、44%以上54%以下であることが好ましい。また、この樹脂フィルムの結晶化度は、45%以上51%以下であることがより好ましい。
なお、袋体20を構成する樹脂フィルムの結晶化度が40%未満であると、鏡面加工面11に接触する樹脂フィルムがやわらか過ぎて、アモルファス状のPE分子が鏡面加工面11にこびりついて微小異物となる。一方、樹脂フィルムの結晶化度が60%を超えると、樹脂フィルムが硬くてもろくなるので、擦れると一部が剥がれて微小異物となる。
The crystallinity of the resin film constituting the bag body 20 is set to 40% or more and 60% or less. This crystallinity is the proportion of crystalline portions and is also a measure of the physical properties of the resin film, such as mechanical strength, density, heat resistance, and transparency. In this embodiment, the crystallinity of the resin film constituting the bag body 20 is set to an appropriate range of 40% or more and 60% or less. This crystallinity is preferably 44% or more and 54% or less. Furthermore, the crystallinity of this resin film is more preferably 45% or more and 51% or less.
If the crystallinity of the resin film constituting the bag body 20 is less than 40%, the resin film that comes into contact with the mirror-finished surface 11 will be too soft, and amorphous PE molecules will stick to the mirror-finished surface 11 and become minute foreign matter. On the other hand, if the crystallinity of the resin film exceeds 60%, the resin film will be hard and brittle, and when rubbed, parts will peel off and become minute foreign matter.

[鏡面加工体の梱包体の梱包方法]
鏡面加工体10の梱包体30は、結晶化度が40%以上60%以下の樹脂フィルム製の袋体20を準備し、鏡面加工体10を袋体20内に収納して密封することにより梱包される。具体的には、図3に示すように、袋体20を開口させ、該開口から鏡面加工体10を収納する。この際、鏡面加工体10のエッジが袋体20の内面に接触すると微小異物が発生する可能性があるため、できるだけ袋体20の内面に接触することがないように袋体20内に収納する。そして、真空梱包装置によって袋体20内の空気を真空引きして、袋体20を封止して密封状態にする。これにより、鏡面加工体10が袋体20により梱包され、鏡面加工体10の梱包体30となる。
[Packaging method for mirror-finished product]
The package 30 of the mirror-finished object 10 is packaged by preparing a bag 20 made of a resin film with a crystallinity of 40% to 60%, and placing and sealing the mirror-finished object 10 inside the bag 20. Specifically, as shown in FIG. 3 , the bag 20 is opened and the mirror-finished object 10 is placed inside the bag 20. If the edge of the mirror-finished object 10 comes into contact with the inner surface of the bag 20, there is a possibility of generating minute foreign matter. Therefore, the mirror-finished object 10 is placed inside the bag 20 so as to avoid contact with the inner surface of the bag 20 as much as possible. Then, the air inside the bag 20 is evacuated using a vacuum packaging device, and the bag 20 is sealed to create a hermetic state. The mirror-finished object 10 is thus packaged in the bag 20, forming the package 30 of the mirror-finished object 10.

本実施形態の梱包体30は、袋体20を形成する樹脂フィルムの結晶化度が40%以上60%以下と適切な範囲に設定されているので、鏡面加工体10の鏡面加工面11に接触する樹脂フィルム由来の微小異物が生じることを抑制できる。また、本実施形態の梱包体30は、袋体20を形成する樹脂フィルムの結晶化度を調整するだけで微小異物の発生を抑制できるので、梱包コストを低減できる。
例えば、鏡面加工体10がプラズマエッチャーの電極板やスパッタリングターゲットである場合には、これらを袋から出して、真空チャンバー内に設置し、真空排気ののちに、鏡面加工体10に電圧を印加してプラズマを発生させることが一般的である。この際、鏡面加工面11に微小異物が付着していると、この微小異物を起点として、異常放電が発生し、プラズマエッチャーでは処理基板に、スパッタリングターゲットでは成膜基板に、それぞれ異物が飛散する。これに対し、本実施形態では、鏡面加工体10の鏡面加工面11に微小異物が生じることを抑制できるので、後工程における微小異物を起点とする異常放電を抑制して、処理基板や成膜基板に異物が飛散することを抑制できる。
In the packaging body 30 of this embodiment, the crystallinity of the resin film forming the bag body 20 is set to an appropriate range of 40% to 60%, which can prevent the generation of minute foreign matter originating from the resin film that comes into contact with the mirror-finished surface 11 of the mirror-finished body 10. Furthermore, in the packaging body 30 of this embodiment, the generation of minute foreign matter can be prevented simply by adjusting the crystallinity of the resin film forming the bag body 20, thereby reducing packaging costs.
For example, when the mirror-finished object 10 is an electrode plate or a sputtering target for a plasma etcher, it is typically removed from a bag, placed in a vacuum chamber, evacuated, and then a voltage is applied to the mirror-finished object 10 to generate plasma. If minute foreign matter adheres to the mirror-finished surface 11, this minute foreign matter will cause an abnormal discharge to occur, scattering the foreign matter onto the processing substrate in the plasma etcher or onto the deposition substrate in the sputtering target. In contrast, this embodiment can prevent minute foreign matter from being generated on the mirror-finished surface 11 of the mirror-finished object 10, thereby suppressing abnormal discharge originating from the minute foreign matter in subsequent processes and preventing foreign matter from scattering onto the processing substrate or deposition substrate.

[第2実施形態]
次に、第2実施形態に係る鏡面加工体の梱包体について図面を用いて説明する。なお、以下の説明では、第1実施形態と同一又は略同じ構成については同じ番号を付し、説明を省略又は簡略化して説明する。
本実施形態の鏡面加工体10の梱包体31(以下、梱包体31という)は、図4に示すように、鏡面加工面11を有する鏡面加工体10が真空状態で袋体21に密封された梱包体であり、鏡面加工体10の鏡面加工面11と袋体21との間には、内側樹脂フィルム40が設けられている。
Second Embodiment
Next, a package of a mirror-finished product according to a second embodiment will be described with reference to the drawings. In the following description, the same or substantially the same components as those in the first embodiment will be denoted by the same reference numerals, and the description will be omitted or simplified.
The packaging body 31 (hereinafter referred to as packaging body 31) for the mirror-finished body 10 of this embodiment is a packaging body in which the mirror-finished body 10 having a mirror-finished surface 11 is sealed in a bag body 21 under vacuum, as shown in Figure 4, and an inner resin film 40 is provided between the mirror-finished surface 11 of the mirror-finished body 10 and the bag body 21.

袋体21は、図4に示すように、平面視で鏡面加工体10の鏡面加工面11や内側樹脂フィルム40よりも大きく形成され、内部に鏡面加工体10及び内側樹脂フィルム40を収容した状態で密封している。なお、本実施形態では、内側樹脂フィルム40が設けられているため、袋体21は、第1実施形態と同様にポリエチレン等の樹脂フィルムにより形成されていてもよいし、その他の素材により形成されていてもよい。この袋体21は、例えば、その平面サイズが100mm~700mm×150mm~800mm、厚さが70μm~130μmとされている。 As shown in FIG. 4, the bag body 21 is formed larger than the mirror-finished surface 11 of the mirror-finished body 10 and the inner resin film 40 in a plan view, and seals the mirror-finished body 10 and inner resin film 40 inside. In this embodiment, since the inner resin film 40 is provided, the bag body 21 may be formed from a resin film such as polyethylene, as in the first embodiment, or from other materials. The bag body 21 has, for example, a planar size of 100 mm to 700 mm x 150 mm to 800 mm and a thickness of 70 μm to 130 μm.

袋体21内に鏡面加工体10とともに収容される内側樹脂フィルム40は、図4に示すように、平面視で鏡面加工体10の鏡面加工面11より若干大きい円形状に形成され、鏡面加工体10の鏡面加工面11の全領域を被覆している。また、袋体21は真空状態で密封されているため、内側樹脂フィルム40は、袋体21内において鏡面加工面11及び袋体21の内面のそれぞれに接触した状態で配置される。このような内側樹脂フィルム40は、袋体21と同材料(例えば、ポリプロピレン等)により構成され、酸化防止剤や滑剤等の添加剤を含まない無添加タイプの樹脂を用いるのが好ましい。また、内側樹脂フィルム40は、インフレーション成形等によってフィルム状に成形される。 As shown in FIG. 4, the inner resin film 40 housed in the bag 21 together with the mirror-finished body 10 is formed in a circular shape that is slightly larger than the mirror-finished surface 11 of the mirror-finished body 10 in a plan view, and covers the entire area of the mirror-finished surface 11 of the mirror-finished body 10. Furthermore, because the bag 21 is sealed under a vacuum, the inner resin film 40 is disposed within the bag 21 in contact with both the mirror-finished surface 11 and the inner surface of the bag 21. This inner resin film 40 is preferably made of the same material as the bag 21 (e.g., polypropylene), and is preferably an additive-free resin that does not contain additives such as antioxidants or lubricants. Furthermore, the inner resin film 40 is formed into a film by inflation molding or the like.

また、内側樹脂フィルム40の直径は、鏡面加工体10の直径203mm~530mmよりも若干大きく、例えば、204.5mm~539.5mmに設定され、その厚さが70μm~130μmに設定されている。この内側樹脂フィルム40は、本実施形態では、鏡面加工面11の全領域を覆う形状とされており、鏡面加工体10を袋体21内に収納する際にエッジが袋体に接触することを抑制するため、鏡面加工面11の直径よりも大きく形成され、内側樹脂フィルム40の周縁部が鏡面加工体10の周縁からはみ出すように配置される必要がある。一方、内側樹脂フィルム40の周縁部が鏡面加工体10の周縁から大きくはみ出していると、真空状態で密封された際に鏡面加工体10のエッジ近傍ではみ出し部分にシワが生じて鏡面加工体10のエッジや袋体21の内面と擦れが生じる可能性がある。このため、内側樹脂フィルム40の鏡面加工面11の周縁に対するはみ出し量は、鏡面加工体10の厚さより小さいことが好ましく、例えば、鏡面加工体10の厚みの半分以下であるとよい。 The diameter of the inner resin film 40 is slightly larger than the diameter of the mirror-finished body 10, which is 203 mm to 530 mm, and is set to, for example, 204.5 mm to 539.5 mm, with a thickness of 70 μm to 130 μm. In this embodiment, the inner resin film 40 is shaped to cover the entire area of the mirror-finished surface 11. To prevent the edge of the mirror-finished body 10 from contacting the bag body when storing the mirror-finished body 10 inside the bag body 21, the inner resin film 40 must be formed larger than the diameter of the mirror-finished surface 11 and positioned so that the peripheral edge of the inner resin film 40 extends beyond the peripheral edge of the mirror-finished body 10. On the other hand, if the peripheral edge of the inner resin film 40 extends significantly beyond the peripheral edge of the mirror-finished body 10, wrinkles may form near the edge of the mirror-finished body 10 when sealed in a vacuum, potentially causing friction with the edge of the mirror-finished body 10 or the inner surface of the bag body 21. For this reason, it is preferable that the amount of protrusion of the inner resin film 40 from the peripheral edge of the mirror-finished surface 11 be smaller than the thickness of the mirror-finished body 10, for example, less than half the thickness of the mirror-finished body 10.

また、内側樹脂フィルム40の結晶化度は、40%以上60%以下に設定されている。このため、鏡面加工体10の鏡面加工面11に接触する樹脂フィルム由来の微小異物が生じることを抑制できる。この結晶化度は、44%以上54%以下であることが好ましい。また、この結晶化度は、45%以上51%以下であることがより好ましい。
なお、内側樹脂フィルム40の結晶化度が40%未満であると、鏡面加工面11に接触する内側樹脂フィルム40がやわらか過ぎて、アモルファス状のPE分子が鏡面加工面11にこびりついて微小異物となる可能性がある。一方、内側樹脂フィルム40の結晶化度が60%を超えると、内側樹脂フィルム40が硬くてもろくなることから、一部が剥がれて微小異物となる可能性がある。
The crystallinity of the inner resin film 40 is set to 40% or more and 60% or less. This prevents minute foreign matter from being generated from the resin film in contact with the mirror-finished surface 11 of the mirror-finished body 10. The crystallinity is preferably 44% or more and 54% or less. The crystallinity is more preferably 45% or more and 51% or less.
If the crystallinity of the inner resin film 40 is less than 40%, the inner resin film 40 in contact with the mirror-finished surface 11 will be too soft, and amorphous PE molecules may adhere to the mirror-finished surface 11 and become minute foreign matter. On the other hand, if the crystallinity of the inner resin film 40 is more than 60%, the inner resin film 40 will be hard and brittle, and there is a possibility that parts of the inner resin film 40 will peel off and become minute foreign matter.

また、内側樹脂フィルム40の袋体21側の面(内側樹脂フィルム40の外側の面
)と袋体21の内面との第1摩擦係数は、鏡面加工面11と内側樹脂フィルム40の鏡面加工面11に接触する側の面との第2摩擦係数より小さい。なお、第1摩擦係数に対する第2摩擦係数の比である第2摩擦係数/第1摩擦係数(第2摩擦係数を第1摩擦係数で除した値)は、1.2以上であることが好ましい。このように第2摩擦係数を第1摩擦係数より大きくすることで、内側樹脂フィルム40で鏡面加工面11を被覆した鏡面加工体10を袋体21内に収容する際、及び袋体21内を真空引きする際等に、鏡面加工面11と内側樹脂フィルム40との間では相対移動を抑制し、内側樹脂フィルム40と袋体21の内面との間で相対移動が生じるようにしている。つまり、鏡面加工体10と内側樹脂フィルム40とが擦れることを抑制している。また、第2摩擦係数/第1摩擦係数は1.3以上であることがより好ましく、さらに好ましくは1.5以上であるとよい。
Furthermore, the first coefficient of friction between the surface of the inner resin film 40 facing the bag body 21 (the outer surface of the inner resin film 40) and the inner surface of the bag body 21 is smaller than the second coefficient of friction between the mirror-finished surface 11 and the surface of the inner resin film 40 that contacts the mirror-finished surface 11. The ratio of the second friction coefficient to the first friction coefficient, i.e., second friction coefficient/first friction coefficient (the value obtained by dividing the second friction coefficient by the first friction coefficient), is preferably 1.2 or greater. By making the second friction coefficient larger than the first friction coefficient, relative movement between the mirror-finished surface 11 and the inner resin film 40 is suppressed when the mirror-finished body 10, whose mirror-finished surface 11 is covered with the inner resin film 40, is placed in the bag body 21, or when the bag body 21 is evacuated, thereby allowing relative movement between the inner resin film 40 and the inner surface of the bag body 21. In other words, rubbing between the mirror-finished body 10 and the inner resin film 40 is suppressed. Furthermore, the second friction coefficient/first friction coefficient is more preferably 1.3 or more, and even more preferably 1.5 or more.

[鏡面加工体の梱包体の梱包方法]
鏡面加工体10の梱包体21は、鏡面加工体10の全領域を内側樹脂フィルム40で被覆した状態で、袋体21内に収納して密封することにより梱包される。以下、具体的に説明する。
まず、図5に示すように、鏡面加工体10の各鏡面加工面11の全領域を被覆するように、2枚の内側フィルム40を鏡面加工体10の表裏の鏡面加工面11に接触させる。このとき、鏡面加工体10のエッジが内側樹脂フィルム40の外側にはみ出すことがないように、内側樹脂フィルム40の周縁部が鏡面加工体10の周縁からはみ出すように配置する。そして、図6に示すように、内側樹脂フィルム40により全領域が被覆された状態の鏡面加工体10を袋体21内に収納する。
そして、袋体21内の空気を真空引きして、袋体21の開口端部を加熱したヒーター棒を押し当て溶着する等して袋体21を封止して密封状態にする。これにより、鏡面加工体10が袋体21により梱包され、鏡面加工体10の梱包体31となる。
[Packaging method for mirror-finished product]
The package 21 of the mirror-finished body 10 is packaged by enclosing the mirror-finished body 10 in a state where the entire area of the mirror-finished body 10 is covered with the inner resin film 40, and then sealing the same in the bag 21. This will be described in detail below.
First, as shown in Fig. 5, two inner films 40 are brought into contact with the front and back mirror-finished surfaces 11 of the mirror-finished body 10 so as to cover the entire area of each mirror-finished surface 11 of the mirror-finished body 10. At this time, the inner resin films 40 are arranged so that the peripheral portion of the inner resin films 40 extends beyond the peripheral edge of the mirror-finished body 10 so that the edge of the mirror-finished body 10 does not extend outside the inner resin films 40. Then, as shown in Fig. 6, the mirror-finished body 10, whose entire area is covered by the inner resin films 40, is stored in the bag 21.
Then, the air inside the bag 21 is evacuated, and the bag 21 is sealed by pressing a heated heater rod against the open end of the bag 21 and welding it, etc. In this way, the mirror-finished body 10 is packaged in the bag 21, and a package 31 of the mirror-finished body 10 is formed.

このように本実施形態では、鏡面加工面11、内側樹脂フィルム40、袋体21がこの順で重なった状態で袋体21内の真空引きをしているため、内側樹脂フィルム40の袋体21側の面(内側樹脂フィルム40の面のうち袋体21の内面に対向する面)と袋体21の内面との第1摩擦係数が鏡面加工面11と内側樹脂フィルム40の鏡面加工面11に接触する側の面との第2摩擦係数より大きいと、真空引き時に内側樹脂フィルム40と袋体21の内面とが密着した状態となり、鏡面加工体10が内側フィルム40との間にずれが生じて鏡面加工面11と内側樹脂フィルム40とが擦れることにより微小異物が発生する可能性がある。 In this embodiment, the bag 21 is evacuated with the mirror-finished surface 11, inner resin film 40, and bag 21 stacked in this order. Therefore, if the first coefficient of friction between the surface of the inner resin film 40 facing the bag 21 (the surface of the inner resin film 40 facing the inner surface of the bag 21) and the inner surface of the bag 21 is greater than the second coefficient of friction between the mirror-finished surface 11 and the surface of the inner resin film 40 that comes into contact with the mirror-finished surface 11, the inner resin film 40 and the inner surface of the bag 21 will come into close contact with each other during evacuation, causing misalignment between the mirror-finished body 10 and the inner film 40, which may result in the generation of minute foreign matter due to friction between the mirror-finished surface 11 and the inner resin film 40.

このため、本実施形態では、内側樹脂フィルム40の袋体21側の面と袋体21の内面との第1摩擦係数を、鏡面加工面11と内側樹脂フィルム40の鏡面加工面11に接触する側の面との第2摩擦係数より小さくしている。このように第2摩擦係数が第1摩擦係数より大きいので、内側樹脂フィルム40で鏡面加工面を11被覆した鏡面加工体10を袋体21内に収容する際、及び袋体21内を真空引きする際に、鏡面加工面11と内側樹脂フィルム40との間では相対移動が生じず、内側樹脂フィルム40と袋体21の内面との間で相対移動する。つまり、鏡面加工体10と内側樹脂フィルム40とが擦れることがないので、鏡面加工体10と内側樹脂フィルム40とが擦れることにより生じる微小異物の発生を抑制できる。
なお、第2摩擦係数/第1摩擦係数は1.2以上であることが好ましい。この場合、内側樹脂フィルム40と鏡面加工面11との間よりも、内側樹脂フィルム40と袋体21の内面との間でより滑りやすくなるので、収容時や真空引き時に鏡面加工体10と内側樹脂フィルム40とが擦れることにより生じる微小異物の発生を確実に抑制できる。
For this reason, in this embodiment, the first coefficient of friction between the surface of the inner resin film 40 facing the bag body 21 and the inner surface of the bag body 21 is set to be smaller than the second coefficient of friction between the mirror-finished surface 11 and the surface of the inner resin film 40 that comes into contact with the mirror-finished surface 11. Because the second coefficient of friction is larger than the first coefficient of friction, when the mirror-finished body 10, whose mirror-finished surface 11 is covered with the inner resin film 40, is placed in the bag body 21, and when the bag body 21 is evacuated, relative movement does not occur between the mirror-finished surface 11 and the inner resin film 40, but occurs between the inner resin film 40 and the inner surface of the bag body 21. In other words, there is no rubbing between the mirror-finished body 10 and the inner resin film 40, and therefore the generation of minute foreign matter caused by rubbing between the mirror-finished body 10 and the inner resin film 40 can be suppressed.
The ratio of the second friction coefficient to the first friction coefficient is preferably 1.2 or more. In this case, the inner resin film 40 and the inner surface of the bag body 21 slide more easily than the inner resin film 40 and the mirror-finished surface 11, so that the generation of minute foreign matter caused by rubbing between the mirror-finished body 10 and the inner resin film 40 during storage or evacuation can be reliably suppressed.

本実施形態では、内側樹脂フィルム40で鏡面加工面11を被覆した状態の鏡面加工体10を袋体21内に収納する際に、内側樹脂フィルム40の周縁部が鏡面加工体10の周縁からはみ出すように配置されているので、鏡面加工体10のエッジが袋体21に直接接触して微小異物が発生することを抑制できる。また、内側樹脂フィルム40が鏡面加工体10と袋体21との間に配置されることによって、鏡面加工体10が袋体21と内側樹脂フィルム40との2層構造で保護されるので、鏡面加工体10をより確実に保護できる。さらに、内側樹脂フィルム40の結晶化度が40%以上60%以下と適切な範囲に設定されているので、鏡面加工体10の鏡面加工面11に接触する内側樹脂フィルム40由来の微小異物が生じることを抑制できる。 In this embodiment, when the mirror-finished body 10, whose mirror-finished surface 11 is covered with the inner resin film 40, is stored in the bag 21, the peripheral edge of the inner resin film 40 is positioned so that it extends beyond the peripheral edge of the mirror-finished body 10, thereby preventing the edge of the mirror-finished body 10 from coming into direct contact with the bag 21 and generating minute foreign matter. Furthermore, by positioning the inner resin film 40 between the mirror-finished body 10 and the bag 21, the mirror-finished body 10 is protected by a two-layer structure consisting of the bag 21 and the inner resin film 40, thereby more reliably protecting the mirror-finished body 10. Furthermore, because the crystallinity of the inner resin film 40 is set within an appropriate range of 40% to 60%, the generation of minute foreign matter originating from the inner resin film 40 that comes into contact with the mirror-finished surface 11 of the mirror-finished body 10 is prevented.

なお、本発明は上記各実施形態の構成のものに限定されるものではなく、細部構成においては、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。
例えば、上記第2実施形態では、内側樹脂フィルム40は、平面視円形状としたがこれに限らず、例えば、矩形状であってもよい。
The present invention is not limited to the configurations of the above-described embodiments, and various modifications can be made to the detailed configurations without departing from the spirit of the present invention.
For example, in the second embodiment, the inner resin film 40 has a circular shape in a plan view, but is not limited to this, and may have, for example, a rectangular shape.

上記第2実施形態では、内側樹脂フィルム40は、鏡面加工面11の全領域を被覆する形状としたが、これに限らず、例えば、内側樹脂フィルムの中央部に複数の穴が形成されている等、必ずしも全領域が被覆されていない形状であってもよい。さらに、内側樹脂フィルム40は、鏡面加工面11の少なくとも周縁を含む領域を覆う形状(例えば、鏡面加工面の周縁のみが覆われている形状)であってもよい。 In the second embodiment described above, the inner resin film 40 is shaped to cover the entire area of the mirror-finished surface 11, but this is not limited thereto. For example, the inner resin film may have multiple holes formed in the center, or may have a shape that does not necessarily cover the entire area. Furthermore, the inner resin film 40 may be shaped to cover an area that includes at least the periphery of the mirror-finished surface 11 (for example, a shape that covers only the periphery of the mirror-finished surface).

上記第2実施形態では、袋体21はどのような素材により形成されてもよいこととしたが、これに限らず、例えば、内側樹脂フィルム40と同一材料により形成されてもよい。この場合、仮に内側樹脂フィルム40が破損し、袋体を構成する樹脂フィルムが鏡面加工体に接触することとなっても、内側樹脂フィルム40及び袋体を構成する樹脂フィルムのいずれもの結晶化度が上記範囲内にあることとなるので、内側樹脂フィルム40が破損した場合でも、微小異物が生じることを抑制できる。さらに、同一材料を用いるので製造コストを低減できる。 In the second embodiment described above, the bag body 21 may be made of any material, but this is not a limitation. For example, the bag body 21 may be made of the same material as the inner resin film 40. In this case, even if the inner resin film 40 is damaged and the resin film constituting the bag body comes into contact with a mirror-finished body, the crystallinity of both the inner resin film 40 and the resin film constituting the bag body will be within the above-mentioned range, so even if the inner resin film 40 is damaged, the generation of minute foreign matter can be suppressed. Furthermore, using the same material reduces manufacturing costs.

直径:380mm、厚さ:10mmのシリコン円板(シリコン板)と、シリコン板を収容するための700mm×800mmのポリエチレン製の袋体と、シリコン板の鏡面加工面の全領域を覆う直径:390mm、厚さ:100μmのポリエチレン製の内側樹脂フィルム(サンプルA,B,C)とを用意した。そして、各サンプルA,B,Cの結晶化度を測定するとともに、各サンプルA,B,Cのそれぞれからなる内側樹脂フィルムと、シリコン板及び袋体の内面のそれぞれとの静摩擦係数及び動摩擦係数を測定した。 A 380mm diameter, 10mm thick silicon disk (silicon plate), a 700mm x 800mm polyethylene bag to house the silicon plate, and a 390mm diameter, 100μm thick polyethylene inner resin film (samples A, B, C) covering the entire mirror-finished surface of the silicon plate were prepared. The crystallinity of each of samples A, B, and C was measured, as well as the static and dynamic friction coefficients between the inner resin film of each of samples A, B, and C and the silicon plate and the inner surface of the bag.

(結晶化度の測定方法)
各サンプルA,B,Cの結晶化度の測定は、XRD(X線回折)にて実行した。この測定は、ブルカー社製X線解析装置(D8 Discover)を用いてシリコン板の鏡面加工面(表面、裏面)の任意の6点(n=6)でX線解析を行い、結晶性散乱強度及び非結晶性散乱強度を求め、これらの値を用いて結晶化度(6点の平均値)を算出した。その結果を表1に示す。
なお、本実施例では、結晶化度は以下の式1に基づいて算出した。
結晶化度Xc=Ic/(Ic + Ia)×100…(式1)
Ic:結晶性散乱強度, Ia:非結晶性散乱強度
(Method for measuring crystallinity)
The crystallinity of each sample A, B, and C was measured by XRD (X-ray diffraction). This measurement was performed using a Bruker X-ray analyzer (D8 Discover) at six arbitrary points (n = 6) on the mirror-finished surface (front and back) of the silicon plate to determine the crystalline scattering intensity and non-crystalline scattering intensity. These values were used to calculate the crystallinity (average value of the six points). The results are shown in Table 1.
In this example, the crystallinity was calculated based on the following formula 1.
Crystallinity Xc=Ic/(Ic+Ia)×100...(Formula 1)
Ic: Crystalline scattering intensity, Ia: Amorphous scattering intensity

(静摩擦係数及び動摩擦係数の測定方法)
静摩擦係数及び動摩擦係数の測定は、次のようにして行った。
第1摩擦係数の測定は、測定対象となるポリエチレン製の袋体を使用機器に固定し、使用圧子にサンプルA,B,Cを張り付けた状態とし、使用機器に固定した袋体上にサンプルA,B,Cを張り付けた使用圧子を配置し、この使用圧子に一定の荷重を付与した状態で使用圧子を一定の速度で一定の距離動かすことにより静摩擦係数及び動摩擦係数を測定した。第2摩擦係数の測定は、測定対象となるシリコン板を使用機器に固定し、使用圧子にサンプルA,B,Cを張り付けた状態とし、使用機器に固定したシリコン板上にサンプルA,B,Cを張り付けた使用圧子を配置し、この使用圧子に一定の荷重を付与した状態で使用圧子を一定の速度で一定の距離動かすことにより静摩擦係数及び動摩擦係数を測定した。具体的には、以下の試験条件によりサンプルごとに3回ずつ実行し、平均値及び標準偏差を算出した。静摩擦係数の試験結果を表2に、動摩擦係数の試験結果を表3に示した。
[試験条件]
使用機器: トライボギアTYPE 40(新東化学製)
速度:1000 mm/m
距離:30mm
使用圧子:φ12 mmスチールウールホルダ
荷重:200g
(Method for measuring static and dynamic friction coefficients)
The static and dynamic friction coefficients were measured as follows.
The first friction coefficient was measured by fixing a polyethylene bag to be measured to the test equipment, attaching samples A, B, and C to the indenter, and placing the indenter with samples A, B, and C attached on the bag fixed to the test equipment. The static and kinetic friction coefficients were measured by applying a constant load to the indenter and moving it at a constant speed for a constant distance. The second friction coefficient was measured by fixing a silicon plate to be measured to the test equipment, attaching samples A, B, and C to the indenter, and placing the indenter with samples A, B, and C attached on the silicon plate fixed to the test equipment. The static and kinetic friction coefficients were measured by applying a constant load to the indenter and moving it at a constant speed for a constant distance. Specifically, the test was performed three times for each sample under the following test conditions, and the average and standard deviation were calculated. The static friction coefficient test results are shown in Table 2, and the kinetic friction coefficient test results are shown in Table 3.
[Test conditions]
Equipment used: Tribogear Type 40 (Shinto Chemical)
Speed: 1000mm/m
Distance: 30mm
Indenter used: φ12 mm steel wool holder load: 200 g

表2に示すように、静摩擦係数において、サンプルA,B,Cのいずれも第1摩擦係数は第2摩擦係数よりも小さく、第2摩擦係数/第1摩擦係数は、1.4以上となった。また、表3に示すように、動摩擦係数において、サンプルA,B,Cのいずれも第1摩擦係数は第2摩擦係数よりも小さく、第2摩擦係数/第1摩擦係数は、1.7以上となった。このように静摩擦係数、動摩擦係数ともに、すべてのサンプルで第1摩擦係数は第2摩擦係数よりも小さくなった。このことから、シリコン板の鏡面加工面を内側樹脂フィルムで覆うことにより、シリコン板を袋体に収容する際、及び袋体内を真空引きする際に、鏡面加工面と内側樹脂フィルムとの間では相対移動が生じず、内側樹脂フィルムと袋体の内面との間で相対移動することがわかる。 As shown in Table 2, for the static friction coefficients, the first friction coefficient was smaller than the second friction coefficient for all of Samples A, B, and C, and the ratio of the second friction coefficient to the first friction coefficient was 1.4 or greater. Furthermore, as shown in Table 3, for the kinetic friction coefficients, the first friction coefficient was smaller than the second friction coefficient for all of Samples A, B, and C, and the ratio of the second friction coefficient to the first friction coefficient was 1.7 or greater. Thus, for both the static and kinetic friction coefficients, the first friction coefficient was smaller than the second friction coefficient for all of the samples. This shows that by covering the mirror-finished surface of the silicon plate with the inner resin film, no relative movement occurs between the mirror-finished surface and the inner resin film when the silicon plate is placed in the bag and when the bag is evacuated, but relative movement occurs between the inner resin film and the inner surface of the bag.

また、シリコン板の鏡面加工面に樹脂フィルム1(例えば、サンプルA)を載置し、樹脂フィルム1(サンプルA)上から樹脂フィルム2(サンプルA)をシリコン板の3cm×3cmの範囲に5回擦りつけたもの、及び樹脂フィルム1(サンプルA)を設けず直接鏡面加工面を直接、樹脂フィルム2(サンプルA)で上記範囲を5回擦ったものの微小異物の発生状況を目視で確認した。
その結果を図7及び図8に示す。図7は、樹脂フィルム1(サンプルA)を用いた場合のシリコン板の擦り付け範囲を示す画像であり、図8は、樹脂フィルム1(サンプルA)を用いることなく樹脂フィルム2をこすりつけたシリコン板の上記範囲を示す画像である。
In addition, resin film 1 (for example, sample A) was placed on the mirror-finished surface of a silicon plate, and resin film 2 (sample A) was rubbed five times over a 3 cm x 3 cm area of the silicon plate on top of resin film 1 (sample A), and the mirror-finished surface was directly rubbed five times with resin film 2 (sample A) over the same area, without resin film 1 (sample A), and the occurrence of micro-foreign matter was visually confirmed.
The results are shown in Figures 7 and 8. Figure 7 is an image showing the rubbing area of the silicon plate when resin film 1 (sample A) was used, and Figure 8 is an image showing the same area of the silicon plate when resin film 2 was rubbed without using resin film 1 (sample A).

樹脂フィルム1(サンプルA)をシリコン板上に配置したものの上から樹脂フィルム2により擦り付けたものの実験結果は、例えば、図7に示すように、樹脂フィルム1とシリコン板との擦れに基づく微小異物の発生が認められなかった。一方、樹脂フィルム1(サンプルA)を設けず、直接シリコン板に樹脂フィルム2を擦りつけたものは、図8に示すように、シリコン板と樹脂フィルム2との擦れに基づく微小異物が発生していた。つまり、内側樹脂フィルムを設けるだけでも樹脂フィルムの擦れに起因する微小異物の発生を抑制できることがわかった。これらの知見に基づいて、以下の第1実施例に示す実験を行った。 In an experiment in which resin film 1 (sample A) was placed on a silicon plate and then rubbed with resin film 2, the results showed that, for example, as shown in Figure 7, no minute foreign matter was generated due to rubbing between resin film 1 and the silicon plate. On the other hand, when resin film 2 was rubbed directly against the silicon plate without resin film 1 (sample A), minute foreign matter was generated due to rubbing between the silicon plate and resin film 2, as shown in Figure 8. In other words, it was found that simply providing an inner resin film can suppress the generation of minute foreign matter caused by rubbing of the resin film. Based on these findings, the experiment shown in the following first example was conducted.

[第1実施例]
上述したシリコン円板及び平面サイズ700mm×800mmの袋体を作製した。袋体の素材は、上述した結晶化度がそれぞれ異なるサンプルA,B,Cの樹脂フィルムにより製造した。また、内側樹脂フィルムとしてサンプルA,B,Cの樹脂フィルムを製造した。そして、これらサンプルA,B,Cのそれぞれで製造した袋体に各サンプルA,B,Cからなる内側樹脂フィルムで被覆したシリコン板を収納して真空密封した各試料No.1~No.9を製造した。次に、これら各試料を開梱して、シリコン板の鏡面加工面(両面)を観察し、微小異物であるスマッジ及びパーティクルの発生数を測定し、評価を行った。なお、スマッジとは、暗室で、1000ルーメン以上のLED電灯からの距離を1cm,3cm,5cmとし、様々な角度から照射した際に、目視観測できる白い曇りのような汚れ(おおよそ1um以上のもの)である。また、パーティクルとは、暗室で、300ルーメン以上のLED電灯からの距離を1cm,3cm,5cmとし、様々な角度から照射した際に、目視観測できる点状異物(おおよそ1um以上のもの)である。
[First Example]
The above-described silicon disks and bags with a planar size of 700 mm x 800 mm were fabricated. The bags were made from the resin films of Samples A, B, and C, each with a different degree of crystallinity. The resin films of Samples A, B, and C were also fabricated as inner resin films. Silicon plates coated with the inner resin films of Samples A, B, and C were then housed in the bags fabricated from Samples A, B, and C, respectively, and vacuum-sealed to produce Samples No. 1 to No. 9. Each sample was then unpacked, and the mirror-finished surfaces (both sides) of the silicon plates were observed. The number of smudges and particles, which are minute foreign matter, was measured and evaluated. Smudges are defined as white, cloudy stains (approximately 1 μm or larger) that can be visually observed when illuminated from various angles in a darkroom at distances of 1 cm, 3 cm, and 5 cm from an LED light with an output of 1000 lumens or more. Furthermore, particles are point-like foreign objects (approximately 1 μm or larger) that can be visually observed when an LED light of 300 lumens or more is placed in a dark room at distances of 1 cm, 3 cm, and 5 cm and illuminated from various angles.

(微小異物の発生評価方法)
サンプルA,B,Cのそれぞれで製造した袋体に各サンプルA,B,Cからなる内側樹脂フィルムで被覆したシリコン板を収納して真空密封した各試料を開梱して、シリコン板の鏡面加工面(両面)を観察し、微小異物であるスマッジ及びパーティクルの発生数を測定した。スマッジの測定は、暗室で1000ルーメンのLED電灯から距離を1,3,5cmで、図9の角度において角度αは30°,45°,80 °、角度βを0°,60°,120°,180°,240°,320°の範囲でそれぞれ測定した。また、パーティクルの測定は、暗室で300ルーメンのLED電灯から距離を1,3,5cmで、図9の角度において角度αは30°,45°,80 °、角度βを0°,60°,120°,180°,240°,320°の範囲でそれぞれ測定した。つまり、LEDの距離が3通り、角度αが3通り、角度βが6通りあるため、全54通り(表裏合わせると108通り)の条件でスマッジ及びパーティクルの発生数を測定した。なお、以下の評価でスマッジ又はパーティクルが検出された箇所は、上記距離、角度α,βのそれぞれを変更した108通りの全てで検出されたスマッジ又はパーティクルが発生した箇所の合計値である。
評価基準は、スマッジ又はパーティクルのそれぞれごとに評価し、これらが見つからなかった場合を「無」、1~3か所で見つかった場合を「極少量」、4~9か所で見つかった場合を「少」、10か所以上見つかった場合を「多」と判定した。また、スマッジ及びパーティクルのいずれもが無、又は一方が極少量、他方が無の場合を合格とし、それ以外を不合格と判定した。この結果を表4に示す。なお、内側フィルムの結晶化度及び摩擦係数比(第2摩擦係数/第1摩擦係数)は、上述した方法により検出した。
(Method for evaluating the occurrence of minute foreign matter)
Each sample was vacuum-sealed by placing a silicon plate coated with an inner resin film made of each sample A, B, or C in a bag manufactured for each sample A, B, or C. The samples were then unpacked, and the mirror-finished surfaces (both sides) of the silicon plate were observed to measure the number of smudges and particles, which are minute foreign bodies. Smudges were measured in a darkroom at distances of 1, 3, and 5 cm from a 1,000-lumen LED light bulb, with angles α of 30°, 45°, and 80° and angles β of 0°, 60°, 120°, 180°, 240°, and 320°, as shown in Figure 9. Particle counts were measured in a darkroom at distances of 1, 3, and 5 cm from a 300-lumen LED light bulb, with angles α of 30°, 45°, and 80° and angles β of 0°, 60°, 120°, 180°, 240°, and 320°, as shown in Figure 9. That is, since there are three different LED distances, three different angles α, and six different angles β, the number of smudges and particles generated was measured under a total of 54 conditions (108 conditions when the front and back are combined). Note that the locations where smudges or particles were detected in the following evaluation are the total number of locations where smudges or particles were generated, detected under all 108 conditions when the distance and angles α and β were changed.
The evaluation criteria were based on whether smudges or particles were present, with "absent" being the case when no smudges or particles were found, "very small amounts" being the case when they were found in 1 to 3 locations, "few amounts" being the case when they were found in 4 to 9 locations, and "large amounts" being the case when they were found in 10 or more locations. A sample with no smudges or particles, or a sample with only a small amount of one and no other, was judged as passing, while any other sample was judged as failing. The results are shown in Table 4. The crystallinity and friction coefficient ratio (second friction coefficient/first friction coefficient) of the inner film were detected by the methods described above.

表4に示すように、袋体をサンプルA,B,C、内側フィルムをサンプルA,B,Cのいずれにより製造した場合でも、スマッジ及びパーティクルの発生を略無くすことができた。なお、試料No.7のものは、第2摩擦係数/第1摩擦係数(摩擦係数比)の値が1.2と最も小さかったことから、スマッジが極少量発生したものと考えられる。 As shown in Table 4, when the bag body was manufactured using Sample A, B, or C, and the inner film was manufactured using Sample A, B, or C, the generation of smudges and particles was virtually eliminated. Furthermore, since Sample No. 7 had the smallest second friction coefficient/first friction coefficient (friction coefficient ratio) of 1.2, it is believed that only a very small amount of smudge was generated.

[第2実施例]
第1実施例に示したシリコン板及び平面サイズ700mm×800mmの袋体を作製した。袋体の素材は、結晶化度がそれぞれ異なるサンプルA,B,C,D,E,Fの樹脂フィルムにより製造し、これらのサンプルを用いて袋体を製造した。そして、これらサンプルA,B,C,D,E,Fのそれぞれで製造した袋体にシリコン板を収納して真空密封した各試料No.10~No.15を製造した。次に、これら各試料を開梱して、シリコン板の鏡面加工面(両面)を観察し、微小異物であるスマッジ及びパーティクルの発生数を測定し、評価を行った。なお、スマッジ及びパーティクルの検出及び評価方法は、上記第1実施例で示した方法と同じ方法で実行した。また、サンプルA,B,Cについては、上記第1実施例におけるサンプルA,B,Cと同一の素材であり、サンプルDとして結晶化度63%と高いもの、サンプルEとして結晶化度35%と低いものを用意した。また、サンプルFには添加剤を配合したものを用いた。なお、各サンプルの結晶化度の測定は、前述した方法で検出した。
[Second Example]
The silicon plate and bag body with a planar size of 700 mm x 800 mm shown in Example 1 were fabricated. The bag body material was made from resin films of Samples A, B, C, D, E, and F, each with a different degree of crystallinity, and bags were manufactured using these samples. Then, a silicon plate was placed in the bag body manufactured for each of Samples A, B, C, D, E, and F and vacuum-sealed to produce Samples No. 10 to No. 15. Next, each of these samples was unpacked, and the mirror-finished surfaces (both sides) of the silicon plate were observed. The number of smudges and particles, which are minute foreign matter, was measured and evaluated. The detection and evaluation methods for smudges and particles were performed in the same manner as in Example 1 above. Samples A, B, and C were made from the same material as Samples A, B, and C in Example 1 above. Sample D had a high crystallinity of 63%, and Sample E had a low crystallinity of 35%. Sample F was also formulated with an additive. The crystallinity of each sample was measured by the method described above.

表5に示すように、試料No.15は、サンプルFの樹脂フィルムが添加剤を含み、結晶化度が極めて低いことから、スマッジが及びパーティクルのそれぞれが大量に発生したため、結晶化度の測定をするまでもなく総合判定が不合格であった。また、試料No.10はサンプルDの樹脂フィルムの結晶化度が63%と高いことから、パーティクルが少量発生し、総合判定が不合格であった。また、試料No.14はサンプルEの樹脂フィルムの結晶化度が35%と小さいことから、スマッジが少量発生し、総合判定が不合格であった。
以上のように、樹脂フィルムの結晶化度は43%~58%の範囲で合格とされた。これら試料の結果を総合すると、樹脂フィルムに起因する微小異物の発生を抑制するためには、袋体を構成する樹脂フィルムの結晶化度が40%以上60%以下の範囲で、かつ、添加剤を含んでいないものであれば好適に使用できると考えられる。これらの中でも試料No.12は、スマッジ及びパーティクルの発生がなかったことから、結晶化度は48(σ=3)、つまり、45%以上51%以下であることがより好ましいことがわかった。
As shown in Table 5, sample No. 15 was judged to be unacceptable overall without even measuring the crystallinity because the resin film of sample F contained additives and had an extremely low degree of crystallinity, resulting in the generation of large amounts of both smudges and particles. Sample No. 10 was judged to be unacceptable overall because the resin film of sample D had a high degree of crystallinity of 63%, resulting in the generation of small amounts of particles. Sample No. 14 was judged to be unacceptable overall because the resin film of sample E had a low degree of crystallinity of 35%, resulting in the generation of small amounts of smudges.
As described above, a resin film with a crystallinity of 43% to 58% was deemed acceptable. Taking the results of these samples together, it appears that in order to suppress the generation of minute foreign matter due to the resin film, a resin film constituting the bag with a crystallinity of 40% to 60% and containing no additives is suitable for use. Among these, sample No. 12 showed no smudge or particle generation, indicating that a crystallinity of 48 (σ=3), i.e., 45% to 51%, is more preferable.

10 鏡面加工体
11 鏡面加工面
20,21 袋体
30,31 鏡面加工体の梱包体
40 内側樹脂フィルム
10 Mirror-finished body 11 Mirror-finished surfaces 20, 21 Bag body 30, 31 Package body of mirror-finished body 40 Inner resin film

Claims (3)

鏡面加工面を有するプラズマエッチャー用電極板が真空状態で袋体に密封された梱包体であって、前記プラズマエッチャー用電極板と前記袋体の内面との間に前記鏡面加工面を被覆する内側樹脂フィルムが設けられ、前記内側樹脂フィルムの周縁部は、前記プラズマエッチャー用電極板の周縁からはみ出すように配置されており、
前記内側樹脂フィルムは、添加剤を含まない無添加タイプのポリエチレンからなり、その結晶化度は、40%以上60%以下であり、
前記内側樹脂フィルムの前記袋体側の面と前記袋体の内面との第1摩擦係数は、前記鏡面加工面と前記内側樹脂フィルムの前記鏡面加工面に接触する側の面との第2摩擦係数より小さいことを特徴とするプラズマエッチャー用電極板の梱包体。
A package in which an electrode plate for a plasma etcher having a mirror-finished surface is sealed in a bag under vacuum, an inner resin film covering the mirror-finished surface is provided between the electrode plate for the plasma etcher and the inner surface of the bag, and a peripheral portion of the inner resin film is arranged so as to protrude beyond the peripheral edge of the electrode plate for the plasma etcher,
the inner resin film is made of additive-free polyethylene, and its crystallinity is 40% or more and 60% or less;
A packaging body for electrode plates for plasma etchers, characterized in that a first coefficient of friction between the surface of the inner resin film facing the bag body and the inner surface of the bag body is smaller than a second coefficient of friction between the mirror-finished surface and the surface of the inner resin film that comes into contact with the mirror-finished surface.
前記第2摩擦係数/前記第1摩擦係数が1.2以上であることを特徴とする請求項に記載のプラズマエッチャー用電極板の梱包体。 2. The package of electrode plates for a plasma etcher according to claim 1 , wherein the second friction coefficient/the first friction coefficient is 1.2 or more. 鏡面加工面を有するプラズマエッチャー用電極板の前記鏡面加工面を、結晶化度が40%以上60%以下の添加剤を含まない無添加タイプのポリエチレンからなる内側樹脂フィルムで被覆した状態で、袋体内に収納して密封する梱包方法であり、前記内側樹脂フィルムの前記袋体側の面と前記袋体の内面との第1摩擦係数は、前記鏡面加工面と前記内側樹脂フィルムの前記鏡面加工面に接触する側の面との第2摩擦係数より小さいことを特徴とするプラズマエッチャー用電極板の梱包体の梱包方法。 A packaging method for a plasma etcher electrode plate having a mirror-finished surface, in which the mirror-finished surface is covered with an inner resin film made of additive-free polyethylene with a crystallinity of 40% to 60% and the plate is then placed in a bag and sealed, wherein a first coefficient of friction between the surface of the inner resin film facing the bag and the inner surface of the bag is smaller than a second coefficient of friction between the mirror-finished surface and the surface of the inner resin film that comes into contact with the mirror-finished surface.
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JP2000299304A (en) 1999-04-12 2000-10-24 Shin Etsu Chem Co Ltd Packing container for electrode plate for plasma device
JP2001118912A (en) 1999-08-12 2001-04-27 Ibiden Co Ltd Ceramic substrate for semiconductor manufacturing / inspection equipment, ceramic heater, electrostatic chuck, wafer prober
JP2004296912A (en) 2003-03-27 2004-10-21 Kyocera Corp Wafer support substrate
JP2012101838A (en) 2010-11-12 2012-05-31 Tokuyama Corp Method for manufacturing polysilicon package
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