JP7791794B2 - Substrate storage container - Google Patents
Substrate storage containerInfo
- Publication number
- JP7791794B2 JP7791794B2 JP2022142717A JP2022142717A JP7791794B2 JP 7791794 B2 JP7791794 B2 JP 7791794B2 JP 2022142717 A JP2022142717 A JP 2022142717A JP 2022142717 A JP2022142717 A JP 2022142717A JP 7791794 B2 JP7791794 B2 JP 7791794B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- reticle
- adapter
- positioning member
- storage container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1906—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for containing masks, reticles or pellicles
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Description
本発明は、半導体ウェーハの他、レチクル用のレチクル収容容器を収納可能な基板収納容器に関するものである。 The present invention relates to a substrate storage container that can store not only semiconductor wafers but also reticle storage containers for reticles.
半導体製造ラインのリソグラフィ工程においては、半導体ウェーハに電子回路を形成するため、複数枚のレチクルが使用されるが、半導体ウェーハとレチクルとでは、一度に搬送できる枚数が異なり、1枚の半導体ウェーハに電子回路を形成するために複数枚のレチクルを何回も搬送する必要があるので、半導体ウェーハの搬送効率の向上に支障を来すことがある。また、半導体ウェーハ用の基板収納容器とレチクル用の収容容器とは、大きさや搬送形態が相違し、別々の搬送ラインが要求されるので、複数の搬送ラインを設置しなければならず、設備やコスト、スペース占有等の点で問題が生じる。 In the lithography process on semiconductor manufacturing lines, multiple reticles are used to form electronic circuits on semiconductor wafers. However, the number of semiconductor wafers and reticles that can be transported at one time differs, and multiple reticles must be transported multiple times to form electronic circuits on a single semiconductor wafer, which can hinder efforts to improve semiconductor wafer transport efficiency. Furthermore, substrate storage containers for semiconductor wafers and containers for reticles differ in size and transport format, requiring separate transport lines. This necessitates the installation of multiple transport lines, which creates problems in terms of equipment, costs, and space occupation.
これらの問題を解消するため、従来においては、図示しないが、半導体ウェーハ用の基板収納容器の容器本体にレチクル用のレチクル収容容器を専用のアダプタを介して収納し、一種類の基板収納容器を用いて搬送する技術が提案されている(特許文献1、2、3、4参照)。 To solve these problems, a technology has been proposed in the past (not shown) in which a reticle storage container for reticles is stored in the container body of a substrate storage container for semiconductor wafers via a dedicated adapter, allowing for transportation using a single type of substrate storage container (see Patent Documents 1, 2, 3, and 4).
半導体ウェーハ用の基板収納容器にレチクル収容容器を専用のアダプタを介して収納する場合には、半導体ウェーハの搬送効率を向上させたり、設備、コスト、スペース占有等の問題を解消することができる。
しかしながら、アダプタにレチクル収容容器が単に搭載される場合、アダプタからレチクル収容容器が浮き上がって位置ずれしたり、脱落したりし、その結果、レチクル収容容器内のレチクルが損傷するおそれがある。
When a reticle container is stored in a substrate container for semiconductor wafers via a dedicated adapter, it is possible to improve the efficiency of transporting semiconductor wafers and to solve problems such as equipment, costs, and space occupation.
However, if the reticle container is simply mounted on the adapter, the reticle container may float up and become misaligned or fall off the adapter, which may result in damage to the reticle inside the reticle container.
本発明は上記に鑑みなされたもので、容器本体内のアダプタに搭載されたレチクル収容容器の浮き上がりや脱落を抑制し、レチクル収容容器内のレチクルが損傷するおそれを払拭することのできる基板収納容器を提供することを目的としている。 The present invention has been developed in consideration of the above, and aims to provide a substrate storage container that can prevent reticle storage containers mounted on an adapter inside the container body from floating up or falling off, thereby eliminating the risk of damage to the reticles inside the reticle storage container.
本発明においては上記課題を解決するため、複数枚の半導体ウェーハを上下方向に並べて収納可能な容器本体と、この容器本体の開口した正面に着脱自在に嵌め合わされる蓋体と、容器本体に収納されるレチクル収容容器搭載用のアダプタとを含んでなるものであって、
容器本体の内部両側に、半導体ウェーハを略水平に支持可能な一対の支持片を対向させて設け、この一対の支持片を上下方向に所定の間隔で複数配列し、
アダプタを容器本体内の一対の支持片に支持される略板形に形成し、このアダプタの容器本体正面側に位置する前部を直線的に切り欠き、アダプタのレチクル収容容器を搭載する搭載面に、レチクル収容容器の周縁前部に近接する前部位置決め部材、レチクル収容容器の周縁後部に近接する後部位置決め部材、及びレチクル収容容器の周縁側部に近接する一対の側部位置決め部材を所定の間隔をおいて配列するとともに、前部位置決め部材と一対の側部位置決め部材のうち少なくとも前部位置決め部材に、レチクル収容容器の周縁部に上方から係止するクランプ部材を回転可能に支持させ、後部位置決め部材を断面略逆L字形に形成し、この後部位置決め部材を、レチクル収容容器の周縁後部に横方向から対向する起立部と、この起立部に締結具を介し着脱自在に螺着されてレチクル収容容器の周縁後部に上方から係止する係止被覆部とに分割したことを特徴としている。
In order to solve the above problems, the present invention provides a container comprising a container body capable of storing a plurality of semiconductor wafers arranged vertically, a lid body detachably fitted to the open front surface of the container body, and an adapter for mounting a reticle storage container stored in the container body,
A pair of support pieces capable of supporting the semiconductor wafers substantially horizontally are provided facing each other on both sides inside the container body, and a plurality of pairs of support pieces are arranged at predetermined intervals in the vertical direction;
The adapter is formed in a generally plate-like shape and is supported by a pair of support pieces within the container body. The adapter has a front portion located on the front side of the container body that is linearly cut out. A mounting surface of the adapter on which the reticle storage container is mounted is provided with a front positioning member adjacent to the front periphery of the reticle storage container, a rear positioning member adjacent to the rear periphery of the reticle storage container, and a pair of side positioning members adjacent to the side periphery of the reticle storage container, all arranged at a predetermined interval. At least the front positioning member of the front positioning member and the pair of side positioning members rotatably supports a clamp member that engages with the periphery of the reticle storage container from above. The rear positioning member is formed with a generally inverted L-shaped cross section and is divided into an upright portion that faces the rear periphery of the reticle storage container from the side, and a locking cover portion that is detachably screwed to the upright portion via a fastener and engages with the rear periphery of the reticle storage container from above .
なお、アダプタ、前部位置決め部材、後部位置決め部材、一対の側部位置決め部材、及びクランプ部材の少なくともいずれかを、樹脂と導電フィラー含有の成形材料により成形することができる。 At least one of the adapter, the front positioning member, the rear positioning member, the pair of side positioning members, and the clamp member can be molded from a molding material containing resin and conductive filler.
ここで、特許請求の範囲における半導体ウェーハには、少なくともφ300mmやφ450mmのシリコンウェーハ等が含まれる。また、容器本体や蓋体の少なくとも一部は、透明、不透明、半透明のいずれでも良い。容器本体における支持片の表面の少なくとも前部には、半導体ウェーハやアダプタ用のストッパを形成することができる。また、レチクル収容容器は、5~7インチのレチクルを収容する平面多角形の箱型でも良いし、カセット型等でも良い。 The semiconductor wafers referred to in the claims include silicon wafers with a diameter of at least 300 mm or 450 mm. At least a portion of the container body or lid may be transparent, opaque, or translucent. A stopper for the semiconductor wafer or adapter may be formed on at least the front of the surface of the support piece of the container body. The reticle storage container may be a box-shaped, flat polygonal container capable of storing 5- to 7-inch reticles, or a cassette-type container.
アダプタは、平面円形、楕円形、矩形、多角形、正方形等に適宜形成することができる。また、クランプ部材の「回転」という用語には、回動や揺動が含まれる。後部位置決め部材の「断面略逆L字形」には、断面逆L字形と、おおよそ断面逆L字形と認められる類似形(例えば、断面逆J字形や断面逆Γ字形等)のいずれもが含まれる。さらに、基板収納容器は、半導体工場用のFOUPが主ではあるが、出荷・輸送用のFOSBでも良い。 The adapter can be appropriately formed into a flat circular, elliptical, rectangular, polygonal, square, or other shape. Furthermore, the term "rotation" of the clamp member includes rotation and swing. The "approximately inverted L-shaped cross section" of the rear positioning member includes both an inverted L-shaped cross section and similar shapes that are roughly recognized as an inverted L-shaped cross section (e.g., an inverted J-shaped cross section or an inverted Γ-shaped cross section). Furthermore, while the substrate storage container is primarily a FOUP for semiconductor factories, it may also be a FOSB for shipping and transportation.
本発明によれば、基板収納容器の容器本体にレチクル収容容器をアダプタを介して収納する場合には、先ず、アダプタを用意してその搭載面の複数の位置決め部材の間にレチクル収容容器を嵌めて位置決めする。レチクル収容容器を嵌めて位置決めしたら、アダプタのクランプ部材をレチクル収容容器に係止させてレチクル収容容器が浮き上がらないようにし、容器本体内にアダプタを収納してその両側部を容器本体の対向する一対の支持片に支持させ、容器本体の開口した正面に蓋体を嵌め合わせれば、容器本体にレチクル収容容器をアダプタを介して収納することができ、レチクル収容容器を安全に保管したり、搬送することができる。 According to the present invention, when storing a reticle storage container in the container body of a substrate storage container via an adapter, first prepare the adapter and fit the reticle storage container between the multiple positioning members on its mounting surface to position it. Once the reticle storage container is fitted and positioned, the adapter's clamping members are engaged with the reticle storage container to prevent it from floating up. The adapter is then placed inside the container body, with both sides supported by a pair of opposing support pieces on the container body, and the lid is fitted onto the open front of the container body. This allows the reticle storage container to be stored in the container body via the adapter, allowing for safe storage and transportation of the reticle storage container.
本発明によれば、容器本体内のアダプタに搭載されたレチクル収容容器の浮き上がりや脱落を抑制し、レチクル収容容器内のレチクルが損傷するおそれを払拭することができるという効果がある。また、アダプタの容器本体正面側に位置する前部を直線的に切り欠くので、位置方向の特定が容易となる。また、アダプタの搭載面に、レチクル収容容器の周縁前部に近接する前部位置決め部材、レチクル収容容器の周縁後部に近接する後部位置決め部材、及びレチクル収容容器の周縁側部に近接する一対の側部位置決め部材を所定の間隔をおいて配列するので、レチクル収容容器の四隅部以外の大部分を包囲して位置決めすることができる。
また、前部位置決め部材と一対の側部位置決め部材のうち少なくとも前部位置決め部材に、レチクル収容容器の周縁部に上方から係止するクランプ部材を回転可能に支持させるので、アダプタからレチクル収容容器が浮き上がって位置ずれしたり、脱落するのを有効に防止することができる。また、後部位置決め部材を、一体品ではなく、分解可能な起立部と係止被覆部とから構成するので、後部位置決め部材の組み立てが容易となる。さらに、アダプタの搭載面に搭載したレチクル収容容器の周縁後部を後部位置決め部材に位置決めしながら係止させるので、レチクル収容容器がアダプタの前後方向にずれるのを抑制することができ、しかも、アダプタからレチクル収容容器の後部が浮き上がって位置ずれしたり、脱落するのを防ぐことが可能となる。
According to the present invention, the reticle container mounted on the adapter inside the container body is prevented from floating up or falling off, thereby eliminating the risk of damage to the reticle inside the reticle container. Furthermore, the front portion of the adapter located on the front side of the container body is linearly cut out, making it easy to identify the orientation. Furthermore, the mounting surface of the adapter is provided with a front positioning member adjacent to the front peripheral edge of the reticle container, a rear positioning member adjacent to the rear peripheral edge of the reticle container, and a pair of side positioning members adjacent to the side peripheral edges of the reticle container, all arranged at a predetermined interval. This allows the reticle container to be positioned by surrounding most of it except for the four corners.
Furthermore, at least the front positioning member of the pair of side positioning members rotatably supports a clamp member that engages the peripheral edge of the reticle container from above, effectively preventing the reticle container from floating up and becoming misaligned or falling off the adapter. Furthermore, since the rear positioning member is not a single unit but is comprised of a disassembled upright portion and a locking covering portion, assembly of the rear positioning member is facilitated. Furthermore, since the rear peripheral portion of the reticle container mounted on the mounting surface of the adapter is positioned and locked to the rear positioning member, it is possible to prevent the reticle container from shifting in the front-to-rear direction of the adapter and also to prevent the rear portion of the reticle container from floating up and becoming misaligned or falling off the adapter.
請求項2記載の発明によれば、アダプタ、前部位置決め部材、後部位置決め部材、一対の側部位置決め部材、及びクランプ部材の少なくともいずれかを、樹脂と導電フィラー含有の成形材料により成形するので、導電性を付与してレチクルの静電気破壊を防ぐことができる。 According to the invention of claim 2, at least one of the adapter, the front positioning member, the rear positioning member, the pair of side positioning members, and the clamp member is molded from a molding material containing resin and conductive filler, thereby imparting conductivity and preventing electrostatic damage to the reticle.
以下、図面を参照して本発明の好ましい実施の形態を説明すると、本実施形態における基板収納容器は、図1ないし図8に示すように、複数枚の半導体ウェーハWを収納可能な容器本体1と、この容器本体1の開口した正面に嵌合される蓋体10と、半導体ウェーハWの代わりに容器本体1に必要数が収納されるレチクル収容容器搭載用のアダプタ40とを備えた半導体工場用のFOUPであり、アダプタ40のレチクル収容容器30を搭載する搭載面41に、レチクル収容容器30を位置決めする複数の位置決めバー43を配設し、この複数の位置決めバー43に、レチクル収容容器30に係止可能なクランプ50を支持させることにより、国連サミットで採択されたSDGs(国連の持続可能な開発のための国際目標であり、17のグローバル目標と169のターゲット(達成基準)からなる持続可能な開発目標)の目標9の達成に貢献する。 A preferred embodiment of the present invention will now be described with reference to the drawings. As shown in FIGS. 1 to 8, the substrate storage container in this embodiment is a FOUP for use in a semiconductor factory, comprising a container body 1 capable of storing multiple semiconductor wafers W, a lid 10 that fits onto the open front of the container body 1, and an adapter 40 for mounting reticle storage containers, the required number of which are stored in the container body 1 instead of semiconductor wafers W. A plurality of positioning bars 43 for positioning the reticle storage container 30 are disposed on the mounting surface 41 of the adapter 40 on which the reticle storage container 30 is mounted, and clamps 50 that can be engaged with the reticle storage container 30 are supported by these positioning bars 43, thereby contributing to the achievement of Goal 9 of the SDGs (the United Nations' international goals for sustainable development, consisting of 17 global goals and 169 targets (achievement criteria)) adopted at the United Nations Summit.
複数枚の半導体ウェーハWは、図1に示すように、例えばφ300mmの丸いシリコンウェーハからなり、容器本体1の内部に25枚が上下方向に並べて整列収納され、各半導体ウェーハWが水平に支持される。 As shown in Figure 1, the semiconductor wafers W are round silicon wafers, for example, 300 mm in diameter, and 25 of them are stored in a vertically aligned arrangement inside the container body 1, with each semiconductor wafer W supported horizontally.
容器本体1と蓋体10とは、所定の樹脂を含有する成形材料により複数の部品がそれぞれ射出成形され、この複数の部品の組み合わせで構成される。この成形材料の樹脂としては、例えばポリカーボネート、シクロオレフィンポリマー、ポリエーテルイミド、ポリエーテルケトン、ポリエーテルエーテルケトン、ポリブチレンテレフタレート、ポリアセタール、液晶ポリマーといった熱可塑性樹脂やこれらのアロイ等があげられる。熱可塑性樹脂には、導電性を付与するため、適量のカーボンブラック、カーボン繊維、カーボンナノファイバー、カーボンナノチューブ、導電性高分子、金属繊維、金属酸化物等が添加される。 The container body 1 and lid 10 are constructed by combining multiple parts that are each injection-molded using a molding material containing a specific resin. Examples of resins used in this molding material include thermoplastic resins such as polycarbonate, cycloolefin polymer, polyetherimide, polyetherketone, polyetheretherketone, polybutylene terephthalate, polyacetal, and liquid crystal polymer, as well as alloys of these. To impart conductivity to the thermoplastic resin, an appropriate amount of carbon black, carbon fiber, carbon nanofiber, carbon nanotube, conductive polymer, metal fiber, metal oxide, etc. is added.
容器本体1は、図1や図2に示すように、正面が横長に開口した背の高いフロントオープンボックスに成形され、内部の両側、換言すれば、左右両側壁の内面に、半導体ウェーハWの周縁側部を下方から水平に支持する一対の支持片2が対設されており、この一対の支持片2が上下方向に所定の間隔で複数配列される。この容器本体1は、例えば25枚の半導体ウェーハWを上下方向に並べて整列収納可能な大きさに形成される。また、各支持片2は、例えば容器本体1の前後方向に伸びる平坦な棚板に形成され、表面の前後部のうち、少なくとも前部に、収納された半導体ウェーハWが正面方向に位置ずれするのを防止するストッパ3が隆起して一体形成される。 As shown in Figures 1 and 2, the container body 1 is formed as a tall, front-opening box with a horizontally elongated opening at the front. A pair of support pieces 2 are provided on both sides of the interior, in other words, on the inner surfaces of the left and right side walls, to horizontally support the peripheral sides of the semiconductor wafers W from below. A plurality of pairs of support pieces 2 are arranged vertically at a predetermined interval. The container body 1 is formed to a size that can store, for example, 25 semiconductor wafers W aligned vertically. Each support piece 2 is formed, for example, as a flat shelf extending in the front-to-rear direction of the container body 1, and a stopper 3 is integrally formed on at least the front of the front and rear portions of the surface, protruding to prevent the stored semiconductor wafers W from shifting forward.
容器本体1の底板下面にはボトムプレート4が選択的に装着され、容器本体1の天井中央部には、自動搬送用の搬送具である平面矩形のロボティックフランジ5が着脱自在に装着されており、このロボティックフランジ5が半導体工場の天井搬送装置に把持して吊持された後、半導体の製造ラインを搬送される。また、容器本体1の内部背面には、非常時に半導体ウェーハWの周縁後部を挟持可能な複数のリアサポートが並設される。容器本体1の正面周縁部は幅方向外側に屈曲して膨出形成されており、この正面周縁部の内面における上部両側と下部両側とには、蓋体10用の施錠穴6がそれぞれ凹み形成される。 A bottom plate 4 is selectively attached to the underside of the bottom plate of the container body 1, and a flat, rectangular robotic flange 5, a carrier for automatic transport, is detachably attached to the center of the ceiling of the container body 1. This robotic flange 5 is gripped and suspended by a ceiling transport device in a semiconductor factory, and then transported along the semiconductor production line. Additionally, multiple rear supports are lined up on the interior back surface of the container body 1, which can clamp the rear peripheral portion of the semiconductor wafer W in an emergency. The front peripheral portion of the container body 1 is bent outward in the width direction and bulged outward, and locking holes 6 for the lid 10 are recessed into both the upper and lower sides of the inner surface of this front peripheral portion.
容器本体1の両側壁の外面には、手動操作用の操作ハンドル7がそれぞれ着脱自在に装着され、各側壁の下部には、自動搬送具である搬送レール8が必要に応じ着脱自在に装着されて前後方向に水平に指向する。 Operating handles 7 for manual operation are removably attached to the outer surfaces of both side walls of the container body 1, and conveyor rails 8, which are automatic conveyors, are removably attached to the bottom of each side wall as needed and are oriented horizontally in the front-to-back direction.
蓋体10は、図1に示すように、容器本体1の正面に着脱自在に嵌合される断面略皿形の蓋本体11と、この蓋本体11の開口した表面を覆うカバープレート14とを備え、これら蓋本体11とカバープレート14との間に施錠機構16が内蔵される。蓋本体11は、横長の略矩形に形成され、裏面の中央部に、半導体ウェーハWの周縁前部を弾性片で弾発的に保持するフロントリテーナ12が着脱自在に装着される。また、蓋本体11の周壁には、容器本体1の正面内周に圧接変形する枠形のガスケットが嵌合され、蓋本体11の周壁における上部両側と下部両側とには、施錠機構16用の出没孔13がそれぞれ貫通して穿孔される。 As shown in Figure 1, the lid body 10 comprises a lid body 11 with a generally dish-shaped cross section that is removably fitted to the front of the container body 1, and a cover plate 14 that covers the open surface of the lid body 11. A locking mechanism 16 is built in between the lid body 11 and the cover plate 14. The lid body 11 is formed in a generally rectangular shape with a horizontally elongated shape, and a front retainer 12 that resiliently holds the front peripheral edge of the semiconductor wafer W with an elastic piece is removably attached to the center of the back surface. In addition, a frame-shaped gasket that is pressed against and deformed on the inner periphery of the front of the container body 1 is fitted to the peripheral wall of the lid body 11, and access holes 13 for the locking mechanism 16 are drilled through both the upper and lower sides of the peripheral wall of the lid body 11.
カバープレート14は、透明、半透明、あるいは不透明の板に形成され、両側部に、施錠機構16用の操作孔15がそれぞれ貫通して穿孔されており、各操作孔15を蓋体開閉装置の回転可能な操作キーが外部から貫通する。 The cover plate 14 is formed from a transparent, translucent, or opaque plate, with operation holes 15 for the locking mechanism 16 drilled through both sides. A rotatable operation key for the lid opening and closing device passes through each operation hole 15 from the outside.
施錠機構16は、図1に示すように、カバープレート14の操作孔15を貫通した蓋体開閉装置の操作キーに回転操作される左右一対の回転プレート17と、各回転プレート17の回転に応じて上下方向にスライドする複数のスライドバー19と、各スライドバー19の先端部に連結軸支され、蓋本体周壁の出没孔13を貫通して容器本体1の施錠穴6に嵌合係止する出没可能な複数の施錠爪20とを備えて構成される。 As shown in Figure 1, the locking mechanism 16 is composed of a pair of left and right rotating plates 17 that are rotated by the operating key of the lid opening/closing device that passes through the operating hole 15 in the cover plate 14, multiple slide bars 19 that slide up and down in response to the rotation of each rotating plate 17, and multiple retractable locking claws 20 that are connected and pivoted to the tip of each slide bar 19 and pass through the retractable holes 13 in the peripheral wall of the lid body to fit into the locking holes 6 in the container body 1.
施錠機構16は、容器本体1や蓋体10と同様の成形材料により成形される。複数の回転プレート17とスライドバー19とは、蓋本体11内に設けられる支持リブを介して軸支されたり、支持されたりし、各回転プレート17の周縁部寄りの一対の円弧溝孔18にスライドバー19の末端部がピンを介しそれぞれ遊嵌される。また、各施錠爪20は、例えば断面略L字形に屈曲形成され、自由端部に摩擦軽減用のローラが回転可能に軸支される。 The locking mechanism 16 is molded from the same molding material as the container body 1 and lid body 10. The multiple rotating plates 17 and slide bars 19 are supported and journaled via support ribs provided within the lid body 11, and the ends of the slide bars 19 are loosely fitted via pins into a pair of arc-shaped slots 18 near the periphery of each rotating plate 17. Each locking claw 20 is bent, for example, into a roughly L-shaped cross section, and a friction-reducing roller is rotatably journaled at its free end.
このような基板収納容器は、容器本体1内に複数枚の半導体ウェーハWが順次収納され、容器本体1の正面に蓋体10が蓋体開閉装置により圧入して嵌合されるとともに、各半導体ウェーハWの周縁前部をフロントリテーナ12が保持し、施錠機構16が蓋体開閉装置に施錠操作されて蓋体10を強固に固定する。蓋体10が強固に固定されると、容器本体1のロボティックフランジ5が半導体工場の天井搬送装置に吊持され、次の加工処理工程に搬送されて各半導体ウェーハWに加工と処理とが順次施され、半導体ウェーハWの表面に電子回路が形成されることとなる。 In this type of substrate storage container, multiple semiconductor wafers W are sequentially stored within the container body 1, and the lid 10 is press-fitted into the front of the container body 1 by the lid opening/closing device. The front retainer 12 holds the front peripheral edge of each semiconductor wafer W, and the locking mechanism 16 locks the lid opening/closing device to firmly secure the lid 10. Once the lid 10 is firmly secured, the robotic flange 5 of the container body 1 is suspended from an overhead transport device in the semiconductor factory and transported to the next processing stage, where each semiconductor wafer W is processed and treated in sequence, resulting in the formation of electronic circuits on the surface of the semiconductor wafer W.
レチクル収容容器30は、特に限定されるものではないが、図3ないし図5に示すように、例えば6インチのレチクルを1枚収容してアダプタ40に搭載される平面矩形の底板31と、この底板31にシールガスケットを介し上方から着脱自在に嵌合される平面略矩形の上蓋32とを備えたレチクルSMIFポッド(RSP)である。このレチクル収容容器30の底板31と上蓋32とは、例えば静電気によるレチクルの損傷を防止する観点から、カーボン等の導電材料を含有する所定の成形材料(例えば、ポリカーボネート樹脂、ポリブチレンテレフタレート樹脂、ポリアセタール樹脂、ポリエーテルエーテルケトン樹脂等の各種合成樹脂)によりそれぞれ成形される。 The reticle storage container 30 is not particularly limited, but as shown in Figures 3 to 5, it is a reticle SMIF pod (RSP) that includes a flat rectangular bottom plate 31 that can store one 6-inch reticle and is mounted on the adapter 40, and a flat, approximately rectangular top lid 32 that is detachably fitted to the bottom plate 31 from above via a seal gasket. The bottom plate 31 and top lid 32 of the reticle storage container 30 are each molded from a predetermined molding material (e.g., various synthetic resins such as polycarbonate resin, polybutylene terephthalate resin, polyacetal resin, polyether ether ketone resin, etc.) that contains a conductive material such as carbon, in order to prevent damage to the reticle due to static electricity, for example.
底板31は、相対向する平面略矩形の上板と下板とを備え、これら上板と下板との間に隙間が区画形成されており、この隙間に施錠用のロック機構が内蔵される。上板の上面には、1枚のレチクルの周縁部を水平に支持する一対の支持部材が間隔をおいて敷設され、各支持部材がレールに形成されており、上板の上面周縁部付近には、弾性変形可能な平面枠形のシールガスケットが装着される。 The bottom plate 31 comprises opposing, flat, roughly rectangular upper and lower plates, with a gap defined between them that houses a locking mechanism. A pair of support members are spaced apart on the upper surface of the upper plate to horizontally support the peripheral edge of a single reticle. Each support member is formed into a rail, and a resiliently deformable, flat, frame-shaped sealing gasket is attached near the peripheral edge of the upper surface of the upper plate.
上蓋32は、例えば透明あるいは半透明の断面略ハット形に形成され、底板31との嵌合時に幅方向外側に水平に突出するフランジにより、シールガスケットを圧接変形してシール性を確保する。この上蓋32の内部天井には、レチクルの上面周縁部に接触して保持する一対の保持部材が間隔をおいて対設され、各保持部材が例えばレールに形成されて支持部材に上方から対向する。 The top cover 32 is, for example, transparent or translucent and formed with a roughly hat-shaped cross section. When mated with the bottom plate 31, a flange that protrudes horizontally outward in the width direction presses and deforms the seal gasket, ensuring a seal. A pair of spaced-apart holding members that contact and hold the top peripheral edge of the reticle are installed on the interior ceiling of the top cover 32, and each holding member is formed, for example, as a rail and faces the support member from above.
上蓋32の幅方向外側に突出するフランジは、その周縁部33の先端が下方に短く屈曲形成されて底板31の周面に対向し、この先端の内面に、ロック機構の出没バーの先端部に嵌合されるロック溝がそれぞれ凹み形成される。また、上蓋32の外面天井には、搬送装置等に把持される搬送用フランジ34が装着される。 The flange that protrudes outward in the width direction of the top cover 32 has its peripheral edge 33 bent downward at a short angle to face the peripheral surface of the bottom plate 31, and the inner surface of this edge has locking grooves recessed therein that fit into the tips of the retractable bars of the locking mechanism. In addition, a transport flange 34 that can be gripped by a transport device or the like is attached to the outer ceiling of the top cover 32.
レチクル収容容器30の製品例としては、RSP‐150、RSP‐200〔大日商事株式会社製:製品名〕、レチクルケース〔ナガセエンジニアリング株式会社製:製品名〕、レチクルカセット〔三洋マテリアル株式会社製:製品名〕等があげられる。 Examples of reticle storage containers 30 include RSP-150 and RSP-200 (product names manufactured by Dainichi Shoji Co., Ltd.), reticle cases (product names manufactured by Nagase Engineering Co., Ltd.), and reticle cassettes (product names manufactured by Sanyo Materials Co., Ltd.).
アダプタ40は、図2、図3、図5ないし図8に示すように、容器本体1内の一対の支持片2に支持される略板形に成形され、レチクル収容容器30を搭載する平坦な上面の搭載面41に、レチクル収容容器30の四隅部以外の大部分を包囲する複数の位置決めバー43が配設されており、この複数の位置決めバー43の一部に、レチクル収容容器30に係止する複数のクランプ50が回転可能に支持される。このアダプタ40は、所定の成形材料により、基本的には容器本体1の隣接する支持片2と支持片2との間に挿入可能な厚さと大きさを有する円板に成形され、容器本体1の正面側に位置する前部42が位置方向を示す観点から左右方向に直線的に切り欠かれており、両側部が容器本体1の一対の支持片2に水平に支持される。 As shown in Figures 2, 3, 5 to 8, the adapter 40 is molded in a generally plate-like shape supported by a pair of support pieces 2 within the container body 1. A plurality of positioning bars 43 are arranged on the flat top mounting surface 41 on which the reticle storage container 30 is mounted, surrounding most of the reticle storage container 30 except for the four corners. A plurality of clamps 50 that engage with the reticle storage container 30 are rotatably supported on some of these positioning bars 43. The adapter 40 is molded from a predetermined molding material into a disk of a thickness and size that allows it to be inserted between adjacent support pieces 2 of the container body 1. The front portion 42, located on the front side of the container body 1, is linearly notched left and right to indicate the positioning direction, and both sides are supported horizontally by the pair of support pieces 2 of the container body 1.
アダプタ40の所定の成形材料としては、例えば耐薬品性・耐摩耗性・耐衝撃性・汎用性等に優れる軽量のポリプロピレン樹脂、ポリカーボネート樹脂、ポリブチレンテレフタレート樹脂、ポリアセタール樹脂、ポリエーテルエーテルケトン樹脂等の各種合成樹脂、ポリエステル系、ポリスチレン系、ポリオレフィン系等の熱可塑性エラストマーがあげられる。この成形材料には、導電性を付与してレチクルの静電気破壊を防止するため、適量のカーボンブラック、カーボン繊維、カーボンナノファイバー、カーボンナノチューブ、導電性高分子、金属繊維、金属酸化物等が好ましくは添加される。 The molding material for the adapter 40 may be, for example, a lightweight polypropylene resin, which has excellent chemical resistance, abrasion resistance, impact resistance, and versatility, as well as various synthetic resins such as polycarbonate resin, polybutylene terephthalate resin, polyacetal resin, and polyether ether ketone resin, as well as thermoplastic elastomers such as polyester, polystyrene, and polyolefin. To impart conductivity to the molding material and prevent electrostatic breakdown of the reticle, an appropriate amount of carbon black, carbon fiber, carbon nanofiber, carbon nanotube, conductive polymer, metal fiber, metal oxide, etc. is preferably added.
アダプタ40は、例えば半導体ウェーハWと略同じ大きさに形成され、搭載面41の周縁部付近に、レチクル収容容器30の上蓋周縁部33に前後左右から近接して位置決めする複数の位置決めバー43が平面矩形の搭載領域49を描くよう間隔をおいて螺着されており、各位置決めバー43が平面略半円形等に形成される。複数の位置決めバー43は、アダプタ40と同様の成形材料により成形され、この成形材料には導電性を付与してレチクルの静電気破壊を防止するため、適量のカーボンブラック、カーボン繊維、カーボンナノファイバー、カーボンナノチューブ、導電性高分子、金属繊維、金属酸化物等が好ましくは添加される。 The adapter 40 is formed to be approximately the same size as the semiconductor wafer W, for example. Near the periphery of the mounting surface 41, multiple positioning bars 43 are screwed at intervals to define a planar rectangular mounting area 49, closely positioning the top lid peripheral portion 33 of the reticle storage container 30 from the front, rear, left, and right. Each positioning bar 43 is formed in a planar, approximately semicircular, or the like. The multiple positioning bars 43 are molded from the same molding material as the adapter 40. To impart conductivity to this molding material and prevent electrostatic breakdown of the reticle, an appropriate amount of carbon black, carbon fiber, carbon nanofiber, carbon nanotube, conductive polymer, metal fiber, metal oxide, or the like is preferably added.
複数の位置決めバー43は、図3、図5、図7に示すように、レチクル収容容器30の上蓋32の周縁前部に近接して位置決めする前部位置決めバー44と、レチクル収容容器30の上蓋32の周縁後部に近接して位置決めする後部位置決めバー45と、レチクル収容容器30の周縁両側部に近接して位置決めする左右一対の側部位置決めバー48とを備え、これら44・45・48の間に隙間がそれぞれ区画形成されており、後部位置決めバー45がやや背の高い断面略逆L字形に屈曲形成される。 As shown in Figures 3, 5, and 7, the multiple positioning bars 43 include a front positioning bar 44 that positions the reticle storage container 30 adjacent to the front peripheral edge of the top lid 32, a rear positioning bar 45 that positions the reticle storage container 30 adjacent to the rear peripheral edge of the top lid 32, and a pair of left and right side positioning bars 48 that position the reticle storage container 30 adjacent to both sides of the peripheral edge. Gaps are defined between these bars 44, 45, and 48, and the rear positioning bar 45 is bent to form a slightly tall, approximately inverted L-shaped cross section.
複数の位置決めバー43のうち、後部位置決めバー45は、製造作業や組立作業を容易にする観点から、図5や図6に示すように、上蓋32の周縁後部に横方向から対向近接するブロック形の起立部46と、この起立部46に螺子等の複数の締結具を介し着脱自在に螺着されて上蓋32の周縁後部に上方から係止する平面略半円形でL字形の係止被覆部47とに分割され、位置決め機能の他、係止機能を発揮する。 Of the multiple positioning bars 43, the rear positioning bar 45 is divided into a block-shaped upright portion 46 that faces closely to the rear peripheral edge of the top cover 32 from the side, as shown in Figures 5 and 6, and an L-shaped locking cover portion 47 that is removably attached to the upright portion 46 via multiple fasteners such as screws and locks onto the rear peripheral edge of the top cover 32 from above, performing a locking function in addition to a positioning function.
複数(本実施形態では3個)のクランプ50は、図3、図5、図7、図8に示すように、前部位置決めバー44と一対の側部位置決めバー48の中央部にそれぞれボルト52を介して支持され、水平横方向に回転する。各クランプ50は、アダプタ40や位置決めバー43と同様の成形材料により略倒L字形に成形され、レチクル収容容器30の上蓋周縁部33に長片部を上方から係止してZ方向への浮き上がりを防止したり、長片部の係止を解除してレチクル収容容器30の取り外しを可能にするよう機能する。 As shown in Figures 3, 5, 7, and 8, multiple clamps 50 (three in this embodiment) are supported via bolts 52 at the center of the front positioning bar 44 and the pair of side positioning bars 48, and rotate horizontally. Each clamp 50 is molded in a roughly inverted L-shape from the same molding material as the adapter 40 and positioning bar 43, and functions to engage its long piece from above with the upper lid rim 33 of the reticle storage container 30 to prevent it from lifting up in the Z direction, and to release the engagement of the long piece to enable removal of the reticle storage container 30.
クランプ50の成形材料には、レチクルの静電気破壊を防止する観点から、好ましくは適量のカーボンブラック、カーボン繊維、カーボンナノファイバー、カーボンナノチューブ、導電性高分子、金属繊維、金属酸化物等が添加される。また、ボルト52は、特に限定されるものではないが、例えば耐熱性や機械特性等に優れる高機能のポリエーテルエーテルケトン樹脂等により成形され、クランプ50の短片筒部51に上方から螺挿される。 To prevent electrostatic damage to the reticle, the molding material of the clamp 50 preferably contains an appropriate amount of carbon black, carbon fiber, carbon nanofiber, carbon nanotube, conductive polymer, metal fiber, metal oxide, etc. The bolt 52 is molded from, but is not limited to, a high-performance polyether ether ketone resin with excellent heat resistance and mechanical properties, and is threaded into the short-end tubular portion 51 of the clamp 50 from above.
上記構成において、基板収納容器の容器本体1にレチクルを収容したレチクル収容容器30をアダプタ40を介して収納する場合には、先ず、アダプタ40を用意してその複数のクランプ50の長片部を位置決めバー43の長手方向に向け(図5参照)、アダプタ40の搭載面41に傾けたレチクル収容容器30の後部を接触させ、このレチクル収容容器30を後方にスライドさせてその上蓋32の周縁後部を後部位置決めバー45の係止被覆部47に係止させるとともに、前部位置決めバー44、後部位置決めバー45、及び一対の側部位置決めバー48の間の搭載領域49にレチクル収容容器30を嵌入して位置決めする。 In the above configuration, when storing a reticle storage container 30 containing reticles in the container body 1 of the substrate storage container via the adapter 40, first prepare the adapter 40 and orient the long pieces of its multiple clamps 50 in the longitudinal direction of the positioning bar 43 (see Figure 5), then contact the rear of the tilted reticle storage container 30 with the mounting surface 41 of the adapter 40, slide the reticle storage container 30 rearward until the rear peripheral edge of its top lid 32 engages with the locking covering portion 47 of the rear positioning bar 45, and position the reticle storage container 30 by fitting it into the mounting area 49 between the front positioning bar 44, rear positioning bar 45, and pair of side positioning bars 48.
レチクル収容容器30を嵌入して搭載したら、各クランプ50の長片部をアダプタ40の中心部方向に回転させ(図8参照)、クランプ50の長片部をレチクル収容容器30の周縁部33に係止させてレチクル収容容器30がZ方向に浮き上がらないようにし(図3参照)、空の容器本体1内に複数のアダプタ40を順次収納してその両側部を容器本体1の対向する一対の支持片2にそれぞれ支持させ、アダプタ40の位置や姿勢を安定させた後、容器本体1の開口した正面に蓋体10を圧入して嵌合すれば、容器本体1にレチクル収容容器30をアダプタ40を介し安全に収納することができる。この際、アダプタ40とアダプタ40の間隔を空け、アダプタ40の下面にレチクル収容容器30が衝突しないようにすることが好ましい。 Once the reticle storage container 30 is inserted and loaded, the long pieces of each clamp 50 are rotated toward the center of the adapter 40 (see Figure 8), and the long pieces of the clamps 50 engage with the peripheral edge 33 of the reticle storage container 30 to prevent the reticle storage container 30 from floating up in the Z direction (see Figure 3). Then, multiple adapters 40 are sequentially placed inside the empty container body 1, with both sides supported by a pair of opposing support pieces 2 on the container body 1. After stabilizing the position and orientation of the adapters 40, the lid 10 is press-fit into the open front of the container body 1, allowing the reticle storage container 30 to be safely stored in the container body 1 via the adapters 40. It is preferable to leave some space between the adapters 40 to prevent the reticle storage container 30 from colliding with the underside of the adapter 40.
上記構成によれば、アダプタ40の搭載面41にレチクル収容容器30を安定して搭載するだけではなく、レチクル収容容器30の周縁部33に複数のクランプ50をそれぞれ係止させるので、例え基板収納容器が衝突して外力が作用しても、アダプタ40からレチクル収容容器30が浮き上がってZ方向に位置ずれしたり、がたついたり、脱落するのを有効に防止することができる。したがって、レチクル収容容器30内のレチクルの損傷防止が大いに期待できる。また、アダプタ40、複数の位置決めバー43、及び複数のクランプ50を樹脂と導電フィラー含有の成形材料によりそれぞれ成形するので、導電性の付与によりレチクルの静電気破壊を防止することができる。 With the above configuration, not only is the reticle storage container 30 stably mounted on the mounting surface 41 of the adapter 40, but multiple clamps 50 are each engaged with the peripheral edge 33 of the reticle storage container 30. Therefore, even if an external force is applied due to a collision with a substrate storage container, the reticle storage container 30 is effectively prevented from floating up from the adapter 40, becoming misaligned in the Z direction, rattling, or falling off. This significantly reduces the risk of damage to the reticles inside the reticle storage container 30. Furthermore, because the adapter 40, multiple positioning bars 43, and multiple clamps 50 are each molded from molding materials containing resin and conductive filler, the added conductivity prevents electrostatic damage to the reticles.
また、アダプタ40の搭載面41に搭載されたレチクル収容容器30の周縁後部に後部位置決めバー45の起立部46を近接させて位置決めするとともに、後部位置決めバー45の係止被覆部47を係止させるので、レチクル収容容器30がアダプタ40の前後方向にずれるのを抑制することができ、しかも、アダプタ40からレチクル収容容器30の後部が浮き上がって位置ずれしたり、がたついたり、脱落するのを防ぐことが可能となる。さらに、別体の起立部46と係止被覆部47とを組み立てて後部位置決めバー45を構成するので、形状が複雑な後部位置決めバー45を容易に組み立てて使用することができる。 In addition, the upright portion 46 of the rear positioning bar 45 is positioned close to the rear peripheral edge of the reticle storage container 30 mounted on the mounting surface 41 of the adapter 40, and the locking cover portion 47 of the rear positioning bar 45 is locked, preventing the reticle storage container 30 from shifting in the front-to-rear direction of the adapter 40. Furthermore, it is possible to prevent the rear portion of the reticle storage container 30 from floating up from the adapter 40 and becoming misaligned, rattling, or falling off. Furthermore, because the rear positioning bar 45 is constructed by assembling the separate upright portion 46 and locking cover portion 47, even rear positioning bars 45 with complex shapes can be easily assembled and used.
次に、図9は本発明の第2の実施形態を示すもので、この場合には、前部位置決めバー44の中央部に、水平横方向に回転可能なクランプ50をボルト52を介して支持させるようにしている。その他の部分については、上記実施形態と同様であるので説明を省略する。
本実施形態においても上記実施形態と同様の作用効果が期待でき、しかも、各側部位置決めバー48のクランプ50を省略するので、部品点数の削減が大いに期待できるのは明らかである。
9 shows a second embodiment of the present invention, in which a clamp 50 that can rotate horizontally and laterally is supported at the center of the front positioning bar 44 via a bolt 52. The other parts are the same as those of the above embodiment, so a description thereof will be omitted.
In this embodiment, the same effects as those of the above embodiment can be expected, and furthermore, since the clamps 50 of the side positioning bars 48 are omitted, it is clear that a significant reduction in the number of parts can be expected.
次に、図10は本発明の第3の実施形態を示すもので、この場合には、前部位置決めバー44に、水平横方向に回転可能な左右一対のクランプ50をボルト52を介しそれぞれ支持させるようにしている。その他の部分については、上記実施形態と同様であるので説明を省略する。
本実施形態においても上記実施形態と同様の作用効果が期待でき、しかも、各側部位置決めバー48のクランプ50を省略するので、部品点数の削減が期待できる。また、一対のクランプ50を用いるので、例え一方のクランプ50が外れても、他方のクランプ50により、レチクル収容容器30の位置ずれやがたつき、脱落等を確実に防止することができる。
10 shows a third embodiment of the present invention, in which a pair of left and right clamps 50 that can rotate horizontally and laterally are supported on the front positioning bar 44 via bolts 52. The other parts are the same as those of the above-mentioned embodiment, so a description thereof will be omitted.
This embodiment is expected to have the same effects as the above embodiment, and furthermore, it is expected to reduce the number of parts by omitting the clamps 50 on each side positioning bar 48. Furthermore, since a pair of clamps 50 is used, even if one clamp 50 comes loose, the other clamp 50 can reliably prevent the reticle container 30 from shifting position, rattling, falling off, etc.
なお、上記実施形態ではアダプタ40、複数の位置決めバー43、及び複数のクランプ50を樹脂と導電フィラー含有の成形材料により成形したが、これらの少なくともいずれかを樹脂と導電フィラー含有の成形材料により成形しても良い。また、アダプタ40の下面における両側部周縁に、支持片2のストッパ3に近接する切り欠きを他の部分よりも厚さが薄くなるようそれぞれ形成し、各切り欠きを支持片2のストッパ3に接触させてアダプタ40が前後方向、特に前方向に位置ずれしたり、がたつくのを防止するようにしても良い。 In the above embodiment, the adapter 40, the multiple positioning bars 43, and the multiple clamps 50 are molded from a molding material containing resin and conductive filler, but at least one of these may also be molded from a molding material containing resin and conductive filler. Also, notches may be formed on both side edges of the underside of the adapter 40 near the stoppers 3 of the support pieces 2 so that they are thinner than the other parts, and each notch may come into contact with the stoppers 3 of the support pieces 2 to prevent the adapter 40 from shifting in the front-to-rear direction, particularly the forward direction, or from rattling.
また、アダプタ40の径方向に複数の位置決めバー50用の取付孔を複数穿孔し、レチクル収容容器30の大きさに応じ、複数の取り付け孔に位置決めバー50を選択的に螺着しても良い。また、上記実施形態ではアダプタ40の前部位置決めバー44と一対の側部位置決めバー48のうち、少なくとも前部位置決めバー44にクランプ50を支持させたが、一対の側部位置決めバー48のみに必要数のクランプ50を回転可能に支持させても良い。また、特に支障を来さなければ、アダプタ40の搭載面41に複数のクランプ50を回転可能に支持させることができる。 Mounting holes for the positioning bars 50 may also be drilled radially through the adapter 40, and the positioning bars 50 may be selectively screwed into the mounting holes depending on the size of the reticle storage container 30. In the above embodiment, the clamps 50 are supported by at least the front positioning bar 44 of the adapter 40's front positioning bar 44 and pair of side positioning bars 48, but the required number of clamps 50 may also be rotatably supported by only the pair of side positioning bars 48. Furthermore, if no particular obstacles arise, multiple clamps 50 may be rotatably supported on the mounting surface 41 of the adapter 40.
また、アダプタ40の搭載面41に必要数の凹凸を配列形成してレチクル収容容器30の底面との間に隙間を形成可能とし、レチクル収容容器30の取り付け取り外しを容易にすることができる。また、アダプタ40の搭載面41に、レチクル収容容器30用の浅底の収容穴等を選択的に穿孔することもできる。また、後部位置決めバー45の係止被覆部47のレチクル収容容器30に対向する起立面を傾斜させてレチクル収容容器30の上方への傾斜角を拡大可能とし、レチクル収容容器30の取り外しを円滑にすることが可能である。さらに、各位置決めバー43に可撓性やバネ性を付与してレチクル収容容器30の周縁部33に密接させ、レチクル収容容器30の位置ずれや脱落を防止することも可能である。 In addition, the mounting surface 41 of the adapter 40 can be patterned with the required number of projections and recesses to create a gap between the adapter 40 and the bottom surface of the reticle container 30, facilitating the installation and removal of the reticle container 30. Also, shallow holes for the reticle container 30 can be selectively drilled into the mounting surface 41 of the adapter 40. The upright surface of the locking cover 47 of the rear positioning bar 45 facing the reticle container 30 can be tilted to increase the upward tilt angle of the reticle container 30, facilitating the removal of the reticle container 30. Furthermore, each positioning bar 43 can be made flexible or springy to fit tightly against the peripheral edge 33 of the reticle container 30, preventing the reticle container 30 from shifting or falling off.
本発明に係る基板収納容器は、半導体やレチクルを取り扱う分野で使用することができる。 The substrate storage container of the present invention can be used in fields that handle semiconductors and reticles.
1 容器本体
2 支持片
5 ロボティックフランジ
8 搬送レール
10 蓋体
11 蓋本体
14 カバープレート
16 施錠機構
30 レチクル収容容器
31 底板
32 上蓋
33 周縁部
40 アダプタ
41 搭載面
43 位置決めバー(位置決め部材)
44 前部位置決めバー(位置決め部材、前部位置決め部材)
45 後部位置決めバー(位置決め部材、後部位置決め部材)
46 起立部
47 係止被覆部
48 側部位置決めバー(位置決め部材、側部位置決め部材)
49 搭載領域
50 クランプ(クランプ部材)
W 半導体ウェーハ
REFERENCE SIGNS LIST 1 Container body 2 Support piece 5 Robotic flange 8 Transport rail 10 Lid body 11 Lid body 14 Cover plate 16 Locking mechanism 30 Reticle storage container 31 Bottom plate 32 Top lid 33 Peripheral edge portion 40 Adapter 41 Mounting surface 43 Positioning bar (positioning member)
44 Front positioning bar (positioning member, front positioning member)
45 Rear positioning bar (positioning member, rear positioning member)
46 Standing portion 47 Locking covering portion 48 Side positioning bar (positioning member, side positioning member)
49 Mounting area 50 Clamp (clamp member)
W Semiconductor wafer
Claims (2)
容器本体の内部両側に、半導体ウェーハを略水平に支持可能な一対の支持片を対向させて設け、この一対の支持片を上下方向に所定の間隔で複数配列し、
アダプタを容器本体内の一対の支持片に支持される略板形に形成し、このアダプタの容器本体正面側に位置する前部を直線的に切り欠き、アダプタのレチクル収容容器を搭載する搭載面に、レチクル収容容器の周縁前部に近接する前部位置決め部材、レチクル収容容器の周縁後部に近接する後部位置決め部材、及びレチクル収容容器の周縁側部に近接する一対の側部位置決め部材を所定の間隔をおいて配列するとともに、前部位置決め部材と一対の側部位置決め部材のうち少なくとも前部位置決め部材に、レチクル収容容器の周縁部に上方から係止するクランプ部材を回転可能に支持させ、後部位置決め部材を断面略逆L字形に形成し、この後部位置決め部材を、レチクル収容容器の周縁後部に横方向から対向する起立部と、この起立部に締結具を介し着脱自在に螺着されてレチクル収容容器の周縁後部に上方から係止する係止被覆部とに分割したことを特徴とする基板収納容器。 A substrate storage container comprising: a container body capable of storing a plurality of semiconductor wafers arranged vertically; a lid body detachably fitted to the open front surface of the container body; and an adapter for mounting a reticle storage container stored in the container body,
A pair of support pieces capable of supporting the semiconductor wafers substantially horizontally are provided facing each other on both sides inside the container body, and a plurality of pairs of support pieces are arranged at predetermined intervals in the vertical direction;
a front positioning member adjacent to the front periphery of the reticle container, a rear positioning member adjacent to the rear periphery of the reticle container, and a pair of side positioning members adjacent to the side periphery of the reticle container, are arranged at a predetermined interval on a mounting surface of the adapter on which the reticle container is mounted; a front positioning member adjacent to the front periphery of the reticle container, a rear positioning member adjacent to the rear periphery of the reticle container, and a pair of side positioning members adjacent to the side periphery of the reticle container; a clamp member that engages with the periphery of the reticle container from above is rotatably supported on at least the front positioning member of the front positioning member and the pair of side positioning members; the rear positioning member is formed into a substantially inverted L-shaped cross section; and the rear positioning member is divided into an upright portion that laterally faces the rear periphery of the reticle container, and a locking cover portion that is detachably screwed to the upright portion via a fastener and locks with the rear periphery of the reticle container from above .
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| JP2000091401A (en) | 1998-09-09 | 2000-03-31 | Toshiba Corp | Cassette transport system, semiconductor exposure apparatus, and reticle transport method |
| JP3150378U (en) | 2009-02-26 | 2009-05-07 | 有限会社橋本通商 | Picture frame |
| JP2012099663A (en) | 2010-11-02 | 2012-05-24 | Toshiba Corp | Mask carrying system and mask carrying adapter |
| JP2013239643A (en) | 2012-05-16 | 2013-11-28 | Shin Etsu Polymer Co Ltd | Substrate housing container |
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| JPH0758192A (en) | 1993-08-12 | 1995-03-03 | Nikon Corp | Board storage case |
| JP2011003723A (en) | 2009-06-18 | 2011-01-06 | Nikon Corp | Mask conveyance apparatus, exposure apparatus, mask conveyance method, and device manufacturing method |
| JP5916508B2 (en) | 2012-05-14 | 2016-05-11 | 信越ポリマー株式会社 | Substrate storage container |
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| JP2000091401A (en) | 1998-09-09 | 2000-03-31 | Toshiba Corp | Cassette transport system, semiconductor exposure apparatus, and reticle transport method |
| JP3150378U (en) | 2009-02-26 | 2009-05-07 | 有限会社橋本通商 | Picture frame |
| JP2012099663A (en) | 2010-11-02 | 2012-05-24 | Toshiba Corp | Mask carrying system and mask carrying adapter |
| JP2013239643A (en) | 2012-05-16 | 2013-11-28 | Shin Etsu Polymer Co Ltd | Substrate housing container |
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