JP7795595B2 - Manufacturing method for busbar assembly and flat plate laminate structure for busbar assembly - Google Patents

Description

The present invention relates to a method for manufacturing a busbar assembly in which multiple busbars are electrically insulated and mechanically connected, and to a flat plate laminate structure for a busbar assembly.

Busbar assemblies comprising multiple busbars that are electrically insulated from one another but mechanically connected have been proposed and are used in a variety of fields.

For example, a stacked busbar assembly has been proposed in which one flat busbar and another flat busbar are stacked one on top of the other in a parallel relationship (see Patent Documents 1 and 2 below).

In the laminated bus bar assembly, the opposing flat surfaces of one flat bus bar and the opposing flat surfaces of another flat bus bar are arranged to face each other across an insulating layer, which makes it difficult to ensure sufficient reliability in terms of insulation.
In particular, if the thickness of the insulating layer between the one flat bus bar and the other flat bus bar is reduced in order to reduce the size in the vertical direction, there is a risk of leakage current flowing between the two bus bars.

To solve the problems with the laminated busbar assembly, the applicant filed an application for and received a patent for a planar busbar assembly in which first and second busbars made of conductive metal flat plates are arranged side by side on the same plane (see Patent Documents 3 and 4 below).

Figure 17 shows a vertical cross-sectional view of a semiconductor module 600 in which a semiconductor element 110 such as an LED is mounted on the flat busbar assembly 500.

As shown in FIG. 17 , the planar busbar assembly 500 includes a plurality of first and second busbars 510(1), 510(2) formed from a conductive flat plate member and arranged in the same plane with a gap 519 between opposing side surfaces; a busbar-side insulating layer 520 including a gap-filling portion 529 filled in the gap 519 and an upper surface-side laminated portion 521 extending integrally from the gap-filling portion 529 so as to cover the upper surface on one side in the plate thickness direction of the busbar connected body formed by the gap-filling portion 529; and a frame body 530 including a frame body main body 531 having the same external shape as the busbar connected body in a planar view and provided with a central hole 523 penetrating vertically, and a frame body-side insulating layer 540 covering the outer peripheral surface of the frame body main body 531.

In the planar busbar assembly 500, one of the first and second busbars 510(1), 510(2) acts as an anode, and the other acts as a cathode.

The upper surface laminated portion 521 is provided with first and second upper surface openings 522(1), 522(2) that expose at least a portion of the upper surfaces of the first and second bus bars 510(1), 510(2).

The portion of the upper surface of the first bus bar 510(1) that is exposed through the first upper surface opening 522(1) forms the upper surface connection portion of the first bus bar 510(1), and the portion of the upper surface of the second bus bar 510(2) that is exposed through the second upper surface opening 522(2) forms the upper surface connection portion of the second bus bar 510(2).

One of the pair of electrode layers 111, 112 of the semiconductor element 110 is attached in an electrically connected state to the upper surface connection portion of one of the first and second bus bars 510(1), 510(2), and the other electrode layer of the semiconductor element 110 is electrically connected to the upper surface connection portion of the other of the first and second bus bars 510(1), 510(2) via an electrical connection member such as a wire 120.

That is, the semiconductor element 110 has an element body 115 and an upper electrode layer 111 and a lower electrode layer 112 disposed on one and the other thickness-wise sides of the element body 115, respectively. The lower electrode layer 112 is mechanically and electrically connected to the upper surface connection portion of one of the first and second bus bars 510(1), 510(2) (the first bus bar 510(1) in FIG. 17) via, for example, a plating layer (not shown), and the upper electrode layer 111 is electrically connected to the upper surface connection portion of the other of the first and second bus bars 510(1), 510(2) (the second bus bar 510(2) in FIG. 17) via a wire 120.

In the illustrated embodiment, the busbar-side insulating layer 520 further includes a lower-surface-side laminated portion 523 that covers the lower surface of the busbar connected body on the other side in the plate thickness direction, and a side-surface-side laminated portion 525 that covers the side surface of the busbar connected body, and the lower-surface-side laminated portion 523 is provided with first and second lower-surface-side openings 524(1), 524(2) that expose at least a portion of the lower surface of each of the first and second busbars 510(1), 510(2).

The portion of the underside of the first bus bar 510(1) that is exposed through the first underside opening 524(1) forms the underside connection portion of the first bus bar 510(1), and the portion of the underside of the second bus bar 510(2) that is exposed through the second underside opening 524(2) forms the underside connection portion of the second bus bar 510(2).

The frame body 530 is a member for preventing the leakage and detachment of the sealing resin body 130 that protects the semiconductor element 110 and the wires 120, and is fixed to the periphery of the upper surface of the busbar connector with the first and second upper surface openings 522(1), 522(2) positioned within the central hole 535 in a plan view.

That is, the encapsulating resin body 130 is formed by pouring insulating resin onto the upper surface of the busbar connector so as to surround the semiconductor element 110 and the wire 120 and then hardening it. The frame body 530 prevents the insulating resin from flowing out before hardening and also prevents the encapsulating resin body 130 from detaching from the busbar assembly 500 after hardening.

The above-mentioned Patent Document 4 describes a manufacturing method (hereinafter referred to as a conventional manufacturing method) that can efficiently manufacture the frame-attached planar bus bar assembly 500.
A conventional manufacturing method will be described below.

The conventional manufacturing method includes a step of preparing a bus bar flat plate 550 made of a conductive metal.
FIG. 18 shows a plan view of the bus bar plate 550. As shown in FIG.

As shown in Figure 18, the busbar plate 550 has a busbar row 555 that runs along a first direction (the Y direction in Figure 18 below) of the X-Y plane in which the busbar plate 550 is located.

The busbar row 555 has an outer shape in a plan view that corresponds to the busbar connector, and includes a plurality of (five in the illustrated embodiment) busbar forming regions 560 arranged in series along a first direction in the X-Y plane, and a plurality of (six in the illustrated embodiment) busbar side connecting pieces 570 that integrally connect the plurality of busbar forming regions 560.

The conventional manufacturing method includes a slit forming step.
The slit forming process is configured to form slits 569 in the busbar forming region 560, which penetrate through the plate thickness direction and have the same width as the gap 519, and to divide the busbar forming region 560 into a plurality of busbar forming portions 565(1), 565(2) corresponding to the plurality of busbars 510(1), 510(2).
FIG. 18 shows the state after the slit forming step.

As shown in FIG. 18, the slit 569 formed in one busbar forming region 560 in the slit forming process has one longitudinal end extending into a busbar side connecting piece 570 connected to one side of the busbar forming region in the first direction (the Y direction in the illustrated embodiment) (e.g., the downward side in FIG. 18), and the other longitudinal end extending into a busbar side connecting piece 570 connected to the other side of the busbar forming region 560 in the first direction (e.g., the upward side in FIG. 18).

The conventional manufacturing method further includes a busbar side insulating layer forming step of applying an insulating resin paint to the inside of the slit 569 and the outer peripheral surface of the busbar forming region 560 and curing it to provide the busbar side insulating layer 520.
FIG. 19 shows a plan view of the bus bar forming plate 550 after the bus bar side insulating layer forming step.

The conventional manufacturing method further includes a laser light irradiation step of irradiating the upper surface laminated portion 521 of the busbar side insulating layer 520 with laser light to form the first and second upper surface openings 522(1), 522(2), and irradiating the lower surface laminated portion 523 with laser light to form the first and second lower surface openings 524(1), 524(2).
20(a) and 20(b) are a plan view and a bottom view, respectively, of the bus bar forming plate 550 after the laser light irradiation step.

Conventional manufacturing methods include a frame formation process for forming the frame 530, separate from the processing of the busbar flat plate 550.

More specifically, the frame forming process includes a step of preparing a frame plate 650 made of conductive metal.
FIG. 21 shows a plan view of the frame plate 650. As shown in FIG.

As shown in Figure 21, the frame body flat plate 650 has a frame body row 655 that runs in the same direction as the bus bar row 555 (the Y direction in the X-Y plane).

The frame body row 655 has a plurality of frame body forming regions 660 (five in the illustrated embodiment) that have an outer shape in a plan view that corresponds to the busbar forming regions 560 and that have through holes 665 that correspond to the central hole 35, and a plurality of frame body side connecting pieces 670 (six in the illustrated embodiment) that integrally connect the plurality of frame body forming regions 660.

The frame forming process further includes a frame-side insulating layer forming step of applying an insulating resin paint to the outer peripheral surface of the frame forming region 660 and hardening it to provide the frame-side insulating layer 540 .
FIG. 22 shows a plan view of the frame body flat plate 650 after the frame body side insulating layer forming step.

The conventional manufacturing method further includes a flat plate fixing process in which the lower surface of the frame body forming region 660 after the frame body forming process is fixed in an overlapping state to the upper surface of the busbar forming region 560 after the busbar side insulating layer forming process.
FIG. 23 shows a plan view of the bus bar forming plate 550 and the frame forming plate 650 after the plate fixing step.

The conventional manufacturing method further includes a cutting step, after the flat plate fixing step, in which the fixed busbar forming region 560 and the fixed frame body forming region 660 are cut from the busbar flat plate 550 and the frame body flat plate 650.

Although the conventional manufacturing method of this configuration is useful in that it allows multiple planar busbar assemblies 500 with the frame to be manufactured simultaneously, there is still room for improvement.

In conventional manufacturing methods, as shown in Figure 23, when the busbar forming plate 550 and the frame forming plate 650 are fixed together so that the busbar forming region 560 and the frame forming region 660 overlap, the busbar connecting piece 570 and the frame connecting piece 670 also overlap each other.

In this case, the boundary D1 between the frame body forming region 660 and the frame body side connecting piece 670 and the boundary D2 between the busbar forming region 560 and the busbar side connecting piece 570 are located at the same position in a plan view.

Therefore, in the cutting process in the conventional manufacturing method, the cutting process for separating the frame body forming region 660 from the frame body flat plate 650 and the cutting process for separating the busbar forming region 560 from the busbar flat plate 550 are performed in a single cutting process at the same position in a plan view.

24(a) and (b) are enlarged cross-sectional views taken along line XXIV-XXIV in FIG. 23. FIG.
24(a) and (b) show the state before and after cutting, respectively.
In addition, reference numeral 180 in Figures 24(a) and (b) denotes a cutting member such as a diamond blade, and reference numeral 190 denotes a holding member that fixes the bus bar flat plate 550 and the frame flat plate 650 and is provided with a guide for the cutting member 180.

As shown in Figure 24(b), if the boundary D1 between the frame body forming region 660 and the frame body side connecting piece 670 and the boundary D2 between the busbar forming region 560 and the busbar side connecting piece 570, which are located in the same position in a plan view, are cut in a single cutting process, a burr 680 that occurs on one of the busbar forming plate 550 and the frame body forming plate 650, which is located upstream in the cutting direction (the frame body forming plate 650 in Figures 24(a) and 24(b)), can damage the insulating layer of the other plate located directly below (the busbar forming plate 550 in Figures 24(a) and 24(b)). In some cases, this can come into contact with the plate located downstream in the cutting direction (the busbar forming plate 550 in Figures 24(a) and 24(b)). If this occurs, the resulting product will be unusable and will be deemed defective.

Patent No. 4432913 Patent No. 6487769 Patent No. 6637002 Patent No. 6637003

The present invention was developed in consideration of the above-mentioned prior art, and aims to provide a method for manufacturing busbar assemblies that can simultaneously manufacture multiple frame-equipped planar busbar assemblies with a high yield.

In order to achieve the above object, the present invention provides a method for manufacturing a busbar assembly, the method comprising: a plurality of busbars formed of conductive flat plate-like members and arranged in the same plane with gaps between opposing side surfaces; a busbar-side insulating layer including gap filling portions filled in the gaps and a top surface laminate portion covering an upper surface on one side in a plate thickness direction of a busbar connected body formed by the gap filling portions; and a frame body having a frame body main body having the same external shape in a plan view as the busbar connected body and provided with a central hole penetrating vertically; and a frame body-side insulating layer covering an outer peripheral surface of the frame body, the top surface laminate portion being provided with one or more top surface openings exposing at least a portion of the upper surface of each of the plurality of busbars, and the frame body being fixed to the periphery of the upper surface of the busbar connected body via the top surface laminate portion with the one or more top surface openings positioned within the central hole in a plan view; a slit forming step of forming one or more slits in the busbar forming region that penetrate in the plate thickness direction and have the same width as the gap, thereby dividing the busbar forming region into a plurality of busbar forming portions corresponding to the plurality of busbars; a busbar-side insulating layer forming step of applying and curing an insulating resin paint at least within the slits and on an upper surface of the busbar forming region to provide the busbar-side insulating layer; a laser light irradiation step of irradiating a top laminated portion of the busbar-side insulating layer with laser light to provide the one or more top openings; a frame forming process that is performed before, after, or in parallel with the processes from the busbar plate preparing step to the laser light irradiation step, the frame forming step comprising: a step of preparing a frame plate made of a conductive metal that includes a frame forming region that has an outer shape in a plan view that corresponds to the busbar forming region and in which a through hole corresponding to the central hole is formed; and a frame-side insulating layer forming step of applying and curing an insulating resin paint on an outer peripheral surface of the frame forming region to provide the frame-side insulating layer. a plate fixing step of fixing, before or after the laser light irradiation step, a lower surface of the frame body forming region after the frame body forming step in an overlapping state to an upper surface of the busbar forming region after the busbar side insulating layer forming step; and a cutting step of cutting, after the plate fixing step, the fixed busbar forming region and the fixed frame body forming region from the busbar forming plate and the frame body forming plate, a busbar row formed by a plurality of the busbar forming areas arranged in a row and a plurality of busbar side connecting pieces integrally connecting the plurality of busbar forming areas, wherein one longitudinal end side of the slit formed in one busbar forming area extends into a busbar side connecting piece connected to one side of the one busbar forming area in a first direction, and the other longitudinal end side of the slit extends into a busbar side connecting piece connected to the other side of the one busbar forming area in the first direction, and the frame body flat plate is a frame body row formed by a plurality of frame body forming regions arranged in series in a first direction at the same pitch as the plurality of busbar forming regions and a plurality of frame body side connecting pieces integrally connecting the plurality of frame body forming regions, wherein the busbar side connecting pieces are arranged at the center in the width direction of the busbar row and the frame body side connecting pieces are arranged on both sides of the center in the width direction of the frame body row, and when the frame body flat plate and the busbar flat plate are fixed together, the busbar side connecting pieces and the frame body side connecting pieces The busbars are displaced relative to each other so as not to overlap in a planar view, and the cutting step includes a busbar-side cutting process for cutting the boundary between the busbar forming region and the busbar-side connecting piece from the side of the surface facing the frame body flat plate toward the side of the surface opposite the frame body flat plate, and a frame body-side cutting process for cutting the boundary between the frame body forming region and the frame body-side connecting piece from the side of the surface facing the busbar flat plate toward the side of the surface opposite the busbar flat plate.

Preferably, the busbar plate has a plurality of busbar rows arranged in parallel in a second direction perpendicular to the first direction within the X-Y plane on which the busbar plate is located, and busbar-side gripping pieces that hold the plurality of busbar rows together, and the frame plate has a plurality of frame rows arranged in parallel in the second direction with the same pitch and number as the plurality of busbar rows, and frame-side gripping pieces that hold the plurality of frame rows together.

The present invention also provides a wiring board comprising: a plurality of bus bars formed of conductive flat plate-like members and arranged in the same plane with gaps between opposing side surfaces; a bus bar-side insulating layer including gap filling portions filled in the gaps and an upper surface-side laminate portion covering an upper surface on one side in a plate thickness direction of a bus bar connected body formed by the gap filling portions; and a frame having a frame body main body having the same external shape as the bus bar connected body in a plan view and provided with a central hole penetrating vertically; and a frame body-side insulating layer covering an outer peripheral surface of the frame body main body, wherein the upper surface-side laminate portion is provided with one or more upper surface-side openings exposing at least a part of the upper surface of each of the plurality of bus bars, and the frame body is fixed to the periphery of the upper surface of the bus bar connected body via the upper surface-side laminate portion with the one or more upper surface-side openings positioned within the central hole in a plan view. a busbar forming region formed in series along a first direction of an X-Y plane in which the busbar forming plate is located, and a busbar row formed by a plurality of busbar side connecting pieces integrally connecting the plurality of busbar forming regions, the busbar forming region being formed by a plurality of busbar side connecting pieces penetrating the busbar forming region in a plate thickness direction and having the same width as the gap; a busbar-side insulating coating film having a portion that forms the upper surface side laminated portion and that is provided with the one or more upper surface openings in the portion that forms the upper surface side laminated portion; a frame body flat plate made of a conductive metal having an outer shape in a plan view that corresponds to the busbar forming region, and having a frame body row formed by a plurality of frame body forming regions that are arranged in series in a first direction at the same pitch as the plurality of busbar forming regions in the busbar row, and a plurality of frame body connecting pieces that integrally connect the plurality of frame body forming regions, wherein each of the plurality of frame body forming regions is provided with a through hole that forms the central hole; and a frame body flat plate provided on the outer peripheral surface of the frame body forming region and that forms the frame body side insulating layer, the busbar forming region on which the frame body side insulating coating film is provided overlaps the busbar forming region on which the frame body side insulating coating film is provided, the busbar side connecting piece is disposed at the center in the width direction of the busbar row, and the frame body side connecting pieces are disposed on both sides of the center in the width direction of the frame body row, and the busbar side connecting piece and the frame body side connecting piece are displaced relative to each other so as not to overlap in a plan view when the frame body flat plate and the busbar flat plate are fixed in place.

Preferably, the busbar plate has a plurality of busbar rows arranged in parallel in a second direction perpendicular to the first direction in the X-Y plane on which the busbar plate is located, and busbar-side gripping pieces that hold the plurality of busbar rows together, and the frame plate has a plurality of frame body rows arranged in parallel in the second direction at the same pitch as the plurality of busbar rows, and frame body-side gripping pieces that hold the plurality of frame body rows together.

Preferably, the busbar-side insulating coating further includes a portion that forms a lower-surface-side laminated portion provided on the lower surface of the busbar forming area and covers the lower surface of the busbar connected body on the other side in the plate thickness direction, and a portion that forms a side-surface-side laminated portion provided on the side surface of the busbar forming area and covers the side surface of the busbar connected body, and the portion that forms the lower-surface-side laminated portion is provided with one or more lower-surface-side openings that expose at least a portion of the lower surface of each of the plurality of busbars.

The busbar assembly manufacturing method of the present invention allows multiple framed planar busbar assemblies to be manufactured simultaneously with high yield.

FIG. 1(a) is a plan view of a semiconductor module in which semiconductor elements such as LEDs are mounted on a busbar assembly manufactured by a manufacturing method according to a first embodiment of the present invention, and FIG. 1(b) is a cross-sectional view taken along line I(b)-I(b) in FIG. 1(a). FIG. 2 is a plan view of the bus bar plate used in the manufacturing method according to the first embodiment, showing the state after the slit forming step in the manufacturing method. FIG. 3 is a plan view of the busbar forming plate after the busbar-side insulating layer forming step in the manufacturing method according to the first embodiment. FIG. 4 is a plan view of the bus bar forming plate after the laser light irradiation step in the manufacturing method according to the first embodiment. FIG. 5 is a bottom view of the bus bar forming plate after the laser light irradiation step in the manufacturing method according to the first embodiment. FIG. 6 is a plan view of a frame plate used in the manufacturing method according to the first embodiment. FIG. 7 is a plan view of the frame-forming plate after the frame-side insulating layer forming step in the manufacturing method according to the first embodiment. FIG. 8 is a plan view of the bus bar forming plate and the frame forming plate after the plate fixing step in the manufacturing method according to the first embodiment. FIG. 9 is an enlarged view of part IX in FIG. Fig. 10(a) is a cross-sectional view taken along line X(a)-X(a) in Fig. 9, showing a state in which frame-side cutting processing is being performed in the cutting step in the manufacturing method according to the first embodiment. Fig. 10(b) is a cross-sectional view taken along line X(b)-X(b) in Fig. 9, showing a state in which busbar-side cutting processing is being performed in the cutting step. FIG. 11 is a plan view of a bus bar plate used in a manufacturing method according to the second embodiment of the present invention, showing the state after the slit forming step in the manufacturing method. FIG. 12 is a plan view of a frame plate used in the manufacturing method according to the second embodiment. FIG. 13 is a plan view of the bus bar forming plate and the frame forming plate after the plate fixing step in the manufacturing method according to the second embodiment. FIG. 14 is an enlarged view of the portion XIV in FIG. Fig. 15(a) is a cross-sectional view taken along line XV(a)-XV(a) in Fig. 14, showing a state in which frame-side cutting processing is being performed in the cutting step in the manufacturing method according to the second embodiment. Fig. 15(b) is a cross-sectional view taken along line X(b)-X(b) in Fig. 14, showing a state in which busbar-side cutting processing is being performed in the cutting step. FIG. 16 is a plan view of the bus bar plate and the frame plate used in the manufacturing method according to the modified example of the second embodiment after the plate fixing step. FIG. 17 is a vertical cross-sectional view of a semiconductor module in which semiconductor elements such as LEDs are mounted on a flat bus bar assembly. FIG. 18 is a plan view of a bus bar plate used in a conventional manufacturing method, showing the state after the slit forming step in the manufacturing method. FIG. 19 is a plan view of the bus bar forming plate after the bus bar side insulating layer forming step in the conventional manufacturing method. 20(a) and 20(b) are a plan view and a bottom view, respectively, of the bus bar forming plate after the laser light irradiation step in the conventional manufacturing method. FIG. 21 is a plan view of a frame plate used in a conventional manufacturing method. FIG. 22 is a plan view of the frame-forming plate after the frame-side insulating layer forming step in the conventional manufacturing method. FIG. 23 is a plan view of the bus bar forming plate and the frame forming plate after the plate fixing step in the conventional manufacturing method. 24(a) and (b) are enlarged cross-sectional views taken along line XXIV-XXIV in FIG. 23, showing the state before and after cutting, respectively.

First Embodiment
Hereinafter, an embodiment of a method for manufacturing a busbar assembly according to the present invention will be described with reference to the accompanying drawings.
1(a) and 1(b) show a plan view and a cross-sectional view along line I(b)-I(b) in FIG. 1(a), respectively, of a semiconductor module 101 in which a semiconductor element 110 such as an LED is mounted on a busbar assembly 1 manufactured by the manufacturing method according to this embodiment.

As shown in Figures 1(a) and 1(b), the busbar assembly 1 comprises a plurality of busbars 10 formed from a conductive flat plate member and arranged in parallel in the same plane with gaps 19 between opposing side surfaces 15; a busbar-side insulating layer 20 including gap-filling portions 29 filled in the gaps 19 and an upper surface-side laminated portion 21 covering the upper surface of a busbar connection formed by connecting the plurality of busbars 10 via the gap-filling portions 29; and a frame body 30 having a frame body main body 31 having the same external shape as the busbar connection in a planar view and a central hole 35 penetrating it vertically, and a frame body-side insulating layer 40 covering the outer peripheral surface of the frame body main body 31.

The bus bar 10 is made of a conductive metal such as Cu.
The bus bar assembly 1 according to this embodiment has two bus bars, namely, first and second bus bars 10(1) and 10(2), as the plurality of bus bars 10.
Of course, the plurality of bus bars 10 may include three or more bus bars.

Each of the first and second bus bars 10(1), 10(2) has an upper surface 11 and a lower surface 12 facing one side and the other side in the thickness direction, respectively, and a side surface 15 connecting the upper surface 11 and the lower surface 13, with the side surfaces 15 of adjacent bus bars 10 facing each other across the gap 19.

The busbar-side insulating layer 20 is formed from an insulating resin coating that has heat resistance and insulating properties, such as polyamide-imide, polyimide, polyamide, or epoxy, and is preferably formed using Insulead (registered trademark).

The upper surface laminated portion 21 is provided with one or more upper surface openings 22(1), 22(2) that expose at least a portion of the upper surface of each of the first and second bus bars 10(1), 10(2).

As shown in Figures 1(a) and (b), in this embodiment, the upper surface laminate portion 21 is provided with a plurality of upper surface openings (first and second upper surface openings 22(1), 22(2)) that expose portions of the upper surfaces 11 of the plurality of bus bars 10 (the first and second bus bars 10(1), 10(2)).

Alternatively, the upper surface laminated portion 21 may be provided with a single upper surface opening that integrally exposes a portion of the upper surface 11 of the plurality of bus bars 10 (the first and second bus bars 10(1), 10(2)).

The portions of the upper surfaces 11 of the first and second bus bars 10(1) and 10(2) that are exposed through the upper surface openings (in this embodiment, the first and second upper surface openings 22(1) and 22(2)) form the upper surface connection portions 12.

One of the pair of electrode layers of the semiconductor element 110 is attached in an electrically connected state to the top surface connection portion 12 of one of the first and second bus bars 10(1), 10(2) (e.g., the first bus bar 10(1)), and the other of the pair of electrode layers of the semiconductor element 110 is electrically connected to the top surface connection portion 12 of the other of the first and second bus bars 10(1), 10(2) (e.g., the second bus bar 10(2)) via an electrical connection member 120 such as a wire.

That is, the semiconductor element 110 has an upper electrode layer 111 and a lower electrode layer 112 on the upper surface on one side in the thickness direction and on the lower surface on the other side in the thickness direction, respectively, and has an element body 115 between the upper electrode layer 111 and the lower electrode layer 112.

In the semiconductor module 101, the lower electrode layer 112 of the semiconductor element 110 is fixed in an electrically connected state to the upper surface connection portion 12 of the first bus bar 10(1), and the upper electrode layer 111 is electrically connected to the upper surface connection portion 12 of the second bus bar 10(2) via a wire 120.

One of the first and second bus bars 10(1), 10(2) acts as a first electrode, which is one of the anode and cathode (e.g., the anode), and the other of the first and second bus bars 10(1), 10(2) acts as a second electrode, which is the other of the anode and cathode (e.g., the cathode).

At least a portion of the underside 13 of each of the first and second bus bars 10(1) and 10(2) is exposed, forming a underside connection portion 14.

In this embodiment, as shown in FIG. 1(b), the busbar-side insulating layer 20 has a lower-surface-side laminated portion 23 that covers the lower surface of the busbar connected body, and the lower-surface-side laminated portion 23 is provided with first and second lower-surface-side openings 24(1) and 24(2) that expose portions of the lower surfaces 13 of the first and second busbars 10(1) and 10(2), respectively.

Alternatively, the lower laminated portion 23 may be provided with a single lower opening that integrally exposes a portion of the lower surfaces 13 of the plurality of bus bars 10 (the first and second bus bars 10(1), 10(2)).

The portions of the undersides 13 of the first and second bus bars 10(1), 10(2) that are exposed through the underside openings (in this embodiment, the first and second underside openings 24(1), 24(2)) form the underside connection portions 14.
The lower surface side connection portions 14 function as external connection terminals for electrically connecting the corresponding bus bars 10(1), 10(2) to the outside.

In this embodiment, the busbar-side insulating layer 20 integrally includes the gap-filling portion 29, the upper surface-side laminated portion 21, and the lower surface-side laminated portion 23, as well as a side surface-side laminated portion 25 that covers the side surface of the busbar connector.

The frame body 30 holds the sealing resin body 130 that protects the semiconductor element 110 and the wires 120 mounted on the upper surface side connection portion 12.

More specifically, the frame body 30 is fixed to the periphery of the upper surface of the busbar connector via the upper surface laminated portion 21, with the one or more upper surface openings (in this embodiment, the first and second upper surface openings 22(1), 22(2)) positioned within the central hole 35 in a plan view.

The frame body 31 is formed from a conductive metal material (preferably the same material as the bus bar 10).

The frame-side insulating layer 40 is formed from an insulating resin coating that has heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, or epoxy, and is preferably formed using Insulead (registered trademark).

The sealing resin layer 130 is formed from a transparent insulating resin material such as polyimide, polyamide, or epoxy.

More specifically, the insulating resin material that forms the sealing resin layer 130 is poured into the housing space defined by the frame 30 so as to surround the semiconductor element 110 and the wires 120 .
The frame 30 prevents the insulating resin material from flowing out before hardening and prevents the sealing resin layer 130 from detaching from the busbar assembly 1 after hardening.

The following describes a manufacturing method for the busbar assembly 1 according to this embodiment.

The manufacturing method includes a step of preparing a bus bar flat plate 200A made of a conductive metal.
FIG. 2 shows a plan view of the bus bar plate 200A.
FIG. 2 shows the state after the slit forming step described below.

The busbar plate 200A has multiple busbar assembly forming regions 210 whose outer shape in a plan view corresponds to the busbar connected body formed by connecting multiple busbars 10 (in this embodiment, the first and second busbars 10(1), 10(2)) via the busbar-side insulating layer 20.

The busbar assembly forming area 210 has a length in a first direction (Y direction in this embodiment) in the X-Y plane in which the busbar plate 200A is located that is the same as the length of the busbar assembly 1 along a direction parallel to the gap 19, and a length in a second direction (X direction length in this embodiment) perpendicular to the first direction in the X-Y plane that is the same as the length of the busbar assembly 1 along the width direction of the gap 19.

As shown in FIG. 2, in this embodiment, the busbar plate 200A has m (m is an integer of 2 or more; in the illustrated embodiment, m=3) busbar rows 205A (first to third busbar rows 205A(1) to (3) in this embodiment) arranged in parallel in the X direction of the X-Y plane, and a busbar-side gripping piece 207 that holds the m busbar rows 205A together.

Each busbar row 205A(1)-(3) has n busbar forming regions 210 (n is an integer of 2 or greater; in the illustrated embodiment, n=5) arranged in series along the Y direction of the X-Y plane, and a plurality (n+1) of busbar side connecting pieces 230A that integrally connect the n busbar forming regions 210.

In other words, in this embodiment, the busbar forming plate 200A has m x n (3 x 5 = 15 in the illustrated embodiment) busbar forming regions 210 arranged in a rectangular shape.

In this embodiment, the busbar side gripping piece 207 has first and second busbar side gripping pieces 207(1), 207(2) arranged on one and the other longitudinal sides of the busbar row 205A (in this embodiment, the first to third busbar rows 205A(1) to (3)).
Of the multiple busbar side connecting pieces 230A, the busbar side connecting piece 230A(1) located at the outermost position on one longitudinal side of the busbar row 205A is connected to the first busbar side gripping piece 207(1), and the busbar side connecting piece 230A(2) located at the outermost position on the other longitudinal side of the busbar row 205A is connected to the second busbar gripping piece 207(2).

As shown in Figure 2, alignment holes 208 are formed in the first and second busbar side gripping pieces 207(1) and 207(2).

The manufacturing method further includes a slit forming step in which one or more slits 219 that penetrate the busbar forming region 210 in the plate thickness direction and have the same width as the gap 19 are formed, thereby dividing the busbar forming region 210 into multiple busbar forming portions 220 corresponding to the multiple busbars 10.

As described above, in this embodiment, the busbar assembly 1 has the first and second busbars 10(1), 10(2) as the multiple busbars 10. Therefore, as shown in FIG. 2, the slit forming process is configured to form one slit 219 in the busbar forming region 210 to divide the busbar forming region 210 into first and second busbar forming portions 220(1), 220(2).

The slit 219 formed in one busbar forming region 210 has one longitudinal end extending into the busbar side connecting piece 230A connected to one side of the busbar forming region 210 in the Y direction, and the other longitudinal end extending into the busbar side connecting piece 230A connected to the other side of the busbar forming region 210 in the Y direction.

That is, the longitudinal length of the slit 219 is made greater than the length of the busbar forming area 210 along the longitudinal direction of the busbar row 205A, and after the slit forming step, the first and second busbar forming portions 220(1), 220(2) are maintained in a connected state to each other via a pair of busbar side connecting pieces 230A located on both sides of the busbar assembly forming area 210 in the longitudinal direction of the busbar row 205A.
By providing such a configuration, the slit 219 (the gap 19) can be formed with high precision.

The manufacturing method further includes a busbar side insulating layer forming step of applying and curing an insulating resin paint at least in the slits 219 and on the upper surface of the busbar forming region 210 to provide the busbar side insulating layer 20.
FIG. 3 shows a plan view of the busbar forming plate 200A after the busbar side insulating layer forming step.

The application of the insulating resin paint in the busbar-side insulating layer formation process can be carried out by, for example, electrodeposition coating, electrostatic powder coating, or spray coating.

As described above, in the busbar assembly 1, the busbar-side insulating layer 20 has the gap-filling portion 29 and the top-side laminated portion 21, as well as the bottom-side laminated portion 23 and the side-side laminated portion 25.

Therefore, the busbar-side insulating layer forming process is configured to apply insulating resin paint to the bottom and side surfaces of the busbar forming area 210 in addition to the inside of the slit 219 and the top surface of the busbar forming area 210.

The manufacturing method further includes a laser light irradiation step of irradiating the upper surface side laminate portion 21 of the busbar side insulating layer 20 with laser light to form the one or more upper surface side openings 22 (in this embodiment, the first and second upper surface side openings 22(1), 22(2)).
FIG. 4 shows a plan view of the bus bar forming plate 200A after the laser light irradiation step.

As mentioned above, in the busbar assembly 1, the first and second lower surface openings 24(1), 24(2) are provided in the lower surface laminated portion 23.

Therefore, the laser light irradiation process is configured to irradiate the upper surface laminated portion 21 with laser light to form the first and second upper surface openings 22(1), 22(2), as well as the lower surface laminated portion 23 with laser light to form the first and second lower surface openings 24(1), 24(2).
FIG. 5 shows a bottom view of the busbar forming plate 200A after the first and second lower openings 24(1), 24(2) have been formed by irradiating the lower laminated portion 23 with laser light.

The manufacturing method includes a frame formation process that is performed before, after, or in parallel with the processes from the process of preparing the busbar flat plate 200A to the laser light irradiation process.

The frame body forming process includes a step of preparing a frame body flat plate 300A made of a conductive metal, which includes a frame body forming region 310 having a planar outer shape corresponding to the busbar forming region 210 and in which a through hole 315 corresponding to the central hole 35 is formed.
FIG. 6 shows a plan view of the frame plate 300A.

As shown in Figure 6, the frame body flat plate 300A has n frame body rows 305A (in this embodiment, the first to fifth frame body rows 305A (1) to (5)) and a frame body side gripping piece 307 that holds the n frame body rows 305A together.
The n frame body rows 305A are arranged in parallel in the Y direction of the X-Y plane on which the frame body flat plate 300A is located, at the same pitch as the n (n=5 in this embodiment) busbar forming areas 210 in the busbar row 205A.

Each of the n frame body rows 305A has m frame body forming regions 310 arranged in series along the X direction of the X-Y plane on which the frame body flat plate 300A is located, at the same pitch as the m (in this embodiment, m = 3) bus bar rows 205A (in this embodiment, the first to third bus bar rows 205A(1) to (3)), and a plurality (m + 1) of frame body side connecting pieces 330A that integrally connect the m frame body forming regions 310.

In other words, the multiple (15 in this embodiment) busbar forming regions 210 on the busbar forming plate 200A and the multiple (15 in this embodiment) frame forming regions 310 on the frame forming plate 300A are positioned at the same position in the X-Y plane (i.e., in a planar view), while the multiple busbar side connecting pieces 230A and the multiple frame side connecting pieces 330A are displaced in position in the X-Y plane.

The frame-side connecting piece 307 has first and second frame-side gripping pieces 307(1) and 307(2) that are positioned in the same positions as the first and second busbar-side gripping pieces 207(1) and 207(2) in a plan view.

More specifically, as shown in FIG. 6, the frame body flat plate 300A is provided with a first intermediate piece 309(1) extending in the Y direction while connecting one end of the longitudinal direction (X direction) of the n frame body rows 305A (in this embodiment, the first to fifth frame body rows 305A(1) to (5)), and a second intermediate piece 309(2) extending in the Y direction while connecting the other end of the longitudinal direction (X direction) of the n frame body rows 305A.

The first frame-side gripping piece 307(1) is positioned in the same position as the first busbar-side gripping piece 207(1) in a planar view with one longitudinal end (Y direction) of the first and second intermediate pieces 309(1), 309(2) connected to each other, and the second frame-side gripping piece 307(2) is positioned in the same position as the second busbar-side gripping piece 207(2) with the other longitudinal end (Y direction) of the first and second intermediate pieces 309(2) connected to each other.

As shown in FIG. 6, the first and second frame-side gripping pieces 307(1) and 307(2) have alignment holes 308 formed in a plan view that are positioned at the same positions as the alignment holes 208 in the first and second busbar-side gripping pieces 207(1) and 207(2).

The frame forming process further includes a frame-side insulating layer forming step of applying an insulating resin paint to the outer peripheral surface of the frame forming region 310 and hardening it to provide the frame-side insulating layer 40 .
FIG. 7 shows a plan view of the frame-forming plate 300A after the frame-side insulating layer forming step.

The application of the insulating resin paint in the frame-side insulating layer formation process can be carried out by, for example, electrodeposition coating, electrostatic powder coating, or spray coating.

The manufacturing method further includes a flat plate fixing process in which the lower surface of the frame body forming region 310 after the frame body forming process is fixed in an overlapping state to the upper surface of the busbar forming region 210 after the busbar side insulating layer forming process.
Figure 8 shows a plan view of the busbar flat plate 200A and the frame body flat plate 300A after the flat plate fixing process (i.e., a plan view of the flat plate laminate structure for a busbar assembly in which the frame body flat plate 300A is fixed to the busbar flat plate 200A).

The bus bar flat plate 200A and the frame flat plate 300A can be fixed together using an insulating adhesive, for example, after the alignment holes 208, 308 are used to align the two flat plates 200A, 300A.
Alternatively, instead of or in addition to the adhesive, it is also possible to utilize the hardening action of the insulating resin coating film that forms the busbar side insulating layer 20 or the insulating resin coating film that forms the frame body side insulating layer 40.

In other words, when either the insulating resin coating forming the busbar-side insulating layer 20 or the insulating resin coating forming the frame-side insulating layer 40 is in a semi-cured state, the two flat plates 200A, 300A are pressed together in a polymerized state, and the semi-cured insulating resin coating is cured, thereby fixing the two flat plates 200A, 300A together.

The laser light irradiation process is performed after the busbar-side insulating layer 20 has completely hardened, but the order of the laser light irradiation process and the flat plate fixing process can be arbitrary.

In other words, if the laser light irradiation process is performed before the flat plate bonding process, the laser light irradiation process is performed on the busbar forming flat plate 200A in a state in which the busbar side insulating layer 20 has been fully cured, and then the busbar forming flat plate 200A and the frame forming flat plate 300A can be bonded together using an insulating adhesive.

Alternatively, the laser light irradiation process can be performed on the busbar plate 200A in a state where the busbar-side insulating layer 20 is fully cured, while the busbar plate 200A after the laser light irradiation process is pressed against the frame plate 300A in a state where the frame-side insulating layer 40 is semi-cured, thereby fixing the two plates 200A and 300A together. In this case, an insulating adhesive can also be used in addition to curing the frame-side insulating layer 40.

If the laser light irradiation process is performed after the flat plate bonding process, the busbar flat plate 200A, in which the busbar-side insulating layer 20 has been fully cured, and the frame body flat plate 300A, in which the frame body-side insulating layer 40 has been fully cured, can be bonded together using an insulating adhesive before the laser light irradiation process.

Alternatively, instead of or in addition to an insulating adhesive, the two flat plates 200A, 300A can be pressed together when at least one of the busbar-side insulating layer 20 and the frame-side insulating layer 40 is in a semi-cured state, and the curing action of the semi-cured insulating layer can be utilized to secure the two flat plates 200A, 300A together. In this case, an insulating adhesive can also be used in addition to the curing action of the semi-cured insulating layer.

Then, after the two flat plates 200A, 300A are fixed together and the busbar-side insulating layer 20 is completely cured, the laser light irradiation process is carried out.

The manufacturing method further includes a cutting step, after the flat plate fixing step, of cutting the fixed busbar forming region 210 and the fixed frame body forming region 310 from the busbar forming plate 200A and the frame body forming plate 300A.

The cutting process can be performed using a variety of cutting methods, including methods using a rotating or non-rotating dicing blade.

FIG. 9 shows an enlarged view of part IX in FIG.
As shown in Figures 8 and 9, the cutting process includes a frame body side cutting process in which the boundary C1 between the frame body forming region 310 and the frame body side connecting piece 330A is cut to separate the frame body forming region 310 from the frame body flat plate 300A, and a busbar side cutting process in which the boundary C2 between the busbar forming region 210 and the busbar side connecting piece 230A is cut to separate the busbar forming region 210 from the busbar flat plate 200A.

FIG. 10(a) is a cross-sectional view taken along line X(a)-X(a) in FIG. 9, showing the state in which the frame-side cutting process is being performed.
FIG. 10(b) is a cross-sectional view taken along line X(b)-X(b) in FIG. 9, showing the state in which the bus bar side cutting process is being performed.
In addition, reference numeral 180 in Figures 10(a) and (b) denotes a cutting member such as a diamond blade, and reference numeral 190 denotes a holding member that fixes the bus bar flat plate 200A and the frame body flat plate 300A and is provided with a guide for the cutting member 180.

As shown in Figure 10(a), the frame body side cutting process is configured to cut the boundary C1 between the frame body forming region 310 and the frame body side connecting piece 330A from the lower surface on the other side of the frame body flat plate 300A in the plate thickness direction toward the upper surface on one side of the plate thickness direction (i.e., from the side facing the bus bar flat plate 200A toward the side opposite the bus bar flat plate 200A).

As shown in Figure 10(b), the busbar-side cutting process is configured to cut the boundary C2 between the busbar forming region 210 and the busbar connecting piece 230A from the upper surface on one side of the busbar forming plate 200A in the plate thickness direction to the lower surface on the other side of the plate thickness direction (i.e., from the side facing the frame body forming plate 300A to the side opposite the frame body forming plate 300A).

With this configuration, even if burrs 185 are generated by the cutting process on the frame body side, these burrs 185 will not affect the bus bar substrate 200A.
Similarly, even if burrs 187 are generated by the cutting process on the bus bar side, these burrs 187 will not affect the frame body substrate 300A.

Therefore, the manufacturing method according to this embodiment makes it possible to simultaneously manufacture multiple frame-equipped planar busbar assemblies 1 with high yield.

Embodiment 2
Hereinafter, another embodiment of the method for manufacturing a busbar assembly according to the present invention will be described with reference to the accompanying drawings.

11 and 12 are plan views of a busbar forming plate 200B and a frame forming plate 300B used in the manufacturing method according to this embodiment, respectively.
In the drawings, the same members as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

The manufacturing method according to this embodiment differs from the manufacturing method according to the first embodiment only in that the busbar flat plate 200A and the frame body flat plate 300A are changed to busbar flat plate 200B and frame body flat plate 300B.

As shown in FIG. 11, the busbar forming plate 200B has a busbar row 205B including a plurality of (five in the illustrated embodiment) busbar forming regions 210 arranged in series along a first direction (the Y direction in this embodiment) of the X-Y plane in which the busbar forming plate 200B is located, and a plurality of (5 + 1 = 6 in the illustrated embodiment) busbar side connecting pieces 230B that integrally connect the plurality of busbar forming regions 210.

As shown in FIG. 12, the frame body flat plate 300B has a frame body row 305B including a plurality of frame body forming regions 310 arranged in series along the same direction (i.e., the first direction of the X-Y plane (the Y direction in this embodiment)) with the same pitch and the same number (five in this embodiment) of the plurality of busbar forming regions 210 in the busbar row 205B, and a plurality (5 + 1 = 6 in the illustrated embodiment) of frame body side connecting pieces 330B that integrally connect the plurality of frame body forming regions 310.

In other words, in the first embodiment, as shown in Figures 2 and 6, the longitudinal direction of the busbar row 205A (i.e., the arrangement direction of the multiple busbar forming regions 210 in the busbar row 205A) and the longitudinal direction of the frame body row 305A (i.e., the arrangement direction of the multiple frame body forming regions 310 in the frame body row 305A) are perpendicular to each other.

In contrast, in this embodiment, the longitudinal direction of the busbar row 205B (i.e., the arrangement direction of the multiple busbar forming regions 210 in the busbar row 205B) and the longitudinal direction of the frame body row 305B (i.e., the arrangement direction of the multiple frame body forming regions 310 in the frame body row 305B) are the same direction (in this embodiment, the Y direction in the X-Y plane).

Figure 13 shows a plan view of the busbar flat plate 200B and the frame body flat plate 300B after the flat plate fixing process (i.e., a plan view of the flat plate laminate structure for a busbar assembly in which the frame body flat plate 300B is fixed to the busbar flat plate 200B).
As shown in Figures 11 to 13, in this embodiment, the busbar side connecting piece 230B and the frame body side connecting piece 330B are displaced so that they do not overlap with each other in a planar view when the frame body flat plate 300B and the busbar flat plate 200B are fixed together.

In this embodiment, the busbar side connecting piece 230B is positioned at the center of the busbar row 205B in the width direction (X direction in this embodiment), and the frame body side connecting pieces 330B are positioned on both sides of the center of the frame body row 305B in the width direction (X direction in this embodiment).

FIG. 14 shows an enlarged view of the portion XIV in FIG.
As shown in Figures 13 and 14, in this embodiment, the boundary C2 between the busbar forming region 210 and the busbar connecting piece 230B and the boundary C1 between the frame body forming region 310 and the frame body side connecting piece 330B are in the same position in the longitudinal direction of the busbar row 205B and the frame body row 305B, but are displaced in the width direction of the busbar row 205B and the frame body row 305B.

FIG. 15(a) is a cross-sectional view taken along line XV(a)-XV(a) in FIG. 14, showing the state in which the frame-side cutting process is being performed.
FIG. 15(b) is a cross-sectional view taken along line X(b)-X(b) in FIG. 14, showing the state in which the bus bar side cutting process is being performed.

As shown in FIG. 15(a), in the same way as in the first embodiment, in the present embodiment, the frame body side cutting process is configured to cut the boundary C1 between the frame body forming region 310 and the frame body side connecting piece 330B from the lower surface on the other side of the frame body flat plate 300B in the plate thickness direction toward the upper surface on one side of the plate thickness direction (i.e., from the side facing the bus bar forming plate 200B toward the side opposite the bus bar forming plate 200B).

As shown in FIG. 15(b), in the present embodiment, as in the first embodiment, the busbar-side cutting process is configured to cut the boundary C2 between the busbar forming region 210 and the busbar connecting piece 230B from the upper surface on one side of the busbar forming plate 200B in the thickness direction toward the lower surface on the other side of the thickness direction (i.e., from the side facing the frame body forming plate 300B toward the side opposite the frame body forming plate 300B).

The manufacturing method according to this embodiment, which has such a configuration, can also achieve the same effects as those achieved in the first embodiment.

In this embodiment, the busbar plate 200B has a single busbar row 205B, and the frame plate 300B has a single frame row 305B. However, it is also possible to modify the embodiment to use a busbar plate 200C having multiple busbar rows 205B and a frame plate 300C having the same number of frame rows 305B as the multiple busbar rows 205B.

FIG. 16 shows a plan view of the bus bar plate and the frame plate used in the manufacturing method according to the modified example of this embodiment after the plate fixing step.
In the drawings, the same members as those in the first and second embodiments are given the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 16, in the modified example, the busbar plate 200C has a plurality of busbar rows 205B (first to third busbar rows 205B(1) to 205B(3) in the illustrated embodiment) arranged in parallel in a second direction (i.e., the X direction) perpendicular to the first direction within the X-Y plane in which the busbar plate 200C is located.

The frame body flat plate 300C has a plurality of bus bar rows 305B (first to third bus bar rows 305B(1) to 305B(3) in the illustrated embodiment) arranged in parallel in a second direction (i.e., the X direction) perpendicular to the first direction within the X-Y plane in which the frame body flat plate 300C is located.

1 Busbar assembly 10 (1) to (2) First and second busbars 11 Upper surface 12 Upper surface side connection portion 13 Lower surface 14 Lower surface side connection portion 15 Side surface 19 Gap 20 Busbar side insulating layer 21 Upper surface side laminated portion 22 (1) to (2) First and second upper surface side opening 23 Lower surface side laminated portion 24 (1) to (2) First and second lower surface side opening 25 Side surface side laminated portion 29 Gap filling portion 30 Frame body 31 Frame body main body 35 Central hole 40 Frame body side insulating layer 200A, 200B Busbar flat plate 205A (1) to (3), 205B (1) to (3) Busbar row 207 Busbar side gripping piece 208 Alignment hole 210 Busbar assembly forming area 219 Slit
220(1)-(2) First and second busbar forming regions 230A, 230B Busbar side connecting pieces 300A, 300B Frame body flat plates 305A(1)-(5), 305B(1)-(3) Frame body row 307 Frame body side gripping pieces 308 Alignment holes 310 Frame body forming regions 330A, 330B Frame body side connecting pieces C1 Boundary C2 between the frame body forming region and the frame body side connecting pieces Boundary C2 between the busbar forming region and the busbar side connecting pieces

Claims (5)

a busbar assembly including: a plurality of busbars formed of conductive flat plate-like members and arranged in the same plane with gaps between opposing side surfaces; a busbar-side insulating layer including gap filling portions filled in the gaps and a top surface laminate portion covering an upper surface on one side in a plate thickness direction of a busbar connected body formed by the gap filling portions; and a frame having a frame main body having the same external shape as the busbar connected body in a plan view and a central hole passing through it in the vertical direction, and a frame-side insulating layer covering an outer peripheral surface of the frame main body, wherein the top surface laminate portion is provided with one or more top surface openings exposing at least a portion of the upper surface of each of the plurality of busbars, and the frame is fixed to a periphery of the upper surface of the busbar connected body via the top surface laminate portion with the one or more top surface openings positioned within the central hole in a plan view,
preparing a busbar plate made of a conductive metal, the busbar plate including a busbar forming region having an outer shape in a plan view corresponding to the busbar connected body;
a slit forming step of forming one or more slits in the busbar forming region, the slits penetrating the busbar forming region in a plate thickness direction and having the same width as the gap, to divide the busbar forming region into a plurality of busbar forming portions corresponding to the plurality of busbars;
a busbar-side insulating layer forming step of applying and curing an insulating resin paint at least in the slits and on an upper surface of the busbar forming region to provide the busbar-side insulating layer;
a laser light irradiation step of irradiating a laser beam to an upper surface side laminated portion of the busbar side insulating layer to form the one or more upper surface side openings;
a frame-forming process carried out before or after, or in parallel with, processes from the process of preparing a busbar plate to the process of applying laser light, the frame-forming process including: a process of preparing a frame-forming plate made of a conductive metal, the frame-forming plate including a frame-forming region having an outer shape in a plan view corresponding to the busbar-forming region and having a through-hole corresponding to the central hole; and a frame-side insulating layer forming process of applying an insulating resin paint to an outer peripheral surface of the frame-forming region and curing the paint to provide the frame-side insulating layer;
a flat plate fixing step of fixing, in an overlapping state, a lower surface of the frame body forming region after the frame body forming treatment to an upper surface of the busbar forming region after the busbar-side insulating layer forming step, before or after the laser light irradiation step;
a cutting step of cutting the fixed busbar forming region and the fixed frame body forming region from the busbar forming plate and the frame body forming plate after the flat plate fixing step,
the busbar formation plate has a busbar row formed by a plurality of the busbar forming areas arranged in series along a first direction in an X-Y plane on which the busbar formation plate is located and a plurality of busbar side connecting pieces integrally connecting the plurality of busbar forming areas,
the slit formed in one busbar forming region has one longitudinal end extending into a busbar side connecting piece connected to one side of the one busbar forming region in the first direction, and the other longitudinal end extending into a busbar side connecting piece connected to the other side of the one busbar forming region in the first direction,
the frame body flat plate has a plurality of frame body forming regions arranged in series in a first direction at the same pitch as the plurality of busbar forming regions in the busbar row, and a frame body row formed by a plurality of frame body side connecting pieces that integrally connect the plurality of frame body forming regions,
the busbar-side connecting pieces are disposed at a center in the width direction of the busbar row, and the frame-side connecting pieces are disposed on both sides of the center in the width direction of the frame row, and the busbar-side connecting pieces and the frame-side connecting pieces are displaced relative to each other so as not to overlap in a plan view when the frame-forming flat plate and the busbar-forming flat plate are fixed together,
the cutting step includes a busbar-side cutting process for cutting the boundary between the busbar forming region and the busbar-side connecting piece from the side of the surface facing the frame body flat plate toward the side of the surface opposite the frame body flat plate, and a frame body-side cutting process for cutting the boundary between the frame body forming region and the frame body-side connecting piece from the side of the surface facing the busbar flat plate toward the side of the surface opposite the busbar flat plate. the busbar support plate includes a plurality of busbar rows arranged in parallel in a second direction perpendicular to a first direction in an X-Y plane on which the busbar support plate is located, and busbar-side gripping pieces that integrally hold the plurality of busbar rows;
2. The method for manufacturing a busbar assembly according to claim 1, wherein the frame body flat plate has a plurality of frame body rows arranged in parallel in the second direction at the same pitch as the plurality of busbar rows and in the same number, and a frame body side gripping piece that holds the plurality of frame body rows together. a busbar-side insulating layer including a top-side laminated portion covering an upper surface of one side in a plate thickness direction of a busbar connected body formed of a conductive flat plate member and having gaps between opposing side surfaces; a gap filling portion filling the gaps and a top-side laminated portion covering an upper surface of one side in a plate thickness direction of a busbar connected body formed by the gap filling portion; and a frame having a frame main body having the same external shape as the busbar connected body in a plan view and having a central hole penetrating vertically, and a frame-side insulating layer covering an outer peripheral surface of the frame main body, wherein the top-side laminated portion has one or more top-side openings exposing at least a portion of the upper surface of each of the plurality of busbars, and the frame has a plurality of busbar assemblies connected in the same plane, the busbar assemblies being fixed to the periphery of the upper surface of the busbar connected body via the top-side laminated portion with the one or more top-side openings positioned within the central hole in a plan view,
a busbar plate made of a conductive metal, having an outer shape in a plan view corresponding to the busbar connector, the busbar plate having a plurality of busbar forming regions arranged in series along a first direction of an X-Y plane in which the busbar plate is located, and a busbar row formed by a plurality of busbar side connecting pieces integrally connecting the plurality of busbar forming regions, each of the plurality of busbar forming regions being partitioned into a plurality of busbar forming sites corresponding to the plurality of busbars by one or more slits that penetrate the plate in a thickness direction and have the same width as the gap;
a busbar-side insulating coating film having a portion that fills the slit to form the gap filling portion and a portion that is provided on the upper surface of the busbar forming region to form the upper surface side laminated portion, the portion that forms the upper surface side laminated portion having the one or more upper surface side openings;
a frame body flat plate made of a conductive metal, the frame body flat plate having an outer shape in a plan view corresponding to the busbar forming region, the frame body flat plate having a frame body row formed by a plurality of frame body forming regions arranged in series in a first direction at the same pitch as the plurality of busbar forming regions in the busbar row, and a plurality of frame body side connecting pieces integrally connecting the plurality of frame body forming regions, the frame body flat plate having a through hole that forms the central hole in each of the plurality of frame body forming regions;
a frame-side insulating coating film provided on the outer peripheral surface of the frame-forming region to form the frame-side insulating layer,
the slit formed in one busbar forming region has one longitudinal end extending into a busbar side connecting piece connected to one side of the one busbar forming region in the first direction, and the other longitudinal end extending into a busbar side connecting piece connected to the other side of the one busbar forming region in the first direction,
the busbar forming plate and the frame forming plate are fixed together so that the frame forming region provided with the frame body side insulating coating film overlaps the busbar forming region provided with the busbar side insulating coating film,
a flat plate stacking structure for a busbar assembly, characterized in that the busbar side connecting pieces are arranged at the center in the width direction of the busbar row, and the frame body side connecting pieces are arranged on both sides of the center in the width direction of the frame body row, and the busbar side connecting pieces and the frame body side connecting pieces are displaced relative to each other so as not to overlap in a planar view when the frame body flat plate and the busbar flat plate are fixed together. the busbar support plate includes a plurality of busbar rows arranged in parallel in a second direction perpendicular to a first direction in an X-Y plane on which the busbar support plate is located, and busbar-side gripping pieces that integrally hold the plurality of busbar rows;
4. The flat plate stack structure for a bus bar assembly according to claim 3, wherein the frame body flat plate has a plurality of frame body rows arranged in parallel in the second direction at the same pitch as the plurality of bus bar rows, and a frame body side gripping piece that holds the plurality of frame body rows together . the busbar-side insulating coating film further includes a portion that forms a lower-surface-side laminated portion that is provided on the lower surface of the busbar forming region and covers the lower surface of the busbar connected body on the other side in the plate thickness direction, and a portion that forms a side-surface-side laminated portion that is provided on the side surface of the busbar forming region and covers the side surface of the busbar connected body,
5. The flat plate laminate structure for a busbar assembly according to claim 3 , wherein the portion forming the lower surface laminate portion has one or more lower surface openings that expose at least a portion of the lower surface of each of the plurality of busbars.